Cypress CY7C1317CV18-167BZXI 18-mbit ddr-ii sram 4-word burst architecture Datasheet

CY7C1317CV18, CY7C1917CV18
CY7C1319CV18, CY7C1321CV18
18-Mbit DDR-II SRAM 4-Word
Burst Architecture
Features
Functional Description
■
18-Mbit density (2M x 8, 2M x 9, 1M x 18, 512K x 36)
■
300 MHz clock for high bandwidth
■
4-word burst for reducing address bus frequency
■
Double Data Rate (DDR) interfaces
(data transferred at 600 MHz) at 300 MHz
■
Two input clocks (K and K) for precise DDR timing
❐ SRAM uses rising edges only
■
Two input clocks for output data (C and C) to minimize clock
skew and flight time mismatches
■
Echo clocks (CQ and CQ) simplify data capture in high-speed
systems
■
Synchronous internally self-timed writes
■
DDR-II operates with 1.5 cycle read latency when the DLL is
enabled
The CY7C1317CV18, CY7C1917CV18, CY7C1319CV18, and
CY7C1321CV18 are 1.8V Synchronous Pipelined SRAMs
equipped with DDR-II architecture. The DDR-II consists of an
SRAM core with advanced synchronous peripheral circuitry and
a two-bit burst counter. Addresses for read and write are latched
on alternate rising edges of the input (K) clock. Write data is
registered on the rising edges of both K and K. Read data is
driven on the rising edges of C and C if provided, or on the rising
edge of K and K if C/C are not provided. Each address location
is associated with four 8-bit words in the case of CY7C1317CV18
and four 9-bit words in the case of CY7C1917CV18 that burst
sequentially into or out of the device. The burst counter always
starts with a ‘00’ internally in the case of CY7C1317CV18 and
CY7C1917CV18. For CY7C1319CV18 and CY7C1321CV18,
the burst counter takes in the least two significant bits of the
external address and bursts four 18-bit words in the case of
CY7C1319CV18, and four 36-bit words in the case of
CY7C1321CV18, sequentially into or out of the device.
■
Operates similar to a DDR-I device with 1 cycle read latency in
DLL off mode
■
1.8V core power supply with HSTL inputs and outputs
■
Variable drive HSTL output buffers
■
Expanded HSTL output voltage (1.4V–VDD)
■
Available in 165-Ball FBGA package (13 x 15 x 1.4 mm)
■
Offered in both Pb-free and non Pb-free packages
■
JTAG 1149.1 compatible test access port
■
Delay Lock Loop (DLL) for accurate data placement
Asynchronous inputs include an output impedance matching
input (ZQ). Synchronous data outputs (Q, sharing the same
physical pins as the data inputs, D) are tightly matched to the two
output echo clocks CQ/CQ, eliminating the need to capture data
separately from each individual DDR SRAM in the system
design. Output data clocks (C/C) enable maximum system
clocking and data synchronization flexibility.
All synchronous inputs pass through input registers controlled by
the K or K input clocks. All data outputs pass through output
registers controlled by the C or C (or K or K in a single clock
domain) input clocks. Writes are conducted with on-chip
synchronous self-timed write circuitry.
Configurations
CY7C1317CV18 – 2M x 8
CY7C1917CV18 – 2M x 9
CY7C1319CV18 – 1M x 18
CY7C1321CV18 – 512K x 36
Selection Guide
Description
300 MHz
278 MHz
250 MHz
200 MHz
167 MHz
Unit
300
278
250
200
167
MHz
x8
770
720
670
580
515
mA
x9
770
720
670
580
515
x18
810
760
700
600
540
x36
890
830
765
655
600
Maximum Operating Frequency
Maximum Operating Current
Cypress Semiconductor Corporation
Document Number: 001-07161 Rev. *B
•
198 Champion Court
•
San Jose, CA 95134-1709
•
408-943-2600
Revised September 26, 2007
[+] Feedback
CY7C1317CV18, CY7C1917CV18
CY7C1319CV18, CY7C1321CV18
Logic Block Diagram (CY7C1317CV18)
Write Add. Decode
Write
Reg
512K x 8 Array
DOFF
Write
Reg
512K x 8 Array
CLK
Gen.
K
512K x 8 Array
K
512K x 8 Array
Address
Register
LD
Write
Reg
Read Add. Decode
Write
Reg
19
A(18:0)
8
Output
Logic
Control
R/W
C
Read Data Reg.
C
32
VREF
16
Control
Logic
R/W
Reg.
16
NWS[1:0]
CQ
8
Reg.
CQ
8
8
Reg.
8
DQ[7:0]
8
Logic Block Diagram (CY7C1917CV18)
DOFF
9
Output
Logic
Control
R/W
C
Read Data Reg.
C
36
VREF
R/W
Write Add. Decode
CLK
Gen.
Write
Reg
512K x 9 Array
K
Write
Reg
512K x 9 Array
K
512K x 9 Array
Address
Register
512K x 9 Array
LD
Write
Reg
Read Add. Decode
Write
Reg
19
A(18:0)
18
Control
Logic
BWS[0]
18
Reg.
Reg.
Reg.
CQ
9
9
9
Document Number: 001-07161 Rev. *B
CQ
9
9
DQ[8:0]
Page 2 of 31
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CY7C1317CV18, CY7C1917CV18
CY7C1319CV18, CY7C1321CV18
Logic Block Diagram (CY7C1319CV18)
Burst
Logic
A(1:0)
CLK
Gen.
K
Write Add. Decode
K
DOFF
Write
Reg
Write
Reg
256K x 18 Array
Address
Register
256K x 18 Array
A(19:2)
LD
Write
Reg
256K x 18 Array
Write
Reg
18
20
256K x 18 Array
A(19:0)
Read Add. Decode
2
18
Output
Logic
Control
R/W
C
Read Data Reg.
C
72
VREF
36
Control
Logic
R/W
Reg.
36
BWS[1:0]
CQ
18
Reg.
CQ
18
18
Reg.
18
DQ[17:0]
18
Logic Block Diagram (CY7C1321CV18)
Burst
Logic
A(1:0)
K
K
CLK
Gen.
DOFF
Write
Reg
Write
Reg
36
Output
Logic
Control
R/W
C
Read Data Reg.
C
144
VREF
R/W
Write Add. Decode
Address
Register
128K x 36 Array
A(18:2)
LD
Write
Reg
128K x 36 Array
Write
Reg
17
128K x 36 Array
19
128K x 36 Array
A(18:0)
Read Add. Decode
2
72
Control
Logic
BWS[3:0]
72
Reg.
Reg.
Reg.
36
CQ
36
CQ
36
36
Document Number: 001-07161 Rev. *B
36
DQ[35:0]
Page 3 of 31
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CY7C1317CV18, CY7C1917CV18
CY7C1319CV18, CY7C1321CV18
Pin Configuration
The pin configuration for CY7C1317CV18, CY7C1917CV18, CY7C1319CV18, and CY7C1321CV18 follow. [1]
165-Ball FBGA (13 x 15 x 1.4 mm) Pinout
CY7C1317CV18 (2M x 8)
A
1
2
3
4
5
6
7
8
9
10
11
CQ
NC/72M
A
R/W
NWS1
K
NC/144M
LD
A
NC/36M
CQ
B
NC
NC
NC
A
NC/288M
K
NWS0
A
NC
NC
DQ3
C
NC
NC
NC
VSS
A
NC
A
VSS
NC
NC
NC
D
NC
NC
NC
VSS
VSS
VSS
VSS
VSS
NC
NC
NC
E
NC
NC
DQ4
VDDQ
VSS
VSS
VSS
VDDQ
NC
NC
DQ2
F
NC
NC
NC
VDDQ
VDD
VSS
VDD
VDDQ
NC
NC
NC
G
NC
NC
DQ5
VDDQ
VDD
VSS
VDD
VDDQ
NC
NC
NC
H
DOFF
VREF
VDDQ
VDDQ
VDD
VSS
VDD
VDDQ
VDDQ
VREF
ZQ
J
NC
NC
NC
VDDQ
VDD
VSS
VDD
VDDQ
NC
DQ1
NC
K
NC
NC
NC
VDDQ
VDD
VSS
VDD
VDDQ
NC
NC
NC
L
NC
DQ6
NC
VDDQ
VSS
VSS
VSS
VDDQ
NC
NC
DQ0
M
NC
NC
NC
VSS
VSS
VSS
VSS
VSS
NC
NC
NC
N
NC
NC
NC
VSS
A
A
A
VSS
NC
NC
NC
P
NC
NC
DQ7
A
A
C
A
A
NC
NC
NC
R
TDO
TCK
A
A
A
C
A
A
A
TMS
TDI
CY7C1917CV18 (2M x 9)
