Rohm BM6204FS-E2 3-phase brushless fan motor driver Datasheet

For Air-Conditioner Fan Motor
3-Phase Brushless Fan Motor
Driver
BM6204FS
General Description
This motor driver IC adopts PrestoMOS™ as the output
transistor, and put in a small full molding package with
the 120° square wave commutation controller chip and
the high voltage gate driver chip. The protection circuits
for overcurrent, overheating, under voltage lock out and
the high voltage bootstrap diode with current regulation
are built-in. It provides optimum motor drive system and
downsizing the built-in PCB of the motor.
Key Specifications
Output MOSFET Voltage:
600V
Driver Output Current (DC):
±1.5A (Max)
Driver Output Current (Pulse):
±2.5A (Max)
Output MOSFET DC On Resistance:
2.7Ω (Typ)
Duty Control Voltage Range:
2.1V to 5.4V
Operating Case Temperature:
-20°C to +100°C
Junction Temperature:
+150°C
Power Dissipation:
3.00W
Features
600V PrestoMOS™ built-in
Output current 1.5A
Bootstrap operation by floating high side driver
(including diode)
120° square wave commutation logic
PWM control
Rotational direction switch
FG signal output with pulse number switch (4 or 12)
VREG output (5V/30mA)
Protection circuits provided: CL, OCP, TSD, UVLO,
MLP and the external fault input
Fault output (open drain)
Package
SSOP-A54_36
Applications
Air conditioners; air purifiers; water pumps;
dishwashers; washing machines
W (Typ) x D (Typ) x H (Max)
22.0 mm x 14.1 mm x 2.4 mm
SSOP-A54_36
Typical Application Circuit
VDC
GND
VCC
VSP
R1
D1
C5
C6
C1
C13
C7
C2~C4
C8
M
HW
HV
HU
VREG
R2
R4
C11
R3
FG
R6
Q1
DTR
R5
C10
R11
R9
R13
R12
R10
C14
R8
C12
C9
R7
Figure 1. Application Circuit Example
Product structure : Semiconductor IC This product is not designed protection against radioactive rays
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Datasheet
BM6204FS
Block Diagram and Pin Configuration
VCC
VCC
VSP
VREG
1
36
VDC
BU
35
5
VCC
GND
VSP
6
TEST
VREG
VREG
7
LEVEL
SHIFT
&
GATE
DRIVER
34
U
GND
GND
VCC
VSP
UH
UL
HWN
HWP
HW
HVN
HV
HVP
HUN
HUP
HU
PCT
PC
9
33
10
LEVEL
SHIFT
&
GATE
DRIVER
13
14
LOGIC
V/I
15
VH
VL
FGS
FG
FOB
31
30
LEVEL
SHIFT
&
GATE
DRIVER
17
18
19
VREG
FAULT
29
28
FIB
20
V
M
VDC
BW
WH
WL
VREG
VREG
32
16
TEST
CCW
BV
11
12
W
PGND
GND
26
SNS
24
VSP
21
OSC
23
BU
VREG
NC
HWN
HWP
HVN
HVP
HUN
HUP
PCT
PC
CCW
FGS
FG
FOB
U
BV
V
VDC
SNS
NC
RT
GND
PWM
FAULT
VDC
GND
RT
BW
W
GND
GND
VCC
Figure 2. Block Diagram
PGND
Figure 3. Pin Configuration
Pin Descriptions (NC: No Connection)
Pin
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
Name
VCC
GND
GND
GND
VCC
VSP
VREG
NC
HWN
HWP
HVN
HVP
HUN
HUP
PCT
PC
CCW
FGS
FG
FOB
SNS
NC
RT
GND
GND
GND
VCC
Function
Low voltage power supply
Ground
Ground
Ground
Low voltage power supply
Duty control voltage input pin
Regulator output
Hall input pin phase WHall input pin phase W+
Hall input pin phase VHall input pin phase V+
Hall input pin phase UHall input pin phase U+
VSP offset voltage output pin
PWM switching arm setting pin
Direction switch (H:CCW)
FG pulse # switch (H:12, L:4)
FG signal output
Fault signal output (open drain)
Over current sense pin
Carrier frequency setting pin
Ground
Ground
Ground
Low voltage power supply
Pin
36
-
Name
VDC
VDC
35
34
BU
U
U
33
32
BV
V
V
31
VDC
VDC
30
29
BW
W
W
28
PGND
PGND
Function
High voltage power supply
Phase U floating power supply
Phase U output
Phase V floating power supply
Phase V output
High voltage power supply
Phase W floating power supply
Phase W output
Ground (current sense pin)
Note) All pin cut surfaces visible from the side of package are no connected, except the pin number is expressed as a “-”.
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Datasheet
BM6204FS
Description of Blocks
1. Commutation Logic
When the hall frequency is about 1.4-Hz or less (e.g. when the motor starts up), or PC pin is “L”, the commutation mode
is 120° square wave drive with upper and lower switching (synchronous switching). The controller monitors the hall
frequency, and switches to upper switching when the hall frequency reaches or exceeds about 1.4-Hz over four
consecutive cycles and PC pin is “H”. Refer to the timing charts in figures 12 and 13.
Table 1. 120° commutation (synchronous switching) truth table
HU
H
H
H
L
L
L
HV
L
L
H
H
H
L
HW
H
L
L
L
H
H
UH
L
VH
PWM
L
L
L
L
PWM
L
PWM
L
L
PWM
WH
L
PWM
UL
VL
H
--------------------
PWM
L
L
--------------------
H
WL
PWM
PWM
L
H
--------------------
L
--------------------
H
L
L
--------------------
PWM
L
H
L
--------------------
H
L
PWM
PWM
PWM
2. Duty Control
The switching duty can be controlled by forcing DC voltage with value from VSPMIN to VSPMAX to the VSP pin. When the
VSP voltage is higher than VSPTST, the controller forces PC pin voltage to ground (Testing mode, maximum duty and
synchronous switching). The VSP pin is pulled down internally by a 200 kΩ resistor. Therefore, note the impedance when
setting the VSP voltage with a resistance voltage divider.
