ams AS1154-BSOT Dual lvds driver Datasheet

Datasheet
A S 11 5 4
D u a l LVD S D r i v e r
1 General Description
2 Key Features
The AS1154 is a dual Flow-Through LVDS (Low-Voltage Differential
Signaling) Line Driver which accepts and converts LVTTL/LVCMOS
input levels into LVDS output signals. The device is perfect for lowpower low-noise applications requiring high signaling rates and
reduced EMI emissions.
The device is guaranteed to transmit data at speeds up to 800Mbps
(400MHz) over controlled impedance media of approximately 100Ω.
Supported transmission media are PCB traces, backplanes, and
cables.
Outputs conform to the ANSI TIA/EIA-644 LVDS standards. Flowthrough pinout simplifies PC board layout and reduces crosstalk by
separating the LVTTL/LVCMOS inputs and LVDS outputs.
The AS1154 operates from a single +3.3V supply and is specified for
operation from -40°C to +85°C.
„
Flow-Through Pinout
„
Guaranteed 800Mbps Data Rate
„
250ps Pulse Skew (Max)
„
Conforms to ANSI TIA/EIA-644 LVDS Standards
„
Single +3.3V Supply
„
Operating Temperature Range: -40°C to +85°C
„
8-Pin SOIC Package
3 Applications
Digital Copiers, Laser Printers, Cellular Phone Base Stations, Add/
Drop Muxes, Digital Cross-Connects, DSLAMs, Network Switches/
Routers, Backplane Interconnect, Clock Distribution Computers,
Intelligent Instruments, Controllers, Critical Microprocessors and
Microcontrollers, Power Monitoring, and Portable/Battery-Powered
Equipment.
Figure 1. AS1154 - Block Diagram
VCC
OUT1Tx
OUT1+
IN1
AS1154
IN2
OUT2+
Tx
GND
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OUT2-
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AS1154
Datasheet - P i n o u t
4 Pinout
Pin Assignments
Figure 2. Pin Assignments (Top View)
VCC
1
IN1
2
8
OUT1-
7
OUT1+
AS1154
IN2
3
6
OUT2+
GND
4
5
OUT2-
Pin Descriptions
Table 1. Pin Descriptions
Pin Number
Pin Name
Description
1
VCC
Power Supply Input. Bypass VCC to GND with 0.1µF and 0.001µF ceramic capacitors.
2
IN1
LVTTL/LVCMOS Driver Input
3
IN2
LVTTL/LVCMOS Driver Input
4
GND
Ground
5
OUT2-
Inverting LVDS Driver Output
6
OUT2+
Noninverting LVDS Driver Output
7
OUT1+
Noninverting LVDS Driver Output
8
OUT1-
Inverting LVDS Driver Output
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AS1154
Datasheet - A b s o l u t e M a x i m u m R a t i n g s
5 Absolute Maximum Ratings
Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only, and functional operation of
the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
Table 2. Absolute Maximum Ratings
Parameter
Min
Max
Units
Comments
Electrical Parameters
VCC to GND
-0.3
5.0
V
INx to GND
-0.3
Vcc + 0.3
V
OUTx+, OUTx- to GND
-0.3
5.0
V
Short Circuit Duration (OUTx+, OUTx-)
Continuous
Electrostatic Discharge
Electrostatic Discharge HBM
+/- 4
kV
Norm: MIL 883 E method 3015, INx, OUTx+, OUTx-
Continous Power Dissipation (TA = +70°C)
Continous Power Dissipation
755
mW
PT1 for 8-pin SOIC Package
Continous Power Dissipation Derating Factor
9.4
mW / °C
PDERATE2
Temperature Ranges and Storage Conditions
Junction Temperature
Storage Temperature Range
-55
Package Body Temperature
Humidity non-condensing
Moisture Sensitive Level
5
+150
ºC
+125
ºC
+260
ºC
85
%
1
The reflow peak soldering temperature (body
temperature) specified is in accordance with IPC/
JEDEC J-STD-020“Moisture/Reflow Sensitivity
Classification for Non-Hermetic Solid State Surface
Mount Devices”.
The lead finish for Pb-free leaded packages is matte tin
(100% Sn).