1
2
3
4
5
6
7
8
9
10
11
A
CQ
NC/72M
A
R/W
NC
K
NC/144M
LD
A
NC/36M
CQ
B
NC
NC
NC
A
NC/288M
K
BWS0
A
NC
NC
DQ3
C
NC
NC
NC
VSS
A
NC
A
VSS
NC
NC
NC
D
NC
NC
NC
VSS
VSS
VSS
VSS
VSS
NC
NC
NC
E
NC
NC
DQ4
VDDQ
VSS
VSS
VSS
VDDQ
NC
NC
DQ2
F
NC
NC
NC
VDDQ
VDD
VSS
VDD
VDDQ
NC
NC
NC
G
NC
NC
DQ5
VDDQ
VDD
VSS
VDD
VDDQ
NC
NC
NC
H
DOFF
VREF
VDDQ
VDDQ
VDD
VSS
VDD
VDDQ
VDDQ
VREF
ZQ
J
NC
NC
NC
VDDQ
VDD
VSS
VDD
VDDQ
NC
DQ1
NC
K
NC
NC
NC
VDDQ
VDD
VSS
VDD
VDDQ
NC
NC
NC
L
NC
DQ6
NC
VDDQ
VSS
VSS
VSS
VDDQ
NC
NC
DQ0
M
NC
NC
NC
VSS
VSS
VSS
VSS
VSS
NC
NC
NC
N
NC
NC
NC
VSS
A
A
A
VSS
NC
NC
NC
P
NC
NC
DQ7
A
A
C
A
A
NC
NC
DQ8
R
TDO
TCK
A
A
A
C
A
A
A
TMS
TDI
Note
1. NC/36M, NC/72M, NC/144M and NC/288M are not connected to the die and can be tied to any voltage level.
Document Number: 001-07161 Rev. *B
Page 4 of 31
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CY7C1317CV18, CY7C1917CV18
CY7C1319CV18, CY7C1321CV18
Pin Configuration
(continued)
The pin configuration for CY7C1317CV18, CY7C1917CV18, CY7C1319CV18, and CY7C1321CV18 follow. [1]
165-Ball FBGA (13 x 15 x 1.4 mm) Pinout
CY7C1319CV18 (1M x 18)
A
1
2
3
4
5
6
7
8
9
10
11
CQ
NC/72M
A
R/W
BWS1
K
NC/144M
LD
A
NC/36M
CQ
B
NC
DQ9
NC
A
NC/288M
K
BWS0
A
NC
NC
DQ8
C
NC
NC
NC
VSS
A
A0
A1
VSS
NC
DQ7
NC
D
NC
NC
DQ10
VSS
VSS
VSS
VSS
VSS
NC
NC
NC
E
NC
NC
DQ11
VDDQ
VSS
VSS
VSS
VDDQ
NC
NC
DQ6
F
NC
DQ12
NC
VDDQ
VDD
VSS
VDD
VDDQ
NC
NC
DQ5
G
NC
NC
DQ13
VDDQ
VDD
VSS
VDD
VDDQ
NC
NC
NC
H
DOFF
VREF
VDDQ
VDDQ
VDD
VSS
VDD
VDDQ
VDDQ
VREF
ZQ
J
NC
NC
NC
VDDQ
VDD
VSS
VDD
VDDQ
NC
DQ4
NC
K
NC
NC
DQ14
VDDQ
VDD
VSS
VDD
VDDQ
NC
NC
DQ3
L
NC
DQ15
NC
VDDQ
VSS
VSS
VSS
VDDQ
NC
NC
DQ2
M
NC
NC
NC
VSS
VSS
VSS
VSS
VSS
NC
DQ1
NC
N
NC
NC
DQ16
VSS
A
A
A
VSS
NC
NC
NC
P
NC
NC
DQ17
A
A
C
A
A
NC
NC
DQ0
R
TDO
TCK
A
A
A
C
A
A
A
TMS
TDI
CY7C1321CV18 (512K x 36)
1
2
3
4
5
6
7
8
9
10
11
R/W
BWS2
K
BWS1
LD
A
NC/72M
CQ
DQ18
A
BWS3
K
BWS0
A
NC
NC
DQ8
DQ28
VSS
A
A0
A1
VSS
NC
DQ17
DQ7
DQ19
VSS
VSS
VSS
VSS
VSS
NC
NC
DQ16
DQ20
VDDQ
VSS
VSS
VSS
VDDQ
NC
DQ15
DQ6
DQ21
VDDQ
VDD
VSS
VDD
VDDQ
NC
NC
DQ5
DQ22
VDDQ
VDD
VSS
VDD
VDDQ
NC
NC
DQ14
VDDQ
VDDQ
VDD
VSS
VDD
VDDQ
VDDQ
VREF
ZQ
DQ32
VDDQ
VDD
VSS
VDD
VDDQ
NC
DQ13
DQ4
DQ23
VDDQ
VDD
VSS
VDD
VDDQ
NC
DQ12
DQ3
DQ33
DQ24
VDDQ
VSS
VSS
VSS
VDDQ
NC
NC
DQ2
NC/144M NC/36M
A
CQ
B
NC
DQ27
C
NC
NC
D
NC
DQ29
E
NC
NC
F
NC
DQ30
G
NC
DQ31
H
DOFF
VREF
J
NC
NC
K
NC
NC
L
NC
M
NC
NC
DQ34
VSS
VSS
VSS
VSS
VSS
NC
DQ11
DQ1
N
NC
DQ35
DQ25
VSS
A
A
A
VSS
NC
NC
DQ10
P
NC
NC
DQ26
A
A
C
A
A
NC
DQ9
DQ0
R
TDO
TCK
A
A
A
C
A
A
A
TMS
TDI
Document Number: 001-07161 Rev. *B
Page 5 of 31
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CY7C1317CV18, CY7C1917CV18
CY7C1319CV18, CY7C1321CV18
Pin Definitions
Pin Name
IO
Pin Description
DQ[x:0]
Input Output- Data Input Output Signals. Inputs are sampled on the rising edge of K and K clocks during valid write
Synchronous operations. These pins drive out the requested data during a read operation. Valid data is driven out on
the rising edge of both the C and C clocks during read operations or K and K when in single clock mode.
When read access is deselected, Q[x:0] are automatically tri-stated.
CY7C1317CV18 − DQ[7:0]
CY7C1917CV18 − DQ[8:0]
CY7C1319CV18 − DQ[17:0]
CY7C1321CV18 − DQ[35:0]
LD
InputSynchronous Load. This input is brought LOW when a bus cycle sequence is defined. This definition
Synchronous includes address and read/write direction. All transactions operate on a burst of 4 data (two clock periods
of bus activity).
NWS0,
NWS1
InputNibble Write Select 0, 1 − Active LOW (CY7C1317CV18 only). Sampled on the rising edge of the K
Synchronous and K clocks during write operations. Used to select which nibble is written into the device during the
current portion of the write operations. Nibbles not written remain unaltered.
NWS0 controls D[3:0] and NWS1 controls D[7:4].
All the Nibble Write Selects are sampled on the same edge as the data. Deselecting a Nibble Write Select
ignores the corresponding nibble of data and it is not written into the device.
BWS0,
BWS1,
BWS2,
BWS3
InputByte Write Select 0, 1, 2, and 3 − Active LOW. Sampled on the rising edge of the K and K clocks during
Synchronous write operations. Used to select which byte is written into the device during the current portion of the Write
operations. Bytes not written remain unaltered.
CY7C1917CV18 − BWS0 controls D[8:0]
CY7C1319CV18 − BWS0 controls D[8:0] and BWS1 controls D[17:9].
CY7C1321CV18 − BWS0 controls D[8:0], BWS1 controls D[17:9], BWS2 controls D[26:18] and BWS3 controls
D[35:27].
All the Byte Write Selects are sampled on the same edge as the data. Deselecting a Byte Write Select
ignores the corresponding byte of data and it is not written into the device.
A, A0, A1
InputAddress Inputs. These address inputs are multiplexed for both read and write operations. Internally, the
Synchronous device is organized as 2M x 8 (4 arrays each of 512K x 8) for CY7C1317CV18 and 2M x 9 (4 arrays each
of 512K x 9) for CY7C1917CV18, 1M x 18 (4 arrays each of 256K x 18) for CY7C1319CV18, and 512K
x 36 (4 arrays each of 128K x 36) for CY7C1321CV18.
CY7C1317CV18 – Because the least two significant bits of the address internally are “00”, only 19 external
address inputs are needed to access the entire memory array.
CY7C1917CV18 – Because the least two significant bits of the address internally are “00”, only 19 external
address inputs are needed to access the entire memory array.
CY7C1319CV18 – A0 and A1 are the inputs to the burst counter. These are incremented internally in a
linear fashion. 20 address inputs are needed to access the entire memory array.
CY7C1321CV18 – A0 and A1 are the inputs to the burst counter. These are incremented internally in a
linear fashion. 19 address inputs are needed to access the entire memory array.
R/W
InputSynchronous Read/Write Input. When LD is LOW, this input designates the access type (read when
Synchronous R/W is HIGH, write when R/W is LOW) for the loaded address. R/W must meet the setup and hold times
around the edge of K.
C
Input Clock
Positive Input Clock for Output Data. C is used in conjunction with C to clock out the read data from
the device. C and C can be used together to deskew the flight times of various devices on the board back
to the controller. See Application Example on page 10 for more information.
C
Input Clock
Negative Input Clock for Output Data. C is used in conjunction with C to clock out the read data from
the device. C and C can be used together to deskew the flight times of various devices on the board back
to the controller. See Application Example on page 10 for more information.
K
Input Clock
Positive Input Clock Input. The rising edge of K is used to capture synchronous inputs to the device
and to drive out data through Q[x:0] when in single clock mode. All accesses are initiated on the rising
edge of K.
K
Input Clock
Negative Input Clock Input. K is used to capture synchronous data being presented to the device and
to drive out data through Q[x:0] when in single clock mode.
Document Number: 001-07161 Rev. *B
Page 6 of 31
[+] Feedback
CY7C1317CV18, CY7C1917CV18
CY7C1319CV18, CY7C1321CV18
Pin Definitions
Pin Name
(continued)
IO
Pin Description
CQ
Output Clock CQ Referenced with Respect to C. This is a free running clock and is synchronized to the input clock
for output data (C) of the DDR-II. In single clock mode, CQ is generated with respect to K. The timing for
the echo clocks is shown in Switching Characteristics on page 24.
CQ
Output Clock CQ Referenced with Respect to C. This is a free running clock and is synchronized to the input clock
for output data (C) of the DDR-II. In single clock mode, CQ is generated with respect to K. The timing for
the echo clocks is shown in Switching Characteristics on page 24.
