Vishay CRCW0402249KFKED Selectable frequency from 200 khz to 1 mhz with an external resistor Datasheet

SiC401, SiC402, SiC403
www.vishay.com
Vishay Siliconix
Reference Board User’s Manual for SiC403 (6 A), SiC402 (10 A),
and SiC401 (15 A) Synchronous Buck Regulators
PRODUCT SUMMARY SiC401A, SIC401BCD
Input Voltage Range
3 V to 17 V
Output Voltage Range
0.6 V to VIN x 0.75
Operating Frequency
200 kHz to 1 MHz
Continuous Output Current
Package
15 A
MLP55-32L
FEATURES
• SiC401A/B: 3 V to 17 V input range.
SiC402A/B, SiC403A/B: 3 V to 28 V input range.
• Adjustable output voltage down to 0.6 V
• 6 A (SiC403), 10 A (SiC402), and 15 A (SiC401) continuous
output current
• Selectable frequency from 200 kHz to 1 MHz with an
external resistor
PRODUCT SUMMARY SiC402A, SIC402BCD
Input Voltage Range
3 V to 28 V
• 95 % peak efficiency
Output Voltage Range
0.6 V to VIN x 0.75
• Stable with any capacitor; no external ESR network
required
Operating Frequency
200 kHz to 1 MHz
• Ultrafast transient response
Continuous Output Current
Package
10 A
MLP55-32L
• Power saving scheme for increased light load efficiency
• ± 1 % accuracy of VOUT setting
• Cycle-by-cycle current limit
PRODUCT SUMMARY SiC403A, SIC403BCD
• Fully protected with OTP, SCP, UVP, OVP
Input Voltage Range
• PGOOD Indicator
3 V to 28 V
Output Voltage Range
0.6 V to VIN x 0.75
Operating Frequency
200 kHz to 1 MHz
Continuous Output Current
Package
6A
MLP55-32L
• -40 °C to +125 °C operating junction temperature
• Output voltage tracking
APPLICATIONS
Note
• External divider network needed
• Point of load regulation for low-power processors,
network processors, DSPs, FPGAs, and ASICs
DESCRIPTION
• Low voltage, distributed power architectures with 5 V or
12 V, or 24 V rails
The SiC401, SiC402, and SiC403 are high frequency
voltage-mode constant-on-time (CM-COT) synchronous
buck regulators with integrated high-side and low-side
power MOSFETs. The SiC403 is capable of 6 A continuous
current, the SiC402 is capable of 10 A and the SiC401 15 A.
These regulators produce an adjustable output voltage
which in standard setup can output 5 V down to 0.6 V
and with the VOUT divider network 75 % of VIN down to
0.6 V to accommodate a variety of applications, including
computing, consumer electronics, telecom, and industrial.
The CM-COT architecture delivers ultra-fast transient
response with minimum output capacitance and tight ripple
regulation at very light load. The parts are stable with any
capacitor type and no ESR network is required for loop
stability. The regulator integrates a full protection feature
set, it also has UVLO for the input rail and an internal
soft-start.
• Computing, broadband, networking, LAN / WAN, optical,
test, and measurement
• A / V, high density cards, storage, DSL, STB, DVR, DTV,
industrial PC
ORDERING INFORMATION
BOARD PART NUMBER
MAX. OUTPUT CURRENT
SiC403DB-LC
6A
SiC402DB-HC
10 A
SiC401DB-HC
15 A
Notes
• LC - low current inductor, HC - high current inductor
• The only difference between HC and LC board is the O / P
inductor size
The SiC40X family is available in lead (Pb)-free power
enhanced 5 mm x 5 mm MLP55-32L package.
Revision: 17-Nov-14
Document Number: 62923
1
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SiC401, SiC402, SiC403
www.vishay.com
Vishay Siliconix
SPECIFICATIONS
Output Voltage Sense
This reference board allows the end user to evaluate the
SiC401, SiC402, or the SiC403 chip for its features and all
functionalities.
