CY7C1461AV33 CY7C1463AV33 CY7C1465AV33 36-Mbit (1M x 36/2 M x 18/512K x 72) Flow-Through SRAM with NoBL™ Architecture Functional Description[1] Features • No Bus Latency™ (NoBL™) architecture eliminates dead cycles between write and read cycles • Supports up to 133-MHz bus operations with zero wait states — Data is transferred on every clock • Pin-compatible and functionally equivalent to ZBT™ devices • Internally self timed output buffer control to eliminate the need to use OE • Registered inputs for flow through operation The CY7C1461AV33/CY7C1463AV33/CY7C1465AV33 is a 3.3V, 1M x 36/2M x 18/512K x 72 Synchronous Flow -through Burst SRAM designed specifically to support unlimited true back-to-back Read/Write operations without the insertion of wait states. The CY7C1461AV33/CY7C1463AV33/CY7C1465AV33 is equipped with the advanced No Bus Latency (NoBL) logic required to enable consecutive Read/Write operations with data being transferred on every clock cycle. This feature dramatically improves the throughput of data through the SRAM, especially in systems that require frequent Write-Read transitions. All synchronous inputs pass through input registers controlled by the rising edge of the clock. The clock input is qualified by the Clock Enable (CEN) signal, which when deasserted suspends operation and extends the previous clock cycle. Maximum access delay from the clock rise is 6.5 ns (133-MHz device). • Byte Write capability • 3.3V/2.5V IO power supply • Fast clock-to-output times — 6.5 ns (for 133-MHz device) • Clock Enable (CEN) pin to enable clock and suspend operation • Synchronous self timed writes • Asynchronous Output Enable • CY7C1461AV33, CY7C1463AV33 available in JEDEC-standard Pb-free 100-pin TQFP package, Pb-free and non-Pb-free 165-Ball FBGA package. CY7C1465AV33 available in Pb-free and non-Pb-free 209-Ball FBGA package Write operations are controlled by the two or four Byte Write Select (BWX) and a Write Enable (WE) input. All writes are conducted with on-chip synchronous self timed write circuitry. Three synchronous Chip Enables (CE1, CE2, CE3) and an asynchronous Output Enable (OE) provide for easy bank selection and output tri-state control. To avoid bus contention, the output drivers are synchronously tri-stated during the data portion of a write sequence. • Three chip enables for simple depth expansion • Automatic Power down feature available using ZZ mode or CE deselect • IEEE 1149.1 JTAG-Compatible Boundary Scan • Burst Capability — linear or interleaved burst order • Low standby power Selection Guide 133 MHz 100 MHz Unit Maximum Access Time 6.5 8.5 ns Maximum Operating Current 310 290 mA Maximum CMOS Standby Current 120 120 mA Note: 1. For best-practices recommendations, please refer to the Cypress application note System Design Guidelines on www.cypress.com. Cypress Semiconductor Corporation Document #: 38-05356 Rev. *F • 198 Champion Court • San Jose, CA 95134-1709 • 408-943-2600 Revised July 09, 2007 CY7C1461AV33 CY7C1463AV33 CY7C1465AV33 Logic Block Diagram – CY7C1461AV33 (1M x 36) ADDRESS REGISTER A0, A1, A A1 D1 A0 D0 MODE CLK CEN C CE ADV/LD C BURST LOGIC Q1 A1' A0' Q0 WRITE ADDRESS REGISTER ADV/LD BW A WRITE DRIVERS WRITE REGISTRY AND DATA COHERENCY CONTROL LOGIC BW B BW C MEMORY ARRAY S E N S E A M P S BW D WE INPUT REGISTER OE CE1 CE2 CE3 D A T A S T E E R I N G O U T P U T B U F F E R S DQs DQP A DQP B DQP C DQP D E E READ LOGIC SLEEP CONTROL ZZ Logic Block Diagram – CY7C1463AV33 (2M x 18) ADDRESS REGISTER A0, A1, A A1 D1 A0 D0 MODE CLK CEN C CE ADV/LD C BURST LOGIC Q1 A1' A0' Q0 WRITE ADDRESS REGISTER ADV/LD BW A BW B WRITE REGISTRY AND DATA COHERENCY CONTROL LOGIC WRITE DRIVERS MEMORY ARRAY S E N S E A M P S WE OE CE1 CE2 CE3 ZZ Document #: 38-05356 Rev. *F INPUT REGISTER D A T A S T E E R I N G O U T P U T B U F F E R S DQs DQP A DQP B E E READ LOGIC SLEEP CONTROL Page 2 of 31 CY7C1461AV33 CY7C1463AV33 CY7C1465AV33 Logic Block Diagram – CY7C1465AV33 (512K x 72) ADDRESS REGISTER 0 A0, A1, A A1 A1' D1 Q1 A0 A0' BURST D0 Q0 LOGIC MODE CLK CEN ADV/LD C C WRITE ADDRESS REGISTER 1 WRITE ADDRESS REGISTER 2 S E N S E ADV/LD BW a BW b BW c BW d BW e BW f BW g BW h WRITE REGISTRY AND DATA COHERENCY CONTROL LOGIC WRITE DRIVERS MEMORY ARRAY A M P S O U T P U T R E G I S T E R S O U T P U T D A T A B U F F E R S S T E E R I N G E E DQ s DQ Pa DQ Pb DQ Pc DQ Pd DQ Pe DQ Pf DQ Pg DQ Ph WE INPUT REGISTER 1 OE CE1 CE2 CE3 ZZ Document #: 38-05356 Rev. *F E INPUT REGISTER 0 E READ LOGIC Sleep Control Page 3 of 31 CY7C1461AV33 CY7C1463AV33 CY7C1465AV33 Pin Configurations A 40 41 42 43 44 45 46 47 48 49 50 NC/72M A A A A A A A A 37 A0 VSS 36 A1 VDD 35 A 39 34 A NC/144M 33 A 38 32 NC/288M 31 Document #: 38-05356 Rev. *F 81 A 82 A 83 A 84 ADV/LD 85 OE 86 90 CEN VSS 91 WE VDD 92 88 CE3 93 CLK BWA 94 89 BWC 96 BWB BWD 97 95 CE2 98 A CE1 87 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 CY7C1461AV33 A BYTE D 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 MODE BYTE C DQPC DQC DQC VDDQ VSS DQC DQC DQC DQC VSS VDDQ DQC DQC NC VDD NC VSS DQD DQD VDDQ VSS DQD DQD DQD DQD VSS VDDQ DQD DQD DQPD 99 100 A 100-Pin TQFP Pinout DQPB DQB DQB VDDQ VSS DQB DQB DQB DQB VSS VDDQ DQB DQB VSS NC VDD ZZ DQA DQA VDDQ VSS DQA DQA DQA DQA VSS VDDQ DQA DQA DQPA BYTE B BYTE A Page 4 of 31 CY7C1461AV33 CY7C1463AV33 CY7C1465AV33 Pin Configurations (continued) A 42 43 44 45 46 47 48 49 50 A A A A A A A A 41 NC/72M 40 37 A0 VSS 36 A1 VDD 35 A 39 34 A NC/144M 33 A 38 32 NC/288M 31 Document #: 38-05356 Rev. *F 81 A 82 A 83 A 84 85 ADV/LD OE 86 90 CEN VSS 91 WE VDD 92 88 CE3 93 CLK BWA 94 89 NC BWB 95 NC 97 96 CE2 98 A CE1 87 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 CY7C1463AV33 A BYTE B VDDQ VSS NC NC DQB DQB VSS VDDQ DQB DQB NC VDD NC VSS DQB DQB VDDQ VSS DQB DQB DQPB NC VSS VDDQ NC NC NC 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 MODE NC NC NC 99 100 A 100-Pin TQFP Pinout A NC NC VDDQ VSS NC DQPA DQA DQA VSS VDDQ DQA DQA VSS NC VDD ZZ BYTE A DQA DQA VDDQ VSS DQA DQA NC NC VSS VDDQ NC NC NC Page 5 of 31 CY7C1461AV33 CY7C1463AV33 CY7C1465AV33 Pin Configurations (continued) 165-Ball FBGA (15 x 17 x 1.4 mm) Pinout CY7C1461AV33 (1M x 36) 1 2 3 4 5 6 7 8 9 10 11 A B C D E F G H J K L M N P NC/576M A CE1 BWC BWB CE3 CEN ADV/LD A A NC R MODE NC/1G A CE2 BWD BWA CLK WE OE A A NC DQPC DQC NC DQC VDDQ VSS VSS VSS VSS VSS VSS VSS VDD VDDQ VDDQ VSS VDD VDDQ NC DQB DQPB DQB DQC DQC VDDQ VDD VSS VSS VSS VDD VDDQ DQB DQB DQC DQC NC DQD DQC VDDQ VDD VSS VSS VSS VDD DQB DQB DQC NC DQD VDDQ NC VDDQ VDD VDD VDD VSS VSS VSS VSS VSS VSS VSS VSS VSS VDD VDD VDD VDDQ VDDQ NC VDDQ DQB NC DQA DQB ZZ DQA DQD DQD VDDQ VDD VSS VSS VSS VDD VDDQ DQA DQA DQD DQD VDDQ VDD VSS VSS VSS VDD VDDQ DQA DQA DQD DQPD DQD NC VDDQ VDDQ VDD VSS VSS NC VSS VDD VSS VDDQ VDDQ DQA NC DQA DQPA A A TDI NC A1 VSS NC TDO A A A NC/288M A A TMS A0 TCK A A A A NC/144M NC/72M A CY7C1463AV33 (2M x 18) A B C D E F G H J K L M N P R 1 2 3 4 5 6 7 8 9 10 11 NC/576M A CE1 BWB NC CE3 CEN ADV/LD A A A NC/1G A CE2 NC BWA CLK WE OE A A NC NC NC NC DQB VDDQ VDDQ VSS VDD