Intersil EL5103IC-T7A 400mhz slew enhanced vfa Datasheet

EL5102, EL5103, EL5202, EL5203, EL5302
®
Data Sheet
January 17, 2008
400MHz Slew Enhanced VFAs
Features
The EL5x02 and EL5x03 families represent high-speed
VFAs based on a CFA amplifier architecture. This gives the
typical high slew rate benefits of a CFA family along with the
stability and ease of use associated with the VFA type
architecture. With slew rates of 3500V/µs, this family of
devices enables the use of voltage feedback amplifiers in a
space where the only alternative has been current feedback
amplifiers. This family will also be available in single, dual,
and triple versions, with 200MHz, 400MHz, and 750MHz
versions. These are all available in single, dual, and triple
versions.
• Operates off 3V, 5V, or ±5V applications
Both families operate on single 5V or ±5V supplies from
minimum supply current. EL5x02 also features an output
enable function, which can be used to put the output in to a
high-impedance mode. This enables the outputs of multiple
amplifiers to be tied together for use in multiplexing
applications.
• AVOL = 2000
Typical applications for these families will include cable
driving, filtering, A/D and D/A buffering, multiplexing and
summing within video, communications, and instrumentation
designs.
FN7331.8
• Power-down to 0µA (EL5x02)
• -3dB bandwidth = 400MHz
• ±0.1dB bandwidth = 50MHz
• Low supply current = 5mA
• Slew rate = 3500V/µs
• Low offset voltage = 5mV max
• Output current = 140mA
• Differential gain/phase = 0.01%/0.01°
• Pb-free available (RoHS compliant)
Applications
• Video amplifiers
• PCMCIA applications
• A/D drivers
• Line drivers
• Portable computers
• High speed communications
• RGB applications
• Broadcast equipment
• Active filtering
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright Intersil Americas Inc. 2002-2007, 2008. All Rights Reserved
All other trademarks mentioned are the property of their respective owners.
EL5102, EL5103, EL5202, EL5203, EL5302
Ordering Information
PART NUMBER
PART MARKING
PACKAGE
PKG. DWG. #
EL5102IS
5102IS
8 Ld SOIC (150 mil)
MDP0027
EL5102IS-T7*
5102IS
8 Ld SOIC (150 mil)
MDP0027
EL5102IS-T13*
5102IS
8 Ld SOIC (150 mil)
MDP0027
EL5102ISZ (Note)
5102ISZ
8 Ld SOIC (150 mil) (Pb-free)
MDP0027
EL5102ISZ-T7* (Note)
5102ISZ
8 Ld SOIC (150 mil) (Pb-free)
MDP0027
EL5102ISZ-T13* (Note)
5102ISZ
8 Ld SOIC (150 mil) (Pb-free)
MDP0027
EL5102IW-T7*
q
6 Ld SOT-23
MDP0038
EL5102IW-T7A*
q
6 Ld SOT-23
MDP0038
EL5102IWZ-T7* (Note)
BBSA
6 Ld SOT-23 (Pb-free)
MDP0038
EL5102IWZ-T7A* (Note)
BBSA
6 Ld SOT-23 (Pb-free)
MDP0038
EL5103IC
B
5 Ld SC-70
P5.049
EL5103IC-T7*
B
5 Ld SC-70
P5.049
EL5103IC-T7A*
B
5 Ld SC-70
P5.049
EL5103IW-T7*
g
5 Ld SOT-23
MDP0038
EL5103IW-T7A*
g
5 Ld SOT-23
MDP0038
EL5103IWZ-T7*
BBTA
5 Ld SOT-23 (Pb-free)
MDP0038
EL5103IWZ-T7A*
BBTA
5 Ld SOT-23 (Pb-free)
MDP0038
EL5202IY
BRAAA
10 Ld MSOP (3.0mm)
MDP0043
EL5202IY-T7*
BRAAA
10 Ld MSOP (3.0mm)
MDP0043
EL5202IY-T13*
BRAAA
10 Ld MSOP (3.0mm)
MDP0043
EL5202IYZ (Note)
BAAAD
10 Ld MSOP (3.0mm) (Pb-free)
MDP0043
EL5202IYZ-T7* (Note)
BAAAD
10 Ld MSOP (3.0mm) (Pb-free)
MDP0043
EL5202IYZ-T13* (Note)
BAAAD
10 Ld MSOP (3.0mm) (Pb-free)
MDP0043
EL5203IS
5203IS
8 Ld SOIC (150 mil)
MDP0027
EL5203IS-T7*
5203IS
8 Ld SOIC (150 mil)
MDP0027
EL5203IS-T13*
5203IS
8 Ld SOIC (150 mil)
MDP0027
EL5203ISZ (Note)
5203ISZ
8 Ld SOIC (150 mil) (Pb-free)
MDP0027
EL5203ISZ-T7* (Note)
5203ISZ
8 Ld SOIC (150 mil) (Pb-free)
MDP0027
EL5203ISZ-T13* (Note)
5203ISZ
8 Ld SOIC (150 mil) (Pb-free)
MDP0027
EL5203IY
BSAAA
8 Ld MSOP (3.0mm)
MDP0043
EL5203IY-T7*
BSAAA
8 Ld MSOP (3.0mm)
MDP0043
EL5203IY-T13*
BSAAA
8 Ld MSOP (3.0mm)
MDP0043
EL5203IYZ (Note)
BAAAE
8 Ld MSOP (3.0mm) (Pb-free)
MDP0043
EL5203IYZ-T7* (Note)
BAAAE
8 Ld MSOP (3.0mm) (Pb-free)
MDP0043
EL5203IYZ-T13* (Note)
BAAAE
8 Ld MSOP (3.0mm) (Pb-free)
MDP0043
EL5302IU
5302IU
16 Ld QSOP (150 mil)
MDP0040
EL5302IU-T7*
5302IU
16 Ld QSOP (150 mil)
MDP0040
EL5302IU-T13*
5302IU
16 Ld QSOP (150 mil)
MDP0040
EL5302IUZ (Note)
5302IUZ
16 Ld QSOP (150 mil) (Pb-free)
MDP0040
EL5302IUZ-T7* (Note)
5302IUZ
16 Ld QSOP (150 mil) (Pb-free)
MDP0040
EL5302IUZ-T13* (Note)
5302IUZ
16 Ld QSOP (150 mil) (Pb-free)
MDP0040
* Please refer to TB347 for details on reel specifications.