ZQ
Input
Output Impedance Matching Input. This input is used to tune the device outputs to the system data bus
impedance. CQ, CQ, and Q[x:0] output impedance are set to 0.2 x RQ, where RQ is a resistor connected
between ZQ and ground. Alternatively, this pin can be connected directly to VDDQ, which enables the
minimum impedance mode. This pin cannot be connected directly to GND or left unconnected.
DOFF
Input
DLL Turn Off − Active LOW. Connecting this pin to ground turns off the DLL inside the device. The timing
in the DLL turned off operation is different from that listed in this data sheet. For normal operation, this
pin can be connected to a pull up through a 10 Kohm or less pull up resistor. The device behaves in DDR-I
mode when the DLL is turned off. In this mode, the device can be operated at a frequency of up to 167
MHz with DDR-I timing.
TDO
Output
TCK
Input
TCK Pin for JTAG.
TDI
Input
TDI Pin for JTAG.
TMS
Input
TMS Pin for JTAG.
NC
N/A
Not Connected to the Die. Can be tied to any voltage level.
NC/36M
N/A
Not Connected to the Die. Can be tied to any voltage level.
NC/72M
N/A
Not Connected to the Die. Can be tied to any voltage level.
NC/144M
N/A
Not Connected to the Die. Can be tied to any voltage level.
NC/288M
N/A
Not Connected to the Die. Can be tied to any voltage level.
VREF
VDD
VSS
VDDQ
InputReference
TDO for JTAG.
Reference Voltage Input. Static input used to set the reference level for HSTL inputs, outputs, and AC
measurement points.
Power Supply Power Supply Inputs to the Core of the Device.
Ground
Ground for the Device.
Power Supply Power Supply Inputs for the Outputs of the Device.
Document Number: 001-07161 Rev. *B
Page 7 of 31
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CY7C1317CV18, CY7C1917CV18
CY7C1319CV18, CY7C1321CV18
Functional Overview
The CY7C1317CV18, CY7C1917CV18, CY7C1319CV18, and
CY7C1321CV18 are synchronous pipelined Burst SRAMs
equipped with a DDR interface, which operates with a read
latency of one and half cycles when DOFF pin is tied HIGH.
When DOFF pin is set LOW or connected to VSS the device
behaves in DDR-I mode with a read latency of one clock cycle.
Accesses are initiated on the rising edge of the positive input
clock (K). All synchronous input timing is referenced from the
rising edge of the input clocks (K and K) and all output timing is
referenced to the rising edge of the output clocks (C/C, or K/K
when in single clock mode).
All synchronous data inputs (D[x:0]) pass through input registers
controlled by the rising edge of the input clocks (K and K). All
synchronous data outputs (Q[x:0]) pass through output registers
controlled by the rising edge of the output clocks (C/C, or K/K
when in single-clock mode).
All synchronous control (R/W, LD, BWS[0:X]) inputs pass through
input registers controlled by the rising edge of the input clock (K).
CY7C1319CV18 is described in the following sections. The
same basic descriptions apply to CY7C1317CV18,
CY7C1917CV18, and CY7C1321CV18.
Write Operations
Write operations are initiated by asserting R/W LOW and LD
LOW at the rising edge of the positive input clock (K). The
address presented to address inputs is stored in the write
address register and the least two significant bits of the address
are presented to the burst counter. The burst counter increments
the address in a linear fashion. On the following K clock rise the
data presented to D[17:0] is latched and stored into the 18-bit
write data register, provided BWS[1:0] are both asserted active.
On the subsequent rising edge of the negative input clock (K) the
information presented to D[17:0] is also stored into the write data
register, provided BWS[1:0] are both asserted active. This
process continues for one more cycle until four 18-bit words (a
total of 72 bits) of data are stored in the SRAM. The 72 bits of
data are then written into the memory array at the specified
location. Therefore, Write accesses to the device can not be
initiated on two consecutive K clock rises. The internal logic of
the device ignores the second write request. Write accesses can
be initiated on every other rising edge of the positive input clock
(K). Doing so pipelines the data flow such that 18 bits of data can
be transferred into the device on every rising edge of the input
clocks (K and K).
When Write access is deselected, the device ignores all inputs
after the pending write operations are completed.
Read Operations
Byte Write Operations
The CY7C1319CV18 is organized internally as four arrays of
256K x 18. Accesses are completed in a burst of four sequential
18-bit data words. Read operations are initiated by asserting
R/W HIGH and LD LOW at the rising edge of the positive input
clock (K). The address presented to address inputs is stored in
the read address register and the least two significant bits of the
address are presented to the burst counter. The burst counter
increments the address in a linear fashion. Following the next K
clock rise, the corresponding 18-bit word of data from this
address location is driven onto Q[17:0], using C as the output
timing reference. On the subsequent rising edge of C the next
18-bit data word from the address location generated by the
burst counter is driven onto Q[17:0]. This process continues until
all four 18-bit data words have been driven out onto Q[17:0]. The
requested data is valid 0.45 ns from the rising edge of the output
clock (C or C, or K and K when in single clock mode, for 200 MHz
and 250 MHz device). To maintain the internal logic, each read
access must be allowed to complete. Each Read access
consists of four 18-bit data words and takes two clock cycles to
complete. Therefore, Read accesses to the device can not be
initiated on two consecutive K clock rises. The internal logic of
the device ignores the second read request. Read accesses can
be initiated on every other K clock rise. Doing so pipelines the
data flow such that data is transferred out of the device on every
rising edge of the output clocks (C/C or K/K when in single-clock
mode).
Byte write operations are supported by the CY7C1319CV18. A
write operation is initiated as described in the Write Operations
section. The bytes that are written are determined by BWS0 and
BWS1, which are sampled with each set of 18-bit data words.
Asserting the appropriate Byte Write Select input during the data
portion of a write latches the data being presented and writes it
into the device. Deasserting the Byte Write Select input during
the data portion of a write enables the data stored in the device
for that byte to remain unaltered. This feature can be used to
simplify read/modify/write operations to a byte write operation.
The CY7C1319CV18 first completes the pending read transactions, when read access is deselected. Synchronous internal
circuitry automatically tri-states the output following the next
rising edge of the positive output clock (C). This enables a
seamless transition between devices without the insertion of wait
states in a depth expanded memory.
Document Number: 001-07161 Rev. *B
Single Clock Mode
The CY7C1319CV18 can be used with a single clock that
controls both the input and output registers. In this mode the
device recognizes only a single pair of input clocks (K and K) that
control both the input and output registers. This operation is
identical to the operation if the device had zero skew between
the K/K and C/C clocks. All timing parameters remain the same
in this mode. To use this mode of operation, tie C and C HIGH at
power on. This function is a strap option and not alterable during
device operation.
DDR Operation
The CY7C1319CV18 enables high-performance operation
through high clock frequencies (achieved through pipelining) and
double data rate mode of operation. The CY7C1319CV18
requires a single No Operation (NOP) cycle when transitioning
from a read to a write cycle. At higher frequencies, some applications may require a second NOP cycle to avoid contention.
If a read occurs after a write cycle, address and data for the write
are stored in registers. The write information must be stored
because the SRAM cannot perform the last word write to the
array without conflicting with the read. The data stays in this
register until the next write cycle occurs. On the first write cycle
Page 8 of 31
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CY7C1317CV18, CY7C1917CV18
CY7C1319CV18, CY7C1321CV18
after the read(s), the stored data from the earlier write is written
into the SRAM array. This is called a posted write.
If a read is performed on the same address on which a write is
performed in the previous cycle, the SRAM reads out the most
current data. The SRAM does this by bypassing the memory
array and reading the data from the registers.
Depth Expansion
Depth expansion requires replicating the LD control signal for
each bank. All other control signals can be common between
banks as appropriate.
Programmable Impedance
An external resistor, RQ, must be connected between the ZQ pin
on the SRAM and VSS to enable the SRAM to adjust its output
driver impedance. The value of RQ must be 5x the value of the
intended line impedance driven by the SRAM. The allowable
range of RQ to guarantee impedance matching with a tolerance
of ±15% is between 175Ω and 350Ω, with VDDQ = 1.5V. The
output impedance is adjusted every 1024 cycles at power up to
account for drifts in supply voltage and temperature.
Document Number: 001-07161 Rev. *B
Echo Clocks
Echo clocks are provided on the DDR-II to simplify data capture
on high-speed systems. Two echo clocks are generated by the
DDR-II. CQ is referenced with respect to C and CQ is referenced
with respect to C. These are free running clocks and are synchronized to the output clock of the DDR-II. In the single clock mode,
CQ is generated with respect to K and CQ is generated with
respect to K. The timing for the echo clocks is shown in Switching
Characteristics on page 24.
DLL
These chips use a Delay Lock Loop (DLL) that is designed to
function between 120 MHz and the specified maximum clock
frequency. During power up, when the DOFF is tied HIGH, the
DLL is locked after 1024 cycles of stable clock. The DLL can also
be reset by slowing or stopping the input clocks K and K for a
minimum of 30 ns. However, it is not necessary to reset the DLL
to lock to the desired frequency. The DLL automatically locks
1024 clock cycles after a stable clock is presented. The DLL may
be disabled by applying ground to the DOFF pin. When the DLL
is turned off, the device behaves in DDR-I mode (with one cycle
latency and a longer access time). For information refer to the
application note DLL Considerations in QDRII™/DDRII.
Page 9 of 31
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CY7C1317CV18, CY7C1917CV18
CY7C1319CV18, CY7C1321CV18
Application Example
Figure 1 shows two DDR-II used in an application.
