TI CD74HC85PWTE4 High-speed cmos logic 4-bit magnitude comparator Datasheet

[ /Title
(CD74
HC85,
CD74
HCT85
)
/Subject
(High
Speed
CMOS
Logic
4-Bit
Magnitude
Compara-
CD54HC85, CD74HC85,
CD54HCT85, CD74HCT85
Data sheet acquired from Harris Semiconductor
SCHS136E
High-Speed CMOS Logic
4-Bit Magnitude Comparator
August 1997 - Revised October 2003
Features
Description
• Buffered Inputs and Outputs
The ’HC85 and ’HCT85 are high speed magnitude
comparators that use silicon-gate CMOS technology to
achieve operating speeds similar to LSTTL with the low
power consumption of standard CMOS integrated circuits.
• Typical Propagation Delay: 13ns (Data to Output at
VCC = 5V, CL = 15pF, TA = 25oC
• Serial or Parallel Expansion Without External Gating
These 4-bit devices compare two binary, BCD, or other
monotonic codes and present the three possible magnitude
results at the outputs (A > B, A < B, and A = B). The 4-bit
input words are weighted (A0 to A3 and B0 to B3), where A3
and B3 are the most significant bits.
• Fanout (Over Temperature Range)
- Standard Outputs . . . . . . . . . . . . . . . 10 LSTTL Loads
- Bus Driver Outputs . . . . . . . . . . . . . 15 LSTTL Loads
• Wide Operating Temperature Range . . . -55oC to 125oC
The devices are expandable without external gating, in both
serial and parallel fashion. The upper part of the truth table
indicates operation using a single device or devices in a
serially expanded application. The parallel expansion
scheme is described by the last three entries in the truth
table.
• Balanced Propagation Delay and Transition Times
• Significant Power Reduction Compared to LSTTL
Logic ICs
• HC Types
- 2V to 6V Operation
- High Noise Immunity: NIL = 30%, NIH = 30%of VCC at
VCC = 5V
Ordering Information
• HCT Types
- 4.5V to 5.5V Operation
- Direct LSTTL Input Logic Compatibility,
VIL= 0.8V (Max), VIH = 2V (Min)
- CMOS Input Compatibility, Il ≤ 1µA at VOL, VOH
Pinout
CD54HC85, CD54HCT85 (CERDIP)
CD74HC85 (PDIP, SOIC, SOP, TSSOP)
CD74HCT85 (PDIP, SOIC)
TOP VIEW
B3 1
TEMP. RANGE
(oC)
PACKAGE
CD54HC85F3A
-55 to 125
16 Ld CERDIP
CD54HCT85F3A
-55 to 125
16 Ld CERDIP
CD74HC85E
-55 to 125
16 Ld PDIP
CD74HC85M
-55 to 125
16 Ld SOIC
CD74HC85MT
-55 to 125
16 Ld SOIC
CD74HC85M96
-55 to 125
16 Ld SOIC
CD74HC85NSR
-55 to 125
16 Ld SOP
CD74HC85PW
-55 to 125
16 Ld TSSOP
PART NUMBER
16 VCC
(A < B) IN 2
15 A3
CD74HC85PWR
-55 to 125
16 Ld TSSOP
(A = B) IN 3
14 B2
CD74HC85PWT
-55 to 125
16 Ld TSSOP
(A > B) IN 4
13 A2
CD74HCT85E
-55 to 125
16 Ld PDIP
(A > B) OUT 5
12 A1
(A = B) OUT 6
11 B1
CD74HCT85M
-55 to 125
16 Ld SOIC
(A < B) OUT 7
10 A0
CD74HCT85MT
-55 to 125
16 Ld SOIC
GND 8
9 B0
CD74HCT85M96
-55 to 125
16 Ld SOIC
NOTE: When ordering, use the entire part number. The suffixes 96
and R denote tape and reel. The suffix T denotes a small-quantity
reel of 250.
CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures.