3. Carrier Frequency Setting
The carrier frequency setting can be freely adjusted by connecting an external
resistor between the RT pin and ground. The RT pin is biased to a constant
voltage, which determines the charge current to the internal capacitor. Carrier
frequencies can be set within a range from about 16 kHz to 50 kHz. Refer to the
formula to the right.
4. FG Signal Output
The number of FG output pulses can be switched in accordance with the number
of poles and the rotational speed of the motor. The FG signal is output from the FG
pin. The 12-pulse signal is generated from the three hall signals (exclusive NOR),
and the 4-pulse signal is the same as hall U signal. It is recommended to pull up
FGS pin to VREG voltage when malfunctioning because of the noise.
5. Direction of Motor Rotation Setting
The direction of rotation can be switched by the CCW pin. When CCW pin is “H” or
open, the motor rotates at CCW direction. It is recommended to pull up CCW pin to
VREG voltage when malfunctioning because of the noise.
fOSC [ kHz ] 
400
RT [ kohm ]
FGS
No. of pulse
H
12
L
4
CCW
Direction
H
CCW
L
CW
6. Hall Signal Comparator
The hall comparator provides voltage hysteresis to prevent noise malfunctions. The bias current to the hall elements
should be set to the input voltage amplitude from the element, at a value higher than the minimum input voltage, VHALLMIN.
We recommend connecting a ceramic capacitor with value from 100 pF to 0.01 µF, between the differential input pins of
the hall comparator. Note that the bias to hall elements must be set within the common mode input voltage range
VHALLCM.
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Datasheet
BM6204FS
7. Output Duty Pulse Width Limiter
Pulse width duty is controlled during PWM switching in order to ensure the operation of internal power transistor. The
controller doesn’t output pulse of less than TMIN (0.8µs minimum), nor output a duty pulse of DMAX or more. Dead time is
forcibly provided to prevent internal power transistors to turn-on simultaneously in upper and lower side in gate driver
output (for example, UH and UL) of each arm. This will not overlap the minimum time TDT (1.6µs minimum). Because of
this, the maximum duty of the synchronous switching mode is 84% (typical).
8. PWM Switching Arm Setting
The PWM switching arm can choose one from the synchronous switching or the upper switching. When PC is “L”, the
switching mode is the synchronous. And also when PC is “H”, the switching mode is the upper switching. However, when
the hall cycle is about 1.4-Hz or less, the switching mode keeps the synchronous even if PC is “H”. When the PWM
control is entering to the testing mode, the controller forces PC pin voltage to ground and synchronous switching mode.
Therefore, when PC pin pull-up to VREG pin, at least a resistor with a value 10k Ω or more. The VSP offset voltage
(Figure 32) is buffered to PCT pin, to connect an external resistor between PCT pin and ground. The internal bias current
is determined by PCT voltage and the resistor value - VPCT / RPCT -, and mixed to PC pin. Because you can freely
determine the slope by the resistance ratio of PC pin and PCT pin, which allows you to adjust the voltage command
value to switch the synchronous switching or the upper switching. Please select the RPCT value from 50 kΩ to 200 kΩ in
the range on the basis of 100 kΩ, because the PCT pin current capability is a 100 µA or less.
VSP
V PCT = VSP-V SPMIN
V SPMIN
Upper SW
or
Upper/Lower S W
Upper/Lower
SW
PCT
V PC
Upper
SW
V PCT
R PCT
PC
PC: H
PC: L
1/2 V REG
R PCL
R PCT
VSP
Figure 4. PWM Switching Arm Setting
9. Current Limiter (CL) Circuit and Overcurrent Protection (OCP) Circuit
The current limiter circuit can be activated by connecting a low value resistor for current detection between the output
stage ground (PGND) and the controller ground (GND). When the SNS pin voltage reaches or surpasses the threshold
value (VSNS, 0.5V typical), the controller forces all the upper switching arm inputs low (UH, VH, WH = L, L, L), thus
initiating the current limiter operation. When the SNS pin voltage swings below the ground, it is recommended to insert a
resistor - 1.5 kΩ or more - between SNS pin and PGND pin to prevent malfunction. Since this limiter circuit is not a latch
type, it returns to normal operation - synchronizing with the carrier frequency - once the SNS pin voltage falls below the
threshold voltage. A filter is built into the overcurrent detection circuit to prevent malfunctions, and does not activate when
a short pulse of less than TMASK is present at the input.
When the SNS pin voltage reaches or surpasses the threshold value (VOVER, 0.9V typical) because of the power fault or
the short circuit except the ground fault, the gate driver outputs low to the gate of all output MOSFETs, thus initiating the
overcurrent protection operation. Since this protection circuit is also not a latch type, it returns to normal operation
synchronizing with the carrier frequency.
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BM6204FS
10. Under Voltage Lock Out (UVLO) Circuit
To secure the lowest power supply voltage necessary to operate the controller and the driver, and to prevent under
voltage malfunctions, the UVLO circuits are independently built into the upper side floating driver, the lower side driver
and the controller. When the supply voltage falls to VUVL or below, the controller forces driver outputs low. When the
voltage rises to VUVH or above, the UVLO circuit ends the lockout operation and returns the chip only after 32 carrier
periods (1.6ms for the default 20kHz frequency) to normal operation. Even if the controller returns to normal operation,
the output begins from the following control input signal.
