CPC3708 350V N-Channel Depletion Mode FET INTEGRATED CIRCUITS DIVISION Parameter Drain-to-Source Voltage - V(BR)DSX Rating 350 Max On-Resistance - RDS(on) 14 Units V Max Power SOT-89 Package 1.1 SOT-223 Package 2.5 Features • 350V Drain-to-Source Voltage • Depletion Mode Device Offers Low RDS(on) at Cold Temperatures • Low On-Resistance: 8 (Typical) @ 25°C • Low VGS(off) Voltage • High Input Impedance • Low Input and Output Leakage • Small Package Size SOT-89 and SOT-223 • PC Card (PCMCIA) Compatible • PCB Space and Cost Savings The CPC3708 is a N-channel, depletion mode Field Effect Transistor (FET) that is available in an SOT-223 package (CPC3708Z) and an SOT-89 package (CPC3708C). Both utilize IXYS Integrated Circuits Division’s proprietary third-generation vertical DMOS process that realizes world class, high voltage MOSFET performance in an economical silicon gate process. The vertical DMOS process yields a highly reliable device, particularly for use in difficult application environments such as telecommunications, security, and power supplies. CPC3708Z and the CPC3708C have a typical on-resistance of 8 and a drain-to-source voltage of 350V. As with all MOS devices, the FET structure prevents thermal runaway and thermally induced secondary breakdown. Ordering Information Part Number CPC3708CTR CPC3708ZTR Applications • • • • • • • • W Description LED Drive Circuits Telecommunications Normally On Switches Ignition Modules Converters Security Power Supplies Regulators Circuit Symbol Description SOT-89: Tape and Reel (1000/Reel) SOT-223: Tape and Reel (1000/Reel) Package Pinout: D D G 1 4 2 3 G D S S Pin Number Name 1 GATE 2 DRAIN 3 SOURCE 4 DRAIN DS-CPC3708-R03 www.ixysic.com 1 INTEGRATED CIRCUITS DIVISION CPC3708 Absolute Maximum Ratings @ 25ºC Parameter Ratings Units Drain-to-Source Voltage (V(BR)DSX) 350 V Gate-to-Source Voltage (VGS) ±20 V Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Total Package Dissipation 1 SOT-89 1.1 SOT-223 2.5 W Operational Temperature -40 to +110 oC Storage Temperature -40 to +125 oC 1 Mounted on 1"x1" FR4 board. Electrical Characteristics @25oC (Unless Otherwise Specified) Symbol Conditions Min Typ Max Units Gate-to-Source Voltage Gate-to-Source Off Voltage Parameter VGS VGS(off) Drain-to-Source Leakage Current IDS(off) RDS(on) IGSS CISS ID=60mA, VDS=5V ID=2A, VDS=10V, VDS=100V VGS= -5V, VDS=190V VGS= -5V, VDS=350V VGS= -2.7V, VDS=5V, VDS=50V VGS= -0.57V, VDS=5V VGS= -0.35V, IDS=50mA VGS=±20V VDS= VGS=0V -1.005 -2 130 - 8 - -1.735 -3.6 20 1 5 14 100 300 V V nA A mA mA Symbol Conditions Min Typ - - - Drain Current ID On-Resistance Gate Leakage Current Gate Capacitance nA pF Thermal Resistance Package SOT-89 SOT-223 2 Parameter Junction to Case RJC Junction to Ambient RJA Junction to Case RJC Junction to Ambient RJA - www.ixysic.com - - Max Units 50 90 14 ºC/W 55 R03 INTEGRATED CIRCUITS DIVISION CPC3708 CPC3708Z (SOT-223) PERFORMANCE DATA* Output Characteristics (TA=25ºC) 0.20 0.15 0.10 300 TA=-40ºC TA=25ºC TA=125ºC 250 15 200 10 150 100 5 50 0.05 0 0.00 250 VDS (V) Transfer Characteristics (VDS=10V) VGS(off) vs. Temperature (VDS=10V, ID=2PA) 2 3 4 0.0 5 0.1 -2.3 0.2 0.4 0.5 0.6 VGS(off) (V) -2.6 -2.7 10 300 -1.5 -1.0 -20 0 20 40 60 Temperature (ºC) 80 7 6 -40 100 -20 0 20 40 60 Temperature (ºC) 80 100 Forward Safe Operating Bias (VGS=0V, DC Load, TC=25ºC) 1 Limited by Device Channel Saturation 250 CISS COSS CRSS 0.1 IDS(A) Capacitance (pF) 8 4 -40 Capacitance vs. Drain-Source Voltage (VGS=-5V) 200 9 5 -3.0 -2.0 VGS (V) 150 11 -2.9 -2.5 100 On-Resistance