Copyright
© 2003, Texas Instruments Incorporated
1
CD54HC85, CD74HC85, CD54HCT85, CD74HCT85
PFunctional Diagram
15
A3
13
A2
12
A1
10
A0
(A < B) IN
(A = B) IN
(A > B) IN
B3
7
2
3
6
4
5
(A < B) OUT
(A = B) OUT
(A > B) OUT
1
14
B2
11
B1
9
B0
TRUTH TABLE
COMPARING INPUTS
A3, B3
A2, B2
A1, B1
CASCADING INPUTS
OUTPUTS
A0, B0
A>B
A<B
A=B
A>B
A<B
A=B
SINGLE DEVICE OR SERIES CASCADING
A3 > B3
X
X
X
X
X
X
H
L
L
A3 < B3
X
X
X
X
X
X
L
H
L
A3 = B3
A2 >B2
X
X
X
X
X
H
L
L
A3 = B3
A2 < B2
X
X
X
X
X
L
H
L
A3 = B3
A2 = B2
A1 > B1
X
X
X
X
H
L
L
A3 = B3
A2 = B2
A1 < B1
X
X
X
X
L
H
L
A3 = B3
A2 = B2
A1 = B1
A0 > B0
X
X
X
H
L
L
A3 = B3
A2 = B2
A1 = B1
A0 < B0
X
X
X
L
H
L
A3 = B3
A2 = B2
A1 = B1
A0 = B0
H
L
L
H
L
L
A3 = B3
A2 = B2
A1 = B1
A0 = B0
L
H
L
L
H
L
A3 = B3
A2 = B2
A1 = B1
A0 = B0
L
L
H
L
L
H
PARALLEL CASCADING
A3 = B3
A2 = B2
A1 = B1
A0 = B0
X
X
H
L
L
H
A3 = B3
A2 = B2
A1 = B1
A0 = B0
H
H
L
L
L
L
A3 = B3
A2 = B2S
A1 = B1
A0 = B0
L
L
L
H
H
L
H = High Voltage Level, L = Low Voltage, Level, X = Don’t Care
2
CD54HC85, CD74HC85, CD54HCT85, CD74HCT85
Absolute Maximum Ratings
Thermal Information
DC Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7V
DC Input Diode Current, IIK
For VI < -0.5V or VI > VCC + 0.5V . . . . . . . . . . . . . . . . . . . . . .±20mA
DC Output Diode Current, IOK
For VO < -0.5V or VO > VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±20mA
DC Output Source or Sink Current per Output Pin, IO
For VO > -0.5V or VO < VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±25mA
DC VCC or Ground Current, ICC or IGND . . . . . . . . . . . . . . . . . .±50mA
Package Thermal Impedance, θJA (see Note 1):
E (PDIP) Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67oC/W
M (SOIC) Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73oC/W
NS (SOP) Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64oC/W
PW (TSSOP) Package . . . . . . . . . . . . . . . . . . . . . . . . . 108oC/W
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . 150oC
Maximum Storage Temperature Range . . . . . . . . . .-65oC to 150oC
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300oC
(SOIC - Lead Tips Only)
Operating Conditions
Temperature Range (TA) . . . . . . . . . . . . . . . . . . . . . -55oC to 125oC
Supply Voltage Range, VCC
HC Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2V to 6V
HCT Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5V to 5.5V
DC Input or Output Voltage, VI, VO . . . . . . . . . . . . . . . . . 0V to VCC
Input Rise and Fall Time
2V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1000ns (Max)
4.5V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500ns (Max)
6V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400ns (Max)
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. The package thermal impedance is calculated in accordance with JESD 51-7.
DC Electrical Specifications
TEST
CONDITIONS
PARAMETER
25oC
-40oC TO 85oC -55oC TO 125oC
SYMBOL
VI (V)
IO (mA)
VCC
(V)
VIH
-
-
2
1.5
-
-
1.5
4.5
3.15
-
-
3.15
-
3.15
-
V
6
4.2
-
-
4.2
-
4.2
-
V
MIN
TYP
MAX
MIN
MAX
MIN
MAX
UNITS
-
1.5
-
V
HC TYPES
High Level Input
Voltage
Low Level Input
Voltage
High Level Output
Voltage
CMOS Loads
VIL
VOH
-
VIH or VIL
High Level Output
Voltage
TTL Loads
Low Level Output
Voltage
CMOS Loads
VOL
VIH or VIL
Low Level Output
Voltage
TTL Loads
Input Leakage
Current
Quiescent Device
