TI1 DAC081C081CIMKX/NOPB 8-bit micro power digital-to-analog converter Datasheet

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DAC081C081, DAC081C085
SNAS449E – FEBRUARY 2008 – REVISED JANUARY 2016
DAC081C08x 8-Bit Micro Power Digital-to-Analog Converter With An I2C-Compatible
Interface
1 Features
3 Description
•
•
•
•
The DAC081C08x device is an 8-bit, single-channel,
voltage-output digital-to-analog converter (DAC) that
operates from a 2.7-V to 5.5-V supply. The output
amplifier allows rail-to-rail output swing and has an
4.5-µsec settling time. The DAC081C081 uses the
supply voltage as the reference to provide the widest
dynamic output range and typically consumes 132 µA
while operating at 5 V. It is available in 6-lead SOT
and WSON packages and provides three address
options (pin selectable).
1
•
•
•
•
•
•
•
•
•
Ensured Monotonicity to 8-bits
Low Power Operation: 156 µA Maximum at 3.3 V
Extended Power Supply Range (2.7 V to 5.5 V)
I2C-Compatible 2-Wire Interface Which Supports
Standard (100-kHz), Fast (400-kHz), and HighSpeed (3.4-MHz) Modes
Rail-to-Rail Voltage Output
Very Small Package
Resolution 8 Bits
INL ±0.6 LSB (Maximum)
DNL ±0.1 LSB (Maximum)
Settling Time 4.5 μs (Maximum)
Zero Code Error +10 mV (Maximum)
Full-Scale Error −0.7 %FS (Maximum)
Supply Power
– Normal
– 380 μW (3 V)
– 730 μW (5 V) Typical
– Power Down
– 0.5 μW (3 V)
– 0.9 μW (5 V) Typical
As an alternative, the DAC081C085 provides nine I2C
addressing options and uses an external reference. It
has the same performance and settling time as the
DAC081C081. It is available in an 8-lead VSSOP.
The DAC081C081 and DAC081C085 use a 2-wire,
I2C-compatible serial interface that operates in all
three speed modes, including high-speed mode (3.4
MHz). An external address selection pin allows up to
three DAC081C081 or nine DAC081C085 devices
per 2-wire bus. Pin-compatible alternatives to the
DAC081C081 are available that provide additional
address options.
Device Information(1)
PART NUMBER
DAC081C081
2 Applications
•
•
•
•
•
PACKAGE
DAC081C085
Industrial Process Control
Portable Instruments
Digital Gain and Offset Adjustments
Programmable Voltage and Current Sources
Test Equipment
BODY SIZE (NOM)
WSON (6)
2.20 mm × 2.50 mm
SOT (6)
1.60 mm × 2.90 mm
VSSOP (8)
3.00 mm × 3.00 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Block Diagram
VA*
VREF*
GND
DAC081C081 / DAC081C085
POWER-ON
RESET
REF
DAC
REGISTER
8 BIT DAC
VOUT
BUFFER
8
8
2.5k
100k
POWER-DOWN
CONTROL
LOGIC
2
I C
INTERFACE
* NOTE: ADR1 and VREF are for the DAC081C085 only. The DAC081C085 uses an external
reference (VREF), whereas, the DAC081C081 uses the supply (VA) as the reference.
ADR1* ADR0
SCL
SDA
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
DAC081C081, DAC081C085
SNAS449E – FEBRUARY 2008 – REVISED JANUARY 2016
www.ti.com
Table of Contents
1
2
3
4
5
6
7
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Description (continued).........................................
Pin Configuration and Functions .........................
Specifications.........................................................
7.1
7.2
7.3
7.4
7.5
7.6
7.7
8
1
1
1
2
3
4
5
Absolute Maximum Ratings ..................................... 5
ESD Ratings.............................................................. 5
Recommended Operating Conditions ...................... 6
Thermal Information .................................................. 6
Electrical Characteristics........................................... 7
AC and Timing Characteristics ............................... 10
Typical Characteristics ............................................ 13
Detailed Description ............................................ 16
8.1
8.2
8.3
8.4
Overview .................................................................
Functional Block Diagram .......................................
Feature Description.................................................
Device Functional Modes........................................
16
16
16
18
8.5 Programming........................................................... 18
8.6 Registers ................................................................. 22
9
Application and Implementation ........................ 23
9.1 Application Information............................................ 23
9.2 Typical Application ................................................. 25
10 Power Supply Recommendations ..................... 26
10.1
Using References as Power Supplies ................. 26
11 Layout................................................................... 29
11.1 Layout Guidelines ................................................. 29
11.2 Layout Example .................................................... 29
12 Device and Documentation Support ................. 30
12.1
12.2
12.3
12.4
12.5
12.6
Device Support ....................................................
Related Links ........................................................
Community Resources..........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
30
31
31
31
31
31
13 Mechanical, Packaging, and Orderable
Information ........................................................... 31
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision D (March 2013) to Revision E
Page
•
Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section. ................................................................................................ 1
•
Added addresses that the DAC responds to on the I2C bus. ............................................................................................. 20
Changes from Revision C (March 2013) to Revision D
•
2
Page
Changed layout of National Data Sheet to TI format ........................................................................................................... 29
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SNAS449E – FEBRUARY 2008 – REVISED JANUARY 2016
5 Description (continued)
The DAC081C081 and DAC081C085 each have a 16-bit register that controls the mode of operation, the powerdown condition, and the output voltage. A power-on reset circuit ensures that the DAC output powers up to zero
volts. A power-down feature reduces power consumption to less than a microWatt. Their low power consumption
and small packages make these DACs an excellent choice for use in battery-operated equipment. Each DAC
operates over the extended industrial temperature range of −40°C to +125°C.
The DAC081C081 and DAC081C085 are each part of a family of pin-compatible DACs that also provide 12- and
10-bit resolution. For 12-bit DACs see the DAC121C081 and DAC121C085. For 10-bit DACs see the
DAC101C081 and DAC101C085.
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6 Pin Configuration and Functions
NGF Package
6-Pin WSON
Top View
ADR0 1
6
DDC Package
6-Pin SOT
Top View
VOUT
SCL
2 WSON 5
VA
SDA
3
GND
4
VOUT
1
VA
2
GND
3
SOT
6
ADR0
5
SCL
4
SDA
DAC081C081
DAC081C081
DGK Package
8-Pin VSSOP
Top View
ADR0
1
8
VOUT
ADR1
2
7
VREF
SCL
3
6
VA
SDA
4
5
GND
VSSOP
DAC081C085
Pin Functions
PIN
NAME
WSON
SOT
VSSOP
ADR0
1
6
1
EQUIVALENT
CIRCUIT
TYPE
Digital Input,
three levels
V+
PIN
Snap
Back
D1
41.5k
2.1k
41.5k
DESCRIPTION
Tri-state Address Selection Input. Sets the two Least
Significant Bits (A1 and A0) of the 7-bit slave address.
(see Table 1)
ADR1
—
—
2
Digital Input,
three levels
GND
4
3
5
Ground
Ground for all on-chip circuitry.
PAD
(WSON
only)
—
—
Ground
Exposed die attach pad can be connected to ground
or left floating. Soldering the pad to the PCB offers
optimal thermal performance and enhances package
self-alignment during reflow.
SCL
2
5
3
Digital Input
Serial Clock Input. SCL is used together with SDA to
control the transfer of data in and out of the device.
