MCP2210
Breakout Module
User’s Guide
© 2012 Microchip Technology Inc.
DS52056A
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
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OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
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FITNESS FOR PURPOSE. Microchip disclaims all liability
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suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART,
PIC32 logo, rfPIC and UNI/O are registered trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MXDEV, MXLAB, SEEVAL and The Embedded Control
Solutions Company are registered trademarks of Microchip
Technology Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, chipKIT,
chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net,
dsPICworks, dsSPEAK, ECAN, ECONOMONITOR,
FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP,
Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB,
MPLINK, mTouch, Omniscient Code Generation, PICC,
PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE,
rfLAB, Select Mode, Total Endurance, TSHARC,
UniWinDriver, WiperLock and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2012, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
ISBN: 978-1-62076-117-5
QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
DS52056A-page 2
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
© 2012 Microchip Technology Inc.
MCP2210 BREAKOUT MODULE
USER’S GUIDE
Table of Contents
Preface ........................................................................................................................... 5
Introduction............................................................................................................ 5
Document Layout .................................................................................................. 5
Conventions Used in this Guide ............................................................................ 6
Recommended Reading........................................................................................ 7
The Microchip Web Site ........................................................................................ 7
Customer Support ................................................................................................. 7
Document Revision History ................................................................................... 7
Chapter 1. Product Overview
1.1 Introduction ..................................................................................................... 9
1.2 MCP2210 Breakout Module General Description .......................................... 9
1.3 What the MCP2210 Breakout Module Kit Includes ........................................ 9
Chapter 2. Installation and Operation
2.1 Introduction ................................................................................................... 11
2.2 Board Setup ................................................................................................. 11
2.3 Board Operation ........................................................................................... 12
2.4 MCP2210 Typical Usage Scenarios ............................................................. 14
Appendix A. Schematic and Layouts
A.1 Introduction .................................................................................................. 17
A.2 Board – Schematic ....................................................................................... 18
A.3 Board – Top Silk and Pads .......................................................................... 19
A.4 Board – Top Silk, Pads and Copper ............................................................ 20
A.5 Board – Top Pads and Copper .................................................................... 21
A.6 Board – Bottom Silk and Pads ..................................................................... 22
A.7 Board – Bottom Silk, Pads and Copper ....................................................... 23
A.8 Board – Bottom Pads and Copper ............................................................... 24
Appendix B. Bill of Materials
Worldwide Sales and Service .................................................................................... 26
© 2012 Microchip Technology Inc.
DS52056A-page 3
MCP2210 Breakout Module User’s Guide
DS52056A-page 4
© 2012 Microchip Technology Inc.
MCP2210 BREAKOUT MODULE
USER’S GUIDE
Preface
NOTICE TO CUSTOMERS
All documentation becomes dated, and this manual is no exception. Microchip tools and
documentation are constantly evolving to meet customer needs, so some actual dialogs
and/or tool descriptions may differ from those in this document. Please refer to our web site
(www.microchip.com) to obtain the latest documentation available.
Documents are identified with a “DS” number. This number is located on the bottom of each
page, in front of the page number. The numbering convention for the DS number is
“DSXXXXXA”, where “XXXXX” is the document number and “A” is the revision level of the
document.
For the most up-to-date information on development tools, see the MPLAB® IDE online help.
Select the Help menu, and then Topics to open a list of available online help files.
INTRODUCTION
This chapter contains general information that will be useful to know before using the
MCP2210 Breakout Module. Items discussed in this chapter include:
•
•
•
•
•
•
Document Layout
Conventions Used in this Guide
Recommended Reading
The Microchip Web Site
Customer Support
Document Revision History
DOCUMENT LAYOUT
This document describes how to use the MCP2210 Breakout Module board. The
manual layout is as follows:
• Chapter 1. “Product Overview” – Important information about the MCP2210
Breakout Module
• Chapter 2. “Installation and Operation” – Covers the initial set-up of this board,
required tools, board setup and Graphical User Interface (GUI)
• Appendix A. “Schematic and Layouts” – Shows the schematic and board
layouts for the MCP2210 Breakout Module User’s Guide
• Appendix B. “Bill of Materials” – Lists the parts used to populate the MCP2210
Breakout Module
© 2012 Microchip Technology Inc.