Current
-
2
-
-
0.5
-
0.5
-
0.5
V
4.5
-
-
1.35
-
1.35
-
1.35
V
6
-
-
1.8
-
1.8
-
1.8
V
-0.02
2
1.9
-
-
1.9
-
1.9
-
V
-0.02
4.5
4.4
-
-
4.4
-
4.4
-
V
-0.02
6
5.9
-
-
5.9
-
5.9
-
V
-
-
-
-
-
-
-
-
-
V
-4
4.5
3.98
-
-
3.84
-
3.7
-
V
V
-5.2
6
5.48
-
-
5.34
-
5.2
-
0.02
2
-
-
0.1
-
0.1
-
0.1
V
0.02
4.5
-
-
0.1
-
0.1
-
0.1
V
0.02
6
-
-
0.1
-
0.1
-
0.1
V
4
4.5
-
-
0.26
-
0.33
-
0.4
V
5.2
6
-
-
0.26
-
0.33
-
0.4
V
II
VCC or
GND
-
6
-
-
±0.1
-
±1
-
±1
µA
ICC
VCC or
GND
0
6
-
-
8
-
80
-
160
µA
3
CD54HC85, CD74HC85, CD54HCT85, CD74HCT85
DC Electrical Specifications
(Continued)
TEST
CONDITIONS
SYMBOL
VI (V)
IO (mA)
High Level Input
Voltage
VIH
-
-
Low Level Input
Voltage
VIL
-
High Level Output
Voltage
CMOS Loads
VOH
VIH or VIL
PARAMETER
25oC
VCC
(V)
-40oC TO 85oC -55oC TO 125oC
MIN
TYP
MAX
MIN
MAX
MIN
MAX
UNITS
4.5 to
5.5
2
-
-
2
-
2
-
V
-
4.5 to
5.5
-
-
0.8
-
0.8
-
0.8
V
-0.02
4.5
4.4
-
-
4.4
-
4.4
-
V
-4
4.5
3.98
-
-
3.84
-
3.7
-
V
0.02
4.5
-
-
0.1
-
0.1
-
0.1
V
4
4.5
-
-
0.26
-
0.33
-
0.4
V
±0.1
-
±1
-
±1
µA
HCT TYPES
High Level Output
Voltage
TTL Loads
Low Level Output
Voltage
CMOS Loads
VOL
VIH or VIL
Low Level Output
Voltage
TTL Loads
Input Leakage
Current
II
VCC and
GND
0
5.5
-
ICC
VCC or
GND
0
5.5
-
-
8
-
80
-
160
µA
∆ICC
(Note 2)
VCC
-2.1
-
4.5 to
5.5
-
100
360
-
450
-
490
µA
Quiescent Device
Current
Additional Quiescent
Device Current Per
Input Pin: 1 Unit Load
NOTE:
2. For dual-supply systems theoretical worst case (VI = 2.4V, VCC = 5.5V) specification is 1.8mA.
HCT Input Loading Table
INPUT
UNIT LOADS
A0-A3, B0-B3 and (A = B) IN
1.5
(A > B) IN, (A < B) IN
1
NOTE: Unit Load is ∆ICC limit specified in DC Electrical Table, e.g.
360µA max at 25oC.
Switching Specifications Input tr, tf = 6ns
PARAMETER
HC TYPES
Propagation Delay,
An, Bn to (A > B) OUT,
(A < B) OUT
An, Bn to (A = B) OUT
SYMBOL
TEST
CONDITIONS
tPLH, tPHL CL = 50pF
-40oC TO
85oC
25oC
-55oC TO
125oC
VCC (V)
MIN
TYP
MAX
MIN
MAX
MIN
MAX
UNITS
2
-
-
195
-
245
-
295
ns
4.5
-
-
39
-
47
-
59
ns
CL = 15pF
5
-
16
-
-
-
-
-
ns
CL = 50pF
6
-
-
33
-
42
-
50
ns
ns
tPLH, tPHL CL = 50pF
2
-
-
175
-
240
-
265
4.5
-
-
35
-
44
-
53
ns
CL = 15pF
5
-
14
-
-
-
-
-
ns
CL = 50pF
6
-
-
30
-
37
-
45
ns
4
CD54HC85, CD74HC85, CD54HCT85, CD74HCT85
Switching Specifications Input tr, tf = 6ns
PARAMETER
(Continued)
TEST
CONDITIONS
SYMBOL
(A > B) IN, (A < B) IN, (A = B) IN tPLH, tPHL CL = 50pF
to (A > B) OUT, (A < B) OUT
(A > B) IN to (A = B) OUT
Output Transition Times
(Figure 1)
CPD
CIN
VCC (V)
MIN
TYP
MAX
MIN
MAX
MIN
MAX
UNITS
2
-
-
140
-
175
-
210
ns
4.5
-
-
28
-
35
-
42
ns
5
-
11
-
-
-
-
-
ns
CL = 50pF
6
-
-
24
-
30
-
36
ns
2
-
-
120
-
150
-
180
ns
4.5
-
-
24
-
30
-
36
ns
CL = 15pF
5
-
9
-
-
-
-
-
ns
CL = 50pF
6
-
-
20
-
26
-
31
ns
-
5
-
24
-
-
-
-
-
pF
2
-
-
75
-
95
-
110
ns
4.5
-
-
15
-
19
-
22
ns
6
-
-
13
-
16
-
19
ns
-
-
-
10
-
10
-
10
pF
tTLH, tTHL CL = 50pF
Input Capacitance
-55oC TO
125oC
CL = 15pF
tPLH, tPHL CL = 50pF
Power Dissipation Capacitance
(Notes 3, 4)
-40oC TO
85oC
25oC
-
HCT TYPES
Propagation Delay,
An, Bn to (A > B) OUT,
(A < B) OUT
tPLH, tPHL CL = 50pF
CL = 15pF
4.5
-
-
37
-
46
-
56
ns
5
-
15
-
-
-
-
-
ns
An, Bn to (A = B) OUT
tPLH, tPHL CL = 50pF
4.5
-
-
40
-
50
-
60
ns
5
-
17
-
-
-
-
-
ns
(A > B) IN, (A < B) IN, (A = B) IN tPLH, tPHL CL = 50pF
to (A > B) OUT, (A < B) OUT
CL = 15pF
4.5
-
-
30
-
38
-
45
ns
5
-
12
-
-
-