GND
PIN
SDA
3
4
4
Digital
Input/Output
Snap
Back
D1
GND
Tri-state Address Selection Input. Sets Bits A6 and A3
of the 7-bit slave address. (see Table 1)
Serial Data bidirectional connection. Data is clocked
into or out of the internal 16-bit register relative to the
clock edges of SCL. This is an open drain data line
that must be pulled to the supply (VA) by an external
pullup resistor.
VA
5
2
6
Supply
Power supply input. For the SOT and WSON versions,
this supply is used as the reference. Must be
decoupled to GND.
VOUT
6
1
8
Analog
Output
Analog Output Voltage
VREF
—
—
7
Supply
Unbufferred reference voltage. For the VSSOP-8, this
supply is used as the reference. VREF must be free of
noise and decoupled to GND.
4
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SNAS449E – FEBRUARY 2008 – REVISED JANUARY 2016
7 Specifications
7.1 Absolute Maximum Ratings
See
(1) (2) (3)
MIN
MAX
UNIT
Supply voltage, VA
−0.3
6.5
V
Voltage on any Input Pin
−0.3
Input current at any pin (4)
Package input current (4)
Power consumption at TA = 25°C
See
Junction temperature
−65
Storage temperature, Tstg
(1)
(2)
(3)
(4)
(5)
6.5
V
±10
mA
±20
mA
150
°C
150
°C
(5)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltages are measured with respect to GND = 0 V, unless otherwise specified.
If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.
When the input voltage at any pin exceeds 5.5 V or is less than GND, the current at that pin should be limited to 10 mA. The 20-mA
maximum package input current rating limits the number of pins that can safely exceed the power supplies with an input current of 10
mA to two.
The absolute maximum junction temperature (TJmax) for this device is 150°C. The maximum allowable power dissipation is dictated by
TJmax, the junction-to-ambient thermal resistance (RθJA), and the ambient temperature (TA), and can be calculated using the formula
PDMAX = (TJmax − TA) / RθJA. The values for maximum power dissipation will be reached only when the device is operated in a severe
fault condition (for example, when input or output pins are driven beyond the operating ratings, or the power supply polarity is reversed).
7.2 ESD Ratings
VALUE
UNIT
DAC081C081 in NGF Package
Human-body model (HBM), per
ANSI/ESDA/JEDEC JS-001
V(ESD)
Electrostatic discharge
All pins except 2 and 3
±2500
Pins 2 and 3
±5000
Charged-device model (CDM), per JEDEC All pins except 2 and 3
specification JESD22-C101
Pins 2 and 3
±1000
All pins except 2 and 3
±250
Pins 2 and 3
±350
All pins except 4 and 5
±2500
Pins 4 and 5
±5000
Machine model (MM)
±1000
V
DAC081C081 in DDC Package
Human-body model (HBM), per
ANSI/ESDA/JEDEC JS-001
V(ESD)
Electrostatic discharge
Charged-device model (CDM), per JEDEC All pins except 4 and 5
specification JESD22-C101
Pins 4 and 5
±1000
All pins except 4 and 5
±250
Pins 4 and 5
±350
All pins except 3 and 4
±2500
Pins 3 and 4
±5000
Machine model (MM)
±1000
V
DAC081C085 in DGK Package
Human-body model (HBM), per
ANSI/ESDA/JEDEC JS-001
V(ESD)
Electrostatic discharge
Charged-device model (CDM), per JEDEC All pins except 3 and 4
specification JESD22-C101
Pins 3 and 4
±1000
All pins except 3 and 4
±250
Pins 3 and 4
±350
Machine model (MM)
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±1000
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V
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7.3 Recommended Operating Conditions
(1)
See
MIN
NOM
MAX
UNIT
−40
TA
Operating Temperature
Supply Voltage, VA
Reference Voltage, VREFIN
125
°C
2.7
5.5
V
1
VA
V
5.5
V
1500
pF
Digital Input Voltage (2)
Output Load
(1)
(2)
0
All voltages are measured with respect to GND = 0 V, unless otherwise specified.
The inputs are protected as shown below. Input voltage magnitudes up to 5.5 V, regardless of VA, will not cause errors in the conversion
result. For example, if VA is 3 V, the digital input pins can be driven with a 5V logic device.
I/O
TO INTERNAL
CIRCUITRY
GND
7.4 Thermal Information
DAC081C081
THERMAL METRIC (1) (2)
RθJA
(1)
(2)
6
Junction-to-ambient thermal resistance
DAC081C085
NGF (WSON)
DDC (SOT)
DGK (VSSOP)
6 PINS
6 PINS
8 PINS
190
250
240
UNIT
°C/W
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
Soldering process must comply with Reflow Temperature Profile specifications. Refer to http://www.ti.com/packaging.
Reflow temperature profiles are different for lead-free packages.
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7.5 Electrical Characteristics
The following specifications apply for VA = 2.7 V to 5.5 V, VREF = VA, CL = 200 pF to GND, input code range 3 to 252. All
Maximum and Minimum limits apply for TMIN ≤ TA ≤ TMAX and all Typical limits are at TA = 25°C, unless otherwise specified.
PARAMETER
TEST CONDITIONS
MIN
TYP (1)
MAX (1)
UNIT
STATIC PERFORMANCE
INL
Resolution
8
Monotonicity
8
Bits
Bits
0.14
Integral non-linearity
−0.6
−0.14
−0.1
−0.02
0.04
0.6
LSB
LSB
0.1
LSB
DNL
Differential non-linearity
ZE
Zero code error
IOUT = 0
1.1
10
FSE
Full-scale error
IOUT = 0
−0.1
−0.7
%FSR
GE
Gain error
All ones loaded to DAC register
−0.2
−0.7
%FSR
ZCED
Zero code error drift
TC GE
Gain error tempco
LSB
mV
−20
µV/°C
VA = 3 V
−0.7
ppm FSR/°C
VA = 5 V
−1
ppm FSR/°C
ANALOG OUTPUT CHARACTERISTICS (VOUT)
Output voltage range (2)
ZCO
Zero code output
FSO
Full-scale output
Output short circuit current
(ISOURCE)
IOS
Output short circuit current
(ISINK)
IOS
IO
Continuous output
current (2)
CL
Maximum load capacitance
ZOUT
DC output impedance
(1)
(2)
DAC081C085
0
DAC081C081
0
VREF
VA
V
V
VA = 3 V, IOUT = 200 µA
1.3
mV
VA = 5 V, IOUT = 200 µA
7
mV
VA = 3 V, IOUT = 200 µA
2.984
V
VA = 5 V, IOUT = 200 µA
4.989
V
VA = 3 V, VOUT = 0 V, input code =
FFFh.
56
mA
VA = 5 V, VOUT = 0 V, input code =
FFFh.
69
mA
VA = 3 V, VOUT = 3 V, input code =
000h.
−52
mA
VA = 5 V, VOUT = 5 V, input code =
000h.
−75
mA
Available on the DAC output
11
mA
RL = ∞
1500
pF
RL = 2kΩ
1500
pF
7.5
Ω
Typical figures are at TJ = 25°C, and represent most likely parametric norms. Test limits are specified to TI's AOQL (Average Outgoing
Quality Level).
This parameter is ensured by design and/or characterization and is not tested in production.
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Electrical Characteristics (continued)
The following specifications apply for VA = 2.7 V to 5.5 V, VREF = VA, CL = 200 pF to GND, input code range 3 to 252. All
Maximum and Minimum limits apply for TMIN ≤ TA ≤ TMAX and all Typical limits are at TA = 25°C, unless otherwise specified.