VSS VSS VSS VSS VSS VSS VSS VDD VDDQ VDDQ NC NC DQPA DQA NC DQB VDDQ VDD VSS VSS VSS VDD VDDQ NC DQA NC DQB VDDQ VDD VSS VSS VSS VDD VDDQ NC DQA NC NC DQB DQB NC NC VDDQ NC VDDQ VDD VDD VDD VSS VSS VSS VSS VSS VSS VSS VSS VSS VDD VDD VDD VDDQ NC VDDQ NC NC DQA DQA ZZ NC DQB NC VDDQ VDD VSS VSS VSS VDD VDDQ DQA NC DQB NC VDDQ VDD VSS VSS VSS VDD VDDQ DQA NC DQB DQPB NC NC VDDQ VDDQ VDD VSS VSS NC VSS VDD VSS VDDQ VDDQ DQA NC NC NC A A TDI NC A1 VSS NC TDO A A A NC/288M A A TMS A0 TCK A A A A NC/144M NC/72M MODE A Document #: 38-05356 Rev. *F Page 6 of 31 CY7C1461AV33 CY7C1463AV33 CY7C1465AV33 Pin Configurations (continued) 209-Ball FBGA (14 x 22 x 1.76 mm) Pinout CY7C1465AV33 (512K × 72) 1 2 3 4 5 6 7 8 9 A DQg DQg A CE2 A ADV/LD A CE3 A DQb DQb B DQg DQg BWSc BWSg NC WE A BWSb BWSf DQb DQb C DQg DQg BWSh BWSd NC/576M CE1 NC BWSe BWSa DQb DQb D DQg DQg VSS NC OE NC NC VSS DQb DQb E DQPg DQPc VDDQ VDDQ VDD VDD VDD VDDQ VDDQ DQPf DQPb F DQc DQc VSS VSS VSS NC VSS VSS VSS DQf G DQc DQc VDDQ VDDQ VDD NC VDD VDDQ VDDQ DQf DQf H DQc DQc VSS VSS VSS NC VSS VSS VSS DQf DQf J DQc DQc VDDQ VDDQ VDD NC VDD VDDQ VDDQ DQf DQf K NC NC CLK NC VSS CEN VSS NC NC NC NC L DQh DQh VDDQ VDDQ VDD NC VDD VDDQ VDDQ DQa DQa M DQh DQh VSS VSS VSS NC VSS VSS VSS DQa DQa N DQh DQh VDDQ VDDQ VDD NC VDD VDDQ VDDQ DQa DQa P DQh DQh VSS VSS VSS ZZ VSS VSS VSS DQa DQa R DQPd DQPh VDDQ VDDQ VDD VDD VDD VDDQ VDDQ T DQd DQd VSS NC NC MODE NC NC DQe DQe U DQd DQd A A A NC/288M DQe DQe V DQd DQd A A A A1 A A A DQe DQe W DQd DQd TMS TDI A A0 A TCK DQe DQe Document #: 38-05356 Rev. *F NC/144M A NC/1G NC/72M TDO VSS 10 DQPa 11 DQf DQPe Page 7 of 31 CY7C1461AV33 CY7C1463AV33 CY7C1465AV33 Pin Definitions Name IO Description A0, A1, A InputAddress Inputs used to select one of the address locations. Sampled at the rising edge of the Synchronous CLK. A[1:0] are fed to the two-bit burst counter. BWA, BWB BWC, BWD, BWE, BWF, BWG, BWH InputByte Write Inputs, Active LOW. Qualified with WE to conduct writes to the SRAM. Sampled on Synchronous the rising edge of CLK. WE InputWrite Enable Input, Active LOW. Sampled on the rising edge of CLK if CEN is active LOW. This Synchronous signal must be asserted LOW to initiate a write sequence. ADV/LD InputAdvance/Load Input. Used to advance the on-chip address counter or load a new address. When Synchronous HIGH (and CEN is asserted LOW) the internal burst counter is advanced. When LOW, a new address can be loaded into the device for an access. After being deselected, ADV/LD must be driven LOW to load a new address. CLK InputClock Clock Input. Used to capture all synchronous inputs to the device. CLK is qualified with CEN. CLK is only recognized if CEN is active LOW. CE1 InputChip Enable 1 Input, Active LOW. Sampled on the rising edge of CLK. Used in conjunction with Synchronous CE2 and CE3 to select/deselect the device. CE2 InputChip Enable 2 Input, Active HIGH. Sampled on the rising edge of CLK. Used in conjunction with Synchronous CE1 and CE3 to select/deselect the device. CE3 InputChip Enable 3 Input, Active LOW. Sampled on the rising edge of CLK. Used in conjunction with Synchronous CE1 and CE2 to select/deselect the device. OE InputOutput Enable, asynchronous input, Active LOW. Combined with the synchronous logic block Asynchronous inside the device to control the direction of the IO pins. When LOW, the IO pins are allowed to behave as outputs. When deasserted HIGH, IO pins are tri-stated, and act as input data pins. OE is masked during the data portion of a write sequence, during the first clock when emerging from a deselected state, when the device is deselected. CEN InputClock Enable Input, Active LOW. When asserted LOW the Clock signal is recognized by the Synchronous SRAM. When deasserted HIGH the Clock signal is masked. Since deasserting CEN does not deselect the device, use CEN to extend the previous cycle when required. ZZ InputZZ “Sleep” Input. This active HIGH input places the device in a non-time critical “sleep” condition Asynchronous with data integrity preserved. During normal operation, this pin has to be LOW or left floating. ZZ pin has an internal pull down. DQs IOBidirectional Data IO lines. As inputs, they feed into an on-chip data register that is triggered by Synchronous the rising edge of CLK. As outputs, they deliver the data contained in the memory location specified by the addresses presented during the previous clock rise of the read cycle. The direction of the pins is controlled by OE. When OE is asserted LOW, the pins behave as outputs. When HIGH, DQs and DQP[A:D] are placed in a tri-state condition.The outputs are automatically tri-stated during the data portion of a write sequence, during the first clock when emerging from a deselected state, and when the device is deselected, regardless of the state of OE. DQPX IOBidirectional Data Parity IO Lines. Functionally, these signals are identical to DQs. During write Synchronous sequences, DQPX is controlled by BWX correspondingly. MODE Input Strap Pin Mode Input. Selects the burst order of the device. When tied to Gnd selects linear burst sequence. When tied to VDD or left floating selects interleaved burst sequence. VDD Power Supply Power supply inputs to the core of the device. VDDQ VSS IO Power Supply Ground Power supply for the IO circuitry. Ground for the device. Document #: 38-05356 Rev. *F Page 8 of 31 CY7C1461AV33 CY7C1463AV33 CY7C1465AV33 Pin Definitions (continued) Name IO Description TDO JTAG serial Serial data-out to the JTAG circuit. Delivers data on the negative edge of TCK. If the JTAG feature is not used, leave this pin unconnected. This pin is not available on TQFP packages. output Synchronous TDI JTAG serial Serial data-In to the JTAG circuit. Sampled on the rising edge of TCK. If the JTAG feature is not being used, this pin can be left floating or connected to VDD through a pull up resistor. This pin is input Synchronous not available on TQFP packages. TMS JTAG serial Serial data-In to the JTAG circuit. Sampled on the rising edge of TCK. If the JTAG feature is not input being used, this pin can be disconnected or connected to VDD. This pin is not available on TQFP Synchronous packages. TCK JTAG-Clock NC N/A No Connects. Not internally connected to the die. NC/72M N/A Not connected to the die. Can be tied to any voltage level. NC/144M N/A Not connected to the die. Can be tied to any voltage level. NC/288M N/A Not connected to the die. Can be tied to any voltage level. NC/576M N/A Not connected to the die. Can be tied to any voltage level. NC/1G N/A Not connected to the die. Can be tied to any voltage level. Clock input to the JTAG circuitry. If the JTAG feature is not being used, this pin must be connected to VSS. This pin is not available on TQFP packages. Functional Overview The CY7C1461AV33/CY7C1463AV33/CY7C1465AV33 is a synchronous flow through burst SRAM designed specifically to eliminate wait states during Write-Read transitions. All synchronous inputs pass through input registers controlled by the rising edge of the clock. The clock