The voltage monitor circuit (4.0V nominal) is built-in for the VREG voltage. Therefore, the UVLO circuit does not release
operation when the VREG voltage rising is delayed behind the VCC voltage rising even if VCC voltage becomes VUVH or
more.
11. Thermal Shutdown (TSD) Circuit
The TSD circuit operates when the junction temperature of the controller exceeds the preset temperature (125°C
nominal). At this time, the controller forces all driver outputs low. Since thermal hysteresis is provided in the TSD circuit,
the chip returns to normal operation when the junction temperature falls below the preset temperature (100°C nominal).
The TSD circuit is designed only to shut the IC off to prevent thermal runaway. It is not designed to protect the IC or
guarantee its operation in the presence of extreme heat. Do not continue to use the IC after the TSD circuit is activated,
and do not use the IC in an environment where activation of the circuit is assumed.
Moreover, it is not possible to follow the output MOSFET junction temperature rising rapidly because it is a gate driver
chip that monitors the temperature and it is likely not to function effectively.
12. Motor Lock Protection (MLP) Circuit
When the controller detects the motor locking during fixed time of 4 seconds nominal when each edge of the hall signal
doesn't input either, the controller forces all driver outputs low under a fixed time 20 seconds nominal, and self-returns to
normal operation. This circuit is enabled if the voltage force to VSP is over the duty minimum voltage VSPMIN, and note
that the motor cannot start up when the controller doesn’t detect the motor rotation by the minimum duty control. Even if
the edge of the hall signal is inputted within range of the OFF state by this protection circuit, it is ignored. But if the VSP
is forced to ground level once, the protection can be canceled immediately.
13. Hall Signal Wrong Input Detection
Hall element abnormalities may cause incorrect inputs that vary from the normal logic. When all hall input signals go high
or low, the hall signal wrong input detection circuit forces all driver outputs low. And when the controller detects the
abnormal hall signals continuously for four times or more motor rotation, the controller forces all driver outputs low and
latches the state. It is released if the duty control voltage VSP is forced to ground level once.
14. Internal Voltage Regulator
The internal voltage regulator VREG is output for the bias of the hall
element and the phase control setting. However, when using the VREG
function, be aware of the IOMAX value. If a capacitor is connected to the
ground in order to stabilize output, a value of 1 µF or more should be used.
In this case, be sure to confirm that there is no oscillation in the output.
VCC
VREG
R1
HUP
HU
HUN
HV
HVN
HW
HWN
HVP
HWP
Controller IC
Figure 5. VREG Output Pin Application Example
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BM6204FS
15. Bootstrap Operation
VB
DX
HO
L
VB
VDC
DX
CB
OFF
H
VS
HO
VDC
CB
ON
VS
VCC
VCC
LO
H
L
ON
Figure 6. Charging Period
LO
OFF
Figure 7. Discharging Period
The bootstrap is operated by the charge period and the discharge period being alternately repeated for bootstrap
capacitor (CB) as shown in the figure above. In a word, this operation is repeated while the output of an external
transistor is switching with synchronous rectification. Because the supply voltage of the floating driver is charged from the
VCC power supply to CB through prevention of backflow diode DX, it is approximately (VCC-1V). The resistance series
connection with DX has the impedance of approximately 200 Ω. Because the total gate charge is needed only by the
carrier frequency in the upper switching section of 120° commutation driving, please set it after confirming actual
application operation.
16. Fault Signal Output
When the controller detects either state that should be protected the overcurrent (OCP) and the over temperature (TSD),
the FOB pin outputs low (open drain) and it returns to normal operation synchronizing with the carrier frequency. Even
when this function is not used, the FOB pin is pull-up to the voltage of 3V or more and at least a resistor with a value 10k
Ω or more. A filter is built into the fault signal input circuit to prevent malfunctions by the switching noise, and does not
activate when a short pulse of less than TMASK is present at the input. The time to the fault operation is the sum total of
the propagation delay time of the detection circuit and the filter time, 1.6µs (typical).
VSP
TRIOSC
XH
YL
XHO
YLO
1.6µs (Typ)
SNS
1.6µs (Typ)
1.6µs (Typ)
1.6µs (Typ)
0.9V(Typ)
OCP threshold
0.5V(Typ)
CL threshold
FOB
Figure 8. Fault Operation ~ OCP ~ Timing Chart
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BM6204FS
10
The release time from the protection operation can be
changed by inserting an external capacitor. Refer to
the formula below. Release time of 5ms or more is
recommended.
8
Release time : t [ms]
2 .3
)  R  C [s]
VREG
t   ln( 1 
9
VREG
R
FOB
7
6
5
4
3
2
C
1
0
0.01
Figure 9. Release Time Setting Application Circuit
0.10
1.00
Capacitance : C[µF]
Figure 10. Release Time (Reference Data @R=100kΩ)
17. Switching Time
XH, XL
VDS
trr
ton
td(on)
tr
90%
90%
ID
10%
10%
td(off)
tf
toff
Figure 11. Switching Time Definition
Parameter
High Side Switching
Time
Low Side Switching
Time
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Symbol
tdH(on)
trH
trrH
tdH(off)
tfH
tdL(on)
trL
trrL
tdL(off)
tfL
Reference
790
110
200
490
15
830
110
160
570
80
7/27
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
Conditions
VDC=300V, VCC=15V, ID=0.75A
Inductive load
The propagation delay time: Internal
gate driver input stage to the driver
IC output.
