Microchip DSC6013JI2A-024.0000 Ultra-small, ultra-low power mems oscillator Datasheet

DSC60XX
Ultra-Small, Ultra-Low Power MEMS Oscillator
Features
General Description
• Wide Frequency Range: 2 kHz to 80 MHz
• Ultra-Low Power Consumption: 1.3 mA/12 A
(Active/Stdby)
• Ultra-Small Footprints
- 1.6 mm  1.2 mm
- 2.0 mm  1.6 mm
- 2.5 mm  2.0 mm
- 3.2 mm  2.5 mm
• Frequency Select Input Supports 2 Predefined
Frequencies
• High Stability: ±25, ±50 ppm
• Wide Temperature Range
- Industrial: –40°C to 85°C
- Ext. Commercial: –20° to 70°C
• Excellent Shock & Vibration Immunity
- Qualified to MIL-STD-883
• High Reliability
- 20x Better MTF Than Quartz Oscillators
• Supply Range of 1.71V to 3.63V
• Short Sample Lead Time: <2 weeks
• Lead Free & RoHS Compliant
The DSC60xx family of MEMS oscillators combines
industry-leading low-power consumption, ultra-small
packages with exceptional frequency stability, and jitter
performance over temperature. The single-output
DSC60xx MEMS oscillators are excellent choices for
use as clock references in small, battery-powered
devices such as wearable and Internet of Things (IoT)
devices in which small size, low power consumption,
and long-term reliability are paramount. They also meet
the stringent mechanical durability and reliability
requirements within Automotive Electronics Council
standard Q100 (AEC-Q100), so they are well suited for
under-hood applications as well.
The DSC60xx family is available in ultra-small
1.6 mm x 1.2 mm and 2.0 mm x 1.6 mm packages.
Other package sizes include: 2.5 mm x 2.0 mm and
3.2 mm x 2.5 mm. These packages are “drop-in”
replacements for standard 4-pin CMOS quartz crystal
oscillators.
Package Types
DSC60XX
3.2x2.5
DFN
Top View
Applications
• Low Power/Portable Applications - IoT,
Embedded/Smart Devices
• Consumer - Home Healthcare, Fitness Devices,
Home Automation
• Automotive - Rear View/Surround View Cameras,
Infotainment System
• Industrial - Building/Factory Automation,
Surveillance Camera
4
3
1
2
DSC60XX
2.0x1.6
LGA
Top View
4
3
DSC60XX
2.5x2.0
LGA
Top View
4
3
1
2
DSC60XX
1.6x1.2
LGA
Top View
4
3
1
1
 2016 Microchip Technology Inc.
2
2
DS20005625A-page 1
DSC60XX
Block Diagram
DSC6001/03/11/13/21/23/41/43/51/53/61/63
OE/STBY/FS
PIN 1
SUPPLY
REGULATION
DIGITAL
CONTROL
VDD
PIN 4
MEMS
RESONATOR
GND
PIN 2
TEMP SENSOR
CONTROL &
COMPENSATION
PLL
VCO
OUTPUT
DIVIDER
DRIVER
OUTPUT
PIN 3
DSC6083 (kHz Output)
SUPPLY
REGULATION
DRIVER
P1
OUTPUT
MEMS
RESONATOR
P2
GND
DS20005625A-page 2
TEMP SENSOR
CONTROL &
COMPENSATION
PLL
VCO
OUTPUT
DIVIDER
P4
VDD
P3
DNC
 2016 Microchip Technology Inc.
DSC60XX
1.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings
Supply Voltage .......................................................................................................................................... –0.3V to +4.0V
Input Voltage, VIN ............................................................................................................................... –0.3V to VDD+0.3V
ESD Protection .......................................................................................................4000V HBM, 400V MM, 2000V CDM
ELECTRICAL CHARACTERISTICS
Electrical Characteristics: Unless otherwise indicated, VDD= 1.8V –5% to 3.3V +10%, TA= –40°C to 85°C.