VOUT_SENSE, GNDOUT_SENSE (P4): This allows the user to
measure the voltage at the output of the regulator and
remove any losses generated due to the connections, from
the measurement. This can also be used by an active load
with sense capability.
It can also be a reference design for a user’s application.
CONNECTION AND SIGNAL / TEST POINTS
Power Sockets
VIN, GND (P1): Input voltage source with VIN to be positive.
Connect to a voltage source:
- SiC401A/BCD - 3 V to 17 V
- SiC402A/BCD - 3 V to 28 V
- SiC403A/BCD - 3 V to 28 V
VOUT, GND (P3): Output voltage with VOUT to be positive.
Connect to a load that draws no more than:
• SiC401A/BCD - 15 A
• SiC402A/BCD - 10 A
• SiC403A/BCD - 6 A
5 V, GND (P5): External 5 V voltage source with 5 V to be
positive. Connect to a 5 V source when this option is
selected.
SELECTION JUMPERS
Mode Select
P7: This is a 2 way header which allows the user to select
either power save mode or constant PWM mode.
OPEN - forced PWM, the pin is floating
SHORT - power save mode, the pin is at 5 V
A third option is available whereby pin 2 is shorted to 0 V to
disable the part.
UVLO Option
P8: This is a 2 way header that will enable the UVLO function
when selected. The divider resistors R1 and R2 can be
changed depending on the required turn on voltage level,
the pin requires a voltage greater than 3 V to enable.
OPEN - UVLO disabled
SHORT - UVLO enabled
VDD Select
P6: This is a 3 way header that will enable the user to select
between internal LDO and an external 5 V supply.
Position 1 - SHORT PIN 1-2 - internal LDO
Position 2 - SHORT PIN 2-3 - external 5 V
SIGNALS AND TEST LEADS
PGD (P9): Is an open drain output and is pulled up with a
10 kΩ resistor to VIN. When FB or VOUT are within -10 % to
+20 % percent of the set voltage this pin will go HI to
indicate the output is okay. The pin will also follow EN/PSV
condition switching LO if the IC is disabled.
POWER UP PROCEDURE
To turn-on the reference board, apply 12 V to VIN with the
P6 jumper is in Position 1. If the P7 jumper is in place the
board will come up in power save mode, if not in place then
constant PWM will be observed.
When applying higher than 12 V to the input it is reasonable
to install a RC snubber from LX to GND. There are place
holders on the reference board R9 and C11 for the snubber.
Values of 10 Ω and 1 nF are a reasonable starting point.
ADJUSTMENTS TO THE REFERENCE BOARD
OUTPUT VOLTAGE ADJUSTMENT
If a different output voltage is needed, simply change the
value of VOUT and solve for R12 based on the following
formula:
V OUT - V FB
R 12 = R 13 x ----------------------------V FB
Where VFB is 0.6 V for the SiC40X.
CHANGING SWITCHING FREQUENCY
The following equation illustrates the relationship between
ON-time, VIN, VOUT, and RON value:
k
R tON = --------------------------------25 pF x F SW
Where k equals 1 when VDD is greater than 3.6 V. When k is
less than 3.6 V and VIN is greater than ((VDD - 1.75 V) x 10),
k is shown by the following equation:
( V DD - 1.75 V ) x 10
k = ---------------------------------------------------V IN
The maximum Rton value allowed is shown:
V IN min.
R tON MAX. = -----------------15 μA
Input Voltage Sense
VIN_SENSE, GNDIN_SENSE (P2): This allows the user to
measure the voltage at the input of the regulator and remove
any losses generated due to the, connections from the
measurement. This can also be used by a power source with
sense capability.
Revision: 17-Nov-14
Document Number: 62923
2
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SiC401, SiC402, SiC403
www.vishay.com
OUTPUT RIPPLE VOLTAGE
Output ripple voltage is measured with a tip and barrel
measurement across COUT. Typically output ripple voltage
is set to 3 % to 5 % of the output voltage, but an all ceramic
output solution can bring output ripple voltage to a much
lower level since the ESR of ceramics is very small.