TSZ02201-0828AB400120-1-2
09.Sep.2015 Rev.002
Datasheet
BM6204FS
Timing Chart (CW)
Hall Signals
HALL U
HALL V
HALL W
Spin Up (Hall Period < 1.4Hz)
UH
VHPWM
WH
PWM
PWM
UL
PWM
PWM
PWM
PWM
VLPWM
WL
PWM
PWM
PWM
PWM
PWM
PWM
PWM
PWM
PWM
PWM
PWM
PWM
PWM
PWM
PWM
PWM
PWM
PWM
PC=L, Hall Period >1.4Hz
UH
VHPWM
WH
PWM
PWM
UL
PWM
PWM
PWM
PWM
VLPWM
WL
PWM
PWM
PWM
PWM
PWM
PWM
PWM
PWM
PWM
PWM
PWM
PWM
PWM
PWM
PWM
PWM
PWM
PWM
PC=H, Hall Period >1.4Hz
UH
VHPWM
WH
PWM
PWM
PWM
PWM
PWM
PWM
PWM
PWM
PWM
PWM
PWM
PWM
UL
VL
WL
FG Output (FGS=H)
FG
Figure 12. Timing Chart (Clockwise)
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BM6204FS
Timing Chart (CCW)
Hall Signals
HALL U
HALL V
HALL W
Spin Up (Hall Period < 1.4Hz)
UH
PWM
PWM
VHPWM
PWM
WH
UL
PWM
PWM
WL
PWM
PWM
PWM
PWM
PWM
PWM
PWM
PWM
PWM
VLPWM
PWM
PWM
PWM
PWM
PWM
PWM
PWM
PWM
PWM
PWM
PC=L, Hall Period >1.4Hz
UH
PWM
PWM
VHPWM
PWM
WH
UL
PWM
PWM
WL
PWM
PWM
PWM
PWM
PWM
PWM
PWM
PWM
PWM
VLPWM
PWM
PWM
PWM
PWM
PWM
PWM
PWM
PWM
PWM
PWM
PC=H, Hall Period >1.4Hz
UH
PWM
PWM
VHPWM
WH
PWM
PWM
PWM
PWM
PWM
PWM
PWM
PWM
PWM
PWM
UL
VL
WL
FG Output (FGS=H)
FG
Figure 13. Timing Chart (Counter Clockwise)
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Datasheet
BM6204FS
Controller Outputs and Operation Mode Summary
Detected direction
Conditions
Hall sensor frequency
PC pin
L
Forward (CW:U~V~W, CCW:U~W~V)
Reverse (CW:U~W~V, CCW:U~V~W)
< 1.4Hz
< 1.4Hz
1.4Hz <
H
L
VSP < VSPMIN
(Duty off)
Normal
operation
H
L
H
L
H
Upper and lower arm off
VSPMIN < VSP < VSPMAX
(Control range)
Upper
switching
Upper and lower
switching
Upper and lower
switching
VSPTST < VSP
(Testing mode)
Upper and lower
switching
Current limiter (Note 1)
Upper arm off
Overcurrent
1.4Hz <
Upper switching
Upper and lower arm off
(Note 2)
TSD (Note 2)
Protect
operation
External input (Note 2)
UVLO
Upper and lower arm off
(Note 3)
Motor lock
Hall sensor abnormally
(Note)
(Note 1)
(Note 2)
(Note 3)
Upper and lower arm off and latch
The controller monitors both edges of three hall sensors for detecting period.
It returns to normal operation by the carrier frequency synchronization.
It works together with the fault operation, and returns after the release time synchronizing with the carrier frequency.
It returns to normal operation after 32 cycles of the carrier oscillation period.
Absolute Maximum Ratings (Ta=25°C)
Parameter
Output MOSFET
Symbol
VDSS
Supply Voltage
VDC
Output Voltage
VU, VV, VW
High Side Supply Pin Voltage
High Side Floating Supply Voltage
Ratings
600
(Note 1)
VBU, VBV, VBW
V
(Note 1)
V
-0.3 to +600 (Note 1)
V
(Note 1)
V
-0.3 to +600
-0.3 to +600
VBU-VU, VBV-VV, VBW -VW
Unit
-0.3 to +20
V
Low Side Supply Voltage
VCC
-0.3 to +20
V
Duty Control Voltage
VSP
-0.3 to +20
V
All Others
VI/O
-0.3 to +5.5
V
Driver Outputs (DC)
IOMAX(DC)
±1.5 (Note 1)
A
Driver Outputs (Pulse)
IOMAX(PLS)
±2.5 (Note 1, 2)
A
Fault Signal Output
IOMAX(FOB)
15
(Note 1)
mA
3.00 (Note 3)
W
Rthj-c
15
°C/W
TC
-20 to +100
°C
Storage Temperature
TSTG
-55 to +150
°C
Junction Temperature
Tjmax
150
°C
Power Dissipation
Thermal Resistance
Operating Case Temperature
Pd
(Note)
(Note 1)
(Note 2)
(Note 3)
All voltages are with respect to ground.
Do not, however, exceed Pd or ASO.
Pw ≤ 10µs, Duty cycle ≤ 1%
Mounted on a 70mm x 70mm x 1.6mm FR4 glass-epoxy board with less than 3% copper foil. Derated at 24mW/°C above 25°C.
Caution:
Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operated over the absolute maximum ratings.
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Datasheet
BM6204FS
Recommended Operating Conditions (Tc=25°C)
Parameter
Symbol
Min
Typ
Max
Unit
VDC
-
310
400
V
VBU-VU, VBV-VV, VBW -VW
13.5
15
16.5
V
Low Side Supply Voltage
VCC
13.5
15
16.5
V
Bootstrap Capacitor
CB
1.0
-
-
µF
VREG Bypass Capacitor
CVREG
1.0
-
-
µF
Shunt Resistor (PGND)
RS
0.6
-
-
Ω
Junction Temperature
Tj
-
-
125
°C
Supply Voltage
High Side Floating Supply Voltage
(Note) All voltages are with respect to ground.