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
Supply Voltage Note 1
VDD
1.71
—
3.63
V
—
Active Supply Current
IDD
—
1.3
—
mA
FOUT = 24 MHz, VDD = 1.8V,
No Load
—
12
—
—
80
—
—
—
±25
±50
—
—
±5
—
—
±1
Standby Supply Current
Note 2
ISTBY
A
VDD = 3.3V
Frequency Stability Note 3
Δf
Aging
Δf
Startup Time
tSU
—
—
1.3
ms
Input Logic Levels Note 4
Input Logic High
Input Logic Low
VIH
0.7xVDD
—
—
V
VIL
—
—
0.3xVDD
V
Output Disable Time
Note 5
tDA
—
—
200+Period
s
—
Output Enable Time
Note 6
tEN
—
—
1
s
—
Enable Pull-up Resistor
Note 7
—
—
300
—
k
If configured
VOH
0.8xVDD
—
—
V
I = 1mA
VOL
—
—
0.2xVDD
V
I = –1mA
Output Logic Levels
Output Logic High
Output Logic Low
Note 1:
2:
3:
4:
5:
6:
7:
8:
ppm
VDD = 1.8/2.5V
ppm
All temp ranges
1st year @25°C
Per year after first year
From 90% VDD to valid clock
output, T = 25°C
—
Pin 4 VDD should be filtered with 0.1 uf capacitor.
Not including current through pull-up resistor on EN pin (if configured). Higher standby current seen at
>3.3V VDD.
Includes frequency variations due to initial tolerance, temp. and power supply voltage.
Input waveform must be monotonic with rise/fall time < 10 ms
Output Disable time takes up to 1 Period of the output waveform + 200 ns.
For parts configured with OE, not Standby.
Output is enabled if pad is floated or not connected.
Output Duty Cycle will be 40% to 60% when output frequency is between 40 MHz to 60 MHz.
 2016 Microchip Technology Inc.
DS20005625A-page 3
DSC60XX
ELECTRICAL CHARACTERISTICS (CONTINUED)
Electrical Characteristics: Unless otherwise indicated, VDD= 1.8V –5% to 3.3V +10%, TA= –40°C to 85°C.
Parameters
Sym.
Min.
Typ.
Max.
—
2.5
3.5
tRX/tFX
Units
ns
—
1.5
2.2
—
1.2
2.0
Conditions
DSC60x3
Low Drive,
20% to 80%
CL=5 pF
VDD = 1.8V
DSC60x1
Std. Drive,
20% to 80%
CL=10 pF
VDD = 1.8V
VDD =
2.5V/3.3V
Output Transition Time
Rise Time/Fall Time
tRY/tFY
Frequency
Output Duty Cycle, Note 8
Period Jitter, RMS
ns
0.6
1.2
f0
0.002
—
80
MHz
Output on Pin 1 for < 1 MHz
SYM
45
—
55
%
—
—
32
40
—
25
32
—
23
30
—
20
28
—
180
240
VDD = 1.8V
DSC60x1
Std. Drive,
FOUT =
27 MHz
VDD = 1.8V
VDD =
2.5V/3.3V
170
VDD =
2.5V/3.3V
DSC60x3
Low Drive,
FOUT =
27 MHz
VDD = 1.8V
DSC60x1,
Std. Drive,
FOUT =
27 MHz
VDD =
2.5V/3.3V
ps
—
3:
4:
5:
6:
7:
8:
120
JCy–Cy
—
Note 1:
2:
DSC60x3
Low Drive,
FOUT =
27 MHz
psRMS
JPER
—
Cycle-to-Cycle Jitter
(peak)
VDD =
2.5V/3.3V
—
115
90
190
150
Pin 4 VDD should be filtered with 0.1 uf capacitor.
Not including current through pull-up resistor on EN pin (if configured). Higher standby current seen at
>3.3V VDD.
Includes frequency variations due to initial tolerance, temp. and power supply voltage.