PARAMETER
TEST CONDITIONS
MIN
TYP (1)
1
0.2
MAX (1)
UNIT
REFERENCE INPUT CHARACTERISTICS- (DAC081C085 only)
Input range minimum
VREF
Input range maximum
V
VA
Input impedance
120
V
kΩ
LOGIC INPUT CHARACTERISTICS (SCL, SDA)
VIH
Input high voltage
VIL
Input low voltage
IIN
Input current
CIN
Input pin capacitance (2)
VHYST
Input hysteresis
0.7 × VA
V
0.3 × VA
V
±1
µA
3
pF
0.1 × VA
V
LOGIC INPUT CHARACTERISTICS (ADR0, ADR1)
VIH
Input high voltage
VIL
Input low voltage
VA – 0.5
0.5
V
V
IIN
Input current
±1
µA
ISINK = 3 mA
0.4
V
ISINK = 6 mA
0.6
V
±1
µA
LOGIC OUTPUT CHARACTERISTICS (SDA)
VOL
Output low voltage
IOZ
High-impedence output
leakage current
POWER REQUIREMENTS
Supply voltage minimum
VA
2.7
Supply voltage maximum
5.5
V
NORMAL -- VOUT SET TO MIDSCALE. 2-WIRE INTERFACE QUIET (SCL = SDA = VA) (OUTPUT UNLOADED)
IST_VA-1
VA = 2.7 V to 3.6 V
105
156
µA
VA = 4.5 V to 5.5 V
132
214
µA
VA = 2.7 V to 3.6 V
86
118
µA
VA = 4.5 V to 5.5 V
98
152
µA
VREF supply current
(DAC081C085 only)
VA = 2.7 V to 3.6 V
37
43
µA
53
61
Power consumption
(VA & VREF for DAC081C085)
VA = 3 V
380
µW
VA = 5 V
730
µW
VA DAC081C081 supply current
IST_VA-5
VA DAC081C085 supply current
IST_VREF
PST
VA = 4.5 V to 5.5 V
µA
CONTINUOUS OPERATION -- 2-WIRE INTERFACE ACTIVELY ADDRESSING THE DAC AND WRITING TO THE DAC REGISTER
(OUTPUT UNLOADED)
fSCL = 400 kHz
ICO_VA-1
VA DAC081C081 supply current
fSCL = 3.4 MHz
8
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VA = 2.7 V to
3.6 V
134
220
µA
VA = 4.5 V to
5.5 V
192
300
µA
VA = 2.7 V to
3.6 V
225
320
µA
VA = 4.5 V to
5.5 V
374
500
µA
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Electrical Characteristics (continued)
The following specifications apply for VA = 2.7 V to 5.5 V, VREF = VA, CL = 200 pF to GND, input code range 3 to 252. All
Maximum and Minimum limits apply for TMIN ≤ TA ≤ TMAX and all Typical limits are at TA = 25°C, unless otherwise specified.
PARAMETER
fSCL = 400 kHz
ICO_VA-5
VA DAC081C085 supply current
fSCL = 3.4 MHz
ICO_VREF
VREF supply current
(DAC081C085 only)
fSCL = 400 kHz
PCO
TYP (1)
MAX (1)
VA = 2.7 V to
3.6 V
101
155
µA
VA = 4.5 V to
5.5 V
142
220
µA
VA = 2.7 V to
3.6 V
193
235
µA
VA = 4.5 V to
5.5 V
325
410
µA
VA = 2.7 V to
3.6 V
33.5
55
µA
VA = 4.5 V to
5.5 V
49.5
71.4
µA
TEST CONDITIONS
Power consumption
(VA and VREF for DAC081C085)
fSCL = 3.4 MHz
MIN
UNIT
VA = 3 V
480
µW
VA = 5 V
1.06
mW
VA = 3 V
810
µW
VA = 5 V
2.06
mW
POWER DOWN -- 2-WIRE INTERFACE QUIET (SCL = SDA = VA) AFTER PD MODE WRITTEN TO DAC REGISTER (OUTPUT
UNLOADED)
IPD
PPD
Supply current
All power-down
(VA and VREF for DAC081C085) modes
Power consumption
All power-down
(VA and VREF for DAC081C085) modes
VA = 2.7 V to
3.6 V
0.13
1.52
µA
VA = 4.5 V to
5.5 V
0.15
3.25
µA
VA = 3 V
0.5
µW
VA = 5 V
0.9
µW
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7.6 AC and Timing Characteristics
The following specifications apply for VA = 2.7 V to 5.5 V, VREF = VA, RL = Infinity, CL = 200 pF to GND. All Maximum and
Minimum limits apply for TMIN ≤ TA ≤ TMAX and all Typical limits are at TA = 25°C, unless otherwise specified.
TEST CONDITIONS (1)
PARAMETER
ts
Output voltage settling time (3)
SR
Output slew rate
Glitch impulse
MIN
40h to C0h code change
RL = 2 kΩ, CL = 200 pF
Code change from 80h to 7Fh
Digital feedthrough
Multiplying bandwidth
(4)
Total harmonic distortion
tWU
VREF = 2.5 V ± 0.1 Vpp
(4)
Wake-up time
TYP (2)
MAX (1) (2)
3
4.5
UNIT
µs
1
V/µs
12
nV-sec
0.5
nV-sec
160
kHz
VREF = 2.5 V ± 0.1 Vpp
input frequency = 10 kHz
70
dB
VA = 3 V
0.8
µsec
VA = 5 V
0.5
µsec
DIGITAL TIMING SPECS (SCL, SDA)
fSCL
Serial clock frequency
tLOW
SCL low time
Standard mode
100
Fast mode
400
High-speed mode, Cb = 100 pF
3.4
High-speed mode, Cb = 400 pF
1.7
Standard mode
4.7
Fast mode
1.3
High-speed mode, Cb = 100 pF
160
High-speed mode, Cb = 400 pF
320
Standard mode
tHIGH
tSU;DAT
SCL high time
Data set-up time
0.6
High-speed mode, Cb = 100 pF
60
High-speed mode, Cb = 400 pF
120
Standard mode
250
Fast mode
100
High-speed mode
tHD;DAT
tSU;STA
Data hold time
Set-up time for a start or a
repeated start condition
tHD;STA
Hold time for a start or a
repeated start condition
tBUF
Bus free time between a stop
and start condition
tSU;STO
Set-up time for a stop condition
(3)
(4)
10
µs
ns
ns
10
0
3.45
Fast mode
0
0.9
High-speed mode, Cb = 100 pF
0
70
High-speed mode, Cb = 400 pF
0
150
Standard mode
4.7
Fast mode
0.6
High-speed mode
160
4
Fast mode
0.6
High-speed mode
160
Standard mode
4.7
Fast mode
1.3
Standard mode
(1)
(2)
ns
Standard mode
Standard mode
MHz
µs
4
Fast mode
kHz
4
Fast mode
0.6
High-speed mode
160
µs
ns
µs
ns
µs
ns
µs
µs
ns
Cb refers to the capacitance of one bus line. Cb is expressed in pF units.
Typical figures are at TJ = 25°C, and represent most likely parametric norms. Test limits are specified to TI's AOQL (Average Outgoing
Quality Level).
This parameter is ensured by design and/or characterization and is not tested in production.
Applies to the Multiplying DAC configuration. In this configuration, the reference is used as the analog input. The value loaded in the
DAC Register will digitally attenuate the signal at Vout.
