TI1 AM3352BZCEA30R Sitara processor Datasheet

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AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351
SPRS717J – OCTOBER 2011 – REVISED APRIL 2016
AM335x Sitara™ Processors
1 Device Overview
1.1
Features
1
• Up to 1-GHz Sitara™ ARM® Cortex®-A8 32‑Bit
RISC Processor
– NEON™ SIMD Coprocessor
– 32KB of L1 Instruction and 32KB of Data Cache
With Single-Error Detection (Parity)
– 256KB of L2 Cache With Error Correcting Code
(ECC)
– 176KB of On-Chip Boot ROM
– 64KB of Dedicated RAM
– Emulation and Debug - JTAG
– Interrupt Controller (up to 128 Interrupt
Requests)
• On-Chip Memory (Shared L3 RAM)
– 64KB of General-Purpose On-Chip Memory
Controller (OCMC) RAM
– Accessible to All Masters
– Supports Retention for Fast Wakeup
• External Memory Interfaces (EMIF)
– mDDR(LPDDR), DDR2, DDR3, DDR3L
Controller:
– mDDR: 200-MHz Clock (400-MHz Data Rate)
– DDR2: 266-MHz Clock (532-MHz Data Rate)
– DDR3: 400-MHz Clock (800-MHz Data Rate)
– DDR3L: 400-MHz Clock (800-MHz Data
Rate)
– 16-Bit Data Bus
– 1GB of Total Addressable Space
– Supports One x16 or Two x8 Memory Device
Configurations
– General-Purpose Memory Controller (GPMC)
– Flexible 8-Bit and 16-Bit Asynchronous
Memory Interface With up to Seven Chip
Selects (NAND, NOR, Muxed-NOR, SRAM)
– Uses BCH Code to Support 4-, 8-, or 16-Bit
ECC
– Uses Hamming Code to Support 1-Bit ECC
– Error Locator Module (ELM)
– Used in Conjunction With the GPMC to
Locate Addresses of Data Errors from
Syndrome Polynomials Generated Using a
BCH Algorithm
– Supports 4-, 8-, and 16-Bit per 512-Byte
Block Error Location Based on BCH
Algorithms
• Programmable Real-Time Unit Subsystem and
Industrial Communication Subsystem (PRU-ICSS)
– Supports Protocols such as EtherCAT®,
PROFIBUS, PROFINET, EtherNet/IP™, and
More
– Two Programmable Real-Time Units (PRUs)
– 32-Bit Load/Store RISC Processor Capable
of Running at 200 MHz
– 8KB of Instruction RAM With Single-Error
Detection (Parity)
– 8KB of Data RAM With Single-Error Detection
(Parity)
– Single-Cycle 32-Bit Multiplier With 64-Bit
Accumulator
– Enhanced GPIO Module Provides ShiftIn/Out Support and Parallel Latch on External
Signal
– 12KB of Shared RAM With Single-Error
Detection (Parity)
– Three 120-Byte Register Banks Accessible by
Each PRU
– Interrupt Controller (INTC) for Handling System
Input Events
– Local Interconnect Bus for Connecting Internal
and External Masters to the Resources Inside
the PRU-ICSS
– Peripherals Inside the PRU-ICSS:
– One UART Port With Flow Control Pins,
Supports up to 12 Mbps
– One Enhanced Capture (eCAP) Module
– Two MII Ethernet Ports that Support Industrial
Ethernet, such as EtherCAT
– One MDIO Port
• Power, Reset, and Clock Management (PRCM)
Module
– Controls the Entry and Exit of Stand-By and
Deep-Sleep Modes
– Responsible for Sleep Sequencing, Power
Domain Switch-Off Sequencing, Wake-Up
Sequencing, and Power Domain Switch-On
Sequencing
– Clocks
– Integrated 15- to 35-MHz High-Frequency
Oscillator Used to Generate a Reference
Clock for Various System and Peripheral
Clocks
– Supports Individual Clock Enable and Disable
Control for Subsystems and Peripherals to
Facilitate Reduced Power Consumption
– Five ADPLLs to Generate System Clocks
(MPU Subsystem, DDR Interface, USB and
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351
SPRS717J – OCTOBER 2011 – REVISED APRIL 2016
Peripherals [MMC and SD, UART, SPI, I2C],
L3, L4, Ethernet, GFX [SGX530], LCD Pixel
Clock)
– Power
– Two Nonswitchable Power Domains (RealTime Clock [RTC], Wake-Up Logic
[WAKEUP])
– Three Switchable Power Domains (MPU
Subsystem [MPU], SGX530 [GFX],
Peripherals and Infrastructure [PER])
– Implements SmartReflex™ Class 2B for Core
Voltage Scaling Based On Die Temperature,
Process Variation, and Performance
(Adaptive Voltage Scaling [AVS])
– Dynamic Voltage Frequency Scaling (DVFS)
• Real-Time Clock (RTC)
– Real-Time Date (Day-Month-Year-Day of Week)
and Time (Hours-Minutes-Seconds) Information
– Internal 32.768-kHz Oscillator, RTC Logic and
1.1-V Internal LDO
– Independent Power-on-Reset
(RTC_PWRONRSTn) Input
– Dedicated Input Pin (EXT_WAKEUP) for
External Wake Events
– Programmable Alarm Can be Used to Generate
Internal Interrupts to the PRCM (for Wakeup) or
Cortex-A8 (for Event Notification)
– Programmable Alarm Can be Used With
External Output (PMIC_POWER_EN) to Enable
the Power Management IC to Restore Non-RTC
Power Domains
• Peripherals
– Up to Two USB 2.0 High-Speed OTG Ports
With Integrated PHY
– Up to Two Industrial Gigabit Ethernet MACs (10,
100, 1000 Mbps)
– Integrated Switch
– Each MAC Supports MII, RMII, RGMII, and
MDIO Interfaces
– Ethernet MACs and Switch Can Operate
Independent of Other Functions
– IEEE 1588v2 Precision Time Protocol (PTP)
– Up to Two Controller-Area Network (CAN) Ports
– Supports CAN Version 2 Parts A and B
– Up to Two Multichannel Audio Serial Ports
(McASPs)
– Transmit and Receive Clocks up to 50 MHz
– Up to Four Serial Data Pins per McASP Port
With Independent TX and RX Clocks
– Supports Time Division Multiplexing (TDM),
Inter-IC Sound (I2S), and Similar Formats
2
Device Overview
www.ti.com
–
–
–
–
–
–
–
–
–
– Supports Digital Audio Interface Transmission
(SPDIF, IEC60958-1, and AES-3 Formats)
– FIFO Buffers for Transmit and Receive (256
Bytes)
Up to Six UARTs
– All UARTs Support IrDA and CIR Modes
– All UARTs Support RTS and CTS Flow
Control
– UART1 Supports Full Modem Control
Up to Two Master and Slave McSPI Serial
Interfaces
– Up to Two Chip Selects
– Up to 48 MHz
Up to Three MMC, SD, SDIO Ports
– 1-, 4- and 8-Bit MMC, SD, SDIO Modes
– MMCSD0 has Dedicated Power Rail for 1.8‑V
or 3.3-V Operation
– Up to 48-MHz Data Transfer Rate
– Supports Card Detect and Write Protect
– Complies With MMC4.3, SD, SDIO 2.0
Specifications
Up to Three I2C Master and Slave Interfaces
– Standard Mode (up to 100 kHz)
– Fast Mode (up to 400 kHz)
Up to Four Banks of General-Purpose I/O
(GPIO) Pins
– 32 GPIO Pins per Bank (Multiplexed With
Other Functional Pins)
– GPIO Pins Can be Used as Interrupt Inputs
(up to Two Interrupt Inputs per Bank)
Up to Three External DMA Event Inputs that can
Also be Used as Interrupt Inputs
Eight 32-Bit General-Purpose Timers
– DMTIMER1 is a 1-ms Timer Used for
Operating System (OS) Ticks
– DMTIMER4–DMTIMER7 are Pinned Out
One Watchdog Timer
SGX530 3D Graphics Engine
– Tile-Based Architecture Delivering up to 20
Million Polygons per Second
– Universal Scalable Shader Engine (USSE) is
a Multithreaded Engine Incorporating Pixel
and Vertex Shader Functionality
– Advanced Shader Feature Set in Excess of
Microsoft VS3.0, PS3.0, and OGL2.0
– Industry Standard API Support of Direct3D
Mobile, OGL-ES 1.1 and 2.0, OpenVG 1.0,
and OpenMax
– Fine-Grained Task Switching, Load
Balancing, and Power Management
– Advanced Geometry DMA-Driven Operation
for Minimum CPU Interaction
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–
–
–
–
SPRS717J – OCTOBER 2011 – REVISED APRIL 2016
– Programmable High-Quality Image AntiAliasing
– Fully Virtualized Memory Addressing for OS
Operation in a Unified Memory Architecture
LCD Controller
– Up to 24-Bit Data Output; 8 Bits per Pixel
(RGB)
– Resolution up to 2048 × 2048 (With
Maximum 126-MHz Pixel Clock)
– Integrated LCD Interface Display Driver
(LIDD) Controller
– Integrated Raster Controller
– Integrated DMA Engine to Pull Data from the
External Frame Buffer Without Burdening the
Processor via Interrupts or a Firmware Timer
– 512-Word Deep Internal FIFO
– Supported Display Types:
– Character Displays - Uses LIDD Controller
to Program these Displays
– Passive Matrix LCD Displays - Uses LCD
Raster Display Controller to Provide
Timing and Data for Constant Graphics
Refresh to a Passive Display
– Active Matrix LCD Displays - Uses
External Frame Buffer Space and the
Internal DMA Engine to Drive Streaming
Data to the Panel
12-Bit Successive Approximation Register
(SAR) ADC
– 200K Samples per Second
– Input can be Selected from any of the Eight
Analog Inputs Multiplexed Through an 8:1
Analog Switch
– Can be Configured to Operate as a 4-Wire, 5Wire, or 8-Wire Resistive Touch Screen
Controller (TSC) Interface
Up to Three 32-Bit eCAP Modules
– Configurable as Three Capture Inputs or
Three Auxiliary PWM Outputs
Up to Three Enhanced High-Resolution PWM
Modules (eHRPWMs)
– Dedicated 16-Bit Time-Base Counter With
Time and Frequency Controls
– Configurable as Six Single-Ended, Six DualEdge Symmetric, or Three Dual-Edge
Asymmetric Outputs
•
•
•
•
•
•
•
– Up to Three 32-Bit Enhanced Quadrature
Encoder Pulse (eQEP) Modules
Device Identification
– Contains Electrical Fuse Farm (FuseFarm) of
Which Some Bits are Factory Programmable
– Production ID
– Device Part Number (Unique JTAG ID)
– Device Revision (Readable by Host ARM)
Debug Interface Support
– JTAG and cJTAG for ARM (Cortex-A8 and
PRCM), PRU-ICSS Debug
– Supports Device Boundary Scan
– Supports IEEE 1500
DMA
– On-Chip Enhanced DMA Controller (EDMA) has
Three Third-Party Transfer Controllers (TPTCs)
and One Third-Party Channel Controller
(TPCC), Which Supports up to 64
Programmable Logical Channels and Eight
QDMA Channels. EDMA is Used for:
– Transfers to and from On-Chip Memories
– Transfers to and from External Storage
(EMIF, GPMC, Slave Peripherals)
Inter-Processor Communication (IPC)
– Integrates Hardware-Based Mailbox for IPC and
Spinlock for Process Synchronization Between
Cortex-A8, PRCM, and PRU-ICSS
– Mailbox Registers that Generate Interrupts
– Four Initiators (Cortex-A8, PRCM, PRU0,
PRU1)
– Spinlock has 128 Software-Assigned Lock
Registers
Security
– Crypto Hardware Accelerators (AES, SHA,
RNG)
– Secure Boot
Boot Modes
– Boot Mode is Selected Through Boot
Configuration Pins Latched on the Rising Edge
of the PWRONRSTn Reset Input Pin
Packages:
– 298-Pin S-PBGA-N298 Via Channel Package
(ZCE Suffix), 0.65-mm Ball Pitch
– 324-Pin S-PBGA-N324 Package
(ZCZ Suffix), 0.80-mm Ball Pitch
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Device Overview
3
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SPRS717J – OCTOBER 2011 – REVISED APRIL 2016
1.2
•
•
•
•
•
Applications
Gaming Peripherals
Home and Industrial Automation
Consumer Medical Appliances
Printers
Smart Toll Systems
1.3
www.ti.com
•
•
•
•
Connected Vending Machines
Weighing Scales
Educational Consoles
Advanced Toys
Description
The AM335x microprocessors, based on the ARM Cortex-A8 processor, are enhanced with image,
graphics processing, peripherals and industrial interface options such as EtherCAT and PROFIBUS. The
devices support high-level operating systems (HLOS). Linux® and Android™ are available free of charge
from TI.
The AM335x microprocessor contains the subsystems shown in the Functional Block Diagram and a brief
description of each follows:
The contains the subsystems shown in the Functional Block Diagram and a brief description of each
follows:
The microprocessor unit (MPU) subsystem is based on the ARM Cortex-A8 processor and the PowerVR
SGX™ Graphics Accelerator subsystem provides 3D graphics acceleration to support display and gaming
effects.
The PRU-ICSS is separate from the ARM core, allowing independent operation and clocking for greater
efficiency and flexibility. The PRU-ICSS enables additional peripheral interfaces and real-time protocols
such as EtherCAT, PROFINET, EtherNet/IP, PROFIBUS, Ethernet Powerlink, Sercos, and others.
Additionally, the programmable nature of the PRU-ICSS, along with its access to pins, events and all
system-on-chip (SoC) resources, provides flexibility in implementing fast, real-time responses, specialized
data handling operations, custom peripheral interfaces, and in offloading tasks from the other processor
cores of SoC.
Device Information (1)
PART NUMBER
PACKAGE
BODY SIZE
AM3359ZCZ
NFBGA (324)
15.0 mm × 15.0 mm
AM3358ZCZ
NFBGA (324)
15.0 mm × 15.0 mm
AM3357ZCZ
NFBGA (324)
15.0 mm × 15.0 mm
AM3356ZCZ, AM3356ZCE
NFBGA (324), NFBGA (298)
15.0 mm × 15.0 mm, 13.0 mm × 13.0 mm
AM3354ZCZ, AM3354ZCE
NFBGA (324), NFBGA (298)
15.0 mm × 15.0 mm, 13.0 mm × 13.0 mm
AM3352ZCZ, AM3352ZCE
NFBGA (324), NFBGA (298)
15.0 mm × 15.0 mm, 13.0 mm × 13.0 mm
NFBGA (298)
13.0 mm × 13.0 mm
AM3351ZCE
(1)
4
For more information, see Section 9, Mechanical, Packaging, and Orderable Information.
Device Overview
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1.4
SPRS717J – OCTOBER 2011 – REVISED APRIL 2016
Functional Block Diagram
Figure 1-1 shows the AM335x microprocessor functional block diagram.
Graphics
Display
PowerVR
SGX
3D GFX
24-bit LCD controller
Touch screen controller
32KB and 32KB L1 + SED
Crypto
PRU-ICSS
256KB L2 + ECC
64KB
shared
RAM
ARM
Cortex-A8
Up to 1 GHz
176KB ROM 64KB RAM
EtherCAT, PROFINET,
EtherNet/IP,
and more
L3 and L4 interconnect
Serial
System
UART x6
eDMA
SPI x2
Timers x8
2
I C x3
McASP x2
(4 channel)
CAN x2
(Ver. 2 A and B)
USB 2.0 HS
OTG + PHY x2
eCAP x3
ADC (8 channel)
12-bit SAR
WDT
RTC
Parallel
MMC, SD and
SDIO x3
GPIO
JTAG
eHRPWM x3
eQEP x3
PRCM
EMAC (2-port) 10M, 100M, 1G
IEEE 1588v2, and switch
(MII, RMII, RGMII)
Crystal
Oscillator x2
Memory interface
mDDR(LPDDR), DDR2,
DDR3, DDR3L
(16-bit; 200, 266, 400, 400 MHz)
NAND and NOR (16-bit ECC)
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Figure 1-1. AM335x Functional Block Diagram
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Device Overview
5
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SPRS717J – OCTOBER 2011 – REVISED APRIL 2016
www.ti.com
Table of Contents
1
Device Overview ......................................... 1
Features .............................................. 1
1.2
Applications ........................................... 4
7.3
OPP50 Support .................................... 115
Description ............................................ 4
7.4
Controller Area Network (CAN) .................... 116
........................... 5
Revision History ......................................... 7
Device Comparison ..................................... 8
3.1
Related Products ..................................... 9
Terminal Configuration and Functions ............ 10
4.1
Pin Diagram ......................................... 10
4.2
Pin Attributes ........................................ 18
4.3
Signal Descriptions .................................. 50
Specifications ........................................... 79
5.1
Absolute Maximum Ratings ......................... 79
5.2
ESD Ratings ........................................ 80
5.3
Power-On Hours (POH) ............................. 81
5.4
Operating Performance Points (OPPs) ............. 81
5.5
Recommended Operating Conditions ............... 84
5.6
Power Consumption Summary...................... 86
5.7
DC Electrical Characteristics ........................ 88
7.5
7.6
DMTimer ........................................... 117
Ethernet Media Access Controller (EMAC) and
Switch .............................................. 118
7.7
External Memory Interfaces ........................ 126
7.8
I2C .................................................. 189
1.4
4
5
Functional Block Diagram
5.8
7
6.2
Clock Specifications................................ 106
Peripheral Information and Timings .............. 115
7.1
6
Parameter Information ............................. 115
Table of Contents
LCD Controller (LCDC)
7.11
Multichannel Audio Serial Port (McASP)
7.15
8
Power and Clocking ................................... 98
Power Supplies ...................................... 98
JTAG Electrical Data and Timing .................. 191
7.10
7.13
7.14
External Capacitors ................................. 93
Touch Screen Controller and Analog-to-Digital
Subsystem Electrical Parameters ................... 96
6.1
7.9
7.12
Thermal Resistance Characteristics for ZCE and
ZCZ Packages ...................................... 92
5.9
5.10
6
Recommended Clock and Control Signal Transition
Behavior............................................ 115
1.1
1.3
2
3
7.2
9
............................
..........
Multichannel Serial Port Interface (McSPI) ........
Multimedia Card (MMC) Interface .................
192
208
213
219
Programmable Real-Time Unit Subsystem and
Industrial Communication Subsystem (PRU-ICSS) 222
Universal Asynchronous Receiver Transmitter
(UART) ............................................. 231
Device and Documentation Support .............. 234
8.1
Device Nomenclature .............................. 234
8.2
Tools and Software ................................ 235
8.3
Documentation Support ............................ 239
8.4
Related Links
8.5
Community Resources............................. 242
8.6
Trademarks ........................................ 243
8.7
Electrostatic Discharge Caution
8.8
Glossary............................................ 243
......................................
...................
242
243
Mechanical, Packaging, and Orderable
Information ............................................. 244
9.1
Via Channel ........................................ 244
9.2
Packaging Information ............................. 244
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SPRS717J – OCTOBER 2011 – REVISED APRIL 2016
2 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision I (December 2015) to Revision J
•
•
•
•
Page
Added Secure boot to Security feature list ........................................................................................ 3
Added extended temperature range for the AM3351 device in Table 3-1 .................................................... 8
Added Section 3.1, Related Products ............................................................................................. 9
Reformatted and added content to Section 8, Device and Documentation Support ...................................... 234
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SPRS717J – OCTOBER 2011 – REVISED APRIL 2016
www.ti.com
3 Device Comparison
Table 3-1 lists the features supported across different AM335x devices.
Table 3-1. Device Features Comparison
FUNCTION
ARM Cortex-A8
Frequency(1)
MIPS(2)
AM3351
AM3352
AM3354
AM3356
AM3357
AM3358
AM3359
Yes
Yes
Yes
Yes
Yes
Yes
Yes
300 MHz
600 MHz
300 MHz
600 MHz
800 MHz
1000 MHz
600 MHz
800 MHz
1000 MHz
300 MHz
600 MHz
800 MHz
300 MHz
600 MHz
800 MHz
600 MHz
800 MHz
1000 MHz
600 MHz
800 MHz
600
1200
600
1200
1600
2000
1200
1600
2000
600
1200
1600
600
1200
1600
1200
1600
2000
1200
1600
On-chip L1 cache
64KB
64KB
64KB
64KB
64KB
64KB
64KB
On-chip L2 cache
256KB
256KB
256KB
256KB
256KB
256KB
256KB
—
—
3D
—
—
3D
3D
Crypto
accelerator
Crypto
accelerator
Crypto
accelerator
Crypto
accelerator
Crypto
accelerator
Crypto
accelerator
Crypto
accelerator
Features
including all
Industrial
protocols
Features
including basic
Industrial
protocols
Features
including all
Industrial
protocols
128KB
Graphics accelerator
(SGX530)
Hardware acceleration
—
—
—
Features
including basic
Industrial
protocols;
ZCE: Limited
PRU I/Os pinned
out
128KB
128KB
128KB
128KB
128KB
128KB
LCD
LCD
LCD
LCD
LCD
LCD
LCD
1 16-bit (GPMC,
NAND flash,
NOR flash,
SRAM)
1 16-bit (GPMC,
NAND flash,
NOR flash,
SRAM)
1 16-bit (GPMC,
NAND flash,
NOR flash,
SRAM)
1 16-bit (GPMC,
NAND flash,
NOR flash,
SRAM)
1 16-bit (GPMC,
NAND flash,
NOR flash,
SRAM)
1 16-bit (GPMC,
NAND flash,
NOR flash,
SRAM)
1 16-bit (GPMC,
NAND flash,
NOR flash,
SRAM)
1 16-bit
(LPDDR-400,
DDR2-532,
DDR3-800)
1 16-bit
(LPDDR-400,
DDR2-532,
DDR3-800)
1 16-bit
(LPDDR-400,
DDR2-532,
DDR3-800)
1 16-bit
(LPDDR-400,
DDR2-532,
DDR3-800)
1 16-bit
(LPDDR-400,
DDR2-532,
DDR3-800)
1 16-bit
(LPDDR-400,
DDR2-532,
DDR3-800)
1 16-bit
(LPDDR-400,
DDR2-532,
DDR3-800)
Universal serial bus (USB)
ZCE: 1 port
ZCE: 1 port
ZCZ: 2 ports
ZCE: 1 port
ZCZ: 2 ports
ZCE: 1 port
ZCZ: 2 ports
No ZCE
Available
ZCZ: 2 ports
No ZCE
Available
ZCZ: 2 ports
No ZCE
Available
ZCZ: 2 ports
Ethernet media access
controller (EMAC) with 2port switch
10/100/1000
ZCE: 1 port
10/100/1000
ZCE: 1 port
ZCZ: 2 ports
10/100/1000
ZCE: 1 port
ZCZ: 2 ports
10/100/1000
ZCE: 1 port
ZCZ: 2 ports
10/100/1000
No ZCE
Available
ZCZ: 2 ports
10/100/1000
No ZCE
Available
ZCZ: 2 ports
10/100/1000
No ZCE
Available
ZCZ: 2 ports
Multimedia card (MMC)
3
3
3
3
3
3
3
Controller-area network
(CAN)
—
2
2
2
2
2
2
Universal asynchronous
receiver and transmitter
(UART)
6
6
6
6
6
6
6
Analog-to-digital converter
(ADC)
8-ch 12-bit
8-ch 12-bit
8-ch 12-bit
8-ch 12-bit
8-ch 12-bit
8-ch 12-bit
8-ch 12-bit
Enhanced high-resolution
PWM modules
(eHRPWM)
3
3
3
3
3
3
3
Enhanced capture
modules (eCAP)
3
3
3
3
3
3
3
Enhanced quadrature
encoder pulse (eQEP)
3
3
3
3
3
3
3
Real-time clock (RTC)
1
1
1
1
1
1
1
Inter-integrated circuit
(I2C)
3
3
3
3
3
3
3
Programmable real-time
unit subsystem and
industrial communication
subsystem (PRU-ICSS)
On-chip memory
Display options
General-purpose memory
DRAM(3)
8
Device Comparison
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SPRS717J – OCTOBER 2011 – REVISED APRIL 2016
Table 3-1. Device Features Comparison (continued)
FUNCTION
AM3351
AM3352
AM3354
AM3356
AM3357
AM3358
AM3359
Multichannel audio serial
port (McASP)
2
2
2
2
2
2
2
Multichannel serial port
interface (McSPI)
2
2
2
2
2
2
2
Enhanced direct memory
access (EDMA)
64-Ch
64-Ch
64-Ch
64-Ch
64-Ch
64-Ch
64-Ch
Input/output (I/O) supply
1.8 V, 3.3 V
1.8 V, 3.3 V
1.8 V, 3.3 V
1.8 V, 3.3 V
1.8 V, 3.3 V
1.8 V, 3.3 V
1.8 V, 3.3 V
0 to 90°C
–40 to 105°C
-40 to 125°C(4)
–40 to 105°C
–40 to 90°C
0 to 90°C
–40 to 105°C
–40 to 90°C
0 to 90°C
–40 to 105°C
–40 to 90°C
0 to 90°C
–40 to 105°C
–40 to 90°C
–40 to 105°C
–40 to 90°C
0 to 90°C
–40 to 105°C
–40 to 90°C
Operating temperature
range
(1) Frequencies listed correspond to silicon revision 2.x. Earlier silicon revisions support 275 MHz, 500 MHz, 600 MHz, and 720 MHz.
(2) MIPS listed correspond to silicon revision 2.x. Earlier silicon revisions support 560, 1000, 1200, and 1440.
(3) DRAM speeds listed are data rates.
(4) Industrial extended temperature only supported for 300-MHz and 600-MHz frequencies.
3.1
Related Products
For information about other devices in this family of products, see the following links:
Sitara Processors Scalable processors based on ARM Cortex-A cores with flexible peripherals,
connectivity and unified software support – perfect for sensors to servers.
TI's ARM Cortex-A8 Advantage The ARM Cortex-A8 core is highly-optimized by ARM for performance
and power efficiency. With the ability to scale in speed from 300 MHz to 1.35 GHz, the ARM
Cortex-A8-based processor can meet the requirements for power optimized devices with a
power budget of less than the Cortex-A8 core a dual-issue superscalar, achieving twice the
instructions executed per clock cycle at 2 DMIPS/MHz.
AM335x Sitara Processors Scalable ARM Cortex-A8-based core from 300 MHz up to 1 GHz, 3D
graphics option for enhanced user interface, dual-core PRU-ICSS for industrial Ethernet
protocols and position feedback control, and premium secure boot option.
Companion Products for AM335x Sitara Processors Review products that are frequently purchased or
used with this product.
TI Designs for AM335x Sitara Processors The TI Designs Reference Design Library is a robust
reference design library spanning analog, embedded processor and connectivity. Created by
TI experts to help you jump start your system design, all TI Designs include schematic or
block diagrams, BOMs and design files to speed your time to market. Search and download
designs at ti.com/tidesigns.
Device Comparison
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4 Terminal Configuration and Functions
4.1
Pin Diagram
NOTE
The terms 'ball', 'pin', and 'terminal' are used interchangeably throughout the document. An
attempt is made to use 'ball' only when referring to the physical package.
4.1.1
ZCE Package Pin Maps (Top View)
The pin maps that follow show the pin assignments on the ZCE package in three sections (left, middle,
and right).
10
Terminal Configuration and Functions
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SPRS717J – OCTOBER 2011 – REVISED APRIL 2016
Table 4-1. ZCE Pin Map [Section Left - Top View]
A
B
C
D
E
F
19
VSS
I2C0_SCL
UART1_TXD
UART1_RTSn
UART0_RXD
UART0_CTSn
18
SPI0_SCLK
SPI0_D0
I2C0_SDA
UART1_RXD
ECAP0_IN_PWM0_OUT
UART0_RTSn
17
SPI0_CS0
SPI0_D1
EXTINTn
XXXX
UART1_CTSn
UART0_TXD
16
WARMRSTn
SPI0_CS1
XXXX
XXXX
XXXX
VDDS
15
EMU0
XDMA_EVENT_INTR1
XDMA_EVENT_INTR0
XXXX
PWRONRSTn
XXXX
14
TDO
TCK
TMS
EMU1
XXXX
VDDSHV6
13
TRSTn
TDI
CAP_VBB_MPU
CAP_VDD_SRAM_MPU
VDDSHV6
VSS
12
AIN7
AIN5
VDDS_SRAM_MPU_BB
VDDS
VDDSHV6
VSS
11
AIN1
AIN3
XXXX
XXXX
VDDSHV6
VDD_CORE
10
AIN6
CAP_VDD_SRAM_CORE
VDDS_SRAM_CORE_BG
VSS
VSS
XXXX
9
VREFP
VREFN
XXXX
XXXX
VSS
VDD_CORE
8
AIN2
AIN0
AIN4
VSSA_ADC
VSS
VSS
7
RTC_KALDO_ENn
RTC_PWRONRSTn
PMIC_POWER_EN
VDDA_ADC
VSS
VSS
6
RTC_XTALIN
RESERVED
VDDS_RTC
CAP_VDD_RTC
XXXX
VSS
5
RTC_XTALOUT
EXT_WAKEUP
VDDS_PLL_DDR
XXXX
DDR_A4
XXXX
4
DDR_WEn
DDR_BA2
XXXX
XXXX
XXXX
DDR_A12
3
DDR_BA0
DDR_A3
DDR_A8
XXXX
DDR_A15
DDR_A0
2
DDR_A5
DDR_A9
DDR_CK
DDR_A7
DDR_A10
DDR_RASn
1
VSS
DDR_A6
DDR_CKn
DDR_A2
DDR_BA1
DDR_CASn
Pin map section location
Left
Terminal Configuration and Functions
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ZCE Pin Map [Section Middle - Top View]
G
H
J
K
L
M
19
MMC0_CLK
MMC0_DAT3
MII1_COL
MII1_RX_ER
MII1_RX_DV
MII1_RX_CLK
18
MMC0_DAT0
MMC0_DAT2
MII1_CRS
RMII1_REF_CLK
MII1_TXD0
MII1_TXD1
17
MMC0_CMD
MMC0_DAT1
XXXX
MII1_TX_EN
XXXX
MII1_TXD3
16
USB0_DRVVBUS
VDDS_PLL_MPU
XXXX
VDD_CORE
XXXX
VDDS
15
VDDSHV4
VDDSHV4
VSS
VDD_CORE
VSS
VDDSHV5
14
XXXX
VDDSHV4
VSS
XXXX
VSS
VDDSHV5
13
XXXX
VDD_CORE
VDD_CORE
XXXX
VDD_CORE
VDD_CORE
12
VSS
VDD_CORE
VDD_CORE
VSS
VDD_CORE
VDD_CORE
11
VDD_CORE
VSS
VSS
VSS
VSS
VSS
10
XXXX
VSS
XXXX
XXXX
XXXX
VSS
9
VDD_CORE
VSS
VSS
VSS
VSS
VSS
8
VSS
VDD_CORE
VDD_CORE
VSS
VDD_CORE
VDD_CORE
7
XXXX
VDD_CORE
VDD_CORE
XXXX
VDD_CORE
VDD_CORE
6
XXXX
VDDS_DDR
VSS
XXXX
VSS
VDDS_DDR
5
VDDS_DDR
VDDS_DDR
VSS
VDDS_DDR
VSS
VDDS_DDR
4
DDR_A11
DDR_VREF
XXXX
VDDS_DDR
XXXX
DDR_D11
3
DDR_CKE
DDR_A14
XXXX
DDR_DQM1
XXXX
DDR_D10
2
DDR_RESETn
DDR_CSn0
DDR_A1
DDR_D8
DDR_DQSn1
DDR_D12
1
DDR_ODT
DDR_A13
DDR_VTP
DDR_D9
DDR_DQS1
DDR_D13
Pin map section location
Middle
12
Terminal Configuration and Functions
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SPRS717J – OCTOBER 2011 – REVISED APRIL 2016
ZCE Pin Map [Section Right - Top View]
N
P
R
T
U
V
W
19
MII1_TX_CLK
MII1_RXD1
MDC
USB0_VBUS
USB0_DP
USB0_ID
VSS
18
MII1_TXD2
MII1_RXD0
VDDA3P3V_USB0
USB0_CE
USB0_DM
GPMC_BEn1
GPMC_WPn
17
MII1_RXD3
MDIO
VDDA1P8V_USB0
XXXX
GPMC_CSn3
GPMC_AD15
GPMC_AD14
16
MII1_RXD2
VSSA_USB
XXXX
XXXX
XXXX
GPMC_CLK
GPMC_AD9
15
VDDSHV5
XXXX
GPMC_WAIT0
XXXX
GPMC_CSn2
GPMC_AD8
GPMC_AD7
14
XXXX
VSS
XXXX
VDDS
GPMC_AD6
GPMC_CSn1
GPMC_AD5
13
XXXX
VSS
VDDSHV1
GPMC_AD13
GPMC_AD12
GPMC_AD4
GPMC_AD3
12
VSS
VSS
VDDSHV1
GPMC_AD10
GPMC_AD11
GPMC_AD2
XTALOUT
11
VDD_CORE
VDD_CORE
VDDSHV1
XXXX
XXXX
VSS_OSC
XTALIN
10
XXXX
XXXX
VSS
VSS
VDDS_OSC
GPMC_ADVn_ALE
GPMC_AD0
9
VDD_CORE
VDD_CORE
VDDSHV1
XXXX
XXXX
GPMC_AD1
GPMC_OEn_REn
8
VSS
VSS
VDDSHV1
VDDS_PLL_CORE_LCD
GPMC_WEn
GPMC_BEn0_CLE
GPMC_CSn0
7
XXXX
VSS
VDDSHV6
LCD_HSYNC
LCD_VSYNC
LCD_DATA15
LCD_AC_BIAS_EN
6
XXXX
VDDSHV6
XXXX
VDDS
LCD_DATA13
LCD_DATA12
LCD_DATA14
5
VDDS_DDR
XXXX
VPP
XXXX
LCD_DATA10
LCD_DATA11
LCD_PCLK
4
DDR_D0
DDR_D1
XXXX
XXXX
XXXX
LCD_DATA8
LCD_DATA9
3
DDR_DQM0
DDR_D4
DDR_D7
XXXX
LCD_DATA7
LCD_DATA6
LCD_DATA5
2
DDR_D14
DDR_D2
DDR_DQSn0
DDR_D6
LCD_DATA1
LCD_DATA3
LCD_DATA4
1
DDR_D15
DDR_D3
DDR_DQS0
DDR_D5
LCD_DATA0
LCD_DATA2
VSS
Pin map section location
Right
Terminal Configuration and Functions
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4.1.2
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ZCZ Package Pin Maps (Top View)
The pin maps that follow show the pin assignments on the ZCZ package in three sections (left, middle,
and right).
14
Terminal Configuration and Functions
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SPRS717J – OCTOBER 2011 – REVISED APRIL 2016
ZCZ Pin Map [Section Left - Top View]
A
B
C
D
E
F
18
VSS
EXTINTn
ECAP0_IN_PWM0_OUT
UART1_CTSn
UART0_CTSn
MMC0_DAT2
17
SPI0_SCLK
SPI0_D0
I2C0_SDA
UART1_RTSn
UART0_RTSn
MMC0_DAT3
16
SPI0_CS0
SPI0_D1
I2C0_SCL
UART1_RXD
UART0_TXD
USB0_DRVVBUS
15
XDMA_EVENT_INTR0
PWRONRSTn
SPI0_CS1
UART1_TXD
UART0_RXD
USB1_DRVVBUS
14
MCASP0_AHCLKX
EMU1
EMU0
XDMA_EVENT_INTR1
VDDS
VDDSHV6
13
MCASP0_ACLKX
MCASP0_FSX
MCASP0_FSR
MCASP0_AXR1
VDDSHV6
VDD_MPU
12
TCK
MCASP0_ACLKR
MCASP0_AHCLKR
MCASP0_AXR0
VDDSHV6
VDD_MPU
11
TDO
TDI
TMS
CAP_VDD_SRAM_MPU
VDDSHV6
VDD_MPU
10
WARMRSTn
TRSTn
CAP_VBB_MPU
VDDS_SRAM_MPU_BB
VDDSHV6
VDD_MPU
9
VREFN
VREFP
AIN7
CAP_VDD_SRAM_CORE
VDDS_SRAM_CORE_BG
VDDS
8
AIN6
AIN5
AIN4
VDDA_ADC
VSSA_ADC
VSS
7
AIN3
AIN2
AIN1
VDDS_RTC
VDDS_PLL_DDR
VDD_CORE
6
RTC_XTALIN
AIN0
PMIC_POWER_EN
CAP_VDD_RTC
VDDS
VDD_CORE
5
VSS_RTC
RTC_PWRONRSTn
EXT_WAKEUP
DDR_A6
VDDS_DDR
VDDS_DDR
4
RTC_XTALOUT
RTC_KALDO_ENn
DDR_BA0
DDR_A8
DDR_A2
DDR_A10
3
RESERVED
DDR_BA2
DDR_A3
DDR_A15
DDR_A12
DDR_A0
2
VDD_MPU_MON
DDR_WEn
DDR_A4
DDR_CK
DDR_A7
DDR_A11
1
VSS
DDR_A5
DDR_A9
DDR_CKn
DDR_BA1
DDR_CASn
Pin map section location
Left
Terminal Configuration and Functions
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ZCZ Pin Map [Section Middle - Top View]
G
H
J
K
L
M
18
MMC0_CMD
RMII1_REF_CLK
MII1_TXD3
MII1_TX_CLK
MII1_RX_CLK
MDC
17
MMC0_CLK
MII1_CRS
MII1_RX_DV
MII1_TXD0
MII1_RXD3
MDIO
16
MMC0_DAT0
MII1_COL
MII1_TX_EN
MII1_TXD1
MII1_RXD2
MII1_RXD0
15
MMC0_DAT1
VDDS_PLL_MPU
MII1_RX_ER
MII1_TXD2
MII1_RXD1
USB0_CE
14
VDDSHV6
VDDSHV4
VDDSHV4
VDDSHV5
VDDSHV5
VSSA_USB
13
VDD_MPU
VDD_MPU
VDD_MPU
VDDS
VSS
VDD_CORE
12
VSS
VSS
VDD_CORE
VDD_CORE
VSS
VSS
11
VSS
VDD_CORE
VSS
VSS
VSS
VDD_CORE
10
VDD_CORE
VSS
VSS
VSS
VSS
VSS
9
VSS
VSS
VSS
VSS
VDD_CORE
VSS
8
VSS
VSS
VSS
VDD_CORE
VDD_CORE
VSS
7
VDD_CORE
VSS
VSS
VSS
VDD_CORE
VSS
6
VDD_CORE
VSS
VSS
VDD_CORE
VDD_CORE
VSS
5
VDDS_DDR
VDDS_DDR
VDDS_DDR
VDDS_DDR
VDDS_DDR
VPP
4
DDR_RASn
DDR_A14
DDR_VREF
DDR_D12
DDR_D14
DDR_D1
3
DDR_CKE
DDR_A13
DDR_VTP
DDR_D11
DDR_D13
DDR_D0
2
DDR_RESETn
DDR_CSn0
DDR_DQM1
DDR_D10
DDR_DQSn1
DDR_DQM0
1
DDR_ODT
DDR_A1
DDR_D8
DDR_D9
DDR_DQS1
DDR_D15
Pin map section location
Middle
16
Terminal Configuration and Functions
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ZCZ Pin Map [Section Right - Top View]
N
P
R
T
U
V
18
USB0_DM
USB1_CE
USB1_DM
USB1_VBUS
GPMC_BEn1
VSS
17
USB0_DP
USB1_ID
USB1_DP
GPMC_WAIT0
GPMC_WPn
GPMC_A11
16
VDDA1P8V_USB0
USB0_ID
VDDA1P8V_USB1
GPMC_A10
GPMC_A9
GPMC_A8
15
VDDA3P3V_USB0
USB0_VBUS
VDDA3P3V_USB1
GPMC_A7
GPMC_A6
GPMC_A5
14
VSSA_USB
VDDS
GPMC_A4
GPMC_A3
GPMC_A2
GPMC_A1
13
VDD_CORE
VDDSHV3
GPMC_A0
GPMC_CSn3
GPMC_AD15
GPMC_AD14
12
VDD_CORE
VDDSHV3
GPMC_AD13
GPMC_AD12
GPMC_AD11
GPMC_CLK
11
VSS
VDDSHV2
VDDS_OSC
GPMC_AD10
XTALOUT
VSS_OSC
10
VSS
VDDSHV2
VDDS_PLL_CORE_LCD
GPMC_AD9
GPMC_AD8
XTALIN
9
VDD_CORE
VDDS
GPMC_AD6
GPMC_AD7
GPMC_CSn1
GPMC_CSn2
8
VDD_CORE
VDDSHV1
GPMC_AD2
GPMC_AD3
GPMC_AD4
GPMC_AD5
7
VSS
VDDSHV1
GPMC_ADVn_ALE
GPMC_OEn_REn
GPMC_AD0
GPMC_AD1
6
VDDS
VDDSHV6
LCD_AC_BIAS_EN
GPMC_BEn0_CLE
GPMC_WEn
GPMC_CSn0
5
VDDSHV6
VDDSHV6
LCD_HSYNC
LCD_DATA15
LCD_VSYNC
LCD_PCLK
4
DDR_D5
DDR_D7
LCD_DATA3
LCD_DATA7
LCD_DATA11
LCD_DATA14
3
DDR_D4
DDR_D6
LCD_DATA2
LCD_DATA6
LCD_DATA10
LCD_DATA13
2
DDR_D3
DDR_DQSn0
LCD_DATA1
LCD_DATA5
LCD_DATA9
LCD_DATA12
1
DDR_D2
DDR_DQS0
LCD_DATA0
LCD_DATA4
LCD_DATA8
VSS
Pin map section location
Right
Terminal Configuration and Functions
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4.2
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Pin Attributes
The AM335x and AMIC110 Sitara Processors Technical Reference Manual and this document may
reference internal signal names when discussing peripheral input and output signals because many of the
AM335x package terminals can be multiplexed to one of several peripheral signals. The following table
has a Pin Name column that lists all device terminal names and a Signal Name column that lists all
internal signal names multiplexed to each terminal which provides a cross reference of internal signal
names to terminal names. This table also identifies other important terminal characteristics.
(1) BALL NUMBER: Package ball numbers associated with each signals.
(2) PIN NAME: The name of the package pin or terminal.
Note: The table does not take into account subsystem terminal multiplexing options.
(3) SIGNAL NAME: The signal name for that pin in the mode being used.
(4) MODE: Multiplexing mode number.
a. Mode 0 is the primary mode; this means that when mode 0 is set, the function mapped on the terminal corresponds to the name of
the terminal. There is always a function mapped on the primary mode. Notice that primary mode is not necessarily the default
mode.
b.
Note: The default mode is the mode at the release of the reset; also see the RESET REL. MODE column.
Modes 1 to 7 are possible modes for alternate functions. On each terminal, some modes are effectively used for alternate
functions, while some modes are not used and do not correspond to a functional configuration.
(5) TYPE: Signal direction
– I = Input
– O = Output
– I/O = Input and Output
– D = Open drain
– DS = Differential
– A = Analog
– PWR = Power
– GND = Ground
Note: In the safe_mode, the buffer is configured in high-impedance.
(6) BALL RESET STATE: State of the terminal while the active low PWRONRSTn terminal is low.
– 0: The buffer drives VOL (pulldown or pullup resistor not activated)
0(PD): The buffer drives VOL with an active pulldown resistor
– 1: The buffer drives VOH (pulldown or pullup resistor not activated)
1(PU): The buffer drives VOH with an active pullup resistor
– Z: High-impedance
– L: High-impedance with an active pulldown resistor
– H : High-impedance with an active pullup resistor
(7) BALL RESET REL. STATE: State of the terminal after the active low PWRONRSTn terminal transitions from low to high.
– 0: The buffer drives VOL (pulldown or pullup resistor not activated)
0(PD): The buffer drives VOL with an active pulldown resistor
– 1: The buffer drives VOH (pulldown or pullup resistor not activated)
1(PU): The buffer drives VOH with an active pullup resistor
– Z: High-impedance.
– L: High-impedance with an active pulldown resistor
– H : High-impedance with an active pullup resistor
(8) RESET REL. MODE: The mode is automatically configured after the active low PWRONRSTn terminal transitions from low to high.
(9) POWER: The voltage supply that powers the I/O buffers of the terminal.
(10) HYS: Indicates if the input buffer is with hysteresis.
(11) BUFFER STRENGTH: Drive strength of the associated output buffer.
(12) PULLUP OR PULLDOWN TYPE: Denotes the presence of an internal pullup or pulldown resistor. Pullup and pulldown resistors can
be enabled or disabled via software.
(13) I/O CELL: I/O cell information.
Note: Configuring two terminals to the same input signal is not supported as it can yield unexpected results. This can be easily prevented
with the proper software configuration.
18
Terminal Configuration and Functions
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Table 4-2. Pin Attributes (ZCE and ZCZ Packages)
ZCE BALL
ZCZ BALL
NUMBER [1] NUMBER [1]
PIN NAME [2]
SIGNAL NAME [3]
MODE [4]
BALL RESET
TYPE BALL RESET
RESET REL. ZCE POWER / HYS
REL. STATE
[5]
STATE [6](25)
MODE [8] ZCZ POWER [9] [10]
[7]
BUFFER
STRENGTH
(mA) [11]
PULLUP
/DOWN TYPE
[12]
I/O CELL [13]
B8
B6
AIN0
AIN0
0
A
(22)
Z
Z
0
VDDA_ADC /
VDDA_ADC
NA
25
NA
Analog
A11
C7
AIN1
AIN1
0
A
(21)
Z
Z
0
VDDA_ADC /
VDDA_ADC
NA
25
NA
Analog
A8
B7
AIN2
AIN2
0
A
(21)
Z
Z
0
VDDA_ADC /
VDDA_ADC
NA
25
NA
Analog
B11
A7
AIN3
AIN3
0
A
(20)
Z
Z
0
VDDA_ADC /
VDDA_ADC
NA
25
NA
Analog
C8
C8
AIN4
AIN4
0
A
(20)
Z
Z
0
VDDA_ADC /
VDDA_ADC
NA
25
NA
Analog
B12
B8
AIN5
AIN5
0
A
Z
Z
0
VDDA_ADC /
VDDA_ADC
NA
NA
NA
Analog
A10
A8
AIN6
AIN6
0
A
Z
Z
0
VDDA_ADC /
VDDA_ADC
NA
NA
NA
Analog
A12
C9
AIN7
AIN7
0
A
Z
Z
0
VDDA_ADC /
VDDA_ADC
NA
NA
NA
Analog
C13
C10
CAP_VBB_MPU
CAP_VBB_MPU
NA
A
D6
D6
CAP_VDD_RTC
CAP_VDD_RTC
NA
A
B10
D9
CAP_VDD_SRAM_CORE
CAP_VDD_SRAM_CORE
NA
A
D13
D11
CAP_VDD_SRAM_MPU
CAP_VDD_SRAM_MPU
NA
A
F3
F3
DDR_A0
ddr_a0
0
O
H
1
0
VDDS_DDR /
VDDS_DDR
NA
8
PU/PD
LVCMOS/SSTL/
HSTL
J2
H1
DDR_A1
ddr_a1
0
O
H
1
0
VDDS_DDR /
VDDS_DDR
NA
8
PU/PD
LVCMOS/SSTL/
HSTL
D1
E4
DDR_A2
ddr_a2
0
O
H
1
0
VDDS_DDR /
VDDS_DDR
NA
8
PU/PD
LVCMOS/SSTL/
HSTL
B3
C3
DDR_A3
ddr_a3
0
O
H
1
0
VDDS_DDR /
VDDS_DDR
NA
8
PU/PD
LVCMOS/SSTL/
HSTL
E5
C2
DDR_A4
ddr_a4
0
O
H
1
0
VDDS_DDR /
VDDS_DDR
NA
8
PU/PD
LVCMOS/SSTL/
HSTL
A2
B1
DDR_A5
ddr_a5
0
O
H
1
0
VDDS_DDR /
VDDS_DDR
NA
8
PU/PD
LVCMOS/SSTL/
HSTL
B1
D5
DDR_A6
ddr_a6
0
O
H
1
0
VDDS_DDR /
VDDS_DDR
NA
8
PU/PD
LVCMOS/SSTL/
HSTL
D2
E2
DDR_A7
ddr_a7
0
O
H
1
0
VDDS_DDR /
VDDS_DDR
NA
8
PU/PD
LVCMOS/SSTL/
HSTL
C3
D4
DDR_A8
ddr_a8
0
O
H
1
0
VDDS_DDR /
VDDS_DDR
NA
8
PU/PD
LVCMOS/SSTL/
HSTL
B2
C1
DDR_A9
ddr_a9
0
O
H
1
0
VDDS_DDR /
VDDS_DDR
NA
8
PU/PD
LVCMOS/SSTL/
HSTL
E2
F4
DDR_A10
ddr_a10
0
O
H
1
0
VDDS_DDR /
VDDS_DDR
NA
8
PU/PD
LVCMOS/SSTL/
HSTL
G4
F2
DDR_A11
ddr_a11
0
O
H
1
0
VDDS_DDR /
VDDS_DDR
NA
8
PU/PD
LVCMOS/SSTL/
HSTL
Terminal Configuration and Functions
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Table 4-2. Pin Attributes (ZCE and ZCZ Packages) (continued)
ZCE BALL
ZCZ BALL
NUMBER [1] NUMBER [1]
PIN NAME [2]
SIGNAL NAME [3]
MODE [4]
BALL RESET
TYPE BALL RESET
RESET REL. ZCE POWER / HYS
REL. STATE
[5]
STATE [6](25)
MODE [8] ZCZ POWER [9] [10]
[7]
BUFFER
STRENGTH
(mA) [11]
PULLUP
/DOWN TYPE
[12]
I/O CELL [13]
F4
E3
DDR_A12
ddr_a12
0
O
H
1
0
VDDS_DDR /
VDDS_DDR
NA
8
PU/PD
LVCMOS/SSTL/
HSTL
H1
H3
DDR_A13
ddr_a13
0
O
H
1
0
VDDS_DDR /
VDDS_DDR
NA
8
PU/PD
LVCMOS/SSTL/
HSTL
H3
H4
DDR_A14
ddr_a14
0
O
H
1
0
VDDS_DDR /
VDDS_DDR
NA
8
PU/PD
LVCMOS/SSTL/
HSTL
E3
D3
DDR_A15
ddr_a15
0
O
H
1
0
VDDS_DDR /
VDDS_DDR
NA
8
PU/PD
LVCMOS/SSTL/
HSTL
A3
C4
DDR_BA0
ddr_ba0
0
O
H
1
0
VDDS_DDR /
VDDS_DDR
NA
8
PU/PD
LVCMOS/SSTL/
HSTL
E1
E1
DDR_BA1
ddr_ba1
0
O
H
1
0
VDDS_DDR /
VDDS_DDR
NA
8
PU/PD
LVCMOS/SSTL/
HSTL
B4
B3
DDR_BA2
ddr_ba2
0
O
H
1
0
VDDS_DDR /
VDDS_DDR
NA
8
PU/PD
LVCMOS/SSTL/
HSTL
F1
F1
DDR_CASn
ddr_casn
0
O
H
1
0
VDDS_DDR /
VDDS_DDR
NA
8
PU/PD
LVCMOS/SSTL/
HSTL
C2
D2
DDR_CK
ddr_ck
0
O
L
0
0
VDDS_DDR /
VDDS_DDR
NA
8
PU/PD
LVCMOS/SSTL/
HSTL
G3
G3
DDR_CKE
ddr_cke
0
O
L
0
0
VDDS_DDR /
VDDS_DDR
NA
8
PU/PD
LVCMOS/SSTL/
HSTL
C1
D1
DDR_CKn
ddr_nck
0
O
H
1
0
VDDS_DDR /
VDDS_DDR
NA
8
PU/PD
LVCMOS/SSTL/
HSTL
H2
H2
DDR_CSn0
ddr_csn0
0
O
H
1
0
VDDS_DDR /
VDDS_DDR
NA
8
PU/PD
LVCMOS/SSTL/
HSTL
N4
M3
DDR_D0
ddr_d0
0
I/O
L
Z
0
VDDS_DDR /
VDDS_DDR
Yes
8
PU/PD
LVCMOS/SSTL/
HSTL
P4
M4
DDR_D1
ddr_d1
0
I/O
L
Z
0
VDDS_DDR /
VDDS_DDR
Yes
8
PU/PD
LVCMOS/SSTL/
HSTL
P2
N1
DDR_D2
ddr_d2
0
I/O
L
Z
0
VDDS_DDR /
VDDS_DDR
Yes
8
PU/PD
LVCMOS/SSTL/
HSTL
P1
N2
DDR_D3
ddr_d3
0
I/O
L
Z
0
VDDS_DDR /
VDDS_DDR
Yes
8
PU/PD
LVCMOS/SSTL/
HSTL
P3
N3
DDR_D4
ddr_d4
0
I/O
L
Z
0
VDDS_DDR /
VDDS_DDR
Yes
8
PU/PD
LVCMOS/SSTL/
HSTL
T1
N4
DDR_D5
ddr_d5
0
I/O
L
Z
0
VDDS_DDR /
VDDS_DDR
Yes
8
PU/PD
LVCMOS/SSTL/
HSTL
T2
P3
DDR_D6
ddr_d6
0
I/O
L
Z
0
VDDS_DDR /
VDDS_DDR
Yes
8
PU/PD
LVCMOS/SSTL/
HSTL
R3
P4
DDR_D7
ddr_d7
0
I/O
L
Z
0
VDDS_DDR /
VDDS_DDR
Yes
8
PU/PD
LVCMOS/SSTL/
HSTL
K2
J1
DDR_D8
ddr_d8
0
I/O
L
Z
0
VDDS_DDR /
VDDS_DDR
Yes
8
PU/PD
LVCMOS/SSTL/
HSTL
K1
K1
DDR_D9
ddr_d9
0
I/O
L
Z
0
VDDS_DDR /
VDDS_DDR
Yes
8
PU/PD
LVCMOS/SSTL/
HSTL
M3
K2
DDR_D10
ddr_d10
0
I/O
L
Z
0
VDDS_DDR /
VDDS_DDR
Yes
8
PU/PD
LVCMOS/SSTL/
HSTL
20
Terminal Configuration and Functions
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SPRS717J – OCTOBER 2011 – REVISED APRIL 2016
Table 4-2. Pin Attributes (ZCE and ZCZ Packages) (continued)
ZCE BALL
ZCZ BALL
NUMBER [1] NUMBER [1]
PIN NAME [2]
SIGNAL NAME [3]
MODE [4]
BALL RESET
TYPE BALL RESET
RESET REL. ZCE POWER / HYS
REL. STATE
[5]
STATE [6](25)
MODE [8] ZCZ POWER [9] [10]
[7]
BUFFER
STRENGTH
(mA) [11]
PULLUP
/DOWN TYPE
[12]
I/O CELL [13]
M4
K3
DDR_D11
ddr_d11
0
I/O
L
Z
0
VDDS_DDR /
VDDS_DDR
Yes
8
PU/PD
LVCMOS/SSTL/
HSTL
M2
K4
DDR_D12
ddr_d12
0
I/O
L
Z
0
VDDS_DDR /
VDDS_DDR
Yes
8
PU/PD
LVCMOS/SSTL/
HSTL
M1
L3
DDR_D13
ddr_d13
0
I/O
L
Z
0
VDDS_DDR /
VDDS_DDR
Yes
8
PU/PD
LVCMOS/SSTL/
HSTL
N2
L4
DDR_D14
ddr_d14
0
I/O
L
Z
0
VDDS_DDR /
VDDS_DDR
Yes
8
PU/PD
LVCMOS/SSTL/
HSTL
N1
M1
DDR_D15
ddr_d15
0
I/O
L
Z
0
VDDS_DDR /
VDDS_DDR
Yes
8
PU/PD
LVCMOS/SSTL/
HSTL
N3
M2
DDR_DQM0
ddr_dqm0
0
O
H
1
0
VDDS_DDR /
VDDS_DDR
NA
8
PU/PD
LVCMOS/SSTL/
HSTL
K3
J2
DDR_DQM1
ddr_dqm1
0
O
H
1
0
VDDS_DDR /
VDDS_DDR
NA
8
PU/PD
LVCMOS/SSTL/
HSTL
R1
P1
DDR_DQS0
ddr_dqs0
0
I/O
L
Z
0
VDDS_DDR /
VDDS_DDR
Yes
8
PU/PD
LVCMOS/SSTL/
HSTL
L1
L1
DDR_DQS1
ddr_dqs1
0
I/O
L
Z
0
VDDS_DDR /
VDDS_DDR
Yes
8
PU/PD
LVCMOS/SSTL/
HSTL
R2
P2
DDR_DQSn0
ddr_dqsn0
0
I/O
H
Z
0
VDDS_DDR /
VDDS_DDR
Yes
8
PU/PD
LVCMOS/SSTL/
HSTL
L2
L2
DDR_DQSn1
ddr_dqsn1
0
I/O
H
Z
0
VDDS_DDR /
VDDS_DDR
Yes
8
PU/PD
LVCMOS/SSTL/
HSTL
G1
G1
DDR_ODT
ddr_odt
0
O
L
0
0
VDDS_DDR /
VDDS_DDR
NA
8
PU/PD
LVCMOS/SSTL/
HSTL
F2
G4
DDR_RASn
ddr_rasn
0
O
H
1
0
VDDS_DDR /
VDDS_DDR
NA
8
PU/PD
LVCMOS/SSTL/
HSTL
G2
G2
DDR_RESETn
ddr_resetn
0
O
L
0
0
VDDS_DDR /
VDDS_DDR
NA
8
PU/PD
LVCMOS/SSTL/
HSTL
H4
J4
DDR_VREF
ddr_vref
0
A
NA
NA
NA
VDDS_DDR /
VDDS_DDR
NA
NA
NA
Analog
J1
J3
DDR_VTP
ddr_vtp
0
I (19)
NA
NA
NA
VDDS_DDR /
VDDS_DDR
NA
NA
NA
Analog
A4
B2
DDR_WEn
ddr_wen
0
O
H
1
0
VDDS_DDR /
VDDS_DDR
NA
8
PU/PD
LVCMOS/SSTL/
HSTL
E18
C18
ECAP0_IN_PWM0_OUT
eCAP0_in_PWM0_out
0
I/O
Z
L
7
4
PU/PD
LVCMOS
1
O
VDDSHV6 /
VDDSHV6
Yes
uart3_txd
spi1_cs1
2
I/O
pr1_ecap0_ecap_capin_apwm_o
3
I/O
spi1_sclk
4
I/O
mmc0_sdwp
5
I
xdma_event_intr2
6
I
gpio0_7
7
I/O
EMU0
0
I/O
H
H
0
6
PU/PD
LVCMOS
7
I/O
VDDSHV6 /
VDDSHV6
Yes
gpio3_7
A15
C14
EMU0
(18)
Terminal Configuration and Functions