Input waveform must be monotonic with rise/fall time < 10 ms
Output Disable time takes up to 1 Period of the output waveform + 200 ns.
For parts configured with OE, not Standby.
Output is enabled if pad is floated or not connected.
Output Duty Cycle will be 40% to 60% when output frequency is between 40 MHz to 60 MHz.
DS20005625A-page 4
 2016 Microchip Technology Inc.
DSC60XX
TEMPERATURE SPECIFICATIONS
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
TJ
—
+150
—
°C
—
Storage Temperature Range
TA
–55
—
+150
°C
—
Soldering Temperature
TS
—
+260
—
°C
40 Sec. Max.
Temperature Ranges
Junction Operating Temperature
 2016 Microchip Technology Inc.
DS20005625A-page 5
DSC60XX
2.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 2-1.
TABLE 2-1:
DSC6001/03/11/13/21/23/41/43/51/53/61/63 PIN FUNCTION TABLE (OUTPUT ≥1 MHZ)
Pin Number
Pin Name
Pin Type
Output Enable: H = Specified Frequency Output, Note 1
L = Output is high impedance
OE
1
STBY
Description
I
Standby: H = Specified Frequency Output, Note 1
L = Output is high impedance, Device is in low power
mode, Supply current is at ISTBY
Frequency Select: H = Output Frequency 1, Note 2
L = Output Frequency 2
FS
2
GND
Power
Power supply ground
3
Output
O
Oscillator clock output
4
VDD
Power
Power supply, Note 3
Note 1: DSC600x/1x/2x has 300 kΩ internal pull-up resistor on pin1. DSC604x/5x/6x has no internal pull-up resistor
on pin1 and needs external pull up or being driven by other chip.
2: Two pre-programmed frequencies can be configured at http://clockworks.microchip.com/timing/.
3: Bypass with 0.1 μF capacitor placed as close to VDD pin as possible.
TABLE 2-2:
DSC6083 PIN FUNCTION TABLE (OUTPUT FREQUENCY < 1 MHZ)
Pin Number
Pin Name
Pin Type
1
Output
O
2
GND
Power
3
DNC
DNC
4
Note 1:
Description
Oscillator clock output
Power supply ground
Do Not Connect
VDD
Power
Power supply, Note 1
Bypass with 0.1 μF capacitor placed as close to VDD pin as possible.
DSC60xx family is available in multiple output driver configurations.
The low-drive DSC60x3 is configured with a low-power driver minimizing current consumption and EMI while delivering
greater than 1 mA output current at 20%/80% of the supply voltage. The standard-drive DSC60x1 delivers greater than
3 mA output current at 20%/80% of the supply voltage.
DS20005625A-page 6
 2016 Microchip Technology Inc.
DSC60XX
3.0
OUTPUT WAVEFORM
FIGURE 3-1:
OUTPUT WAVEFORM
tR
tF
VOH
OUTPUT
VOL
tEN
1/fo
tDA
VIH
ENABLE
 2016 Microchip Technology Inc.
VIL
DS20005625A-page 7
DSC60XX
4.0
TEST CIRCUIT
FIGURE 4-1:
TEST CIRCUIT
µ
DS20005625A-page 8
4
3
1
2
CL
 2016 Microchip Technology Inc.
DSC60XX
5.0
BOARD LAYOUT (RECOMMENDED)
FIGURE 5-1:
BOARD LAYOUT (RECOMMENDED)
 2016 Microchip Technology Inc.
DS20005625A-page 9
DSC60XX
6.0
SOLDER REFLOW PROFILE
FIGURE 6-1:
SOLDER REFLOW
20-40
Sec
Se
ax
cM
Se
3C
/
Reflow
Pre heat
8 min max
x.
25°C
60-180
Sec
Ma
150°C
60-150
Sec
ec
.
3C
/
217°C
200°C
S
6C/
Temperature (°C)
cM
ax
.
