ON CM1457-06CP Praetorian iiiâ® 4, 6, 8-channel emi filter array with esd protection Datasheet

Praetorian III® 4, 6, 8-Channel
EMI Filter Array with ESD Protection
CM1457
Functional Description
Features
•
Four, six, or eight channels of EMI filtering
The CM1457 is an inductor-based (L-C) EMI filter array
•
±15kV ESD protection (IEC 61000-4-2, contact
with ESD protection, which integrates four, six, or eight
discharge) at external pins
filters in a CSP form factor with 0.40mm pitch. Each EMI
Greater than -40dB of attenuation at 1GHz
filter channel of the CM1457 is implemented with the
MIL_STD_883 international ESD standard
component value of 6pF-35nH–4.7pF-35nH–1.8pF. The
Chip Scale Package (CSP) with 0.40mm pitch and
cut-off frequency at -3dB attenuation is 300MHz and can
0.25mm CSP solder ball which features extremely
be used in applications where the data rates are as high as
low parasitic inductance for optimum filter and
160Mbps, while providing greater than -35dB attenuation
ESD performance
over the 800MHz to 2.7GHz frequency range. The parts
OptiGuardTM coating for improved reliability at
include ESD diodes on every I/O pin and provide a high
assembly
level of protection against electrostatic discharge (ESD).
RoHS-compliant, lead-free finishing
The ESD protection diodes connected to the external filter
•
•
•
•
ports are designed and characterized to safely dissipate
Applications
ESD strikes of ±15kV, which is beyond the maximum
requirement of the IEC61000-4-2 international standard.
•
LCD and camera data lines in mobile handsets
•
I/O port protection for mobile handsets, notebook
This device is particularly well suited for wireless handsets,
computers, PDAs, etc.
•
mobile LCD modules and PDAs because of its small
EMI filtering for data ports in cell phones, PDAs or
package format and easy-to-use pin assignments. In
notebook computer
•
•
•
particular, the CM1457 is ideal for EMI filtering and
Wireless handsets
Handheld PCs/PDAs
LCD and camera modules
protecting data and control lines for the LCD display and
camera interface in mobile handsets.
The CM1457 incorporates OptiGuardTM which results in
Note: Refer to Application Note AP-217, "The Chip Scale
Package", for a detailed description of Chip Scale
Packages offered by California Micro Devices. See
http://www.wlcspforum.org/documents/pdf/ap217.pdf for download.
improved reliability at assembly. It is manufactured with a
0.40mm pitch and 0.25mm CSP solder ball to provide up to
28% board space savings vs. competing CSP devices with
0.50mm pitch and 0.30mm CSP solder ball.
Block Diagram
35nH
Cn*
(Externa l
Pi ns)
6p F
35 nH
4 .7p F
1 .8 p F
An*
(Interna l
Pins)
GND
(Pins B1 -B4)
©2010 SCILLC. All rights reserved.
May 2010 – Rev. 4
Publication Order Number:
CM1457/D
CM1457
Pin Configurations
Rev. 4 | Page 2 of 9 | www.onsemi.com
CM1457
Pin Descriptions
PIN NUMBER
-04
-06
-08
A1
A1
A1
A2
A2
A3
A4
PIN
DESCRIPTION
PIN NUMBER
PIN
DESCRIPTION
-04
-06
-08
Filter #1 (Internal)
C1
C1
C1
Filter #1 (External)
A2
Filter #2 (Internal)
C2
C2
C2
Filter #2 (External)
A3
A3
Filter #3 (Internal)
C3
C3
C3
Filter #3 (External)
A4
A4
Filter #4 (Internal)
C4
C4
C4
Filter #4 (External)
A5
A5
Filter #5 (Internal)
C5
C5
Filter #5 (External)
A6
A6
Filter #6 (Internal)
C6
C6
Filter #6 (External)
A7
Filter #7 (Internal)
C7
Filter #7 (External)
A8
Filter #8 (Internal)
C8
Filter #8 (External)
B1
B1
B1
GND
B2
B2
B2
GND
B3
B3
GND
B4
GND
Ordering Information
Bumps
Package
Ordering Part Number1
Part Marking2
10
15
20
CSP
CSP
CSP
CM1457-04CP
CM1457-06CP
CM1457-08CP
N57 (w)
N57 (yww)
N57 (yyww)
Note 1: Parts are shipped in Tape and Reel form unless otherwise specified.
Note 2: (w/yww/yyww) = date code
Absolute Maximum Ratings
PARAMETER
RATING
UNITS
-65 to +150
°C
DC current per Inductor
15
mA
DC Package Power Rating
0.5
W
Storage Temperature Range
Rev. 4 | Page 3 of 9 | www.onsemi.com
CM1457
Standard Operating Conditions
PARAMETER
Operating Temperature Range
RATING
UNITS
-40 to +85
°C
Electrical Operating Characteristics (see Note 1)
SYMBOL
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
LTOT
Total Channel Inductance
70
nH
RTOT
Total Channel DC Resistance
45
Ω
CTOT_0V
Total Channel Capacitance, 0V bias
0V dc; 1MHz, 30mV rms
CTOT_2.5V
Total Channel Capacitance, 2.5V bias
2.5V dc; 1MHz, 30mV rms
VST
Stand-off Voltage
I = 10μA
ILEAK
Diode Leakage Current
VIN = +3.3V
VSIG
Signal Clamp Voltage
Positive Clamp
Negative Clamp
ILOAD = 10mA
ILOAD = -10mA
VESD
fC
In-system ESD Withstand Voltage
a) Contact discharge per
IEC 61000-4-2 standard, Level 4
(External Pins)
b) Contact discharge per
IEC 61000-4-2 standard, Level 4
(Internal Pins)
20
24
12.5
pF
5.5
5.6
-1.5
pF
V
0.1
0.5
μA
6.8
-0.8
9.0
-0.4
V
V
Notes 2 and 3
Cut-off frequency
ZSOURCE = 50Ω, ZLOAD = 50Ω
±15
kV
±2
kV
300
Note 1: TA=25°C unless otherwise specified.
