CPC3980 N-Channel Depletion-Mode Vertical DMOS FET INTEGRATED CIRCUITS DIVISION BVDSX/ BVDGX 800V RDS(on) (max) 45 IDSS (min) 100mA Features • • • • • High Breakdown Voltage: 800V Low On-Resistance: 45 max. at 25ºC Low VGS(off) Voltage: -1.4 to -3.1V High Input Impedance Small Package Size: SOT-223 Applications • • • • • • Normally-On Switches Solid State Relays Converters Telecommunications Power Supply Current Regulators Package SOT-223 Description The CPC3980 is an 800V, N-channel, depletion-mode, Field Effect Transistor (FET) created using IXYS Integrated Circuits Division’s proprietary vertical DMOS process. Yielding a robust device with high input impedance, this process enables world class, high voltage MOSFET performance with an economical silicon gate architecture. As with all MOS devices, the FET structure prevents thermal runaway and thermal-induced secondary breakdown, which makes the CPC3980 ideal for use in high-power applications. The CPC3980 is a highly reliable FET device that has been used extensively in IXYS Integrated Circuits Division’s Solid State Relays for industrial and telecommunications applications. The CPC3980 is available in the SOT-223 package. Ordering Information Part # CPC3980ZTR Package Pinout Description SOT-223: Tape and Reel (1000/Reel) Circuit Symbol D 1 4 2 D 3 G G D S S DS-CPC3980-R02 www.ixysic.com 1 INTEGRATED CIRCUITS DIVISION CPC3980 Absolute Maximum Ratings @ 25ºC Parameter Drain-to-Source Voltage Gate-to-Source Voltage Pulsed Drain Current Total Package Dissipation 1 Operational Temperature Junction Temperature, Maximum Storage Temperature 1 Ratings 800 ±15 150 1.8 -55 to +125 +125 -55 to +125 Units V V mA W ºC ºC ºC Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Mounted on 1"x1" 2 oz. Copper FR4 board. Electrical Characteristics @ 25ºC (Unless Otherwise Noted) Source-Drain Diode Voltage Drop Thermal Resistance Junction to Ambient Junction to Case 2 Symbol BVDSX VGS(off) dVGS(off) /dT IGSS ID(off) IDSS RDS(on) dRDS(on) /dT Gfs CISS COSS CRSS Conditions VGS= -5.5V, ID=100µA VDS= 15V, ID=1A VDS= 15V, ID=1A VGS=±15V, VDS=0V VGS= -5.5V, VDS=800V VGS= 0V, VDS=15V VGS= 0V, ID=100mA, VDS=10V ID= 50mA, VDS = 10V VGS= -3.5V Min 800 -1.4 100 100 Typ 115 5 3 Max -3.1 4.5 100 1 45 2.5 - Units V V mV/ºC nA µA mA %/ºC m - pF Parameter Drain-to-Source Breakdown Voltage Gate-to-Source Off Voltage Change in VGS(off) with Temperature Gate Body Leakage Current Drain-to-Source Leakage Current Saturated Drain-to-Source Current Static Drain-to-Source On-State Resistance Change in RDS(on) with Temperature Forward Transconductance Input Capacitance Common Source Output Capacitance Reverse Transfer Capacitance VDS= 25V - VSD f= 1MHz VGS= -5V, ISD=150mA - 0.72 1 V JA JC - - 55 23 - ºC/W www.ixysic.com R02 INTEGRATED CIRCUITS DIVISION CPC3980 PERFORMANCE DATA @25ºC (Unless Otherwise Noted)* Threshold Voltage vs. Temperature (ID=1PA, VDS=10V) -1.9 -2.0 -2.1 -50 -25 0 25 50 75 Temperature (ºC) 100 Forward Safe Operating Bias (VGS=0, DC Load) 1 50 40 30 1000 Limited by device RDS(on) Current (A) 60 20 -50 125 0.1 0.01 2.0 Power Dissipation (W) On-Resistance (:) -1.8 1.5 1.0 0.5 0.0 -25 0 25 50 75 Temperature (ºC) 100 0 125 Capacitance vs. Drain-Source Voltage (VGS=3.5V) 20 40 60 80 100 Temperature (ºC) 120 140 Output Characteristics 100 VGS= -1 Capacitance (pF) VTHRESHOLD (V) -1.7 70 100 Drain Current (mA) -1.6 Power Dissipation vs. Ambient Temperature On-Resistance vs. Temperature (ID=100mA, VGS=5V) CISS CRSS COSS 10 Limited by device channel saturation 80 60 VGS= -1.2 40 VGS= -1.4 20 VGS= -1.6 1 0.1 10 Voltage (V) 100 1000 0 On-Resistance vs. Drain Current (VGS=0V) 40 120 5 10 20 25 30 0 2 4 6 8 10 VDS (V) Input Admittance (VDS=10V) Transconductance vs. Drain Current (VDS=10V) 300 80 60 -40ºC 25ºC 55ºC 85ºC 250 85ºC 55ºC 25ºC -40ºC 35 30 15 VDS (V) 100 ID (mA) On-Resistance (:) 1 0 gm (mS) 0.001 200 150 40 100 20 50 25 20 0 20 40 60 ID (mA) 80 100 0 -2.5 0 -2.0 -1.5 VGS (V) -1.0 -0.5 0 20 40 60 ID (mA) 80 100 *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. R02 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION CPC3980 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Rating CPC3980Z MSL 1 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Reflow Profile This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020 must be observed. Device Maximum Temperature x Time CPC3980Z 260ºC for 30 seconds Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to remove flux residue is acceptable, and the use of a short drying bake may be necessary. Chlorine-based or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be used. 4 www.ixysic.com R02 INTEGRATED CIRCUITS DIVISION CPC3980 Mechanical Dimensions CPC3980Z 2.90 / 3.10 (0.114 / 0.122) PCB Land Pattern 0.229 / 0.330 (0.009 / 0.013) 1.90 (0.075) 6.705 / 7.290 (0.264 / 0.287) 3.30 / 3.71 (0.130 / 0.146) 1.499 / 1.981 (0.059 / 0.078) 3.20 (0.126) 6.10 (0.24) Pin 1 0.610 / 0.787 (0.024 / 0.031) 1.90 (0.075) 0.914 MIN (0.036 MIN) 2.286 (0.090) 6.30 / 6.71 (0.248 / 0.264) 0.020 / 0.102 (0.0008 / 0.004) 0.864 / 1.067 (0.034 / 0.042) 0.90 (0.035) 1.549 / 1.803 (0.061 / 0.071) 2.286 (0.090) Dimensions mm MIN / mm MAX (inches MIN / inches MAX) 4.597 (0.181) CPC3980ZTR Tape & Reel 177.8 Dia (7.00 Dia) 5.50 ± 0.05 (0.217 ± 0.002) Top Cover Tape Thickness 0.102 Max (0.004 Max) 2.00 ± 0.05 (0.079 ± 0.002) 4.00 ± 0.1 (0.157 ± 0.004) W=12.08 ± 0.2 (0.476 ± 0.008) B0=7.42 ± 0.1 (0.292 ± 0.004) K0=1.88 ± 0.1 (0.074 ± 0.004) Embossed Carrier 1.75 ± 0.1 (0.069 ± 0.004) A0=6.83 ± 0.1 (0.269 ± 0.004) P=8.03 ± 0.1 (0.316 ± 0.004) Embossment Dimensions mm (inches) For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. 5 Specification: DS-CPC3980-R02 ©Copyright 2015, IXYS Integrated Circuits Division All rights reserved. Printed in USA. 4/10/2015