Figure 1. Application Example
SRAM#1
DQ
A
DQ
Addresses
BUS
MASTER Cycle Start#
R/W#
(CPU
Return CLK
or
Source CLK
ASIC)
Return CLK#
Source CLK#
Echo Clock1/Echo Clock#1
Echo Clock2/Echo Clock#2
ZQ
CQ/CQ#
LD# R/W# C C# K K#
R = 250ohms
SRAM#2
DQ
A
ZQ
CQ/CQ#
LD# R/W# C C# K K#
R = 250ohms
Vterm = 0.75V
R = 50ohms
Vterm = 0.75V
Truth Table
The truth table for the CY7C1317CV18, CY7C1917CV18, CY7C1319CV18, and CY7C1321CV18 follows. [2, 3, 4, 5, 6, 7]
Operation
K
LD R/W
DQ
DQ
DQ
DQ
Write Cycle:
Load address; wait one cycle;
input write data on four consecutive K
and K rising edges.
L-H
L
L D(A1) at K(t + 1)↑ D(A2) at K(t + 1)↑ D(A3) at K(t + 2)↑ D(A4) at K(t + 2)↑
Read Cycle:
Load address; wait one and a half cycle;
read data on four consecutive C and C
rising edges.
L-H
L
H Q(A1) at C(t + 1)↑ Q(A2) at C(t + 2)↑ Q(A3) at C(t + 2)↑ Q(A4) at C(t + 3)↑
NOP: No Operation
L-H
H
X High-Z
High-Z
High-Z
High-Z
X Previous State
Previous State
Previous State
Previous State
Standby: Clock Stopped
Stopped X
Notes
2. X = “Don’t Care,” H = Logic HIGH, L = Logic LOW, ↑ represents rising edge.
3. Device powers up deselected with the outputs in a tri-state condition.
4. On CY7C1319CV18 and CY7C1321CV18, “A1” represents address location latched by the devices when transaction was initiated and “A2”, “A3”, “A4” represents the
addresses sequence in the burst. On CY7C1317CV18 and CY7C1917CV18, “A1” represents A + ‘00’ and “A2” represents A + ‘01’, “A3” represents A + ‘10’ and “A4”
represents A + ‘11’.
5. “t” represents the cycle at which a read/write operation is started. t + 1 and t + 2 are the first and second clock cycles succeeding the “t” clock cycle.
6. Data inputs are registered at K and K rising edges. Data outputs are delivered on C and C rising edges, except when in single clock mode.
7. It is recommended that K = K and C = C = HIGH when clock is stopped. This is not essential, but permits most rapid restart by overcoming transmission line charging
symmetrically.
Document Number: 001-07161 Rev. *B
Page 10 of 31
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CY7C1317CV18, CY7C1917CV18
CY7C1319CV18, CY7C1321CV18
Burst Address Table
(CY7C1319CV18, CY7C1321CV18)
First Address (External)
Second Address (Internal)
Third Address (Internal)
Fourth Address (Internal)
X..X00
X..X01
X..X10
X..X11
X..X01
X..X10
X..X11
X..X00
X..X10
X..X11
X..X00
X..X01
X..X11
X..X00
X..X01
X..X10
Write Cycle Descriptions
The write cycle description table for CY7C1317CV18 and CY7C1319CV18 follows. [2, 8]
BWS0/ BWS1/
K
K
L
L–H
–
L
L
–
L
H
L–H
L
H
–
H
L
L–H
H
L
–
H
H
L–H
H
H
–
NWS0
NWS1
L
Comments
During the data portion of a write sequence :
CY7C1317CV18 − both nibbles (D[7:0]) are written into the device,
CY7C1319CV18 − both bytes (D[17:0]) are written into the device.
L-H During the data portion of a write sequence :
CY7C1317CV18 − both nibbles (D[7:0]) are written into the device,
CY7C1319CV18 − both bytes (D[17:0]) are written into the device.
–
During the data portion of a write sequence :
CY7C1317CV18 − only the lower nibble (D[3:0]) is written into the device, D[7:4] remains unaltered.
CY7C1319CV18 − only the lower byte (D[8:0]) is written into the device, D[17:9] remains unaltered.
L–H During the data portion of a write sequence :
CY7C1317CV18 − only the lower nibble (D[3:0]) is written into the device, D[7:4] remains unaltered.
CY7C1319CV18 − only the lower byte (D[8:0]) is written into the device, D[17:9] remains unaltered.
–
During the data portion of a write sequence :
CY7C1317CV18 − only the upper nibble (D[7:4]) is written into the device, D[3:0] remains unaltered.
CY7C1319CV18 − only the upper byte (D[17:9]) is written into the device, D[8:0] remains unaltered.
L–H During the data portion of a write sequence :
CY7C1317CV18 − only the upper nibble (D[7:4]) is written into the device, D[3:0] remains unaltered.
CY7C1319CV18 − only the upper byte (D[17:9]) is written into the device, D[8:0] remains unaltered.
–
No data is written into the devices during this portion of a write operation.
L–H No data is written into the devices during this portion of a write operation.
Write Cycle Descriptions
The write cycle description table for CY7C1917CV18 follows. [2, 8]
BWS0
K
K
L
L–H
–
During the Data portion of a write sequence, the single byte (D[8:0]) is written into the device.
L
–
L–H
During the Data portion of a write sequence, the single byte (D[8:0]) is written into the device.
H
L–H
–
No data is written into the device during this portion of a write operation.
H
–
L–H
No data is written into the device during this portion of a write operation.
Note
8. Is based on a write cycle that was initiated in accordance with the Write Cycle Descriptions table. NWS0, NWS1, BWS0, BWS1, BWS2, and BWS3 can be altered on
different portions of a write cycle, as long as the setup and hold requirements are achieved.
Document Number: 001-07161 Rev. *B
Page 11 of 31
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CY7C1317CV18, CY7C1917CV18
CY7C1319CV18, CY7C1321CV18
Write Cycle Descriptions
The write cycle description table for CY7C1321CV18 follows. [2, 8]
BWS0
BWS1
BWS2
BWS3
K
K
Comments
L
L
L
L
L–H
–
During the Data portion of a write sequence, all four bytes (D[35:0]) are written into
the device.
L
L
L
L
–
L
H
H
H
L–H
L
H
H
H
–
H
L
H
H
L–H
H
L
H
H
–
H
H
L
H
L–H
H
H
L
H
–
H
H
H
L
L–H
H
H
H
L
–
H
H
H
H
L–H
H
H
H
H
–
Document Number: 001-07161 Rev. *B
L–H During the Data portion of a write sequence, all four bytes (D[35:0]) are written into
the device.
–
During the Data portion of a write sequence, only the lower byte (D[8:0]) is written
into the device. D[35:9] remains unaltered.
L–H During the Data portion of a write sequence, only the lower byte (D[8:0]) is written
into the device. D[35:9] remains unaltered.
–
During the Data portion of a write sequence, only the byte (D[17:9]) is written into
the device. D[8:0] and D[35:18] remains unaltered.
L–H During the Data portion of a write sequence, only the byte (D[17:9]) is written into
the device. D[8:0] and D[35:18] remains unaltered.
–
During the Data portion of a write sequence, only the byte (D[26:18]) is written into
the device. D[17:0] and D[35:27] remains unaltered.
L–H During the Data portion of a write sequence, only the byte (D[26:18]) is written into
the device. D[17:0] and D[35:27] remains unaltered.
–
During the Data portion of a write sequence, only the byte (D[35:27]) is written into
the device. D[26:0] remains unaltered.
L–H During the Data portion of a write sequence, only the byte (D[35:27]) is written into
the device. D[26:0] remains unaltered.
–
No data is written into the device during this portion of a write operation.
L–H No data is written into the device during this portion of a write operation.
Page 12 of 31
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CY7C1317CV18, CY7C1917CV18
CY7C1319CV18, CY7C1321CV18
IEEE 1149.1 Serial Boundary Scan (JTAG)
These SRAMs incorporate a serial boundary scan Test Access
Port (TAP) in the FBGA package. This part is fully compliant with
IEEE Standard #1149.1-2001. The TAP operates using JEDEC
standard 1.8V IO logic levels.
Disabling the JTAG Feature
It is possible to operate the SRAM without using the JTAG
feature. To disable the TAP controller, TCK must be tied LOW
(VSS) to prevent clocking of the device. TDI and TMS are internally pulled up and may be unconnected. They may alternatively
be connected to VDD through a pull up resistor. TDO must be left
unconnected. Upon power up, the device comes up in a reset
state, which does not interfere with the operation of the device.
Test Access Port—Test Clock
The test clock is used only with the TAP controller. All inputs are
captured on the rising edge of TCK. All outputs are driven from
the falling edge of TCK.
Test Mode Select (TMS)
The TMS input is used to give commands to the TAP controller
and is sampled on the rising edge of TCK. This pin may be left
unconnected if the TAP is not used. The pin is pulled up internally, resulting in a logic HIGH level.
Test Data-In (TDI)
The TDI pin is used to serially input information into the registers
and can be connected to the input of any of the registers. The
register between TDI and TDO is chosen by the instruction that
is loaded into the TAP instruction register. For information on
loading the instruction register, see the TAP Controller State
Diagram on page 15. TDI is internally pulled up and can be
unconnected if the TAP is unused in an application. TDI is
connected to the most significant bit (MSB) on any register.
Instruction Register
Three-bit instructions can be serially loaded into the instruction
register. This register is loaded when it is placed between the TDI
and TDO pins, as shown in TAP Controller Block Diagram on
page 16. Upon power up, the instruction register is loaded with
the IDCODE instruction. It is also loaded with the IDCODE
instruction if the controller is placed in a reset state, as described
in the previous section.
When the TAP controller is in the Capture-IR state, the two least
significant bits are loaded with a binary “01” pattern to allow for
fault isolation of the board level serial test path.
Bypass Register
To save time when serially shifting data through registers, it is
sometimes advantageous to skip certain chips. The bypass
register is a single-bit register that can be placed between TDI
and TDO pins. This enables shifting of data through the SRAM
with minimal delay. The bypass register is set LOW (VSS) when
the BYPASS instruction is executed.
