CPC1988 ISOPLUS™-264 Power Relay Parameter Blocking Voltage Load Current, TA=25ºC With 5°C/W Heat Sink No Heat Sink On-resistance RθJC Rating 1000 2.25 0.9 2.5 0.3 Description Units VP Clare and IXYS have combined to bring OptoMOS® technology, reliability and compact size to a new family of high power solid state relays. Arms As part of this family, the CPC1988 single pole normally open (1-Form-A) solid state power relay is rated for up to 2.25Arms continuous load current with a 5ºC/W heat sink. Ω °C/W Features • • • • • • • • • • 100% Solid State Compact ISOPLUS-264 Power Package Low Thermal Resistance (0.3°C/W) 2.25Arms Load Current with 5°C/W Heat Sink Low Drive Power Requirements Electrically Non-conductive Thermal Pad for Heat Sink Applications Arc-Free With No Snubbing Circuits 2500Vrms Input/Output Isolation No EMI/RFI Generation Machine Insertable, Wave Solderable Applications • • • • • Industrial Controls Motor Control Robotics Medical Equipment—Patient/Equipment Isolation Instrumentation • Multiplexers • Data Acquisition • Electronic Switching • I/O Subsystems • Energy Meters • Transportation Equipment • Aerospace/Defense Pin Configuration The CPC1988 employs optically coupled MOSFET technology to provide 2500Vrms of input to output isolation. The output is constructed with efficient MOSFET switches and photovoltaic die that use Clare’s patented OptoMOS architecture while the input, a highly efficient GaAlAs infrared LED provides the optically coupled control. The combination of low on-resistance and high load current handling capability makes this relay suitable for a variety of high performance switching applications. The unique ISOPLUS-264 package pioneered by IXYS allows solid state relays to achieve the highest load current and power ratings. This package features a unique IXYS process where the silicon chips are soft soldered onto the Direct Copper Bond (DCB) substrate instead of the traditional copper leadframe. The DCB ceramic, the same substrate used in high power modules, not only provides 2500Vrms isolation but also very low thermal resistance (0.3 °C/W). Approvals • UL recognized component: File # E69938 • Certified to: UL 508 Ordering Information Part Number CPC1988J Description ISOPLUS-264 (25/tube) Switching Characteristics of Normally Open (Form A) Devices CONTROL ILOAD RoHS 2002/95/EC 10%+ e3 DS-CPC1988-R02 + 90% TON www.clare.com TOFF 1 CPC1988 Absolute Maximum Ratings Parameter Blocking Voltage Reverse Input Voltage Input Control Current Peak (10ms) Input Power Dissipation Isolation Voltage Input to Output Operational Temperature Storage Temperature Ratings 1000 5 100 1 150 2500 -40 to +85 -40 to +125 Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Units VP V mA A mW Vrms °C °C Electrical absolute maximum ratings are at 25°C Electrical Characteristics Parameter Output Characteristics Load Current 1 Peak Continuous Continuous Continuous On-Resistance 2 Off-State Leakage Current Switching Speeds Turn-On Turn-Off Output Capacitance Input Characteristics Input Control Current 3 Input Dropout Current Input Voltage Drop Reverse Input Current Common Characteristics Capacitance Input to Output 1 2 3 Conditions TA=25°C Symbol t ≤ 10ms No Heat Sink TC=25ºC TC=99ºC IL = 0.9A, IF=10mA VL=1000V IF=20mA, VL=10V V=25V, f=1MHz TA=25°C IL=0.9A IF=5mA VR=5V TA=25°C - Min Typ Max Units - - IL(99) RON ILEAK - 1.78 - 10 0.9 9.4 1.05 2.5 1 TON TOFF COUT - 6 0.11 540 20 5 - pF IF IF VF IR 0.6 0.9 - 1.2 - 10 1.4 10 mA mA V µA CI/O - 1 - pF IL AP Arms Ω µA ms Higher load currents possible with proper heat sinking. Measurement taken within 1 second of on time. For applications requiring high temperature operation (greater than 60oC) an LED drive current of 20mA is recommended. 