DS75176B, DS75176BT www.ti.com SNLS381C – JULY 1998 – REVISED APRIL 2013 DS75176B/DS75176BT Multipoint RS-485/RS-422 Transceivers Check for Samples: DS75176B, DS75176BT FEATURES DESCRIPTION • The DS75176B is a high speed differential TRISTATE®bus/line transceiver designed to meet the requirements of EIA standard RS485 with extended common mode range (+12V to −7V), for multipoint data transmission. In addition, it is compatible with RS-422. 1 23 • • • • • • • • • Meets EIA Standard RS485 for Multipoint Bus Transmission and is Compatible with RS-422. Small Outline (SOIC) Package Option Available for Minimum Board Space. 22 ns Driver Propagation Delays. Single +5V Supply. −7V to +12V Bus Common Mode Range Permits ±7V Ground Difference Between Devices on the Bus. Thermal Shutdown Protection. High Impedance to Bus with Driver in TRISTATE or with Power Off, Over the Entire Common Mode Range Allows the Unused Devices on the Bus to be Powered Down. Pin Out Compatible with DS3695/A and SN75176A/B. Combined Impedance of a Driver Output and Receiver Input is Less Than One RS485 Unit Load, Allowing up to 32 Transceivers on the Bus. 70 mV Typical Receiver Hysteresis. The driver and receiver outputs feature TRI-STATE capability, for the driver outputs over the entire common mode range of +12V to −7V. Bus contention or fault situations that cause excessive power dissipation within the device are handled by a thermal shutdown circuit, which forces the driver outputs into the high impedance state. DC specifications are guaranteed over the 0 to 70°C temperature and 4.75V to 5.25V supply voltage range. Connection and Logic Diagram Figure 1. Top View See Package Number P0008E or D0008A These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 1 2 3 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. TRI-STATE is a registered trademark of Texas Instruments. All other trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 1998–2013, Texas Instruments Incorporated DS75176B, DS75176BT SNLS381C – JULY 1998 – REVISED APRIL 2013 Absolute Maximum Ratings www.ti.com (1) (2) Supply Voltage, VCC 7V Control Input Voltages 7V Driver Input Voltage 7V Driver Output Voltages +15V/ −10V Receiver Input Voltages (DS75176B) +15V/ −10V Receiver Output Voltage 5.5V Continuous Power Dissipation @ 25°C for SOIC Package 675 mW (3) for PDIP Package 900 mW (4) −65°C to +150°C Storage Temperature Range Lead Temperature (Soldering, 4 seconds) 260°C ESD Rating (HBM) (1) 500V “Absolute Maximum Ratings” are those beyond which the safety of the device cannot be verified. They are not meant to imply that the device should be operated at these limits. The tables of “Electrical Characteristics” provide conditions for actual device operation. If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications. Derate linearly @ 6.11 mW/°C to 400 mW at 70°C. Derate linearly at 5.56 mW/°C to 650 mW at 70°C. (2) (3) (4) Recommended Operating Conditions Supply Voltage, VCC Voltage at Any Bus Terminal (Separate or Common Mode) Min Max Units 4.75 5.25 V −7 +12 V 0 +70 °C −40 +85 °C −12 +12 V Operating Free Air Temperature TA DS75176B DS75176BT Differential Input Voltage, VID (1) (1) Differential - Input/Output bus voltage is measured at the noninverting terminal A with respect to the inverting terminal B. Electrical Characteristics (1) (2) 0°C ≤ TA≤ 70°C, 4.75V < VCC< 5.25V unless otherwise specified Symbol Parameter Conditions VOD1 Differential Driver Output Voltage (Unloaded) IO = 0 VOD2 Differential Driver Output Voltage (with Load) See (Figure 2) ΔVOD Min Typ Max 5 R = 50Ω; (RS-422) (3) R = 