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SPRS717J – OCTOBER 2011 – REVISED APRIL 2016
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Table 4-2. Pin Attributes (ZCE and ZCZ Packages) (continued)
ZCE BALL
ZCZ BALL
NUMBER [1] NUMBER [1]
D14
B14
PIN NAME [2]
EMU1
SIGNAL NAME [3]
MODE [4]
BALL RESET
TYPE BALL RESET
RESET REL. ZCE POWER / HYS
REL. STATE
[5]
STATE [6](25)
MODE [8] ZCZ POWER [9] [10]
[7]
EMU1
0
I/O
gpio3_8
7
I/O
BUFFER
STRENGTH
(mA) [11]
PULLUP
/DOWN TYPE
[12]
I/O CELL [13]
H
H
0
VDDSHV6 /
VDDSHV6
Yes
6
PU/PD
LVCMOS
C17
B18
EXTINTn
nNMI
0
I
Z
H
0
VDDSHV6 /
VDDSHV6
Yes
NA
PU/PD
LVCMOS
B5
C5
EXT_WAKEUP
EXT_WAKEUP
0
I
L
Z
0
VDDS_RTC /
VDDS_RTC
Yes
NA
NA
LVCMOS
NA
R13
GPMC_A0
gpmc_a0
0
O
L
L
7
NA / VDDSHV3 Yes
6
PU/PD
LVCMOS
gmii2_txen
1
O
rgmii2_tctl
2
O
rmii2_txen
3
O
gpmc_a16
4
O
pr1_mii_mt1_clk
5
I
ehrpwm1_tripzone_input
6
I
gpio1_16
7
I/O
gpmc_a1
0
O
L
L
7
NA / VDDSHV3 Yes
6
PU/PD
LVCMOS
gmii2_rxdv
1
I
rgmii2_rctl
2
I
mmc2_dat0
3
I/O
gpmc_a17
4
O
pr1_mii1_txd3
5
O
ehrpwm0_synco
6
O
gpio1_17
7
I/O
gpmc_a2
0
O
L
L
7
NA / VDDSHV3 Yes
6
PU/PD
LVCMOS
gmii2_txd3
1
O
rgmii2_td3
2
O
mmc2_dat1
3
I/O
gpmc_a18
4
O
pr1_mii1_txd2
5
O
ehrpwm1A
6
O
gpio1_18
7
I/O
gpmc_a3
0
O
L
L
7
NA / VDDSHV3 Yes
6
PU/PD
LVCMOS
gmii2_txd2
1
O
rgmii2_td2
2
O
mmc2_dat2
3
I/O
gpmc_a19
4
O
pr1_mii1_txd1
5
O
ehrpwm1B
6
O
gpio1_19
7
I/O
NA
NA
NA
22
V14
U14
T14
GPMC_A1
GPMC_A2
GPMC_A3
Terminal Configuration and Functions
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SPRS717J – OCTOBER 2011 – REVISED APRIL 2016
Table 4-2. Pin Attributes (ZCE and ZCZ Packages) (continued)
ZCE BALL
ZCZ BALL
NUMBER [1] NUMBER [1]
NA
NA
NA
NA
R14
V15
U15
T15
PIN NAME [2]
GPMC_A4
GPMC_A5
GPMC_A6
GPMC_A7
SIGNAL NAME [3]
MODE [4]
BALL RESET
TYPE BALL RESET
RESET REL. ZCE POWER / HYS
REL. STATE
[5]
STATE [6](25)
MODE [8] ZCZ POWER [9] [10]
[7]
gpmc_a4
0
O
gmii2_txd1
1
O
rgmii2_td1
2
O
rmii2_txd1
3
O
gpmc_a20
4
O
pr1_mii1_txd0
5
O
eQEP1A_in
6
I
gpio1_20
7
I/O
gpmc_a5
0
O
gmii2_txd0
1
O
rgmii2_td0
2
O
rmii2_txd0
3
O
gpmc_a21
4
O
pr1_mii1_rxd3
5
I
eQEP1B_in
6
I
gpio1_21
7
I/O
gpmc_a6
0
O
gmii2_txclk
1
I
rgmii2_tclk
2
O
mmc2_dat4
3
I/O
gpmc_a22
4
O
pr1_mii1_rxd2
5
I
eQEP1_index
6
I/O
gpio1_22
7
I/O
gpmc_a7
0
O
gmii2_rxclk
1
I
rgmii2_rclk
2
I
mmc2_dat5
3
I/O
gpmc_a23
4
O
pr1_mii1_rxd1
5
I
eQEP1_strobe
6
I/O
gpio1_23
7
I/O
BUFFER
STRENGTH
(mA) [11]
PULLUP
/DOWN TYPE
[12]
I/O CELL [13]
L
L
7
NA / VDDSHV3 Yes
6
PU/PD
LVCMOS
L
L
7
NA / VDDSHV3 Yes
6
PU/PD
LVCMOS
L
L
7
NA / VDDSHV3 Yes
6
PU/PD
LVCMOS
L
L
7
NA / VDDSHV3 Yes
6
PU/PD
LVCMOS
Terminal Configuration and Functions
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SPRS717J – OCTOBER 2011 – REVISED APRIL 2016
www.ti.com
Table 4-2. Pin Attributes (ZCE and ZCZ Packages) (continued)
ZCE BALL
ZCZ BALL
NUMBER [1] NUMBER [1]
NA
NA
NA
NA
W10
V9
24
V16
U16
T16
V17
U7
V7
PIN NAME [2]
GPMC_A8
GPMC_A9
(10)
GPMC_A10
GPMC_A11
GPMC_AD0
GPMC_AD1
SIGNAL NAME [3]
MODE [4]
BALL RESET
TYPE BALL RESET
RESET REL. ZCE POWER / HYS
REL. STATE
[5]
STATE [6](25)
MODE [8] ZCZ POWER [9] [10]
[7]
gpmc_a8
0
O
gmii2_rxd3
1
I
rgmii2_rd3
2
I
mmc2_dat6
3
I/O
gpmc_a24
4
O
pr1_mii1_rxd0
5
I
mcasp0_aclkx
6
I/O
gpio1_24
7
I/O
gpmc_a9
0
O
gmii2_rxd2
1
I
rgmii2_rd2
2
I
mmc2_dat7 / rmii2_crs_dv
3
I/O
gpmc_a25
4
O
pr1_mii_mr1_clk
5
I
mcasp0_fsx
6
I/O
gpio1_25
7
I/O
gpmc_a10
0
O
gmii2_rxd1
1
I
rgmii2_rd1
2
I
rmii2_rxd1
3
I
gpmc_a26
4
O
pr1_mii1_rxdv
5
I
mcasp0_axr0
6
I/O
gpio1_26
7
I/O
gpmc_a11
0
O
gmii2_rxd0
1
I
rgmii2_rd0
2
I
rmii2_rxd0
3
I
gpmc_a27
4
O
pr1_mii1_rxer
5
I
mcasp0_axr1
6
I/O
gpio1_27
7
I/O
gpmc_ad0
0
I/O
mmc1_dat0
1
I/O
gpio1_0
7
I/O
gpmc_ad1
0
I/O
mmc1_dat1
1
I/O
gpio1_1
7
I/O
BUFFER
STRENGTH
(mA) [11]
PULLUP
/DOWN TYPE
[12]
I/O CELL [13]
L
L
7
NA / VDDSHV3 Yes
6
PU/PD
LVCMOS
L
L
7
NA / VDDSHV3 Yes
6
PU/PD
LVCMOS
L
L
7
NA / VDDSHV3 Yes
6
PU/PD
LVCMOS
L
L
7
NA / VDDSHV3 Yes
6
PU/PD
LVCMOS
L
L
7
VDDSHV1 /
VDDSHV1
Yes
6
PU/PD
LVCMOS
L
L
7
VDDSHV1 /
VDDSHV1
Yes
6
PU/PD
LVCMOS
Terminal Configuration and Functions
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SPRS717J – OCTOBER 2011 – REVISED APRIL 2016
Table 4-2. Pin Attributes (ZCE and ZCZ Packages) (continued)
ZCE BALL
ZCZ BALL
NUMBER [1] NUMBER [1]
V12
W13
V13
W14
U14
W15
V15
W16
R8
T8
U8
V8
R9
T9
U10
T10
PIN NAME [2]
GPMC_AD2
GPMC_AD3
GPMC_AD4
GPMC_AD5
GPMC_AD6
GPMC_AD7
GPMC_AD8
GPMC_AD9
SIGNAL NAME [3]
MODE [4]
BALL RESET
TYPE BALL RESET
RESET REL. ZCE POWER / HYS
REL. STATE
[5]
STATE [6](25)
MODE [8] ZCZ POWER [9] [10]
[7]
gpmc_ad2
0
I/O
mmc1_dat2
1
I/O
gpio1_2
7
I/O
gpmc_ad3
0
I/O
mmc1_dat3
1
I/O
gpio1_3
7
I/O
gpmc_ad4
0
I/O
mmc1_dat4
1
I/O
gpio1_4
7
I/O
gpmc_ad5
0
I/O
mmc1_dat5
1
I/O
gpio1_5
7
I/O
gpmc_ad6
0
I/O
mmc1_dat6
1
I/O
gpio1_6
7
I/O
gpmc_ad7
0
I/O
mmc1_dat7
1
I/O
gpio1_7
7
I/O
gpmc_ad8
0
I/O
lcd_data23
1
O
mmc1_dat0
2
I/O
mmc2_dat4
3
I/O
ehrpwm2A
4
O
pr1_mii_mt0_clk
5
I
gpio0_22
7
I/O
gpmc_ad9
0
I/O
lcd_data22
1
O
mmc1_dat1
2
I/O
mmc2_dat5
3
I/O
ehrpwm2B
4
O
pr1_mii0_col
5
I
gpio0_23
7
I/O
BUFFER
STRENGTH
(mA) [11]
PULLUP
/DOWN TYPE
[12]
I/O CELL [13]
L
L
7
VDDSHV1 /
VDDSHV1
Yes
6
PU/PD
LVCMOS
L
L
7
VDDSHV1 /
VDDSHV1
Yes
6
PU/PD
LVCMOS
L
L
7
VDDSHV1 /
VDDSHV1
Yes
6
PU/PD
LVCMOS
L
L
7
VDDSHV1 /
VDDSHV1
Yes
6
PU/PD
LVCMOS
L
L
7
VDDSHV1 /
VDDSHV1
Yes
6
PU/PD
LVCMOS
L
L
7
VDDSHV1 /
VDDSHV1
Yes
6
PU/PD
LVCMOS
L
L
7
VDDSHV1 /
VDDSHV2
Yes
6
PU/PD
LVCMOS
L
L
7
VDDSHV1 /
VDDSHV2
Yes
6
PU/PD
LVCMOS
Terminal Configuration and Functions
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Table 4-2. Pin Attributes (ZCE and ZCZ Packages) (continued)
ZCE BALL
ZCZ BALL
NUMBER [1] NUMBER [1]
T12
U12
U13
T13
W17
26
T11
U12
T12
R12
V13
PIN NAME [2]
GPMC_AD10
GPMC_AD11
GPMC_AD12
GPMC_AD13
GPMC_AD14
SIGNAL NAME [3]
MODE [4]
BALL RESET
TYPE BALL RESET
RESET REL. ZCE POWER / HYS
REL. STATE
[5]
STATE [6](25)
MODE [8] ZCZ POWER [9] [10]
[7]
gpmc_ad10
0
I/O
lcd_data21
1
O
mmc1_dat2
2
I/O
mmc2_dat6
3
I/O
ehrpwm2_tripzone_input
4
I
pr1_mii0_txen
5
O
gpio0_26
7
I/O
gpmc_ad11
0
I/O
lcd_data20
1
O
mmc1_dat3
2
I/O
mmc2_dat7
3
I/O
ehrpwm0_synco
4
O
pr1_mii0_txd3
5
O
gpio0_27
7
I/O
gpmc_ad12
0
I/O
lcd_data19
1
O
mmc1_dat4
2
I/O
mmc2_dat0
3
I/O
eQEP2A_in
4
I
pr1_mii0_txd2
5
O
pr1_pru0_pru_r30_14
6
O
gpio1_12
7
I/O
gpmc_ad13
0
I/O
lcd_data18
1
O
mmc1_dat5
2
I/O
mmc2_dat1
3
I/O
eQEP2B_in
4
I
pr1_mii0_txd1
5
O
pr1_pru0_pru_r30_15
6
O
gpio1_13
7
I/O
gpmc_ad14
0
I/O
lcd_data17
1
O
mmc1_dat6
2
I/O
mmc2_dat2
3
I/O
eQEP2_index
4
I/O
pr1_mii0_txd0
5
O
pr1_pru0_pru_r31_14
6
I
gpio1_14
7
I/O
BUFFER
STRENGTH
(mA) [11]
PULLUP
/DOWN TYPE
[12]
I/O CELL [13]
L
L
7
VDDSHV1 /
VDDSHV2
Yes
6
PU/PD
LVCMOS
L
L
7
VDDSHV1 /
VDDSHV2
Yes
6
PU/PD
LVCMOS
L
L
7
VDDSHV1 /
VDDSHV2
Yes
6
PU/PD
LVCMOS
L
L
7
VDDSHV1 /
VDDSHV2
Yes
6
PU/PD
LVCMOS
L
L
7
VDDSHV1 /
VDDSHV2
Yes
6
PU/PD
LVCMOS
Terminal Configuration and Functions
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SPRS717J – OCTOBER 2011 – REVISED APRIL 2016
Table 4-2. Pin Attributes (ZCE and ZCZ Packages) (continued)
ZCE BALL
ZCZ BALL
NUMBER [1] NUMBER [1]
V17
V10
V8
V18
V16
W8
U13
R7
T6
U18
V12
V6
PIN NAME [2]
GPMC_AD15
GPMC_ADVn_ALE
GPMC_BEn0_CLE
GPMC_BEn1
GPMC_CLK
GPMC_CSn0
SIGNAL NAME [3]
MODE [4]
BALL RESET
TYPE BALL RESET
RESET REL. ZCE POWER / HYS
REL. STATE
[5]
STATE [6](25)
MODE [8] ZCZ POWER [9] [10]
[7]
gpmc_ad15
0
I/O
lcd_data16
1
O
mmc1_dat7
2
I/O
mmc2_dat3
3
I/O
eQEP2_strobe
4
I/O
pr1_ecap0_ecap_capin_apwm_o
5
I/O
pr1_pru0_pru_r31_15
6
I
gpio1_15
7
I/O
gpmc_advn_ale
0
O
timer4
2
I/O
gpio2_2
7
I/O
gpmc_be0n_cle
0
O
timer5
2
I/O
gpio2_5
7
I/O
gpmc_be1n
0
O
gmii2_col
1
I
gpmc_csn6
2
O
mmc2_dat3
3
I/O
gpmc_dir
4
O
pr1_mii1_rxlink
5
I
mcasp0_aclkr
6
I/O
gpio1_28
7
I/O
gpmc_clk
0
I/O
lcd_memory_clk
1
O
gpmc_wait1
2
I
mmc2_clk
3
I/O
pr1_mii1_crs
4
I
pr1_mdio_mdclk
5
O
mcasp0_fsr
6
I/O
gpio2_1
7
I/O
gpmc_csn0
0
O
gpio1_29
7
I/O
BUFFER
STRENGTH
(mA) [11]
PULLUP
/DOWN TYPE
[12]
I/O CELL [13]
L
L
7
VDDSHV1 /
VDDSHV2
Yes
6
PU/PD
LVCMOS
H
H
7
VDDSHV1 /
VDDSHV1
Yes
6
PU/PD
LVCMOS
H
H
7
VDDSHV1 /
VDDSHV1
Yes
6
PU/PD
LVCMOS
H
H
7
VDDSHV1 /
VDDSHV3
Yes
6
PU/PD
LVCMOS
L
L
7
VDDSHV1 /
VDDSHV2
Yes
6
PU/PD
LVCMOS
H
H
7
VDDSHV1 /
VDDSHV1
Yes
6
PU/PD
LVCMOS
Terminal Configuration and Functions
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Table 4-2. Pin Attributes (ZCE and ZCZ Packages) (continued)
ZCE BALL
ZCZ BALL
NUMBER [1] NUMBER [1]
V14
U15
U17
W9
R15
U8
28
U9
V9
T13
T7
T17
U6
PIN NAME [2]
GPMC_CSn1
GPMC_CSn2
GPMC_CSn3 (6)
GPMC_OEn_REn
GPMC_WAIT0
GPMC_WEn
SIGNAL NAME [3]
MODE [4]
BALL RESET
TYPE BALL RESET
RESET REL. ZCE POWER / HYS
REL. STATE
[5]
STATE [6](25)
MODE [8] ZCZ POWER [9] [10]
[7]
gpmc_csn1
0
O
gpmc_clk
1
I/O
mmc1_clk
2
I/O
pr1_edio_data_in6
3
I
pr1_edio_data_out6
4
O
pr1_pru1_pru_r30_12
5
O
pr1_pru1_pru_r31_12
6
I
gpio1_30
7
I/O
gpmc_csn2
0
O
gpmc_be1n
1
O
mmc1_cmd
2
I/O
pr1_edio_data_in7
3
I
pr1_edio_data_out7
4
O
pr1_pru1_pru_r30_13
5
O
pr1_pru1_pru_r31_13
6
I
gpio1_31
7
I/O
gpmc_csn3
0
O
gpmc_a3
1
O
rmii2_crs_dv
2
I
mmc2_cmd
3
I/O
pr1_mii0_crs
4
I
pr1_mdio_data
5
I/O
EMU4
6
I/O
gpio2_0
7
I/O
gpmc_oen_ren
0
O
timer7
2
I/O
gpio2_3
7
I/O
gpmc_wait0
0
I
gmii2_crs
1
I
gpmc_csn4
2
O
rmii2_crs_dv
3
I
mmc1_sdcd
4
I
pr1_mii1_col
5
I
uart4_rxd
6
I
gpio0_30
7
I/O
gpmc_wen
0
O
timer6
2
I/O
gpio2_4
7
I/O
BUFFER
STRENGTH
(mA) [11]
PULLUP
/DOWN TYPE
[12]
I/O CELL [13]
H
H
7
VDDSHV1 /
VDDSHV1
Yes
6
PU/PD
LVCMOS
H
H
7
VDDSHV1 /
VDDSHV1
Yes
6
PU/PD
LVCMOS
H
H
7
VDDSHV1 /
VDDSHV2
Yes
6
PU/PD
LVCMOS
H
H
7
VDDSHV1 /
VDDSHV1
Yes
6
PU/PD
LVCMOS
H
H
7
VDDSHV1 /
VDDSHV3
Yes
6
PU/PD
LVCMOS
H
H
7
VDDSHV1 /
VDDSHV1
Yes
6
PU/PD
LVCMOS
Terminal Configuration and Functions
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SPRS717J – OCTOBER 2011 – REVISED APRIL 2016
Table 4-2. Pin Attributes (ZCE and ZCZ Packages) (continued)
ZCE BALL
ZCZ BALL
NUMBER [1] NUMBER [1]
W18
C18
B19
W7
U1
U17
C17
C16
R6
R1
PIN NAME [2]
GPMC_WPn
I2C0_SDA
I2C0_SCL
LCD_AC_BIAS_EN
LCD_DATA0
(5)
SIGNAL NAME [3]
MODE [4]
BALL RESET
TYPE BALL RESET
RESET REL. ZCE POWER / HYS
REL. STATE
[5]
STATE [6](25)
MODE [8] ZCZ POWER [9] [10]
[7]
gpmc_wpn
0
O
gmii2_rxerr
1
I
gpmc_csn5
2
O
rmii2_rxerr
3
I
mmc2_sdcd
4
I
pr1_mii1_txen
5
O
uart4_txd
6
O
gpio0_31
7
I/O
I2C0_SDA
0
I/OD
timer4
1
I/O
uart2_ctsn
2
I
eCAP2_in_PWM2_out
3
I/O
gpio3_5
7
I/O
I2C0_SCL
0
I/OD
timer7
1
I/O
uart2_rtsn
2
O
eCAP1_in_PWM1_out
3
I/O
gpio3_6
7
I/O
lcd_ac_bias_en
0
O
gpmc_a11
1
O
pr1_mii1_crs
2
I
pr1_edio_data_in5
3
I
pr1_edio_data_out5
4
O
pr1_pru1_pru_r30_11
5
O
pr1_pru1_pru_r31_11
6
I
gpio2_25
7
I/O
lcd_data0
0
I/O
gpmc_a0
1
O
pr1_mii_mt0_clk
2
I
ehrpwm2A
3
O
pr1_pru1_pru_r30_0
5
O
pr1_pru1_pru_r31_0
6
I
gpio2_6
7
I/O
BUFFER
STRENGTH
(mA) [11]
PULLUP
/DOWN TYPE
[12]
I/O CELL [13]
H
H
7
VDDSHV1 /
VDDSHV3
Yes
6
PU/PD
LVCMOS
Z
H
7
VDDSHV6 /
VDDSHV6
Yes
4
PU/PD
LVCMOS
Z
H
7
VDDSHV6 /
VDDSHV6
Yes
4
PU/PD
LVCMOS
Z
L
7
VDDSHV6 /
VDDSHV6
Yes
6
PU/PD
LVCMOS
Z
Z
7
VDDSHV6 /
VDDSHV6
Yes
6
PU/PD
LVCMOS
Terminal Configuration and Functions
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Table 4-2. Pin Attributes (ZCE and ZCZ Packages) (continued)
ZCE BALL
ZCZ BALL
NUMBER [1] NUMBER [1]
U2
V1
V2
W2
W3
30
R2
R3
R4
T1
T2
PIN NAME [2]
LCD_DATA1
LCD_DATA2
LCD_DATA3
LCD_DATA4
LCD_DATA5
(5)
(5)
(5)
(5)
(5)
SIGNAL NAME [3]
MODE [4]
BALL RESET
TYPE BALL RESET
RESET REL. ZCE POWER / HYS
REL. STATE
[5]
STATE [6](25)
MODE [8] ZCZ POWER [9] [10]
[7]
lcd_data1
0
I/O
gpmc_a1
1
O
pr1_mii0_txen
2
O
ehrpwm2B
3
O
pr1_pru1_pru_r30_1
5
O
pr1_pru1_pru_r31_1
6
I
gpio2_7
7
I/O
lcd_data2
0
I/O
gpmc_a2
1
O
pr1_mii0_txd3
2
O
ehrpwm2_tripzone_input
3
I
pr1_pru1_pru_r30_2
5
O
pr1_pru1_pru_r31_2
6
I
gpio2_8
7
I/O
lcd_data3
0
I/O
gpmc_a3
1
O
pr1_mii0_txd2
2
O
ehrpwm0_synco
3
O
pr1_pru1_pru_r30_3
5
O
pr1_pru1_pru_r31_3
6
I
gpio2_9
7
I/O
lcd_data4
0
I/O
gpmc_a4
1
O
pr1_mii0_txd1
2
O
eQEP2A_in
3
I
pr1_pru1_pru_r30_4
5
O
pr1_pru1_pru_r31_4
6
I
gpio2_10
7
I/O
lcd_data5
0
I/O
gpmc_a5
1
O
pr1_mii0_txd0
2
O
eQEP2B_in
3
I
pr1_pru1_pru_r30_5
5
O
pr1_pru1_pru_r31_5
6
I
gpio2_11
7
I/O
BUFFER
STRENGTH
(mA) [11]
PULLUP
/DOWN TYPE
[12]
I/O CELL [13]
Z
Z
7
VDDSHV6 /
VDDSHV6
Yes
6
PU/PD
LVCMOS
Z
Z
7
VDDSHV6 /
VDDSHV6
Yes
6
PU/PD
LVCMOS
Z
Z
7
VDDSHV6 /
VDDSHV6
Yes
6
PU/PD
LVCMOS
Z
Z
7
VDDSHV6 /
VDDSHV6
Yes
6
PU/PD
LVCMOS
Z
Z
7
VDDSHV6 /
VDDSHV6
Yes
6
PU/PD
LVCMOS
Terminal Configuration and Functions
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SPRS717J – OCTOBER 2011 – REVISED APRIL 2016
Table 4-2. Pin Attributes (ZCE and ZCZ Packages) (continued)
ZCE BALL
ZCZ BALL
NUMBER [1] NUMBER [1]
V3
U3
V4
W4
T3
T4
U1
U2
PIN NAME [2]
LCD_DATA6
LCD_DATA7
LCD_DATA8
LCD_DATA9
(5)
(5)
(5)
(5)
SIGNAL NAME [3]
MODE [4]
BALL RESET
TYPE BALL RESET
RESET REL. ZCE POWER / HYS
REL. STATE
[5]
STATE [6](25)
MODE [8] ZCZ POWER [9] [10]
[7]
lcd_data6
0
I/O
gpmc_a6
1
O
pr1_edio_data_in6
2
I
eQEP2_index
3
I/O
pr1_edio_data_out6
4
O
pr1_pru1_pru_r30_6
5
O
pr1_pru1_pru_r31_6
6
I
gpio2_12
7
I/O
lcd_data7
0
I/O
gpmc_a7
1
O
pr1_edio_data_in7
2
I
eQEP2_strobe
3
I/O
pr1_edio_data_out7
4
O
pr1_pru1_pru_r30_7
5
O
pr1_pru1_pru_r31_7
6
I
gpio2_13
7
I/O
lcd_data8
0
I/O
gpmc_a12
1
O
ehrpwm1_tripzone_input
2
I
mcasp0_aclkx
3
I/O
uart5_txd
4
O
pr1_mii0_rxd3
5
I
uart2_ctsn
6
I
gpio2_14
7
I/O
lcd_data9
0
I/O
gpmc_a13
1
O
ehrpwm0_synco
2
O
mcasp0_fsx
3
I/O
uart5_rxd
4
I
pr1_mii0_rxd2
5
I
uart2_rtsn
6
O
gpio2_15
7
I/O
BUFFER
STRENGTH
(mA) [11]
PULLUP
/DOWN TYPE
[12]
I/O CELL [13]
Z
Z
7
VDDSHV6 /
VDDSHV6
Yes
6
PU/PD
LVCMOS
Z
Z
7
VDDSHV6 /
VDDSHV6
Yes
6
PU/PD
LVCMOS
Z
Z
7
VDDSHV6 /
VDDSHV6
Yes
6
PU/PD
LVCMOS
Z
Z
7
VDDSHV6 /
VDDSHV6
Yes
6
PU/PD
LVCMOS
Terminal Configuration and Functions
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Table 4-2. Pin Attributes (ZCE and ZCZ Packages) (continued)
ZCE BALL
ZCZ BALL
NUMBER [1] NUMBER [1]
U5
V5
V6
U6
32
U3
U4
V2
V3
PIN NAME [2]
LCD_DATA10 (5)
LCD_DATA11 (5)
LCD_DATA12 (5)
LCD_DATA13 (5)
SIGNAL NAME [3]
MODE [4]
BALL RESET
TYPE BALL RESET
RESET REL. ZCE POWER / HYS
REL. STATE
[5]
STATE [6](25)
MODE [8] ZCZ POWER [9] [10]
[7]
lcd_data10
0
I/O
gpmc_a14
1
O
ehrpwm1A
2
O
mcasp0_axr0
3
I/O
pr1_mii0_rxd1
5
I
uart3_ctsn
6
I
gpio2_16
7
I/O
lcd_data11
0
I/O
gpmc_a15
1
O
ehrpwm1B
2
O
mcasp0_ahclkr
3
I/O
mcasp0_axr2
4
I/O
pr1_mii0_rxd0
5
I
uart3_rtsn
6
O
gpio2_17
7
I/O
lcd_data12
0
I/O
gpmc_a16
1
O
eQEP1A_in
2
I
mcasp0_aclkr
3
I/O
mcasp0_axr2
4
I/O
pr1_mii0_rxlink
5
I
uart4_ctsn
6
I
gpio0_8
7
I/O
lcd_data13
0
I/O
gpmc_a17
1
O
eQEP1B_in
2
I
mcasp0_fsr
3
I/O
mcasp0_axr3
4
I/O
pr1_mii0_rxer
5
I
uart4_rtsn
6
O
gpio0_9
7
I/O
BUFFER
STRENGTH
(mA) [11]
PULLUP
/DOWN TYPE
[12]
I/O CELL [13]
Z
Z
7
VDDSHV6 /
VDDSHV6
Yes
6
PU/PD
LVCMOS
Z
Z
7
VDDSHV6 /
VDDSHV6
Yes
6
PU/PD
LVCMOS
Z
Z
7
VDDSHV6 /
VDDSHV6
Yes
6
PU/PD
LVCMOS
Z
Z
7
VDDSHV6 /
VDDSHV6
Yes
6
PU/PD
LVCMOS
Terminal Configuration and Functions
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SPRS717J – OCTOBER 2011 – REVISED APRIL 2016
Table 4-2. Pin Attributes (ZCE and ZCZ Packages) (continued)
ZCE BALL
ZCZ BALL
NUMBER [1] NUMBER [1]
W6
V7
T7
W5
V4
T5
R5
V5
PIN NAME [2]
LCD_DATA14 (5)
LCD_DATA15 (5)
LCD_HSYNC (7)
LCD_PCLK
SIGNAL NAME [3]
MODE [4]
BALL RESET
TYPE BALL RESET
RESET REL. ZCE POWER / HYS
REL. STATE
[5]
STATE [6](25)
MODE [8] ZCZ POWER [9] [10]
[7]
lcd_data14
0
I/O
gpmc_a18
1
O
eQEP1_index
2
I/O
mcasp0_axr1
3
I/O
uart5_rxd
4
I
pr1_mii_mr0_clk
5
I
uart5_ctsn
6
I
gpio0_10
7
I/O
lcd_data15
0
I/O
gpmc_a19
1
O
eQEP1_strobe
2
I/O
mcasp0_ahclkx
3
I/O
mcasp0_axr3
4
I/O
pr1_mii0_rxdv
5
I
uart5_rtsn
6
O
gpio0_11
7
I/O
lcd_hsync
0
O
gpmc_a9
1
O
gpmc_a2
2
O
pr1_edio_data_in3
3
I
pr1_edio_data_out3
4
O
pr1_pru1_pru_r30_9
5
O
pr1_pru1_pru_r31_9
6
I
gpio2_23
7
I/O
lcd_pclk
0
O
gpmc_a10
1
O
pr1_mii0_crs
2
I
pr1_edio_data_in4
3
I
pr1_edio_data_out4
4
O
pr1_pru1_pru_r30_10
5
O
pr1_pru1_pru_r31_10
6
I
gpio2_24
7
I/O
BUFFER
STRENGTH
(mA) [11]
PULLUP
/DOWN TYPE
[12]
I/O CELL [13]
Z
Z
7
VDDSHV6 /
VDDSHV6
Yes
6
PU/PD
LVCMOS
Z
Z
7
VDDSHV6 /
VDDSHV6
Yes
6
PU/PD
LVCMOS
Z
L
7
VDDSHV6 /
VDDSHV6
Yes
6
PU/PD
LVCMOS
Z
L
7
VDDSHV6 /
VDDSHV6
Yes
6
PU/PD
LVCMOS
Terminal Configuration and Functions
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Table 4-2. Pin Attributes (ZCE and ZCZ Packages) (continued)
ZCE BALL
ZCZ BALL
NUMBER [1] NUMBER [1]
U7
NA
NA
NA
34
U5
B13
B12
C12
PIN NAME [2]
LCD_VSYNC
(7)
MCASP0_FSX
MCASP0_ACLKR
MCASP0_AHCLKR
SIGNAL NAME [3]
MODE [4]
BALL RESET
TYPE BALL RESET
RESET REL. ZCE POWER / HYS
REL. STATE
[5]
STATE [6](25)
MODE [8] ZCZ POWER [9] [10]
[7]
lcd_vsync
0
O
gpmc_a8
1
O
gpmc_a1
2
O
pr1_edio_data_in2
3
I
pr1_edio_data_out2
4
O
pr1_pru1_pru_r30_8
5
O
pr1_pru1_pru_r31_8
6
I
gpio2_22
7
I/O
mcasp0_fsx
0
I/O
ehrpwm0B
1
O
spi1_d0
3
I/O
mmc1_sdcd
4
I
pr1_pru0_pru_r30_1
5
O
pr1_pru0_pru_r31_1
6
I
gpio3_15
7
I/O
mcasp0_aclkr
0
I/O
eQEP0A_in
1
I
mcasp0_axr2
2
I/O
mcasp1_aclkx
3
I/O
mmc0_sdwp
4
I
pr1_pru0_pru_r30_4
5
O
pr1_pru0_pru_r31_4
6
I
gpio3_18
7
I/O
mcasp0_ahclkr
0
I/O
ehrpwm0_synci
1
I
mcasp0_axr2
2
I/O
spi1_cs0
3
I/O
eCAP2_in_PWM2_out
4
I/O
pr1_pru0_pru_r30_3
5
O
pr1_pru0_pru_r31_3
6
I
gpio3_17
7
I/O
BUFFER
STRENGTH
(mA) [11]
PULLUP
/DOWN TYPE
[12]
I/O CELL [13]
Z
L
7
VDDSHV6 /
VDDSHV6
Yes
6
PU/PD
LVCMOS
L
L
7
NA / VDDSHV6 Yes
6
PU/PD
LVCMOS
L
L
7
NA / VDDSHV6 Yes
6
PU/PD
LVCMOS
L
L
7
NA / VDDSHV6 Yes
6
PU/PD
LVCMOS
Terminal Configuration and Functions
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SPRS717J – OCTOBER 2011 – REVISED APRIL 2016
Table 4-2. Pin Attributes (ZCE and ZCZ Packages) (continued)
ZCE BALL
ZCZ BALL
NUMBER [1] NUMBER [1]
NA
NA
NA
NA
NA
A14
A13
C13
D12
D13
PIN NAME [2]
MCASP0_AHCLKX
MCASP0_ACLKX
MCASP0_FSR
MCASP0_AXR0
MCASP0_AXR1
SIGNAL NAME [3]
MODE [4]
BALL RESET
TYPE BALL RESET
RESET REL. ZCE POWER / HYS
REL. STATE
[5]
STATE [6](25)
MODE [8] ZCZ POWER [9] [10]
[7]
mcasp0_ahclkx
0
I/O
eQEP0_strobe
1
I/O
mcasp0_axr3
2
I/O
mcasp1_axr1
3
I/O
EMU4
4
I/O
pr1_pru0_pru_r30_7
5
O
pr1_pru0_pru_r31_7
6
I
gpio3_21
7
I/O
mcasp0_aclkx
0
I/O
ehrpwm0A
1
O
spi1_sclk
3
I/O
mmc0_sdcd
4
I
pr1_pru0_pru_r30_0
5
O
pr1_pru0_pru_r31_0
6
I
gpio3_14
7
I/O
mcasp0_fsr
0
I/O
eQEP0B_in
1
I
mcasp0_axr3
2
I/O
mcasp1_fsx
3
I/O
EMU2
4
I/O
pr1_pru0_pru_r30_5
5
O
pr1_pru0_pru_r31_5
6
I
gpio3_19
7
I/O
mcasp0_axr0
0
I/O
ehrpwm0_tripzone_input
1
I
spi1_d1
3
I/O
mmc2_sdcd
4
I
pr1_pru0_pru_r30_2
5
O
pr1_pru0_pru_r31_2
6
I
gpio3_16
7
I/O
mcasp0_axr1
0
I/O
eQEP0_index
1
I/O
mcasp1_axr0
3
I/O
EMU3
4
I/O
pr1_pru0_pru_r30_6
5
O
pr1_pru0_pru_r31_6
6
I
gpio3_20
7
I/O
BUFFER
STRENGTH
(mA) [11]
PULLUP
/DOWN TYPE
[12]
I/O CELL [13]
L
L
7
NA / VDDSHV6 Yes
6
PU/PD
LVCMOS
L
L
7
NA / VDDSHV6 Yes
6
PU/PD
LVCMOS
L
L
7
NA / VDDSHV6 Yes
6
PU/PD
LVCMOS
L
L
7
NA / VDDSHV6 Yes
6
PU/PD
LVCMOS
L
L
7
NA / VDDSHV6 Yes
6
PU/PD
LVCMOS
Terminal Configuration and Functions
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Table 4-2. Pin Attributes (ZCE and ZCZ Packages) (continued)
ZCE BALL
ZCZ BALL
NUMBER [1] NUMBER [1]
R19
P17
L19
K17
36
M18
M17
J17
J16
PIN NAME [2]
MDC
MDIO
MII1_RX_DV
MII1_TX_EN
SIGNAL NAME [3]
MODE [4]
BALL RESET
TYPE BALL RESET
RESET REL. ZCE POWER / HYS
REL. STATE
[5]
STATE [6](25)
MODE [8] ZCZ POWER [9] [10]
[7]
mdio_clk
0
O
timer5
1
I/O
uart5_txd
2
O
uart3_rtsn
3
O
mmc0_sdwp
4
I
mmc1_clk
5
I/O
mmc2_clk
6
I/O
gpio0_1
7
I/O
mdio_data
0
I/O
timer6
1
I/O
uart5_rxd
2
I
uart3_ctsn
3
I
mmc0_sdcd
4
I
mmc1_cmd
5
I/O
mmc2_cmd
6
I/O
gpio0_0
7
I/O
gmii1_rxdv
0
I
lcd_memory_clk
1
O
rgmii1_rctl
2
I
uart5_txd
3
O
mcasp1_aclkx
4
I/O
mmc2_dat0
5
I/O
mcasp0_aclkr
6
I/O
gpio3_4
7
I/O
gmii1_txen
0
O
rmii1_txen
1
O
rgmii1_tctl
2
O
timer4
3
I/O
mcasp1_axr0
4
I/O
eQEP0_index
5
I/O
mmc2_cmd
6
I/O
gpio3_3
7
I/O
BUFFER
STRENGTH
(mA) [11]
PULLUP
/DOWN TYPE
[12]
I/O CELL [13]
H
H
7
VDDSHV5 /
VDDSHV5
Yes
6
PU/PD
LVCMOS
H
H
7
VDDSHV5 /
VDDSHV5
Yes
6
PU/PD
LVCMOS
L
L
7
VDDSHV5 /
VDDSHV5
Yes
6
PU/PD
LVCMOS
L
L
7
VDDSHV5 /
VDDSHV5
Yes
6
PU/PD
LVCMOS
Terminal Configuration and Functions
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SPRS717J – OCTOBER 2011 – REVISED APRIL 2016
Table 4-2. Pin Attributes (ZCE and ZCZ Packages) (continued)
ZCE BALL
ZCZ BALL
NUMBER [1] NUMBER [1]
K19
M19
N19
J19
J15
L18
K18
H16
PIN NAME [2]
MII1_RX_ER
MII1_RX_CLK
MII1_TX_CLK
MII1_COL
SIGNAL NAME [3]
MODE [4]
BALL RESET
TYPE BALL RESET
RESET REL. ZCE POWER / HYS
REL. STATE
[5]
STATE [6](25)
MODE [8] ZCZ POWER [9] [10]
[7]
gmii1_rxerr
0
I
rmii1_rxerr
1
I
spi1_d1
2
I/O
I2C1_SCL
3
I/OD
mcasp1_fsx
4
I/O
uart5_rtsn
5
O
uart2_txd
6
O
gpio3_2
7
I/O
gmii1_rxclk
0
I
uart2_txd
1
O
rgmii1_rclk
2
I
mmc0_dat6
3
I/O
mmc1_dat1
4
I/O
uart1_dsrn
5
I
mcasp0_fsx
6
I/O
gpio3_10
7
I/O
gmii1_txclk
0
I
uart2_rxd
1
I
rgmii1_tclk
2
O
mmc0_dat7
3
I/O
mmc1_dat0
4
I/O
uart1_dcdn
5
I
mcasp0_aclkx
6
I/O
gpio3_9
7
I/O
gmii1_col
0
I
rmii2_refclk
1
I/O
spi1_sclk
2
I/O
uart5_rxd
3
I
mcasp1_axr2
4
I/O
mmc2_dat3
5
I/O
mcasp0_axr2
6
I/O
gpio3_0
7
I/O
BUFFER
STRENGTH
(mA) [11]
PULLUP
/DOWN TYPE
[12]
I/O CELL [13]
L
L
7
VDDSHV5 /
VDDSHV5
Yes
6
PU/PD
LVCMOS
L
L
7
VDDSHV5 /
VDDSHV5
Yes
6
PU/PD
LVCMOS
L
L
7
VDDSHV5 /
VDDSHV5
Yes
6
PU/PD
LVCMOS
L
L
7
VDDSHV5 /
VDDSHV5
Yes
6
PU/PD
LVCMOS
Terminal Configuration and Functions
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SPRS717J – OCTOBER 2011 – REVISED APRIL 2016
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Table 4-2. Pin Attributes (ZCE and ZCZ Packages) (continued)
ZCE BALL
ZCZ BALL
NUMBER [1] NUMBER [1]
J18
P18
P19
N16
38
H17
M16
L15
L16
PIN NAME [2]
MII1_CRS
MII1_RXD0
MII1_RXD1
MII1_RXD2
SIGNAL NAME [3]
MODE [4]
BALL RESET
TYPE BALL RESET
RESET REL. ZCE POWER / HYS
REL. STATE
[5]
STATE [6](25)
MODE [8] ZCZ POWER [9] [10]
[7]
gmii1_crs
0
I
rmii1_crs_dv
1
I
spi1_d0
2
I/O
I2C1_SDA
3
I/OD
mcasp1_aclkx
4
I/O
uart5_ctsn
5
I
uart2_rxd
6
I
gpio3_1
7
I/O
gmii1_rxd0
0
I
rmii1_rxd0
1
I
rgmii1_rd0
2
I
mcasp1_ahclkx
3
I/O
mcasp1_ahclkr
4
I/O
mcasp1_aclkr
5
I/O
mcasp0_axr3
6
I/O
gpio2_21
7
I/O
gmii1_rxd1
0
I
rmii1_rxd1
1
I
rgmii1_rd1
2
I
mcasp1_axr3
3
I/O
mcasp1_fsr
4
I/O
eQEP0_strobe
5
I/O
mmc2_clk
6
I/O
gpio2_20
7
I/O
gmii1_rxd2
0
I
uart3_txd
1
O
rgmii1_rd2
2
I
mmc0_dat4
3
I/O
mmc1_dat3
4
I/O
uart1_rin
5
I
mcasp0_axr1
6
I/O
gpio2_19
7
I/O
BUFFER
STRENGTH
(mA) [11]
PULLUP
/DOWN TYPE
[12]
I/O CELL [13]
L
L
7
VDDSHV5 /
VDDSHV5
Yes
6
PU/PD
LVCMOS
L
L
7
VDDSHV5 /
VDDSHV5
Yes
6
PU/PD
LVCMOS
L
L
7
VDDSHV5 /
VDDSHV5
Yes
6
PU/PD
LVCMOS
L
L
7
VDDSHV5 /
VDDSHV5
Yes
6
PU/PD
LVCMOS
Terminal Configuration and Functions
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SPRS717J – OCTOBER 2011 – REVISED APRIL 2016
Table 4-2. Pin Attributes (ZCE and ZCZ Packages) (continued)
ZCE BALL
ZCZ BALL
NUMBER [1] NUMBER [1]
N17
L18
M18
N18
L17
K17
K16
K15
PIN NAME [2]
MII1_RXD3
MII1_TXD0
MII1_TXD1
MII1_TXD2
SIGNAL NAME [3]
MODE [4]
BALL RESET
TYPE BALL RESET
RESET REL. ZCE POWER / HYS
REL. STATE
[5]
STATE [6](25)
MODE [8] ZCZ POWER [9] [10]
[7]
gmii1_rxd3
0
I
uart3_rxd
1
I
rgmii1_rd3
2
I
mmc0_dat5
3
I/O
mmc1_dat2
4
I/O
uart1_dtrn
5
O
mcasp0_axr0
6
I/O
gpio2_18
7
I/O
gmii1_txd0
0
O
rmii1_txd0
1
O
rgmii1_td0
2
O
mcasp1_axr2
3
I/O
mcasp1_aclkr
4
I/O
eQEP0B_in
5
I
mmc1_clk
6
I/O
gpio0_28
7
I/O
gmii1_txd1
0
O
rmii1_txd1
1
O
rgmii1_td1
2
O
mcasp1_fsr
3
I/O
mcasp1_axr1
4
I/O
eQEP0A_in
5
I
mmc1_cmd
6
I/O
gpio0_21
7
I/O
gmii1_txd2
0
O
dcan0_rx
1
I
rgmii1_td2
2
O
uart4_txd
3
O
mcasp1_axr0
4
I/O
mmc2_dat2
5
I/O
mcasp0_ahclkx
6
I/O
gpio0_17
7
I/O
BUFFER
STRENGTH
(mA) [11]
PULLUP
/DOWN TYPE
[12]
I/O CELL [13]
L
L
7
VDDSHV5 /
VDDSHV5
Yes
6
PU/PD
LVCMOS
L
L
7
VDDSHV5 /
VDDSHV5
Yes
6
PU/PD
LVCMOS
L
L
7
VDDSHV5 /
VDDSHV5
Yes
6
PU/PD
LVCMOS
L
L
7
VDDSHV5 /
VDDSHV5
Yes
6
PU/PD
LVCMOS
Terminal Configuration and Functions
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Table 4-2. Pin Attributes (ZCE and ZCZ Packages) (continued)
ZCE BALL
ZCZ BALL
NUMBER [1] NUMBER [1]
M17
G17
G19
G18
40
J18
G18
G17
G16
PIN NAME [2]
MII1_TXD3
MMC0_CMD
MMC0_CLK
MMC0_DAT0
SIGNAL NAME [3]
MODE [4]
BALL RESET
TYPE BALL RESET
RESET REL. ZCE POWER / HYS
REL. STATE
[5]
STATE [6](25)
MODE [8] ZCZ POWER [9] [10]
[7]
gmii1_txd3
0
O
dcan0_tx
1
O
rgmii1_td3
2
O
uart4_rxd
3
I
mcasp1_fsx
4
I/O
mmc2_dat1
5
I/O
mcasp0_fsr
6
I/O
gpio0_16
7
I/O
mmc0_cmd
0
I/O
gpmc_a25
1
O
uart3_rtsn
2
O
uart2_txd
3
O
dcan1_rx
4
I
pr1_pru0_pru_r30_13
5
O
pr1_pru0_pru_r31_13
6
I
gpio2_31
7
I/O
mmc0_clk
0
I/O
gpmc_a24
1
O
uart3_ctsn
2
I
uart2_rxd
3
I
dcan1_tx
4
O
pr1_pru0_pru_r30_12
5
O
pr1_pru0_pru_r31_12
6
I
gpio2_30
7
I/O
mmc0_dat0
0
I/O
gpmc_a23
1
O
uart5_rtsn
2
O
uart3_txd
3
O
uart1_rin
4
I
pr1_pru0_pru_r30_11
5
O
pr1_pru0_pru_r31_11
6
I
gpio2_29
7
I/O
BUFFER
STRENGTH
(mA) [11]
PULLUP
/DOWN TYPE
[12]
I/O CELL [13]
L
L
7
VDDSHV5 /
VDDSHV5
Yes
6
PU/PD
LVCMOS
H
H
7
VDDSHV4 /
VDDSHV4
Yes
6
PU/PD
LVCMOS
H
H
7
VDDSHV4 /
VDDSHV4
Yes
6
PU/PD
LVCMOS
H
H
7
VDDSHV4 /
VDDSHV4
Yes
6
PU/PD
LVCMOS
Terminal Configuration and Functions
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SPRS717J – OCTOBER 2011 – REVISED APRIL 2016
Table 4-2. Pin Attributes (ZCE and ZCZ Packages) (continued)
ZCE BALL
ZCZ BALL
NUMBER [1] NUMBER [1]
H17
H18
H19
G15
F18
F17
PIN NAME [2]
MMC0_DAT1
MMC0_DAT2
MMC0_DAT3
SIGNAL NAME [3]
MODE [4]
BALL RESET
TYPE BALL RESET
RESET REL. ZCE POWER / HYS
REL. STATE
[5]
STATE [6](25)
MODE [8] ZCZ POWER [9] [10]
[7]
mmc0_dat1
0
I/O
gpmc_a22
1
O
uart5_ctsn
2
I
uart3_rxd
3
I
uart1_dtrn
4
O
pr1_pru0_pru_r30_10
5
O
pr1_pru0_pru_r31_10
6
I
gpio2_28
7
I/O
mmc0_dat2
0
I/O
gpmc_a21
1
O
uart4_rtsn
2
O
timer6
3
I/O
uart1_dsrn
4
I
pr1_pru0_pru_r30_9
5
O
pr1_pru0_pru_r31_9
6
I
gpio2_27
7
I/O
mmc0_dat3
0
I/O
gpmc_a20
1
O
uart4_ctsn
2
I
timer5
3
I/O
uart1_dcdn
4
I
pr1_pru0_pru_r30_8
5
O
pr1_pru0_pru_r31_8
6
I
gpio2_26
7
I/O
BUFFER
STRENGTH
(mA) [11]
PULLUP
/DOWN TYPE
[12]
I/O CELL [13]
H
H
7
VDDSHV4 /
VDDSHV4
Yes
6
PU/PD
LVCMOS
H
H
7
VDDSHV4 /
VDDSHV4
Yes
6
PU/PD
LVCMOS
H
H
7
VDDSHV4 /
VDDSHV4
Yes
6
PU/PD
LVCMOS
C7
C6
PMIC_POWER_EN
PMIC_POWER_EN
0
O
H
1
0
VDDS_RTC /
VDDS_RTC
NA
6
NA
LVCMOS
E15
B15
PWRONRSTn
porz
0
I
Z
Z
0
VDDSHV6 /
VDDSHV6 (12)
Yes
NA
NA
LVCMOS
B6
A3
RESERVED
testout
0
O
NA
NA
NA
VDDSHV6 /
VDDSHV6
NA
NA
NA
Analog
K18
H18
RMII1_REF_CLK
rmii1_refclk
0
I/O
L
L
7
6
PU/PD
LVCMOS
1
I
VDDSHV5 /
VDDSHV5
Yes
xdma_event_intr2
spi1_cs0
2
I/O
uart5_txd
3
O
mcasp1_axr3
4
I/O
mmc0_pow
5
O
mcasp1_ahclkx
6
I/O
gpio0_29
7
I/O
ENZ_KALDO_1P8V
0
I
Z
Z
0
VDDS_RTC /
VDDS_RTC
NA
NA
NA
Analog
A7
B4
(3)
RTC_KALDO_ENn
Terminal Configuration and Functions
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Table 4-2. Pin Attributes (ZCE and ZCZ Packages) (continued)
ZCE BALL
ZCZ BALL
NUMBER [1] NUMBER [1]
PIN NAME [2]
SIGNAL NAME [3]
MODE [4]
BALL RESET
TYPE BALL RESET
RESET REL. ZCE POWER / HYS
REL. STATE
[5]
STATE [6](25)
MODE [8] ZCZ POWER [9] [10]
[7]
BUFFER
STRENGTH
(mA) [11]
PULLUP
/DOWN TYPE
[12]
B7
B5
RTC_PWRONRSTn
RTC_PORz
0
I
Z
Z
0
VDDS_RTC /
VDDS_RTC
Yes
NA
NA
A6
A6
RTC_XTALIN
OSC1_IN
0
I
H
H
0
VDDS_RTC /
VDDS_RTC
Yes
NA
PU
A5
A4
RTC_XTALOUT
OSC1_OUT
0
O
Z (23)
Z (23)
0
VDDS_RTC /
VDDS_RTC
NA
NA
A18
A17
SPI0_SCLK
spi0_sclk
0
I/O
Z
H
7
1
I
VDDSHV6 /
VDDSHV6
Yes
uart2_rxd
I2C2_SDA
2
I/OD
ehrpwm0A
3
O
pr1_uart0_cts_n
4
I
pr1_edio_sof
5
O
EMU2
6
I/O
gpio0_2
7
I/O
spi0_cs0
0
I/O
Z
H
7
mmc2_sdwp
1
I
VDDSHV6 /
VDDSHV6
I2C1_SCL
2
I/OD
ehrpwm0_synci
3
I
pr1_uart0_txd
4
O
pr1_edio_data_in1
5
I
pr1_edio_data_out1
6
O
gpio0_5
7
I/O
spi0_cs1
0
I/O
Z
H
7
uart3_rxd
1
I
eCAP1_in_PWM1_out
2
I/O
mmc0_pow
3
O
xdma_event_intr2
4
I
mmc0_sdcd
5
I
EMU4
6
I/O
gpio0_6
7
I/O
spi0_d0
0
I/O
Z
H
7
uart2_txd
1
O
I2C2_SCL
2
I/OD
ehrpwm0B
3
O
pr1_uart0_rts_n
4
O
pr1_edio_latch_in
5
I
EMU3
6
I/O
gpio0_3
7
I/O
A17
B16
B18
42
A16
C15
B17
SPI0_CS0
SPI0_CS1
SPI0_D0
(15)
I/O CELL [13]
LVCMOS
(1)
LVCMOS
NA
LVCMOS
6
PU/PD
LVCMOS
Yes
6
PU/PD
LVCMOS
VDDSHV6 /
VDDSHV6
Yes
6
PU/PD
LVCMOS
VDDSHV6 /
VDDSHV6
Yes
6
PU/PD
LVCMOS
Terminal Configuration and Functions
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SPRS717J – OCTOBER 2011 – REVISED APRIL 2016
Table 4-2. Pin Attributes (ZCE and ZCZ Packages) (continued)
ZCE BALL
ZCZ BALL
NUMBER [1] NUMBER [1]
B17
B16
PIN NAME [2]
SPI0_D1
SIGNAL NAME [3]
MODE [4]
BALL RESET
TYPE BALL RESET
RESET REL. ZCE POWER / HYS
REL. STATE
[5]
STATE [6](25)
MODE [8] ZCZ POWER [9] [10]
[7]
spi0_d1
0
I/O
mmc1_sdwp
1
I
I2C1_SDA
2
I/OD
ehrpwm0_tripzone_input
3
I
pr1_uart0_rxd
4
I
pr1_edio_data_in0
5
I
pr1_edio_data_out0
6
O
gpio0_4
7
I/O
BUFFER
STRENGTH
(mA) [11]
PULLUP
/DOWN TYPE
[12]
I/O CELL [13]
Z
H
7
VDDSHV6 /
VDDSHV6
Yes
6
PU/PD
LVCMOS
B14
A12
TCK
TCK
0
I
H
H
0
VDDSHV6 /
VDDSHV6
Yes
NA
PU/PD
LVCMOS
B13
B11
TDI
TDI
0
I
H
H
0
VDDSHV6 /
VDDSHV6
Yes
NA
PU/PD
LVCMOS
A14
A11
TDO
TDO
0
O
H
H
0
VDDSHV6 /
VDDSHV6
NA
4
PU/PD
LVCMOS
C14
C11
TMS
TMS
0
I
H
H
0
VDDSHV6 /
VDDSHV6
Yes
NA
PU/PD
LVCMOS
A13
B10
TRSTn
nTRST
0
I
L
L
0
VDDSHV6 /
VDDSHV6
Yes
NA
PU/PD
LVCMOS
F17
E16
UART0_TXD
uart0_txd
0
O
Z
H
7
4
PU/PD
LVCMOS
1
I/O
VDDSHV6 /
VDDSHV6
Yes
spi1_cs1
dcan0_rx
2
I
I2C2_SCL
3
I/OD
eCAP1_in_PWM1_out
4
I/O
pr1_pru1_pru_r30_15
5
O
pr1_pru1_pru_r31_15
6
I
gpio1_11
7
I/O
uart0_ctsn
0
I
Z
H
7
4
PU/PD
LVCMOS
1
I
VDDSHV6 /
VDDSHV6
Yes
uart4_rxd
dcan1_tx
2
O
I2C1_SDA
3
I/OD
spi1_d0
4
I/O
timer7
5
I/O
pr1_edc_sync0_out
6
O
gpio1_8
7
I/O
F19
E18
UART0_CTSn
Terminal Configuration and Functions
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Table 4-2. Pin Attributes (ZCE and ZCZ Packages) (continued)
ZCE BALL
ZCZ BALL
NUMBER [1] NUMBER [1]
E19
F18
C19
D18
D19
44
E15
E17
D15
D16
D17
PIN NAME [2]
UART0_RXD
UART0_RTSn
UART1_TXD
UART1_RXD
UART1_RTSn
SIGNAL NAME [3]
MODE [4]
BALL RESET
TYPE BALL RESET
RESET REL. ZCE POWER / HYS
REL. STATE
[5]
STATE [6](25)
MODE [8] ZCZ POWER [9] [10]
[7]
uart0_rxd
0
I
spi1_cs0
1
I/O
dcan0_tx
2
O
I2C2_SDA
3
I/OD
eCAP2_in_PWM2_out
4
I/O
pr1_pru1_pru_r30_14
5
O
pr1_pru1_pru_r31_14
6
I
gpio1_10
7
I/O
uart0_rtsn
0
O
uart4_txd
1
O
dcan1_rx
2
I
I2C1_SCL
3
I/OD
spi1_d1
4
I/O
spi1_cs0
5
I/O
pr1_edc_sync1_out
6
O
gpio1_9
7
I/O
uart1_txd
0
O
mmc2_sdwp
1
I
dcan1_rx
2
I
I2C1_SCL
3
I/OD
pr1_uart0_txd
5
O
pr1_pru0_pru_r31_16
6
I
gpio0_15
7
I/O
uart1_rxd
0
I
mmc1_sdwp
1
I
dcan1_tx
2
O
I2C1_SDA
3
I/OD
pr1_uart0_rxd
5
I
pr1_pru1_pru_r31_16
6
I
gpio0_14
7
I/O
uart1_rtsn
0
O
timer5
1
I/O
dcan0_rx
2
I
I2C2_SCL
3
I/OD
spi1_cs1
4
I/O
pr1_uart0_rts_n
5
O
pr1_edc_latch1_in
6
I
gpio0_13
7
I/O
BUFFER
STRENGTH
(mA) [11]
PULLUP
/DOWN TYPE
[12]
I/O CELL [13]
Z
H
7
VDDSHV6 /
VDDSHV6
Yes
4
PU/PD
LVCMOS
Z
H
7
VDDSHV6 /
VDDSHV6
Yes
4
PU/PD
LVCMOS
Z
H
7
VDDSHV6 /
VDDSHV6
Yes
4
PU/PD
LVCMOS
Z
H
7
VDDSHV6 /
VDDSHV6
Yes
4
PU/PD
LVCMOS
Z
H
7
VDDSHV6 /
VDDSHV6
Yes
4
PU/PD
LVCMOS
Terminal Configuration and Functions
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SPRS717J – OCTOBER 2011 – REVISED APRIL 2016
Table 4-2. Pin Attributes (ZCE and ZCZ Packages) (continued)
ZCE BALL
ZCZ BALL
NUMBER [1] NUMBER [1]
E17
T18
D18
M15
PIN NAME [2]
UART1_CTSn
USB0_CE
SIGNAL NAME [3]
MODE [4]
BALL RESET
TYPE BALL RESET
RESET REL. ZCE POWER / HYS
REL. STATE
[5]
STATE [6](25)
MODE [8] ZCZ POWER [9] [10]
[7]
uart1_ctsn
0
I
timer6
1
I/O
dcan0_tx
2
O
I2C2_SDA
3
I/OD
spi1_cs0
4
I/O
pr1_uart0_cts_n
5
I
pr1_edc_latch0_in
6
I
gpio0_12
7
I/O
USB0_CE
0
A
BUFFER
STRENGTH
(mA) [11]
PULLUP
/DOWN TYPE
[12]
I/O CELL [13]
Z
H
7
VDDSHV6 /
VDDSHV6
Yes
4
PU/PD
LVCMOS
Z
Z
0
VDDA*_USB0 /
VDDA*_USB0
NA
NA
NA
Analog
NA
NA
NA
Analog
Yes
8
NA
Analog
(26)
T19
P15
USB0_VBUS
USB0_VBUS
0
A
Z
Z
0
VDDA*_USB0 /
VDDA*_USB0
(26)
U18
N18
USB0_DM
USB0_DM
0
A
Z
Z
0
(13)
VDDA*_USB0 /
VDDA*_USB0
(16)
(16)
(26)
G16
V19
F16
P16
USB0_DRVVBUS
USB0_ID
USB0_DRVVBUS
0
O
gpio0_18
7
I/O
USB0_ID
0
A
L
0(PD)
0
VDDSHV6 /
VDDSHV6
Yes
4
PU/PD
LVCMOS
Z
Z
0
VDDA*_USB0 /
VDDA*_USB0
NA
NA
NA
Analog
Yes
8
NA
Analog
(26)
U19
N17
USB0_DP
USB0_DP
0
A
Z
Z
0
(13)
VDDA*_USB0 /
VDDA*_USB0
(16)
(16)
(26)
NA
P18
USB1_CE
USB1_CE
0
A
Z
Z
0
NA /
VDDA*_USB1
NA
NA
NA
Analog
NA
NA
NA
Analog
NA
NA
NA
Analog
Yes
8
NA
Analog
PU/PD
LVCMOS
NA
Analog
(27)
NA
P17
USB1_ID
USB1_ID
0
A
Z
Z
0
NA /
VDDA*_USB1
(27)
NA
T18
USB1_VBUS
USB1_VBUS
0
A
Z
Z
0
NA /
VDDA*_USB1
(27)
NA
R17
USB1_DP
USB1_DP
0
A
Z
Z
0
(14)
NA /
VDDA*_USB1
(17)
(17)
(27)
NA
NA
F15
R18
USB1_DRVVBUS
USB1_DM
USB1_DRVVBUS
0
O
gpio3_13
7
I/O
USB1_DM
0
A
L
0(PD)
0
Z
Z
0
(14)
NA / VDDSHV6 Yes
4
NA /
VDDA*_USB1
8
Yes
(17)
(17)
(27)
R17
N16
VDDA1P8V_USB0
VDDA1P8V_USB0
NA
PWR
NA
R16
VDDA1P8V_USB1
VDDA1P8V_USB1
NA
PWR
R18
N15
VDDA3P3V_USB0
VDDA3P3V_USB0
NA
PWR
NA
R15
VDDA3P3V_USB1
VDDA3P3V_USB1
NA
PWR
Terminal Configuration and Functions
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Table 4-2. Pin Attributes (ZCE and ZCZ Packages) (continued)
ZCE BALL
ZCZ BALL
NUMBER [1] NUMBER [1]
D7
SIGNAL NAME [3]
MODE [4]
BALL RESET
TYPE BALL RESET
RESET REL. ZCE POWER / HYS
REL. STATE
[5]
STATE [6](25)
MODE [8] ZCZ POWER [9] [10]
[7]
BUFFER
STRENGTH
(mA) [11]
PULLUP
/DOWN TYPE
[12]
I/O CELL [13]
VDDA_ADC
VDDA_ADC
NA
PWR
D12, F16,
E6, E14, F9,
M16, T6, T14 K13, N6, P9,
P14
VDDS
VDDS
NA
PWR
R8, R9, R11,
R12, R13
P7, P8
VDDSHV1
VDDSHV1
NA
PWR
NA
P10, P11
VDDSHV2
VDDSHV2
NA
PWR
NA
P12, P13
VDDSHV3
VDDSHV3
NA
PWR
G15, H14,
H15
H14, J14
VDDSHV4
VDDSHV4
NA
PWR
M14, M15,
N15
K14, L14
VDDSHV5
VDDSHV5
NA
PWR
E11, E12,
E10, E11,
VDDSHV6
E13, F14, P6, E12, E13,
R7
F14, G14, N5,
P5, P6
VDDSHV6
NA
PWR
G5, H5, H6,
K4, K5, M5,
M6, N5
E5, F5, G5,
VDDS_DDR
H5, J5, K5, L5
VDDS_DDR
NA
PWR
U10
R11
VDDS_OSC
VDDS_OSC
NA
PWR
T8
R10
VDDS_PLL_CORE_LCD
VDDS_PLL_CORE_LCD
NA
PWR
C5
E7
VDDS_PLL_DDR
VDDS_PLL_DDR
NA
PWR
H16
H15
VDDS_PLL_MPU
VDDS_PLL_MPU
NA
PWR
C6
D7
VDDS_RTC
VDDS_RTC
NA
PWR
C10
E9
VDDS_SRAM_CORE_BG
VDDS_SRAM_CORE_BG
NA
PWR
C12
D10
VDDS_SRAM_MPU_BB
VDDS_SRAM_MPU_BB
NA
PWR
F9, F11, G9,
G11, H7, H8,
H12, H13, J7,
J8, J12, J13,
K15, K16, L7,
L8, L12, L13,
M7, M8, M12,
M13, N9,
N11, P9, P11
F6, F7, G6,
VDD_CORE
G7, G10,
H11, J12, K6,
K8, K12, L6,
L7, L8, L9,
M11, M13,
N8, N9, N12,
N13
VDD_CORE
NA
PWR
NA
F10, F11,
F12, F13,
G13, H13,
J13
VDD_MPU
VDD_MPU (30)
NA
PWR
NA
A2
VDD_MPU_MON
VDD_MPU_MON
NA
A
R5
M5
VPP
VPP
NA
PWR
B9
A9
VREFN
VREFN
0
AP
Z
Z
0
VDDA_ADC /
VDDA_ADC
NA
NA
NA
Analog
A9
B9
VREFP
VREFP
0
AP
Z
Z
0
VDDA_ADC /
VDDA_ADC
NA
NA
NA
Analog
46
D8
PIN NAME [2]
(31)
Terminal Configuration and Functions
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Table 4-2. Pin Attributes (ZCE and ZCZ Packages) (continued)
ZCE BALL
ZCZ BALL
NUMBER [1] NUMBER [1]
PIN NAME [2]
SIGNAL NAME [3]
MODE [4]
BALL RESET
TYPE BALL RESET
RESET REL. ZCE POWER / HYS
REL. STATE
[5]
STATE [6](25)
MODE [8] ZCZ POWER [9] [10]
[7]
A1, A19, D10,
E7, E8, E9,
E10, F6, F7,
F8, F12, F13,
G8, G12, H9,
H10, H11, J5,
J6, J9, J11,
J14, J15, K8,
K9, K11, K12,
L5, L6, L9,
L11, L14, L15,
M9, M10,
M11, N8,
N12, P7, P8,
P12, P13,
P14, R10,
T10, W1, W19
A1, A18, F8, VSS
G8, G9, G11,
G12, H6, H7,
H8, H9, H10,
H12, J6, J7,
J8, J9, J10,
J11, K7, K9,
K10, K11,
L10, L11, L12,
L13, M6, M7,
M8, M9, M10,
M12, N7,
N10, N11, V1,
V18
VSS
NA
GND
D8
E8
VSSA_ADC
VSSA_ADC
NA
GND
P16
M14, N14
VSSA_USB
VSSA_USB
NA
GND
V11
V11
VSS_OSC
VSS_OSC (28)
NA
A
NA
A5
VSS_RTC
VSS_RTC
(29)
NA
A
A16
A10
WARMRSTn
nRESETIN_OUT
0
I/OD
0
0(PU)
Z
(11)
B15
A15
D14
XDMA_EVENT_INTR0
XDMA_EVENT_INTR1
xdma_event_intr0
0
I
timer4
2
I/O
clkout1
3
O
spi1_cs1
4
I/O
pr1_pru1_pru_r31_16
5
I
EMU2
6
I/O
gpio0_19
7
I/O
xdma_event_intr1
0
I
tclkin
2
I
clkout2
3
O
timer7
4
I/O
pr1_pru0_pru_r31_16
5
I
EMU3
6
I/O
gpio0_20
7
I/O
PULLUP
/DOWN TYPE
[12]
I/O CELL [13]
0
VDDSHV6 /
VDDSHV6
Yes
4
PU/PD
LVCMOS
(4)
(9)
VDDSHV6 /
VDDSHV6
Yes
4
PU/PD
LVCMOS
Z
L
7
VDDSHV6 /
VDDSHV6
Yes
4
PU/PD
LVCMOS
PD
(8)
C15
BUFFER
STRENGTH
(mA) [11]
W11
V10
XTALIN
OSC0_IN
0
I
Z
Z
0
VDDS_OSC /
VDDS_OSC
Yes
NA
W12
U11
XTALOUT
OSC0_OUT
0
O
(24)
(24)
0
VDDS_OSC /
VDDS_OSC
NA
NA
(15)
NA
(2)
LVCMOS
LVCMOS
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(1) An internal 10 kohm pullup is turned on when the oscillator is disabled. The oscillator is disabled by default after power is applied.
(2) An internal 15 kohm pulldown is turned on when the oscillator is disabled. The oscillator is enabled by default after power is applied.
(3) Do not connect anything to this terminal.
(4) If sysboot[5] is low on the rising edge of PWRONRSTn, this terminal has an internal pulldown turned on after reset is released. If sysboot[5] is high on the rising edge or PWRONRSTn,
this terminal will initially be driven low after reset is released then it begins to toggle at the same frequency of the XTALIN terminal.
(5) LCD_DATA[15:0] terminals are respectively SYSBOOT[15:0] inputs, latched on the rising edge of PWRONRSTn.
(6) Mode1 and Mode2 signal assignments for this terminal are only available with silicon revision 2.0 or newer devices.
(7) Mode2 signal assignment for this terminal is only available with silicon revision 2.0 or newer devices.
(8) Refer to the External Warm Reset section of the AM335x Technical Reference Manual for more information related to the operation of this terminal.
(9) Reset Release Mode = 7 if sysboot[5] is low. Mode = 3 if sysboot[5] is high.
(10) Silicon revision 1.0 devices only provide the MMC2_DAT7 signal when Mode3 is selected. Silicon revision 2.0 and newer devices implement another level of pin multiplexing which
provides the original MMC2_DAT7 signal or RMII2_CRS_DV signal when Mode3 is selected. This new level of of pin multiplexing is selected with bit zero of the SMA2 register. For more
details refer to Section 1.2 of the AM335x Technical Reference Manual.
(11) The 0(PU) indicates that this terminal is initially low based on the description in the AM335x Technical Reference Manual. However, it is also has a weak internal pullup applied.
(12) The input voltage thresholds for this input are not a function of VDDSHV6. Please refer to the DC Electrical Characteristics section for details related to electrical parameters associated
with this input terminal.
(13) The internal USB PHY can be configured to multiplex the UART2_TX or UART2_RX signals to this terminal. For more details refer to USB GPIO Details section of the AM335x Technical
Reference Manual.
(14) The internal USB PHY can be configured to multiplex the UART3_TX or UART3_RX signals to this terminal. For more details refer to USB GPIO Details section of the AM335x Technical
Reference Manual.
(15) This output should only be used to source the recommended crystal circuit.
(16) This parameter only applies when this USB PHY terminal is operating in UART2 mode.
(17) This parameter only applies when this USB PHY terminal is operating in UART3 mode.
(18) This terminal is a analog input used to set the switching threshold of the DDR input buffers to (VDDS_DDR / 2).
(19) This terminal is a analog passive signal that connects to an external 49.9 ohm 1%, 20mW reference resistor which is used to calibrate the DDR input/output buffers.
(20) This terminal is analog input that may also be configured as an open-drain output.
(21) This terminal is analog input that may also be configured as an open-source or open-drain output.
(22) This terminal is analog input that may also be configured as an open-source output.
(23) This terminal is high-Z when the oscillator is disabled. This terminal is driven high if RTC_XTALIN is less than VIL, driven low if RTC_XTALIN is greater than VIH, and driven to a
unknown value if RTC_XTALIN is between VIL and VIH when the oscillator is enabled. The oscillator is disabled by default after power is applied.
(24) This terminal is high-Z when the oscillator is disabled. This terminal is driven high if XTALIN is less than VIL, driven low if XTALIN is greater than VIH, and driven to a unknown value if
XTALIN is between VIL and VIH when the oscillator is enabled. The oscillator is enabled by default after power is applied.
(25) For all pins with content in the Ball Reset State column of this table, the terminal is not defined until all the supplies are ramped.
(26) This terminal requires two power supplies, VDDA3p3v_USB0 and VDDA1p8v_USB0. The "*" character in the power supply name is a wild card that represents "3p3v" and "1p8v".
(27) This terminal requires two power supplies, VDDA3p3v_USB1 and VDDA1p8v_USB1. The "*" character in the power supply name is a wild card that represents "3p3v" and "1p8v".
(28) Refer to Section 6.2.2 for additional details about VSS_OSC.
(29) Refer to Section 6.2.2 for additional details about VSS_RTC.
(30) This power rail is connected to VDD_CORE in the ZCE package.
(31) This terminal provides a Kelvin connection to VDD_MPU. It can be connected to the power supply feedback input to provide remote sensing which compensates for voltage drop in the
48
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SPRS717J – OCTOBER 2011 – REVISED APRIL 2016
PCB power distribution network and package. When the Kelvin connection is not used it should be connected to the same power source as VDD_MPU.
Terminal Configuration and Functions
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4.3
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Signal Descriptions
The AM335x device contains many peripheral interfaces. In order to reduce package size and lower
overall system cost while maintaining maximum functionality, many of the AM335x terminals can multiplex
up to eight signal functions. Although there are many combinations of pin multiplexing that are possible,
only a certain number of sets, called I/O Sets, are valid due to timing limitations. These valid I/O Sets were
carefully chosen to provide many possible application scenarios for the user.
Texas Instruments has developed a Windows-based application called Pin Mux Utility that helps a system
designer select the appropriate pin-multiplexing configuration for their AM335x-based product design. The
Pin Mux Utility provides a way to select valid I/O Sets of specific peripheral interfaces to ensure the pinmultiplexing configuration selected for a design only uses valid I/O Sets supported by the AM335x device.