260°C
Cool
Time
MSL 1 @ 260°C refer to JSTD-020C
Ramp-Up Rate (200°C to Peak Temp)
3°C/Sec Max.
Preheat Time 150°C to 200°C
60-180 Sec
Time maintained above 217°C
60-150 Sec
Peak Temperature
255-260°C
Time within 5°C of actual Peak
Ramp-Down Rate
Time 25°C to Peak Temperature
DS20005625A-page 10
20-40 Sec
6°C/Sec Max.
8 min. Max.
 2016 Microchip Technology Inc.
DSC60XX
7.0
PACKAGING INFORMATION
4-Lead VFLGA 1.6 mm x 1.2 mm Package Outline
4-Lead Very Thin Fine Pitch Land Grid Array (ARA) - 1.6x1.2 mm Body [VFLGA]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
A
B
N
(DATUM A)
(DATUM B)
NOTE 1
E
2X
0.05 C
1
2X
2
TOP VIEW
0.05 C
0.10 C
A1
A
C
SEATING
PLANE
4X
(A3)
0.08 C
SIDE VIEW
b2
3X b1
CH
1
2
CH
NOTE 1
0.07
0.03
C A B
C
e1
e1
2
4X L
N
e
BOTTOM VIEW
Microchip Technology Drawing C04-1199A Sheet 1 of 2
 2016 Microchip Technology Inc.
DS20005625A-page 11
DSC60XX
4-Lead VFLGA 1.6 mm x 1.2 mm Package Outline
4-Lead Very Thin Fine Pitch Land Grid Array (ARA) - 1.6x1.2 mm Body [VFLGA]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
Dimension Limits
Number of Terminals
N
e
Terminal Pitch
Terminal Pitch
e1
A
Overall Height
Standoff
A1
Substrate Thickness (with Terminals) A3
Overall Length
D
E
Overall Width
b1
Terminal Width
Terminal Width
b2
L
Terminal Length
Terminal 1 Index Chamfer
CH
MILLIMETERS
NOM
MAX
4
1.20 BSC
0.75 BSC
0.79
0.89
0.84
0.00
0.05
0.02
0.20 REF
1.60 BSC
1.20 BSC
0.25
0.30
0.35
0.325
0.425
0.375
0.30
0.40
0.35
0.125
MIN
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated
3. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-1199A Sheet 2 of 2
DS20005625A-page 12
 2016 Microchip Technology Inc.
DSC60XX
4-Lead VFLGA 1.6 mm x 1.2 mm Recommended Land Pattern
4-Lead Very Thin Fine Pitch Land Grid Array (ARA) - 1.6x1.2 mm Body [VFLGA]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
E1
X1
G1
4
Y
C
G2
1
2
(CH)
SILK SCREEN
X2
E2
RECOMMENDED LAND PATTERN
Units
Dimension Limits
Contact Pitch
E1
Contact Pitch
E2
Contact Spacing
C
Contact Width (X3)
X1
Contact Width
X2
Contact Pad Length (X6)
Y
Space Between Contacts (X4)
G1
Space Between Contacts (X3)
G2
Contact 1 Index Chamfer
CH
MIN
MILLIMETERS
NOM
1.20 BSC
1.16 BSC
0.75
MAX
0.35
0.43
0.50
0.85
0.25
0.13 X 45° REF
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing C04-3199A
 2016 Microchip Technology Inc.
DS20005625A-page 13
DSC60XX
4-Lead VLGA 2.0 mm x 1.6 mm Package Outline
4-Lead Very Thin Fine Pitch Land Grid Array (ASA) - 2.0x1.6 mm Body [VFLGA]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
A
B
N
(DATUM A)
(DATUM B)
NOTE 1
E
2X
0.05 C
1
2X
2
TOP VIEW
0.05 C
0.10 C
C
A1
A
SEATING
PLANE
4X
(A3)