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AC and Timing Characteristics (continued)
The following specifications apply for VA = 2.7 V to 5.5 V, VREF = VA, RL = Infinity, CL = 200 pF to GND. All Maximum and
Minimum limits apply for TMIN ≤ TA ≤ TMAX and all Typical limits are at TA = 25°C, unless otherwise specified.
TEST CONDITIONS (1)
PARAMETER
MIN
TYP (2)
Standard mode
trDA
Rise time of SDA signal
Fast mode
20 + 0.1 Cb
300
High-speed mode, Cb = 100 pF
10
80
High-speed mode, Cb = 400 pF
20
160
Fall time of SDA signal
Fast mode
250
High-speed mode, Cb = 100 pF
10
80
High-speed mode, Cb = 400 pF
20
160
Standard mode
trCL
Rise time of SCL signal
300
High-speed mode, Cb = 100 pF
10
40
High-speed mode, Cb = 400 pF
20
Rise time of SCL signal after a
Fast mode
repeated start condition and after
High-speed mode, Cb = 100 pF
an acknowledge bit.
High-speed mode, Cb = 400 pF
80
20 + 0.1 Cb
300
10
80
20
160
300
High-speed mode, Cb = 100 pF
10
40
High-speed mode, Cb = 400 pF
20
80
Fall time of a SCL signal
Cb
Capacitive load for each bus line
(SCL and SDA)
tSP
Pulse width of spike
suppressed (5) (3)
toutz
SDA output delay (see Additional Fast mode
Timing Information: toutz)
High-speed mode
(5)
ns
300
20 + 0.1 Cb
tfCL
ns
1000
Standard mode
Fast mode
ns
1000
20 + 0.1 Cb
Standard mode
trCL1
ns
250
20 + 0.1 Cb
Fast mode
UNIT
1000
Standard mode
tfDA
MAX (1) (2)
400
Fast mode
50
High-speed mode
10
87
270
38
60
ns
pF
ns
ns
Spike suppression filtering on SCL and SDA will supress spikes that are less than 50ns for standard-fast mode and less than 10ns for
hs-mode.
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FSE
255 x VREF
256
GE = FSE - ZE
FSE = GE + ZE
OUTPUT
VOLTAGE
ZE
0
0
255
DIGITAL INPUT CODE
Figure 1. Input / Output Transfer Characteristic
SDA
tLOW
tf
tr
tHD;STA
tr
tf
tBUF
tSP
SCL
tSU;STA
tHD;STA
tHD;DAT
START
tHIGH
tSU;STO
tSU;DAT
STOP
REPEATED
START
START
Figure 2. Serial Timing Diagram
12
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7.7 Typical Characteristics
VREF = VA, fSCL = 3.4 MHz, TA = 25°C, Input Code Range 3 to 252, unless otherwise stated.
Figure 3. INL
Figure 4. DNL
Figure 5. INL/DNL vs Temperature at VA = 3 V
Figure 6. INL/DNL vs Temperature at VA = 5 V
Figure 7. INL/DNL vs VREFIN at VA = 3 V
Figure 8. INL/DNL vs VREFIN at VA = 5 V
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Typical Characteristics (continued)
VREF = VA, fSCL = 3.4 MHz, TA = 25°C, Input Code Range 3 to 252, unless otherwise stated.
14
Figure 9. INL/DNL vs VA
Figure 10. Zero Code Error vs VA
Figure 11. Zero Code Error vs Temperature
Figure 12. Full Scale Error vs VA
Figure 13. Full Scale Error vs Temperature
Figure 14. Total Supply Current vs VA
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Typical Characteristics (continued)
VREF = VA, fSCL = 3.4 MHz, TA = 25°C, Input Code Range 3 to 252, unless otherwise stated.
Figure 15. VREF Supply Current vs VA
Figure 16. Total Supply Current vs Temperature at VA = 3 V
Figure 17. Total Supply Current vs Temperature at VA = 5 V
Figure 18. 5-V Glitch Response
Figure 19. Power-ON Reset
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8 Detailed Description
8.1 Overview
The DAC081C081 is fabricated on a CMOS process with an architecture that consists of switches and resistor
strings that are followed by an output buffer.
8.2 Functional Block Diagram
VA*
VREF*
GND
DAC081C081 / DAC081C085
POWER-ON
RESET
REF
DAC
REGISTER
8 BIT DAC
VOUT
BUFFER
8
8
2.5k
100k
POWER-DOWN
CONTROL
LOGIC
2
I C
INTERFACE
* NOTE: ADR1 and VREF are for the DAC081C085 only. The DAC081C085 uses an external
reference (VREF), whereas, the DAC081C081 uses the supply (VA) as the reference.
ADR1* ADR0
SCL
SDA
8.3 Feature Description
8.3.1 DAC Section
For simplicity, a single resistor string is shown in Figure 20. This string consists of 256 equal-valued resistors
with a switch at each junction of two resistors, plus a switch to ground. The code loaded into the DAC register
determines which switch is closed, connecting the proper node to the amplifier. The input coding is straight
binary with an ideal output voltage of Equation 1:
VOUT = VREF × (D / 256)
where
•
D is the decimal equivalent of the binary code that is loaded into the DAC register.
(1)
D can take on any integer value between 0 and 255. This configuration ensures that the DAC is monotonic.
16
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Feature Description (continued)
VREF
R
R
R
To Output Amplifier
R
R
Figure 20. DAC Resistor String
8.3.2 Output Amplifier
The output amplifier is rail-to-rail, providing an output voltage range of 0 V to VA when the reference is VA. All
amplifiers, even rail-to-rail types, exhibit a loss of linearity as the output approaches the supply rails (0V and VA,
in this case). For this reason, linearity is specified over less than the full output range of the DAC. However, if the
reference is less than VA, there is only a loss in linearity in the lowest codes. The output capabilities of the
amplifier are described in the Electrical Characteristics.
The output amplifiers are capable of driving a load of 2 kΩ in parallel with 1500 pF to ground or to VA. The zerocode and full-scale outputs for given load currents are available in the Electrical Characteristics.
8.3.3 Reference Voltage
The DAC081C081 uses the supply (VA) as the reference. With that said, VA must be treated as a reference. The
Analog output will only be as clean as the reference (VA). It is recommended that the reference be driven by a
voltage source with low output impedance.
The DAC081C085 comes with an external reference supply pin (VREF). For the DAC081C085, it is important that
VREF be kept as clean as possible.
The Application and Implementation section describes a handful of ways to drive the reference appropriately.
Refer to Using References as Power Supplies for details.
8.3.4 Power-On Reset
The power-on reset circuit controls the output voltage of the DAC during power up. Upon application of power,
the DAC register is filled with zeros and the output voltage is 0 Volts. The output remains at 0 V until a valid write
sequence is made to the DAC.
When resetting the device, it is crucial that the VA supply be lowered to a maximum of 200 mV before the supply
is raised again to power up the device. Dropping the supply to within 200 mV of GND during a reset will ensure
the ADC performs as specified.
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Feature Description (continued)
8.3.5 Simultaneous Reset
The broadcast address allows the I2C master to write a single word to multiple DACs simultaneously. Provided
that all of the DACs exist on a single I2C bus, every DAC will update when the broadcast address is used to
address the bus. This feature allows the master to reset all of the DACs on a shared I2C bus to a specific digital
code. For instance, if the master writes a power-down code to the bus with the broadcast address, all of the
DACs will power-down simultaneously.
