Datasheet White LED Driver with Synchronous Boost Converter and PWM Brightness Control for up to 4 LEDs in Series BD6076GUT ●General Description The BD6076GUT is a white LED driver IC with synchronous rectification that can drive up to 4LEDs. With synchronous rectification (no external schottky diode required) and small package, they can save mount space. And the brightness of LED can be adjusted by using PWM pulse on EN pin. ●Key Specifications ■ Power supply voltage range: ■ Switching Frequency: ■ Quiescent Current: ■ Operating temperature range: 2.7V to 5.5V 1.25MHz(Typ.) 0.1µA(Typ.) -30°C to +85°C W(Typ.) x D(Typ.) x H(Max.) 1.68mm x 1.68mm x 0.68mm ●Package VCSP60N1 ●Features ■ Synchronous rectification Boost DC/DC converter ■ No external schottky diode required ■ Driving 4 series white LEDs ■ Internal Load Disconnect SW ■ Over voltage protection ■ Protect open and short output ■ Thermal shut down ■ Brightness adjustment by external PWM pulse ■ Small and Thin CSP package in 8pins ●Applications White LED Backlight Torch light and easy flash for camera of mobile phone ●Typical Application Circuit CIN L ●Pin Configuration 10µH or 22µH VIN SW VOUT COUT C1 C2 C3 VOUTPUT B3 B1 BD6076GUT white LED A1 VFB RFB GND GNDA A2 A3 <BOTTOM VIEW> EN ○Product structure：Silicon monolithic integrated circuit www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 ○This product is not designed protection against radioactive rays 1/18 TSZ02201-0G3G0C200360-1-2 12.SEP.2012 Rev.001 Datasheet BD6076GUT ●Absolute Maximum Ratings (Ta=25°C) Parameter Symbol Ratings Unit Maximum applied voltage 1 VMAX1 7 *1 V VIN, EN, VFB, TEST pin Maximum applied voltage 2 VMAX2 20 *1 V SW, VOUT, VOUTPUT pin Pd 800 *2 mW Operating temperature range Topr -30 to +85 °C Storage temperature range Tstg -55 to +150 °C Power dissipation Condition *1 These values are based on GND and GNDA pins. *2 50mm×58mm×1.75mm At glass epoxy board mounting. When it’s used by more than Ta=25°C, it’s reduced by 6.4mW/°C. ●Recommended Operating Ratings (Ta=-30°C to +85°C) Parameter Symbol Power supply voltage Vin Ratings Min. Typ. Max. 2.7 3.6 5.5 Unit Condition V ●Electrical Characteristics Unless otherwise specified Ta =-30°C to +85°C, VIN=3.1 to 5.5V Limits Parameter Symbol Unit Min. Typ. Max. Condition [ EN terminal ] EN threshold voltage (Low) VthL - - 0.4 V EN threshold voltage (High) VthH 1.2 - - V Iin - 18.3 30.0 µA EN=5.5V Iout -2.0 0.0 - µA EN=0V Quiescent Current Iq - 0.1 2.0 µA EN=0V Current Consumption Idd - 1.0 1.5 mA EN=2.6V,VFB=1.0V,VIN=3.6V Feedback voltage Vfb 0.47 0.50 0.53 V Inductor current limit Icoil 310 400 490 mA VIN=3.6V *1 SW saturation voltage Vsat - 0.14 0.28 V Isw=200mA Vout PMOS resistance Ronp - 2.1 3.2 Ω Ipch=200mA, VOUT=13V Voutput PMOS resistance Rpsw - 1.8 2.0 Ω Ipsw=20mA, VOUT=13V Switching frequency fSW 1.0 1.25 1.5 MHz Duty cycle limit Duty 83.0 91.0 99.0 % Output voltage range Vo - - 18.0 V Over voltage limit Ovl 18.0 18.5 19.0 V VFB=0V UVLOD 1.75 - 2.25 V Falling VIN level EN terminal input current EN terminal output current [ Switching regulator ] UVLO detect voltage VFB=0V *1 This parameter is tested with DC measurement. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 2/18 TSZ02201-0G3G0C200360-1-2 12.SEP.2012 Rev.001 Datasheet BD6076GUT ●Pin Description PIN Name In/Out Ball number Function GNDA - A1 Analog GND EN In A2 Enable control (pull down by inner resistor) VOUTPUT Out A3 Switching output VIN In B1 Power supply input VFB In B3 Feedback voltage input VOUT Out C1 VOUT, connected to output capacitor SW In C2 Switching terminal GND - C3 Power GND ●Block Diagram VIN SW over voltage protect Thermal Shutdown TSD UVLO short protect short protect Q S Q R PWMcomp Control Current Sence + VOUT + - VOUTPUT + + - ERRAMP + VFB + OSC GND GNDA www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 EN 3/18 TSZ02201-0G3G0C200360-1-2 12.SEP.2012 Rev.001 Datasheet BD6076GUT IIN [µA] IIN [mA] ●Typical Performance Curves Figure 2. Quiescent current vs. Power supply voltage VFB [mV] Frequency [MHz] Figure 1. Current consumption vs. Power supply voltage Figure 4. Feedback voltage vs. Power supply voltage Figure 3. Oscillation frequency vs. Power