Rohm BD8119FM-M White backlight led driver for medium to large lcd panel Datasheet

Datasheet
White Backlight LED Driver
For Medium to Large LCD Panels
(Switching Regulator Type)
BD8119FM-M
General Description
BD8119FM-M is a white LED driver with the capability
to withstand high input voltage (36V Max).
This driver has 4ch constant-current drivers integrated
in 1-chip. Each channel can draw up to 150mA max for
driving high brightness on LED. A current-mode
buck-boost DC/DC controller is also integrated to
achieve stable operation against unstable car-battery
voltage input. This also removes the constraint of the
number of LEDs in series connection. The brightness
can be controlled by either PWM or VDAC techniques.
Key Specifications




Input Supply Voltage Range:
Standby Current:
LED Maximum Output Current:
Operating Temperature Range:
Package
5.0V to 30V
4µA (Typ)
150mA(Max)
-40°C to +95°C
W(Typ) x D(Typ) x H(Max)
Features
■ Integrated buck-boost current-mode DC/DC
controller
■ Four integrated LED current driver channels
(150mA Max each channel)
■ PWM Light Modulation
(Minimum Pulse Width 25µs)
■ Built-in protection functions
(UVLO, OVP, TSD, OCP, SCP)
■ Abnormal status detection function
(OPEN/ SHORT)
HSOP-M28
18.50mm x 9.90mm x 2.41mm
Applications
Backlight for car navigation, dashboard panels, etc.
〇Product structure : Silicon monolithic integrated circuit 〇This product has no designed protection against radioactive rays
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BD8119FM-M
Pin Configuration
(TOP VIEW)
COMP
1
28
VREG
SS
2
27
BOOT
VCC
3
26
CS
EN
4
25
OUTH
RT
5
24
SW
SYNC
6
23
DGND
GND
7
22
OUTL
PWM
8
21
N.C.
FAIL1
9
20
PGND
FAIL2
10
19
ISET
LEDEN1
11
18
VDAC
LEDEN2
12
17
OVP
LED1
13
16
LED4
LED2
14
15
LED3
Pin Descriptions
Pin
Symbol
1
COMP
2
SS
3
VCC
4
Function
Pin
Symbol
Error amplifier output
15
LED3
LED output 3
Soft start time-setting capacitance input
16
LED4
LED output 4
Input power supply
17
OVP
Over-voltage detection input
EN
Enable input
18
VDAC
DC variable light modulation input
5
RT
Oscillation frequency-setting resistance input
19
ISET
LED output current-setting resistance input
6
SYNC
External synchronization signal input
20
PGND
7
GND
Small-signal GND
21
-
8
PWM
PWM light modulation input
22
OUTL
Low-side external MOSFET Gate Drive output
9
FAIL1
Failure signal output
23
DGND
Low-side internal MOSFET Source output
10
FAIL2
LED open/short detection signal output
24
SW
11
LEDEN1
LED output enable pin 1
25
OUTH
12
LEDEN2
LED output enable pin 2
26
CS
13
LED1
LED output 1
27
BOOT
High-side MOSFET Power Supply pin
14
LED2
LED output 2
28
VREG
Internal reference voltage output
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Function
LED output GND
No Connection
High-side external MOSFET Source pin
High-side external MOSFET Gate Drive outpin
DC/DC Current Sense Pin
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28.Aug.2014 Rev.001
BD8119FM-M
Block Diagram
VREG
OVP
UVLO
TSD
OVP
VCC
VREG
EN
OCP
＋
－
Timer
Latch
PWM
CS
FAIL1
BOOT
Control Logic
OUTH
DRV
－
PWM
SYNC
SLOPE
RT
SW
CTL
＋
DGND
OSC
VREG
OUTL
ERR AMP
－
－
－
－
＋
COMP
GND
OCP OVP
LED1
SS
LED2
Current driver
LED3
PWM
LED4
VDAC
ISET
PGND
Open Short Detect
ISET
Open Det
Timer
Latch
Short Det
FAIL2
LEDEN1
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LEDEN2
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BD8119FM-M
Absolute Maximum Ratings (Ta=25°C)
Parameter
Symbol
Rating
Unit
Power Supply Voltage
VCC
36
V
BOOT ,OUTH Voltage
VBOOT, VOUTH
41
V
VSW, VCS, VOUTH
36
V
BOOT-SW Voltage
VBOOT-SW
7
V
LED Output Voltage
VLED1, VLED2, VLED3, VLED4
36
V
VREG, VOVP, VOUTL, VFAIL1, VFAIL2,
VLEDEN1, VLEDEN2, VISET, VVDAC,
VPWM, VSS, VCOMP, VRT, VSYNC, VEN
-0.3 to +7 < VCC
V
SW,CS Voltage
VREG, OVP, OUTL, FAIL1, FAIL2,
LEDEN1, LEDEN2, ISET, VDAC,
PWM, SS, COMP, RT, SYNC, EN Voltage
Power Consumption
Pd
2.20
(Note 1)
W
Operating Temperature Range
Topr
-40 to +95
°C
Storage Temperature Range
Tstg
-55 to +150
°C
LED Maximum Output Current
ILED
150
(Note 2) (Note 3)
mA
(Note 1) IC mounted on glass epoxy board measuring 70mm x 70mm x 1.6mm, power dissipated at a rate of 17.6mw/°C at temperatures above 25°C.
(Note 2) Dispersion figures for LED maximum output current and VF are correlated. Please refer to data on separate sheet.
(Note 3) Amount of current per channel.