If ceramics or a combination of ceramics and bulk
capacitors are used it may be necessary to add a voltage
injection network.
VOLTAGE INJECTION NETWORK
This is the network seen placed across the output inductor
in the schematic consisting of R8, C9, and C10. A quick
method to add or remove injection is to reduce or increase
R4.
The time constant of the inductor (τIND) and voltage injection
network are as follows:
L
τ IND = -----------DCR
and
τ RIN = R L x C L
In (1) the recommended value of C9 = 10 nF.
Vishay Siliconix
Other than the inductance the DCR and saturation current
parameters are key values. The DCR causes an I2R loss
which will decrease the system efficiency and generate
heat. The saturation current has to be higher than the
maximum output current plus 1/2 the ripple current. In over
current condition the inductor current may be very high. All
this needs to be considered when selecting the inductor.
On this board Vishay IHLP series inductors are used to meet
cost requirement and high efficiency, a part that utilizes a
material that has incredible saturation levels compared to
competing products.
OUTPUT CAPACITOR SELECTION
Voltage rating, ESR, transient response, overall PCB area
and cost are requirements for selecting output capacitors.
The types of capacitors and there general advantages and
disadvantages are covered next.
Electrolytic have high ESR, dry out over time so ripple
current rating must be examined and have slower transient
response, but are fairly inexpensive for the amount of overall
capacitance.
Tantalums can come in low ESR varieties and high
capacitance value for its overall size, but they fail short when
damaged and also have slower transient response.
The injection voltage can be checked for magnitude next
using the following equation,



1 
---------V INJ = ( V IN MIN. - V OUT ) x  1 - t 
----------

τ RIN

e 
Ceramics have very low ESR, fast transient response and
overall small size, but come in low capacitance values
compared to the others above. A combination of technology
is sensible.
Where t is the ON period. This required magnitude is
> 20 mVpp for stable operation, when the ripple injection
voltage is smaller than 20 mVpp then double pulsing may be
observed as the thresholds are not correctly triggered within
the SiC40X.
In order that the LDO is programmed to 5 V the divider
resistors from the VDD pin to the FBL pin need to be set in
order that 0.75 V is present on FBL. They can be set as
follows:
V DD x R 8
V LDO = -----------------------R2 + R8
The injection voltage will be DC decoupled from the FB pin
via a capacitor, the calculation for this part is as follows:
C 10
1
3
= --------- x -------------------------------R 12 2 x π x F SW
--------R 13
LDO SETTING
ENABLE PIN VOLTAGE
The ENL pin will need to be set to enable the LDO. This pin
accepts an input voltage up to VIN however it can also be set
as an under voltage trigger. The operation for this pin can be
seen in Table 1.
INDUCTOR SELECTION
The choice of inductor is specific to each application and
quickly determined with the following equations:
t ON
V OUT
= ------------------------------------V IN MAX. x f SW
( V IN - VOUT ) x t ON
L = -------------------------------------------------I OUT MAX. x k 2
Where k2 is a percentage of maximum output current ripple
required. The designer can quickly make a choice if the
ripple percentage is decided, usually no more than 30 %
however higher or lower percentages of IOUT can be
acceptable depending on application.
Revision: 17-Nov-14
TABLE 1
EN/PSV
ENL
LDO
SWITCHER
Disabled
Low, < 0.4 V
Off
Off
Enabled
Low, < 0.4 V
Off
On
Disabled
1 V < High < 2.6 V
On
Off
Enabled
1 V < High < 2.6 V
On
Off
Disabled
High > 2.6 V
On
Off
Enabled
High > 2.6 V
On
On
Document Number: 62923
3
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SiC401, SiC402, SiC403
www.vishay.com
The UVLO will be activated if the voltage present at this pin
is below 2.6 V. This can be set using the following equation.