supply voltage www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 4/18 TSZ02201-0G3G0C200360-1-2 12.SEP.2012 Rev.001 Datasheet BD6076GUT ●Typical Performance Curves - continued 500 450 Efficiency [%] Inductor current [mA] Ta=85℃ 400 Ta=-30℃ Ta=25℃ 350 300 3.1 3.5 3.9 4.3 4.7 VIN [V] 5.1 5.5 Figure 5. Inductor current limit vs. Power supply voltage Efficiency [%] Output Power [mW] Figure 6. Efficiency vs. LED current (4LED=VOUT13V) Figure 7. Efficiency vs. LED current (4LED=VOUT13V) coil : TDK VLS3010T220M www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 Figure 8. Output power vs. Power supply voltage coil : TDK VLS3010T220M 5/18 TSZ02201-0G3G0C200360-1-2 12.SEP.2012 Rev.001 Datasheet BD6076GUT ●Typical Performance Curves - continued 1.VOUT Efficiency [%] Δ=1.66V 5.3ms 2.IIN VIN=3.6V Ta=25℃ 1.VOUT 2.IIN Idd=1.5mA (4ms/div) 1V/div AC 200mA/div DC Figure 10. LED Open output voltage Figure 9. Efficiency vs. power supply voltage coil ; TDK VLS3010T220M 1.EN VOUT Drop = 76mVpp 2.VOUT Peak=155mA 3.VFB 4.Icoil 1.EN 2V/div DC 2.VOUT 3.VFB 0.5V/div DC 4.IIN (3ms/div) 100mV/div AC 200mA/div DC Figure 11. LED brightness adjustment (COUT=4.7µF, ILED=15mA) www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 Figure 12. Soft Start (COUT=4.7µF, ILED=15mA) 6/18 TSZ02201-0G3G0C200360-1-2 12.SEP.2012 Rev.001 Datasheet BD6076GUT ●Typical Performance Curves - continued Figure 13. LED brightness adjustment For PWM control 1.VIN Figure 14. LED brightness adjustment For PWM control (Expansion) 3.1V 600µs 2.8V 10µs 10µs 2.VOUT VOUT=100mVpp 3. VFB VFB=30mVpp 1.VIN 200mV/div DC 3.VFB 50mV/div AC 2.VOUT 100mV/div AC Figure 15. VIN Line Transient (COUT=4.7µF, ILED=15mA) VIN: 3.1V 2.8V www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 7/18 TSZ02201-0G3G0C200360-1-2 12.SEP.2012 Rev.001 Datasheet BD6076GUT ●Test circuit *Test circuit A (for Inductor current limit, Feedback voltage.) Procedure ~Inductor current limit~ 1. Start to increase Iout from 0mA gradually. 2. You will find that VOUT will start to go down and the duty will be decreased. 3. Then, you can measure the coil current as “inductor current limit” ~VFB voltage~ 1. Supply 0mA to Iout 2. Then, you can measure the VFB voltage as “Feedback voltage”. Icoil 3.1~5.5V VIN 10µH or 22µH 1µF SW VIN Tall monitor A Duty= Ton VOUT Ton Tall 1µF VOUTPUT EN Iout GNDA GND VFB RFB 24Ω V Figure 16. Test Circuit A *Test circuit B (for Over voltage limit,Duty cycle limit, Switching frequency) Procedure ~Over voltage limit~ 1. Start to increase VOUT from 9V to 20V 2. You will find frequency change from around 1MHz to 0Hz 3. Then, it is “Over Voltage limit” ~Duty cycle limit, Switching frequency ~ 1. Supply 9V to VOUT terminal 2. Then, you can measure the duty as “Duty cycle limit” and the frequency and “Switching frequency”. monitor 3.1~5.5V VIN Ton SW VIN VOUT 1µF EN Tall 1µF Duty= Ton Tall 9V to 20V VOUTPUT GNDA GND VFB Figure 17. Test Circuit B *Test circuit C (for Quiescent current, current comsumption, EN Terminal input/output current, EN threshold voltage(Low/High)) ICC 3.1~5.5V 1uF A VIN SW A EN VOUT IEN VOUTPUT 0.0~5.5V GNDA GND VFB 1.0V(current comsumption) Figure 18. Test Circuit C www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 8/18 TSZ02201-0G3G0C200360-1-2 12.SEP.2012 Rev.001 Datasheet BD6076GUT ●Operation BD6076GUT is PWM current mode DC/DC converter with fixed frequency. It adopts synchronous rectification architecture. The feature of the PWM current mode is that input is the combination of error components from the error amplifier, and a current sense signal that controls the inductor current into Slope waveform for sub harmonic oscillation prevention. This output controls Q1 and Q2 via the RS latch (Refer to Page 3). Timing of Q1 and Q2 is precisely adjusted so that they will not turn ON at the same time, thus putting them into non-overlapped relation. In the period when Q1 is ON, energy is accumulated in the external inductor, and in the period when Q1 is OFF, energy is transferred to the capacitor of VOUT via Q2. Further more, BD6076GUT has many safety functions, and their detection signals stop switching operation at once. ●Functional descriptions 