50
Terminal Configuration and Functions
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(1) SIGNAL NAME: The signal name
(2) DESCRIPTION: Description of the signal
(3) TYPE: Ball type for this specific function:
– I = Input
– O = Output
– I/O = Input/Output
– D = Open drain
– DS = Differential
– A = Analog
(4) BALL: Package ball location
Table 4-3. ADC Signals Description
SIGNAL NAME [1]
TYPE
[3]
DESCRIPTION [2]
ZCE BALL [4]
ZCZ BALL [4]
AIN0
Analog Input/Output
A
B8
B6
AIN1
Analog Input/Output
A
A11
C7
AIN2
Analog Input/Output
A
A8
B7
AIN3
Analog Input/Output
A
B11
A7
AIN4
Analog Input/Output
A
C8
C8
AIN5
Analog Input
A
B12
B8
AIN6
Analog Input
A
A10
A8
AIN7
Analog Input
A
A12
C9
VREFN
Analog Negative Reference Input
AP
B9
A9
VREFP
Analog Positive Reference Input
AP
A9
B9
Table 4-4. Debug Subsystem Signals Description
SIGNAL NAME [1]
TYPE
[3]
DESCRIPTION [2]
ZCE BALL [4]
ZCZ BALL [4]
EMU0
MISC EMULATION PIN
I/O
A15
C14
EMU1
MISC EMULATION PIN
I/O
D14
B14
EMU2
MISC EMULATION PIN
I/O
A18, C15
A15, A17, C13
EMU3
MISC EMULATION PIN
I/O
B15, B18
B17, D13, D14
EMU4
MISC EMULATION PIN
I/O
B16, U17
A14, C15, T13
nTRST
JTAG TEST RESET (ACTIVE LOW)
I
A13
B10
TCK
JTAG TEST CLOCK
I
B14
A12
TDI
JTAG TEST DATA INPUT
I
B13
B11
TDO
JTAG TEST DATA OUTPUT
O
A14
A11
TMS
JTAG TEST MODE SELECT
I
C14
C11
Table 4-5. LCD Controller Signals Description
SIGNAL NAME [1]
DESCRIPTION [2]
TYPE
[3]
ZCE BALL [4]
ZCZ BALL [4]
lcd_ac_bias_en
LCD AC bias enable chip select
O
W7
R6
lcd_data0
LCD data bus
I/O
U1
R1
lcd_data1
LCD data bus
I/O
U2
R2
lcd_data10
LCD data bus
I/O
U5
U3
lcd_data11
LCD data bus
I/O
V5
U4
lcd_data12
LCD data bus
I/O
V6
V2
lcd_data13
LCD data bus
I/O
U6
V3
lcd_data14
LCD data bus
I/O
W6
V4
lcd_data15
LCD data bus
I/O
V7
T5
lcd_data16
LCD data bus
O
V17
U13
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Table 4-5. LCD Controller Signals Description (continued)
SIGNAL NAME [1]
DESCRIPTION [2]
TYPE
[3]
ZCE BALL [4]
ZCZ BALL [4]
lcd_data17
LCD data bus
O
W17
V13
lcd_data18
LCD data bus
O
T13
R12
lcd_data19
LCD data bus
O
U13
T12
lcd_data2
LCD data bus
I/O
V1
R3
lcd_data20
LCD data bus
O
U12
U12
lcd_data21
LCD data bus
O
T12
T11
lcd_data22
LCD data bus
O
W16
T10
lcd_data23
LCD data bus
O
V15
U10
lcd_data3
LCD data bus
I/O
V2
R4
lcd_data4
LCD data bus
I/O
W2
T1
lcd_data5
LCD data bus
I/O
W3
T2
lcd_data6
LCD data bus
I/O
V3
T3
lcd_data7
LCD data bus
I/O
U3
T4
lcd_data8
LCD data bus
I/O
V4
U1
lcd_data9
LCD data bus
I/O
W4
U2
lcd_hsync
LCD Horizontal Sync
O
T7
R5
lcd_memory_clk
LCD MCLK
O
L19, V16
J17, V12
lcd_pclk
LCD pixel clock
O
W5
V5
lcd_vsync
LCD Vertical Sync
O
U7
U5
52
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4.3.1
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External Memory Interfaces
Table 4-6. External Memory Interfaces/DDR Signals Description
SIGNAL NAME [1]
DESCRIPTION [2]
TYPE
[3]
ZCE BALL [4]
ZCZ BALL [4]
ddr_a0
DDR SDRAM ROW/COLUMN ADDRESS
OUTPUT
O
F3
F3
ddr_a1
DDR SDRAM ROW/COLUMN ADDRESS
OUTPUT
O
J2
H1
ddr_a10
DDR SDRAM ROW/COLUMN ADDRESS
OUTPUT
O
E2
F4
ddr_a11
DDR SDRAM ROW/COLUMN ADDRESS
OUTPUT
O
G4
F2
ddr_a12
DDR SDRAM ROW/COLUMN ADDRESS
OUTPUT
O
F4
E3
ddr_a13
DDR SDRAM ROW/COLUMN ADDRESS
OUTPUT
O
H1
H3
ddr_a14
DDR SDRAM ROW/COLUMN ADDRESS
OUTPUT
O
H3
H4
ddr_a15
DDR SDRAM ROW/COLUMN ADDRESS
OUTPUT
O
E3
D3
ddr_a2
DDR SDRAM ROW/COLUMN ADDRESS
OUTPUT
O
D1
E4
ddr_a3
DDR SDRAM ROW/COLUMN ADDRESS
OUTPUT
O
B3
C3
ddr_a4
DDR SDRAM ROW/COLUMN ADDRESS
OUTPUT
O
E5
C2
ddr_a5
DDR SDRAM ROW/COLUMN ADDRESS
OUTPUT
O
A2
B1
ddr_a6
DDR SDRAM ROW/COLUMN ADDRESS
OUTPUT
O
B1
D5
ddr_a7
DDR SDRAM ROW/COLUMN ADDRESS
OUTPUT
O
D2
E2
ddr_a8
DDR SDRAM ROW/COLUMN ADDRESS
OUTPUT
O
C3
D4
ddr_a9
DDR SDRAM ROW/COLUMN ADDRESS
OUTPUT
O
B2
C1
ddr_ba0
DDR SDRAM BANK ADDRESS OUTPUT
O
A3
C4
ddr_ba1
DDR SDRAM BANK ADDRESS OUTPUT
O
E1
E1
ddr_ba2
DDR SDRAM BANK ADDRESS OUTPUT
O
B4
B3
ddr_casn
DDR SDRAM COLUMN ADDRESS STROBE
OUTPUT (ACTIVE LOW)
O
F1
F1
ddr_ck
DDR SDRAM CLOCK OUTPUT (Differential+)
O
C2
D2
ddr_cke
DDR SDRAM CLOCK ENABLE OUTPUT
O
G3
G3
ddr_csn0
DDR SDRAM CHIP SELECT OUTPUT
O
H2
H2
ddr_d0
DDR SDRAM DATA INPUT/OUTPUT
I/O
N4
M3
ddr_d1
DDR SDRAM DATA INPUT/OUTPUT
I/O
P4
M4
ddr_d10
DDR SDRAM DATA INPUT/OUTPUT
I/O
M3
K2
ddr_d11
DDR SDRAM DATA INPUT/OUTPUT
I/O
M4
K3
ddr_d12
DDR SDRAM DATA INPUT/OUTPUT
I/O
M2
K4
ddr_d13
DDR SDRAM DATA INPUT/OUTPUT
I/O
M1
L3
ddr_d14
DDR SDRAM DATA INPUT/OUTPUT
I/O
N2
L4
ddr_d15
DDR SDRAM DATA INPUT/OUTPUT
I/O
N1
M1
ddr_d2
DDR SDRAM DATA INPUT/OUTPUT
I/O
P2
N1
ddr_d3
DDR SDRAM DATA INPUT/OUTPUT
I/O
P1
N2
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Table 4-6. External Memory Interfaces/DDR Signals Description (continued)
SIGNAL NAME [1]
TYPE
[3]
DESCRIPTION [2]
ZCE BALL [4]
ZCZ BALL [4]
ddr_d4
DDR SDRAM DATA INPUT/OUTPUT
I/O
P3
N3
ddr_d5
DDR SDRAM DATA INPUT/OUTPUT
I/O
T1
N4
ddr_d6
DDR SDRAM DATA INPUT/OUTPUT
I/O
T2
P3
ddr_d7
DDR SDRAM DATA INPUT/OUTPUT
I/O
R3
P4
ddr_d8
DDR SDRAM DATA INPUT/OUTPUT
I/O
K2
J1
ddr_d9
DDR SDRAM DATA INPUT/OUTPUT
I/O
K1
K1
ddr_dqm0
DDR WRITE ENABLE / DATA MASK FOR
DATA[7:0]
O
N3
M2
ddr_dqm1
DDR WRITE ENABLE / DATA MASK FOR
DATA[15:8]
O
K3
J2
ddr_dqs0
DDR DATA STROBE FOR DATA[7:0]
(Differential+)
I/O
R1
P1
ddr_dqs1
DDR DATA STROBE FOR DATA[15:8]
(Differential+)
I/O
L1
L1
ddr_dqsn0
DDR DATA STROBE FOR DATA[7:0]
(Differential-)
I/O
R2
P2
ddr_dqsn1
DDR DATA STROBE FOR DATA[15:8]
(Differential-)
I/O
L2
L2
ddr_nck
DDR SDRAM CLOCK OUTPUT (Differential-)
O
C1
D1
ddr_odt
ODT OUTPUT
O
G1
G1
ddr_rasn
DDR SDRAM ROW ADDRESS STROBE
OUTPUT (ACTIVE LOW)
O
F2
G4
ddr_resetn
DDR3/DDR3L RESET OUTPUT (ACTIVE LOW)
O
G2
G2
ddr_vref
Voltage Reference Input
A
H4
J4
ddr_vtp
VTP Compensation Resistor
I
J1
J3
ddr_wen
DDR SDRAM WRITE ENABLE OUTPUT
(ACTIVE LOW)
O
A4
B2
Table 4-7. External Memory Interfaces/General-Purpose Memory Controller Signals Description
SIGNAL NAME [1]
DESCRIPTION [2]
TYPE
[3]
ZCE BALL [4]
ZCZ BALL [4]
gpmc_a0
GPMC Address
O
U1
R1, R13
gpmc_a1
GPMC Address
O
U2, U7
R2, U5, V14
gpmc_a10
GPMC Address
O
W5
T16, V5
gpmc_a11
GPMC Address
O
W7
R6, V17
gpmc_a12
GPMC Address
O
V4
U1
gpmc_a13
GPMC Address
O
W4
U2
gpmc_a14
GPMC Address
O
U5
U3
gpmc_a15
GPMC Address
O
V5
U4
gpmc_a16
GPMC Address
O
V6
R13, V2
gpmc_a17
GPMC Address
O
U6
V14, V3
gpmc_a18
GPMC Address
O
W6
U14, V4
gpmc_a19
GPMC Address
O
V7
T14, T5
gpmc_a2
GPMC Address
O
T7, V1
R3, R5, U14
gpmc_a20
GPMC Address
O
H19
F17, R14
gpmc_a21
GPMC Address
O
H18
F18, V15
gpmc_a22
GPMC Address
O
H17
G15, U15
gpmc_a23
GPMC Address
O
G18
G16, T15
gpmc_a24
GPMC Address
O
G19
G17, V16
54
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SPRS717J – OCTOBER 2011 – REVISED APRIL 2016
Table 4-7. External Memory Interfaces/General-Purpose Memory Controller Signals
Description (continued)
SIGNAL NAME [1]
TYPE
[3]
DESCRIPTION [2]
ZCE BALL [4]
ZCZ BALL [4]
gpmc_a25
GPMC Address
O
G17
G18, U16
gpmc_a26
GPMC Address
O
NA
T16
gpmc_a27
GPMC Address
O
NA
V17
gpmc_a3
GPMC Address
O
U17, V2
R4, T13, T14
gpmc_a4
GPMC Address
O
W2
R14, T1
gpmc_a5
GPMC Address
O
W3
T2, V15
gpmc_a6
GPMC Address
O
V3
T3, U15
gpmc_a7
GPMC Address
O
U3
T15, T4
gpmc_a8
GPMC Address
O
U7
U5, V16
gpmc_a9
GPMC Address
O
T7
R5, U16
gpmc_ad0
GPMC Address and Data
I/O
W10
U7
gpmc_ad1
GPMC Address and Data
I/O
V9
V7
gpmc_ad10
GPMC Address and Data
I/O
T12
T11
gpmc_ad11
GPMC Address and Data
I/O
U12
U12
gpmc_ad12
GPMC Address and Data
I/O
U13
T12
gpmc_ad13
GPMC Address and Data
I/O
T13
R12
gpmc_ad14
GPMC Address and Data
I/O
W17
V13
gpmc_ad15
GPMC Address and Data
I/O
V17
U13
gpmc_ad2
GPMC Address and Data
I/O
V12
R8
gpmc_ad3
GPMC Address and Data
I/O
W13
T8
gpmc_ad4
GPMC Address and Data
I/O
V13
U8
gpmc_ad5
GPMC Address and Data
I/O
W14
V8
gpmc_ad6
GPMC Address and Data
I/O
U14
R9
gpmc_ad7
GPMC Address and Data
I/O
W15
T9
gpmc_ad8
GPMC Address and Data
I/O
V15
U10
gpmc_ad9
GPMC Address and Data
I/O
W16
T10
gpmc_advn_ale
GPMC Address Valid / Address Latch Enable
O
V10
R7
gpmc_be0n_cle
GPMC Byte Enable 0 / Command Latch Enable
O
V8
T6
gpmc_be1n
GPMC Byte Enable 1
O
U15, V18
U18, V9
gpmc_clk
GPMC Clock
I/O
V14, V16
U9, V12
gpmc_csn0
GPMC Chip Select
O
W8
V6
gpmc_csn1
GPMC Chip Select
O
V14
U9
gpmc_csn2
GPMC Chip Select
O
U15
V9
gpmc_csn3
GPMC Chip Select
O
U17
T13
gpmc_csn4
GPMC Chip Select
O
R15
T17
gpmc_csn5
GPMC Chip Select
O
W18
U17
gpmc_csn6
GPMC Chip Select
O
V18
U18
gpmc_dir
GPMC Data Direction
O
V18
U18
gpmc_oen_ren
GPMC Output / Read Enable
O
W9
T7
gpmc_wait0
GPMC Wait 0
I
R15
T17
gpmc_wait1
GPMC Wait 1
I
V16
V12
gpmc_wen
GPMC Write Enable
O
U8
U6
gpmc_wpn
GPMC Write Protect
O
W18
U17
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General-Purpose IOs
Table 4-8. General-Purpose IOs/GPIO0 Signals Description
SIGNAL NAME [1]
DESCRIPTION [2]
TYPE
[3]
ZCE BALL [4]
ZCZ BALL [4]
gpio0_0
GPIO
I/O
P17
M17
gpio0_1
GPIO
I/O
R19
M18
gpio0_10
GPIO
I/O
W6
V4
gpio0_11
GPIO
I/O
V7
T5
gpio0_12
GPIO
I/O
E17
D18
gpio0_13
GPIO
I/O
D19
D17
gpio0_14
GPIO
I/O
D18
D16
gpio0_15
GPIO
I/O
C19
D15
gpio0_16
GPIO
I/O
M17
J18
gpio0_17
GPIO
I/O
N18
K15
gpio0_18
GPIO
I/O
G16
F16
gpio0_19
GPIO
I/O
C15
A15
gpio0_2
GPIO
I/O
A18
A17
gpio0_20
GPIO
I/O
B15
D14
gpio0_21
GPIO
I/O
M18
K16
gpio0_22
GPIO
I/O
V15
U10
gpio0_23
GPIO
I/O
W16
T10
gpio0_26
GPIO
I/O
T12
T11
gpio0_27
GPIO
I/O
U12
U12
gpio0_28
GPIO
I/O
L18
K17
gpio0_29
GPIO
I/O
K18
H18
gpio0_3
GPIO
I/O
B18
B17
gpio0_30
GPIO
I/O
R15
T17
gpio0_31
GPIO
I/O
W18
U17
gpio0_4
GPIO
I/O
B17
B16
gpio0_5
GPIO
I/O
A17
A16
gpio0_6
GPIO
I/O
B16
C15
gpio0_7
GPIO
I/O
E18
C18
gpio0_8
GPIO
I/O
V6
V2
gpio0_9
GPIO
I/O
U6
V3
Table 4-9. General-Purpose IOs/GPIO1 Signals Description
SIGNAL NAME [1]
DESCRIPTION [2]
TYPE
[3]
ZCE BALL [4]
ZCZ BALL [4]
gpio1_0
GPIO
I/O
W10
U7
gpio1_1
GPIO
I/O
V9
V7
gpio1_10
GPIO
I/O
E19
E15
gpio1_11
GPIO
I/O
F17
E16
gpio1_12
GPIO
I/O
U13
T12
gpio1_13
GPIO
I/O
T13
R12
gpio1_14
GPIO
I/O
W17
V13
gpio1_15
GPIO
I/O
V17
U13
gpio1_16
GPIO
I/O
NA
R13
gpio1_17
GPIO
I/O
NA
V14
gpio1_18
GPIO
I/O
NA
U14
56
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SPRS717J – OCTOBER 2011 – REVISED APRIL 2016
Table 4-9. General-Purpose IOs/GPIO1 Signals Description (continued)
SIGNAL NAME [1]
DESCRIPTION [2]
TYPE
[3]
ZCE BALL [4]
ZCZ BALL [4]
gpio1_19
GPIO
I/O
NA
T14
gpio1_2
GPIO
I/O
V12
R8
gpio1_20
GPIO
I/O
NA
R14
gpio1_21
GPIO
I/O
NA
V15
gpio1_22
GPIO
I/O
NA
U15
gpio1_23
GPIO
I/O
NA
T15
gpio1_24
GPIO
I/O
NA
V16
gpio1_25
GPIO
I/O
NA
U16
gpio1_26
GPIO
I/O
NA
T16
gpio1_27
GPIO
I/O
NA
V17
gpio1_28
GPIO
I/O
V18
U18
gpio1_29
GPIO
I/O
W8
V6
gpio1_3
GPIO
I/O
W13
T8
gpio1_30
GPIO
I/O
V14
U9
gpio1_31
GPIO
I/O
U15
V9
gpio1_4
GPIO
I/O
V13
U8
gpio1_5
GPIO
I/O
W14
V8
gpio1_6
GPIO
I/O
U14
R9
gpio1_7
GPIO
I/O
W15
T9
gpio1_8
GPIO
I/O
F19
E18
gpio1_9
GPIO
I/O
F18
E17
Table 4-10. General-Purpose IOs/GPIO2 Signals Description
SIGNAL NAME [1]
DESCRIPTION [2]
TYPE
[3]
ZCE BALL [4]
ZCZ BALL [4]
gpio2_0
GPIO
I/O
U17
T13
gpio2_1
GPIO
I/O
V16
V12
gpio2_10
GPIO
I/O
W2
T1
gpio2_11
GPIO
I/O
W3
T2
gpio2_12
GPIO
I/O
V3
T3
gpio2_13
GPIO
I/O
U3
T4
gpio2_14
GPIO
I/O
V4
U1
gpio2_15
GPIO
I/O
W4
U2
gpio2_16
GPIO
I/O
U5
U3
gpio2_17
GPIO
I/O
V5
U4
gpio2_18
GPIO
I/O
N17
L17
gpio2_19
GPIO
I/O
N16
L16
gpio2_2
GPIO
I/O
V10
R7
gpio2_20
GPIO
I/O
P19
L15
gpio2_21
GPIO
I/O
P18
M16
gpio2_22
GPIO
I/O
U7
U5
gpio2_23
GPIO
I/O
T7
R5
gpio2_24
GPIO
I/O
W5
V5
gpio2_25
GPIO
I/O
W7
R6
gpio2_26
GPIO
I/O
H19
F17
gpio2_27
GPIO
I/O
H18
F18
gpio2_28
GPIO
I/O
H17
G15
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Table 4-10. General-Purpose IOs/GPIO2 Signals Description (continued)
SIGNAL NAME [1]
DESCRIPTION [2]
TYPE
[3]
ZCE BALL [4]
ZCZ BALL [4]
gpio2_29
GPIO
I/O
G18
G16
gpio2_3
GPIO
I/O
W9
T7
gpio2_30
GPIO
I/O
G19
G17
gpio2_31
GPIO
I/O
G17
G18
gpio2_4
GPIO
I/O
U8
U6
gpio2_5
GPIO
I/O
V8
T6
gpio2_6
GPIO
I/O
U1
R1
gpio2_7
GPIO
I/O
U2
R2
gpio2_8
GPIO
I/O
V1
R3
gpio2_9
GPIO
I/O
V2
R4
Table 4-11. General-Purpose IOs/GPIO3 Signals Description
SIGNAL NAME [1]
DESCRIPTION [2]
TYPE
[3]
ZCE BALL [4]
ZCZ BALL [4]
gpio3_0
GPIO
I/O
J19
H16
gpio3_1
GPIO
I/O
J18
H17
gpio3_10
GPIO
I/O
M19
L18
gpio3_13
GPIO
I/O
NA
F15
gpio3_14
GPIO
I/O
NA
A13
gpio3_15
GPIO
I/O
NA
B13
gpio3_16
GPIO
I/O
NA
D12
gpio3_17
GPIO
I/O
NA
C12
gpio3_18
GPIO
I/O
NA
B12
gpio3_19
GPIO
I/O
NA
C13
gpio3_2
GPIO
I/O
K19
J15
gpio3_20
GPIO
I/O
NA
D13
gpio3_21
GPIO
I/O
NA
A14
gpio3_3
GPIO
I/O
K17
J16
gpio3_4
GPIO
I/O
L19
J17
gpio3_5
GPIO
I/O
C18
C17
gpio3_6
GPIO
I/O
B19
C16
gpio3_7
GPIO
I/O
A15
C14
gpio3_8
GPIO
I/O
D14
B14
gpio3_9
GPIO
I/O
N19
K18
58
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4.3.3
SPRS717J – OCTOBER 2011 – REVISED APRIL 2016
Miscellaneous
Table 4-12. Miscellaneous/Miscellaneous Signals Description
SIGNAL NAME [1]
TYPE
[3]
DESCRIPTION [2]
ZCE BALL [4]
ZCZ BALL [4]
clkout1
Clock out1
O
C15
A15
clkout2
Clock out2
O
B15
D14
ENZ_KALDO_1P8V
Active low enable input for internal
CAP_VDD_RTC voltage regulator
I
A7
B4
EXT_WAKEUP
EXT_WAKEUP input
I
B5
C5
nNMI
External Interrupt to ARM Cortex-A8 core
I
C17
B18
nRESETIN_OUT
Active low Warm Reset
I/OD
A16
A10
OSC0_IN
High frequency oscillator input
I
W11
V10
OSC0_OUT
High frequency oscillator output
O
W12
U11
OSC1_IN
Low frequency (32.768 kHz) Real Time Clock
oscillator input
I
A6
A6
OSC1_OUT
Low frequency (32.768 kHz) Real Time Clock
oscillator output
O
A5
A4
PMIC_POWER_EN
PMIC_POWER_EN output
O
C7
C6
porz
Active low Power on Reset
I
E15
B15
RTC_PORz
Active low RTC reset input
I
B7
B5
tclkin
Timer Clock In
I
B15
D14
xdma_event_intr0
External DMA Event or Interrupt 0
I
C15
A15
xdma_event_intr1
External DMA Event or Interrupt 1
I
B15
D14
xdma_event_intr2
External DMA Event or Interrupt 2
I
B16, E18, K18
C15, C18, H18
Terminal Configuration and Functions
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4.3.3.1
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eCAP
Table 4-13. eCAP/eCAP0 Signals Description
SIGNAL NAME [1]
eCAP0_in_PWM0_out
DESCRIPTION [2]
Enhanced Capture 0 input or Auxiliary PWM0
output
TYPE
[3]
I/O
ZCE BALL [4]
E18
ZCZ BALL [4]
C18
Table 4-14. eCAP/eCAP1 Signals Description
SIGNAL NAME [1]
eCAP1_in_PWM1_out
DESCRIPTION [2]
Enhanced Capture 1 input or Auxiliary PWM1
output
TYPE
[3]
I/O
ZCE BALL [4]
B16, B19, F17
ZCZ BALL [4]
C15, C16, E16
Table 4-15. eCAP/eCAP2 Signals Description
SIGNAL NAME [1]
eCAP2_in_PWM2_out
60
DESCRIPTION [2]
Enhanced Capture 2 input or Auxiliary PWM2
output
Terminal Configuration and Functions
TYPE
[3]
I/O
ZCE BALL [4]
C18, E19
ZCZ BALL [4]
C12, C17, E15
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4.3.3.2
SPRS717J – OCTOBER 2011 – REVISED APRIL 2016
eHRPWM
Table 4-16. eHRPWM/eHRPWM0 Signals Description
SIGNAL NAME [1]
TYPE
[3]
DESCRIPTION [2]
ZCE BALL [4]
ZCZ BALL [4]
ehrpwm0A
eHRPWM0 A output.
O
A18
A13, A17
ehrpwm0B
eHRPWM0 B output.
O
B18
B13, B17
ehrpwm0_synci
Sync input to eHRPWM0 module from an
external pin
I
A17
A16, C12
ehrpwm0_synco
Sync Output from eHRPWM0 module to an
external pin
O
U12, V2, W4
R4, U12, U2, V14
ehrpwm0_tripzone_input
eHRPWM0 trip zone input
I
B17
B16, D12
Table 4-17. eHRPWM/eHRPWM1 Signals Description
SIGNAL NAME [1]
TYPE
[3]
DESCRIPTION [2]
ZCE BALL [4]
ZCZ BALL [4]
ehrpwm1A
eHRPWM1 A output.
O
U5
U14, U3
ehrpwm1B
eHRPWM1 B output.
O
V5
T14, U4
ehrpwm1_tripzone_input
eHRPWM1 trip zone input
I
V4
R13, U1
Table 4-18. eHRPWM/eHRPWM2 Signals Description
SIGNAL NAME [1]
TYPE
[3]
DESCRIPTION [2]
ZCE BALL [4]
ZCZ BALL [4]
ehrpwm2A
eHRPWM2 A output.
O
U1, V15
R1, U10
ehrpwm2B
eHRPWM2 B output.
O
U2, W16
R2, T10
ehrpwm2_tripzone_input
eHRPWM2 trip zone input
I
T12, V1
R3, T11
Terminal Configuration and Functions
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eQEP
Table 4-19. eQEP/eQEP0 Signals Description
SIGNAL NAME [1]
TYPE
[3]
DESCRIPTION [2]
ZCE BALL [4]
ZCZ BALL [4]
eQEP0A_in
eQEP0A quadrature input
I
M18
B12, K16
eQEP0B_in
eQEP0B quadrature input
I
L18
C13, K17
eQEP0_index
eQEP0 index.
I/O
K17
D13, J16
eQEP0_strobe
eQEP0 strobe.
I/O
P19
A14, L15
Table 4-20. eQEP/eQEP1 Signals Description
SIGNAL NAME [1]
TYPE
[3]
DESCRIPTION [2]
ZCE BALL [4]
ZCZ BALL [4]
eQEP1A_in
eQEP1A quadrature input
I
V6
R14, V2
eQEP1B_in
eQEP1B quadrature input
I
U6
V15, V3
eQEP1_index
eQEP1 index.
I/O
W6
U15, V4
eQEP1_strobe
eQEP1 strobe.
I/O
V7
T15, T5
Table 4-21. eQEP/eQEP2 Signals Description
SIGNAL NAME [1]
TYPE
[3]
DESCRIPTION [2]
ZCE BALL [4]
ZCZ BALL [4]
eQEP2A_in
eQEP2A quadrature input
I
U13, W2
T1, T12
eQEP2B_in
eQEP2B quadrature input
I
T13, W3
R12, T2
eQEP2_index
eQEP2 index.
I/O
V3, W17
T3, V13
eQEP2_strobe
eQEP2 strobe.
I/O
U3, V17
T4, U13
62
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4.3.3.4
SPRS717J – OCTOBER 2011 – REVISED APRIL 2016
Timer
Table 4-22. Timer/Timer4 Signals Description
SIGNAL NAME [1]
timer4
DESCRIPTION [2]
Timer trigger event / PWM out
TYPE
[3]
I/O
ZCE BALL [4]
C15, C18, K17,
V10
ZCZ BALL [4]
A15, C17, J16,
R7
Table 4-23. Timer/Timer5 Signals Description
SIGNAL NAME [1]
timer5
DESCRIPTION [2]
Timer trigger event / PWM out
TYPE
[3]
I/O
ZCE BALL [4]
D19, H19, R19,
V8
ZCZ BALL [4]
D17, F17, M18,
T6
Table 4-24. Timer/Timer6 Signals Description
SIGNAL NAME [1]
timer6
DESCRIPTION [2]
Timer trigger event / PWM out
TYPE
[3]
I/O
ZCE BALL [4]
E17, H18, P17,
U8
ZCZ BALL [4]
D18, F18, M17,
U6
Table 4-25. Timer/Timer7 Signals Description
SIGNAL NAME [1]
timer7
DESCRIPTION [2]
Timer trigger event / PWM out
TYPE
[3]
I/O
ZCE BALL [4]
B15, B19, F19,
W9
ZCZ BALL [4]
C16, D14, E18,
T7
Terminal Configuration and Functions
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PRU-ICSS
Table 4-26. PRU-ICSS/eCAP Signals Description
SIGNAL NAME [1]
pr1_ecap0_ecap_capin_apwm_o
TYPE
[3]
DESCRIPTION [2]
Enhanced capture input or Auxiliary PWM out
I/O
ZCE BALL [4]
E18, V17
ZCZ BALL [4]
C18, U13
Table 4-27. PRU-ICSS/ECAT Signals Description
SIGNAL NAME [1]
TYPE
[3]
DESCRIPTION [2]
ZCE BALL [4]
ZCZ BALL [4]
pr1_edc_latch0_in
Data In
I
E17
D18
pr1_edc_latch1_in
Data In
I
D19
D17
pr1_edc_sync0_out
Data Out
O
F19
E18
pr1_edc_sync1_out
Data Out
O
F18
E17
pr1_edio_data_in0
Data In
I
B17
B16
pr1_edio_data_in1
Data In
I
A17
A16
pr1_edio_data_in2
Data In
I
U7
U5
pr1_edio_data_in3
Data In
I
T7
R5
pr1_edio_data_in4
Data In
I
W5
V5
pr1_edio_data_in5
Data In
I
W7
R6
pr1_edio_data_in6
Data In
I
V14, V3
T3, U9
pr1_edio_data_in7
Data In
I
U15, U3
T4, V9
pr1_edio_data_out0
Data Out
O
B17
B16
pr1_edio_data_out1
Data Out
O
A17
A16
pr1_edio_data_out2
Data Out
O
U7
U5
pr1_edio_data_out3
Data Out
O
T7
R5
pr1_edio_data_out4
Data Out
O
W5
V5
pr1_edio_data_out5
Data Out
O
W7
R6
pr1_edio_data_out6
Data Out
O
V14, V3
T3, U9
pr1_edio_data_out7
Data Out
O
U15, U3
T4, V9
pr1_edio_latch_in
Latch In
I
B18
B17
pr1_edio_sof
Start of Frame
O
A18
A17
Table 4-28. PRU-ICSS/MDIO Signals Description
SIGNAL NAME [1]
TYPE
[3]
DESCRIPTION [2]
ZCE BALL [4]
ZCZ BALL [4]
pr1_mdio_data
MDIO Data
I/O
U17
T13
pr1_mdio_mdclk
MDIO Clk
O
V16
V12
Table 4-29. PRU-ICSS/MII0 Signals Description
SIGNAL NAME [1]
TYPE
[3]
DESCRIPTION [2]
ZCE BALL [4]
ZCZ BALL [4]
pr1_mii0_col
MII Collision Detect
I
W16
T10
pr1_mii0_crs
MII Carrier Sense
I
U17, W5
T13, V5
pr1_mii0_rxd0
MII Receive Data bit 0
I
V5
U4
pr1_mii0_rxd1
MII Receive Data bit 1
I
U5
U3
pr1_mii0_rxd2
MII Receive Data bit 2
I
W4
U2
pr1_mii0_rxd3
MII Receive Data bit 3
I
V4
U1
pr1_mii0_rxdv
MII Receive Data Valid
I
V7
T5
pr1_mii0_rxer
MII Receive Data Error
I
U6
V3
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Table 4-29. PRU-ICSS/MII0 Signals Description (continued)
SIGNAL NAME [1]
TYPE
[3]
DESCRIPTION [2]
ZCE BALL [4]
ZCZ BALL [4]
pr1_mii0_rxlink
MII Receive Link
I
V6
V2
pr1_mii0_txd0
MII Transmit Data bit 0
O
W17, W3
T2, V13
pr1_mii0_txd1
MII Transmit Data bit 1
O
T13, W2
R12, T1
pr1_mii0_txd2
MII Transmit Data bit 2
O
U13, V2
R4, T12
pr1_mii0_txd3
MII Transmit Data bit 3
O
U12, V1
R3, U12
pr1_mii0_txen
MII Transmit Enable
O
T12, U2
R2, T11
pr1_mii_mr0_clk
MII Receive Clock
I
W6
V4
pr1_mii_mt0_clk
MII Transmit Clock
I
U1, V15
R1, U10
Table 4-30. PRU-ICSS/MII1 Signals Description
SIGNAL NAME [1]
TYPE
[3]
DESCRIPTION [2]
ZCE BALL [4]
ZCZ BALL [4]
pr1_mii1_col
MII Collision Detect
I
R15
T17
pr1_mii1_crs
MII Carrier Sense
I
V16, W7
R6, V12
pr1_mii1_rxd0
MII Receive Data bit 0
I
NA
V16
pr1_mii1_rxd1
MII Receive Data bit 1
I
NA
T15
pr1_mii1_rxd2
MII Receive Data bit 2
I
NA
U15
pr1_mii1_rxd3
MII Receive Data bit 3
I
NA
V15
pr1_mii1_rxdv
MII Receive Data Valid
I
NA
T16
pr1_mii1_rxer
MII Receive Data Error
I
NA
V17
pr1_mii1_rxlink
MII Receive Link
I
V18
U18
pr1_mii1_txd0
MII Transmit Data bit 0
O
NA
R14
pr1_mii1_txd1
MII Transmit Data bit 1
O
NA
T14
pr1_mii1_txd2
MII Transmit Data bit 2
O
NA
U14
pr1_mii1_txd3
MII Transmit Data bit 3
O
NA
V14
pr1_mii1_txen
MII Transmit Enable
O
W18
U17
pr1_mii_mr1_clk
MII Receive Clock
I
NA
U16
pr1_mii_mt1_clk
MII Transmit Clock
I
NA
R13
Table 4-31. PRU-ICSS/UART0 Signals Description
SIGNAL NAME [1]
TYPE
[3]
DESCRIPTION [2]
ZCE BALL [4]
ZCZ BALL [4]
pr1_uart0_cts_n
UART Clear to Send
I
A18, E17
A17, D18
pr1_uart0_rts_n
UART Request to Send
O
B18, D19
B17, D17
pr1_uart0_rxd
UART Receive Data
I
B17, D18
B16, D16
pr1_uart0_txd
UART Transmit Data
O
A17, C19
A16, D15
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PRU0
Table 4-32. PRU0/General-Purpose Inputs Signals Description
SIGNAL NAME [1]
TYPE
[3]
DESCRIPTION [2]
ZCE BALL [4]
ZCZ BALL [4]
pr1_pru0_pru_r31_0
PRU0 Data In
I
NA
A13
pr1_pru0_pru_r31_1
PRU0 Data In
I
NA
B13
pr1_pru0_pru_r31_10
PRU0 Data In
I
H17
G15
pr1_pru0_pru_r31_11
PRU0 Data In
I
G18
G16
pr1_pru0_pru_r31_12
PRU0 Data In
I
G19
G17
pr1_pru0_pru_r31_13
PRU0 Data In
I
G17
G18
pr1_pru0_pru_r31_14
PRU0 Data In
I
W17
V13
pr1_pru0_pru_r31_15
PRU0 Data In
I
V17
U13
pr1_pru0_pru_r31_16
PRU0 Data In Capture Enable
I
B15, C19
D14, D15
pr1_pru0_pru_r31_2
PRU0 Data In
I
NA
D12
pr1_pru0_pru_r31_3
PRU0 Data In
I
NA
C12
pr1_pru0_pru_r31_4
PRU0 Data In
I
NA
B12
pr1_pru0_pru_r31_5
PRU0 Data In
I
NA
C13
pr1_pru0_pru_r31_6
PRU0 Data In
I
NA
D13
pr1_pru0_pru_r31_7
PRU0 Data In
I
NA
A14
pr1_pru0_pru_r31_8
PRU0 Data In
I
H19
F17
pr1_pru0_pru_r31_9
PRU0 Data In
I
H18
F18
Table 4-33. PRU0/General-Purpose Outputs Signals Description
SIGNAL NAME [1]
DESCRIPTION [2]
TYPE
[3]
ZCE BALL [4]
ZCZ BALL [4]
pr1_pru0_pru_r30_0
PRU0 Data Out
O
NA
A13
pr1_pru0_pru_r30_1
PRU0 Data Out
O
NA
B13
pr1_pru0_pru_r30_10
PRU0 Data Out
O
H17
G15
pr1_pru0_pru_r30_11
PRU0 Data Out
O
G18
G16
pr1_pru0_pru_r30_12
PRU0 Data Out
O
G19
G17
pr1_pru0_pru_r30_13
PRU0 Data Out
O
G17
G18
pr1_pru0_pru_r30_14
PRU0 Data Out
O
U13
T12
pr1_pru0_pru_r30_15
PRU0 Data Out
O
T13
R12
pr1_pru0_pru_r30_2
PRU0 Data Out
O
NA
D12
pr1_pru0_pru_r30_3
PRU0 Data Out
O
NA
C12
pr1_pru0_pru_r30_4
PRU0 Data Out
O
NA
B12
pr1_pru0_pru_r30_5
PRU0 Data Out
O
NA
C13
pr1_pru0_pru_r30_6
PRU0 Data Out
O
NA
D13
pr1_pru0_pru_r30_7
PRU0 Data Out
O
NA
A14
pr1_pru0_pru_r30_8
PRU0 Data Out
O
H19
F17
pr1_pru0_pru_r30_9
PRU0 Data Out
O
H18
F18
66
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4.3.4.2
SPRS717J – OCTOBER 2011 – REVISED APRIL 2016
PRU1
Table 4-34. PRU1/General-Purpose Inputs Signals Description
SIGNAL NAME [1]
TYPE
[3]
DESCRIPTION [2]
ZCE BALL [4]
ZCZ BALL [4]
pr1_pru1_pru_r31_0
PRU1 Data In
I
U1
R1
pr1_pru1_pru_r31_1
PRU1 Data In
I
U2
R2
pr1_pru1_pru_r31_10
PRU1 Data In
I
W5
V5
pr1_pru1_pru_r31_11
PRU1 Data In
I
W7
R6
pr1_pru1_pru_r31_12
PRU1 Data In
I
V14
U9
pr1_pru1_pru_r31_13
PRU1 Data In
I
U15
V9
pr1_pru1_pru_r31_14
PRU1 Data In
I
E19
E15
pr1_pru1_pru_r31_15
PRU1 Data In
I
F17
E16
pr1_pru1_pru_r31_16
PRU1 Data In Capture Enable
I
C15, D18
A15, D16
pr1_pru1_pru_r31_2
PRU1 Data In
I
V1
R3
pr1_pru1_pru_r31_3
PRU1 Data In
I
V2
R4
pr1_pru1_pru_r31_4
PRU1 Data In
I
W2
T1
pr1_pru1_pru_r31_5
PRU1 Data In
I
W3
T2
pr1_pru1_pru_r31_6
PRU1 Data In
I
V3
T3
pr1_pru1_pru_r31_7
PRU1 Data In
I
U3
T4
pr1_pru1_pru_r31_8
PRU1 Data In
I
U7
U5
pr1_pru1_pru_r31_9
PRU1 Data In
I
T7
R5
Table 4-35. PRU1/General-Purpose Outputs Signals Description
SIGNAL NAME [1]
DESCRIPTION [2]
TYPE
[3]
ZCE BALL [4]
ZCZ BALL [4]
pr1_pru1_pru_r30_0
PRU1 Data Out
O
U1
R1
pr1_pru1_pru_r30_1
PRU1 Data Out
O
U2
R2
pr1_pru1_pru_r30_10
PRU1 Data Out
O
W5
V5
pr1_pru1_pru_r30_11
PRU1 Data Out
O
W7
R6
pr1_pru1_pru_r30_12
PRU1 Data Out
O
V14
U9
pr1_pru1_pru_r30_13
PRU1 Data Out
O
U15
V9
pr1_pru1_pru_r30_14
PRU1 Data Out
O
E19
E15
pr1_pru1_pru_r30_15
PRU1 Data Out
O
F17
E16
pr1_pru1_pru_r30_2
PRU1 Data Out
O
V1
R3
pr1_pru1_pru_r30_3
PRU1 Data Out
O
V2
R4
pr1_pru1_pru_r30_4
PRU1 Data Out
O
W2
T1
pr1_pru1_pru_r30_5
PRU1 Data Out
O
W3
T2
pr1_pru1_pru_r30_6
PRU1 Data Out
O
V3
T3
pr1_pru1_pru_r30_7
PRU1 Data Out
O
U3
T4
pr1_pru1_pru_r30_8
PRU1 Data Out
O
U7
U5
pr1_pru1_pru_r30_9
PRU1 Data Out
O
T7
R5
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Removable Media Interfaces
Table 4-36. Removable Media Interfaces/MMC0 Signals Description
SIGNAL NAME [1]
TYPE
[3]
DESCRIPTION [2]
ZCE BALL [4]
ZCZ BALL [4]
mmc0_clk
MMC/SD/SDIO Clock
I/O
G19
G17
mmc0_cmd
MMC/SD/SDIO Command
I/O
G17
G18
mmc0_dat0
MMC/SD/SDIO Data Bus
I/O
G18
G16
mmc0_dat1
MMC/SD/SDIO Data Bus
I/O
H17
G15
mmc0_dat2
MMC/SD/SDIO Data Bus
I/O
H18
F18
mmc0_dat3
MMC/SD/SDIO Data Bus
I/O
H19
F17
mmc0_dat4
MMC/SD/SDIO Data Bus
I/O
N16
L16
mmc0_dat5
MMC/SD/SDIO Data Bus
I/O
N17
L17
mmc0_dat6
MMC/SD/SDIO Data Bus
I/O
M19
L18
mmc0_dat7
MMC/SD/SDIO Data Bus
I/O
N19
K18
mmc0_pow
MMC/SD Power Switch Control
O
B16, K18
C15, H18
mmc0_sdcd
SD Card Detect
I
B16, P17
A13, C15, M17
mmc0_sdwp
SD Write Protect
I
E18, R19
B12, C18, M18
Table 4-37. Removable Media Interfaces/MMC1 Signals Description
SIGNAL NAME [1]
TYPE
[3]
DESCRIPTION [2]
ZCE BALL [4]
ZCZ BALL [4]
mmc1_clk
MMC/SD/SDIO Clock
I/O
L18, R19, V14
K17, M18, U9
mmc1_cmd
MMC/SD/SDIO Command
I/O
M18, P17, U15
K16, M17, V9
mmc1_dat0
MMC/SD/SDIO Data Bus
I/O
N19, V15, W10
K18, U10, U7
mmc1_dat1
MMC/SD/SDIO Data Bus
I/O
M19, V9, W16
L18, T10, V7
mmc1_dat2
MMC/SD/SDIO Data Bus
I/O
N17, T12, V12
L17, R8, T11
mmc1_dat3
MMC/SD/SDIO Data Bus
I/O
N16, U12, W13
L16, T8, U12
mmc1_dat4
MMC/SD/SDIO Data Bus
I/O
U13, V13
T12, U8
mmc1_dat5
MMC/SD/SDIO Data Bus
I/O
T13, W14
R12, V8
mmc1_dat6
MMC/SD/SDIO Data Bus
I/O
U14, W17
R9, V13
mmc1_dat7
MMC/SD/SDIO Data Bus
I/O
V17, W15
T9, U13
mmc1_sdcd
SD Card Detect
I
R15
B13, T17
mmc1_sdwp
SD Write Protect
I
B17, D18
B16, D16
Table 4-38. Removable Media Interfaces/MMC2 Signals Description
SIGNAL NAME [1]
TYPE
[3]
DESCRIPTION [2]
ZCE BALL [4]
ZCZ BALL [4]
mmc2_clk
MMC/SD/SDIO Clock
I/O
P19, R19, V16
L15, M18, V12
mmc2_cmd
MMC/SD/SDIO Command
I/O
K17, P17, U17
J16, M17, T13
mmc2_dat0
MMC/SD/SDIO Data Bus
I/O
L19, U13
J17, T12, V14
mmc2_dat1
MMC/SD/SDIO Data Bus
I/O
M17, T13
J18, R12, U14
mmc2_dat2
MMC/SD/SDIO Data Bus
I/O
N18, W17
K15, T14, V13
mmc2_dat3
MMC/SD/SDIO Data Bus
I/O
J19, V17, V18
H16, U13, U18
mmc2_dat4
MMC/SD/SDIO Data Bus
I/O
V15
U10, U15
mmc2_dat5
MMC/SD/SDIO Data Bus
I/O
W16
T10, T15
mmc2_dat6
MMC/SD/SDIO Data Bus
I/O
T12
T11, V16
mmc2_dat7
MMC/SD/SDIO Data Bus
I/O
U12
U12
mmc2_sdcd
SD Card Detect
I
W18
D12, U17
mmc2_sdwp
SD Write Protect
I
A17, C19
A16, D15
68
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4.3.6
4.3.6.1
SPRS717J – OCTOBER 2011 – REVISED APRIL 2016
Serial Communication Interfaces
CAN
Table 4-39. CAN/DCAN0 Signals Description
SIGNAL NAME [1]
TYPE
[3]
DESCRIPTION [2]
ZCE BALL [4]
ZCZ BALL [4]
dcan0_rx
DCAN0 Receive Data
I
D19, F17, N18
D17, E16, K15
dcan0_tx
DCAN0 Transmit Data
O
E17, E19, M17
D18, E15, J18
Table 4-40. CAN/DCAN1 Signals Description
SIGNAL NAME [1]
TYPE
[3]
DESCRIPTION [2]
ZCE BALL [4]
ZCZ BALL [4]
dcan1_rx
DCAN1 Receive Data
I
C19, F18, G17
D15, E17, G18
dcan1_tx
DCAN1 Transmit Data
O
D18, F19, G19
D16, E18, G17
Terminal Configuration and Functions
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GEMAC_CPSW
Table 4-41. GEMAC_CPSW/MDIO Signals Description
SIGNAL NAME [1]
TYPE
[3]
DESCRIPTION [2]
ZCE BALL [4]
ZCZ BALL [4]
mdio_clk
MDIO Clk
O
R19
M18
mdio_data
MDIO Data
I/O
P17
M17
Table 4-42. GEMAC_CPSW/MII1 Signals Description
SIGNAL NAME [1]
TYPE
[3]
DESCRIPTION [2]
ZCE BALL [4]
ZCZ BALL [4]
gmii1_col
MII Colision
I
J19
H16
gmii1_crs
MII Carrier Sense
I
J18
H17
gmii1_rxclk
MII Receive Clock
I
M19
L18
gmii1_rxd0
MII Receive Data bit 0
I
P18
M16
gmii1_rxd1
MII Receive Data bit 1
I
P19
L15
gmii1_rxd2
MII Receive Data bit 2
I
N16
L16
gmii1_rxd3
MII Receive Data bit 3
I
N17
L17
gmii1_rxdv
MII Receive Data Valid
I
L19
J17
gmii1_rxer
MII Receive Data Error
I
K19
J15
gmii1_txclk
MII Transmit Clock
I
N19
K18
gmii1_txd0
MII Transmit Data bit 0
O
L18
K17
gmii1_txd1
MII Transmit Data bit 1
O
M18
K16
gmii1_txd2
MII Transmit Data bit 2
O
N18
K15
gmii1_txd3
MII Transmit Data bit 3
O
M17
J18
gmii1_txen
MII Transmit Enable
O
K17
J16
Table 4-43. GEMAC_CPSW/MII2 Signals Description
SIGNAL NAME [1]
TYPE
[3]
DESCRIPTION [2]
ZCE BALL [4]
ZCZ BALL [4]
gmii2_col
MII Colision
I
V18
U18
gmii2_crs
MII Carrier Sense
I
R15
T17
gmii2_rxclk
MII Receive Clock
I
NA
T15
gmii2_rxd0
MII Receive Data bit 0
I
NA
V17
gmii2_rxd1
MII Receive Data bit 1
I
NA
T16
gmii2_rxd2
MII Receive Data bit 2
I
NA
U16
gmii2_rxd3
MII Receive Data bit 3
I
NA
V16
gmii2_rxdv
MII Receive Data Valid
I
NA
V14
gmii2_rxer
MII Receive Data Error
I
W18
U17
gmii2_txclk
MII Transmit Clock
I
NA
U15
gmii2_txd0
MII Transmit Data bit 0
O
NA
V15
gmii2_txd1
MII Transmit Data bit 1
O
NA
R14
gmii2_txd2
MII Transmit Data bit 2
O
NA
T14
gmii2_txd3
MII Transmit Data bit 3
O
NA
U14
gmii2_txen
MII Transmit Enable
O
NA
R13
Table 4-44. GEMAC_CPSW/RGMII1 Signals Description
SIGNAL NAME [1]
rgmii1_rclk
70
TYPE
[3]
DESCRIPTION [2]
RGMII Receive Clock
Terminal Configuration and Functions
I
ZCE BALL [4]
M19
ZCZ BALL [4]
L18
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Table 4-44. GEMAC_CPSW/RGMII1 Signals Description (continued)
SIGNAL NAME [1]
TYPE
[3]
DESCRIPTION [2]
ZCE BALL [4]
ZCZ BALL [4]
rgmii1_rctl
RGMII Receive Control
I
L19
J17
rgmii1_rd0
RGMII Receive Data bit 0
I
P18
M16
rgmii1_rd1
RGMII Receive Data bit 1
I
P19
L15
rgmii1_rd2
RGMII Receive Data bit 2
I
N16
L16
rgmii1_rd3
RGMII Receive Data bit 3
I
N17
L17
rgmii1_tclk
RGMII Transmit Clock
O
N19
K18
rgmii1_tctl
RGMII Transmit Control
O
K17
J16
rgmii1_td0
RGMII Transmit Data bit 0
O
L18
K17
rgmii1_td1
RGMII Transmit Data bit 1
O
M18
K16
rgmii1_td2
RGMII Transmit Data bit 2
O
N18
K15
rgmii1_td3
RGMII Transmit Data bit 3
O
M17
J18
Table 4-45. GEMAC_CPSW/RGMII2 Signals Description
SIGNAL NAME [1]
TYPE
[3]
DESCRIPTION [2]
ZCE BALL [4]
ZCZ BALL [4]
rgmii2_rclk
RGMII Receive Clock
I
NA
T15
rgmii2_rctl
RGMII Receive Control
I
NA
V14
rgmii2_rd0
RGMII Receive Data bit 0
I
NA
V17
rgmii2_rd1
RGMII Receive Data bit 1
I
NA
T16
rgmii2_rd2
RGMII Receive Data bit 2
I
NA
U16
rgmii2_rd3
RGMII Receive Data bit 3
I
NA
V16
rgmii2_tclk
RGMII Transmit Clock
O
NA
U15
rgmii2_tctl
RGMII Transmit Control
O
NA
R13
rgmii2_td0
RGMII Transmit Data bit 0
O
NA
V15
rgmii2_td1
RGMII Transmit Data bit 1
O
NA
R14
rgmii2_td2
RGMII Transmit Data bit 2
O
NA
T14
rgmii2_td3
RGMII Transmit Data bit 3
O
NA
U14
Table 4-46. GEMAC_CPSW/RMII1 Signals Description
SIGNAL NAME [1]
TYPE
[3]
DESCRIPTION [2]
ZCE BALL [4]
ZCZ BALL [4]
rmii1_crs_dv
RMII Carrier Sense / Data Valid
I
J18
H17
rmii1_refclk
RMII Reference Clock
I/O
K18
H18
rmii1_rxd0
RMII Receive Data bit 0
I
P18
M16
rmii1_rxd1
RMII Receive Data bit 1
I
P19
L15
rmii1_rxer
RMII Receive Data Error
I
K19
J15
rmii1_txd0
RMII Transmit Data bit 0
O
L18
K17
rmii1_txd1
RMII Transmit Data bit 1
O
M18
K16
rmii1_txen
RMII Transmit Enable
O
K17
J16
Table 4-47. GEMAC_CPSW/RMII2 Signals Description
SIGNAL NAME [1]
TYPE
[3]
DESCRIPTION [2]
ZCE BALL [4]
ZCZ BALL [4]
rmii2_crs_dv
RMII Carrier Sense / Data Valid
I
R15, U17
T13, T17
rmii2_refclk
RMII Reference Clock
I/O
J19
H16
rmii2_rxd0
RMII Receive Data bit 0
I
NA
V17
rmii2_rxd1
RMII Receive Data bit 1
I
NA
T16
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Table 4-47. GEMAC_CPSW/RMII2 Signals Description (continued)
SIGNAL NAME [1]
TYPE
[3]
DESCRIPTION [2]
ZCE BALL [4]
ZCZ BALL [4]
rmii2_rxer
RMII Receive Data Error
I
W18
U17
rmii2_txd0
RMII Transmit Data bit 0
O
NA
V15
rmii2_txd1
RMII Transmit Data bit 1
O
NA
R14
rmii2_txen
RMII Transmit Enable
O
NA
R13
72
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4.3.6.3
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I2C
Table 4-48. I2C/I2C0 Signals Description
SIGNAL NAME [1]
DESCRIPTION [2]
TYPE
[3]
ZCE BALL [4]
ZCZ BALL [4]
I2C0_SCL
I2C0 Clock
I/OD
B19
C16
I2C0_SDA
I2C0 Data
I/OD
C18
C17
Table 4-49. I2C/I2C1 Signals Description
SIGNAL NAME [1]
DESCRIPTION [2]
TYPE
[3]
ZCE BALL [4]
ZCZ BALL [4]
I2C1_SCL
I2C1 Clock
I/OD
A17, C19, F18,
K19
A16, D15, E17,
J15
I2C1_SDA
I2C1 Data
I/OD
B17, D18, F19,
J18
B16, D16, E18,
H17
Table 4-50. I2C/I2C2 Signals Description
SIGNAL NAME [1]
DESCRIPTION [2]
TYPE
[3]
ZCE BALL [4]
ZCZ BALL [4]
I2C2_SCL
I2C2 Clock
I/OD
B18, D19, F17
B17, D17, E16
I2C2_SDA
I2C2 Data
I/OD
A18, E17, E19
A17, D18, E15
Terminal Configuration and Functions
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McASP
Table 4-51. McASP/MCASP0 Signals Description
SIGNAL NAME [1]
DESCRIPTION [2]
TYPE
[3]
ZCE BALL [4]
ZCZ BALL [4]
mcasp0_aclkr
McASP0 Receive Bit Clock
I/O
L19, V18, V6
B12, J17, U18,
V2
mcasp0_aclkx
McASP0 Transmit Bit Clock
I/O
N19, V4
A13, K18, U1,
V16
mcasp0_ahclkr
McASP0 Receive Master Clock
I/O
V5
C12, U4
mcasp0_ahclkx
McASP0 Transmit Master Clock
I/O
N18, V7
A14, K15, T5
mcasp0_axr0
McASP0 Serial Data (IN/OUT)
I/O
N17, U5
D12, L17, T16,
U3
mcasp0_axr1
McASP0 Serial Data (IN/OUT)
I/O
N16, W6
D13, L16, V17,
V4
mcasp0_axr2
McASP0 Serial Data (IN/OUT)
I/O
J19, V5, V6
B12, C12, H16,
U4, V2
mcasp0_axr3
McASP0 Serial Data (IN/OUT)
I/O
P18, U6, V7
A14, C13, M16,
T5, V3
mcasp0_fsr
McASP0 Receive Frame Sync
I/O
M17, U6, V16
C13, J18, V12,
V3
mcasp0_fsx
McASP0 Transmit Frame Sync
I/O
M19, W4
B13, L18, U16,
U2
Table 4-52. McASP/MCASP1 Signals Description
SIGNAL NAME [1]
DESCRIPTION [2]
TYPE
[3]
ZCE BALL [4]
ZCZ BALL [4]
mcasp1_aclkr
McASP1 Receive Bit Clock
I/O
L18, P18
K17, M16
mcasp1_aclkx
McASP1 Transmit Bit Clock
I/O
J18, L19
B12, H17, J17
mcasp1_ahclkr
McASP1 Receive Master Clock
I/O
P18
M16
mcasp1_ahclkx
McASP1 Transmit Master Clock
I/O
K18, P18
H18, M16
mcasp1_axr0
McASP1 Serial Data (IN/OUT)
I/O
K17, N18
D13, J16, K15
mcasp1_axr1
McASP1 Serial Data (IN/OUT)
I/O
M18
A14, K16
mcasp1_axr2
McASP1 Serial Data (IN/OUT)
I/O
J19, L18
H16, K17
mcasp1_axr3
McASP1 Serial Data (IN/OUT)
I/O
K18, P19
H18, L15
mcasp1_fsr
McASP1 Receive Frame Sync
I/O
M18, P19
K16, L15
mcasp1_fsx
McASP1 Transmit Frame Sync
I/O
K19, M17
C13, J15, J18
74
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SPI
Table 4-53. SPI/SPI0 Signals Description
SIGNAL NAME [1]
DESCRIPTION [2]
TYPE
[3]
ZCE BALL [4]
ZCZ BALL [4]
spi0_cs0
SPI Chip Select
I/O
A17
A16
spi0_cs1
SPI Chip Select
I/O
B16
C15
spi0_d0
SPI Data
I/O
B18
B17
spi0_d1
SPI Data
I/O
B17
B16
spi0_sclk
SPI Clock
I/O
A18
A17
Table 4-54. SPI/SPI1 Signals Description
SIGNAL NAME [1]
DESCRIPTION [2]
TYPE
[3]
ZCE BALL [4]
ZCZ BALL [4]
spi1_cs0
SPI Chip Select
I/O
E17, E19, F18,
K18
C12, D18, E15,
E17, H18
spi1_cs1
SPI Chip Select
I/O
C15, D19, E18,
F17
A15, C18, D17,
E16
spi1_d0
SPI Data
I/O
F19, J18
B13, E18, H17
spi1_d1
SPI Data
I/O
F18, K19
D12, E17, J15
spi1_sclk
SPI Clock
I/O
E18, J19
A13, C18, H16
Terminal Configuration and Functions
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UART
Table 4-55. UART/UART0 Signals Description
SIGNAL NAME [1]
TYPE
[3]
DESCRIPTION [2]
ZCE BALL [4]
ZCZ BALL [4]
uart0_ctsn
UART Clear to Send
I
F19
E18
uart0_rtsn
UART Request to Send
O
F18
E17
uart0_rxd
UART Receive Data
I
E19
E15
uart0_txd
UART Transmit Data
O
F17
E16
Table 4-56. UART/UART1 Signals Description
SIGNAL NAME [1]
TYPE
[3]
DESCRIPTION [2]
ZCE BALL [4]
ZCZ BALL [4]
uart1_ctsn
UART Clear to Send
I
E17
D18
uart1_dcdn
UART Data Carrier Detect
I
H19, N19
F17, K18
uart1_dsrn
UART Data Set Ready
I
H18, M19
F18, L18
uart1_dtrn
UART Data Terminal Ready
O
H17, N17
G15, L17
uart1_rin
UART Ring Indicator
I
G18, N16
G16, L16
uart1_rtsn
UART Request to Send
O
D19
D17
uart1_rxd
UART Receive Data
I
D18
D16
uart1_txd
UART Transmit Data
O
C19
D15
Table 4-57. UART/UART2 Signals Description
SIGNAL NAME [1]
TYPE
[3]
DESCRIPTION [2]
ZCE BALL [4]
ZCZ BALL [4]
uart2_ctsn
UART Clear to Send
I
C18, V4
C17, U1
uart2_rtsn
UART Request to Send
O
B19, W4
C16, U2
uart2_rxd
UART Receive Data
I
A18, G19, J18,
N19
A17, G17, H17,
K18
uart2_txd
UART Transmit Data
O
B18, G17, K19,
M19
B17, G18, J15,
L18
Table 4-58. UART/UART3 Signals Description
SIGNAL NAME [1]
TYPE
[3]
DESCRIPTION [2]
ZCE BALL [4]
ZCZ BALL [4]
uart3_ctsn
UART Clear to Send
I
G19, P17, U5
G17, M17, U3
uart3_rtsn
UART Request to Send
O
G17, R19, V5
G18, M18, U4
uart3_rxd
UART Receive Data
I
B16, H17, N17
C15, G15, L17
uart3_txd
UART Transmit Data
O
E18, G18, N16
C18, G16, L16
Table 4-59. UART/UART4 Signals Description
SIGNAL NAME [1]
TYPE
[3]
DESCRIPTION [2]
ZCE BALL [4]
ZCZ BALL [4]
uart4_ctsn
UART Clear to Send
I
H19, V6
F17, V2
uart4_rtsn
UART Request to Send
O
H18, U6
F18, V3
uart4_rxd
UART Receive Data
I
F19, M17, R15
E18, J18, T17
uart4_txd
UART Transmit Data
O
F18, N18, W18
E17, K15, U17
76
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Table 4-60. UART/UART5 Signals Description
SIGNAL NAME [1]
TYPE
[3]
DESCRIPTION [2]
ZCE BALL [4]
ZCZ BALL [4]
uart5_ctsn
UART Clear to Send
I
H17, J18, W6
G15, H17, V4
uart5_rtsn
UART Request to Send
O
G18, K19, V7
G16, J15, T5
uart5_rxd
UART Receive Data
I
J19, P17, W4,
W6
H16, M17, U2, V4
uart5_txd
UART Transmit Data
O
K18, L19, R19,
V4
H18, J17, M18,
U1
Terminal Configuration and Functions
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USB
Table 4-61. USB/USB0 Signals Description
SIGNAL NAME [1]
DESCRIPTION [2]
TYPE
[3]
ZCE BALL [4]
ZCZ BALL [4]
USB0_CE
USB0 Active high Charger Enable output
A
T18
M15
USB0_DM
USB0 Data minus
A
U18
N18
USB0_DP
USB0 Data plus
A
U19
N17
USB0_DRVVBUS
USB0 Active high VBUS control output
O
G16
F16
USB0_ID
USB0 OTG ID (Micro-A or Micro-B Plug)
A
V19
P16
USB0_VBUS
USB0 VBUS
A
T19
P15
Table 4-62. USB/USB1 Signals Description
SIGNAL NAME [1]
DESCRIPTION [2]
TYPE
[3]
ZCE BALL [4]
ZCZ BALL [4]
USB1_CE
USB1 Active high Charger Enable output
A
NA
P18
USB1_DM
USB1 Data minus
A
NA
R18
USB1_DP
USB1 Data plus
A
NA
R17
USB1_DRVVBUS
USB1 Active high VBUS control output
O
NA
F15
USB1_ID
USB1 OTG ID (Micro-A or Micro-B Plug)
A
NA
P17
USB1_VBUS
USB1 VBUS
A
NA
T18
78
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5 Specifications
5.1
Absolute Maximum Ratings
over junction temperature range (unless otherwise noted)(1)(2)
MIN
MAX
UNIT
VDD_MPU(3)
Supply voltage for the MPU core domain
–0.5
1.5
V
VDD_CORE
Supply voltage for the core domain
–0.5
1.5
V
CAP_VDD_RTC(4)
Supply voltage for the RTC core domain
–0.5
1.5
V
VPP(5)
Supply voltage for the FUSE ROM domain
–0.5
2.2
V
VDDS_RTC
Supply voltage for the RTC domain
–0.5
2.1
V
VDDS_OSC
Supply voltage for the System oscillator
–0.5
2.1
V
VDDS_SRAM_CORE_BG
Supply voltage for the Core SRAM LDOs
–0.5
2.1
V
VDDS_SRAM_MPU_BB
Supply voltage for the MPU SRAM LDOs
–0.5
2.1
V
VDDS_PLL_DDR
Supply voltage for the DPLL DDR
–0.5
2.1
V
VDDS_PLL_CORE_LCD
Supply voltage for the DPLL Core and LCD
–0.5
2.1
V
VDDS_PLL_MPU
Supply voltage for the DPLL MPU
–0.5
2.1
V
VDDS_DDR
Supply voltage for the DDR I/O domain
–0.5
2.1
V
VDDS
Supply voltage for all dual-voltage I/O domains
–0.5
2.1
V
VDDA1P8V_USB0
Supply voltage for USBPHY
–0.5
2.1
V
VDDA1P8V_USB1(6)
Supply voltage for USBPHY
–0.5
2.1
V
VDDA_ADC
Supply voltage for ADC
–0.5
2.1
V
VDDSHV1
Supply voltage for the dual-voltage I/O domain
–0.5
3.8
V
VDDSHV2(6)
Supply voltage for the dual-voltage I/O domain
–0.5
3.8
V
VDDSHV3(6)
Supply voltage for the dual-voltage I/O domain
–0.5
3.8
V
VDDSHV4
Supply voltage for the dual-voltage I/O domain
–0.5
3.8
V
VDDSHV5
Supply voltage for the dual-voltage I/O domain
–0.5
3.8
V
VDDSHV6
Supply voltage for the dual-voltage I/O domain
–0.5
3.8
V
VDDA3P3V_USB0
Supply voltage for USBPHY
–0.5
4
V
VDDA3P3V_USB1(6)
Supply voltage for USBPHY
–0.5
4
V
USB0_VBUS(7)
Supply voltage for USB VBUS comparator input
–0.5
5.25
V
USB1_VBUS(6)(7)
Supply voltage for USB VBUS comparator input
–0.5
5.25
V
DDR_VREF
Supply voltage for the DDR SSTL and HSTL reference voltage
–0.3
1.1
V
Steady state max voltage
at all I/O pins(8)
(9)
–0.5 V to I/O supply voltage + 0.3 V
USB0_ID
Steady state maximum voltage for the USB ID input
–0.5
2.1
V
USB1_ID(6)(9)
Steady state maximum voltage for the USB ID input
–0.5
2.1
V
Transient overshoot and
undershoot specification at
I/O terminal
Latch-up performance(10)
25% of corresponding I/O supply
voltage for up to 30% of signal
period
Class II (105°C)
Storage temperature,
Tstg(11)
45
–55
mA
155
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to their associated VSS or VSSA_x.
(3) Not available on the ZCE package. VDD_MPU is merged with VDD_CORE on the ZCE package.
(4) This supply is sourced from an internal LDO when RTC_KALDO_ENn is low. If RTC_KALDO_ENn is high, this supply must be sourced
from an external power supply.
(5) During functional operation, this pin is a no connect.
(6) Not available on the ZCE package.