8.3.6 Additional Timing Information: toutz
The toutz specification is provided to aid the design of the I2C bus. After the SCL bus is driven low by the I2C
master, the SDA bus will be held for a short time by the DAC081C081. This time is referred to as toutz. The
following figure illustrates the relationship between the fall of SCL, at the 30% threshold, to the time when the
DAC begins to transition the SDA bus. The toutz specification only applies when the DAC is in control of the SDA
bus. The DAC is only in control of the bus during an ACK by the DAC081C081 or a data byte read from the DAC
(see Figure 25).
SCL
SDA
toutz
Figure 21. Data Output Timing
The toutz specification is typically 87 ns in standard-fast mode and 38 ns in Hs-Mode.
8.4 Device Functional Modes
8.4.1 Power-Down Modes
The DAC081C081 has three power-down modes. In power-down mode, the supply current drops to 0.13 µA at 3
V and 0.15 µA at 5 V (typical). The DAC081C081 is put into power-down mode by writing a one to PD1 and/or
PD0. The outputs can be set to high impedance, terminated by 2.5 kΩ to GND, or terminated by 100 kΩ to GND
(see Figure 26).
The bias generator, output amplifier, resistor string, and other linear circuitry are all shut down in any of the
power-down modes. When the DAC081C081 is powered down, the value written to the DAC register, including
the power-down bits, is saved. While the DAC is in power-down, the saved DAC register contents can be read
back. When the DAC is brought out of power-down mode, the DAC register contents will be overwritten and VOUT
will be updated with the new 8-bit data value.
The time to exit power-down (wake-up time) is typically 0.8 µs at 3 V and 0.5 µs at 5 V.
8.5 Programming
8.5.1 Serial Interface
The I2C-compatible interface operates in all three speed modes. Standard mode (100 kHz) and fast mode (400
kHz) are functionally the same and will be referred to as standard-fast mode in this document. High-speed mode
(3.4 MHz) is an extension of standard-fast mode and will be referred to as Hs-mode in this document. The
following diagrams describe the timing relationships of the clock (SCL) and data (SDA) signals. Pullup resistors
or current sources are required on the SCL and SDA busses to pull them high when they are not being driven
low. A logic zero is transmitted by driving the output low. A logic high is transmitted by releasing the output and
allowing it to be pulled up externally. The appropriate pullup resistor values will depend upon the total bus
capacitance and operating speed.
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Programming (continued)
8.5.2 Basic I2C Protocol
The I2C interface is bidirectional and allows multiple devices to operate on the same bus. To facilitate this bus
configuration, each device has a unique hardware address which is referred to as the slave address. To
communicate with a particular device on the bus, the controller (master) sends the slave address and listens for
a response from the slave. This response is referred to as an acknowledge bit. If a slave on the bus is addressed
correctly, it acknowledges (ACKs) the master by driving the SDA bus low. If the address doesn't match a device's
slave address, it not-acknowledges (NACKs) the master by letting SDA be pulled high. ACKs also occur on the
bus when data is being transmitted. When the master is writing data, the slave ACKs after every data byte is
successfully received. When the master is reading data, the master ACKs after every data byte is received to let
the slave know it wants to receive another data byte. When the master wants to stop reading, it NACKs after the
last data byte and creates a Stop condition on the bus.
All communication on the bus begins with either a start condition or a repeated start condition. The protocol for
starting the bus varies between standard-fast mode and Hs-mode. In standard-fast mode, the master generates
a start condition by driving SDA from high to low while SCL is high. In Hs-mode, starting the bus is more
complicated. Please refer to High-Speed (Hs) Mode for the full details of a Hs-mode start condition. A repeated
start is generated to either address a different device, or switch between read and write modes. The master
generates a repeated start condition by driving SDA low while SCL is high. Following the repeated start, the
master sends out the slave address and a read/write bit as shown in Figure 22. The bus continues to operate in
the same speed mode as before the repeated start condition.
All communication on the bus ends with a stop condition. In either standard-fast mode or Hs-Mode, a stop
condition occurs when SDA is pulled from low to high while SCL is high. After a stop condition, the bus remains
idle until a master generates a start condition.
Please refer to the Phillips I2C Specification (Version 2.1 Jan, 2000) for a detailed description of the serial
interface.
SDA
1
2
6
MSB
R/W
Direction
Bit
Acknowledge
from the Device
7-bit Slave Address
SCL
ACK
LSB
MSB
7
8
9
LSB
N/ACK
Data Byte
*Acknowledge
or Not-ACK
1
2
8
Repeated for the Lower Data Byte
and Additional Data Transfers
START or
REPEATED
START
9
STOP
*Note: In continuous mode, this bit must be an ACK from
the data receiver. Immediately preceding a STOP
condition, this bit must be a NACK from the master.
Figure 22. Basic Operation
8.5.3 Standard-Fast Mode
In standard-fast mode, the master generates a start condition by driving SDA from high to low while SCL is high.
The start condition is always followed by a 7-bit slave address and a read/write bit. After these eight bits have
been transmitted by the master, SDA is released by the master and the DAC081C081 either ACKs or NACKs the
address. If the slave address matches, the DAC081C081 ACKs the master. If the address doesn't match, the
DAC081C081 NACKs the master.
For a write operation, the master follows the ACK by sending the upper eight data bits to the DAC081C081.
Then the DAC081C081 ACKs the transfer by driving SDA low. Next, the lower eight data bits are sent by the
master. The DAC081C081 then ACKs the transfer. At this point, the DAC output updates to reflect the contents
of the 16-bit DAC register. Next, the master either sends another pair of data bytes, generates a stop condition to
end communication, or generates a repeated start condition to communicate with another device on the bus.
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Programming (continued)
For a read operation, the DAC081C081 sends out the upper eight data bits of the DAC register. This is followed
by an ACK by the master. Next, the lower eight data bits of the DAC register are sent to the master. The master
then produces a NACK by letting SDA be pulled high. The NACK is followed by a master-generated stop
condition to end communication on the bus, or a repeated start to communicate with another device on the bus.
8.5.4 High-Speed (Hs) Mode
For Hs-mode, the sequence of events to begin communication differ slightly from standard-fast mode. Figure 23
describes this in further detail. Initially, the bus begins running in standard-fast mode. The master generates a
start condition and sends the 8-bit Hs master code (00001XXX) to the DAC081C081. Next, the DAC081C081
responds with a NACK. Once the SCL line has been pulled to a high level, the master switches to Hs-mode by
increasing the bus speed and generating a repeated start condition (driving SDA low while SCL is pulled high).
At this point, the master sends the slave address to the DAC081C081, and communication continues as shown
above in the "basic operation" diagram (see Figure 22).
When the master generates a repeated start condition while in Hs-mode, the bus stays in Hs-mode awaiting the
slave address from the master. The bus continues to run in Hs-mode until a stop condition is generated by the
master. When the master generates a stop condition on the bus, the bus must be started in standard-fast mode
again before increasing the bus speed and switching to Hs-mode.
SDA
NACK
MSB
8-ELW 0DVWHU FRGH ³00001[[[´
7-bit Slave
Address
Not-Acknowledge
from the Device
1
SCL
2
6
5
7
8
9
1
2
Repeated
START
START
Standard-Fast Mode
Hs-Mode
Figure 23. Beginning Hs-Mode Communication
8.5.5
I2C Slave (Hardware) Address
The DAC has a seven-bit I2C slave address. For the VSSOP-8 version of the DAC, this address is configured by
the ADR0 and ADR1 address selection inputs. For the DAC081C081, the address is configured by the ADR0
address selection input. ADR0 and ADR1 can be grounded, left floating, or tied to VA. If desired, the address
selection inputs can be set to VA/2 rather than left floating. The state of these inputs sets the address the DAC
responds to on the I2C bus (see Table 1). In addition to the selectable slave address, there is also a broadcast
address (1001000) for all DAC081C081s and DAC081C085s on the 2-wire bus. When the bus is addressed by
the broadcast address, all the DAC081C081's and DAC081C085's will respond and update synchronously.
