BCP030C HIGH EFFICIENCY HETEROJUNCTION POWER FET CHIP (.25µm x 300µm) The BeRex BCP030C is a GaAs Power pHEMT with a nominal 0.25-micron by 300-micron gate making this product ideally suited for applications where high-gain and medium power in the DC to 26.5 GHz frequency range are required. The product may be used in either wideband (6-18 GHz) or narrow-band applications. The BCP030C is produced using state of the art metallization with SI 3 N 4 passivation and is screened to assure reliability. PRODUCT FEATURES • • • 24.5 dBm Typical Output Power 13.5 dB Typical Gain @ 12 GHz 0.25 X 300 Micron Recessed Gate APPLICATIONS • • • Commercial Military / Hi-Rel. Test & Measurement ELECTRICAL CHARACTERISTIC (TUNED FOR POWER) T a = 25° C PARAMETER/TEST CONDITIONS P 1dB Output Power @ P 1dB (V ds = 8V, I d = 45mA) G 1dB Gain @ P 1dB (V ds = 8V, I d = 45mA) PAE PAE @ P 1dB (V ds = 8V, I d = 45mA) NF Noise figure (Vds = 2V, I d = 15 mA) I dss Saturated Drain Current (V gs = 0V, V ds = 2.0V) Gm Transconductance (V ds = 2V, I d = 45mA) Vp Pinch-off Voltage (I ds = 0.3mA, V ds = 2V) TEST FREQ. 12 GHZ 18 GHz 12 GHZ 18 GHz 12 GHZ 18 GHz MIN. TYPICAL 23.0 23.0 12.0 9.0 24.5 24.5 13.5 10.5 60 55 12 GHz MAX. dBm dB % 1.1 60 -2.5 90 UNIT dB 120 mA 115 mS -1.2 V BV gd Drain Breakdown Voltage (I g = -0.3mA, source open) -15 BV gs Source Breakdown Voltage (I g = -0.3mA, drain open) -13 V R th Thermal Resistance (Au-Sn Eutectic Attach) 115 °C/W www.berex.com BeRex, Inc. 3350 Scott Blvd. #6101 Santa Clara 95054 tel. (408) 452-5595 Specifications are subject to change without notice. ©BeRex 2017 Rev. 1.1 -12 V February 2017 BCP030C MAXIMUM RATING (T a = 25° C) V ds V gs Id I gsf P in T ch T stg Pt PARAMETERS Drain-Source Voltage Gate-Source Voltage Drain Current Forward Gate Current Input Power Channel Temperature Storage Temperature Total Power Dissipation ABSOLUTE 12 V -6 V I dss 18 mA 22 dBm 175°C -60°C – 150°C 1.3 W CONTINUOUS 8V -3 V I dss 3 mA @ 3 dB compression 150°C -60°C – 150°C 1.1 W Exceeding any of the above Maximum Ratings will result in reduced MTTF and may cause permanent damage to the device. P IN _P OUT /Gain, PAE (12 GHz) Frequency = 12 GHz V ds = 8 V, I ds = 45mA (Tuned for Power) www.berex.com P IN _P OUT /Gain, PAE (18 GHz) Frequency = 18 GHz V ds = 8 V, I ds = 45mA (Tuned for Power) BeRex, Inc. 3350 Scott Blvd. #6101 Santa Clara 95054 tel. (408) 452-5595 Specifications are subject to change without notice. ©BeRex 2017 Rev. 1.1 February 2017 BCP030C S-PARAMETERS (V ds = 8V, I ds = 45mA) FREQ. [GHZ] S11 [MAG] S11 [ANG.] S21 [MAG] S21 [ANG.] S12 [MAG] S12 [ANG.] S22 [MAG] S22 [ANG.] 1.0 2.0 3.0 4.0 5.0 6.0 7.0 8.0 9.0 10.0 11.0 12.0 13.0 14.0 15.0 16.0 17.0 18.0 19.0 20.0 21.0 22.0 23.0 24.0 25.0 26.0 0.98 0.94 0.89 0.84 0.79 0.76 0.75 0.74 0.75 0.76 0.77 0.79 0.81 0.83 0.85 0.86 0.88 0.89 0.90 0.91 0.90 0.90 0.89 0.90 0.90 0.92 -23.86 -46.46 -69.03 -91.85 -113.68 -134.40 -153.92 -170.69 174.28 161.67 150.68 140.76 131.79 124.13 116.58 110.76 106.16 100.57 96.91 93.43 91.80 90.93 90.40 90.80 91.15 90.01 7.38 7.02 6.57 6.05 5.52 4.98 4.49 4.01 3.58 3.21 2.88 2.61 2.38 2.16 1.97 1.79 1.66 1.52 1.39 1.26 1.15 1.05 0.95 0.87 0.80 0.72 162.50 146.70 131.52 117.38 103.92 91.19 79.98 69.58 59.64 50.90 42.68 34.50 27.20 20.07 12.99 6.68 0.71 -6.23 -12.56 -18.91 -24.47 -29.70 -35.59 -39.96 -44.03 -48.59 0.014 0.030 0.038 0.046 0.054 0.056 0.057 0.056 0.056 0.051 0.050 0.049 0.049 0.049 0.046 0.047 0.049 0.051 0.051 0.051 0.054 0.054 0.058 0.056 0.052 0.059 74.60 66.16 55.17 47.41 38.46 30.31 24.78 19.61 14.51 10.25 9.53 8.41 6.81 3.22 4.27 5.07 3.61 1.39 2.67 -1.59 -0.89 -1.15 -2.37 0.12 -1.19 1.93 0.81 0.79 0.75 0.71 0.67 0.63 0.60 0.57 0.55 0.53 0.52 0.51 0.49 0.47 0.46 0.44 0.43 0.42 0.42 0.41 0.42 0.44 0.46 0.48 0.51 0.55 -6.76 -13.54 -19.74 -23.65 -27.78 -31.80 -34.64 -37.56 -41.45 -44.56 -48.73 -53.13 -57.19 -61.62 -66.25 -71.83 -79.17 -86.51 -95.77 -107.58 -118.49 -129.50 -140.82 -151.10 -159.63 -168.32 Note: S-parameters include bond wires. Reference planes are at edge of substrates shown on “Wire Bonding Information” figure below. www.berex.com BeRex, Inc. 3350 Scott Blvd. #6101 Santa Clara 95054 tel. (408) 452-5595 Specifications are subject to change without notice. ©BeRex 2017 Rev. 1.1 February 2017 BCP030C WIRE BONDING INFORMATION Using 1 mil. diameter, Au bonding wires. 1. Gate to input transmission line - Length and Height : 600 µm x 250 µm - Number of wire(s): 1 2. Drain to output transmission line - Length and Height : 400 µm x 250 µm - Number of wire(s) : 1 3. Source to ground plate - Length and Height : 250 µm x 300 µm - Number of wire(s) : 4 DISCLAIMER BEREX RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. BEREX DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN. LIFE SUPPORT POLICY BEREX PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES WITHOUT THE EXPRESS WRITTEN APPROVAL OF BEREX. 1. Life support devices or systems are devices or systems which (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in labeling, can be reasonably expected to result in significant injury to the user. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. www.berex.com BeRex, Inc. 3350 Scott Blvd. #6101 Santa Clara 95054 tel. (408) 452-5595 Specifications are subject to change without notice. ©BeRex 2017 Rev. 1.1 February 2017