ETC1 ATT3042-125M132I Field-programmable gate array Datasheet

Data Sheet
February 1997
ATT3000 Series Field-Programmable Gate Arrays
Features
Description
■
High performance:
— Up to 270 MHz toggle rates
— 4-input LUT delays <2.7 ns
■
User-programmable gate arrays
— Unlimited reprogrammability
— Easy design iteration through in-system
logic changes
■
Flexible array architecture:
— Compatible arrays ranging from 1500 to
6000 gate logic complexity
— Extensive register, combinatorial, and I/O
capabilities
— Low-skew clock nets
— High fan-out signal distribution
— Internal 3-state bus capabilities
— TTL or CMOS input thresholds
— On-chip oscillator amplifier
The CMOS ATT3000 Series Field-Programmable
Gate Array (FPGA) family provides a group of highdensity, digital integrated circuits. Their regular,
extendable, flexible, user-programmable array
architecture is composed of a configuration program
store plus three types of configurable elements: a
perimeter of I/O blocks, a core array of logic blocks,
and resources for interconnection. The general structure of an FPGA is shown in Figure 1.
The ORCA Foundry for ATT3000 Development System provides automatic place and route of netlists.
Logic and timing simulation are available as design
verification alternatives. The design editor is used for
interactive design optimization and to compile the
data pattern that represents the configuration program.
■
Standard product availability:
— Low-power 0.55 µm CMOS, static memory
technology
— Pin-for-pin compatible with Xilinx* XC3000*
and XC3100* families
— Cost-effective for volume production
— 100% factory pretested
— Selectable configuration modes
■
ORCA™ Foundry for ATT3000 Development
System support
The FPGA’s user-logic functions and interconnections are determined by the configuration program
data stored in internal static memory cells. The program can be loaded in any of several modes to
accommodate various system requirements. The
program data resides externally in an EEPROM,
EPROM, or ROM on the application circuit board, or
on a floppy disk or hard disk. On-chip initialization
logic provides for optional automatic loading of program data at powerup. A serial configuration PROM
can provide a very simple serial configuration program storage.
■
All FPGAs processed on a QML-certified line
*
■
Extensive packaging options
Xilinx, XC3000, and XC3100 are registered trademarks of
Xilinx, Inc.
Table 1. ATT3000 Series FPGAs
FPGA
ATT3020
ATT3030
ATT3042
ATT3064
ATT3090
Max
Logic
Gates
1,500
2,000
3,000
4,500
6,000
Typical Gate
Range
1,000—1,500
1,500—2,000
2,000—3,000
3,500—4,500
5,000—6,000
Configurable
Logic
Blocks
64
100
144
224
320
Array
User I/Os
Max
FlipFlops
Horizontal
Long Lines
Configuration
Data Bits
8x8
10 x 10
12 x 12
16 x 14
20 x 16
64
80
96
120
144
256
360
480
688
928
16
20
24
32
40
14,779
22,176
30,784
46,064
64,160
ATT3000 Series Field-Programmable Gate Arrays
Data Sheet
February 1997
Table of Contents
Contents
Page
Features ..................................................................... 1
Description ................................................................. 1
Architecture ................................................................ 3
Configuration Memory................................................ 4
I/O Block ..................................................................... 5
Summary of I/O Options ......................................... 6
Configurable Logic Block ............................................ 7
Programmable Interconnect ....................................... 9
General-Purpose Interconnect ............................. 10
Direct Interconnect ............................................... 11
Long Lines ............................................................ 13
Internal Buses ...................................................... 14
Crystal Oscillator .................................................. 16
Configuration ............................................................ 17
Initialization Phase ............................................... 17
Configuration Data ............................................... 19
Configuration Modes ................................................ 22
Master Mode ........................................................ 22
Peripheral Mode ................................................... 24
Slave Mode .......................................................... 25
Daisy Chain .......................................................... 26
Special Configuration Functions .............................. 27
Input Thresholds ................................................... 27
Readback ............................................................. 27
Reprogram ........................................................... 28
DONE Pull-Up ...................................................... 28
DONE Timing ....................................................... 28
RESET Timing ...................................................... 28
Crystal Oscillator Division .................................... 28
2
Contents
Page
Performance .............................................................29
Device Performance .............................................29
Logic Block Performance ......................................30
Interconnect Performance .....................................30
Power ........................................................................32
Power Distribution .................................................32
Power Dissipation .................................................33
Pin Information .........................................................34
Pin Assignments .......................................................39
Package Thermal Characteristics .............................50
Package Coplanarity .................................................51
Package Parasitics ...................................................51
Absolute Maximum Ratings ......................................53
Electrical Characteristics ..........................................54
Outline Diagrams ......................................................68
Terms and Definitions ...........................................68
44-Pin PLCC .........................................................68
68-Pin PLCC .........................................................69
84-Pin PLCC .........................................................70
100-Pin QFP .........................................................71
100-Pin TQFP .......................................................72
132-Pin PPGA ......................................................73
144-Pin TQFP .......................................................74
160-Pin QFP .........................................................75
175-Pin PPGA ......................................................76
208-Pin SQFP .......................................................77
Ordering Information .................................................78
Lucent Technologies Inc.
Data Sheet
February 1997
ATT3000 Series Field-Programmable Gate Arrays
Architecture
The perimeter of configurable I/O blocks (IOBs) provides a programmable interface between the internal
logic array and the device package pins. The array of
configurable logic blocks (CLBs) performs userspecified logic functions. The interconnect resources
are programmed to form networks, carrying logic
signals among blocks, analogous to printed-circuit
board traces connecting MSI/SSI packages.
The blocks’ logic functions are implemented by
programmed look-up tables. Functional options are
implemented by program-controlled multiplexers.
Interconnecting networks between blocks are
implemented with metal segments joined by programcontrolled pass transistors. These functions of the
FPGA are established by a configuration program
which is loaded into an internal, distributed array of
configuration memory cells. The configuration program
is loaded into the FPGA at powerup and may be
reloaded on command. The FPGA includes logic and
control signals to implement automatic or passive
configuration. Program data may be either bit serial or
byte parallel. The ORCA Foundry for ATT3000 Development System generates the configuration program
bit stream used to configure the FPGA. The memory
loading process is independent of the user logic functions.
Figure 1. Field-Programmable Gate Array Structure
Lucent Technologies Inc.
3
Data Sheet
February 1997
ATT3000 Series Field-Programmable Gate Arrays
Configuration Memory
The static memory cell used for the configuration memory in the FPGA has been designed specifically for
high reliability and noise immunity. Integrity of the
FPGA configuration memory based on this design is
ensured even under various adverse conditions. Compared with other programming alternatives, static memory is believed to provide the best combination of high
density, high performance, high reliability, and comprehensive testability.
As shown in Figure 2, the basic memory cell consists of
two CMOS inverters plus a pass transistor used for
writing and reading cell data. The cell is only written to
during configuration and only read from during readback. During normal operation, the cell provides continuous control and the pass transistor is off and does not
affect cell stability. This is quite different from the operation of conventional memory devices, in which the cells
are frequently read and rewritten.
READ OR
WRITE
The memory cell outputs Q and Q use full ground and
VCC levels and provide continuous, direct control. The
additional capacitive load and the absence of address
decoding and sense amplifiers provide high stability to
the cell. Due to their structure, the configuration memory cells are not affected by extreme power supply
excursions or very high levels of alpha particle radiation. Soft errors have not been observed in reliability
testing.
Two methods of loading configuration data use serial
data, while three use byte-wide data. The internal configuration logic utilizes framing information, embedded
in the program data by the ORCA Foundry Development System, to direct memory cell loading. The serial
data framing and length count preamble provide programming compatibility for mixes of various Lucent programmable gate arrays in a synchronous, serial, daisychain fashion.
Q CONFIGURATION
CONTROL
Q
DATA
5-3101(F)
Figure 2. Static Configuration Memory Cell
4
Lucent Technologies Inc.
Data Sheet
February 1997
ATT3000 Series Field-Programmable Gate Arrays
I/O Block
package pin to internal logic levels. The global inputbuffer threshold of the IOB can be programmed to be
compatible with either TTL or CMOS levels. The buffered input signal drives the data input of a storage
element which may be configured as a positive-edge
triggered D flip-flop or a low-level transparent latch. The
sense of the clock can be inverted (negative edge/high
transparent) as long as all IOBs on the same clock net
use the same clock sense. Clock/load signals (IOB pins
.ik and .ok) can be selected from either of two die edge
metal lines. I/O storage elements are reset during configuration or by the active-low chip RESET input. Both
direct input (from IOB pin .i) and registered input (from
IOB pin .q) signals are available for interconnect.
Each user-configurable I/O block (IOB), shown in
Figure 3, provides an interface between the external
package pin of the device and the internal user logic.
Each IOB includes both registered and direct input
paths and a programmable 3-state output buffer which
may be driven by a registered or direct output signal.
Configuration options allow each IOB an inversion, a
controlled slew rate, and a high-impedance pull-up.
Each input circuit also provides input clamping diodes
to provide electrostatic protection and circuits to inhibit
latch-up produced by input currents.
The input buffer portion of each IOB provides threshold
detection to translate external signals applied to the
PROGRAM-CONTROLLED MEMORY CELLS
OUT
INVERT
3-STATE
OUTPUT ENABLE
OUT
3-STATE
INVERT
OUTPUT
SELECT
SLEW
RATE
VCC
PASSIVE
PULL UP
.t
.o
D
OUTPUT
BUFFER
Q
FLIPFLOP
I/O PAD
R
DIRECT IN
REGISTERED IN
.i
.q
Q
D
FLIPFLOP
OR
LATCH
TTL OR
CMOS
INPUT
THRESHOLD
R
.ok
(GLOBAL RESET)
.lk
CK1
CK2
PROGRAMCONTROLLED
MULTIPLEXER
= PROGRAMMABLE INTERCONNECTION POINT OR PIP
5-3102(F)
Figure 3. Input/Output Block
Lucent Technologies Inc.
5
Data Sheet
February 1997
ATT3000 Series Field-Programmable Gate Arrays
I/O Block (continued)
For reliable operation, inputs should have transition
times of less than 100 ns and should not be left floating. Floating CMOS input-pin circuits might be at
threshold and produce oscillations. This can produce
additional power dissipation and system noise. A
typical hysteresis of about 300 mV reduces sensitivity
to input noise. Each user IOB includes a programmable
high-impedance pull-up resistor which is selected by
the program to provide a constant high for otherwise
undriven package pins. Normal CMOS handling
precautions should be observed.
Flip-flop loop delays for the IOB and logic block flipflops are approximately 3 ns. This short delay provides
good performance under asynchronous clock and data
conditions. Short loop delays minimize the probability
of a metastable condition which can result from assertion of the clock during data transitions. Because of the
short loop delay characteristic in the FPGA, the IOB
flip-flops can be used to synchronize external signals
applied to the device. When synchronized in the IOB,
the signals can be used internally without further consideration of their clock relative timing, except as it
applies to the internal logic and routing path delays.
Output buffers of the IOBs provide CMOS-compatible
4 mA source-or-sink drive for high fan-out CMOS or
TTL compatible signal levels. The network driving IOB
pin .o becomes the registered or direct data source for
the output buffer. The 3-state control signal (IOB pin .t)
can control output activity. An open-drain type output
may be obtained by using the same signal for driving
the output and 3-state signal nets so that the buffer output is enabled only for a LOW.
Configuration program bits for each IOB control
features such as optional output register, logical signal
inversion, and 3-state and slew rate control of the output.
6
The program-controlled memory cells in Figure 3
control the following options:
■
Logical inversion of the output is controlled by one
configuration program bit per IOB.
■
Logical 3-state control of each IOB output buffer is
determined by the states of configuration program
bits which turn the buffer on or off or select the output
buffer 3-state control interconnection (IOB pin .t).
When this IOB output control signal is high, a logic 1,
the buffer is disabled and the package pin is high
impedance. When this IOB output control signal is
low, a logic 0, the buffer is enabled and the package
pin is active. Inversion of the buffer 3-state control
logic sense (output enable) is controlled by an additional configuration program bit.
■
Direct or registered output is selectable for each IOB.
The register uses a positive-edge, clocked flip-flop.
The clock source may be supplied (IOB pin .ok) by
either of two metal lines available along each die
edge. Each of these lines is driven by an invertible
buffer.
■
Increased output transition speed can be selected to
improve critical timing. Slower transitions reduce
capacitive load peak currents of noncritical outputs
and minimize system noise.
■
A high-impedance pull-up resistor may be used to
prevent unused inputs from floating.
Summary of I/O Options
■
Inputs
—Direct
—Flip-flop/latch
—CMOS/TTL threshold (chip inputs)
—Pull-up resistor/open circuit
■
Outputs
—Direct/registered
—Inverted/not
—3-state/on/off
—Full speed/slew limited
—3-state/output enable (inverse)
Lucent Technologies Inc.
Data Sheet
February 1997
ATT3000 Series Field-Programmable Gate Arrays
Configurable Logic Block
The array of configurable logic blocks (CLBs) provides
the functional elements from which the user’s logic is
constructed. The logic blocks are arranged in a matrix
within the perimeter of IOBs. The ATT3020 has 64 such
blocks arranged in eight rows and eight columns. The
ORCA Foundry Development System is used to compile the configuration data for loading into the internal
configuration memory to define the operation and interconnection of each block. User definition of CLBs and
their interconnecting networks may be done by automatic translation from a schematic capture logic diagram or optionally by installing library or user macros.
Each CLB has a combinatorial logic section, two flipflops, and an internal control section; see Figure 4
below. There are five logic inputs (.a, .b, .c, .d, and .e);
a common clock input (.k); an asynchronous direct
reset input (.rd); and an enable clock (.ec). All may be
driven from the interconnect resources adjacent to the
blocks. Each CLB also has two outputs (.x and .y)
which may drive interconnect networks.
Data input for either flip-flop within a CLB is supplied
from the function F or G outputs of the combinatorial
logic, or the block input, data-in (.di). Both flip-flops in
each CLB share the asynchronous reset (.rd) which,
DATA IN
when enabled and high, is dominant over clocked
inputs. All flip-flops are reset by the active-low chip
input, RESET, or during the configuration process.
The flip-flops share the enable clock (.ec) which, when
low, recirculates the flip-flops’ present states and inhibits response to the data-in or combinatorial function
inputs on a CLB. The user may enable these control
inputs and select their sources. The user may also
select the clock net input (.k), as well as its active
sense within each logic block. This programmable
inversion eliminates the need to route both phases of a
clock signal throughout the device. Flexible routing
allows use of common or individual CLB clocking.
The combinatorial logic portion of the logic block uses
a 32 x 1 look-up table to implement Boolean functions.
Variables selected from the five logic inputs and the
two internal block flip-flops are used as table address
inputs. The combinatorial propagation delay through
the network is independent of the logic function generated and is spike-free for single-input variable changes.
This technique can generate two independent logic
functions of up to four variables each as shown in Figure 5A, or a single function of five variables as shown in
Figure 5B, or some functions of seven variables as
shown in Figure 5C.
.di
F
DIN
G
LOGIC
VARIABLES
.a
.b
.c
.d
.e
0
MUX
1
D
Q
QX
RD
QX
.x
F
F
COMBINATORIAL
FUNCTION
CLB OUTPUTS
G
G
.y
QX
F
DIN
G
ENABLE
CLOCK
QY
0
MUX
1
D
Q
.ec
RD
“1” (ENABLE)
CLOCK
DIRECT
RESET
.k
.rd
“0” (INHIBIT)
(GLOBAL RESET)
5-3103(F)
Figure 4. Configurable Logic Block
Lucent Technologies Inc.
7
Data Sheet
February 1997
ATT3000 Series Field-Programmable Gate Arrays
Configurable Logic Block (continued)
A
B
QX
QY
ANY FUNCTION
OF UP TO 4
VARIABLES
F
QY
ANY FUNCTION
OF UP TO 4
VARIABLES
G
C
D
E
A
B
QX
C
D
5A
E
Figure 6 shows a modulo 8 binary counter with parallel
enable. It uses one CLB of each type. The partial functions of six or seven variables are implemented by
using the input variable (.e) to dynamically select
between two functions of four different variables. For
the two functions of four variables each, the independent results (F and G) may be used as data inputs to
either flip-flop or logic block output. For the single function of five variables and merged functions of six or
seven variables, the F and G outputs are identical.
Symmetry of the F and G functions and the flip-flops
allows the interchange of CLB outputs to optimize
routing efficiencies of the networks interconnecting
the logic and IOBs.
CLOCK
ENABLE
TERMINAL
COUNT
PARALLEL
ENABLE
A
B
CLOCK
QX
QY
C
D
E
ANY FUNCTION
OF 5
VARIABLES
F
DUAL FUNCTION OF
4 VARIABLES
G
5B
D Q
Q0
D Q
Q1
D0
A
B
QX
QY
C
D
ANY FUNCTION
OF UP TO 4
VARIABLES
F
M
U
X
A
B
QX
QY
C
D
E
D1
G
FUNCTION OF 5 VARIABLES
ANY FUNCTION
OF UP TO 4
VARIABLES
5C
5-3104(F)
5A. Combinatorial Logic Option 1 generates two functions of four
variables each. One variable, A, must be common to both functions. The second and third variables can be any choice among
B, C, Qx, and Qy. The fourth variable can be either D or E.
D Q
Q2
D2
5B. Combinatorial Logic Option 2 generates any function of five
variables: A, D, E, and two choices among B, C, Qx, Qy.
5C. Combinatorial Logic Option 3 allows variable E to select
between two functions of four variables: both have common
inputs, A and D, and any choice among B, C, Qx, and Qy for
the remaining two variables. Option 3 can then implement
some functions of six or seven variables.
FUNCTION OF 6 VARIABLES
Figure 5. Combinatorial Logic Diagram
5-3105(F)
Figure 6. C8BCP Macro
8
Lucent Technologies Inc.
Data Sheet
February 1997
ATT3000 Series Field-Programmable Gate Arrays
Programmable Interconnect
Programmable interconnection resources in the FPGA
provide routing paths to connect inputs and outputs of
the IOBs and logic blocks into logical networks. Interconnections between blocks are composed from a twolayer grid of metal segments. Specially designed pass
transistors, each controlled by a configuration bit, form
programmable interconnect points (PIPs) and switching
matrices used to implement the necessary connections
between selected metal segments and block pins.
Figure 7 is an example of a routed net. The ORCA
Foundry Development System provides automatic routing of these interconnections. Interactive routing is also
available for design optimization. The inputs of the logic
or IOBs are multiplexers which can be programmed to
select an input network from the adjacent interconnect
segments. Since the switch connections to block inputs
are unidirectional (as are block outputs), they are
usable only for block input connection and not routing.