Represents a max. floor life time of unlimited
1. Depending on actual PCB layout and PCB used.
2. PDERATE derating factor changes the total continuous power dissipation (PT) if the ambient temperature is not 70ºC. Therefore for e.g.
TA=85ºC calculate PT at 85ºC = PT - PDERATE x (85ºC - 70ºC)
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AS1154
Datasheet - E l e c t r i c a l C h a r a c t e r i s t i c s
6 Electrical Characteristics
DC Electrical Characteristics
VCC = +3.0V to +3.6V, TA = -40°C to +85°C, RL = 100Ω ±1%, (Typical values are at VCC = +3.3V, TA = +25°C) unless otherwise specified; 1
Table 3. DC Electrical Characteristics
Parameter
Symbol
Operating Temperature Range
TA
Conditions
Min
Typ
Max
Unit
+85
°C
355
450
mV
1
35
mV
1.25
1.375
V
4
25
mV
1.6
V
-40
LVDS Output (OUtx+, OUTx-)
Differential Output Voltage
VOD
Figure 21 on page 12
Change in Magnitude of VOD Between
Complementary Output States
ΔVOD
Figure 21 on page 12
Offset Voltage
VOS
Figure 21 on page 12
Change in Magnitude of VOS Between
Complementary Output States
ΔVOS
Figure 21 on page 12
Output High Voltage
VOH
Output Low Voltage
VOL
Differential Output Short-Circuit
Current 2
IOSD
VOD = 0V
Output Short-Circuit Current
IOS
OUTx+ = 0V at INx = VCC or
OUTx- = 0V at INx = 0V
Power-Off Output Current
IOFF
VCC = 0V or open, OUTx+ = 0V or 3.6V
OUTx- = 0V or 3.6V, RL = ∞
250
1.125
0.90
V
-9
mA
-9
mA
-20
20
µA
-3.7
Inputs (INx)
High-Level Input Voltage
VIH
2.0
VCC
V
Low-Level Input Voltage
VIL
GND
0.8
V
Input Current
IIN
INx = 0V or VCC
-20
20
µA
No-Load Supply Current
ICC
RL = ∞ , INx = VCC or 0V for all channels
2
3.5
mA
Loaded Supply Current
ICCL
RL = 100Ω, INx = VCC or 0V for all channels
5.5
7.5
mA
RL = 100Ω, INx = VCC or 0V for all channels
8.5
12
mA
Supply Current
Notes:
1. Currents into the device are positive, and current out of the device is negative. All voltages are referenced to ground except VOD.
2. Guaranteed by correlation data.
3. All limits are guaranteed. The parameters with min and max values are guaranteed with production tests or SQC (Statistical Quality
Control) methods.
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AS1154
Datasheet - E l e c t r i c a l C h a r a c t e r i s t i c s
Switching Characteristics
VCC = +3.0V to +3.6V, RL = 100Ω ±1%, CL = 2.5pF (differential), TA = -40°C to +85°C, (Typical values are at VCC = +3.3V, TA = +25ºC) unless otherwise
specified; 1, 2, 3, 10
Table 4. Switching Characteristics
Parameter
Symbol
Conditions
Min
Typ
Max
Unit
Differential Propagation Delay,
High-to-Low
tPHLD
Figure 20 on page 11 and
Figure 21 on page 12
1.1
1.268
1.5
ns
Differential Propagation Delay,
Low-to-High
tPLHD
Figure 20 on page 11 and
Figure 21 on page 12
1.1
1.267
1.5
ns
Differential Pulse Skew 4
tSKD1
Figure 20 on page 11 and
Figure 21 on page 12
90
200
ps
Differential Channel-to-Channel Skew 5
tSKD2
Figure 20 on page 11 and
Figure 21 on page 12
110
250
ps
Differential Part-to-Part Skew 6
tSKD3
Figure 20 on page 11 and
Figure 21 on page 12
750
ps
Differential Part-to-Part Skew 7
tSKD4
Figure 20 on page 11 and
Figure 21 on page 12
900
ps
Rise Time
tTLH
Figure 20 on page 11 and
Figure 21 on page 12
200
356
800
ps
Fall Time
tTHL
Figure 20 on page 11 and
Figure 21 on page 12
200
352
800
ps
Maximum Operating Frequency 8, 9
fMAX
400
MHz
Notes:
1. Parameters are guaranteed by design and characterization.
2. CL includes probe and jig capacitance.
3. Signal generator conditions for dynamic tests: VOL = 0, VOH = 2.4V, f = 100MHz, 50% duty cycle, RO = 50Ω,
tR ≤ 1ns, tF ≤ 1ns (0 to 100%).