Caution: Use of the IC in excess of absolute maximum ratings (such as the input voltage or operating temperature range) may result in damage to the IC.
Assumptions should not be made regarding the state of the IC (e.g., short mode or open mode) when such damage is suffered. If operational values are
expected to exceed the maximum ratings for the device, consider adding protective circuitry (such as fuses) to eliminate the risk of damaging the IC.
Recommended Operating Conditions (Ta=25°C)
Parameter
Symbol
Rating
Unit
Power Supply Voltage
VCC
5.0 to 30
V
Oscillating Frequency Range
fOSC
250 to 550
kHz
fSYNC
fOSC to 550
kHz
fSDUTY
40 to 60
%
External Synchronization Frequency Range
(Note 4) (Note 5)
External Synchronization Pulse Duty Range
(Note 4) Connect SYNC to GND or OPEN when not using external frequency synchronization.
(Note 5) Do not switch between internal and external synchronization when an external synchronization signal is inputted to the device.
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BD8119FM-M
Electrical Characteristics (unless otherwise specified, VCC=12V Ta=25°C)
Parameter
Symbol
Limit
Min
Typ
Max
Unit
Conditions
Circuit Current
ICC
-
7
14
mA
EN=Hi, SYNC=Hi, RT=OPEN
PWM=Low, ISET=OPEN, CIN=10µF
Standby Current
IST
-
4
8
µA
EN=Low
VREG
4.5
5
5.5
V
IREG=-5mA, CREG=2.2µF
OUTH High-side ON-Resistance
RONHH
1.0
3
4.5
Ω
ION=-10mA
OUTH Low-side ON-Resistance
RONHL
0.5
2
3.0
Ω
ION=10mA
Over-Current Protection
Operating Voltage
VOLIMIT
VCC
-0.66
VCC
-0.6
VCC
-0.54
V
OUTL High-side ON-Resistance
RONLH
1.0
3
4.5
Ω
ION=-10mA
OUTL Low-side ON-Resistance
RONLL
0.5
2
3.0
Ω
ION=10mA
RON_SW
1.0
2.0
4.0
Ω
ION_SW=10mA
VLED
0.9
1.0
1.1
V
ICOMPSINK
15
25
35
µA
VLED=2V, VCOMP=1V
ICOMPSOURCE
-35
-25
-15
µA
VLED=0V, VCOMP=1V
fOSC
250
300
350
KHz
Over-voltage Detection
Reference Voltage
VOVP
1.9
2.0
2.1
V
VOVP=Sweep up
OVP Hysteresis Width
VOHYS
0.45
0.55
0.65
V
VOVP=Sweep down
tSCP
70
100
130
ms
UVLO Voltage
VUVLO
4.0
4.3
4.6
V
UVLO Hysteresis Width
VUHYS
50
150
150
mV
[VREG Block (VREG)]
Reference Voltage
[OUTH Block]
[OUTL Block]
[SW Block]
SW Low-side ON-Resistance
[Error Amplifier Block]
LED Voltage
COMP Sink Current
COMP Source Current
[Oscillator Block]
Oscillating Frequency
RRT=100kΩ
[OVP Block]
SCP Latch OFF Delay Time
RRT=100kΩ
[UVLO Block ]
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VCC : Sweep down
VCC : Sweep up
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BD8119FM-M
Electrical Characteristics – continued (unless otherwise specified, VCC=12V Ta=25°C)
Parameter
Symbol
Limit
Min
Typ
Max
Unit
Conditions
[LED Output Block]
LED Current
Relative Dispersion Width
LED Current
Absolute Dispersion Width
ΔILED1
-3
-
+3
%
ΔILED2
-5
-
+5
%
ISET Voltage
VISET
1.96
2.0
2.04
V
RISET 1=120kΩ
PWM Minimum Pulse Width
Tmin
25
-
-
µs
fPWM=150Hz, ILED=50mA
PWM Maximum Duty
Dmax
-
-
100
%
fPWM=150Hz, ILED=50mA
fPWM
-
-
20
KHz
Duty=50%, ILED=50mA
VDAC Gain
GVDAC
-
25
-
mA/V
VDAC=0V to 2V, RISET=120kΩ
ILED=VDAC ÷ RISET x Gain
Open Detection Voltage
VOPEN
0.2
0.3
0.4
V
VLED= Sweep down
LED Short Detection Voltage
VSHORT
4.4
4.7
5.0
V
VOVP= Sweep up
LED Short Latch OFF Delay Time
tSHORT
70
100
130
ms
RRT=100kΩ
tPWM
70
100
130
ms
RRT=100kΩ
PWM Frequency
PWM Latch OFF Delay Time
ILED=50mA,
ΔILED1=(ILEDILED_AVG-1) x 100
ILED=50mA,
ΔILED2=(ILED50mA-1) x 100
[Logic Inputs (EN, SYNC, PWM, LEDEN1, LEDEN2)]
Input HIGH Voltage
VINH
2.1
-
5.5
V
Input LOW Voltage
VINL
GND
-
0.8
V
Input Current 1
IIN
20
35
50
µA
VIN=5V
(SYNC, PWM, LEDEN1, LEDEN2)
Input Current 2
IEN
15
25
35
µA
VEN=5V (EN)
VOL
-
0.1
0.2
V
IOL=0.1mA
[FAIL Output (Open Drain) ]
FAIL LOW Voltage
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BD8119FM-M
Typical Performance Curves (Unless otherwise specified, Ta=25°C)
400
Switching Frequency : fOSC [kHz]
SWITCHING FREQUENCY:FOSC [kHz]
[kHz]
Output Voltage : VREG [V]
OUTPUT VOLTAGE:VREG[V]
[V]
5.5
5.3
VCC=12V
5.1
4.9
4.7
4.5
-40
-15
10
35
60
TEMPERATURE:Ta
[℃]
Temperature : Ta [°C]
85
VCC=12V
320
280
240
200
-40
-15
10
35
60