If under voltage is not a consideration then this can be
connected to VIN. The divider values for this pin can be set
using the following equation:
V IN x R 9
V ENL = ---------------------R1 + R9
SOFT START SETTING
Soft start is a useful function helping to limit the current draw
from the source at switch on. This is simply set with a
ceramic capacitor using the following equation:
t SS
C SS = --------------------500 000
A 2. 2 nF capacitor will provide ~ 1 ms soft start time.
BOOTSTRAP CIRCUIT
A bootstrap capacitor of 100 nF will be sufficient for this
circuit with switching frequencies from 200 kHz to 500 kHz.
A series resistor has been added in order to slow down the
low side switch in and minimize overshoot without adding a
snubber. This is user adjustable.
Vishay Siliconix
Where ILPK is the peak inductor current, IMAX. is the
maximum output current, dILOAD is the current step in μF
and VPK is the peak voltage, the output voltage summed
with the specified over and under shoot.
INPUT CAPACITANCE
In order to keep the design compact and minimize parasitic
elements, ceramic capacitors will be chosen. The initial
requirement for the input capacitance is decided by the
maximum input voltage, 16 V in this case however a 35 V
rated capacitor will be chosen of the X7R variety. The
footprint will be a compact 1206.
In order to determine the minimum capacitance the input
voltage ripple needs to be specified; VCINPP ≤ 150 mV is a
suitable starting point. This magnitude is determined by the
final application specification. The input current needs to be
determined for the lowest operating input voltage:
I OUT
I CIN(RMS) = ------------ x V OUT x ( V IN - V OUT )
V IN
The minimum input capacitance can then be found,
DC - ( 1 - DC )
C IN MIN. = I OUT x -------------------------------------V CINPP x F SW
VDD DECOUPLING
HIGH OUTPUT VOLTAGE OPERATION
The VDD pin will need to be decoupled in order to provide a
stable voltage internally and externally. The value for this
capacitor is recommended as ≥ 1 μF.
For the SiC40X family the recommended maximum output
voltage of no more than 75 % of VIN.
CURRENT LIMIT RESISTOR
The current limit is set by placing a resistor between pins
LXS and ILIM. The values can be found using the following
equations.
SiC401:
R ILIM = 792 x I LIM x [ 0.101 x ( 5 V - V DD ) + 1 ]
SiC402:
R ILIM = 446 x I LIM x [ 0.099 x ( 5 V - V DD ) + 1 ]
SiC403:
R ILIM = 1176 x I LIM x [ 0.112 x ( 5 V - V DD ) + 1 ]
For applications where an output voltage greater than 5 V is
required a resistive network should be used to step down
the output voltage in order to provide the VOUT pin with
4.5 V.
R 2 x ( V OUT - V OUT PIN )
R 1 = ------------------------------------------------------------V OUT PIN
For example, if an output voltage of VOUT = 8.5 V is
required, setting R2 = 10 kΩ and VOUT PIN = 4.5 V results in
R1 = 8870 Ω.
The switching frequency will also need recalculating using a
VOUT PIN magnitude of 4.5 V.
V OUT PIN
F SW = ------------------------t ON x V IN
OUTPUT CAPACITANCE
The output capacitance will be determined by the ripple
voltage requirement. Voltage mode COT topology can work
with very small values of capacitor ESR however a ripple
injection network will also be required for stable operation.
The overall capacitance needs to be calculated next. The
following equations are used to calculate the size needed to
meet a transient load response:
I LPK = I MAX. + 0.5 x I RIPPLE MAX,
C OUT MIN. = I LPK
Revision: 17-Nov-14
I LPK
I MAX.
L x -------------- - ------------------ x dt
V OUT dI LOAD
x -------------------------------------------------------------2 x ( VPK - V OUT )
LX
SiC40X
VOUT
R1
VOUT PIN
COUT
R2
Fig. 1 - Resistor Divider Network Allows 4.5 V at the VOUT PIN
Document Number: 62923
4
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SiC401, SiC402, SiC403
www.vishay.com
Vishay Siliconix
LAYOUT CONSIDERATIONS
7. If a voltage injection network is needed then place it near
to the inductor LX node.