Figure 8 illustrates routing access to logic block input
variables, control inputs, and block outputs.
Three types of metal resources are provided to accommodate various network interconnect requirements:
■
■
■
General-purpose interconnect
Direct connection
Long lines (multiplexed buses and wide-AND gates)
Figure 8. CLB Input and Output Routing
Figure 7. Example of Routing Resources
Lucent Technologies Inc.
9
Data Sheet
February 1997
ATT3000 Series Field-Programmable Gate Arrays
Programmable Interconnect (continued)
General-Purpose Interconnect
General-purpose interconnect, as shown in Figure 9,
consists of a grid of five horizontal and five vertical
metal segments located between the rows and columns of logic and IOBs. Each segment is the height or
width of a logic block. Switching matrices join the ends
of these segments and allow programmed interconnections between the metal grid segments of adjoining
rows and columns. The switches of an unprogrammed
device are all nonconducting. The connections through
the switch matrix may be established by automatic or
interactive routing by selecting the desired pairs of
matrix pins to be connected or disconnected. The
legitimate switching matrix combinations for each pin
are indicated in Figure 10.
Special buffers within the general interconnect areas
provide periodic signal isolation and restoration for
improved performance of lengthy nets. The interconnect buffers are available to propagate signals in either
direction on a given general interconnect segment.
These bidirectional (bidi) buffers are found adjacent to
the switching matrices, above and to the right. The
other PIPs adjacent to the matrices are accessed to or
from long lines. The development system automatically
defines the buffer direction based on the location of the
interconnection network source. The delay calculator in
the ORCA Foundry Development System automatically
calculates and displays the block, interconnect, and
buffer delays for any paths selected. Generation of the
simulation netlist with a worst-case delay model is also
provided by the development system.
Some of the interconnect PIPs are directional, as
indicated below:
■
■
■
■
■
■
ND is a nondirectional interconnection.
D:H->V is a PIP which drives from a horizontal to a
vertical line.
D:V->H is a PIP which drives from a vertical to a
horizontal line.
D:C->T is a T-PIP which drives from a cross of a
T to the tail.
D:CW is a corner PIP which drives in the clockwise
direction.
P0 indicates the PIP is nonconducting; P1 is on.
10
Figure 9. FPGA General-Purpose Interconnect
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
Figure 10. Switch Matrix Interconnection Options
Lucent Technologies Inc.
Data Sheet
February 1997
ATT3000 Series Field-Programmable Gate Arrays
Programmable Interconnect (continued)
Direct Interconnect
Direct interconnect (shown in Figure 11) provides the
most efficient implementation of networks between
adjacent logic or IOBs. Signals routed from block to
block using the direct interconnect exhibit minimum
interconnect propagation and use no general interconnect resources. For each CLB, the .x output may be
connected directly to the .b input of the CLB immediately to its right and to the .c input of the CLB to its left.
The .y output can use direct interconnect to drive the .d
input of the block immediately above, and the .a input
of the block below. Direct interconnect should be used
to maximize the speed of high-performance portions of
logic. Where logic blocks are adjacent to IOBs, direct
connect is provided alternately to the IOB inputs (.i)
and outputs (.o) on all four edges of the die. The right
edge provides additional direct connects from CLB outputs to adjacent IOBs. Direct interconnections of IOBs
with CLBs are shown in Figure 12.
Figure 11. Direct Interconnect
Lucent Technologies Inc.
11
ATT3000 Series Field-Programmable Gate Arrays
Data Sheet
February 1997
Programmable Interconnect (continued)
Figure 12. ATT3020 Die Edge I/O Blocks with Direct Access to Adjacent CLB
12
Lucent Technologies Inc.
Data Sheet
February 1997
ATT3000 Series Field-Programmable Gate Arrays
Programmable Interconnect (continued)
Long Lines
The long lines bypass the switch matrices and are
intended primarily for signals which must travel a long
distance, or must have minimum skew among multiple
destinations. Long lines, shown in Figure 13, run
vertically and horizontally the height or width of the
interconnect area. Each interconnection column has
three vertical long lines, and each interconnection row
has two horizontal long lines. Additionally, two long
lines are located adjacent to the outer sets of switching
matrices. Two vertical long lines in each column are
connectable half-length lines, except on the ATT3020,
where only the outer long lines serve that function.
Long lines can be driven by a logic block or IOB output
on a column-by-column basis. This capability provides
a common low-skew control or clock line within each
column of logic blocks. Interconnections of these long
lines are shown in Figure 14. Isolation buffers are provided at each input to a long line and are enabled automatically by the development system when a
connection is made.
3-
-
Figure 13. Horizontal and Vertical Long Lines in the FPGA
Lucent Technologies Inc.
13
Data Sheet
February 1997
ATT3000 Series Field-Programmable Gate Arrays
Programmable Interconnect (continued)
Internal Buses
A buffer in the upper left corner of the FPGA chip drives
a global net which is available to all .k inputs of logic
blocks. Using the global buffer for a clock signal provides a skew-free, high fan-out, synchronized clock for
use at any or all of the I/O and logic blocks. Configuration bits for the .k input to each logic block can select
this global line, or another routing resource, as the
clock source for its flip-flops. This net may also be programmed to drive the die edge clock lines for IOB use.
An enhanced speed, CMOS threshold, offers direct
access to this buffer and is available at the
second pad from the top of the left die edge.
A pair of 3-state buffers is located adjacent to each
CLB. These buffers allow logic to drive the horizontal
long lines. Logical operation of the 3-state buffer
controls allows them to implement wide multiplexing
functions. Any 3-state buffer input can be selected as
drive for the horizontal long line bus by applying a low
logic level on its 3-state control line (see Figure 15A).
The user is required to avoid contention that can result
from multiple drivers with opposing logic levels. Control
of the 3-state input by the same signal that drives the
buffer input creates an open-drain wired-AND function.
A logical high on both buffer inputs creates a high
impedance which represents no contention. A logical
low enables the buffer to drive the long line low (see
Figure 15B). Pull-up resistors are available at each end
of the long line to provide a high output when all connected buffers are nonconducting. This forms fast, wide
gating functions. When data drives the inputs and separate signals drive the 3-state control lines, these buffers form multiplexers (3-state buses). In this case, care
must be used to prevent contention through multiple
active buffers of conflicting levels on a common line.
Figure 16 shows 3-state buffers, long lines, and pull-up
resistors.
A buffer in the lower right corner of the array drives a
horizontal long line that can drive programmed connections to a vertical long line in each interconnection
column. This alternate buffer also has low skew and
high fan-out. The network formed by this alternate buffer’s long lines can be selected to drive the .k inputs of
the logic blocks. CMOS threshold, high-speed access
to this buffer is available from the third pad from the
bottom of the right die edge.
3-STATE
Figure 14. Programmable Interconnection of Long Lines
14
Lucent Technologies Inc.
Data Sheet
February 1997
ATT3000 Series Field-Programmable Gate Arrays
Programmable Interconnect (continued)
VCC
VCC
Z = DA • DB • DC • ... • DN
(LOW)
DA
DB
DC
5-3106(F)
DN
Figure 15A. 3-State Buffers Implement a Wired-AND Function
Z = DA • A + DB • B + DC • C + ... + DN • N
WEAK KEEPER CIRCUIT
DA
DB
DC
DN
A
B
C
N
5-3107(F)
Figure 15B. 3-State Buffers Implement a Multiplexer
BIDIRECTIONAL
INTERCONNECT
BUFFERS
GLOBAL NET
GG
3 VERTICAL LONG LINES
PER COLUMN
GH
P48
HORIZONTAL LONG LINE
PULL-UP RESISTOR
HORIZONTAL LONG LINE
OSCILLATOR
AMPLIFIER OUTPUT
HG
P47
DIRECT INPUT OF P47
TO AUXILIARY BUFFER
BCL
KIN
CRYSTAL OSCILLATOR
BUFFER
HH
3-STATE INPUT
O
S
C
3-STATE CONTROL
3-STATE BUFFER
P46
.l .lk
.q.ok
.o
O
P
G
M
P40
P41
P42
P43
ALTERNATE BUFFER
RST
OSCILLATOR
AMPLIFIER INPUT
5-3108(F)
Figure 16. Lower-Right Corner of ATT3020
Lucent Technologies Inc.
15
Data Sheet
February 1997
ATT3000 Series Field-Programmable Gate Arrays
Programmable Interconnect (continued)
to minimize loading of the crystal. The inversion of the
amplifier, together with the R-C networks and an AT cut
series resonant crystal, produces the 360° phase shift
of the Pierce oscillator. A series resistor, R2, may be
included to add to the amplifier output impedance when
needed for phase shift control or crystal resistance
matching, or to limit the amplifier input swing to control
clipping at large amplitudes. Excess feedback voltage
may be corrected by the ratio of C2/C1. The amplifier is
designed to be used from 1 MHz to one-half the specified CLB toggle frequency. Use at frequencies below
1 MHz may require individual characterization with
respect to a series resistance. Crystal oscillators above
20 MHz generally require a crystal which operates in a
third overtone mode, where the fundamental frequency
must be suppressed by an inductor across C2. When
the oscillator inverter is not used, these IOBs and their
package pins are available for general user I/O.
Crystal Oscillator
Figure 16 shows the location of an internal high-speed
inverting amplifier which may be used to implement an
on-chip crystal oscillator. It is associated with the auxiliary buffer in the lower right corner of the die. When the
oscillator is configured and connected as a signal
source, two special user IOBs are also configured to
connect the oscillator amplifier with external crystal
oscillator components as shown in Figure 17. A divideby-two option is available to ensure symmetry. The
oscillator circuit becomes active before configuration is
complete in order to allow the oscillator to stabilize.
Actual internal connection is delayed until completion
of configuration. In Figure 17, the feedback resistor,
R1, between output and input biases the amplifier at
threshold. The value should be as large as is practical
D
INTERNAL
Q
EXTERNAL
XTAL1 (OUT)
XTAL2
(IN)
ALTERNATE
CLOCK BUFFER
R1
R2
C1
Y1
C2
L
THIRD
OVERTONE
ONLY
5-3109(F)
Suggested component values:
R1—0.5 MΩ to 1 MΩ
R2—0 kΩ to 1 kΩ (may be required for low frequency, phase shift, and/or compensation level for Crystal Q)
C1, C2—10 pF to 40 pF
Y1—1 MHz to 20 MHz AT cut series resonant
Pin
XTAL1 (OUT)
XTAL2 (IN)
100-Pin
44-Pin
PLCC
68-Pin
PLCC
84-Pin
PLCC
QFP
TQFP
132-Pin
PPGA
144-Pin
TQFP
160-Pin
QFP
175-Pin
PPGA
208-Pin
SQFP
30
26
47
43
57
53
82
76
79
73
P13
M13
75
69
82
76
T14
P15
110
100
Figure 17. Crystal Oscillator Inverter
16
Lucent Technologies Inc.
Data Sheet
February 1997
ATT3000 Series Field-Programmable Gate Arrays
Configuration
Initialization Phase
An internal power-on-reset circuit is triggered when
power is applied. When VCC reaches the voltage where
portions of the FPGA begin to operate (2.5 V to 3 V),
the programmable I/O output buffers are disabled and a
high-impedance pull-up resistor is provided for the user
I/O pins. A time-out delay is initiated to allow the power
supply voltage to stabilize. During this time, the powerdown mode is inhibited. The initialization state time-out
(about 11 ms to 33 ms) is determined by a 14-bit
counter driven by a self-generated, internal timer. This
nominal 1 MHz timer is subject to variations with process, temperature, and power supply over the range of
0.5 MHz to 1.5 MHz. As shown in Table 2, five configuration mode choices are available, as determined by
the input levels of three mode pins: M0, M1, and M2.
Table 2. Configuration Modes
M0 M1 M2
Clock
Mode
Data
0
0
0
Active
Master
Bit Serial
0
0
1
Active
Master
Byte Wide
(Address = 0000
up)
0
1
0
—
Reserved
—
0
1
1
Active
Master
Byte Wide
(Address = FFFF
down)
1
0
0
—
Reserved
—
1
0
1
Active
Peripheral
Byte Wide
1
1
0
—
Reserved
—
1
1
1
Passive
Slave
Bit Serial
Lucent Technologies Inc.
In master configuration mode, the FPGA becomes the
source of configuration clock (CCLK). Beginning configuration of devices using peripheral or slave modes
must be delayed long enough for their initialization to
be completed. An FPGA with mode lines selecting a
master configuration mode extends its initialization
state using four times the delay (43 ms to 130 ms) to
ensure that all daisy-chained slave devices it may be
driving will be ready, even if the master is very fast and
the slave(s), very slow (see Figure 18). At the end of
initialization, the FPGA enters the clear state where it
clears configuration memory. The active-low, opendrain initialization signal INIT indicates when the initialization and clear states are complete. The FPGA tests
for the absence of an external active-low RESET before
it makes a final sample of the mode lines and enters
the configuration state. An external wired-AND of one
or more INIT pins can be used to control configuration
by the assertion of the active-low RESET of a master
mode device or to signal a processor that the FPGAs
are not yet initialized.
If a configuration has begun, a reassertion of RESET for
a minimum of three internal timer cycles will be recognized and the FPGA will initiate an abort, returning to
the clear state to clear the partially loaded configuration memory words. The FPGA will then resample
RESET and the mode lines before reentering the configuration state.
A reprogram is initiated when a configured FPGA
senses a high-to-low transition on the DONE/PROG
package pin. The FPGA returns to the clear state
where configuration memory is cleared and mode lines
resampled, as for an aborted configuration. The complete configuration program is cleared and loaded during each configuration program cycle.
17
Data Sheet
February 1997
ATT3000 Series Field-Programmable Gate Arrays
Configuration (continued)
USER I/O PINS WITH HIGH-IMPEDANCE PULL-UP
INIT = LOW
HDC = HIGH
LDC = LOW
PWRDWN
INACTIVE
INITIALIZATION
POWER-ON
TIME DELAY
POWERDOWN
NO HDC, LDC
OR PULL-UP
PWRDWN
ACTIVE
ACTIVE RESET
CLEAR
CONFIGURATION
MEMORY
NO
RESET
ACTIVE
TEST
MODE PINS
CONFIGURATION
PROGRAM MODE
START-UP
OPERATIONAL
MODE
ACTIVE RESET
OPERATES ON
USER LOGIC
YES
LOW ON DONE/PROG AND RESET
5-3110(F)
Figure 18. State Diagram of Configuration Process for Powerup and Reprogram
Length count control allows a system of multiple
FPGAs in assorted sizes to begin operation in a synchronized fashion. The configuration program generated by the ORCA Foundry Development System
begins with a preamble of 111111110010 (binary), followed by a 24-bit length count representing the total
number of configuration clocks needed to complete
loading of the configuration program(s). The data framing is shown in Figure 19. All FPGAs connected in
series read and shift preamble and length count in (on
positive) and out (on negative) CCLK edges. An FPGA
which has received the preamble and length count then
presents a HIGH data out until it has intercepted the
appropriate number of data frames. When the configuration program memory of an FPGA is full and the
length count does not compare, the FPGA shifts any
additional data through, as it did for preamble and
length count.
When the FPGA configuration memory is full and the
length count compares, the FPGA will execute a synchronous start-up sequence and become operational
(see Figure 20 on page 20). Two CCLK cycles after the
completion of loading configuration data, the user
I/O pins are enabled as configured. As selected in
ORCA Foundry, the internal user-logic reset is released
either one clock cycle before or after the I/O pins
18
become active. A similar timing selection is programmable for the DONE/PROG output signal. DONE/PROG
may also be programmed to be an open drain or
include a pull-up resistor to accommodate wiredANDing. The high during configuration (HDC) and low
during configuration (LDC) are two user I/O pins which
are driven active when an FPGA is in initialization,
clear, or configure states. These signals and DONE/
PROG provide for control of external logic signals such
as reset, bus enable, or PROM enable during
configuration.
For parallel master configuration modes, these signals
provide PROM enable control and allow the data pins
to be shared with user logic signals.
User I/O inputs can be programmed to be either TTL or
CMOS compatible thresholds. At powerup, all inputs
have TTL thresholds and can change to CMOS thresholds at the completion of configuration, if the user has
selected CMOS thresholds. The threshold of PWRDWN
and the direct clock inputs are fixed at a CMOS level.
If the crystal oscillator is used, it will begin operation
before configuration is complete to allow time for
stabilization before it is connected to the internal
circuitry.
Lucent Technologies Inc.
Data Sheet
February 1997
ATT3000 Series Field-Programmable Gate Arrays
Configuration (continued)
Configuration Data
Configuration data to define the function and interconnection within an FPGA are loaded from an external storage
at powerup and on a reprogram signal. Several methods of automatic and controlled loading of the required data
are available. Logic levels applied to mode selection pins at the start of configuration time determine the method to
be used (see Table 2). The data may be either bit-serial or byte-parallel, depending on the configuration mode.
Various Lucent programmable gate arrays have different sizes and numbers of data frames. For the ATT3020, configuration requires 14779 bits for each device, arranged in 197 data frames. An additional 40 bits are used in the
header (see Figure 20).
11111111
0010
< 24-BIT LENGTH COUNT >
1111
0 < DATA FRAME # 001 >
0 < DATA FRAME # 002 >
0 < DATA FRAME # 003 >
.
.
.
.
.
.
.
.
.
.
.
.
0 < DATA FRAME # 196 >
0 < DATA FRAME # 197 >
1111
– DUMMY BITS*
– PREAMBLE CODE
– CONFIGURATION PROGRAM LENGTH
– DUMMY BITS (4 BITS MINIMUM)
111
111
111
HEADER
FOR ATT3020
111
111
197 CONFIGURATION DATA FRAMES
PROGRAM DATA
(EACH FRAME CONSISTS OF:
A START BIT (0)
A 71-BIT DATA FIELD
THREE STOP BITS)
REPEATED FOR EACH LOGIC
CELL ARRAY IN A DAISY CHAIN
POSTAMBLE CODE (4 BITS MINIMUM)
* The FPGA devices require four dummy bits minimum.
Figure 19. Internal Configuration Data Structure
Lucent Technologies Inc.
