CL04-15 Technical Specifications FEATURES High Overload Surge Capacity Durable Epoxy Resin Package ABSOLUTE MAXIMUM RATINGS To order with quick disconnect terminals, use the partnum-TERM VRRM Repeating Peak Reverse Voltage (kV): 15 T JMAX Max. junction temp.(°C): 130 T STG Storage temp.(°C): -40 to +130 IO Avg. Forward Current (mA): 500 IFSM Forward Surge Current (A): 40 ELECTRICAL CHARACTERISTICS IR1 Normal temp. Reverse Current (μA) @ VR=VRRM, Tamb=25°C: IR2 High temp. Reverse Current (μA) @ VR=VRRM, Tamb=100°C: VF Forward Voltage Drop (V) @ IF=500mA: Reverse Breakdown Voltage (kV) @ IR=100μA: 5.0 max 50 max 13.0 ≥15 TEST CONDITIONS High temp. Reverse Voltage @ 1000 hrs.: High temp. storage @ 1000 Hrs.: Soldering Resistance Heat Test: High pressure smoke test @ 10 hrs.: Insulation Resistance Test (1000MΩ): Insulation Strength Test @ 10KV: Lead bend test: Lead pull test: VRM=VRRM, f=50Hz, TAMB=100°C Half sine voltage with f=50Hz applied, TAMB=100°C T AMB=130 ±2°C Solder trough temp.: 350±10°C, Dip Time: 3.5s ± 0.5s 120°C, 2 x 105pa Between the center of the body and terminal (See Fig. 1) 1 min. between center of the body and terminal. (Fig.1 ) Force 10 N to the lead, bent it to pos. and neg. 90° Force 70 N of axial to the lead for 1 min. Insulation resistance test condition: Measure between A and B by using a DC 500V Insulation resistance tester Insulation strength test condition: Apply half sine wave voltage with 10kV wave height between A and B in insulation liquid American Microsemiconductor Inc. 133 Kings Road, Madison, NJ 07940 tel. 973-377-9566 fax. 973-377-3078 Page 1 of 1 AS/EN/JISQ/ 9100:2009 REV C and ISO 9001:2008 Certificate No: 45325 http://www.americanmicrosemiconductor.com