TEMPERATURE:Ta
[℃]
Temperature : Ta [°C]
85
Figure 2. Switching Frequency vs Temperature
Figure 1. Output Voltage vs Temperature
55
55
Output Current : ILED [mA]
OUTPUTCURRENT :ILED [mA]
Output Current : I
[mA]
OUTPUTCURRENT LED
:ILED [mA]
360
53
VCC= 12V
51
49
47
45
53
VCC= 12V
51
49
47
45
0.5
1.5
2.5
3.5
LED
VOLTAGE:VLED[V]
LED Voltage : V
[V]
4.5
-40
LED
85
Figure 4. Output Current vs Temperature
Figure 3. Output Current vs LED Voltage
(ILED Depend on VLED)
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-15
10
35
60
Temperature
:
Ta
[°C]
TEMPERATURE:Ta [℃]
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BD8119FM-M
Typical Performance Curves – continued
(Unless otherwise specified, Ta=25°C)
5
Output Current : ILED [mA]
OUTPUTCURRENT :ILED [mA]
Output Current : ILED [mA]
OUTPUTCURRENT :ILED [mA]
50
40
30
20
10
0
4
3
2
1
0
0
0.5
1
1.5
2
0
0.02
VDAC VOLTAGE:VDAC[V]
VDAC
Voltage : VDAC [V]
Figure 5. Output Current vs VDAC Voltage
(VDAC Gain①)
100
85
85
Efficiency [%]
EFFICIENCY [%]
Efficiency [%]
0.06
0.08
0.1
Figure 6. Output Current vs VDAC Voltage
(VDAC Gain②)
100
EFFICIENCY [% ]
0.04
VDAC
VDACVOLTAGE:VDAC[V]
Voltage : VDAC [V]
70
VCC=30V
VCC=12V
55
40
70
VCC=30V
VCC=15V
55
40
VCC=5V
VCC=4V
25
25
25
150
275
400
525
OutputCURRENT
Current [mA]
OUTPUT
[mA]
25
Figure 8. Efficiency vs Output Current
(Depend on Output Voltage)
Figure 7. Efficiency vs Output Current
(Depend on Input Voltage)
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150
275
400
525
OUTPUT
[mA]
OutputCURRENT
Current [mA]
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BD8119FM-M
Typical Performance Curves – continued
(Unless otherwise specified, Ta=25°C)
Output Voltage : VCC - VCS [V]
CircuitCARRENT:Icc
Current : ICC [mA]
OUTPUT
[mA]
10.0
8.0
6.0
VCC=12V
4.0
VCC=12V
2.0
0.0
0
6
12
18
24
30
SUPPLY
VOLTAGE:Vcc
[V]
Supply Voltage : VCC [V]
36
Temperature : Ta [°C]
Figure 10.Output Voltage vs Temperature
(Over-current Detection Voltage Temperature Characteristic)
Figure 9. Cicuit Current vs Supply Voltage
(Switching OFF)
10
Output Current : ILED [mA]
OUTPUTCURRENT :ILED [mA]
Output Voltage : VREG [V]
OUTPUT VOLTAGE:VREG [V]
10
8
6
4
2
0
0
1
2
3
4
EN
EN VOLTAGE:VEN
Voltage : VEN [V][V]
6
4
2
0
5
0
Figure 11. Output Voltage vs EN Threshold Voltage
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8
1
2
3
4
PWM
[V]
PWMVOLTAGE:VEN
Voltage : VEN [V]
5
Figure 12. Output Current vs PWM Threshold Voltage
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BD8119FM-M
Application Information
1. 5V Voltage Reference (VREG)
5V (Typ) is generated from the VCC input voltage when the enable pin is set high. This voltage is used to power the
internal circuitry as well as the voltage source for device pins that need to be fixed to a logical HIGH.
UVLO protection is integrated into the VREG pin. The voltage regulation circuitry operates uninterrupted for output
voltages higher than 4.5V (Typ). If output voltage drops to 4.3V (Typ) or lower, UVLO operates and turns the IC OFF.
Connect a capacitor (CREG = 2.2µF Typ) to the VREG terminal for phase compensation. Operation may become unstable
if CREG is not connected.
2. Constant-current LED Drivers
If less than four constant-current drivers are used, unused channels should be switched OFF based on LEDEN pin
configuration. The truth table for these pins is shown below. If a driver output is enabled but not used (i.e. left open), the
IC’s open circuit-detection circuitry will operate. Please keep the unused pins open. The LEDEN terminals are pulled
down internally in the IC, so if left open, the IC will recognize them as logic LO. However, they should be connected
directly to VREG or fixed to a logic HI when in use.
LED EN
〈1〉
〈2〉
L
L
H
L
L
H
H
H
LED
1
ON
ON
ON
ON
2
ON
ON
ON
OFF
3
ON
ON
OFF
OFF
4
ON
OFF
OFF
OFF
(1) Output Current Setting
LED current is computed based on the following equation:


I LED  min V DAC ,VISET  2.0V  / RSET  GAIN
A
(min[VDAC , 2.0V] = the smaller value of either VDAC or VISET; GAIN = set by internal circuitry.)