19
Data Sheet
February 1997
ATT3000 Series Field-Programmable Gate Arrays
Configuration (continued)
Table 3. ATT3000 Device Configuration Data
Device
ATT3020
ATT3030
ATT3042
ATT3064
ATT3090
1500
2000
3000
4500
6000
64
(8 x 8)
100
(10 x 10)
144
(12 x 12)
224
(16 x 14)
320
(20 x 16)
IOBs
64
80
96
120
144
Flip-flops
256
360
480
688
928
Bits-per-frame
(with 1 start/3 stop)
75
92
108
140
172
Frames
197
241
285
329
373
Program Data =
Bits * Frames + 4
(excludes header)
14779
22176
30784
46064
64160
PROM Size (bits) =
Program Data
+ 40-bit Headers
14819
22216
30824
46104
64200
Gates
CLBs
(row x column)
Note: The length count produced by the bit stream generation program = [(40-bit preamble + sum of program data + 1 per daisy-chain device)
rounded up to a multiple of 8] – (2 ≤ K ≤ 4), where K is a function of DONE and RESET timing selected. An additional 8 is added if the
roundup increment is less than K. K additional clocks are needed to complete start-up after length count is reached.
POSTAMBLE
DATA FRAME
12
24
4
LAST FRAME
75
3
STOP
3
4
STOP
PREAMBLE
LENGTH COUNT
3
DATA
LENGTH COUNT*
START
START
WEAK PULL-UP
I/O ACTIVE
HIGH
DOUT LEAD DEVICE
1/2 CLOCK CYCLE
DELAY FROM DATA INPUT
PROG
DONE
INTERNAL RESET
5-3111(F)
* The configuration data consists of a composite 40-bit preamble/length count, followed by one or more concatenated FPGA programs,
separated by 4-bit postambles. An additional final postamble bit is added for each slave device, and the result rounded up to byte boundary.
The length count is two less than the number of resulting bits. Timing of the assertion of DONE and termination of the internal RESET may
each be programmed to occur one cycle before or after the I/O outputs become active.
Figure 20. FPGA Configuration and Start-Up
20
Lucent Technologies Inc.
Data Sheet
February 1997
ATT3000 Series Field-Programmable Gate Arrays
Configuration (continued)
The specific data format for each device is produced by
the bit stream generation program, and one or more of
these files can then be combined and appended to a
length count preamble and be transformed into a
PROM format file by the PROM generation program of
the ORCA Foundry Development System. The tie
option of the bit stream generation program defines
output levels of unused blocks of a design and connects these to unused routing resources. This prevents
indeterminate levels which might produce parasitic
supply currents. This tie option can be omitted for quick
breadboard iterations where a few additional mA of ICC
are acceptable.
The configuration bit stream begins with high preamble
bits, a 4-bit preamble code, and a 24-bit length count.
When configuration is initiated, a counter in the FPGA
is set to 0 and begins to count the total number of configuration clock cycles applied to the device. As each
configuration data frame is supplied to the FPGA, it is
internally assembled into a data word. As each data
word is completely assembled, it is loaded in parallel
Lucent Technologies Inc.
into one word of the internal configuration memory
array. The configuration loading process is complete
when the current length count equals the loaded length
count and the required configuration program data
frames have been written. Internal user flip-flops are
held reset during configuration.
Two user-programmable pins are defined in the unconfigured FPGA: high during configuration (HDC) and low
during configuration (LDC), and DONE/PROG may be
used as external control signals during configuration. In
master mode configurations, it is convenient to use LDC
as an active-low EPROM chip enable. After the last
configuration data bit is loaded and the length count
compares, the user I/O pins become active. Options in
the bit stream generation program allow timing choices
of one clock earlier or later for the timing of the end of
the internal logic reset and the assertion of the DONE
signal. The open-drain DONE/PROG output can be
AND-tied with multiple FPGAs and used as an activehigh READY, an active-low PROM enable, or a RESET
to other portions of the system. The state diagram of
Figure 18 illustrates the configuration process.
21
Data Sheet
February 1997
ATT3000 Series Field-Programmable Gate Arrays
Configuration Modes
required. The FPGA HEX starting address is 0000 and
increments for master low mode, and it is FFFF and
decrements for master high mode. These two modes
provide address compatibility with microprocessors
which begin execution from opposite ends of memory.
Master Mode
In master mode, the FPGA automatically loads configuration data from an external memory device. There are
three master modes which use the internal timing
source to supply the configuration clock (CCLK) to time
the incoming data. Serial master mode uses serial configuration data supplied to data-in (DIN) from a synchronous serial source such as the serial configuration
PROM shown in Figure 21. Parallel master low and
master high modes automatically use parallel data supplied to the D[7:0] pins in response to the 16-bit
address generated by the FPGA. Figure 22 shows an
example of the parallel master mode connections
For master high or low, data bytes are read in parallel
by each read clock (RCLK) and internally serialized by
the configuration clock. As each data byte is read, the
least significant bit of the next byte, D0, becomes the
next bit in the internal serial configuration word. One
master mode FPGA can be used to interface the
configuration program-store, and pass additional
concatenated configuration data to additional FPGAs in
a serial daisy-chain fashion. CCLK is provided for the
slaved devices, and their serialized data is supplied
from DOUT to DIN, DOUT to DIN, etc.
+5 V
DURING CONFIGURATION
THE 5 kΩ M2 PULL-DOWN
RESISTOR OVERCOMES THE
INTERNAL PULL-UP,
BUT IT ALLOWS M2 TO
BE USER I/O.
M0 M1 PWRDWN
DOUT
*
*
M2
HDC
GENERALPURPOSE
USER I/O
PINS
LDC
OPTIONAL
IDENTICAL SLAVE
FPGAs CONFIGURED
THE SAME
OTHER
I/O PINS
ATT3000
SERIES
FPGA
SYSTEM RESET
ATT1700A
RESET
DIN
CCLK
D/P
INIT
DATA
DATA
CLK
CLK
CE
OE/RESET
CEO
CASCADED
ATT1700A
MEMORY
CE
OE/RESET
(HIGH RESETS THE ADDRESS POINTER)
5-3112(C)
Note: The serial configuration PROM supports automatic loading of configuration programs up to 36/64/128 Kbits. Multiple devices can be
cascaded to support additional FPGAs. An early DONE inhibits the data output one CCLK cycle before the FPGA I/O becomes active.
Figure 21. Master Serial Mode
22
Lucent Technologies Inc.
Data Sheet
February 1997
ATT3000 Series Field-Programmable Gate Arrays
Configuration Modes (continued)
+5 V
USER CONTROL OF HIGHER
ORDER FROM ADDRESS BITS
CAN BE USED TO SELECT FROM
ALTERNATIVE CONFIGURATIONS
M0 M1 PWRDWN
5 kΩ
DOUT
M2
GENERALPURPOSE
USER I/O
PNS
CCLK
HDC
LDC
A15
RCLK
A14
INIT
A13
OTHER
I/O PINS
SYSTEM
RESET
A12
*
*
EPROM
(2K x 8
OR LARGER)
A11
A10
A10
A9
A9
A8
A8
D7
A7
A7
D7
D6
A6
A6
D6
D5
A5
A5
D5
D4
A4
A4
D4
D3
A3
A3
D3
D2
A2
A2
D2
D1
A1
A1
D1
A0
A0
D0
D/P
OE
RESET
FPGA
D0
+5 V
CE
5 kΩ
8
DATA BUS
5-3113(F)
Figure 22. Master Parallel Mode
Lucent Technologies Inc.
23
Data Sheet
February 1997
ATT3000 Series Field-Programmable Gate Arrays
Configuration Modes (continued)
Peripheral Mode
Peripheral mode provides a simplified interface through which the device may be loaded byte-wide, as a processor
peripheral. Figure 23 shows the peripheral mode connections. Processor write cycles are decoded from the common assertion of the active-low write strobe (WS), and two active-low and one active-high chip selects (CS0, CS1,
CS2). If all of these signals are not available, the unused inputs should be driven to their respective active levels.
The FPGA will accept 1 byte of configuration data on the D[7:0] inputs for each selected processor write cycle.
Each byte of data is loaded into a buffer register. The FPGA generates a CCLK from the internal timing generator
and serializes the parallel input data for internal framing or for succeeding slaves on data out (DOUT). An output
HIGH on READY/BUSY pin indicates the completion of loading for each byte when the input register is ready for a
new byte. As with master modes, peripheral mode may also be used as a lead device for a daisy-chain of slave
devices.
+5 V
CONTROL ADDRESS
SIGNALS
BUS
DATA
BUS
5 kΩ
8
M0
D[7:0]
ADDRESS
DECODE
LOGIC
M1
D[7:0]
PWRDWN
CCLK
*
DOUT
*
CS0
M2
HDC
+5 V
LDC
CS1
GENERALPURPOSE
USER I/O
CS2
WS
OTHER
I/O PINS
RDY/BUSY
INIT
REPROGRAM
OC
D/P
RESET
5-3114(F)
Figure 23. Peripheral Mode
24
Lucent Technologies Inc.
Data Sheet
February 1997
ATT3000 Series Field-Programmable Gate Arrays
Configuration Modes (continued)
Slave Mode
Slave mode provides a simple interface for loading the FPGA configuration as shown in Figure 24. Serial data is
supplied in conjunction with a synchronizing input clock. Most slave mode applications are in daisy-chain configurations in which the data input is supplied by the previous FPGA’s data out, while the clock is supplied by a lead
device in master or peripheral mode. Data may also be supplied by a processor or other special circuits.
+5 V
M0 M1
MICROCOMPUTER
5 kΩ
D0
DOUT
DIN
*
*
HDC
D1
I/O PORT
M2
CCLK
STRB
D2
PWRDWN
FPGA
LDC
+5 V
D3
GENERALPURPOSE
USER I/O
D4
D5
D/P
D6
D7
RESET
OTHER
I/O PINS
INIT
RESET
SYSTEM
RESET
5-3115(F)
Figure 24. Slave Mode
Lucent Technologies Inc.
25
Data Sheet
February 1997
ATT3000 Series Field-Programmable Gate Arrays
Configuration Modes (continued)
Daisy Chain
The ORCA Foundry for ATT3000 Development System
is used to create a composite configuration bit stream
for selected FPGAs including a preamble, a length
count for the total bit stream, multiple concatenated
data programs, a postamble, plus an additional fill bit
per device in the serial chain. After loading and passing
on the preamble and length count to a possible daisy
chain, a lead device will load its configuration data
frames while providing a high DOUT to possible downstream devices as shown in Figure 25. Loading continues while the lead device has received its configuration
+5 V
program and the current length count has not reached
the full value. Additional data is passed through the
lead device and appears on the data out (DOUT) pin in
serial form. The lead device also generates the CCLK
to synchronize the serial output data and data in of
downstream FPGAs. Data is read in on DIN of slave
devices by the positive edge of CCLK and shifted out
the DOUT on the negative edge of CCLK. A parallel
master mode device uses its internal timing generator
to produce an internal CCLK of eight times its EPROM
address rate, while a peripheral mode device produces
a burst of eight CCLKs for each chip select and writestrobe cycle. The internal timing generator continues to
operate for general timing and synchronization of
inputs in all modes.
+5 V
+5 V
M0 M1 PWRDWN
+5 V
M0 M1 PWRDWN
5 kΩ
GENERALPURPOSE
USER I/O
PINS
M0 M1 PWRDWN
5 kΩ
CCLK
DIN
CCLK
DOUT
M2
HDC
LDC
RCLK
A15
OTHER
I/O PINS
FPGA
MASTER
A14
A14
A13
A13
A12
A12
A11
A11
A10
A10
D/P
A9
A9
RESET
EPROM
M2
HDC
LDC
OTHER
I/O PINS
A8
A8
D7
A7
A7
D7
D6
A6
A6
D6
D5
A5
A5
D5
D4
A4
A4
D4
D3
A3
A3
D3
D2
A2
A2
D2
D1
A1
A1
D1
D0
A0
A0
D0
D/P
OE
INIT
CE
RESET
DOUT
FPGA
SLAVE #1
A15
5 kΩ
CCLK
DIN
DOUT
FPGA
SLAVE #n
GENERALPURPOSE
USER I/O
M2
HDC
LDC
GENERALPURPOSE
USER I/O
OTHER
I/O PINS
D/P
INIT
INIT
RESET
+5 V
8
5 kΩ EACH
OPEN COLLECTOR
REPROGRAM
SYSTEM
RESET
5-3116(F)
Figure 25. Master Mode with Daisy-Chained Slave Mode Devices
26
Lucent Technologies Inc.
Data Sheet
February 1997
ATT3000 Series Field-Programmable Gate Arrays
Special Configuration Functions
Readback
The configuration data includes control over several
special functions in addition to the normal user logic
functions and interconnects:
■
Input thresholds
■
Readback enable
The contents of an FPGA may be read back if it has
been programmed with a bit stream in which the readback option has been enabled. Readback may be used
for verification of configuration and as a method for
determining the state of internal logic nodes. There are
three options in generating the configuration bit stream:
■
DONE pull-up resistor
■
Never will inhibit the readback capability.
■
DONE timing
■
■
RESET timing
One-time will inhibit readback after one readback
has been executed to verify the configuration.
■
Oscillator frequency divided by two
■
On-command will allow unrestricted use of readback.
Each of these functions is controlled by configuration
data bits which are selected as part of the normal
development system bit stream generation process.
Input Thresholds
Prior to the completion of configuration, all FPGA input
thresholds are TTL compatible. Upon completion of
configuration, the input thresholds become either TTL
or CMOS compatible as programmed. The use of the
TTL threshold option requires some additional supply
current for threshold shifting. The exception is the
threshold of the PWRDWN input and direct clocks which
always have a CMOS input. Prior to the completion of
configuration, the user I/O pins each have a highimpedance pull-up. The configuration program can be
used to enable the IOB pull-up resistors in the operational mode to act either as an input load or to avoid a
floating input on an otherwise unused pin.
Lucent Technologies Inc.
Readback is accomplished without the use of any of
the user I/O pins; only M0, M1, and CCLK are used.
The initiation of readback is produced by a low-to-high
transition of the M0/RTRIG (read trigger) pin. Once the
readback command has been given, the input CCLK is
driven by external logic to read back each data bit in a
format similar to loading. After two dummy bits, the first
data frame is shifted out on the M1/RDATA (read data)
pin. The logic polarity of the readback data is always
inverted, such that a zero in configuration becomes a
one in readback and vice versa. Each readback frame
has one start bit and one stop bit per frame (configuration writes at least 3 stop bits per frame). All data
frames must be read back to complete the process and
return the mode select and CCLK pins to their normal
functions.
The readback data includes the current state of each
internal logic block storage element, and the state of
the input (.i and .ri) connection pins on each IOB. The
data is imbedded into unused configuration bit positions during readback. This state information is used by
the FPGA development system in-circuit verifier to provide visibility into the internal operation of the logic
while the system is operating. To read back a uniform
time sample of all storage elements, it may be necessary to inhibit the system clock.
27
Data Sheet
February 1997
ATT3000 Series Field-Programmable Gate Arrays
Special Configuration Functions
DONE Timing
(continued)
Reprogram
The FPGA configuration memory can be rewritten
while the device is operating in the user’s system. To
initiate a reprogramming cycle, the dual-function package pin DONE/PROG must be given a high-to-low transition. To reduce sensitivity to noise, the input signal is
filtered for two cycles of the FPGA’s internal timing generator. When reprogram begins, the user-programmable I/O output buffers are disabled and high-impedance
pull-ups are provided for the package pins. The device
returns to the clear state and clears the configuration
memory before it prompts INITIALIZED. Since this
clear operation uses chip-individual internal timing, the
master might complete the clear operation and then
start configuration before the slave has completed the
clear operation. To avoid this, wire-AND the slave INIT
pins and use them to force a RESET on the master (see
Figure 25). Reprogram control is often implemented by
using an external open-collector driver which pulls
DONE/PROG low. Once it recognizes a stable request,
the FPGA will hold a low until the new configuration has
been completed. Even if the reprogram request is
externally held low beyond the configuration period, the
FPGA will begin operation upon completion of configuration.
The timing of the DONE status signal can be controlled
by a selection in the bit stream generation program to
occur a CCLK cycle before, or after, the timing of outputs being activated (see Figure 20). This facilitates
control of external functions, such as a PROM enable
or holding a system in a wait-state.
RESET Timing
As with DONE timing, the timing of the release of the
internal RESET can be controlled by a selection in the
bit stream generation program to occur a CCLK cycle
before, or after, the timing of outputs being enabled
(see Figure 20). This reset maintains all user-programmable flip-flops and latches in a zero state during configuration.
Crystal Oscillator Division
A selection in the bit stream generation program allows
the user to incorporate a dedicated divide-by-two flipflop in the crystal oscillator function. This provides
higher assurance of a symmetrical timing signal.
Although the frequency stability of crystal oscillators is
high, the symmetry of the waveform can be affected by
bias or feedback drive.
DONE Pull-Up
DONE/PROG is an open-drain I/O pin that indicates the
FPGA is in the operational state. An optional internal
pull-up resistor can be enabled by the user of the development system when the bit stream generation program is executed. The DONE/PROG pins of multiple
FPGAs in a daisy chain may be connected together to
indicate that all are DONE or to direct them all to reprogram.
28
Lucent Technologies Inc.
Data Sheet
February 1997
ATT3000 Series Field-Programmable Gate Arrays
Performance
Device Performance
The high performance of the FPGA is due in part to the
manufacturing process, which is similar to that used for
high-speed CMOS static memories. Performance can
be measured in terms of minimum propagation times
for logic elements. The parameter which traditionally
describes the overall performance of a gate array is the
toggle frequency of a flip-flop. The configuration for
determining the toggle performance of the FPGA is
shown in Figure 26. The flip-flop output Q is fed back
through the combinatorial logic as Q to form the toggle
flip-flop.
D Q
CLOCK
5-3117(F)
Figure 26. Toggle Flip-Flop
FPGA performance is determined by the timing of
critical paths, including both the fixed timing for the
logic and storage elements in that path, and the timing
associated with the routing of the network. Examples
CLOCK TO
OUTPUT
TCKO
CLB
COMBINATORIAL
TILO
of internal worst-case timing are included in the
performance data to allow the user to make the best
use of the capabilities of the device. The ORCA
Foundry Development System timing calculator or
ORCA Foundry-generated simulation models should
be used to calculate worst-case paths by using actual
impedance and loading information.
Figure 27 shows a variety of elements which are
involved in determining system performance. Table 20
gives the parameter values for the different speed
grades. Actual measurement of internal timing is not
practical, and often only the sum of component
timing is relevant as in the case of input to output. The
relationship between input and output timing is arbitrary, and only the total determines performance.
Timing components of internal functions may be determined by the measurement of differences at the pins of
the package. A synchronous logic function which
involves a clock to block-output and a block-input to
clock setup is capable of higher-speed operation than a
logic configuration of two synchronous blocks with an
extra combinatorial block level between them. System
clock rates to 60% of the toggle frequency are practical
for logic in which an extra combinatorial level is located
between synchronized blocks. This allows implementation of functions of up to 25 variables. The use of the
wired-AND is also available for wide, high-speed
functions.