Boundary Scan Register
The boundary scan register is connected to all of the input and
output pins on the SRAM. Several No Connect (NC) pins are also
included in the scan register to reserve pins for higher density
devices.
The boundary scan register is loaded with the contents of the
RAM input and output ring when the TAP controller is in the
Capture-DR state and is then placed between the TDI and TDO
pins when the controller is moved to the Shift-DR state. The
EXTEST, SAMPLE/PRELOAD, and SAMPLE Z instructions can
be used to capture the contents of the input and output ring.
The Boundary Scan Order on page 19 shows the order in which
the bits are connected. Each bit corresponds to one of the bumps
on the SRAM package. The MSB of the register is connected to
TDI, and the LSB is connected to TDO.
Test Data-Out (TDO)
Identification (ID) Register
The TDO output pin is used to serially clock data out from the
registers. The output is active, depending upon the current state
of the TAP state machine (see Instruction Codes on page 18).
The output changes on the falling edge of TCK. TDO is
connected to the least significant bit (LSB) of any register.
The ID register is loaded with a vendor-specific, 32-bit code
during the Capture-DR state when the IDCODE command is
loaded in the instruction register. The IDCODE is hardwired into
the SRAM and can be shifted out when the TAP controller is in
the Shift-DR state. The ID register has a vendor code and other
information described in Identification Register Definitions on
page 18.
Performing a TAP Reset
A Reset is performed by forcing TMS HIGH (VDD) for five rising
edges of TCK. This Reset does not affect the operation of the
SRAM and can be performed while the SRAM is operating. At
power up, the TAP is reset internally to ensure that TDO comes
up in a high-Z state.
TAP Registers
Registers are connected between the TDI and TDO pins to scan
the data in and out of the SRAM test circuitry. Only one register
can be selected at a time through the instruction registers. Data
is serially loaded into the TDI pin on the rising edge of TCK. Data
is output on the TDO pin on the falling edge of TCK.
Document Number: 001-07161 Rev. *B
TAP Instruction Set
Eight different instructions are possible with the three-bit
instruction register. All combinations are listed in Instruction
Codes on page 18. Three of these instructions are listed as
RESERVED and must not be used. The other five instructions
are described in this section in detail.
Instructions are loaded into the TAP controller during the Shift-IR
state when the instruction register is placed between TDI and
TDO. During this state, instructions are shifted through the
instruction register through the TDI and TDO pins. To execute
the instruction once it is shifted in, the TAP controller must be
moved into the Update-IR state.
Page 13 of 31
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CY7C1317CV18, CY7C1917CV18
CY7C1319CV18, CY7C1321CV18
IDCODE
The IDCODE instruction loads a vendor-specific, 32-bit code into
the instruction register. It also places the instruction register
between the TDI and TDO pins and shifts the IDCODE out of the
device when the TAP controller enters the Shift-DR state. The
IDCODE instruction is loaded into the instruction register at
power up or whenever the TAP controller is supplied a
Test-Logic-Reset state.
SAMPLE Z
The SAMPLE Z instruction connects the boundary scan register
between the TDI and TDO pins when the TAP controller is in a
Shift-DR state. The SAMPLE Z command puts the output bus
into a High-Z state until the next command is supplied during the
Update IR state.
SAMPLE/PRELOAD
SAMPLE/PRELOAD is a 1149.1 mandatory instruction. When
the SAMPLE/PRELOAD instructions are loaded into the
instruction register and the TAP controller is in the Capture-DR
state, a snapshot of data on the input and output pins is captured
in the boundary scan register.
The user must be aware that the TAP controller clock can only
operate at a frequency up to 20 MHz, while the SRAM clock
operates more than an order of magnitude faster. Because there
is a large difference in the clock frequencies, it is possible that
during the Capture-DR state, an input or output undergoes a
transition. The TAP may then try to capture a signal while in
transition (metastable state). This does not harm the device, but
there is no guarantee as to the value that is captured.
Repeatable results may not be possible.
PRELOAD places an initial data pattern at the latched parallel
outputs of the boundary scan register cells before the selection
of another boundary scan test operation.
The shifting of data for the SAMPLE and PRELOAD phases can
occur concurrently when required, that is, while the data
captured is shifted out, the preloaded data can be shifted in.
BYPASS
When the BYPASS instruction is loaded in the instruction register
and the TAP is placed in a Shift-DR state, the bypass register is
placed between the TDI and TDO pins. The advantage of the
BYPASS instruction is that it shortens the boundary scan path
when multiple devices are connected together on a board.
EXTEST
The EXTEST instruction drives the preloaded data out through
the system output pins. This instruction also connects the
boundary scan register for serial access between the TDI and
TDO in the Shift-DR controller state.
EXTEST OUTPUT BUS TRI-STATE
IEEE Standard 1149.1 mandates that the TAP controller be able
to put the output bus into a tri-state mode.
The boundary scan register has a special bit located at bit #47.
When this scan cell, called the “extest output bus tri-state,” is
latched into the preload register during the Update-DR state in
the TAP controller, it directly controls the state of the output
(Q-bus) pins, when the EXTEST is entered as the current
instruction. When HIGH, it enables the output buffers to drive the
output bus. When LOW, this bit places the output bus into a
High-Z condition.
To guarantee that the boundary scan register captures the
correct value of a signal, the SRAM signal must be stabilized
long enough to meet the TAP controller's capture setup plus hold
times (tCS and tCH). The SRAM clock input might not be captured
correctly if there is no way in a design to stop (or slow) the clock
during a SAMPLE/PRELOAD instruction. If this is an issue, it is
still possible to capture all other signals and simply ignore the
value of the CK and CK captured in the boundary scan register.
This bit can be set by entering the SAMPLE/PRELOAD or
EXTEST command, and then shifting the desired bit into that cell,
during the Shift-DR state. During Update-DR, the value loaded
into that shift-register cell latches into the preload register. When
the EXTEST instruction is entered, this bit directly controls the
output Q-bus pins. Note that this bit is pre-set HIGH to enable
the output when the device is powered up, and also when the
TAP controller is in the Test-Logic-Reset state.
Once the data is captured, it is possible to shift out the data by
putting the TAP into the Shift-DR state. This places the boundary
scan register between the TDI and TDO pins.
Reserved
Document Number: 001-07161 Rev. *B
These instructions are not implemented but are reserved for
future use. Do not use these instructions.
Page 14 of 31
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CY7C1317CV18, CY7C1917CV18
CY7C1319CV18, CY7C1321CV18
TAP Controller State Diagram
The state diagram for the TAP controller follows. [9]
1
TEST-LOGIC
RESET
0
0
TEST-LOGIC/
IDLE
1
SELECT
DR-SCAN
1
1
SELECT
IR-SCAN
0
0
1
1
CAPTURE-DR
CAPTURE-IR
0
0
SHIFT-DR
0
SHIFT-IR
1
1
EXIT1-DR
1
EXIT1-IR
0
1
0
PAUSE-DR
0
PAUSE-IR
1
0
1
0
EXIT2-DR
0
EXIT2-IR
1
1
UPDATE-IR
UPDATE-DR
1
0
0
1
0
Note
9. The 0/1 next to each state represents the value at TMS at the rising edge of TCK.
Document Number: 001-07161 Rev. *B
Page 15 of 31
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CY7C1317CV18, CY7C1917CV18
CY7C1319CV18, CY7C1321CV18
TAP Controller Block Diagram
0
Bypass Register
2
Selection
Circuitry
TDI
1
0
Selection
Circuitry
Instruction Register
31
30
29
.
.
2
1
0
1
0
TDO
Identification Register
106
.
.
.
.
2
Boundary Scan Register
TCK
TAP Controller
TMS
TAP Electrical Characteristics
Over the Operating Range [10, 11, 12]
Parameter
Description
Test Conditions
Min
Max
Unit
VOH1
Output HIGH Voltage
IOH = −2.0 mA
1.4
V
VOH2
Output HIGH Voltage
IOH = −100 μA
1.6
V
VOL1
Output LOW Voltage
IOL = 2.0 mA
0.4
V
VOL2
Output LOW Voltage
IOL = 100 μA
0.2
V
VIH
Input HIGH Voltage
VIL
Input LOW Voltage
IX
Input and Output Load Current
0.65VDD VDD + 0.3
GND ≤ VI ≤ VDD
V
–0.3
0.35VDD
V
–5
5
μA
Notes
10. These characteristics pertain to the TAP inputs (TMS, TCK, TDI and TDO). Parallel load levels are specified in the Electrical Characteristics Table.
11. Overshoot: VIH(AC) < VDDQ + 0.85V (Pulse width less than tCYC/2), Undershoot: VIL(AC) > −1.5V (Pulse width less than tCYC/2).
12. All Voltage referenced to Ground.
Document Number: 001-07161 Rev. *B
Page 16 of 31
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CY7C1317CV18, CY7C1917CV18
CY7C1319CV18, CY7C1321CV18
TAP AC Switching Characteristics
Over the Operating Range [13, 14]
Parameter
Description
Min
Max
Unit
20
MHz
tTCYC
TCK Clock Cycle Time
tTF
TCK Clock Frequency
tTH
TCK Clock HIGH
20
ns
tTL
TCK Clock LOW
20
ns
tTMSS
TMS Setup to TCK Clock Rise
5
ns
tTDIS
TDI Setup to TCK Clock Rise
5
ns
tCS
Capture Setup to TCK Rise
5
ns
tTMSH
TMS Hold after TCK Clock Rise
5
ns
tTDIH
TDI Hold after Clock Rise
5
ns
tCH
Capture Hold after Clock Rise
5
ns
50
ns
Setup Times
Hold Times
Output Times
tTDOV
TCK Clock LOW to TDO Valid
tTDOX
TCK Clock LOW to TDO Invalid
10
0
ns
ns
TAP Timing and Test Conditions
Figure 2 shows the TAP timing and test conditions. [14]
Figure 2. TAP Timing and Test Conditions
0.9V
ALL INPUT PULSES
1.8V
50Ω
0.9V
TDO
0V
Z0 = 50Ω
(a)
CL = 20 pF
tTH
GND
tTL
Test Clock
TCK
tTCYC
tTMSH
tTMSS
Test Mode Select
TMS
tTDIS
tTDIH
Test Data In
TDI
Test Data Out
TDO
tTDOV
tTDOX
Notes
13. tCS and tCH refer to the setup and hold time requirements of latching data from the boundary scan register.