DS52056A-page 5
MCP2210 Breakout Module User’s Guide
CONVENTIONS USED IN THIS GUIDE
This manual uses the following documentation conventions:
DOCUMENTATION CONVENTIONS
Description
Arial font:
Italic characters
Initial caps
Quotes
Underlined, italic text with
right angle bracket
Bold characters
N‘Rnnnn
Text in angle brackets < >
Courier New font:
Plain Courier New
Represents
Referenced books
Emphasized text
A window
A dialog
A menu selection
A field name in a window or
dialog
A menu path
MPLAB® IDE User’s Guide
...is the only compiler...
the Output window
the Settings dialog
select Enable Programmer
“Save project before build”
A dialog button
A tab
A number in verilog format,
where N is the total number of
digits, R is the radix and n is a
digit.
A key on the keyboard
Click OK
Click the Power tab
4‘b0010, 2‘hF1
Italic Courier New
Sample source code
Filenames
File paths
Keywords
Command-line options
Bit values
Constants
A variable argument
Square brackets [ ]
Optional arguments
Curly brackets and pipe
character: { | }
Ellipses...
Choice of mutually exclusive
arguments; an OR selection
Replaces repeated text
Represents code supplied by
user
DS52056A-page 6
Examples
File>Save
Press <Enter>, <F1>
#define START
autoexec.bat
c:\mcc18\h
_asm, _endasm, static
-Opa+, -Opa0, 1
0xFF, ‘A’
file.o, where file can be
any valid filename
mcc18 [options] file
[options]
errorlevel {0|1}
var_name [,
var_name...]
void main (void)
{ ...
}
© 2012 Microchip Technology Inc.
Preface
RECOMMENDED READING
This user's guide describes how to use MCP2210 Breakout Module. Other useful
documents are listed below. The following Microchip document is available and
recommended as a supplemental reference resource.
• MCP2210 Data Sheet - “USB-to-SPI Protocol Converter with GPIO (Master
Mode)” (DS22288)
THE MICROCHIP WEB SITE
Microchip provides online support via our web site at www.microchip.com. This web
site is used as a means to make files and information easily available to customers.
Accessible by using your favorite Internet browser, the web site contains the following
information:
• Product Support – Data sheets and errata, application notes and sample
programs, design resources, user’s guides and hardware support documents,
latest software releases and archived software
• General Technical Support – Frequently Asked Questions (FAQs), technical
support requests, online discussion groups, Microchip consultant program
member listing
• Business of Microchip – Product selector and ordering guides, latest Microchip
press releases, listing of seminars and events, listings of Microchip sales offices,
distributors and factory representatives
CUSTOMER SUPPORT
Users of Microchip products can receive assistance through several channels:
•
•
•
•
Distributor or Representative
Local Sales Office
Field Application Engineer (FAE)
Technical Support
Customers should contact their distributor, representative or field application engineer
(FAE) for support. Local sales offices are also available to help customers. A listing of
sales offices and locations is included in the back of this document.
Technical support is available through the web site at: http://www.microchip.com/support.
DOCUMENT REVISION HISTORY
Revision A (March 2012)
• Initial Release of this Document.
© 2012 Microchip Technology Inc.
DS52056A-page 7
MCP2210 Breakout Module User’s Guide
NOTES:
DS52056A-page 8
© 2012 Microchip Technology Inc.
MCP2210 BREAKOUT MODULE
USER’S GUIDE
Chapter 1. Product Overview
1.1
INTRODUCTION
This chapter provides an overview of the MCP2210 Breakout Module and covers the
following topics:
• MCP2210 Breakout Module General Description
• What the MCP2210 Breakout Module Kit Includes
1.2
MCP2210 BREAKOUT MODULE GENERAL DESCRIPTION
The MCP2210 Breakout Module is a development and evaluation platform for the
MCP2210 device. The module is comprised of a single DIP form-factor board.