NOTE: These Intersil Pb-free plastic packaged products employ special Pb-free material sets; molding compounds/die attach materials and 100%
matte tin plate PLUS ANNEAL - e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations.
Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J
STD-020.
2
FN7331.8
January 17, 2008
EL5102, EL5103, EL5202, EL5203, EL5302
Pinouts
EL5103
(5 LD SOT-23)
TOP VIEW
EL5102
(6 LD SOT-23)
TOP VIEW
OUT 1
VS- 2
+ -
IN+ 3
6 VS+
OUT 1
5 CE
VS- 2
4 IN-
IN+ 3
8 CE
IN- 2
+
IN+ 3
VS- 4
INA- 2
6 OUT
INA+ 3
IN+ 3
9 OUT
+
VS- 4
CE 5
7 OUTB
+
6 INB+
8 IN-
INA+ 1
CEA 2
16 INA+
7 IN+
CEB 4
6 CE
INB+ 5
CEC 7
INC+ 8
15 OUTA
14 VS+
VS- 3
+
-
13 OUTB
12 INB-
NC 6
3
5 INB+
EL5302
(16 LD QSOP)
TOP VIEW
10 VS+
+
8 VS+
VS- 4
EL5202
(10 LD MSOP)
TOP VIEW
IN- 2
4 IN-
OUTA 1
7 VS+
5 NC
OUT 1
+ -
EL5203
(8 LD SOIC, MSOP)
TOP VIEW
EL5102
(8 LD SOIC)
TOP VIEW
NC 1
5 VS+
11 NC
+
-
10 OUTC
9 INC-
FN7331.8
January 17, 2008
EL5102, EL5103, EL5202, EL5203, EL5302
Absolute Maximum Ratings (TA = +25°C)
Thermal Information
Supply Voltage between VS+ and GND. . . . . . . . . . . . . . . . . . 13.2V
Maximum Supply Slewrate between VS+ and VS- . . . . . . . . . 1V/µs
Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .±VS
Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .±4V
Maximum Continuous Output Current . . . . . . . . . . . . . . . . . . . 80mA
Maximum Current into IN+, IN-, CE . . . . . . . . . . . . . . . . . . . . . ±5mA
Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . See Curves
Storage Temperature Range . . . . . . . . . . . . . . . . . .-65°C to +150°C
Ambient Operating Temperature Range . . . . . . . . . .-40°C to +85°C
Operating Junction Temperature . . . . . . . . . . . . . . . . . . . . . . +150°C
Pb-free reflow profile . . . . . . . . . . . . . . . . . . . . . . . . . .see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and
result in failures not covered by warranty.
IMPORTANT NOTE: All parameters having Min/Max specifications are guaranteed. Typical values are for information purposes only. Unless otherwise noted, all tests
are at the specified temperature and are pulsed tests, therefore: TJ = TC = TA
DC Electrical Specifications
PARAMETER
VS+ = +5V, VS- = -5V, TA = +25°C, RL = 500Ω, VENABLE = +5V, Unless Otherwise Specified.