14. Test conditions are specified using the load in TAP AC Test Conditions. tR/tF = 1 ns.
Document Number: 001-07161 Rev. *B
Page 17 of 31
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CY7C1317CV18, CY7C1917CV18
CY7C1319CV18, CY7C1321CV18
Identification Register Definitions
Instruction Field
Value
CY7C1317CV18
CY7C1917CV18
CY7C1319CV18
CY7C1321CV18
001
001
001
001
Cypress Device ID
(28:12)
11010100011000101
11010100011001101
11010100011010101
Cypress JEDEC ID
(11:1)
00000110100
00000110100
00000110100
00000110100
1
1
1
1
Revision Number
(31:29)
ID Register
Presence (0)
Description
Version number.
11010100011100101 Defines the type of
SRAM.
Allows unique
identification of
SRAM vendor.
Indicates the
presence of an ID
register.
Scan Register Sizes
Register Name
Bit Size
Instruction
3
Bypass
1
ID
32
Boundary Scan
107
Instruction Codes
Instruction
Code
Description
EXTEST
000
Captures the input and output ring contents.
IDCODE
001
Loads the ID register with the vendor ID code and places the register between TDI and TDO.
This operation does not affect SRAM operation.
SAMPLE Z
010
Captures the input and output contents. Places the boundary scan register between TDI and
TDO. Forces all SRAM output drivers to a High-Z state.
RESERVED
011
Do Not Use: This instruction is reserved for future use.
SAMPLE/PRELOAD
100
Captures the input and output ring contents. Places the boundary scan register between TDI
and TDO. Does not affect the SRAM operation.
RESERVED
101
Do Not Use: This instruction is reserved for future use.
RESERVED
110
Do Not Use: This instruction is reserved for future use.
BYPASS
111
Places the bypass register between TDI and TDO. This operation does not affect SRAM
operation.
Document Number: 001-07161 Rev. *B
Page 18 of 31
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CY7C1317CV18, CY7C1917CV18
CY7C1319CV18, CY7C1321CV18
Boundary Scan Order
Bit #
Bump ID
Bit #
Bump ID
Bit #
Bump ID
Bit #
Bump ID
0
6R
28
10G
56
6A
84
2J
1
6P
29
9G
57
5B
85
3K
2
6N
30
11F
58
5A
86
3J
3
7P
31
11G
59
4A
87
2K
4
7N
32
9F
60
5C
88
1K
5
7R
33
10F
61
4B
89
2L
6
8R
34
11E
62
3A
90
3L
7
8P
35
10E
63
1H
91
1M
8
9R
36
10D
64
1A
92
1L
9
11P
37
9E
65
2B
93
3N
10
10P
38
10C
66
3B
94
3M
11
10N
39
11D
67
1C
95
1N
12
9P
40
9C
68
1B
96
2M
13
10M
41
9D
69
3D
97
3P
14
11N
42
11B
70
3C
98
2N
15
9M
43
11C
71
1D
99
2P
16
9N
44
9B
72
2C
100
1P
17
11L
45
10B
73
3E
101
3R
18
11M
46
11A
74
2D
102
4R
19
9L
47
Internal
75
2E
103
4P
20
10L
48
9A
76
1E
104
5P
21
11K
49
8B
77
2F
105
5N
22
10K
50
7C
78
3F
106
5R
23
9J
51
6C
79
1G
24
9K
52
8A
80
1F
25
10J
53
7A
81
3G
26
11J
54
7B
82
2G
27
11H
55
6B
83
1J
Document Number: 001-07161 Rev. *B
Page 19 of 31
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CY7C1317CV18, CY7C1917CV18
CY7C1319CV18, CY7C1321CV18
Power Up Sequence in DDR-II SRAM
DDR-II SRAMs must be powered up and initialized in a
predefined manner to prevent undefined operations. During
power up, when the DOFF is tied HIGH, the DLL is locked after
1024 cycles of stable clock.
Power Up Sequence
■
Apply power and drive DOFF LOW (all other inputs can be
HIGH or LOW)
❐ Apply VDD before VDDQ
❐ Apply VDDQ before VREF or at the same time as VREF
■
After the power and clock (K, K) are stable take DOFF HIGH
■
The additional 1024 cycles of clocks are required for the DLL
to lock.
DLL Constraints
■
DLL uses K clock as its synchronizing input. The input must
have low phase jitter, which is specified as tKC Var.
■
The DLL functions at frequencies down to 120 MHz.
■
If the input clock is unstable and the DLL is enabled, then the
DLL may lock onto an incorrect frequency, causing unstable
SRAM behavior. To avoid this, provide 1024 cycles stable clock
to relock to the desired clock frequency.
~
~
Power Up Waveforms
K
K
~
~
Unstable Clock
> 1024 Stable clock
Start Normal
Operation
Clock Start (Clock Starts after V DD / V DDQ Stable)
VDD / VDDQ
DOFF
Document Number: 001-07161 Rev. *B
V DD / V DDQ Stable (< +/- 0.1V DC per 50ns )
Fix High (or tied to VDDQ)
Page 20 of 31
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CY7C1319CV18, CY7C1321CV18
Maximum Ratings
Current into Outputs (LOW) ........................................ 20 mA
Exceeding maximum ratings may impair the useful life of the
device. These user guidelines are not tested.
Storage Temperature ................................. –65°C to +150°C
Static Discharge Voltage (MIL-STD-883, M 3015).... >2001V
Latch up Current..................................................... >200 mA
Operating Range
Ambient Temperature with Power Applied.... –10°C to +85°C
Supply Voltage on VDD Relative to GND ........–0.5V to +2.9V
Range
Supply Voltage on VDDQ Relative to GND.......–0.5V to +VDD
Commercial
DC Applied to Outputs in High-Z ......... –0.5V to VDDQ + 0.3V
Industrial
DC Input Voltage
[11]
Ambient
Temperature (TA)
VDD [15]
VDDQ [15]
0°C to +70°C
1.8 ± 0.1V
1.4V to
VDD
–40°C to +85°C
.............................. –0.5V to VDD + 0.3V
Electrical Characteristics
DC Electrical Characteristics
Over the Operating Range [12]
Min
Typ
Max
Unit
VDD
Parameter
Power Supply Voltage
Description
Test Conditions
1.7
1.8
1.9
V
VDDQ
IO Supply Voltage
1.4
1.5
VDD
V
VOH
Output HIGH Voltage
Note 16
VDDQ/2 – 0.12
VDDQ/2 + 0.12
V
VOL
Output LOW Voltage
Note 17
VDDQ/2 – 0.12
VDDQ/2 + 0.12
V
VOH(LOW)
Output HIGH Voltage
IOH = −0.1 mA, Nominal Impedance
VDDQ – 0.2
VDDQ
V
VOL(LOW)
Output LOW Voltage
IOL = 0.1 mA, Nominal Impedance
VSS
0.2
V
VIH
Input HIGH Voltage
VREF + 0.1
VDDQ + 0.3
V
VIL
Input LOW Voltage
–0.3
VREF – 0.1
V
IX
Input Leakage Current
GND ≤ VI ≤ VDDQ
−5
5
μA
IOZ
Output Leakage Current
GND ≤ VI ≤ VDDQ, Output Disabled
−5
5
μA
VREF
Input Reference Voltage [18] Typical Value = 0.75V
0.95
V
IDD
VDD Operating Supply
(x8)
770
mA
(x9)
770
(x18)
810
(x36)
890
(x8)
720
(x9)
720
(x18)
760
(x36)
830
(x8)
670
(x9)
670
(x18)
700
(x36)
765
VDD = Max,
IOUT = 0 mA,
f = fMAX = 1/tCYC
0.68
300MHz
278MHz
250MHz
0.75
mA
mA
Notes
15. Power up: assumes a linear ramp from 0V to VDD(min) within 200 ms. During this time VIH < VDD and VDDQ < VDD.
16. Outputs are impedance controlled. IOH = –(VDDQ/2)/(RQ/5) for values of 175Ω < RQ < 350Ω.
17. Outputs are impedance controlled. IOL = (VDDQ/2)/(RQ/5) for values of 175Ω < RQ < 350Ω.
18. VREF(min) = 0.68V or 0.46VDDQ, whichever is larger, VREF(max) = 0.95V or 0.54VDDQ, whichever is smaller.
Document Number: 001-07161 Rev. *B
Page 21 of 31
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CY7C1319CV18, CY7C1321CV18
Electrical Characteristics (continued)
DC Electrical Characteristics
Over the Operating Range [12]
Parameter
IDD
Description
VDD Operating Supply
Test Conditions
VDD = Max,
IOUT = 0 mA,
f = fMAX = 1/tCYC
200MHz
167MHz
ISB1
Automatic Power down
Current
Max VDD,
Both Ports Deselected,
VIN ≥ VIH or VIN ≤ VIL
f = fMAX = 1/tCYC,
Inputs Static
300MHz
278MHz
250MHz
200MHz
167MHz
Min
Typ
Max
Unit
(x8)
580
mA
(x9)
580
(x18)
600
(x36)
655
(x8)
515
(x9)
515
(x18)
540
(x36)
600
(x8)
315
(x9)
315
(x18)
325
(x36)
350
(x8)
305
(x9)
305
(x18)
315
(x36)
330
(x8)
300
(x9)
300
(x18)
300
(x36)
320
(x8)
285
(x9)
285
(x18)
290
(x36)
300
(x8)
280
(x9)
280
(x18)
285
(x36)
295
mA
mA
mA
mA
mA
mA
AC Electrical Characteristics
Over the Operating Range [11]
Parameter
Description
Test Conditions
Min
Typ
Max
Unit
VIH
Input HIGH Voltage
VREF + 0.2
–
–
V
VIL
Input LOW Voltage
–
–
VREF – 0.2
V
Document Number: 001-07161 Rev. *B
Page 22 of 31
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CY7C1317CV18, CY7C1917CV18
CY7C1319CV18, CY7C1321CV18
Capacitance
Tested initially and after any design or process change that may affect these parameters.