signal is qualified with the Clock Enable input signal (CEN). If CEN is HIGH, the clock signal is not recognized and all internal states are maintained. All synchronous operations are qualified with CEN. Maximum access delay from the clock rise (tCDV) is 6.5 ns (133-MHz device). Accesses can be initiated by asserting all three Chip Enables (CE1, CE2, CE3) active at the rising edge of the clock. If Clock Enable (CEN) is active LOW and ADV/LD is asserted LOW, the address presented to the device is latched. The access can either be a read or write operation, depending on the status of the Write Enable (WE). BWX can be used to conduct byte write operations. Write operations are qualified by the Write Enable (WE). All writes are simplified with on-chip synchronous self timed write circuitry. Three synchronous Chip Enables (CE1, CE2, CE3) and an asynchronous Output Enable (OE) simplify depth expansion. All operations (Reads, Writes, and Deselects) are pipelined. ADV/LD must be driven LOW after the device has been deselected to load a new address for the next operation. Single Read Accesses A read access is initiated when these conditions are satisfied at clock rise: • CEN is asserted LOW Document #: 38-05356 Rev. *F • CE1, CE2, and CE3 are ALL asserted active • The Write Enable input signal WE is deasserted HIGH • ADV/LD is asserted LOW. The address presented to the address inputs is latched into the Address Register and presented to the memory array and control logic. The control logic determines that a read access is in progress and allows the requested data to propagate to the output buffers. The data is available within 6.5 ns (133-MHz device) provided OE is active LOW. After the first clock of the read access, the output buffers are controlled by OE and the internal control logic. OE must be driven LOW in order for the device to drive out the requested data. On the subsequent clock, another operation (Read/Write/Deselect) can be initiated. When the SRAM is deselected at clock rise by one of the chip enable signals, its output is tri-stated immediately. Burst Read Accesses The CY7C1461AV33/CY7C1463AV33/CY7C1465AV33 has an on-chip burst counter that allows the user the ability to supply a single address and conduct up to four Reads without reasserting the address inputs. ADV/LD must be driven LOW to load a new address into the SRAM, as described in the Single Read Access section above. The sequence of the burst counter is determined by the MODE input signal. A LOW input on MODE selects a linear burst mode, a HIGH selects an interleaved burst sequence. Both burst counters use A0 and A1 in the burst sequence, and wraps around when incremented sufficiently. A HIGH input on ADV/LD increments the internal burst counter regardless of the state of chip enable inputs or WE. WE is latched at the beginning of a burst cycle. Therefore, the type of access (Read or Write) is maintained throughout the burst sequence. Page 9 of 31 CY7C1461AV33 CY7C1463AV33 CY7C1465AV33 Single Write Accesses Write access are initiated when the following conditions are satisfied at clock rise: (1) CEN is asserted LOW, (2) CE1, CE2, and CE3 are ALL asserted active, and (3) the write signal WE is asserted LOW. The address presented to the address bus is loaded into the Address Register. The write signals are latched into the Control Logic block. The data lines are automatically tri-stated regardless of the state of the OE input signal. This allows the external logic to present the data on DQs and DQPX. On the next clock rise the data presented to DQs and DQPX (or a subset for byte write operations, see truth table for details) inputs is latched into the device and the write is complete. Additional accesses (Read/Write/Deselect) can be initiated on this cycle. The data written during the Write operation is controlled by BWX signals. The CY7C1461AV33/CY7C1463AV33/CY7C1465AV33 provides byte write capability that is described in the truth table. Asserting the Write Enable input (WE) with the selected Byte Write Select input selectively writes to only the desired bytes. Bytes not selected during a byte write operation remains unaltered. A synchronous self timed write mechanism has been provided to simplify the write operations. Byte write capability has been included to greatly simplify Read/Modify/Write sequences, which can be reduced to simple byte write operations. Because the CY7C1461AV33/CY7C1463AV33/CY7C1465AV33 is a common IO device, data must not be driven into the device while the outputs are active. The Output Enable (OE) can be deasserted HIGH before presenting data to the DQs and DQPX inputs. Doing so tri-states the output drivers. As a safety precaution, DQs and DQPX are automatically tri-stated during the data portion of a write cycle, regardless of the state of OE. Burst Write Accesses The CY7C1461AV33/CY7C1463AV33/CY7C1465AV33 has an on-chip burst counter that allows the user the ability to supply a single address and conduct up to four Write operations without reasserting the address inputs. ADV/LD must be driven LOW to load the initial address, as described in the Single Write Access section above. When ADV/LD is driven HIGH on the subsequent clock rise, the Chip Enables (CE1, CE2, and CE3) and WE inputs are ignored and the burst counter is incremented. The correct BWX inputs must be driven in each cycle of the burst write, to write the correct bytes of data. Interleaved Burst Address Table (MODE = Floating or VDD) . First Address A1: A0 Second Address A1: A0 Third Address A1: A0 Fourth Address A1: A0 00 01 10 11 01 00 11 10 10 11 00 01 11 10 01 00 Linear Burst Address Table (MODE = GND) First Address A1: A0 Second Address A1: A0 Third Address A1: A0 Fourth Address A1: A0 00 01 10 11 01 10 11 00 10 11 00 01 11 00 01 10 Sleep Mode The ZZ input pin is an asynchronous input. Asserting ZZ places the SRAM in a power conservation “sleep” mode. Two clock cycles are required to enter into or exit from this “sleep” mode. While in this mode, data integrity is guaranteed. Accesses pending when entering the “sleep” mode are not considered valid nor is the completion of the operation guaranteed. The device must be deselected prior to entering the “sleep” mode. CE1, CE2, and CE3, must remain inactive for the duration of tZZREC after the ZZ input returns LOW. ZZ Mode Electrical Characteristics Parameter Description Test Conditions Min Max Unit IDDZZ Sleep mode standby current ZZ > VDD – 0.2V 100 mA tZZS Device operation to ZZ ZZ > VDD – 0.2V 2tCYC ns tZZREC ZZ recovery time ZZ < 0.2V tZZI ZZ active to sleep current This parameter is sampled tRZZI ZZ Inactive to exit sleep current This parameter is sampled Document #: 38-05356 Rev. *F 2tCYC ns 2tCYC 0 ns ns Page 10 of 31 CY7C1461AV33 CY7C1463AV33 CY7C1465AV33 Truth Table[2, 3, 4, 5, 6, 7, 8] Address Used CE1 CE2 CE3 ZZ Deselect Cycle None H X X L L Deselect Cycle None X X H L Deselect Cycle None X L X Continue Deselect Cycle None X X Read Cycle (Begin Burst) External L Next Operation BWX OE X X X L L->H Tri-State L X X X L L->H Tri-State L L X X X L L->H Tri-State X L H X X X L L->H Tri-State H L L L H X L L L->H Data Out (Q) X X X L H X X L L L->H Data Out (Q) External L H L L L H X H L L->H Tri-State Next X X X L H X X H L L->H Tri-State External L H L L L L L X L L->H Data In (D) Write Cycle (Continue Burst) Next X X X L H X L X L L->H Data In (D) NOP/Write Abort (Begin Burst) None L H L L L L H X L L->H Tri-State Write Abort (Continue Burst) Next X X X L H X H X L L->H Tri-State Current X X X L X X X X H L->H – None X X X H X X X X X X Tri-State Read Cycle (Continue Burst) NOP/Dummy Read (Begin Burst) Dummy Read (Continue Burst) Write Cycle (Begin Burst) Ignore Clock Edge (Stall) Sleep Mode ADV/LD WE CEN CLK DQ Notes: 2. X = “Don't Care.” H = Logic HIGH, L = Logic LOW. BWx = L signifies at least one Byte Write Select is active, BWx = Valid signifies that the desired byte write selects are asserted, see truth table for details. 