PRELIMINARY CM1418 Praetorian™ L-C EMI Filter with ESD Protection for Headset Speaker Applications Features Product Description • • • • • California Micro Devices’ CM1418 is an L-C EMI filter array with ESD protection, which integrates two Pifilters (C-L-C) for the headset speaker. The CM1418 has component values of 117pF-3.0nH-117pF. The parts include ESD protection diodes on all input/output pins, which provide a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge (ESD). The ESD diodes connected to the filter ports safely dissipate ESD strikes of ±30kV, beyond the maximum requirement of the IEC61000-4-2 international standard. Using the MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the pins are protected for contact discharges at greater than ±30kV. • • • 2 channels of EMI filtering ±30kV ESD protection (IEC 61000-4-2, contact discharge) ±30kV ESD protection (HBM) OptiGuard™ Coating for improved reliability at assembly Greater than 35dB of attenuation at 1GHz 6-bump, 1.720mm x 1.220mm footprint Chip Scale Package (CSP) Lead-free version available Applications • • • Headset Speaker port in mobile handsets I/O port protection for mobile handsets, notebook computers, PDAs etc. EMI filtering for data ports in cell phones, PDAs or notebook computers. This device is particularly well suited for portable electronics (e.g. mobile handsets, PDAs, notebook computers) because of its small package format and easy-to-use pin assignments. In particular, the CM1418 is ideal for EMI filtering and protecting speaker output lines from ESD for the headset speaker in mobile handsets. Most speakers have impedance of 8Ω and in order to maximize the power output, the resistance of an EMI filter needs to be as low as possible and the CM1418 addresses this by having a C-L-C based EMI filter where the inductor has less than 0.35Ω of resistance. The CM1418 is available either uncoated or with OptiGuard™ coating resulting in improved reliability at assembly. The CM1418 is also available in a space saving, low profile Chip Scale Package with optional lead-free finishing. Electrical Schematic FILTER #1 3nH A1 117pF GND FILTER #2 FILTER #1 A2 3nH B1 117pF GND A3 117pF B3 FILTER #2 117pF B2 © 2005 California Micro Devices Corp. All rights reserved. 12/13/05 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 1 PRELIMINARY CM1418 PACKAGE / PINOUT DIAGRAMS BOTTOM VIEW (Bumps Up View) TOP VIEW (Bumps Down View) Orientation Marking (see note 2) 1 A B 2 3 XX Orientation Marking B1 B2 B3 A1 A2 A3 A1 CM1418 CSP Package Notes: 1) These drawings are not to scale. 2) Lead-free devices are specified by using a "+" character for the top side orientation mark. PIN DESCRIPTIONS PIN NAME A1 Filter #1 DESCRIPTION Filter #1 Input A2 GND Device Ground A3 Filter #1 Filter #1 Input B1 Filter #2 Filter #2 Input B2 GND Device Ground B3 Filter #2 Filter #2 Input Ordering Information PART NUMBERING INFORMATION Lead-free Finish2 Standard Finish Pins Package OptiGuard™ Coating Ordering Part Number1 Part Marking Ordering Part Number1 Part Marking 6 CSP Y CM1418-02CS CG CM1418-02CP CG 6 CSP N CM1418-0BCS AL CM1418-0BCP AL Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark. © 2005 California Micro Devices Corp. All rights reserved. 2 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 12/13/05 PRELIMINARY CM1418 Specifications ABSOLUTE MAXIMUM RATINGS PARAMETER RATING UNITS -65 to +150 °C DC Current per Inductor 30 mA DC Package Power Rating 0.5 W RATING UNITS -40 to +85 °C Storage Temperature Range STANDARD OPERATING CONDITIONS PARAMETER Operating Temperature Range ELECTRICAL OPERATING CHARACTERISTICS (SEE NOTE 1) SYMBOL PARAMETER L Inductance R DC Channel Resistance CONDITIONS MIN TYP MAX 3.0 UNITS nH 0.28 0.35 Ω Total Channel Capacitance 2.5V dc; 1MHz, 30mV ac 187 234 281 pF C1 Capacitance C1 2.5V dc; 1MHz, 30mV ac 93 117 140 pF VST Stand-off Voltage I = 10μA 6.0 ILEAK Diode Leakage Current VIN = ±3.3V 0.1 1.0 μA VSIG Signal Clamp Voltage Positive Clamp Negative Clamp ILOAD = 10mA ILOAD = -10mA 6.8 -6.8 9.0 -5.6 V V VESD In-system ESD Withstand Voltage a) Human Body Model, MIL-STD-883, Method 3015 b) Contact Discharge per IEC 61000-4-2 Level 4 CTOT RDYN fC 5.6 -9.0 V Notes 2 and 3 Dynamic Resistance Positive Negative Cut-off frequency ZSOURCE = 50Ω, ZLOAD = 50Ω L = 3nH, C = 117pF ±30 kV ±30 kV 0.95 0.90 Ω Ω 22 MHz Note 1: TA=25°C unless otherwise specified. Note 2: ESD applied to input and output pins with respect to GND, one at a time. Note 3: These parameters are guaranteed by design and characterization. © 2005 California Micro Devices Corp. All rights reserved. 