(7) This terminal is connected to a fail-safe I/O and does not have a dependence on any I/O supply voltage.
(8) This parameter applies to all I/O terminals which are not fail-safe and the requirement applies to all values of I/O supply voltage. For
example, if the voltage applied to a specific I/O supply is 0 volts the valid input voltage range for any I/O powered by that supply will be
–0.5 to +0.3 V. Apply special attention anytime peripheral devices are not powered from the same power sources used to power the
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Absolute Maximum Ratings (continued)
over junction temperature range (unless otherwise noted)(1)(2)
respective I/O supply. It is important the attached peripheral never sources a voltage outside the valid input voltage range, including
power supply ramp-up and ramp-down sequences.
(9) This terminal is connected to analog circuits in the respective USB PHY. The circuit sources a known current while measuring the
voltage to determine if the terminal is connected to VSSA_USB with a resistance less than 10 Ω or greater than 100 kΩ. The terminal
should be connected to ground for USB host operation or open-circuit for USB peripheral operation, and should never be connected to
any external voltage source.
(10) Based on JEDEC JESD78D [IC Latch-Up Test].
(11) For tape and reel the storage temperature range is [–10°C; +50°C] with a maximum relative humidity of 70%. TI recommends returning
to ambient room temperature before usage.
Fail-safe I/O terminals are designed such they do not have dependencies on the respective I/O power supply voltage. This allows
external voltage sources to be connected to these I/O terminals when the respective I/O power supplies are turned off. The USB0_VBUS
and USB1_VBUS are the only fail-safe I/O terminals. All other I/O terminals are not fail-safe and the voltage applied to them should be
limited to the value defined by the steady state max. Voltage at all I/O pins parameter in Section 5.1.
5.2
ESD Ratings
VALUE
VESD
(1)
(2)
80
Electrostatic discharge
(ESD) performance:
Human Body Model (HBM), per ANSI/ESDA/JEDEC JS001 (1)
±2000
Charged Device Model (CDM), per JESD22-C101 (2)
±500
UNIT
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
Specifications
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5.3
SPRS717J – OCTOBER 2011 – REVISED APRIL 2016
Power-On Hours (POH)
Table 5-1. Reliability Data(1)(2)(3)(4)
OPERATING
CONDITION
COMMERCIAL
INDUSTRIAL
EXTENDED
INDUSTRIAL EXTENDED
JUNCTION
TEMP (TJ)
LIFETIME
(POH)(5)
JUNCTION
TEMP (TJ)
LIFETIME
(POH)(5)
JUNCTION
TEMP (TJ)
LIFETIME
(POH)(5)
JUNCTION
TEMP (TJ)
LIFETIME
(POH)(5)
Nitro
0°C to 90°C
100K
–40°C to 90°C
100K
–40°C to 105°C
37K
–40°C to 125°C
–
Turbo
0°C to 90°C
100K
–40°C to 90°C
100K
–40°C to 105°C
80K
–40°C to 125°C
–
OPP120
0°C to 90°C
100K
–40°C to 90°C
100K
–40°C to 105°C
100K
–40°C to 125°C
–
OPP100
0°C to 90°C
100K
–40°C to 90°C
100K
–40°C to 105°C
100K
–40°C to 125°C
35K
OPP50
0°C to 90°C
100K
–40°C to 90°C
100K
–40°C to 105°C
100K
–40°C to 125°C
95K
(1) The power-on hours (POH) information in this table is provided solely for your convenience and does not extend or modify the warranty
provided under TI's standard terms and conditions for TI semiconductor products.
(2) To avoid significant degradation, the device power-on hours (POH) must be limited as described in this table.
(3) Logic functions and parameter values are not assured out of the range specified in the recommended operating conditions.
(4) The previous notations cannot be deemed a warranty or deemed to extend or modify the warranty under TI's standard terms and
conditions for TI semiconductor products.
(5) POH = Power-on hours when the device is fully functional.
5.4
Operating Performance Points (OPPs)
Device OPPs are defined in Table 5-2 through Table 5-9.
Table 5-2. VDD_CORE OPPs for ZCZ Package
With Device Revision Code "Blank"(1)
VDD_CORE
OPP
Device Rev.
"Blank"
VDD_CORE
MIN
NOM
MAX
DDR3,
DDR3L(2)
DDR2(2)
mDDR(2)
L3 and L4
OPP100
1.056 V
1.100 V
1.144 V
400 MHz
266 MHz
200 MHz
200 and 100
MHz
OPP50
0.912 V
0.950 V
0.988 V
—
125 MHz
90 MHz
100 and 50
MHz
(1) Frequencies in this table indicate maximum performance for a given OPP condition.
(2) This parameter represents the maximum memory clock frequency. Because data is transferred on both edges of the clock, double-data
rate (DDR), the maximum data rate is two times the maximum memory clock frequency defined in this table.
Table 5-3. VDD_MPU OPPs for ZCZ Package
With Device Revision Code "Blank"(1)
VDD_MPU OPP
Device Rev. "Blank"
VDD_MPU
ARM (A8)
MIN
NOM
MAX
Turbo
1.210 V
1.260 V
1.326 V
720 MHz
OPP120
1.152 V
1.200 V
1.248 V
600 MHz
OPP100(2)
1.056 V
1.100 V
1.144 V
500 MHz
(3)
1.056 V
1.100 V
1.144 V
275 MHz
OPP100
(1) Frequencies in this table indicate maximum performance for a given OPP condition.
(2) Applies to all orderable AM335__ZCZ_50 (500-MHz speed grade) or higher devices.
(3) Applies to all orderable AM335__ZCZ_27 (275-MHz speed grade) devices.
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Table 5-4. Valid Combinations of VDD_CORE and
VDD_MPU OPPs for ZCZ Package
With Device Revision Code "Blank"
VDD_CORE
VDD_MPU
OPP50
OPP100
OPP100
OPP100
OPP100
OPP120
OPP100
Turbo
Table 5-5. VDD_CORE OPPs for ZCE Package
With Device Revision Code "Blank"(1)
VDD_CORE
OPP
Device Rev.
"Blank"
VDD_MPU(2)
ARM (A8)
DDR3,
DDR3L(3)
DDR2(3)
mDDR(3)
L3 and L4
1.144 V
500 MHz
400 MHz
266 MHz
200 MHz
200 and 100
MHz
1.144 V
275 MHz
400 MHz
266 MHz
200 MHz
200 and 100
MHz
MIN
NOM
MAX
OPP100
1.056 V
1.100 V
OPP100
1.056 V
1.100 V
(1) Frequencies in this table indicate maximum performance for a given OPP condition.
(2) VDD_MPU is merged with VDD_CORE on the ZCE package.
(3) This parameter represents the maximum memory clock frequency. Because data is transferred on both edges of the clock, double-data
rate (DDR), the maximum data rate is two times the maximum memory clock frequency defined in this table.
Table 5-6. VDD_CORE OPPs for ZCZ Package
With Device Revision Code "A" or Newer(1)
VDD_CORE
OPP
Rev "A" or
Newer
VDD_CORE
MIN
NOM
MAX
DDR3,
DDR3L(2)
DDR2(2)
mDDR(2)
L3 and L4
OPP100
1.056 V
1.100 V
1.144 V
400 MHz
266 MHz
200 MHz
200 and 100
MHz
OPP50
0.912 V
0.950 V
0.988 V
—
125 MHz
90 MHz
100 and 50
MHz
(1) Frequencies in this table indicate maximum performance for a given OPP condition.
(2) This parameter represents the maximum memory clock frequency. Because data is transferred on both edges of the clock, double-data
rate (DDR), the maximum data rate is two times the maximum memory clock frequency defined in this table.
Table 5-7. VDD_MPU OPPs for ZCZ Package
With Device Revision Code "A" or Newer(1)
VDD_MPU OPP
Rev "A" or Newer
VDD_MPU
ARM (A8)
MIN
NOM
MAX
Nitro
1.272 V
1.325 V
1.378 V
1 GHz
Turbo
1.210 V
1.260 V
1.326 V
800 MHz
OPP120
1.152 V
1.200 V
1.248 V
720 MHz
OPP100(2)
1.056 V
1.100 V
1.144 V
600 MHz
(3)
1.056 V
1.100 V
1.144 V
300 MHz
0.912 V
0.950 V
0.988 V
300 MHz
OPP100
OPP50
(1) Frequencies in this table indicate maximum performance for a given OPP condition.
(2) Applies to all orderable AM335__ZCZ_60 (600-MHz speed grade) or higher devices.
(3) Applies to all orderable AM335__ZCZ_30 (300-MHz speed grade) devices.
82
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Table 5-8. Valid Combinations of VDD_CORE and
VDD_MPU OPPs for ZCZ Package With Device
Revision Code "A" or Newer
VDD_CORE
VDD_MPU
OPP50
OPP50
OPP50
OPP100
OPP100
OPP50
OPP100
OPP100
OPP100
OPP120
OPP100
Turbo
OPP100
Nitro
Table 5-9. VDD_CORE OPPs for ZCE Package
With Device Revision Code "A" or Newer(1)
VDD_CORE
OPP
Rev "A" or
newer
VDD_MPU(2)
ARM (A8)
DDR3,
DDR3L(3)
DDR2(3)
mDDR(3)
L3 and L4
1.144 V
600 MHz
400 MHz
266 MHz
200 MHz
200 and 100
MHz
1.100 V
1.144 V
300 MHz
400 MHz
266 MHz
200 MHz
200 and 100
MHz
0.950 V
0.988 V
300 MHz
–
125 MHz
90 MHz
100 and 50
MHz
MIN
NOM
MAX
OPP100
1.056 V
1.100 V
OPP100
1.056 V
OPP50
0.912 V
(1) Frequencies in this table indicate maximum performance for a given OPP condition.
(2) VDD_MPU is merged with VDD_CORE on the ZCE package.
(3) This parameter represents the maximum memory clock frequency. Because data is transferred on both edges of the clock, double-data
rate (DDR), the maximum data rate is two times the maximum memory clock frequency defined in this table.
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Recommended Operating Conditions
over junction temperature range (unless otherwise noted)
SUPPLY NAME
DESCRIPTION
MIN
NOM
MAX
Supply voltage range for core
domain; OPP100
1.056
1.100
1.144
Supply voltage range for core
domain; OPP50
0.912
0.950
0.988
Supply voltage range for MPU
domain, Nitro
1.272
1.325
1.378
Supply voltage range for MPU
domain; Turbo
1.210
1.260
1.326
Supply voltage range for MPU
domain; OPP120
1.152
1.200
1.248
Supply voltage range for MPU
domain; OPP100
1.056
1.100
1.144
Supply voltage range for MPU
domain; OPP50
0.912
0.950
0.988
CAP_VDD_RTC(3)
Supply voltage range for RTC
domain input
0.900
1.100
1.250
V
VDDS_RTC
Supply voltage range for RTC
domain
1.710
1.800
1.890
V
Supply voltage range for DDR
I/O domain (DDR2)
1.710
1.800
1.890
Supply voltage range for DDR
I/O domain (DDR3)
1.425
1.500
1.575
Supply voltage range for DDR
I/O domain (DDR3L)
1.283
1.350
1.418
VDDS(4)
Supply voltage range for all dualvoltage I/O domains
1.710
1.800
1.890
V
VDDS_SRAM_CORE_BG
Supply voltage range for Core
SRAM LDOs, analog
1.710
1.800
1.890
V
VDDS_SRAM_MPU_BB
Supply voltage range for MPU
SRAM LDOs, analog
1.710
1.800
1.890
V
VDDS_PLL_DDR(5)
Supply voltage range for DPLL
DDR, analog
1.710
1.800
1.890
V
VDDS_PLL_CORE_LCD(5)
Supply voltage range for DPLL
CORE and LCD, analog
1.710
1.800
1.890
V
VDDS_PLL_MPU(5)
Supply voltage range for DPLL
MPU, analog
1.710
1.800
1.890
V
VDDS_OSC
Supply voltage range for system
oscillator I/Os, analog
1.710
1.800
1.890
V
VDDA1P8V_USB0(5)
Supply voltage range for
USBPHY and PER DPLL,
analog, 1.8 V
1.710
1.800
1.890
V
VDDA1P8V_USB1(6)
Supply voltage range for USB
PHY, analog, 1.8 V
1.710
1.800
1.890
V
VDDA3P3V_USB0
Supply voltage range for USB
PHY, analog, 3.3 V
3.135
3.300
3.465
V
VDDA3P3V_USB1(6)
Supply voltage range for USB
PHY, analog, 3.3 V
3.135
3.300
3.465
V
VDDA_ADC
Supply voltage range for ADC,
analog
1.710
1.800
1.890
V
VDDSHV1
Supply voltage range for dualvoltage I/O domain (1.8-V
operation)
1.710
1.800
1.890
V
VDDSHV2(6)
Supply voltage range for dualvoltage I/O domain (1.8-V
operation)
1.710
1.800
1.890
V
VDD_CORE(1)
VDD_MPU(1)(2)
VDDS_DDR
84
Specifications
UNIT
V
V
V
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Recommended Operating Conditions (continued)
over junction temperature range (unless otherwise noted)
SUPPLY NAME
MIN
NOM
MAX
UNIT
VDDSHV3(6)
Supply voltage range for dualvoltage I/O domain (1.8-V
operation)
DESCRIPTION
1.710
1.800
1.890
V
VDDSHV4
Supply voltage range for dualvoltage I/O domain (1.8-V
operation)
1.710
1.800
1.890
V
VDDSHV5
Supply voltage range for dualvoltage I/O domain (1.8-V
operation)
1.710
1.800
1.890
V
VDDSHV6
Supply voltage range for dualvoltage I/O domain (1.8-V
operation)
1.710
1.800
1.890
V
VDDSHV1
Supply voltage range for dualvoltage I/O domain (3.3-V
operation)
3.135
3.300
3.465
V
VDDSHV2(6)
Supply voltage range for dualvoltage I/O domain (3.3-V
operation)
3.135
3.300
3.465
V
VDDSHV3(6)
Supply voltage range for dualvoltage I/O domain (3.3-V
operation)
3.135
3.300
3.465
V
VDDSHV4
Supply voltage range for dualvoltage I/O domain (3.3-V
operation)
3.135
3.300
3.465
V
VDDSHV5
Supply voltage range for dualvoltage I/O domain (3.3-V
operation)
3.135
3.300
3.465
V
VDDSHV6
Supply voltage range for dualvoltage I/O domain (3.3-V
operation)
3.135
3.300
3.465
V
DDR_VREF
Voltage range for DDR SSTL and
HSTL reference input (DDR2,
0.49 × VDDS_DDR 0.50 × VDDS_DDR 0.51 × VDDS_DDR
DDR3, DDR3L)
V
USB0_VBUS
Voltage range for USB VBUS
comparator input
0.000
5.000
5.250
V
USB1_VBUS(6)
Voltage range for USB VBUS
comparator input
0.000
5.000
5.250
V
USB0_ID
Voltage range for the USB ID
input
(7)
V
USB1_ID(6)
Voltage range for the USB ID
input
(7)
V
Commercial temperature
Operating temperature
range, TJ
0
90
Industrial temperature
–40
90
Extended temperature
–40
105
°C
(1) The supply voltage defined by OPP100 should be applied to this power domain before the device is released from reset.
(2) Not available on the ZCE package. VDD_MPU is merged with VDD_CORE on the ZCE package.
(3) This supply is sourced from an internal LDO when RTC_KALDO_ENn is low. If RTC_KALDO_ENn is high, this supply must be sourced
from an external power supply.
(4) VDDS should be supplied irrespective of 1.8- or 3.3-V mode of operation of the dual-voltage I/Os.
(5) For more details on power supply requirements, see Section 6.1.4.
(6) Not available on the ZCE package.
(7) This terminal is connected to analog circuits in the respective USB PHY. The circuit sources a known current while measuring the
voltage to determine if the terminal is connected to VSSA_USB with a resistance less than 10 Ω or greater than 100 kΩ. The terminal
should be connected to ground for USB host operation or open-circuit for USB peripheral operation, and should never be connected to
any external voltage source.
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Power Consumption Summary
Table 5-10 summarizes the power consumption at the AM335x power terminals.
Table 5-10. Maximum Current Ratings at AM335x Power Terminals(1)
SUPPLY NAME
DESCRIPTION
VDD_CORE(2)
MAX
Maximum current rating for the core domain; OPP100
400
Maximum current rating for the core domain; OPP50
250
Maximum current rating for the MPU domain; Nitro
at 1 GHz
Maximum current rating for the MPU domain; Turbo
Maximum current rating for the MPU domain; OPP120
VDD_MPU(2)
Maximum current rating for the MPU domain; OPP100
Maximum current rating for the MPU domain; OPP50
UNIT
mA
1000
at 800 MHz
800
at 720 MHz
720
at 720 MHz
720
at 600 MHz
600
at 600 MHz
600
at 500 MHz
500
at 300 MHz
380
at 275 MHz
350
at 300 MHz
330
at 275 MHz
300
mA
CAP_VDD_RTC(3)
Maximum current rating for RTC domain input and LDO output
2
mA
VDDS_RTC
Maximum current rating for the RTC domain
5
mA
VDDS_DDR
Maximum current rating for DDR I/O domain
250
mA
VDDS
Maximum current rating for all dual-voltage I/O domains
50
mA
VDDS_SRAM_CORE_BG
Maximum current rating for core SRAM LDOs
10
mA
VDDS_SRAM_MPU_BB
Maximum current rating for MPU SRAM LDOs
10
mA
VDDS_PLL_DDR
Maximum current rating for the DPLL DDR
10
mA
VDDS_PLL_CORE_LCD
Maximum current rating for the DPLL Core and LCD
20
mA
VDDS_PLL_MPU
Maximum current rating for the DPLL MPU
10
mA
VDDS_OSC
Maximum current rating for the system oscillator I/Os
5
mA
VDDA1P8V_USB0
Maximum current rating for USBPHY 1.8 V
25
mA
VDDA1P8V_USB1(4)
Maximum current rating for USBPHY 1.8 V
25
mA
VDDA3P3V_USB0
Maximum current rating for USBPHY 3.3 V
40
mA
VDDA3P3V_USB1(4)
Maximum current rating for USBPHY 3.3 V
40
mA
VDDA_ADC
Maximum current rating for ADC
10
mA
VDDSHV1(5)
Maximum current rating for dual-voltage I/O domain
50
mA
(4)
Maximum current rating for dual-voltage I/O domain
50
mA
VDDSHV3(4)
Maximum current rating for dual-voltage I/O domain
50
mA
VDDSHV4
Maximum current rating for dual-voltage I/O domain
50
mA
VDDSHV5
Maximum current rating for dual-voltage I/O domain
50
mA
VDDSHV6
Maximum current rating for dual-voltage I/O domain
100
mA
VDDSHV2
(1) Current ratings specified in this table are worst-case estimates. Actual application power supply estimates could be lower. For more
information, see AM335x Power Consumption Summary.
(2) VDD_MPU is merged with VDD_CORE and is not available separately on the ZCE package. The maximum current rating for
VDD_CORE on the ZCE package is the sum of VDD_CORE and VDD_MPU shown in this table.
(3) This supply is sourced from an internal LDO when RTC_KALDO_ENn is low. If RTC_KALDO_ENn is high, this supply must be sourced
from an external power supply.
(4) Not available on the ZCE package.
(5) VDDSHV1 and VDDSHV2 are merged in the ZCE package. The maximum current rating for VDDSHV1 on the ZCE package is the sum
of VDDSHV1 and VDDSHV2 shown in this table.
86
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Table 5-11 summarizes the power consumption of the AM335x low-power modes.
Table 5-11. AM335x Low-Power Modes Power Consumption Summary
POWER
MODES
Standby
Deepsleep1
Deepsleep0
APPLICATION STATE
POWER DOMAINS, CLOCKS, AND
VOLTAGE SUPPLY STATES
NOM
MAX
UNIT
DDR memory is in self-refresh and
contents are preserved. Wake up
from any GPIO. Cortex-A8
context/register contents are lost
and must be saved before entering
standby. On exit, context must be
restored from DDR. For wakeup,
boot ROM executes and branches
to system resume.
Power supplies:
•
All power supplies are ON.
•
VDD_MPU = 0.95 V (nom)
•
VDD_CORE = 0.95 V (nom)
Clocks:
•
Main Oscillator (OSC0) = ON
•
All DPLLs are in bypass.
Power domains:
•
PD_PER = ON
•
PD_MPU = OFF
•
PD_GFX = OFF
•
PD_WKUP = ON
DDR is in self-refresh.
16.5
22.0
mW
On-chip peripheral registers are
preserved. Cortex-A8
context/registers are lost, so the
application must save them to the
L3 OCMC RAM or DDR before
entering DeepSleep. DDR is in selfrefresh. For wakeup, boot ROM
executes and branches to system
resume.
Power supplies:
•
All power supplies are ON.
•
VDD_MPU = 0.95 V (nom)
•
VDD_CORE = 0.95 V (nom)
Clocks:
•
Main Oscillator (OSC0) = OFF
•
All DPLLs are in bypass.
Power domains:
•
PD_PER = ON
•
PD_MPU = OFF
•
PD_GFX = OFF
•
PD_WKUP = ON
DDR is in self-refresh.
6.0
10.0
mW
PD_PER peripheral and CortexA8/MPU register information will be
lost. On-chip peripheral register
(context) information of PD-PER
domain must be saved by
application to SDRAM before
entering this mode. DDR is in selfrefresh. For wakeup, boot ROM
executes and branches to
peripheral context restore followed
by system resume.
Power supplies:
•
All power supplies are ON.
•
VDD_MPU = 0.95 V (nom)
•
VDD_CORE = 0.95 V (nom)
Clocks:
•
Main Oscillator (OSC0) = OFF
•
All DPLLs are in bypass.
Power domains:
•
PD_PER = OFF
•
PD_MPU = OFF
•
PD_GFX = OFF
•
PD_WKUP = ON
DDR is in self-refresh.
3.0
4.3
mW
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DC Electrical Characteristics
over recommended ranges of supply voltage and operating temperature (unless otherwise noted)(1)
PARAMETER
MIN
NOM
MAX
UNIT
DDR_RESETn,DDR_CSn0,DDR_CKE,DDR_CK,DDR_CKn,DDR_CASn,DDR_RASn,DDR_WEn,DDR_BA0,DDR_BA1,DDR_BA2,DDR_A0,DDR_A1,DDR_A
2,DDR_A3,DDR_A4,DDR_A5,DDR_A6,DDR_A7,DDR_A8,DDR_A9,DDR_A10,DDR_A11,DDR_A12,DDR_A13,DDR_A14,DDR_A15,DDR_ODT,DDR_D0,DD
R_D1,DDR_D2,DDR_D3,DDR_D4,DDR_D5,DDR_D6,DDR_D7,DDR_D8,DDR_D9,DDR_D10,DDR_D11,DDR_D12,DDR_D13,DDR_D14,DDR_D15,DDR_DQM
0,DDR_DQM1,DDR_DQS0,DDR_DQSn0,DDR_DQS1,DDR_DQSn1 Pins (mDDR - LVCMOS Mode)
0.65 ×
VDDS_DDR
VIH
High-level input voltage
VIL
Low-level input voltage
VHYS
Hysteresis voltage at an input
VOH
High level output voltage, driver enabled, pullup or
pulldown disabled
IOH = 8 mA
VOL
Low level output voltage, driver enabled, pullup or
pulldown disabled
IOL = 8 mA
V
0.07
Input leakage current, Receiver disabled, pullup enabled
Input leakage current, Receiver disabled, pulldown enabled
IOZ
V
0.25
V
VDDS_DDR –
0.4
V
0.4
Input leakage current, Receiver disabled, pullup or pulldown inhibited
II
0.35 ×
VDDS_DDR
V
10
–240
–80
80
240
Total leakage current through the terminal connection of a driver-receiver
combination that may include a pullup or pulldown. The driver output is
disabled and the pullup or pulldown is inhibited.
10
µA
µA
DDR_RESETn,DDR_CSn0,DDR_CKE,DDR_CK,DDR_CKn,DDR_CASn,DDR_RASn,DDR_WEn,DDR_BA0,DDR_BA1,DDR_BA2,DDR_A0,DDR_A1,DDR_A
2,DDR_A3,DDR_A4,DDR_A5,DDR_A6,DDR_A7,DDR_A8,DDR_A9,DDR_A10,DDR_A11,DDR_A12,DDR_A13,DDR_A14,DDR_A15,DDR_ODT,DDR_D0,DD
R_D1,DDR_D2,DDR_D3,DDR_D4,DDR_D5,DDR_D6,DDR_D7,DDR_D8,DDR_D9,DDR_D10,DDR_D11,DDR_D12,DDR_D13,DDR_D14,DDR_D15,DDR_DQM
0,DDR_DQM1,DDR_DQS0,DDR_DQSn0,DDR_DQS1,DDR_DQSn1 Pins (DDR2 - SSTL Mode)
DDR_VREF +
0.125
VIH
High-level input voltage
VHYS
Hysteresis voltage at an input
VOH
High-level output voltage, driver enabled, pullup or
pulldown disabled
IOH = 8 mA
VOL
Low-level output voltage, driver enabled, pullup or
pulldown disabled
IOL = 8 mA
V
N/A
V
0.4
Input leakage current, Receiver disabled, pullup or pulldown inhibited
II
Input leakage current, Receiver disabled, pullup enabled
Input leakage current, Receiver disabled, pulldown enabled
IOZ
V
VDDS_DDR –
0.4
V
10
–240
–80
80
240
Total leakage current through the terminal connection of a driver-receiver
combination that may include a pullup or pulldown. The driver output is
disabled and the pullup or pulldown is inhibited.
10
µA
µA
DDR_RESETn,DDR_CSn0,DDR_CKE,DDR_CK,DDR_CKn,DDR_CASn,DDR_RASn,DDR_WEn,DDR_BA0,DDR_BA1,DDR_BA2,DDR_A0,DDR_A1,DDR_A
2,DDR_A3,DDR_A4,DDR_A5,DDR_A6,DDR_A7,DDR_A8,DDR_A9,DDR_A10,DDR_A11,DDR_A12,DDR_A13,DDR_A14,DDR_A15,DDR_ODT,DDR_D0,DD
R_D1,DDR_D2,DDR_D3,DDR_D4,DDR_D5,DDR_D6,DDR_D7,DDR_D8,DDR_D9,DDR_D10,DDR_D11,DDR_D12,DDR_D13,DDR_D14,DDR_D15,DDR_DQM
0,DDR_DQM1,DDR_DQS0,DDR_DQSn0,DDR_DQS1,DDR_DQSn1 Pins (DDR3, DDR3L - HSTL Mode)
VIH
High-level input voltage
VDDS_DDR =
1.5 V
DDR_VREF +
0.1
VDDS_DDR =
1.35 V
DDR_VREF +
0.09
V
VDDS_DDR =
1.5 V
DDR_VREF –
0.1
VDDS_DDR =
1.35 V
DDR_VREF –
0.09
VIL
Low-level input voltage
VHYS
Hysteresis voltage at an input
VOH
High-level output voltage, driver enabled, pullup or
pulldown disabled
IOH = 8 mA
VOL
Low-level output voltage, driver enabled, pullup or
pulldown disabled
IOL = 8 mA
N/A
Input leakage current, Receiver disabled, pullup enabled
Input leakage current, Receiver disabled, pulldown enabled
IOZ
88
V
0.4
V
10
–240
–80
80
240
Total leakage current through the terminal connection of a driver-receiver
combination that may include a pullup or pulldown. The driver output is
disabled and the pullup or pulldown is inhibited.
Specifications
V
VDDS_DDR –
0.4
Input leakage current, Receiver disabled, pullup or pulldown inhibited
II
V
10
µA
µA
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DC Electrical Characteristics (continued)
over recommended ranges of supply voltage and operating temperature (unless otherwise noted)(1)
PARAMETER
MIN
NOM
MAX
UNIT
ECAP0_IN_PWM0_OUT,UART0_CTSn,UART0_RTSn,UART0_RXD,UART0_TXD,UART1_CTSn,UART1_RTSn,UART1_RXD,UART1_TXD,I2C0_SDA,I2C0_
SCL,XDMA_EVENT_INTR0,XDMA_EVENT_INTR1,WARMRSTn,EXTINTn,TMS,TDO,USB0_DRVVBUS,USB1_DRVVBUS (VDDSHV6 = 1.8 V)
VIH
High-level input voltage
VIL
Low-level input voltage
0.65 × VDDSHV6
VHYS
Hysteresis voltage at an input
VOH
High-level output voltage, driver enabled, pullup or
pulldown disabled
IOH = 4 mA
VOL
Low-level output voltage, driver enabled, pullup or
pulldown disabled
IOL = 4 mA
V
0.18
Input leakage current, Receiver disabled, pullup enabled
Input leakage current, Receiver disabled, pulldown enabled
IOZ
V
0.305
V
VDDSHV6 – 0.45
V
0.45
Input leakage current, Receiver disabled, pullup or pulldown inhibited
II
0.35 × VDDSHV6
V
8
–161
–100
–52
52
100
170
Total leakage current through the terminal connection of a driver-receiver
combination that may include a pullup or pulldown. The driver output is
disabled and the pullup or pulldown is inhibited.
8
µA
µA
ECAP0_IN_PWM0_OUT,UART0_CTSn,UART0_RTSn,UART0_RXD,UART0_TXD,UART1_CTSn,UART1_RTSn,UART1_RXD,UART1_TXD,I2C0_SDA,I2C0_
SCL,XDMA_EVENT_INTR0,XDMA_EVENT_INTR1,WARMRSTn,EXTINTn,TMS,TDO,USB0_DRVVBUS,USB1_DRVVBUS (VDDSHV6 = 3.3 V)
VIH
High-level input voltage
VIL
Low-level input voltage
2
VHYS
Hysteresis voltage at an input
VOH
High-level output voltage, driver enabled, pullup or
pulldown disabled
IOH = 4 mA
VOL
Low-level output voltage, driver enabled, pullup or
pulldown disabled
IOL = 4 mA
V
0.265
Input leakage current, Receiver disabled, pullup enabled
Input leakage current, Receiver disabled, pulldown enabled
IOZ
V
0.44
V
VDDSHV6 – 0.45
V
0.45
Input leakage current, Receiver disabled, pullup or pulldown inhibited
II
0.8
V
18
–243
–100
–19
51
110
210
Total leakage current through the terminal connection of a driver-receiver
combination that may include a pullup or pulldown. The driver output is
disabled and the pullup or pulldown is inhibited.
18
µA
µA
TCK (VDDSHV6 = 1.8 V)
VIH
High-level input voltage
VIL
Low-level input voltage
VHYS
Hysteresis voltage at an input
1.45
V
0.46
0.4
V
Input leakage current, Receiver disabled, pullup or pulldown inhibited
II
Input leakage current, Receiver disabled, pullup enabled
Input leakage current, Receiver disabled, pulldown enabled
V
8
–161
–100
–52
52
100
170
µA
TCK (VDDSHV6 = 3.3 V)
VIH
High-level input voltage
VIL
Low-level input voltage
VHYS
Hysteresis voltage at an input
2.15
V
0.46
0.4
V
Input leakage current, Receiver disabled, pullup or pulldown inhibited
II
Input leakage current, Receiver disabled, pullup enabled
Input leakage current, Receiver disabled, pulldown enabled
V
18
–243
–100
–19
51
110
210
µA
PWRONRSTn (VDDSHV6 = 1.8 or 3.3 V)(2)
VIH
High-level input voltage
VIL
Low-level input voltage
VHYS
Hysteresis voltage at an input
II
Input leakage current
1.35
V
0.5
0.07
V
V
VI = 1.8 V
0.1
VI = 3.3 V
2
µA
RTC_PWRONRSTn
VIH
High-level input voltage
0.65 ×
VDDS_RTC
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DC Electrical Characteristics (continued)
over recommended ranges of supply voltage and operating temperature (unless otherwise noted)(1)
PARAMETER
VIL
Low-level input voltage
VHYS
Hysteresis voltage at an input
II
Input leakage current
MIN
NOM
MAX
UNIT
0.35 ×
VDDS_RTC
V
1
µA
0.065
V
–1
PMIC_POWER_EN
VOH
High-level output voltage, driver enabled, pullup or
pulldown disabled
IOH = 6 mA
VOL
Low-level output voltage, driver enabled, pullup or
pulldown disabled
IOL = 6 mA
Input leakage current, Receiver disabled, pullup or pulldown inhibited
II
IOZ
VDDS_RTC –
0.45
V
0.45
–1
1
–200
–40
Input leakage current, Receiver disabled, pulldown enabled
40
200
Total leakage current through the terminal connection of a driver-receiver
combination that may include a pullup or pulldown. The driver output is
disabled and the pullup or pulldown is inhibited.
–1
1
Input leakage current, Receiver disabled, pullup enabled
V
µA
µA
EXT_WAKEUP
VIH
High-level input voltage
VIL
Low-level input voltage
VHYS
Hysteresis voltage at an input
0.65 ×
VDDS_RTC
0.35 ×
VDDS_RTC
0.15
Input leakage current, Receiver disabled, pullup or pulldown inhibited
II
V
Input leakage current, Receiver disabled, pullup enabled
Input leakage current, Receiver disabled, pulldown enabled
V
V
–1
1
–200
–40
40
200
µA
XTALIN (OSC0)
VIH
High-level input voltage
VIL
Low-level input voltage
0.65 ×
VDDS_OSC
V
0.35 ×
VDDS_OSC
V
RTC_XTALIN (OSC1)
VIH
High-level input voltage
VIL
Low-level input voltage
0.65 ×
VDDS_RTC
V
0.35 ×
VDDS_RTC
V
All other LVCMOS pins (VDDSHVx = 1.8 V; x = 1 to 6)
VIH
High-level input voltage
VIL
Low-level input voltage
0.65 × VDDSHVx
VHYS
Hysteresis voltage at an input
VOH
High-level output voltage, driver enabled, pullup or
pulldown disabled
IOH = 6 mA
VOL
Low-level output voltage, driver enabled, pullup or
pulldown disabled
IOL = 6 mA
V
0.18
Input leakage current, Receiver disabled, pullup enabled
Input leakage current, Receiver disabled, pulldown enabled
IOZ
V
0.305
V
VDDSHVx – 0.45
V
0.45
Input leakage current, Receiver disabled, pullup or pulldown inhibited
II
0.35 × VDDSHVx
V
8
–161
–100
–52
52
100
170
Total leakage current through the terminal connection of a driver-receiver
combination that may include a pullup or pulldown. The driver output is
disabled and the pullup or pulldown is inhibited.
8
µA
µA
All other LVCMOS pins (VDDSHVx = 3.3 V; x = 1 to 6)
VIH
High-level input voltage
VIL
Low-level input voltage
VHYS
Hysteresis voltage at an input
VOH
High-level output voltage, driver enabled, pullup or
pulldown disabled
IOH = 6 mA
VOL
Low-level output voltage, driver enabled, pullup or
pulldown disabled
IOL = 6 mA
90
Specifications
2
0.265
V
0.8
V
0.44
V
VDDSHVx – 0.45
V
0.45
V
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SPRS717J – OCTOBER 2011 – REVISED APRIL 2016
DC Electrical Characteristics (continued)
over recommended ranges of supply voltage and operating temperature (unless otherwise noted)(1)
PARAMETER
MIN
NOM
Input leakage current, Receiver disabled, pullup or pulldown inhibited
II
Input leakage current, Receiver disabled, pullup enabled
Input leakage current, Receiver disabled, pulldown enabled
IOZ
MAX
UNIT
18
–243
–100
–19
51
110
210
Total leakage current through the terminal connection of a driver-receiver
combination that may include a pullup or pulldown. The driver output is
disabled and the pullup or pulldown is inhibited.
18
µA
µA
(1) The interfaces or signals described in this table correspond to the interfaces or signals available in multiplexing mode 0. All interfaces or
signals multiplexed on the terminals described in this table have the same DC electrical characteristics.
(2) The input voltage thresholds for this input are not a function of VDDSHV6.
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5.8
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Thermal Resistance Characteristics for ZCE and ZCZ Packages
Failure to maintain a junction temperature within the range specified in Section 5.5 reduces operating
lifetime, reliability, and performance—and may cause irreversible damage to the system. Therefore, the
product design cycle should include thermal analysis to verify the maximum operating junction
temperature of the device. It is important this thermal analysis is performed using specific system use
cases and conditions. TI provides an application report to aid users in overcoming some of the existing
challenges of producing a good thermal design. For more information, see AM335x Thermal
Considerations.
Table 5-12 provides thermal characteristics for the packages used on this device.
NOTE
Table 5-12 provides simulation data and may not represent actual use-case values.
Table 5-12. Thermal Resistance Characteristics (PBGA Package) [ZCE and ZCZ]
ZCE (°C/W) (1)
ZCZ (°C/W) (1)
(2)
AIR FLOW
(m/s) (3)
(2)
RΘJC
Junction-to-case
10.3
10.2
N/A
RΘJB
Junction-to-board
11.6
12.1
N/A
24.7
24.2
0
20.5
20.1
1.0
19.7
19.3
2.0
19.2
18.8
3.0
0.4
0.3
0.0
0.6
0.6
1.0
0.7
0.7
2.0
RΘJA
φJT
φJB
(1)
(2)
(3)
92
Junction-to-free air
Junction-to-package top
Junction-to-board
0.9
0.8
3.0
11.9
12.7
0.0
11.7
12.3
1.0
11.7
12.3
2.0
11.6
12.2
3.0
These values are based on a JEDEC-defined 2S2P system (with the exception of the theta JC [RΘJC] value, which is based on a
JEDEC-defined 1S0P system) and will change based on environment as well as application. For more information, see these
EIA/JEDEC standards:
• JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air)
• JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
• JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
• JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements
Power dissipation of 2 W and an ambient temperature of 70ºC is assumed.
°C/W = degrees Celsius per watt.
m/s = meters per second.
Specifications
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5.9
SPRS717J – OCTOBER 2011 – REVISED APRIL 2016
External Capacitors
To improve module performance, decoupling capacitors are required to suppress the switching noise
generated by high frequency and to stabilize the supply voltage. A decoupling capacitor is most effective
when it is close to the device, because this minimizes the inductance of the circuit board wiring and
interconnects.
5.9.1
Voltage Decoupling Capacitors
Table 5-13 summarizes the Core voltage decoupling characteristics.
5.9.1.1
Core Voltage Decoupling Capacitors
To improve module performance, decoupling capacitors are required to suppress high-frequency switching
noise and to stabilize the supply voltage. A decoupling capacitor is most effective when located close to
the AM335x device, because this minimizes the inductance of the circuit board wiring and interconnects.
Table 5-13. Core Voltage Decoupling Characteristics
TYP
UNIT
CVDD_CORE(1)
PARAMETER
10.08
μF
CVDD_MPU(2)(3)
10.05
μF
TYP
UNIT
(1) The typical value corresponds to one capacitor of 10 μF and eight capacitors of 10 nF.
(2) Not available on the ZCE package. VDD_MPU is merged with VDD_CORE on the ZCE package.
(3) The typical value corresponds to one capacitor of 10 μF and five capacitors of 10 nF.
5.9.1.2
I/O and Analog Voltage Decoupling Capacitors
Table 5-14 summarizes the power-supply decoupling capacitor recommendations.
Table 5-14. Power-Supply Decoupling Capacitor Characteristics
PARAMETER
CVDDA_ADC
10
nF
CVDDA1P8V_USB0
10
nF
CCVDDA3P3V_USB0
10
nF
(1)
10
nF
CVDDA3P3V_USB1(1)
10
nF
10.04
μF
CVDDA1P8V_USB1
CVDDS(2)
CVDDS_DDR
(3)
CVDDS_OSC
10
nF
CVDDS_PLL_DDR
10
nF
CVDDS_PLL_CORE_LCD
10
nF
10.01
μF
CVDDS_SRAM_CORE_BG
(4)
CVDDS_SRAM_MPU_BB(5)
CVDDS_PLL_MPU
CVDDS_RTC
10.01
μF
10
nF
10
nF
CVDDSHV1(6)
10.02
μF
CVDDSHV2(1)(6)
10.02
μF
(1)(6)
CVDDSHV3
10.02
μF
CVDDSHV4(6)
10.02
μF
CVDDSHV5(6)
10.02
μF
CVDDSHV6(7)
10.06
μF
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(1) Not available on the ZCE package.
(2) Typical values consist of one capacitor of 10 μF and four capacitors of 10 nF.
(3) For more details on decoupling capacitor requirements for the mDDR(LPDDR), DDR2, DDR3, DDR3L memory interface, see
Section 7.7.2.1.2.6 and Section 7.7.2.1.2.7 when using mDDR(LPDDR) memory devices, Section 7.7.2.2.2.6 and Section 7.7.2.2.2.7
when using DDR2 memory devices, or Section 7.7.2.3.3.6 and Section 7.7.2.3.3.7 when using DDR3 or DDR3L memory devices.
(4) VDDS_SRAM_CORE_BG supply powers an internal LDO for SRAM supplies. Inrush currents could cause voltage drop on the
VDDS_SRAM_CORE_BG supplies when the SRAM LDO is enabled after powering up VDDS_SRAM_CORE_BG terminals. A 10 µF is
recommended to be placed close to the terminal and routed with widest traces possible to minimize the voltage drop on
VDDS_SRAM_CORE_BG terminals.
(5) VDDS_SRAM_MPU_BB supply powers an internal LDO for SRAM supplies. Inrush currents could cause voltage drop on the
VDDS_SRAM_MPU_BB supplies when the SRAM LDO is enabled after powering up VDDS_SRAM_MPU_BB terminals. A 10 µF is
recommended to be placed close to the terminal and routed with widest traces possible to minimize the voltage drop on
VDDS_SRAM_MPU_BB terminals.
(6) Typical values consist of one capacitor of 10 μF and two capacitors of 10 nF.
(7) Typical values consist of one capacitor of 10 μF and six capacitors of 10 nF.
5.9.2
Output Capacitors
Internal low dropout output (LDO) regulators require external capacitors to stabilize their outputs. These
capacitors should be placed as close as possible to the respective terminals of the AM335x device.
Table 5-15 summarizes the LDO output capacitor recommendations.
Table 5-15. Output Capacitor Characteristics
PARAMETER
TYP
UNIT
CCAP_VDD_SRAM_CORE(1)
1
μF
CCAP_VDD_RTC(1)(2)
1
μF
1
μF
1
μF
CCAP_VDD_SRAM_MPU
(1)
CCAP_VBB_MPU(1)
(1) LDO regulator outputs should not be used as a power source for any external components.
(2) The CAP_VDD_RTC terminal operates as an input to the RTC core voltage domain when the RTC_KLDO_ENn terminal is high.
94
Specifications
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Figure 5-1 shows an example of the external capacitors.
AM335x Device
VDDS_PLL_MPU
MPU
PLL
VDD_MPU
CVDDS_PLL_MPU
MPU
CVDD_MPU
VDDS_PLL_CORE_LCD
CORE
PLL
VDD_CORE
CORE
CVDDS_PLL_CORE_LCD
LCD
PLL
CAP_VBB_MPU
CVDD_CORE
CCAP_VBB_MPU
CVDDS
CVDDSHV1
VDDS
I/O
VDDS_SRAM_MPU_BB
VDDSHV1
I/Os
Back Bias
LDO
CVDDSHV2
CVDDS_SRAM_MPU_BB
MPU SRAM
LDO
CAP_VDD_SRAM_MPU
CCAP_VDD_SRAM_MPU
VDDSHV2
I/Os
VDDS_SRAM_CORE_BG
CVDDSHV3
VDDSHV3
I/Os
CVDDSHV4
VDDSHV4
I/Os
CVDDSHV5
VDDSHV5
I/Os
CVDDSHV6
VDDSHV6
I/Os
CVDDS_SRAM_CORE_BG
CORE SRAM
LDO
Band Gap
Reference
CAP_VDD_SRAM_CORE
CCAP_VDD_SRAM_CORE
VDDA_3P3V_USBx
CVDDA_3P3V_USBx
VSSA_USB
CVDDS_DDR
USB PHYx
VDDA_1P8V_USBx
CVDDA_1P8V_USBx
VSSA_USB
VDDS_DDR
I/Os
VDDA_ADC
CVDDA_ADC
ADC
CVDDS_RTC
VDDS_RTC
I/Os
VSSA_ADC
VDDS_OSC
CVDDS_OSC
VDDS_PLL_DDR
CVDDS_PLL_DDR
DDR
PLL
CAP_VDD_RTC
RTC
A.
B.
CCAP_VDD_RTC
Decoupling capacitors must be placed as closed as possible to the power terminal. Choose the ground closest to the
power pin for each decoupling capacitor. In case of interconnecting powers, first insert the decoupling capacitor and
then interconnect the powers.
The decoupling capacitor value depends on the characteristics of the board.
Figure 5-1. External Capacitors
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5.10 Touch Screen Controller and Analog-to-Digital Subsystem Electrical Parameters
The touch screen controller (TSC) and analog-to-digital converter (ADC) subsystem (TSC_ADC) is an 8channel general-purpose ADC with optional support for interleaving TSC conversions for 4-wire, 5-wire, or
8-wire resistive panels. The TSC_ADC subsystem can be configured for use in one of the following
applications:
• 8 general-purpose ADC channels
• 4-wire TSC with 4 general-purpose ADC channels
• 5-wire TSC with 3 general-purpose ADC channels
• 8-wire TSC.
Table 5-16 summarizes the TSC_ADC subsystem electrical parameters.
Table 5-16. TSC_ADC Electrical Parameters
PARAMETER
TEST CONDITIONS
MIN
NOM
MAX
UNIT
Analog Input
VREFP(1)
(0.5 × VDDA_ADC) +
0.25
VDDA_ADC
V
VREFN(1)
0
(0.5 × VDDA_ADC) –
0.25
V
VREFP + VREFN(1)
VDDA_ADC
Internal voltage reference
Full-scale input range
Differential nonlinearity
(DNL)
Integral nonlinearity (INL)
V
0
VDDA_ADC
External voltage reference
VREFN
VREFP
Internal voltage reference:
VDDA_ADC = 1.8 V
External voltage reference:
VREFP – VREFN = 1.8 V
–1
0.5
1
Source impedance = 50 Ω
Internal voltage reference:
VDDA_ADC = 1.8 V
External voltage reference:
VREFP – VREFN = 1.8 V
–2
±1
2
V
LSB
LSB
Source impedance = 1 kΩ
Internal voltage reference:
VDDA_ADC = 1.8 V
External voltage reference:
VREFP – VREFN = 1.8 V
±1
Gain error
Internal voltage reference:
VDDA_ADC = 1.8 V
External voltage reference:
VREFP – VREFN = 1.8 V
±2
LSB
Offset error
Internal voltage reference:
VDDA_ADC = 1.8 V
External voltage reference:
VREFP – VREFN = 1.8 V
±2
LSB
Input sampling capacitance
5.5
pF
Signal-to-noise ratio (SNR)
Internal voltage reference:
VDDA_ADC = 1.8 V
External voltage reference:
VREFP – VREFN = 1.8 V
Input signal: 30-kHz sine wave at
–0.5-dB full scale
70
dB
Total harmonic distortion
(THD)
Internal voltage reference:
VDDA_ADC = 1.8 V
External voltage reference:
VREFP – VREFN = 1.8 V
Input signal: 30-kHz sine wave at
–0.5-dB full scale
75
dB
96
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Table 5-16. TSC_ADC Electrical Parameters (continued)
PARAMETER
TEST CONDITIONS
MIN
NOM
MAX
UNIT
Spurious free dynamic
range
Internal voltage reference:
VDDA_ADC = 1.8 V
External voltage reference:
VREFP – VREFN = 1.8 V
Input signal: 30-kHz sine wave at
–0.5-dB full scale
80
dB
Signal-to-noise plus
distortion
Internal voltage reference:
VDDA_ADC = 1.8 V
External voltage reference:
VREFP – VREFN = 1.8 V
Input signal: 30-kHz sine wave at
–0.5-dB full scale
69
dB
20
kΩ
VREFP and VREFN input impedance
Input impedance of
AIN[7:0](2)
ƒ = Input frequency
–12
[1 / ((65.97 × 10
) × ƒ)]
Ω
Sampling Dynamics
Conversion time
15
ADC
clock
cycles
Acquisition time
2
ADC
clock
cycles
Sampling rate
ADC clock = 3 MHz
Channel-to-channel isolation
200
kSPS
100
dB
2
Ω
Touch Screen Switch Drivers
Pullup and pulldown switch ON resistance (Ron)
Pullup and pulldown switch
current leakage Ileak
Source impedance = 500 Ω
Drive current
0.5
uA
25
mA
Touch screen resistance
6
kΩ
Pen touch detect
2
kΩ
(1) VREFP and VREFN must be tied to ground if the internal voltage reference is used.
(2) This parameter is valid when the respective AIN terminal is configured to operate as a general-purpose ADC input.
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6 Power and Clocking
6.1
6.1.1
Power Supplies
Power Supply Slew Rate Requirement
To maintain the safe operating range of the internal ESD protection devices, TI recommends limiting the
maximum slew rate for powering on the supplies to be less than 1.0E +5 V/s. For instance, as shown in
Figure 6-1, TI recommends a value greater than 18 µs for the supply ramp slew for a 1.8-V supply.
Supply value
t
slew rate < 1E + 5 V/s
slew > (supply value) / (1E + 5V/s)
supply value ´ 10 µs
0
Figure 6-1. Power Supply Slew and Slew Rate
98
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1.8 V
VDDS_RTC
1.8 V
RTC_PWRONRSTn
1.8 V
PMIC_POWER_EN
1.8 V
All 1.8-V Supplies
1.8 V/1.5 V/1.35 V
VDDS_DDR
3.3 V
I/O 3.3-V Supplies
1.1 V
VDD_CORE, VDD_MPU
PWRONRSTn
CLK_M_OSC
A.
B.
C.
D.
E.
F.
RTC_PWRONRSTn should be asserted for at least 1 ms to provide enough time for the internal RTC LDO output to
reach a valid level before RTC reset is released.
When using the ZCZ package option, VDD_MPU and VDD_CORE power inputs may be powered from the same
source if the application only uses operating performance points (OPPs) that define a common power supply voltage
for VDD_MPU and VDD_CORE. The ZCE package option has the VDD_MPU domain merged with the VDD_CORE
domain.
If a USB port is not used, the respective VDDA1P8V_USB terminal may be connected to any 1.8-V power supply and
the respective VDDA3P3V_USB terminal may be connected to any 3.3-V power supply. If the system does not have a
3.3-V power supply, the VDDA3P3V_USB terminal may be connected to ground.
If the system uses mDDR or DDR2 memory devices, VDDS_DDR can be ramped simultaneously with the other 1.8-V
I/O power supplies.
VDDS_RTC can be ramped independent of other power supplies if PMIC_POWER_EN functionality is not required. If
VDDS_RTC is ramped after VDD_CORE, there might be a small amount of additional leakage current on
VDD_CORE. The power sequence shown provides the lowest leakage option.
To configure VDDSHVx [1-6] as 1.8 V, power up the respective VDDSHVx [1-6] to 1.8 V following the recommended
sequence. To configure VDDSHVx [1-6] as 3.3 V, power up the respective VDDSHVx [1-6] to 3.3 V following the
recommended sequence.
Figure 6-2. Preferred Power-Supply Sequencing With Dual-Voltage I/Os Configured as 3.3 V
Power and Clocking
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1.8 V
VDDS_RTC
1.8 V
RTC_PWRONRSTn
1.8 V
PMIC_POWER_EN
3.3 V
All 1.8-V Supplies
All 3.3-V Supplies
1.8 V
See Notes Below
1.8 V/1.5 V/1.35 V
VDDS_DDR
1.1 V
VDD_CORE, VDD_MPU
PWRONRSTn
CLK_M_OSC
A.
B.
C.
D.
E.
F.
G.
RTC_PWRONRSTn should be asserted for at least 1 ms to provide enough time for the internal RTC LDO output to
reach a valid level before RTC reset is released.
The 3.3-V I/O power supplies may be ramped simultaneously with the 1.8-V I/O power supplies if the voltage sourced
by any 3.3-V power supplies does not exceed the voltage sourced by any 1.8-V power supply by more than 2 V.
Serious reliability issues may occur if the system power supply design allows any 3.3-V I/O power supplies to exceed
any 1.8-V I/O power supplies by more than 2 V.
When using the ZCZ package option, VDD_MPU and VDD_CORE power inputs may be powered from the same
source if the application only uses operating performance points (OPPs) that define a common power supply voltage
for VDD_MPU and VDD_CORE. The ZCE package option has the VDD_MPU domain merged with the VDD_CORE
domain.
If a USB port is not used, the respective VDDA1P8V_USB terminal may be connected to any 1.8-V power supply and
the respective VDDA3P3V_USB terminal may be connected to any 3.3-V power supply. If the system does not have a
3.3-V power supply, the VDDA3P3V_USB terminal may be connected to ground.
If the system uses mDDR or DDR2 memory devices, VDDS_DDR can be ramped simultaneously with the other 1.8-V
I/O power supplies.
VDDS_RTC can be ramped independent of other power supplies if PMIC_POWER_EN functionality is not required. If
VDDS_RTC is ramped after VDD_CORE, there might be a small amount of additional leakage current on
VDD_CORE. The power sequence shown provides the lowest leakage option.
To configure VDDSHVx [1-6] as 1.8 V, power up the respective VDDSHVx [1-6] to 1.8 V following the recommended
sequence. To configure VDDSHVx [1-6] as 3.3 V, power up the respective VDDSHVx [1-6] to 3.3 V following the
recommended sequence.
Figure 6-3. Alternate Power-Supply Sequencing With Dual-Voltage I/Os Configured as 3.3 V
100
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1.8 V
VDDS_RTC
1.8V
RTC_PWRONRSTn
1.8 V
PMIC_POWER_EN
1.8 V
All 1.8-V Supplies
1.8 V/1.5 V/1.35 V
VDDS_DDR
3.3 V
All 3.3-V Supplies
1.1 V
VDD_CORE, VDD_MPU
PWRONRSTn
CLK_M_OSC
A.
B.
C.
D.
E.
F.
RTC_PWRONRSTn should be asserted for at least 1 ms to provide enough time for the internal RTC LDO output to
reach a valid level before RTC reset is released.
When using the ZCZ package option, VDD_MPU and VDD_CORE power inputs may be powered from the same
source if the application only uses operating performance points (OPPs) that define a common power supply voltage
for VDD_MPU and VDD_CORE. The ZCE package option has the VDD_MPU domain merged with the VDD_CORE
domain.
If a USB port is not used, the respective VDDA1P8V_USB terminal may be connected to any 1.8-V power supply and
the respective VDDA3P3V_USB terminal may be connected to any 3.3-V power supply. If the system does not have a
3.3-V power supply, the VDDA3P3V_USB terminal may be connected to ground.
If the system uses mDDR or DDR2 memory devices, VDDS_DDR can be ramped simultaneously with the other 1.8-V
I/O power supplies.
VDDS_RTC can be ramped independent of other power supplies if PMIC_POWER_EN functionality is not required. If
VDDS_RTC is ramped after VDD_CORE, there might be a small amount of additional leakage current on
VDD_CORE. The power sequence shown provides the lowest leakage option.
To configure VDDSHVx [1-6] as 1.8 V, power up the respective VDDSHVx [1-6] to 1.8 V following the recommended
sequence. To configure VDDSHVx [1-6] as 3.3 V, power up the respective VDDSHVx [1-6] to 3.3 V following the
recommended sequence.
Figure 6-4. Power-Supply Sequencing With Dual-Voltage I/Os Configured as 1.8 V
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1.8 V
1.1 V
VDDS_RTC,
CAP_VDD_RTC
1.8 V
RTC_PWRONRSTn
1.8 V
PMIC_POWER_EN
1.8 V
VDDSHV 1-6
All other 1.8-V Supplies
1.8 V/1.5 V/1.35 V
VDDS_DDR
3.3 V
All 3.3-V Supplies
1.1 V
VDD_CORE, VDD_MPU
PWRONRSTn
CLK_M_OSC
A.
B.
C.
D.
E.
F.
G.
RTC_PWRONRSTn should be asserted for at least 1 ms to provide enough time for the internal RTC LDO output to
reach a valid level before RTC reset is released.
The CAP_VDD_RTC terminal operates as an input to the RTC core voltage domain when the internal RTC LDO is
disabled by connecting the RTC_KALDO_ENn terminal to VDDS_RTC. If the internal RTC LDO is disabled,
CAP_VDD_RTC should be sourced from an external 1.1-V power supply.
When using the ZCZ package option, VDD_MPU and VDD_CORE power inputs may be powered from the same
source if the application only uses operating performance points (OPPs) that define a common power supply voltage
for VDD_MPU and VDD_CORE. The ZCE package option has the VDD_MPU domain merged with the VDD_CORE
domain.
If a USB port is not used, the respective VDDA1P8V_USB terminal may be connected to any 1.8-V power supply and
the respective VDDA3P3V_USB terminal may be connected to any 3.3-V power supply. If the system does not have a
3.3-V power supply, the VDDA3P3V_USB terminal may be connected to ground.
If the system uses mDDR or DDR2 memory devices, VDDS_DDR can be ramped simultaneously with the other 1.8-V
I/O power supplies.
VDDS_RTC should be ramped at the same time or before CAP_VDD_RTC, but these power inputs can be ramped
independent of other power supplies if PMIC_POWER_EN functionality is not required. If CAP_VDD_RTC is ramped
after VDD_CORE, there might be a small amount of additional leakage current on VDD_CORE. The power sequence
shown provides the lowest leakage option.
To configure VDDSHVx [1-6] as 1.8 V, power up the respective VDDSHVx [1-6] to 1.8 V following the recommended
sequence. To configure VDDSHVx [1-6] as 3.3 V, power up the respective VDDSHVx [1-6] to 3.3 V following the
recommended sequence.
Figure 6-5. Power-Supply Sequencing With Internal RTC LDO Disabled
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1.8 V
VDDS_RTC,
All other 1.8-V Supplies
1.8 V/1.5 V/1.35 V
VDDS_DDR
3.3 V
All 3.3-V Supplies
1.1 V
VDD_CORE, VDD_MPU
CAP_VDD_RTC
PWRONRSTn
CLK_M_OSC
A.
B.
C.
D.
E.
F.
CAP_VDD_RTC terminal operates as an input to the RTC core voltage domain when the internal RTC LDO is
disabled by connecting the RTC_KALDO_ENn terminal to VDDS_RTC. If the internal RTC LDO is disabled,
CAP_VDD_RTC should be sourced from an external 1.1-V power supply. The PMIC_POWER_EN output cannot be
used when the RTC is disabled.
When using the ZCZ package option, VDD_MPU and VDD_CORE power inputs may be powered from the same
source if the application only uses operating performance points (OPPs) that define a common power supply voltage
for VDD_MPU and VDD_CORE. The ZCE package option has the VDD_MPU domain merged with the VDD_CORE
domain.
If a USB port is not used, the respective VDDA1P8V_USB terminal may be connected to any 1.8-V power supply and
the respective VDDA3P3V_USB terminal may be connected to any 3.3-V power supply. If the system does not have a
3.3-V power supply, the VDDA3P3V_USB terminal may be connected to ground.
If the system uses mDDR or DDR2 memory devices, VDDS_DDR can be ramped simultaneously with the other 1.8-V
I/O power supplies.
VDDS_RTC should be ramped at the same time or before CAP_VDD_RTC, but these power inputs can be ramped
independent of other power supplies if PMIC_POWER_EN functionality is not required. If CAP_VDD_RTC is ramped
after VDD_CORE, there might be a small amount of additional leakage current on VDD_CORE. The power sequence
shown provides the lowest leakage option.
To configure VDDSHVx [1-6] as 1.8 V, power up the respective VDDSHVx [1-6] to 1.8 V following the recommended
sequence. To configure VDDSHVx [1-6] as 3.3 V, power up the respective VDDSHVx [1-6] to 3.3 V following the
recommended sequence.
Figure 6-6. Power-Supply Sequencing With RTC Feature Disabled
6.1.2
Power-Down Sequencing
PWRONRSTn input terminal should be taken low, which stops all internal clocks before power supplies
are turned off. All other external clocks to the device should be shut off.
The preferred way to sequence power down is to have all the power supplies ramped down sequentially in
the exact reverse order of the power-up sequencing. In other words, the power supply that has been
ramped up first should be the last one that should be ramped down. This ensures there would be no
spurious current paths during the power-down sequence. The VDDS power supply must ramp down after
all 3.3-V VDDSHVx [1-6] power supplies.
If it is desired to ramp down VDDS and VDDSHVx [1-6] simultaneously, it should always be ensured that
the difference between VDDS and VDDSHVx [1-6] during the entire power-down sequence is <2 V. Any
violation of this could cause reliability risks for the device. TI recommends maintaining VDDS ≥1.5V as all
the other supplies fully ramp down to minimize in-rush currents.
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If none of the VDDSHVx [1-6] power supplies are configured as 3.3 V, the VDDS power supply may ramp
down along with the VDDSHVx [1-6] supplies or after all the VDDSHVx [1-6] supplies have ramped down.
TI recommends maintaining VDDS ≥1.5V as all the other supplies fully ramp down to minimize in-rush
currents.
6.1.3
VDD_MPU_MON Connections
Figure 6-7 shows the VDD_MPU_MON connectivity. VDD_MPU_MON connectivity is available only on the
ZCZ package.
VDD_MPU
AM335x Device
Power
Management
IC
VDD_MPU_MON
Vfeedback
Connection for VDD_MPU_MON if voltage monitoring is used
VDD_MPU
AM335x Device
Power
Source
VDD_MPU_MON
Preferred connection for VDD_MPU_MON if voltage monitoring is NOT used
VDD_MPU
AM335x Device
Power
Source
VDD_MPU_MON
N/C
Optional connection for VDD_MPU_MON if voltage monitoring is NOT used
Figure 6-7. VDD_MPU_MON Connectivity
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6.1.4
SPRS717J – OCTOBER 2011 – REVISED APRIL 2016
Digital Phase-Locked Loop Power Supply Requirements
The digital phase-locked loop (DPLL) provides all interface clocks and functional clocks to the processor
of the AM335x device. The AM335x device integrates five different DPLLs—Core DPLL, Per DPLL, LCD
DPLL, DDR DPLL, MPU DPLL.
Figure 6-8 shows the power supply connectivity implemented in the AM335x device. Table 6-1 provides
the power supply requirements for the DPLL.
MPU
PLL
PER
PLL
VDDS_PLL_MPU
VDDA1P8V_USB0
CORE
PLL
DDR
PLL
VDDS_PLL_CORE_LCD
LCD
PLL
VDDS_PLL_DDR
Figure 6-8. DPLL Power Supply Connectivity
Table 6-1. DPLL Power Supply Requirements
SUPPLY NAME
VDDA1P8V_USB0
VDDS_PLL_MPU
VDDS_PLL_CORE_LCD
VDDS_PLL_DDR
DESCRIPTION
MIN NOM
MAX
UNIT
Supply voltage range for USBPHY and PER DPLL, Analog, 1.8 V
1.71
1.8
1.89
V
1.71
1.8
1.89
Max peak-to-peak supply noise
Supply voltage range for DPLL MPU, analog
50 mV (p-p)
Max peak-to-peak supply noise
Supply voltage range for DPLL CORE and LCD, analog
1.71
1.8
1.89
1.71
1.8
1.89
Max peak-to-peak supply noise
Supply voltage range for DPLL DDR, analog
Max peak-to-peak supply noise
V
50 mV (p-p)
V
50 mV (p-p)
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V
50 mV (p-p)
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6.2
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Clock Specifications
6.2.1
Input Clock Specifications
The AM335x device has two clock inputs. Each clock input passes through an internal oscillator which can
be connected to an external crystal circuit (oscillator mode) or external LVCMOS square-wave digital clock
source (bypass mode). The oscillators automatically operate in bypass mode when their input is
connected to an external LVCMOS square-wave digital clock source. The oscillator associated with a
specific clock input must be enabled when the clock input is being used in either oscillator mode or bypass
mode.
The OSC1 oscillator provides a 32.768-kHz reference clock to the real-time clock (RTC) and is connected
to the RTC_XTALIN and RTC_XTALOUT terminals. This clock source is referred to as the 32K oscillator
(CLK_32K_RTC) in the AM335x and AMIC110 Sitara Processors Technical Reference Manual. OSC1 is
disabled by default after power is applied. This clock input is optional and may not be required if the RTC
is configured to receive a clock from the internal 32k RC oscillator (CLK_RC32K) or peripheral PLL
(CLK_32KHZ) which receives a reference clock from the OSC0 input.
The OSC0 oscillator provides a 19.2-MHz, 24-MHz, 25-MHz, or 26-MHz reference clock which is used to
clock all non-RTC functions and is connected to the XTALIN and XTALOUT terminals. This clock source is
referred to as the master oscillator (CLK_M_OSC) in the AM335x and AMIC110 Sitara Processors
Technical Reference Manual. OSC0 is enabled by default after power is applied.
For more information related to recommended circuit topologies and crystal oscillator circuit requirements
for these clock inputs, see Section 6.2.2.
6.2.2
Input Clock Requirements
6.2.2.1
OSC0 Internal Oscillator Clock Source
Figure 6-9 shows the recommended crystal circuit. TI recommends that preproduction printed-circuit board
(PCB) designs include the two optional resistors Rbias and Rd in case they are required for proper oscillator
operation when combined with production crystal circuit components. In most cases, Rbias is not required
and Rd is a 0-Ω resistor. These resistors may be removed from production PCB designs after evaluating
oscillator performance with production crystal circuit components installed on preproduction PCBs.
The XTALIN terminal has a 15- to 40-kΩ internal pulldown resistor which is enabled when OSC0 is
disabled. This internal resistor prevents the XTALIN terminal from floating to an invalid logic level which
may increase leakage current through the oscillator input buffer.
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AM335x
VSS_OSC
XTALIN
XTALOUT
C1
C2
Crystal
Optional Rd
Optional Rbias
Copyright © 2016, Texas Instruments Incorporated
A.
B.
Oscillator components (Crystal, C1, C2, optional Rbias and Rd) must be located close to the AM335x package.
Parasitic capacitance to the VSS_OSC and respective crystal circuit component grounds should be connected directly
to the nearest PCB digital ground (VSS).
C1 and C2 represent the total capacitance of the respective PCB trace, load capacitor, and other components
(excluding the crystal) connected to each crystal terminal. The value of capacitors C1 and C2 should be selected to
provide the total load capacitance, CL, specified by the crystal manufacturer. The total load capacitance is CL = [(C1 ×
C2) / (C1 + C2)] + Cshunt, where Cshunt is the crystal shunt capacitance (C0) specified by the crystal manufacturer plus
any mutual capacitance (Cpkg + CPCB) seen across the AM335x XTALIN and XTALOUT signals. For recommended
values of crystal circuit components, see Table 6-2.