3. Write is defined by BWX, and WE. See truth table for Read/Write. 4. When a write cycle is detected, all IOs are tri-stated, even during byte writes. 5. The DQs and DQPX pins are controlled by the current cycle and the OE signal. OE is asynchronous and is not sampled with the clock. 6. CEN = H, inserts wait states. 7. Device powers up deselected and the IOs in a tri-state condition, regardless of OE. 8. OE is asynchronous and is not sampled with the clock rise. It is masked internally during write cycles. During a read cycle DQs and DQPX = Tri-state when OE is inactive or when the device is deselected, and DQs and DQPX = data when OE is active. Document #: 38-05356 Rev. *F Page 11 of 31 CY7C1461AV33 CY7C1463AV33 CY7C1465AV33 Truth Table for Read/Write[2, 9] Function (CY7C1461AV33) WE BWA BWB BWC BWD Read H X X X X Write No bytes written L H H H H Write Byte A – (DQA and DQPA) L L H H H Write Byte B – (DQB and DQPB) L H L H H Write Byte C – (DQC and DQPC) L H H L H Write Byte D – (DQD and DQPD) L H H H L Write All Bytes L L L L L WE BWb BWa Truth Table for Read/Write[2, 9] Function (CY7C1463AV33) Read H X X Write – No Bytes Written L H H Write Byte a – (DQa and DQPa) L H L Write Byte b – (DQb and DQPb) L L H Write Both Bytes L L L WE BWx Read H X Write – No Bytes Written L H Write Byte X − (DQx and DQPx) L L Write All Bytes L All BW = L Truth Table for Read/Write[2, 9] Function (CY7C1465AV33) Note: 9. Table only lists a partial listing of the byte write combinations. Any Combination of BWX is valid Appropriate write is done based on which byte write is active Document #: 38-05356 Rev. *F Page 12 of 31 CY7C1461AV33 CY7C1463AV33 CY7C1465AV33 IEEE 1149.1 Serial Boundary Scan (JTAG) Test Data In (TDI) The CY7C1461AV33/CY7C1463AV33/CY7C1465AV33 contains a TAP controller, instruction register, boundary scan register, bypass register, and ID register. The TDI ball is used to serially input information into the registers and can be connected to the input of any of the registers. The register between TDI and TDO is chosen by the instruction that is loaded into the TAP instruction register. TDI is internally pulled up and can be unconnected if the TAP is unused in an application. TDI is connected to the most significant bit (MSB) of any register. (See Tap Controller Block Diagram.) Disabling the JTAG Feature Test Data Out (TDO) It is possible to operate the SRAM without using the JTAG feature. To disable the TAP controller, TCK must be tied LOW (VSS) to prevent clocking of the device. TDI and TMS are internally pulled up and may be unconnected. They may alternately be connected to VDD through a pull up resistor. TDO must be left unconnected. Upon power up, the device is up in a reset state which does not interfere with the operation of the device. The TDO output ball is used to serially clock data-out from the registers. The output is active depending upon the current state of the TAP state machine. The output changes on the falling edge of TCK. TDO is connected to the least significant bit (LSB) of any register. (See Tap Controller State Diagram.) The CY7C1461AV33/CY7C1463AV33/CY7C1465AV33 incorporates a serial boundary scan test access port (TAP). This part is fully compliant with 1149.1. The TAP operates using JEDEC-standard 3.3V/2.5V IO logic level. TAP Controller Block Diagram TAP Controller State Diagram 1 0 Bypass Register TEST-LOGIC RESET 2 1 0 0 0 RUN-TEST/ IDLE 1 SELECT DR-SCAN 1 SELECT IR-SCAN 0 1 1 CAPTURE-DR TDO x . . . . . 2 1 0 SHIFT-IR 1 Selection Circuitry Identification Register 0 0 Instruction Register 31 30 29 . . . 2 1 0 CAPTURE-IR 0 0 Boundary Scan Register 1 EXIT1-DR 1 EXIT1-IR PAUSE-DR 0 1 0 TCK PAUSE-IR TMS 0 1 0 TAP CONTROLLER 1 EXIT2-DR 0 EXIT2-IR 1 1 UPDATE-DR UPDATE-IR 1 TDI 0 SHIFT-DR 0 1 Selection Circuitry 0 1 0 Performing a TAP Reset A RESET is performed by forcing TMS HIGH (VDD) for five rising edges of TCK. This RESET does not affect the operation of the SRAM and may be performed while the SRAM is operating. At power up, the TAP is reset internally to ensure that TDO comes up in a High-Z state. The 0/1 next to each state represents the value of TMS at the rising edge of TCK. Test Access Port (TAP) Test Clock (TCK) The test clock is used only with the TAP controller. All inputs are captured on the rising edge of TCK. All outputs are driven from the falling edge of TCK. Test Mode Select (TMS) The TMS input is used to give commands to the TAP controller and is sampled on the rising edge of TCK. It is allowable to leave this ball unconnected if the TAP is not used. The ball is pulled up internally, resulting in a logic HIGH level. Document #: 38-05356 Rev. *F TAP Registers Registers are connected between the TDI and TDO balls and allow data to be scanned into and out of the SRAM test circuitry. Only one register can be selected at a time through the instruction register. Data is serially loaded into the TDI ball on the rising edge of TCK. Data is output on the TDO ball on the falling edge of TCK. Instruction Register Three-bit instructions can be serially loaded into the instruction register. This register is loaded when it is placed between the TDI and TDO balls as shown in the Tap Controller Block Diagram. Upon power up, the instruction register is loaded with the IDCODE instruction. It is also loaded with the IDCODE instruction if the controller is placed in a reset state as described in the previous section. Page 13 of 31 CY7C1461AV33 CY7C1463AV33 CY7C1465AV33 When the TAP controller is in the Capture-IR state, the two least significant bits are loaded with a binary “01” pattern to allow for fault isolation of the board-level serial test data path. The IDCODE instruction is loaded into the instruction register upon power up or whenever the TAP controller is supplied a test logic reset state. Bypass Register SAMPLE Z To save time when serially shifting data through registers, it is sometimes advantageous to skip certain chips. The bypass register is a single-bit register that can be placed between the TDI and TDO balls. This allows data to be shifted through the SRAM with minimal