EM MICROELECTRONIC - MARIN SA EM4006 13.56 MHz 64 Data bit Read Only Contactless Identification Device Description Features The EM4006 (previously named H4006) is a CMOS integrated circuit intended for use in electronic Read Only transponders. The exited coil connected to the device generates the power supply via a rectifier and an integrated decoupling capacitor. The clock used for the logic is also extracted from the coil. The logic is mainly composed by a miller code generator and the LROM control. The memory is factory programmed so that each IC is unique. Operating frequency range 10 MHz to 15 MHz RF interface optimized for 13.56 MHz operation Laser programmed memory array (64 data bit + 16 CRC bit) Modulator switch designed to preserve supply voltage Miller coding Default data rate is 26484 Baud Other data rates possible (mask programmable) On chip rectifier On chip resonant capacitor On chip supply buffer capacitor Applications VDD TOUT TESTn Pad Assignment VSS Typical Operating Configuration Logistics automation Anticounterfeiting Access control Industrial transponder Coil1 EM4006 EM4006 Coil2 L: typical 1.4µH for fo = 13.56MHz C1 Fig. 2 Fig. 1 Copyright 2001, EM Microelectronic-Marin SA C2 1 www.emmicroelectronic.com EM4006 Absolute Maximum Ratings Parameter Maximum DC Current forced on COIL1 and COIL2 Power Supply Storage Temp. Die form Storage Temp. PCB form Electrostatic discharge maximum to MIL-STD-883C method 3015 Handling Procedures Symbol Conditions ICMAX ±30mA VDD Tst Tst -0.3V to 7.5V -55 to +200°C -55 to +125°C VESD 2000V This device has built-in protection against high static voltages or electric fields; however, anti-static precautions must be taken as for any other CMOS component. Unless otherwise specified, proper operation can only occur when all terminal voltages are kept within the voltage range. Unused inputs must always be tied to a defined logic voltage level. Operating Conditions Parameter Operating Temp. Stresses above these listed maximum ratings may cause permanent damages to the device. Exposure beyond specified operating conditions may affect device reliability or cause malfunction. Symb Top Min -40 Typ Maximum Coil Current Icoil -10 AC Voltage on Coil Vcoil 3 14* Supply Frequency fcoil 10 13.56 Max Units +85 °C 10 mA Vpp 15 MHz *) The AC Voltage on Coil is limited by the on chip voltage limitation circuitry. This is according to the parameter Icoil. System Principle Transponder Tranceiver Coil1 Oscillator Antenna Driver EM4006 Coil2 Filter and Gain Data decoder Demodulator Data received from transponder Signal on coils Transponder coil Transeiver coil RF Carrier Data Fig. 3 Copyright 2001, EM Microelectronic-Marin SA 2 www.emmicroelectronic.com EM4006 Electrical Characteristics VDD = 2V, VSS = 0V, fC1 = 13.56MHz sine wave, VC1 = 1.0Vpp centered at (VDD - VSS)/2, Ta = 25°C unless otherwise specified Parameter Symbol Test Conditions Min. Typ. Max. Supply Voltage VDD Supply current IDD 1.9 60 Rectifier Voltage Drop VREC IC1C2 = 1mA, modulator switch on VREC = (VC1-VC2) - (VDD - VSS) Modulator ON DC voltage drop (note 2) VON1 VON2 IVDD VSS = 1mA IVDD VSS = 10mA Power on reset (note 3) f=10kHz V 150 µA 1.8 V 1.9 2.4 2.3 2.8 2.8 3.3 V V 1.2 0.1 1.4 0.25 1.7 0.5 V V 92.6 94.5 96.4 pF VR VR - VMIN Vcoil=100mVRMS Units (note 1) Coil1 - Coil2 Capacitance CRES Series resistance of CRES RS 3 Ω Power Supply Capacitor Csup 140 pF Note 1: Maximum voltage is defined by forcing 10 mA on C1 - C2 Note 2: Measured between VDD and VSS Note 3: According to Figure 7 Block Diagram Clock extractor C1 CRES C2 AC1 + Sequencer - Miller Code Generator VDD Power on Reset CSUP HF Rectifier AC2 Divider Chain Modulator VSS LASER ROM Power Management Fig. 4 Copyright 2001, EM Microelectronic-Marin SA 3 www.emmicroelectronic.com EM4006 General Description Functional Description The transponder will be activated when illuminated by a RF field of sufficient