2 www.clare.com R02 CPC1988 Thermal Characteristics Parameter Thermal Resistance (junction to case) Thermal Resistance (junction to ambient) Junction Temperature (operation) Conditions Free air - Symbol RθJC RθJA TJ Min -40 Typ 33 - Max 0.3 100 Units °C/W °C/W °C Thermal Management Device high current characterization was performed using Kunze heat sink KU 1-159, phase change thermal interface material KU-ALC 5, and transistor clip KU 4-499/1. This combination provided an approximate junction-to-ambient thermal resistance of 12.5°C/W. Heat Sink Calculation Higher load currents are possible by using lower thermal resistance heat sink combinations. Heat Sink Rating RθCA = (TJ - TA) IL(99)2 IL2 • RθJC - RθJC TJ = Junction Temperature (°C), TJ ≤ 100°C * TA = Ambient Temperature (°C) IL(99) = Load Current with Case Temperature @ 99°C (Arms) IL = Desired Operating Load Current (Arms), IL ≤ IL(MAX) RθJC = Thermal Resistance, Junction to Case (°C/W) = 0.3°C/W RθCA = Thermal Resistance of Heat Sink & Thermal Interface Material , Case to Ambient (°C/W) * Elevated junction temperature reduces semiconductor lifetime. R02 www.clare.com 3 CPC1988 PERFORMANCE DATA* 20 25 Device Count (N) Device Count (N) 25 15 10 5 CPC1988 Typical On-Resistance Distribution (N=50, TA=25ºC, IL=0.9A, IF=10mA) 35 15 10 5 25 20 15 10 5 0 0 0 LED Forward Voltage (V) On-Resistance (Ω) 1080 1090 1100 1110 Blocking Voltage (VP) CPC1988 Typical Turn-On Time (N=50, TA=25ºC, IL=0.5A, IF=10mA) CPC1988 Typical Turn-Off Time (N=50, TA=25ºC, IL=0.5A, IF=10mA) CPC1988 Maximum Load Current vs. Temperature with Heat Sink (IF=20mA) 1.3250 30 CPC1988 Typical Blocking Voltage Distribution (TA=25C) 30 20 Device Count (N) CPC1988 Typical LED Forward Voltage Drop (N=50, TA=25ºC, IF=10mA) 1.3275 1.3300 1.3325 1.72 1.3350 25 1.74 1.76 1.78 1.80 1070 1.82 6 1120 1ºC/W 20 15 10 Load Current (Arms) Device Count (N) Device Count (N) 25 20 15 10 5 5 6 7 8 Turn-On (ms) 9 0.08 10 0.09 0.010 0.008 0.006 0.004 0.002 80 100 1120 1100 1080 1060 1040 1000 -40 IF = 20mA 0.06 0.04 IF = 10mA 0.02 0 -20 0 20 40 60 Temperature (ºC) 80 -20 0 20 40 60 Temperature (ºC) 80 100 Free Air 1 0 20 40 60 Temperature (ºC) 100 1.6 IF = 50mA 1.2 IF = 20mA IF = 10mA 1.0 0.8 -40 -20 0 20 40 60 80 Temperature (ºC) 100 120 100 20 18 16 14 12 10 8 6 4 2 0 IF = 10mA IF = 20mA -20 0 20 40 60 Temperature (ºC) 80 100 CPC1988 Typical Turn-On vs. LED Forward Current (IL=0.5A) 1.8 1.4 80 CPC1988 Typical Turn-On vs. Temperature (IL=0.5A) -40 CPC1988 Typical LED Forward Voltage Drop vs. Temperature 0.10 0.08 2 0.13 Turn-On (ms) Turn-Off (ms) 0.12 1020 20 40 60 Temperature (ºC) 0.12 -40 0.11 1140 CPC1988 Typical Turn-Off vs. Temperature (IL=0.5A) 0.14 0.10 Turn-On (ms) Blocking Voltage (VP) 1160 LED Forward Voltage Drop (V) Leakage (µA) 1180 0.012 0 5ºC/W 10ºC/W CPC1988 Typical Blocking Voltage vs. Temperature 0.014 -20 3 Turn-Off (ms) CPC1988 Typical Leakage vs. Temperature at Maximum Rated Voltage (Measured Across Pins 1 & 2) 0 -40 4 0 0 0 5 30 27 24 21 18 15 12 9 6 3 0 0 5 10 15 20 25 30 35 40 LED Forward Current (mA) 45 50 Unless otherwise specified, all performance data was acquired without the use of a heat sink. *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. 