Hall IC Series Omnipolar Detection Hall ICs BU52001GUL, BU52011HFV, BU52021HFV, BU52015GUL, BU52025G, BU52051NVX, BD7411G No.10045ECT02 ●Description The bipolar Hall ICs are magnetic switches that can operate both S-and N-pole , upon which the output goes from Hi to Low. In addition to regular single-output Hall ICs, We offers a line up of dual-output units with a reverse output terminal (active High). ●Features 1) Omnipolar detection 2) Micropower operation (small current using intermittent operation method)(BD7411G is excluded.) 3) Ultra-compact CSP package (BU52001GUL,BU52015GUL) 4) Ultra-Small outline package HVSOF5 (BU52011HFV,BU52021HFV) 5) Ultra-Small outline package SSON004X1216 (BU52051NVXV) 6) Small outline package (BU52025G,BD7411G) 7) Line up of supply voltage For 1.8V Power supply voltage(BU52011HFV,BU52015GUL,BU52051NVX) For 3.0V Power supply voltage (BU52001GUL) For 3.3V Power supply voltage (BU52021HFV,BU52025G) For 5.0V Power supply voltage (BD7411G) 8) Dual output type (BU52015GUL) 9) High ESD resistance 8kV(HBM) ●Applications Mobile phones, notebook computers, digital video camera, digital still camera, white goods etc. ●Product Lineup Product name BU52001GUL BU52015GUL BU52051NVX BU52011HFV BU52021HFV BU52025G BD7411G Supply voltage (V) 2.40～3.30 1.65～3.30 1.65～3.30 1.65～3.30 2.40～3.60 2.40～3.60 4.50～5.50 Operate point (mT) +/-3.7※ +/-3.0※ +/-3.0※ +/-3.0※ +/-3.7※ +/-3.7※ +/-3.4※ Hysteresis (mT) Period (ms) 0.8 0.9 0.9 0.9 0.8 0.8 0.4 50 50 50 50 50 50 - Supply current (AVG) (A) 8.0μ 5.0μ 5.0μ 5.0μ 8.0μ 8.0μ 2.0m Output type Package CMOS CMOS CMOS CMOS CMOS CMOS CMOS VCSP50L1 VCSP50L1 SSON004X1216 HVSOF5 HVSOF5 SSOP5 SSOP5 ※Plus is expressed on the S-pole; minus on the N-pole www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 1/19 2010.01 - Rev.C BU52001GUL,BU52011HFV,BU52021HFV, BU52015GUL,BU52025G,BU52051NVX, BD7411G Technical Note ●Absolute Maximum Ratings BU52001GUL (Ta=25℃) PARAMETERS SYMBOL LIMIT UNIT Power Supply Voltage VDD -0.1～+4.5※1 V Output Current IOUT ±1 mA Power Dissipation Pd 420 ※2 mW Operating Temperature Range Topr -40～+85 ℃ Storage Temperature Range Tstg -40～+125 ℃ ※1. Not to exceed Pd ※2. Reduced by 4.20mW for each increase in Ta of 1℃ over 25℃ (mounted on 50mm×58mm Glass-epoxy PCB) BU52015GUL (Ta=25℃) PARAMETERS SYMBOL LIMIT UNIT Power Supply Voltage VDD -0.1～+4.5※3 V Output Current IOUT ±0.5 mA ※4 mW Power Dissipation Pd Operating Temperature Range Topr -40～+85 420 ℃ Storage Temperature Range Tstg -40～+125 ℃ ※3. Not to exceed Pd ※4. Reduced by 4.20mW for each increase in Ta of 1℃ over 25℃ (mounted on 50mm×58mm Glass-epoxy PCB) BU52051NVX (Ta=25℃) PARAMETERS SYMBOL LIMIT UNIT Power Supply Voltage VDD -0.1～+4.5※5 V Output Current IOUT ±0.5 mA Power Dissipation Pd 2049※6 mW Operating Temperature Range Topr -40～+85 ℃ Storage Temperature Range Tstg -40～+125 ℃ LIMIT UNIT ※5. Not to exceed Pd ※6. Reduced by 20.49mW for each increase in Ta of 1℃ over 25℃ (mounted on 70mm×70 mm×1.6mm Glass-epoxy PCB) BU52011HFV (Ta=25℃) PARAMETERS SYMBOL ※7 Power Supply Voltage VDD Output Current IOUT -0.1～+4.5 ±0.5 mA V Power Dissipation Pd 536※8 mW Operating Temperature Range Topr -40～+85 ℃ Storage Temperature Range Tstg -40～+125 ℃ ※7. Not to exceed Pd ※8. Reduced by 5.36mW for each increase in Ta of 1℃ over 25℃ (mounted on 70mm×70 mm×1.6mm Glass-epoxy PCB) www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 2/19 2010.01 - Rev.C BU52001GUL,BU52011HFV,BU52021HFV, BU52015GUL,BU52025G,BU52051NVX, BD7411G BU52021NVX (Ta=25℃) PARAMETERS Technical Note SYMBOL LIMIT UNIT ※9 Power Supply Voltage VDD Output Current IOUT -0.1～+4.5 ±1 mA V Power Dissipation Pd 536※10 mW Operating Temperature Range Topr -40～+85 ℃ Storage Temperature Range Tstg -40～+125 ℃ LIMIT UNIT ※9. Not to exceed Pd ※10. Reduced by5.36mW for each increase in Ta of 1℃ over 25℃ (mounted on 70mm×70 mm×1.6mm Glass-epoxy PCB) BU52025G (Ta=25℃) PARAMETERS SYMBOL ※11 Power Supply