power and at any frequency that is compatible with its associated antenna and its internal power supply circuit input characteristics. The chip will Power-on-Reset itself when powered by this incoming energy that exceeds its reset threshold. After resetting itself the chip will start to transmit its memory contents as a stream of Miller code. The memory contents is transmitted by modifying the antenna matching impedance at its internal clock rate, thereby causing varying amounts of RF energy to be reflected from the antenna. This impedance variation will be achieved by connecting a modulating device across the antenna terminals. When switched on the modulating device will present a low impedance to the antenna. This will cause a change in the matching of the antenna and therefore in the amount of RF energy reflected by the transponder to the reader. This reflected signal combines with the transmitted signal in the receiver to yield an amplitude modulated signal representative of the IC memory contents. The “ON” impedance of the modulating device needs to be comparable to about 100 Ohms to affect the matching of the antenna and therefore its reflectivity. The RF signal received from the transponder antenna will serve several purposes : • power the chip • provide a global reset to the chip through its POR (Power-On-Reset) function • provide a carrier for the data transmission • provide the input of the internal clock generation circuit (frequency division) Output Sequence Transmission from the transponder will be accomplished through variation of the antenna load impedance by switching the modulating device ON and OFF. Output sequence is composed of cycles which are repeated. Each cycle is composed of 82 bits Standard Message Structure (STDMS) which is Miller coded and a pause (LW) during which the modulating device is OFF (see figure 6 for details of Miller code). The pause (LW) is 9bits length. The 82 bit STDMS consists of 1 start bit, 64 data bits, 16 CRC bits and 1 stop bit. Start bit (1) Data(64) CRC (16) Stop bit (1) LW(9) Memory organisation As already mentioned above the 82 bits are stored in laser programmed ROM (LROM). The 82 bits of this LROM is partioned as followed (see Memory Map): Factory reserved IC name Customer ID ID code CRC-CCITT Start and stop bits 9 bits 10 bits 13 bits 32 bits 16 bits 2 bits Memory Map (First out) 0 1 Start 2 17 18 33 34 MSB 3 4 5 6 Factory reserved 19 20 21 LSB MSB 7 8 9 10 11 MSB 12 13 14 IC Name 15 16 22 23 24 25 26 27 Customer ID 28 29 30 31 32 LSB 40 43 44 45 46 47 48 35 36 37 38 39 41 42 ID code 49 50 51 52 53 54 55 56 57 ID code 58 59 60 61 62 63 64 LSB 65 LSB 66 67 68 69 70 71 72 73 74 CRC - CCITT 75 76 77 78 79 80 81 MSB Stop Copyright 2001, EM Microelectronic-Marin SA 4 www.emmicroelectronic.com EM4006 Factory reserved bits These 9 bits are reserved. Default value is 00Bhex. ID code bits This field is programmed from a counter in that way that each device is unique. IC name bits They contains the 3 last characters device name. For this device, the value is 006hex. Cyclic redundancy check The shift register is reset to all zero with each Stop Bit. CRC code is calculated on 64 data bits. The CRC code is calculated according to CCITT / ISO 3309 - 1984 standards. See figure 5 for principle block schematic and generating polynomial of the CRC code. Customer ID bits This field contains a code which is defined by EM Microelectronic-Marin S.A. For standard version, the code is 0001hex. Start and stop bits Start bit is set to logic 1 and stop bit is set to logic 0. CRC Block Diagram SERIAL QUOTIENT X5 X12 X16 FEEDBACK BEFORE SHIFT 15 14 13 12 11 10 9 8 7 6 5 4 MSB 3 2 1 0 LSB BCC REGISTER x = BCC(Block Check Characters) REGISTER STAGE data input = EXCLUSIVE - OR CRC-CCITT GENERATING POLYNOMIAL = X16 + X12 + X5 + X0 Fig. 5 RF Interface Resonant capacitor, Rectifier, Limiter and Modulator Switch form the unit which is