1) Soft start and off status BD6076 has soft start function and off status function. The soft start function and the off status function prevent large current from flowing to the IC via coil. Occurrence of rush current at turning on is prevented by the soft start function, and occurrence of invalid current at turning off is prevented by the off status function. As for detailed actions, refer to the block diagram (Figure 19) and the timing chart (Figure 20). ･Soft start When VOUT is smaller than Vshort, to decrease charge current PMOS is set to off by PMOS Startup Control (in Term “I”). Vshort means “VOUT short detect voltage”. After VOUT is bigger than Vshort, PMOS is turned on and start switching. In term “II” (Vshort < VOUT < VIN), status of Current Limiter is “soft mode”. So “A” voltage is restricted and “D” duty is kept low. Therefore VOUT voltage goes up slowly and coil current is restricted. In term III (VOUT > VIN), status of Current Limiter is “normal mode”. So “A” voltage goes up suitable voltage, and “D” duty goes up slowly. And then VOUT voltage goes up to required voltage. Operation Current at start Current at PWM Max current 450mA 300mA VOUT L ERRAMP SW PWM comp A Soft Current limit B R Q S Q D LED current C PMOS Startup Control Off Status Soft Reference Charge current OSC VFB RFB Figure 19. Block diagram of soft start and off status EN I II III VIN Vshort VOUT Normal mode Current Limit Soft mode D Figure 20. timing chart ・Off status The gate voltage of the switching Tr either "H" or "L" at power off depends on the operation conditions at that time. When it is fixed to "H", the switching Tr remains to be ON, and invalid current from the battery is consumed. In order to prevent this, at power off, D is always fixed to L level. So that, it is possible to prevent invalid current at power off. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 9/18 TSZ02201-0G3G0C200360-1-2 12.SEP.2012 Rev.001 Datasheet BD6076GUT 2) Isolation control BD6076GUT has isolation control to prevent LED wrong lighting at power off. The cause of the LED wrong lighting is leak current from VIN to the white LED. Therefore, when BD6076GUT powered off (EN = L), the isolation control cuts the DC path between SW and VOUT, so that, it prevents from leak current from VIN to LED. VIN SW VOUT VOUTPUT White LED VFB Figure 21. Isolation control 3) Short-circuit protection and over voltage protection BD6076 has short-circuit protection and over voltage protection. These detect the voltage of VOUT, VOUTPUT, and at error, they stop the output Tr. Details are as shown below. ・Short-circuit protection In the case of short-circuit of the DC/DC output (VOUT) and switched output (VOUTPUT) to GND, the coil or the IC may be destructed. Therefore, at such an error as VOUT, VOTPUT becoming 0.7V or below, the Under Detector shown in the figure works, and turns off the output Tr, and prevents the coil and the IC from being destructed. And the IC changes from its action condition into its non action condition, and current does not flow to the coil (0mA). ・Over voltage protection In a case of error as the IC and the LED being cut off, over voltage causes the SW terminal and the VOUT terminal exceed the absolute maximum ratings, and may destroy the IC. Therefore, when VOUT becomes 18.5V or higher, the over voltage limits works, and turns off the output Tr, and prevents the SW terminal and the VOUT terminal from exceeding the absolute maximum ratings. At this moment, turns into non operation condition from operation condition, and the output voltage goes down slowly. And, when the output voltage becomes the hysteresis of the over voltage limit or below, the output voltage goes on up to 18.5V once again. This protection action is shown in Figure 22. COUT SW VOUTPUT VOUT OVER Detector OVER VOLTAGE REF driver UNDER Detector UNDER Detector UNDER VOLTAGE REF UNDER VOLTAGE REF Control Figure 22. Block diagram of short-circuit protection and over voltage 4) Thermal shut down BD6076GUT has thermal shut down function. The thermal shut down works at 175C or higher, and while holding the setting of EN control from the outside, turns into non operation condition from operation condition. And at 175C or below, the IC gets back to its normal operation. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 10/18 TSZ02201-0G3G0C200360-1-2 12.SEP.2012 Rev.001 Datasheet BD6076GUT ●Start control and brightness control BD6076GUT can control the start conditions by its EN terminal, and power off at 0.4V or below, and power on at 1.2V or higher. And by changing the duty of power on and off by PWM control, the LED brightness can be adjusted. 1. PWM brightness adjustment is done by giving PWM signal to EN as shown in Figure 23. The BD6076GUT is powered on/off by the PWM signal. By this method, LED current is controlled from 0 to the maximum current. The average LED current increases with proportion to the duty cycle of PWM signal. While in PWM off-cycle mode, the IC and LED both consume no currents, thus providing a high-efficiency operation. The recommended PWM frequency is 100Hz to 300Hz. 10µH or 22µH VIN 4.7µF PWM VOUT SW VIN 4.7µF VOUTPUT EN GNDA GND VFB 33ohm Figure 23. The brightness adjustment example of EN terminal by PWM (fPWM = 100 to 300Hz) High Pulse Minimum High Pulse = 13µs (Duty = 1/256) Range of Period = 3.3 ~ 10 ms EN Period Low Pulse Minimum Low Pulse = 13µs (Duty = 255/256) Range of Period = 3.3 ~ 10 ms EN Period Figure 24. The Rule of PWM signal of EN ●VFB characteristic on PWM function BD6076GUT constantly controls the rising time to decrease the tolerance of the VFB voltage at PWM function. VFB [mV] EN 13μs typ Max 150mV(average) Typ -3% Min VFB +3% Figure 25. VFB signal at PWM 3.1 3.6 5.5 Typical Target Spec VIN [V] VFB [mV] 500mV Duty 30% 150mV (Average) time Figure 26. VFB Voltage Line Regulation (PWM Duty=30%) www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 11/18 TSZ02201-0G3G0C200360-1-2 12.SEP.2012 Rev.001 Datasheet BD6076GUT ●VIN characteristic in Battery charge Transient during Battery charger is normally +300mV, 250Hz(duty 85%) from a baseline Battery Voltage 3.1 to 2.8V. In this term, it is necessary that VOUT Voltage noise is less than 200mVp-p. VIN [V] VIN [V] 10µs 10µs 4ms 3.1V 3.1V 2.8V 300mVp-p 2.8V 600µs time time VOUT [V] less than 200mVp-p time Figure 27. Battery Voltage transient during charger ●Setting range of LED current LED current is determined by the voltage of VFB and the resistor connected to VFB terminal. ILED is given as shown below. ILED = VFB/RFB The current in the standard application is as shown below. VFB=0.5V, RFB=33Ω ILED=15.2mA 10µH or 22µH VIN 4.7µF VIN PWM EN VOUT SW 4.7µF VOUTPUT ILED GNDA GND VFB 33ohm Figure 28. standard application The shaded portion in the figure below is the setting range of LED current to become the standard. Depending on coils and white LEDs to be used, however, some ICs may not be used at desired currents. Consequently, for the proper setting of LED current, thoroughly check it for the suitability under use conditions including applicable power supply voltage and temperature. 80 70 ILED[mA] 60 50 40 30 20 10 Min 16µA 0 7 8 9 10 11 12 13 14 15 16 17 18 VOUT[V] Figure 29. Setting range of LED current www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 12/18 TSZ02201-0G3G0C200360-1-2 12.SEP.2012 Rev.001 Datasheet BD6076GUT ●Selection of external parts Recommended external parts are listed as below. When to use other parts than these, select the following equivalent components. ・Coil Value Tolerance Manufacturer Product number Vertical size Size Horizontal size 22µH ±20% MURATA LQH3NPN220MGOL 3.0 10µH ±20% MURATA LQH3NPN100MGOL 22µH ±20% TDK 10µH ±20% 22µH Height DCR (Ω) 3.0 0.9 1.10 3.0 3.0 0.9 0.57 VLF3010ST220M 2.8 3.0 1.0 0.90 TDK VLF3010ST100M 2.8 3.0 1.0 0.49 ±20% TOKO DB3015C220M 2.6 2.8 1.5 0.60 10µH ±20% TOKO DB3015C100M 2.6 2.8 1.5 0.29 22µH ±20% Taiyo Yuden NR3010T220M 3.0 3.0 1.0 1.24 10µH ±20% Taiyo Yuden NR3010T100M 3.0 3.0 1.0 0.54 22µH ±20% Panasonic ELLVEG220NN 3.0 3.0 0.9 1.44 10µH ±20% Panasonic ELLVEG100NN 3.0 3.0 0.9 0.48 Please refer to the reference data of p.5 for the change in the efficiency when the coil is changed. ・Capacitor Manufacturer Product number Vertical size Size Horizontal size 1µF MURATA GRM188B11A105K 1.6 4.7µF MURATA GRM21BB31A475K 1µF MURATA 4.7µF MURATA