In applications where an external signal is used for output current control, a control voltage in the range of 0.1V to
2.0V can be connected on the VDAC pin to control according to the above equation. If an external control signal is
not used, connect the VDAC pin to VREG (do not leave the pin open as it may cause IC malfunction). Also, do not
switch individual channels on or OFF using LEDEN pin while operating in PWM mode.
The following diagram illustrates the relation between ILED and GAIN.
ILED
ILED vs
vsGAIN
GAIN
3350
3300
GAIN
GAIN
3250
3200
3150
3100
3050
3000
2950
0
20
40
60
80
100
120
140
ILED
[mA]
ILED[mA]
160
ILED[mA]
ILED[mA]
10
20
30
40
50
60
70
80
90
100
110
120
130
140
150
GAIN
3215
3080
3030
2995
3000
3020
3040
3070
3105
3140
3175
3210
3245
3280
3330
In PWM intensity control mode, the ON/OFF state of each current driver is controlled directly by the input signal on the
PWM pin; thus, the duty ratio of the input signal on the PWM pin equals the duty ratio of the LED current. When not
controlling intensity at PWM, fix the PWM terminal to a high voltage (100%). Output light intensity is greatest at 100%
input.
PWM
PWM
ILED
ILED(50mA/div)
PWM=150Hz Duty=50%
PWM=150Hz Duty=0.38%
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BD8119FM-M
3. Buck-Boost DC/DC Controller
(1) Number of LEDs in Series Connection
Output voltage of the DCDC converter is controlled such that the forward voltage over each of the LEDs on the output
is set to 1.0V (Typ). DCDC operation is performed only when the LED output is operating. When two or more LED
outputs are operating simultaneously, the LED voltage output is held at 1.0V (Typ) per LED from the set of LEDs in
series with the highest VF value. The voltages of other LED outputs are increased only in relation to the fluctuation of
voltage over these LEDs in series. Consideration should be given to the change in power dissipation due to variations
in VF of the LEDs. Please determine the allowable maximum V F variance of the total LEDs in series by using the
description as shown below:
VF variation allowable voltage 3.7V(Typ) = short detecting voltage 4.7V(Typ) - LED control voltage 1.0V(Typ)
The number of LEDs that can be connected in series is limited due to the open-circuit protection circuit, which
engages at 85% of the set OVP voltage. Therefore, the maximum output voltage of the under normal operation
becomes 30.6V  36V  0.85, where 30.6 1.0V /VF  Nmaximum number of LEDs in series .
(2) Over-voltage Protection Circuit (OVP)
The output of the DCDC converter should be connected to the OVP pin using a voltage divider. In determining an
appropriate trigger voltage for OVP function, consider the total number of LEDs in series and the maximum variation
in VF. Also, bear in mind that over-current protection (OCP) is triggered at 0.85 x OVP trigger voltage. If the OVP
function operates, it will not release unless the DCDC voltage drops to 72.5% of the OVP trigger voltage. For
example, if ROVP1 (output voltage side), ROVP2 (GND side), and DCDC voltage VOUT are conditions for OVP, then:
VOUT  ROVP1  ROVP 2 / ROVP2  2.0V
OVP will operate when VOUT > 32 V if ROVP1 = 330 kΩ and ROVP2 = 22 kΩ.
(3) Buck-boost DC/DC Converter Oscillation Frequency (fOSC)
The regulator’s internal triangular wave oscillation frequency can be set using a resistor connected to the RT pin (pin
26). This resistor determines the charge/discharge current to the internal capacitor, thereby changing the oscillating
frequency. Refer to the following theoretical formula when setting RT:
f OSC 
30  10 6
α
R RT Ω
kHz 
6
30 x 10 (V/A/S) is a constant (±16.6%) determined by the internal circuitry, and α is a correction factor that varies in
relation to RT: {RT: α = 50kΩ: 0.98, 60kΩ: 0.985, 70kΩ: 0.99, 80kΩ: 0.994, 90kΩ: 0.996, 100kΩ: 1.0, 150kΩ: 1.01,
200kΩ: 1.02, 300kΩ: 1.03, 400kΩ: 1.04, 500kΩ: 1.045 }
A resistor in the range of 62.6kΩ to 523kΩ is recommended. Settings that deviate from the frequency range shown
below may cause switching to stop, and proper operation cannot be guaranteed.
550K
Frequency
[kHz]
周波数 [kHz]
450K
350K
250K
150K
50K
0
100
200
300
400
500
600
700
800
RT
RT [kΩ]
[kΩ ]
Figure 13. Switching Frequency vs RT
(4) External DC/DC Converter Oscillating Frequency Synchronization (fSYNC)
Do not switch from external to internal oscillation of the DC/DC converter if an external synchronization signal is
present on the SYNC pin. When the signal on the SYNC terminal is switched from high to low, a delay of about 30µs
(Typ) occurs before the internal oscillation circuitry starts to operate (only the rising edge of the input clock signal on
the SYNC terminal is recognized). Moreover, if external input frequency is less than the internal oscillation frequency,
the internal oscillator will operate after the above-mentioned 30µs (Typ) delay; thus, do not input a synchronization
signal with a frequency less than the internal oscillation frequency.
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BD8119FM-M
(5) Soft Start Function
The soft-start (SS) limits the current and slows the rise-time of the output voltage during the start-up, hence it leads to
prevention of the overshoot on the output voltage and the inrush current.
(6) Self-diagnostic Functions
The operating status of the built-in protection circuitry is propagated to FAIL1 and FAIL2 pins (open-drain outputs).