Figure 6-9. OSC0 Crystal Circuit Schematic
Table 6-2. OSC0 Crystal Circuit Requirements
PARAMETER
MIN
Crystal parallel resonance
frequency
ƒxtal
Crystal frequency stability
and tolerance (1)
CC1
C1 capacitance
CC2
C2 capacitance
Cshunt
Shunt capacitance
ESR
(1)
Fundamental mode oscillation only
Crystal effective series
resistance
TYP
MAX
19.2, 24,
25, or 26
UNIT
MHz
–50
50
Cshunt ≤ 5 pF
12
24
Cshunt > 5 pF
18
24
Cshunt ≤ 5 pF
12
24
Cshunt > 5 pF
18
24
7
ƒxtal = 19.2 MHz, oscillator has nominal
negative resistance of 272 Ω and worstcase negative resistance of 163 Ω
54.4
ƒxtal = 24 MHz, oscillator has nominal
negative resistance of 240 Ω and worstcase negative resistance of 144 Ω
48.0
ƒxtal = 25 MHz, oscillator has nominal
negative resistance of 233 Ω and worstcase negative resistance of 140 Ω
46.6
ƒxtal = 26 MHz, oscillator has nominal
negative resistance of 227 Ω and worstcase negative resistance of 137 Ω
45.3
ppm
pF
pF
pF
Ω
Initial accuracy, temperature drift, and aging effects should be combined when evaluating a reference clock for this requirement.
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Table 6-3. OSC0 Crystal Circuit Characteristics
NAME
DESCRIPTION
MIN
TYP
ZCE package
0.01
ZCZ package
0.01
Cpkg
Shunt capacitance of
package
Pxtal
The actual values of the ESR, ƒxtal, and CL should be used to yield a
typical crystal power dissipation value. Using the maximum values
specified for ESR, ƒxtal, and CL parameters yields a maximum power
dissipation value.
tsX
Start-up time
UNIT
pF
Pxtal = 0.5 ESR (2 π ƒxtal
CL VDDS_OSC)2
1.5
VDD_CORE (min.)
MAX
ms
VDD_CORE
Voltage
VSS
VDDS_OSC (min.)
VSS
VDDS_OSC
XTALOUT
tsX
Time
Figure 6-10. OSC0 Start-Up Time
108
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6.2.2.2
SPRS717J – OCTOBER 2011 – REVISED APRIL 2016
OSC0 LVCMOS Digital Clock Source
Figure 6-11 shows the recommended oscillator connections when OSC0 is connected to an LVCMOS
square-wave digital clock source. The LVCMOS clock source is connected to the XTALIN terminal. The
ground for the LVCMOS clock source and VSS_OSC should be connected directly to the nearest PCB
digital ground (VSS). In this mode of operation, the XTALOUT terminal should not be used to source any
external components. The PCB design should provide a mechanism to disconnect the XTALOUT terminal
from any external components or signal traces that may couple noise into OSC0 via the XTALOUT
terminal.
The XTALIN terminal has a 15- to 40-kΩ internal pulldown resistor which is enabled when OSC0 is
disabled. This internal resistor prevents the XTALIN terminal from floating to an invalid logic level which
may increase leakage current through the oscillator input buffer.
AM335x
XTALIN
VSS_OSC
XTALOUT
VDDS_OSC
LVCMOS
Digital
Clock
Source
Copyright © 2016, Texas Instruments Incorporated
Figure 6-11. OSC0 LVCMOS Circuit Schematic
Table 6-4. OSC0 LVCMOS Reference Clock Requirements
NAME
ƒ(XTALIN)
DESCRIPTION
MIN
Frequency, LVCMOS reference clock
Frequency, LVCMOS reference clock stability and tolerance (1)
TYP
MAX
19.2, 24, 25,
or 26
UNIT
MHz
–50
50
tdc(XTALIN)
Duty cycle, LVCMOS reference clock period
45%
55%
tjpp(XTALIN)
Jitter peak-to-peak, LVCMOS reference clock period
–1%
1%
tR(XTALIN)
Time, LVCMOS reference clock rise
5
ns
tF(XTALIN)
Time, LVCMOS reference clock fall
5
ns
(1)
ppm
Initial accuracy, temperature drift, and aging effects should be combined when evaluating a reference clock for this requirement.
6.2.2.3
OSC1 Internal Oscillator Clock Source
Figure 6-12 shows the recommended crystal circuit for OSC1 of the ZCE package and Figure 6-13 shows
the recommended crystal circuit for OSC1 of the ZCZ package. TI recommends that preproduction PCB
designs include the two optional resistors Rbias and Rd in case they are required for proper oscillator
operation when combined with production crystal circuit components. In most cases, Rbias is not required
and Rd is a 0-Ω resistor. These resistors may be removed from production PCB designs after evaluating
oscillator performance with production crystal circuit components installed on preproduction PCBs.
The RTC_XTALIN terminal has a 10- to 40-kΩ internal pullup resistor which is enabled when OSC1 is
disabled. This internal resistor prevents the RTC_XTALIN terminal from floating to an invalid logic level
which may increase leakage current through the oscillator input buffer.
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AM335x
(ZCE Package)
RTC_XTALIN
RTC_XTALOUT
Optional Rbias
Optional Rd
Crystal
C1
C2
Copyright © 2016, Texas Instruments Incorporated
A.
B.
Oscillator components (Crystal, C1, C2, optional Rbias and Rd) must be located close to the AM335x package.
Parasitic capacitance to the PCB ground and other signals should be minimized to reduce noise coupled into the
oscillator. VSS_RTC and respective crystal circuit component grounds should be connected directly to the nearest
PCB digital ground (VSS).
C1 and C2 represent the total capacitance of the respective PCB trace, load capacitor, and other components
(excluding the crystal) connected to each crystal terminal. The value of capacitors C1 and C2 should be selected to
provide the total load capacitance, CL, specified by the crystal manufacturer. The total load capacitance is CL = [(C1 ×
C2) / (C1 + C2)] + Cshunt, where Cshunt is the crystal shunt capacitance (C0) specified by the crystal manufacturer plus
any mutual capacitance (Cpkg + CPCB) seen across the AM335x RTC_XTALIN and RTC_XTALOUT signals. For
recommended values of crystal circuit components, see Table 6-5.
Figure 6-12. OSC1 (ZCE Package) Crystal Circuit Schematic
AM335x
(ZCZ Package)
VSS_RTC
RTC_XTALIN
RTC_XTALOUT
C1
C2
Crystal
Optional Rd
Optional Rbias
Copyright © 2016, Texas Instruments Incorporated
A.
B.
Oscillator components (Crystal, C1, C2, optional Rbias and Rd) must be located close to the AM335x package.
Parasitic capacitance to the PCB ground and other signals should be minimized to reduce noise coupled into the
oscillator. VSS_RTC and respective crystal circuit component grounds should be connected directly to the nearest
PCB digital ground (VSS).
C1 and C2 represent the total capacitance of the respective PCB trace, load capacitor, and other components
(excluding the crystal) connected to each crystal terminal. The value of capacitors C1 and C2 should be selected to
provide the total load capacitance, CL, specified by the crystal manufacturer. The total load capacitance is CL = [(C1 ×
C2) / (C1 + C2)] + Cshunt, where Cshunt is the crystal shunt capacitance (C0) specified by the crystal manufacturer plus
any mutual capacitance (Cpkg + CPCB) seen across the AM335x RTC_XTALIN and RTC_XTALOUT signals. For
recommended values of crystal circuit components, see Table 6-5.
Figure 6-13. OSC1 (ZCZ Package) Crystal Circuit Schematic
110
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Table 6-5. OSC1 Crystal Circuit Requirements
NAME
DESCRIPTION
MIN
Crystal parallel resonance
frequency
ƒxtal
Crystal frequency stability
and tolerance (1)
Fundamental mode oscillation only
TYP
MAX
32.768
UNIT
kHz
Maximum RTC error = 10.512 minutes
per year
–20.0
20.0
ppm
Maximum RTC error = 26.28 minutes per
year
–50.0
50.0
ppm
CC1
C1 capacitance
12.0
24.0
pF
CC2
C2 capacitance
12.0
24.0
pF
Cshunt
Shunt capacitance
1.5
pF
ESR
Crystal effective series
resistance
80
kΩ
(1)
ƒxtal = 32.768 kHz, oscillator has nominal
negative resistance of 725 kΩ and worstcase negative resistance of 250 kΩ
Initial accuracy, temperature drift, and aging effects should be combined when evaluating a reference clock for this requirement.
Table 6-6. OSC1 Crystal Circuit Characteristics
NAME
DESCRIPTION
MIN
Cpkg
Shunt capacitance of
package
Pxtal
The actual values of the ESR, ƒxtal, and CL should be used to yield a
typical crystal power dissipation value. Using the maximum values
specified for ESR, ƒxtal, and CL parameters yields a maximum power
dissipation value.
tsX
Start-up time
TYP
MAX
UNIT
ZCE package
0.17
pF
ZCZ package
0.01
pF
Pxtal = 0.5 ESR (2 π ƒxtal CL
VDDS_RTC)2
2
CAP_VDD_RTC (min.)
s
CAP_VDD_RTC
Voltage
VSS_RTC
VDDS_RTC (min.)
VDDS_RTC
RTC_XTALOUT
VSS_RTC
tsX
Time
Figure 6-14. OSC1 Start-up Time
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OSC1 LVCMOS Digital Clock Source
Figure 6-15 shows the recommended oscillator connections when OSC1 of the ZCE package is connected
to an LVCMOS square-wave digital clock source and Figure 6-16 shows the recommended oscillator
connections when OSC1 of the ZCZ package is connected to an LVCMOS square-wave digital clock
source. The LVCMOS clock source is connected to the RTC_XTALIN terminal. The ground for the
LVCMOS clock source and VSS_RTC of the ZCZ package should be connected directly to the nearest
PCB digital ground (VSS). In this mode of operation, the RTC_XTALOUT terminal should not be used to
source any external components. The PCB design should provide a mechanism to disconnect the
RTC_XTALOUT terminal from any external components or signal traces that may couple noise into OSC1
through the RTC_XTALOUT terminal.
The RTC_XTALIN terminal has a 10- to 40-kΩ internal pullup resistor which is enabled when OSC1 is
disabled. This internal resistor prevents the RTC_XTALIN terminal from floating to an invalid logic level
which may increase leakage current through the oscillator input buffer.
AM335x
(ZCE Package)
RTC_XTALIN
RTC_XTALOUT
VDDS_RTC
LVCMOS
Digital
Clock
Source
N/C
Copyright © 2016, Texas Instruments Incorporated
Figure 6-15. OSC1 (ZCE Package) LVCMOS Circuit Schematic
AM335x
(ZCZ Package)
RTC_XTALIN
VSS_RTC
RTC_XTALOUT
VDDS_RTC
LVCMOS
Digital
Clock
Source
N/C
Copyright © 2016, Texas Instruments Incorporated
Figure 6-16. OSC1 (ZCZ Package) LVCMOS Circuit Schematic
Table 6-7. OSC1 LVCMOS Reference Clock Requirements
NAME
DESCRIPTION
MIN
Frequency, LVCMOS reference clock
ƒ(RTC_XTALIN)
Frequency, LVCMOS reference clock
stability and tolerance (1)
TYP MAX
32.768
UNIT
kHz
Maximum RTC error =
10.512 minutes/year
–20
20
ppm
Maximum RTC error = 26.28
minutes/year
–50
50
ppm
tdc(RTC_XTALIN)
Duty cycle, LVCMOS reference clock period
45%
55%
tjpp(RTC_XTALIN)
Jitter peak-to-peak, LVCMOS reference clock period
–1%
1%
tR(RTC_XTALIN)
Time, LVCMOS reference clock rise
5
ns
tF(RTC_XTALIN)
Time, LVCMOS reference clock fall
5
ns
(1)
112
Initial accuracy, temperature drift, and aging effects should be combined when evaluating a reference clock for this requirement.
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6.2.2.5
SPRS717J – OCTOBER 2011 – REVISED APRIL 2016
OSC1 Not Used
Figure 6-17 shows the recommended oscillator connections when OSC1 of the ZCE package is not used
and Figure 6-18 shows the recommended oscillator connections when OSC1 of the ZCZ package is not
used. An internal 10-kΩ pullup on the RTC_XTALIN terminal is turned on when OSC1 is disabled to
prevent this input from floating to an invalid logic level which may increase leakage current through the
oscillator input buffer. OSC1 is disabled by default after power is applied. Therefore, both RTC_XTALIN
and RTC_XTALOUT terminals should be a no connect (NC) when OSC1 is not used.
AM335x
(ZCE Package)
RTC_XTALIN
RTC_XTALOUT
N/C
N/C
Copyright © 2016, Texas Instruments Incorporated
Figure 6-17. OSC1 (ZCE Package) Not Used Schematic
AM335x
(ZCZ Package)
RTC_XTALIN
N/C
VSS_RTC
RTC_XTALOUT
N/C
Copyright © 2016, Texas Instruments Incorporated
Figure 6-18. OSC1 (ZCZ Package) Not Used Schematic
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6.2.3
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Output Clock Specifications
The AM335x device has two clock output signals. The CLKOUT1 signal is always a replica of the OSC0
input clock which is referred to as the master oscillator (CLK_M_OSC) in the AM335x and AMIC110 Sitara
Processors Technical Reference Manual. The CLKOUT2 signal can be configured to output the OSC1
input clock, which is referred to as the 32K oscillator (CLK_32K_RTC) in the AM335x and AMIC110 Sitara
Processors Technical Reference Manual, or four other internal clocks. For more information related to
configuring these clock output signals, see the CLKOUT Signals section of the AM335x and AMIC110
Sitara Processors Technical Reference Manual.
6.2.4
Output Clock Characteristics
NOTE
The AM335x CLKOUT1 and CLKOUT2 clock outputs should not be used as a synchronous
clock for any of the peripheral interfaces because they were not timing closed to any other
signals. These clock outputs also were not designed to source any time critical external
circuits that require a low jitter reference clock. The jitter performance of these outputs is
unpredictable due to complex combinations of many system variables. For example,
CLKOUT2 may be sourced from several PLLs with each PLL supporting many configurations
that yield different jitter performance. There are also other unpredictable contributors to jitter
performance such as application specific noise or crosstalk into the clock circuits. Therefore,
there are no plans to specify jitter performance for these outputs.
6.2.4.1
CLKOUT1
The CLKOUT1 signal can be output on the XDMA_EVENT_INTR0 terminal. This terminal connects to one
of seven internal signals via configurable multiplexers. The XDMA_EVENT_INTR0 multiplexer must be
configured for Mode 3 to connect the CLKOUT1 signal to the XDMA_EVENT_INTR0 terminal.
The default reset configuration of the XDMA_EVENT_INTR0 multiplexer is selected by the logic level
applied to the LCD_DATA5 terminal on the rising edge of PWRONRSTn. The XDMA_EVENT_INTR0
multiplexer is configured to Mode 7 if the LCD_DATA5 terminal is low on the rising edge of PWRONRSTn
or Mode 3 if the LCD_DATA5 terminal is high on the rising edge of PWRONRSTn. This allows the
CLKOUT1 signal to be output on the XDMA_EVENT_INTR0 terminal without software intervention. In this
mode, the output is held low while PWRONRSTn is active and begins to toggle after PWRONRSTn is
released.
6.2.4.2
CLKOUT2
The CLKOUT2 signal can be output on the XDMA_EVENT_INTR1 terminal. This terminal connects to one
of seven internal signals via configurable multiplexers. The XDMA_EVENT_INTR1 multiplexer must be
configured for Mode 3 to connect the CLKOUT2 signal to the XDMA_EVENT_INTR1 terminal.
The default reset configuration of the XDMA_EVENT_INTR1 multiplexer is always Mode 7. Software must
configure the XDMA_EVENT_INTR1 multiplexer to Mode 3 for the CLKOUT2 signal to be output on the
XDMA_EVENT_INTR1 terminal.
114
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SPRS717J – OCTOBER 2011 – REVISED APRIL 2016
7 Peripheral Information and Timings
The AM335x device contains many peripheral interfaces. In order to reduce package size and lower
overall system cost while maintaining maximum functionality, many of the AM335x terminals can multiplex
up to eight signal functions. Although there are many combinations of pin multiplexing that are possible,
only a certain number of sets, called I/O Sets, are valid due to timing limitations. These valid I/O Sets were
carefully chosen to provide many possible application scenarios for the user.
Texas Instruments has developed a Windows-based application called Pin Mux Utility that helps a system
designer select the appropriate pin-multiplexing configuration for their AM335x-based product design. The
Pin Mux Utility provides a way to select valid I/O Sets of specific peripheral interfaces to ensure the pinmultiplexing configuration selected for a design only uses valid I/O Sets supported by the AM335x device.
7.1
Parameter Information
The data provided in the following Timing Requirements and Switching Characteristics tables assumes the
device is operating within the Recommended Operating Conditions defined in Section 5, unless otherwise
noted.
7.1.1
Timing Parameters and Board Routing Analysis
The timing parameter values specified in this data manual do not include delays by board routings. As a
good board design practice, such delays must always be taken into account. Timing values may be
adjusted by increasing or decreasing such delays. TI recommends using the available I/O buffer
information specification (IBIS) models to analyze the timing characteristics correctly. If needed, external
logic hardware such as buffers may be used to compensate any timing differences.
The timing parameter values specified in this data manual assume the SLEWCTRL bit in each pad control
register is configured for fast mode (0b).
For the mDDR(LPDDR), DDR2, DDR3, DDR3L memory interface, it is not necessary to use the IBIS
models to analyze timing characteristics. TI provides a PCB routing rules solution that describes the
routing rules to ensure the mDDR(LPDDR), DDR2, DDR3, DDR3L memory interface timings are met.
7.2
Recommended Clock and Control Signal Transition Behavior
All clocks and control signals must transition between VIH and VIL (or between VIL and VIH) in a monotonic
manner.
7.3
OPP50 Support
Some peripherals and features have limited support when the device is operating in OPP50. A complete
list of these limitations follows.
Not supported when operating in OPP50:
Reduced performance when operating in
OPP50:
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
CPSW
DDR3
DEBUGSS-Trace
GPMC Asynchronous Mode
LCDC LIDD Mode
MDIO
PRU-ICSS MII
DDR2
DEBUGSS-JTAG
GPMC Synchronous Mode
LCDC Raster Mode
LPDDR
McASP
McSPI
MMCSD
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Controller Area Network (CAN)
For more information, see the Controller Area Network (CAN) section of the AM335x and AMIC110 Sitara
Processors Technical Reference Manual.
7.4.1
DCAN Electrical Data and Timing
Table 7-1. Timing Requirements for DCANx Receive
(see Figure 7-1)
NO.
1
MIN
ƒbaud(baud)
Maximum programmable baud rate
tw(RX)
Pulse duration, receive data bit
H – 2(1)
MAX
UNIT
1
Mbps
H + 2(1)
ns
(1) H = Period of baud rate, 1 / programmed baud rate
Table 7-2. Switching Characteristics for DCANx Transmit
(see Figure 7-1)
NO.
2
PARAMETER
ƒbaud(baud)
Maximum programmable baud rate
tw(TX)
Pulse duration, transmit data bit
MIN
MAX
UNIT
1
Mbps
H – 2(1)
H + 2(1)
ns
(1) H = Period of baud rate, 1 / programmed baud rate
1
DCANx_RX
2
DCANx_TX
Figure 7-1. DCANx Timings
116
Peripheral Information and Timings
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7.5
SPRS717J – OCTOBER 2011 – REVISED APRIL 2016
DMTimer
7.5.1
DMTimer Electrical Data and Timing
Table 7-3. Timing Requirements for DMTimer [1-7]
(see Figure 7-2)
NO.
1
(1)
MIN
tc(TCLKIN)
Cycle time, TCLKIN
4P + 1
MAX
UNIT
(1)
ns
P = Period of PICLKOCP (interface clock).
Table 7-4. Switching Characteristics for DMTimer [4-7]
(see Figure 7-2)
NO.
(1)
PARAMETER
MIN
MAX
UNIT
2
tw(TIMERxH)
Pulse duration, high
4P – 3 (1)
ns
3
tw(TIMERxL)
Pulse duration, low
4P – 3 (1)
ns
P = Period of PICLKTIMER (functional clock).
1
TCLKIN
2
3
TIMER[x]
Figure 7-2. Timer Timing
Peripheral Information and Timings
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Ethernet Media Access Controller (EMAC) and Switch
7.6.1
EMAC and Switch Electrical Data and Timing
The EMAC and Switch implemented in the AM335x device supports GMII mode, but the AM335x design
does not pin out 9 of the 24 GMII signals. This was done to reduce the total number of package terminals.
Therefore, the AM335x device does not support GMII mode. MII mode is supported with the remaining
GMII signals.
The AM335x and AMIC110 Sitara Processors Technical Reference Manual and this document may
reference internal signal names when discussing peripheral input and output signals because many of the
AM335x package terminals can be multiplexed to one of several peripheral signals. For example, the
AM335x terminal names for port 1 of the EMAC and switch have been changed from GMII to MII to
indicate their Mode 0 function, but the internal signal is named GMII. However, documents that describe
the Ethernet switch reference these signals by their internal signal name. For a cross-reference of internal
signal names to terminal names, see Table 4-2.
Operation of the EMAC and switch is not supported for OPP50.
Table 7-5. EMAC and Switch Timing Conditions
PARAMETER
MIN
TYP
MAX
UNIT
Input Conditions
tR
Input signal rise time
tF
Input signal fall time
1(1)
5(1)
ns
(1)
(1)
ns
30
pF
1
5
Output Condition
CLOAD
Output load capacitance
3
(1) Except when specified otherwise.
7.6.1.1
EMAC/Switch MDIO Electrical Data and Timing
Table 7-6. Timing Requirements for MDIO_DATA
(see Figure 7-3)
NO.
MIN
1
tsu(MDIO-MDC)
Setup time, MDIO valid before MDC high
2
th(MDIO-MDC)
Hold time, MDIO valid from MDC high
TYP
MAX
UNIT
90
ns
0
ns
1
2
MDIO_CLK (Output)
MDIO_DATA (Input)
Figure 7-3. MDIO_DATA Timing - Input Mode
Table 7-7. Switching Characteristics for MDIO_CLK
(see Figure 7-4)
NO.
118
PARAMETER
MIN
TYP
MAX
UNIT
1
tc(MDC)
Cycle time, MDC
400
ns
2
tw(MDCH)
Pulse duration, MDC high
160
ns
3
tw(MDCL)
Pulse duration, MDC low
160
4
tt(MDC)
Transition time, MDC
Peripheral Information and Timings
ns
5
ns
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4
1
3
2
MDIO_CLK
4
Figure 7-4. MDIO_CLK Timing
Table 7-8. Switching Characteristics for MDIO_DATA
(see Figure 7-5)
NO.
1
PARAMETER
td(MDC-MDIO)
MIN
Delay time, MDC high to MDIO valid
TYP
10
MAX
UNIT
390
ns
1
MDIO_CLK (Output)
MDIO_DATA (Output)
Figure 7-5. MDIO_DATA Timing - Output Mode
7.6.1.2
EMAC and Switch MII Electrical Data and Timing
Table 7-9. Timing Requirements for GMII[x]_RXCLK - MII Mode
(see Figure 7-6)
10 Mbps
NO.
MIN
TYP
100 Mbps
MAX
MIN
TYP
MAX
UNIT
1
tc(RX_CLK)
Cycle time, RX_CLK
399.96
400.04
39.996
40.004
ns
2
tw(RX_CLKH)
Pulse duration, RX_CLK high
140
260
14
26
ns
3
tw(RX_CLKL)
Pulse duration, RX_CLK low
140
260
14
26
ns
4
tt(RX_CLK)
Transition time, RX_CLK
5
ns
5
4
1
2
3
GMII[x]_RXCLK
4
Figure 7-6. GMII[x]_RXCLK Timing - MII Mode
Peripheral Information and Timings
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Table 7-10. Timing Requirements for GMII[x]_TXCLK - MII Mode
(see Figure 7-7)
10 Mbps
NO.
MIN
100 Mbps
TYP
MAX
MIN
TYP
MAX
UNIT
1
tc(TX_CLK)
Cycle time, TX_CLK
399.96
400.04
39.996
40.004
ns
2
tw(TX_CLKH)
Pulse duration, TX_CLK high
140
260
14
26
ns
3
tw(TX_CLKL)
Pulse duration, TX_CLK low
140
260
14
26
ns
4
tt(TX_CLK)
Transition time, TX_CLK
5
ns
5
4
1
3
2
GMII[x]_TXCLK
4
Figure 7-7. GMII[x]_TXCLK Timing - MII Mode
Table 7-11. Timing Requirements for GMII[x]_RXD[3:0], GMII[x]_RXDV, and GMII[x]_RXER - MII Mode
(see Figure 7-8)
10 Mbps
NO
.
1
2
MIN
tsu(RXD-RX_CLK)
Setup time, RXD[3:0] valid before RX_CLK
tsu(RX_DV-RX_CLK)
Setup time, RX_DV valid before RX_CLK
tsu(RX_ER-RX_CLK)
Setup time, RX_ER valid before RX_CLK
th(RX_CLK-RXD)
Hold time RXD[3:0] valid after RX_CLK
th(RX_CLK-RX_DV)
Hold time RX_DV valid after RX_CLK
th(RX_CLK-RX_ER)
Hold time RX_ER valid after RX_CLK
100 Mbps
TYP
MAX
MIN
TYP
MAX
UNIT
8
8
ns
8
8
ns
1
2
GMII[x]_MRCLK (Input)
GMII[x]_RXD[3:0], GMII[x]_RXDV,
GMII[x]_RXER (Inputs)
Figure 7-8. GMII[x]_RXD[3:0], GMII[x]_RXDV, GMII[x]_RXER Timing - MII Mode
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Table 7-12. Switching Characteristics for GMII[x]_TXD[3:0], and GMII[x]_TXEN - MII Mode
(see Figure 7-9)
NO.
1
PARAMETER
td(TX_CLK-TXD)
Delay time, TX_CLK high to TXD[3:0] valid
td(TX_CLK-TX_EN)
Delay time, TX_CLK to TX_EN valid
10 Mbps
MIN
5
TYP
100 Mbps
MAX
MIN
25
5
TYP
MAX
25
UNIT
ns
1
GMII[x]_TXCLK (input)
GMII[x]_TXD[3:0],
GMII[x]_TXEN (outputs)
Figure 7-9. GMII[x]_TXD[3:0], GMII[x]_TXEN Timing - MII Mode
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EMAC and Switch RMII Electrical Data and Timing
Table 7-13. Timing Requirements for RMII[x]_REFCLK - RMII Mode
(see Figure 7-10)
NO.
MIN
TYP
MAX
UNIT
1
tc(REF_CLK)
Cycle time, REF_CLK
19.999
20.001
ns
2
tw(REF_CLKH)
Pulse duration, REF_CLK high
7
13
ns
3
tw(REF_CLKL)
Pulse duration, REF_CLK low
7
13
ns
1
2
RMII[x]_REFCLK
(Input)
3
Figure 7-10. RMII[x]_REFCLK Timing - RMII Mode
Table 7-14. Timing Requirements for RMII[x]_RXD[1:0], RMII[x]_CRS_DV, and RMII[x]_RXER - RMII Mode
(see Figure 7-11)
NO.
1
2
MIN
tsu(RXD-REF_CLK)
Setup time, RXD[1:0] valid before REF_CLK
tsu(CRS_DV-REF_CLK)
Setup time, CRS_DV valid before REF_CLK
tsu(RX_ER-REF_CLK)
Setup time, RX_ER valid before REF_CLK
th(REF_CLK-RXD)
Hold time RXD[1:0] valid after REF_CLK
th(REF_CLK-CRS_DV)
Hold time, CRS_DV valid after REF_CLK
th(REF_CLK-RX_ER)
Hold time, RX_ER valid after REF_CLK
TYP
MAX
UNIT
4
ns
2
ns
1
2
RMII[x]_REFCLK (input)
RMII[x]_RXD[1:0], RMII[x]_CRS_DV,
RMII[x]_RXER (inputs)
Figure 7-11. RMII[x]_RXD[1:0], RMII[x]_CRS_DV, RMII[x]_RXER Timing - RMII Mode
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Table 7-15. Switching Characteristics for RMII[x]_TXD[1:0], and RMII[x]_TXEN - RMII Mode
(see Figure 7-12)
NO.
1
2
3
PARAMETER
td(REF_CLK-TXD)
Delay time, REF_CLK high to TXD[1:0] valid
td(REF_CLK-TXEN)
Delay time, REF_CLK to TXEN valid
tr(TXD)
Rise time, TXD outputs
tr(TX_EN)
Rise time, TX_EN output
tf(TXD)
Fall time, TXD outputs
tf(TX_EN)
Fall time, TX_EN output
MIN
TYP
MAX
UNIT
2
13
ns
1
5
ns
1
5
ns
1
RMII[x]_REFCLK (Input)
RMII[x]_TXD[1:0],
RMII[x]_TXEN (Outputs)
3
2
Figure 7-12. RMII[x]_TXD[1:0], RMII[x]_TXEN Timing - RMII Mode
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EMAC and Switch RGMII Electrical Data and Timing
Table 7-16. Timing Requirements for RGMII[x]_RCLK - RGMII Mode
(see Figure 7-13)
10 Mbps
NO.
1
MIN
100 Mbps
TYP
MAX
MIN
TYP
1000 Mbps
MAX
MIN
TYP
MAX
UNIT
tc(RXC)
Cycle time, RXC
360
440
36
44
7.2
8.8
ns
2
tw(RXCH)
Pulse duration, RXC
high
160
240
16
24
3.6
4.4
ns
3
tw(RXCL)
Pulse duration, RXC low
160
240
16
24
3.6
4.4
ns
4
tt(RXC)
Transition time, RXC
0.75
ns
0.75
0.75
1
4
2
4
3
RGMII[x]_RCLK
Figure 7-13. RGMII[x]_RCLK Timing - RGMII Mode
Table 7-17. Timing Requirements for RGMII[x]_RD[3:0], and RGMII[x]_RCTL - RGMII Mode
(see Figure 7-14)
10 Mbps
NO.
MIN
MAX
MIN
TYP
1000 Mbps
MAX
MIN
TYP
MAX
tsu(RD-RXC)
Setup time, RD[3:0] valid
before RXC high or low
1
1
1
tsu(RX_CTL-RXC)
Setup time, RX_CTL valid
before RXC high or low
1
1
1
th(RXC-RD)
Hold time, RD[3:0] valid after
RXC high or low
1
1
1
th(RXC-RX_CTL)
Hold time, RX_CTL valid after
RXC high or low
1
1
1
tt(RD)
Transition time, RD
0.75
0.75
0.75
tt(RX_CTL)
Transition time, RX_CTL
0.75
0.75
0.75
1
2
3
TYP
100 Mbps
UNIT
ns
ns
ns
(A)
RGMII[x]_RCLK
1
1st Half-byte
2
2nd Half-byte
(B)
RGMII[x]_RD[3:0]
(B)
RGMII[x]_RCTL
RGRXD[3:0]
RGRXD[7:4]
RXDV
RXERR
3
A.
B.
RGMII[x]_RCLK must be externally delayed relative to the RGMII[x]_RD[3:0] and RGMII[x]_RCTL signals to meet the
respective timing requirements.
Data and control information is received using both edges of the clocks. RGMII[x]_RD[3:0] carries data bits 3-0 on the
rising edge of RGMII[x]_RCLK and data bits 7-4 on the falling edge of RGMII[x]_RCLK. Similarly, RGMII[x]_RCTL
carries RXDV on rising edge of RGMII[x]_RCLK and RXERR on falling edge of RGMII[x]_RCLK.
Figure 7-14. RGMII[x]_RD[3:0], RGMII[x]_RCTL Timing - RGMII Mode
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Table 7-18. Switching Characteristics for RGMII[x]_TCLK - RGMII Mode
(see Figure 7-15)
NO.
1
10 Mbps
PARAMETER
MIN
100 Mbps
TYP
MAX
MIN
1000 Mbps
TYP
MAX
MIN
TYP
MAX
UNIT
tc(TXC)
Cycle time, TXC
360
440
36
44
7.2
8.8
ns
2
tw(TXCH)
Pulse duration, TXC
high
160
240
16
24
3.6
4.4
ns
3
tw(TXCL)
Pulse duration, TXC low
160
240
16
24
3.6
4.4
ns
4
tt(TXC)
Transition time, TXC
0.75
ns
0.75
0.75
1
4
2
4
3
RGMII[x]_TCLK
Figure 7-15. RGMII[x]_TCLK Timing - RGMII Mode
Table 7-19. Switching Characteristics for RGMII[x]_TD[3:0], and RGMII[x]_TCTL - RGMII Mode
(see Figure 7-16)
NO.
10 Mbps
PARAMETER
1
2
MIN
TYP
100 Mbps
MAX
MIN
TYP
1000 Mbps
MAX
MIN
TYP
MAX
tsk(TD-TXC)
TD to TXC output skew
–0.5
0.5
–0.5
0.5
–0.5
0.5
tsk(TX_CTL-TXC)
TX_CTL to TXC output skew
–0.5
0.5
–0.5
0.5
–0.5
0.5
tt(TD)
Transition time, TD
0.75
0.75
0.75
tt(TX_CTL)
Transition time, TX_CTL
0.75
0.75
0.75
UNIT
ns
ns
(A)
RGMII[x]_TCLK
1
1
2
(B)
1st Half-byte
2nd Half-byte
(B)
TXEN
TXERR
RGMII[x]_TD[3:0]
RGMII[x]_TCTL
A.
B.
The EMAC and switch implemented in the AM335x device supports internal delay mode, but timing closure was not
performed for this mode of operation. Therefore, the AM335x device does not support internal delay mode.
Data and control information is transmitted using both edges of the clocks. RGMII[x]_TD[3:0] carries data bits 3-0 on
the rising edge of RGMII[x]_TCLK and data bits 7-4 on the falling edge of RGMII[x]_TCLK. Similarly, RGMII[x]_TCTL
carries TXEN on rising edge of RGMII[x]_TCLK and TXERR of falling edge of RGMII[x]_TCLK.
Figure 7-16. RGMII[x]_TD[3:0], RGMII[x]_TCTL Timing - RGMII Mode
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External Memory Interfaces
The device includes the following external memory interfaces:
• General-purpose memory controller (GPMC)
• mDDR(LPDDR), DDR2, DDR3, DDR3L Memory Interface (EMIF)
7.7.1
General-Purpose Memory Controller (GPMC)
NOTE
For more information, see the Memory Subsystem and General-Purpose Memory Controller
section of the AM335x and AMIC110 Sitara Processors Technical Reference Manual.
The GPMC is the unified memory controller used to interface external memory devices such as:
• Asynchronous SRAM-like memories and ASIC devices
• Asynchronous page mode and synchronous burst NOR flash
• NAND flash
7.7.1.1
GPMC and NOR Flash—Synchronous Mode
Table 7-21 and Table 7-22 assume testing over the recommended operating conditions and electrical
characteristic conditions shown in Table 7-20 (see Figure 7-17 through Figure 7-21).
Table 7-20. GPMC and NOR Flash Timing Conditions—Synchronous Mode
PARAMETER
MIN
TYP
MAX
UNIT
Input Conditions
tR
Input signal rise time
1
5
ns
tF
Input signal fall time
1
5
ns
3
30
pF
Output Condition
CLOAD
Output load capacitance
Table 7-21. GPMC and NOR Flash Timing Requirements—Synchronous Mode
OPP100
NO.
F12
F13
F21
F22
MIN
tsu(dV-clkH)
Setup time, input data gpmc_ad[15:0] valid before output clock
gpmc_clk high
th(clkH-dV)
Hold time, input data gpmc_ad[15:0]
valid after output clock gpmc_clk
high
tsu(waitV-clkH)
Setup time, input wait gpmc_wait[x](1) valid before output clock
gpmc_clk high
th(clkH-waitV)
Hold time, input wait gpmc_wait[x](1)
valid after output clock gpmc_clk
high
MAX
OPP50
MIN
3.2
13.2
Industrial extended
temperature
(-40°C to 125°C)
4.74
4.74
All other temperature ranges
4.74
2.75
3.2
13.2
Industrial extended
temperature
(-40°C to 125°C)
4.74
4.74
All other temperature ranges
4.74
2.75
MAX
UNIT
ns
ns
ns
ns
(1) In gpmc_wait[x], x is equal to 0 or 1.
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Table 7-22. GPMC and NOR Flash Switching Characteristics—Synchronous Mode(2)
NO.
OPP100
PARAMETER
OPP50
MIN
MAX
MIN
MAX
UNIT
F0
1 / tc(clk)
Frequency(18), output clock gpmc_clk
F1
tw(clkH)
Typical pulse duration, output clock gpmc_clk high
0.5P(15)
0.5P(15)
0.5P(15)
0.5P(15)
ns
F1
tw(clkL)
Typical pulse duration, output clock gpmc_clk low
0.5P(15)
0.5P(15)
0.5P(15)
0.5P(15)
ns
tdc(clk)
Duty cycle error, output clock gpmc_clk
–500
500
–500
500
ps
100
(19)
MHz
tJ(clk)
Jitter standard deviation
33.33
33.33
ps
tR(clk)
Rise time, output clock gpmc_clk
2
2
ns
tF(clk)
Fall time, output clock gpmc_clk
2
2
ns
tR(do)
Rise time, output data gpmc_ad[15:0]
2
2
ns
tF(do)
Fall time, output data gpmc_ad[15:0]
2
2
ns
F2
td(clkH-csnV)
Delay time, output clock gpmc_clk rising edge to
output chip select gpmc_csn[x](14) transition
F(6) - 2.2
F(6) + 4.5
F(6) - 3.2
F(6) + 9.5
ns
F3
td(clkH-csnIV)
Delay time, output clock gpmc_clk rising edge to
output chip select gpmc_csn[x](14) invalid
E(5) – 2.2
E(5) + 4.5
E(5) – 3.2
E(5) + 9.5
ns
F4
td(aV-clk)
Delay time, output address gpmc_a[27:1] valid to
output clock gpmc_clk first edge
B(2) – 4.5
B(2) + 2.3
B(2) – 5.5
B(2) + 12.3
ns
F5
td(clkH-aIV)
Delay time, output clock gpmc_clk rising edge to
output address gpmc_a[27:1] invalid
–2.3
4.5
–3.3
14.5
ns
td(be[x]nV-clk)
Delay time, output lower byte enable and command
latch enable gpmc_be0n_cle, output upper byte
enable gpmc_be1n valid to output clock gpmc_clk
first edge
B(2) – 1.9
B(2) + 2.3
B(2) – 2.9
B(2) + 12.3
ns
F7
td(clkH-be[x]nIV)
Delay time, output clock gpmc_clk rising edge to
output lower byte enable and command latch enable
gpmc_be0n_cle, output upper byte enable
gpmc_be1n invalid(11)
D(4) – 2.3
D(4) + 1.9
D(4) – 3.3
D(4) + 6.9
ns
F7
td(clkL-be[x]nIV)
Delay time, gpmc_clk falling edge to
gpmc_nbe0_cle, gpmc_nbe1 invalid(12)
D(4) – 2.3
D(4) + 1.9
D(4) – 3.3
D(4) + 6.9
ns
F7
td(clkL-be[x]nIV)
Delay time, gpmc_clk falling edge to
gpmc_nbe0_cle, gpmc_nbe1 invalid(13)
D(4) – 2.3
D(4) + 1.9
D(4) – 3.3
D(4) + 11.9
ns
F8
td(clkH-advn)
Delay time, output clock gpmc_clk rising edge to
output address valid and address latch enable
gpmc_advn_ale transition
G(7) – 2.3
G(7) + 4.5
G(7) – 3.3
G(7) + 9.5
ns
F9
td(clkH-advnIV)
Delay time, output clock gpmc_clk rising edge to
output address valid and address latch enable
gpmc_advn_ale invalid
D(4) – 2.3
D(4) + 3.5
D(4) – 3.3
D(4) + 9.5
ns
F10
td(clkH-oen)
Delay time, output clock gpmc_clk rising edge to
output enable gpmc_oen transition
H(8) – 2.3
H(8) + 3.5
H(8) – 3.3
H(8) + 8.5
ns
F11
td(clkH-oenIV)
Delay time, output clock gpmc_clk rising edge to
output enable gpmc_oen invalid
E(8) – 2.3
E(8) + 3.5
E(8) – 3.3
E(8) + 8.5
ns
F14
td(clkH-wen)
Delay time, output clock gpmc_clk rising edge to
output write enable gpmc_wen transition
I(9) – 2.3
I(9) + 4.5
I(9) – 3.3
I(9) + 9.5
ns
F15
td(clkH-do)
Delay time, output clock gpmc_clk rising edge to
output data gpmc_ad[15:0] transition(11)
J(10) – 2.3
J(10) + 1.9
J(10) – 3.3
J(10) + 6.9
ns
F15
td(clkL-do)
Delay time, gpmc_clk falling edge to gpmc_ad[15:0]
data bus transition(12)
J(10) – 2.3
J(10) + 1.9
J(10) – 3.3
J(10) + 6.9
ns
F15
td(clkL-do)
Delay time, gpmc_clk falling edge to gpmc_ad[15:0]
data bus transition(13)
J(10) – 2.3
J(10) + 1.9
J(10) – 3.3
J(10) + 11.9
ns
F17
td(clkH-be[x]n)
Delay time, output clock gpmc_clk rising edge to
output lower byte enable and command latch enable
gpmc_be0n_cle transition(11)
J(10) – 2.3
J(10) + 1.9
J(10) – 3.3
J(10) + 6.9
ns
F17
td(clkL-be[x]n)
Delay time, gpmc_clk falling edge to
gpmc_nbe0_cle, gpmc_nbe1 transition(12)
J(10) – 2.3
J(10) + 1.9
J(10) – 3.3
J(10) + 6.9
ns
F17
td(clkL-be[x]n)
Delay time, gpmc_clk falling edge to
gpmc_nbe0_cle, gpmc_nbe1 transition(13)
J(10) – 2.3
J(10) + 1.9
J(10) – 3.3
J(10) + 11.9
ns
F6
, output clock gpmc_clk
50
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Table 7-22. GPMC and NOR Flash Switching Characteristics—Synchronous Mode(2) (continued)
NO.
OPP100
PARAMETER
MIN
OPP50
MAX
MIN
MAX
UNIT
tw(csnV)
Pulse duration, output chip select
gpmc_csn[x](14) low
Read
A(1)
A(1)
ns
Write
A
(1)
A(1)
ns
Read
C(3)
C(3)
ns
F19
tw(be[x]nV)
Pulse duration, output lower byte enable
and command latch enable
gpmc_be0n_cle, output upper byte enable
gpmc_be1n low
C(3)
C(3)
ns
F20
tw(advnV)
Pulse duration, output address valid and
address latch enable gpmc_advn_ale low
Read
K(16)
K(16)
ns
Write
(16)
(16)
ns
F18
Write
K
K
(1) For single read: A = (CSRdOffTime – CSOnTime) × (TimeParaGranularity + 1) × GPMC_FCLK(17)
For burst read: A = (CSRdOffTime – CSOnTime + (n – 1) × PageBurstAccessTime) × (TimeParaGranularity + 1) × GPMC_FCLK(17)
For burst write: A = (CSWrOffTime – CSOnTime + (n – 1) × PageBurstAccessTime) × (TimeParaGranularity + 1) × GPMC_FCLK(17)
With n being the page burst access number.
(2) B = ClkActivationTime × GPMC_FCLK(17)
(3) For single read: C = RdCycleTime × (TimeParaGranularity + 1) × GPMC_FCLK (17)
For burst read: C = (RdCycleTime + (n – 1) × PageBurstAccessTime) × (TimeParaGranularity + 1) × GPMC_FCLK(17)
For burst write: C = (WrCycleTime + (n – 1) × PageBurstAccessTime) × (TimeParaGranularity + 1) × GPMC_FCLK(17)
With n being the page burst access number.
(4) For single read: D = (RdCycleTime – AccessTime) × (TimeParaGranularity + 1) × GPMC_FCLK(17)
For burst read: D = (RdCycleTime – AccessTime) × (TimeParaGranularity + 1) × GPMC_FCLK(17)
For burst write: D = (WrCycleTime – AccessTime) × (TimeParaGranularity + 1) × GPMC_FCLK(17)
(5) For single read: E = (CSRdOffTime – AccessTime) × (TimeParaGranularity + 1) × GPMC_FCLK(17)
For burst read: E = (CSRdOffTime – AccessTime) × (TimeParaGranularity + 1) × GPMC_FCLK(17)
For burst write: E = (CSWrOffTime – AccessTime) × (TimeParaGranularity + 1) × GPMC_FCLK(17)
(6) For csn falling edge (CS activated):
– Case GpmcFCLKDivider = 0:
– F = 0.5 × CSExtraDelay × GPMC_FCLK(17)
– Case GpmcFCLKDivider = 1:
– F = 0.5 × CSExtraDelay × GPMC_FCLK(17) if (ClkActivationTime and CSOnTime are odd) or (ClkActivationTime and
CSOnTime are even)
– F = (1 + 0.5 × CSExtraDelay) × GPMC_FCLK(17) otherwise
– Case GpmcFCLKDivider = 2:
– F = 0.5 × CSExtraDelay × GPMC_FCLK(17) if ((CSOnTime – ClkActivationTime) is a multiple of 3)
– F = (1 + 0.5 × CSExtraDelay) × GPMC_FCLK(17) if ((CSOnTime – ClkActivationTime – 1) is a multiple of 3)
– F = (2 + 0.5 × CSExtraDelay) × GPMC_FCLK(17) if ((CSOnTime – ClkActivationTime – 2) is a multiple of 3)
(7) For ADV falling edge (ADV activated):
– Case GpmcFCLKDivider = 0:
– G = 0.5 × ADVExtraDelay × GPMC_FCLK(17)
– Case GpmcFCLKDivider = 1:
– G = 0.5 × ADVExtraDelay × GPMC_FCLK(17) if (ClkActivationTime and ADVOnTime are odd) or (ClkActivationTime and
ADVOnTime are even)
– G = (1 + 0.5 × ADVExtraDelay) × GPMC_FCLK(17) otherwise
– Case GpmcFCLKDivider = 2:
– G = 0.5 × ADVExtraDelay × GPMC_FCLK(17) if ((ADVOnTime – ClkActivationTime) is a multiple of 3)
– G = (1 + 0.5 × ADVExtraDelay) × GPMC_FCLK(17) if ((ADVOnTime – ClkActivationTime – 1) is a multiple of 3)
– G = (2 + 0.5 × ADVExtraDelay) × GPMC_FCLK(17) if ((ADVOnTime – ClkActivationTime – 2) is a multiple of 3)
For ADV rising edge (ADV deactivated) in Reading mode:
– Case GpmcFCLKDivider = 0:
– G = 0.5 × ADVExtraDelay × GPMC_FCLK(17)
– Case GpmcFCLKDivider = 1:
– G = 0.5 × ADVExtraDelay × GPMC_FCLK(17) if (ClkActivationTime and ADVRdOffTime are odd) or (ClkActivationTime and
ADVRdOffTime are even)
– G = (1 + 0.5 × ADVExtraDelay) × GPMC_FCLK(17) otherwise
– Case GpmcFCLKDivider = 2:
– G = 0.5 × ADVExtraDelay × GPMC_FCLK(17) if ((ADVRdOffTime – ClkActivationTime) is a multiple of 3)
– G = (1 + 0.5 × ADVExtraDelay) × GPMC_FCLK(17) if ((ADVRdOffTime – ClkActivationTime – 1) is a multiple of 3)
– G = (2 + 0.5 × ADVExtraDelay) × GPMC_FCLK(17) if ((ADVRdOffTime – ClkActivationTime – 2) is a multiple of 3)
For ADV rising edge (ADV deactivated) in Writing mode:
– Case GpmcFCLKDivider = 0:
– G = 0.5 × ADVExtraDelay × GPMC_FCLK(17)
– Case GpmcFCLKDivider = 1:
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G = 0.5 × ADVExtraDelay × GPMC_FCLK(17) if (ClkActivationTime and ADVWrOffTime are odd) or (ClkActivationTime and
ADVWrOffTime are even)
– G = (1 + 0.5 × ADVExtraDelay) × GPMC_FCLK(17) otherwise
Case GpmcFCLKDivider = 2:
– G = 0.5 × ADVExtraDelay × GPMC_FCLK(17) if ((ADVWrOffTime – ClkActivationTime) is a multiple of 3)
– G = (1 + 0.5 × ADVExtraDelay) × GPMC_FCLK(17) if ((ADVWrOffTime – ClkActivationTime – 1) is a multiple of 3)
– G = (2 + 0.5 × ADVExtraDelay) × GPMC_FCLK(17) if ((ADVWrOffTime – ClkActivationTime – 2) is a multiple of 3)
–
–
(8) For OE falling edge (OE activated) and I/O DIR rising edge (Data Bus input direction):
– Case GpmcFCLKDivider = 0:
– H = 0.5 × OEExtraDelay × GPMC_FCLK(17)
– Case GpmcFCLKDivider = 1:
– H = 0.5 × OEExtraDelay × GPMC_FCLK(17) if (ClkActivationTime and OEOnTime are odd) or (ClkActivationTime and
OEOnTime are even)
– H = (1 + 0.5 × OEExtraDelay) × GPMC_FCLK(17) otherwise
– Case GpmcFCLKDivider = 2:
– H = 0.5 × OEExtraDelay × GPMC_FCLK(17) if ((OEOnTime – ClkActivationTime) is a multiple of 3)
– H = (1 + 0.5 × OEExtraDelay) × GPMC_FCLK(17) if ((OEOnTime – ClkActivationTime – 1) is a multiple of 3)
– H = (2 + 0.5 × OEExtraDelay) × GPMC_FCLK(17) if ((OEOnTime – ClkActivationTime – 2) is a multiple of 3)
For OE rising edge (OE deactivated):
– Case GpmcFCLKDivider = 0:
– H = 0.5 × OEExtraDelay × GPMC_FCLK(17)
– Case GpmcFCLKDivider = 1:
– H = 0.5 × OEExtraDelay × GPMC_FCLK(17) if (ClkActivationTime and OEOffTime are odd) or (ClkActivationTime and
OEOffTime are even)
– H = (1 + 0.5 × OEExtraDelay) × GPMC_FCLK(17) otherwise
– Case GpmcFCLKDivider = 2:
– H = 0.5 × OEExtraDelay × GPMC_FCLK(17) if ((OEOffTime – ClkActivationTime) is a multiple of 3)
– H = (1 + 0.5 × OEExtraDelay) × GPMC_FCLK(17) if ((OEOffTime – ClkActivationTime – 1) is a multiple of 3)
– H = (2 + 0.5 × OEExtraDelay) × GPMC_FCLK(17) if ((OEOffTime – ClkActivationTime – 2) is a multiple of 3)
(9) For WE falling edge (WE activated):
– Case GpmcFCLKDivider = 0:
– I = 0.5 × WEExtraDelay × GPMC_FCLK(17)
– Case GpmcFCLKDivider = 1:
– I = 0.5 × WEExtraDelay × GPMC_FCLK(17) if (ClkActivationTime and WEOnTime are odd) or (ClkActivationTime and
WEOnTime are even)
– I = (1 + 0.5 × WEExtraDelay) × GPMC_FCLK(17) otherwise
– Case GpmcFCLKDivider = 2:
– I = 0.5 × WEExtraDelay × GPMC_FCLK(17) if ((WEOnTime – ClkActivationTime) is a multiple of 3)
– I = (1 + 0.5 × WEExtraDelay) × GPMC_FCLK(17) if ((WEOnTime – ClkActivationTime – 1) is a multiple of 3)
– I = (2 + 0.5 × WEExtraDelay) × GPMC_FCLK(17) if ((WEOnTime – ClkActivationTime – 2) is a multiple of 3)
For WE rising edge (WE deactivated):
– Case GpmcFCLKDivider = 0:
– I = 0.5 × WEExtraDelay × GPMC_FCLK (17)
– Case GpmcFCLKDivider = 1:
– I = 0.5 × WEExtraDelay × GPMC_FCLK(17) if (ClkActivationTime and WEOffTime are odd) or (ClkActivationTime and
WEOffTime are even)
– I = (1 + 0.5 × WEExtraDelay) × GPMC_FCLK(17) otherwise
– Case GpmcFCLKDivider = 2:
– I = 0.5 × WEExtraDelay × GPMC_FCLK(17) if ((WEOffTime – ClkActivationTime) is a multiple of 3)
– I = (1 + 0.5 × WEExtraDelay) × GPMC_FCLK(17) if ((WEOffTime – ClkActivationTime – 1) is a multiple of 3)
– I = (2 + 0.5 × WEExtraDelay) × GPMC_FCLK(17) if ((WEOffTime – ClkActivationTime – 2) is a multiple of 3)
(10) J = GPMC_FCLK(17)
(11) First transfer only for CLK DIV 1 mode.
(12) Half cycle; for all data after initial transfer for CLK DIV 1 mode.
(13) Half cycle of GPMC_CLK_OUT; for all data for modes other than CLK DIV 1 mode. GPMC_CLK_OUT divide down from GPMC_FCLK.
(14) In gpmc_csn[x], x is equal to 0, 1, 2, 3, 4, or 5. In gpmc_wait[x], x is equal to 0 or 1.
(15) P = gpmc_clk period in ns
(16) For read: K = (ADVRdOffTime – ADVOnTime) × (TimeParaGranularity + 1) × GPMC_FCLK(17)
For write: K = (ADVWrOffTime – ADVOnTime) × (TimeParaGranularity + 1) × GPMC_FCLK(17)
(17) GPMC_FCLK is general-purpose memory controller internal functional clock period in ns.
(18) Related to the gpmc_clk output clock maximum and minimum frequencies programmable in the GPMC module by setting the
GPMC_CONFIG1_CSx configuration register bit field GpmcFCLKDivider.
(19) The jitter probability density can be approximated by a Gaussian function.
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F1
F0
F1
gpmc_clk
F2
F3
F18
gpmc_csn[x]
F4
gpmc_a[10:1]
Valid Address
F6
F7
F19
gpmc_be0n_cle
F19
gpmc_be1n
F6
F8
F8
F20
F9
gpmc_advn_ale
F10
F11
gpmc_oen
F13
F12
gpmc_ad[15:0]
D0
gpmc_wait[x]
A.
B.
In gpmc_csn[x], x is equal to 0, 1, 2, 3, 4, or 5.
In gpmc_wait[x], x is equal to 0 or 1.
Figure 7-17. GPMC and NOR Flash—Synchronous Single Read—(GpmcFCLKDivider = 0)
130
Peripheral Information and Timings
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F1
F0
F1
gpmc_clk
F2
F3
gpmc_csn[x]
F4
Valid Address
gpmc_a[10:1]
F6
F7
gpmc_be0n_cle
F7
gpmc_be1n
F6
F8
F8
F9
gpmc_advn_ale
F10
F11
gpmc_oen
F13
F13
F12
gpmc_ad[15:0]
D0
F21
F12
D1
D2
D3
F22
gpmc_wait[x]
A.
B.
In gpmc_csn[x], x is equal to 0, 1, 2, 3, 4, or 5.
In gpmc_wait[x], x is equal to 0 or 1.
Figure 7-18. GPMC and NOR Flash—Synchronous Burst Read—4x16-Bit (GpmcFCLKDivider = 0)
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F1
F1
F0
gpmc_clk
F2
F3
gpmc_csn[x]
F4
Valid Address
gpmc_a[10:1]
F17
F6
F17
F17
gpmc_be0n_cle
F17
F17
F17
gpmc_be1n
F6
F8
F8
F9
gpmc_advn_ale
F14
F14
gpmc_wen
F15
gpmc_ad[15:0]
D0
D1
F15
F15
D2
D3
gpmc_wait[x]
A.
B.
In gpmc_csn[x], x is equal to 0, 1, 2, 3, 4, or 5.
In gpmc_wait[x], x is equal to 0 or 1.
Figure 7-19. GPMC and NOR Flash—Synchronous Burst Write—(GpmcFCLKDivider > 0)
132
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F1
F0
F1
gpmc_clk
F2
F3
gpmc_csn[x]
F6
F7
gpmc_be0n_cle
Valid
F6
F7
gpmc_be1n
Valid
F4
gpmc_a[27:17]
Address (MSB)
F12
F4
gpmc_ad[15:0]
F5
Address (LSB)
F13
D0
F8
D1
F12
D2
F8
D3
F9
gpmc_advn_ale
F10
F11
gpmc_oen
gpmc_wait[x]
A.
B.
In gpmc_csn[x], x is equal to 0, 1, 2, 3, 4, or 5.
In gpmc_wait[x], x is equal to 0 or 1.
Figure 7-20. GPMC and Multiplexed NOR Flash—Synchronous Burst Read
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F1
F1
F0
gpmc_clk
F2
F3
F18
gpmc_csn[x]
F4
gpmc_a[27:17]
Address (MSB)
F17
F6
F17
F6
F17
F17
gpmc_be1n
F17
F17
gpmc_be0n_cle
F8
F8
F20
F9
gpmc_advn_ale
F14
F14
gpmc_wen
F15
gpmc_ad[15:0]
Address (LSB)
D0
F22
D1
F15
F15
D2
D3
F21
gpmc_wait[x]
A.
B.
In gpmc_csn[x], x is equal to 0, 1, 2, 3, 4, or 5.
In gpmc_wait[x], x is equal to 0 or 1.
Figure 7-21. GPMC and Multiplexed NOR Flash—Synchronous Burst Write
134
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7.7.1.2
SPRS717J – OCTOBER 2011 – REVISED APRIL 2016
GPMC and NOR Flash—Asynchronous Mode
Table 7-24 and Table 7-25 assume testing over the recommended operating conditions and electrical
characteristic conditions shown in Table 7-23 (see Figure 7-22 through Figure 7-27).
Table 7-23. GPMC and NOR Flash Timing Conditions—Asynchronous Mode
MIN
TYP
MAX
UNIT
Input Conditions
tR
Input signal rise time
1
5
ns
tF
Input signal fall time
1
5
ns
3
30
pF
Output Condition
CLOAD
Output load capacitance
Table 7-24. GPMC and NOR Flash Internal Timing Requirements—Asynchronous Mode(1)(2)
OPP100
NO.
MIN
FI1
Delay time, output data gpmc_ad[15:0] generation from internal functional clock
GPMC_FCLK(3)
FI2
Delay time, input data gpmc_ad[15:0] capture from internal functional clock
GPMC_FCLK(3)
FI3
OPP50
MAX
MIN
MAX
UNIT
6.5
6.5
ns
4
4
ns
Delay time, output chip select gpmc_csn[x] generation from internal functional
clock GPMC_FCLK(3)
6.5
6.5
ns
FI4
Delay time, output address gpmc_a[27:1] generation from internal functional clock
GPMC_FCLK(3)
6.5
6.5
ns
FI5
Delay time, output address gpmc_a[27:1] valid from internal functional clock
GPMC_FCLK(3)
6.5
6.5
ns
FI6
Delay time, output lower-byte enable and command latch enable gpmc_be0n_cle,
output upper-byte enable gpmc_be1n generation from internal functional clock
GPMC_FCLK(3)
6.5
6.5
ns
FI7
Delay time, output enable gpmc_oen generation from internal functional clock
GPMC_FCLK(3)
6.5
6.5
ns
FI8
Delay time, output write enable gpmc_wen generation from internal functional
clock GPMC_FCLK(3)
6.5
6.5
ns
100
100
ps
FI9
(3)
Skew, internal functional clock GPMC_FCLK
(1) The internal parameters table must be used to calculate data access time stored in the corresponding CS register bit field.
(2) Internal parameters are referred to the GPMC functional internal clock which is not provided externally.
(3) GPMC_FCLK is general-purpose memory controller internal functional clock.
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Table 7-25. GPMC and NOR Flash Timing Requirements—Asynchronous Mode
NO.
OPP100
MIN
FA5(1)
tacc(d)
(2)
FA20
tacc1-pgmode(d)
FA21(3)
tacc2-pgmode(d)
OPP50
MAX
MIN
UNIT
MAX
H(5)
H(5)
ns
Page mode successive data access time
P
(4)
P(4)
ns
Page mode first data access time
H(5)
H(5)
ns
Data access time
(1) The FA5 parameter shows the amount of time required to internally sample input data. It is expressed in number of GPMC functional
clock cycles. From start of read cycle and after FA5 functional clock cycles, input data is internally sampled by active functional clock
edge. FA5 value must be stored inside the AccessTime register bit field.
(2) The FA20 parameter shows amount of time required to internally sample successive input page data. It is expressed in number of
GPMC functional clock cycles. After each access to input page data, next input page data is internally sampled by active functional clock
edge after FA20 functional clock cycles. The FA20 value must be stored in the PageBurstAccessTime register bit field.
(3) The FA21 parameter shows amount of time required to internally sample first input page data. It is expressed in number of GPMC
functional clock cycles. From start of read cycle and after FA21 functional clock cycles, first input page data is internally sampled by
active functional clock edge. FA21 value must be stored inside the AccessTime register bit field.
(4) P = PageBurstAccessTime × (TimeParaGranularity + 1) × GPMC_FCLK(6)
(5) H = AccessTime × (TimeParaGranularity + 1) × GPMC_FCLK(6)
(6) GPMC_FCLK is general-purpose memory controller internal functional clock period in ns.
Table 7-26. GPMC and NOR Flash Switching Characteristics—Asynchronous Mode
NO.
OPP100
PARAMETER
MIN
OPP50
MAX
MIN
UNIT
tR(d)
Rise time, output data gpmc_ad[15:0]
tF(d)
Fall time, output data gpmc_ad[15:0]
Read
FA0
tw(be[x]nV)
Pulse duration, output lower-byte
enable and command latch enable
gpmc_be0n_cle, output upper-byte
enable gpmc_be1n valid time
Write
N(12)
N(12)
FA1
tw(csnV)
Pulse duration, output chip select
gpmc_csn[x](13) low
Read
A(1)
A(1)
Write
(1)
A(1)
Read
B(2) – 0.2
B(2) + 2.0
B(2) – 5
B(2) + 5
FA3
td(csnV-advnIV)
Delay time, output chip select
gpmc_csn[x](13) valid to output
address valid and address latch
enable gpmc_advn_ale invalid
Write
B(2) – 0.2
B(2) + 2.0
B(2) – 5
B(2) + 5
FA4
td(csnV-oenIV)
Delay time, output chip select gpmc_csn[x](13)
valid to output enable gpmc_oen invalid (Single
read)
C(3) – 0.2
C(3) + 2.0
C(3) – 5
C(3) + 5
ns
FA9
td(aV-csnV)
Delay time, output address gpmc_a[27:1] valid
to output chip select gpmc_csn[x](13) valid
J(9) – 0.2
J(9) + 2.0
J(9) – 5
J(9) + 5
ns
FA10
td(be[x]nV-csnV)
Delay time, output lower-byte enable and
command latch enable gpmc_be0n_cle, output
upper-byte enable gpmc_be1n valid to output
chip select gpmc_csn[x](13) valid
J(9) – 0.2
J(9) + 2.0
J(9) – 5
J(9) + 5
ns
FA12
td(csnV-advnV)
Delay time, output chip select gpmc_csn[x](13)
valid to output address valid and address latch
enable gpmc_advn_ale valid
K(10) – 0.2
K(10) + 2.0
K(10) – 5
K(10) + 5
ns
FA13
td(csnV-oenV)
Delay time, output chip select gpmc_csn[x](13)
valid to output enable gpmc_oen valid
L(11) – 0.2
L(11) + 2.0
L
L(11) + 5
ns
FA16
tw(aIV)
Pulse durationm output address gpmc_a[26:1]
invalid between 2 successive read and write
accesses
G(7)
FA18
td(csnV-oenIV)
Delay time, output chip select gpmc_csn[x](13)
valid to output enable gpmc_oen invalid (Burst
read)
I(8) – 0.2
FA20
tw(aV)
Pulse duration, output address gpmc_a[27:1]
valid - 2nd, 3rd, and 4th accesses
FA25
td(csnV-wenV)
Delay time, output chip select gpmc_csn[x](13)
valid to output write enable gpmc_wen valid
136
Peripheral Information and Timings
2
MAX
2
ns
2
2
ns
N(12)
N(12)
A
–5
G(7)
I(8) + 2.0
D(4)
E(5) – 0.2
(11)
I(8) – 5
E(5) – 5
ns
ns
ns
I(8) + 5
D(4)
E(5) + 2.0
ns
ns
ns
E(5) + 5
ns
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Table 7-26. GPMC and NOR Flash Switching Characteristics—Asynchronous Mode (continued)
NO.