SIDE VIEW
b2
3X b1
0.07
0.03
CH
1
0.08 C
2
CH
NOTE 1
C A B
C
e1
e1
2
4X L
N
e
BOTTOM VIEW
Microchip Technology Drawing C04-1200A Sheet 1 of 2
DS20005625A-page 14
 2016 Microchip Technology Inc.
DSC60XX
4-Lead VLGA 2.0 mm x 1.6 mm Package Outline (Continued)
4-Lead Very Thin Fine Pitch Land Grid Array (ASA) - 2.0x1.6 mm Body [VFLGA]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
Dimension Limits
Number of Terminals
N
e
Terminal Pitch
Terminal Pitch
e1
Overall Height
A
Standoff
A1
Substrate Thickness (with Terminals) A3
Overall Length
D
Overall Width
E
b1
Terminal Width
Terminal Width
b2
Terminal Length
L
Terminal 1 Index Chamfer
CH
MIN
0.79
0.00
0.30
0.40
0.50
-
MILLIMETERS
NOM
6
1.55 BSC
0.95 BSC
0.84
0.02
0.20 REF
2.00 BSC
1.60 BSC
0.35
0.45
0.55
0.15
MAX
0.89
0.05
0.40
0.50
0.60
-
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated
3. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-1200A Sheet 2 of 2
 2016 Microchip Technology Inc.
DS20005625A-page 15
DSC60XX
4-Lead VFLGA 2.0 mm x 1.6 mm Package Outline
4-Lead Very Thin Fine Pitch Land Grid Array (ASA) - 2.0x1.6 mm Body [VFLGA]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
X1
4
Y
G2
C
1
2
(CH)
G1
SILK SCREEN
E
RECOMMENDED LAND PATTERN
Units
Dimension Limits
E
Contact Pitch
Contact Spacing
C
Contact Width (X4)
X1
Contact Width (X2)
X2
Contact Pad Length (X6)
Y
Space Between Contacts (X4)
G1
Space Between Contacts (X3)
G2
Contact 1 Index Chamfer
CH
MIN
MILLIMETERS
NOM
1.55 BSC
0.95
MAX
0.50
0.40
0.70
1.05
0.25
0.13 X 45° REF
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing C04-3200A
DS20005625A-page 16
 2016 Microchip Technology Inc.
DSC60XX
4-Lead VLGA 2.5 mm x 2.0 mm Package Outline
4-Lead Very Thin Land Grid Array (AUA) - 2.5x2.0 mm Body [VLGA]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
A
B
N
(DATUM A)
(DATUM B)
NOTE 1
E
2X
0.05 C
1
2X
0.05 C
2
TOP VIEW
0.10 C
A1
C
A
SEATING
PLANE
(A3)
4X
SIDE VIEW
0.08 C
4X b1
CH
1
2
CH
NOTE 1
0.07
0.03
C A B
C
e1
e1
2
4X L
N
e
BOTTOM VIEW
Microchip Technology Drawing C04-1202A Sheet 1 of 2
 2016 Microchip Technology Inc.
DS20005625A-page 17
DSC60XX
4-Lead VLGA 2.5 mm x 2.0 mm Package Outline (Continued)
4-Lead Very Thin Land Grid Array (AUA) - 2.5x2.0 mm Body [VLGA]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