Value Height Temperature range 0.8 0.8 -25°C to +85°C 2.0 1.25 1.25 -25°C to +85°C GRM188B31E105K 1.6 0.8 0.8 -25°C to +85°C GRM21BB31E475K 2.0 1.25 1.25 -25°C to +85°C 【 CIN 】 【 COUT 】 ・Resistor Value Tolerance Manufacturer Product number Vertical size Size Horizontal size ±1% ROHM MCR006YZPF□□□□ 0.6 0.3 Height 【 RFB 】 24Ω 0.23 Value □□□□ 15Ω 15R0 24Ω 24R0 33Ω 33R0 The coil is the component that is most influential to efficiency. Select the coil which direct current resistor (DCR) and current - inductance characteristic are excellent. Select a capacitor of ceramic type with excellent frequency and temperature characteristics. Further, select Capacitor to be used for CIN/COUT with small direct current resistance, and pay much attention to the PCB layout shown in the next page. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 13/18 TSZ02201-0G3G0C200360-1-2 12.SEP.2012 Rev.001 Datasheet BD6076GUT ●PCB Layout In order to make the most of the performance of this IC, PCB layout is very important. Please note that characteristics such as efficiency and ripple will likely to change greatly depending on PCB layout. To battery power source CIN GNDA EN VOUTPUT VIN VOUT VFB SW RFB GND To battery GND COUT L1 Figure 30. PCB layout Connect the input bypath capacitor CIN between VIN and GNDA pin closely, as shown in the upper diagram. Thereby, the input voltage ripple of the IC can be reduced. And, connect the output capacitor COUT between VOUT and GND pin closely. Thereby, the output voltage ripple of the IC can be reduced. Connect the current setting RFB VFB pin closely. Connect the GND closely connection side of RFB directly to GND pin. Connect the GNDA pin directly to GND pin. When those pins are not connected directly near the chip, the performance of BD6076GUT shall be influenced and may limit the current drive performance. As for the wire to the inductor, make its resistance component small to reduce electric power consumption and increase the entire efficiency. Please keep away which are subject to be influenced like VFB pin in wire connection with SW. The layout pattern in consideration of these is shown in the next page. 112mVpp VOUT (VIN=3.6V, Ta=25°C, VOUT=14V. 20mA Load) Figure 31. Output noise www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 14/18 TSZ02201-0G3G0C200360-1-2 12.SEP.2012 Rev.001 Datasheet BD6076GUT ●Recommended PCB layout VOUTPUT LED EN GNDA VFB RFB CIN LED VIN GND COUT VOUT LED L1 LED Figure 32. Front surface (TOP VIEW) GND SW Figure 33. Rear surface (TOP VIEW) ●Attention point for PCB layout For PCB layout design, the wire of power supply line should be low Impedance, and put bypass capacitor if necessary. Especially the wiring impedance must be low around DC/DC converter. ●About heat loss For heat design, operate DC/DC converter in the following condition. (The following temperature is a guaranteed temperature, margin will be needed.) 1. Periphery temperature Ta must be less than 85°C. 2. The loss of IC must be less than dissipation Pd. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 15/18 TSZ02201-0G3G0C200360-1-2 12.SEP.2012 Rev.001 Datasheet BD6076GUT ●Operational Notes 1) Absolute Maximum Ratings An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. If any special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical safety measures including the use of fuses, etc. 2) Operating conditions These conditions represent a range within which characteristics can be provided approximately as expected. The electrical characteristics are guaranteed under the conditions of each parameter. 3) Reverse connection of power supply connector The reverse connection of power supply connector can break down ICs. Take protective measures against the breakdown due to the reverse connection, such as mounting an external diode between the power supply and the IC’s power supply terminal. 