DAC DAC7616 761 6 DAC ® 761 6 www.ti.com Quad, Serial Input, 12-Bit, Voltage Output DIGITAL-TO-ANALOG CONVERTER FEATURES APPLICATIONS ● LOW POWER: 3mW ● SETTLING TIME: 10µs to 0.012% ● ● ● ● ● ● ● 12-BIT LINEARITY AND MONOTONICITY: –40°C to +85°C ● USER SELECTABLE RESET TO MIDSCALE OR ZERO-SCALE ATE PIN ELECTRONICS PROCESS CONTROL CLOSED-LOOP SERVO-CONTROL MOTOR CONTROL DATA ACQUISITION SYSTEMS DAC-PER-PIN PROGRAMMERS ● SECOND-SOURCE for DAC8420 ● SO-16 or SSOP-20 PACKAGES ● SINGLE SUPPLY +3V OPERATION DESCRIPTION The DAC7616 is a quad, serial input, 12-bit, voltage output Digital-to-Analog Converter (DAC) with guaranteed 12-bit monotonic performance over the –40°C to +85°C temperature range. An asynchronous reset clears all registers to either mid-scale (800H) or zeroscale (000H), selectable via the RESETSEL pin. The device is powered from a single +3V supply. for process control, data acquisition systems, and closed-loop servo-control. The device is available in SO-16 or SSOP-20 packages, and is guaranteed over the –40°C to +85°C temperature range. Low power and small size makes the DAC7616 ideal VDD GND VREFH DAC Register A DAC A DAC Register B DAC B DAC Register C DAC C DAC Register D DAC D VOUTA SDI Serial-toParallel Shift Register CLK CS DAC Select LDAC Copyright © 2001, Texas Instruments Incorporated VOUTB 12 RESET RESETSEL SBAS186 VOUTC VOUTD VREFL AGND Printed in U.S.A. February, 2001 SPECIFICATIONS At TA = –40°C to +85°C, VDD = +3V, VREFH = +1.25V, and VREFL = 0V, unless otherwise noted. DAC7616E, U PARAMETER ACCURACY Linearity Error(1) Linearity Matching(3) Differential Linearity Error Monotonicity Zero-Scale Error Zero-Scale Drift Zero-Scale Matching(3) Full-Scale Error Full-Scale Matching(3) Power Supply Rejection ANALOG OUTPUT Voltage Output(4) Output Current Load Capacitance Short-Circuit Current Short-Circuit Duration CONDITIONS Output Noise Voltage DIGITAL INPUT/OUTPUT Logic Family Logic Levels VIH VIL Data Format POWER SUPPLY REQUIREMENTS VDD IDD Power Dissipation TEMPERATURE RANGE Specified Performance TYP DAC7616EB, UB MAX MIN TYP ±2 ±2 ±1 5 ±1 Code = FFFH ±1 30 VREFL –625 No Oscillation VREFH +625 0 0 | IIH | ≤ 10µA | IIL | ≤ 10µA ±2.4 10 ±2 ±2.4 ±2 ✻ ✻ ✻ ✻ ✻ ✻ +1.25 5 0.1 –40 ✻ ✻ ✻ ✻ 10 65 ✻ CMOS ✻ VDD • 0.7 VDD –0.3 VDD • 0.3 Straight Binary 3.0 UNITS ±1 ±1 ±1 LSB(2) LSB LSB Bits mV ppm/°C mV mV mV ppm/V 3.3 0.8 2.4 ✻ ✻ ±1.2 ✻ ±1.2 ✻ ✻ V µA pF mA ✻ V V ✻ µs LSB ✻ ✻ ✻ 100 +8, –2 Indefinite To ±0.012% Full-Scale Step On Any Other DAC Bandwidth: 0Hz to 1MHz MAX ✻ 12 Code = 00AH REFERENCE INPUT VREFH Input Range VREFL Input Range DYNAMIC PERFORMANCE Settling Time Channel-to-Channel Crosstalk MIN ✻ ✻ nV/√Hz ✻ ✻ V V ✻ ✻ ✻ V mA mW ✻ °C ✻ 3.6 1 3 ✻ +85 ✻ ✻ ✻ ✻ ✻ Specification same as DAC7616E, U. NOTES: (1) Specification applies at code 00AH and above. (2) LSB means Least Significant Bit, with VREFH equal to +1.25V and VREFL equal to 0V, one LSB is 0.305mV. (3) All DAC outputs will match within the specified error band. (4) Ideal output voltage does not take into account zero or full-scale error. 2 DAC7616 SBAS186 ELECTROSTATIC DISCHARGE SENSITIVITY ABSOLUTE MAXIMUM RATINGS(1) VDD to GND ........................................................................ –0.3V to +5.5V VREFL to GND ........................................................... –0.3V to (VDD + 0.3V) VDD to VREFH .......................................................................... –0.3V to VDD VREFH to VREFL ........................................................................ –0.3V to VDD Digital Input Voltage to GND ...................................... –0.3V to VDD + 0.3V Maximum Junction Temperature ................................................... +150°C Operating Temperature Range ......................................... –40°C to +85°C Storage Temperature Range .......................................... –65°C to +150°C Lead Temperature (soldering, 10s) ............................................... +300°C NOTE: (1) Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. Exposure to absolute maximum conditions for extended periods may affect device reliability. This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. PACKAGE/ORDERING INFORMATION PRODUCT MAXIMUM LINEARITY ERROR (LSB) MAXIMUM DIFFERENTIAL LINEARITY (LSB) DAC7616U PACKAGE PACKAGE DRAWING NUMBER SPECIFICATION TEMPERATURE RANGE ±2 ±1 SO-16 211 –40°C to +85°C " " " " " " DAC7616UB ±1 ±1 SO-16 211 –40°C to +85°C " " " " " " ±2 ±1 SSOP-20 334 –40°C to +85°C " " " " " " DAC7616EB ±1 ±1 SSOP-20 334 –40°C to +85°C " " " " " " DAC7616E ORDERING NUMBER(1) TRANSPORT MEDIA DAC7616U DAC7616U/1K DAC7616UB DAC7616UB/1K Rails Tape and Reel Rails Tape and Reel DAC7616E DAC7616E/1K DAC7616EB DAC7616EB/1K Rails Tape and Reel Rails Tape and Reel NOTES: (1) Models with a slash (/) are available only in Tape and Reel in the quantities indicated (e.g., /1K indicates 1000 devices per reel). Ordering 1000 pieces of “DAC7616EB/1K” will get a single 1000-piece Tape and Reel. DAC7616 SBAS186 3 PIN CONFIGURATION—U Package PIN CONFIGURATION—E Package Top View SO VDD 1 16 RESETSEL VOUTD 2 15 VOUTC 3 VREFL 4 DAC7616U 1 20 RESETSEL RESET VOUTD 2 19 RESET 14 LDAC VOUTC 3 18 LDAC 13 NIC VREFL 4 17 NIC 12 CS NIC 5 16 NIC VREFH 5 VOUTB 6 11 CLK NIC 6 15 NIC VOUTA 7 10 SDI VREFH 7 14 CS AGND 8 9 GND VOUTB 8 13 CLK VOUTA 9 12 SDI AGND 10 11 GND DAC7616E LABEL PIN DESCRIPTIONS—E Package DESCRIPTION PIN LABEL DESCRIPTION 1 VDD Positive Analog Supply Voltage, +3V nominal. 1 VDD 2 VOUTD DAC D Voltage Output 2 VOUTD DAC D Voltage Output 3 VOUTC DAC C Voltage Output 3 VOUTC DAC C Voltage Output 4 VREFL Reference Input Voltage Low. Sets minimum output voltage for all DACs. 4 VREFL Reference Input Voltage Low. Sets minimum output voltage for all DACs. 5 VREFH Reference Input Voltage High. Sets maximum output voltage for all DACs. 5 NIC Not Internally Connected. 6 NIC Not Internally Connected. 7 VREFH Reference Input Voltage High. Sets maximum output voltage for all DACs. Positive Analog Supply Voltage, +3V nominal. 6 VOUTB DAC B Voltage Output 7 VOUTA DAC A Voltage Output 8 AGND Analog Ground 8 VOUTB DAC B Voltage Output. 9 GND Ground 9 VOUTA DAC A Voltage Output. 10 SDI Serial Data Input 10 AGND 11 CLK Serial Data Clock 11 GND Ground Analog Ground 12 CS Chip Select Input 12 SDI Serial Data Input 13 NIC Not Internally Connected. 13 CLK Serial Data Clock 14 LDAC The selected DAC register becomes transparent when LDAC is LOW. It is in the latched state when LDAC is HIGH. 14 CS Chip Select Input 15 NIC Not Internally Connected. 