Voltage VDD Output Current IOUT -0.1～+4.5 ±1 mA V Power Dissipation Pd 540※12 mW Operating Temperature Range Topr -40～+85 ℃ Storage Temperature Range Tstg -40～+125 ℃ ※11. Not to exceed Pd ※12. Reduced by 5.40mW for each increase in Ta of 1℃ over 25℃ (mounted on 70mm×70 mm×1.6mm Glass-epoxy PCB) BD7411G (Ta=25℃) PARAMETERS SYMBOL LIMIT UNIT ※13 Power Supply Voltage VDD Output Current IOUT -0.3～+7.0 ±1 mA V Power Dissipation Pd 540※14 mW Operating Temperature Range Topr -40～+85 ℃ Storage Temperature Range Tstg -55～+150 ℃ ※13. Not to exceed Pd ※14. Reduced by 5.40mW for each increase in Ta of 1℃ over 25℃ (mounted on 70mm×70 mm×1.6mm Glass-epoxy PCB) www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 3/19 2010.01 - Rev.C BU52001GUL,BU52011HFV,BU52021HFV, BU52015GUL,BU52025G,BU52051NVX, BD7411G Technical Note ●Magnetic, Electrical Characteristics BU52001GUL (Unless otherwise specified, VDD＝3.0V, Ta＝25℃) LIMIT PARAMETERS SYMBOL MIN TYP Power Supply Voltage MAX UNIT CONDITIONS VDD 2.4 3.0 3.3 BopS BopN BrpS BrpN BhysS BhysN -5.5 0.8 - 3.7 -3.7 2.9 -2.9 0.8 0.8 5.5 -0.8 - Tp - 50 100 ms Output High Voltage VOH VDD -0.4 - - V Output Low Voltage VOL - - 0.4 V Supply Current IDD(AVG) - 8 12 μA Average Supply Current During Startup Time IDD (EN) - 4.7 - mA During Startup Time Value Supply CurrentDuring Standby Time IDD (DIS) - 3.8 - μA During Standby Time Value Operate Point Release Point Hysteresis Period V mT mT mT BrpN<B<BrpS IOUT =-1.0mA B<BopN,BopS<B IOUT =+1.0mA ※15 ※15 ※15 B = Magnetic flux density 1mT=10Gauss Positive (“+”) polarity flux is defined as the magnetic flux from south pole which is direct toward to the branded face of the sensor. After applying power supply, it takes one cycle of period (TP) to become definite output. Radiation hardiness is not designed. BU52015GUL (Unless otherwise specified, VDD＝1.80V, Ta＝25℃) LIMIT PARAMETERS SYMBOL MIN TYP MAX Power Supply Voltage Operate Point Release Point Hysteresis Period Output High Voltage Output Low Voltage VDD 1.65 1.80 3.30 BopS BopN BrpS BrpN BhysS BhysN -5.0 0.6 - 3.0 -3.0 2.1 -2.1 0.9 0.9 5.0 -0.6 - Tp - 50 100 VOH VDD -0.2 - - UNIT CONDITIONS V mT mT mT ms V VOL - - 0.2 V Supply Current 1 IDD1(AVG) - 5 8 μA Supply Current During Startup Time 1 IDD1(EN) - 2.8 - mA Supply CurrentDuring Standby Time 1 IDD1(DIS) - 1.8 - μA Supply Current 2 IDD2(AVG) - 8 12 μA Supply Current During Startup Time 2 IDD2(EN) - 4.5 - mA Supply CurrentDuring Standby Time 2 IDD2(DIS) - 4.0 - μA OUT1: BrpN<B<BrpS OUT2: B<BopN, BopS<B IOUT = -0.5mA OUT1: B<BopN, BopS<B OUT2: BrpN<B<BrpS IOUT = +0.5mA ※16 ※16 VDD=1.8V, Average VDD=1.8V, During Startup Time Value VDD=1.8V, During Standby Time Value VDD=2.7V, Average VDD=2.7V, During Startup Time Value VDD=2.7V, During Standby Time Value ※16 B = Magnetic flux density 1mT=10Gauss Positive (“+”) polarity flux is defined as the magnetic flux from south pole which is direct toward to the branded face of the sensor. After applying power supply, it takes one cycle of period (TP) to become definite output. Radiation hardiness is not designed. www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 4/19 2010.01 - Rev.C BU52001GUL,BU52011HFV,BU52021HFV, BU52015GUL,BU52025G,BU52051NVX, BD7411G Technical Note BU52051NVX , BU52011HFV (Unless otherwise specified, VDD＝1.80V, Ta＝25℃) BU52021HFV,BU52025G (Unless otherwise specified, VDD＝3.0V, Ta＝25℃) LIMIT PARAMETERS SYMBOL UNIT MIN TYP MAX Power Supply Voltage CONDITIONS VDD 2.4 3.0 3.6 BopS BopN BrpS BrpN BhysS BhysN -5.5 0.8 - 3.7 -3.7 2.9 -2.9 0.8 0.8 5.5 -0.8 - Tp - 50 100 ms Output High Voltage VOH VDD -0.4 - - V Output Low Voltage VOL - - 0.4 V Supply Current IDD(AVG) - 8 12 μA Average Supply Current During Startup Time IDD (EN) - 4.7 - mA During Startup Time Value Supply CurrentDuring Standby Time IDD (DIS) - 3.8 - μA During Standby Time Value Operate Point Release Point Hysteresis Period V mT mT mT BrpN<B<BrpS IOUT =-1.0mA