12/13/05 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 3 PRELIMINARY CM1418 Performance Information Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment) Figure 1. Insertion Loss vs. Frequency (Filter #1 to GND B2) To be determined Figure 2. Insertion Loss vs. Frequency (Filter #2 to GND B2) © 2005 California Micro Devices Corp. All rights reserved. 4 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 12/13/05 PRELIMINARY CM1418 Capacitance (Normalized) 1.2 1 0.8 0.6 0.4 0.2 0 -6 -5 -4 -3 -2 -1 0 1 2 3 4 5 6 Voltage Figure 3. Typical Diode Capacitance vs. Input Voltage (normalized to 2.5VDC) © 2005 California Micro Devices Corp. All rights reserved. 12/13/05 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 5 PRELIMINARY CM1418 Application Information Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages offered by California Micro Devices. PRINTED CIRCUIT BOARD RECOMMENDATIONS PARAMETER VALUE Pad Size on PCB 0.275mm Pad Shape Round Pad Definition Non-Solder Mask defined pads Solder Mask Opening 0.325mm Round Solder Stencil Thickness 0.125 - 0.150mm Solder Stencil Aperture Opening (laser cut, 5% tapered walls) 0.330mm Round Solder Flux Ratio 50/50 by volume Solder Paste Type No Clean Pad Protective Finish OSP (Entek Cu Plus 106A) Tolerance — Edge To Corner Ball +50μm Solder Ball Side Coplanarity +20μm Maximum Dwell Time Above Liquidous 60 seconds Maximum Soldering Temperature for Eutectic Devices using a Eutectic Solder Paste 240°C Maximum Soldering Temperature for Lead-free Devices using a Lead-free Solder Paste 260°C Non-Solder Mask Defined Pad 0.275mm DIA. Solder Stencil Opening 0.330mm DIA. Solder Mask Opening 0.325mm DIA. Figure 4. Recommended Non-Solder Mask Defined Pad Illustration Temperature (°C) 250 200 150 100 50 0 Figure 5. Eutectic (SnPb) Solder Ball Reflow Profile 1:00.0 2:00.0 3:00.0 Time (minutes) 4:00.0 Figure 6. Lead-free (SnAgCu) Solder Ball Reflow Profile © 2005 California Micro Devices Corp. All rights reserved. 6 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 12/13/05 PRELIMINARY CM1418 Mechanical Details CM1418 CSP Mechanical Specifications The CM1418 is supplied in 6-bump Chip Scale Package (CSP). Dimensions are presented below. Mechanical Package Diagrams Non-Coated CSP PACKAGE DIMENSIONS Package Custom CSP Bumps 6 Min Nom Max A1 C1 Inches Min Nom B1 B2 Dim Millimeters BOTTOM VIEW Max 1.175 1.220 1.265 0.0463 0.0480 0.0498 3 A2 1.675 1.720 1.765 0.0659 0.0677 0.0695 2 B1 0.495 0.500 0.505 0.0195 0.0197 0.0199 1 B2 0.495 0.500 0.505 0.0195 0.0197 0.0199 C1 0.310 0.360 0.410 0.0122 0.0142 0.0161 0.310 0.360 0.410 0.0122 0.0142 0.0161 D1 0.562 0.606 0.650 0.0221 0.0239 0.0256 D2 0.356 0.381 0.406 0.0140 0.0150 0.0160 D3 0.575 0.644 0.714 0.0226 0.0254 0.0281 D4 0.368 0.419 0.470 0.0145 0.0165 0.0185 # per tape and reel A B C2 C2 A2 A1 D1 D2 0.30 DIA. 63/37 Sn/Pb (Eutectic) or 96.8/2.6/0.6 Sn/Ag/Cu (Lead-free) SOLDER BUMPS OptiGuard™ Coated CSP 3500 pieces BOTTOM VIEW OptiGuardTM Coating A1 C1 Controlling dimension: millimeters SIDE VIEW B2 B1 3 A2 2 1 B A C2 D3 D4 0.30 DIA. 63/37 Sn/Pb (Eutectic) or 96.8/2.6/0.6 Sn/Ag/Cu (Lead-free) SOLDER BUMPS SIDE VIEW NOTE: DIMENSIONS IN MILLIMETERS Package Dimensions for CM1418-0xCS/CP 6-bump Chip Scale Package © 2005 California Micro Devices Corp. All rights reserved. 12/13/05 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 7 PRELIMINARY CM1418 Mechanical Details (cont’d) CSP Tape and Reel Specifications TAPE WIDTH W REEL DIA. QTY PER REEL P0 P1 PART NUMBER CHIP SIZE (mm) POCKET SIZE (mm) B0 X A0 X K0 CM1418-02CS/CP 1.72 X 1.22 X 0.67 2.08 x 1.45 x 0.71 8mm 178mm (7") 3500 4mm 4mm CM1418-02CS/CP 1.72 X 1.22 X 0.61 2.08 x 1.45 x 0.71 8mm 178mm (7") 3500 4mm 4mm Po Top Cover Tape 10 Pitches Cumulative Tolerance On Tape ±0.2 mm Ao W Bo Ko For tape feeder reference only including draft. Concentric around B. Embossment Center Lines of Cavity P1 User Direction of Feed Figure 7. Tape and Reel Mechanical DataTape and Reel Mechanical Data © 2005 California Micro Devices Corp. All rights reserved. 8 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 12/13/05