NT Features S CO M PL IA ■ *R oH ■ ■ Applications Two resistance-matched PTCs in a plastic housing Narrow resistance tolerance RoHS compliant* Used as a secondary overcurrent protection device in: ■ Customer Premise Equipment (CPE) ■ Central Office (CO) ■ Access equipment CMF-SDP Series - Telecom CPTC Resettable Fuses Electrical Characteristics Model Induction Voltage Withstand Rated Voltage VAC Volts Ohms Tolerance Ohms 600 600 600 600 600 600 600 600 600 600 230 230 230 230 230 230 230 230 230 230 7 10 10 25 25 35 35 50 50 75 ±20 % ±20 % ±20 % ±20 % ±20 % +15/-20 % +15/-20 % ±15 % ±15 % ±20 % ±0.5 ±0.5 ±0.5 ±0.5 ±0.5 ±0.5 ±0.5 ±0.5 ±0.5 ±1 CMF-SDP07 CMF-SDP10 CMF-SDP10A CMF-SDP25 CMF-SDP25A CMF-SDP35 CMF-SDP35A CMF-SDP50 CMF-SDP50A CMF-SDP75 Rated Resistance (RN) Resistance Matching In Housing Hold Current Trip Current Amps @ 25 °C Amps @ 25 °C 0.150 0.180 0.150 0.130 0.130 0.110 0.110 0.090 0.090 0.070 0.350 0.360 0.360 0.260 0.260 0.230 0.230 0.190 0.190 0.150 Typical Time to Trip Imax @ @ Imax/ 230 VAC 230 VAC Amps Seconds 3.0 1.0 1.0 2.8 2.8 4.6 4.6 2.5 2.5 2.5 0.45 3.8 3.8 0.2 0.3 0.06 0.04 0.13 0.1 0.12 Operating Temperature Range: -40°C to +125 °C Test Procedures And Requirements For Model CMF-SDP Series Primary Test Protection Test Condition Requirements Mains Power Contact - ITU-T K.20, K.21 ....None................230 V rms, 10 ohms, 15 Min. ......................................................(Ri-Rf) / Ri < ±10 % Power Induction - ITU-T K.20, K.21..............None................600V rms, 600 ohms, 0.2 seconds, 10 cycles, every 1 Min. ......(Ri-Rf) / Ri < ±10 % Power Induction - ITU-T K.20, K.21..............GDT ................600 V rms, 600 ohms, 1 second, 10 cycles, every 1 Min. ..........(Ri-Rf) / Ri < ±10 % Power Induction - ITU-T K.20, K.21..............GDT ................600 V rms, 200 ohms, 1 second, 10 cycles, every 1 Min. ..........(Ri-Rf) / Ri < ±10 % Lightning Surge - ITU-T K.20, K.21 ......................................10/700 µs, 25 ohms, 1.0 kV, 10 Tests, every 1 Min. ..................(Ri-Rf) / Ri < ±10 % Lightning Surge......................................................................10/100 µs, 25 ohms, 1.5 kV, 30 Tests, every 3 Min. ..................(Ri-Rf) / Ri < ±10 % Ri = R initial Rf = R final Typical Part Marking How to Order Represents total content. Layout may vary. PART IDENTIFICATION: 07P = CMF-SDP07 10P = CMF-SDP10 10PA = CMF-SDP10A 25P = CMF-SDP25 25PA = CMF-SDP25A 35P = CMF-SDP35 35PA = CMF-SDP35A 50P = CMF-SDP50 50PA = CMF-SDP50A 75P = CMF-SDP75 MANUFACTURER'S TRADEMARK 35P8G BI-WEEKLY DATE CODE: WEEK 13-14 = G YEAR CODE: 8 = 2008 CMF - SD P 35 A -XX - 2 Product Designator Style SD = Surface Mount Dual Pkg. Housing P = Plastic Rated Resistance (RN) 7-75 (7-75 Ohms) Footprint and Height Option Blank = Standard Product A = Reduced Footprint and Height Resistance Tolerance Option Blank = Standard -XX = XX %; e.g. -10 = ±10 % Packaging Options - 2 = Tape & Reel *RoHS Directive 2002/95/EC Jan 27 2003 including Annex. Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. Asia-Pacific: Tel: +886-2 2562-4117 Fax: +886-2 2562-4116 Europe: Tel: +41-41 768 5555 Fax: +41-41 768 5510 The Americas: Tel: +1-951 781-5500 Fax: +1-951 781-5700 www.bourns.com CMF-SDP Series - Telecom CPTC Resettable Fuses Solder Reflow Recommendations Preheating 300 Soldering Cooling Solder reflow • Recommended reflow methods: IR, vapor phase oven, hot air oven. • Devices are not designed to be wave soldered to the bottom side of the board. • Gluing the devices is not recommended. • Recommended maximum paste thickness is 0.25 mm (.010 inch). • Devices can be cleaned using standard industry methods and solvents. Note: • If reflow temperatures exceed the recommended profile, devices may not meet the performance specifications. Rework • A device should not be reworked. Temperature (°C) 250 200 150 100 50 0 160–220 120 10–20 Time (seconds) Product Dimensions CMF-SDP10A, 25A, 35A & 50A CMF-SDP07, 10, 25, 35, 50 & 75 8.75 (.344) MAX. 11.5 (.453) MAX. 10.2 (402) MAX. 2.6 (.102) 9.0 MAX. (.354) 2.4 (.094) 5.0 (.197) 11.0 MAX. (.433) 0.5 (.020) 2 PLCS. 3.9 (.154) Recommended Pad Layout 7.2 MAX. (.283) Recommended Pad Layout 9.0 (.354) 7.2 (.283) MAX. MAX. 8.75 (.344) 11.0 (.433) 6.3 (.248) 3.9 (.154) 7.6 (.299) 5.0 (.197) 10.0 (.394) 3.2 (.126) 8.2 (.323) 2.6 2.0 (.102) (.079) DIMENSIONS = Packaging options: TAPE & REEL: 350 pcs. per reel 3.2 (.126) 2.4 (.094) 2.0 (.079) MM (INCHES) Packaging options: TAPE & REEL: 400 pcs. per reel CMF-SDP SERIES, REV. C, 11/08 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. CMF-SDP Series Tape and Reel Specifications CMF-SDP10-2, CMF-SDP25-2, CMF-SDP-35-2, CMF-SDP50-2, CMF-SDP75-2 Tape Dimensions per EIA 481-2 CMF-SDP10A-2, CMF-SDP25A-2, CMF-SDP35A-2, CMF-SDP50A-2 W 24.0 ±0.5 (0.945 ±0.020 ) 24.0 ±0.5 (0.945 ±0.020 ) P0 4.0 (0.157) 4.0 (0.157) P 16.0 (0.630) 16.0 (0.630) P2 2.0 (0.079) 2.0 (0.079) A0 9.1 ± 0.2 (0.358 ± 0.008) 7.5 ± 0.2 (0.295 ± 0.008) B0 11.20 ± 0.2 (0.441 ± 0.008) 9.0 ± 0.2 (0.354 ± 0.008) D0 1.5 (0.059) 1.5 (0.059) F 11.5 (0.453) 11.5 (0.453) E1 1.75 (0.069) 1.75 (0.069) t1 0.5 ± 0.15 (0.020 ± 0.006) 0.5 ± 0.15 (0.020 ± 0.006) K0 11.7 ± 0.2 (0.433 ± 0.008) 10.0 ± 0.2 (0.394 ± 0.008) D P2 E P0 T -0.4 (-.016) F W B0 P A0 K0 DIMENSIONS = MM (INCHES) 330 -2/+0 (12.99 -.079/+0) DIA. 24.4 (.961) MIN. 30.4 (1.197) MAX. 13.2 +0.2/-0 (.520 +.008/-0 100 ± 1.5 (3.94 ± .059) DIA. Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications.