Data sheet acquired from Harris Semiconductor SCHS087D − Revised October 2003 The CD4555B and CD4556B types are supplied in 16-lead hermetic dual-in-line ceramic packages (F3A suffix), 16-lead dual-in-line plastics packages (E suffix), and 16-lead small-outline packages (M, M96, and MT suffixes). The CD4555B is also supplied in 16-lead small-outline packages (NSR suffix) and 16-lead thin shrink small-outline packages (PW and PWR suffixes.) Copyright 2003, Texas Instruments Incorporated PACKAGE OPTION ADDENDUM www.ti.com 28-Feb-2005 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty 7704701EA ACTIVE CDIP J 16 1 None Call TI Level-NC-NC-NC 7704801EA ACTIVE CDIP J 16 1 None Call TI Level-NC-NC-NC CD4555BE ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU Level-NC-NC-NC CD4555BF3A ACTIVE CDIP J 16 1 None Call TI Level-NC-NC-NC CD4555BM ACTIVE SOIC D 16 40 Pb-Free (RoHS) CU NIPDAU Level-2-260C-1 YEAR/ Level-1-235C-UNLIM CD4555BM96 ACTIVE SOIC D 16 2500 Pb-Free (RoHS) CU NIPDAU Level-2-260C-1 YEAR/ Level-1-235C-UNLIM CD4555BMT ACTIVE SOIC D 16 250 Pb-Free (RoHS) CU NIPDAU Level-2-260C-1 YEAR/ Level-1-235C-UNLIM CD4555BNSR ACTIVE SO NS 16 2000 Pb-Free (RoHS) CU NIPDAU Level-2-260C-1 YEAR/ Level-1-235C-UNLIM CD4555BPW ACTIVE TSSOP PW 16 90 Pb-Free (RoHS) CU NIPDAU Level-1-250C-UNLIM CD4555BPWR ACTIVE TSSOP PW 16 2000 Pb-Free (RoHS) CU NIPDAU Level-1-250C-UNLIM CD4556BE ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU Level-NC-NC-NC Lead/Ball Finish MSL Peak Temp (3) CD4556BF ACTIVE CDIP J 16 1 None Call TI Level-NC-NC-NC CD4556BF3A ACTIVE CDIP J 16 1 None Call TI Level-NC-NC-NC CD4556BM ACTIVE SOIC D 16 40 Pb-Free (RoHS) CU NIPDAU Level-2-260C-1 YEAR/ Level-1-235C-UNLIM CD4556BM96 ACTIVE SOIC D 16 2500 Pb-Free (RoHS) CU NIPDAU Level-2-260C-1 YEAR/ Level-1-235C-UNLIM CD4556BMT ACTIVE SOIC D 16 250 Pb-Free (RoHS) CU NIPDAU Level-2-260C-1 YEAR/ Level-1-235C-UNLIM (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. None: Not yet available Lead (Pb-Free). Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens, including bromine (Br) or antimony (Sb) above 0.1% of total product weight. (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 28-Feb-2005 incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 MECHANICAL DATA MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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