B<BopN, BopS<B IOUT =+1.0mA ※17 ※17 ※17 B = Magnetic flux density 1mT=10Gauss Positive (“+”) polarity flux is defined as the magnetic flux from south pole which is direct toward to the branded face of the sensor. After applying power supply, it takes one cycle of period (TP) to become definite output. Radiation hardiness is not designed. BD7411G (Unless otherwise specified, VDD＝5.0V, Ta＝25℃) LIMIT PARAMETERS SYMBOL MIN TYP Power Supply Voltage MAX UNIT VDD 4.5 5.0 5.5 BopS BopN BrpS BrpN BhysS BhysN -5.6 1.5 - 3.4 -3.4 3.0 -3.0 0.4 0.4 5.6 -1.5 - mT Output High Voltage VOH 4.6 - - V Output Low Voltage VOL - - 0.4 V Supply Current IDD - 2 4 mA Operate Point Release Point Hysteresis CONDITIONS V mT mT BrpN<B<BrpS IOUT =-1.0mA B<BopN, BopS<B IOUT =+1.0mA ※18 ※18 ※18 B = Magnetic flux density 1mT=10Gauss Positive (“+”) polarity flux is defined as the magnetic flux from south pole which is direct toward to the branded face of the sensor. Radiation hardiness is not designed. www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 5/19 2010.01 - Rev.C BU52001GUL,BU52011HFV,BU52021HFV, BU52015GUL,BU52025G,BU52051NVX, BD7411G Technical Note ●Figure of measurement circuit Tp Bop/Brp VDD VDD VDD 200Ω VDD OUT 100μF GND Oscilloscope OUT GND V The period is monitored by Oscilloscope. Bop and Brp are measured with applying the magnetic field from the outside. Fig.1 Fig.2 Bop,Brp measurement circuit Tp measurement circuit VOH VDD GND Fig.3 Product Name OUT 100μF VDD IOUT V IOUT BU52001GUL, BU52021HFV, BU52025G, BD7411G 1.0mA BU52015GUL, BU52051NVX, BU52011HFV 0.5mA VOH measurement circuit VOL Product Name IOUT BU52001GUL, BU52021HFV, BU52025G, BD7411G 1.0mA BU52015GUL, BU52051NVX, BU52011HFV 0.5mA VDD VDD OUT 100μF GND Fig.4 V IOUT VOL measurement circuit IDD A VDD VDD OUT C GND Fig.5 Product Name C BU52001GUL,BU52015GUL,BU52051NVX, BU52011HFV, BU52021HFV, BU52025G 2200μF BD7411G 100μF IDD measurement circuit www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 6/19 2010.01 - Rev.C BU52001GUL,BU52011HFV,BU52021HFV, BU52015GUL,BU52025G,BU52051NVX, BD7411G Technical Note 8.0 6.0 VDD=3.0V 4.0 Bop S 2.0 Brp S 0.0 -2.0 Brp N -4.0 Bop N -6.0 -8.0 -60 -40 -20 0 100 6.0 Ta = 25°C 4.0 90 80 Bop S 2.0 PERIOD [ms] 8.0 MAGNETIC FLUX DENSITY [mT] MAGNETIC FLUX DENSITY [mT] ●Technical (Reference) Data BU52001GUL (VDD=2.4V～3.3V type) Brp S 0.0 Brp N -2.0 -4.0 -8.0 2.0 20 40 60 80 100 2.4 2.8 3.2 60 50 40 30 20 10 Bop N -6.0 VDD=3.0V 70 0 3.6 -60 -40 -20 0 SUPPLY VOLTAGE ［V］ AMBIENT TEMPERATURE [℃] Fig.7 Bop,Brp- Supply voltage Ta = 70 60 50 40 30 20 10 0 2.0 2.4 2.8 3.2 SUPPLY VOLTAGE [V] 14.0 12.0 VDD=3.0V 10.0 8.0 6.0 4.0 2.0 0.0 3.6 -60 -40 -20 Fig.8 TP– Ambient temperature AVERAGE SUPPLY CURRENT [µA] PERIOD [ms] 100 90 80 AVERAGE SUPPLY CURRENT [µA] Fig.6 Bop,Brp– Ambient temperature 0 20 40 60 14.0 12.0 Ta = 25°C 10.0 8.0 6.0 4.0 2.0 0.0 2.0 80 100 AMBIENT TEMPERATURE [℃] Fig.9 TP– Supply voltage 20 40 60 80 100 AMBIENT TEMPERATURE [℃] 2.4 2.8 3.2 SUPPLY VOLTAGE [V] 3.6 Fig.11 IDD – Supply voltage Fig.10 IDD– Ambient temperature 8.0 VDD=1.8V Bop S 4.0 2.0 Brp S 0.0 Brp N -2.0 -4.0 Bop N -6.0 -8.0 -60 -40 -20 0 20 40 60 80 100 100 6.0 2.0 Brp S 0.0 Brp N -2.0 -4.0 Bop N AVERAGE SUPPLY CURRENT [µA] Ta = 25°C PERIOD [ms] 70 60 50 40 30 20 10 0 2.6 3.0 3.4 50 40 30 10 0 -8.0 1.8 2.2 2.6 3.0 3.4 -60 -40 -20 0 3.8 3.8 SUPPLY VOLTAGE [V] Fig.15 TP– Supply voltage www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 14.0 12.0 10.0 VDD=1.8V 8.0 6.0 4.0 2.0 0.0 -60 -40 -20 0 20 40 60 80 100 AMBIENT TEMPERATURE [℃] Fig.16 IDD– Ambient temperature 7/19 20 40 60 80 100 AMBIENT TEMPERATURE [℃] Fig.14 TP – Ambient temperature Fig.13 Bop,Brp– Supply voltage 90 2.2 60 SUPPLY VOLTAGE ［V］ 100 1.8 VDD=1.8V 80 70 20 -6.0 AMBIENT TEMPERATURE [℃] 1.4 Bop S 4.0 1.4 Fig.12 Bop,Brp– Ambient temperature 80 90 Ta = 25°C AVERAGE SUPPLY CURRENT [µA] 6.0 PERIOD [ms] 8.0 MAGNETIC FLUX DENSITY [mT] MAGNETIC FLUX