www.fairchildsemi.com FAN1654 1.5A LDO, DDR Bus Termination Regulator Features Description • • • • • • • • The FAN1654 is a low-cost bi-directional LDO specifically designed for terminating DDR memory bus. It can both sink and source up to 1A continuous, 1.5A peak, providing enough current for most DDR applications. Load regulation meets the JEDEC spec, VTT = (VDDQ/2) ± 40mV. Sinks and sources 1A continuous, 1.5A peak -40°C to +125°C Operating Range Load regulation: (VDDQ/2) ± 40mV 5mA VREF buffer tracks VTT On-chip thermal limiting Power-enhanced eTSSOP™-16 package Low Current Shutdown Mode Output Short Circuit Protection The FAN1654 includes a buffered reference voltage capable of supplying up to 5mA current. On-chip thermal limiting provides protection against a combination of power overload and ambient temperature that would create an excessive junction temperature. A shutdown input puts the FAN1654 into a low power mode for laptop computer applications. Applications • DDR terminators The FAN1654 regulator is available in a power-enhanced eTSSOP™-16 package, and the standard SOIC-14 Block Diagram VDDQ VDD VDD VDD SHDN 200k VREFOUT + VTTFORCE + VREFIN VTTFORCE 200k VTTSENSE FAN1655 VSSQ VSS VSS VSS REV. 1.0.5 4/17/02 PRODUCT SPECIFICATION FAN1654 Pin Assignments VDD 1 16 NC VDD VTTFORCE 2 15 14 VDDQ VSS VSS 4 5 13 VSSQ 6 12 11 SHDN VTTFORCE VDD VSS 7 8 10 9 VTTSENSE 3 FAN1654 VREFOUT VREFIN VSSQ 1 14 SHDN VREFOUT VDDQ 2 3 13 12 VREFIN VDD 11 VSS VDD 4 5 VDD VTTFORCE 6 10 9 VSS 7 8 VSS FAN1654 VTTSENSE VTTFORCE NC 16-Lead Plastic eTSSOP-16 θJC = 4˚C/W* 14-Lead Plastic SOIC θJC = 37˚C/W, θJA = 88˚C/W *With package power slug soldered to 0.5 square inch copper area over backside ground plane of internal power plane Pin Definitions Pin Number* Pin Name 1, 2, 7 (4, 5, 10) VDD Pin Function Description VDD. Input power for the LDO. 3, 6 (6, 9) VTTFORCE 4, 5, 8 (7, 8, 11) VSS VTT Force Output. 10 (12) VTTSENSE 11 (13) VREFIN 12 (14) SHDN Shutdown. This active low shutdown turns off both VTT and VREFOUT. This pin has an internal pull-down, and must be externally driven high for the IC to be on. 13 (1) VSSQ Signal Ground. 14 (2) VREFOUT 15 (3) VDDQ 9,16 NC Power Ground. VTT Sense. Feedback for remote sense of the VTT voltage. VREFIN. Alternative input for direct control of VTTOUT and VREFOUT. Buffered Voltage Reference Output. VDDQ Input. Attach this pin to the VDDQ supply to generate VTT and VREFOUT. No Internal Connection * Pin Numbers in brackets are for the SOIC-14 package Typical Application VDDQ VDD VTTFORCE 470µF GND 100µF 6V 1 2 3 4 FAN1654 5 6 7 8 10µF 16 13 12 11 10 9 10µF 10k 15 14 VREFOUT 1nF SHDN VTTSENSE 1nF (connect to VTTFORCE at the load) GND Figure 1. (eTSSOP pinout shown) 2 REV. 1.0.5 4/17/02 FAN1654 PRODUCT SPECIFICATION Typical Performance Characteristics Quiescent Current vs. Temperature VREF Output Change vs. IREF 3.5 1.0 VDD = VDDQ = 2.5V TA = 25˚C 0.5 2.5 ∆ VREFOUT (mV) QUIESCENT CURRENT (mA) 3 2 1.5 ROUT = 0.2Ω 0 -0.5 1 -1.0 -6 .5 0 -60 -5 -4 -3 -2 -1 0 1 2 3 4 5 6 VREF LOAD CURRENT (mA) -40 -20 0 20 40 60 80 100 120 140 AMBIENT TEMPERATURE (˚C) Figure 2 Figure 3 VTT Load Current 1.260 VDD = VDDQ = 2.5V TA = 25°C VTT OUTPUT (V) 1.255 1.250 1.245 1.240 -1500 -1000 -500 0 500 1000 1500 VTT Load Current (mA) Figure 4 REV. 1.0.5 4/17/02 