SETUP
TICK
TOP
CLB
LOGIC
CLB
IOB
LOGIC
PAD
(K)
(K)
CLOCK
IOB
TCKO
PAD
TPID
TOKOP
5-3118(F)
Figure 27. Examples of Primary Block Speed Factors
Lucent Technologies Inc.
29
ATT3000 Series Field-Programmable Gate Arrays
Performance (continued)
Logic Block Performance
Logic block performance is expressed as the propagation time from the interconnect point at the input of the
combinatorial logic to the output of the block in the
interconnect area. Combinatorial performance is independent of the specific logic function because of the
table look-up based implementation. Timing is different
when the combinatorial logic is used in conjunction with
the storage element. For the combinatorial logic function driving the data input of the storage element, the
critical timing is data setup relative to the clock edge
provided to the flip-flop element. The delay from the
clock source to the output of the logic block is critical in
the timing of signals produced by storage elements.
Loading of a logic block output is limited only by the
resulting propagation delay of the larger interconnect
network. Speed performance of the logic block is a
function of supply voltage and temperature (see
Figures 28 and 29).
Interconnect Performance
Interconnect performance depends on the routing
resource used to implement the signal path. As discussed earlier, direct interconnect from block to block
provides a fast path for a signal. The single metal
30
Data Sheet
February 1997
segment used for long lines exhibits low resistance
from end to end, but relatively high capacitance.
Signals driven through a programmable switch will
have the additional impedance of the switch added to
their normal drive impedance.
General-purpose interconnect performance depends
on the number of switches and segments used, the
presence of the bidirectional repowering buffers, and
the overall loading on the signal path at all points along
the path. In calculating the worst-case timing for a
general interconnect path, the timing calculator portion
of the ORCA Foundry Development System accounts
for all of these elements.
As an approximation, interconnect timing is proportional to the summation of totals of local metal segments beyond each programmable switch. In effect, the
time is a sum of R-C time each approximated by an R
times the total C it drives. The R of the switch and the C
of the interconnect are functions of the particular
device performance grade.
For a string of three local interconnects, the approximate time at the first segment after the first switch
resistance would be three units—an additional two
units after the next switch plus an additional unit after
the last switch in the chain. The interconnect R-C chain
terminates at each repowering buffer. The capacitance
of the actual block inputs is not significant; the capacitance is in the interconnect metal and switches.
Figure 30 illustrates this.
Lucent Technologies Inc.
Data Sheet
February 1997
ATT3000 Series Field-Programmable Gate Arrays
Performance (continued)
1.2
1.3
1.2
1.1
1.1
1.0
0.9
1.0
0.8
0.7
0.9
0.6
0.5
–55 –40
0
30
70 85
4.0
125
4.5
5.0
5.5
6.0
VCC
TEMPERATURE (°C)
5-3120(F)
5-3119(F)
Figure 28. Change in Speed Performance
Figure 29. Speed Performance of a CMOS Device
SWITCH MATRIX
R3
R2
C1
REPOWERING
BUFFER
C2
C3
C4
CLB
R1
TIMING: INCREMENTAL
IF R1 = R2 = R3 = R AND C1 = C2 = C3 = C,
THEN CUMULATIVE TIMING
R1(C1 + C2 + C3)
+ R2(C2 + C3)
T1 = 3RC
T2 = 3RC + 2RC
T3 = 3RC + 2RC + RC
= 5RC
= 6RC
= 3RC
+ R3 + C3
6RC + BUFFER
5-3121(F)
Figure 30. Interconnection Timing Example
Lucent Technologies Inc.
31
Data Sheet
February 1997
ATT3000 Series Field-Programmable Gate Arrays
Power
Power Distribution
Power for the FPGA is distributed through a grid to
achieve high noise immunity and isolation between
logic and I/O. Inside the FPGA, a dedicated VCC and
ground ring surrounding the logic array provides power
to the I/O drivers (see Figure 31 below). An independent matrix of VCC and ground lines supplies the interior logic of the device. This power distribution grid
provides a stable supply and ground for all internal
logic, provided that the external package power pins
are all connected and appropriately decoupled. Typically, a 0.1 µF capacitor connected near the VCC and
ground pins of the package will provide adequate
decoupling.
Output buffers which drive the specified 4 mA loads
under worst-case conditions may drive 25 to 30 times
this amount under best-case process conditions. Noise
can be reduced by minimizing external load capacitance and reducing simultaneous output transitions in
the same direction. It may also be beneficial to locate
heavily loaded output buffers near the ground pads.
The IOB output buffers have a slew-limited mode which
should be used where output rise and fall times are not
speed critical.
Slew-limited outputs maintain their dc drive capability
but generate less external reflections and internal
noise. More than 32 fast outputs should not be switching in the same direction simultaneously.
GND
GROUND AND
VCC RING FOR
I/O DRIVERS
VCC
VCC
LOGIC POWER GRID
GND
5-3122(F)
Figure 31. FPGA Power Distribution
32
Lucent Technologies Inc.
Data Sheet
February 1997
ATT3000 Series Field-Programmable Gate Arrays
Power (continued)
Power Dissipation
The FPGA exhibits the low power consumption characteristic of CMOS ICs. The configuration option of TTL
chip input threshold requires power for the threshold
reference. The power required by the static memory
cells that hold the configuration data is very low and
may be maintained in a powerdown mode.
Typically, most of the power dissipation is produced by
external capacitive loads on the output buffers. This
load and frequency dependent power is 25 µW/pF/MHz
per output. Another component of I/O power is the dc
loading on each output pin by devices driven by the
FPGA.
Internal power dissipation is a function of the number
and size of the nodes, and the frequency at which they
change. In an FPGA, the fraction of nodes changing on
a given clock is typically low (10% to 20%). For
example, in a large binary counter, the average clock
cycle produces changes equal to one CLB output at
the clock frequency. Typical global clock buffer power is
between 1.7 mW/MHz for the ATT3020 and 3.5 mW/
MHz for the ATT3090. The internal capacitive load is
more a function of interconnect than fan-out. With a
typical load of three general interconnect segments,
each configurable logic block output requires about
0.22 mW/MHz of its output frequency:
Total Power = VCC + ICCO + External
(dc + Capacitive) + Internal
(CLB + IOB + Long Line + Pull-up)
Lucent Technologies Inc.
Because the control storage of the FPGA is CMOS
static memory, its cells require a very low standby current for data retention. In some systems, this low data
retention current characteristic can be used as a
method of preserving configurations in the event of a
primary power loss. The FPGA has built-in powerdown
logic which, when activated, will disable normal operation of the device and retain only the configuration data.
All internal operation is suspended and output buffers
are placed in their high-impedance state with no pullups. Powerdown data retention is possible with a simple battery backup circuit, because the power requirement is extremely low. For retention at 2.4 V, the
required current is typically on the order of 50 nA.
To force the FPGA into the powerdown state, the user
must pull the PWRDWN pin low and continue to supply
a retention voltage to the VCC pins of the package.
When normal power is restored, VCC is elevated to its
normal operating voltage and PWRDWN is returned to a
high. The FPGA resumes operation with the same
internal sequence that occurs at the conclusion of
configuration. Internal I/O and logic block storage elements will be reset, the outputs will become enabled,
and the DONE/PROG pin will be released. No configuration programming is involved.
When the power supply is removed from a CMOS
device, it is possible to supply some power from an
input signal. The conventional electrostatic input protection is implemented with diodes to the supply and
ground. A positive voltage applied to an I/O will cause
the positive protection diode to conduct and drive the
power pin. This condition can produce invalid power
conditions and should be avoided. A large series resistor might be used to limit the current or a bipolar buffer
may be used to isolate the input signal.
33
ATT3000 Series Field-Programmable Gate Arrays
Data Sheet
February 1997
Pin Information
Table 4. Permanently Dedicated Pins
Symbol
VCC
Two to eight (depending on package type) connections to the nominal +5 V supply voltage. All
must be connected.
GND
Two to eight (depending on package type) connections to ground. All must be connected.
PWRDWN
RESET
A low on this CMOS compatible input stops all internal activity to minimize VCC power, and puts
all output buffers in a high-impedance state; configuration is retained. When the PWRDWN pin
returns high, the device returns to operation with the same sequence of buffer enable and
DONE/PROG as at the completion of configuration. All internal storage elements are reset. If
not used, PWRDWN must be tied to VCC.
This is an active-low input which has three functions:
■
Prior to the start of configuration, a low input will delay the start of the configuration process.
An internal circuit senses the application of power and begins a minimal time-out cycle. When
the time-out and RESET are complete, the levels of the M lines are sampled and configuration
begins.
■
If RESET is asserted during a configuration, the FPGA is reinitialized and will restart the configuration at the termination of RESET.
■
If RESET is asserted after configuration is complete, it will provide an asynchronous reset of all
IOB and CLB storage elements of the FPGA.
CCLK
Configuration Clock. During configuration, this is an output of an FPGA in master mode or
peripheral mode. FPGAs in slave mode use it as a clock input. During a readback operation, it is
a clock input for the configuration data being filtered out.
DONE/
DONE Output. Configurable as open drain with or without an internal pull-up resistor. At the
completion of configuration, the circuitry of the FPGA becomes active in a synchronous order,
and DONE may be programmed to occur one cycle before or after that occurs. Once configuration is done, a high-to-low transition of this pin will cause an initialization of the FPGA and start a
reconfiguration.
PROG
34
Name/Description
M0/RTRIG
Mode 0. This input, M1, and M2 are sampled before the start of configuration to establish the
configuration mode to be used. After configuration is complete, a low-to-high transition acts as a
read trigger to initiate a readback of configuration and storage-element data clocked by CCLK.
M1/RDATA
Mode 1. This input, M0, and M2 are sampled before the start of configuration to establish the
configuration mode to be used. After configuration is complete, this pin is the active-low output of
the readback data.
Lucent Technologies Inc.
Data Sheet
February 1997
ATT3000 Series Field-Programmable Gate Arrays
Pin Information (continued)
Table 5. I/O Pins with Special Functions
Symbol
M2
Name/Description
Mode 2. This input has a passive pull-up during configuration. Together with M0 and M1, it is
sampled before the start of configuration to establish the configuration mode to be used. After
configuration, this pin becomes a user-programmable I/O pin.
HDC
High During Configuration. HDC is held at a high level by the FPGA until after configuration. It
is available as a control output indicating that configuration is not yet completed. After
configuration, this pin is a user I/O pin.
LDC
Low During Configuration. This active-low signal is held at a low level by the FPGA until after
configuration. It is available as a control output indicating that configuration is not yet completed.
It is particularly useful in master mode as a low enable for an EPROM. After configuration, this
pin is a user I/O pin. If used as a low EPROM enable, it must be programmed as a high after
configuration.
INIT
This is an active-low, open-drain output which is held low during the power stabilization and
internal clearing of the configuration memory. It can be used to indicate status to a configuring
microprocessor or, as a wired-AND of several slave mode devices, a hold-off signal for a master
mode device. After configuration, this pin becomes a user-programmable I/O pin.
BCLKIN
This is a direct CMOS level input to the alternate clock buffer (auxiliary buffer) in the lower right
corner.
XTL1
This user I/O pin can be used to operate as the output of an amplifier driving an external crystal
and bias circuitry.
XTL2
This user I/O pin can be used as the input of an amplifier connected to an external crystal and
bias circuitry. The I/O block is left unconfigured. The oscillator configuration is activated by
routing a net from the oscillator buffer symbol output and by the ORCA Foundry bit stream
generation program.
CS0, CS1,
CS2, WS
These four inputs represent a set of signals, three active-low and one active-high, which are
used in the peripheral mode to control configuration data entry. The assertion of all four
generates a write to the internal data buffer. The removal of any assertion clocks in the D[7:0]
data present. In the master parallel mode, WS and CS2 are the A0 and A1 outputs. After
configuration, the pins are user-programmable I/O pins.
Lucent Technologies Inc.
35
ATT3000 Series Field-Programmable Gate Arrays
Data Sheet
February 1997
Pin Information (continued)
Table 5. I/O Pins with Special Functions (continued)
Symbol
RCLK
RDY/BUSY
During master parallel mode configuration, RCLK represents a read of an external dynamic
memory device (normally not used).
During peripheral parallel mode configuration, this pin indicates when the chip is ready for
another byte of data to be written to it. After configuration is complete, this pin becomes a userprogrammed I/O pin.
D[7:0]
This set of eight pins represents the parallel configuration byte for the parallel master and
peripheral modes. After configuration is complete, they are user-programmed I/O pins.
A[15:0]
This set of 16 pins presents an address output for a configuration EPROM during master parallel
mode. After configuration is complete, they are user-programmed I/O pins.
DIN
This user I/O pin is used as serial data input during slave or master serial configuration. This pin
is data zero input in master or peripheral configuration mode.
DOUT
TCLKIN
I/O
36
Name/Description
This user I/O pin is used during configuration to output serial configuration data for daisychained slaves’ data in.
This is a direct CMOS level input to the global clock buffer.
Input/Output (Unrestricted). May be programmed by the user to be input and/or output pin
following configuration. Some of these pins present a high-impedance pull-up (see next page) or
perform other functions before configuration is complete (see above).
Lucent Technologies Inc.
Data Sheet
February 1997
ATT3000 Series Field-Programmable Gate Arrays
Pin Information (continued)
Table 6A. ATT3000 Family Configuration (44, 68, and 84 PLCC; 100 QFP; and 100 TQFP)
Configuration Mode (M2:M1:M0)
Slave
(1:1:1)
Master-Serial
(0:0:0)
Peripheral
(1:0:1)
Master-High
(1:1:0)
Master-Low
(1:0:0)
PWRDWN
PWRDWN
PWRDWN
PWRDWN
PWRDWN
VCC
M1 (High)
M0 (High)
M2 (High)
HDC (High)
LDC (Low)
INIT‡
VCC
M1 (Low)
M0 (Low)
M2 (Low)
HDC (High)
LDC (Low)
INIT‡
VCC
M1 (Low)
M0 (Low)
M2 (High)
HDC (High)
LDC (Low)
INIT‡
VCC
M1 (High)
M0 (High)
M2 (High)
HDC (High)
LDC (Low)
INIT‡
VCC
M1 (Low)
M0 (Low)
M2 (Low)
HDC (High)
LDC (Low)
INIT‡
GND
GND
GND
GND
GND
RESET
RESET
RESET
RESET
RESET
DONE
DONE
DONE
D7
DONE
D7
DONE
D7
D6
D5
D6
D5
—
D4
VCC
D3
—
D2
D1
D6
D5
—
D4
VCC
D3
—
D2
D1
RCLK
RCLK
D0
DOUT
CCLK
A0
A1
A2
A3
A15
A4
A14
A5
GND
A13
A6
A12
A7
A11
A8
A10
A9
D0
DOUT
CCLK
A0
A1
A2
A3
A15
A4
A14
A5
GND
A13
A6
A12
A7
A11
A8
A10
A9
CS0
VCC
VCC
D4
VCC
D3
CS1
DIN
DOUT
CCLK
DIN
DOUT
CCLK
D2
D1
RDY/BUSY
D0
DOUT
CCLK
WS
CS2
GND
GND
GND
44
PLCC*
68
PLCC
84
PLCC†
100
QFP
100
TQFP
User
Operation
7
12
16
17
18
19
20
22
23
26
27
28
—
30
—
—
—
—
34
—
—
—
—
—
38
39
40
—
—
—
—
—
—
—
—
1
—
—
—
—
—
—
—
—
10
18
25
26
27
28
30
34
35
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
1
2
3
4
5
6
7
8
9
12
22
31
32
33
34
36
42
43
53
54
55
56
57
58
60
61
62
64
65
66
67
70
71
72
73
74
75
76
77
78
81
82
83
84
1
2
3
4
5
8
9
10
11
29
41
52
54
56
57
59
65
66
76
78
80
81
82
83
87
88
89
91
92
93
94
98
99
100
1
2
5
6
8
9
12
13
14
15
16
17
18
19
20
23
24
25
26
26
38
49
51
53
54
56
62
63
73
75
77
78
79
80
84
85
86
88
89
90
91
95
96
97
98
99
2
3
5
6
9
10
11
12
13
14
15
16
17
20
21
22
23
PWRDWN
VCC
RDATA
RTRIG
I/O
I/O
I/O
I/O
GND
XTL2–I/O
RESET
PROG
I/O
XTL1–I/O
I/O
I/O
I/O
I/O
VCC
I/O
I/O
I/O
I/O
I/O
I/O
I/O
CCLK
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
GND
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
Represents a 50 kΩ to 100 kΩ pull-up.
* Peripheral mode and master parallel mode are not supported in the 44-pin PLCC package; see Table 7.
† Pin assignments for the ATT3064/ATT3090 differ from those shown; see page 42.
‡ INIT is an open-drain output during configuration.
Lucent Technologies Inc.