FAIL1 becomes low when UVLO, TSD, OVP, or SCP protection is engaged, whereas FAIL2 becomes low when open
or short LED is detected.
FAIL2
FAIL1
OPEN
UVLO
TSD
OVP
OCP
SCP
Counter
S
MASK
R
Q
EN=Low
S
UVLO/TSD
Q
EN=Low
SHORT
R
UVLO/TSD
(7) Operation of the Protection Circuitry
(a) Under-Voltage Lock Out (UVLO)
The UVLO shuts down all the circuits other than VREG when VCC  4.3V (Typ).
(b) Thermal Shut Down (TSD)
The TSD shuts down all the circuits other than VREG when the Tj reaches 175°C (TYP), and releases when the
Tj becomes below 150°C (Typ).
(c) Over-Current Protection (OCP)
The OCP detects the current through the power-FET by monitoring the voltage of the high-side resistor, and
activates when the CS voltage becomes less than VCC-0.6V (Typ).
When the OCP is activated, the external capacitor of the SS pin becomes discharged and the switching operation
of the DCDC turns OFF.
(d) Over Voltage Protection (OVP)
The output voltage of the DCDC is detected with the OVP-pin voltage, and the protection activates when the
OVP-pin voltage becomes greater than 2.0V (Typ).
When the OVP is activated, the external capacitor of the SS pin becomes discharged and the switching operation
of the DCDC turns OFF.
(8) Short Circuit Protection (SCP)
When the LED-pin voltage becomes less than 0.3V (Typ), the internal counter starts operating and latches OFF the
circuit approximately after 100ms (when fOSC = 300kHz). If the LED-pin voltage becomes over 0.3V before 100ms,
then the counter resets.
When the LED anode (i.e. DCDC output voltage) is shorted to ground, then the LED current becomes OFF and the
LED-pin voltage becomes low. Furthermore, the LED current also becomes OFF when the LED cathode is shorted to
ground. Hence in summary, the SCP works with both cases of the LED anode and the cathode being shorted.
(9) LED Open Detection
When the LED-pin voltage  0.3V (Typ) as well as OVP-pin voltage  1.7V (Typ) simultaneously, the device detects as
LED open and latches OFF that particular channel.
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(10) LED Short Detection
When the LED-pin voltage  4.7V (Typ) and OVP-pin voltage  1.6V (Typ) simultaneously, the internal counter starts
operating and the only detected channel (as LED short) latches OFF approximately after 100ms (when fOSC= 300kHz).
With the PWM brightness control, the detecting operation is processed only when PWM-pin = High. If the condition of
the detection operation is released before 100ms (when fOSC = 300kHz), then the internal counter resets.
(Note) The counter frequency is the DCDC switching frequency determined by the RT. The latch proceeds at the count of 32770.
Detecting Condition
Protection
Operation after detect
[Detect]
[Release]
UVLO
VREG<4.3V
VREG>4.5V
All blocks shut down
TSD
Tj>175°C
Tj<150°C
All blocks (except VREG)
shut down
OVP
VOVP>2.0V
VOVP<1.45V
SS discharges
OCP
VCS≤VCC-0.6V
VCS>VCC-0.6V
SS discharges
SCP
VLED<0.3V
(100ms delay when
fOSC=300kHz)
EN or UVLO
Counter starts and then latches OFF
all blocks (except VREG)
LED open
VLED<0.3V & VOVP>1.7V
EN or UVLO
Only the detected channel latches
OFF
LED short
VLED>4.7V & VOVP<1.6V
(100ms delay when
fOSC=300kHz)
EN or UVLO
Only the detected channel latches
OFF
(after the counter sets)
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4. Protection Sequence
VCC
(Note 1)
＊1
EN
4.5V
VREG
UVLO
(Note 1)
＊1
VDAC
(Note 2)
＊2
SYNC
(Note
＊22)
PWM
④
SS
ILED1
①
ILED2
②
ILED3
ILED4
VLED1
VLED2
1.0Ｖ
<0.3Ｖ
>4.7Ｖ
VLED3
(Note 3)
100ms ＊3
(Note 3)
100ms ＊3
VLED4
0.3V
2.0V
1.7V
VOVP
③
(Note 4)
＊4
FAIL1
FAIL2
(Note 1) Turn ON the EN after the VCC is ON
(Note 2) SYNC and PWM inputs are allowed to be on before the VCC is ON
(Note 3) Approximately 100ms of delay when fOSC = 300kHz
(Note 4) This waveform is pulled up by a external supply.
①
②
③
Case for LED2 in open-mode
When VLED2 < 0.3V and VOVP > 1.7V simultaneously, then LED2 becomes off and FAIL2 becomes low
Case for LED3 in short-mode
When VLED3 > 4.7V and VOVP < 1.6V simultaneously, then LED3 becomes off after 100ms approx
Case for LED4 in short to GND
③-1
DCDC output voltage increases, and then SS dichages and FAIL1 becomes low
③-2
Detects VLED4<0.3V and shuts down after approximately 100ms
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BD8119FM-M
5. Procedure for External Components Selection
Follow the steps as shown below for selecting the external components
(1)
Work out IL_MAX from the operating conditions.
(2)
Select the value of RCS such that IOCP > IL_MAX
(3)
Select the value of L such that 0.05V/µs < VOUT / L < 0.3V/ µs
(4)
Select coil, schottky diodes, MOSFET and RCS which meet with the ratings
(5)
Select the output capacitor which meets with the ripple voltage requirements
(6)
Select the input capacitor
Feedback the value of L
(7) Work on the compensation circuit
(8) Work on the Over-Voltage Protection (OVP) setting
(9) Work on the soft-start setting
(10)
Verify experimentally
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(1) Computation of the Input Peak Current and IL_MAX
① Calculation of the maximum output voltage (VOUT_MAX)
To calculate the VOUT_MAX, it is necessary to take into account the VF variation and the number of LED connected
in series.