Note 2: ESD applied to input and output pins with respect to GND, one at a time.
Note 3: Unused pins are left open.
Rev. 4 | Page 4 of 9 | www.onsemi.com
MHz
CM1457
Performance Information
Insertion Loss Vs. Frequency (0V Bias)
0 dB
-10 dB
-20 dB
-30 dB
-40 dB
-50 dB
3
10
100
1000
FREQUENCY (MHz)
Insertion Loss Vs. Frequency (2.5V Bias)
Rev. 4 | Page 5 of 9 | www.onsemi.com
2000
6000
CM1457
CM1457-04CP Mechanical Specifications
The 10-bump CM1457-04CP package dimensions are shown below.
Package Specifications
Package
Custom CSP
Bumps
10
Millimeters
Inches
Dim
Min
Nom
Max
Min
Nom
Max
A1
1.627 1.672 1.717 0.0641 0.0658 0.0676
A2
1.008 1.053 1.098 0.0397 0.0415 0.0432
B1
0.395 0.400 0.405 0.0156 0.0157 0.0159
B2
0.195 0.200 0.205 0.0077 0.0079 0.0081
B3
0.342 0.347 0.352 0.0135 0.0137 0.0139
B4
0.342 0.347 0.352 0.0135 0.0137 0.0139
C1
0.186 0.236 0.286 0.0073 0.0093 0.0113
C2
0.130 0.180 0.230 0.0051 0.0071 0.0090
D1
0.545 0.615 0.685 0.0215 0.0242 0.0270
D2
0.378 0.419 0.460 0.0149 0.0165 0.0181
Package Dimensions for CM1457-04CP Chip Scale
Package
Controlling dimension: millimeters
CSP Tape and Reel Specifications
PART NUMBER
CHIP SIZE (mm)
POCKET SIZE (mm)
B0 X A0 X K0
TAPE WIDTH
W
REEL
DIAMETER
QTY PER
REEL
P0
P1
CM1457-04CP
1.67 X 1.05 X 0.615
1.80 X 1.27 X 0.73
8mm
178mm (7")
3500
4mm
4mm
Rev. 4 | Page 6 of 9 | www.onsemi.com
CM1457
CM1457-04CP Mechanical Specifications
The 15-bump CM1457-06CP package dimensions are shown below.
Package Specifications
Package
Custom CSP
Bumps
15
Millimeters
Inches
Dim
Min
Nom
Max
Min
Nom
Max
A1
2.427 2.472 2.517 0.0956 0.0973 0.0992
A2
1.008 1.053 1.098 0.0397 0.0415 0.0432
B1
0.395 0.400 0.405 0.0156 0.0157 0.0159
B2
0.195 0.200 0.205 0.0077 0.0079 0.0081
B3
0.342 0.347 0.352 0.0135 0.0137 0.0139
B4
0.342 0.347 0.352 0.0135 0.0137 0.0139
C1
0.187 0.237 0.287 0.0074 0.0093 0.0113
C2
0.130 0.180 0.230 0.0051 0.0071 0.0090
D1
0.545 0.615 0.685 0.0215 0.0242 0.0270
D2
0.368 0.419 0.470 0.0145 0.0165 0.0185
# per tape and
reel
Package Dimensions for CM1457-06CP Chip Scale
Package
3500 pieces
Controlling dimension: millimeters
CSP Tape and Reel Specifications
PART NUMBER
CHIP SIZE (mm)
POCKET SIZE (mm)
B0 X A0 X K0
TAPE WIDTH
W
REEL
DIAMETER
QTY PER
REEL
P0
P1
CM1457-06
2.47 X 1.05 X 0.615
2.59 X 1.27 X 0.73
8mm
178mm (7")
3500
4mm
4mm
Rev. 4 | Page 7 of 9 | www.onsemi.com
CM1457
CM1457-08CP Mechanical Specifications
The 20-bump CM1457-08CP package dimensions are shown below.
Package Specifications
Package
Custom CSP
Bumps
20
Dim
Millimeters
Min
Nom
Max
Inches
Min
Nom
Max
A1
3.227 3.272 3.317 0.1270 0.1288 0.1306
A2
1.008 1.053 1.098 0.0397 0.0415 0.0432
B1
0.395 0.400 0.405 0.0156 0.0157 0.0159
B2
0.195 0.200 0.205 0.0077 0.0079 0.0081
B3
0.342 0.347 0.352 0.0135 0.0137 0.0139
B4
0.342 0.347 0.352 0.0135 0.0137 0.0139
Package Dimensions for CM1457-08CP Chip Scale
C1
0.186 0.236 0.286 0.0073 0.0093 0.0113
Package
C2
0.130 0.180 0.230 0.0051 0.0071 0.0090
D1
0.545 0.615 0.685 0.0215 0.0242 0.0270
D2
0.368 0.419 0.470 0.0145 0.0165 0.0185
# per tape and
reel
3500 pieces
Controlling dimension: millimeters
CSP Tape and Reel Specifications
PART NUMBER
CHIP SIZE (mm)
POCKET SIZE (mm)
B0 X A0 X K0
TAPE WIDTH
W
REEL
DIAMETER
QTY PER
REEL
P0
P1
CM1457-08CP
3.27 X 1.05 X 0.615
3.40 X 1.27 X 0.73
12mm
330mm (13")
3500
4mm
4mm
Rev. 4 | Page 8 of 9 | www.onsemi.com
CM1457
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are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any
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