PARAMETER
FA27
td(csnV-wenIV)
Delay time, output chip select gpmc_csn[x](13)
valid to output write enable gpmc_wen invalid
FA28
td(wenV-dV)
Delay time, output write enable gpmc_ wen
valid to output data gpmc_ad[15:0] valid
FA29
td(dV-csnV)
Delay time, output data gpmc_ad[15:0] valid to
output chip select gpmc_csn[x](13) valid
FA37
td(oenV-aIV)
Delay time, output enable gpmc_oen valid to
output address gpmc_ad[15:0] phase end
OPP100
OPP50
UNIT
MIN
MAX
MIN
MAX
F(6) – 0.2
F(6) + 2.0
F(6) – 5
F(6) + 5
ns
5
ns
J(9) + 5
ns
5
ns
2.0
J(9) – 0.2
J(9) + 2.0
J(9) – 5
2.0
GPMC_FCLK(14)
(14)
(1) For single read: A = (CSRdOffTime – CSOnTime) × (TimeParaGranularity + 1) ×
For single write: A = (CSWrOffTime – CSOnTime) × (TimeParaGranularity + 1) × GPMC_FCLK
For burst read: A = (CSRdOffTime – CSOnTime + (n – 1) × PageBurstAccessTime) × (TimeParaGranularity + 1) × GPMC_FCLK(14)
For burst write: A = (CSWrOffTime – CSOnTime + (n – 1) × PageBurstAccessTime) × (TimeParaGranularity + 1) × GPMC_FCLK(14)
with n being the page burst access number
(2) For reading: B = ((ADVRdOffTime – CSOnTime) × (TimeParaGranularity + 1) + 0.5 × (ADVExtraDelay – CSExtraDelay)) ×
GPMC_FCLK(14)
For writing: B = ((ADVWrOffTime – CSOnTime) × (TimeParaGranularity + 1) + 0.5 × (ADVExtraDelay – CSExtraDelay)) ×
GPMC_FCLK(14)
(3) C = ((OEOffTime – CSOnTime) × (TimeParaGranularity + 1) + 0.5 × (OEExtraDelay – CSExtraDelay)) × GPMC_FCLK(14)
(4) D = PageBurstAccessTime × (TimeParaGranularity + 1) × GPMC_FCLK(14)
(5) E = ((WEOnTime – CSOnTime) × (TimeParaGranularity + 1) + 0.5 × (WEExtraDelay – CSExtraDelay)) × GPMC_FCLK(14)
(6) F = ((WEOffTime – CSOnTime) × (TimeParaGranularity + 1) + 0.5 × (WEExtraDelay – CSExtraDelay)) × GPMC_FCLK(14)
(7) G = Cycle2CycleDelay × GPMC_FCLK(14)
(8) I = ((OEOffTime + (n – 1) × PageBurstAccessTime – CSOnTime) × (TimeParaGranularity + 1) + 0.5 × (OEExtraDelay – CSExtraDelay))
× GPMC_FCLK(14)
(9) J = (CSOnTime × (TimeParaGranularity + 1) + 0.5 × CSExtraDelay) × GPMC_FCLK(14)
(10) K = ((ADVOnTime – CSOnTime) × (TimeParaGranularity + 1) + 0.5 × (ADVExtraDelay – CSExtraDelay)) × GPMC_FCLK(14)
(11) L = ((OEOnTime – CSOnTime) × (TimeParaGranularity + 1) + 0.5 × (OEExtraDelay – CSExtraDelay)) × GPMC_FCLK(14)
(12) For single read: N = RdCycleTime × (TimeParaGranularity + 1) × GPMC_FCLK(14)
For single write: N = WrCycleTime × (TimeParaGranularity + 1) × GPMC_FCLK(14)
For burst read: N = (RdCycleTime + (n – 1) × PageBurstAccessTime) × (TimeParaGranularity + 1) × GPMC_FCLK(14)
For burst write: N = (WrCycleTime + (n – 1) × PageBurstAccessTime) × (TimeParaGranularity + 1) × GPMC_FCLK(14)
(13) In gpmc_csn[x], x is equal to 0, 1, 2, 3, 4, or 5.
(14) GPMC_FCLK is general-purpose memory controller internal functional clock period in ns.
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GPMC_FCLK
gpmc_clk
FA5
FA1
gpmc_csn[x]
FA9
gpmc_a[10:1]
Valid Address
FA0
FA10
gpmc_be0n_cle
Valid
FA0
gpmc_be1n
Valid
FA10
FA3
FA12
gpmc_advn_ale
FA4
FA13
gpmc_oen
Data IN 0
gpmc_ad[15:0]
Data IN 0
gpmc_wait[x]
A.
B.
C.
In gpmc_csn[x], x is equal to 0, 1, 2, 3, 4, or 5. In gpmc_wait[x], x is equal to 0 or 1.
FA5 parameter illustrates amount of time required to internally sample input data. It is expressed in number of GPMC
functional clock cycles. From start of read cycle and after FA5 functional clock cycles, input data will be internally
sampled by active functional clock edge. FA5 value must be stored inside AccessTime register bits field.
GPMC_FCLK is an internal clock (GPMC functional clock) not provided externally.
Figure 7-22. GPMC and NOR Flash—Asynchronous Read—Single Word
138
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GPMC_FCLK
gpmc_clk
FA5
FA5
FA1
FA1
gpmc_csn[x]
FA16
FA9
FA9
gpmc_a[10:1]
Address 0
Address 1
FA0
FA10
FA0
FA10
gpmc_be0n_cle
Valid
Valid
FA0
gpmc_be1n
FA0
Valid
FA10
Valid
FA10
FA3
FA3
FA12
FA12
gpmc_advn_ale
FA4
FA13
FA4
FA13
gpmc_oen
gpmc_ad[15:0]
Data Upper
gpmc_wait[x]
A.
B.
C.
In gpmc_csn[x], x is equal to 0, 1, 2, 3, 4, or 5. In gpmc_wait[x], x is equal to 0 or 1.
FA5 parameter illustrates amount of time required to internally sample input data. It is expressed in number of GPMC
functional clock cycles. From start of read cycle and after FA5 functional clock cycles, input data will be internally
sampled by active functional clock edge. FA5 value must be stored inside AccessTime register bits field.
GPMC_FCLK is an internal clock (GPMC functional clock) not provided externally.
Figure 7-23. GPMC and NOR Flash—Asynchronous Read—32-Bit
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GPMC_FCLK
gpmc_clk
FA21
FA20
FA20
FA20
Add1
Add2
Add3
D0
D1
D2
FA1
gpmc_csn[x]
FA9
Add0
gpmc_a[10:1]
Add4
FA0
FA10
gpmc_be0n_cle
FA0
FA10
gpmc_be1n
FA12
gpmc_advn_ale
FA18
FA13
gpmc_oen
gpmc_ad[15:0]
D3
D3
gpmc_wait[x]
A.
B.
C.
D.
In gpmc_csn[x], x is equal to 0, 1, 2, 3, 4, or 5. In gpmc_wait[x], x is equal to 0 or 1.
FA21 parameter illustrates amount of time required to internally sample first input page data. It is expressed in
number of GPMC functional clock cycles. From start of read cycle and after FA21 functional clock cycles, first input
page data will be internally sampled by active functional clock edge. FA21 calculation must be stored inside
AccessTime register bits field.
FA20 parameter illustrates amount of time required to internally sample successive input page data. It is expressed in
number of GPMC functional clock cycles. After each access to input page data, next input page data will be internally
sampled by active functional clock edge after FA20 functional clock cycles. FA20 is also the duration of address
phases for successive input page data (excluding first input page data). FA20 value must be stored in
PageBurstAccessTime register bits field.
GPMC_FCLK is an internal clock (GPMC functional clock) not provided externally.
Figure 7-24. GPMC and NOR Flash—Asynchronous Read—Page Mode 4x16-Bit
140
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gpmc_fclk
gpmc_clk
FA1
gpmc_csn[x]
FA9
gpmc_a[10:1]
Valid Address
FA0
FA10
gpmc_be0n_cle
FA0
FA10
gpmc_be1n
FA3
FA12
gpmc_advn_ale
FA27
FA25
gpmc_wen
FA29
gpmc_ad[15:0]
Data OUT
gpmc_wait[x]
A.
In gpmc_csn[x], x is equal to 0, 1, 2, 3, 4, or 5. In gpmc_wait[x], x is equal to 0 or 1.
Figure 7-25. GPMC and NOR Flash—Asynchronous Write—Single Word
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GPMC_FCLK
gpmc_clk
FA1
FA5
gpmc_csn[x]
FA9
gpmc_a[27:17]
Address (MSB)
FA0
FA10
gpmc_be0n_cle
Valid
FA0
FA10
gpmc_be1n
Valid
FA3
FA12
gpmc_advn_ale
FA4
FA13
gpmc_oen
FA29
gpmc_ad[15:0]
FA37
Data IN
Address (LSB)
Data IN
gpmc_wait[x]
A.
B.
C.
In gpmc_csn[x], x is equal to 0, 1, 2, 3, 4, or 5. In gpmc_wait[x], x is equal to 0 or 1.
FA5 parameter illustrates amount of time required to internally sample input data. It is expressed in number of GPMC
functional clock cycles. From start of read cycle and after FA5 functional clock cycles, input data will be internally
sampled by active functional clock edge. FA5 value must be stored inside AccessTime register bits field.
GPMC_FCLK is an internal clock (GPMC functional clock) not provided externally.
Figure 7-26. GPMC and Multiplexed NOR Flash—Asynchronous Read—Single Word
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gpmc_fclk
gpmc_clk
FA1
gpmc_csn[x]
FA9
gpmc_a[27:17]
Address (MSB)
FA0
FA10
gpmc_be0n_cle
FA0
FA10
gpmc_be1n
FA3
FA12
gpmc_advn_ale
FA27
FA25
gpmc_wen
FA29
gpmc_ad[15:0]
FA28
Valid Address (LSB)
Data OUT
gpmc_wait[x]
A.
In gpmc_csn[x], x is equal to 0, 1, 2, 3, 4, or 5. In gpmc_wait[x], x is equal to 0 or 1.
Figure 7-27. GPMC and Multiplexed NOR Flash—Asynchronous Write—Single Word
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GPMC and NAND Flash—Asynchronous Mode
Table 7-28 and Table 7-29 assume testing over the recommended operating conditions and electrical
characteristic conditions shown in Table 7-27 (see Figure 7-28 through Figure 7-31).
Table 7-27. GPMC and NAND Flash Timing Conditions—Asynchronous Mode
PARAMETER
MIN
TYP
MAX
UNIT
Input Conditions
tR
Input signal rise time
1
5
ns
tF
Input signal fall time
1
5
ns
3
30
pF
Output Condition
CLOAD
Output load capacitance
Table 7-28. GPMC and NAND Flash Internal Timing Requirements—Asynchronous Mode(1)(2)
OPP100
NO.
MIN
OPP50
MAX
MIN
MAX
UNIT
GNFI1
Delay time, output data gpmc_ad[15:0] generation from internal
functional clock GPMC_FCLK(3)
6.5
6.5
ns
GNFI2
Delay time, input data gpmc_ad[15:0] capture from internal functional
clock GPMC_FCLK(3)
4.0
4.0
ns
GNFI3
Delay time, output chip select gpmc_csn[x] generation from internal
functional clock GPMC_FCLK(3)
6.5
6.5
ns
GNFI4
Delay time, output address valid and address latch enable
gpmc_advn_ale generation from internal functional clock
GPMC_FCLK(3)
6.5
6.5
ns
GNFI5
Delay time, output lower-byte enable and command latch enable
gpmc_be0n_cle generation from internal functional clock
GPMC_FCLK(3)
6.5
6.5
ns
GNFI6
Delay time, output enable gpmc_oen generation from internal functional
clock GPMC_FCLK(3)
6.5
6.5
ns
GNFI7
Delay time, output write enable gpmc_wen generation from internal
functional clock GPMC_FCLK(3)
6.5
6.5
ns
GNFI8
Skew, functional clock GPMC_FCLK(3)
100
100
ps
(1) Internal parameters table must be used to calculate data access time stored in the corresponding CS register bit field.
(2) Internal parameters are referred to the GPMC functional internal clock which is not provided externally.
(3) GPMC_FCLK is general-purpose memory controller internal functional clock.
Table 7-29. GPMC and NAND Flash Timing Requirements—Asynchronous Mode
OPP100
NO.
GNF12(1)
MIN
tacc(d)
OPP50
MAX
J(2)
Access time, input data gpmc_ad[15:0]
MIN
MAX
J(2)
UNIT
ns
(1) The GNF12 parameter illustrates the amount of time required to internally sample input data. It is expressed in number of GPMC
functional clock cycles. From start of the read cycle and after GNF12 functional clock cycles, input data is internally sampled by the
active functional clock edge. The GNF12 value must be stored inside AccessTime register bit field.
(2) J = AccessTime × (TimeParaGranularity + 1) × GPMC_FCLK(3)
(3) GPMC_FCLK is general-purpose memory controller internal functional clock period in ns.
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Table 7-30. GPMC and NAND Flash Switching Characteristics—Asynchronous Mode
NO.
OPP100
PARAMETER
MIN
OPP50
MAX
MIN
MAX
UNIT
tR(d)
Rise time, output data gpmc_ad[15:0]
2
2
ns
tF(d)
Fall time, output data gpmc_ad[15:0]
2
2
ns
GNF0
tw(wenV)
Pulse duration, output write enable gpmc_wen
valid
GNF1
td(csnV-wenV)
Delay time, output chip select gpmc_csn[x](13)
valid to output write enable gpmc_wen valid
B(2) – 0.2
B(2) + 2.0
B(2) – 5
B(2) + 5
ns
GNF2
tw(cleH-wenV)
Delay time, output lower-byte enable and
command latch enable gpmc_be0n_cle high to
output write enable gpmc_wen valid
C(3) – 0.2
C(3) + 2.0
C(3) – 5
C(3) + 5
ns
GNF3
tw(wenV-dV)
Delay time, output data gpmc_ad[15:0] valid to
output write enable gpmc_wen valid
D(4) – 0.2
D(4) + 2.0
D(4) – 5
D(4) + 5
ns
GNF4
tw(wenIV-dIV)
Delay time, output write enable gpmc_wen
invalid to output data gpmc_ad[15:0] invalid
E(5) – 0.2
E(5) + 5
E(5) – 5
E(5) + 5
ns
GNF5
tw(wenIV-cleIV)
Delay time, output write enable gpmc_wen
invalid to output lower-byte enable and command
latch enable gpmc_be0n_cle invalid
F(6) – 0.2
F(6) + 2.0
F(6) – 5
F(6) + 5
ns
GNF6
tw(wenIV-csnIV)
Delay time, output write enable gpmc_wen
invalid to output chip select gpmc_csn[x](13)
invalid
G(7) – 0.2
G(7) + 2.0
G(7) – 5
G(7) + 5
ns
GNF7
tw(aleH-wenV)
Delay time, output address valid and address
latch enable gpmc_advn_ale high to output write
enable gpmc_wen valid
C(3) – 0.2
C(3) + 2.0
C(3) – 5
C(3) + 5
ns
GNF8
tw(wenIV-aleIV)
Delay time, output write enable gpmc_wen
invalid to output address valid and address latch
enable gpmc_advn_ale invalid
F(6) – 0.2
F(6) + 2.0
F(6) – 5
F(6) + 5
ns
GNF9
tc(wen)
Cycle time, write
H(8)
ns
I(9) + 5
ns
(10)
ns
GNF10 td(csnV-oenV)
Delay time, output chip select gpmc_csn[x]
valid to output enable gpmc_oen valid
A
(1)
A
(1)
ns
H(8)
(13)
GNF13 tw(oenV)
Pulse duration, output enable gpmc_oen valid
GNF14 tc(oen)
Cycle time, read
GNF15 tw(oenIV-csnIV)
Delay time, output enable gpmc_oen invalid to
output chip select gpmc_csn[x](13) invalid
I(9) – 0.2
I(9) + 2.0
K
I(9) – 5
(10)
K
L(11)
M(12) – 0.2 M(12) + 2.0
L(11)
M(12) – 5
ns
M(12) + 5
ns
(1) A = (WEOffTime – WEOnTime) × (TimeParaGranularity + 1) × GPMC_FCLK(14)
(2) B = ((WEOnTime – CSOnTime) × (TimeParaGranularity + 1) + 0.5 × (WEExtraDelay – CSExtraDelay)) × GPMC_FCLK(14)
(3) C = ((WEOnTime – ADVOnTime) × (TimeParaGranularity + 1) + 0.5 × (WEExtraDelay – ADVExtraDelay)) × GPMC_FCLK(14)
(4) D = (WEOnTime × (TimeParaGranularity + 1) + 0.5 × WEExtraDelay) × GPMC_FCLK(14)
(5) E = ((WrCycleTime – WEOffTime) × (TimeParaGranularity + 1) – 0.5 × WEExtraDelay) × GPMC_FCLK(14)
(6) F = ((ADVWrOffTime – WEOffTime) × (TimeParaGranularity + 1) + 0.5 × (ADVExtraDelay – WEExtraDelay)) × GPMC_FCLK(14)
(7) G = ((CSWrOffTime – WEOffTime) × (TimeParaGranularity + 1) + 0.5 × (CSExtraDelay – WEExtraDelay)) × GPMC_FCLK(14)
(8) H = WrCycleTime × (1 + TimeParaGranularity) × GPMC_FCLK(14)
(9) I = ((OEOnTime – CSOnTime) × (TimeParaGranularity + 1) + 0.5 × (OEExtraDelay – CSExtraDelay)) × GPMC_FCLK(14)
(10) K = (OEOffTime – OEOnTime) × (1 + TimeParaGranularity) × GPMC_FCLK(14)
(11) L = RdCycleTime × (1 + TimeParaGranularity) × GPMC_FCLK(14)
(12) M = ((CSRdOffTime – OEOffTime) × (TimeParaGranularity + 1) + 0.5 × (CSExtraDelay – OEExtraDelay)) × GPMC_FCLK(14)
(13) In gpmc_csn[x], x is equal to 0, 1, 2, 3, 4, or 5.
(14) GPMC_FCLK is general-purpose memory controller internal functional clock period in ns.
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GPMC_FCLK
GNF1
GNF6
GNF2
GNF5
gpmc_csn[x]
gpmc_be0n_cle
gpmc_advn_ale
gpmc_oen
GNF0
gpmc_wen
GNF3
GNF4
gpmc_ad[15:0]
(1)
Command
In gpmc_csn[x], x is equal to 0, 1, 2, 3, 4, or 5.
Figure 7-28. GPMC and NAND Flash—Command Latch Cycle
GPMC_FCLK
GNF1
GNF6
GNF7
GNF8
gpmc_csn[x]
gpmc_be0n_cle
gpmc_advn_ale
gpmc_oen
GNF9
GNF0
gpmc_wen
GNF3
gpmc_ad[15:0]
(1)
GNF4
Address
In gpmc_csn[x], x is equal to 0, 1, 2, 3, 4, or 5.
Figure 7-29. GPMC and NAND Flash—Address Latch Cycle
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GPMC_FCLK
GNF12
GNF10
GNF15
gpmc_csn[x]
gpmc_be0n_cle
gpmc_advn_ale
GNF14
GNF13
gpmc_oen
gpmc_ad[15:0]
DATA
gpmc_wait[x]
(1)
(2)
(3)
GNF12 parameter illustrates amount of time required to internally sample input data. It is expressed in number of GPMC functional
clock cycles. From start of read cycle and after GNF12 functional clock cycles, input data will be internally sampled by active
functional clock edge. GNF12 value must be stored inside AccessTime register bits field.
GPMC_FCLK is an internal clock (GPMC functional clock) not provided externally.
In gpmc_csn[x], x is equal to 0, 1, 2, 3, 4, or 5. In gpmc_wait[x], x is equal to 0 or 1.
Figure 7-30. GPMC and NAND Flash—Data Read Cycle
GPMC_FCLK
GNF1
GNF6
gpmc_csn[x]
gpmc_be0n_cle
gpmc_advn_ale
gpmc_oen
GNF9
GNF0
gpmc_wen
GNF3
gpmc_ad[15:0]
(1)
GNF4
DATA
In gpmc_csn[x], x is equal to 0, 1, 2, 3, 4, or 5.
Figure 7-31. GPMC and NAND Flash—Data Write Cycle
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mDDR(LPDDR), DDR2, DDR3, DDR3L Memory Interface
The device has a dedicated interface to mDDR(LPDDR), DDR2, DDR3, and DDR3L SDRAM. It supports
JEDEC standard compliant mDDR(LPDDR), DDR2, DDR3, and DDR3L SDRAM devices with a 16-bit
data path to external SDRAM memory.
For more details on the mDDR(LPDDR), DDR2, DDR3, and DDR3L memory interface, see the EMIF
section of the AM335x and AMIC110 Sitara Processors Technical Reference Manual.
7.7.2.1
mDDR (LPDDR) Routing Guidelines
It is common to find industry references to mobile double data rate (mDDR) when discussing JEDEC
defined low-power double-data rate (LPDDR) memory devices. The following guidelines use LPDDR when
referencing JEDEC defined low-power double-data rate memory devices.
7.7.2.1.1 Board Designs
TI only supports board designs that follow the guidelines outlined in this document. The switching
characteristics and the timing diagram for the LPDDR memory interface are shown in Table 7-31 and
Figure 7-32.
Table 7-31. Switching Characteristics for LPDDR Memory Interface
NO.
1
PARAMETER
tc(DDR_CK)
tc(DDR_CKn)
Cycle time, DDR_CK and DDR_CKn
MIN
MAX
5
(1)
UNIT
ns
(1) The JEDEC JESD209B specification only defines the maximum clock period for LPDDR333 and faster speed bin LPDDR memory
devices. To determine the maximum clock period, see the respective LPDDR memory data sheet.
1
DDR_CK
DDR_CKn
Figure 7-32. LPDDR Memory Interface Clock Timing
7.7.2.1.2 LPDDR Interface
This section provides the timing specification for the LPDDR interface as a PCB design and manufacturing
specification. The design rules constrain PCB trace length, PCB trace skew, signal integrity, cross-talk,
and signal timing. These rules, when followed, result in a reliable LPDDR memory system without the
need for a complex timing closure process. For more information regarding the guidelines for using this
LPDDR specification, see Understanding TI’s PCB Routing Rule-Based DDR Timing Specification. This
application report provides generic guidelines and approach. All the specifications provided in the data
manual take precedence over the generic guidelines and must be adhered to for a reliable LPDDR
interface operation.
7.7.2.1.2.1 LPDDR Interface Schematic
Figure 7-33 shows the schematic connections for 16-bit interface on the AM335x device using one x16
LPDDR device. The AM335x LPDDR memory interface only supports 16-bit-wide mode of operation. The
AM335x device can only source one load connected to the DQS[x] and DQ[x] net class signals and one
load connected to the CK and ADDR_CTRL net class signals. For more information related to net classes,
see Section 7.7.2.1.2.8.
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16-Bit LPDDR
Device
AM335x
DDR_D0
DQ0
DDR_D7
DDR_DQM0
DDR_DQS0
DDR_DQSn0
DDR_D8
DQ7
LDM
LDQS
NC
(A)
DQ8
DDR_D15
DDR_DQM1
DDR_DQS1
DDR_DQSn1
NC
DDR_ODT
NC
DDR_BA0
DDR_BA1
DDR_BA2
T
T
NC
BA0
BA1
DDR_A0
T
A0
DDR_A15
DDR_CSn0
T
T
A15
CS
DDR_CASn
DDR_RASn
DDR_WEn
DDR_CKE
DDR_CK
T
T
T
T
T
T
CAS
DDR_CKn
DQ15
UDM
UDQS
(A)
RAS
WE
CKE
CK
CK
DDR_VREF
NC
DDR_RESETn
NC
DDR_VTP
49.9 Ω
(±1%, 20 mW)
A.
B.
Enable internal weak pulldown on these pins. For details, see the EMIF section of the AM335x and AMIC110 Sitara
Processors Technical Reference Manual.
For all the termination requirements, see Section 7.7.2.1.2.9.
Figure 7-33. 16-Bit LPDDR Interface Using One 16-Bit LPDDR Device
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7.7.2.1.2.2 Compatible JEDEC LPDDR Devices
Table 7-32 shows the parameters of the JEDEC LPDDR devices that are compatible with this interface.
Generally, the LPDDR interface is compatible with x16 LPDDR400 speed grade LPDDR devices.
Table 7-32. Compatible JEDEC LPDDR Devices (Per Interface)(1)
NO.
PARAMETER
1
JEDEC LPDDR device speed grade
2
JEDEC LPDDR device bit width
3
JEDEC LPDDR device count
4
JEDEC LPDDR device terminal count
MIN
MAX
UNIT
LPDDR400
x16
x16
Bits
1
Devices
60
Terminals
(1) If the LPDDR interface is operated with a clock frequency less than 200 MHz, lower-speed grade LPDDR devices may be used if the
minimum clock period specified for the LPDDR device is less than or equal to the minimum clock period selected for the AM335x
LPDDR interface.
7.7.2.1.2.3 PCB Stackup
The minimum stackup required for routing the AM335x device is a 4-layer stackup as shown in Table 733. Additional layers may be added to the PCB stackup to accommodate other circuitry, enhance signal
integrity and electromagnetic interference performance, or to reduce the size of the PCB footprint.
Table 7-33. Minimum PCB Stackup(1)
LAYER
TYPE
DESCRIPTION
1
Signal
Top signal routing
2
Plane
Ground
3
Plane
Split Power Plane
4
Signal
Bottom signal routing
(1) All signals that have critical signal integrity requirements should be routed first on layer 1. It may not be possible to route all of these
signals on layer 1, therefore requiring routing of some signals on layer 4. When this is done, the signal routes on layer 4 must not cross
splits in the power plane.
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Complete stackup specifications are provided in Table 7-34.
Table 7-34. PCB Stackup Specifications(1)
NO.
PARAMETER
MIN
TYP
1
PCB routing and plane layers
4
2
Signal routing layers
2
3
Full ground layers under LPDDR routing region
1
4
Number of ground plane cuts allowed within LPDDR routing region
5
Full VDDS_DDR power reference layers under LPDDR routing region
6
Number of layers between LPDDR routing layer and reference ground
plane
7
PCB routing feature size
4
8
PCB trace width, w
4
9
PCB BGA escape via pad size(2)
18
(2)
MAX
UNIT
0
1
0
mils
mils
20
mils
10
PCB BGA escape via hole size
10
11
Single-ended impedance, Zo(3)
50
75
Ω
12
Impedance control(4)(5)
Zo
Zo+5
Ω
Zo-5
mils
(1) For the LPDDR device BGA pad size, see the LPDDR device manufacturer documentation.
(2) A 20-10 via may be used if enough power routing resources are available. An 18-10 via allows for more flexible power routing to the
AM335x device.
(3) Zo is the nominal singled-ended impedance selected for the PCB.
(4) This parameter specifies the AC characteristic impedance tolerance for each segment of a PCB signal trace relative to the chosen Zo
defined by the single-ended impedance parameter.
(5) Tighter impedance control is required to ensure flight time skew is minimal.
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7.7.2.1.2.4 Placement
Figure 7-34 shows the required placement for the LPDDR devices. The dimensions for this figure are
defined in Table 7-35. The placement does not restrict the side of the PCB on which the devices are
mounted. The ultimate purpose of the placement is to limit the maximum trace lengths and allow for
proper routing space. For single-memory LPDDR systems, the second LPDDR device is omitted from the
placement.
X
Y
OFFSET
LPDDR
Device
Y
Y
OFFSET
LPDDR
Interface
A1
AM335x
A1
Recommended LPDDR
Device Orientation
Figure 7-34. AM335x Device and LPDDR Device Placement
Table 7-35. Placement Specifications(1)
NO.
MAX
UNIT
1
X(2)(3)
PARAMETER
MIN
1750
mils
2
Y(2)(3)
1280
mils
650
mils
(2)(3)(4)
3
Y Offset
4
Clearance from non-LPDDR signal to LPDDR keepout region(5)(6)
4
w
(1) LPDDR keepout region to encompass entire LPDDR routing area.
(2) For dimension definitions, see Figure 7-34.
(3) Measurements from center of the AM335x device to center of LPDDR device.
(4) For single-memory systems, TI recommends that Y offset be as small as possible.
(5) w is defined as the signal trace width.
(6) Non-LPDDR signals allowed within LPDDR keepout region provided they are separated from LPDDR routing layers by a ground plane.
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7.7.2.1.2.5 LPDDR Keepout Region
The region of the PCB used for the LPDDR circuitry must be isolated from other signals. The LPDDR
keepout region is defined for this purpose and is shown in Figure 7-35. This region should encompass all
LPDDR circuitry and the region size varies with component placement and LPDDR routing. Additional
clearances required for the keepout region are shown in Table 7-35. Non-LPDDR signals must not be
routed on the same signal layer as LPDDR signals within the LPDDR keepout region. Non-LPDDR signals
may be routed in the region provided they are routed on layers separated from LPDDR signal layers by a
ground layer. No breaks should be allowed in the reference ground or VDDS_DDR power plane in this
region. In addition, the VDDS_DDR power plane should cover the entire keepout region.
LPDDR
Device
LPDDR
Interface
A1
A1
Figure 7-35. LPDDR Keepout Region
7.7.2.1.2.6 Bulk Bypass Capacitors
Bulk bypass capacitors are required for moderate speed bypassing of the LPDDR and other circuitry.
Table 7-36 contains the minimum numbers and capacitance required for the bulk bypass capacitors. Note
that this table only covers the bypass needs of the AM335x LPDDR interface and LPDDR devices.
Additional bulk bypass capacitance may be needed for other circuitry.
Table 7-36. Bulk Bypass Capacitors(1)
NO.
PARAMETER
1
AM335x VDDS_DDR bulk bypass capacitor count
2
AM335x VDDS_DDR bulk bypass total capacitance
3
LPDDR#1 bulk bypass capacitor count
4
LPDDR#1 bulk bypass total capacitance
5
(2)
LPDDR#2 bulk bypass capacitor count
6
LPDDR#2 bulk bypass total capacitance(2)
MIN
1
MAX
UNIT
Devices
10
μF
1
Devices
10
μF
1
Devices
10
μF
(1) These devices should be placed near the device they are bypassing, but preference should be given to the placement of the high-speed
(HS) bypass capacitors.
(2) Only used when two LPDDR devices are used.
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7.7.2.1.2.7 High-Speed Bypass Capacitors
High-speed (HS) bypass capacitors are critical for proper LPDDR interface operation. It is particularly
important to minimize the parasitic series inductance of the HS bypass capacitors, the AM335x device
LPDDR power, and the AM335x device LPDDR ground connections. Table 7-37 contains the specification
for the HS bypass capacitors as well as for the power connections on the PCB.
Table 7-37. High-Speed Bypass Capacitors
NO.
PARAMETER
MIN
1
HS bypass capacitor package size(1)
2
Distance from HS bypass capacitor to device being bypassed
3
Number of connection vias for each HS bypass capacitor(2)
4
Trace length from bypass capacitor contact to connection via
5
Number of connection vias for each AM335x VDDS_DDR and VSS terminal
6
Trace length from AM335x VDDS_DDR and VSS terminal to connection via
7
Number of connection vias for each LPDDR device power and ground terminal
8
Trace length from LPDDR device power and ground terminal to connection via
9
AM335x VDDS_DDR HS bypass capacitor count(3)
10
10
AM335x VDDS_DDR HS bypass capacitor total capacitance
0.6
11
LPDDR device HS bypass capacitor count(3)(4)
12
LPDDR device HS bypass capacitor total capacitance(4)
MAX
UNIT
0402
10 mils
250
2
mils
Vias
30
1
mils
Vias
35
1
mils
Vias
35
8
0.4
mils
Devices
μF
Devices
μF
(1) LxW, 10-mil units; for example, a 0402 is a 40x20-mil surface-mount capacitor.
(2) An additional HS bypass capacitor can share the connection vias only if it is mounted on the opposite side of the board.
(3) These devices should be placed as close as possible to the device being bypassed.
(4) Per LPDDR device.
7.7.2.1.2.8 Net Classes
Table 7-38 lists the clock net classes for the LPDDR interface. Table 7-39 lists the signal net classes, and
associated clock net classes, for the signals in the LPDDR interface. These net classes are used for the
termination and routing rules that follow.
Table 7-38. Clock Net Class Definitions
CLOCK NET CLASS
CK
AM335x PIN NAMES
DDR_CK and DDR_CKn
DQS0
DDR_DQS0
DQS1
DDR_DQS1
Table 7-39. Signal Net Class Definitions
154
SIGNAL NET CLASS
ASSOCIATED CLOCK
NET CLASS
ADDR_CTRL
CK
DQ0
DQS0
DDR_D[7:0], DDR_DQM0
DQ1
DQS1
DDR_D[15:8], DDR_DQM1
Peripheral Information and Timings
AM335x PIN NAMES
DDR_BA[1:0], DDR_A[15:0], DDR_CSn0, DDR_CASn, DDR_RASn,
DDR_WEn, DDR_CKE
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7.7.2.1.2.9 LPDDR Signal Termination
There is no specific need for adding terminations on the LPDDR interface. However, system designers
may evaluate the need for serial terminators for EMI and overshoot reduction. Placement of serial
terminations for DQS[x] and DQ[x] net class signals should be determined based on PCB analysis.
Placement of serial terminations for ADDR_CTRL net class signals should be close to the AM335x device.
Table 7-40 shows the specifications for the serial terminators in such cases.
Table 7-40. LPDDR Signal Terminations
NO.
MIN
TYP
MAX
UNIT
1
CK net class(1)
PARAMETER
0
22
Zo(2)
Ω
2
ADDR_CTRL net class(1)(3)(4)
0
22
Zo(2)
Ω
3
DQS0, DQS1, DQ0, and DQ1 net classes
0
22
Zo(2)
Ω
(1) Only series termination is permitted.
(2) Zo is the LPDDR PCB trace characteristic impedance.
(3) Series termination values larger than typical only recommended to address EMI issues.
(4) Series termination values should be uniform across net class.
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7.7.2.1.3 LPDDR CK and ADDR_CTRL Routing
Figure 7-36 shows the topology of the routing for the CK and ADDR_CTRL net classes. The length of
signal path AB and AC should be minimized with emphasis to minimize lengths C and D such that length
A is the majority of the total length of signal path AB and AC.
C
A
LPDDR
Interface
B
A1
AM335x
A1
Figure 7-36. CK and ADDR_CTRL Routing and Topology
Table 7-41. CK and ADDR_CTRL Routing Specification(1)(2)
NO.
PARAMETER
MIN
TYP
MAX
UNIT
1
Center-to-center CK spacing
2w
2
CK differential pair skew length mismatch(2)(3)
25
mils
3
CK B-to-CK C skew length mismatch
25
mils
4
Center-to-center CK to other LPDDR trace spacing(4)
5
CK and ADDR_CTRL nominal trace length(5)
CACLM+50
mils
6
ADDR_CTRL-to-CK skew length mismatch
100
mils
7
ADDR_CTRL-to-ADDR_CTRL skew length mismatch
100
mils
8
Center-to-center ADDR_CTRL to other LPDDR trace spacing(4)
4w
9
Center-to-center ADDR_CTRL to other ADDR_CTRL trace spacing(4)
3w
10
ADDR_CTRL A-to-B and ADDR_CTRL A-to-C skew length mismatch(2)
100
mils
11
ADDR_CTRL B-to-C skew length mismatch
100
mils
4w
CACLM-50
CACLM
(1) CK represents the clock net class, and ADDR_CTRL represents the address and control signal net class.
(2) Series terminator, if used, should be located closest to the AM335x device.
(3) Differential impedance should be Zo x 2, where Zo is the single-ended impedance defined in Table 7-34.
(4) Center-to-center spacing is allowed to fall to minimum (w) for up to 500 mils of routed length to accommodate BGA escape and routing
congestion.
(5) CACLM is the longest Manhattan distance of the CK and ADDR_CTRL net classes.
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A1
DQ[0]
DQ[1]
LPDDR
Interface
Figure 7-37 shows the topology and routing for the DQS[x] and DQ[x] net classes; the routes are point to
point. Skew matching across bytes is not needed nor recommended.
AM335x
Figure 7-37. DQS[x] and DQ[x] Routing and Topology
Table 7-42. DQS[x] and DQ[x] Routing Specification(1)
NO.
PARAMETER
1
Center-to-center DQS[x] spacing
2
Center-to-center DDR_DQS[x] to other LPDDR trace spacing(2)
3
DQS[x] and DQ[x] nominal trace length(3)
4
DQ[x]-to-DQS[x] skew length mismatch(3)
MIN
TYP
MAX
UNIT
2w
4w
DQLM-50
DQLM
DQLM+50
mils
100
mils
100
mils
(3)
5
DQ[x]-to-DQ[x] skew length mismatch
6
Center-to-center DQ[x] to other LPDDR trace spacing(2)(4)
4w
7
Center-to-center DQ[x] to other DQ[x] trace spacing(2)(5)
3w
(1) DQS[x] represents the DQS0 and DQS1 clock net classes, and DQ[x] represents the DQ0 and DQ1 signal net classes.
(2) Center-to-center spacing is allowed to fall to minimum (w) for up to 500 mils of routed length to accommodate BGA escape and routing
congestion.
(3) There is no requirement for skew matching between data bytes; that is, from net classes DQS0 and DQ0 to net classes DQS1 and DQ1.
(4) Signals from one DQ net class should be considered other LPDDR traces to another DQ net class.
(5) DQLM is the longest Manhattan distance of each of the DQS[x] and DQ[x] net classes.
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7.7.2.2
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DDR2 Routing Guidelines
7.7.2.2.1 Board Designs
TI only supports board designs that follow the guidelines outlined in this document. Table 7-43 and
Figure 7-38 show the switching characteristics and timing diagram for the DDR2 memory interface.
Table 7-43. Switching Characteristics for DDR2 Memory Interface
NO.
1
PARAMETER
tc(DDR_CK)
tc(DDR_CKn)
Cycle time, DDR_CK and DDR_CKn
MIN
MAX
3.75
8(1)
UNIT
ns
(1) The JEDEC JESD79-2F specification defines the maximum clock period of 8 ns for all standard-speed bin DDR2 memory devices.
Therefore, all standard-speed bin DDR2 memory devices are required to operate at 125 MHz.
1
DDR_CK
DDR_CKn
Figure 7-38. DDR2 Memory Interface Clock Timing
7.7.2.2.2 DDR2 Interface
This section provides the timing specification for the DDR2 interface as a PCB design and manufacturing
specification. The design rules constrain PCB trace length, PCB trace skew, signal integrity, cross-talk,
and signal timing. These rules, when followed, result in a reliable DDR2 memory system without the need
for a complex timing closure process. For more information regarding the guidelines for using this DDR2
specification, see Understanding TI’s PCB Routing Rule-Based DDR Timing Specification. This application
report provides generic guidelines and approach. All the specifications provided in the data manual take
precedence over the generic guidelines and must be adhered to for a reliable DDR2 interface operation.
7.7.2.2.2.1 DDR2 Interface Schematic
Figure 7-39 shows the schematic connections for 16-bit interface on the AM335x device using one x16
DDR2 device and Figure 7-40 shows the schematic connections for 16-bit interface on the AM335x device
using two x8 DDR2 devices. The AM335x DDR2 memory interface only supports 16-bit-wide mode of
operation. The AM335x device can only source one load connected to the DQS[x] and DQ[x] net class
signals and two loads connected to the CK and ADDR_CTRL net class signals. For more information
related to net classes, see Section 7.7.2.2.2.8.
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16-Bit DDR2
Device
AM335x
DDR_D0
DQ0
DDR_D7
DDR_DQM0
DDR_DQS0
DQ7
LDM
LDQS
DDR_DQSn0
DDR_D8
LDQS
DQ8
DDR_D15
DDR_DQM1
DDR_DQS1
DDR_DQSn1
DQ15
UDM
UDQS
UDQS
DDR_ODT
T
ODT
DDR_BA0
DDR_BA1
DDR_BA2
T
T
T
BA0
BA1
BA2
DDR_A0
T
A0
DDR_A15
DDR_CSn0
T
T
A15
CS
DDR_CASn
DDR_RASn
DDR_WEn
DDR_CKE
DDR_CK
T
T
T
T
T
T
CAS
DDR_CKn
RAS
WE
CKE
CK
CK
DDR_VREF
0.1 µF
(B)
0.1 µF
(A)
1 kΩ 1%
DDR_VREF
VREF
0.1 µF
DDR_RESETn
VDDS_DDR
(B)
0.1 µF
1 kΩ 1%
NC
DDR_VTP
49.9 Ω
(±1%, 20 mW)
A.
B.
C.
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VDDS_DDR is the power supply for the DDR2 memories and the AM335x DDR2 interface.
One of these capacitors can be eliminated if the divider and its capacitors are placed near a DDR_VREF pin.
For all the termination requirements, see Section 7.7.2.2.2.9.
Figure 7-39. 16-Bit DDR2 Interface Using One 16-Bit DDR2 Device
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8-Bit DDR2
Devices
AM335x
DDR_D0
DQ0
DDR_D7
DDR_DQM0
DDR_DQS0
DQ7
DM
DQS
DDR_DQSn0
DQS
DDR_D8
DQ0
DDR_D15
DDR_DQM1
DDR_DQS1
DDR_DQSn1
DQ7
DM
DQS
DQS
DDR_ODT
T
ODT
ODT
DDR_BA0
DDR_BA1
DDR_BA2
T
T
T
BA0
BA1
BA2
BA0
BA1
BA2
DDR_A0
T
A0
A0
DDR_A15
DDR_CSn0
T
T
A15
CS
A15
CS
DDR_CASn
DDR_RASn
DDR_WEn
DDR_CKE
DDR_CK
T
T
T
T
T
T
CAS
CAS
RAS
WE
CKE
CK
CK
RAS
WE
CKE
CK
CK
DDR_CKn
DDR_VREF
VREF
(B)
0.1 µF
DDR_RESETn
(B)
0.1 µF
VDDS_DDR
0.1 µF
(A)
1 kΩ 1%
DDR_VREF
VREF
(B)
0.1 µF
0.1 µF
1 kΩ 1%
NC
DDR_VTP
49.9 Ω
(±1%, 20 mW)
A.
B.
C.
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VDDS_DDR is the power supply for the DDR2 memories and the AM335x DDR2 interface.
One of these capacitors can be eliminated if the divider and its capacitors are placed near a DDR_VREF pin.
For all the termination requirements, see Section 7.7.2.2.2.9.
Figure 7-40. 16-Bit DDR2 Interface Using Two 8-Bit DDR2 Devices
160
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7.7.2.2.2.2 Compatible JEDEC DDR2 Devices
Table 7-44 shows the parameters of the JEDEC DDR2 devices that are compatible with this interface.
Generally, the DDR2 interface is compatible with x16 or x8 DDR2-533 speed grade DDR2 devices.
Table 7-44. Compatible JEDEC DDR2 Devices (Per Interface)(1)
NO.
PARAMETER
1
JEDEC DDR2 device speed grade(2)
2
JEDEC DDR2 device bit width
3
JEDEC DDR2 device count
4
JEDEC DDR2 device terminal count(3)
MIN
MAX
UNIT
DDR2-533
x8
x16
1
2
devices
bits
60
84
terminals
(1) If the DDR2 interface is operated with a clock frequency less than 266 MHz, lower-speed grade DDR2 devices may be used if the
minimum clock period specified for the DDR2 device is less than or equal to the minimum clock period selected for the AM335x DDR2
interface.
(2) Higher DDR2 speed grades are supported due to inherent JEDEC DDR2 backward compatibility.
(3) 92-terminal devices are also supported for legacy reasons. New designs will migrate to 84-terminal DDR2 devices. Electrically, the 92and 84-terminal DDR2 devices are the same.
7.7.2.2.2.3 PCB Stackup
The minimum stackup required for routing the AM335x device is a 4-layer stackup as shown in Table 745. Additional layers may be added to the PCB stackup to accommodate other circuitry, enhance signal
integrity and electromagnetic interference performance, or to reduce the size of the PCB footprint.
Table 7-45. Minimum PCB Stackup(1)
LAYER
TYPE
DESCRIPTION
1
Signal
Top signal routing
2
Plane
Ground
3
Plane
Split power plane
4
Signal
Bottom signal routing
(1) All signals that have critical signal integrity requirements should be routed first on layer 1. It may not be possible to route all of these
signals on layer 1, therefore requiring routing of some signals on layer 4. When this is done, the signal routes on layer 4 must not cross
splits in the power plane.
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Complete stackup specifications are provided in Table 7-46.
Table 7-46. PCB Stackup Specifications(1)
NO.
PARAMETER
MIN
TYP
1
PCB routing and plane layers
4
2
Signal routing layers
2
3
Full ground layers under DDR2 routing region
1
4
Number of ground plane cuts allowed within DDR2 routing region
5
Full VDDS_DDR power reference layers under DDR2 routing region
6
Number of layers between DDR2 routing layer and reference ground plane
7
PCB routing feature size
4
8
PCB trace width, w
4
9
PCB BGA escape via pad size(2)
18
(2)
MAX
UNIT
0
1
0
mils
mils
20
mils
10
PCB BGA escape via hole size
10
11
Single-ended impedance, Zo(3)
50
75
Ω
12
Impedance control(4)(5)
Zo
Zo+5
Ω
Zo-5
mils
(1) For the DDR2 device BGA pad size, see the DDR2 device manufacturer documentation.
(2) A 20-10 via may be used if enough power routing resources are available. An 18-10 via allows for more flexible power routing to the
AM335x device.
(3) Zo is the nominal singled-ended impedance selected for the PCB.
(4) This parameter specifies the AC characteristic impedance tolerance for each segment of a PCB signal trace relative to the chosen Zo
defined by the single-ended impedance parameter.
(5) Tighter impedance control is required to ensure flight time skew is minimal.
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7.7.2.2.2.4 Placement
Figure 7-41 shows the required placement for the DDR2 devices. The dimensions for this figure are
defined in Table 7-47. The placement does not restrict the side of the PCB on which the devices are
mounted. The ultimate purpose of the placement is to limit the maximum trace lengths and allow for
proper routing space. For single-memory DDR2 systems, the second DDR2 device is omitted from the
placement.
X
Y
OFFSET
DDR2
Device
Y
Y
OFFSET
DDR2
Interface
A1
AM335x
A1
Recommended DDR2
Device Orientation
Figure 7-41. AM335x Device and DDR2 Device Placement
Table 7-47. Placement Specifications(1)
NO.
MAX
UNIT
1
X(2)(3)
PARAMETER
MIN
1750
mils
2
Y(2)(3)
1280
mils
650
mils
(2)(3)(4)
3
Y Offset
4
Clearance from non-DDR2 signal to DDR2 keepout region(5)(6)
4
w
(1) DDR2 keepout region to encompass entire DDR2 routing area.
(2) For dimension definitions, see Figure 7-41.
(3) Measurements from center of the AM335x device to center of the DDR2 device.
(4) For single-memory systems, it is recommended that Y offset be as small as possible.
(5) w is defined as the signal trace width.
(6) Non-DDR2 signals allowed within DDR2 keepout region provided they are separated from DDR2 routing layers by a ground plane.
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7.7.2.2.2.5 DDR2 Keepout Region
The region of the PCB used for the DDR2 circuitry must be isolated from other signals. The DDR2
keepout region is defined for this purpose and is shown in Figure 7-42. This region should encompass all
DDR2 circuitry and the region size varies with component placement and DDR2 routing. Additional
clearances required for the keepout region are shown in Table 7-47. Non-DDR2 signals must not be
routed on the same signal layer as DDR2 signals within the DDR2 keepout region. Non-DDR2 signals
may be routed in the region provided they are routed on layers separated from DDR2 signal layers by a
ground layer. No breaks should be allowed in the reference ground or VDDS_DDR power plane in this
region. In addition, the VDDS_DDR power plane should cover the entire keepout region.
DDR2
Device
DDR2
Interface
A1
A1
Figure 7-42. DDR2 Keepout Region
7.7.2.2.2.6 Bulk Bypass Capacitors
Bulk bypass capacitors are required for moderate speed bypassing of the DDR2 and other circuitry.
Table 7-48 contains the minimum numbers and capacitance required for the bulk bypass capacitors. Note
that this table only covers the bypass needs of the AM335x DDR2 interface and DDR2 devices. Additional
bulk bypass capacitance may be needed for other circuitry.
Table 7-48. Bulk Bypass Capacitors(1)
NO.
PARAMETER
1
AM335x VDDS_DDR bulk bypass capacitor count
2
AM335x VDDS_DDR bulk bypass total capacitance
3
DDR2 number 1 bulk bypass capacitor count
4
DDR2 number 1 bulk bypass total capacitance
5
(2)
DDR2 number 2 bulk bypass capacitor count
6
DDR2 number 2 bulk bypass total capacitance(2)
MIN
1
MAX
UNIT
devices
10
μF
1
devices
10
μF
1
devices
10
μF
(1) These devices should be placed near the device they are bypassing, but preference should be given to the placement of the high-speed
(HS) bypass capacitors.
(2) Only used when two DDR2 devices are used.
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7.7.2.2.2.7 High-Speed (HS) Bypass Capacitors
HS bypass capacitors are critical for proper DDR2 interface operation. It is particularly important to
minimize the parasitic series inductance of the HS bypass capacitors, the AM335x device DDR2 power,
and the AM335x device DDR2 ground connections. Table 7-49 contains the specification for the HS
bypass capacitors as well as for the power connections on the PCB.
Table 7-49. HS Bypass Capacitors
NO.
PARAMETER
MIN
1
HS bypass capacitor package size(1)
2
Distance from HS bypass capacitor to device being bypassed
3
Number of connection vias for each HS bypass capacitor(2)
4
Trace length from bypass capacitor contact to connection via
5
Number of connection vias for each AM335x VDDS_DDR and VSS terminal
6
Trace length from AM335x VDDS_DDR and VSS terminal to connection via
7
Number of connection vias for each DDR2 device power and ground terminal
8
Trace length from DDR2 device power and ground terminal to connection via
9
AM335x VDDS_DDR HS bypass capacitor count(3)
10
10
AM335x VDDS_DDR HS bypass capacitor total capacitance
0.6
11
DDR2 device HS bypass capacitor count(3)(4)
12
DDR2 device HS bypass capacitor total capacitance(4)
MAX
UNIT
0402
10 mils
250
mils
2
vias
30
mils
1
vias
35
mils
1
vias
35
8
mils
devices
μF
devices
0.4
μF
(1) LxW, 10-mil units; for example, a 0402 is a 40x20-mil surface-mount capacitor.
(2) An additional HS bypass capacitor can share the connection vias only if it is mounted on the opposite side of the board.
(3) These devices should be placed as close as possible to the device being bypassed.
(4) Per DDR2 device.
7.7.2.2.2.8 Net Classes
Table 7-50 lists the clock net classes for the DDR2 interface. Table 7-51 lists the signal net classes, and
associated clock net classes, for the signals in the DDR2 interface. These net classes are used for the
termination and routing rules that follow.
Table 7-50. Clock Net Class Definitions
CLOCK NET CLASS
CK
AM335x PIN NAMES
DDR_CK and DDR_CKn
DQS0
DDR_DQS0 and DDR_DQSn0
DQS1
DDR_DQS1 and DDR_DQSn1
Table 7-51. Signal Net Class Definitions
SIGNAL NET CLASS
ASSOCIATED CLOCK
NET CLASS
ADDR_CTRL
CK
DQ0
DQS0
DDR_D[7:0], DDR_DQM0
DQ1
DQS1
DDR_D[15:8], DDR_DQM1
AM335x PIN NAMES
DDR_BA[2:0], DDR_A[15:0], DDR_CSn0, DDR_CASn, DDR_RASn,
DDR_WEn, DDR_CKE, DDR_ODT
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7.7.2.2.2.9 DDR2 Signal Termination
Signal terminations are required on the CK and ADDR_CTRL net class signals. Serial terminations should
be used on the CK and ADDR_CTRL lines and is the preferred termination scheme. On-device
terminations (ODTs) are required on the DQS[x] and DQ[x] net class signals. They should be enabled to
ensure signal integrity. Table 7-52 shows the specifications for the series terminators. Placement of serial
terminations for ADDR_CTRL net class signals should be close to the AM335x device.
Table 7-52. DDR2 Signal Terminations
NO.
PARAMETER
MIN
1
CK net class(1)
0
2
ADDR_CTRL net class(1)(2)(3)
0
3
DQS0, DQS1, DQ0, and DQ1 net classes(5)
TYP
22
N/A
MAX
UNIT
10
Ω
Zo(4)
Ω
N/A
Ω
(1) Only series termination is permitted.
(2) Series termination values larger than typical only recommended to address EMI issues.
(3) Series termination values should be uniform across net class.
(4) Zo is the DDR2 PCB trace characteristic impedance.
(5) No external termination resistors are allowed and ODT must be used for these net classes.
If the DDR2 interface is operated at a lower frequency (<200-MHz clock rate), on-device terminations are
not specifically required for the DQS[x] and DQ[x] net class signals and serial terminations for the CK and
ADDR_CTRL net class signals are not mandatory. System designers may evaluate the need for serial
terminators for EMI and overshoot reduction. Placement of serial terminations for DQS[x] and DQ[x] net
class signals should be determined based on PCB analysis. Placement of serial terminations for
ADDR_CTRL net class signals should be close to the AM335x device. Table 7-53 shows the
specifications for the serial terminators in such cases.
Table 7-53. Lower-Frequency DDR2 Signal Terminations
NO.
PARAMETER
MIN
TYP
MAX
UNIT
1
CK net class(1)
0
22
Zo(2)
Ω
2
ADDR_CTRL net class(1)(3)(4)
0
22
Zo(2)
Ω
22
(2)
Ω
3
DQS0, DQS1, DQ0, and DQ1 net classes
0
Zo
(1) Only series termination is permitted.
(2) Zo is the DDR2 PCB trace characteristic impedance.
(3) Series termination values larger than typical only recommended to address EMI issues.
(4) Series termination values should be uniform across net class.
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7.7.2.2.2.10 DDR_VREF Routing
DDR_VREF is used as a reference by the input buffers of the DDR2 memories as well as the AM335x
device. DDR_VREF is intended to be half the DDR2 power supply voltage and should be created using a
resistive divider as shown in Figure 7-39 and Figure 7-40. TI does not recommend other methods of
creating DDR_VREF. Figure 7-43 shows the layout guidelines for DDR_VREF.
DDR_VREF Bypass Capacitor
DDR2 Device
A1
DDR_VREF Nominal Minimum
Trace Width is 20 Mils
AM335x
A1
Neck down to minimum in BGA escape
regions is acceptable. Narrowing to
accommodate via congestion for short
distances is also acceptable. Best
performance is obtained if the width
of DDR_VREF is maximized.
Figure 7-43. DDR_VREF Routing and Topology
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7.7.2.2.3 DDR2 CK and ADDR_CTRL Routing
Figure 7-44 shows the topology of the routing for the CK and ADDR_CTRL net classes. The length of
signal path AB and AC should be minimized with emphasis to minimize lengths C and D such that length
A is the majority of the total length of signal path AB and AC.
T
C
A
DDR2
Interface
B
A1
AM335x
A1
Figure 7-44. CK and ADDR_CTRL Routing and Topology
Table 7-54. CK and ADDR_CTRL Routing Specification(1)(2)
NO.
PARAMETER
MIN
TYP
MAX
UNIT
1
Center-to-center CK spacing
2w
2
CK differential pair skew length mismatch(2)(3)
25
mils
3
CK B-to-CK C skew length mismatch
25
mils
4
Center-to-center CK to other DDR2 trace spacing(4)
5
CK and ADDR_CTRL nominal trace length(5)
CACLM+50
mils
6
ADDR_CTRL-to-CK skew length mismatch
100
mils
7
ADDR_CTRL-to-ADDR_CTRL skew length mismatch
100
mils
8
Center-to-center ADDR_CTRL to other DDR2 trace spacing(4)
4w
9
Center-to-center ADDR_CTRL to other ADDR_CTRL trace spacing(4)
3w
10
ADDR_CTRL A-to-B and ADDR_CTRL A-to-C skew length mismatch(2)
100
mils
11
ADDR_CTRL B-to-C skew length mismatch
100
mils
4w
CACLM-50
CACLM
(1) CK represents the clock net class, and ADDR_CTRL represents the address and control signal net class.
(2) Series terminator, if used, should be located closest to the AM335x device.
(3) Differential impedance should be Zo x 2, where Zo is the single-ended impedance defined in Table 7-46.
(4) Center-to-center spacing is allowed to fall to minimum (w) for up to 500 mils of routed length to accommodate BGA escape and routing
congestion.
(5) CACLM is the longest Manhattan distance of the CK and ADDR_CTRL net classes.
A1
DQ[0]
DQ[1]
DDR2
Interface
Figure 7-45 shows the topology and routing for the DQS[x] and DQ[x] net classes; the routes are point to
point. Skew matching across bytes is not needed nor recommended.
AM335x
Figure 7-45. DQS[x] and DQ[x] Routing and Topology
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Table 7-55. DQS[x] and DQ[x] Routing Specification(1)
NO.
PARAMETER
MIN
1
Center-to-center DQS[x] spacing
2
DQS[x] differential pair skew length mismatch(2)
3
Center-to-center DDR_DQS[x] to other DDR2 trace spacing(3)
4
DQS[x] and DQ[x] nominal trace length(4)
5
DQ[x]-to-DQS[x] skew length mismatch(4)
6
DQ[x]-to-DQ[x] skew length mismatch(4)
TYP
MAX
UNIT
2w
25
mils
DQLM+50
mils
100
mils
100
mils
4w
DQLM-50
7
Center-to-center DQ[x] to other DDR2 trace spacing
(3)(5)
4w
8
Center-to-center DQ[x] to other DQ[x] trace spacing(3)(6)
3w
DQLM
(1) DQS[x] represents the DQS0 and DQS1 clock net classes, and DQ[x] represents the DQ0 and DQ1 signal net classes.
(2) Differential impedance should be Zo x 2, where Zo is the single-ended impedance defined in Table 7-46.
(3) Center-to-center spacing is allowed to fall to minimum (w) for up to 500 mils of routed length to accommodate BGA escape and routing
congestion.
(4) There is no requirement for skew matching between data bytes; that is, from net classes DQS0 and DQ0 to net classes DQS1 and DQ1.
(5) Signals from one DQ net class should be considered other DDR2 traces to another DQ net class.
(6) DQLM is the longest Manhattan distance of each of the DQS[x] and DQ[x] net classes.
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7.7.2.3
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DDR3 and DDR3L Routing Guidelines
NOTE
All references to DDR3 in this section apply to DDR3 and DDR3L devices, unless otherwise
noted.
7.7.2.3.1 Board Designs
TI only supports board designs using DDR3 memory that follow the guidelines in this document. The
switching characteristics and timing diagram for the DDR3 memory interface are shown in Table 7-56 and
Figure 7-46.
Table 7-56. Switching Characteristics for DDR3 Memory Interface
NO.
1
PARAMETER
tc(DDR_CK)
tc(DDR_CKn)
Cycle time, DDR_CK and DDR_CKn
MIN
MAX
UNIT
2.5
3.3(1)
ns
(1) The JEDEC JESD79-3F Standard defines the maximum clock period of 3.3 ns for all standard-speed bin DDR3 and DDR3L memory
devices. Therefore, all standard-speed bin DDR3 and DDR3L memory devices are required to operate at 303 MHz.
1
DDR_CK
DDR_CKn
Figure 7-46. DDR3 Memory Interface Clock Timing
7.7.2.3.1.1 DDR3 versus DDR2
This specification only covers AM335x PCB designs that use DDR3 memory. Designs using DDR2
memory should use the DDR2 routing guidleines described in Section 7.7.2.2. While similar, the two
memory systems have different requirements. It is currently not possible to design one PCB that meets
the requirements of both DDR2 and DDR3.
7.7.2.3.2 DDR3 Device Combinations
Because there are several possible combinations of device counts and single-side or dual-side mounting,
Table 7-57 summarizes the supported device configurations.
Table 7-57. Supported DDR3 Device Combinations
NUMBER OF DDR3 DEVICES
DDR3 DEVICE WIDTH (BITS)
MIRRORED?
DDR3 EMIF WIDTH (BITS)
1
16
N
16
2
(1)
8
Y
(1)
16
Two DDR3 devices are mirrored when one device is placed on the top of the board and the second device is placed on the bottom of
the board.
7.7.2.3.3 DDR3 Interface
This section provides the timing specification for the DDR3 interface as a PCB design and manufacturing
specification. The design rules constrain PCB trace length, PCB trace skew, signal integrity, cross-talk,
and signal timing. These rules, when followed, result in a reliable DDR3 memory system without the need
for a complex timing closure process. For more information regarding the guidelines for using this DDR3
specification, see Understanding TI's PCB Routing Rule-Based DDR Timing Specification. This application
report provides generic guidelines and approach. All the specifications provided in the data manual take
precedence over the generic guidelines and must be adhered to for a reliable DDR3 interface operation.
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7.7.2.3.3.1 DDR3 Interface Schematic
The DDR3 interface schematic varies, depending upon the width of the DDR3 devices used. Figure 7-47
shows the schematic connections for 16-bit interface on the AM335x device using one x16 DDR3 device
and Figure 7-49 shows the schematic connections for 16-bit interface on the AM335x device using two x8
DDR3 devices. The AM335x DDR3 memory interface only supports 16-bit wide mode of operation. The
AM335x device can only source one load connected to the DQS[x] and DQ[x] net class signals and two
loads connected to the CK and ADDR_CTRL net class signals. For more information related to net
classes, see Section 7.7.2.3.3.8.
16-Bit DDR3
Interface
16-Bit DDR3
Device
DDR_D15
DQU7
8
DDR_D8
DQU0
DDR_DQM1
DDR_DQS1
DDR_DQSn1
DMU
DQSU
DQSU#
DDR_D7
DQL7
8
DDR_D0
DQL0
DDR_DQM0
DDR_DQS0
DDR_DQSn0
DML
DQSL
DQSL#
DDR_CK
DDR_CKn
CK
CK#
DDR_ODT
DDR_CSn0
DDR_BA0
DDR_BA1
DDR_BA2
Zo
VDDS_DDR
Zo
ODT
CS#
BA0
BA1
BA2
DDR_A0
0.1 µF
DDR_VTT
A0
Zo
A15
Zo
15
DDR_A15
DDR_CASn
DDR_RASn
DDR_WEn
DDR_CKE
DDR_RESETn
ZQ
DDR_VREF
0.1 µF
CAS#
RAS#
WE#
CKE
RESET#
ZQ
VREFDQ
VREFCA
0.1 µF
DDR_VREF
0.1 µF
DDR_VTP
49.9 Ω
(±1%, 20 mW)
Zo
ZQ
Termination is required. See terminator comments.
Value determined according to the DDR3 memory device data sheet.
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Figure 7-47. 16-Bit DDR3 Interface Using One 16-Bit DDR3 Device with VTT Termination
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16-Bit DDR3
Interface
16-Bit DDR3
Device
DDR_D15
DQU7
8
DDR_D8
DQU0
DDR_DQM1
DDR_DQS1
DDR_DQSn1
DMU
DQSU
DQSU#
DDR_D7
DQL7
8
DDR_D0
DQL0
DDR_DQM0
DDR_DQS0
DDR_DQSn0
DML
DQSL
DQSL#
DDR_CK
DDR_CKn
CK
CK#
DDR_ODT
DDR_CSn0
DDR_BA0
DDR_BA1
DDR_BA2
ODT
CS#
BA0
BA1
BA2
DDR_A0
A0
15
DDR_A15
A15
DDR_CASn
DDR_RASn
DDR_WEn
DDR_CKE
DDR_RESETn
ZQ
DDR_VREF
0.1 µF
CAS#
RAS#
WE#
CKE
RESET#
ZQ
VREFDQ
VREFCA
0.1 µF
VDDS_DDR
0.1 µF
(A)
1 kΩ 1%
DDR_VREF
0.1 µF
1 kΩ 1%
DDR_VTP
49.9 Ω
(±1%, 20 mW)
ZQ
A.
Value determined according to the DDR3 memory device data sheet.
Copyright © 2016, Texas Instruments Incorporated
VDDS_DDR is the power supply for the DDR3 memories and the AM335x DDR3 interface.
Figure 7-48. 16-Bit DDR3 Interface Using One 16-Bit DDR3 Device without VTT Termination
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16-Bit DDR3
Interface
8-Bit DDR3
Devices
DDR_D15
DQ7
8
DDR_D8
DQ0
DDR_DQM1
NC
DDR_DQS1
DDR_DQSn1
DDR_D7
DM/TDQS
TDQS#
DQS
DQS#
DQ7
8
DDR_D0
DQ0
DDR_DQM0
NC
DDR_DQS0
DDR_DQSn0
DDR_CK
DDR_CKn
DDR_ODT
DDR_CSn0
DDR_BA0
DDR_BA1
DDR_BA2
DDR_A0
DM/TDQS
TDQS#
DQS
DQS#
Zo
CK
CK#
CK
CK#
ODT
CS#
BA0
BA1
BA2
ODT
CS#
BA0
BA1
BA2
A0
A0
Zo
A15
A15
Zo
CAS#
RAS#
WE#
CKE
RESET#
ZQ
VREFDQ
VREFCA
CAS#
RAS#
WE#
CKE
RESET#
ZQ
VREFDQ
VREFCA
0.1 µF
VDDS_DDR
Zo
DDR_VTT
15
DDR_A15
DDR_CASn
DDR_RASn
DDR_WEn
DDR_CKE
DDR_RESETn
ZQ
DDR_VREF
0.1 µF
0.1 µF
0.1 µF
DDR_VREF
ZQ
0.1 µF
DDR_VTP
49.9 Ω
(±1%, 20 mW)
Zo
ZQ
Termination is required. See terminator comments.
Value determined according to the DDR3 memory device data sheet.
Copyright © 2016, Texas Instruments Incorporated
Figure 7-49. 16-Bit DDR3 Interface Using Two 8-Bit DDR3 Devices
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7.7.2.3.3.2 Compatible JEDEC DDR3 Devices
Table 7-58 shows the parameters of the JEDEC DDR3 devices that are compatible with this interface.
Table 7-58. Compatible JEDEC DDR3 Devices (Per Interface)
NO.
1
PARAMETER
TEST CONDITIONS
JEDEC DDR3 device speed grade
MIN
tC(DDR_CK) and tC(DDR_CKn)
= 3.3 ns
DDR3-800
tC(DDR_CK) and tC(DDR_CKn)
= 2.5 ns
DDR3-1600
MAX
2
JEDEC DDR3 device bit width
x8
x16
3
JEDEC DDR3 device count(1)
1
2
UNIT
bits
devices
(1) For valid DDR3 device configurations and device counts, see Section 7.7.2.3.3.1, Figure 7-47, and Figure 7-49.
7.7.2.3.3.3 PCB Stackup
The minimum stackup for routing the DDR3 interface is a four-layer stack up as shown in Table 7-59.
Additional layers may be added to the PCB stackup to accommodate other circuitry, enhance signal
integrity and electromagnetic interference performance, or to reduce the size of the PCB footprint.
Table 7-59. Minimum PCB Stackup(1)
LAYER
TYPE
DESCRIPTION
1
Signal
Top signal routing
2
Plane
Ground
3
Plane
Split Power Plane
4
Signal
Bottom signal routing
(1) All signals that have critical signal integrity requirements should be routed first on layer 1. It may not be possible to route all of these
signals on layer 1, therefore requiring routing of some signals on layer 4. When this is done, the signal routes on layer 4 must not cross
splits in the power plane.
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Table 7-60. PCB Stackup Specifications(1)
NO.
PARAMETER
MIN
1
PCB routing and plane layers
4
2
Signal routing layers
2
3
Full ground reference layers under DDR3 routing region(2)
TYP
MAX
UNIT
1
(2)
4
Full VDDS_DDR power reference layers under the DDR3 routing region
5
Number of reference plane cuts allowed within DDR3 routing region(3)
1
0
6
Number of layers between DDR3 routing layer and reference plane(4)
0
7
PCB routing feature size
4
8
PCB trace width, w
4
9
PCB BGA escape via pad size(5)
18
10
PCB BGA escape via hole size
10
11
Single-ended impedance, Zo(6)
50
75
Ω
12
Impedance control(7)(8)
Zo
Zo+5
Ω
Zo-5
mils
mils
20
mils
mils
(1) For the DDR3 device BGA pad size, see the DDR3 device manufacturer documentation.