Figure 24 and Figure 25 describe how the master device should address the DAC through the I2C-compatible
interface.
Keep in mind that the address selection inputs (ADR0 and ADR1) are only sampled until the DAC is correctly
addressed with a non-broadcast address. At this point, the ADR0 and ADR1 inputs TRI-STATE and the slave
address is locked. Changes to ADR0 and ADR1 will not update the selected slave address until the device is
power-cycled.
Table 1. Slave Addresses
SLAVE ADDRESS
[A6 - A0]
(1)
20
DAC101C081 (SOT &
WSON) (1)
DAC101C085 (VSSOP-8)
ADR1
ADR0
ADR0
0001100, 1000110
Floating
Floating
Floating
0001101, 1000110
Floating
GND
GND
Pin-compatible alternatives to the DAC101C081 options are available with additional address options.
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Programming (continued)
Table 1. Slave Addresses (continued)
DAC101C081 (SOT &
WSON) (1)
DAC101C085 (VSSOP-8)
SLAVE ADDRESS
[A6 - A0]
ADR1
ADR0
ADR0
0001110, 1000111
Floating
VA
VA
0001000, 1000100
GND
Floating
—
0001001, 1000100
GND
GND
—
0001010, 1000101
GND
VA
—
1001100, 1100110
VA
Floating
—
1001101, 1100110
VA
GND
—
1001110, 1100111
VA
VA
—
1001000, 1100100
Broadcast Address
8.5.6 Writing to the DAC Register
To write to the DAC, the master addresses the part with the correct slave address (A6-A0) and writes a zero to
the read/write bit. If addressed correctly, the DAC returns an ACK to the master. The master then sends out the
upper data byte. The DAC responds by sending an ACK to the master. Next, the master sends the lower data
byte to the DAC. The DAC responds by sending an ACK again. At this point, the master either sends the upper
byte of the next data word to be converted by the DAC, generates a Stop condition to end communication, or
generates a repeated start condition to begin communication with another device on the bus. Until generating a
stop condition, the master can continuously write the upper and lower data bytes to the DAC register. This allows
for a maximum DAC conversion rate of 188.9 kilo-conversions per second in Hs-mode.
1
9
1
9
1
9
SCL
SDA
A6
Start by
Master
A5
A4
A3
A2
A1
A0 R/W
0
ACK
by
DAC081C081
Frame 1
Address Byte
from Master
0
PD1 PD0 D11 D10 D9
Frame 2
Data Byte from
Master
D7
ACK
by
DAC081C081
D8
D6
D5
D4
D3
D2
D1
D0
ACK Stop by
by
Master
DAC081C081
Frame 3
Data Byte from
Master
Repeat Frames
2 and 3 for
Continuous Mode
Figure 24. Typical Write to the DAC Register
8.5.7 Reading from the DAC Register
To read from the DAC register, the master addresses the part with the correct slave address (A6-A0) and writes
a one to the read/write bit. If addressed correctly, the DAC returns an ACK to the master. Next, the DAC sends
out the upper data byte. The master responds by sending an ACK to the DAC to indicate that it wants to receive
another data byte. Then the DAC sends the lower data byte to the master. Assuming only one 16-bit data word is
read, the master sends a NACK after receiving the lower data byte. At this point, the master either generates a
stop condition to end communication, or a repeated start condition to begin communication with another device
on the bus.
1
9
1
9
1
9
SCL
SDA
A6
A5
A4
A3
A2
A1
Start by
Master
Frame 1
Address Byte
from Master
A0 R/W
0
ACK
by
DAC081C081
0
PD1 PD0 D11 D10 D9
Frame 2
Data Byte from
DAC081C081
D8
D7
D6
D5
ACK
by
Master
D4
D3
D2
Frame 3
Data Byte from
DAC081C081
D1
D0
NACK
by
Master
Stop by
Master
Figure 25. Typical Read from the DAC Register
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8.6 Registers
8.6.1 DAC Register
The DAC register, Figure 26, has sixteen bits. The first two bits are always zero. The next two bits determine the
mode of operation (normal mode or one of three power-down modes). The final twelve bits of the shift register
are the data bits. The data format is straight binary (MSB first, LSB last), with twelve 0's corresponding to an
output of 0V and twelve 1's corresponding to a full-scale output of VA – 1 LSB. When writing to the DAC
Register, VOUT will update on the rising edge of the ACK following the lower data byte.
LSB
MSB
X
X PD1 PD0 D7 D6 D5 D4 D3 D2 D1 D0
0
0
0
0
DATA BITS
0
0
1
1
0
1
0
1
Normal Operation.
2.5 kÖ to GND.
100 kÖ to GND.
High Impedance.
Power-Down Modes
Figure 26. DAC Register Contents
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9 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information
9.1.1 Bipolar Operation
The DAC081C081 is designed for single-supply operation and thus has a unipolar output. However, a bipolar
output may be obtained with the circuit in Figure 27. This circuit will provide an output voltage range of ±5 Volts.
A rail-to-rail amplifier should be used if the amplifier supplies are limited to ±5 V.
10 pF
R2
+5V
R1
+5V
10 PF
+
-
0.1 PF
±5V
+
DAC081C081
SDA
-5V
VOUT
SCL
Figure 27. Bipolar Operation
The output voltage of this circuit for any code is found to be
VO = (VA × (D / 256) × ((R1 + R2) / R1) – VA × R2 / R1)
where
•
D is the input code in decimal form.
(2)
With VA = 5V and R1 = R2,
VO = (10 × D / 256) – 5 V
(3)
A list of rail-to-rail amplifiers suitable for this application are indicated in Table 2.
Table 2. Some Rail-to-Rail Amplifiers
AMP
PKGS
TYP VOS
LMP7701
SOT23-5
37 uV
LMV841
SC70-5
50 uV
1 mA
LMC7111
SOT23-5
0.9 mV
25 µA
LM7301
SO-8
SOT23-5
0.03 mV
620 µA
LM8261
SOT23-5
0.7 mV
1 mA
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0.79 mA
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9.1.2 DSP/Microprocessor Interfacing
Interfacing the DAC081C081 to microprocessors and DSPs is quite simple. The following guidelines are offered
to simplify the design process.
9.1.2.1 Interfacing to the 2-Wire Bus
Figure 28 shows a microcontroller interfacing to the DAC081C081 through the 2-wire bus. Pullup resistors (Rp)
should be chosen to create an appropriate bus rise time and to limit the current that will be sunk by the opendrain outputs of the devices on the bus. Please refer to the I2C Specification for further details. Typical pullup
values to use in standard-fast mode bus applications are 2 kΩ to 10 kΩ. SCL and SDA series resisters (RS) near
the DAC081C081 are optional. If high-voltage spikes are expected on the 2-wire bus, series resistors should be
used to filter the voltage on SDA and SCL. The value of the series resistance must be picked to ensure the VIL
threshold can be achieved. If used, RS is typically 51 Ω.