TYP
MAX
UNIT
EL5102, EL5103, EL5202, EL5203
1
5
mV
EL5302
2
8
mV
Offset Voltage Temperature Coefficient
Measured from TMIN to TMAX
10
Input Bias Current
VIN = 0V
-12
2
12
µA
Input Offset Current
VIN = 0V
-8
1
8
µA
TCIOS
Input Bias Current Temperature
Coefficient
Measured from TMIN to TMAX
PSRR
Power Supply Rejection Ratio
VS = ±4.75V to ±5.25V
CMRR
Common Mode Rejection Ratio
CMIR
VOS
TCVOS
IB
IOS
DESCRIPTION
Offset Voltage
CONDITIONS
MIN
µV/°C
50
nA/°C
-70
-80
dB
VCM = -3V to 3.0V
-60
-80
dB
Common Mode Input Range
Guaranteed by CMRR test
-3
±3.3
RIN
Input Resistance
Common mode
200
400
kΩ
CIN
Input Capacitance
SO package
1
pF
3
V
IS,ON
Supply Current - Enabled Per Amplifier
4.6
5.2
5.8
mA
IS,OFF
Supply Current - Shut-down Per Amplifier VS+
+1
+9
+25
µA
VS-
-25
-13
-1
µA
VOUT = ±2.5V, RL = 1kΩ to GND
58
66
dB
60
dB
AVOL
Open Loop Gain
VOUT = ±2.5V, RL = 150Ω to GND
VOUT
IOUT
Output Voltage Swing
Output Current
RL = 1kΩ to GND
±3.5
±3.9
V
RL = 150Ω to GND
±3.4
±3.7
V
AV = 1, RL = 10Ω to 0V
±80
±150
mA
VCE-ON
CE Pin Voltage for Power-up
(VS+) -5
(VS+) -3
V
VCE-OFF
CE Pin Voltage for Shut-down
(VS+) -1
VS+
V
IEN-ON
Pin Current - Enabled
CE = 0V
-1
0
+1
µA
IEN-OFF
Pin Current - Disabled
CE = +5V
1
14
25
µA
4
FN7331.8
January 17, 2008
EL5102, EL5103, EL5202, EL5203, EL5302
Closed Loop AC Electrical Specifications VS+ = +5V, VS- = -5V, TA = +25°C, VENABLE = +5V, AV = +1, RF = 0Ω, RL = 150Ω to
GND Pin, Unless Otherwise Specified. (Note 1)
PARAMETER
DESCRIPTION
CONDITIONS
BW
-3dB Bandwidth (VOUT = 400mVP-P)
AV = 1, RF = 0Ω
SR
Slew Rate
AV = +2, RL = 100Ω, VOUT = -3V to +3V
RL = 500Ω, VOUT = -3V to +3V
MIN
TYP
MAX
400
1100
2200
UNIT
MHz
5000
V/µs
4000
V/µs
tR,tF
Rise Time, Fall Time
±0.1V step
2.8
ns
OS
Overshoot
±0.1V step
10
%
tS
0.1% Settling Time
VS = ±5V, RL = 500Ω, AV = 1, VOUT = ±3V
20
ns
dG
Differential Gain (Note 2)
AV = 2, RF = 1kΩ
0.01
%
dP
Differential Phase (Note 2)
AV = 2, RF = 1kΩ
0.01
°
eN
Input Noise Voltage
f = 10kHz
12
nV/√Hz
iN
Input Noise Current
f = 10kHz
11
pA/√Hz
tDIS
Disable Time (Note 3)
50
ns
tEN
Enable Time (Note 3)
25
ns
NOTES:
1. All AC tests are performed on a “warmed up” part, except slew rate, which is pulse tested.
2. Standard NTSC signal = 286mVP-P, f = 3.58MHz, as VIN is swept from 0.6V to 1.314V.RL is DC coupled.
3. Disable/Enable time is defined as the time from when the logic signal is applied to the ENABLE pin to when the supply current has reached half
its final value.
5
FN7331.8
January 17, 2008
EL5102, EL5103, EL5202, EL5203, EL5302
Typical Performance Curves
5
3
2
120
1
0
-1
-2
60
0
-60
-120
-3
-180
-4
-3dB BW @ 438MHz
-240
-5
0.1
1M
10M
100M
FREQUENCY (Hz)
0.1
1G
70
0.5
VS = ±5V
AV = +1
RF = 0
RL = 500Ω
CL = +3.3pF
0.3
0.2
0.1
VS = ±5V
RL = 500Ω
0.1dB BW @ 35MHz
0
-0.1
10M
FREQUENCY (Hz)
100M
1G
GAIN = 40dB or 100
FREQUENCY = 1.64 MHz
GAIN BW PRODUCT =
1.64 x 100 = 164MHz
60
GAIN (dB)
0.4
1M
FIGURE 2. PHASE vs FREQUENCY
FIGURE 1. GAIN vs FREQUENCY (-3dB BANDWIDTH)
NORMALIZED GAIN (dB)
VS = ±5V
AV = +1
RF = 0
RL = 500Ω
CL = +3.3pF