The MCP2210 Breakout Module has the following features:
• SPI bus signals (MOSI, MISO, SCK)
• Nine GP lines, configurable for GPIO, Chip Select or dedicated function operation
• Provides a user selectable (by using a jumper) power supply of 3.3V or 5V (up to
500 mA)
• DIP form-factor (0.6 inches overall row spacing between pins)
• PICkit™ Serial Analyzer header – used for SPI communication only
A Windows®-based PC software was created to help with the evaluation/demonstration
of the MCP2210 device as a USB-to-SPI (Master) device. It allows I/O control and
custom device configuration. The software is downloadable from the board web page
on www.microchip.com.
A DLL package is included to allow development of custom PC applications using the
MCP2210. The DLL package is also available for download on the board web page.
1.3
WHAT THE MCP2210 BREAKOUT MODULE KIT INCLUDES
The MCP2210 Breakout Module Kit includes:
• MCP2210 Breakout Module (ADM00419)
• Mini-USB cable
• Important Information Sheet
© 2012 Microchip Technology Inc.
DS52056A-page 9
MCP2210 Breakout Module User’s Guide
NOTES:
DS52056A-page 10
© 2012 Microchip Technology Inc.
MCP2210 BREAKOUT MODULE
USER’S GUIDE
Chapter 2. Installation and Operation
2.1
INTRODUCTION
The MCP2210 Breakout Module is designed to demonstrate the device as a
USB-to-SPI (Master) bridge solution.
The package is comprised of a single board and has the following features:
• Small plug-in board with DIP form factor (600 millimeters overall row spacing
between pins)
• Mini-USB connector
• Access to SPI bus and all GP signals through USB port
• PICkit™ Serial Analyzer compatible header
• 3.3 or 5V jumper selectable VDD; the breakout board can be used to supply up to
500 mA to the rest of the system. The board already provides a signal trace
between the VDD and the 3.3V rail. For systems requiring 5V VDD power supply,
VDD header must be mounted on the board. A jumper will close the middle pin and
the 5V pin.
2.2
BOARD SETUP
Follow these steps to set up the MCP2210 Breakout Module:
1. Download the support material (PC applications and DLL libraries) that can be
found on the board’s page, on the Microchip web site.
2. Attach the MCP2210 Breakout Module to a board that has one or more SPI slave
devices attached to a bus (SPI).
3. Plug the MCP2210 Breakout Module in to a PC.
4. The computer operating system will automatically install the driver for this board.
When the installation is complete, the board is ready for operation.
5. Install the downloaded PC software.
6. Start the SPI Terminal utility.
© 2012 Microchip Technology Inc.
DS52056A-page 11
MCP2210 Breakout Module User’s Guide
2.3
BOARD OPERATION
The MCP2210 will be detected by a Windows PC host as an HID device. The
accompanying software can be used to exercise the MCP2210 Breakout Module’s
features and also provides a reference point for users that want to design their own
applications based on the MCP2210 device.
2.3.1
MCP2210 Breakout Board Operation
The MCP2210 Breakout Module can be used as a stand-alone USB-to-SPI (Master)
bridge module. The breakout board provides all the signals required to assist the user
in building their boards with the MCP2210.
The board has the following features:
• SPI bus signals (MOSI, MISO, SCK)
• Nine GP signals that can be configured for:
- GPIO functionality (digital input or output pins)
- Chip Select functionality (working with the SPI bus signals)
- Dedicated function pins
• Jumper selectable power supply: 3.3 or 5V (up to 500 mA)
• PICkit™ Serial Analyzer header using GP4 pin as Chip Select signal
Note:
This function is available only on SPI operations, it does not work on I2C or
UART signals.
• DIP form-factor (0.6 inches overall row spacing between pins)
By using the provided software and libraries, the user can create personalized PC
applications, using the breakout board as a USB-to-SPI (Master) bridge adapter.
2.3.2
MCP2210 Utility
The MCP2210 Utility software was created for custom device setting requirements. A
few of the settings that this utility can alter include VID, PID, power requirements, and
string descriptors. A download link for this software can be found on the board web
page. For instructions on the use of this software, refer to the software’s supporting
documentation included within the application install package.
2.3.3
SPI Terminal Utility
The SPI Terminal Utility is a tool that allows low-level data exchange at the SPI bus
level. This application is useful for low-level communication and troubleshooting
between the MCP2210 and various SPI slave modules.