The SiC40x family of footprint compatible 15 A, 10 A, and
6 A products offers the designer a scalable buck regulator
solution. If the below layout recommendations are followed,
the same layout can be used to cover a wide range of output
currents and voltages without any changes to the board
design and only minor changes to the component values in
the schematic.
8. PGND can be used on internal layers if the resistance of
the PCB is to be small; this will also help remove heat.
Use extra vias if needed but be mindful to allow a path
between the vias.
The reference design has a majority of the components
placed on the top layer. This allows for easy assembly and
straightforward layout.
9. A quiet plane should be employed for the AGND, this is
placed under the small signal passives. This can be
placed on multiple layers if needed for heat removal. This
should be connected to the PGND plane near to the input
GND at one connection only of at least 1mm width.
Figure 2 outlines the pointers for the layout considerations
and the explanations follow.
10. The LX copper can also be used on multiple layers, use
a number of vias.
11. The copper area beneath the inductor has been removed
(on all layers) in this design to reduce the inductive
coupling that occurs between the inductor and the GND
trace. No other voltage planes should be placed under
this area.
Fig. 2 - Resistor Divider Network Allows 4.5 V at the VOUT PIN
1. Place input ceramic capacitors close to the voltage input
pins with a small 10 nF / 100 nF placed as close as the
design rules will allow. This will help reduce the size of
the input high frequency current loop and consequently
reduce the high frequency ripple noise seen at the input
and the LX node.
2. Place the setup and control passive devices logically
around the IC with the intention of placing a quiet ground
plane beneath them on a secondary layer.
3. It is advisable to use ceramic capacitors at the output to
reduce impedance. Place these as close to the IC PGND
and output voltage node as design will allow. Place a
small 10 nF / 100 nF ceramic capacitor closest to the IC
and inductor loop.
4. The loop between LX, VOUT and the IC GND should be as
compact as possible. This will lower series resistance
and also make the current loop smaller enabling the high
frequency response of the output capacitors to take
effect.
5. The output impedance should be small when high
current is required; use high current traces, multiple
layers can be used with many vias.
6. Use many vias when multiple layers are involved. This
will have the effect of lowering the resistance between
layers and reducing the via inductance of the PCB nets.
Revision: 17-Nov-14
Document Number: 62923
5
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SiC401, SiC402, SiC403