delay. The bypass register is set LOW (VSS) when the BYPASS instruction is executed. The SAMPLE Z instruction causes the boundary scan register to be connected between the TDI and TDO pins when the TAP controller is in a Shift-DR state. The SAMPLE Z command puts the output bus into a High-Z state until the next command is supplied during the “Update IR” state. Boundary Scan Register SAMPLE/PRELOAD is a 1149.1 mandatory instruction. When the SAMPLE/PRELOAD instructions are loaded into the instruction register and the TAP controller is in the Capture-DR state, a snapshot of data on the inputs and output pins is captured in the boundary scan register. The boundary scan register is connected to all the input and bidirectional balls on the SRAM. The length of the Boundary Scan Register for the SRAM in different packages is listed in the Scan Register Sizes table. The boundary scan register is loaded with the contents of the RAM IO ring when the TAP controller is in the Capture-DR state and is then placed between the TDI and TDO balls when the controller is moved to the Shift-DR state. The EXTEST, SAMPLE/PRELOAD and SAMPLE Z instructions can be used to capture the contents of the IO ring. The Boundary Scan Order tables show the order in which the bits are connected. Each bit corresponds to one of the bumps on the SRAM package. The MSB of the register is connected to TDI, and the LSB is connected to TDO. Identification (ID) Register The ID register is loaded with a vendor-specific, 32-bit code during the Capture-DR state when the IDCODE command is loaded in the instruction register. The IDCODE is hardwired into the SRAM and can be shifted out when the TAP controller is in the Shift-DR state. The ID register has a vendor code and other information described in the Identification Register Definitions table. TAP Instruction Set Overview Eight different instructions are possible with the three bit instruction register. All combinations are listed in the Instruction Codes table. Three of these instructions are listed as RESERVED and must not be used. The other five instructions are described in detail below. Instructions are loaded into the TAP controller during the Shift-IR state when the instruction register is placed between TDI and TDO. During this state, instructions are shifted through the instruction register through the TDI and TDO balls. To execute the instruction after it is shifted in, the TAP controller needs to be moved into the Update-IR state. IDCODE The IDCODE instruction causes a vendor-specific, 32-bit code to be loaded into the instruction register. It also places the instruction register between the TDI and TDO balls and allows the IDCODE to be shifted out of the device when the TAP controller enters the Shift-DR state. Document #: 38-05356 Rev. *F SAMPLE/PRELOAD The user must be aware that the TAP controller clock can only operate at a frequency up to 20 MHz, while the SRAM clock operates more than an order of magnitude faster. Because there is a large difference in the clock frequencies, it is possible that during the Capture-DR state, an input or output undergoes a transition. The TAP may then try to capture a signal while in transition (metastable state). This does not harm the device, but there is no guarantee as to the value that is captured. Repeatable results may not be possible. To guarantee that the boundary scan register captures the correct value of a signal, the SRAM signal must be stabilized long enough to meet the TAP controller's capture setup plus hold times (tCS and tCH). The SRAM clock input might not be captured correctly if there is no way in a design to stop (or slow) the clock during a SAMPLE/PRELOAD instruction. If this is an issue, it is still possible to capture all other signals and simply ignore the value of the CK and CK captured in the boundary scan register. Once the data is captured, it is possible to shift out the data by putting the TAP into the Shift-DR state. This places the boundary scan register between the TDI and TDO pins. PRELOAD allows an initial data pattern to be placed at the latched parallel outputs of the boundary scan register cells prior to the selection of another boundary scan test operation. The shifting of data for the SAMPLE and PRELOAD phases can occur concurrently when required—that is, while data captured is shifted out, the preloaded data can be shifted in. BYPASS When the BYPASS instruction is loaded in the instruction register and the TAP is placed in a Shift-DR state, the bypass register is placed between the TDI and TDO pins. The advantage of the BYPASS instruction is that it shortens the boundary scan path when multiple devices are connected together on a board. EXTEST The EXTEST instruction enables the preloaded data to be driven out through the system output pins. This instruction also selects the boundary scan register to be connected for serial access between the TDI and TDO in the shift-DR controller state. Page 14 of 31 CY7C1461AV33 CY7C1463AV33 CY7C1465AV33 This bit can be set by entering the SAMPLE/PRELOAD or EXTEST command, and then shifting the desired bit into that cell, during the “Shift-DR” state. During “Update-DR”, the value loaded into that shift-register cell latches into the preload register. When the EXTEST instruction is entered, this bit directly controls the output Q-bus pins. Note that this bit is pre-set HIGH to enable the output when the device is powered-up, and also when the TAP controller is in the “Test-Logic-Reset” state. EXTEST OUTPUT BUS TRI-STATE IEEE Standard 1149.1 mandates that the TAP controller be able to put the output bus into a tri-state mode. The boundary scan register has a special bit located at bit #89 (for 165-FBGA package) or bit #138 (for 209 FBGA package). When this scan cell, called the “extest output bus tri-state”, is latched into the preload register during the “Update-DR” state in the TAP controller, it directly controls the state of the output (Q-bus) pins, when the EXTEST is entered as the current instruction. When HIGH, it enables the output buffers to drive the output bus. When LOW, this bit places the output bus into a High-Z condition. Reserved These instructions are not implemented but are reserved for future use. Do not use these instructions. TAP Timing 1 2 Test Clock (TCK) 3 t t TH t TMSS t TMSH t TDIS t TDIH TL 4 5 6 t CYC Test Mode Select (TMS) Test Data-In (TDI) t TDOV t TDOX Test Data-Out (TDO) DON’T CARE Document #: 38-05356 Rev. *F UNDEFINED Page 15 of 31 CY7C1461AV33 CY7C1463AV33 CY7C1465AV33 TAP AC Switching Characteristics Over the Operating Range[10, 11] Parameter Description Min Max Unit Clock tTCYC TCK Clock Cycle Time 50 ns tTF TCK Clock Frequency tTH TCK Clock HIGH time 20 ns tTL TCK Clock LOW time 20 ns 20 MHz Output Times tTDOV TCK Clock LOW to TDO Valid 10 ns tTDOX TCK Clock LOW to TDO Invalid 0 ns tTMSS TMS Setup to TCK Clock Rise 5 ns tTDIS TDI Setup to TCK Clock Rise 5 ns tCS Capture Setup to TCK Rise 5 ns tTMSH TMS Hold after TCK Clock Rise 5 ns tTDIH TDI Hold after Clock Rise 5 ns tCH Capture Hold after Clock Rise 5 ns Setup Times Hold Times Notes: 10. tCS and tCH refer to the setup and hold time requirements of latching data from the boundary scan register. 