16 NIC Not Internally Connected. 17 NIC Not Internally Connected. 18 LDAC The selected DAC register becomes transparent when LDAC is LOW. It is in the latched state when LDAC is HIGH. 19 RESET Asynchronous Reset Input. Sets all DAC registers to either zero-scale (000H) or midscale (800H) when LOW. RESETSEL determines which code is active. 20 RESETSEL When LOW, a LOW on RESET will cause all DAC registers to be set to code 000H. When RESETSEL is HIGH, a LOW on RESET will set the registers to code 800H. 15 16 4 SSOP VDD PIN DESCRIPTIONS—U Package PIN Top View RESET RESETSEL Asynchronous Reset Input. Sets all DAC registers to either zero-scale (000H) or midscale (800H) when LOW. RESETSEL determines which code is active. When LOW, a LOW on RESET will cause all DAC registers to be set to code 000H. When RESETSEL is HIGH, a LOW on RESET will set the registers to code 800H. DAC7616 SBAS186 TYPICAL PERFORMANCE CURVES At TA = +25°C, VDD = +3V, VREFH = +1.25V, and VREFL = 0V, representative unit, unless otherwise specified. 0.50 0.25 0.25 0 –0.25 0.50 0.25 0.25 DLE (LSB) –0.50 0.50 0 –0.25 200H 400H 600H 800H A00H C00H E00H 0 –0.25 –0.50 000H FFFH 800H A00H C00H E00H LINEARITY ERROR AND DIFFERENTIAL LINEARITY ERROR vs CODE (DAC B, +25°C) 0.25 LE (LSB) 0.50 0 –0.25 0 0.50 0.25 0.25 DLE (LSB) –0.50 0.50 0 –0.25 200H 400H 600H 800H A00H C00H E00H 0 –0.25 –0.50 000H FFFH 200H 400H 600H 800H A00H C00H E00H Digital Input Code Digital Input Code LINEARITY ERROR AND DIFFERENTIAL LINEARITY ERROR vs CODE (DAC B, +85°C) LINEARITY ERROR AND DIFFERENTIAL LINEARITY ERROR vs CODE (DAC B, –40°C) 0.50 0.50 0.25 0.25 0 –0.25 0 –0.50 0.50 0.50 0.25 0.25 –0.25 200H 400H 600H 800H A00H Digital Input Code C00H E00H FFFH FFFH –0.25 –0.50 0 FFFH –0.25 –0.50 SBAS186 600H LINEARITY ERROR AND DIFFERENTIAL LINEARITY ERROR vs CODE (DAC A, –40°C) 0.25 DAC7616 400H Digital Input Code 0.50 –0.50 000H 200H Digital Input Code LE (LSB) LE (LSB) DLE (LSB) 0 –0.25 –0.50 –0.50 000H LE (LSB) LE (LSB) 0.50 –0.50 000H DLE (LSB) LINEARITY ERROR AND DIFFERENTIAL LINEARITY ERROR vs CODE (DAC A, +85°C) DLE (LSB) DLE (LSB) LE (LSB) LINEARITY ERROR AND DIFFERENTIAL LINEARITY ERROR vs CODE (DAC A, +25°C) 0 –0.25 –0.50 000H 200H 400H 600H 800H A00H C00H E00H FFFH Digital Input Code 5 TYPICAL PERFORMANCE CURVES At TA = +25°C, VDD = +3V, VREFH = +1.25V, and VREFL = 0V, representative unit, unless otherwise specified. 0.50 0.25 0.25 0 –0.25 0.50 0.25 0.25 DLE (LSB) –0.50 0.50 0 –0.25 200H 400H 600H 800H A00H C00H E00H 0 –0.25 –0.50 000H FFFH 400H 600H 800H A00H C00H E00H Digital Input Code LINEARITY ERROR AND DIFFERENTIAL LINEARITY ERROR vs CODE (DAC C, –40°C) LINEARITY ERROR AND DIFFERENTIAL LINEARITY ERROR vs CODE (DAC D, +25°C) 0.50 0.25 0.25 LE (LSB) 0.50 0 –0.25 0 0.50 0.50 0.25 0.25 DLE (LSB) –0.50 0 –0.25 200H 400H 600H 800H A00H C00H E00H 0 –0.25 –0.50 000H FFFH 200H 400H 600H 800H A00H C00H E00H Digital Input Code Digital Input Code LINEARITY ERROR AND DIFFERENTIAL LINEARITY ERROR vs CODE (DAC D, +85°C) LINEARITY ERROR AND DIFFERENTIAL LINEARITY ERROR vs CODE (DAC D, –40°C) 0.50 0.50 0.25 0.25 0 –0.25 –0.50 –0.50 0.50 0.50 0.25 0.25 –0.25 200H 400H 600H 800H A00H Digital Input Code C00H E00H FFFH FFFH 0 –0.25 0 FFFH –0.25 –0.50 –0.50 000H 200H Digital Input Code LE (LSB) LE (LSB) DLE (LSB) LE (LSB) 0 –0.25 –0.50 –0.50 000H DLE (LSB) LE (LSB) 0.50 –0.50 000H 6 LINEARITY ERROR AND DIFFERENTIAL LINEARITY ERROR vs CODE (DAC C, +85°C) DLE (LSB) DLE (LSB) LE (LSB) LINEARITY ERROR AND DIFFERENTIAL LINEARITY ERROR vs CODE (DAC C, +25°C) 0 –0.25 –0.50 000H 200H 400H 600H 800H A00H C00H E00H FFFH Digital Input Code DAC7616 SBAS186 TYPICAL PERFORMANCE CURVES At TA = +25°C, VDD = +3V, VREFH = +1.25V, and VREFL = 0V, representative unit, unless otherwise specified. NEGATIVE FULL-SCALE ERROR vs TEMPERATURE POSITIVE FULL-SCALE ERROR vs TEMPERATURE 2.0 Code Code(0040 (000HH)) 1.5 1.0 DAC D DAC C DAC B 0.5 0 DAC A –0.5 1.5 Positive Full-Scale Error (mV) Negative Full-Scale Error (mV) 2.0 –1.0 –1.5 Code Code (0040 (FFFHH)) 1.0 0 DAC A –0.5 DAC B –1.0 –1.5 –2.0 –2.0 –40 –30 –20 –10 0 10 20 30 40 50 60 70 80 90 –40 –30 –20 –10 0 Temperature (°C) 10 20 30 40 50 60 70 80 90 Temperature (°C) VREFL CURRENT vs CODE VREFH CURRENT vs CODE 0.000 0.200 0.050 0.150 VREF Current (mA) VREF Current (mA) DAC D DAC C 0.5 –0.100 –0.150 0.100 0.050 –0.200 000H 200H 400H 600H 800H A00H C00H E00H FFFH 0.000 000H 200H 400H Digital Input Code 600H 800H A00H C00H E00H FFFH Digital Input Code SUPPLY CURRENT LIMIT vs INPUT CODE SUPPLY CURRENT vs DIGITAL INPUT CODE 0.8 10 No Load 0.7 8 Short to VDD 6 0.5 IOUT (mA) IDD (mA) 0.6 0.4 0.3 4 2 0 0.2 0.1 –2 0.0 000H –4 000H 200H 400H 600H 800H A00H Digital Input Code DAC7616 SBAS186 C00H E00H FFFH Short to Ground 200H 400H 600H 800H A00H C00H E00H FFFH Input Code 7 TYPICAL PERFORMANCE CURVES At TA = +25°C, VDD = +3V, VREFH = +1.25V, and VREFL = 0V, representative unit, unless otherwise specified. POWER SUPPLY CURRENT vs TEMPERATURE OUTPUT VOLTAGE vs RLOAD 1000 3.0 2.5 800 700 2.0 600 VOUT (V) Quiescent Current (uA) 900 500 400 1.5 Source 1.0 300 200 0.5 100 Sink 0 –40 –20 0 20 40 60 80 100 0.0 0.01 0.1 1 10 100 Temperature (°C) RLOAD (kΩ) OUTPUT VOLTAGE vs SETTLING TIME (0V to +1.25V) OUTPUT VOLTAGE vs SETTLING TIME (+1.25V to 0V) Large-Signal Output (0.5V/div) Large-Signal Output (0.5V/div) Small-Signal Error (1mV/div) Small-Signal Error (1mV/div) LDAC (5.0V/div) Time (2µs/div) Time (2µs/div) MID-SCALE GLITCH PERFORMANCE (CODE 7FFH to 800H) MID-SCALE GLITCH PERFORMANCE (CODE 800H to 7FFH) Glitch Waveform (20mV/div) LDAC (5.0V/div) Time (1µs/div) 8 LDAC (5.0V/div) Glitch Waveform (20mV/div) LDAC (5.0V/div) Time (1µs/div) DAC7616 SBAS186 TYPICAL PERFORMANCE CURVES At TA = +25°C, VDD = +3V, VREFH = +1.25V, and VREFL = 0V, representative unit, unless otherwise specified. WIDEBAND NOISE (Bandwidth = 10kHz) OUTPUT NOISE VOLTAGE vs FREQUENCY 120 Code FFFH Noise (nV/√Hz) Noise Voltage (20µV/div) 100 80 60 40 20 0 Time (100µs/div) 100 1k 10k 100k 1M Frequency (Hz) DAC7616 SBAS186 9 THEORY OF OPERATION measuring the zero-scale error. If the output amplifier has a negative offset, the output voltage may not change for the first few digital input codes (000H, 001H, 002H, etc.) since the output voltage cannot swing below ground. The DAC7616 is a quad, serial input, 12-bit, voltage output DAC. The architecture is a classic R-2R ladder configuration followed by an operational amplifier that serves as a buffer. Each DAC has its own R-2R ladder network and output op amp, but all