www.vishay.com
Vishay Siliconix
PCB LAYOUT
Revision: 17-Nov-14
Fig. 3 - Top Layer
Fig. 5 - Inner Layer 2
Fig. 4 - Inner Layer 1
Fig. 6 - Bottom Layer
Document Number: 62923
6
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SiC401, SiC402, SiC403
www.vishay.com
Vishay Siliconix
SCHEMATIC - COMMON TO ALL BOARDS
Revision: 17-Nov-14
Document Number: 62923
7
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SiC401, SiC402, SiC403
www.vishay.com
Vishay Siliconix
BILL OF MATERIAL FOR SIC401 (VIN = 12 V, VOUT = 1.5 V, FSW = 500 kHz)
ITEM
QTY
REFERENCE
PCB FOOTPRINT
VALUE
VOLTAGE
PART NUMBER
MANUFACTURER
1
2
C1, C2
1206
Omit
35 V
C3216X5R1V226M160AC
TDK
2
2
C3, C4
1206
22 μF
35 V
C3216X5R1V226M160AC
TDK
3
3
C5, C9, C12
0402
10 nF
50 V
GRM155R71H103KA88D
Murata
4
1
C6
0402
2.2 μF
10 V
C0402C225M8PACTU
Kemet
5
2
C7, C10
0402
2.2 nF
50 V
GRM155R71H222KA01D
Murata
6
1
C8
0402
100 nF
35 V
CGA2B3X7R1V104K050BB
Vishay
7
5
C13, C14, C15, C16,
C17
1206
47 μF
35 V
GRM31CR61A476ME15L
Murata
8
3
C18, C19, C20
1206
Omit
35 V
GRM31CR61A476ME15L
Murata
9
2
C21, C22
7343
Omit
-
-
-
10
4
P1, P3, P9, P10
Banana Jack
-
-
575-4K-ND
Keystone
11
5
P2, P4, P5, P7, P8
Header-2
-
-
826926-2
AMP (TE)
12
1
P6
Header-3
-
-
HTSW-103-08-T-S
Samtec
13
1
L1
IHLP5050
1 μH
-
IHLP5050FDER1R0
Vishay
14
1
R1
0402
249K
-
CRCW0402249KFKED
Vishay
15
1
R2
0402
100K
-
CRCW0402100KFKED
Vishay
16
1
R3
0402
169K
-
CRCW0402169KFKED
Vishay
17
1
R4
0402
30K
-
CRCW040230K0FKED
Vishay
18
1
R5
0402
5K11
-
CRCW04025K11FKED
Vishay
19
1
R6
0402
76K8
-
CRCW040276K8FKED
Vishay
20
1
R7
0402
10R
-
CRCW040210R0FKEA
Vishay
21
1
R8
0402
10K
-
CRCW040210K0FKED
Vishay
22
1
R9
0805
Omit
-
-
Vishay
23
1
R10
0402
0R
-
CRCW04020000Z0ED
Vishay
24
1
R11
0402
Omit
-
-
Vishay
25
1
R12
0402
1K54
-
CRCW04021K54FKED
Vishay
26
1
R13
0402
1K
-
CRCW0402249KFKED
Vishay
27
1
R14
0402
10R
-
CRCW040210R0FKEA
Vishay
28
1
R15
0402
10K
-
CRCW040210K0FKED
Vishay
29
1
U1
MLP55-33
SIC401
-
-
-
KEY
Only needed for reference board
Revision: 17-Nov-14
Document Number: 62923
8
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SiC401, SiC402, SiC403
www.vishay.com
Vishay Siliconix
BILL OF MATERIAL FOR SIC402 (VIN = 12 V, VOUT = 1.5 V, FSW = 500 kHz)
ITEM
QTY
REFERENCE
PCB FOOTPRINT
VALUE
VOLTAGE
PART NUMBER
MANUFACTURER
1
2
C1, C2
1206
Omit
35 V
C3216X5R1V226M160AC
TDK
2
2
C3, C4
1206
22 μF
35 V
C3216X5R1V226M160AC
TDK
3
3
C5, C9, C12
0402
10 nF
50 V
GRM155R71H103KA88D
Murata
4
1
C6
0402
2.2 μF
10 V
C0402C225M8PACTU
Kemet
5
2
C7, C10
0402
2.2 nF
50 V
GRM155R71H222KA01D
Murata
6
1
C8
0402
100 nF
35 V
CGA2B3X7R1V104K050BB
Vishay
7
3
C13, C14, C15
1206
47 μF
35 V
GRM31CR61A476ME15L
Murata
8
5
C16, C17, C18, C19,
C20
1206
Omit
35 V
GRM31CR61A476ME15L
Murata
9
2
C21, C22
7343
Omit
-
-
-
10
4
P1, P3, P9, P10
Banana Jack