The utility window has different sections for GP designation, SPI transfer parameters
and user data areas.
DS52056A-page 12
© 2012 Microchip Technology Inc.
Installation and Operation
FIGURE 2-1:
SPI TERMINAL UTILITY WINDOW
SPI user data
section
GP Settings Section
HEX/Decimal
user data
mode
SPI Transfer
Parameters
Section
Status messages
Transfer Data button
GP Direct
Settings section
After the application is started, the state of the connection with the MCP2210 is shown
in the Status Messages section (lower left corner of the screen).
The user can establish the GP configuration. The GPs can be used as chip select pins.
Each GP Active and Idle value can be established by selecting the appropriate check
boxes, or by directly supplying the correct value in the GP Direct Settings section. The
same behavior applies to the GP designation (the GP designation can be established
by clicking the appropriate radio button, or by directly supplying the GP designation
value in the GP Settings Direct Values section).
The SPI settings pertaining to the needed SPI transfer can be established in the SPI
Parameters section.
The data to be sent goes in the Tx Data field. To send the data to the SPI slave device,
click the SPI Transfer Data button on the lower-right side of the screen. The data
received from the SPI slave device is displayed in the Rx Data field.
The user data can be supplied in either HEX or Decimal mode. This can be accomplished by selecting the HEX mode check box. The data in the Tx and Rx Data fields
will be displayed in HEX or Decimal.
© 2012 Microchip Technology Inc.
DS52056A-page 13
MCP2210 Breakout Module User’s Guide
A wider range of tests is available when using this board and the utility software with
the MCP2210 Evaluation Kit (ADM00421). This kit allows communication with several
SPI slave devices (I/O expander, EEPROM, ADC and temperature sensor). For more
details on examples using the SPI Terminal Utility software, see MCP2210 Evaluation
Kit User’s Guide (DS52057).
2.4
MCP2210 TYPICAL USAGE SCENARIOS
MCP2210 can be used in systems where an SPI bus is available. The MCP2210 can
be either the single master on the bus, or one of the masters sharing the bus, if a proper
master access arbitration scheme is in place.
A typical usage scenario is shown in Figure 2-2, where MCP2210 is the only master on
the SPI bus. This links the SPI slave chips in the system, while a few GPs (configured
for Chip Select function) can be used as Chip Select lines.
If SPI slave interrupt monitoring is required, the GP6 needs to be configured for its
dedicated function, in order to monitor the interrupts coming from the SPI slave chips.
The PC application will take care of all the details necessary for data transfer between
the MCP2210 and the SPI slave chips.
FIGURE 2-2:
MCP2210 TYPICAL USAGE DIAGRAM
MCP2210
USB
USB-to-SPI
bridge
External
Interrupt
(GP6)
SPI bus
MOSI, MISO, SCK
Chip Select lines
CS0-CS8
SPI slave chip #1
Interrupt
...
SPI slave chip #n
Interrupt
When a system requires more than one SPI master that share the same bus, an
arbitration scheme needs to be developed, in order to prevent the multiple SPI masters
from accessing the bus at the same time.
MCP2210 has support for an arbitration mechanism which uses GP7 and GP8
(configured for dedicated pin functionality) for this purpose.
DS52056A-page 14
© 2012 Microchip Technology Inc.
Installation and Operation
When GP8 is configured for its dedicated functionality, the pin can be used as a bus
release request for MCP2210 coming from another master. GP7 (configured for its
dedicated functionality) is used as an SPI bus release acknowledge signal towards the
requesting master. When an external SPI master requests the MCP2210 to release the
bus, the device completes the current SPI transfer (or it can be cancelled by the PC
application sending the proper USB command), then releases the bus and signals the
event on the acknowledge pin (GP7). The second master now has ownership of the
bus, and can keep it, as long as the SPI bus request pin (GP8) is kept asserted.
By using the dedicated functionality of the GP7 and GP8, the MCP2210 can be used
in a multiple SPI master system.