(2) Ground reference layers are preferred over power reference layers. Be sure to include bypass capacitors to accommodate reference
layer return current as the trace routes switch routing layers.
(3) No traces should cross reference plane cuts within the DDR3 routing region. High-speed signal traces crossing reference plane cuts
create large return current paths which can lead to excessive crosstalk and EMI radiation.
(4) Reference planes are to be directly adjacent to the signal plane to minimize the size of the return current loop.
(5) An 18-mil pad assumes Via Channel is the most economical BGA escape. A 20-mil pad may be used if additional layers are available
for power routing. An 18-mil pad is required for minimum layer count escape.
(6) Zo is the nominal singled-ended impedance selected for the PCB.
(7) This parameter specifies the AC characteristic impedance tolerance for each segment of a PCB signal trace relative to the chosen Zo
defined by the single-ended impedance parameter.
(8) Tighter impedance control is required to ensure flight time skew is minimal.
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7.7.2.3.3.4 Placement
Figure 7-50 shows the required placement for the AM335x device as well as the DDR3 devices. The
dimensions for this figure are defined in Table 7-61. The placement does not restrict the side of the PCB
on which the devices are mounted. The ultimate purpose of the placement is to limit the maximum trace
lengths and allow for proper routing space.
X1
X2
DDR3
Interface
Y
Figure 7-50. Placement Specifications
Table 7-61. Placement Specifications(1)
NO.
PARAMETER
1
X1(2)(3)(4)
2
X2
(2)(3)
3
Y Offset(2)(3)(4)
4
Clearance from non-DDR3 signal to DDR3 keepout region(5)(6)
MIN
4
MAX
UNIT
1000
mils
600
mils
1500
mils
w
(1) DDR3 keepout region to encompass entire DDR3 routing area.
(2) For dimension definitions, see Figure 7-50.
(3) Measurements from center of the AM335x device to center of the DDR3 device.
(4) Minimizing X1 and Y improves timing margins.
(5) w is defined as the signal trace width.
(6) Non-DDR3 signals allowed within DDR3 keepout region provided they are separated from DDR3 routing layers by a ground plane.
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7.7.2.3.3.5 DDR3 Keepout Region
The region of the PCB used for DDR3 circuitry must be isolated from other signals. The DDR3 keepout
region is defined for this purpose and is shown in Figure 7-51. This region should encompass all DDR3
circuitry and the region size varies with component placement and DDR3 routing. Additional clearances
required for the keepout region are shown in Table 7-61. Non-DDR3 signals must not be routed on the
same signal layer as DDR3 signals within the DDR3 keepout region. Non-DDR3 signals may be routed in
the region provided they are routed on layers separated from DDR3 signal layers by a ground layer. No
breaks should be allowed in the reference ground or VDDS_DDR power plane in this region. In addition,
the VDDS_DDR power plane should cover the entire keepout region.
DDR3 Interface
DDR3 Keepout Region
Encompasses Entire
DDR3 Routing Area
Figure 7-51. DDR3 Keepout Region
7.7.2.3.3.6 Bulk Bypass Capacitors
Bulk bypass capacitors are required for moderate speed bypassing of the DDR3 and other circuitry.
Table 7-62 contains the minimum numbers and capacitance required for the bulk bypass capacitors. Note
that this table only covers the bypass needs of the AM335x DDR3 interface and DDR3 devices. Additional
bulk bypass capacitance may be needed for other circuitry.
Table 7-62. Bulk Bypass Capacitors(1)
NO.
PARAMETER
MIN
2
MAX
UNIT
1
AM335x VDDS_DDR bulk bypass capacitor count
2
AM335x VDDS_DDR bulk bypass total capacitance
devices
3
DDR3 number 1 bulk bypass capacitor count
4
DDR3 number 1 bulk bypass total capacitance
20
μF
5
DDR3 number 2 bulk bypass capacitor count(2)
2
devices
6
DDR3 number 2 bulk bypass total capacitance(2)
20
μF
20
μF
2
devices
(1) These devices should be placed near the devices they are bypassing, but preference should be given to the placement of the highspeed (HS) bypass capacitors and DDR3 signal routing.
(2) Only used when two DDR3 devices are used.
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7.7.2.3.3.7 High-Speed Bypass Capacitors
High-speed (HS) bypass capacitors are critical for proper DDR3 interface operation. It is particularly
important to minimize the parasitic series inductance of the HS bypass capacitors, the AM335x device
DDR3 power, and the AM335x device DDR3 ground connections. Table 7-63 contains the specification for
the HS bypass capacitors as well as for the power connections on the PCB. Generally speaking, it is good
to:
• Fit as many HS bypass capacitors as possible.
• Minimize the distance from the bypass capacitor to the power terminals being bypassed.
• Use the smallest physical sized capacitors possible with the highest capacitance readily available.
• Connect the bypass capacitor pads to their vias using the widest traces possible and using the largest
hole size via possible.
• Minimize via sharing. Note the limits on via sharing shown in Table 7-63.
Table 7-63. High-Speed Bypass Capacitors
NO.
PARAMETER
MIN
1
HS bypass capacitor package size(1)
2
Distance, HS bypass capacitor to AM335x VDDS_DDR and VSS terminal
being bypassed(2)(3)(4)
3
AM335x VDDS_DDR HS bypass capacitor count
4
AM335x VDDS_DDR HS bypass capacitor total capacitance
5
Trace length from AM335x VDDS_DDR and VSS terminal to connection
via(2)
6
Distance, HS bypass capacitor to DDR3 device being bypassed(5)
7
DDR3 device HS bypass capacitor count(6)
8
DDR3 device HS bypass capacitor total capacitance(6)
TYP
MAX
UNIT
0201
0402
10 mils
400
mils
20
devices
1
μF
35
70
150
12
9
Number of connection vias for each HS bypass capacitor
10
Trace length from bypass capacitor connect to connection via(2)(8)
11
Number of connection vias for each DDR3 device power and ground
terminal(9)
12
Trace length from DDR3 device power and ground terminal to connection
via(2)(7)
mils
devices
0.85
(7)(8)
mils
μF
2
vias
35
100
1
mils
vias
35
60
mils
(1) LxW, 10-mil units; for example, a 0402 is a 40x20-mil surface-mount capacitor.
(2) Closer and shorter is better.
(3) Measured from the nearest AM335x VDDS_DDR and ground terminal to the center of the capacitor package.
(4) Three of these capacitors should be located underneath the AM335x device, between the cluster of VDDS_DDR and ground terminals,
between the DDR3 interfaces on the package.
(5) Measured from the DDR3 device power and ground terminal to the center of the capacitor package.
(6) Per DDR3 device.
(7) An additional HS bypass capacitor can share the connection vias only if it is mounted on the opposite side of the board. No sharing of
vias is permitted on the same side of the board.
(8) An HS bypass capacitor may share a via with a DDR3 device mounted on the same side of the PCB. A wide trace should be used for
the connection and the length from the capacitor pad to the DDR3 device pad should be less than 150 mils.
(9) Up to two pairs of DDR3 power and ground terminals may share a via.
7.7.2.3.3.7.1 Return Current Bypass Capacitors
Use additional bypass capacitors if the return current reference plane changes due to DDR3 signals
hopping from one signal layer to another. The bypass capacitor here provides a path for the return current
to hop planes along with the signal. As many of these return current bypass capacitors should be used as
possible. Because these are returns for signal current, the signal via size may be used for these
capacitors.
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7.7.2.3.3.8 Net Classes
Table 7-64 lists the clock net classes for the DDR3 interface. Table 7-65 lists the signal net classes, and
associated clock net classes, for signals in the DDR3 interface. These net classes are used for the
termination and routing rules that follow.
Table 7-64. Clock Net Class Definitions
CLOCK NET CLASS
CK
AM335x PIN NAMES
DDR_CK and DDR_CKn
DQS0
DDR_DQS0 and DDR_DQSn0
DQS1
DDR_DQS1 and DDR_DQSn1
Table 7-65. Signal Net Class Definitions
SIGNAL NET CLASS
ASSOCIATED CLOCK NET
AM335x PIN NAMES
CLASS
DDR_BA[2:0], DDR_A[15:0], DDR_CSn0, DDR_CASn, DDR_RASn,
DDR_WEn, DDR_CKE, DDR_ODT
ADDR_CTRL
CK
DQ0
DQS0
DDR_D[7:0], DDR_DQM0
DQ1
DQS1
DDR_D[15:8], DDR_DQM1
7.7.2.3.3.9 DDR3 Signal Termination
Signal terminations are required for the CK and ADDR_CTRL net class signals. On-device terminations
(ODTs) are required on the DQS[x] and DQ[x] net class signals. Detailed termination specifications are
covered in the routing rules in the following sections.
Figure 7-48 provides an example DDR3 schematic with a single 16-bit DDR3 memory device that does
not have VTT termination on the address and control signals. A typical DDR3 point-to-point topology may
provide acceptable signal integrity without VTT termination. System performance should be verified by
performing signal integrity analysis using specific PCB design details before implementing this topology.
7.7.2.3.3.10 DDR_VREF Routing
DDR_VREF is used as a reference by the input buffers of the DDR3 memories as well as the AM335x
device. DDR_VREF is intended to be half the DDR3 power supply voltage and is typically generated with
a voltage divider connected to the VDDS_DDR power supply. It should be routed as a nominal 20-mil wide
trace with 0.1 µF bypass capacitors near each device connection. Narrowing of DDR_VREF is allowed to
accommodate routing congestion.
7.7.2.3.3.11 VTT
Like DDR_VREF, the nominal value of the VTT supply is half the DDR3 supply voltage. Unlike
DDR_VREF, VTT is expected to source and sink current, specifically the termination current for the
ADDR_CTRL net class Thevinen terminators. VTT is needed at the end of the address bus and it should
be routed as a power sub-plane. VTT should be bypassed near the terminator resistors.
7.7.2.3.4 DDR3 CK and ADDR_CTRL Topologies and Routing Definition
The CK and ADDR_CTRL net classes are routed similarly and are length matched to minimize skew
between them. CK is a bit more complicated because it runs at a higher transition rate and is differential.
The following subsections show the topology and routing for various DDR3 configurations for CK and
ADDR_CTRL. The figures in the following subsections define the terms for the routing specification
detailed in Table 7-66.
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7.7.2.3.4.1 Two DDR3 Devices
Two DDR3 devices are supported on the DDR3 interface consisting of two x8 DDR3 devices arranged as
one 16-bit bank. These two devices may be mounted on a single side of the PCB, or may be mirrored in a
pair to save board space at a cost of increased routing complexity and parts on the backside of the PCB.
7.7.2.3.4.1.1 CK and ADDR_CTRL Topologies, Two DDR3 Devices
Figure 7-52 shows the topology of the CK net classes and Figure 7-53 shows the topology for the
corresponding ADDR_CTRL net classes.
+ –
+ –
AS+
AS-
AS+
AS-
DDR3 Differential CK Input Buffers
Clock Parallel
Terminator
VDDS_DDR
Rcp
A1
AM335x
Differential Clock
Output Buffer
A2
A3
AT
Cac
+
–
Rcp
A1
A2
A3
0.1 µF
AT
Routed as Differential Pair
Figure 7-52. CK Topology for Two DDR3 Devices
AM335x
Address and Control
Output Buffer
A1
A2
AS
AS
DDR3 Address and Control Input Buffers
A3
Address and Control
Terminator
Rtt
Vtt
AT
Figure 7-53. ADDR_CTRL Topology for Two DDR3 Devices
7.7.2.3.4.1.2 CK and ADDR_CTRL Routing, Two DDR3 Devices
Figure 7-54 shows the CK routing for two DDR3 devices placed on the same side of the PCB. Figure 7-55
shows the corresponding ADDR_CTRL routing.
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A1
A1
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VDDS_DDR
A3
A3
=
Rcp
Cac
Rcp
0.1 µF
AT
AT
AS+
AS-
A2
A2
A1
Figure 7-54. CK Routing for Two Single-Sided DDR3 Devices
Rtt
A3
=
AT
Vtt
AS
A2
Figure 7-55. ADDR_CTRL Routing for Two Single-Sided DDR3 Devices
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A1
A1
To save PCB space, the two DDR3 memories may be mounted as a mirrored pair at a cost of increased
routing and assembly complexity. Figure 7-56 and Figure 7-57 show the routing for CK and ADDR_CTRL,
respectively, for two DDR3 devices mirrored in a single-pair configuration.
VDDS_DDR
A3
A3
=
Rcp
Cac
Rcp
0.1 µF
AT
AT
AS+
AS-
A2
A2
A1
Figure 7-56. CK Routing for Two Mirrored DDR3 Devices
Rtt
=
AT
Vtt
AS
A3
A2
Figure 7-57. ADDR_CTRL Routing for Two Mirrored DDR3 Devices
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7.7.2.3.4.2 One DDR3 Device
One DDR3 device is supported on the DDR3 interface consisting of one x16 DDR3 device arranged as
one 16-bit bank.
7.7.2.3.4.2.1 CK and ADDR_CTRL Topologies, One DDR3 Device
Figure 7-58 shows the topology of the CK net classes and Figure 7-59 shows the topology for the
corresponding ADDR_CTRL net classes.
DDR3 Differential CK Input Buffer
AS+
AS-
+ –
Clock Parallel
Terminator
VDDS_DDR
Rcp
A1
AM335x
Differential Clock
Output Buffer
A2
AT
Cac
+
–
Rcp
A1
A2
0.1 µF
AT
Routed as Differential Pair
Figure 7-58. CK Topology for One DDR3 Device
AS
DDR3 Address and Control Input Buffers
AM335x
Address and Control
Output Buffer
A1
A2
Address and Control
Terminator
Rtt
AT
Vtt
Figure 7-59. ADDR_CTRL Topology for One DDR3 Device
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7.7.2.3.4.2.2 CK and ADDR_CTRL Routing, One DDR3 Device
A1
A1
Figure 7-60 shows the CK routing for one DDR3 device. Figure 7-61 shows the corresponding
ADDR_CTRL routing.
VDDS_DDR
Rcp
Cac
Rcp
0.1 µF
AT
AT
=
AS+
AS-
A2
A2
A1
Figure 7-60. CK Routing for One DDR3 Device
Rtt
AT
=
Vtt
AS
A2
Figure 7-61. ADDR_CTRL Routing for One DDR3 Device
7.7.2.3.5 Data Topologies and Routing Definition
No matter the number of DDR3 devices used, the data line topology is always point to point, so its
definition is simple.
7.7.2.3.5.1 DQS[x] and DQ[x] Topologies, Any Number of Allowed DDR3 Devices
DQS[x] lines are point-to-point differential, and DQ[x] lines are point-to-point single-ended. Figure 7-62
and Figure 7-63 show these topologies.
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Am335x
DQS[x]
I/O Buffer
DDR3
DQS[x]
I/O Buffer
DQS[x]+
DQS[x]Routed Differentially
x = 0, 1
Figure 7-62. DQS[x] Topology
AM335x
DQ[x]
I/O Buffer
DDR3
DQ[x]
I/O Buffer
DQ[x]
x = 0, 1
Figure 7-63. DQ[x] Topology
7.7.2.3.5.2 DQS[x] and DQ[x] Routing, Any Number of Allowed DDR3 Devices
Figure 7-64 and Figure 7-65 show the DQS[x] and DQ[x] routing.
DQS[x]+
DQS[x]-
DQS[x]
Routed Differentially
x = 0, 1
Figure 7-64. DQS[x] Routing With Any Number of Allowed DDR3 Devices
DQ[x]
x = 0, 1
Figure 7-65. DQ[x] Routing With Any Number of Allowed DDR3 Devices
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7.7.2.3.6 Routing Specification
7.7.2.3.6.1 CK and ADDR_CTRL Routing Specification
Skew within the CK and ADDR_CTRL net classes directly reduces setup and hold margin and, thus, this
skew must be controlled. The only way to practically match lengths on a PCB is to lengthen the shorter
traces up to the length of the longest net in the net class and its associated clock. A metric to establish
this maximum length is Manhattan distance. The Manhattan distance between two points on a PCB is the
length between the points when connecting them only with horizontal or vertical segments. A reasonable
trace route length is to within a percentage of its Manhattan distance. CACLM is defined as Clock Address
Control Longest Manhattan distance.
Given the clock and address pin locations on the AM335x device and the DDR3 memories, the maximum
possible Manhattan distance can be determined given the placement. Figure 7-66 shows this distance for
two loads. The specifications on the lengths of the transmission lines for the address bus are determined
from this distance. CACLM is determined similarly for other address bus configurations; that is, it is based
on the longest net of the CK and ADDR_CTRL net class. For CK and ADDR_CTRL routing, these
specifications are contained in Table 7-66.
(A)
A1
A8
CACLMY
CACLMX
A8
(A)
A8
(A)
Rtt
A3
=
A.
AT
Vtt
AS
A2
It is very likely that the longest CK and ADDR_CTRL Manhattan distance will be for Address Input 8 (A8) on the
DDR3 memories. CACLM is based on the longest Manhattan distance due to the device placement. Verify the net
class that satisfies this criteria and use as the baseline for CK and ADDR_CTRL skew matching and length control.
The length of shorter CK and ADDR_CTRL stubs as well as the length of the terminator stub are not included in this
length calculation. Nonincluded lengths are grayed out in the figure.
Assuming A8 is the longest, CALM = CACLMY + CACLMX + 300 mils.
The extra 300 mils allows for routing down lower than the DDR3 memories and returning up to reach A8.
Figure 7-66. CACLM for Two Address Loads on One Side of PCB
Table 7-66. CK and ADDR_CTRL Routing Specification(1)(2)(3)
NO.
PARAMETER
MIN
TYP
MAX
UNIT
2500
mils
25
mils
660
mils
1
A1 + A2 length
2
A1 + A2 skew
3
A3 length
4
A3 skew(4)
25
mils
5
(5)
A3 skew
125
mils
6
AS length
100
mils
186
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Table 7-66. CK and ADDR_CTRL Routing Specification(1)(2)(3) (continued)
NO.
MAX
UNIT
7
AS skew
PARAMETER
MIN
TYP
25
mils
8
AS+ and AS– length
70
mils
9
AS+ and AS– skew
5
mils
10
AT length(6)
500
(7)
11
AT skew
12
AT skew(8)
13
CK and ADDR_CTRL nominal trace length(9)
mils
100
CACLM-50
(10)
mils
5
mils
CACLM
CACLM+50
mils
14
Center-to-center CK to other DDR3 trace spacing
15
Center-to-center ADDR_CTRL to other DDR3 trace spacing(10)(11)
4w
4w
16
Center-to-center ADDR_CTRL to other ADDR_CTRL trace spacing(10)
3w
17
CK center-to-center spacing(12)
18
CK spacing to other net(10)
19
Rcp(13)
Zo-1
Zo
Zo+1
Ω
20
Rtt(13)(14)
Zo-5
Zo
Zo+5
Ω
4w
(1) CK represents the clock net class, and ADDR_CTRL represents the address and control signal net class.
(2) The use of vias should be minimized.
(3) Additional bypass capacitors are required when using the VDDS_DDR plane as the reference plane to allow the return current to jump
between the VDDS_DDR plane and the ground plane when the net class switches layers at a via.
(4) Mirrored configuration (one DDR3 device on top of the board and one DDR3 device on the bottom).
(5) Nonmirrored configuration (all DDR3 memories on same side of PCB).
(6) While this length can be increased for convenience, its length should be minimized.
(7) ADDR_CTRL net class only (not CK net class). Minimizing this skew is recommended, but not required.
(8) CK net class only.
(9) CACLM is the longest Manhattan distance of the CK and ADDR_CTRL net classes + 300 mils. For definition, see Section 7.7.2.3.6.1
and Figure 7-66.
(10) Center-to-center spacing is allowed to fall to minimum (w) for up to 1250 mils of routed length.
(11) Signals from one DQ net class should be considered other DDR3 traces to another DQ net class.
(12) CK spacing set to ensure proper differential impedance. Differential impedance should be Zo x 2, where Zo is the single-ended
impedance defined in Table 7-60.
(13) Source termination (series resistor at driver) is specifically not allowed.
(14) Termination values should be uniform across the net class.
7.7.2.3.6.2 DQS[x] and DQ[x] Routing Specification
Skew within the DQS[x] and DQ[x] net classes directly reduces setup and hold margin and, thus, this skew
must be controlled. The only way to practically match lengths on a PCB is to lengthen the shorter traces
up to the length of the longest net in the net class and its associated clock. DQLMn is defined as DQ
Longest Manhattan distance n, where n is the byte number. For a 16-bit interface, there are two DQLMs,
DQLM0-DQLM1.
NOTE
Matching the lengths across all bytes is not required, nor is it recommended. Length
matching is only required within each byte.
Given the DQS[x] and DQ[x] pin locations on the AM335x device and the DDR3 memories, the maximum
possible Manhattan distance can be determined given the placement. Figure 7-67 shows this distance for
a two-load case. It is from this distance that the specifications on the lengths of the transmission lines for
the data bus are determined. For DQS[x] and DQ[x] routing, these specifications are contained in Table 767.
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DQLMX0
DQ0
DQ1
DQ[0:7], DM0, DQS0
DQ[8:15], DM1, DQS1
DQLMX1
DQLMY0
DQLMY1
1
0
DQ0 - DQ1 represent data bytes 0 - 1.
There are two DQLMs, one for each byte (16-bit interface). Each DQLM is the longest Manhattan distance of the byte;
therefore:
DQLM0 = DQLMX0 + DQLMY0
DQLM1 = DQLMX1 + DQLMY1
Figure 7-67. DQLM for Any Number of Allowed DDR3 Devices
Table 7-67. DQS[x] and DQ[x] Routing Specification(1)(2)
NO.
MAX
UNIT
1
DQ0 nominal length(3)(4)
PARAMETER
MIN
TYP
DQLM0
mils
2
(3)(5)
DQ1 nominal length
DQLM1
mils
3
DQ[x] skew(6)
25
mils
4
DQS[x] skew
5
mils
25
mils
(6)(7)
5
DQS[x]-to-DQ[x] skew
6
Center-to-center DQ[x] to other DDR3 trace spacing(8)(9)
4w
7
Center-to-center DQ[x] to other DQ[x] trace spacing(8)(10)
3w
8
DQS[x] center-to-center spacing(11)
9
DQS[x] center-to-center spacing to other net(8)
4w
(1) DQS[x] represents the DQS0 and DQS1 clock net classes, and DQ[x] represents the DQ0 and DQ1 signal net classes.
(2) External termination disallowed. Data termination should use built-in ODT functionality.
(3) DQLMn is the longest Manhattan distance of a byte. For definition, see Section 7.7.2.3.6.2 and Figure 7-67.
(4) DQLM0 is the longest Manhattan length for the DQ0 net class.
(5) DQLM1 is the longest Manhattan length for the DQ1 net class.
(6) Length matching is only done within a byte. Length matching across bytes is not required.
(7) Each DQS clock net class is length matched to its associated DQ signal net class.
(8) Center-to-center spacing is allowed to fall to minimum for up to 1250 mils of routed length.
(9) Other DDR3 trace spacing means signals that are not part of the same DQ[x] signal net class.
(10) This applies to spacing within same DQ[x] signal net class.
(11) DQS[x] pair spacing is set to ensure proper differential impedance. Differential impedance should be Zo x 2, where Zo is the singleended impedance defined in Table 7-60.
188
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7.8
SPRS717J – OCTOBER 2011 – REVISED APRIL 2016
I2C
For more information, see the Inter-Integrated Circuit (I2C) section of the AM335x and AMIC110 Sitara
Processors Technical Reference Manual.
7.8.1
I2C Electrical Data and Timing
Table 7-68. I2C Timing Conditions – Slave Mode
STANDARD MODE
PARAMETER
MIN
MAX
FAST MODE
MIN
MAX
UNIT
Output Condition
Cb
Capacitive load for each bus line
400
400
pF
Table 7-69. Timing Requirements for I2C Input Timings
(see Figure 7-68)
STANDARD MODE
NO.
1
MIN
MAX
FAST MODE
MIN
MAX
UNIT
tc(SCL)
Cycle time, SCL
10
2.5
µs
2
tsu(SCLH-SDAL)
Setup time, SCL high before SDA low (for a repeated
START condition)
4.7
0.6
µs
3
th(SDAL-SCLL)
Hold time, SCL low after SDA low (for a START and a
repeated START condition)
4
0.6
µs
4
tw(SCLL)
Pulse duration, SCL low
4.7
1.3
µs
5
tw(SCLH)
Pulse duration, SCL high
4
0.6
µs
(1)
6
tsu(SDAV-SCLH)
Setup time, SDA valid before SCL high
250
7
th(SCLL-SDAV)
Hold time, SDA valid after SCL low
0(2)
8
tw(SDAH)
Pulse duration, SDA high between STOP and START
conditions
4.7
100
3.45(3)
0(2)
ns
0.9(3)
1.3
µs
µs
9
tr(SDA)
Rise time, SDA
1000
300
ns
10
tr(SCL)
Rise time, SCL
1000
300
ns
11
tf(SDA)
Fall time, SDA
300
300
ns
12
tf(SCL)
Fall time, SCL
13
tsu(SCLH-SDAH)
Setup time, high before SDA high (for STOP condition)
4
14
tw(SP)
Pulse duration, spike (must be suppressed)
0
2
300
300
0.6
50
0
ns
µs
50
ns
2
(1) A fast-mode I C-bus device can be used in a standard-mode I C-bus system, but the requirement tsu(SDA-SCLH)≥ 250 ns must then be
met. This is automatically the case if the device does not stretch the LOW period of the SCL signal. If such a device stretches the LOW
period of the SCL signal, it must output the next data bit to the SDA line tr max + tsu(SDA-SCLH) = 1000 + 250 = 1250 ns (according to the
standard-mode I2C-Bus Specification) before the SCL line is released.
(2) A device must internally provide a hold time of at least 300 ns for the SDA signal (referred to the VIHmin of the SCL signal) to bridge the
undefined region of the falling edge of SCL.
(3) The maximum th(SDA-SCLL) has only to be met if the device does not stretch the low period [tw(SCLL)] of the SCL signal.
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9
11
I2C[x]_SDA
6
8
14
4
13
5
10
I2C[x]_SCL
1
12
3
7
2
3
Stop
Start
Repeated
Start
Stop
Figure 7-68. I2C Receive Timing
Table 7-70. Switching Characteristics for I2C Output Timings
(see Figure 7-69)
NO.
15
STANDARD MODE
PARAMETER
MIN
FAST MODE
MAX
MIN
MAX
UNIT
tc(SCL)
Cycle time, SCL
10
2.5
µs
16
tsu(SCLH-SDAL)
Setup time, SCL high before SDA low (for a repeated
START condition)
4.7
0.6
µs
17
th(SDAL-SCLL)
Hold time, SCL low after SDA low (for a START and a
repeated START condition)
4
0.6
µs
18
tw(SCLL)
Pulse duration, SCL low
4.7
1.3
µs
19
tw(SCLH)
Pulse duration, SCL high
4
0.6
µs
20
tsu(SDAV-SCLH)
Setup time, SDA valid before SCL high
21
th(SCLL-SDAV)
Hold time, SDA valid after SCL low
22
tw(SDAH)
Pulse duration, SDA high between STOP and START
conditions
23
tr(SDA)
Rise time, SDA
1000
300
ns
24
tr(SCL)
Rise time, SCL
1000
300
ns
25
tf(SDA)
Fall time, SDA
300
300
ns
26
tf(SCL)
Fall time, SCL
27
tsu(SCLH-SDAH)
Setup time, high before SDA high (for STOP condition)
250
100
0
3.45
4.7
ns
0
0.9
1.3
µs
300
4
µs
300
0.6
ns
µs
23
25
I2C[x]_SDA
20
22
18
27
19
24
I2C[x]_SCL
26
15
17
21
16
17
Stop
Start
Repeated
Start
Stop
Figure 7-69. I2C Transmit Timing
190
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7.9
SPRS717J – OCTOBER 2011 – REVISED APRIL 2016
JTAG Electrical Data and Timing
Table 7-71. Timing Requirements for JTAG
(see Figure 7-70)
OPP100
NO.
MIN
OPP50
MAX
MIN
MAX
UNIT
1
tc(TCK)
Cycle time, TCK
81.5
104.5
ns
1a
tw(TCKH)
Pulse duration, TCK high (40% of tc)
32.6
41.8
ns
1b
tw(TCKL)
Pulse duration, TCK low (40% of tc)
32.6
41.8
ns
tsu(TDI-TCKH)
Input setup time, TDI valid to TCK high
3
3
ns
tsu(TMS-TCKH)
Input setup time, TMS valid to TCK high
3
3
ns
th(TCKH-TDI)
Input hold time, TDI valid from TCK high
8.05
8.05
ns
th(TCKH-TMS)
Input hold time, TMS valid from TCK high
8.05
8.05
ns
3
4
Table 7-72. Switching Characteristics for JTAG
(see Figure 7-70)
NO.
2
OPP100
PARAMETER
td(TCKL-TDO)
Delay time, TCK low to TDO valid
OPP50
MIN
MAX
MIN
MAX
3
27.6
4
36.8
UNIT
ns
1
1a
1b
TCK
2
TDO
3
4
TDI/TMS
Figure 7-70. JTAG Timing
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7.10 LCD Controller (LCDC)
The LCDC consists of two independent controllers, the raster controller and the LCD interface display
driver (LIDD) controller. Each controller operates independently from the other and only one of them is
active at any given time.
• The raster controller handles the synchronous LCD interface. It provides timing and data for constant
graphics refresh to a passive display. It supports a wide variety of monochrome and full-color display
types and sizes by use of programmable timing controls, a built-in palette, and a gray-scale and
serializer. Graphics data is processed and stored in frame buffers. A frame buffer is a contiguous
memory block in the system. A built-in DMA engine supplies the graphics data to the raster engine
which, in turn, outputs to the external LCD device.
• The LIDD controller supports the asynchronous LCD interface. It provides full-timing programmability of
control signals (CS, WE, OE, ALE) and output data.
The maximum resolution for the LCD controller is 2048 × 2048 pixels. The maximum frame rate is
determined by the image size in combination with the pixel clock rate.
Table 7-73. LCD Controller Timing Conditions
PARAMETER
MIN
TYP
MAX
UNIT
Output Condition
CLOAD
Output load capacitance
LIDD mode
5
60
Raster mode
3
30
pF
7.10.1 LCD Interface Display Driver (LIDD Mode)
Table 7-74. Timing Requirements for LCD LIDD Mode
(see Figure 7-72 through Figure 7-80)
OPP100
NO.
MIN
16
tsu(LCD_DATA-LCD_MEMORY_CLK)
Setup time, LCD_DATA[15:0] valid before
LCD_MEMORY_CLK high
17
th(LCD_MEMORY_CLK-LCD_DATA)
18
tt(LCD_DATA)
MAX
UNIT
18
ns
Hold time, LCD_DATA[15:0] valid after
LCD_MEMORY_CLK high
0
ns
Transition time, LCD_DATA[15:0]
1
3
ns
Table 7-75. Switching Characteristics for LCD LIDD Mode
(see Figure 7-72 through Figure 7-80)
NO.
OPP100
MIN
MAX
tc(LCD_MEMORY_CLK)
Cycle time, LCD_MEMORY_CLK
2
tw(LCD_MEMORY_CLKH)
Pulse duration, LCD_MEMORY_CLK high
0.45tc
0.55tc
ns
3
tw(LCD_MEMORY_CLKL)
Pulse duration, LCD_MEMORY_CLK low
0.45tc
0.55tc
ns
4
td(LCD_MEMORY_CLK-LCD_DATAV)
Delay time, LCD_MEMORY_CLK high to
LCD_DATA[15:0] valid (write)
7
ns
5
td(LCD_MEMORY_CLK-LCD_DATAI)
Delay time, LCD_MEMORY_CLK high to
LCD_DATA[15:0] invalid (write)
0
6
td(LCD_MEMORY_CLK-LCD_AC_BIAS_EN)
Delay time, LCD_MEMORY_CLK high to
LCD_AC_BIAS_EN
0
6.8
ns
7
tt(LCD_AC_BIAS_EN)
Transition time, LCD_AC_BIAS_EN
1
10
ns
8
td(LCD_MEMORY_CLK-LCD_VSYNC)
Delay time, LCD_MEMORY_CLK high to
LCD_VSYNC
0
7
ns
9
tt(LCD_VSYNC)
Transition time, LCD_VSYNC
1
10
ns
td(LCD_MEMORY_CLK-LCD_HYSNC)
Delay time, LCD_MEMORY_CLK high to
LCD_HSYNC
0
7
ns
Peripheral Information and Timings
23.7
UNIT
1
10
192
PARAMETER
ns
ns
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SPRS717J – OCTOBER 2011 – REVISED APRIL 2016
Table 7-75. Switching Characteristics for LCD LIDD Mode (continued)
(see Figure 7-72 through Figure 7-80)
NO.
OPP100
PARAMETER
UNIT
MIN
MAX
10
ns
11
tt(LCD_HSYNC)
Transition time, LCD_HYSNC
1
12
td(LCD_MEMORY_CLK-LCD_PCLK)
Delay time, LCD_MEMORY_CLK high to LCD_PCLK
0
7
ns
13
tt(LCD_PCLK)
Transition time, LCD_PCLK
1
10
ns
14
td(LCD_MEMORY_CLK-LCD_DATAZ)
Delay time, LCD_MEMORY_CLK high to
LCD_DATA[15:0] high-Z
0
7
ns
15
td(LCD_MEMORY_CLK-LCD_DATA)
Delay time, LCD_MEMORY_CLK high to
LCD_DATA[15:0] driven
0
7
ns
19
tt(LCD_MEMORY_CLK)
Transition time, LCD_MEMORY_CLK
1
2.5
ns
20
tt(LCD_DATA)
Transition time, LCD_DATA
1
10
ns
W_SU
(0 to 31)
CS_DELAY
(0 to 3)
W_STROBE
(1 to 63)
W_HOLD
(1 to 15)
LCD_MEMORY_CLK
6
6
LCD_MEMORY_CLK
(E1)
7
4
LCD_DATA[7:0]
5
Write Instruction
8
8
10
10
LCD_VSYNC
(RS)
9
LCD_HSYNC
(R/W)
6
6
11
LCD_AC_BIAS_EN
(E0)
7
A.
Hitachi mode performs asynchronous operations that do not require an external LCD_MEMORY_CLK. The first
LCD_MEMORY_CLK waveform is only shown as a reference of the internal clock that sequences the other signals.
The second LCD_MEMORY_CLK waveform is shown as E1 because the LCD_MEMORY_CLK signal is used to
implement the E1 function in Hitachi mode.
Figure 7-71. Command Write in Hitachi Mode
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W_SU
(0 to 31)
CS_DELAY
(0 to 3)
W_STROBE
(1 to 63)
W_HOLD
(1 to 15)
LCD_MEMORY_CLK
6
6
LCD_MEMORY_CLK
(E1)
7
4
LCD_DATA[15:0]
5
Write Data
20
LCD_VSYNC
(RS)
10
10
LCD_HSYNC
(R/W)
11
6
6
LCD_AC_BIAS_EN
(E0)
7
A.
Hitachi mode performs asynchronous operations that do not require an external LCD_MEMORY_CLK. The first
LCD_MEMORY_CLK waveform is only shown as a reference of the internal clock that sequences the other signals.
The second LCD_MEMORY_CLK waveform is shown as E1 because the LCD_MEMORY_CLK signal is used to
implement the E1 function in Hitachi mode.
Figure 7-72. Data Write in Hitachi Mode
R_SU
(0 to 31)
R_STROBE
(1 to 63)
R_HOLD
(1 to 15)
CS_DELAY
(0 to 3)
LCD_MEMORY_CLK
6
6
LCD_MEMORY_CLK
(E1)
14
7
16
17
15
LCD_DATA[15:0]
8
Read Command
18
8
LCD_VSYNC
(RS)
9
LCD_HSYNC
(R/W)
6
6
LCD_AC_BIAS_EN
(E0)
7
A.
Hitachi mode performs asynchronous operations that do not require an external LCD_MEMORY_CLK. The first
LCD_MEMORY_CLK waveform is only shown as a reference of the internal clock that sequences the other signals.
The second LCD_MEMORY_CLK waveform is shown as E1 because the LCD_MEMORY_CLK signal is used to
implement the E1 function in Hitachi mode.
Figure 7-73. Command Read in Hitachi Mode
194
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R_SU
(0 to 31)
R_STROBE
(1 to 63)
R_HOLD
(1 to 15)
CS_DELAY
(0 to 3)
LCD_MEMORY_CLK
6
6
LCD_MEMORY_CLK
(E1)
14
7
16
17
15
LCD_DATA[15:0]
Read Data
18
LCD_VSYNC
(RS)
LCD_HSYNC
(R/W)
6
6
LCD_AC_BIAS_EN
(E0)
7
A.
Hitachi mode performs asynchronous operations that do not require an external LCD_MEMORY_CLK. The first
LCD_MEMORY_CLK waveform is only shown as a reference of the internal clock that sequences the other signals.
The second LCD_MEMORY_CLK waveform is shown as E1 because the LCD_MEMORY_CLK signal is used to
implement the E1 function in Hitachi mode.
Figure 7-74. Data Read in Hitachi Mode
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W_HOLD
(1−15)
1
W_SU
(0−31)
W_STROBE
(1−63)
2
3
W_HOLD
(1−15)
W_SU
(0−31)
CS_DELAY
(0−3)
W_STROBE
(1−63)
CS_DELAY
(0−3)
LCD_MEMORY_CLK
(MCLK) Sync Mode
19
6
6
6
6
4
5
LCD_MEMORY_CLK
(CS1) Async Mode
7
4
LCD_DATA[15:0]
5
Write Address
Write Data
20
6
6
6
6
10
10
LCD_AC_BIAS_EN
(CS0)
7
8
8
LCD_VSYNC
(ALE)
9
10
10
LCD_HSYNC
(DIR)
11
12
12
12
12
LCD_PCLK
(EN)
A.
13
Motorola mode can be configured to perform asynchronous operations or synchronous operations. When configured
in asynchronous mode, LCD_MEMORY_CLK is not required, so it performs the CS1 function. When configured in
synchronous mode, LCD_MEMORY_CLK performs the MCLK function. LCD_MEMORY_CLK is also shown as a
reference of the internal clock that sequences the other signals.
Figure 7-75. Micro-Interface Graphic Display Motorola Write
196
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R_SU
(0−31)
W_HOLD
(1−15)
1
W_SU
(0−31)
2
3
W_STROBE
(1−63)
R_STROBE
(1−63)
CS_DELAY
(0−3)
R_HOLD
(1−15)
CS_DELAY
(0−3)
LCD_MEMORY_CLK
(MCLK) Sync Mode
19
6
6
6
6
LCD_MEMORY_CLK
(CS1) Async Mode
7
4
LCD_DATA[15:0]
5
16
14
17
15
Write Address
18
20
6
6
Read
Data
6
6
LCD_AC_BIAS_EN
(CS0)
7
8
8
LCD_VSYNC
(ALE)
9
10
10
LCD_HSYNC
(DIR)
11
12
12
12
12
LCD_PCLK
(EN)
A.
13
Motorola mode can be configured to perform asynchronous operations or synchronous operations. When configured
in asynchronous mode, LCD_MEMORY_CLK is not required, so it performs the CS1 function. When configured in
synchronous mode, LCD_MEMORY_CLK performs the MCLK function. LCD_MEMORY_CLK is also shown as a
reference of the internal clock that sequences the other signals.
Figure 7-76. Micro-Interface Graphic Display Motorola Read
Peripheral Information and Timings
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R_SU
(0−31)
1
2
3
R_STROBE
(1−63)
R_HOLD
(1−15)
CS_DELAY
(0−3)
LCD_MEMORY_CLK
(MCLK) Sync Mode
19
6
6
LCD_MEMORY_CLK
(CS1) Async Mode
7
14
16
17
15
LCD_DATA[15:0]
Read
Status
18
6
6
LCD_AC_BIAS_EN
(CS0)
7
8
8
LCD_VSYNC
(ALE)
9
LCD_HSYNC
(DIR)
12
12
LCD_PCLK
(EN)
13
A.
Motorola mode can be configured to perform asynchronous operations or synchronous operations. When configured
in asynchronous mode, LCD_MEMORY_CLK is not required, so it performs the CS1 function. When configured in
synchronous mode, LCD_MEMORY_CLK performs the MCLK function. LCD_MEMORY_CLK is also shown as a
reference of the internal clock that sequences the other signals.
Figure 7-77. Micro-Interface Graphic Display Motorola Status
198
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W_HOLD
(1−15)
1
W_SU
(0−31)
2
3
W_HOLD
(1−15)
W_SU
(0−31)
W_STROBE
(1−63)
CS_DELAY
(0−3)
W_STROBE
(1−63)
CS_DELAY
(0−3)
LCD_MEMORY_CLK
(MCLK) Sync Mode
19
6
6
6
6
5
4
5
LCD_MEMORY_CLK
(CS1) Async Mode
7
4
LCD_DATA[15:0]
Write Address
Write Data
20
6
6
6
6
LCD_AC_BIAS_EN
(CS0)
7
8
8
LCD_VSYNC
(ALE)
9
10
10
10
10
LCD_HSYNC
(WS)
11
LCD_PCLK
(RS)
A.
Intel mode can be configured to perform asynchronous operations or synchronous operations. When configured in
asynchronous mode, LCD_MEMORY_CLK is not required, so it performs the CS1 function. When configured in
synchronous mode, LCD_MEMORY_CLK performs the MCLK function. LCD_MEMORY_CLK is also shown as a
reference of the internal clock that sequences the other signals.
Figure 7-78. Micro-Interface Graphic Display Intel Write
Peripheral Information and Timings
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R_SU
(0−31)
W_HOLD
(1−15)
1
W_SU
(0−31)
W_STROBE
(1−63)
2
3
R_STROBE
(1−63)
CS_DELAY
(0−3)
R_HOLD
(1−15)
CS_DELAY
(0−3)
LCD_MEMORY_CLK
(MCLK) Sync Mode
6
6
19
6
6
LCD_MEMORY_CLK
(CS1) Async Mode
7
4
LCD_DATA[15:0]
5
16
14
17
15
Write Address
18
20
6
6
Read
Data
6
6
LCD_AC_BIAS_EN
(CS0)
7
8
8
LCD_VSYNC
(ALE)
9
10
10
LCD_HSYNC
(WS)
11
12
12
LCD_PCLK
(RS)
A.
13
Intel mode can be configured to perform asynchronous operations or synchronous operations. When configured in
asynchronous mode, LCD_MEMORY_CLK is not required, so it performs the CS1 function. When configured in
synchronous mode, LCD_MEMORY_CLK performs the MCLK function. LCD_MEMORY_CLK is also shown as a
reference of the internal clock that sequences the other signals.
Figure 7-79. Micro-Interface Graphic Display Intel Read
200
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R_SU
(0−31)
1
2
3
R_STROBE
(1−63)
R_HOLD
(1−15)
CS_DELAY
(0−3)
LCD_MEMORY_CLK
(MCLK) Sync Mode
19
6
6
LCD_MEMORY_CLK
(CS1) Async Mode
7
14
16
17
15
LCD_DATA[15:0]
Read
Status
18
6
6
LCD_AC_BIAS_EN
(CS0)
7
8
8
LCD_VSYNC
(ALE)
9
LCD_HSYNC
(WS)
12
12
LCD_PCLK
(RS)
13
A.
Intel mode can be configured to perform asynchronous operations or synchronous operations. When configured in
asynchronous mode, LCD_MEMORY_CLK is not required, so it performs the CS1 function. When configured in
synchronous mode, LCD_MEMORY_CLK performs the MCLK function. LCD_MEMORY_CLK is also shown as a
reference of the internal clock that sequences the other signals.
Figure 7-80. Micro-Interface Graphic Display Intel Status
Peripheral Information and Timings
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7.10.2 LCD Raster Mode
Table 7-76. Switching Characteristics for LCD Raster Mode
(see Figure 7-82 through Figure 7-85)
NO.
PARAMETER
OPP50
MIN
OPP100
MAX
MIN
15.8
MAX
7.9
UNIT
1
tc(LCD_PCLK)
Cycle time, pixel clock
2
tw(LCD_PCLKH)
Pulse duration, pixel clock high
0.45tc
0.55tc
0.45tc
0.55tc
ns
3
tw(LCD_PCLKL)
Pulse duration, pixel clock low
0.45tc
0.55tc
0.45tc
0.55tc
ns
4
td(LCD_PCLK-LCD_DATAV)
Delay time, LCD_PCLK to LCD_DATA[23:0] valid
(write)
1.9
ns
5
td(LCD_PCLK-LCD_DATAI)
Delay time, LCD_PCLK to LCD_DATA[23:0] invalid
(write)
6
td(LCD_PCLK-LCD_AC_BIAS_EN) Delay time, LCD_PCLK to LCD_AC_BIAS_EN
7
tt(LCD_AC_BIAS_EN)
Transition time, LCD_AC_BIAS_EN
8
td(LCD_PCLK-LCD_VSYNC)
Delay time, LCD_PCLK to LCD_VSYNC
9
tt(LCD_VSYNC)
Transition time, LCD_VSYNC
10
td(LCD_PCLK-LCD_HSYNC)
Delay time, LCD_PCLK to LCD_HSYNC
11
tt(LCD_HSYNC)
Transition time, LCD_HSYNC
12
tt(LCD_PCLK)
13
tt(LCD_DATA)
3.0
–3.0
ns
–1.7
–3.0
3.0
ns
–1.7
1.9
ns
0.5
2.4
0.5
2.4
ns
–3.0
3.0
–1.7
1.9
ns
0.5
2.4
0.5
2.4
ns
–3.0
3.0
–1.7
1.9
ns
0.5
2.4
0.5
2.4
ns
Transition time, LCD_PCLK
0.5
2.4
0.5
2.4
ns
Transition time, LCD_DATA
0.5
2.4
0.5
2.4
ns
Frame-to-frame timing is derived through the following parameters in the LCD (RASTER_TIMING_1)
register:
• Vertical front porch (VFP)
• Vertical sync pulse width (VSW)
• Vertical back porch (VBP)
• Lines per panel (LPP_B10 + LPP)
Line-to-line timing is derived through the following parameters in the LCD (RASTER_TIMING_0) register:
• Horizontal front porch (HFP)
• Horizontal sync pulse width (HSW)
• Horizontal back porch (HBP)
• Pixels per panel (PPLMSB + PPLLSB)
LCD_AC_BIAS_EN timing is derived through the following parameter in the LCD (RASTER_TIMING_2)
register:
• AC bias frequency (ACB)
The display format produced in raster mode is shown in Figure 7-81. An entire frame is delivered one line
at a time. The first line delivered starts at data pixel (1, 1) and ends at data pixel (P, 1). The last line
delivered starts at data pixel (1, L) and ends at data pixel (P, L). The beginning of each new frame is
denoted by the activation of I/O signal LCD_VSYNC. The beginning of each new line is denoted by the
activation of I/O signal LCD_HSYNC.
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Data Pixels (From 1 to P)
1, 1
2, 1
1, 2
2, 2
P−2,
1
3, 1
P−1,
1
P, 1
P−1,
2
P, 2
1, 3
Data Lines (From 1 to L)
P, 3
LCD
1,
L−2
P,
L−2
1,
L−1
2,
L−1
1, L
2, L
P−2,
L
3, L
P−1,
L−1
P,
L−1
P−1,
L
P, L
Figure 7-81. LCD Raster-Mode Display Format
Peripheral Information and Timings
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Frame Time
VBP
(0 to 255)
VSW
(1 to 64)
Line
Time
LPP_B10 + LPP
VFP
(1 to 2048)
(0 to 255)
VSW
(1 to 64)
LCD_HSYNC
LCD_VSYNC
LCD_DATA[23:0]
1, 1
P, 1
1, 2
P, 2
1, L-1
P, L-1
1, L
P, L
LCD_AC_BIAS_EN
(ACTVID)
10
10
LCD_HSYNC
11
LCD_PCLK
LCD_DATA[23:0]
1, 1
2, 1
1, 2
P, 1
2, 2
P, 2
LCD_AC_BIAS_EN
(ACTVID)
PPLMSB + PPLLSB
HFP
HSW
HBP
PPLMSB + PPLLSB
16 × (1 to 2048)
(1 to 256)
(1 to 64)
(1 to 256)
16 × (1 to 2048)
Line 1
Line 2
Figure 7-82. LCD Raster-Mode Active
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Frame Time
VBP = 0
VFP = 0
VSW = 1
LPP_B10 + LPP
(1 to 2048)
Line
Time
LCD_HSYNC
LCD_VSYNC
1, L
Data
LCD_DATA[7:0]
1, L:
P, L
1, 1:
P, 1
1, 2:
P, 2
1, 3:
P, 3
1, 4:
P, 4
1, 5:
P, 5
1, 6:
P, 6
1, L
P, L
1, L−1
P, L−1
1, L−4
P, L−4
1, L−3
P, L−3
1, L−2
P, L−2
1, 1
P, 1
1, 2
P, 2
1, L−1
P, L−1
LCD_AC_BIAS_EN
ACB
ACB
(0 to 255)
(0 to 255)
10
10
LCD_HSYNC
11
LCD_PCLK
LCD_DATA[7:0]
A.
1, 5
P, 5
2, 5
1, 6
2, 6
P, 6
PPLMSB + PPLLSB
HFP
HSW
HBP
PPLMSB + PPLLSB
16 x (1 to 2048)
(1 to 256)
(1 to 64)
(1 to 256)
16 x (1 to 2048)
Line 6
Line 5
The dashed portion of LCD_PCLK is only shown as a reference of the internal clock that sequences the other signals.
Figure 7-83. LCD Raster-Mode Passive
Peripheral Information and Timings
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6
LCD_AC_BIAS_EN
7
8
LCD_VSYNC
9
10
10
LCD_HSYNC
11
1
2
3
LCD_PCLK
(passive mode)
5
4
LCD_DATA[7:0]
(passive mode)
1, L
2, L
P, L
1, 1
2, 1
P, 1
1
2
3
LCD_PCLK
(active mode)
5
4
LCD_DATA[23:0]
(active mode)
1, L
VBP = 0
VFP = 0
VWS = 1
2, L
P, L
PPLMSB + PPLLSB
16 x (1 to 2048)
HFP
(1 to 256)
HSW
(1 to 64)
HBP
(1 to 256)
Line L
A.
PPLMSB + PPLLSB
16 x (1 to 2048)
Line 1 (Passive Only)
The dashed portion of LCD_PCLK is only shown as a reference of the internal clock that sequences the other signals.
Figure 7-84. LCD Raster-Mode Control Signal Activation
206
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6
LCD_AC_BIAS_EN
8
LCD_VSYNC
10
10
LCD_HSYNC
11
1
2
3
LCD_PCLK
(passive mode)
4
LCD_D[7:0]
(passive mode)
1, 1
P, 1
2, 1
1, 2
2, 2
1, 1
2, 1
5
P, 2
1
2
3
LCD_PCLK
(active mode)
4
LCD_DATA[23:0]
(active mode)
VBP = 0
VFP = 0
VWS = 1
PPLMSB + PPLLSB
16 x (1 to 2048)
HFP
(1 to 256)
HSW
(1 to 64)
HBP
(1 to 256)
PPLMSB + PPLLSB
Line 1
A.
5
P, 1
16 x (1 to 2048)
Line 1 for active
Line 2 for passive
The dashed portion of LCD_PCLK is only shown as a reference of the internal clock that sequences the other signals.
Figure 7-85. LCD Raster-Mode Control Signal Deactivation
Peripheral Information and Timings
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7.11 Multichannel Audio Serial Port (McASP)
The multichannel audio serial port (McASP) functions as a general-purpose audio serial port optimized for
the needs of multichannel audio applications. The McASP is useful for time-division multiplexed (TDM)
stream, Inter-Integrated Sound (I2S) protocols, and inter-component digital audio interface transmission
(DIT).
7.11.1 McASP Device-Specific Information
The device includes two multichannel audio serial port (McASP) interface peripherals (McASP0 and
McASP1). The McASP module consists of a transmit and receive section. These sections can operate
completely independently with different data formats, separate master clocks, bit clocks, and frame syncs
or, alternatively, the transmit and receive sections may be synchronized. The McASP module also
includes shift registers that may be configured to operate as either transmit data or receive data.
The transmit section of the McASP can transmit data in either a time-division-multiplexed (TDM)
synchronous serial format or in a digital audio interface (DIT) format where the bit stream is encoded for
SPDIF, AES-3, IEC-60958, CP-430 transmission. The receive section of the McASP peripheral supports
the TDM synchronous serial format.
The McASP module can support one transmit data format (either a TDM format or DIT format) and one
receive format at a time. All transmit shift registers use the same format and all receive shift registers use
the same format; however, the transmit and receive formats need not be the same. Both the transmit and
receive sections of the McASP also support burst mode, which is useful for nonaudio data (for example,
passing control information between two devices).
The McASP peripheral has additional capability for flexible clock generation and error detection/handling,
as well as error management.
The device McASP0 and McASP1 modules have up to four serial data pins each. The McASP FIFO size
is 256 bytes and two DMA and two interrupt requests are supported. Buffers are used transparently to
better manage DMA, which can be leveraged to manage data flow more efficiently.
For more detailed information on and the functionality of the McASP peripheral, see the Multichannel
Audio Serial Port (McASP) section of the AM335x and AMIC110 Sitara Processors Technical Reference
Manual.
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7.11.2 McASP Electrical Data and Timing
Table 7-77. McASP Timing Conditions
PARAMETER
MIN
TYP
MAX
UNIT
Input Conditions
tR
Input signal rise time
1(1)
4(1)
ns
tF
Input signal fall time
1(1)
4(1)
ns
15
30
pF
Output Condition
CLOAD
Output load capacitance
(1) Except when specified otherwise.
Table 7-78. Timing Requirements for McASP(1)
(see Figure 7-86)
OPP100
NO.
MIN
1
tc(AHCLKRX)
Cycle time, McASP[x]_AHCLKR and
McASP[x]_AHCLKX
2
tw(AHCLKRX)
Pulse duration, McASP[x]_AHCLKR and
McASP[x]_AHCLKX high or low
3
tc(ACLKRX)
Cycle time, McASP[x]_ACLKR and
McASP[x]_ACLKX
4
tw(ACLKRX)
Pulse duration, McASP[x]_ACLKR and
McASP[x]_ACLKX high or low
5
tsu(AFSRXACLKRX)
6
th(ACLKRXAFSRX)
Setup time, McASP[x]_AFSR and
McASP[x]_AFSX input valid before
McASP[x]_ACLKR and
McASP[x]_ACLKX
Hold time, McASP[x]_AFSR and
McASP[x]_AFSX input valid after
McASP[x]_ACLKR and
McASP[x]_ACLKX
7
tsu(AXR-ACLKRX)
8
th(ACLKRX-AXR)
MAX
UNIT
40
ns
0.5P - 2.5(2)
0.5P - 2.5(2)
ns
20
40
ns
0.5R - 2.5(3)
0.5R - 2.5(3)
ns
11.5
15.5
ACLKR and
ACLKX ext in
4
6
ACLKR and
ACLKX ext out
4
6
-1
-1
ACLKR and
ACLKX ext in
0.4
0.4
ACLKR and
ACLKX ext out
0.4
0.4
11.5
15.5
ACLKR and
ACLKX ext in
4
6
ACLKR and
ACLKX ext out
4
6
-1
-1
ACLKR and
ACLKX ext in
0.4
0.4
ACLKR and
ACLKX ext out
0.4
0.4
ACLKR and
ACLKX int
ACLKR and
ACLKX int
ACLKR and
ACLKX int
Hold time, McASP[x]_AXR input
valid after McASP[x]_ACLKR and
McASP[x]_ACLKX
MIN
20
ACLKR and
ACLKX int
Setup time, McASP[x]_AXR input
valid before McASP[x]_ACLKR and
McASP[x]_ACLKX
OPP50
MAX
ns
ns
ns
ns
(1) ACLKR internal: ACLKRCTL.CLKRM = 1, PDIR.ACLKR = 1
ACLKR external input: ACLKRCTL.CLKRM = 0, PDIR.ACLKR = 0
ACLKR external output: ACLKRCTL.CLKRM = 0, PDIR.ACLKR = 1
ACLKX internal: ACLKXCTL.CLKXM = 1, PDIR.ACLKX = 1
ACLKX external input: ACLKXCTL.CLKXM = 0, PDIR.ACLKX = 0
ACLKX external output: ACLKXCTL.CLKXM = 0, PDIR.ACLKX = 1
(2) P = McASP[x]_AHCLKR and McASP[x]_AHCLKX period in nanoseconds (ns).
(3) R = McASP[x]_ACLKR and McASP[x]_ACLKX period in ns.
Peripheral Information and Timings
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2
1
2
McASP[x]_ACLKR/X (Falling Edge Polarity)
McASP[x]_AHCLKR/X (Rising Edge Polarity)
4
4
3
McASP[x]_ACLKR/X (CLKRP = CLKXP = 0)
McASP[x]_ACLKR/X (CLKRP = CLKXP = 1)
(A)
(B)
6
5
McASP[x]_AFSR/X (Bit Width, 0 Bit Delay)
McASP[x]_AFSR/X (Bit Width, 1 Bit Delay)
McASP[x]_AFSR/X (Bit Width, 2 Bit Delay)
McASP[x]_AFSR/X (Slot Width, 0 Bit Delay)
McASP[x]_AFSR/X (Slot Width, 1 Bit Delay)
McASP[x]_AFSR/X (Slot Width, 2 Bit Delay)
8
7
McASP[x]_AXR[x] (Data In/Receive)
A.
B.
For CLKRP = CLKXP =
receiver is configured for
For CLKRP = CLKXP =
receiver is configured for
A0 A1
A30 A31 B0 B1
B30 B31 C0 C1 C2 C3
0, the McASP transmitter is configured for rising edge (to shift data out) and the McASP
falling edge (to shift data in).
1, the McASP transmitter is configured for falling edge (to shift data out) and the McASP
rising edge (to shift data in).
C31
Figure 7-86. McASP Input Timing
210
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Table 7-79. Switching Characteristics for McASP(1)
(see Figure 7-87)
NO.
OPP100
PARAMETER
MIN
9
tc(AHCLKRX)
Cycle time, McASP[x]_AHCLKR and
McASP[x]_AHCLKX
10
tw(AHCLKRX)
Pulse duration, McASP[x]_AHCLKR and
McASP[x]_AHCLKX high or low
11
tc(ACLKRX)
Cycle time, McASP[x]_ACLKR and
McASP[x]_ACLKX
12
tw(ACLKRX)
Pulse duration, McASP[x]_ACLKR and
McASP[x]_ACLKX high or low
Delay time, McASP[x]_ACLKR and
McASP[x]_ACLKX transmit edge to
McASP[x]_AFSR and
McASP[x]_AFSX output valid
13
14
td(ACLKRX-AFSRX)
td(ACLKX-AXR)
Delay time, McASP[x]_ACLKR and
McASP[x]_ACLKX transmit edge to
McASP[x]_AFSR and
McASP[x]_AFSX output valid with
Pad Loopback
Delay time, McASP[x]_ACLKX
transmit edge to McASP[x]_AXR
output valid
Delay time, McASP[x]_ACLKX
transmit edge to McASP[x]_AXR
output valid with Pad Loopback
Disable time, McASP[x]_ACLKX
transmit edge to McASP[x]_AXR
output high impedance
15
tdis(ACLKX-AXR)
Disable time, McASP[x]_ACLKX
transmit edge to McASP[x]_AXR
output high impedance with pad
loopback
OPP50
MAX
MIN
MAX
UNIT
20(2)
40
ns
0.5P – 2.5(3)
0.5P – 2.5(3)
ns
20
40
ns
0.5P – 2.5(3)
0.5P – 2.5(3)
ns
ACLKR and
ACLKX int
0
6
0
6
ACLKR and
ACLKX ext in
2
13.5
2
18
ns
ACLKR and
ACLKX ext
out
2
13.5
2
18
ACLKX int
0
6
0
6
ACLKX ext in
2
13.5
2
18
ns
ACLKX ext
out
2
13.5
2
18
ACLKX int
0
6
0
6
ACLKX ext in
2
13.5
2
18
ns
ACLKX ext
out
2
13.5
2
18
(1) ACLKR internal: ACLKRCTL.CLKRM = 1, PDIR.ACLKR = 1
ACLKR external input: ACLKRCTL.CLKRM = 0, PDIR.ACLKR = 0
ACLKR external output: ACLKRCTL.CLKRM = 0, PDIR.ACLKR = 1
ACLKX internal: ACLKXCTL.CLKXM = 1, PDIR.ACLKX = 1
ACLKX external input: ACLKXCTL.CLKXM = 0, PDIR.ACLKX = 0
ACLKX external output: ACLKXCTL.CLKXM = 0, PDIR.ACLKX = 1
(2) 50 MHz
(3) P = AHCLKR and AHCLKX period.
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10
10
9
McASP[x]_ACLKR/X (Falling Edge Polarity)
McASP[x]_AHCLKR/X (Rising Edge Polarity)
12
11
McASP[x]_ACLKR/X (CLKRP = CLKXP = 1)
McASP[x]_ACLKR/X (CLKRP = CLKXP = 0)
12
(A)
(B)
13
13
13
13
McASP[x]_AFSR/X (Bit Width, 0 Bit Delay)
McASP[x]_AFSR/X (Bit Width, 1 Bit Delay)
McASP[x]_AFSR/X (Bit Width, 2 Bit Delay)
McASP[x]_AFSR/X (Slot Width, 0 Bit Delay)
13
13
13
McASP[x]_AFSR/X (Slot Width, 1 Bit Delay)
McASP[x]_AFSR/X (Slot Width, 2 Bit Delay)
McASP[x]_AXR[x] (Data Out/Transmit)
14
15
A0
A.
B.
For CLKRP = CLKXP =
receiver is configured for
For CLKRP = CLKXP =
receiver is configured for
A1
A30 A31 B0
B1
B30 B31 C0
C1 C2 C3
C31
1, the McASP transmitter is configured for falling edge (to shift data out) and the McASP
rising edge (to shift data in).
0, the McASP transmitter is configured for rising edge (to shift data out) and the McASP
falling edge (to shift data in).
Figure 7-87. McASP Output Timing
212
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7.12 Multichannel Serial Port Interface (McSPI)
For more information, see the Multichannel Serial Port Interface (McSPI) section of the AM335x and
AMIC110 Sitara Processors Technical Reference Manual.
7.12.1 McSPI Electrical Data and Timing
The following timings are applicable to the different configurations of McSPI in master or slave mode for
any McSPI and any channel (n).
7.12.1.1 McSPI—Slave Mode
Table 7-80. McSPI Timing Conditions – Slave Mode
PARAMETER
MIN
MAX
UNIT
Input Conditions
tr
Input signal rise time
5
ns
tf
Input signal fall time
5
ns
20
pF
Output Condition
Cload
Output load capacitance
Table 7-81. Timing Requirements for McSPI Input Timings—Slave Mode
(see Figure 7-88)
OPP100
NO.
MIN
OPP50
MAX
MAX
tc(SPICLK)
Cycle time, SPI_CLK
2
tw(SPICLKL)
Typical pulse duration, SPI_CLK low
0.5P –
3.12(1)
0.5P +
3.12(1)
0.5P –
3.12(1)
0.5P +
3.12(1)
ns
3
tw(SPICLKH)
Typical pulse duration, SPI_CLK high
0.5P –
3.12(1)
0.5P +
3.12(1)
0.5P –
3.12(1)
0.5P +
3.12(1)
ns
4
tsu(SIMO-SPICLK)
Setup time, SPI_D[x] (SIMO) valid before SPI_CLK
active edge(2)(3)
12.92
12.92
ns
5
th(SPICLK-SIMO)
Hold time, SPI_D[x] (SIMO) valid after SPI_CLK
active edge(2)(3)
12.92
12.92
ns
8
tsu(CS-SPICLK)
Setup time, SPI_CS valid before SPI_CLK first
edge(2)
12.92
12.92
ns
12.92
12.92
ns
th(SPICLK-CS)
(2)
Hold time, SPI_CS valid after SPI_CLK last edge
124.8
UNIT
1
9
62.5
MIN
ns
(1) P = SPI_CLK period.
(2) This timing applies to all configurations regardless of MCSPIX_CLK polarity and which clock edges are used to drive output data and
capture input data.
(3) Pins SPIx_D0 and SPIx_D1 can function as SIMO or SOMI.
Table 7-82. Switching Characteristics for McSPI Output Timings—Slave Mode
(see Figure 7-89)
NO.
PARAMETER
6
td(SPICLK-SOMI)
Delay time, SPI_CLK active edge to
SPI_D[x] (SOMI) transition(1)(2)
7
td(CS-SOMI)
Delay time, SPI_CS active edge to
SPI_D[x] (SOMI) transition(1)(2)
OPP100
OPP50
UNIT
MIN
MAX
MIN
MAX
–4.00
17.12
–4.00
17.12
ns
17.12
ns
17.12
(1) This timing applies to all configurations regardless of MCSPIX_CLK polarity and which clock edges are used to drive output data and
capture input data.
(2) Pins SPIx_D0 and SPIx_D1 can function as SIMO or SOMI.
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PHA=0
EPOL=1
SPI_CS[x] (In)
1
3
8
SPI_SCLK (In)
2
9
POL=0
1
3
2
POL=1
SPI_SCLK (In)
4
4
5
SPI_D[x] (SIMO, In)
5
Bit n-1
Bit n-3
Bit n-2
Bit 0
Bit n-4
PHA=1
EPOL=1
SPI_CS[x] (In)
1
3
8
SPI_SCLK (In)
9
2
POL=0
1
2
3
POL=1
SPI_SCLK (In)
4
5
SPI_D[x] (SIMO, In)
Bit n-1
4
5
Bit n-2
Bit n-3
Bit 1
Bit 0
Figure 7-88. SPI Slave Mode Receive Timing
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PHA=0
EPOL=1
SPI_CS[x] (In)
1
3
8
SPI_SCLK (In)
2
9
POL=0
1
3
2
POL=1
SPI_SCLK (In)
SPI_D[x] (SOMI, Out)
6
7
6
Bit n-1
Bit n-2
Bit n-3
Bit 0
Bit n-4
PHA=1
EPOL=1
SPI_CS[x] (In)
1
3
8
SPI_SCLK (In)
9
2
POL=0
1
2
3
POL=1
SPI_SCLK (In)
6
SPI_D[x] (SOMI, Out)
Bit n-1
6
6
Bit n-2
Bit n-3
6
Bit 1
Bit 0
Figure 7-89. SPI Slave Mode Transmit Timing
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7.12.1.2 McSPI—Master Mode
Table 7-83. McSPI Timing Conditions – Master Mode
LOW LOAD
PARAMETER
HIGH LOAD
MIN
MAX
MIN
MAX
UNIT
Input Conditions
tr
Input signal rise time
8
8
ns
tf
Input signal fall time
8
8
ns
5
25
pF
Output Condition
Cload
Output load capacitance
Table 7-84. Timing Requirements for McSPI Input Timings – Master Mode
(see Figure 7-90)
OPP100
NO.