VOUT _ MAX  VF  VF   N  1.0V
Where:
ΔVF is the VF Variation
N is the Number of LED connection in series
② Calculation of the output current IOUT
IOUT  I LED  1.05  M
Where:
M is the Number of LED connections in parallel
③ Calculation of the input peak current IL_MAX
I L _ MAX  I L _ AVG  1 2 I L
I L _ AVG  VI N  VOUT   I OUT /   VIN 
I L 
VIN
1
VOUT


L
fOSC VIN  VOUT
Where:
η is the efficiency
fOSC is the switching frequency
(a) The worst case scenario for VIN is when it is at the minimum, and thus the minimum value should be applied in the
equation.
(b) An L value of 10µF to 47µF is recommended. The current-mode type of DC/DC conversion is adopted for
BD8119FM-M, which is optimized with the use of the recommended L value in the design stage. This
recommendation is based upon the efficiency as well as the stability. L values outside this recommended range may
cause irregular switching waveform and hence deterioration of stable operation.
(c) η (efficiency) is approximately 80%
VIN
IL
RCS
CS
M1
D2
L
VOUT
M2
COUT
D1
External Application Circuit
(2) The Setting of Over-Current Protection
Choose RCS with the use of the equation VOCP_MIN (=0.54V) / RCS > IL_MAX
When investigating the margin, it is worth noting that the L value may vary by approximately ±30%.
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(3) The Selection of the L
In order to achieve stable operation of the current-mode DC/DC converter, we recommend selecting the L value in
the range indicated below:
0.05[V / s ] 
The smaller
VOUT  RCS
 0.3V / s 
L
VOUT  RCS
L
allows stability improvement but slows down the response time.
(4) Selection of coil L, diode D1 and D2, MOSFET M1 and M2, and RCS
Current rating
Voltage Rating
> IL_MAX
―
Diode D1
> IOCP
> VIN_MAX
Diode D2
> IOCP
> VOUT
MOSFET M1
> IOCP
> VIN_MAX
MOSFET M2
> IOCP
> VOUT
―
―
Coil L
RCS
Heat Loss
2
> IOCP x RCS
(Note 1) Allow some margin such as the tolerance of the external components when selecting.
(Note 2) In order to achieve fast switching, choose a MOSFET with the smaller gate-capacitance.
(5) Selection of the Output Capacitor
Select the output capacitor COUT based on the requirement of the ripple voltage Vpp.
V pp 
I OUT
VOUT
1


 ⊿I L  RESR
COUT VOUT  VIN
f OSC
Choose COUT that allows the Vpp to settle within the requirement. Allow some margin also, such as the tolerance of
the external components.
(6) Selection of the Input Capacitor
A capacitor at the input is also required as the peak current flows between the input and the output in DC/DC
conversion. An input capacitor greater than 10µF with the ESR smaller than 100mΩ is recommended. An input
capacitor outside the recommended range may cause large ripple voltage at the input and may lead to malfunction.
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(7) Phase Compensation Guidelines
In general, the negative feedback loop is stable when the following conditions are met:
Overall gain of 1 (0dB) with a phase lag of less than 150º (i.e., a phase margin of 30º or more)
However, as the DC/DC converter constantly samples the switching frequency, the gain-bandwidth (GBW) product of
the entire series should be set to 1/10 the switching frequency of the system. Therefore, the overall stability
characteristics of the application are as follows:
(a) Overall gain of 1 (0dB) with a phase lag of less than 150º (i.e., a phase margin of 30º or more)
(b) GBW (frequency at gain 0dB) of 1/10 the switching frequency
Thus, to improve response within the GBW product limits, the switching frequency must be increased.
The key for achieving stability is to place fz near to the GBW.
The GBW depends on a phase lag "fp1" that is decided by COUT and output impedance RL.
VOUT
The phase-lead and the phase-lag are the following.
Phase-lead fz 
Phase-lag fp1 
1
2CpcRpc
1
2RLCOUT
Hz 
LED
Hz 
FB
COMP
A
Rpc
Cpc
Good stability would be obtained when the fz is set between 1kHz to 10kHz.
In buck-boost applications, Right-Hand-Plane (RHP) Zero exists. This Zero has no gain but a pole characteristic in
terms of phase. As this Zero may cause instability when it is in the control loop, it is necessary to bring this zero
before the GBW.
f RHP 
VOUT  VIN / VOUT  VIN 
Hz 
2I LOAD L
Where:
ILOAD is the Maximum Load Current
It is important to keep in mind that these are not very strict guidelines. Adjustments may have to be made to ensure
stability in the actual circuitry. It is also important to note that stability characteristics can change greatly depending on
factors such as substrate layout and load conditions. Therefore, when designing for mass-production, stability should
be thoroughly investigated and confirmed in the actual physical design.
(8) Setting of the Over-Voltage Protection
We recommend setting the over-voltage protection VOVP
from 1.2V to 1.5V greater than VOUT which is adjusted by the
number of LEDs in series connection. Less than 1.2V may
cause unexpected detection of the LED open and short during
the PWM brightness control. For VOVP greater than 1.5V,
the LED short detection may become invalid.