FIGURE 2-3:
MCP2210 TYPICAL USAGE DIAGRAM
MCP2210
SPI Bus Release Request
GP8
GP7
USB
USB-to-SPI
bridge
External
Interrupt
(GP6)
SPI Bus Release
Acknowledge
SPI bus
MOSI, MISO, SCK
External
Interrupt
Chip-Select lines
SPI slave chip #1
Interrupt
© 2012 Microchip Technology Inc.
SPI Master #2
...
SPI slave chip #n
Interrupt
DS52056A-page 15
MCP2210 Breakout Module User’s Guide
DS52056A-page 16
© 2012 Microchip Technology Inc.
MCP2210 BREAKOUT MODULE
USER’S GUIDE
Appendix A. Schematic and Layouts
A.1
INTRODUCTION
This appendix contains the following schematics and layouts for the MCP2210
Breakout Module:
•
•
•
•
•
•
•
Board – Schematic
Board – Top Silk and Pads
Board – Top Silk, Pads and Copper
Board – Top Pads and Copper
Board – Bottom Silk and Pads
Board – Bottom Silk, Pads and Copper
Board – Bottom Pads and Copper
© 2012 Microchip Technology Inc.
DS52056A-page 17
J1
7 6 5 4 3 2 1
U2
MCP1825S-3.3V
1
3
VIN
VOUT
GP0
GP1
GP2
GP3
GP4
MOSI
SCK
GND D
2
GND
HDR M 1x7 VERT
Left Side Header
0.1uF
0603
C4
GND D GND D
4.7uF
0603
C3
5V
VDD
GND D
0.1uF
0603
C5
GND D
J3
GND D
VDD
J2
HDR M 1x7 VERT
Right Side Header
GP8
GP7
GP6
GP5
MI SO
GND D
5V
22uF
1206
C1
Default connection
between 1 - 2. User
to cut the trace if
5V VDD is needed.
PICkit™ Serial Analyzer Header
HDR M 1x6 VERT
J4
1 2 3
VDD
HDR M 1x3 VERT
NT1
3.3V
VUSB
1 2 3 4 5 6
GP4
DS52056A-page 18
MISO
SCK
MOSI
TP1
2
3
12MHz
GND D
1
X1
Via_1.2x0.7
GP0
GP1
GP2
GP3
MOSI
GP4
R1
OSC1
OSC2
RST
VDD
390 5%
0603
1
2
3
4
5
6
7
8
9
10
VSS
D+
DVUSB
GP8
GP7
GP6
MI SO
GP5
SCK
20
19
18
17
16
15
14
13
12
11
GND D
MCP2210
U1
0603
VDD
OSC1
OSC2
RST
GP0
GP1
GP2
GP3
MOSI
GP4
0.1uF
C2
USB_D+
USB_DVUSB
GND D
C6
1uF
0603
J5
GND
ID
D+
D-
VBUS
USB-B-Mini SMD
5
4
3
2
1
GP8
GP7
GP6
MI SO
GP5
SCK
GND D
GND D
USB_D+
USB_D-
5V
A.2
7 6 5 4 3 2 1
VDD
MCP2210 Breakout Module User’s Guide
BOARD – SCHEMATIC
© 2012 Microchip Technology Inc.
Schematic and Layouts
A.3
BOARD – TOP SILK AND PADS
© 2012 Microchip Technology Inc.
DS52056A-page 19
MCP2210 Breakout Module User’s Guide
A.4
BOARD – TOP SILK, PADS AND COPPER
DS52056A-page 20
© 2012 Microchip Technology Inc.
Schematic and Layouts
A.5
BOARD – TOP PADS AND COPPER
© 2012 Microchip Technology Inc.
DS52056A-page 21
MCP2210 Breakout Module User’s Guide
A.6
BOARD – BOTTOM SILK AND PADS
DS52056A-page 22
© 2012 Microchip Technology Inc.
Schematic and Layouts
A.7
BOARD – BOTTOM SILK, PADS AND COPPER
© 2012 Microchip Technology Inc.
DS52056A-page 23
MCP2210 Breakout Module User’s Guide
A.8
BOARD – BOTTOM PADS AND COPPER
DS52056A-page 24
© 2012 Microchip Technology Inc.