DENSITY [mT] BU52015GUL, BU52051NVX, BU52011HFV (VDD=1.65V～3.3V type) 14.0 12.0 Ta = 25°C 10.0 8.0 6.0 4.0 2.0 0.0 1.4 1.8 2.2 2.6 3.0 3.4 3.8 SUPPLY VOLTAGE [V] Fig.17 IDD – Supply voltage 2010.01 - Rev.C BU52001GUL,BU52011HFV,BU52021HFV, BU52015GUL,BU52025G,BU52051NVX, BD7411G Technical Note 8.0 Bop S 2.0 Brp S 0.0 Brp N -2.0 -4.0 Bop N -6.0 -8.0 -60 -40 -20 0 Ta = 25°C 2.0 Brp S 0.0 Brp N -2.0 -4.0 Bop N -6.0 -8.0 2.0 20 40 60 80 100 2.4 AVERAGE SUPPLY CURRENT [µA] PERIOD [ms] Ta = 25°C 60 50 40 30 20 10 0 2.0 2.4 2.8 3.2 3.6 3.2 3.6 90 80 VDD=3.0V 70 60 50 40 30 20 10 0 4.0 -60 -40 -20 0 14.0 Fig.20 TP – Ambient temperature 14.0 12.0 VDD=3.0V 10.0 8.0 6.0 4.0 2.0 0.0 4.0 20 40 60 80 100 AMBIENT TEMPERATURE [℃] Fig.19 Bop,Brp– Supply voltage Fig.18 Bop,Brp– Ambient temperature 80 70 2.8 100 SUPPLY VOLTAGE ［V］ AMBIENT TEMPERATURE [℃] 100 90 Bop S 4.0 AVERAGE SUPPLY CURRENT [µA] VDD=3.0V 4.0 6.0 AVERAGE SUPPLY CURRENT [µA] 8.0 6.0 MAGNETIC FLUX DENSITY [mT] MAGNETIC FLUX DENSITY [mT] BU52021HFV, BU52025G (VDD=2.4V～3.6V type) -60 -40 -20 SUPPLY VOLTAGE [V] 0 20 40 60 12.0 8.0 6.0 4.0 2.0 0.0 2.0 80 100 2.4 2.8 3.2 3.6 4.0 SUPPLY VOLATAGE [V] AMBIENT TEMPERATURE [℃] Fig.23 IDD – Supply voltage Fig.22 IDD – Ambient temperature Fig.21 TP – Supply voltage Ta = 25°C 10.0 6.0 Bop S VDD=5.0V 4.0 2.0 Brp S 0.0 Brp N -2.0 -4.0 Bop N -6.0 -8.0 -60 -40 -20 0 20 40 60 80 100 6.0 Ta = 25°C 4.0 Bop S 2.0 Brp S 0.0 Brp N -2.0 -4.0 Bop N -6.0 -8.0 4.0 4.5 5.0 5.5 6.0 SUPPLY VOLTAGE ［V］ AMBIENT TEMPERATURE [℃] Fig.25 Fig.24 Bop,Brp– Ambient temperature AVERAGE SUPPLY CURRENT [mA] AVERAGE SUPPLY CURRENT [mA] 8.0 8.0 MAGNETIC FLUX DENSITY [mT] MAGNETIC FLUX DENSITY [mT] BD7411G (VDD=4.5V～5.5V type) Bop,Brp– Supply voltage 6.0 5.0 VDD=5.0V 4.0 3.0 2.0 1.0 0.0 -60 -40 -20 0 20 40 60 80 100 AMBIENT TEMPERATURE [℃] Fig.26 IDD – Ambient temperature 6.0 5.0 Ta = 25°C 4.0 3.0 2.0 1.0 0.0 4.0 4.5 5.0 5.5 6.0 SUPPLY VOLTAGE [V] Fig.27 IDD – Supply voltage www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 8/19 2010.01 - Rev.C BU52001GUL,BU52011HFV,BU52021HFV, BU52015GUL,BU52025G,BU52051NVX, BD7411G Technical Note ●Block Diagram BU52001GUL ＶDD 0.1μF Adjust the bypass capacitor value A1 as necessary, according to voltage noise conditions, etc. TIMING LOGIC LATCH × SAMPLE & HOLD ELEMENT DYNAMIC OFFSET CANCELLATION HALL The CMOS output terminals enable direct B1 OUT connection to the PC, with no external pull-up resistor required. A2 GND Fig.28 PIN No. PIN NAME FUNCTION A1 VDD POWER SUPPLY A2 GND GROUND B1 OUT OUTPUT B2 N.C. A1 COMMENT A2 B1 OPEN or Short to GND. B2 Surface A2 A1 B2 B1 Reverse BU52015GUL VDD B2 0.1μF Adjust the bypass capacitor value as necessary, according OUT1 connection to the PC, with no external pull-up VDD resistor required. A2 OUT2 B1 GND Fig.29 PIN No. PIN NAME FUNCTION A1 OUT1 Output pin (Active Low) A2 OUT2 Output pin (Active High) B1 GND GROUND B2 VDD Power Supply Voltage www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. COMMENT A1 B1 A2 B2 Surface 9/19 to voltage noise conditions, etc. The CMOS output terminals enable direct GND LATCH × A1 SAMPLE & HOLD HALL ELEMENT DYNAMIC OFFSET CANCELLATION TIMING LOGIC A2 A1 B2 B1 Reverse 2010.01 - Rev.C BU52001GUL,BU52011HFV,BU52021HFV, BU52015GUL,BU52025G,BU52051NVX, BD7411G Technical Note BU52051NVX ＶDD 0.1μF 4 Adjust the bypass capacitor value as necessary, according to voltage noise conditions, etc. TIMING LOGIC LATCH × The CMOS output terminals enable direct SAMPLE & HOLD ELEMENT DYNAMIC OFFSET CANCELLATION HALL 1 OUT connection to the PC, with no external pull-up resistor required. 2 GND Fig.30 4 PIN No. PIN NAME FUNCTION 1 OUT OUTPUT 2 GND GROUND 3 N.C. 4 VDD 3 3 COMMENT OPEN or Short to GND. 2 1 Reverse 1 2 Surface POWER SUPPLY 4 BU52011HFV,BU52021HFV ＶDD 0.1μF Adjust the bypass capacitor value 4 as necessary, according to voltage noise conditions, etc. TIMING LOGIC LATCH × The CMOS output terminals enable SAMPLE & HOLD ELEMENT DYNAMIC OFFSET CANCELLATION HALL 5 OUT direct connection to the PC, with no external pull-up resistor required. 