180
PHASE (°)
NORMALIZED GAIN (dB)
240
VS = ±5V
AV = +1
RF = 0
RL = 500Ω
CL = +3.3pF
4
50
40
-0.2
30
-0.3
-0.4
20
-0.5
1M
10M
FREQUENCY (Hz)
100M
300
1M
10M
FREQUENCY (Hz)
5
VS = ±5V
RL = 500Ω
4
250
200
150
100
3
VS = ±5V
RL = 500Ω
CL = +3.3pF
AV = +1
RF = 0
1
0
-1
-2
AV = +5
RF = 1.6k, RG = 400
-3
-5
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
SUPPLY VOLTAGES (±V)
FIGURE 5. GAIN BANDWIDTH PRODUCT vs SUPPLY
VOLTAGES
6
AV = +2
RF = RG = 400Ω
2
-4
50
2.0
100M
FIGURE 4. GAIN BANDWIDTH PRODUCT
NORMALIZED GAIN (dB)
GAIN-BANDWIDTH PRODUCT (MHz)
FIGURE 3. 0.1dB BANDWIDTH
0
0.1
1M
10M
100M
1G
FREQUENCY (Hz)
FIGURE 6. GAIN vs FREQUENCY FOR VARIOUS +AV
FN7331.8
January 17, 2008
EL5102, EL5103, EL5202, EL5203, EL5302
Typical Performance Curves
(Continued)
5
5
3
2
AV = +1
RF = 0
RL = 500Ω
CL = +3.3pF
1
0
-1
VS = ±6
VS = ±5V
VS = ±4V
-2
-3
VS = ±3V
-4
-5
1M
10M
100M
3
2
RL = 500Ω
0
-1
-2
RL = 150Ω
-3
RL = 75Ω
-5
1G
RL = 50Ω
0.1
1M
FIGURE 7. GAIN vs FREQUENCY FOR VARIOUS ±VS
RL = 500Ω
RL = 1kΩ
0
-1
RL = 50Ω
RL = 70Ω
-3
RL = 150Ω
-4
1M
10M
100M
FREQUENCY (Hz)
3
2
CL = 27pF
CL = 15pF
CL = 8.2pF
1
RL = 1kΩ
0
-1
RL = 50Ω
-2
-3
RL = 75Ω
RL = 150Ω
0.1
5
VS = ±5V
AV = +1
RF = 0
RL = 500Ω
0
-1
CL = 3.3pF
-2
-3
CL = 0pF
-4
RL = 500Ω
1
1M
10M
FREQUENCY (Hz)
100M
FIGURE 10. GAIN vs FREQUENCY FOR VARIOUS
RLOAD (AV = +5)
4
NORMALIZED GAIN (dB)
NORMALIZED GAIN (dB)
4
2
-5
1G
FIGURE 9. GAIN vs FREQUENCY FOR VARIOUS
RLOAD (AV = +2)
5
3
-4
-5
0.1
VS = ±5V
AV = +5
RF = 402Ω
CL = +3.9pF
4
1
-2
1G
5
VS = ±5V
AV = +2
RF = 402Ω
CL = +3.9pF
NORMALIZED GAIN (dB)
NORMALIZED GAIN (dB)
2
100M
FIGURE 8. GAIN vs FREQUENCY FOR VARIOUS
RLOAD (AV = +1)
5
3
10M
FREQUENCY (Hz)
FREQUENCY (Hz)
4
RL = 1kΩ
1
-4
VS = ±2.5V
0.1
VS = ±5V
AV = +1
RF = 0
CL = +3.3pF
4
NORMALIZED GAIN (dB)
NORMALIZED GAIN (dB)
4
3
2
VS = ±5V
AV = +2
RF = 400Ω
RL = 500Ω
CL = 47pF
CL = 18pF
1
0
-1
CL = 8.2pF
-2
-3
CL = 0pF
-4
-5
CL = 33pF
-5
0.1
1M
10M
100M
FREQUENCY (Hz)
FIGURE 11. GAIN vs FREQUENCY FOR VARIOUS
CLOAD (AV = +1)
7
1G
0.1
1M
10M
100M
FREQUENCY (Hz)
1G
FIGURE 12. GAIN vs FREQUENCY FOR VARIOUS
CLOAD (AV = +2)
FN7331.8
January 17, 2008
EL5102, EL5103, EL5202, EL5203, EL5302
Typical Performance Curves
(Continued)
5
3
2
CL = 150pF
CL = 220pF
CL = 100pF
1
0
-1
CL = 56pF
-2
-3
-4
3
2
RF = 50Ω
-2
RF = 25Ω
-3
RF = 0Ω
-4
10M
-5
100M
0.1
1M
FREQUENCY (Hz)
3
2
VS = ±5V
AV = +2
RL = 500Ω
CL = +8pF
5
RF = 1.0kΩ
RF = 680Ω
1
0
-1
RF = 402Ω
-2
RF = 274Ω
-3
-4
-5
1M
10M
VS = ±5V
AV = +5
RL = 500Ω
CL = +12pF
4
3
2
100M
1
0
-1
RF = 100Ω
RF = 1kΩ
-2
-3
RF = 402Ω
1G
-5
0.1
1M
FIGURE 15. GAIN vs FREQUENCY FOR VARIOUS RF (AV = +2)
3
2
VS = ±5V
CIN = 3.3pF
AV = +2
RF = RG = 402Ω CIN = 2.2pF
RL = 500Ω
CL= +8pF
0
-1
CIN = 1pF
-3
CIN = 0pF
-4
-5
0.1
1M
10M
100M
FREQUENCY (Hz)
4
3
2
VS = ±5V
AV = +5
RG = 402Ω
RL = 1600Ω
CL = +12pF
CIN = 8.2pF CIN = 10pF
CIN = 6.8pF
1
0
-1
-2
CIN = 0pF
CIN = 4.7pF
-3
-4
1G
FIGURE 17. GAIN vs FREQUENCY FOR VARIOUS CIN(-)
(AV = +2)
8
5
CIN = 4.7pF
1
-2
100M
FIGURE 16. GAIN vs FREQUENCY FOR VARIOUS RF (AV = +5)