11. Test conditions are specified using the load in TAP AC test Conditions. tR/tF = 1 ns. Document #: 38-05356 Rev. *F Page 16 of 31 CY7C1461AV33 CY7C1463AV33 CY7C1465AV33 3.3V TAP AC Test Conditions 2.5V TAP AC Test Conditions Input pulse levels ................................................ VSS to 3.3V Input pulse levels................................................. VSS to 2.5V Input rise and fall times ................................................... 1 ns Input rise and fall time .....................................................1 ns Input timing reference levels ...........................................1.5V Input timing reference levels......................................... 1.25V Output reference levels...................................................1.5V Output reference levels ............................................... .1.25V Test load termination supply voltage...............................1.5V Test load termination supply voltage ............................ 1.25V 3.3V TAP AC Output Load Equivalent 2.5V TAP AC Output Load Equivalent 1.25V 1.5V 50Ω 50Ω TDO TDO Z O= 50Ω Z O= 50Ω 20pF 20pF TAP DC Electrical Characteristics And Operating Conditions (0°C < TA < +70°C; VDD = 3.135 to 3.6V unless otherwise noted)[12] Parameter VOH1 VOH2 VOL1 VOL2 VIH VIL IX Description Output HIGH Voltage Output HIGH Voltage Output LOW Voltage Output LOW Voltage Test Conditions Max Unit IOH = –4.0 mA, VDDQ = 3.3V 2.4 V IOH = –1.0 mA, VDDQ = 2.5V 2.0 V VDDQ = 3.3V 2.9 V VDDQ = 2.5V 2.1 V IOH = –100 µA IOL = 8.0 mA VDDQ = 3.3V 0.4 V IOL = 1.0 mA VDDQ = 2.5V 0.4 V IOL = 100 µA VDDQ = 3.3V 0.2 V VDDQ = 2.5V 0.2 V Input HIGH Voltage Input LOW Voltage Input Load Current Min GND < VIN < VDDQ VDDQ = 3.3V 2.0 VDD + 0.3 V VDDQ = 2.5V 1.7 VDD + 0.3 V VDDQ = 3.3V –0.3 0.8 V VDDQ = 2.5V –0.3 0.7 V –5 5 µA Note: 12. All voltages referenced to VSS (GND). Document #: 38-05356 Rev. *F Page 17 of 31 CY7C1461AV33 CY7C1463AV33 CY7C1465AV33 Identification Register Definitions CY7C1461AV33 CY7C1463AV33 CY7C1465AV33 (1M x 36) (2M x 18) (512K x 72) Instruction Field Revision Number (31:29) Description 000 000 000 01011 01011 01011 Reserved for internal use Architecture/Memory Type (23:18) 001001 001001 001001 Defines memory type and architecture Bus Width/Density(17:12) 100111 010111 110111 Defines width and density 00000110100 00000110100 00000110100 1 1 1 Device Depth (28:24) [13] Cypress JEDEC ID Code (11:1) ID Register Presence Indicator (0) Describes the version number Allows unique identification of SRAM vendor Indicates the presence of an ID register Scan Register Sizes Register Name Bit Size (x36) Bit Size (x18) Bit Size (x72) Instruction 3 3 3 Bypass 1 1 1 ID 32 32 32 Boundary Scan Order (165-Ball FBGA package) 89 89 – Boundary Scan Order (209-Ball FBGA package) – – 138 Identification Codes Instruction Code Description EXTEST 000 Captures IO ring contents. Places the boundary scan register between TDI and TDO. Forces all SRAM outputs to High-Z state. IDCODE 001 Loads the ID register with the vendor ID code and places the register between TDI and TDO. This operation does not affect SRAM operations. SAMPLE Z 010 Captures IO ring contents. Places the boundary scan register between TDI and TDO. Forces all SRAM output drivers to a High-Z state. RESERVED 011 Do Not Use: This instruction is reserved for future use. SAMPLE/PRELOAD 100 Captures IO ring contents. Places the boundary scan register between TDI and TDO. Does not affect SRAM operation. RESERVED 101 Do Not Use: This instruction is reserved for future use. RESERVED 110 Do Not Use: This instruction is reserved for future use. BYPASS 111 Places the bypass register between TDI and TDO. This operation does not affect SRAM operations. Note: 13. Bit #24 is “1” in the ID Register Definitions for both 2.5V and 3.3V versions of this device. Document #: 38-05356 Rev. *F Page 18 of 31 CY7C1461AV33 CY7C1463AV33 CY7C1465AV33 165-Ball FBGA Boundary Scan Order [14] CY7C1461AV33 (1M x 36), CY7C1463AV33 (2M x 18) Bit# Ball ID Bit# Ball ID Bit# Ball ID Bit# Ball ID 1 N6 26 E11 51 A3 76 N1 2 N7 27 D11 52 A2 77 N2 3 N10 28 G10 53 B2 78 P1 4 P11 29 F10 54 C2 79 R1 5 P8 30 E10 55 B1 80 R2 6 R8 31 D10 56 A1 81 P3 7 R9 32 C11 57 C1 82 R3 8 P9 33 A11 58 D1 83 P2 9 P10 34 B11 59 E1 84 R4 10 R10 35 A10 60 F1 85 P4 11 R11 36 B10 61 G1 86 N5 12 H11 37 A9 62 D2 87 P6 13 N11 38 B9 63 E2 88 R6 14 M11 39 C10 64 F2 89 Internal 15 L11 40 A8 65 G2 16 K11 41 B8 66 H1 17 J11 42 A7 67 H3 18 M10 43 B7 68 J1 19 L10 44 B6 69 K1 20 K10 45 A6 70 L1 21 J10 46 B5 71 M1 22 H9 47 A5 72 J2 23 H10 48 A4 73 K2 24 G11 49 B4 74 L2 25 F11 50 B3 75 M2 Note: 14. Bit# 89 is preset HIGH. Document #: 38-05356 Rev. *F Page 19 of 31 CY7C1461AV33 CY7C1463AV33 CY7C1465AV33 209-Ball FBGA Boundary Scan Order [15] CY7C1465AV33 (512K x 72) Bit# Ball ID Bit# Ball ID Bit# Ball ID Bit# Ball ID 1 W6 36 F6 71 H6 106 K3 2 V6 37 K8 72 C6 107 K4 3 U6 38 K9 73 B6 108 K6 4 W7 39 K10 74 A6 109 K2 5 V7 40 J11 75 A5 110 L2 6 U7 41 J10 76 B5 111 L1 7 T7 42 H11 77 C5 112 M2 8 V8 43 H10 78 D5 113 M1 9 U8 44 G11 79 D4 114 N2 10 T8 45 G10 80 C4 115 N1 11 V9 46 F11 81 A4 116 P2 12 U9 47 F10 82 B4 117 P1 13 P6 48 E10 83 C3 118 R2 14 W11 49 E11 84 B3 119 R1 15 W10 50 D11 85 A3 120 T2 16 V11 51 D10 86 A2 121 T1 17 V10 52 C11 87 A1 122 U2 18 U11 53 C10 88 B2 123 U1 19 U10 54 B11 89 B1 124 V2 20 T11 55 B10 90 C2 125 V1 21 T10 56 A11 91 C1 126 W2 22 R11 57 A10 92 D2 127 W1 23 R10 58 C9 93 D1 128 T6 24 P11 59 B9 94 E1 129 U3 25 P10 60 A9 95 E2 130 V3 26 N11 61 D8 96 F2 131 T4 27 N10 62 C8 97 F1 132 T5 28 M11 63 B8 98 G1 133 U4 29 M10 64 A8 99 G2 134 V4 30 L11 65 D7 100 H2 135 W5 31 L10 66 C7 101 H1 136 V5 32 K11 67 B7 102 J2 137 U5 33 M6 68 A7 103 J1 138 Internal 34 L6 69 D6 104 K1 35 J6 70 G6 105 N6 Note: 15. Bit# 138 is preset HIGH. Document #: 38-05356 Rev. *F Page 20 of 31 CY7C1461AV33 CY7C1463AV33 CY7C1465AV33 Maximum Ratings DC Input Voltage ................................... –0.5V to VDD + 0.5V Exceeding maximum ratings may impair the useful life of the device. These user guidelines are not tested. Storage Temperature ................................. –65°C to +150°C Ambient Temperature with Power Applied............................................. –55°C to +125°C Current into Outputs (LOW)......................................... 20 mA Static Discharge Voltage........................................... >2001V (MIL-STD-883, Method 3015) Latch-up Current..................................................... >200 mA Operating Range Supply Voltage on VDD Relative to GND........ –0.5V to +4.6V Supply Voltage on VDDQ Relative to GND ...... –0.5V to +VDD DC Voltage Applied to Outputs in Tri-State........................................... –0.5V to VDDQ + 0.5V Range Ambient Temperature VDD VDDQ Commercial 0°C to +70°C 3.3V –5%/+10% 2.5V – 5% to VDD Industrial –40°C to +85°C Electrical Characteristics Over the Operating Range[16, 17] Parameter Description Power Supply Voltage VDD IO Supply Voltage VDDQ Test Conditions for 3.3V IO for 2.5V IO for 3.3V IO, IOH = –4.0 mA for 2.5V IO, IOH = –1.0 mA for 3.3V IO, IOL = 8.0 mA for 2.5V IO, IOL = 1.0 mA for 3.3V IO for 2.5V IO for 3.3V IO for 2.5V IO GND ≤ VI ≤ VDDQ VOH Output HIGH Voltage VOL Output LOW Voltage VIH Input HIGH Voltage[16] VIL Input LOW Voltage[16] IX Input Leakage Current except ZZ and MODE Input Current of MODE Input = VSS Input = VDD Input Current of ZZ Input = VSS Input = VDD Output Leakage Current GND ≤ VI ≤ VDDQ, Output Disabled VDD Operating Supply VDD = Max., IOUT = 0 mA, 7.5 ns cycle, 133 MHz Current f = fMAX = 1/tCYC 10 ns cycle, 100 MHz VDD = Max, Device Deselected, 7.5 ns cycle, 133 MHz Automatic CE Power down VIN ≥ VIH or VIN ≤ VIL 10 ns cycle, 100 MHz Current—TTL Inputs f = fMAX, inputs switching VDD = Max, Device Deselected, All speeds Automatic CE Power down VIN ≤ 0.3V or VIN > VDD – 0.3V, Current—CMOS Inputs f = 0, inputs static VDD = Max, Device Deselected, 7.5 ns cycle, 133 MHz Automatic CE Power down or VIN ≤ 0.3V or VIN > VDDQ – 0.3V 10 ns cycle, 100 MHz Current—CMOS Inputs f = fMAX, inputs switching VDD = Max, Device Deselected, All Speeds Automatic CE Power down VIN ≥ VDD – 0.3V or VIN ≤ 0.3V, Current—TTL Inputs f = 0, inputs static IOZ IDD ISB1 ISB2 ISB3 ISB4 Min 3.135 3.135 2.375 2.4 2.0 2.0 1.7 –0.3 –0.3 –5 Max 3.6 VDD 2.625 Unit V V V V V 0.4 V 0.4 V VDD + 0.3V V VDD + 0.3V V 0.8 V 0.7 V 5 µA 30 5 310 290 180 180 µA µA µA µA µA mA mA mA mA 120 mA 180 180 mA mA 135 mA –30 5 –5 –5 Notes: 16. Overshoot: VIH(AC) < VDD +1.5V (Pulse width less than tCYC/2), undershoot: VIL(AC) > –2V (Pulse width less than tCYC/2). 17. TPower-up: Assumes a linear ramp from 0V to VDD(min.) within 200 ms. During this time VIH < VDD and VDDQ < VDD. Document #: 38-05356 Rev. *F Page 21 of 31 CY7C1461AV33 CY7C1463AV33 CY7C1465AV33 Capacitance[18] Parameter Description CIN Input Capacitance CCLK Clock Input Capacitance CIO Input/Output Capacitance Test Conditions 100 TQFP Max 165 FBGA Max 209 FBGA Max Unit 6.5 7 5 pF 3 7 5 pF 5.5 6 7 pF 100 TQFP Package 165 FBGA Package 209 FBGA Package Unit 25.21 20.8 25.31 °C/W 2.28 3.2 4.48 °C/W TA = 25°C, f = 1 MHz, VDD = 3.3V VDDQ = 2.5V Thermal Resistance[18] Parameter Description ΘJA Thermal Resistance (Junction to Ambient) ΘJC Thermal Resistance (Junction to Case) Test Conditions Test conditions follow standard test methods and procedures for measuring thermal impedance, according to EIA/JESD51. AC Test Loads and Waveforms 3.3V IO Test Load 3.3V OUTPUT R = 317Ω Z0 = 50Ω VT = 1.5V (a) 5 pF INCLUDING JIG AND SCOPE 2.5V IO Test Load 2.5V OUTPUT GND R = 351Ω VT = 1.25V (a) 5 pF INCLUDING JIG AND SCOPE 10% 90% 10% 90% ≤ 1ns ≤ 1ns (b) (c) R = 1667Ω ALL INPUT PULSES VDDQ OUTPUT RL = 50Ω Z0 = 50Ω ALL INPUT PULSES VDDQ OUTPUT RL = 50Ω GND R = 1538Ω (b) 10% 90% 10% 90% ≤ 1ns ≤ 1ns (c) Note: 18. Tested initially and after any design or process change that may affect these parameters. Document #: 38-05356 Rev. *F Page 22 of 31 CY7C1461AV33 CY7C1463AV33 CY7C1465AV33 Switching Characteristics Over the Operating Range[23, 24] 133 MHz Parameter tPOWER Description [19] Min Max 100 MHz Min Max Unit 1 1 ms Clock tCYC Clock Cycle Time 7.5 10 ns tCH Clock HIGH 2.5 3.0 ns tCL Clock LOW 2.5 3.0 ns Output Times tCDV Data Output Valid After CLK Rise tDOH Data Output Hold After CLK Rise 2.5 2.5 ns tCLZ Clock to Low-Z[20, 21, 22] 2.5 2.5 ns tCHZ Clock to High-Z[20, 21, 22] 3.8 tOEV OE LOW to Output Valid 3.0 tOELZ OE LOW to Output Low-Z[20, 21, 22] tOEHZ OE HIGH to Output 6.5 0 High-Z[20, 21, 22] 8.5 0 4.5 ns 3.8 ns 0 3.0 ns ns 4.0 ns Setup Times tAS Address Setup Before CLK Rise 1.5 1.5 ns tALS ADV/LD Setup Before CLK Rise 1.5 1.5 ns tWES WE, BWX Setup Before CLK Rise 1.5 1.5 ns tCENS CEN Setup Before CLK Rise 1.5 1.5 ns tDS Data Input Setup Before CLK Rise 1.5 1.5 ns tCES Chip Enable Setup Before CLK Rise 1.5 1.5 ns tAH Address Hold After CLK Rise 0.5 0.5 ns tALH ADV/LD Hold After CLK Rise 0.5 0.5 ns tWEH WE, BWX Hold After CLK Rise 0.5 0.5 ns tCENH CEN Hold After CLK Rise 0.5 0.5 ns tDH Data Input Hold After CLK Rise 0.5 0.5 ns tCEH Chip Enable Hold After CLK Rise 0.5 0.5 ns Hold Times Notes: 19. This part has a voltage regulator internally; tPOWER is the time that the power needs to be supplied above VDD(minimum) initially, before a read or write operation can be initiated. 20. tCHZ, tCLZ,tOELZ, and tOEHZ are specified with AC test conditions shown in part (b) of AC Test Loads. Transition is measured ± 200 mV from steady-state voltage. 21. At any voltage and temperature, tOEHZ is less than tOELZ and tCHZ is less than tCLZ to eliminate bus contention between SRAMs when sharing the same data bus. These specifications do not imply a bus contention condition, but reflect parameters guaranteed over worst case user conditions. Device is designed to achieve High-Z prior to Low-Z under the same system conditions. 22. This parameter is sampled and not 100% tested. 23. Timing reference level is 1.5V when VDDQ = 3.3V and is 1.25V when VDDQ = 2.5V. 24. Test conditions shown in (a) of AC Test Loads unless otherwise noted. Document #: 38-05356 Rev. *F Page 23 of 31 CY7C1461AV33 CY7C1463AV33 CY7C1465AV33 Switching Waveforms Read/Write Waveforms[25, 26, 27] 1 2 3 t CY C 4 5 6 7 8 9 A5 A6 A7 10 CLK t CENS t CENH t CES t CEH t CH t CL CEN CE ADV/LD WE BW X A1 ADDRESS t AS A2 A4 A3 t CDV t AH t DOH t CLZ DQ D(A1) t DS D(A2) Q(A3) D(A2+1) t OEV Q(A4+1) Q(A4) t OELZ W RITE D(A1) W RITE D(A2) D(A5) Q(A6) D(A7) W RITE D(A7) DESELECT t OEHZ t DH OE COM M AND t CHZ BURST W RITE D(A2+1) READ Q(A3) READ Q(A4) DON’T CARE BURST READ Q(A4+1) t DOH W RITE D(A5) READ Q(A6) UNDEFINED Notes: 25. For this waveform ZZ is tied LOW. 26. When CE is LOW, CE1 is LOW, CE2 is HIGH and CE3 is LOW. When CE is HIGH, CE1 is HIGH or CE2 is LOW or CE3 is HIGH. 27. Order of the Burst sequence is determined by the status of the MODE (0 = Linear, 1 = Interleaved). Burst operations are optional. Document #: 38-05356 Rev. *F Page 24 of 31 CY7C1461AV33 CY7C1463AV33 CY7C1465AV33 Switching Waveforms (continued) NOP, STALL and DESELECT Cycles[25, 26, 28] 1 2 A1 A2 3 4 5 A3 A4 6 7 8 9 10 CLK CEN CE ADV/LD WE BW [A:D] ADDRESS A5 t CHZ D(A1) DQ Q(A2) Q(A3) D(A4) Q(A5) t DOH COMMAND WRITE D(A1) READ Q(A2) STALL READ Q(A3) WRITE D(A4) DON’T CARE STALL NOP READ Q(A5) DESELECT CONTINUE DESELECT UNDEFINED Note: 28. The IGNORE CLOCK EDGE or STALL cycle (Clock 3) illustrates CEN being used to create a pause. A write is not performed during this cycle. Document #: 38-05356 Rev. *F Page 25 of 31 CY7C1461AV33 CY7C1463AV33 CY7C1465AV33 Switching Waveforms (continued) ZZ Mode Timing[29, 30] CLK t ZZ I t ZZREC ZZ t ZZI SUPPLY I DDZZ t RZZI A LL INPUTS (except ZZ) Outputs (Q) DESELECT or REA D Only High-Z DON’T CA RE Notes: 29. Device must be deselected when entering ZZ mode. See truth table for all possible signal conditions to deselect the device. 