2 GND Fig.31 PIN No. PIN NAME FUNCTION 1 N.C. 2 GND 3 N.C. 4 VDD POWER SUPPLY 5 OUT OUTPUT COMMENT 5 4 4 1 2 3 Surface 3 5 OPEN or Short to GND. GROUND OPEN or Short to GND. www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 10/19 2 1 Reverse 2010.01 - Rev.C BU52001GUL,BU52011HFV,BU52021HFV, BU52015GUL,BU52025G,BU52051NVX, BD7411G Technical Note BU52025G ＶDD 0.1μF 4 Adjust the bypass capacitor value as necessary, according to voltage noise conditions, etc. LATCH × The CMOS output terminals enable direct SAMPLE & HOLD HALL ELEMENT DYNAMIC OFFSET CANCELLATION TIMING LOGIC 5 OUT connection to the PC, with no external pull-up resistor required. 2 GND Fig.32 PIN No. PIN NAME FUNCTION COMMENT 1 N.C. 2 GND 3 N.C. 4 VDD POWER SUPPLY 5 OUT OUTPUT OPEN or Short to GND. 5 4 4 5 1 2 3 Surface 3 2 1 Reverse GROUND OPEN or Short to GND. BD7411G ＶDD 5 0.1μF Adjust the bypass capacitor value as necessary, according to voltage noise conditions, etc. TIMING LOGIC connection to the PC, with no external pull-up LATCH × The CMOS output terminals enable direct SAMPLE & HOLD HALL ELEMENT DYNAMIC OFFSET CANCELLATION REG resistor required. 4 OUT 2 GND Fig.33 PIN No. PIN NAME FUNCTION 1 N.C. 2 GND 3 N.C. 4 OUT OUTPUT 5 VDD POWER SUPPLY COMMENT OPEN or Short to GND. 5 4 4 5 1 2 3 Surface 3 2 1 Reverse GROUND OPEN or Short to GND. www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 11/19 2010.01 - Rev.C BU52001GUL,BU52011HFV,BU52021HFV, BU52015GUL,BU52025G,BU52051NVX, BD7411G Technical Note ●Description of Operations (Micropower Operation) The Omnipolar detection Hall IC adopts an intermittent operation method to save energy. At startup, the Hall elements, amp, comparator and other detection circuits power ON and magnetic detection begins. During standby, the detection circuits power OFF, thereby reducing current consumption. The detection results are held while standby is active, and then output. IDD Period Startup time Standby t Fig.34 ※BD7411G don’t adopts an intermittent operation method. (Offset Cancelation) VDD I B× ＋ Hall Voltage － GND Fig.35 www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. Reference period: 50ms (MAX100ms) Reference startup time: 48μs The Hall elements form an equivalent Wheatstone (resistor) bridge circuit. Offset voltage may be generated by a differential in this bridge resistance, or can arise from changes in resistance due to package or bonding stress. A dynamic offset cancellation circuit is employed to cancel this offset voltage. When Hall elements are connected as shown in Fig. 35 and a magnetic field is applied perpendicular to the Hall elements, voltage is generated at the mid-point terminal of the bridge. This is known as Hall voltage. Dynamic cancellation switches the wiring (shown in the figure) to redirect the current flow to a 90˚ angle from its original path, and thereby cancels the Hall voltage. The magnetic signal (only) is maintained in the sample/hold circuit during the offset cancellation process and then released. 12/19 2010.01 - Rev.C BU52001GUL,BU52011HFV,BU52021HFV, BU52015GUL,BU52025G,BU52051NVX, BD7411G Technical Note (Magnetic Field Detection Mechanism) S N S S S N N Flux Flux Fig.36 The Hall IC cannot detect magnetic fields that run horizontal to the package top layer. Be certain to configure the Hall IC so that the magnetic field is perpendicular to the top layer. N S N S S N OUT [V] Flux Flux High High High Low Low Bop N Brp N N-Pole 0 Magnetic flux density [mT] B Brp S Bop S S-Pole Fig.37 The Omnipolar detection Hall IC detects magnetic fields running perpendicular to the top surface of the package. There is an inverse relationship between magnetic flux density and the distance separating the magnet and the Hall IC: when distance increases magnetic density falls. When it drops