interfacing to the incoming RF signal. These blocks are interdependent so they are developed as unit. They interface to the antenna which typical characteristics are: LS ≈ 1400 nH RS ≈ 3 Ohms 30 < Q < 40 at 13.56 MHz. Resonant Capacitor The capacitor value is adjusted by laser fusing. It can be trimmed by 1pF steps to achieve the absolute value of 94.5pF typically. This option, which is available on request, allows a smaller capacitor tolerance over the whole production. Copyright 2001, EM Microelectronic-Marin SA 5 Rectifier and Limiter A full wave rectifier (Graetz Bridge) is used to provide supply voltage to the IC. The reverse breakdown of the diodes is also used to protect the IC from overvoltages. www.emmicroelectronic.com EM4006 Modulator Switch Due to the low impedance of the antenna and resonant capacitor the Modulator Switch has to present low RF impedance when switched ON (about 100 ohms). The minimum time period with the Modulator Switch ON is 38 µs. At lower data rates this time is even much longer. The current consumption of divider chain running at 13 MHz is near 60 µA. Putting together this two figures it is clear that it is not possible to supply the IC during the time the Modulator Switch is ON from the integrated Supply Buffer Capacitor which value is approximately 140 pF. The IC has to get power from the RF field also during the time the Modulator Switch is ON. 1 0 1 1 This problem is solved by putting the Modulator Switch on the output of the Rectifier (between VDD and VSS) and regulating its ON resistance in function of supply voltage. When the supply voltage is high the ON impedance is low. When the supply voltage drops near the region where the operation of the IC at 13.56 MHz is not guaranteed the ON impedance is increased in order to prevent further drop. 0 0 0 1 1 0 1 NRZ-L STREAM DM-M CODED Bit i-1 x 0 1 Bit i 1 0 0 no transition at the beginning of Bit i, transition at the beginning of Bit i, no transition at the beginning of Bit i, transition in the middle of Bit i no transition in the middle of Bit i no transition in the middle of Bit i Fig. 6 Power Supply Management For a correct operation, the device must be initialised. When the transponder is put in the RF field, the supply voltage increases until it achieves Vr limit (see Figure 7). During this time and for an additionnal 64 bit period, the modulator switch is on and the device initialises its internal logic. Copyright 2001, EM Microelectronic-Marin SA At this point, the data transmission starts and runs while the supply voltage is higher than Vmin. If the supply voltage decreases under this limit, the device is again in an initialising state and the modulator is on. 6 www.emmicroelectronic.com EM4006 supply voltage VDD chip operating voltage range: from Vmin to Vmax Vmax (voltage clipping) chip supply voltage Vr (Read wake up) Vmin time modulator ON/OFF ON READ 64 bits period OFF time Fig. 7 Miller Encoder The input to Miller encoder is NRZ data coming from LROM. The output is coded according to Miller format and is driving the modulator Switch. See figure 6 for example of Miller code. Clock Generation The clock of the logic is extracted from the RF signal. The clock extracted from RF signal is driving the divider chain consisting of toggle flip-flops. The output of this divider chain is data clock with which the data from Laser ROM (LROM) is addressed, encoded and sent to Modulator Switch. The layout of divider chain is designed in a way that different data rates can be chosen with metal mask (options). The following division factors are possible on request: 128, 256, 1024, 2048, 4094 and 8192. The standard is 512. Copyright 2001, EM Microelectronic-Marin SA Others As mentioned in Output Sequence, during the pause (LW) the Modulator Switch is OFF. When observing the pause duration one has to remember that the time with Modulator Switch OFF effectively observed can vary