Parameter
Description
Test Conditions
Max
Unit
5
pF
CIN
Input Capacitance
CCLK
Clock Input Capacitance
6
pF
CO
Output Capacitance
7
pF
165 FBGA
Package
Unit
28.51
°C/W
5.91
°C/W
TA = 25°C, f = 1 MHz, VDD = 1.8V, VDDQ = 1.5V
Thermal Resistance
Tested initially and after any design or process change that may affect these parameters.
Parameter
Description
ΘJA
Thermal Resistance
(Junction to Ambient)
ΘJC
Thermal Resistance
(Junction to Case)
Test Conditions
Test conditions follow standard test methods and
procedures for measuring thermal impedance, in
accordance with EIA/JESD51.
AC Test Loads and Waveforms
VREF = 0.75V
VREF
0.75V
VREF
OUTPUT
Z0 = 50Ω
Device
Under
Test
RL = 50Ω
VREF = 0.75V
ZQ
R = 50Ω
ALL INPUT PULSES
1.25V
0.75V
OUTPUT
Device
Under
Test ZQ
RQ =
250Ω
(a)
0.75V
INCLUDING
JIG AND
SCOPE
5 pF
[19]
0.25V
Slew Rate = 2 V/ns
RQ =
250Ω
(b)
Note
19. Unless otherwise noted, test conditions assume signal transition time of 2V/ns, timing reference levels of 0.75V, VREF = 0.75V, RQ = 250Ω, VDDQ = 1.5V, input pulse
levels of 0.25V to 1.25V, and output loading of the specified IOL/IOH and load capacitance shown in (a) of AC Test Loads and Waveforms.
Document Number: 001-07161 Rev. *B
Page 23 of 31
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CY7C1319CV18, CY7C1321CV18
Switching Characteristics
Over the Operating Range [19, 20]
Cypress Consortium
Parameter Parameter
300 MHz
250 MHz
200 MHz
167 MHz
Unit
Min Max Min Max Min Max Min Max Min Max
VDD(Typical) to the First Access [21]
tPOWER
278 MHz
Description
1
–
1
–
1
–
1
–
1
–
ms
tCYC
tKHKH
K Clock and C Clock Cycle Time
3.3
8.4
3.6
8.4
4.0
8.4
5.0
8.4
6.0
8.4
ns
tKH
tKHKL
Input Clock (K/K and C/C) HIGH
1.32
–
1.4
–
1.6
–
2.0
–
2.4
–
ns
tKL
tKLKH
Input Clock (K/K and C/C) LOW
1.32
–
1.4
–
1.6
–
2.0
–
2.4
–
ns
tKHKH
tKHKH
K Clock Rise to K Clock Rise and C 1.49
to C Rise (rising edge to rising edge)
–
1.6
–
1.8
–
2.2
–
2.7
–
ns
tKHCH
tKHCH
K/K Clock Rise to C/C Clock Rise
(rising edge to rising edge)
0.00 1.45 0.00 1.55 0.00
1.8
0.00
2.2
0.00
2.7
ns
Setup Times
tSA
tAVKH
Address Setup to K Clock Rise
0.4
–
0.4
–
0.5
–
0.6
–
0.7
–
ns
tSC
tIVKH
Control Setup to K Clock Rise
(LD, R/W)
0.4
–
0.4
–
0.5
–
0.6
–
0.7
–
ns
tSCDDR
tIVKH
Double Data Rate Control Setup to
Clock (K/K) Rise
(BWS0, BWS1, BWS2, BWS3)
0.3
–
0.3
–
0.35
–
0.4
–
0.5
–
ns
tSD [22]
tDVKH
D[X:0] Setup to Clock (K/K) Rise
0.3
–
0.3
–
0.35
–
0.4
–
0.5
–
ns
Hold Times
tHA
tKHAX
Address Hold after K Clock Rise
0.4
–
0.4
–
0.5
–
0.6
–
0.7
–
ns
tHC
tKHIX
Control Hold after K Clock Rise
(LD, R/W)
0.4
–
0.4
–
0.5
–
0.6
–
0.7
–
ns
tHCDDR
tKHIX
Double Data Rate Control Hold after 0.3
Clock (K/K) Rise
(BWS0, BWS1, BWS2, BWS3)
–
0.3
–
0.35
–
0.4
–
0.5
–
ns
tHD
tKHDX
D[X:0] Hold after Clock (K/K) Rise
–
0.3
–
0.35
–
0.4
–
0.5
–
ns
0.3
Notes
20. When a part with a maximum frequency above 167 MHz is operating at a lower clock frequency, it requires the input timings of the frequency range in which it is being
operated and outputs data with the output timings of that frequency range.
21. This part has an internal voltage regulator; tPOWER is the time that the power is supplied above VDD minimum initially before a read or write operation can be initiated.
22. For DQ2 data signal on CY7C1917CV18 device, tSD is 0.5 ns for 200 MHz, 250 MHz, 278 MHz and 300 MHz frequencies.
Document Number: 001-07161 Rev. *B
Page 24 of 31
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CY7C1319CV18, CY7C1321CV18
Switching Characteristics (continued)
Over the Operating Range [19, 20]
Cypress Consortium
Parameter Parameter
300 MHz
278 MHz
250 MHz
200 MHz
167 MHz
Description
Unit
Min Max Min Max Min Max Min Max Min Max
Output Times
tCO
tCHQV
C/C Clock Rise (or K/K in single
clock mode) to Data Valid
tDOH
tCHQX
Data Output Hold after Output C/C –0.45
Clock Rise (Active to Active)
tCCQO
tCHCQV
C/C Clock Rise to Echo Clock Valid
tCQOH
tCHCQX
Echo Clock Hold after C/C Clock
Rise
tCQD
tCQHQV
Echo Clock High to Data Valid
tCQDOH
tCQHQX
Echo Clock High to Data Invalid
–
0.45
–
0.45
–
0.45
–
0.45
–
0.50
ns
–
–0.45
–
–0.45
–
–0.45
–
–0.50
–
ns
–
0.45
–
0.45
–
0.45
–
0.45
–
0.50
ns
–0.45
–
–0.45
–
–0.45
–
–0.45
–
–0.50
–
ns
–
0.27
–
0.27
–
0.30
–
0.35
–
0.40
ns
–0.27
–
–0.27
–
–0.30
–
–0.35
–
–0.40
–
ns
[23]
1.24
–
1.35
–
1.55
–
1.95
–
2.45
–
ns
1.24
–
1.35
–
1.55
–
1.95
–
2.45
–
ns
–
0.45
–
0.45
–
0.45
–
0.45
–
0.50
ns
–0.45
–
–0.45
–
–0.45
–
–0.45
–
–0.50
–
ns
–
0.20
–
0.20
–
0.20
–
0.20
–
0.20
ns
tCQH
tCQHCQL
Output Clock (CQ/CQ) HIGH
tCQHCQH
tCQHCQH
CQ Clock Rise to CQ Clock Rise
(rising edge to rising edge) [23]
tCHZ
tCHQZ
Clock (C/C) Rise to High-Z
(Active to High-Z) [24, 25]
tCLZ
tCHQX1
Clock (C/C) Rise to Low-Z [24, 25]
DLL Timing
tKC Var
tKC Var
Clock Phase Jitter
tKC lock
tKC lock
DLL Lock Time (K, C)
1024
–
1024
–
1024
–
1024
–
1024
–
Cycles
tKC Reset
tKC Reset
K Static to DLL Reset
30
–
30
–
30
–
30
–
30
–
ns
Notes
23. These parameters are extrapolated from the input timing parameters (tKHKH - 250 ps, where 250 ps is the internal jitter. An input jitter of 200 ps (tKC Var) is already
included in the tKHKH). These parameters are only guaranteed by design and are not tested in production.
24. tCHZ, tCLZ are specified with a load capacitance of 5 pF as in (b) of AC Test Loads and Waveforms. Transition is measured ±100 mV from steady-state voltage.
25. At any voltage and temperature tCHZ is less than tCLZ and tCHZ less than tCO.
Document Number: 001-07161 Rev. *B
Page 25 of 31
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CY7C1319CV18, CY7C1321CV18
Switching Waveforms
Figure 3. Read/Write/Deselect Sequence [26, 27, 28]
READ
(burst of 4)
5
4
READ
(burst of 4)
3
2
NOP
1
NOP
NOP
6
7
WRITE
(burst of 4)
9
8
WRITE
(burst of 4)
11
10
READ
(burst of 4)
12
13
A3
A4
K
tKH tKL
tCYC
tKHKH
K
LD
tSC tHC
R/W
A
A0
A2
A1
tSA tHA
tHD
tHD
tSD
tSD
DQ
Q00
Q01
Q02
tKHCH tCLZ
Q03
tCO
tDOH
Q10
Q11
Q12
Q13
D20
D21
D22
D23
D30
D31
D32
D33
Q40
tCQD
tCQDOH
tKHCH
tCHZ
C
tKH tKL
tCYC
tKHKH
C
tCQOH
tCCQO
CQ
tCQOH
tCCQO
tCQH
tCQHCQH
CQ
DON’T CARE
UNDEFINED
Notes
26. Q00 refers to output from address A0. Q01 refers to output from the next internal burst address following A0, that is, A0 + 1.