NORMALIZED GAIN (dB)
NORMALIZED GAIN (dB)
4
10M
FREQUENCY (Hz)
FREQUENCY (MHz)
5
1G
RF = 4kΩ
RF = 2kΩ
-4
RF = 100Ω
0.1
100M
FIGURE 14. GAIN vs FREQUENCY FOR VARIOUS RF (AV = +1)
NORMALIZED GAIN (dB)
NORMALIZED GAIN (dB)
4
10M
FREQUENCY (Hz)
FIGURE 13. GAIN vs FREQUENCY FOR VARIOUS
CLOAD (AV = +5)
5
RF = 150Ω
0
-1
-5
1M
RF = 100Ω
1
CL = 0pF
0.1
VS = ±5V
AV = +1
RL = 500Ω
CL = +3pF
4
NORMALIZED GAIN (dB)
NORMALIZED GAIN (dB)
5
VS = ±5V
AV = +5
RF = 400Ω
RL = 500Ω
4
-5
0.1
1M
10M
FREQUENCY (Hz)
100M
FIGURE 18. GAIN vs FREQUENCY FOR VARIOUS CIN(-)
(AV = +5)
FN7331.8
January 17, 2008
EL5102, EL5103, EL5202, EL5203, EL5302
-45
70
0
45
PHASE
50
90
40
135
30
180
20
225
GAIN
10
270
0
315
VCC = +5V
VEE = -5V
-10
-20
10
100
1k
100
OUTPUT IMPEDANCE (Ω)
80
60
GAIN (dB)
(Continued)
PHASE (°)
Typical Performance Curves
360
10k 100k
1M
AV = +2
VS = ±5V
10
1
0.1
0.01
405
10M 100M 1G
10k
100k
FIGURE 19. OPEN LOOP GAIN AND PHASE vs FREQUENCY
-10
0
-10
-40
-20
PSRR (dB)
CMRR (dB)
10
-30
-50
-60
-70
-50
-60
-70
-100
-80
100k
1M
10M
-90
1k
100M 500M
AV = +1
VS = ±5V
-40
-90
10k
+PSRR
-PSRR
10k
RLOAD = 1kΩ
8
GROUP DELAY (ns)
MAX OUTPUT VOLTAGE SWING (VP-P)
10
7
6
5
4
2
1
0
VS = ±5V
AV = +2
RF = RG = 402Ω
CL = 8pF
0.1
RLOAD = 150Ω
1M
10M
100M
1G
FREQUENCY (Hz)
FIGURE 23. MAX OUTPUT VOLTAGE SWING vs FREQUENCY
9
1M
10M
100M 500M
FIGURE 22. PSRR vs FREQUENCY
FIGURE 21. CMRR vs FREQUENCY
9
100k
FREQUENCY (Hz)
FREQUENCY (Hz)
3
100M
-30
-80
-110
1k
10M
FIGURE 20. OUTPUT IMPEDANCE/PHASE vs FREQUENCY
AV = +5
VS = ±5V
-20
1M
FREQUENCY (Hz)
FREQUENCY (Hz)
30
25 VS = ±5V
A = +1
20 RV = 0
F
15 RL = 500Ω
10
5
0
-5
-10
-15
-20
-25
-30
0.1
1M
10M
100M
FREQUENCY (Hz)
1G
FIGURE 24. GROUP DELAY vs FREQUENCY
FN7331.8
January 17, 2008
EL5102, EL5103, EL5202, EL5203, EL5302
Typical Performance Curves
(Continued)
-10
VS = ±5V
AV = +1
RF = 0
CHIP DISABLED
ISOLATION (dB)
-30
OUTPUT TO INPUT
-40
-50
-60
INPUT TO OUTPUT
GAIN (dB)
-20
-70
-80
-90
-100
0.1
1M
10M
100M
1G
10
NOTE:
0 VS = ±5V
This was done on the
-10 AV = +1
EL5203 (Dual Op-Amps)
RF = 0
-20
RL = 500Ω
-30
BIN TO AOUT
-40
-50
AIN TO BOUT
-60
-70
-80
-90
-100
-110
-120
0.1
1M
10M
100M
FREQUENCY (Hz)
FIGURE 25. INPUT AND OUTPUT ISOLATION
FIGURE 26. CHANNEL-TO-CHANNEL ISOLATION
-20
-40
-50
-60
-70
-40
T.H.D
2nd HD
-80
-70
-100
100M
ENABLE SIGNAL
4
3
VS = ±5V
AV = +1
RF = 0
RL = 500Ω
VOUT = 2VP-P
OUTPUT SIGNAL
2
1
0
2
10
3
4
5
6
7
8
DISABLE SIGNAL
OUTPUT SIGNAL
1
0
-2
FIGURE 29. TURN-ON TIME
2
VS = ±5V
5 AV = +1
RF = 0
4 R = 500Ω
L
3 VOUT = 2VP-P
-2
TIME (ns)
1
6
-1
0 200 400 600 800 1000 1200 1400 1600
0
FIGURE 28. TOTAL HARMONIC DISTORTION vs OUTPUT
VOLTAGES
-1
-3
-600 -400 -200
FIN = 1MHz
OUTPUT VOLTAGES (VP-P)
AMPLITUDE (V)
1M
10M
FUNDAMENTAL FREQUENCY (Hz)
6
AMPLITUDE (V)
-60
-90
3rd HD
FIGURE 27. HARMONIC DISTORTION vs FREQUENCY
5
-50
FIN = 10MHz
-80
-90
-100
0.1
VS = ±5V
AV = +5
RG = 402Ω
RF = 1600Ω
RL = 500Ω
CL = 12pF
-30
THD (dBc)
HARMONIC DISTORTION (dBc)
-30
VS = ±5V
AV = +1
RF = 0
RL = 500Ω
CL = 3.3pF
VOUT = 2VP-P
1G
FREQUENCY (Hz)
-3