4 www.clare.com R02 CPC1988 PERFORMANCE DATA* CPC1988 Typical Turn-Off vs. LED Forward Current (IL=0.5A) 6.0 0.14 9.0 0.08 0.06 0.04 0.02 5.0 LED Current (mA) On-Resistance (Ω) Turn-Off (ms) 0.10 4.5 4.0 3.5 3.0 2.5 7.0 5.0 3.0 2.0 1.5 0 0 5 10 15 20 25 30 35 40 45 -40 50 -20 0 20 40 60 LED Forward Current (mA) Temperature (ºC) CPC1988 Typical Load Current vs. Load Voltage (TA=25ºC, IF=10mA) CPC1988 Energy Rating Curve (Free Air, No Heat Sink) 80 100 1.0 -40 -20 0 20 40 60 Temperature (ºC) 80 100 12 10 Load Current (AP) Load Current (A) CPC1988 Typical IF for Switch Operation vs. Temperature (IL=0.5A) 5.5 0.12 2.5 2.0 1.5 1.0 0.5 0 -0.5 -1.0 -1.5 -2.0 -2.5 CPC1988 Typical On-Resistance vs. Temperature (IL=max rated) -6 -4 0 -2 2 Load Voltage (V) 4 6 8 6 4 2 0 10µs 100µs 1ms 10ms 100ms 1s 10s 100s Time Unless otherwise specified, all performance data was acquired without the use of a heat sink. *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. R02 www.clare.com 5 CPC1988 MANUFACTURING INFORMATION Soldering For proper assembly, the component must be processed in accordance with the current revision of IPC/JEDEC standard J-STD-020. Failure to follow the recommended guidelines may cause permanent damage to the device resulting in impaired performance and/or a reduced lifetime expectancy. Washing Clare does not recommend ultrasonic cleaning or the use of chlorinated solvents. e3 RoHS 2002/95/EC MECHANICAL DIMENSIONS ISOPLUS-264 0.190 MIN - 0.205 MAX (4.83 MIN - 5.21 MAX) 0.046 MIN - 0.055 MAX (1.17 MIN - 1.40 MAX) 0.770 MIN - 0.799 MAX (19.56 MIN - 20.29 MAX) 0.210 MIN - 0.235 MAX (5.33 MIN - 5.97 MAX) 0.668 MIN - 0.690 MAX (16.97 MIN - 17.53 MAX) 0.065 MIN - 0.080 MAX (1.65 MIN - 2.03 MAX) 0.100 MIN - 0.180 MAX (2.54 MIN - 4.57 MAX) 1.020 MIN - 1.040 MAX (25.91 MIN - 26.42 MAX) 0.490 MIN - 0.513 MAX (12.54 MIN - 13.03 MAX) 0.801 MIN - 0.821 MAX (20.34 MIN - 20.85 MAX) 0.100 MIN - 0.130 MAX (2.54 MIN - 3.03 MAX) 1 2 3 4 0.080 MIN - 0.102 MAX (2.03 MIN - 2.59 MAX) 0.780 MIN - 0.820 MAX (19.81 MIN - 20.83 MAX) 0.300 BSC (7.62) BSC 0.150 BSC (3.81 BSC) 0.020 MIN - 0.029 MAX (0.51 MIN - 0.74 MAX) 0.058 MIN - 0.068 MAX (1.47 MIN - 1.73 MAX) 0.102 MIN - 0.118 MAX (2.59 MIN - 3.00 MAX) 0.045 MIN - 0.055 MAX (1.14 MIN - 1.40 MAX) DIMENSIONS: INCHES (MM) NOTE: Bottom heatsink meets 2500Vrms isolation to the pins. Dimensions inches (mm) For additional information please visit our website at: www.clare.com Clare, Inc. makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in Clare’s Standard Terms and Conditions of Sale, Clare, Inc. assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of Clare’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. Clare, Inc. reserves the right to discontinue or make changes to its products at any time without notice. 6 Specification: DS-CPC1988-R02 ©Copyright 2007, Clare, Inc. OptoMOS® is a registered trademark of Clare, Inc. ISOPLUS™-264 is a trademark of IXYS Corporation All rights reserved. Printed in USA. 3/22/07