below the operate point (Bop), output goes HIGH. When the magnet gets closer to the IC and magnetic density rises, to the operate point, the output switches LOW. In LOW output mode, the distance from the magnet to the IC increases again until the magnetic density falls to a point just below Bop, and output returns HIGH. (This point, where magnetic flux density restores HIGH output, is known as the release point, Brp.) This detection and adjustment mechanism is designed to prevent noise, oscillation and other erratic system operation. www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 13/19 2010.01 - Rev.C BU52001GUL,BU52011HFV,BU52021HFV, BU52015GUL,BU52025G,BU52051NVX, BD7411G Technical Note ●Intermittent Operation at Power ON Power ON VDD Startup time Standby time Standby time Startup time Supply current (Intermittent action) Indefinite OUT High (No magnetic field present) Indefinite OUT (Magnetic field present) Low Fig.38 The Omnipolar detection Hall IC adopts an intermittent operation method in detecting the magnetic field during startup, as shown in Fig. 38. It outputs to the appropriate terminal based on the detection result and maintains the output condition during the standby period. The time from power ON until the end of the initial startup period is an indefinite interval, but it cannot exceed the maximum period, 100ms. To accommodate the system design, the Hall IC output read should be programmed within 100ms of power ON, but after the time allowed for the period ambient temperature and supply voltage. ※BD7411G don’t adopts an intermittent operation method. ●Magnet Selection Of the two representative varieties of permanent magnet, neodymium generally offers greater magnetic power per volume than ferrite, thereby enabling the highest degree of miniaturization, Thus, neodymium is best suited for small equipment applications. Fig. 39 shows the relation between the size (volume) of a neodymium magnet and magnetic flux density. The graph plots the correlation between the distance (L) from three versions of a 4mm X 4mm cross-section neodymium magnet (1mm, 2mm, and 3mm thick) and magnetic flux density. Fig. 40 shows Hall IC detection distance – a good guide for determining the proper size and detection distance of the magnet. Based on the BU52011HFV, BU52015GUL operating point max 5.0 mT, the minimum detection distance for the 1mm, 2mm and 3mm magnets would be 7.6mm, 9.22mm, and 10.4mm, respectively. To increase the magnet’s detection distance, either increase its thickness or sectional area. 10 Magnetic flux density[mT] 9 t=3mm 8 7 t=1mm t=2mm 6 5 4 3 2 1 7.6mm 0 0 2 4 6 8 9.2mm 10.4mm 10 12 14 16 18 20 Distance between magnet and Hall IC [mm] Fig.39 X t Y X=Y=4mm t=1mm,2mm,3mm Magnet size Magnet material: NEOMAX-44H (material) Maker: NEOMAX CO.,LTD. Magnet t L: Variable …Flux density measuring point Fig.40 Magnet Dimensions and Flux Density Measuring Point www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 14/19 2010.01 - Rev.C BU52001GUL,BU52011HFV,BU52021HFV, BU52015GUL,BU52025G,BU52051NVX, BD7411G Technical Note ●Position of the Hall Effect IC(Reference) VCSP50L1 0.6 0.55 0.55 0.8 0.6 0.8 0.35 SSOP5 HVSOF5 SSON004X1216 1.45 0.8 0.6 0.2 0.2 (UNIT：mm) ●Footprint dimensions (Optimize footprint dimensions to the board design and soldering condition) VCSP50L1 SSON004X1216 Please avoid having potential overstress from PCB material, strength, mounting positions. If you had any further questions or concerns, please contact your Rohm sales and affiliate. HVSOF5 SSOP5 (UNIT：mm) www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 15/19 2010.01 - Rev.C BU52001GUL,BU52011HFV,BU52021HFV, BU52015GUL,BU52025G,BU52051NVX, BD7411G Technical Note ●Terminal Equivalent Circuit Diagram OUT , OUT1, OUT2 Because they are configured for CMOS (inverter) output, the output pins require no external resistance and allow direct connection to the PC. This, in