3 PRODUCT SPECIFICATION FAN1654 Absolute Maximum Ratings Supply Voltage VDD, VDDQ 6V Junction Temperature, TJ 150°C Storage Temperature -65 to 150°C Lead Soldering Temperature, 10 seconds 300°C Power Dissipation, PD 1.4W Recommended Operating Conditions Parameter Conditions Min. Typ. Max. Units 2.3 2.5 3.6 V Supply Voltage VDDQ 2.2 2.5 Ambient Operating Temperature -40 VREFIN 1.1 Supply Voltage VDD 1.25 3.0 V 125 °C 1.5 V Electrical Characteristics (VDD = VDDQ = 2.5V ± 0.2V, and TA = 25˚C using circuit in Figure 1, unless otherwise noted.) The • denotes specifications which apply over the specified operating temperature range. Parameter VTT Output Voltage VTT Output Slew Rate VTT Leakage Current VTT Current Limit VREFIN Input Impedance VREFOUT Output Voltage VREFOUT Output Current VREFOUT Leakage Current SHDN Logic High SHDN Logic Low IDD Supply Current VDDQ Leakage Current VDD Leakage Current SHDN Input Current Over-Temperature Shutdown Over-Temperature Hysteresis 4 Conditions IOUT = 0A, VREFIN = open VDDQ = 2.3V VDDQ = 2.5V VDDQ = 2.7V IOUT = +1A, VREFIN = open VDDQ = 2.3V VDDQ = 2.5V VDDQ = 2.7V Cload = 10µF SHDN = 0V • • • Min. Typ. Max. Units 1.135 1.235 1.335 1.150 1.250 1.350 1.165 1.265 1.365 V V V 1.110 1.210 1.310 1.150 1.250 1.350 1.190 1.290 1.390 V V V 0.1 • -50 50 ±2 100 V/µsec µA A KΩ No load VREFIN = 1.150V • VREFIN = 1.250V • VREFIN = 1.350V • VDDQ = 2.3V • SHDN = 0V • • • No load, SHDN = 2.7V • SHDN = 0V • SHDN = 0V • SHDN = 2.7V • 1.145 1.245 1.345 -5 -10 1.667 1.150 1.250 1.350 3 6 3 50 155 30 1.155 1.255 1.355 5 10 0.800 10 10 50 75 V V V mA µA V V mA µA µA µA °C °C REV. 1.0.5 4/17/02 FAN1654 PRODUCT SPECIFICATION Mechanical Dimensions 16 Lead eTSSOP 5.0 ± 0.1 0.10 TYP -A4.00 9 16 16 -B- 9 6.4 4.4 ± 0.1 7.72 3.40 4.16 3.2 1 8 0.2 C B A ALL LEAD TIPS PIN #1 IDENT. (1.78) 1 1.2 MAX ALL LEAD TIPS 0.1 C +0.15 (0.90) –0.10 -C- 8 0.42 TYP 0.65 TYP LAND PATTERN RECOMMENDATION 0.10±0.05 TYP (0.19–0.30) 0.65 TYP 0.10 M C B A SEE DETAIL A 1.7 MIN 9 (0.09–0.20) 16 1.5 MIN 12° TOP & BOTTOM GAGE PLANE R0.09MIN 0.25 0°–8° 8 1 BOTTOM VIEW SEATING PLANE 0.75 0.45 (1.00) DETAIL A NOTES: A. CONFORMS TO JEDEC REGISTRATION MO-153, VARIATION ABT, DATED 10/97. B. DIMENSIONS ARE IN MILLIMETERS. C. DIMENSIONS ARE EXCLUSIVE OF BURRS, MOLD FLASH, AND THE BAR EXTENSIONS. D. DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. REV. 1.0.5 4/17/02 5 PRODUCT SPECIFICATION FAN1654 Mechanical Dimensions 14-Lead SOIC NOTES: 1. This package conforms to JEDEC MS-012, variation AB, ISSUEC dated May, 1990. 2. All dimensions are in millimeters 3. Standard lead finished 200 microinches / 5.08 microns min. Lead/Tin (solder) oncopper 0.50 S8.71-8.51; 7.62 12 13 14 11 10 8 9 5.75 1.00 S4.00-3.80 S6.20-5.80; 1 2 3 4 1.27 5 6 1.27 7 7.62 S0.51-0.35; LAND PATTERN RECOMMENDATION S0.50-0.25;X45˚ S0.25-0.10;z S0.25-0.19; S8˚-0˚ S1.75-1.35; S1.27-0.40; SEATING PLANE 6 REV. 1.0.5 4/17/02 PRODUCT SPECIFICATION FAN1654 Ordering Information Product Number Package FAN1654MTF eTSSOP-16 FAN1654MTFX eTSSOP-16 in tape and reel FAN1654M SOIC-14 FAN1654MX SOIC-14 in tape and reel LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. 2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. www.fairchildsemi.com 4/17/02 0.0m 004 Stock#DS30004854 2002 Fairchild Semiconductor Corporation