-
-
ns
(A > B) IN to (A = B) OUT
tPLH, tPHL CL = 50pF
CL = 15pF
4.5
-
-
31
-
39
-
47
ns
5
-
13
-
-
-
-
-
ns
Output Transition Times
(Figure 1)
tTLH, tTHL CL = 50pF
4.5
-
-
15
-
19
-
22
ns
5
-
26
-
-
-
-
-
pF
-
-
-
10
-
10
-
10
pF
CL = 15pF
Power Dissipation Capacitance
(Notes 3, 4)
CPD
Input Capacitance
CIN
-
NOTES:
3. CPD is used to determine the dynamic power consumption, per gate/package.
4. PD = VCC2 fi (CPD + CL) where fi = Input Frequency, CL = Output Load Capacitance, VCC = Supply Voltage.
Test Circuits and Waveforms
tr = 6ns
tf = 6ns
90%
50%
10%
INPUT
GND
tTLH
GND
tTHL
90%
50%
10%
INVERTING
OUTPUT
3V
2.7V
1.3V
0.3V
INPUT
tTHL
tPHL
tf = 6ns
tr = 6ns
VCC
tTLH
90%
1.3V
10%
INVERTING
OUTPUT
tPHL
tPLH
FIGURE 1. HC AND HCU TRANSITION TIMES AND PROPAGATION DELAY TIMES, COMBINATION LOGIC
tPLH
FIGURE 2. HCT TRANSITION TIMES AND PROPAGATION
DELAY TIMES, COMBINATION LOGIC
5
CD54HC85, CD74HC85, CD54HCT85, CD74HCT85
Test Circuits and Waveforms
GND
VCC
GND
LEAST SIGNIFICANT
4-BITS OF EACH WORD
A0
A1
A2
A3
B0
B1
B2
B3
(A > B) IN
(A = B) IN
(A < B) IN
A0
A1
CD74HC85
A2 CD74HCT85
A3
B0
B1
B2
B3
(A > B) IN
(A = B) IN
(A < B) IN
A4
A5
A6
A7
B4
B5
B6
B7
MOST SIGNIFICANT
4-BITS OF EACH WORD
A4
A5
A6
A7
B4
B5
B6
B7
A0
A1
A2
A3
B0
B1
B2
B3
CD74HC85
CD74HCT85
(A > B) OUT
(A = B) OUT
(A < B) OUT
(A > B) IN
(A = B) IN
(A < B) IN
A0
A1
A2
A3
B0
B1
B2
B3
FIGURE 3. SERIES CASCADING - COMPARING 12-BIT WORDS
6
CD74HC85
CD74HCT85
(A > B) OUT
(A = B) OUT
(A < B) OUT
OUTPUTS
CD54HC85, CD74HC85, CD54HCT85, CD74HCT85
Test Circuits and Waveforms
B1
A1
B0
A0
GND
VCC
GND
CD74HC85
B3 CD74HCT85
A3
B2
A2 (A < B) OUT
B1 (A = B) OUT
A1 (A > B) OUT
B0
A0
(A < B) IN
(A = B) IN
(A > B) IN
B6
A6
B5
A5
B4
A4
B3
A3
B2
GND
A2
CD74HC85
B3 CD74HCT85
A3
B2
A2 (A < B) OUT
B1 (A = B) OUT
A1 (A > B) OUT
B0
A0
(A < B) IN
(A = B) IN
(A > B) IN
B11
A11
B10
A10
B9
A9
B8
A8
B7
GND
A7
CD74HC85
B3 CD74HCT85
A3
B2
A2 (A < B) OUT
B1 (A = B) OUT
A1 (A > B) OUT
B0
A0
(A < B) IN
(A = B) IN
(A > B) IN
NC
NC
OUTPUTS
B3 CD74HC85
CD74HCT85
A3
B2
A2 (A > B) OUT
B1 (A = B) OUT
A1 (A < B) OUT
B0
A0
(A < B) IN
(A = B) IN
(A > B) IN
FIGURE 4. PARALLEL CASCADING - COMPARING 12-BIT WORDS
7
OUTPUTS
PACKAGE OPTION ADDENDUM
www.ti.com
9-Oct-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
5962-8867201EA
ACTIVE
CDIP
J
16
1
TBD
A42 SNPB
N / A for Pkg Type
8601301EA
ACTIVE
CDIP
J
16
1
TBD
A42 SNPB
N / A for Pkg Type
Lead/Ball Finish
MSL Peak Temp (3)
CD54HC85F3A
ACTIVE
CDIP
J
16
1
TBD
A42 SNPB
N / A for Pkg Type
CD54HCT85F3A
ACTIVE
CDIP
J
16
1
TBD
A42 SNPB
N / A for Pkg Type
CD74HC85E
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
CD74HC85EE4
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
CD74HC85M
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC85M96
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC85M96E4
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC85M96G4
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC85ME4
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC85MG4
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC85MT
ACTIVE
SOIC
D
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC85MTE4
ACTIVE
SOIC
D
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC85MTG4
ACTIVE
SOIC
D
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC85NSR
ACTIVE
SO
NS
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC85NSRE4