vs. Temperature (VGS=0V, ID=100mA) 12 -2.8 50 50 ID (mA) -2.5 TA=125ºC TA=25ºC TA=-40ºC 100 0 -3.0 0 -2.4 200 150 0 0.3 ID (A) 1 On-Resistance (:) 0 ID (mA) Transconductance vs Drain Current (VDS=10V) : On-Resistance (:) 0.25 ID (A) 20 VGS=-0.5 VGS=-1 VGS=-1.5 VGS=-2 0.30 GFS (m) 0.35 On-Resistance vs. Drain Current (VGS=0V) 150 Limited by Device RDS(on) 0.01 100 50 0.001 0 0 5 10 15 VDS (V) 20 25 30 1 10 100 1000 VDS (V) *The Performance data shown in the graphs above is typical of device performance in SOT-223 Package. For guaranteed parameters not indicated in the written specifications, please contact our application department. R03 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION CPC3708 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Rating CPC3708C / CPC3708Z MSL 1 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Reflow Profile This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020 must be observed. Device Maximum Temperature x Time CPC3708C / CPC3708Z 260ºC for 30 seconds Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to remove flux residue is acceptable, and the use of a short drying bake may be necessary. Chlorine-based or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be used. 4 www.ixysic.com R03 INTEGRATED CIRCUITS DIVISION CPC3708 MECHANICAL DIMENSIONS CPC3708Z 2.90 / 3.10 (0.114 / 0.122) PCB Land Pattern 0.229 / 0.330 (0.009 / 0.013) 1.90 (0.075) 6.705 / 7.290 (0.264 / 0.287) 3.30 / 3.71 (0.130 / 0.146) 1.499 / 1.981 (0.059 / 0.078) 3.20 (0.126) 6.10 (0.24) Pin 1 0.610 / 0.787 (0.024 / 0.031) 1.90 (0.075) 0.914 MIN (0.036 MIN) 2.286 (0.090) 6.30 / 6.71 (0.248 / 0.264) 0.020 / 0.102 (0.0008 / 0.004) 0.90 (0.035) 1.549 / 1.803 (0.061 / 0.071) 2.286 (0.090) 0.864 / 1.067 (0.034 / 0.042) Dimensions mm MIN / mm MAX (inches MIN / inches MAX) 4.597 (0.181) CPC3708C 1.626 / 1.829 (0.064 / 0.072) 1.397 / 1.600 (0.055 / 0.063) R 0.254 (R 0.010) PCB Land Pattern 1.90 (0.075) 3.937 / 4.242 (0.155 / 0.167) 2.45 (0.096) 1.40 (0.055) Pin 1 0.889 / 1.194 (0.035 / 0.047) 0.356 / 0.483 (0.014 / 0.019) 0.432 / 0.559 (0.017 / 0.022) 0.356 / 0.432 (0.014 / 0.017) 0.864 / 1.016 (0.034 / 0.040) 4.394 / 4.597 (0.173 / 0.181) 1.118 / 1.270 (0.044 / 0.050) 50º 0.432 / 0.508 (0.017 / 0.020) 5.00 (0.197) 50º 1.90 (0.074) 0.60 (0.024) TYP 3 2.845 / 2.997 (0.112 / 0.118) 1.422 / 1.575 (0.056 / 0.062) 2.921 / 3.073 (0.115 / 0.121) R03 45º 2.286 / 2.591 (0.090 / 0.102) Dimensions mm MIN / mm MAX (inches MIN / inches MAX) www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION CPC3708 MECHANICAL DIMENSIONS CPC3708ZTR Tape & Reel 177.8 Dia (7.00 Dia) 5.50 ± 0.05 (0.217 ± 0.002) Top Cover Tape Thickness 0.102 Max (0.004 Max) 2.00 ± 0.05 (0.079 ± 0.002) 4.00 ± 0.1 (0.157 ± 0.004) 1.75 ± 0.1 (0.069 ± 0.004) W=12.08 ± 0.2 (0.476 ± 0.008) B0=7.42 ± 0.1 (0.292 ± 0.004) K0=1.88 ± 0.1 (0.074 ± 0.004) Embossed Carrier A0=6.83 ± 0.1 (0.269 ± 0.004) P=8.03 ± 0.1 (0.316 ± 0.004) Dimensions mm (inches) Embossment CPC3708CTR Tape & Reel 177.8 Dia (7.00 Dia) 5.50 ± 0.05 (0.217 ± 0.002) Top Cover Tape Thickness 0.102 Max (0.004 Max) 1.75 ± 0.1 (0.069 ± 0.004) W=12.00 ± 0.3 (0.472 ± 0.012) B0=4.60 ± 0.1 (0.181 ± 0.004) K0=1.80 ± 0.1 (0.071 ± 0.004) Embossed Carrier 2.00 ± 0.05 (0.079 ± 0.002) 4.00 ± 0.1 (0.157 ± 0.004) A0=4.80 ± 0.1 (0.189 ± 0.004) P=8.00 ± 0.1 (0.315 ± 0.004) Embossment Dimensions mm (inches) For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. 6 Specification: DS-CPC3708-R03 ©Copyright 2014, IXYS Integrated Circuits Division All rights reserved. Printed in USA. 8/1/2014