Electrical Characteristics (Driver part, unless otherwise specified, Ta=25°C and VCC=15V)
Parameter
Symbol
Min
Typ
Max
Unit
Conditions
HS Quiescence Current
IBBQ
30
70
150
µA
VSP=0V, each phase
LS Quiescence Current
ICCQ
0.2
0.7
1.3
mA
VSP=0V
V(BR)DSS
600
-
-
V
ID=1mA, VSP=0V
IDSS
-
-
100
µA
VDS=600V, VSP=0V
RDS(ON)
-
2.7
3.5
Ω
ID=0.75A
VSD
-
1.1
1.5
V
ID=0.75A
Leak Current
ILBD
-
-
10
µA
VBX=600V
Forward Voltage
VFBD
1.5
1.8
2.1
V
IBD=-5mA, including series-R
Series Resistance
RBD
-
200
-
Ω
HS Release Voltage
VBUVH
9.5
10.0
10.5
V
VBX - VX
HS Lockout Voltage
VBUVL
8.5
9.0
9.5
V
VBX - VX
Power Supply
Output MOSFET
D-S Breakdown Voltage
Leak Current
DC On Resistance
Diode Forward Voltage
Bootstrap Diode
Under Voltage Lock Out
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© 2014 ROHM Co., Ltd. All rights reserved.
TSZ22111 · 15 · 001
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TSZ02201-0828AB400120-1-2
09.Sep.2015 Rev.002
Datasheet
BM6204FS
Electrical Characteristics (Controller part, unless otherwise specified, Ta=25°C and VCC=15V)
Parameter
Symbol
Min
Typ
Max
Unit
Conditions
Supply Current
ICC
0.8
1.7
3.0
mA
VSP=0V
VREG Voltage
VREG
4.5
5.0
5.5
V
IO=-30mA
VIN=0V
Power Supply
Hall Comparators
Input Bias Current
IHALL
-2.0
-0.1
2.0
µA
VHALLCM
0
-
VREG-1.5
V
Minimum Input Level
VHALLMIN
50
-
-
mVp-p
Hysteresis Voltage P
VHALLHY+
5
13
23
mV
Hysteresis Voltage N
VHALLHY-
-23
-13
-5
mV
ISP
15
25
35
µA
Duty Minimum Voltage
VSPMIN
1.8
2.1
2.4
V
Duty Maximum Voltage
VSPMAX
5.1
5.4
5.7
V
Testing Operation Range
Common Mode Input
Duty Control
Input Bias Current
VIN=5V
VSPTST
8.2
-
18
V
Minimum Output Duty
DMIN
-
2
-
%
FOSC=20kHz
Maximum Output Duty
DMAX
-
95
-
%
FOSC=20kHz, upper switching
VIN=0V
Mode Switch - FGS and CCW
Input Bias Current
IIN
-70
-50
-30
µA
Input High Voltage
VINH
3
-
VREG
V
Input Low Voltage
VINL
0
-
1
V
VFOBIH
3
-
VREG
V
Fault Input/Output - FOB
Input High Voltage
Input Low Voltage
VFOBIL
0
-
1
V
Output Low Voltage
VFOBOL
0
0.07
0.60
V
IO=5mA
Output High Voltage
VMONH
VREG-0.40
VREG-0.08
VREG
V
IO=-2mA
Output Low Voltage
VMONL
0
0.02
0.40
V
IO=2mA
VIN=0V
Monitor Output - FG
Current Detection
Input Bias Current
ISNS
-30
-20
-10
µA
Current Limiter Voltage
VSNS
0.48
0.50
0.52
V
Overcurrent Voltage
VOVER
0.84
0.90
0.96
V
Noise Masking Time
TMASK
0.8
1.0
1.2
µs
VPC
-0.05
0
0.05
V
FOSC
18
20
22
kHz
PWM Switching Arm Setting
Threshold Voltage
1/2·VREG, reference voltage
Carrier Frequency Oscillator
Carrier Frequency
RT=20kΩ
Under Voltage Lock Out
LS Release Voltage
VCCUVH
11.5
12.0
12.5
V
LS Lockout Voltage
VCCUVL
10.5
11.0
11.5
V
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© 2014 ROHM Co., Ltd. All rights reserved.
TSZ22111 · 15 · 001
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TSZ02201-0828AB400120-1-2
09.Sep.2015 Rev.002
Datasheet
BM6204FS
Typical Performance Curves (Reference data)
5.0
10
3.5
3.0
2.5
Supply Current : I QVBX [µA] _
7
6
5
1.5
4
12
14
16
18
20
110°C
25°C
-40°C
8
2.0
12
14
16
18
Supply Voltage : VCC [V]
Figure 14. Quiscence Current
(Low Side Drivers)
Figure 15. Low Side Drivers Operating Current
(FPWM: 20kHz)
120
400
100
350
80
60
40
125°C
25°C
-40°C
20
300
250
200
125°C
25°C
-40°C
150
12
20
Supply Voltage : VCC [V]
Supply Current : I QVBX [µA] _
Supply Current : Icc [mA]
4.0
9
Supply Current : Icc [mA]
110°C
25°C
-40°C
4.5
14
16
18
20
12
Supply Voltage : VBX-VX [V]
16
18
20
Supply Voltage : VBX-VX [V]
Figure 16. Quiescence Current
(High Side Driver, Each Phase)
http://www.rohm.com
© 2014 ROHM Co., Ltd. All rights reserved.
