oH VE S CO AV R M AI SIO PL LA N IA BL S NT E Features ■ *R ■ ■ ■ ■ Concave terminals Lead free version available (see How to Order “Termination” options) RoHS compliant* 8 bit multiple applications Smallest bussed chip array ■ E 24 Series from 10 ohms to 1 megohm CAT25 - Thick Film Chip Resistor Arrays Electrical Characteristics How To Order Parameters Number of Resistors Resistance Range E24 Resistance Tolerance Power Rating/Resistor Rating Temperature T.C.R. Maximum Operating Voltage Operating Temperature CAT25 8 10 ohms to 1 megohm 5% 62.5 mW +70 °C +/-200 ppm/°C 25 V -55 °C to +125 °C Test Method JIS-C-5202.5.1 CA T 25 - 103 J A __ Product CA = Chip Array Pin Style T = Concave Model JIS-C-5202.5.2 Resistance Value 103 = 10K ohms Tolerance J=5% Electrical Circuit A = 8 Resistors, Bussed Type Environmental Characteristics Specification Short Time Overload Load Life Humidity Load Life Resistance to Soldering Heat Terminal Strength Temperature Cycle Vibration Insulation Resistance Dielectric Withstanding Voltage Lead Solderability Characteristics +/-(3 % +0.1 ohm) +/-(5 % +0.1 ohm) +/-(3 % +0.1 ohm) +/-(1 % +0.1 ohm) +/-(1 % +0.1 ohm) +/-(2 % +0.1 ohm) +/-(1 % +0.1 ohm) 1000 megohms minimum 50 VRMS >95 % Outline Drawing Test Method JIS-C-5202.5.5 JIS-C-5202.7.10 JIS-C-5202.7.9 JIS-C-5202.6.4 JIS-C-5202.6. JIS-C-5202.7.4 JIS-C-5202.6.3 JIS-C-5202.5.6 JIS-C-5202.5.7 JIS-C-5202.6.5 Terminations LF = Tin-plated (lead free) Blank = Solder-plated For Standard Values Used in Capacitors, Inductors, and Resistors, click here. Land Pattern 103 0.25 ± 0.20 (.010 ± .008) 0.30 ± 0.20 (.012 ± .008) 4.8 - 5.2 (.190 - .205) 2.10 ± 0.20 (.083 ± .008) 2.8 - 3.0 (.110 - .118) 0.55 ± 0.10 (.022 ± .004) 0.80 ± 0.10 (.032 ± .004) 0.9 - 1.1 (.035 - .043) 3.2 - 3.5 (.125 - .138) 3.3 - 3.4 (.130 - .133) 4.00 ± 0.20 (.157 ± .008) 0.35 ± 0.20 (.014 ± .008) 0.50 ± 0.20 (.020 ± .008) 0.25 ± 0.15 DIA. (.010 ± .006) 0.4 - 0.5 (.016 - .020) 0.80 (.032) Electrical Circuit 0.40 ± 0.20 (.016 ± .008) DIMENSIONS ARE: MM (INCHES) *RoHS Directive 2002/95/EC Jan 27 2003 including Annex Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. CAT25 - Thick Film Chip Resistor Arrays Soldering Profile for Lead Free Chip Resistors and Arrays 275 <1> Maximum of 20 seconds between 260 °C peak +255 °C and +260 °C <1> 255 °C 225 Temperature (°C) 220 °C 190 °C 175 60 - 90 seconds Ramp Down 3 °C/second 150 °C 125 60 - 120 seconds 10 seconds minimum 75 Ramp Up 3 °C/second maximum 25 0 Packaging 12 (.472) embossed tape 4,000 pcs. per reel 50 100 150 Time (seconds) 200 Material Substrate Element Coating Terminal REV. 04/06 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. Alumina 96 Ruthenium Oxide Glass AgPb, Plated Ni+SnPb 250 300