Microsemi DRF1300 Mosfet push-pull hybrid Datasheet

DRF1300
500V, 30A, 30MHz
MOSFET Push-Pull Hybrid
The DRF1300 is a push-pull hybrid containing two high power gate
drivers and two power MOSFETs. It was designed to provide the system designer increased flexibility, higher performance, and lowered cost
over a non-integrated solution. This low parasitic approach, coupled
with the Schmitt trigger input, Kelvin signal ground, Anti-Ring function
Invert and Non-invert select pin provide improved stability and control in
Kilowatt to Multi-Kilowatt, High Frequency ISM applications.
D
IN
S
D
IN
DRIVER 30A
MOSFETS
FEATURES
S
TYPICAL APPLICATIONS
• Switching Frequency: DC TO 30MHz
• Switching Speed 3-4ns
• Class C, D and E RF Generators
• Inverting Non-Inverting Select
• BVds = 500V
• Switch Mode Power Amplifiers
• Low Pulse Width Distortion
• Ids = 30A max. Per-section
• HV Pulse Generators
• Single Power Supply (Per Section)
• Rds(on) ≤ .24 Ohm
• 1V CMOS Schmitt Trigger Input 1V
• Ultrasound Transducer Drivers
• PD = 550W Per-section
• Acoustic Optical Modulators
Hysteresis
• RoHS Compliant
Driver Absolute Maximum Ratings
Symbol
VDD
Parameter
Ratings
Supply Voltage
Unit
18
V
IN, FN
Input Single Voltages
-.7 to +5.5
IO PK
Output Current Peak
8
A
TJMAX
Operating Temperature
175
°C
Driver Specifications
VDD
IN
Parameter
Min
Typ
Supply Voltage
8
15
Input Voltage
3
5
Max
Unit
V
IN(R)
Input Voltage Rising Edge
3
IN(F)
Input Voltage Falling Edge
3
IDDQ
Quiescent Current
2
mA
Output Current
8
A
IO
Coss
Output Capacitance
Ciss
Input Capacitance
3
RIN
Input Parallel Resistance
1
ns
2500
pF
MΩ
VT(ON)
Input, Low to High Out
0.8
1.1
VT(OFF)
Input, High to Low Out
1.9
2.2
TDLY
Time Delay (throughput)
38
tr
Rise Time
5
tf
Fall Time
5
Microsemi Website - http://www.microsemi.com
V
ns
ns
050-4971 Rev D 4-2009
Symbol
MOSFET Specifications (Per-Section)
Symbol
BVDSS
ID
RDS(on)
DRF1300
Parameter
Min
Drain Source Voltage
500
Typ
Max
V
Continuous Drain Current THS = 25°C
30
Drain-Source On State Resistance
Unit
0.24
A
Ω
Dynamic Characteristics (Per-Section)
Symbol
Parameter
Min
Typ
CISS
Input Capacitance
1800
Coss
Output Capacitance
335
Crss
Reverse Transfer Capacitance
75
Max
Unit
pF
Thermal Characteristics (Total Package)
Symbol
Parameter
Ratings
RθJC
Junction to Case Thermal Resistance
.06
RθJHS
Junction to Heat Sink Thermal Resistance
.134
TJSTG
Storage Junction Temperature
PD
PDC
Unit
°C/W
-55 to 150
Maximum Power Dissipation @ TSINK = 25°C
1.1
Total Power Dissipation @ TC = 25°C
2.5
°C
KW
Section A and B Output Switching Performance
Symbol
Characteristic
Min
Typ
Max
TON
Leading Edge 10% to 90%
2
3
4
TOFF
Trailing Edge 10% to 90%
45
TBD
49
TDLY(ON)
Total Throughput Delay Time, ON
45
TBD
47
TDLY(OFF)
Total Throughput Delay Time, OFF
49
50
51
∆TDLY(ON)
Delta TON Delay between Section A and B
-0.5
0
1.5
∆TDLY(OFF)
Delta TOFF Delay between Section A and B
0
0.6
1.3
Typ
ns
Microsemi reserves the right to change, without notice, the specifications and information contained herein.