LOW LOAD
MIN
4
tsu(SOMI-
Setup time, SPI_D[x] (SOMI) valid before
SPI_CLK active edge(1)
SPICLKH)
5
Hold time, SPI_D[x]
(SOMI) valid after
SPI_CLK active edge(1)
th(SPICLKHSOMI)
OPP50
HIGH LOAD
MAX
MIN
LOW LOAD
MAX
MIN
HIGH LOAD
MAX
MIN
2.29
3.02
2.29
3.02
Industrial extended
temperature
(-40°C to 125°C)
7.1
7.1
7.1
7.1
All other
temperature ranges
4.7
4.7
4.7
4.7
UNIT
MAX
ns
ns
(1) Pins SPIx_D0 and SPIx_D1 can function as SIMO or SOMI.
Table 7-85. Switching Characteristics for McSPI Output Timings – Master Mode
(see Figure 7-91)
OPP100
NO.
PARAMETER
LOW LOAD
MIN
1
OPP50
HIGH LOAD
MAX
MIN
MAX
MIN
MIN
tw(SPICLKL)
Typical pulse duration,
SPI_CLK low
0.5P –
1.04(1)
0.5P +
1.04(1)
0.5P –
2.08(1)
0.5P +
2.08(1)
0.5P –
1.04(1)
0.5P +
1.04(1)
0.5P –
2.08(1)
0.5P +
2.08(1)
ns
tw(SPICLKH)
Typical pulse duration,
SPI_CLK high
0.5P –
1.04(1)
0.5P +
1.04(1)
0.5P –
2.08(1)
0.5P +
2.08(1)
0.5P –
1.04(1)
0.5P +
1.04(1)
0.5P –
2.08(1)
0.5P +
2.08(1)
ns
tr(SPICLK)
Rising time, SPI_CLK
3.82
3.82
3.82
3.82
ns
tf(SPICLK)
Falling time, SPI_CLK
3.44
3.44
3.44
3.44
ns
6
td(SPICLK-SIMO)
Delay time, SPI_CLK
active edge to SPI_D[x]
(SIMO) transition(2)
4.62
ns
7
td(CS-SIMO)
Delay time, SPI_CS active
edge to SPI_D[x] (SIMO)
transition(2)
4.62
ns
Mode 1
and 3(3)
A – 2.54(4)
A – 4.2(4)
A – 2.54(4)
ns
td(CS-SPICLK)
Delay time,
SPI_CS active
to SPI_CLK
first edge
A – 4.2(4)
8
Mode 0
and 2(3)
B – 4.2(5)
B – 2.54(5)
B – 4.2(5)
B – 2.54(5)
ns
Delay time,
SPI_CLK last
edge to
SPI_CS
inactive
Mode 1
and 3(3)
B – 4.2(5)
B – 2.54(5)
B – 4.2(5)
B – 2.54(5)
ns
Mode 0
and 2(3)
A – 4.2(4)
A – 2.54(4)
A – 4.2(4)
A – 2.54(4)
ns
9
td(SPICLK-CS)
–3.57
3.57
–4.62
3.57
41.6
UNIT
MAX
Cycle time, SPI_CLK
3
20.8
HIGH LOAD
MAX
tc(SPICLK)
2
20.8
LOW LOAD
4.62
–3.57
4.62
41.6
3.57
–4.62
3.57
ns
(1) P = SPI_CLK period.
(2) Pins SPIx_D0 and SPIx_D1 can function as SIMO or SOMI.
(3) The polarity of SPIx_CLK and the active edge (rising or falling) on which mcspix_simo is driven and mcspix_somi is latched is all
software configurable:
– SPIx_CLK(1) phase programmable with the bit PHA of MCSPI_CH(i)CONF register: PHA = 1 (Modes 1 and 3).
– SPIx_CLK(1) phase programmable with the bit PHA of MCSPI_CH(i)CONF register: PHA = 0 (Modes 0 and 2).
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(4) Case P = 20.8 ns, A = (TCS + 1) × TSPICLKREF (TCS is a bit field of MCSPI_CH(i)CONF register).
Case P > 20.8 ns, A = (TCS + 0.5) × Fratio × TSPICLKREF (TCS is a bit field of MCSPI_CH(i)CONF register).
Note: P = SPI_CLK clock period.
(5) B = (TCS + 0.5) × TSPICLKREF × Fratio (TCS is a bit field of MCSPI_CH(i)CONF register, Fratio: Even ≥ 2).
PHA=0
EPOL=1
SPI_CS[x] (Out)
1
3
8
SPI_SCLK (Out)
9
2
POL=0
1
2
3
POL=1
SPI_SCLK (Out)
4
4
5
SPI_D[x] (SOMI, In)
5
Bit n-1
Bit n-3
Bit n-2
Bit 0
Bit n-4
PHA=1
EPOL=1
SPI_CS[x] (Out)
1
3
8
SPI_SCLK (Out)
9
2
POL=0
1
2
3
POL=1
SPI_SCLK (Out)
4
5
SPI_D[x] (SOMI, In)
Bit n-1
4
5
Bit n-2
Bit n-3
Bit 1
Bit 0
Figure 7-90. SPI Master Mode Receive Timing
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PHA=0
EPOL=1
SPI_CS[x] (Out)
1
3
8
SPI_SCLK (Out)
9
2
POL=0
1
2
3
POL=1
SPI_SCLK (Out)
6
7
SPI_D[x] (SIMO, Out)
Bit n-1
6
Bit n-3
Bit n-2
Bit 0
Bit n-4
PHA=1
EPOL=1
SPI_CS[x] (Out)
1
3
8
SPI_SCLK (Out)
9
2
POL=0
1
2
3
POL=1
SPI_SCLK (Out)
6
SPI_D[x] (SIMO, Out)
Bit n-1
6
Bit n-2
6
Bit n-3
6
Bit 1
Bit 0
Figure 7-91. SPI Master Mode Transmit Timing
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7.13 Multimedia Card (MMC) Interface
For more information, see the Multimedia Card (MMC) section of the AM335x and AMIC110 Sitara
Processors Technical Reference Manual.
7.13.1 MMC Electrical Data and Timing
Table 7-86. MMC Timing Conditions
PARAMETER
MIN
TYP
MAX
UNIT
Input Conditions
tr
Input signal rise time
1
5
ns
tf
Input signal fall time
1
5
ns
3
30
pF
Output Condition
Cload
Output load capacitance
Table 7-87. Timing Requirements for MMC[x]_CMD and MMC[x]_DAT[7:0]
(see Figure 7-92)
1.8-V MODE
NO.
1
2
3
4
MIN
tsu(CMDV-CLKH)
th(CLKH-CMDV)
tsu(DATV-CLKH)
th(CLKH-DATV)
Setup time, MMC_CMD valid before MMC_CLK rising clock edge
Hold time, MMC_CMD valid after
MMC_CLK rising clock edge
Industrial extended
temperature
(–40°C to 125°C)
All other
temperature ranges
Hold time, MMC_DATx valid after
MMC_CLK rising clock edge
All other
temperature ranges
MAX
3.3-V MODE
MIN
4.1
4.1
MMC0-2
3.76
3.76
MMC0
3.76
2.52
MMC1
3.76
3.03
MMC2
3.76
3.0
4.1
4.1
MMC0-2
3.76
3.76
MMC0
3.76
2.52
MMC1
3.76
3.03
MMC2
3.76
3.0
Setup time, MMC_DATx valid before MMC_CLK rising clock edge
Industrial extended
temperature
(–40°C to 125°C)
TYP
TYP
MAX
UNIT
ns
ns
ns
ns
1
2
MMC[x]_CLK (Output)
MMC[x]_CMD (Input)
MMC[x]_DAT[7:0] (Inputs)
3
4
Figure 7-92. MMC[x]_CMD and MMC[x]_DAT[7:0] Input Timing
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Table 7-88. Switching Characteristics for MMC[x]_CLK
(see Figure 7-93)
NO.
STANDARD MODE
PARAMETER
MIN TYP
ƒop(CLK)
Operating frequency, MMC_CLK
tcop(CLK)
Operating period: MMC_CLK
fid(CLK)
Identification mode frequency, MMC_CLK
tcid(CLK)
Identification mode period: MMC_CLK
6
tw(CLKL)
7
5
HIGH-SPEED MODE
MAX
MIN TYP
MAX
24
UNIT
48 MHz
41.7
20.8
ns
400
400
kHz
2500
2500
ns
Pulse duration, MMC_CLK low
(0.5 × P) –
tf(CLK)(1)
(0.5 × P) –
tf(CLK)(1)
ns
tw(CLKH)
Pulse duration, MMC_CLK high
(0.5 × P) –
tr(CLK)(1)
(0.5 × P) –
tr(CLK)(1)
ns
8
tr(CLK)
Rise time, all signals (10% to 90%)
2.2
2.2
ns
9
tf(CLK)
Fall time, all signals (10% to 90%)
2.2
2.2
ns
(1) P = MMC_CLK period
5
6
7
8
9
RMII[x]_REFCLK
(Input)
Figure 7-93. MMC[x]_CLK Timing
Table 7-89. Switching Characteristics for MMC[x]_CMD and MMC[x]_DAT[7:0]—Standard Mode
(see Figure 7-94)
NO.
PARAMETER
OPP100
MIN
OPP50
TYP
MAX
MIN
TYP
MAX
UNIT
10
td(CLKL-CMD)
Delay time, MMC_CLK falling clock
edge to MMC_CMD transition
–4
14
–4
17.5
ns
11
td(CLKL-DAT)
Delay time, MMC_CLK falling clock
edge to MMC_DATx transition
–4
14
–4
17.5
ns
10
MMC[x]_CLK (Output)
MMC[x]_CMD (Output)
MMC[x]_DAT[7:0] (Outputs)
11
Figure 7-94. MMC[x]_CMD and MMC[x]_DAT[7:0] Output Timing—Standard Mode
220
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Table 7-90. Switching Characteristics for MMC[x]_CMD and MMC[x]_DAT[7:0]—High-Speed Mode
(see Figure 7-95)
NO.
12
PARAMETER
td(CLKLCMD)
13
td(CLKL-DAT)
OPP100
MIN
TYP
OPP50
MAX
MIN
TYP
MAX
UNIT
Delay time, MMC_CLK rising clock edge to
MMC_CMD transition
3
14
3
17.5
ns
Delay time, MMC_CLK rising clock edge to
MMC_DATx transition
3
14
3
17.5
ns
12
MMC[x]_CLK (Output)
MMC[x]_CMD (Output)
MMC[x]_DAT[7:0] (Outputs)
13
Figure 7-95. MMC[x]_CMD and MMC[x]_DAT[7:0] Output Timing—High-Speed Mode
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7.14 Programmable Real-Time Unit Subsystem and Industrial Communication Subsystem
(PRU-ICSS)
For more information, see the Programmable Real-Time Unit Subsystem and Industrial Communication
Subsystem Interface (PRU-ICSS) section of the AM335x and AMIC110 Sitara Processors Technical
Reference Manual.
7.14.1 Programmable Real-Time Unit (PRU-ICSS PRU)
Table 7-91. PRU-ICSS PRU Timing Conditions
PARAMETER
MIN
MAX
UNIT
Output Condition
Cload
Capacitive load for each bus line
30
pF
MAX
UNIT
7.14.1.1 PRU-ICSS PRU Direct Input/Output Mode Electrical Data and Timing
Table 7-92. PRU-ICSS PRU Timing Requirements - Direct Input Mode
(see Figure 7-96)
NO.
1
2
3
(1)
(2)
MIN
tw(GPI)
Pulse width, GPI
tr(GPI)
Rise time, GPI
tf(GPI)
Fall time, GPI
2 × P (1)
Internal skew between GPI[n:0] signals (2)
tsk(GPI)
ns
1.00
3.00
ns
1.00
3.00
ns
PRU0
1.00
PRU1
3.00
ns
P = L3_CLK (PRU-ICSS ocp clock) period.
n = 16
2
1
GPI[m:0]
3
Figure 7-96. PRU-ICSS PRU Direct Input Timing
Table 7-93. PRU-ICSS PRU Switching Requirements – Direct Output Mode
(see Figure 7-69)
NO.
1
2
3
(1)
(2)
PARAMETER
MIN
UNIT
tw(GPO)
Pulse width, GPO
tr(GPO)
Rise time, GPO
1.00
3.00
ns
tf(GPO)
Fall time, GPO
1.00
3.00
ns
tsk(GPO)
2×P
MAX
(1)
Internal skew between GPO[n:0] signals (2)
ns
PRU0
1.00
PRU1
5.00
ns
P = L3_CLK (PRU-ICSS ocp clock) period
n = 15
1
2
GPO[n:0]
3
Figure 7-97. PRU-ICSS PRU Direct Output Timing
222
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7.14.1.2 PRU-ICSS PRU Parallel Capture Mode Electrical Data and Timing
Table 7-94. PRU-ICSS PRU Timing Requirements - Parallel Capture Mode
(see Figure 7-98 and Figure 7-99)
NO.
MIN
MAX
UNIT
1
tc(CLOCKIN)
Cycle time, CLOCKIN
20.00
ns
2
tw(CLOCKIN_L)
Pulse duration, CLOCKIN low
10.00
ns
3
tw(CLOCKIN_H)
Pulse duration, CLOCKIN high
10.00
ns
4
tr(CLOCKIN)
Rising time, CLOCKIN
1.00
3.00
ns
5
tf(CLOCKIN)
Falling time, CLOCKIN
1.00
3.00
ns
6
tsu(DATAIN-CLOCKIN)
Setup time, DATAIN valid before CLOCKIN
5.00
ns
7
th(CLOCKIN-DATAIN)
Hold time, DATAIN valid after CLOCKIN
0.00
ns
tr(DATAIN)
Rising time, DATAIN
1.00
3.00
ns
tf(DATAIN)
Falling time, DATAIN
1.00
3.00
ns
MAX
UNIT
8
1
3
5
4
2
CLOCKIN
DATAIN
7
6
8
Figure 7-98. PRU-ICSS PRU Parallel Capture Timing - Rising Edge Mode
1
3
4
5
2
CLOCKIN
DATAIN
6
7
8
Figure 7-99. PRU-ICSS PRU Parallel Capture Timing - Falling Edge Mode
7.14.1.3
PRU-ICSS PRU Shift Mode Electrical Data and Timing
Table 7-95. PRU-ICSS PRU Timing Requirements – Shift In Mode
(see Figure 7-100)
NO.
(1)
MIN
1
tc(DATAIN)
Cycle time, DATAIN
10.00
2
tw(DATAIN)
Pulse width, DATAIN
0.45 × P (1)
0.55 × P (1)
ns
ns
3
tr(DATAIN)
Rising time, DATAIN
1.00
3.00
ns
4
tf(DATAIN)
Falling time, DATAIN
1.00
3.00
ns
P = L3_CLK (PRU-ICSS ocp clock) period.
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1
2
3
4
DATAIN
Figure 7-100. PRU-ICSS PRU Shift In Timing
Table 7-96. PRU-ICSS PRU Switching Requirements - Shift Out Mode
(see Figure 7-101)
NO.
MIN
MAX
1
tc(CLOCKOUT)
Cycle time, CLOCKOUT
2
tw(CLOCKOUT)
Pulse width, CLOCKOUT
0.45 × P (1)
0.55 × P (1)
ns
3
tr(CLOCKOUT)
Rising time, CLOCKOUT
1.00
3.00
ns
4
tf(CLOCKOUT)
Falling time, CLOCKOUT
1.00
3.00
ns
5
td(CLOCKOUT-DATAOUT)
Delay time, CLOCKOUT to DATAOUT valid
0.00
3.00
ns
tr(DATAOUT)
Rising time, DATAOUT
1.00
3.00
ns
tf(DATAOUT)
Falling time, DATAOUT
1.00
3.00
ns
MAX
UNIT
6
(1)
10.00
UNIT
ns
P = L3_CLK (PRU-ICSS ocp clock) period.
1
2
3
4
CLOCKOUT
DATAOUT
5
6
Figure 7-101. PRU-ICSS PRU Shift Out Timing
7.14.2
PRU-ICSS EtherCAT (PRU-ICSS ECAT)
Table 7-97. PRU-ICSS ECAT Timing Conditions
PARAMETER
MIN
Output Condition
Cload
Capacitive load for each bus line
30
pF
7.14.2.1 PRU-ICSS ECAT Electrical Data and Timing
Table 7-98. PRU-ICSS ECAT Timing Requirements – Input Validated With LATCH_IN
(see Figure 7-102)
NO.
MIN
MAX
UNIT
1
tw(EDIO_LATCH_IN)
Pulse width, EDIO_LATCH_IN
100.00
2
tr(EDIO_LATCH_IN)
Rising time, EDIO_LATCH_IN
1.00
3.00
ns
3
tf(EDIO_LATCH_IN)
Falling time, EDIO_LATCH_IN
1.00
3.00
ns
4
tsu(EDIO_DATA_IN-
Setup time, EDIO_DATA_IN valid before EDIO_LATCH_IN
active edge
20.00
ns
Hold time, EDIO_DATA_IN valid after EDIO_LATCH_IN active
edge
20.00
ns
EDIO_LATCH_IN)
5
th(EDIO_LATCH_INEDIO_DATA_IN)
224
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Table 7-98. PRU-ICSS ECAT Timing Requirements – Input Validated With LATCH_IN (continued)
(see Figure 7-102)
NO.
6
MIN
MAX
UNIT
tr(EDIO_DATA_IN)
Rising time, EDIO_DATA_IN
1.00
3.00
ns
tf(EDIO_DATA_IN)
Falling time, EDIO_DATA_IN
1.00
3.00
ns
2
3
EDIO_LATCH_IN
1
4
5
EDIO_DATA_IN[7:0]
6
Figure 7-102. PRU-ICSS ECAT Input Validated With LATCH_IN Timing
Table 7-99. PRU-ICSS ECAT Timing Requirements – Input Validated With SYNCx
(see Figure 7-103)
NO.
MIN
MAX
UNIT
1
tw(EDC_SYNCx_OUT)
Pulse width, EDC_SYNCx_OUT
100.00
2
tr(EDC_SYNCx_OUT)
Rising time, EDC_SYNCx_OUT
1.00
3.00
ns
3
tf(EDC_SYNCx_OUT)
Falling time, EDC_SYNCx_OUT
1.00
3.00
ns
4
tsu(EDIO_DATA_IN-
Setup time, EDIO_DATA_IN valid before
EDC_SYNCx_OUT active edge
20.00
ns
Hold time, EDIO_DATA_IN valid after EDC_SYNCx_OUT
active edge
20.00
ns
EDIO_DATA_IN)
tr(EDIO_DATA_IN)
Rising time, EDIO_DATA_IN
1.00
3.00
ns
tf(EDIO_DATA_IN)
Falling time, EDIO_DATA_IN
1.00
3.00
ns
EDC_SYNCx_OUT)
5
6
th(EDC_SYNCx_OUT-
2
ns
3
EDC_SYNCx_OUT
1
4
5
EDIO_DATA_IN[7:0]
6
Figure 7-103. PRU-ICSS ECAT Input Validated With SYNCx Timing
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Table 7-100. PRU-ICSS ECAT Timing Requirements – Input Validated With Start of Frame (SOF)
(see Figure 7-104)
NO.
MIN
MAX
4 × P (1)
5 × P (1)
UNIT
ns
Rising time, EDIO_SOF
1.00
3.00
ns
Falling time, EDIO_SOF
1.00
3.00
ns
1
tw(EDIO_SOF)
Pulse duration, EDIO_SOF
2
tr(EDIO_SOF)
3
tf(EDIO_SOF)
4
tsu(EDIO_DATA_IN-
Setup time, EDIO_DATA_IN valid before EDIO_SOF
active edge
20.00
ns
th(EDIO_SOF-EDIO_DATA_IN)
Hold time, EDIO_DATA_IN valid after EDIO_SOF active
edge
20.00
ns
tr(EDIO_DATA_IN)
Rising time, EDIO_DATA_IN
1.00
3.00
ns
tf(EDIO_DATA_IN)
Falling time, EDIO_DATA_IN
1.00
3.00
ns
MAX
UNIT
EDIO_SOF)
5
6
(1)
P = PRU-ICSS IEP clock source period.
2
3
EDIO_SOF
1
4
5
EDIO_DATA_IN[7:0]
6
Figure 7-104. PRU-ICSS ECAT Input Validated With SOF
Table 7-101. PRU-ICSS ECAT Timing Requirements - LATCHx_IN
(see Figure 7-105)
NO.
MIN
1
tw(EDC_LATCHx_IN)
Pulse duration, EDC_LATCHx_IN
2
tr(EDC_LATCHx_IN)
Rising time, EDC_LATCHx_IN
1.00
3.00
ns
3
tf(EDC_LATCHx_IN)
Falling time, EDC_LATCHx_IN
1.00
3.00
ns
(1)
3×P
(1)
ns
P = PRU-ICSS IEP clock source period.
2
3
EDC_LATCHx_IN
1
Figure 7-105. PRU-ICSS ECAT LATCHx_IN Timing
226
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Table 7-102. PRU-ICSS ECAT Switching Requirements - Digital I/Os
NO.
PARAMETER
MIN
MAX
14 × P (1)
32 × P (1)
ns
Rising time, EDIO_OUTVALID
1.00
3.00
ns
Falling time, EDIO_OUTVALID
1.00
3.00
ns
Delay time, EDIO_OUTVALID to EDIO_DATA_OUT
0.00
(1)
ns
1
tw(EDIO_OUTVALID)
Pulse duration, EDIO_OUTVALID
2
tr(EDIO_OUTVALID)
3
tf(EDIO_OUTVALID)
4
td(EDIO_OUTVALID-
18 × P
UNIT
EDIO_DATA_OUT)
5
tr(EDIO_DATA_OUT)
Rising time, EDIO_DATA_OUT
1.00
3.00
ns
6
tf(EDIO_DATA_OUT)
Falling time, EDIO_DATA_OUT
1.00
3.00
ns
7
tsk(EDIO_DATA_OUT)
EDIO_DATA_OUT skew
8.00
ns
(1)
P = PRU-ICSS IEP clock source period.
7.14.3 PRU-ICSS MII_RT and Switch
Table 7-103. PRU-ICSS MII_RT Switch Timing Conditions
PARAMETER
MIN
TYP
MAX
UNIT
Input Conditions
tR
Input signal rise time
tF
Input signal fall time
1 (1)
3 (1)
ns
(1)
3 (1)
ns
3
20
pF
1
Output Condition
CLOAD
(1)
Output load capacitance
Except when specified otherwise.
7.14.3.1 PRU-ICSS MDIO Electrical Data and Timing
Table 7-104. PRU-ICSS MDIO Timing Requirements – MDIO_DATA
(see Figure 7-106)
NO.
MIN
1
tsu(MDIO-MDC)
Setup time, MDIO valid before MDC high
2
th(MDIO-MDC)
Hold time, MDIO valid from MDC high
TYP
MAX
UNIT
90
ns
0
ns
1
2
MDIO_CLK (Output)
MDIO_DATA (Input)
Figure 7-106. PRU-ICSS MDIO_DATA Timing - Input Mode
Table 7-105. PRU-ICSS MDIO Switching Characteristics - MDIO_CLK
(see Figure 7-107)
NO.
PARAMETER
MIN
TYP
MAX
UNIT
1
tc(MDC)
Cycle time, MDC
400
ns
2
tw(MDCH)
Pulse duration, MDC high
160
ns
3
tw(MDCL)
Pulse duration, MDC low
160
ns
4
tt(MDC)
Transition time, MDC
5
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4
1
3
2
MDIO_CLK
4
Figure 7-107. PRU-ICSS MDIO_CLK Timing
Table 7-106. PRU-ICSS MDIO Switching Characteristics – MDIO_DATA
(see Figure 7-108)
NO.
1
MIN
td(MDC-MDIO)
Delay time, MDC high to MDIO valid
TYP
10
MAX
UNIT
390
ns
1
MDIO_CLK (Output)
MDIO_DATA (Output)
Figure 7-108. PRU-ICSS MDIO_DATA Timing – Output Mode
7.14.3.2 PRU-ICSS MII_RT Electrical Data and Timing
NOTE
In order to guarantee the MII_RT I/O timing values published in the device data manual, the
PRU ocp_clk clock must be configured for 200 MHz (default value) and the TX_CLK_DELAY
bit field in the PRUSS_MII_RT_TXCFG0/1 register must be set to 6 h (non-default value).
Table 7-107. PRU-ICSS MII_RT Timing Requirements – MII_RXCLK
(see Figure 7-109)
10 Mbps
NO.
MIN
TYP
100 Mbps
TYP
MAX
UNIT
MAX
MIN
399.96
400.04
39.996
40.004
ns
1
tc(RX_CLK)
Cycle time, RX_CLK
2
tw(RX_CLKH)
Pulse duration, RX_CLK high
140
260
14
26
ns
3
tw(RX_CLKL)
Pulse duration, RX_CLK low
140
260
14
26
ns
4
tt(RX_CLK)
Transition time, RX_CLK
3
ns
3
4
1
3
2
MII_RXCLK
4
Figure 7-109. PRU-ICSS MII_RXCLK Timing
228
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Table 7-108. PRU-ICSS MII_RT Timing Requirements - MII[x]_TXCLK
(see Figure 7-110)
10 Mbps
NO.
MIN
100 Mbps
TYP
MAX
MIN
TYP
MAX
UNIT
1
tc(TX_CLK)
Cycle time, TX_CLK
399.96
400.04
39.996
40.004
ns
2
tw(TX_CLKH)
Pulse duration, TX_CLK high
140
260
14
26
ns
3
tw(TX_CLKL)
Pulse duration, TX_CLK low
140
260
14
26
ns
4
tt(TX_CLK)
Transition time, TX_CLK
3
ns
3
4
1
3
2
MII_TXCLK
4
Figure 7-110. PRU-ICSS MII_TXCLK Timing
Table 7-109. PRU-ICSS MII_RT Timing Requirements - MII_RXD[3:0], MII_RXDV, and MII_RXER
(see Figure 7-111)
10 Mbps
NO.
1
2
MIN
tsu(RXD-RX_CLK)
Setup time, RXD[3:0] valid before RX_CLK
tsu(RX_DV-RX_CLK)
Setup time, RX_DV valid before RX_CLK
tsu(RX_ER-RX_CLK)
Setup time, RX_ER valid before RX_CLK
th(RX_CLK-RXD)
Hold time RXD[3:0] valid after RX_CLK
th(RX_CLK-RX_DV)
Hold time RX_DV valid after RX_CLK
th(RX_CLK-RX_ER)
Hold time RX_ER valid after RX_CLK
TYP
100 Mbps
MAX
MIN
TYP
MAX
UNIT
8
8
ns
8
8
ns
1
2
MII_MRCLK (Input)
MII_RXD[3:0],
MII_RXDV,
MII_RXER (Inputs)
Figure 7-111. PRU-ICSS MII_RXD[3:0], MII_RXDV, and MII_RXER Timing
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Table 7-110. PRU-ICSS MII_RT Switching Characteristics - MII_TXD[3:0] and MII_TXEN
(see Figure 7-112)
10 Mbps
NO
.
MIN
1
td(TX_CLK-TXD)
Delay time, TX_CLK high to TXD[3:0] valid
td(TX_CLK-TX_EN)
Delay time, TX_CLK to TX_EN valid
TYP
5
100 Mbps
MAX
MIN
25
5
TYP
MAX
UNIT
25
ns
1
MII_TXCLK (input)
MII_TXD[3:0],
MII_TXEN (outputs)
Figure 7-112. PRU-ICSS MII_TXD[3:0], MII_TXEN Timing
7.14.4 PRU-ICSS Universal Asynchronous Receiver Transmitter (PRU-ICSS UART)
Table 7-111. Timing Requirements for PRU-ICSS UART Receive
(see Figure 7-113)
NO.
3
(1)
tw(RX)
Pulse duration, receive start, stop, data bit
MIN
MAX
0.96U (1)
1.05U (1)
UNIT
ns
U = UART baud time = 1/programmed baud rate.
Table 7-112. Switching Characteristics Over Recommended Operating Conditions for PRU-ICSS UART
Transmit
(see Figure 7-113)
NO.
PARAMETER
1
ƒbaud(baud)
Maximum programmable baud rate
2
tw(TX)
Pulse duration, transmit start, stop, data bit
(1)
MIN
MAX
UNIT
0
12
MHz
U – 2 (1)
U + 2 (1)
ns
U = UART baud time = 1/programmed baud rate.
3
2
UART_TXD
Start
Bit
Data Bits
5
4
UART_RXD
Start
Bit
Data Bits
Figure 7-113. PRU-ICSS UART Timing
230
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7.15 Universal Asynchronous Receiver Transmitter (UART)
For more information, see the Universal Asynchronous Receiver Transmitter (UART) section of the
AM335x and AMIC110 Sitara Processors Technical Reference Manual.
7.15.1 UART Electrical Data and Timing
Table 7-113. Timing Requirements for UARTx Receive
(see Figure 7-114)
NO.
3
tw(RX)
Pulse duration, receive start, stop, data bit
MIN
MAX
0.96U(1)
1.05U(1)
UNIT
ns
(1) U = UART baud time = 1/programmed baud rate.
Table 7-114. Switching Characteristics for UARTx Transmit
(see Figure 7-114)
NO.
1
2
PARAMETER
ƒbaud(baud)
tw(TX)
MIN
Maximum programmable baud rate
Pulse duration, transmit start, stop, data bit
U–2
(1)
MAX
UNIT
3.6864
MHz
U+2
(1)
ns
(1) U = UART baud time = 1 / programmed baud rate
2
2
2
UARTx_TXD
Start
Bit
Stop Bit
Data Bits
3
3
UARTx_RXD
Start
Bit
3
Stop Bit
Data Bits
Figure 7-114. UART Timings
Peripheral Information and Timings
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7.15.2 UART IrDA Interface
The IrDA module operates in three different modes:
• Slow infrared (SIR) (≤115.2 kbps)
• Medium infrared (MIR) (0.576 Mbps and 1.152 Mbps)
• Fast infrared (FIR) (4 Mbps).
Figure 7-115 shows the UART IrDA pulse parameters. Table 7-115 and Table 7-116 list the signaling
rates and pulse durations for UART IrDA receive and transmit modes.
Pulse Duration
50%
Pulse Duration
50%
50%
Figure 7-115. UART IrDA Pulse Parameters
Table 7-115. UART IrDA—Signaling Rate and Pulse Duration—Receive Mode
SIGNALING RATE
ELECTRICAL PULSE DURATION
UNIT
MIN
MAX
2.4 kbps
1.41
88.55
µs
9.6 kbps
1.41
22.13
µs
19.2 kbps
1.41
11.07
µs
38.4 kbps
1.41
5.96
µs
57.6 kbps
1.41
4.34
µs
115.2 kbps
1.41
2.23
µs
0.576 Mbps
297.2
518.8
ns
1.152 Mbps
149.6
258.4
ns
4 Mbps (single pulse)
67
164
ns
4 Mbps (double pulse)
190
289
ns
SIR
MIR
FIR
232
Peripheral Information and Timings
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Table 7-116. UART IrDA—Signaling Rate and Pulse Duration—Transmit Mode
SIGNALING RATE
ELECTRICAL PULSE DURATION
UNIT
MIN
MAX
2.4 kbps
78.1
78.1
µs
9.6 kbps
19.5
19.5
µs
19.2 kbps
9.75
9.75
µs
38.4 kbps
4.87
4.87
µs
57.6 kbps
3.25
3.25
µs
115.2 kbps
1.62
1.62
µs
0.576 Mbps
414
419
ns
1.152 Mbps
206
211
ns
4 Mbps (single pulse)
123
128
ns
4 Mbps (double pulse)
248
253
ns
SIR
MIR
FIR
Peripheral Information and Timings
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8 Device and Documentation Support
8.1
Device Nomenclature
To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all
microprocessors (MPUs) and support tools. Each device has one of three prefixes: X, P, or null (no prefix)
(for example, XAM3358AZCE). Texas Instruments recommends two of three possible prefix designators
for its support tools: TMDX and TMDS. These prefixes represent evolutionary stages of product
development from engineering prototypes (TMDX) through fully qualified production devices and tools
(TMDS).
Device development evolutionary flow:
X
Experimental device that is not necessarily representative of the final device's electrical
specifications and may not use production assembly flow.
P
Prototype device that is not necessarily the final silicon die and may not necessarily meet
final electrical specifications.
null
Production version of the silicon die that is fully qualified.
Support tool development evolutionary flow:
TMDX
Development-support product that has not yet completed Texas Instruments internal
qualification testing.
TMDS
Fully-qualified development-support product.
X and P devices and TMDX development-support tools are shipped against the following disclaimer:
"Developmental product is intended for internal evaluation purposes."
Production devices and TMDS development-support tools have been characterized fully, and the quality
and reliability of the device have been demonstrated fully. TI's standard warranty applies.
Predictions show that prototype devices (X or P) have a greater failure rate than the standard production
devices. Texas Instruments recommends that these devices not be used in any production system
because their expected end-use failure rate still is undefined. Only qualified production devices are to be
used.
TI device nomenclature also includes a suffix with the device family name. This suffix indicates the
package type (for example, ZCE), the temperature range (for example, blank is the default commercial
temperature range), and the device speed range, in megahertz (for example, 27 is 275 MHz). Figure 8-1
provides a legend for reading the complete device name for any AM335x device.
For orderable part numbers of AM335x devices in the ZCE and ZCZ package types, see the Package
Option Addendum of this document, ti.com, or contact your TI sales representative.
For additional description of the device nomenclature markings on the die, see the AM335x Sitara
Processors Silicon Errata.
234
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X
AM3358
B
ZCZ
PREFIX
X = Experimental device
Blank = Qualified device
(
)
(
)
(
)
CARRIER TYPE
Blank = Tray
R = Tape and Reel
(A)
DEVICE
ARM Cortex-A8 MPU:
AM3351
AM3352
AM3354
AM3356
AM3357
AM3358
AM3359
DEVICE SPEED RANGE
27 = 275-MHz Cortex-A8
30 = 300-MHz Cortex-A8
50 = 500-MHz Cortex-A8
60 = 600-MHz Cortex-A8
72 = 720-MHz Cortex-A8
80 = 800-MHz Cortex-A8
100 = 1-GHz Cortex-A8
DEVICE REVISION CODE
Blank = silicon revision 1.0
A = silicon revision 2.0
B = silicon revision 2.1
TEMPERATURE RANGE
Blank = 0°C to 90°C (commercial junction temperature)
A = -40°C to 105°C (extended junction temperature)
D = -40°C to 90°C (industrial junction temperature)
T = -40°C to 125°C (industrial extended junction temperature)
(B)
PACKAGE TYPE
ZCE = 298-pin plastic BGA, with Pb-Free solder balls
ZCZ = 324-pin plastic BGA, with Pb-Free solder balls
A.
B.
The AM3358 device shown in this device nomenclature example is one of several valid part numbers for the AM335x
family of devices. For orderable device part numbers, see the Package Option Addendum of this document.
BGA = Ball grid array
Figure 8-1. AM335x Device Nomenclature
8.2
Tools and Software
TI offers an extensive line of development tools. Tools and software to evaluate the performance of the
device, generate code, and develop solutions are listed below.
Design Kits and Evaluation Modules
AM335x Evaluation Module Enables developers to immediately start evaluating the AM335x processor
family (AM3351, AM3352, AM3354, AM3356, AM3358) and begin building applications such
as portable navigation, portable gaming, home/building automation and others.
AM335x Starter Kit Provides a stable and affordable platform to quickly start evaluation of Sitara ARM
Cortex-A8 AM335x Processors (AM3351, AM3352, AM3354, AM3356, AM3358) and
accelerate development for smart appliance, industrial and networking applications. It is a
low-cost development platform based on the ARM Cortex-A8 processor that is integrated
with options such as Dual Gigabit Ethernet, DDR3 and LCD touch screen.
BeagleBone Black Development Board Low-cost, open source, community-supported development
platform for ARM Cortex-A8 processor developers and hobbyists. Boot Linux in under 10seconds and get started on Sitara AM335x ARM Cortex-A8 processor development in less
than 5 minutes with just a single USB cable.
BeagleBone Development Board Low-cost, community-supported development platform for ARM
Cortex-A8 processor developers. Boot Linux in under 10-seconds and get started on Sitara
AM335x ARM Cortex-A8 processor development in less than 5 minutes with just a single
USB cable. For TI-supported hardware platforms, consider the Sitara ARM AM335x Starter
Kit or AM335x Evaluation Module.
Data Concentrator Evaluation Module Based on AM3359 as the main processor and has Power Line
Communication (PLC) Module to support various OFDM PLC communication standards.
TMDSDC3359 also has capability to support multiple interfaces, sub-1GHz and 2.4GHz RF,
Ethernet, RS-232, and RS-485. This evaluation module is ideal development platform for
smart grid infrastructure applications including data concentrator, convergent node of grid
sensor network, and control equipment of power automation.
WiLink™ 8 Dual Band 2.4 & 5 GHz Wi-Fi® + Bluetooth® COM8 Evaluation Module Enables customers
to add both Wi-Fi and Bluetooth to home and building automation, smart energy, gateways,
wireless audio, enterprise, wearables and many more industrial and Internet of Things (IoT)
applications. TI’s WiLink 8 modules are certified and offer high throughput and extended
range along with Wi-Fi and Bluetooth coexistence in a power-optimized design. Drivers for
the Linux and Android high-level operating systems (HLOSs) are available free of charge
Device and Documentation Support
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from TI for the Sitara AM335x microprocessor (Linux and Android version restrictions apply).
WiLink 8 Module 2.4 GHz WiFi + Bluetooth COM8 Evaluation Module Enables customers to add Wi-Fi
and Bluetooth (WL183x module only) to embedded applications based on TI's Sitara
microprocessors. TI’s WiLink 8 Wi-Fi + Bluetooth modules are pre-certified and offer high
throughput and extended range along with Wi-Fi and Bluetooth coexistence (WL183x
modules only) in a power-optimized design. Drivers for the Linux and Android high-level
operating systems (HLOSs) are available free of charge from TI for the Sitara AM335x
microprocessor (Linux and Android version restrictions apply).
TI Designs
EtherCAT Communications Development Platform Allows designers to implement real-time EtherCAT
communications standards in a broad range of industrial automation equipment. It enables
low foot print designs in applications such as industrial automation, factory automation or
industrial communication with minimal external components and with best in class low power
performance.
PROFIBUS Communications Development Platform Allows designers to implement PROFIBUS
communications standards in a broad range of industrial automation equipment. It enables
low foot print designs in applications such as industrial automation, factory automation or
industrial communication with minimal external components and with best in class low power
performance.
Ethernet/IP Communications Development Platform Allows designers to mplement Ethernet/IP
communications standards in a broad range of industrial automation equipment. It enables
low foot print designs in applications such as industrial automation, factory automation or
industrial communication with minimal external components and with best in class low power
performance.
Acontis EtherCAT Master Stack Reference Design Highly portable software stack that can be used on
various embedded platforms. The EC-Master supports the high performane TI Sitara MPUs,
it provides a sophisticated EtherCAT Master solution which customers can use to implement
EtherCAT communication interface boards, EtherCAT based PLC or motion control
applications. The EC-Master architectural design does not require additional tasks to be
scheduled, thus the full stack functionality is available even on an OS less platform such as
TI Starterware suported on AM335x. Due to this architecture combined with the high speed
Ethernet driver it is possible to implement EtherCAT master based applications on the Sitara
platform with short cycle times of 100 microseconds or even below.
Solar Inverter Gateway Development Platform Reference Design Adds communication functions to
solar energy generation systems to enable system monitoring, real-time feedback, system
updates, and more. The TIDEP0044 reference design describes the implementation of a
solar inverter gateway using display, Ethernet, USB, and CAN on the TMDXEVM3358
featuring TI's AM335x processor.
G3 Power Line Communications Data Concentrator on BeagleBone Black Platform
Offers
a
simplified approach for evaluating G3-PLC utilizing Beagle Bone Black powered by the Sitara
AM335x processor. Users can establish a G3-PLC network with one service node. Single
phase coupling is supported.
IEC 61850 Demonstration of Substation Bay Controller on Beaglebone Cape and Starter Kit
Lowcost, simplified implementation of an IEC 61850 Substation Bay Controller is demonstrated
by running the Triangle MicroWorks IEC 61850 stack efficiently on the TI AM335X platform
with a Linux target layer definition. Many different substation automation applications can be
built on top of the AM335X platform and 61850 stack demonstration.
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PRU Real-Time I/O Evaluation Reference Design BeagleBone Black add-on board that allows users get
to know TI’s powerful Programmable Real-Time Unit (PRU) core and basic functionality. The
PRU is a low-latency microcontroller subsystem integrated in the Sitara AM335x and
AM437x family of devices. The PRU core is optimized for deterministic, real-time processing,
direct access to I/Os and ultra-low-latency requirements. With LEDs and push buttons for
GPIO, audio, a temp sensor, optional character display and more, this add-on board includes
schematics, bill of materials (BOM), design files, and design guide to teach the basics of the
PRU.
Smart Home and Energy Gateway Reference Design
Provides
example
implementation
for
measurement, management and communication of energy systems for smart homes and
buildings. This example design is a bridge between different communication interfaces, such
as WiFi, Ethernet, ZigBee or Bluetooth, that are commonly found in residential and
commercial buildings. Since objects in the house and buildings are becoming more and
more connected, the gateway design needs to be flexible to accommodate different RF
standard, since no single RF standard is dominating the market. This example gateway
addresses this problem by supporting existing legacy RF standards (WiFi, Bluetooth) and
newer RF standards (ZigBee, BLE).
Streaming Audio Reference Design Minimizes design time for customers by offering small form factor
hardware and major software components, including streaming protocols and internet radio
services. With this reference design, TI offers a quick and easy transition path to the
AM335x and WiLink8 platform solution. This proven combo solution provides key
advantages in this market category that helps bring your products to the next level.
Software
Processor SDK for AM335X Sitara Processors - Linux and TI-RTOS Support
Unified
software
platform for TI embedded processors providing easy setup and fast out-of-the-box access to
benchmarks and demos. All releases of Processor SDK are consistent across TI’s broad
portfolio, allowing developers to seamlessly reuse and migrate software across devices.
Developing scalable platform solutions has never been easier than with the Processor SDK
and TI’s embedded processor solutions.
G3 Data Concentrator Power-Line Communication Modem G3-PLC standard for narrowband OFDM
Power Line Communications. The data concentrator solution is designed for the head-end
systems which communicate with the end meters (“service node”) in the neighborhood area
network.
PRIME Data Concentrator Power-Line Communication Modem PRIME standard for narrowband
OFDM Power Line Communications. The data concentrator solution is designed for the
head-end systems which communicate with the end meters (“service node”) in the
neighborhood area network.
TI Dual-Mode Bluetooth Stack Comprised of Single-Mode and Dual-Mode offerings implementing the
Bluetooth 4.0 specification. The Bluetooth stack is fully Bluetooth Special Interest Group
(SIG) qualified, certified and royalty-free, provides simple command line sample applications
to speed development, and upon request has MFI capability.
Cryptography for TI Devices Enables encryption, crypto for TI devices. These files contain only
cryptographic modules that were part of a TI software release. For the complete software
release please search ti.com for your device part number, and download the Software
Development Kit (SDK).
Device and Documentation Support
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Development Tools
Clock Tree Tool for Sitara ARM Processors Interactive clock tree configuration software that provides
information about the clocks and modules in Sitara devices.
Code Composer Studio (CCS) Integrated Development Environment (IDE) for Sitara ARM
Processors
Integrated development environment (IDE) that supports TI's Microcontroller and Embedded
Processors portfolio. Code Composer Studio comprises a suite of tools used to develop and
debug embedded applications. It includes an optimizing C/C++ compiler, source code editor,
project build environment, debugger, profiler, and many other features. The intuitive IDE
provides a single user interface taking you through each step of the application development
flow. Familiar tools and interfaces allow users to get started faster than ever before. Code
Composer Studio combines the advantages of the Eclipse software framework with
advanced embedded debug capabilities from TI resulting in a compelling feature-rich
development environment for embedded developers.
Pin Mux Tool Provides a Graphical User Interface for configuring pin multiplexing settings, resolving
conflicts and specifying I/O cell characteristics for TI MPUs. Results are output as C
header/code files that can be imported into software development kits (SDK) or used to
configure customer's custom software. Version 3 of the Pin Mux utility adds the capability of
automatically selecting a mux configuration that satisfies the entered requirements.
Power Estimation Tool (PET) Provides users the ability to gain insight in to the power consumption of
select TI processors. The tool includes the ability for the user to choose multiple application
scenarios and understand the power consumption as well as how advanced power saving
techniques can be applied to further reduce overall power consumption.
Uniflash Standalone Flash Tool for TI Microcontrollers (MCU), Sitara Processors and SimpleLink
devices
Programs on-chip flash memory on TI MCUs and onboard flash memory for Sitara
processors. Uniflash has a GUI, command line, and scripting interface. CCS Uniflash is
available free of charge.
XDS200 USB Debug Probe Connects to the target board via a TI 20-pin connector (with multiple
adapters for TI 14-pin, ARM 10-pin and ARM 20-pin) and to the host PC via USB2.0 High
Speed (480Mbps). It also requires a license of Code Composer Studio IDE running on the
host PC.
XDS560v2 System Trace USB and Ethernet Debug Probe Adds system pin trace in its large external
memory buffer. Available for selected TI devices, this external memory buffer captures
device-level information that allows obtaining accurate bus performance activity and
throughput, as well as power management of core and peripherals. Also, all XDS debug
probes support Core and System Trace in all ARM and DSP processors that feature an
Embedded Trace Buffer (ETB).
XDS560v2 System Trace USB Debug Probe Adds system pin trace in its large external memory buffer.
Available for selected TI devices, this external memory buffer captures device-level
information that allows obtaining accurate bus performance activity and throughput, as well
as power management of core and peripherals. Also, all XDS debug probes support Core
and System Trace in all ARM and DSP processors that feature an Embedded Trace Buffer
(ETB).
238
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Models
AM335x ZCE IBIS Model ZCE package IBIS model
AM335x ZCZ IBIS Model ZCZ package IBIS model
AM335x ZCE Rev. 2.1 BSDL Model ZCE package BSDL model for the revision 2.1 TI F781962A Fixedand Floating-Point DSP with Boundary Scan
AM335x ZCZ Rev. 2.1 BSDL Model ZCZ package BSDL model for the revision 2.1 TI F781962A Fixedand Floating-Point DSP with Boundary Scan
8.3
Documentation Support
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the
upper right corner, click on Alert me to register and receive a weekly digest of any product information that
has changed. For change details, review the revision history included in any revised document.
The current documentation that describes the processor, related peripherals, and other technical collateral
is listed below.
Errata
AM335x Sitara Processors Silicon Errata
Describes the known exceptions to the functional specifications for the AM335x Sitara
Processors.
Application Reports
Processor SDK RTOS Customization: Modifying Board Library to Change UART Instance on
AM335x
Describes the procedure to modify the default UART0 example in the AM335x Processor
SDK RTOS package to enable UART1. On the BeagleBone Black (BBB) P9 header, pins
24(TX) and 26(RX) are connected to UART1. This procedure shows a test to verify that
UART1 is enabled on the BBB.
High-Speed Layout Guidelines As modern bus interface frequencies scale higher, care must be taken in
the printed circuit board (PCB) layout phase of a design to ensure a robust solution.
AM335x Reliability Considerations in PLC Applications Programmable Logic Controllers (PLC) are
used as the main control in an automation system with high- reliability expectations and long
life in harsh environments. Processors used in these applications require an assessment of
performance verses expected power on hours to achieve the optimal performance for the
application.
AM335x Thermal Considerations Discusses the thermal considerations of the AM335x devices. It offers
guidance on analysis of the processor's thermal performance, suggests improvements for an
end system to aid in overcoming some of the existing challenges of producing a good
thermal design, and provides real power/thermal data measured with AM335x EVMs for user
evaluation.
User's Guides
TPS65910Ax User's Guide for AM335x Processors User's Guide A reference for connectivity between
the TPS65910Ax power-management integrated circuit (PMIC) and the AM335x processor.
AM335x and AMIC110 Sitara Processors Technical Reference Manual
Details the integration, the environment, the functional description, and the programming
models for each peripheral and subsystem in the device.
G3 Power Line Communications Data Concentrator on BeagleBone Black Platform Design Guide
Provide the foundation that you need including methodology, testing, and design files to
quickly evaluate and customize the system. TI Designs help you accelerate your time to
market.
Powering the AM335x with the TPS65217x A reference for connectivity between the TPS65217 power
management IC and the AM335x processor.
Powering the AM335x With the TPS650250 Details a power solution for the AM335x application
processor with a TPS650250 Power Management Unit (PMU) or Power Management IC
(PMIC).
Device and Documentation Support
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Selection and Solution Guides
Connected Sensors Building Automation Systems Guide The use of connected sensors has a wide
range of uses in building automation applications, from monitoring human safety and
security, controlling the environment and ambience specified by the comfort preferences of
the end user, or either periodic or continuous data logging of environmental and system data
to detect irregular system conditions.
White Papers
Building Automation for Enhanced Energy And Operational Efficiency Discusses building automation
solutions, focusing on aspects of the Building Control System. TI’s Sitara processors
facilitate intelligent automation of the control systems. The scalable Sitara processor portfolio
offers an opportunity to build a platform solution that also spans beyond Building Control
Systems.
POWERLINK on TI Sitara Processors Supports Ethernet standard features such as cross-traffic, hotplugging and different types of network configurations such as star, ring and mixed
topologies.
EtherNet/IP on TI's Sitara AM335x Processors EtherNet/IP™ (EtherNet/Industrial Protocol) is an
industrial automation networking protocol based on the IEEE 802.3 Ethernet standard that
has dominated the world of IT networking for the past three decades.
PROFINET on TI’s Sitara AM335x Processors To integrate PROFINET into the Sitara AM335x
processor, TI has built upon its programmable realtime unit (PRU) technology to create an
industrial communication sub-system (ICSS).
Profibus on AM335x and AM1810 Sitara ARM Microprocessor PROFIBUS, one of the most used
communication technologies, is installed in more than 35 million industrial nodes worldwide
and is growing at a rate of approximately 10 percent each year.
EtherCAT on Sitara AM335x ARM Cortex-A8 Microprocessors Emerging real-time industrial Ethernet
standard for industrial automation applications, such as input/output (I/O) devices, sensors
and programmable logic controllers (PLCs).
Mainline Linux Ensures Stability and Innovation Enabling and empowering the rapid development of
new functionality starts at the foundational level of the system’s software environment – that
is, at the level of the Linux kernel – and builds upward from there.
Complete Solutions for Next-Generation Wireless Connected Audio Robust, feature-rich and highperformance connectivity technology for Wi-Fi and Bluetooth.
Data Concentrators: The Core of Energy and Data Management With a large install base, it is
essential to establish an automated metering infrastructure (AMI). With automated meter
reading (AMR) measurement, the communication of meter data to the central billing station
will be seamless.
Linaro Speeds Development in TI Linux SDKs Linaro’s software is not a Linux distribution; in fact, it is
distribution neutral. The focus of the organization’s 120 engineers is on optimizing base-level
open-source software in areas that interact directly with the silicon such as multimedia,
graphics, power management, the Linux kernel and booting processes.
Getting Started on TI ARM Embedded Processor Development Beginning with an overview of ARM
technology and available processor platforms, this paper will then explore the fundamentals
of embedded design that influence a system’s architecture and, consequently, impact
processor selection.
Power Optimization Techniques for Energy-Efficient Systems The TI Sitara processor solutions offer
the flexibility to design application-specific systems. The latest Sitara AM335x processors
provide a scalable architecture with speed ranging from 300 MHz to 1 GHz.
The Yocto Project: Changing the Way Embedded Linux Software Solutions are Developed Enabling
complex silicon devices such as SoC with operating firmware and application software can
be a challenge for equipment manufacturers who often are more comfortable with hardware
than software issues.
Smart Thermostats are a Cool Addition to the Connected Home Because of the pervasiveness of
residential broadband connectivity and the explosion in options, the key to the connected
home is – connectivity.
BeagleBone Low-Cost Development Board Provides a Clear Path to Open-source Resources
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Ready-to-use open-source hardware platform for rapid prototyping and firmware and
software development.
Enable Security and Amp Up Chip Performance With Hardware-Accelerated Cryptography
Cryptography is one of several techniques or methodologies that are typically implemented
in contemporary electronic systems to construct a secure perimeter around a device where
information or digital content is being protected.
Gesture Recognition: Enabling Natural Interactions With Electronics Enabling humans and machines
to interface more easily in the home, the automobile, and at work.
Developing Android Applications for ARM Cortex-A8 Cores The flexibility, power, versatility and
ubiquity of the Android operating system (OS) and associated ecosystem have been a boon
to developers of applications for ARM processor cores.
Other Documents
Industrial Communication with Sitara AM335x ARM Cortex-A8 Microprocessors The industry’s first
low- power ARM Cortex-A8 devices to incorporate multiple industrial communication
protocols on a single chip. The six pin-to-pin and software-compatible devices in this
generation of processors, along with industrial hardware development tools, software and
analog complements, provide a total industrial system solution.
Sitara Processors Using the ARM Cortex-A series of cores, are optimized system solutions that go
beyond the core, delivering products that support rich graphics capabilities, LCD displays
and multiple industrial protocols.
Industrial Communication with Sitara AM335x ARM Cortex-A8 Microprocessors Describes the key
features and benefits of multiple, on-chip, production-ready industrial Ethernet and field bus
communication protocols with master and slave functionality.
Device and Documentation Support
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8.4
www.ti.com
Related Links
Table 8-1 lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to sample or buy.
Table 8-1. Related Links
8.5
PARTS
PRODUCT FOLDER
SAMPLE & BUY
TECHNICAL
DOCUMENTS
TOOLS &
SOFTWARE
SUPPORT &
COMMUNITY
AM3359
Click here
Click here
Click here
Click here
Click here
AM3358
Click here
Click here
Click here
Click here
Click here
AM3357
Click here
Click here
Click here
Click here
Click here
AM3356
Click here
Click here
Click here
Click here
Click here
AM3354
Click here
Click here
Click here
Click here
Click here
AM3352
Click here
Click here
Click here
Click here
Click here
AM3351
Click here
Click here
Click here
Click here
Click here
Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the
respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views;
see TI's Terms of Use.
TI E2E™ Online Community The TI engineer-to-engineer (E2E) community was created to foster
collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge,
explore ideas and help solve problems with fellow engineers.
TI Embedded Processors Wiki Established to help developers get started with Embedded Processors
from Texas Instruments and to foster innovation and growth of general knowledge about the
hardware and software surrounding these devices.
242
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www.ti.com
8.6
SPRS717J – OCTOBER 2011 – REVISED APRIL 2016
Trademarks
Sitara, SmartReflex, WiLink, E2E are trademarks of Texas Instruments.
NEON is a trademark of ARM Ltd or its subsidiaries.
ARM, Cortex are registered trademarks of ARM Ltd or its subsidiaries.
Bluetooth is a registered trademark of Bluetooth SIG.
EtherCAT is a registered trademark of EtherCAT Technology Group.
Android is a trademark of Google Inc.
PowerVR SGX is a trademark of Imagination Technologies Limited.
Linux is a registered trademark of Linus Torvalds.
Wi-Fi is a registered trademark of Wi-Fi Alliance.
All other trademarks are the property of their respective owners.
8.7
Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
8.8
Glossary
TI Glossary This glossary lists and explains terms, acronyms, and definitions.
Device and Documentation Support
Submit Documentation Feedback
Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351
Copyright © 2011–2016, Texas Instruments Incorporated
243
AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351
SPRS717J – OCTOBER 2011 – REVISED APRIL 2016
www.ti.com
9 Mechanical, Packaging, and Orderable Information
9.1
Via Channel
The ZCE package has been specially engineered with Via Channel technology. This allows larger than
normal PCB via and trace sizes and reduced PCB signal layers to be used in a PCB design with the 0.65mm pitch package, and substantially reduces PCB costs. It allows PCB routing in only two signal layers
(four layers total) due to the increased layer efficiency of the Via Channel BGA technology.
Via Channel technology implemented on the ZCE package makes it possible to build an AM335x-based
product with a 4-layer PCB, but a 4-layer PCB may not meet system performance goals. Therefore,
system performance using a 4-layer PCB design must be evaluated during product design.
9.2
Packaging Information
The following pages include mechanical packaging and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and
revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
244
Mechanical, Packaging, and Orderable Information
Copyright © 2011–2016, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351
PACKAGE OPTION ADDENDUM
www.ti.com
4-May-2018
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
AM3351BZCE30
ACTIVE
NFBGA
ZCE
298
160
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
0 to 90
AM3351BZCE30
AM3351BZCE30R
ACTIVE
NFBGA
ZCE
298
1000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
0 to 90
AM3351BZCE30
AM3351BZCE60
ACTIVE
NFBGA
ZCE
298
160
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
0 to 90
AM3351BZCE60
AM3351BZCE60R
ACTIVE
NFBGA
ZCE
298
1000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
0 to 90
AM3351BZCE60
AM3351BZCEA30
ACTIVE
NFBGA
ZCE
298
160
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
-40 to 105
AM3351BZCEA30
AM3351BZCEA30R
ACTIVE
NFBGA
ZCE
298
1000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
-40 to 105
AM3351BZCEA30
AM3351BZCEA60
ACTIVE
NFBGA
ZCE
298
160
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
-40 to 105
AM3351BZCEA60
AM3352BZCE30
ACTIVE
NFBGA
ZCE
298
160
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
0 to 90
AM3352BZCE30R
ACTIVE
NFBGA
ZCE
298
1000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
AM3352BZCE60
ACTIVE
NFBGA
ZCE
298
160
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
0 to 90
AM3352BZCEA30
ACTIVE
NFBGA
ZCE
298
160
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
-40 to 105
AM3352BZCEA30
AM3352BZCEA30R
ACTIVE
NFBGA
ZCE
298
1000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
-40 to 105
AM3352BZCEA30
AM3352BZCEA60
ACTIVE
NFBGA
ZCE
298
160
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
-40 to 105
AM3352BZCEA60
AM3352BZCEA60R
ACTIVE
NFBGA
ZCE
298
1000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
-40 to 105
AM3352BZCEA60
AM3352BZCED30
ACTIVE
NFBGA
ZCE
298
160
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
-40 to 90
AM3352BZCED30
AM3352BZCED60
ACTIVE
NFBGA
ZCE
298
160
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
-40 to 90
AM3352BZCED60
AM3352BZCZ100
ACTIVE
NFBGA
ZCZ
324
126
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
0 to 90
AM3352BZCZ100
Addendum-Page 1
AM3352BZCE30
AM3352BZCE30
AM3352BZCE60
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device
4-May-2018
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
AM3352BZCZ30
ACTIVE
NFBGA
ZCZ
324
126
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
0 to 90
AM3352BZCZ30
AM3352BZCZ60
ACTIVE
NFBGA
ZCZ
324
126
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
0 to 90
AM3352BZCZ60
AM3352BZCZ80
ACTIVE
NFBGA
ZCZ
324
126
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
0 to 90
AM3352BZCZ80
AM3352BZCZA100
ACTIVE
NFBGA
ZCZ
324
126
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
-40 to 105
AM3352BZCZA100
AM3352BZCZA30
ACTIVE
NFBGA
ZCZ
324
126
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
-40 to 105
AM3352BZCZA30
AM3352BZCZA60
ACTIVE
NFBGA
ZCZ
324
126
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
-40 to 105
AM3352BZCZA60
AM3352BZCZA80
ACTIVE
NFBGA
ZCZ
324
126
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
-40 to 105
AM3352BZCZA80
AM3352BZCZD30
ACTIVE
NFBGA
ZCZ
324
126
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
-40 to 90
AM3352BZCZD30
AM3352BZCZD60
ACTIVE
NFBGA
ZCZ
324
126
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
-40 to 90
AM3352BZCZD60
AM3352BZCZD80
ACTIVE
NFBGA
ZCZ
324
126
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
-40 to 90
AM3352BZCZD80
AM3352BZCZT60
ACTIVE
NFBGA
ZCZ
324
126
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
-40 to 125
AM3352BZCZT60
AM3352BZCZT60R
ACTIVE
NFBGA
ZCZ
324
1000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
-40 to 125
AM3352BZCZT60
AM3354BZCE60
ACTIVE
NFBGA
ZCE
298
160
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
0 to 90
AM3354BZCE60
AM3354BZCEA60
ACTIVE
NFBGA
ZCE
298
160
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
-40 to 105
AM3354BZCEA60
AM3354BZCED60
ACTIVE
NFBGA
ZCE
298
160
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
-40 to 90
AM3354BZCED60
AM3354BZCZ100
ACTIVE
NFBGA
ZCZ
324
126
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
0 to 90
AM3354BZCZ100
AM3354BZCZ30
ACTIVE
NFBGA
ZCZ
324
126
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
0 to 90
AM3354BZCZ30
AM3354BZCZ60
ACTIVE
NFBGA
ZCZ
324
126
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
0 to 90
AM3354BZCZ60
Addendum-Page 2
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device
4-May-2018
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
AM3354BZCZ80
ACTIVE
NFBGA
ZCZ
324
126
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
0 to 90
AM3354BZCZA100
ACTIVE
NFBGA
ZCZ
324
126
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
-40 to 105
AM3354BZCZA100
AM3354BZCZA60
ACTIVE
NFBGA
ZCZ
324
126
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
-40 to 105
AM3354BZCZA60
AM3354BZCZA80
ACTIVE
NFBGA
ZCZ
324
126
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
-40 to 105
AM3354BZCZA80
AM3354BZCZA80R
ACTIVE
NFBGA
ZCZ
324
1000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
AM3354BZCZD60
ACTIVE
NFBGA
ZCZ
324
126
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
-40 to 90
AM3354BZCZD60
AM3354BZCZD80
ACTIVE
NFBGA
ZCZ
324
126
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
-40 to 90
AM3354BZCZD80
AM3356BZCEA60
ACTIVE
NFBGA
ZCE
298
160
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
AM3356BZCZ30
ACTIVE
NFBGA
ZCZ
324
126
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
0 to 90
AM3356BZCZ30
AM3356BZCZ60
ACTIVE
NFBGA
ZCZ
324
126
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
0 to 90
AM3356BZCZ60
AM3356BZCZ80
ACTIVE
NFBGA
ZCZ
324
126
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
0 to 90
AM3356BZCZ80
AM3356BZCZA30
ACTIVE
NFBGA
ZCZ
324
126
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
-40 to 105
AM3356BZCZA30
AM3356BZCZA60
ACTIVE
NFBGA
ZCZ
324
126
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
-40 to 105
AM3356BZCZA60
AM3356BZCZA80
ACTIVE
NFBGA
ZCZ
324
126
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
-40 to 105
AM3356BZCZA80
AM3356BZCZD30
ACTIVE
NFBGA
ZCZ
324
126
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
-40 to 90
AM3356BZCZD30
AM3356BZCZD60
ACTIVE
NFBGA
ZCZ
324
126
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
-40 to 90
AM3356BZCZD60
AM3357BZCZA30
ACTIVE
NFBGA
ZCZ
324
126
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
-40 to 105
AM3357BZCZA30
AM3357BZCZA60
ACTIVE
NFBGA
ZCZ
324
126
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
-40 to 105
AM3357BZCZA60
Addendum-Page 3
AM3354BZCZ80
AM3354BZCZA80
AM3356BZCEA60
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device
4-May-2018
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
AM3357BZCZA80
ACTIVE
NFBGA
ZCZ
324
126
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
-40 to 105
AM3357BZCZA80
AM3357BZCZD30
ACTIVE
NFBGA
ZCZ
324
126
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
-40 to 90
AM3357BZCZD30
AM3357BZCZD60
ACTIVE
NFBGA
ZCZ
324
126
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
-40 to 90
AM3357BZCZD60
AM3358BZCE60
ACTIVE
NFBGA
ZCE
298
160
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
0 to 90
AM3358BZCE60
AM3358BZCZ100
ACTIVE
NFBGA
ZCZ
324
126
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
0 to 90
AM3358BZCZ100
AM3358BZCZ60
ACTIVE
NFBGA
ZCZ
324
126
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
0 to 90
AM3358BZCZ60
AM3358BZCZ80
ACTIVE
NFBGA
ZCZ
324
126
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
0 to 90
AM3358BZCZ80
AM3358BZCZA100
ACTIVE
NFBGA
ZCZ
324
126
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
-40 to 105
AM3358BZCZA100
AM3358BZCZA80
ACTIVE
NFBGA
ZCZ
324
126
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
-40 to 105
AM3358BZCZA80
AM3359BZCZA80
ACTIVE
NFBGA
ZCZ
324
126
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
-40 to 105
AM3359BZCZA80
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Addendum-Page 4
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
(4)
4-May-2018
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF AM3358 :
• Enhanced Product: AM3358-EP
NOTE: Qualified Version Definitions:
• Enhanced Product - Supports Defense, Aerospace and Medical Applications
Addendum-Page 5
IMPORTANT NOTICE
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semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers
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life-critical medical equipment unless authorized officers of the parties have executed a special contract specifically governing such use.
Life-critical medical equipment is medical equipment where failure of such equipment would cause serious bodily injury or death (e.g., life
support, pacemakers, defibrillators, heart pumps, neurostimulators, and implantables). Such equipment includes, without limitation, all
medical devices identified by the U.S. Food and Drug Administration as Class III devices and equivalent classifications outside the U.S.
TI may expressly designate certain products as completing a particular qualification (e.g., Q100, Military Grade, or Enhanced Product).
Designers agree that it has the necessary expertise to select the product with the appropriate qualification designation for their applications
and that proper product selection is at Designers’ own risk. Designers are solely responsible for compliance with all legal and regulatory
requirements in connection with such selection.
Designer will fully indemnify TI and its representatives against any damages, costs, losses, and/or liabilities arising out of Designer’s noncompliance with the terms and provisions of this Notice.
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