DAC081C081/5
10 PF
VREF
4.7 PF
VA
0.1 PF
Regulated Supply
RP RP
VDD
PController
R S*
SDA
SDA
SCL
SCL
R S*
ADC081C021
SDA
SCL
I2C Device
SDA
SCL
*NOTE: RS is optional.
Figure 28. Serial Interface Connection Diagram
9.1.2.2
Interfacing to a Hs-mode Bus
Interfacing to a Hs-mode bus is very similar to interfacing to a standard-fast mode bus. In Hs-mode, the specified
rise time of SCL is shortened. To create a faster rise time, the master device (microcontroller) can drive the SCL
bus high and low. In other words, the microcontroller can drive the line high rather than leaving it to the pullup
resistor. It is also possible to decrease the value of the pullup resistors or increase the pullup current to meet the
tighter timing specs. Please refer to the I2C Specification for further details.
24
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9.2 Typical Application
2
VA
4 SDA
1
VOUT
+5
120pF
+5
3
+
5 SC
L
6 ADR0
3
1uF
5
1
A2
4
LM4132-3.3
4
5
3
2 .1uF
DAC081C081CIMK
-
180
.2uF
2
+5
+3.3
10
VA
9
VIO
100K
470pF
2
+IN
1
VREF
ADC161S626
AV = 100
2.02K
3
-IN
8
SCLK
7
DOUT
6
/CS
4,
5
+5
.2uF
100K
3
-
5
1
A1
Pressure
Sensor
0.2mV/Volt/PSI
4
+
180
470pF
2
A1 and A2 = LMP7701
Figure 29. Pressure Sensor Gain Adjust
9.2.1 Design Requirements
A positive supply only data acquisition system capable of digitizing a pressure sensor output. In addition to
digitizing the pressure sensor output, the system designer can use the DAC081C081 to correct for gain errors in
the pressure sensor output by adjusting the bias voltage to the bridge pressure sensor.
9.2.2 Detailed Design Procedure
As shown in Equation 4, the output of the pressure sensor is relative to the imbalance of the resistive bridge
times the output of the DAC081C081, thus providing the desired gain correction.
Pressure Sensor Output = (DAC_Output × [(R2 / (R1 + R2) – (R4 / (R3 + R4)]
(4)
Likewise for the ADC161S626, Equation 5 shows that the ADC output is function of the pressure sensor output
times relative to the ratio of the ADC input divided by the DAC081C081 output voltage.
ADC161S626 Output = (Pressure Sensor Output × 100 /(2 × VREF) ) × 216
(5)
9.2.3 Application Curve
Figure 30. INL vs Input Code
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10 Power Supply Recommendations
10.1
Using References as Power Supplies
While the simplicity of the DAC081C081 implies ease of use, it is important to recognize that the path from the
reference input (VA for the DAC081C081 and VREF for the DAC081C085) to VOUT will have essentially zero
Power Supply Rejection Ratio (PSRR). Therefore, it is necessary to provide a noise-free supply voltage to the
reference. In order to use the full dynamic range of the DAC081C085, the supply pin (VA) and VREF can be
connected together and share the same supply voltage. Since the DAC081C081 consumes very little power, a
reference source may be used as the supply voltage. The advantages of using a reference source over a voltage
regulator are accuracy and stability. Some low noise regulators can also be used. Listed below are a few
reference and power supply options for the DAC081C081. When using the DAC081C081, it is important to treat
the analog supply (VA) as the reference.
10.1.1 LM4132
The LM4132, with its 0.05% accuracy over temperature, is a good choice as a reference source for the
DAC081C081. The 4.096-V version is useful if a 0 to 4.095-V output range is desirable or acceptable. Bypassing
the LM4132 VIN pin with a 0.1-µF capacitor and the VOUT pin with a 2.2-µF capacitor will improve stability and
reduce output noise. The LM4132 comes in a space-saving 5-pin SOT23.
Input
Voltage
LM4132-4.1
C3
0.1 PF
C2
2.2 PF
C1
0.1 PF
VA VREF
DAC081C081/5
VOUT = 0V to 4.092V
SDA
SCL
Figure 31. The LM4132 as a Power Supply
10.1.2 LM4050
Available with accuracy of 0.44%, the LM4050 shunt reference is also a good choice as a reference for the
DAC081C081. It is available in 4.096-V and 5-V versions and comes in a space-saving 3-pin SOT23.
Input
Voltage
R
IDAC
VZ
IZ
0.1 PF
0.47 PF
LM4050-4.1
or
LM4050-5.0
VA VREF
DAC081C081/5
VOUT = 0V to 5V
SDA
SCL
Figure 32. The LM4050 as a Power Supply
26
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Using References as Power Supplies (continued)
The minimum resistor value in the circuit of Figure 32 must be chosen such that the maximum current through
the LM4050 does not exceed its 15-mA rating. The conditions for maximum current include the input voltage at
its maximum, the LM4050 voltage at its minimum, and the DAC081C081 drawing zero current. The maximum
resistor value must allow the LM4050 to draw more than its minimum current for regulation plus the maximum
DAC081C081 current in full operation. The conditions for minimum current include the input voltage at its
minimum, the LM4050 voltage at its maximum, the resistor value at its maximum due to tolerance, and the
DAC081C081 draws its maximum current. These conditions can be summarized as
R(min) = ( VIN(max) − VZ(min) ) /IZ(max)
(6)
and
R(max) = ( VIN(min) − VZ(max) ) / ( (IDAC(max) + IZ(min) )
where
•
•
•
•
VZ(min) and VZ(max) are the nominal LM4050 output voltages ± the LM4050 output tolerance over
temperature,
IZ(max) is the maximum allowable current through the LM4050,
IZ(min) is the minimum current required by the LM4050 for proper regulation,
and IDAC(max) is the maximum DAC081C081 supply current.
(7)
10.1.3 LP3985
The LP3985 is a low noise, ultra low dropout voltage regulator with a 3% accuracy over temperature. It is a good
choice for applications that do not require a precision reference for the DAC081C081. It comes in 3-V, 3.3-V and
5-V versions, among others, and sports a low 30-µV noise specification at low frequencies. Since low frequency
noise is relatively difficult to filter, this specification could be important for some applications. The LP3985 comes
in a space-saving 5-pin SOT-23 and 5-bump DSBGA packages.
Input
Voltage
LP3985
0.1 PF
1 PF
0.01 PF
0.1 PF
VA
VREF
DAC081C081/5
VOUT = 0V to 5V
SDA
SCL
Figure 33. Using the LP3985 Regulator
An input capacitance of 1 µF without any ESR requirement is required at the LP3985 input, while a 1-µF ceramic
capacitor with an ESR requirement of 5 mΩ to 500 mΩ is required at the output. Careful interpretation and
understanding of the capacitor specification is required to ensure correct device operation.
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Using References as Power Supplies (continued)
10.1.4 LP2980
The LP2980 is an ultra low dropout regulator with a 0.5% or 1.0% accuracy over temperature, depending upon
grade. It is available in 3-V, 3.3-V and 5-V versions, among others.
Input
Voltage
VIN
VOUT
LP2980
ON /OFF
1 PF
0.1 PF
VA VREF
DAC081C081/5
VOUT = 0V to 5V
SDA
SCL
Figure 34. Using the LP2980 Regulator
Like any low dropout regulator, the LP2980 requires an output capacitor for loop stability. This output capacitor
must be at least 1 µF over temperature, but values of 2.2 µF or more will provide even better performance. The
ESR of this capacitor should be within the range specified in the LP2980 data sheet. Surface-mount solid
tantalum capacitors offer a good combination of small size and ESR. Ceramic capacitors are attractive due to
their small size but generally have ESR values that are too low for use with the LP2980. Aluminum electrolytic
capacitors are typically not a good choice due to their large size and have ESR values that may be too high at
low temperatures.