050-4971 Rev D 4-2009
Figure 1, DRF1300 Circuit Diagram
The DRF1300 is configured as a Push Pull Hybrid incorporating two independent channels configured with a common source each consisting of a
driver, a high voltage MOSFET and by-pass capacitors. The function of the by-pass capacitors C1 and C2 is to reduce the internal parasitic loop
inductance. This coupled with the tight geometry of the hybrid allows optimal gate drive to the MOSFET. This low parasitic approach coupled
with the Schmitt trigger input (IN), Kelvin signal ground (SG) and the Anti-Ring function; provide improved stability and control in Kilowatt to MultiKilowatt high frequency applications. The IN pin should be referenced to the Kelvin Ground (SG) and is applied to a Schmitt Trigger. The SG
pin is a Kelvin return for the IN pin only. The signal is then applied to the intermediate drivers and level shifters; this section contains proprietary
circuitry designed specifically for ring abatement. To further increase the utility of the device the driver die and the MOSFET die are adjacent die
selected. This provides a very close match in the turn on and propagation delays.
DRF1300
None of the inputs to U1 or U2 of the DRF1300 are isolated for direct connection to a ground referenced power supply or control circuitry.
Isolation appropriate to the application is the responsibility of the end user. It is imperative that high output currents be restricted to
the Source (14, 16, 18) and Drain (15, 17) pins by design. See DRF100 for more information on Driver IC used in the device.
The Function (FN, pin 3 or pin 9) is the invert or non-invert select Pin, it is Internally held high.
Truth Table * Referenced to SG
FN (pin 3)
IN (pin 4)
MOSFET
HIGH
HIGH
ON
HIGH
LOW
OFF
LOW
HIGH
OFF
LOW
LOW
ON
Truth Table * Referenced to SG
FN (pin 9)
IN (pin 10)
MOSFET
HIGH
HIGH
ON
HIGH
LOW
OFF
LOW
HIGH
OFF
LOW
LOW
ON
Microsemi’s products are covered by one or more of U.S. patents 4,895,810 5,045,903 5,089,434 5,182,234 5,019,522 5,262,336 6,503,786 5,256,583
4,748,103 5,283,202 5,231,474 5,434,095 5,528,058 6,939,743 and foreign patents. us and Foreign patents pending. All Rights Reserved.
050-4971 Rev D 4-2009
Figure 2, DRF1300 Test Circuit
The test circuit illustrated in Figure 2 was used to evaluate the DRF1300 (available as an evaluation board DRF13XX/EVALSW.) The input
control signal is applied via IN and SG pins using RG188. This provides excellent noise immunity and control of the signal ground currents.
The +VDD inputs (pins 2, 6, 8 and 12) should be heavily by-passed by 1uF capacitors as close to the pins as possible. The capacitors used
for this function must be capable of supporting the RMS currents and frequency of the gate load. A 50 Ohm (RL) load is used to evaluate the
output performance.
DRF1300
Pin Assignments
Pin 1
Ground
Pin 2
U1 +Vdd
Pin 3
U1 FN
Pin 4
U1 IN
Pin 5
U1 SG
Pin 6
U1 +Vdd
Pin 7
Ground
Pin 8
U2 +Vdd
Pin 9
U2 FN
Pin 10
U2 IN
Pin 11
U2 SG
Pin 12
U2 +Vdd
Pin 13
Ground
Pin 14
Source
Pin 15
U2 Drain
Pin 16
Source
Pin 17
U1 Drain
Pin 18
Source
2.000
GAPS - 0.090" , 2 PLCS
LARGE LEADS - 0.300", 2 PLCS
GAPS - 0.080" , 2 PLCS
0.300
MEDIUM LEADS - 0.175", 3 PLCS
0.263
17
18
15
16
0.040
14
R0.150
4 PLCS
0.125
0.125
0.750
Ø0.125
4 PLCS
DRF1300
0.250
0.250
1
0.268
LARGE LEADS - 0.135", 3 PLCS
2
3
4
5
6
7
8
9
10 11 12
050-4971 Rev D 4-2009
0.300
13
GAPS - .0400", 4 PLCS
GAPS - .0300", 8 PLCS
MEDIUM LEADS - 0.090", 4 PLCS
SMALL LEADS - 0.050", 6 PLCS
1.000
All dimensions are ± .005
Figure 4, DRF1300 Mechanical Outline
.005" TYP. HALF HARD
COPPER GOLD PLATED
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