4. tSKD1 is the magnitude difference of differential propagation delay. tSKD1 = |tPHLD - tPLHD|.
5. tSKD2 is the magnitude difference of tPHLD or tPLHD of one channel to the tPHLD or tPLHD of another channel on the same device.
6. tSKD3 is the magnitude difference of any differential propagation delays between devices at the same VCC and within 5°C of each other.
7. tSKD4 is the magnitude difference of any differential propagation delays between devices operating over the rated supply and temperature ranges.
8. fMAX signal generator conditions: VOL = 0, VOH = 2.4V, 50% duty cycle, RO = 50Ω,
tR ≤ 1ns, tF ≤ 1ns (0 to 100%).
9. Transmitter output criteria: duty cycle = 45 to 55%, VOD ³ 250mV.
10. For optimum performance matched circuits should be used.
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AS1154
Datasheet - Ty p i c a l O p e r a t i n g C h a r a c t e r i s t i c s
7 Typical Operating Characteristics
VCC = +3.3V, CLOAD = 2.5pF (differential), Freq = 20MHz, Tamb = +25ºC, unless otherwise specified;
Figure 4. Transition Time vs. Temperature
Figure 3. Transition Time vs. VCC
270
350
.
300
tTHL
260
Transition Time (ps)
Transition Time (ps)
.
tTHL
250
240
tTLH
250
150
100
50
230
3
3.1
3.2
tTLH
200
3.3
3.4
3.5
0
-50
3.6
-30
Supply Voltage(V)
-10
10
30
50
70
90
Ambient Temperature(°C)
Figure 5. Differential Pulse Skew vs. VCC
Figure 6. Pulse Skew vs. Temperature
35
70
30
.
60
Pulse Skew (ps)
Differential Pulse Skew (ps)
.
80
50
40
30
20
25
20
15
10
5
10
0
3
3.1
3.2
3.3
3.4
3.5
0
-50
3.6
Supply Voltage(V)
-30
-10
10
30
50
70
90
Ambient Temperature(°C)
Figure 7. Differential Propagation Delay vs. VCC;
Figure 8. Differential Propagation Delay vs. Temp.
1.14
.
.
1.05
Diff. Propagation Delay (ns)
Diff. Propagation Delay (ns)
1.12
1.03
tPHLD
1.01
0.99
0.97
tPLHD
0.95
3
3.1
3.2
3.3
3.4
3.5
3.6
1.1
1.08
tPLHD
1.04
1.02
1
0.98
-50
Supply Voltage(V)
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tPHLD
1.06
-30
-10
10
30
50
70
90
Ambient Temperature(°C)
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AS1154
Datasheet - Ty p i c a l O p e r a t i n g C h a r a c t e r i s t i c s
Figure 10. Differential Output Voltage vs. Frequency
.
350
Differential Output Voltage (mV)
Differential Output Voltage (mV)
.
Figure 9. Differential Output Voltage vs. VCC
345
340
335
330
325
3
3.1
3.2
3.3
3.4
3.5
350
300
250
200
150
100
50
0
3.6
0
50 100 150 200 250 300 350 400
Supply Voltage (V)
Frequency (MHz)
Figure 11. Offset Voltage vs. VCC
Figure 12. Offset Voltage vs. Frequency
1.35
Offset Voltage (V) .
Offset Voltage (V) .
1.24
1.23
1.22
1.21
1.3
1.25
1.2
1.15
1.2
1.1
3
3.1
3.2
3.3
3.4
3.5
3.6
0
50
Supply Voltage (V)
Figure 13. Output Voltage vs. VCC;
150
200
250
Figure 14. Output Voltage vs. Load Resistance;
1.45
1.45
VOUT+
1.35
Output Voltage (V) .