-
-
575-4K-ND
Keystone
11
5
P2, P4, P5, P7, P8
Header-2
-
-
826926-2
AMP (TE)
12
1
P6
Header-3
-
-
HTSW-103-08-T-S
Samtec
13
1
L1
IHLP4040
1 μH
-
IHLP4040DZER1R0
Vishay
14
1
R1
0402
249K
-
CRCW0402249KFKED
Vishay
15
1
R2
0402
100K
-
CRCW0402100KFKED
Vishay
16
1
R3
0402
169K
-
CRCW0402169KFKED
Vishay
17
1
R4
0402
30K
-
CRCW040230K0FKED
Vishay
18
1
R5
0402
5K11
-
CRCW04025K11FKED
Vishay
19
1
R6
0402
76K8
-
CRCW040276K8FKED
Vishay
20
1
R7
0402
10R
-
CRCW040210R0FKEA
Vishay
21
1
R8
0402
10K
-
CRCW040210K0FKED
Vishay
22
1
R9
0805
Omit
-
-
Vishay
23
1
R10
0402
0R
-
CRCW04020000Z0ED
Vishay
24
1
R11
0402
Omit
-
-
Vishay
25
1
R12
0402
1K54
-
CRCW04021K54FKED
Vishay
26
1
R13
0402
1K
-
CRCW0402249KFKED
Vishay
27
1
R14
0402
10R
-
CRCW040210R0FKEA
Vishay
28
1
R15
0402
10K
-
CRCW040210K0FKED
Vishay
29
1
U1
MLP55-33
SIC402
-
-
-
KEY
Only needed for reference board
Revision: 17-Nov-14
Document Number: 62923
9
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SiC401, SiC402, SiC403
www.vishay.com
Vishay Siliconix
BILL OF MATERIAL FOR SIC403 LC (VIN = 12 V, VOUT = 1.5 V, FSW = 500 kHz)
ITEM
QTY
REFERENCE
PCB FOOTPRINT
VALUE
VOLTAGE
PART NUMBER
MANUFACTURER
1
3
C1, C2, C3
1206
Omit
35 V
C3216X5R1V226M160AC
TDK
2
1
C4
1206
22 μF
35 V
C3216X5R1V226M160AC
TDK
3
3
C5, C9, C12
0402
10 nF
50 V
GRM155R71H103KA88D
Murata
4
1
C6
0402
2.2 μF
10 V
C0402C225M8PACTU
Kemet
5
2
C7, C10
0402
1 nF
50 V
GRM155R71H102KA01D
Murata
6
1
C8
0402
100 nF
35 V
CGA2B3X7R1V104K050BB
Vishay
7
2
C13, C14
1206
47 μF
35 V
GRM31CR61A476ME15L
Murata
8
6
C15, C16, C17
C18, C19, C20
1206
Omit
35 V
GRM31CR61A476ME15L
Murate
9
2
C21, C22
7343
Omit
-
-
-
10
4
P1, P3, P9, P10
Banana Jack
-
-
575-4K-ND
Keystone
11
5
P2, P4, P5, P7, P8
Header-2
-
-
826926-2
AMP (TE)
12
1
P6
Header-3
-
-
HTSW-103-08-T-S
Samtec
13
1
L1
IHLP3232
2.2 μH
-
IHLP3232DZER2R2
Vishay
14
1
R1
0402
249K
-
CRCW0402249KFKED
Vishay
15
1
R2
0402
100K
-
CRCW0402100KFKED
Vishay
16
1
R3
0402
169K
-
CRCW0402169KFKED
Vishay
17
1
R4
0402
30K
-
CRCW040230K0FKED
Vishay
18
1
R5
0402
5K11
-
CRCW04025K11FKED
Vishay
19
1
R6
0402
76K8
-
CRCW040276K8FKED
Vishay
20
1
R7
0402
10R
-
CRCW040210R0FKEA
Vishay
21
1
R8
0402
10K
-
CRCW040210K0FKED
Vishay
22
1
R9
0805
Omit
-
-
Vishay
23
1
R10
0402
0R
-
CRCW04020000Z0ED
Vishay
24
1
R11
0402
Omit
-
-
Vishay
25
1
R12
0402
1K54
-
CRCW04021K54FKED
Vishay
26
1
R13
0402
1K
-
CRCW0402249KFKED
Vishay
27
1
R14
0402
10R
-
CRCW040210R0FKEA
Vishay
28
1
R15
0402
10K
-
CRCW040210K0FKED
Vishay
29
1
U1
MLP55-33
SIC403
-
-
-
KEY
Only needed for reference board
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and
reliability data, see www.vishay.com/ppg?62923.
Revision: 17-Nov-14
Document Number: 62923
10
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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