37
Data Sheet
February 1997
ATT3000 Series Field-Programmable Gate Arrays
Pin Information (continued)
Table 6B. ATT3000 Family Configuration (132 PPGA, 144 TQFP, 160 QFP, 175 PPGA, 208 SQFP)
Configuration Mode (M2:M1:M0)
Slave
(1:1:1)
Master-Serial
(0:0:0)
Peripheral
(1:0:1)
Master-High
(1:1:0)
Master-Low
(1:0:0)
PWRDWN
PWRDWN
PWRDWN
PWRDWN
PWRDWN
VCC
M1 (High)
M0 (High)
M2 (High)
HDC (High)
LDC (Low)
INIT*
GND
VCC
M1 (Low)
M0 (Low)
M2 (Low)
HDC (High)
LDC (Low)
INIT*
GND
VCC
M1 (Low)
M0 (Low)
M2 (High)
HDC (High)
LDC (Low)
INIT*
GND
VCC
M1 (High)
M0 (High)
M2 (High)
HDC (High)
LDC (Low)
INIT*
GND
VCC
M1 (Low)
M0 (Low)
M2 (Low)
HDC (High)
LDC (Low)
INIT*
GND
RESET
RESET
RESET
RESET
RESET
DONE
DONE
DONE
D7
DONE
D7
DONE
D7
D6
D5
D6
D5
—
D4
VCC
D3
—
D2
D1
D6
D5
—
D4
VCC
D3
—
D2
D1
RCLK
RCLK
D0
DOUT
CCLK
A0
A1
A2
A3
A15
A4
A14
A5
GND
A13
A6
A12
A7
A11
A8
A10
A9
D0
DOUT
CCLK
A0
A1
A2
A3
A15
A4
A14
A5
GND
A13
A6
A12
A7
A11
A8
A10
A9
CS0
VCC
VCC
D4
VCC
D3
CS1
DIN
DOUT
CCLK
DIN
DOUT
CCLK
D2
D1
RDY/BUSY
D0
DOUT
CCLK
WS
CS2
GND
*
38
GND
GND
132
PPGA
144
TQFP
160
QFP
175
PPGA
208
SQFP
User
Operation
A1
C8
B13
A14
C13
B14
D14
G14
H12
M13
P14
N13
M12
P13
N11
M9
N9
N8
M8
N7
P6
M6
M5
N4
N2
M3
P1
M2
N1
L2
L1
K1
J2
H1
H2
H3
G2
G1
F2
E1
D1
D2
B1
C2
1
19
36
38
40
41
45
53
55
69
71
73
74
75
78
84
85
88
90
92
93
96
102
103
106
107
108
111
112
115
116
119
120
123
124
126
128
129
133
134
137
138
141
142
159
20
40
42
44
45
49
59
19
76
78
80
81
82
86
92
93
98
100
102
103
108
114
115
119
120
121
124
125
128
129
132
133
136
137
139
141
142
147
148
151
152
155
156
B2
D9
B14
B15
C15
E14
D16
H15
J14
P15
R15
R14
N13
T14
P12
T11
R10
R9
N9
P8
R8
R7
R5
P5
R3
N4
R2
P2
M3
P1
N1
M1
L2
K2
K1
J3
H2
H1
F2
E1
D1
C1
E3
C2
3
26
48
50
56
57
61
77
25
100
102
107
109
110
115
122
123
128
130
132
133
138
145
146
151
152
153
161
162
165
166
172
173
178
179
182
184
185
192
193
199
200
203
204
PWRDWN
VCC
RDATA
RTRIG
I/O
I/O
I/O
I/O
GND
XTL2–I/O
RESET
PROG
I/O
XTL1–I/O
I/O
I/O
I/O
I/O
VCC
I/O
I/O
I/O
I/O
I/O
I/O
I/O
CCLK
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
GND
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
Represents a 50 kΩ to 100 kΩ pull-up.
INIT is an open-drain output during configuration.
Lucent Technologies Inc.
Data Sheet
February 1997
ATT3000 Series Field-Programmable Gate Arrays
Pin Assignments
Table 7. ATT3030 44-Pin PLCC Pinout
Pin No.
Function
Pin No.
Function
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
GND
I/O
I/O
I/O
I/O
I/O
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
GND
I/O
I/O
XTL2–I/O
PWRDWN
TCLKIN–I/O
I/O
I/O
I/O
VCC
I/O
I/O
I/O
M1– RDATA
M0–RTRIG
M2–I/O
HDC–I/O
LDC –I/O
I/O
INIT–I/O
RESET
DONE–PROG
I/O
XTL1–BCLKIN–I/O
I/O
I/O
I/O
VCC
I/O
I/O
I/O
DIN–I/O
DOUT–I/O
CCLK
I/O
I/O
I/O
I/O
Notes:
Peripheral mode and master parallel mode are not supported in the M44 package.
Parallel address and data pins are not assigned.
Lucent Technologies Inc.
39
Data Sheet
February 1997
ATT3000 Series Field-Programmable Gate Arrays
Pin Assignments (continued)
Table 8. ATT3020, ATT3030, and ATT3042; 68-Pin PLCC and 84-Pin PLCC Pinout*
Pin Numbers
68 PLCC 84 PLCC
10
11
—
12
13
—
14
15
16
17
18
19
—
20
21
22
—
23
24
25
26
27
28
29
30
31
—
32
33
—
34
35
36
37
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
Function
PWRDWN
TCLKIN–I/O
I/O†
I/O
I/O
I/O
I/O
I/O
I/O
I/O
VCC
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
M1– RDATA
M0–RTRIG
M2–I/O
HDC–I/O
I/O
LDC –I/O
I/O
I/O†
I/O
I/O
I/O†
INIT –I/O
GND
I/O
I/O
Pin Numbers
68 PLCC 84 PLCC
38
39
40
41
—
—
42
43
44
45
46
47
48
—
49
50
51
—
52
53
54
55
—
—
56
57
58
59
60
61
62
63
64
—
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
Function
I/O
I/O
I/O
I/O
I/O†
I/O†
I/O
XTL2–I/O
RESET
DONE– PROG
D7–I/O
XTL1–BCLKIN–I/O
D6–I/O
I/O
D5–I/O
CS0 –I/O
D4–I/O
I/O
VCC
D3–I/O
CS1–I/O
D2–I/O
I/O
I/O†
D1–I/O
RDY/BUSY– RCLK–I/O
D0–DIN–I/O
DOUT–I/O
CCLK
A0– WS –I/O
A1–CS2–I/O
A2–I/O
A3–I/O
I/O†
* Unprogrammed IOBs have a default pull-up; this prevents an undefined pad level for unbonded or unused IOBs. Programmed outputs are
default slew-limited.
† Indicates unconnected package pins for the ATT3020.
40
Lucent Technologies Inc.
Data Sheet
February 1997
ATT3000 Series Field-Programmable Gate Arrays
Pin Assignments (continued)
Table 8. ATT3020, ATT3030, and ATT3042; 68-Pin PLCC and 84-Pin PLCC Pinout* (continued)
Pin Numbers
68 PLCC 84 PLCC
—
65
66
67
68
1
2
3
80
81
82
83
84
1
2
3
Function
I/O†
A15–I/O
A4–I/O
A14–I/O
A5–I/O
GND
A13–I/O
A6–I/O
Pin Numbers
68 PLCC 84 PLCC
4
5
—
—
6
7
8
9
4
5
6
7
8
9
10
11
Function
A12–I/O
A7–I/O
I/O†
I/O†
A11–I/O
A8–I/O
A10–I/O
A9–I/O
* Unprogrammed IOBs have a default pull-up; this prevents an undefined pad level for unbonded or unused IOBs. Programmed outputs are
default slew-limited.
† Indicates unconnected package pins for the ATT3020.
Note: Table 8 describes the pin assignments for three different chips in two different packages. The function column lists 84 of the 118 pads on
the ATT3042 and 84 of the 98 pads on the ATT3030. Ten pads [indicated with a dagger (†)] do not exist on the ATT3020, which has
74 pads; therefore, the corresponding pins on the 84-pin packages have no connections to an ATT3020.
Lucent Technologies Inc.
41
Data Sheet
February 1997
ATT3000 Series Field-Programmable Gate Arrays
Pin Assignments (continued)
Table 9. ATT3064 and ATT3090 84-Pin PLCC Pinout
84
PLCC
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
Function
PWRDWN
TCLKIN–I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
GND*
VCC
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
M1– RDATA
M0–RTRIG
M2–I/O
HDC–I/O
I/O
LDC –I/O
I/O
I/O
I/O
84
PLCC
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
Function
I/O
INIT–I/O*
VCC*
GND
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
XTL2–I/O
RESET
DONE– PROG
D7–I/O
XTL1–BCLKIN–I/O
D6–I/O
I/O
D5–I/O
CS0 –I/O
D4–I/O
I/O
VCC
GND*
D3–I/O*
CS1 –I/O*
84
PLCC
Function
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
1
2
3
4
5
6
7
8
9
10
11
D2–I/O*
I/O
D1–I/O
RDY/BUSY– RCLK–I/O
D0–DIN–I/O
DOUT–I/O
CCLK
A0– WS –I/O
A1–CS2–I/O
A2–I/O
A3–I/O
I/O*
I/O*
A15–I/O
A4–I/O
A14–I/O
A5–I/O
GND
VCC*
A13–I/O*
A6–I/O*
A12–I/O*
A7–I/O*
I/O
A11–I/O
A8–I/O
A10–I/O
A9–I/O
* Different pin definition than ATT3020/ATT3030/ATT3042 PC84 package.
Note: Unprogrammed IOBs have a default pull-up; this prevents an undefined pad level for unbonded or unused IOBs. Programmed
outputs are default slew-limited.
42
Lucent Technologies Inc.
Data Sheet
February 1997
ATT3000 Series Field-Programmable Gate Arrays
Pin Assignments (continued)
Table 10. ATT3020, ATT3030, and ATT3042 100-Pin QFP Pinout
100
QFP
16
17
18
19
20
21
22
23
24
25
26
27*
28*
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
Function
GND
A13–I/O
A6–I/O
A12–I/O
A7–I/O
I/O*
I/O*
A11–I/O
A8–I/O
A10–I/O
A9–I/O
VCC
GND
PWRDWN
TCLKIN–I/O
I/O**
I/O*
I/O*
I/O
I/O
I/O
I/O
I/O
I/O
I/O
VCC
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
100
QFP
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77*
78
79
80
81
82
83
Function
I/O*
I/O*
M1– RDATA
GND*
M0–RTRIG
VCC*
M2–I/O
HDC–I/O
I/O
LDC –I/O
I/O*
I/O*
I/O
I/O
I/O
INIT–I/O
GND
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O*
I/O*
XTL2–I/O
GND
RESET
VCC*
DONE– PROG
D7–I/O
XTL1–BCLKIN–I/O
D6–I/O
100
QFP
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
—
—
Function
I/O*
I/O*
I/O
D5–I/O
CS0 –I/O
D4–I/O
I/O
VCC
D3–I/O
CS1–I/O
D2–I/O
I/O
I/O*
I/O*
D1–I/O
RCLK–RDY/BUSY–I/O
D0–DIN–I/O
DOUT–I/O
CCLK
VCC*
GND*
A0– WS –I/O
A1–CS2–I/O
I/O**
A2–I/O
A3–I/O
I/O*
I/O*
A15–I/O
A4–I/O
A14–I/O
A5–I/O
—
—
* Only 100 of the 118 pads on the ATT3042 are connected to the 100 package pins. Two pads, indicated by double asterisks, do not exist on
the ATT3030, which has 98 pads; therefore, the corresponding pins have no connections. Twenty-six pads, indicated by single or double
asterisks, do not exist on the ATT3020, which has 74 pads; therefore, the corresponding pins have no connections.
Note: Unprogrammed IOBs have a default pull-up; this prevents an undefined pad level for unbonded or unused IOBs. Programmed outputs
are default slew-limited.
Lucent Technologies Inc.
43
Data Sheet
February 1997
ATT3000 Series Field-Programmable Gate Arrays
Pin Assignments (continued)
Table 11. ATT3030, ATT3042, and ATT3064 100-Pin TQFP Pinout
100
TQFP
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
Function
GND
A13–I/O
A6–I/O
A12–I/O
A7–I/O
I/O
I/O
A11–I/O
A8–I/O
A10–I/O
A9–I/O
VCC
GND
PWRDWN
TCLKIN–I/O
I/O*
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
VCC
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
100
TQFP
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
Function
I/O
I/O
M1– RDATA
GND
M0–RTRIG
VCC
M2–I/O
HDC–I/O
I/O
LDC –I/O
I/O
I/O
I/O
I/O
I/O
INIT–I/O
GND
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
XTL2–I/O
GND
RESET
VCC
DONE– PROG
D7–I/O
XTL1–BCLKIN–I/O
D6–I/O
100
TQFP
Function
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
1
2
3
4
5
6
7
8
9
10
11
12
—
—
I/O
I/O
I/O
D5–I/O
CS0 –I/O
D4–I/O
I/O
VCC
D3–I/O
CS1 –I/O
D2–I/O
I/O
I/O
I/O
D1–I/O
RCLK –RDY/BUSY–I/O
D0–DIN–I/O
DOUT–I/O
CCLK
VCC
GND
A0– WS –I/O
A1–CS2–I/O
I/O*
A2–I/O
A3–I/O
I/O
I/O
A15–I/O
A4–I/O
A14–I/O
A5–I/O
—
—
* Indicates unconnected package pins for the ATT3030.
Note: Unprogrammed IOBs have a default pull-up; this prevents an undefined pad level for unbonded or unused IOBs. Programmed outputs
are default slew-limited.
44
Lucent Technologies Inc.
Data Sheet
February 1997
ATT3000 Series Field-Programmable Gate Arrays
Pin Assignments (continued)
Table 12. ATT3042 and ATT3064 132-Pin PPGA Pinout
132
PPGA
Function
132
PPGA
Function
132
PPGA
Function
C4
A1
C3
B2
B3
A2
B4
C5
A3
A4
B5
C6
A5
B6
A6
B7
C7
C8
A7
B8
A8
A9
B9
C9
A10
B10
A11
C10
B11
A12
B12
A13
C12
B13
C11
A14
D12
C13
B14
C14
E12
D13
D14
E13
GND
PWRDWN
TCLKIN–I/O
I/O
I/O
I/O*
I/O
I/O
I/O*
I/O
I/O
I/O
I/O
I/O
I/O
I/O
GND
VCC
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O*
I/O
I/O
I/O*
I/O
I/O*
I/O
M1– RDATA
GND
M0–RTRIG
VCC
M2–I/O
HDC–I/O
I/O
I/O
I/O
LDC–I/O
I/O*
F12
E14
F13
F14
G13
G14
G12
H12
H14
H13
J14
J13
K14
J12
K13
L14
L13
K12
M14
N14
M13
L12
P14
M11
N13
M12
P13
N12
P12
N11
M10
P11
N10
P10
M9
N9
P9
P8
N8
P7
M8
M7
N7
P6
I/O
I/O
I/O
I/O
I/O
INIT–I/O
VCC
GND
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O*
I/O
I/O
I/O
I/O
XTL2–I/O
GND
RESET
VCC
DONE– PROG
D7–I/O
XTL1–BCLKIN–I/O
I/O
I/O
D6–I/O
I/O
I/O*
I/O
I/O
D5–I/O
CS0–I/O
I/O*
I/O*
D4–I/O
I/O
VCC
GND
D3–I/O
CS1–I/O
N6
P5
M6
N5
P4
P3
M5
N4
P2
N3
N2
M3
P1
M4
L3
M2
N1
M1
K3
L2
L1
K2
J3
K1
J2
J1
H1
H2
H3
G3
G2
G1
F1
F2
E1
F3
E2
D1
D2
E3
C1
B1
C2
D3
I/O*
I/O*
D2–I/O
I/O
I/O
I/O
D1–I/O
RCLK–RDY/BUSY–I/O
I/O
I/O
D0–DIN–I/O
DOUT–I/O
CCLK
VCC
GND
A0– WS–I/O
A1–CS2–I/O
I/O
I/O
A2–I/O
A3–I/O
I/O
I/O
A15–I/O
A4–I/O
I/O*
A14–I/O
A5–I/O
GND
VCC
A13–I/O
A6–I/O
I/O*
A12–I/O
A7–I/O
I/O
I/O
A11–I/O
A8–I/O
I/O
I/O
A10–I/O
A9–I/O
VCC
* Indicates unconnected package pins for the ATT3030.
Note: Unprogrammed IOBs have a default pull-up; this prevents an undefined pad level for unbonded or unused IOBs. Programmed outputs
are default slew-limited.
Lucent Technologies Inc.
45
Data Sheet
February 1997
ATT3000 Series Field-Programmable Gate Arrays
Pin Assignments (continued)
Table 13. ATT3042 and ATT3064 144-Pin TQFP Pinout
144
TQFP
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
Function
PWRDWN
TCLKIN—I/O
I/O*
I/O
I/O
I/O*
I/O
I/O
I/O*
I/O
I/O
I/O
I/O
I/O
I/O*
I/O
I/O
GND
VCC
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O*
I/O
I/O
I/O*
I/O*
I/O
I/O*
I/O
M1– RDATA
144
TQFP
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
Function
GND
M0–RTRIG
VCC
M2–I/O
HDC–I/O
I/O
I/O
I/O
LDC—I/O
I/O*
I/O
I/O
I/O
I/O*
I/O
I/O
INIT–I/O
VCC
GND
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O*
I/O*
I/O
I/O
I/O
I/O
XTL2—I/O
GND
RESET
VCC
144
144
Function
TQFP
TQFP
73
DONE—PROG
109
74
D7–I/O
110
75
111
XTL1–BCLKIN–I/O
76
I/O
112
77
I/O
113
78
D6–I/O
114
79
I/O
115
80
I/O*
116
81
I/O
117
82
I/O
118
83
I/O*
119
84
D5–I/O
120
85
CS0 –I/O
121
86
I/O*
122
87
I/O*
123
88
D4–I/O
124
89
I/O
125
90
VCC
126
91
GND
127
92
D3—I/O
128
93
CS1—I/O
129
94
I/O*
130
95
I/O*
131
96
D2—I/O
132
97
I/O
133
98
I/O
134
99
I/O*
135
100
I/O
136
101
I/O*
137
102
D1—I/O
138
103 RCLK—BUSY/RDY—I/O 139
104
I/O
140
105
I/O
141
106
D0—DIN—I/O
142
107
DOUT–I/O
143
108
CCLK
144
Function
VCC
GND
A0– WS –I/O
A1–CS2–I/O
I/O
I/O
A2–I/O
A3–I/O
I/O
I/O
A15–I/O
A4–I/O
I/O*
I/O*
A14 –I/O
A5–I/O
—
GND
VCC
A13–I/O
A6–I/O
I/O*
—
I/O*
A12–I/O
A7–I/O
I/O
I/O
A11–I/O
A8–I/O
I/O
I/O
A10–I/O
A9–I/O
VCC
GND
* Indicates unconnected package pins for the ATT3042.
Note: Unprogrammed IOBs have a default pull-up; this prevents an undefined pad level for unbonded or unused IOBs. Programmed outputs
are default slew-limited.
46
Lucent Technologies Inc.
Data Sheet
February 1997
ATT3000 Series Field-Programmable Gate Arrays
Pin Assignments (continued)
Table 14. ATT3064 and ATT3090 160-Pin QFP Pinout
160
QFP
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
Function
I/O*
I/O*
I/O*
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
GND
VCC
I/O*
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O*
I/O*
M1– RDATA
160
QFP
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
Function
GND
M0–RTRIG
VCC
M2–I/O
HDC–I/O
I/O
I/O
I/O
LDC –I/O
I/O*
I/O*
I/O
I/O
I/O
I/O
I/O
I/O
I/O
INIT–I/O
VCC
GND
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O*
XTL2–I/O
GND
RESET
VCC
DONE– PROG
160
160
Function
QFP
QFP
81
D7–I/O
121
82
122
XTL1–BCLKIN–I/O
83
I/O*
123
84
I/O
124
85
I/O
125
86
D6–I/O
126
87
I/O
127
88
I/O
128
89
I/O
129
90
I/O
130
91
I/O
131
92
D5–I/O
132
93
CS0 – I/O
133
94
I/O*
134
95
I/O*
135
96
I/O
136
97
I/O
137
98
D4–I/O
138
99
I/O
139
100
VCC
140
101
GND
141
102
D3–I/O
142
103
CS1 –I/O
143
104
I/O
144
105
I/O
145
106
I/O*
146
107
I/O*
147
108
D2–I/O
148
109
I/O
149
110
I/O
150
111
I/O
151
112
I/O
152
113
I/O
153
114
D1–I/O
154
115 RCLK–RDY/BUSY–I/O 155
116
I/O
156
117
I/O
157
118
I/O*
158
119
D0–DIN–I/O
159
120
DOUT–I/O
160
Function
CCLK
VCC
GND
A0– WS –I/O
A1–CS2–I/O
I/O
I/O
A2–I/O
A3–I/O
I/O
I/O
A15–I/O
A4–I/O
I/O
I/O
A14 –I/O
A5–I/O
I/O*
GND
VCC
A13–I/O
A6–I/O
I/O*
I/O*
I/O
I/O
A12–I/O
A7–I/O
I/O
I/O
A11–I/O
A8–I/O
I/O
I/O
A10–I/O
A9–I/O
VCC
GND
PWRDWN
TCLKIN–I/O
* Indicates unconnected package pins for the ATT3064.