due to different terminations of STDMS. The stop bit at 0 can be represented either by Modulator Switch ON or OFF depending on the data. The start bit at 1 adds 1/2 of data period OFF (transition in the middle of bit period). Figure below show the four possible terminations of STDMS and its influence on entire period passed by Modulator Switch OFF. Level LOW represents Modulator Switch OFF. LDB stands for last data bit. 7 www.emmicroelectronic.com EM4006 LDB 1 1 0 0 Last data bit Stop bit at 0 Pause 8 +1 bit periods Start bit at 1 This transition is not due to Miller encoding. Fig. 8 Copyright 2001, EM Microelectronic-Marin SA 8 www.emmicroelectronic.com EM4006 Pad Description Name Description C2 connection to antenna C1 connection to antenna VDD positive supply Tout test output TESTn test input with pull up VSS negative supply Package Information CID Package PCB Package FRONT VIEW Y SYMBOL A B D e F g J K R TOP VIEW B D Z K J MARKING AREA A MIN 8.2 3.8 5.8 0.38 1.25 0.3 0.42 0.115 0.4 TYP 8.5 4.0 6.0 0.5 1.3 0.4 0.44 0.127 0.5 MAX 8.8 4.2 6.2 0.62 1.35 0.5 0.46 0.139 0.6 X C2 Dimensions are in mm R SYMBOL MIN TYP X 8.0 Y 4.0 Z Dimensions are in mm e C2 C1 F F C1 MAX 1.0 g Fig. 9 Fig. 10 Pad position 14 325 513 772 1144 1124 1600 EM4006 316 152 740 Y 1041 X C1, C2 pad size : 95 X 95 Other pads size : 76 X 76 All dimensions in µm Fig. 11 Copyright 2001, EM Microelectronic-Marin SA 9 www.emmicroelectronic.com EM4006 Ordering Information Die Form This chart shows general offering; for detailed Part Number to order, please see the table “Standard Versions” below. EM4006 F9 WS 11 - %%% Version: Customer Version: F9 = Miller, 512 clocks per bit %%% = only for custom specific version Die form: WW = Wafer WS = Sawn Wafer/Frame WT = Sticky Tape WP = Waffle Pack (note 1) Bumping: " " (blank) = no bumps E = with Gold Bumps Thickness: 7 = 7 mils (178um) 11 = 11 mils (280um) 21 = 21 mils (533um) Packaged Devices This chart shows general offering; for detailed Part Number to order, please see the table “Standard Versions” below. EM4006 F9 CI2L C - %%% Version: F9 = Miller, 512 clocks per bit Customer Version: %%% = only for custom specific version Package: CI2L = CID Pack, 2 pins (length 2.5mm) CB2R = PCB Package, 2 pins Delivery Form: B = Tape C = Bulk Remarks: • For ordering please use table of “Standard Version” table below. • For specifications of Delivery Form, including gold bumps, tape and bulk, as well as possible other delivery form or packages, please contact EM Microelectronic-Marin S.A. • Note 1: This is a non-standard package. Please contact EM Microelectronic-Marin S.A for availability. Standard Versions: The versions below are considered standards and should be readily available. For other versions or other delivery form, please contact EM Microelectronic-Marin S.A. Please make sure to give complete part number when ordering (without space between letters). Part Number Bit Cycle/ coding bit Package/Die Form Delivery Form / Bumping For EM internal use only old version OPS# EM4006 F9 CB2RC Miller 512 PCB Package, 2 pins bulk 501 2878 EM4006 F9 CI2LC Miller 512 CID package, 2 pins (length 2.5mm) bulk 501 2930 EM4006 F9 WP7 EM4006 F9 YYY-%%% Miller Miller 512 512 Die in waffle pack, 7 mils custom no bumps custom 501 %%% 3669 Product Support Check our Web Site under Products/RF Identification section. Questions can be sent to [email protected] EM Microelectronic-Marin SA cannot assume responsibility for use of any circuitry described other than circuitry entirely embodied in an EM Microelectronic-Marin SA product. EM Microelectronic-Marin SA reserves the right to change the circuitry and specifications without notice at any time. You are strongly urged to ensure that the information given has not been superseded by a more up-to-date version. © EM Microelectronic-Marin SA, 01/02, Rev. C/404 Copyright 2001, EM Microelectronic-Marin SA 10 www.emmicroelectronic.com