ACTIVE
SO
NS
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC85NSRG4
ACTIVE
SO
NS
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC85PW
ACTIVE
TSSOP
PW
16
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC85PWE4
ACTIVE
TSSOP
PW
16
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC85PWG4
ACTIVE
TSSOP
PW
16
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC85PWR
ACTIVE
TSSOP
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC85PWRE4
ACTIVE
TSSOP
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC85PWRG4
ACTIVE
TSSOP
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC85PWT
ACTIVE
TSSOP
PW
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC85PWTE4
ACTIVE
TSSOP
PW
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC85PWTG4
ACTIVE
TSSOP
PW
16
250
Green (RoHS &
CU NIPDAU
Level-1-260C-UNLIM
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
9-Oct-2007
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
CD74HCT85E
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
CD74HCT85EE4
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
CD74HCT85M
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT85M96
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT85M96E4
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT85M96G4
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT85ME4
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT85MG4
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT85MT
ACTIVE
SOIC
D
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT85MTE4
ACTIVE
SOIC
D
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT85MTG4
ACTIVE
SOIC
D
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Lead/Ball Finish
MSL Peak Temp (3)
no Sb/Br)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
19-Mar-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
CD74HC85M96
Package Package Pins
Type Drawing
SOIC
SPQ
Reel
Reel
Diameter Width
(mm) W1 (mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
D
16
2500
330.0
16.4
6.5
10.3
2.1
8.0
16.0
Q1
CD74HC85NSR
SO
NS
16
2000
330.0
16.4
8.2
10.5
2.5
12.0
16.0
Q1
CD74HC85PWR
TSSOP
PW
16
2000
330.0
12.4
7.0
5.6
1.6
8.0
12.0
Q1
CD74HCT85M96
SOIC
D
16
2500
330.0
16.4
6.5
10.3
2.1
8.0
16.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
19-Mar-2008
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
CD74HC85M96
SOIC
D
16
2500
333.2
345.9
28.6
CD74HC85NSR
SO
NS
16
2000
346.0
346.0
33.0
CD74HC85PWR
TSSOP
PW
16
2000
346.0
346.0
29.0
CD74HCT85M96
SOIC
D
16
2500
333.2
345.9
28.6
Pack Materials-Page 2
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Amplifiers
Data Converters
DSP
Clocks and Timers
Interface
Logic
Power Mgmt
Microcontrollers
RFID
RF/IF and ZigBee® Solutions
amplifier.ti.com
dataconverter.ti.com
dsp.ti.com
www.ti.com/clocks
interface.ti.com
logic.ti.com
power.ti.com
microcontroller.ti.com
www.ti-rfid.com
www.ti.com/lprf
Applications
Audio
Automotive
Broadband
Digital Control
Medical
Military
Optical Networking
Security
Telephony
Video & Imaging
Wireless
www.ti.com/audio
www.ti.com/automotive
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/medical
www.ti.com/military
www.ti.com/opticalnetwork
www.ti.com/security
www.ti.com/telephony
www.ti.com/video
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2008, Texas Instruments Incorporated
Similar pages