Note: Unprogrammed IOBs have a default pull-up; this prevents an undefined pad level for unbonded or unused IOBs. Programmed outputs
are default slew-limited.
Lucent Technologies Inc.
47
Data Sheet
February 1997
ATT3000 Series Field-Programmable Gate Arrays
Pin Assignments (continued)
Table 15. ATT3000 Family 175-Pin PPGA Pinout
175
PPGA
B2
D4
B3
C4
B4
A4
D5
C5
B5
A5
C6
D6
B6
A6
B7
C7
D7
A7
A8
B8
C8
D8
D9
C9
B9
A9
A10
D10
C10
B10
A11
B11
D11
C11
A12
B12
C12
D12
A13
B13
C13
A14
Function
PWRDWN
TCLKIN–I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
GND
VCC
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
175
PPGA
D13
B14
C14
B15
D14
C15
E14
B16
D15
C16
D16
F14
E15
E16
F15
F16
G14
G15
G16
H16
H15
H14
J14
J15
J16
K16
K15
K14
L16
L15
M16
M15
L14
N16
P16
N15
R16
M14
P15
N14
R15
P14
Function
I/O
M1– RDATA
GND
M0–RTRIG
VCC
M2–I/O
HDC–I/O
I/O
I/O
I/O
LDC –I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
INIT –I/O
VCC
GND
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
XTL2–I/O
GND
RESET
VCC
175
PPGA
R14
N13
T14
P13
R13
T13
N12
P12
R12
T12
P11
N11
R11
T11
R10
P10
N10
T10
T9
R9
P9
N9
N8
P8
R8
T8
T7
N7
P7
R7
T6
R6
N6
P6
T5
R5
P5
N5
T4
R4
P4
—
Function
DONE– PROG
D7–I/O
XTL1–BCLKIN–I/O
I/O
I/O
I/O
I/O
D6–I/O
I/O
I/O
I/O
I/O
I/O
D5–I/O
CS0–I/O
I/O
I/O
I/O
I/O
D4–I/O
I/O
VCC
GND
D3–I/O
CS1 –I/O
I/O
I/O
I/O
I/O
D2–I/O
I/O
I/O
I/O
I/O
I/O
D1–I/O
RDY/ BUSY–RCLK–I/O
I/O
I/O
I/O
I/O
—
175
PPGA
Function
R3
N4
R2
P3
N3
P2
M3
R1
N2
P1
N1
L3
M2
M1
L2
L1
K3
K2
K1
J1
J2
J3
H3
H2
H1
G1
G2
G3
F1
F2
E1
E2
F3
D1
C1
D2
B1
E3
C2
D3
C3
—
D0–DIN–I/O
DOUT–I/O
CCLK
VCC
GND
A0– WS –I/O
A1–CS2–I/O
I/O
I/O
A2–I/O
A3–I/O
I/O
I/O
A15 – I/O
A4–I/O
I/O
I/O
A14–I/O
A5–I/O
I/O
I/O
GND
VCC
A13–I/O
A6–I/O
I/O
I/O
I/O
I/O
A12–I/O
A7–I/O
I/O
I/O
A11–I/O
A8–I/O
I/O
I/O
A10–I/O
A9–I/O
VCC
GND
—
Note:Unprogrammed IOBs have a default pull-up; this prevents an undefined pad level for unbonded or unused IOBs. Programmed
outputs are default slew-limited. Pins A2, A3, A15, A16, T1, T2, T3, T15, and T16 are not connected. Pin A1 does not exist.
48
Lucent Technologies Inc.
Data Sheet
February 1997
ATT3000 Series Field-Programmable Gate Arrays
Pin Assignments (continued)
Table 16. ATT3000 Family 208-Pin SQFP Pinout
208
SQFP
Function
208
SQFP
Function
208
SQFP
Function
208
SQFP
Function
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
—
GND
PWRDWN
TCLKIN–I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
GND
VCC
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
—
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
M1–RDATA
GND
M0–RTRIG
—
—
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
101
102
103
104
—
—
VCC
M2–I/O
HDC–I/O
I/O
I/O
I/O
LDC –I/O
I/O
I/O
—
—
—
—
I/O
I/O
I/O
I/O
—
—
I/O
I/O
I/O
INIT–I/O
VCC
GND
I/O
I/O
I/O
—
—
I/O
I/O
I/O
I/O
I/O
—
—
—
I/O
I/O
I/O
I/O
I/O
I/O
I/O
XTL2–I/O
GND
RESET
—
—
105
106
107
108
109
110
111
112
113
114
115
116
117
118
119
120
121
122
123
124
125
126
127
128
129
130
131
132
133
134
135
136
137
138
139
140
141
142
143
144
145
146
147
148
149
150
151
152
153
154
155
156
—
VCC
DONE– PROG
—
D7–I/O
XTL1–BCLKIN–I/O
I/O
I/O
I/O
I/O
D6–I/O
I/O
I/O
I/O
—
I/O
I/O
D5–I/O
CS0–I/O
I/O
I/O
I/O
I/O
D4–I/O
I/O
VCC
GND
D3–I/O
CS1–I/O
I/O
I/O
I/O
I/O
D2–I/O
I/O
I/O
I/O
—
I/O
I/O
D1–I/O
RDY/BUSY–RCLK–I/O
I/O
I/O
I/O
I/O
D0–DIN–I/O
DOUT–I/O
CCLK
VCC
—
—
157
158
159
160
161
162
163
164
165
166
167
168
169
170
171
172
173
174
175
176
177
178
179
180
181
182
183
184
185
186
187
188
189
190
191
192
193
194
195
196
197
198
199
200
201
202
203
204
205
206
207
208
—
—
—
GND
A0– WS–I/O
A1–CS2–I/O
I/O
I/O
A2–I/O
A3–I/O
I/O
I/O
—
—
—
A15–I/O
A4–I/O
I/O
I/O
—
—
A14–I/O
A5–I/O
I/O
I/O
GND
VCC
A13–I/O
A6–I/O
I/O
I/O
—
—
I/O
I/O
A12–I/O
A7–I/O
—
—
—
I/O
I/O
A11–I/O
A8–I/O
I/O
I/O
A10–I/O
A9–I/O
VCC
—
—
—
Note: Unprogrammed IOBs have a default pull-up; this prevents an undefined pad level for unbonded or unused IOBs. Programmed outputs
are default slew-limited.
Lucent Technologies Inc.
49
Data Sheet
February 1997
ATT3000 Series Field-Programmable Gate Arrays
Package Thermal Characteristics
When silicon die junction temperature is below the recommended junction temperature of 125 °C, the
temperature-activated failure mechanisms are minimized. There are four major factors that affect the thermal resistance value: silicon device size/paddle size,
board-mounting configuration (board density, multilayer
nature of board), package type and size, and system
airflow over the package. The values in the table below
reflect the capability of the various package types to
dissipate heat at given airflow rates. The numbers represent the delta °C/W between the ambient temperature and the device junction temperature.
To test package thermal characteristics, a single package containing a 0.269 in. sq. test IC of each configuration is mounted at the center of a printed-circuit board
(PCB) measuring 8 in. x 13 in. x 0.062 in. The assembled PCB is mounted vertically in the center of the rectangular test section of a wind tunnel. The walls of the
wind tunnel simulate adjacent boards in the electronic
rack and can be adjusted to study the effects of PCB
spacing. Forced air at room temperature is supplied by
a pair of push-pull blowers which can be regulated to
supply the desired air velocities. The air velocity is
measured with a hot-wire anemometer at the center of
the channel, 3 in. upstream from the package.
A typical test consists of regulating the wind tunnel
blowers to obtain the desired air velocity and applying
power to the test IC. The power to the IC is adjusted
until the maximum junction temperature (as measured
by its diodes) reaches 115 °C to 120 °C. The thermal
resistance ΘJA (°C/W) is computed by using the power
supplied to the IC, junction temperature, ambient temperature, and air velocity:
50
J – TA
Θ JA = T
--------------------
QC
where:
TJ = peak temperature on the active surface of the IC
TA = ambient air temperature
QC = IC power
The tests are repeated at several velocities from 0 fpm
(feet per minute) to 1000 fpm.
The definition of the junction to case thermal resistance
ΘJC is:
J – TC
Θ JC = T
--------------------
QC
where:
TC = temperature measured to the thermocouple at
the top dead center of the package
The actual ΘJC measurement performed at Lucent,
ΘJ – TDC, uses a different package mounting arrangement than the one defined for ΘJC in MIL-STD-883D
and SEMI standards. Please contact Lucent for a diagram.
The maximum power dissipation for a package is calculated from the maximum junction temperature, maximum operating temperature, and the junction to
ambient characteristic ΘJA. The maximum power dissipation for commercial grade ICs is calculated as follows: max power (watts) = (125 °C – 70 °C) x (1/ΘJA),
where 125 °C is the maximum junction temperature.
Table 17 lists the ATT3000 plastic package thermal
characteristics.
Lucent Technologies Inc.
Data Sheet
February 1997
ATT3000 Series Field-Programmable Gate Arrays
Package Thermal Characteristics (continued)
Table 17. ATT3000 Plastic Package Thermal Characteristics
QJA (°C/W)
0 fpm
200 fpm
400 fpm
QJC
(°C/W)
Max Power
(70 °C—0 fpm)
44-Pin PLCC
49
43
40
—
1.12 W
68-Pin PLCC
43
38
35
11
1.28 W
Package
84-Pin PLCC
40
35
32
9
1.38 W
100-Pin QFP
81
67
64
11
0.68 W
100-Pin TQFP
61
49
46
6
0.90 W
132-Pin PPGA
22
18
16
—
2.50 W
144-Pin TQFP
52
39
36
4
1.06 W
160-Pin QFP
40
36
32
8
1.38 W
175-Pin PPGA
23
20
17
—
2.39 W
208-Pin SQFP
37
33
29
8
1.49 W
Package Coplanarity
The coplanarity of Lucent Technologies postmolded
packages is 4 mils. The coplanarity of the SQFP and
TQFP packages is 3.15 mils.
Package Parasitics
The electrical performance of an IC package, such as
signal quality and noise sensitivity, is directly affected
by the package parasitics. Table 18 lists eight parasitics
associated with the ATT3000 packages. These parasitics represent the contributions of all components of a
package, which include the bond wires, all internal
package routing, and the external leads.
Four inductances in nH are listed: LW and LL, the selfinductance of the lead; and LMW and LML, the mutual
inductance to the nearest neighbor lead. These
parameters are important in determining ground
bounce noise and inductive crosstalk noise. Three
Lucent Technologies Inc.
capacitances in pF are listed: CM, the mutual capacitance of the lead to the nearest neighbor lead; and C1
and C2, the total capacitance of the lead to all other
leads (all other leads are assumed to be grounded).
These parameters are important in determining capacitive crosstalk and the capacitive loading effect of the
lead.
The parasitic values in Table 18 are for the circuit
model of bond wire and package lead parasitics. If the
mutual capacitance value is not used in the designer’s
model, then the value listed as mutual capacitance
should be added to each of the C1 and C2 capacitors.
The PGAs contain power and ground planes that will
make the inductance value for power and ground leads
the minimum value listed. The PGAs also have a significant range of parasitic values. This is due to the large
variation in internal trace lengths and is also due to two
signal metal layers that are separated from the ground
plane by different distances. The upper signal layer is
more inductive but less capacitive than the closer,
lower signal layer.
51
Data Sheet
February 1997
ATT3000 Series Field-Programmable Gate Arrays
Package Parasitics (continued)
Table 18. Package Parasitics
Package Type
LW
MW
RW
C1
C2
CM
LL
ML
44-Pin PLCC
3
1
140
0.5
0.5
0.3
5—6
2—2.5
68-Pin PLCC
3
1
140
0.5
0.5
0.4
6—9
3—4
84-Pin PLCC
3
1
140
1
1
0.5
7—11
3—6
100-Pin QFP
3
1
160
1
1
0.5
7—9
4—5
100-Pin TQFP
3
1
150
0.5
0.5
0.4
4—6
2—3
132-Pin PPGA
3
1
150
1
1
0.25
4—10
0.5—1
144-Pin TQFP
3
1
140
1
1
0.6
4—6
2—2.5
160-Pin QFP
4
1.5
180
1.5
1.5
1
10—13
6—8
175-Pin PPGA
3
1
150
1
1
0.3
5—11
1—1.5
208-Pin SQFP
4
2
200
1
1
1
7—10
4—6
* Leads designated as ground (power) can be connected to the ground plane, reducing the trace inductance to the minimum value listed.
LW
RW
LL
CIRCUIT
BOARD PAD
PAD N
C1
LMW CM
C2
LML
PAD N + 1
LW
RW
LL
C1
C2
5-3862(C)
Figure 32. Package Parasitics
52
Lucent Technologies Inc.
Data Sheet
February 1997
ATT3000 Series Field-Programmable Gate Arrays
Absolute Maximum Ratings
Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are absolute stress ratings only. Functional operation of the device is not implied at these or any other conditions in excess
of those given in the operational sections of the data sheet. Exposure to absolute maximum ratings for extended
periods can adversely affect device reliability.
Parameter
Supply Voltage Relative to GND
Input Voltage Relative to GND
Voltage Applied to 3-state Output
Storage Temperature (ambient)
Maximum Soldering Temperature
(10 seconds at 1/16 in.)
Junction Temperature
Lucent Technologies Inc.
Symbol
Min
Max
Unit
VCC
VIN
VTS
Tstg
TSOL
–0.5
–0.5
–0.5
–65
—
7.0
0.5
0.5
150
260
V
V
V
°C
°C
TJ
—
125
°C
53
Data Sheet
February 1997
ATT3000 Series Field-Programmable Gate Arrays
Electrical Characteristics
Table 19. dc Electrical Characteristics Over Operating Conditions
Commercial: VCC = 5.0 V ± 5%; 0 °C ≤ TA ≤ 70 °C; Industrial: VCC = 5.0 ± 10%, –40 °C ≤ TA ≤ +85 °C.
Parameter/Conditions
High-level Input Voltage
CMOS Level
TTL Level
Low-level Input Voltage
CMOS Level
TTL Level
Output Voltage
High
(IOH = –4 mA)
(IOH = –8 mA)
Low
(IOL = 4 mA)
(IOL = 8 mA)
Input Signal Transition Time
Powerdown Supply Current
ATT3020
ATT3030
ATT3042
ATT3064
ATT3090
Quiescent FPGA Supply Current
(in addition to ICCPD)
CMOS Inputs
ATT3020
ATT3030
ATT3042
ATT3064
ATT3090
TTL Inputs
Leakage Current
Input Capacitance*
All Packages Except 175-PGA:
All Pins Except XTL1/XTL2
XTL1 and XTL2
175-PGA Package:
All Pins Except XTL1/XTL2
XTL1 and XTL2
Pad Pull-up* (when selected)
(at VIN = 0 V)
Horizontal Long-line Pull-up (when
selected) at Logic LOW
Symbol
-50, -70, -100, and -125
-3, -4, and -5
Unit
Min
Max
Min
Max
VIHC
VIHT
70%
2.0
100%
VCC
70%
2.0
100%
VCC
V
V
VILC
VILT
0
0
20%
0.8
0
0
20%
0.8
V
V
VOH
VOH
3.86
—
—
—
—
3.86
—
—
V
V
VOL
VOL
TIN
—
—
0.40
—
—
—
—
0.40
V
V
—
250
—
250
ns
—
—
—
—
—
50
80
120
170
250
—
—
—
—
—
50
80
120
170
250
µA
µA
µA
µA
µA
—
—
—
—
—
—
–10
500
500
500
500
500
10
10
—
—
—
—
—
—
—
–10
10
500
500
500
500
500
20
10
mA
µA
µA
µA
µA
µA
mA
µA
—
—
10
15
—
—
10
15
pF
pF
—
—
15
20
—
—
15
20
pF
pF
0.02
0.17
0.02
0.17
mA
0.2
2.5
0.2
2.8
mA
ICCPD
ICCO
IIL
CIN
IRIN
IRLL
* Sample tested.
Note: With no output current loads, no active input or long-line pull-up resistors, all package pins at VCC or GND, and the FPGA configured
with a bit stream generation program tie option.
54
Lucent Technologies Inc.
Data Sheet
February 1997
ATT3000 Series Field-Programmable Gate Arrays
Electrical Characteristics (continued)
Table 20. CLB Switching Characteristics (-50, -70, -100, and -125)
Commercial: VCC = 5.0 V ± 5%; 0 °C ≤ TA ≤ 70 °C; Industrial: VCC = 5.0 ± 10%, –40 °C ≤ TA ≤ +85 °C.