TSZ22111 · 15 · 001
14
Figure 17. High Side Driver Operating Current
(FPWM: 20kHz, Each Phase)
13/27
TSZ02201-0828AB400120-1-2
09.Sep.2015 Rev.002
Datasheet
BM6204FS
Typical Performance Curves (Reference data) - Continued
2.0
125°C
25°C
-40°C
6
Forward Voltage : V SD [V]
Output On Resistance : R DSON [ohm]
8
4
2
1.5
1.0
0.5
-40°C
25°C
125°C
0
0.0
0.0
0.5
1.0
1.5
2.0
0.0
0.5
1.0
1.5
2.0
Drain Current : IDS [A]
Source Current : ISD [A]
Figure 18. Output MOSFET ON Resistance
Figure 19. Output MOSFET Body Diode
4
1.2
125°C
25°C
-40°C
3
Voltage : V BOOTR [V]
Forward Voltage : V FBD [V]
1.0
0.8
0.6
0.4
1
-40°C
25°C
125°C
0.2
2
0.0
0
0
2
4
6
8
0
10
4
6
8
10
Bootstrap Series Resistor Current : IBR [mA]
Bootstrap Diode Current : IBD [mA]
Figure 20. Bootstrap Diode Forward Voltage
http://www.rohm.com
© 2014 ROHM Co., Ltd. All rights reserved.
TSZ22111 · 15 · 001
2
Figure 21. Bootstrap Series Resistor
14/27
TSZ02201-0828AB400120-1-2
09.Sep.2015 Rev.002
Datasheet
BM6204FS
Typical Performance Curves (Reference data) - Continued
200
15
125°C
25°C
-40°C
125°C
25°C
-40°C
EON
150
E [µJ]
E [µJ]
10
100
5
50
EOFF
0
0
0.0
0.5
1.0
1.5
0.0
Drain Current : IO [A]
0.5
1.0
1.5
Drain Current : IO [A]
Figure 22. High Side Switching Loss
(VDC=300V)
Figure 23. High Side Recovery Loss
(VDC=300V)
200
15
125°C
25°C
-40°C
125°C
25°C
-40°C
EON
150
E [µJ]
E [µJ]
10
100
5
50
EOFF
0
0
0.0
0.5
1.0
1.5
0.0
Drain Current : IO [A]
1.0
1.5
Drain Current : IO [A]
Figure 24. Low Side Switching Loss
(VDC=300V)
http://www.rohm.com
© 2014 ROHM Co., Ltd. All rights reserved.
TSZ22111 · 15 · 001
0.5
Figure 25. Low Side Recovery Loss
(VDC=300V)
15/27
TSZ02201-0828AB400120-1-2
09.Sep.2015 Rev.002
Datasheet
BM6204FS
Typical Performance Curves (Reference data) - Continued
5.4
5.4
-40°C
25°C
110°C
5.2
VREG voltage : V REG [V]
VREG voltage : V REG [V]
-40°C
25°C
110°C
5.0
4.8
4.6
5.0
4.8
4.6
12
14
16
18
20
0
10
20
30
40
Supply Voltage : VCC [V]
Output Current : IOUT [mA]
Figure 26. VREG - VCC
Figure 27. VREG Drive Capability
6
110°C
25°C
-40°C
4
3
2
1
110°C
25°C
-40°C
0
Input Bias Current : I SP [µA]
200
5
Internal Output Voltage : [V]
5.2
-1
150
100
50
110°C
25°C
-40°C
0
-30
-15
0
15
30
0
5
10
15
Differential Voltage : VHUP-VHUN [mV]
VSP Voltage : VSP [V]
Figure 28. Hall Comparator Hysteresis Voltage
Figure 29. VSP Input Bias Current
http://www.rohm.com
© 2014 ROHM Co., Ltd. All rights reserved.
TSZ22111 · 15 · 001
16/27
20
TSZ02201-0828AB400120-1-2
09.Sep.2015 Rev.002
Datasheet
BM6204FS
Typical Performance Curves (Reference data) - Continued
1.5
100
Internal Logic : H/L [-]
Output Duty : D SP [%]
80
60
40
110°C
25°C
-40°C
20
0
1.0
0.5
0.0
110°C
25°C
-40°C
-0.5
0
2
4
6
0
8
5
Figure 30. Output Duty - VSP Voltage
(PC=H)
5
20
4
3
PC Voltage : VPC [V]
PCT Voltage : V PCT [V]
15
Figure 31. Testing Mode Threshold Voltage
110°C
25°C
-40°C
4
10
VSP Voltage : VSP [V]
VSP Voltage : VSP [V]
3
2
2
1
1
-40°C
25°C
110°C
0
0
0
1
2
3
4
5
6
0
7
2
3
4
PCT Voltage : VPCT [V]
VSP Voltage : VSP [V]
Figure 32. VSP - PCT Offset Voltage
http://www.rohm.com
© 2014 ROHM Co., Ltd. All rights reserved.
TSZ22111 · 15 · 001
1
Figure 33. PCT - PC Linearity
(RPCT=RPC=100kΩ)
17/27
TSZ02201-0828AB400120-1-2
09.Sep.2015 Rev.002
Datasheet
BM6204FS
Typical Performance Curves (Reference data) - Continued
1.5
30
1.0
Frequency : F OSC [kHz]
Internal Logic : H/L [-]
25°C
110°C
-40°C
0.5
0.0
110°C
25°C
-40°C
-0.5
25
20
15
10
0.0
0.2
0.4
0.6
0.8
1.0
14
VPC/VREG (Normalized) : [V/V]
Figure 34. PWM Switching Arm Threshold Voltage
22
26
30
Figure 35. Carrier Frequency - RT
0.0
0.8
110°C
25°C
-40°C
Output Voltage : VOL [V] _
Output Drop Voltage : VOH [V]
18
External Resistor : RT [kohm]
-0.2
-0.4
-0.6
-40°C
25°C
110°C
-0.8
0.6
0.4
0.2
0.0
0
2
4
6
0
Output Current : IOUT [mA]
4
6
Output Current : IOUT [mA]
Figure 36. High Side Output Voltage
(FG)
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© 2014 ROHM Co., Ltd. All rights reserved.