-600 -400 -200 0
200 400 600 800 1000 1200 1400 1600
TIME (ns)
FIGURE 30. TURN-OFF TIME
FN7331.8
January 17, 2008
EL5102, EL5103, EL5202, EL5203, EL5302
Typical Performance Curves
(Continued)
0.5
VS = ±5V
0.4 AV = +1
RF = 0
0.3
AMPLITUDE (V)
NOISE VOLTAGE (nV/√Hz)
1000 VS = ±5V
100
10
0.2
tFALL = 0.9ns
0.1
0.0
tRISE = 0.923ns
-0.1
-0.2
1
10
100
1k
10k
-0.3
-20
100k
0
20
FREQUENCY (Hz)
FIGURE 31. EQUIVALENT NOISE VOLTAGE vs FREQUENCY
3
6.0
VS = ±5V
AV = +5
RG = 25Ω
RL = 500Ω
CL = 5pF
VOUT = 4.0V
5.8
SUPPLY CURRENT (mA)
AMPLITUDE (V)
4
2
1
tFALL = 1.167ns
0
tRISE = 1.243ns
-1
-2
40
60 80 100 120 140 160
TIME (ns)
0
-10
-20
-30
-40
-50
5.4
5.2
5.0
4.8
4.6
Please note that the curve showed
positive Current. The negative current
was almost the same.
4.4
40
35
f1 = 1dBm
@ 0.95MHz
2f2-f1 = -77.0dBm
@ 1.15MHz
6.0
30
25
20
15
-80
10
-90
5
-100
0.8M
5.5
VS = ±5V
AV = +5
RF = 1600Ω
RL = 100Ω
CL = 12pF
45
f2 = 1dBm
@ 1.05MHz
2f1-f2 = -76.8dBm
-60 @ 0.85MHz
-70
3.5
4.0
4.5
5.0
SUPPLY VOLTAGE (V)
50
ΔIM = (1) - (-77) = 78dB
IP3 = 1+ (78/2) = 40dBm
VS = ±5V
AV = +5
RF = 1600Ω
RL = 100Ω
CL = 12pF
3.0
FIGURE 34. SUPPLY CURRENT vs SUPPLY VOLTAGE
IP3 (dBm)
20
FIGURE 33. LARGE SIGNAL STEP RESPONSE RISE AND
FALL TIME
10
5.6
4.0
2.5
-3
0
60 80 100 120 140 160
TIME (ns)
AV = +1
RF = 0
RL = 500Ω
CL = 3.3pF
4.2
-20
40
FIGURE 32. SMALL SIGNAL STEP RESPONSE RISE AND
FALL TIME
5
AMPLITUDE (dBm)
RL = 500Ω
CL = 3.3pF
VOUT = 400mV
0
0.9M
1.0M
FREQUENCY (Hz)
1.1M
1.2M
FIGURE 35. THIRD ORDER IMD INTERCEPT (IP3)
11
1M
10M
FREQUENCY (Hz)
100M
FIGURE 36. THIRD ORDER IMD INTERCEPT vs FREQUENCY
FN7331.8
January 17, 2008
EL5102, EL5103, EL5202, EL5203, EL5302
Typical Performance Curves
(Continued)
JEDEC JESD51-7 HIGH EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD
JEDEC JESD51-7 HIGH EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD
1.4
1.0 1.087W
M
θ
JA
=
0.8
0.6
543mW
θJ
0.4
POWER DISSIPATION (W)
POWER DISSIPATION (W)
1.2
SO
P8
/1
+1
0
15
°C
/W
SO
A =+
0.2
T2 3
- 5/6
230
°C/
W
1.2 1.136W
SO8
θJA = +110°C/W
1.0 1.116W
0.8
QSOP16
θJA = +112°C/W
0.6
0.4
0.2
0
0
0
25
75 85 100
50
125
0
150
25
50
75 85 100
125
150
AMBIENT TEMPERATURE (°C)
AMBIENT TEMPERATURE (°C)
FIGURE 37. PACKAGE POWER DISSIPATION vs AMBIENT
TEMPERATURE
FIGURE 38. PACKAGE POWER DISSIPATION vs AMBIENT
TEMPERATURE
JEDEC JESD51-3 LOW EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD
JEDEC JESD51-3 LOW EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD
0.7
1.0
0.6
MSOP8/10
θJA = +206°C/W
488mW
0.5
POWER DISSIPATION (W)
POWER DISSIPATION (W)
607mW
0.4
SOT23-5/6
θJA = +256°C/W
0.3
0.2
0.1
0
0
25
75 85 100
50
125
150
AMBIENT TEMPERATURE (°C)
FIGURE 39. PACKAGE POWER DISSIPATION vs AMBIENT
TEMPERATURE
12
791mW
0.8
QSOP16
θJA = +158°C/W
781mW
0.6
SO8
θJA = +160°C/W
0.4
0.2
0
0
25
50
75 85 100
125
150
AMBIENT TEMPERATURE (°C)
FIGURE 40. PACKAGE POWER DISSIPATION vs AMBIENT
TEMPERATURE
FN7331.8
January 17, 2008
EL5102, EL5103, EL5202, EL5203, EL5302
SOT-23 Package Family
MDP0038
e1
D
SOT-23 PACKAGE FAMILY
A
MILLIMETERS
6
N