Dimension Limits
Number of Terminals
N
e
Terminal Pitch
e1
Terminal Pitch
Overall Height
A
Standoff
A1
Substrate Thickness (with Terminals) A3
Overall Length
D
Overall Width
E
Terminal Width
b1
Terminal Length
L
Terminal 1 Index Chamfer
CH
MIN
0.79
0.00
0.60
0.60
-
MILLIMETERS
NOM
4
1.65 BSC
1.25 BSC
0.84
0.02
0.20 REF
2.50 BSC
2.00 BSC
0.65
0.65
0.225
MAX
0.89
0.05
0.70
0.70
-
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated
3. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-1202A Sheet 2 of 2
DS20005625A-page 18
 2016 Microchip Technology Inc.
DSC60XX
4-Lead VLGA 2.5 mm x 2.0 mm Recommended Land Pattern
4-Lead Very Thin Land Grid Array (AUA) - 2.5x2.0 mm Body [VLGA]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
X
4
Y
C
G2
1
2
(CH)
G1
SILK SCREEN
E
RECOMMENDED LAND PATTERN
Units
Dimension Limits
E
Contact Pitch
Contact Spacing
C
Contact Width (X4)
X
Contact Pad Length (X6)
Y
Space Between Contacts (X4)
G1
Space Between Contacts (X3)
G2
Contact 1 Index Chamfer
CH
MIN
MILLIMETERS
NOM
1.65 BSC
1.25
MAX
0.70
0.80
0.95
0.45
0.13 X 45° REF
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing C04-3202A
 2016 Microchip Technology Inc.
DS20005625A-page 19
DSC60XX
4-Lead CDFN 3.2 mm x 2.5 mm Package Outline and Recommended Land Pattern
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
TITLE
4 LEAD CDFN 3.2x2.5mm COL PACKAGE OUTLINE & RECOMMENDED LAND PATTERN
DRAWING # CDFN3225-4LD-PL-1
UNIT MM
NOTE:
1.
Green shaded rectangles in Recommended Land Pattern are solder stencil opening.
DS20005625A-page 20
 2016 Microchip Technology Inc.
DSC60XX
APPENDIX A:
REVISION HISTORY
Revision A (September 2016)
• Initial creation of DSC60XX Microchip data sheet
DS20005625A.
 2015 Microchip Technology Inc.
DS20005625A-page 21
DSC60XX
NOTES:
DS20005625A-page 22
 2015 Microchip Technology Inc.
DSC60XX
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office.
PART NO.
X
Examples:
X
X
X
X
X – XXX.XXXX
X
a)
Device Pin 1 Output Package Temperature Frequency Revision Frequency Tape
Definition Drive
and
Range
Stability
Strength
Reel
Device:
DSC60XX:
Pin Definition:
Selection
Pin 1
0
OE
Pull-up
1
STDBY
Pull-up
2
FS
Pull-up
4
OE
None
5
STDBY
None
6
FS
None
8
KHz
Output
None
Output Drive
Strength:
1
3
Standard
Low
Packages:
C
J
M
H
=
=
=
=
4-Lead 3.2 mm x 2.5 mm DFN
4-Lead 2.5 mm x 2.0 mm VFLGA
4-Lead 2.0 mm x 1.6 mm VFLGA
4-Lead 1.6 mm x 1.2 mm VFLGA
Temperature
Range:
E
I
=
=
-20C to +70C (Extended Commercial)
-40C to +85C (Industrial)
Frequency
Stability:
1
2
=
=
± 50 ppm
± 25 ppm
Revision:
A
=
Revision A
Frequency:
xxx.xxxx = User-Defined Frequency between
001.0000 MHz and 80.0000 MHz
xxxkxxx = User-Defined Frequency between 002.000 kHz
and 999.999 kHz
xxxx
= Frequency configuration code when pin 1 = FS.
Configure the part online through ClockWorks
configurator.