TSZ22111 · 15 · 001
2
Figure 37. Low Side Output Voltage
(FG)
18/27
TSZ02201-0828AB400120-1-2
09.Sep.2015 Rev.002
Datasheet
BM6204FS
Typical Performance Curves (Reference data) - Continued
1.5
60
Internal Logic : H/L [-]
50
Input Bias Current : I IN [µA]
110°C
25°C
-40°C
110°C
25°C
-40°C
40
30
20
110°C
25°C
-40°C
1.0
0.5
0.0
10
0
-0.5
0
1
2
3
4
5
1.5
1.9
2.1
2.3
2.5
Input Voltage : VIN [V]
Figure 38. Input Bias Current
(CCW, FGS)
Figure 39. Input Threshold Voltage
(CCW, FGS, FOB)
2.7
1.5
30
110°C
25°C
-40°C
Internal Logic : H/L [-]
SNS Input Bias Current : I SNS [µA]
1.7
Input Voltage : VIN [V]
20
10
1.0
0.5
0.0
110°C
25°C
-40°C
0
0
1
2
3
4
-0.5
0.48
5
0.49
0.50
0.51
0.52
SNS Input Voltage : VSNS [V]
Input Voltage : VSNS [V]
Figure 40. SNS Input Bias Current
Figure 41. Current Limiter Input Threshold Voltage
(SNS)
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© 2014 ROHM Co., Ltd. All rights reserved.
TSZ22111 · 15 · 001
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TSZ02201-0828AB400120-1-2
09.Sep.2015 Rev.002
Datasheet
BM6204FS
Typical Performance Curves (Reference data) - Continued
1.5
1.5
1.0
Internal Logic : H/L [-]
Internal Logic : H/L [-]
-40°C
25°C
110°C
0.5
0.0
-0.5
1.0
0.5
0.0
-0.5
0.6
0.7
0.8
0.9
1.0
1.1
1.2
75
Input Voltage : VSNS [V]
105
120
135
150
Junction Temperature : Tj [°C]
Figure 42. OCP Input Threshold Voltage
(SNS)
Figure 43. Thermal Shutdown
1.5
1.5
125°C
25°C
-40°C
110°C
25°C
-40°C
110°C
25°C
-40°C
125°C
25°C
-40°C
1.0
Internal Logic : H/L [-]
Internal Logic : H/L [-]
90
0.5
0.0
-0.5
1.0
0.5
0.0
-0.5
8
9
10
11
12
13
8
Supply Voltage : VBX - VX [V]
10
11
12
13
Supply Voltage : VCC [V]
Figure 44. Under Voltage Lock Out
(High Side Driver, Each Phase)
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© 2014 ROHM Co., Ltd. All rights reserved.
TSZ22111 · 15 · 001
9
Figure 45. Under Voltage Lock Out
(Low Side Drivers)
20/27
TSZ02201-0828AB400120-1-2
09.Sep.2015 Rev.002
Datasheet
BM6204FS
Application Example
VDC
GND
VCC
VSP
IC1
R1
D1
C5
C6
C13
C1
C7
C2~C4
C8
M
HW
HV
HU
VREG
R2
R3
FG
R6
Q1
C9
R4
C11
R5
C10
R11
R9
R13
R12
R10
C14
R8
C12
DTR
R7
Figure 46. Application Example (120° Commutation Driver)
Parts List
Parts
Value
Manufacturer
Type
Parts
Value
Ratings
Type
IC1
-
ROHM
BM6204FS
C1
0.1µF
50V
Ceramic
R1
1kΩ
ROHM
MCR18EZPF1001
C2
2200pF
50V
Ceramic
R2
150Ω
ROHM
MCR18EZPJ151
C3
2200pF
50V
Ceramic
R3
150Ω
ROHM
MCR18EZPJ151
C4
2200pF
50V
Ceramic
R4
20kΩ
ROHM
MCR18EZPF2002
C5
10µF
50V
Ceramic
R5
100kΩ
ROHM
MCR18EZPF1003
C6
10µF
50V
Ceramic
R6
100kΩ
ROHM
MCR18EZPF1003
C7
2.2µF
50V
Ceramic
R7
0.6Ω
ROHM
MCR50JZHFL1R80 x 3
C8
2.2µF
50V
Ceramic
R8
10kΩ
ROHM
MCR18EZPF1002
C9
2.2µF
50V
Ceramic
R9
0Ω
ROHM
MCR18EZPJ000
C10
0.1µF
50V
Ceramic
R10
-
-
-
C11
2.2µF
50V
Ceramic
R11
0Ω
ROHM
MCR18EZPJ000
C12
100pF
50V
Ceramic
R12
-
-
-
C13
0.1µF
630V
Ceramic
R13
100kΩ
ROHM
MCR18EZPF1003
C14
0.1µF
50V
Ceramic
Q1
-
ROHM
DTC124EUA
HX
-
-
Hall elements
D1
-
ROHM
KDZ20B
http://www.rohm.com
© 2014 ROHM Co., Ltd. All rights reserved.