SYMBOL
4
E1
2
E
3
0.15 C D
1
2X
2
3
0.20 C
5
2X
e
0.20 M C A-B D
B
b
NX
0.15 C A-B
1
3
SOT23-5
SOT23-6
A
1.45
1.45
MAX
A1
0.10
0.10
±0.05
A2
1.14
1.14
±0.15
b
0.40
0.40
±0.05
c
0.14
0.14
±0.06
D
2.90
2.90
Basic
E
2.80
2.80
Basic
E1
1.60
1.60
Basic
e
0.95
0.95
Basic
e1
1.90
1.90
Basic
L
0.45
0.45
±0.10
L1
0.60
0.60
Reference
N
5
6
Reference
D
2X
TOLERANCE
Rev. F 2/07
NOTES:
C
A2
2. Plastic interlead protrusions of 0.25mm maximum per side are not
included.
SEATING
PLANE
A1
0.10 C
1. Plastic or metal protrusions of 0.25mm maximum per side are not
included.
3. This dimension is measured at Datum Plane “H”.
4. Dimensioning and tolerancing per ASME Y14.5M-1994.
NX
5. Index area - Pin #1 I.D. will be located within the indicated zone
(SOT23-6 only).
(L1)
6. SOT23-5 version has no center lead (shown as a dashed line).
H
A
GAUGE
PLANE
c
L
13
0.25
0° +3°
-0°
FN7331.8
January 17, 2008
EL5102, EL5103, EL5202, EL5203, EL5302
Quarter Size Outline Plastic Packages Family (QSOP)
MDP0040
A
QUARTER SIZE OUTLINE PLASTIC PACKAGES FAMILY
D
(N/2)+1
N
INCHES
SYMBOL QSOP16 QSOP24 QSOP28 TOLERANCE NOTES
E
PIN #1
I.D. MARK
E1
1
(N/2)
A
0.068
0.068
0.068
Max.
-
A1
0.006
0.006
0.006
±0.002
-
A2
0.056
0.056
0.056
±0.004
-
b
0.010
0.010
0.010
±0.002
-
c
0.008
0.008
0.008
±0.001
-
D
0.193
0.341
0.390
±0.004
1, 3
E
0.236
0.236
0.236
±0.008
-
E1
0.154
0.154
0.154
±0.004
2, 3
e
0.025
0.025
0.025
Basic
-
L
0.025
0.025
0.025
±0.009
-
L1
0.041
0.041
0.041
Basic
-
N
16
24
28
Reference
-
B
0.010
C A B
e
H
C
SEATING
PLANE
0.007
0.004 C
b
C A B
Rev. F 2/07
NOTES:
L1
A
1. Plastic or metal protrusions of 0.006” maximum per side are not
included.
2. Plastic interlead protrusions of 0.010” maximum per side are not
included.
c
SEE DETAIL "X"
3. Dimensions “D” and “E1” are measured at Datum Plane “H”.
4. Dimensioning and tolerancing per ASME Y14.5M-1994.
0.010
A2
GAUGE
PLANE
L
A1
4°±4°
DETAIL X
14
FN7331.8
January 17, 2008
EL5102, EL5103, EL5202, EL5203, EL5302
Small Outline Package Family (SO)
A
D
h X 45°
(N/2)+1
N
A
PIN #1
I.D. MARK
E1
E
c
SEE DETAIL “X”
1
(N/2)
B
L1
0.010 M C A B
e
H
C
A2
GAUGE
PLANE
SEATING
PLANE
A1
0.004 C
0.010 M C A B
L
b
0.010
4° ±4°
DETAIL X
MDP0027
SMALL OUTLINE PACKAGE FAMILY (SO)
INCHES
SYMBOL
SO-14
SO16 (0.300”)
(SOL-16)
SO20
(SOL-20)
SO24
(SOL-24)
SO28
(SOL-28)
TOLERANCE
NOTES
A
0.068
0.068
0.068
0.104
0.104
0.104
0.104
MAX
-
A1
0.006
0.006
0.006
0.007
0.007
0.007
0.007
±0.003
-
A2
0.057
0.057
0.057
0.092
0.092
0.092
0.092
±0.002
-
b
0.017
0.017
0.017
0.017
0.017
0.017
0.017
±0.003
-
c
0.009
0.009
0.009
0.011
0.011
0.011
0.011
±0.001
-
D
0.193
0.341
0.390
0.406
0.504
0.606
0.704
±0.004
1, 3
E
0.236
0.236
0.236
0.406
0.406
0.406
0.406
±0.008
-
E1
0.154
0.154
0.154
0.295
0.295
0.295
0.295
±0.004
2, 3
e
0.050
0.050
0.050
0.050
0.050
0.050
0.050
Basic
-
L
0.025
0.025
0.025
0.030
0.030
0.030
0.030
±0.009
-
L1
0.041
0.041
0.041
0.056
0.056
0.056
0.056
Basic
-
h
0.013
0.013
0.013
0.020
0.020
0.020
0.020
Reference
-
16
20
24
28
Reference
-
N
SO-8
SO16
(0.150”)
8
14
16
Rev. M 2/07
NOTES:
1. Plastic or metal protrusions of 0.006” maximum per side are not included.
2. Plastic interlead protrusions of 0.010” maximum per side are not included.
3. Dimensions “D” and “E1” are measured at Datum Plane “H”.
4. Dimensioning and tolerancing per ASME Y14.5M-1994
15
FN7331.8
January 17, 2008
EL5102, EL5103, EL5202, EL5203, EL5302
Small Outline Transistor Plastic Packages (SC70-5)
P5.049
D
VIEW C
e1
5 LEAD SMALL OUTLINE TRANSISTOR PLASTIC PACKAGE
INCHES
5
SYMBOL
4
E
CL
1
2
CL
3
e
E1
b
CL
0.20 (0.008) M
C
C
CL
A
A2
SEATING
PLANE
A1
-C-
PLATING
b1
0.043
0.80
1.10
-
0.004
0.00
0.10
-
A2
0.031
0.039
0.80
1.00
-
b
0.006
0.012
0.15
0.30
-
b1
0.006
0.010
0.15
0.25
c
0.003
0.009
0.08
0.22
6
c1
0.003
0.009
0.08
0.20
6
D
0.073
0.085
1.85
2.15
3
E
0.071
0.094
1.80
2.40
-
E1
0.045
0.053
1.15
1.35
3
e
0.0256 Ref
0.65 Ref
-
e1
0.0512 Ref
1.30 Ref
-
L2
c1
NOTES
0.031
0.010
0.018
0.017 Ref.
0.26
0.46
4
0.420 Ref.
0.006 BSC
0o
N
c
MAX
0.000
α
WITH
MIN
A
L
b
MILLIMETERS
MAX
A1
L1
0.10 (0.004) C
MIN
-
0.15 BSC
8o
0o
5
8o
-
5
5
R
0.004
-
0.10
-
R1
0.004
0.010
0.15
0.25
Rev. 3 7/07
NOTES:
BASE METAL
1. Dimensioning and tolerances per ASME Y14.5M-1994.
2. Package conforms to EIAJ SC70 and JEDEC MO-203AA.
4X θ1
3. Dimensions D and E1 are exclusive of mold flash, protrusions,
or gate burrs.
R1
4. Footlength L measured at reference to gauge plane.
5. “N” is the number of terminal positions.
R
GAUGE PLANE
SEATING
PLANE
L
C
L1
α
L2
6. These Dimensions apply to the flat section of the lead between
0.08mm and 0.15mm from the lead tip.
7. Controlling dimension: MILLIMETER. Converted inch dimensions are for reference only.
4X θ1
VIEW C
0.4mm
0.75mm
2.1mm
0.65mm
TYPICAL RECOMMENDED LAND PATTERN
16
FN7331.8
January 17, 2008
EL5102, EL5103, EL5202, EL5203, EL5302
Mini SO Package Family (MSOP)
0.25 M C A B
D
MINI SO PACKAGE FAMILY
(N/2)+1
N
E
MDP0043
A
E1
MILLIMETERS
PIN #1
I.D.
1
B
(N/2)
e
H
C
SEATING
PLANE
0.10 C
N LEADS
SYMBOL
MSOP8
MSOP10
TOLERANCE
NOTES
A
1.10
1.10
Max.
-
A1
0.10
0.10
±0.05
-
A2
0.86
0.86
±0.09
-
b
0.33
0.23
+0.07/-0.08
-
c
0.18
0.18
±0.05
-
D
3.00
3.00
±0.10
1, 3
E
4.90
4.90
±0.15
-
E1
3.00
3.00
±0.10
2, 3
e
0.65
0.50
Basic
-
L
0.55
0.55
±0.15
-
L1
0.95
0.95
Basic
-
N
8
10
Reference
-
0.08 M C A B
b
Rev. D 2/07
NOTES:
1. Plastic or metal protrusions of 0.15mm maximum per side are not
included.
L1
2. Plastic interlead protrusions of 0.25mm maximum per side are
not included.
A
3. Dimensions “D” and “E1” are measured at Datum Plane “H”.
4. Dimensioning and tolerancing per ASME Y14.5M-1994.
c
SEE DETAIL "X"
A2
GAUGE
PLANE
L
A1
0.25
3° ±3°
DETAIL X
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
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17
FN7331.8
January 17, 2008
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