turn, enables reduction of the current that would otherwise flow to the external resistor during magnetic field detection, and supports overall low current (micropower) operation. VDD GND Fig.41 ●Operation Notes 1) Absolute maximum ratings Exceeding the absolute maximum ratings for supply voltage, operating conditions, etc. may result in damage to or destruction of the IC. Because the source (short mode or open mode) cannot be identified if the device is damaged in this way, it is important to take physical safety measures such as fusing when implementing any special mode that operates in excess of absolute rating limits. 2) GND voltage Make sure that the GND terminal potential is maintained at the minimum in any operating state, and is always kept lower than the potential of all other pins. 3) Thermal design Use a thermal design that allows for sufficient margin in light of the power dissipation (Pd) in actual operating conditions. 4) Pin shorts and mounting errors Use caution when positioning the IC for mounting on printed circuit boards. Mounting errors, such as improper positioning or orientation, may damage or destroy the device. The IC may also be damaged or destroyed if output pins are shorted together, or if shorts occur between the output pin and supply pin or GND. 5) Positioning components in proximity to the Hall IC and magnet Positioning magnetic components in close proximity to the Hall IC or magnet may alter the magnetic field, and therefore the magnetic detection operation. Thus, placing magnetic components near the Hall IC and magnet should be avoided in the design if possible. However, where there is no alternative to employing such a design, be sure to thoroughly test and evaluate performance with the magnetic component(s) in place to verify normal operation before implementing the design. Magnet Slide d Hall IC L Fig.42 Flux A B S N Flux Fig.43 Magnetic fux density[mT] 6) Slide-by position sensing Fig.42 depicts the slide-by configuration employed for position sensing. Note that when the gap (d) between the magnet and the Hall IC is narrowed, the reverse magnetic field generated by the magnet can cause the IC to malfunction. As seen in Fig.43, the magnetic field runs in opposite directions at Point A and Point B. Since the Omnipolar detection Hall IC can detect the S-pole at Point A and the N-pole at Point B, it can wind up switching output ON as the magnet slides by in the process of position detection. Fig. 44 plots magnetic flux density during the magnet slide-by. Although a reverse magnetic field was generated in the process, the magnetic flux density decreased compared with the center of the magnet. This demonstrates that slightly widening the gap (d) between the magnet and Hall IC reduces the reverse magnetic field and prevents malfunctions. 10 8 6 4 2 0 -2 -4 -6 -8 -10 Reverse 0 1 2 3 4 5 6 7 8 9 10 Horizontal distance from the magnet [mm] Fig.44 www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 16/19 2010.01 - Rev.C BU52001GUL,BU52011HFV,BU52021HFV, BU52015GUL,BU52025G,BU52051NVX, BD7411G Technical Note 7) Operation in strong electromagnetic fields Exercise extreme caution about using the device in the presence of a strong electromagnetic field, as such use may cause the IC to malfunction. 8) Common impedance Make sure that the power supply and GND wiring limits common impedance to the extent possible by, for example, employing short, thick supply and ground lines. Also, take measures to minimize ripple such as using an inductor or capacitor. 9) GND wiring pattern When both a small-signal GND and high-current GND are provided, single-point grounding at the reference point of the set PCB is recommended, in order to separate the small-signal and high-current patterns, and to ensure that voltage changes due to the wiring resistance and high current do not cause any voltage fluctuation in the small-signal GND. In the same way, care must also be taken to avoid wiring pattern fluctuations in the GND wiring pattern of external components. 