28
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11 Layout
11.1 Layout Guidelines
For best accuracy and minimum noise, the printed-circuit-board containing the DAC081C081 should have
separate analog and digital areas. The areas are defined by the locations of the analog and digital power planes.
Both of these planes should be located on the same board layer. There should be a single ground plane. A
single ground plane is preferred if digital return current does not flow through the analog ground area. Frequently
a single ground plane design will use a fencing technique to prevent the mixing of analog and digital ground
current. Separate ground planes should only be used when the fencing technique is inadequate. The separate
ground planes must be connected in one place, preferably near the DAC081C081. Special care is required to
ensure that digital signals with fast edge rates do not pass over split ground planes. They must always have a
continuous return path below their traces.
The DAC081C081 power supply should be bypassed with a 4.7-µF and a 0.1-µF capacitor as close as possible
to the device with the 0.1 µF right at the device supply pin. The 4.7-µF capacitor should be a tantalum type and
the 0.1-µF capacitor should be a low ESL, low ESR type. The power supply for the DAC081C081 should only be
used for analog circuits.
Avoid crossover of analog and digital signals and keep the clock and data lines on the component side of the
board. These clock and data lines should have controlled impedances.
11.2 Layout Example
VOUT
ADR0
SOT
VA
SCL
C1
SDA
GND
Figure 35. Typical Layout
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12 Device and Documentation Support
12.1 Device Support
12.1.1 Development Support
For development support, see the following:
• 12-Bit Micro Power Digital-to-Analog Converter with an I2C-Compatible Interface, DAC121C081
• 12-Bit Micro Pwr DAC w/ I2C-Compatible Interface & External Reference, DAC121C085
• 10-Bit Micro Power Digital-to-Analog Converter with an I2C-Compatible Interface, DAC101C081
• 10-Bit Micro Pwr DAC w/ I2C-Compatible Interface & External Reference, DAC101C085
12.1.2 Device Nomenclature
12.1.2.1 Specification Definitions
DIFFERENTIAL NON-LINEARITY (DNL) is the measure of the maximum deviation from the ideal step size of 1
LSB, which is VREF / 256 = VA / 256.
DIGITAL FEEDTHROUGH is a measure of the energy injected into the analog output of the DAC from the digital
inputs when the DAC output is not updated. It is measured with a full-scale code change on the
data bus.
FULL-SCALE ERROR is the difference between the actual output voltage with a full scale code (FFFh) loaded
into the DAC and the value of VA x 255 / 256.
GAIN ERROR is the deviation from the ideal slope of the transfer function. It can be calculated from Zero and
Full-Scale Errors as GE = FSE - ZE, where GE is Gain error, FSE is Full-Scale Error and ZE is
Zero Error.
GLITCH IMPULSE is the energy injected into the analog output when the input code to the DAC register
changes. It is specified as the area of the glitch in nanovolt-seconds.
INTEGRAL NON-LINEARITY (INL) is a measure of the deviation of each individual code from a straight line
through the input to output transfer function. The deviation of any given code from this straight line
is measured from the center of that code value. The end point method is used. INL for this product
is specified over a limited range, per the Electrical Tables.
LEAST SIGNIFICANT BIT (LSB) is the bit that has the smallest value or weight of all bits in a word. This value
is LSB = VREF / 2n where VREF is the supply voltage for this product, and "n" is the DAC resolution
in bits, which is 8 for the DAC081C081.
MAXIMUM LOAD CAPACITANCE is the maximum capacitance that can be driven by the DAC with output
stability maintained.
MONOTONICITY is the condition of being monotonic, where the DAC has an output that never decreases when
the input code increases.
MOST SIGNIFICANT BIT (MSB) is the bit that has the largest value or weight of all bits in a word. Its value is
1/2 of VA.
MULTIPLYING BANDWIDTH is the frequency at which the output amplitude falls 3dB below the input sine wave
on VREFIN with a full-scale code loaded into the DAC.
POWER EFFICIENCY is the ratio of the output current to the total supply current. The output current comes from
the power supply. The difference between the supply and output currents is the power consumed
by the device without a load.
SETTLING TIME is the time for the output to settle to within 1/2 LSB of the final value after the input code is
updated.
TOTAL HARMONIC DISTORTION (THD) is the measure of the harmonics present at the output of the DACs
with an ideal sine wave applied to VREFIN. THD is measured in dB.
WAKE-UP TIME is the time for the output to exit power-down mode. This time is measured from the rising edge
of SCL during the ACK bit of the lower data byte to the time the output voltage deviates from the
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Device Support (continued)
power-down voltage of 0V.
ZERO CODE ERROR is the output error, or voltage, present at the DAC output after a code of 000h has been
entered.
12.2 Related Links
The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to sample or buy.
Table 3. Related Links
PARTS
PRODUCT FOLDER
SAMPLE & BUY
TECHNICAL
DOCUMENTS
TOOLS &
SOFTWARE
SUPPORT &
COMMUNITY
DAC081C081
Click here
Click here
Click here
Click here
Click here
DAC081C085
Click here
Click here
Click here
Click here
Click here
12.3 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
12.4 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
12.5 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
12.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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PACKAGE OPTION ADDENDUM
www.ti.com
8-Oct-2015
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
DAC081C081CIMK/NOPB
ACTIVE
SOT
DDC
6
1000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
X86C
DAC081C081CIMKX/NOPB
ACTIVE
SOT
DDC
6
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
X86C
DAC081C081CISD/NOPB
ACTIVE
WSON
NGF
6
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
X89
DAC081C081CISDX/NOPB
ACTIVE
WSON
NGF
6
4500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
X89
DAC081C085CIMM/NOPB
ACTIVE
VSSOP
DGK
8
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
X92C
DAC081C085CIMMX/NOPB
ACTIVE
VSSOP
DGK
8
3500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
X92C
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
8-Oct-2015
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
8-Oct-2015
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
DAC081C081CIMK/NOPB
DAC081C081CIMKX/NOP
B
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
SOT
DDC
6
1000
178.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
SOT
DDC
6
3000
178.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
NGF
6
1000
178.0
12.4
2.8
2.5
1.0
8.0
12.0
Q1
DAC081C081CISDX/NOP
B
DAC081C081CISD/NOPB WSON
WSON
NGF
6
4500
330.0
12.4
2.8
2.5
1.0
8.0
12.0
Q1
DAC081C085CIMM/NOP
B
VSSOP
DGK
8
1000
178.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
DAC081C085CIMMX/NO
PB
VSSOP
DGK
8
3500
330.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
8-Oct-2015
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
DAC081C081CIMK/NOPB
SOT
DDC
6
1000
210.0
185.0
35.0
SOT
DDC
6
3000
210.0
185.0
35.0
DAC081C081CIMKX/NOP
B
WSON
NGF
6
1000
210.0
185.0
35.0
DAC081C081CISDX/NOP
B
DAC081C081CISD/NOPB
WSON
NGF
6
4500
367.0
367.0
35.0
DAC081C085CIMM/NOPB
VSSOP
DGK
8
1000
210.0
185.0
35.0
VSSOP
DGK
8
3500
367.0
367.0
35.0
DAC081C085CIMMX/NOP
B
Pack Materials-Page 2
MECHANICAL DATA
NGF0006A
www.ti.com
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TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
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