share the reference voltage inputs. The minimum voltage output (“zero-scale”) and maximum voltage output (“full-scale”) are set by external voltage references (VREFL and VREFH, respectively). The digital input is a 16-bit serial word that contains the 12-bit DAC code and a 2-bit address code that selects one of the four DACs (the two remaining bits are unused). The converter can be powered from a single +3V supply. Each device offers a reset function which immediately sets all DAC output voltages and internal registers to either zero-scale (code 000H) or mid-scale (code 800H). The reset code is selected by the state of the RESETSEL pin (LOW = 000H, HIGH = 800H). See Figure 1 for the basic operation of the DAC7616. The behavior of the output amplifier can be critical in some applications. Under short-circuit conditions (DAC output shorted to VDD), the output amplifier can sink more current than it can source. See the Specifications table for more details concerning short-circuit current. REFERENCE INPUTS The minimum output of each DAC is equal to VREFL plus a small offset voltage (essentially, the offset of the output op amp). The maximum output is equal to VREFH – 1LSB plus a similar offset voltage. The current into the reference inputs depends on the DAC output voltages and can vary from a few microamps to approximately 0.4 milliamp. Bypassing the reference voltage or voltages with a 0.1µF capacitor placed as close as possible to the DAC7616 package is strongly recommended. ANALOG OUTPUTS The output of the DAC7616 can swing to ground. Note that the settling time of the output op amp will be longer with voltages very near ground. Also, care must be taken when +3V + DAC7616(1) 1µF to 10µF 0.1µF 0V to +1.25V 0V to +1.25V 1 VDD 2 RESETSEL 16 VOUTD RESET 15 Reset DACs(2) 3 VOUTC LDAC 14 Update Selected Register 4 VREFL NIC 13 5 VREFH CS 12 Chip Select 6 VOUTB CLK 11 Clock 7 VOUTA SDI 10 Serial Data In 8 AGND GND 9 +1.25V 0.1µF 0V to +1.25V 0V to +1.25V NOTES: (1) U package pin configuration shown. (2) As configured, RESET LOW sets all internal registers to code 000H (0V). If RESETSEL is HIGH, RESET LOW sets all internal registers to code 800H (1.25V). FIGURE 1. Basic Single-Supply Operation of the DAC7616. 10 DAC7616 SBAS186 DIGITAL INTERFACE The DAC code and address are provided via a 16-bit serial interface as shown in Figure 2. The first two bits select the DAC register that will be updated when LDAC goes LOW (see Table II). The next two bits are not used. The last 12 bits is the DAC code which is provided, most significant bit first. Figure 2 and Table I provide the basic timing for the DAC7616. The interface consists of a serial clock (CLK), serial data (SDI), and a load DAC signal (LDAC). In addition, a chip select (CS) input is available to enable serial communication when there are multiple serial devices. An asynchronous reset input (RESET) is provided to simplify start-up conditions, periodic resets, or emergency resets to a known state. SYMBOL DESCRIPTION MIN TYP MAX UNITS tDS Data Valid to CLK Rising 25 ns tDH Data Held Valid after CLK Rises 20 ns tCH CLK HIGH 30 ns tCL CLK LOW 50 ns tCSS CS LOW to CLK Rising 55 ns tCSH CLK HIGH to CS Rising 15 ns tLD1 LDAC HIGH to CLK Rising 40 ns tLD2 CLK Rising to LDAC LOW 