10) Exposure to strong light Exposure to halogen lamps, UV and other strong light sources may cause the IC to malfunction. If the IC is subject to such exposure, provide a shield or take other measures to protect it from the light. In testing, exposure to white LED and fluorescent light sources was shown to have no significant effect on the IC. 11) Power source design Since the IC performs intermittent operation, it has peak current when it’s ON. Please taking that into account and under examine adequate evaluations when designing the power source. www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 17/19 2010.01 - Rev.C BU52001GUL,BU52011HFV,BU52021HFV, BU52015GUL,BU52025G,BU52051NVX, BD7411G Technical Note ●Ordering part number B D 7 Part No. 4 1 1 Part No. 52001,52015 52025,7411 52051 52011,52021 G - T Package GUL: VSCP50L1 G: SSOP5 NVX: SSON004X1216 HFV: HVSOF5 R Packaging and forming specification E2: Embossed tape and reel (VSCP50L1 ) TR: Embossed tape and reel (SSOP5, HVSOF5, SSON004X1216) VCSP50L1 (BU52001GUL,BU52015GUL) <Tape and Reel information> Tape Embossed carrier tape Quantity 3000pcs Direction of feed E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand Direction of feed 1pin (Unit:mm) Reel ) ∗ Order quantity needs to be multiple of the minimum quantity. SSOP5 5 4 1 2 0.2Min. +0.2 1.6 −0.1 2.8±0.2 <Tape and Reel information> +6° 4° −4° 2.9±0.2 3 Tape Embossed carrier tape Quantity 3000pcs Direction of feed TR The direction is the 1pin of product is at the upper right when you hold ( reel on the left hand and you pull out the tape on the right hand 1pin +0.05 0.13 −0.03 0.05±0.05 1.1±0.05 1.25Max. ) +0.05 0.42 −0.04 0.95 0.1 Direction of feed Reel (Unit : mm) www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 18/19 ∗ Order quantity needs to be multiple of the minimum quantity. 2010.01 - Rev.C BU52001GUL,BU52011HFV,BU52021HFV, BU52015GUL,BU52025G,BU52051NVX, BD7411G Technical Note SSON004X1216 <Tape and Reel information> 1.6 ± 0.1 1.2±0.1 Embossed carrier tape Quantity 5000pcs Direction of feed 0.6MAX 1PIN MARK 1 2 4 3 +0.03 0.02 -0.02 0.65±0.1 TR The direction is the 1pin of product is at the upper right when you hold ( reel on the left hand and you pull out the tape on the right hand ) (0.12) S 0.8 ± 0.1 0.2 ± 0.1 0.08 S +0.05 0.2 -0.04 Tape Direction of feed 1pin 0.75±0.1 Reel (Unit : mm) ∗ Order quantity needs to be multiple of the minimum quantity. HVSOF5 <Tape and Reel information> 4 (0.3) 3000pcs 0.2MAX Embossed carrier tape Quantity 4 (0.91) 5 Tape 5 (0.41) (0.05) 1.0±0.05 (0.8) Direction of feed TR The direction is the 1pin of product is at the upper right when you hold ( reel on the left hand and you pull out the tape on the right hand ) 3 2 1 1 2 3 1pin 0.13±0.05 S +0.03 0.02 –0.02 1.6±0.05 0.6MAX 1.2±0.05 (MAX 1.28 include BURR) 1.6±0.05 0.1 S 0.5 0.22±0.05 0.08 Direction of feed M Reel (Unit : mm) www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 19/19 ∗ Order quantity needs to be multiple of the minimum quantity. 2010.01 - Rev.C Notice Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. Great care was taken in ensuring the accuracy of the information specified in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage. The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by ROHM and other parties. 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If you intend to export or ship overseas any Product or technology specified herein that may be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to obtain a license or permit under the Law. Thank you for your accessing to ROHM product informations. More detail product informations and catalogs are available, please contact us. ROHM Customer Support System http://www.rohm.com/contact/ www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. R1010A