30. DQs are in High-Z when exiting ZZ sleep mode. Document #: 38-05356 Rev. *F Page 26 of 31 CY7C1461AV33 CY7C1463AV33 CY7C1465AV33 Ordering Information Not all of the speed, package and temperature ranges are available. Please contact your local sales representative or visit www.cypress.com for actual products offered. Speed (MHz) 133 Ordering Code CY7C1461AV33-133AXC Package Diagram Operating Range Part and Package Type 51-85050 100-Pin Thin Quad Flat Pack (14 x 20 x 1.4 mm) Pb-Free Commercial CY7C1463AV33-133AXC CY7C1461AV33-133BZC 51-85165 165-Ball Fine-Pitch Ball Grid Array (15 x 17 x 1.4 mm) CY7C1463AV33-133BZC CY7C1461AV33-133BZXC 51-85165 165-Ball Fine-Pitch Ball Grid Array (15 x 17 x 1.4 mm) Pb-Free CY7C1463AV33-133BZXC CY7C1465AV33-133BGC CY7C1465AV33-133BGXC CY7C1461AV33-133AXI 51-85167 209-Ball Fine-Pitch Ball Grid Array (14 × 22 × 1.76 mm) 209-Ball Fine-Pitch Ball Grid Array (14 × 22 × 1.76 mm) Pb-Free 51-85050 100-Pin Thin Quad Flat Pack (14 x 20 x 1.4 mm) Pb-Free lndustrial CY7C1463AV33-133AXI CY7C1461AV33-133BZI 51-85165 165-Ball Fine-Pitch Ball Grid Array (15 x 17 x 1.4 mm) CY7C1463AV33-133BZI CY7C1461AV33-133BZXI 51-85165 165-Ball Fine-Pitch Ball Grid Array (15 x 17 x 1.4 mm) Pb-Free CY7C1463AV33-133BZXI CY7C1465AV33-133BGI CY7C1465AV33-133BGXI 100 CY7C1461AV33-100AXC 51-85167 209-Ball Fine-Pitch Ball Grid Array (14 × 22 × 1.76 mm) 209-Ball Fine-Pitch Ball Grid Array (14 × 22 × 1.76 mm) Pb-Free 51-85050 100-Pin Thin Quad Flat Pack (14 x 20 x 1.4 mm) Pb-Free Commercial CY7C1463AV33-100AXC CY7C1461AV33-100BZC 51-85165 165-Ball Fine-Pitch Ball Grid Array (15 x 17 x 1.4 mm) CY7C1463AV33-100BZC CY7C1461AV33-100BZXC 51-85165 165-Ball Fine-Pitch Ball Grid Array (15 x 17 x 1.4 mm) Pb-Free CY7C1463AV33-100BZXC CY7C1465AV33-100BGC CY7C1465AV33-100BGXC CY7C1461AV33-100AXI 51-85167 209-Ball Fine-Pitch Ball Grid Array (14 × 22 × 1.76 mm) 209-Ball Fine-Pitch Ball Grid Array (14 × 22 × 1.76 mm) Pb-Free 51-85050 100-Pin Thin Quad Flat Pack (14 x 20 x 1.4 mm) Pb-Free lndustrial CY7C1463AV33-100AXI CY7C1461AV33-100BZI 51-85165 165-Ball Fine-Pitch Ball Grid Array (15 x 17 x 1.4 mm) CY7C1463AV33-100BZI CY7C1461AV33-100BZXI 51-85165 165-Ball Fine-Pitch Ball Grid Array (15 x 17 x 1.4 mm) Pb-Free CY7C1463AV33-100BZXI CY7C1465AV33-100BGI CY7C1465AV33-100BGXI Document #: 38-05356 Rev. *F 51-85167 209-Ball Fine-Pitch Ball Grid Array (14 × 22 × 1.76 mm) 209-Ball Fine-Pitch Ball Grid Array (14 × 22 × 1.76 mm) Pb-Free Page 27 of 31 CY7C1461AV33 CY7C1463AV33 CY7C1465AV33 Package Diagrams Figure 1. 100-Pin Thin Plastic Quad Flatpack (14 x 20 x 1.4 mm), 51-85050 16.00±0.20 1.40±0.05 14.00±0.10 100 81 80 1 20.00±0.10 22.00±0.20 0.30±0.08 0.65 TYP. 30 12°±1° (8X) SEE DETAIL A 51 31 50 0.20 MAX. 0.10 1.60 MAX. R 0.08 MIN. 0.20 MAX. 0° MIN. SEATING PLANE STAND-OFF 0.05 MIN. 0.15 MAX. 0.25 NOTE: 1. JEDEC STD REF MS-026 GAUGE PLANE 0°-7° R 0.08 MIN. 0.20 MAX. 2. BODY LENGTH DIMENSION DOES NOT INCLUDE MOLD PROTRUSION/END FLASH MOLD PROTRUSION/END FLASH SHALL NOT EXCEED 0.0098 in (0.25 mm) PER SIDE BODY LENGTH DIMENSIONS ARE MAX PLASTIC BODY SIZE INCLUDING MOLD MISMATCH 3. DIMENSIONS IN MILLIMETERS 0.60±0.15 0.20 MIN. 1.00 REF. DETAIL Document #: 38-05356 Rev. *F A 51-85050-*B Page 28 of 31 CY7C1461AV33 CY7C1463AV33 CY7C1465AV33 Package Diagrams (continued) Figure 2. 165-Ball FBGA (15 x 17 x 1.4 mm), 51-85165 PIN 1 CORNER BOTTOM VIEW TOP VIEW Ø0.05 M C PIN 1 CORNER Ø0.25 M C A B Ø0.45±0.05(165X) 1 2 3 4 5 6 7 8 9 10 11 11 10 9 8 7 6 5 4 3 2 1 A B B C C 1.00 A D D F F G G H J 14.00 E 17.00±0.10 E H J K L L 7.00 K M M N N P P R R A 1.00 5.00 0.35 0.15 C +0.05 -0.10 0.53±0.05 0.25 C 10.00 B 15.00±0.10 0.15(4X) SEATING PLANE Document #: 38-05356 Rev. *F 1.40 MAX. 0.36 C 51-85165-*A Page 29 of 31 CY7C1461AV33 CY7C1463AV33 CY7C1465AV33 Package Diagrams (continued) Figure 3. 209-Ball FBGA (14 x 22 x 1.76 mm), 51-85167 51-85167-** NoBL and No Bus Latency are trademarks of Cypress Semiconductor Corporation. ZBT is a trademark of Integrated Device Technology, Inc. All product and company names mentioned in this document are the trademarks of their respective holders. Document #: 38-05356 Rev. *F Page 30 of 31 © Cypress Semiconductor Corporation, 2004-2007. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges. CY7C1461AV33 CY7C1463AV33 CY7C1465AV33 Document History Page Document Title: CY7C1461AV33/CY7C1463AV33/CY7C1465AV33 36-Mbit (1M x 36/2 M x 18/512K x 72) Flow-Through SRAM with NoBL™ Architecture Document Number: 38-05356 REV. ECN NO. Issue Date Orig. of Change ** 254911 See ECN SYT New data sheet Part number changed from previous revision. New and old part number differ by the letter “A” *A 300131 See ECN SYT Removed 150- and 117-MHz Speed Bins Changed ΘJA and ΘJC from TBD to 25.21 and 2.58 °C/W, respectively, for TQFP package Added Pb-free information for 100-pin TQFP, 165 FBGA and 209 FBGA packages Added “Pb-free BG and BZ packages availability” below the Ordering Information *B 320813 See ECN SYT Changed H9 pin from VSSQ to VSS on the Pin Configuration table for 209 FBGA Changed the test condition from VDD = Min. to VDD = Max for VOL in the Electrical Characteristics table Replaced the TBD’s for IDD, ISB1, ISB2, ISB3 and ISB4 to their respective values Replaced TBD’s for ΘJA and ΘJC to their respective values on the Thermal Resistance table for 165 FBGA and 209 FBGA Packages Changed CIN, CCLK and CIO to 6.5, 3 and 5.5 pF from 5, 5 and 7 pF for TQFP Package Removed “Pb-free BG packages availability” comment below the Ordering Information *C 331551 See ECN SYT Modified Address Expansion balls in the pinouts for 165 FBGA and 209 FBGA Packages according to JEDEC standards and updated the Pin Definitions accordingly Modified VOL, VOH test conditions Replaced TBD to 100 mA for IDDZZ Changed CIN, CCLK and CIO to 7, 7and 6 pF from 5, 5 and 7 pF for 165 FBGA Package Added Industrial Temperature Grade Changed ISB2 and ISB4 from 100 and 110 mA to 120 and 135 mA respectively Updated the Ordering Information by shading and unshading MPNs according to availability *D 417547 See ECN RXU Converted from Preliminary to Final Changed address of Cypress Semiconductor Corporation on Page# 1 from “3901 North First Street” to “198 Champion Court” Changed IX current value in MODE from –5 & 30 µA to –30 & 5 µA respectively and also Changed IX current value in ZZ from –30 & 5 µA to –5 & 30 µA respectively on page# 20 Modified test condition from VIH < VDD to VIH < VDD Modified “Input Load” to “Input Leakage Current except ZZ and MODE” in the Electrical Characteristics Table Replaced Package Name column with Package Diagram in the Ordering Information table Replaced Package Diagram of 51-85050 from *A to *B Updated the Ordering Information *E 473650 See ECN VKN Added the Maximum Rating for Supply Voltage on VDDQ Relative to GND. Changed tTH, tTL from 25 ns to 20 ns and tTDOV from 5 ns to 10 ns in TAP AC Switching Characteristics table. Updated the Ordering Information table. *F 1274733 See ECN VKN/AESA Corrected typo in the “NOP, STALL and DESELECT Cycles” waveform Document #: 38-05356 Rev. *F Description of Change Page 31 of 31