27Ω; (RS-485) Units V 2 V 1.5 V Change in Magnitude of Driver Differential Output Voltage For 0.2 V 3.0 V 0.2 V Complementary Output States VOC Driver Common Mode Output Voltage Δ|VOC| Change in Magnitude of Driver See (Figure 2) R = 27Ω Common Mode Output Voltage For Complementary Output States (1) (2) (3) 2 All currents into device pins are positive; all currents out of device pins are negative. All voltages are referenced to device ground unless otherwise specified. All typicals are given for VCC = 5V and TA = 25°C. All worst case parameters for which this note is applied, must be increased by 10% for DS75176BT. The other parameters remain valid for −40°C < TA < +85°C. Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: DS75176B DS75176BT DS75176B, DS75176BT www.ti.com SNLS381C – JULY 1998 – REVISED APRIL 2013 Electrical Characteristics (1) (2) (continued) 0°C ≤ TA≤ 70°C, 4.75V < VCC< 5.25V unless otherwise specified Symbol Parameter VIH Input High Voltage VIL Input Low Voltage VCL Input Clamp Voltage IIL Input Low Current IIH Input High Current IIN Input Current Conditions V 0.8 DI, DE, RE , E DO/RI, DO/RI −1.5 VIL = 0.4V −200 μA VIH = 2.4V 20 μA VIN = 12V +1.0 mA DE = 0V VIN = −7V −0.8 mA +0.2 V −7V ≤ VCM ≤ + 12V ΔVTH Receiver Input Hysteresis VCM = 0V VOH Receiver Output High Voltage IOH = −400 μA RO IIN = −18 mA VCC = 0V or 5.25V Differential Input Threshold Voltage for Receiver −0. 2 70 IOL = 16 mA Output Low Voltage OFF-State (High Impedance) VCC = Max Output Current at Receiver 0.4V ≤ VO ≤ 2.4V RIN Receiver Input Resistance −7V ≤ VCM ≤ +12V ICC Supply Current No Load (3) 0.5 V ±20 μA Driver Outputs Enabled 55 mA Driver Outputs Disabled 35 mA −250 mA +250 mA −85 mA 12 (3) VO = −7V Output Current VO = +12V Receiver Short-Circuit VO = 0V V (3) IOZR Driver Short-Circuit mV 2.7 VOL IOSR Units 2 VTH IOSD Min Typ Max (3) kΩ −15 Output Current Switching Characteristics VCC = 5.0V, TA = 25°C Typ Max Units tPLH Symbol Driver Input to Output Parameter RLDIFF = 60Ω Conditions Min 12 22 ns tPHL Driver Input to Output CL1 = CL2 = 100 pF 17 22 ns tr Driver Rise Time RLDIFF = 60Ω 18 ns tf Driver Fall Time CL1 =CL2 = 100 pF 18 ns tZH Driver Enable to Output High CL = 100 pF (Figure 5 and Figure 7) S1 Open 29 100 ns tZL Driver Enable to Output Low CL = 100 pF (Figure 5 and Figure 7) S2 Open 31 60 ns tLZ Driver Disable Time from Low CL = 15 pF (Figure 5 and Figure 7) S2 Open 13 30 ns tHZ Driver Disable Time from High CL = 15 pF (Figure 5 and Figure 7) S1 Open 19 200 ns tPLH Receiver Input to Output 37 ns Receiver Input to Output CL = 15 pF (Figure 3 and Figure 8) S1 and S2 Closed 30 tPHL 32 37 ns tZL Receiver Enable to Output Low CL = 15 pF (Figure 3 and Figure 9) S2 Open 15 20 ns tZH Receiver Enable to Output High CL = 15 pF (Figure 3 and Figure 9) S1 Open 11 20 ns tLZ Receiver Disable from Low CL = 15 pF (Figure 3 and Figure 9) S2 Open 28 32 ns tHZ Receiver Disable from High CL = 15 pF (Figure 3 and Figure 9) S1 Open 13 35 ns (Figure 4 and Figure 6) Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: DS75176B DS75176BT Submit Documentation Feedback 3 DS75176B, DS75176BT SNLS381C – JULY 1998 – REVISED APRIL 2013 www.ti.com AC TEST CIRCUITS Note: S1 and S2 of load circuit are closed except as otherwise mentioned. Figure 2. Figure 3. Note: Unless otherwise specified the switches are closed. Figure 4. Figure 5. Switching Time Waveforms Figure 6. Driver Propagation Delays and Transition Times Figure 7. Driver Enable and Disable Times 4 Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: DS75176B DS75176BT DS75176B, DS75176BT www.ti.com SNLS381C – JULY 1998 – REVISED APRIL 2013 Note: Differential input voltage may may be realized by grounding RI and pulsing RI between +2.5V and −2.5V Figure 8. Receiver Propagation Delays Figure 9. Receiver Enable and Disable Times Function Tables Table 1. DS75176B Transmitting (1) Inputs (1) Line Condition Outputs RE DE DI DO DO X 1 1 No Fault 0 1 X 1 0 No Fault 1 0 X 0 X X Z Z X 1 X Fault Z Z X — Don't care condition Z — High impedance state Fault — Improper line conditons causing excessive power dissipation in the driver, such as shorts or bus contention situations **This is a fail safe condition Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: DS75176B DS75176BT Submit Documentation Feedback 5 DS75176B, DS75176BT SNLS381C – JULY 1998 – REVISED APRIL 2013 www.ti.com Table 2. DS75176B Receiving (1) Inputs (1) Outputs RE DE RI-RI RO 0 0 ≥ +0.2V 1 0 0 ≤ −0.2V 0 0 0 Inputs Open** 1 1 0 X Z X — Don't care condition Z — High impedance state Fault — Improper line conditons causing excessive power dissipation in the driver, such as shorts or bus contention situations **This is a fail safe condition TYPICAL APPLICATION 6 Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: DS75176B DS75176BT DS75176B, DS75176BT www.ti.com SNLS381C – JULY 1998 – REVISED APRIL 2013 REVISION HISTORY Changes from Revision B (April 2013) to Revision C • Page Changed layout of National Data Sheet to TI format ............................................................................................................ 6 Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: DS75176B DS75176BT Submit Documentation Feedback 7 PACKAGE OPTION ADDENDUM www.ti.com 15-Apr-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) (4) DS75176BM ACTIVE SOIC D 8 95 TBD Call TI Call TI 0 to 70 DS751 76BM DS75176BM/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 DS751 76BM DS75176BMX ACTIVE SOIC D 8 2500 TBD Call TI Call TI 0 to 70 DS751 76BM DS75176BMX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 DS751 76BM DS75176BN ACTIVE PDIP P 8 40 TBD Call TI Call TI 0 to 70 DS75176BN DS75176BN/NOPB ACTIVE PDIP P 8 40 Green (RoHS & no Sb/Br) Call TI Level-1-NA-UNLIM 0 to 70 DS75176BN DS75176BTM ACTIVE SOIC D 8 95 TBD Call TI Call TI -40 to 85 DS751 76BTM DS75176BTM/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 DS751 76BTM DS75176BTMX ACTIVE SOIC D 8 2500 TBD Call TI Call TI -40 to 85 DS751 76BTM DS75176BTMX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 DS751 76BTM DS75176BTN ACTIVE PDIP P 8 40 TBD Call TI Call TI -40 to 85 DS75176 BTN DS75176BTN/NOPB ACTIVE PDIP P 8 40 Green (RoHS & no Sb/Br) Call TI Level-1-NA-UNLIM -40 to 85 DS75176 BTN (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 15-Apr-2013 Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Top-Side Marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. 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Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 24-Apr-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant DS75176BMX SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 DS75176BMX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 DS75176BTMX SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 DS75176BTMX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 24-Apr-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) DS75176BMX SOIC D 8 2500 349.0 337.0 45.0 DS75176BMX/NOPB SOIC D 8 2500 349.0 337.0 45.0 DS75176BTMX SOIC D 8 2500 349.0 337.0 45.0 DS75176BTMX/NOPB SOIC D 8 2500 349.0 337.0 45.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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