-50
Description
Combinatorial Delay
Sequential Delay
Clock K to Outputs x or y
Clock K to Outputs x or y when Q
Returned Through Function
Generators F or G to Drives x or y
Setup Time
Logic Variables
Data In
Enable Clock
Reset Direct Active
Hold Time
Logic Variables
Data In
Enable Clock
Clock
High Time*
Low Time*
Flip-Flop Toggle Rate*
Reset Direct (rd)
rd Width
Delay from rd to Outputs x, y
Master Reset (MR)
MR Width
Delay from MR to Outputs x, y
-70
-100
-125
Symbol
Unit
Min
Max
Min
Max
Min
Max
Min
Max
1
TILO
—
14.0
—
9.0
—
7.0
—
5.5
ns
8
—
TCKO
TQLO
—
—
12.0
23.0
—
—
6.0
13.0
—
—
5.0
10.0
—
—
4.5
8.0
ns
ns
2
4
6
—
TICK
TDICK
TECCK
TRDCK
12.0
8.0
10.0
1.0
—
—
—
—
8.0
5.0
7.0
1.0
—
—
—
—
7.0
4.0
5.0
1.0
—
—
—
—
5.5
3.0
4.5
1.0
—
—
—
—
ns
ns
ns
ns
3
5
7
TCKI
TCKDI
TCKEC
1.0
6.0
0
—
—
—
0
4.0
0
—
—
—
0
2.0
0
—
—
—
0
1.5
0
—
—
—
ns
ns
ns
11
12
—
TCH
TCL
FCLK
9.0
9.0
50
—
—
—
5.0
5.0
70
—
—
—
4.0
4.0
100
—
—
—
3.0
3.0
125
—
—
—
ns
ns
MHz
13
9
TRPW
TRIO
12.0
—
—
12.0
8.0
—
—
8.0
7.0
—
—
7.0
6.0
—
—
6.0
ns
ns
—
—
TMRW
TMRQ
30
—
—
27
25
—
—
23
21
—
—
19
20
—
—
17
ns
ns
* These parameters are for clock pulses within an FPGA device. For externally applied clock, increase values by 20%.
Note: The CLB K to Q output delay (TCKO—#8) of any CLB, plus the shortest possible interconnect delay, is always longer than the data in
hold time requirement (TCKDI—#5) of any CLB on the same die.
Lucent Technologies Inc.
55
Data Sheet
February 1997
ATT3000 Series Field-Programmable Gate Arrays
Electrical Characteristics (continued)
Table 21. CLB Switching Characteristics (-3, -4, and -5)
Commercial: VCC = 5.0 V ± 5%; 0 °C ≤ TA ≤ 70 °C; Industrial: VCC = 5.0 ± 10%, –40 °C ≤ TA ≤ +85 °C.
-5
Description
Combinatorial Delay
Sequential Delay
Clock K to Outputs x or y
Clock K to Outputs x or y when Q Returned
Through Function Generators F or G to
Drives x or y
Setup Time
Logic Variables
Data In
Enable Clock
Reset Direct Active
Hold Time
Logic Variables
Data In
Enable Clock
Clock
High Time*
Low Time*
Flip-Flop Toggle Rate*
Reset Direct (rd)
rd Width
Delay from rd to Outputs x, y
Master Reset (MR)
MR Width
Delay from MR to Outputs x, y
-4
-3
Symbol
Unit
Min
Max
Min
Max
Min
Max
1
TILO
—
4.1
—
3.3
—
2.7
ns
8
—
TCKO
TQLO
—
—
3.1
6.3
—
—
2.5
5.2
—
—
2.1
4.3
ns
ns
2
4
6
—
TICK
TDICK
TECCK
TRDCK
3.1
2.0
3.8
1.0
—
—
—
—
2.5
1.6
3.2
1.0
—
—
—
—
2.1
1.4
2.7
1.0
—
—
—
—
ns
ns
ns
ns
3
5
7
TCKI
TCKDI
TCKEC
0
1.2
1.0
—
—
—
0
1.0
0.8
—
—
—
0
0.9
0.7
—
—
—
ns
ns
ns
11
12
—
TCH
TCL
FCLK
2.4
2.4
190
—
—
—
2.0
2.0
230
—
—
—
1.6
1.6
270
—
—
—
ns
ns
MHz
13
9
TRPW
TRIO
3.8
—
—
4.4
3.2
—
—
3.7
2.7
—
—
3.1
ns
ns
—
—
TMRW
TMRQ
18.0
—
—
17.0
15.0
—
—
14.0
13.0
—
—
12.0
ns
ns
* These parameters are for clock pulses within an FPGA device. For externally applied clock, increase values by 20%.
Note: The CLB K to Q output delay (TCKO—#8) of any CLB, plus the shortest possible interconnect delay, is always longer than the data in
hold time requirement (TCKDI—#5) of any CLB on the same die.
56
Lucent Technologies Inc.
Data Sheet
February 1997
ATT3000 Series Field-Programmable Gate Arrays
Electrical Characteristics (continued)
CLB OUTPUT (X,Y)
(COMBINATORIAL)
1 TILO
CLB INPUT
(A, B, C, D, E)
2 TICK
3 TCKI
CLB CLOCK
12 TCL
4 TDICK
11 TCH
5 TCKDI
CLB INPUT
(DIRECT IN)
6 TECCK
7 TCKEC
CLB INPUT
(ENABLE CLOCK)
8 TCKO
CLB OUTPUT
(FLIP-FLOP)
CLB INPUT
(RESET DIRECT)
13 TRPW
9 TRIO
CLB OUTPUT
(FLIP-FLOP)
5-3124(F)
Figure 33. CLB Switching Characteristics
Lucent Technologies Inc.
57
Data Sheet
February 1997
ATT3000 Series Field-Programmable Gate Arrays
Electrical Characteristics (continued)
Table 22. IOB Switching Characteristics (-50, -70, -100, and -125)
Commercial: VCC = 5.0 V ± 5%; 0 °C ≤ TA ≤ 70 °C; Industrial: VCC = 5.0 ± 10%, –40 °C ≤ TA ≤ +85 °C.
-50
Description
Input Delays
Pad to Direct In
Pad to Registered In
Clock to Registered In
Setup Time (Input):
Clock Setup Time
Output Delays
Clock to Pad
Fast
Slew-rate Limited
Output to Pad
Fast
Slew-rate Limited
3-state to Pad Hi-Z
Fast
Slew-rate Limited
3-state to Pad Valid
Fast
Slew-rate Limited
Setup and Hold Times (output)
Clock Setup Time
Clock Hold Time
Clock
High Time*
Low Time*
Max. Flip-Flop Toggle*
Master Reset Delays
RESET to:
Registered In
Output Pad (fast)
Output Pad (slewrate limited)
-70
-100
-125
Symbol
Unit
Min
Max
Min
Max
Min
Max
Min
Max
3
—
4
TPID
TPTG
TIKRI
—
—
—
9.0
34.0
11.0
—
—
—
6.0
21.0
5.5
—
—
—
4.0
17.0
4.0
—
—
—
3.0
16.0
3.0
ns
ns
ns
1
TPICK
30.0
—
20.0
—
17.0
—
16.0
—
ns
7
7
TOKPO
TOKPO
—
—
18.0
43.0
—
—
13.0
33.0
—
—
10.0
27.0
—
—
9.0
24.0
ns
ns
10
10
TOPF
TOPS
—
—
15.0
40.0
—
—
9.0
29.0
—
—
6.0
23.0
—
—
5.0
20.0
ns
ns
9
9
TTSHZ
TTSHZ
—
—
10.0
37.0
—
—
8.0
28.0
—
—
8.0
25.0
—
—
7.0
24.0
ns
ns
8
8
TTSON
TTSON
—
—
20.0
45.0
—
—
14.0
34.0
—
—
12.0
29.0
—
—
11.0
27.0
ns
ns
5
6
TOCK
TOKO
15.0
0
—
—
10.0
0
—
—
9.0
0
—
—
8.0
0
—
—
ns
ns
11
12
—
TCH
TCL
FCLK
9.0
9.0
—
—
—
50
5.0
5.0
—
—
—
70
4.0
4.0
—
—
—
100
3.0
3.0
—
—
—
125
ns
ns
MHz
13
15
15
TRRI
TRPO
TRPO
—
—
—
35
50
68
—
—
—
25
35
53
—
—
—
24
33
45
—
—
—
23
29
42
ns
ns
ns
* These parameters are for clock pulses within an FPGA device. For externally applied clock, increase values by 20%.
Notes:
Timing is measured at pin threshold with 50 pF external capacitive loads (including test fixture).
Typical fast mode output rise/fall times are 2 ns and will increase approximately 2%/pF of additional load.
Typical slew-rate limited output rise/fall times are approximately 4 times longer.
A maximum total external capacitive load for simultaneous fast mode switching in the same direction is 200 pF per power/ground pin pair. For
slew-rate limited outputs, this total is 4 times larger. Exceeding this maximum capacitive load can result in ground bounce of >1.5 V amplitude
and <5 ns duration, which may cause problems when the FPGA drives clocks and other asynchronous signals.
Voltage levels of unused (bonded and unbonded) pads must be valid logic levels. Each can be configured with the internal pull-up resistor or
alternatively configured as a driven output or driven from an external source.
Input pad setup time is specified with respect to the internal clock (ik).
To calculate system setup time, subtract clock delay (pad to ik) from the input pad setup time value. Input pad hold time with respect to the internal clock (ik) is negative. This means that pad levels changed immediately before the internal clock edge (ik) will not be recognized.
58
Lucent Technologies Inc.
Data Sheet
February 1997
ATT3000 Series Field-Programmable Gate Arrays
Electrical Characteristics (continued)
Table 23. IOB Switching Characteristics (-3, -4, and -5)
Commercial: VCC = 5.0 V ± 5%; 0 °C ≤ TA ≤ 70 °C; Industrial: VCC = 5.0 ± 10%, –40 °C ≤ TA ≤ +85 °C.
-5
Description
Input Delays
Pad to Direct In
Pad to Registered In
Clock to Registered In
Setup Time (Input):
Clock Setup Time
Output Delays
Clock to Pad
Fast
Slew-rate Limited
Output to Pad
Fast
Slew-rate Limited
3-state to Pad Hi-Z
Fast
Slew-rate Limited
3-state to Pad Valid
Fast
Slew-rate Limited
Setup and Hold Times
(output)
Clock Setup Time
Clock Hold Time
Clock
High Time*
Low Time*
Max. Flip-Flop Toggle*
Master Reset Delays
RESET to:
Registered In
Output Pad (fast)
Output Pad (slewrate limited)
-4
-3
Symbol
Unit
Min
Max
Min
Max
Min
Max
3
—
4
TPID
TPTG
TIKRI
—
—
—
2.8
16.0
2.8
—
—
—
2.5
15.0
2.5
—
—
—
2.2
13.0
2.2
ns
ns
ns
1
TPICK
15.0
—
14.0
—
12.0
—
ns
7
7
TOKPO
TOKPO
—
—
5.5
14.0
—
—
5.0
12.0
—
—
4.4
10.0
ns
ns
10
10
TOPF
TOPS
—
—
4.1
13.0
—
—
3.7
11.0
—
—
3.3
9.0
ns
ns
9
9
TTSHZ
TTSHZ
—
—
6.9
21.0
—
—
6.2
19.0
—
—
5.5
17.0
ns
ns
8
8
TTSON
TTSON
—
—
12.0
20.0
—
—
10.0
17.0
—
—
9.0
15.0
ns
ns
5
6
TOCK
TOKO
6.2
0
—
—
5.6
0
—
—
5.0
0
—
—
ns
ns
11
12
—
TCH
TCL
FCLK
2.4
2.4
190
—
—
—
2.0
2.0
230
—
—
—
1.6
1.6
270
—
—
—
ns
ns
MHz
13
15
15
TRRI
TRPO
TRPO
—
—
—
18
24
32
—
—
—
15
20
27
—
—
—
13
17
23
ns
ns
ns
* These parameters are for clock pulses within an FPGA device. For externally applied clock, increase values by 20%.
Notes:
Timing is measured at pin threshold with 50 pF external capacitive loads (including test fixture).
Typical fast mode output rise/fall times are 2 ns and will increase approximately 2%/pF of additional load.
Typical slew-rate limited output rise/fall times are approximately 4 times longer.
A maximum total external capacitive load for simultaneous fast mode switching in the same direction is 200 pF per power/ground pin pair. For
slew-rate limited outputs, this total is 4 times larger. Exceeding this maximum capacitive load can result in ground bounce of >1.5 V amplitude
and <5 ns duration, which may cause problems when the FPGA drives clocks and other asynchronous signals.
Voltage levels of unused (bonded and unbonded) pads must be valid logic levels. Each can be configured with the internal pull-up resistor or
alternatively configured as a driven output or driven from an external source.
Input pad setup time is specified with respect to the internal clock (ik).
To calculate system setup time, subtract clock delay (pad to ik) from the input pad setup time value. Input pad hold time with respect to the
internal clock (ik) is negative. This means that pad levels changed immediately before the internal clock edge (ik) will not be recognized.
Lucent Technologies Inc.
59
Data Sheet
February 1997
ATT3000 Series Field-Programmable Gate Arrays
Electrical Characteristics (continued)
I/O BLOCK (I)
3 TPID
I/O PAD INPUT
1 TPICK
2 TIKPI
I/O CLOCK
(IK/OK)
12 TCL
11 TCH
I/O BLOCK (RI)
4 TIKRI
13 TRRI
RESET
5 TOCK
6 TOKO
15 TRPO
I/O BLOCK (O)
10 TOP
I/O PAD OUTPUT
(DIRECT)
7 TOKPO
I/O PAD OUTPUT
(REGISTERED)
I/O PAD TS
TTSON 8
TTSHZ 9
I/O PAD OUTPUT
5-3126(F)
Figure 34. IOB Switching Characteristics
60
Lucent Technologies Inc.
Data Sheet
February 1997
ATT3000 Series Field-Programmable Gate Arrays
Electrical Characteristics (continued)
Table 24. Buffer (Internal) Switching Characteristics
Commercial: VCC = 5.0 V ± 5%; 0 °C ≤ TA ≤ 70 °C; Industrial: VCC = 5.0 ± 10%, –40 °C ≤ TA ≤ +85 °C.
Description
Global and Alternate Clock Distribution*:
Either Normal IOB Input Pad to
Clock Buffer Input or
Fast (CMOS only) Input Pad to
Clock Buffer Input
TBUF Driving a Horizontal Long Line (LL)*:
I to LL While T Is Low (buffer active)
T↓ to LL Active and Valid with
Single Pull-up Resistor
T↓ to LL Active and Valid with
Pair of Pull-up Resistors
T↑ to LL High with Single Pull-up
Resistor
T↑ to LL High with Pair of Pull-up
Resistors
Bidirectional Buffer Delay
-50
-70
-100
-125
-5
-4
-3
Max
Max
Max
Max
Max
Max
Max
TPID
10.0
8.0
7.5
7.0
6.8
6.5
5.6
ns
TPIDC
8.0
6.5
6.0
5.7
5.4
5.1
4.3
ns
TIO
TON
8.0
12.0
5.0
11.0
4.7
10.0
4.5
9.0
4.1
5.6
3.7
5.0
3.1
4.2
ns
ns
TON
14.0
12.0
11.0
10.0
7.1
6.5
5.7
ns
TPUS
42.0
24.0
22.0
17.0
15.6
13.5
11.4
ns
TPUF
22.0
17.0
15.0
12.0
12.0
10.5
8.8
ns
TBIDI
6.0
2.0
1.8
1.7
1.4
1.2
1.0
ns
Symbol
Unit
* Timing is based on the ATT3042; for other devices, see timing calculator in ORCA Foundry.
Lucent Technologies Inc.
61
Data Sheet
February 1997
ATT3000 Series Field-Programmable Gate Arrays
Electrical Characteristics (continued)
4 TMRW
RESET
2 TMR
M0/M1/M2
3 TRM
VALID
5 TPGW
DONE/PROG
6 TPGI
INIT
(OUTPUT)
CLEAR STATE
USER STATE
CONFIGURE
PWRDWN
See *
VCC (VALID)
VCCPD
5-3124(F)
* At powerup, VCC must rise from 2 V to VCC minimum in less than 25 ms. If this is not possible, configuration can be delayed by holding
RESET low until VCC has reached 4 V. A very long VCC rise time of >100 ms or a nonmonotonically rising VCC may require a >1 µs high level
on RESET, followed by a >6 µs low level on RESET and DONE/PROG after VCC has reached 4 V.
Figure 35. General FPGA Switching Characteristics
Testing of the switching characteristics is modeled after testing specified by MIL-M-38510/605. Devices are 100%
functionally tested. Actual worst-case timing is provided by the timing calculator or simulation.
Table 25. General FPGA Switching Characteristics
Signal
Description
Symbol
Min
Max
Unit
RESET *
M0, M1, and M2 Setup Time
M0, M1, and M2 Hold Time
RESET Width (LOW) Required for Abort
TMR (2)
TRM (3)
TMRW (4)
1
4.5
6
—
—
—
µs
µs
µs
DONE/PROG
Width Low Required for Reconfiguration
INIT Response After DONE/PROG is Pulled Low
TPGW (5)
TPGI (6)
6
—
—
7
µs
µs
VCC†
Powerdown VCC (commercial/industrial)
VCCPD
2.3
—
V
* RESET timing relative to valid mode lines (M0, M1, M2) is relevant when RESET is used to delay configuration.
† PWRDWN transitions must occur while VCC > 4 V.
62
Lucent Technologies Inc.
Data Sheet
February 1997
ATT3000 Series Field-Programmable Gate Arrays
Electrical Characteristics (continued)
CCLK
(OUTPUT)
2 TCKDS
1 TDSCK
SERIAL DIN
SERIAL DOUT
(OUTPUT)
5-3127(F).a
Figure 36. Master Serial Mode Switching Characteristics
Table 26. Master Serial Mode Switching Characteristics
Signal
CCLK
Description
Data-in Setup
Data-in Hold
Symbol
1
2
TDSCK
TCKDS
Min
Max
Unit
60
0
—
—
ns
ns
Notes:
At powerup, VCC must rise from 2.0 V to VCC minimum in less than 25 ms. If this is not possible, configuration can be delayed by
holding RESET low until VCC has reached 4.0 V. A very long VCC rise time of >100 ms, or a nonmonotonically rising VCC may require
a >1 µs high level on RESET, followed by >6 µs low level on RESET and D/P after VCC has reached 4.0 V.
Configuration can be controlled by holding RESET low with or until after the INIT of all daisy-chain slave mode devices is high.
Master serial mode timing is based on slave mode testing.
Lucent Technologies Inc.
63
Data Sheet
February 1997
ATT3000 Series Field-Programmable Gate Arrays
Electrical Characteristics (continued)
A[15:0]
ADDRESS FOR BYTE N
ADDRESS FOR BYTE N + 1
1 TRAC
D[7:0]
BYTE N
2 TDRC
3 TRCD
RCLK
(OUTPUT)
7 CCLKs
CCLK
CCLK
(OUTPUT)
DOUT
(OUTPUT)
D6
D7
BYTE N – 1
5-3128(F)
Note: The EPROM requirements in this timing diagram are extremely relaxed; EPROM access time can be longer than 4000 ns. EPROM data
output has no hold time requirements.