VOUT
－
＋
ROVP2
2.0V/1.45V
OVP
ROVP1
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－
＋
1.7V/1.6V
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BD8119FM-M
(9) Setting of the Soft-Start
The soft-start allows minimizing the coil current as well as the overshoot of the output voltage at start-up.
For the capacitance, the range of 0.001µF to 0.1µF is recommended. Capacitance less than 0.001µF may cause
overshoot on the output voltage. Capacitance greater than 0.1µF may cause massive reverse current through the
parasitic elements of the IC that can damage the whole device. In case it is necessary to use the capacitance greater
than 0.1µF, provide a reverse current protection diode at the VCC or a bypass diode placed between the SS-pin and
the VCC.
Soft-start time tSS
tSS  CSS  0.7V/5µA
s
Where:
CSS is the capacitance at the SS-pin
(10) Verification of the Operation by Taking Measurements
The overall characteristic may change by load current, input voltage, output voltage, inductance, load capacitance,
switching frequency, and the PCB layout. We strongly recommend verifying your design by taking the actual
measurements.
Power Dissipation
Power dissipation can be calculated as follows:
PcN  ICC  VCC  2  Ciss  VREG  fSW  VCC  VLED  N  ΔVF  N  1 ILED
Where:
ICC is the Maximum circuit current
VCC is the Supply power voltage
Ciss is the External FET capacitance
VSW is the SW gate voltage
fSW is the SE frequency
VLED is the LED control voltage
N is the LED parallel numeral
ΔVF is the LED VF fluctuation
ILED is the LED output current
Sample Calculation:
Pc4  10mA  30V  500pF  5V  300kHz  30V  1.0V  4  ΔVF  3100mA
ΔVF  3.0V, Pc4  322.5mW  1.3W  1622.5mW
4
(3) 3.50W
2500
2000
IILED=
LED=
50mA
50mA
ILED
=
ILED=
100mA
100mA
IILED=
LED=
150mA
150mA
1500
1000
500
0
0
0.5
1
1.5
2
2.5
3
3.5
Dissipation :Pd[Ｗ]
PowerPower
Dissipation
Pd [W]
Power Dissipation
: Pd [W]
Pd [mW]
Power Dissipation
3
(2) 3.20W
(1) 2.20W
2
1
0
LEDLEDバラツキ⊿Vf[V]
Fluctuation : ΔVF [V]
(1) θ ja=56.8℃/W (Substrate copper foil density 3%)
(2) θ ja=39.1℃/W (Substrate copper foil density34%)
(3) θ ja=35.7℃/W (Substrate copper foil density60%)
25
50
75
95 100
125
150
Ambient
Temperature Ta[℃]
Ambient
Temperature
: Ta [°C]
Figure 14
(Note 1) Power dissipation calculated when mounted on 70mm x 70mm x 1.6mm glass epoxy substrate (1-layer platform/copper thickness 18µm)
(Note 2) Power dissipation changes with the copper foil density of the board.
The area of the copper foil becomes the total area of the heat radiation fin and the foot pattern (connected directly with IC) of this IC.
This value represents only observed values, not guaranteed values.
Pd=2200mW ( 968mW): Substrate copper foil density 3%
Pd=3200mW (1408mW): Substrate copper foil density 34%
Pd=3500mW (1540mW): Substrate copper foil density 60% (Value within parentheses represents power dissipation when Ta=95°C)
(Note 3) Please preserve that the ambient temperature + self-generation of heat becomes 150°C or less because this IC has a Tj=150°C.
(Note 4) Please note the heat specification because there is a possibility that thermal resistance rises from the examination result of the temperature cycle
by 20% or less.
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BD8119FM-M
VCC
VCC
CPC2
CIN1
CIN2
CPC1
RPC1
CCS
1. COMP
28. VREG
2. SS
27. BOOT
RCS1 RCS2
RCS3
VREG
CSS
RCS5
3. VCC
EN
SW1
4. EN
5. RT
CREG
26. CS
25. OUTH
24. SW
D
CBT
G
OUT
M1
D2
L1
S
D
SYNC
CRT
6. SYNC
23. DGND
7. GND
22. OUTL
D1
ROVP2
G
RRT
CIN3
FIN. FIN
FIN. FIN
8. PWM
21. FBR
9. FAIL1
20. PGND
M2
S
COUT1 COUT2
ROVP1
VREG
PWM
RFL2
CISET
RFL1
FAIL1
10. FAIL2
FAIL2
VREG
RDAC
19. ISET
VREG
RISET
SW2
11. LEDEN1
18. VDAC
12. LEDEN2
17. OVP
VDAC
SW3
13. LED1
16. LED4
LED4
14. LED2
15. LED3
LED3
LED1
LED2
1.
2.
3.
4.
The coupling capacitors CVCC and CREG should be mounted as close as possible to the IC’s pins.
Large currents may pass through DGND and PGND, so each should have its own low-impedance
routing to the system ground.
Noise should be minimized as much as possible on pins VDAC, ISET, RT and COMP.
PWM, SYNC and LED1-4 carry switching signals, so ensure during layout that surrounding traces are
not affected by crosstalk.
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BD8119FM-M
Application Board Part List
Serial No.