27. Outputs are disabled (High-Z) one clock cycle after a NOP.
28. In this example, if address A4 = A3, then data Q40 = D30, Q41 = D31, Q42 = D32, and Q43 = D43. Write data is forwarded immediately as read results. This note
applies to the whole diagram.
Document Number: 001-07161 Rev. *B
Page 26 of 31
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CY7C1319CV18, CY7C1321CV18
Ordering Information
Not all of the speed, package and temperature ranges are available. Please contact your local sales representative or
visit www.cypress.com for actual products offered.
Speed
(MHz)
300
Ordering Code
CY7C1317CV18-300BZC
Package
Diagram
Package Type
51-85180 165-Ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm)
Operating
Range
Commercial
CY7C1917CV18-300BZC
CY7C1319CV18-300BZC
CY7C1321CV18-300BZC
CY7C1317CV18-300BZXC
51-85180 165-Ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm) Pb-Free
CY7C1917CV18-300BZXC
CY7C1319CV18-300BZXC
CY7C1321CV18-300BZXC
CY7C1317CV18-300BZI
51-85180 165-Ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm)
Industrial
CY7C1917CV18-300BZI
CY7C1319CV18-300BZI
CY7C1321CV18-300BZI
CY7C1317CV18-300BZXI
51-85180 165-Ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm) Pb-Free
CY7C1917CV18-300BZXI
CY7C1319CV18-300BZXI
CY7C1321CV18-300BZXI
278
CY7C1317CV18-278BZC
51-85180 165-Ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm)
Commercial
CY7C1917CV18-278BZC
CY7C1319CV18-278BZC
CY7C1321CV18-278BZC
CY7C1317CV18-278BZXC
51-85180 165-Ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm) Pb-Free
CY7C1917CV18-278BZXC
CY7C1319CV18-278BZXC
CY7C1321CV18-278BZXC
CY7C1317CV18-278BZI
51-85180 165-Ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm)
Industrial
CY7C1917CV18-278BZI
CY7C1319CV18-278BZI
CY7C1321CV18-278BZI
CY7C1317CV18-278BZXI
51-85180 165-Ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm) Pb-Free
CY7C1917CV18-278BZXI
CY7C1319CV18-278BZXI
CY7C1321CV18-278BZXI
Document Number: 001-07161 Rev. *B
Page 27 of 31
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CY7C1317CV18, CY7C1917CV18
CY7C1319CV18, CY7C1321CV18
Ordering Information
(continued)
Not all of the speed, package and temperature ranges are available. Please contact your local sales representative or
visit www.cypress.com for actual products offered.
Speed
(MHz)
250
Ordering Code
CY7C1317CV18-250BZC
Package
Diagram
Package Type
51-85180 165-Ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm)
Operating
Range
Commercial
CY7C1917CV18-250BZC
CY7C1319CV18-250BZC
CY7C1321CV18-250BZC
CY7C1317CV18-250BZXC
51-85180 165-Ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm) Pb-Free
CY7C1917CV18-250BZXC
CY7C1319CV18-250BZXC
CY7C1321CV18-250BZXC
CY7C1317CV18-250BZI
51-85180 165-Ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm)
Industrial
CY7C1917CV18-250BZI
CY7C1319CV18-250BZI
CY7C1321CV18-250BZI
CY7C1317CV18-250BZXI
51-85180 165-Ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm) Pb-Free
CY7C1917CV18-250BZXI
CY7C1319CV18-250BZXI
CY7C1321CV18-250BZXI
200
CY7C1317CV18-200BZC
51-85180 165-Ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm)
Commercial
CY7C1917CV18-200BZC
CY7C1319CV18-200BZC
CY7C1321CV18-200BZC
CY7C1317CV18-200BZXC
51-85180 165-Ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm) Pb-Free
CY7C1917CV18-200BZXC
CY7C1319CV18-200BZXC
CY7C1321CV18-200BZXC
CY7C1317CV18-200BZI
51-85180 165-Ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm)
Industrial
CY7C1917CV18-200BZI
CY7C1319CV18-200BZI
CY7C1321CV18-200BZI
CY7C1317CV18-200BZXI
51-85180 165-Ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm) Pb-Free
CY7C1917CV18-200BZXI
CY7C1319CV18-200BZXI
CY7C1321CV18-200BZXI
Document Number: 001-07161 Rev. *B
Page 28 of 31
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CY7C1317CV18, CY7C1917CV18
CY7C1319CV18, CY7C1321CV18
Ordering Information
(continued)
Not all of the speed, package and temperature ranges are available. Please contact your local sales representative or
visit www.cypress.com for actual products offered.
Speed
(MHz)
167
Ordering Code
CY7C1317CV18-167BZC
Package
Diagram
Package Type
51-85180 165-Ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm)
Operating
Range
Commercial
CY7C1917CV18-167BZC
CY7C1319CV18-167BZC
CY7C1321CV18-167BZC
CY7C1317CV18-167BZXC
51-85180 165-Ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm) Pb-Free
CY7C1917CV18-167BZXC
CY7C1319CV18-167BZXC
CY7C1321CV18-167BZXC
CY7C1317CV18-167BZI
51-85180 165-Ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm)
Industrial
CY7C1917CV18-167BZI
CY7C1319CV18-167BZI
CY7C1321CV18-167BZI
CY7C1317CV18-167BZXI
51-85180 165-Ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm) Pb-Free
CY7C1917CV18-167BZXI
CY7C1319CV18-167BZXI
CY7C1321CV18-167BZXI
Document Number: 001-07161 Rev. *B
Page 29 of 31
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CY7C1317CV18, CY7C1917CV18
CY7C1319CV18, CY7C1321CV18
Package Diagram
Figure 4. 165-ball FBGA (13 x 15 x 1.4 mm), 51-85180
BOTTOM VIEW
PIN 1 CORNER
TOP VIEW
Ø0.05 M C
Ø0.25 M C A B
PIN 1 CORNER
Ø0.50 -0.06
(165X)
+0.14
1
2
3
4
5
6
7
8
9
10
11
11
9
8
7
6
5
4
3
2
1
A
B
B
C
C
1.00
A
D
D
E
F
F
G
G
H
J
14.00
E
15.00±0.10
15.00±0.10
10
H
J
K
L
L
7.00
K
M
M
N
N
P
P
R
R
A
A
1.00
5.00
10.00
B
B
13.00±0.10
13.00±0.10
1.40 MAX.
0.15 C
0.53±0.05
0.25 C
0.15(4X)
NOTES :
SOLDER PAD TYPE : NON-SOLDER MASK DEFINED (NSMD)
PACKAGE WEIGHT : 0.475g
JEDEC REFERENCE : MO-216 / DESIGN 4.6C
PACKAGE CODE : BB0AC
0.35±0.06
0.36
SEATING PLANE
C
Document Number: 001-07161 Rev. *B
51-85180-*A
Page 30 of 31
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CY7C1317CV18, CY7C1917CV18
CY7C1319CV18, CY7C1321CV18
Document History Page
Document Title: CY7C1317CV18/CY7C1917CV18/CY7C1319CV18/CY7C1321CV18, 18-Mbit DDR-II SRAM 4-Word
Burst Architecture
Document Number: 001-07161
REV.
ECN NO.
ISSUE
DATE
ORIG. OF
CHANGE
**
433284
See ECN
NXR
New Data Sheet
*A
462615
See ECN
NXR
Changed tTH and tTL from 40 ns to 20 ns, changed tTMSS, tTDIS, tCS, tTMSH, tTDIH, tCH
from 10 ns to 5 ns and changed tTDOV from 20 ns to 10 ns in TAP AC Switching
Characteristics table
Modified Power-Up waveform
*B
1523383 See ECN
VKN/AESA
DESCRIPTION OF CHANGE
Converted from preliminary to final
Updated Logic Block diagram
Updated IDD/ISB specs
Changed DLL minimum operating frequency from 80MHz to 120MHz
Changed tCYC max spec to 8.4ns
Modified Switching waveform
Modified footnotes 20 and 28
© Cypress Semiconductor Corporation, 2006-2007. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use
of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used
for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use
as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support
systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.
Any Source Code (software and/or firmware) is owned by Cypress Semiconductor Corporation (Cypress) and is protected by and subject to worldwide patent protection (United States and foreign),
United States copyright laws and international treaty provisions. Cypress hereby grants to licensee a personal, non-exclusive, non-transferable license to copy, use, modify, create derivative works of,
and compile the Cypress Source Code and derivative works for the sole purpose of creating custom software and or firmware in support of licensee product to be used only in conjunction with a Cypress
integrated circuit as specified in the applicable agreement. Any reproduction, modification, translation, compilation, or representation of this Source Code except as specified above is prohibited without
the express written permission of Cypress.
Disclaimer: CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS MATERIAL, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES
OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. Cypress reserves the right to make changes without further notice to the materials described herein. Cypress does not
assume any liability arising out of the application or use of any product or circuit described herein. Cypress does not authorize its products for use as critical components in life-support systems where
a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress’ product in a life-support systems application implies that the manufacturer
assumes all risk of such use and in doing so indemnifies Cypress against all charges.
Use may be limited by and subject to the applicable Cypress software license agreement.
Document Number: 001-07161 Rev. *B
Revised September 26, 2007
Page 31 of 31
QDR RAMs and Quad Data Rate RAMs comprise a new family of products developed by Cypress, IDT, NEC, Renesas, and Samsung. All product and company names mentioned in this document
are the trademarks of their respective holders.
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