4) Power supply line Design PCB pattern to provide low impedance for the wiring between the power supply and the GND lines. In this regard, for the digital block power supply and the analog block power supply, even though these power supplies has the same level of potential, separate the power supply pattern for the digital block from that for the analog block, thus suppressing the diffraction of digital noises to the analog block power supply resulting from impedance common to the wiring patterns. For the GND line, give consideration to design the patterns in a similar manner. Furthermore, for all power supply terminals to ICs, mount a capacitor between the power supply and the GND terminal. At the same time, in order to use an electrolytic capacitor, thoroughly check to be sure the characteristics of the capacitor to be used present no problem including the occurrence of capacity dropout at a low temperature, thus determining the constant. 5) GND voltage Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state. Furthermore, check to be sure no terminals are at a potential lower than the GND voltage including an actual electric transient. 6) Short circuit between terminals and erroneous mounting In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting can break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between terminals or between the terminal and the power supply or the GND terminal, the ICs can break down. 7) Operation in strong electromagnetic field Be noted that using ICs in the strong electromagnetic field can malfunction them. 8) Inspection with set PCB On the inspection with the set PCB, if a capacitor is connected to a low-impedance IC terminal, the IC can suffer stress. Therefore, be sure to discharge from the set PCB by each process. Furthermore, in order to mount or dismount the set PCB to/from the jig for the inspection process, be sure to turn OFF the power supply and then mount the set PCB to the jig. After the completion of the inspection, be sure to turn OFF the power supply and then dismount it from the jig. In addition, for protection against static electricity, establish a ground for the assembly process and pay thorough attention to the transportation and the storage of the set PCB. 9) Input terminals In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of the input terminal. Therefore, pay thorough attention not to handle the input terminals, such as to apply to the input terminals a voltage lower than the GND respectively, so that any parasitic element will operate. Furthermore, do not apply a voltage to the input terminals when no power supply voltage is applied to the IC. In addition, even if the power supply voltage is applied, apply to the input terminals a voltage lower than the power supply voltage or within the guaranteed value of electrical characteristics. 10) Ground wiring pattern If small-signal GND and large-current GND are provided, It will be recommended to separate the large-current GND pattern from the small-signal GND pattern and establish a single ground at the reference point of the set PCB so that resistance to the wiring pattern and voltage fluctuations due to a large current will cause no fluctuations in voltages of the small-signal GND. Pay attention not to cause fluctuations in the GND wiring pattern of external parts as well. 11) External capacitor In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a degradation in the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc. 12) Thermal shutdown circuit (TSD) When junction temperatures become 175°C (Typ.) or higher, the thermal shutdown circuit operates and turns a switch OFF. The thermal shutdown circuit, which is aimed at isolating the LSI from thermal runaway as much as possible, is not aimed at the protection or guarantee of the LSI. Therefore, do not continuously use the LSI with this circuit operating or use the LSI assuming its operation. 13) Thermal design Perform thermal design in which there are adequate margins by taking into account the permissible dissipation (Pd) in actual states of use. 14) Selection of coil Select the low DCR inductors to decrease power loss for DC/DC converter. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 16/18 TSZ02201-0G3G0C200360-1-2 12.SEP.2012 Rev.001 Datasheet BD6076GUT ●Ordering Information B D 6 0 7 6 Part Number G U T - Package GUT : VCSP60N1 E2 Packaging and forming specification E2: Embossed tape and reel ●Marking Diagram VCSP60N1 (TOP VIEW) 1PIN MARK Part Number Marking 6076 LOT Number ●Physical Dimension Tape and Reel Information (BD6076GUT) VCSP60N1 (BD6176GUT) <Tape and Reel information> 1.68±0.05 1.68±0.05 0.2MIN 0.6±0.075 1PIN MARK Tape Embossed carrier tape Quantity 3000pcs Direction of feed E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand ) 0.08 S 8-φ0.3±0.05 0.05 A B (φ0.15)INDEX POST A C 0.34±0.05 S B A 1 0.34±0.05 2 3 P=0.5×2 P=0.5×2 B (Unit : mm) 1pin Reel Direction of feed ∗ Order quantity needs to be multiple of the minimum quantity. Status of this document The English version of this document is formal specification. A customer may use this translation version only for a reference to help reading the formal version. If there are any differences in translation version of this document formal version takes priority. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 17/18 TSZ02201-0G3G0C200360-1-2 12.SEP.2012 Rev.001 Datasheet BD6076GUT ●Revision History Date Revision 12.Sep.2012 001 Changes New Release www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 18/18 TSZ02201-0G3G0C200360-1-2 12.SEP.2012 Rev.001 Datasheet Notice ●General Precaution 1) Before you use our Products, you are requested to carefully read this document and fully understand its contents. ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any ROHM’s Products against warning, caution or note contained in this document. 2) All information contained in this document is current as of the issuing date and subject to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales representative. ●Precaution on using ROHM Products 1) Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment, transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. 2) ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3) Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4) The Products are not subject to radiation-proof design. 5) Please verify and confirm characteristics of the final or mounted products in using the Products. 6) In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse) is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7) De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8) Confirm that operation temperature is within the specified range described in the product specification. 9) ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Notice - Rev.003 © 2012 ROHM Co., Ltd. All rights reserved. Datasheet ●Precaution for Mounting / Circuit board design 1) When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2) In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification ●Precautions Regarding Application Examples and External Circuits 1) If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2) You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. ●Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). ●Precaution for Storage / Transportation 1) Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2) Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3) Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4) Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. ●Precaution for Product Label QR code printed on ROHM Products label is for ROHM’s internal use only. ●Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. ●Precaution for Foreign Exchange and Foreign Trade act Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with ROHM representative in case of export. ●Precaution Regarding Intellectual Property Rights 1) All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable for infringement of any intellectual property rights or other damages arising from use of such information or data.: 2) No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the information contained in this document. Notice - Rev.003 © 2012 ROHM Co., Ltd. All rights reserved. Datasheet ●Other Precaution 1) The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or concerning such information. 2) This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 3) The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 4) In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 5) The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice - Rev.003 © 2012 ROHM Co., Ltd. All rights reserved.