3.5x2.0mm SMD CHIP LED LAMP APK3520SYC Features Description ! 3.5mmX2.0mm SMT !LOW LED, 1.3mm THICKNESS. POWER CONSUMPTION. ! WIDE ! IDEAL SUPER BRIGHT YELLOW VIEWING ANGLE. The Super Bright Yellow source color devices are made with DH InGaAlP on GaAs substrate Light Emitting Diode. FOR BACKLIGHT AND INDICATOR. ! VARIOUS COLORS AND LENS TYPES AVAILABLE. !PACKAGE : 2000PCS / REEL. Package Dimensions Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ±0.2(0.0079") unless otherwise noted. 3. Specifications are subject to change without notice. SPEC NO:DSAD1164 APPROVED : J. Lu REV NO: V.1 CHECKED : Allen Liu DATE:MAR/27/2003 DRAWN:D.L.HUANG PAGE: 1 OF 4 Selection Guide Par t No . Dic e APK3520SYC Iv (m c d ) @ 20 m A L en s Ty p e SUPER BRIGHT YELLOW ( InGaAlP ) WATER CLEAR V i ew i n g An g l e Min . Ty p . 2θ1/2 50 100 120° Note: 1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value. Electrical / Optical Characteristics at T)=25°°C Sy m b o l Par am et er D ev i c e λpeak Peak Wavelength Super Bright Yellow λD Dominate Wavelength ∆λ1/2 Ty p . Max . Un it s Tes t Co n d it io n s 590 nm IF = 2 0 m A Super Bright Yellow 588 nm IF = 2 0 m A Spectral Line Half-width Super Bright Yellow 28 nm IF = 2 0 m A C Capacitance Super Bright Yellow 25 pF V F = 0 V; f = 1 M Hz VF Forward Voltage Super Bright Yellow 2.0 2.5 V IF = 2 0 m A IR Reverse Current Super Bright Yellow 10 uA VR = 5V Absolute Maximum Ratings at T)=25°°C P ar am e t e r Su p er B r ig h t Yello w Un it s Power dissipation 125 mW DC Forward Current 30 mA Peak Forward Current [1] 150 mA Reverse Voltage 5 V Operating/Storage Temperature -40°C To +85°C Note: 1. 1/10 Duty Cycle, 0.1ms Pulse Width. SPEC NO:DSAD1164 APPROVED : J. Lu REV NO: V.1 CHECKED : Allen Liu DATE:MAR/27/2003 DRAWN:D.L.HUANG PAGE: 2 OF 4 Super Bright Yellow SPEC NO:DSAD1164 APPROVED : J. Lu APK3520SYC REV NO: V.1 CHECKED : Allen Liu DATE:MAR/27/2003 DRAWN:D.L.HUANG PAGE: 3 OF 4 APK3520SYC SMT Reflow Soldering Instructions Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first and second soldering process. Recommended Soldering Pattern (Units : mm) Tape Specifications (Units : mm) SPEC NO:DSAD1164 APPROVED : J. Lu REV NO: V.1 CHECKED : Allen Liu DATE:MAR/27/2003 DRAWN:D.L.HUANG PAGE: 4 OF 4