Output Voltage (V) .
100
Frequency (MHz)
1.25
1.15
VOUT-
1.05
0.95
1.35
VOUT+
1.25
1.15
VOUT-
1.05
0.95
3
3.1
3.2
3.3
3.4
3.5
3.6
80
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90
100 110 120 130 140 150
Load Resistance (Ω )
Supply Voltage (V)
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AS1154
Datasheet - Ty p i c a l O p e r a t i n g C h a r a c t e r i s t i c s
Figure 15. ICC vs. VCC
Figure 16. ICC vs. Temperature;
.
13
10.6
Supply Current (mA)
Supply Current (mA)
.
11
10.2
9.8
9.4
9
3
3.1
3.2
3.3
3.4
3.5
12
Freq = 100MHz
11
10
Freq = 20MHz
9
8
-50
3.6
Supply Voltage (V)
-30
-10
10
30
50
70
90
Ambient Temperature(°C)
Figure 17. Short Circuit Current vs. VCC
Figure 18. ICC vs. Frequency
3.9
Output Short Circuit Current (mA)
.
18
16
Supply Current (mA) .
3.85
3.8
3.75
3.7
3.65
14
12
10
8
6
4
2
3.6
0
3
3.1
3.2
3.3
3.4
3.5
3.6
0
Supply Voltage(V)
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50
100
150
200
250
Frequency (MHz)
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AS1154
Datasheet - D e t a i l e d D e s c r i p t i o n
8 Detailed Description
LVDS Interface
The LVDS interface standard is a signaling method intended for point-to-point communication over a controlled-impedance medium as defined
by the ANSI/TIA/EIA-644 and IEEE 1596.3 standards. The LVDS standard uses a lower voltage swing than other common communication standards, achieving higher data rates with reduced power consumption while reducing EMI emissions and system susceptibility to noise.
The AS1154 is an 800Mbps dual differential LVDS driver that is designed for high-speed, point-to-point, low-power applications. This device
accepts LVTTL/LVCMOS input levels and translates them to LVDS output signals.
The AS1154 generates a 2.5mA to 4.5mA output current using a current-steering configuration. This current steering approach induces less
ground bounce and no shoot-through current, enhancing noise margin and system speed performance. The driver outputs are short-circuit current limited, and enter a high-impedance state when the device is not powered or is disabled.
The current-steering architecture of the AS1154 requires a resistive load to terminate the signal and complete the transmission loop. Because
the device switches current and not voltage, the actual output voltage swing is determined by the value of the termination resistor at the input of
an LVDS receiver (AS1157, AS1158). Logic states are determined by the direction of current flow through the termination resistor.
With a typical 3.7mA output current, the AS1154 produces an output voltage of 370mV when driving a 100Ω load.
Termination
Because the AS1154 is a current-steering device, no output voltage will be generated without a termination resistor. The termination resistors
should match the differential impedance of the transmission line. Output voltage levels depend upon the value of the termination resistor.
The AS1154 is optimized for point-to-point interface with 100Ω termination resistors at the receiver inputs. Termination resistance values may
range between 90 and132Ω, depending on the characteristic impedance of the transmission medium.
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AS1154
Datasheet - A p p l i c a t i o n s
9 Applications
Table 5. Function Table
Input
Output
INx
OUTx+
OUTx-
L
L
H
H
H
L
0.8V < VINx < 2.0V
Undetermined
Undetermined
Figure 19. Typical Application Circuit
+3.3V
+3.3V
0.001µF
0.001µF
0.1µF
0.1µF
LVDS
Signals
LVTTL/LVCMOS
Data Inputs
Tx
107Ω
Rx
LVTTL/LVCMOS
Data Outputs
AS1157
AS1154
LVDS Receiver
100Ω Shielded Twisted Cable or Microstrip PC Board Traces
Power-Supply Bypassing
To bypass VCC, use high-frequency surface-mount ceramic 0.1µF and 0.001µF capacitors in parallel as close to the device as possible, with the
smaller valued capacitor closest to pin VCC.