MCP2210 BREAKOUT MODULE
USER’S GUIDE
Appendix B. Bill of Materials
TABLE B-1:
Qty
BILL OF MATERIALS
Designator
Description_
Manufacturer 1
Part Number
1
C1
Cap. Cerm. 22 uF 10V 20% Y5V 1206
TDK®
3
C2, C4, C5
Cap. Cerm .1 uF 10% 16V X7R 0603
AVX Corporation
1
C3
Cap. Cerm. 4.7 uF 6.3V 10% X5R 0603
TDK Corporation
C1608X5R0J475K
1
C6
Cap. Cerm. 1 uF 16V 10% X7R 0603
TDK Corporation
C1608X7R1C105K
2
J1, J2
DO NOT POPULATE
Conn. Hdr. Male .100 1x7 Pos. Vertical
Tyco® Electronics
HDR M 1x7 Vertical
1
J3
DO NOT POPULATE
Conn. Hdr. Male .100 1x6 Pos. Vertical
Tyco Electronics
HDR M 1x6 Vertical
1
J4
DO NOT POPULATE
Conn. Hdr. Male .100 1x3 Pos. Vertical
Tyco Electronics
HDR M 1x3 Vertical
1
J5
Conn. Rcpt. USB Mini B R/A SMD
Hirose Electric Co. Ltd.
UX60SC-MB-5ST(80)
Corporation
C3216Y5V1A226Z
0603YC104KAT2A
1
R1
Res. 390 Ohm 1/10W 5% 0603 SMD
Panasonic®
1
U1
IC USB-TO-SPI SSOP-20
Microchip Technology
Inc.
MCP2210-I/SS
1
U2
IC LDO Reg. 500 mA 3.3V SOT-223-3
Microchip Technology
Inc.
MCP1825S-3302E/DB
1
X1
Cer. Resonator 12.0 MHz SMD
Murata Electronics®
CSTCE12M0G55-R0
Note 1:
- ECG
ERJ-3GEYJ391V
The components listed in this Bill of Materials are representative of the PCB assembly. The released BOM
used in manufacturing uses all RoHS-compliant components.
© 2012 Microchip Technology Inc.
DS52056A-page 25
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
Web Address:
www.microchip.com
Asia Pacific Office
Suites 3707-14, 37th Floor
Tower 6, The Gateway
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Tel: 852-2401-1200
Fax: 852-2401-3431
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Tel: 91-80-3090-4444
Fax: 91-80-3090-4123
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
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Tel: 91-20-2566-1512
Fax: 91-20-2566-1513
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
Japan - Osaka
Tel: 81-66-152-7160
Fax: 81-66-152-9310
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
Boston
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Cleveland
Independence, OH
Tel: 216-447-0464
Fax: 216-447-0643
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
Detroit
Farmington Hills, MI
Tel: 248-538-2250
Fax: 248-538-2260
Indianapolis
Noblesville, IN
Tel: 317-773-8323
Fax: 317-773-5453
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
Santa Clara
Santa Clara, CA
Tel: 408-961-6444
Fax: 408-961-6445
Toronto
Mississauga, Ontario,
Canada
Tel: 905-673-0699
Fax: 905-673-6509
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
China - Beijing
Tel: 86-10-8569-7000
Fax: 86-10-8528-2104
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
China - Chongqing
Tel: 86-23-8980-9588
Fax: 86-23-8980-9500
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
China - Hangzhou
Tel: 86-571-2819-3187
Fax: 86-571-2819-3189
Korea - Seoul
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
China - Hong Kong SAR
Tel: 852-2401-1200
Fax: 852-2401-3431
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
Taiwan - Hsin Chu
Tel: 886-3-5778-366
Fax: 886-3-5770-955
China - Shenzhen
Tel: 86-755-8203-2660
Fax: 86-755-8203-1760
Taiwan - Kaohsiung
Tel: 886-7-536-4818
Fax: 886-7-330-9305
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
Taiwan - Taipei
Tel: 886-2-2500-6610
Fax: 886-2-2508-0102
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
UK - Wokingham
Tel: 44-118-921-5869
Fax: 44-118-921-5820
China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
DS52056A-page 26
Japan - Yokohama
Tel: 81-45-471- 6166
Fax: 81-45-471-6122
11/29/11
© 2012 Microchip Technology Inc.