Component Name
Component Value
Product Name
Manufacturer
1
CIN1
10µF
GRM31CB31E106KA75B
Murata
2
CIN2
－
3
CIN3
－
4
CPC1
0.1µF
5
CPC2
－
6
RPC1
510Ω
7
CSS
0.1µF
GRM188B31H104KA92
Murata
8
RRT
100kΩ
MCR03 Series
Rohm
9
CRT
－
10
RFL1
100kΩ
MCR03 Series
Rohm
11
RFL2
100kΩ
MCR03 Series
Rohm
12
CCS
－
13
RCS1
620mΩ
MCR100JZHFLR620
Rohm
14
RCS2
620mΩ
MCR100JZHFLR620
Rohm
15
RCS3
－
16
RCS5
0Ω
17
CREG
2.2µF
GRM188B31A225KE33
Murata
18
CBT
0.1µF
GRM188B31H104KA92
Murata
19
M1
－
RSS070N05
Rohm
20
M2
－
RSS070N05
Rohm
21
D1
－
RB050L-40
Rohm
22
D2
－
RF201L2S
Rohm
23
L1
33µH
CDRH105R330
Sumida
24
COUT1
10µF
GRM31CB31E106KA75B
Murata
25
COUT2
10µF
GRM31CB31E106KA75B
Murata
26
ROVP1
30kΩ
MCR03 Series
Rohm
27
ROVP2
360kΩ
MCR03 Series
Rohm
28
RISET
120kΩ
MCR03 Series
Rohm
29
CISET
－
30
RDAC
0Ω
Murata
1.
The above values are fixed numbers for confirmed operation with the following conditions: VCC = 12V, four parallel
channels of five series-connected LEDs, and ILED=50mA.
2.
Optimal values of external components depend on the actual application; these values should only be used as
guidelines and should be adjusted to fit the operating conditions of the actual application.
When performing open/short tests of the external components, the open condition of D 1 or D2 may cause permanent
damage to the driver and/or the external components. In order to prevent this, we recommend having parallel connections
for D1 and D2.
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I/O Equivalent Circuits (terminal name follows pin number)
1. COMP
2. SS
VREG
4. EN
VREG
VREG
VCC
VCC
EN
2K
COMP
1K
SS
175k
10k
2K
135k
5. RT
6. SYNC, 8. PWM
9. FAIL1, 10. FAIL2
3.3V
VREG
FAIL1
FAIL2
10K
167
SYNC
RT
PWM
150K
11. LEDEN1, 12. LEDEN2
3.3V
1K
13. LED1, 14. LED2, 15. LED3, 16. LED4 17. OVP
VCC
VCC
5K
LED1 to LED4
10K
10K
10K
OVP
LEDEN1
LEDEN2
150K
2.5K
5K
18. VDAC
19. ISET
VREG
22. OUTL
VREG
VCC
500
500
VREG
VCC
VREG
12.5
ISET
VDAC
OUTL
100K
24. SW
25. OUTH
VCC
26. CS
BOOT
BOOT
VCC
5K
SW
CS
OUTH
100K
SW
SW
27. BOOT
SW
28. VREG
21.
VREG
VCC
VREG
BOOT
VREG
N.C.
205K
100K
SW
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BD8119FM-M
Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when
the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum
rating, increase the board size and copper area to prevent exceeding the Pd rating.
6.
Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately
obtained. The electrical characteristics are guaranteed under the conditions of each parameter.
7.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush
current may flow instantaneously due to the internal powering sequence and delays, especially if the IC
has more than one power supply. Therefore, give special consideration to power coupling capacitance,
power wiring, width of ground wiring, and routing of connections.
8.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment)
and unintentional solder bridge deposited in between pins during assembly to name a few.
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BD8119FM-M
Operational Notes – continued
11. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
12. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should
be avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
C
E
Pin A
N
P+
P
N
N
P+
N
Pin B
B
Parasitic
Elements
N
P+
N P
P+
N
B
N
C
E
Parasitic
Elements
P Substrate
P Substrate
GND
GND
Parasitic
Elements
GND
Parasitic
Elements
GND
N Region
close-by
Figure 15. Example of monolithic IC structure
13. Area of Safe Operation (ASO)
Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe
Operation (ASO).
14. Thermal Shutdown Circuit(TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always
be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction
temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below
the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from
heat damage.
TSD ON temperature [°C]
(typ)
175
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TSZ22111・15・001
Hysteresis temperature [°C]
(typ)
25
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TSZ02201-0T3T0C600030-1-2
28.Aug.2014 Rev.001
BD8119FM-M
Ordering Information
B
D
8
1
1
9
F
Part
Number
M
-
Package
FM: HSOP-M28
ME2
Packaging and forming specification
E2: Embossed tape and reel
Marking Diagram
HSOP-M28 (TOP VIEW)
Part Number Marking
B D 8 11 9 F M
LOT Number
1PIN MARK
Part Number Marking
BD8119FM
Package
HSOP-M28
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© 2014 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
Part Number
Reel of 1500
25/27
BD8119FM – ME2
TSZ02201-0T3T0C600030-1-2
28.Aug.2014 Rev.001
BD8119FM-M
Physical Dimension, Tape and Reel Information
Package Name
HSOP-M28
Max 18.85 (include. BURR)
（UNIT：mm）
PKG：HSOP-M28
Drawing: EX141-5001
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© 2014 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
26/27
TSZ02201-0T3T0C600030-1-2
28.Aug.2014 Rev.001
BD8119FM-M
Revision History
Date
28.Aug.2014
Revision
001
Changes
New Release
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© 2014 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
27/27
TSZ02201-0T3T0C600030-1-2
28.Aug.2014 Rev.001
Datasheet
Notice
Precaution on using ROHM Products
1.
If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1),
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice – SS
© 2013 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice – SS
© 2013 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.001
Datasheet
BD8119FM-M - Web Page
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Distribution Inventory
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Minimum Package Quantity
Packing Type
Constitution Materials List
RoHS
BD8119FM-M
HSOP-M28
1500
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