Differential Traces
Input trace characteristics can adversely affect the performance of the AS1154.
„
Use controlled-impedance PC board traces to match the cable characteristic impedance. The termination resistor is also matched to this
characteristic impedance.
„
Eliminate reflections and ensure that noise couples as common mode by running the differential traces near each other.
„
Reduce skew by using matched trace lengths. Tight skew control is required to minimize emissions and proper data recovery of the devices.
„
Route each channel’s differential signals very close to each other for optimal cancellation of their respective external magnetic fields. Use a
constant distance between the differential traces to avoid irregularities in differential impedance.
„
Avoid 90° turns (use two 45° turns).
„
Minimize the number of vias to further prevent impedance irregularities.
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AS1154
Datasheet - A p p l i c a t i o n s
Cables and Connectors
Supported transmission media include printed circuit board traces, backplanes, and cables.
„
Use cables and connectors with matched differential impedance (typically 100Ω) to minimize impedance mismatches.
„
Balanced cables such as twisted pair offer superior signal quality and tend to generate less EMI due to magnetic field canceling effects. Balanced cables pick up noise as common mode, which is rejected by the LVDS receiver.
„
Avoid the use of unbalanced cables such as ribbon cable or simple coaxial cable.
Board Layout
The device should be placed as close to the interface connector as possible to minimize LVDS trace length.
„
Keep the LVDS and any other digital signals separated from each other to reduce crosstalk.
„
Use a four-layer PC board that provides separate power, ground, LVDS signals, and input signals.
„
Isolate the input LVDS signals from each other and the output LVCMOS/LVTTL signals from each other to prevent coupling.
„
Separate the input LVDS signals from the output signals planes with the power and ground planes for best results.
Figure 20. Driver Propagation Delay and Transition Time Waveforms
1.5V
1.5V
tPLHD
tPHLD
INx
VOH
OUTx0 Differential
0
OUTx+
VOL
80%
0
80%
VDIFF = (VOUTx+) - (VOUTx-)
00
20%
20%
tTLH
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tTHL
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AS1154
Datasheet - A p p l i c a t i o n s
Figure 21. Driver Propagation Delay and Transition Time Test Circuit
OUTx+
Generator
RL
CL
50Ω
OUTx-
Figure 22. Driver VOD and VOS Test Circuit
OUTx+
RL/2
VCC
INx
VOS
VOD
GND
RL/2
OUTx-
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AS1154
Datasheet - P a c k a g e D r a w i n g s a n d M a r k i n g s
10 Package Drawings and Markings
Figure 23. 8-pin SOIC Marking
Table 6. Packaging Code AYWWRZZ
YY
WW
R
ZZ
last two digits of the current year
manufacturing week
plant identifier
free choice / traceability code
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AS1154
Datasheet - P a c k a g e D r a w i n g s a n d M a r k i n g s
Figure 24. 8-pin SOIC Package
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AS1154
Datasheet - O r d e r i n g I n f o r m a t i o n
11 Ordering Information
The devices are available as the standard products shown in Table 7.
Table 7. Ordering Information
Ordering Code
Marking
Description
Delivery Form
Package
AS1154-BSOU
AS1154
AS1154-BSOT
AS1154
Dual LVDS Driver
Tubes
8-pin SOIC
Dual LVDS Driver
Tape and Reel
8-pin SOIC
Note: All products are RoHS compliant.
Buy our products or get free samples online at ICdirect: http://www.austriamicrosystems.com/ICdirect
Technical Support is found at http://www.austriamicrosystems.com/Technical-Support
For further information and requests, please contact us mailto:[email protected]
or find your local distributor at http://www.austriamicrosystems.com/distributo
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AS1154
Datasheet
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All rights reserved. The material herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of
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austriamicrosystems AG makes no warranty, express, statutory, implied, or by description regarding the information set forth herein or regarding
the freedom of the described devices from patent infringement. austriamicrosystems AG reserves the right to change specifications and prices at
any time and without notice. Therefore, prior to designing this product into a system, it is necessary to check with austriamicrosystems AG for
current information. This product is intended for use in normal commercial applications. Applications requiring extended temperature range,
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