Figure 37. Master Parallel Mode Switching Characteristics
Table 27. Master Parallel Mode Switching Characteristics
Signal
RCLK
Description
To Address Valid
To Data Setup
To Data Hold
RCLK High
RCLK Low
Symbol
1
2
3
—
—
TRAC
TDRC
TRCD
TRCH
TRCL
Min
Max
Unit
0
60
0
600
4.0
200
—
—
—
—
ns
ns
ns
ns
µs
Notes:
At powerup, VCC must rise from 2.0 V to VCC minimum in less than 25 ms. If this is not possible, configuration can be delayed by holding RESET
low until VCC has reached 4.0 V. A very long VCC rise time of >100 ms, or a nonmonotonically rising VCC may require a >1 µs high level on
RESET, followed by >6 µs low level on RESET and D/P after VCC has reached 4.0 V.
Configuration can be controlled by holding RESET low with or until after the INIT of all daisy-chain slave mode devices is high.
64
Lucent Technologies Inc.
Data Sheet
February 1997
ATT3000 Series Field-Programmable Gate Arrays
Electrical Characteristics (continued)
CS1/CS0
CS2
1 TCA
WS
2 TDC
5 TRBWT
3 TCD
VALID
D[7:0]
GROUP OF
8 CCLKs
CCLK
TWTRB 4
6 TBUSY
RDY/BUSY
DOUT
5-3129(F)
Note: The requirements in this timing diagram are extremely relaxed; data need not be held beyond the rising edge of WS. BUSY will go active
within 60 ns after the end of WS. BUSY will stay active for several microseconds. WS may be asserted immediately after the end of BUSY.
Figure 38. Peripheral Mode Switching Characteristics
Table 28. Peripheral Mode Switching Characteristics
Signal
Write Signal
D[7:0]
RDY/BUSY
Description
Effective Write Time Required
(Assertion of CS0, CS1, CS2, WS)
DIN Setup Time Required
DIN Hold TIme Required
RDY/BUSY Delay after End of WS
Earliest Next WS after End of BUSY
BUSY Low Time Generated
Symbol
1
2
3
4
5
6
TCA
TDC
TCD
TWTRB
TRBWT
TBUSY
Min
Max
Unit
100
60
0
—
0
2.5
—
—
—
60
—
9
ns
ns
ns
ns
ns
CCLK
Periods
Notes:
At powerup, VCC must rise from 2.0 V to VCC minimum in less than 25 ms. If this is not possible, configuration can be delayed by holding RESET
low until VCC has reached 4.0 V. A very long VCC rise time of >100 ms, or a nonmonotonically rising VCC may require a >1 µs high level on
RESET, followed by >6 µs low level on RESET and D/P after VCC has reached 4.0 V.
Configuration must be delayed until the INIT of all FPGAs is high.
Time from end of WS to CCLK cycle for the new byte of data depends on completion of previous byte processing and the phase of the
internal timing generator for CCLK.
CCLK and DOUT timing is tested in slave mode.
TBUSY indicates that the double-buffered parallel-to-serial converter is not yet ready to receive new data. The shortest TBUSY occurs when a
byte is loaded into an empty parallel-to-serial converter. The longest TBUSY occurs when a new word is loaded into the input register before the
second-level buffer has started shifting out data.
Lucent Technologies Inc.
65
Data Sheet
February 1997
ATT3000 Series Field-Programmable Gate Arrays
Electrical Characteristics (continued)
DIN
BIT N
1 TDCC
BIT N + 1
2 TCCD
5 TCCL
CCLK
4 TCCH
DOUT
(OUTPUT)
3 TCCO
BIT N
BIT N – 1
5-3130(F)
Figure 39. Slave Mode Switching Characteristics
Table 29. Slave Mode Switching Characteristics
Commercial: VCC = 5.0 V ± 5%; 0 °C ≤ TA ≤ 70 °C; Industrial: VCC = 5.0 ± 10%, –40 °C ≤ TA ≤ +85 °C.
Signal
CCLK
Description
To DOUT
DIN Setup
DIN Hold
HIGH Time
LOW Time
Frequency
Symbol
3
1
2
4
5
—
TCCO
TDCC
TCCD
TCCH
TCCL
FCC
Min
Max
Unit
—
60
0
0.05
0.05
—
100
—
—
—
5.0
10.0
ns
ns
ns
µs
µs
MHz
Notes:
The maximum limit of CCLK LOW time is caused by dynamic circuitry inside the FPGA device.
Configuration must be delayed until the INIT of all FPGAs is high.
At powerup, VCC must rise from 2.0 V to VCC minimum in less than 25 ms. If this is not possible, configuration can be delayed by holding RESET
low until VCC has reached 4.0 V. A very long VCC rise time of >100 ms, or a nonmonotonically rising VCC, may require a >1 µs high level on
RESET, followed by >6 µs low level on RESET and D/P after VCC has reached 4.0 V.
66
Lucent Technologies Inc.
Data Sheet
February 1997
ATT3000 Series Field-Programmable Gate Arrays
Electrical Characteristics (continued)
DONE/PROG
(OUTPUT)
1 TRTH
RTRIG (M0)
2 TRTCC
4 TCCL
4 TCCL
CCLK (1)
3 TCCRD
RDATA
(OUTPUT)
VALID
5-3131(F)
Figure 40. Program Readback Switching Characteristics
Table 30. Program Readback Switching Characteristics
Commercial: VCC = 5.0 V ± 5%; 0 °C ≤ TA ≤ 70 °C; Industrial: VCC = 5.0 ± 10%, –40 °C ≤ TA ≤ +85 °C.
Signal
Description
Symbol
Min
Max
Unit
RTRIG
RTRIG HIGH
1
TRTH
250
—
ns
CCLK
RTRIG Setup
RDATA Delay
HIGH Time
LOW Time
2
3
5
4
TRTCC
TCCRD
TCCH
TCCL
200
—
0.5
0.5
—
100
—
5.0
ns
ns
µs
µs
Notes:
During readback, CCLK frequency may not exceed 1 MHz.
RTRIG (M0 positive transition) must not be done until after one clock following active I/O pins.
Readback should not be initiated until after configuration is complete.
Lucent Technologies Inc.
67
Data Sheet
February 1997
ATT3000 Series Field-Programmable Gate Arrays
Outline Diagrams
Terms and Definitions
Basic Size (BSC):
Design Size:
Typical (TYP):
Reference (REF):
Minimum (MIN) or
Maximum (MAX):
The basic size of a dimension is the size from which the limits for that dimension are derived
by the application of the allowance and the tolerance.
The design size of a dimension is the actual size of the design, including an allowance for fit
and tolerance.
When specified after a dimension, indicates the repeated design size if a tolerance is specified or repeated basic size if a tolerance is not specified.
The reference dimension is an untoleranced dimension used for informational purposes only.
It is a repeated dimension or one that can be derived from other values in the drawing.
Indicates the minimum or maximum allowable size of a dimension.
44-Pin PLCC
Dimensions are in millimeters.
17.65 MAX
16.66 MAX
PIN #1 IDENTIFIER
ZONE
6
1
40
7
39
16.66
MAX
17.65
MAX
17
29
18
28
4.57
MAX
SEATING PLANE
1.27 TYP
68
0.53
MAX
0.51 MIN
TYP
0.10
5-2506r7(C)
Lucent Technologies Inc.
Data Sheet
February 1997
ATT3000 Series Field-Programmable Gate Arrays
Outline Diagrams (continued)
68-Pin PLCC
Dimensions are in millimeters.
25.27 MAX
24.33 MAX
PIN #1 IDENTIFIER ZONE
9
1
61
10
60
24.33
MAX
25.27
MAX
26
44
27
43
5.08
MAX
SEATING PLANE
0.10
1.27 TYP
Lucent Technologies Inc.
0.53 MAX
0.51 MIN,
TYP
5-2139r13(C)
69
Data Sheet
February 1997
ATT3000 Series Field-Programmable Gate Arrays
Outline Diagrams (continued)
84-Pin PLCC
Dimensions are in millimeters.
30.35 MAX
29.16 MAX
PIN #1 IDENTIFIER ZONE
11
1
75
12
74
29.16
MAX
30.35
MAX
32
54
33
53
5.08 MAX
1.27 TYP
70
0.53 MAX
0.51 MIN
TYP
SEATING PLANE
0.10
5-2347r13(C)
Lucent Technologies Inc.
Data Sheet
February 1997
ATT3000 Series Field-Programmable Gate Arrays
Outline Diagrams (continued)
100-Pin QFP
Dimensions are in millimeters.
17.20 ± 0.20
14.00 ± 0.20
PIN #1 IDENTIFIER
ZONE
100
1.60 REF
81
1
0.25
80
GAGE PLANE
SEATING PLANE
0.73/1.03
DETAIL A
20.00
± 0.20
23.20
± 0.20
0.13/0.23
0.22/0.38
51
30
31
0.12
DETAIL B
50
DETAIL A
DETAIL B
M
2.80 ± 0.25
3.30
MAX
SEATING PLANE
0.10
0.65 TYP
Lucent Technologies Inc.
0.25 MAX
5-2131r9(C)
71
Data Sheet
February 1997
ATT3000 Series Field-Programmable Gate Arrays
Outline Diagrams (continued)
100-Pin TQFP
Dimensions are in millimeters.
16.00 ± 0.20
14.00 ± 0.20
PIN #1 IDENTIFIER ZONE
100
76
1.00 REF
1
75
0.25
GAGE PLANE
SEATING PLANE
0.45/0.75
14.00
± 0.20
DETAIL A
16.00
± 0.20
0.106/0.200
25
51
0.19/0.27
0.08
26
M
50
DETAIL B
DETAIL A
DETAIL B
1.40 ± 0.05
1.60 MAX
SEATING PLANE
0.08
0.50 TYP
0.05/0.15
5-2146r14(C)
72
Lucent Technologies Inc.
Data Sheet
February 1997
ATT3000 Series Field-Programmable Gate Arrays
Outline Diagrams (continued)
132-Pin PPGA
Dimensions are in millimeters.
37.08 ± 0.38
TYPICAL THERMAL VIA
PACKAGE ID
37.08
± 0.38
PIN A1 INDEX MARK
2.16 ± 0.23
1.19 ± 0.20
1.78 ± 0.20
TYP 4 PLACES
5.21 ± 0.20
0.46 ± 0.05
13 SPACES @ 2.54 = 33.02
PIN A1 CORNER
1
2
3
4
5
6
13 SPACES @
2.54 = 33.02
7
8
9
10
11
12
13
14
A
B
C
D
E
F
G
H
J
K
L
M
N
P
5-2115(C)
Lucent Technologies Inc.
73
Data Sheet
February 1997
ATT3000 Series Field-Programmable Gate Arrays
Outline Diagrams (continued)
144-Pin TQFP
Dimensions are in millimeters.
22.00 ± 0.20
20.00 ± 0.20
PIN #1 IDENTIFIER ZONE
144
109
1.00 REF
1
108
0.25
GAGE PLANE
SEATING PLANE
0.45/0.75
DETAIL A
20.00
± 0.20
22.00
± 0.20
0.106/0.200
36
0.19/0.27
73
0.08
37
DETAIL A
M
DETAIL B
72
DETAIL B
1.40 ± 0.05
1.60 MAX
SEATING PLANE
0.08
0.50 TYP
0.05/0.15
5-3815r5(C)
74
Lucent Technologies Inc.
Data Sheet
February 1997
ATT3000 Series Field-Programmable Gate Arrays
Outline Diagrams (continued)
160-Pin QFP
Dimensions are in millimeters.
31.20 ± 0.20
28.00 ± 0.20
PIN #1 IDENTIFIER ZONE
121
1.60 REF
120
1
0.25
GAGE PLANE
SEATING PLANE
0.73/1.03
28.00
± 0.20
DETAIL A
31.20
± 0.20
0.13/0.23
81
40
0.22/0.38
0.12
41
M
80
DETAIL B
DETAIL A
DETAIL B
3.42 ± 0.25
4.07
MAX
0.65 TYP
SEATING PLANE
0.10
0.25 MIN
5-2132r12(C)
Lucent Technologies Inc.
75
Data Sheet
February 1997
ATT3000 Series Field-Programmable Gate Arrays
Outline Diagrams (continued)
175-Pin PPGA
Dimensions are in inches.
42.16 ± 0.40
TYPICAL THERMAL VIA
PACKAGE ID
42.16
± 0.40
PIN A1 INDICATOR INDEX MARK
2.16 ± 0.23
1.78 ± 0.20 TYP
4 PLACES
5.21 ± 0.20
0.46 ± 0.05
PIN A1 CORNER
1.19 ± 0.20
15 SPACES @ 2.54 = 38.10
1
2
3
4
5
6
7
8
15 SPACES @
2.54 = 38.10
9
10
11
12
13
14
15
16
A
B
C D E
F G H
J
K L
M N
P
R S
5-2116(C)
76
Lucent Technologies Inc.
Data Sheet
February 1997
ATT3000 Series Field-Programmable Gate Arrays
Outline Diagrams (continued)
208-Pin SQFP
Dimensions are in millimeters.
30.60 ± 0.20
28.00 ± 0.20
PIN #1 IDENTIFIER ZONE
208
157
1.30 REF
1
156
0.25
GAGE PLANE
SEATING PLANE
28.00
± 0.20
0.50/0.75
30.60
± 0.20
DETAIL A
0.090/0.200
105
52
53
0.17/0.27
104
0.10
DETAIL A
M
DETAIL B
3.40 ± 0.20
DETAIL B
4.10 MAX
SEATING PLANE
0.10
0.50 TYP
0.25 MIN
5-2196(C)R12
Lucent Technologies Inc.
77
Data Sheet
February 1997
ATT3000 Series Field-Programmable Gate Arrays
Ordering Information
The ATT3000 Series includes standard and highperformance FPGAs. The part nomenclature uses two
different suffixes for speed designation. The lowerspeed ATT3000 Series devices use a flip-flop toggle
rate (-50, -70, -100, -125), which corresponds to
XC3000 Series nomenclature. The ATT3000 Series
High-Performance FPGAs use a suffix which is an
approximation of the look-up table delay (-5, -4, and
-3), which corresponds to XC3100 nomenclature.
For packaging options, burn-in diagrams, and/or package assembly information, call 1-800-EASY-FPG(A) or
1-800-327-9374.
Example:
ATT3020, 100 MHz, 68-Lead PLCC,
Industrial Temperature
ATT3020-100 M 68 I
DEVICE
TYPE
TOGGLE
RATE
TEMPERATURE
RANGE
NUMBER OF
PINS
PACKAGE
TYPE
Table 31. FPGA Temperature Options
Symbol
Description
Temperature
(Blank)
I
Commercial
Industrial
0 °C to 70 °C
–40 °C to +85 °C
Table 32. FPGA Package Options
Symbol
H
J
M
S
T
78
Description
Plastic Pin Grid Array
Quad Flat Pack
Plastic Leaded Chip Carrier
Shrink Quad Flat Pack
Thin Quad Flat Pack
Lucent Technologies Inc.
Data Sheet
February 1997
ATT3000 Series Field-Programmable Gate Arrays
Ordering Information (continued)
Table 33. ATT3000 Series Package Matrix
Device
ATT3020
ATT3030
ATT3042
ATT3064
ATT3090
Speed
-70
-100
-125
-5
-4
-3
-70
-100
-125
-5
-4
-3
-70
-100
-125
-5
-4
-3
-70
-100
-125
-5
-4
-3
-70
-100
-125
-5
-4
-3
100-Pin
44-Pin
PLCC
68-Pin
PLCC
84-Pin
PLCC
QFP
TQFP
132-Pin
PPGA
144-Pin
TQFP
160-Pin
QFP
175-Pin
PPGA
208-Pin
SQFP
M44
M68
M84
J100
T100
H132
T144
J160
H175
S208
—
—
—
—
—
—
CI
CI
CI
CI
C
C
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
CI
CI
CI
CI
C
C
CI
CI
CI
CI
C
C
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
CI
CI
CI
CI
C
C
CI
CI
CI
CI
C
C
CI
CI
CI
CI
C
C
CI
CI
CI
CI
C
C
CI
CI
CI
CI
C
C
CI
CI
CI
CI
C
C
CI
CI
CI
CI
C
C
CI
CI
CI
CI
C
C
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
CI
CI
CI
CI
C
C
CI
CI
CI
CI
C
C
CI
CI
CI
CI
C
C
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
CI
CI
CI
CI
C
C
CI
CI
CI
CI
C
C
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
CI
CI
CI
CI
C
C
CI
CI
CI
CI
C
C
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
CI
CI
CI
CI
C
C
CI
CI
CI
CI
C
C
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
CI
CI
CI
CI
C
C
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
CI
CI
CI
CI
C
C
Key: C = commercial, I = industrial.
Lucent Technologies Inc.
79
ATT3000 Series Field-Programmable Gate Arrays
Data Sheet
February 1997
For FPGA technical applications support, please call 1-800-327-9374. Outside the U.S.A., please call 1-610-712-4331.
For additional information, contact your Microelectronics Group Account Manager or the following:
INTERNET: http://www.lucent.com/micro/fpga
U.S.A.: Microelectronics Group, Lucent Technologies Inc., 555 Union Boulevard, Room 30L-15P-BA, Allentown, PA 18103
1-800-372-2447, FAX 1-610-712-4106 (In CANADA: 1-800-553-2448, FAX 1-610-712-4106), e-mail [email protected]
ASIA PACIFIC: Microelectronics Group, Lucent Technologies Singapore Pte. Ltd., 77 Science Park Drive, #03-18 Cintech III, Singapore 118256
Tel. (65) 778 8833, FAX (65) 777 7495
JAPAN: Microelectronics Group, Lucent Technologies Semiconductor Marketing Ltd., 2-7-18, Higashi-Gotanda, Shinagawa-ku, Tokyo 141, Japan
Tel. (81) 3 5421 1770, FAX (81) 3 5421 1785
For data requests in Europe:
MICROELECTRONICS GROUP DATALINE: Tel. (44) 1734 324 299, FAX (44) 1734 328 148
For technical inquiries in Europe:
CENTRAL EUROPE: (49) 89 95086 0 (Munich), NORTHERN EUROPE: (44) 1344 865 900 (Bracknell UK),
FRANCE: (33) 1 41 45 77 00 (Paris), SOUTHERN EUROPE: (39) 2 6601 1800 (Milan) or (34) 1 807 1700 (Madrid)
Lucent Technologies Inc. reserves the right to make changes to the product(s) or information contained herein without notice. No liability is assumed as a result of their use or application. No
rights under any patent accompany the sale of any such product(s) or information. ORCA is a trademark of Lucent Technologies Inc. Foundry is a trademark of Xilinx, Inc.
Copyright © 1997 Lucent Technologies Inc.
All Rights Reserved
Printed in U.S.A.
February 1997
DS97-048FPGA (Replaces DS94-177FPGA)