CCSO-914X-1000 True SineWave SAW Based Clock Osc 9x14MM SMD 5 Volt Ultra-Low Phase Noise 1GHz SAW Clock Model CCSO-914-1000 is a 1GHz SAW (surface acoustic wave) Clock Oscillator (CCSO). SAW crystal technology provides low-noise and low-jitter performance with true sinewave output. Features include -138dBc/Hz phase noise at 10kHz offset, 5V input voltage, -40 to +85C operating temperature, FR5 PCB and 9x14 mm SMT package. The oscillator has no sub-harmonic and the second harmonic is typically -20dBc. Applications include: System Clock for Network Clock Generator/Synchronizer, Clock for DDS, Test and Measurement, Avionics, Point-to-Point Radios, and Multi-point Radios. Rev.: C Date: 10-23-07 CCSO-914X-1000 True SineWave SAW Based Clock Osc 9x14MM SMD 5 Volt Frequency : Temperature Range: Storage: Input Voltage: 1 GHz -40°C to 85°C -45°C to 90°C 5.0V ± 0.25V Freq. vs Temp. Input Current: Output: Output Power: Start-up time: 2nd Harmonic: Sub-harmonics: Modulation BW: Jitter: SONET OC-48(12KHz~80MHz) SONET OC-192(50KHz~80MHz) ±100ppm Typ. 25mA Typ., 35mA Max True SineWave +8dBm Min. into 50 Ohm Load 2ms Typ., 10ms Max -20dBc Typ., -15dBc Max None >20KHz @ -3dB Phase Noise Typical: 1KHz 10KHz 100KHz 1MHz 10MHz 0.18ps RMS Typ., 0.20ps RMS Max 0.12ps RMS Typ., 0.15ps RMS Max -110 dBc/Hz -138 dBc/Hz -150 dBc/Hz -160 dBc/Hz -170 dBc/Hz 0.560 (14.2) 0.360 (9.14) 0.040 (1.01) CRYSTEK Part Number Freq Date Code 1 2 4 3 0.070 (1.77) 1 0.200 (5.08) SUGGESTED PAD LAYOUT 0.560 (14.2) 0.210 (5.3) Pad 0.050 (1.27) Connection N/C 2 GND 3 Output 4 Vdd 0.090 (2.28) 0.280 (7.11) 0.200 (5.08) Rev.: C Date: 10-23-07 CCSO-914X-1000 True SineWave SAW Based Clock Osc 9x14MM SMD 5 Volt Frequency VS Temperature RECOMMENDED REFLOW SOLDERING PROFILE Ramp-Up 3°C/Sec Max. TEMPERATURE 260°C 217°C Critical Temperature Zone Ramp-Down 6°C/Sec. 200°C 150°C Preheat 180 Secs. Max. 8 Minutes Max. 90 Secs. Max. 260°C for 10 Secs. Max. NOTE: Reflow Profile with 240°C peak also acceptable. Parameter Mechanical Shock Mechanical Vibration Solderability Solvent Resistance Resistance to Soldering Heat Thermal Shock Moisture Resistance Conditions MIL-STD-883, Method 2002, Condition B MIL-STD-883, Method 2007, Condition A MIL-STD-883, Method 2003 MIL-STD-202, Method 215 MIL-STD-202, Method 210, Condition I or J MIL-STD-883, Method 1011, Condition A MIL-STD-883, Method 1004 Rev.: C Date: 10-23-07