15 ns tLDDW LDAC LOW Time 45 ns tRSSH RESETSEL Valid to RESET LOW 25 tRSTW RESET LOW Time Settling Time tS Note that CS and CLK are combined with an OR gate, whose output controls the serial-to-parallel shift register internal to the DAC7616 (see the block diagram on the front of this data sheet). These two inputs are completely interchangeable. In addition, care must be taken with the state of CLK when CS rises at the end of a serial transfer. If CLK is LOW when CS rises, the OR gate will provide a rising edge to the shift register, shifting the internal data one additional bit. The result will be incorrect data and possible selection of the wrong DAC. STATE OF SELECTED DAC REGISTER A1 A0 LDAC RESET SELECTED DAC REGISTER L(1) L L H A Transparent L H L H B Transparent ns H L L H C Transparent 70 ns H H L H D Transparent 10 µs X(2) X H H NONE (All Latched) X X X L ALL Reset(3) TABLE I. Timing Specifications (TA = –40°C to +85°C). NOTES: (1) L = Logic LOW. (2) X = Don’t Care. (3) Resets to either 000H or 800H, per the RESETSEL state (LOW = 000H, HIGH = 800H). When RESET rises, all registers that are in their latched state retain the reset value. TABLE II. Control Logic Truth Table. (MSB) SDI A1 A0 X X D11 (LSB) D10 D9 D3 D2 D1 D0 CLK tcss tCSH tLD1 tLD2 CS LDAC tLDDW tDS tDH SDI tCL tCH CLK tLDDW LDAC tS VOUT tS 1 LSB ERROR BAND 1 LSB ERROR BAND tRSTW RESET tRSSH RESETSEL FIGURE 2. DAC7616 Timing. DAC7616 SBAS186 11 LAYOUT If both CS and CLK are used, then CS should rise only when CLK is HIGH. If not, then either CS or CLK can be used to operate the shift register. See Table III for more information. CS(1) CLK(1) LDAC RESET H(2) X(3) H H No Change L(4) L H H No Change A precision analog component requires careful layout, adequate bypassing, and clean, well-regulated power supplies. As the DAC7616 offers single-supply operation, it will often be used in close proximity with digital logic, microcontrollers, microprocessors, and digital signal processors. The more digital logic present in the design and the higher the switching speed, the more difficult it will be to keep digital noise from appearing at the converter output. SERIAL SHIFT REGISTER L ↑(5) H H Advanced One Bit ↑ L H H Advanced One Bit H(6) X L(7) H No Change H(6) X H L(8) No Change Because the DAC7616 has a single ground pin, all return currents, including digital and analog return currents, must flow through the GND pin. Ideally, GND should be connected directly to an analog ground plane. This plane should be separate from the ground connection for the digital components until they were connected at the power entry point of the system (see Figure 3). NOTES: (1) CS and CLK are interchangeable. (2) H = Logic HIGH. (3) X = Don’t Care. (4) L = Logic LOW (5) = Positive Logic Transition. (6) A HIGH value is suggested in order to avoid a “false clock” from advancing the shift register and changing the shift register. (7) If data is clocked into the serial register while LDAC is LOW, the selected DAC register will change as the shift register bits “flow” through A1 and A0. This will corrupt the data in each DAC register that has been erroneously selected. (8) RESET LOW causes no change in the contents of the serial shift register. The power applied to VDD should be