TSZ22111 · 15 · 001
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TSZ02201-0828AB400120-1-2
09.Sep.2015 Rev.002
Datasheet
BM6204FS
I/O Equivalence Circuits
VCC
VREG
VREG
VREG
100k
RT
100k
VSP
250k
SNS
2k
Figure 47. RT
Figure 48. SNS
Figure 49. VSP
Figure 50. VREG, VCC
VREG
HUP
HUN
HVP
HVN
HWP
HWN
FG
Figure 51. FG
2k
Figure 52. HXP, HXN
VREG
VREG
100k
2k
FGS
CCW
PC
2k
Figure 53. FGS, CCW
2k
PCT
Figure 54. PC, PCT
BX
VREG
VDC
FOB
X
VCC
Figure 55. FOB
PGND
Figure 56. VCC, PGND, VDC, BX(BU/BV/BW), X(U/V/W)
http://www.rohm.com
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TSZ22111 · 15 · 001
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09.Sep.2015 Rev.002
Datasheet
BM6204FS
Operational Notes
1. Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply
terminals.
2. Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the digital
and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block.
Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the
capacitance value when using electrolytic capacitors.
3. Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. However,
pins that drive inductive loads (e.g. motor driver outputs, DC-DC converter outputs) may inevitably go below ground due to
back EMF or electromotive force. In such cases, the user should make sure that such voltages going below ground will not
cause the IC and the system to malfunction by examining carefully all relevant factors and conditions such as motor
characteristics, supply voltage, operating frequency and PCB wiring to name a few.
4. Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground
caused by large currents. Also ensure that the ground traces of external components do not cause variations on the
ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5. Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when the IC
is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating, increase
the board size and copper area to prevent exceeding the Pd rating.
6. Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The
electrical characteristics are guaranteed under the conditions of each parameter.
7. Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply.
Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of
connections.
8. Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9. Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject
the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always
be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent
damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
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TSZ22111 · 15 · 001
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TSZ02201-0828AB400120-1-2
09.Sep.2015 Rev.002
Datasheet
BM6204FS
11. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge
acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause
unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply
or ground line.
12. Regarding the Input Pin of the IC
Do not force voltage to the input pins when the power does not supply to the IC. Also, do not force voltage to the input pins
that exceed the supply voltage or in the guaranteed the absolute maximum rating value even if the power is supplied to the
IC.
When using this IC, the high voltage pins VDC, BU/U, BV/V and BW/W need a resin coating between these pins. It is
judged that the inter-pins distance is not enough. If any special mode in excess of absolute maximum ratings is to be
implemented with this product or its application circuits, it is important to take physical safety measures, such as providing
voltage-clamping diodes or fuses. And, set the output transistor so that it does not exceed absolute maximum ratings or
ASO. In the event a large capacitor is connected between the output and ground, and if VCC and VDC are short-circuited
with 0V or ground for any reason, the current charged in the capacitor flows into the output and may destroy the IC.
This IC contains the controller chip, P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Resistor
Transistor(NPN)
Pin A
Pin B
E
Pin A
C
P
N
P
+
N
Pin B
B
C
N
P
+
N
Parasitic
Elements
N
P
+
N
P
N
B
P+ N
E
P Substrate
Parasitic
Elements
N
P Substrate
GND
Parasitic
Elements
GND
GND
N Region
close-by
Parasitic
Elements
Figure A-1. Example of IC structure
13. Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature
and the decrease in nominal capacitance due to DC bias and others.
14. Area of Safe Operation (ASO)
Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe Operation
(ASO).
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© 2014 ROHM Co., Ltd. All rights reserved.
TSZ22111 · 15 · 001
24/27
TSZ02201-0828AB400120-1-2
09.Sep.2015 Rev.002
Datasheet
BM6204FS
Physical Dimension, Tape and Reel Information
Package Name
SSOP-A54_36
22.0 0.2
(MAX 22.35 include BURR)
11.4
36
28
1
27
0.4 Min.
0.3
0.2
14.1
4 +6
-4
0.1
0.1
0.1
2.1
0.1
1.05
0.1
0.27
0.8
0.38
(UNIT : mm)
PKG : SSOP-A54_36
0.1
0.1
<Tape and Reel Information>
Tape
Embossed carrier tape
Quantity
1000pcs
Direction
of feed
E2
The direction is the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand
Reel
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© 2014 ROHM Co., Ltd. All rights reserved.
TSZ22111 · 15 · 001
Direction of feed
1pin
*Order quantity needs to be multiple of the minimum quantity.
25/27
TSZ02201-0828AB400120-1-2
09.Sep.2015 Rev.002
Datasheet
BM6204FS
Ordering Information
B M 6
2
0
ROHM Part Number
BM6204 : 600V/1.5A, 120°
4
F
S
Package
FS : SSOP-A54_36
-
E
2
Packaging specification
E2 : Embossed carrier tape
Marking Diagram
SSOP-A54_36
(TOP VIEW)
Part Number Marking
BM6204FS
1PIN MARK
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© 2014 ROHM Co., Ltd. All rights reserved.
TSZ22111 · 15 · 001
LOT Number
26/27
TSZ02201-0828AB400120-1-2
09.Sep.2015 Rev.002
Datasheet
BM6204FS
Revision History
Date
Revision
24.Dec.2014
09.Sep.2015
001
002
Changes
New release
Correct some misdescriptions
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© 2014 ROHM Co., Ltd. All rights reserved.
TSZ22111 · 15 · 001
27/27
TSZ02201-0828AB400120-1-2
09.Sep.2015 Rev.002
Datasheet
Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
, transport
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001
Datasheet
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001
Datasheet
BM6204FS - Web Page
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Distribution Inventory
Part Number
Package
Unit Quantity
Minimum Package Quantity
Packing Type
Constitution Materials List
RoHS
BM6204FS
SSOP-A54_36
1000
1000
Taping
inquiry
Yes