Tape and Reel:
Note 1:
Blank
T
=
=
Ultra-Low Power MEMS Oscillator
Internal Pull Register
Bulk
Tape and Reel
b)
c)
d)
DSC6013JI2A-024.0000: Ultra–Low Power MEMS
Oscillator, Pin1= Standby
with internal Pull–Up, Low
Output Drive Strength, 4Lead 2.5 mm x2.0 mm
VFLGA, Industrial Temperature (–40°C to 85°C),
±25 ppm,
Revision
A,
24 MHz Frequency, Bulk
DSC6001HE1A-016.0000T: Ultra–Low
Power
MEMS Oscillator, Pin1= OE
with internal Pull–Up, Standard Output Drive Strength,
4-Lead 1.6 mm x1.2 mm
VFLGA, Extended Commercial Temperature
(–20°C to 70°C), ±50 ppm,
Revision A, 16 MHz Frequency, Tape and Reel
DSC6083ME1A-032k768:
Ultra–Low
Power
MEMS Oscillator, Pin1=
32.768KHz Clock Output ,
Low Output Drive Strength,
4-Lead 2.0 mm x1.6 mm
VFLGA, Extended Commercial Temperature
(–20°C to 70°C), ±50 ppm,
Revision A, Bulk
DSC6023CI2A-001B:
Ultra–Low Power MEMS
Oscillator, Pin1= FS with
internal Pull-up, Low Output Drive Strength, 4-Lead
3.2 mm x2.5 mm CDFN,
Industrial Temperature
(–40°C to 85°C), ±25 ppm,
Revision A, Frequency
code = 001B (configured
through ClockWorks), Bulk
Note 1:
Tape and Reel identifier only appears in the
catalog part number description. This
identifier is used for ordering purposes and
is not printed on the device package. Check
with your Microchip Sales Office for package
availability with the Tape and Reel option.
Please visit Microchip ClockWorks® Configurator Website to configure the part number for customized frequency. http://clockworks.microchip.com/timing/.
 2016 Microchip Technology Inc.
DS20005625A-page 23
DSC60XX
NOTES:
DS20005625A-page 24
 2016 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights unless otherwise stated.
Trademarks
The Microchip name and logo, the Microchip logo, AnyRate,
dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KeeLoq,
KeeLoq logo, Kleer, LANCheck, LINK MD, MediaLB, MOST,
MOST logo, MPLAB, OptoLyzer, PIC, PICSTART, PIC32 logo,
RightTouch, SpyNIC, SST, SST Logo, SuperFlash and UNI/O
are registered trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
ClockWorks, The Embedded Control Solutions Company,
ETHERSYNCH, Hyper Speed Control, HyperLight Load,
IntelliMOS, mTouch, Precision Edge, and QUIET-WIRE are
registered trademarks of Microchip Technology Incorporated
in the U.S.A.
Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut,
BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM,
dsPICDEM.net, Dynamic Average Matching, DAM, ECAN,
EtherGREEN, In-Circuit Serial Programming, ICSP, Inter-Chip
Connectivity, JitterBlocker, KleerNet, KleerNet logo, MiWi,
motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB,
MPLINK, MultiTRAK, NetDetach, Omniscient Code
Generation, PICDEM, PICDEM.net, PICkit, PICtail,
PureSilicon, RightTouch logo, REAL ICE, Ripple Blocker,
Serial Quad I/O, SQI, SuperSwitcher, SuperSwitcher II, Total
Endurance, TSHARC, USBCheck, VariSense, ViewSpan,
WiperLock, Wireless DNA, and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
GestIC is a registered trademarks of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip
Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2016, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
ISBN: 978-1-5224-0960-1
 2016 Microchip Technology Inc.
DS20005625A-page 25
Worldwide Sales and Service
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ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
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Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
Web Address:
www.microchip.com
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Suites 3707-14, 37th Floor
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Tel: 86-756-3210040
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Tel: 45-4450-2828
Fax: 45-4485-2829
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Tel: 91-80-3090-4444
Fax: 91-80-3090-4123
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Tel: 33-1-69-53-63-20
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Tel: 678-957-9614
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Tel: 86-10-8569-7000
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Tel: 91-11-4160-8631
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Tel: 49-2129-3766400
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Tel: 852-2943-5100
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Tel: 61-2-9868-6733
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Tel: 774-760-0087
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Tel: 86-25-8473-2460
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Tel: 86-532-8502-7355
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Tel: 86-21-5407-5533
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Tel: 91-20-3019-1500
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Fax: 82-2-558-5932 or
82-2-558-5934
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Fax: 31-416-690340
Poland - Warsaw
Tel: 48-22-3325737
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Tel: 886-2-2508-8600
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06/23/16
DS00000A-page 26
 2016 Microchip Technology Inc.