well regulated and low noise. Switching power supplies and DC/DC converters will often have high-frequency glitches or spikes riding on the output voltage. In addition, digital components can create similar high-frequency spikes as their internal logic switches states. This noise can easily couple into the DAC output voltage through various paths between the power connections and analog output. TABLE III. Serial Shift Register Truth Table. Digital Input Coding The DAC7616 input data is in Straight Binary format. The output voltage is given by the following equation: VOUT = VREFL + (VREFH – VREFL ) • N As with the GND connection, VDD should be connected to a +3V power supply plane or trace that is separate from the connection for digital logic until they are connected at the power entry point. In addition, the 1µF to 10µF and 0.1µF capacitors shown in Figure 4 are strongly recommended. In some situations, additional bypassing may be required, such as a 100µF electrolytic capacitor or even a “Pi” filter made up of inductors and capacitors—all designed to essentially lowpass filter the +3V supply, removing the high frequency noise (see Figure 3). 4096 where N is the digital input code (in decimal). This equation does not include the effects of offset (zero-scale) or gain (full-scale) errors. Digital Circuits +3V +3V Power Supply Ground +3V DAC7616 Ground VDD 100µF + + 1µF to 10µF 0.1µF AGND Optional Other Analog Components FIGURE 3. Suggested Power and Ground Connections for a DAC7616 Sharing a +3V Supply with a Digital System. 12 DAC7616 SBAS186 PACKAGE OPTION ADDENDUM www.ti.com 23-Jun-2015 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) DAC7616E ACTIVE SSOP DB 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 DAC7616E DAC7616EB ACTIVE SSOP DB 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 DAC7616E B DAC7616EB/1K OBSOLETE SSOP DB 20 TBD Call TI Call TI -40 to 85 DAC7616E B DAC7616EB/1KG4 OBSOLETE SSOP DB 20 TBD Call TI Call TI -40 to 85 DAC7616EBG4 ACTIVE SSOP DB 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 DAC7616E B DAC7616U ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 DAC7616U DAC7616UB ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 DAC7616U B DAC7616UB/1K ACTIVE SOIC DW 16 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 DAC7616U B DAC7616UBG4 ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 DAC7616U B DAC7616UG4 ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 DAC7616U (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 23-Jun-2015 (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. 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Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 18-Aug-2014 TAPE AND REEL INFORMATION *All dimensions are nominal Device DAC7616UB/1K Package Package Pins Type Drawing SOIC DW 16 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 1000 330.0 16.4 Pack Materials-Page 1 10.75 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 10.7 2.7 12.0 16.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 18-Aug-2014 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) DAC7616UB/1K SOIC DW 16 1000 367.0 367.0 38.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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