Cypress CYUSB3014-BZXC Ez-usbâ® fx3: superspeed usb controller Datasheet

CYUSB301X
EZ-USB® FX3: SuperSpeed USB Controller
Features
■
■
■
■
■
Universal serial bus (USB) integration
❐ USB 3.0 and USB 2.0 peripherals compliant with USB 3.0
specification 1.0
❐ 5-Gbps USB 3.0 PHY compliant with PIPE 3.0
❐ High-speed On-The-Go (HS-OTG) host and peripheral
compliant with OTG Supplement Version 2.0
❐ Thirty-two physical endpoints
❐ Support for battery charging Spec 1.1 and accessory charger
adaptor (ACA) detection
General Programmable Interface (GPIF™ II)
❐ Programmable 100-MHz GPIF II enables connectivity to a
wide range of external devices
❐ 8-, 16-, and 32-bit data bus
❐ As many as16 configurable control signals
Fully accessible 32-bit CPU
❐ ARM926EJ core with 200-MHz operation
❐ 512-KB or 256-KB embedded SRAM
Additional connectivity to the following peripherals
2
❐ I C master controller at 1 MHz
2
❐ I S master (transmitter only) at sampling frequencies of
32 kHz, 44.1 kHz, and 48 kHz
❐ UART support of up to 4 Mbps
❐ SPI master at 33 MHz
Selectable clock input frequencies
❐ 19.2, 26, 38.4, and 52 MHz
❐ 19.2-MHz crystal input support
Cypress Semiconductor Corporation
Document Number: 001-52136 Rev. *N
•
■
Ultra low-power in core power-down mode
❐ Less than 60 µA with VBATT on and 20 µA with VBATT off
■
Independent power domains for core and I/O
❐ Core operation at 1.2 V
2
❐ I S, UART, and SPI operation at 1.8 to 3.3 V
2
❐ I C operation at 1.2 V
■
Package option
❐ 121-ball, 10- × 10-mm, 0.8-mm pitch Pb-free ball grid array
(BGA)
❐ 131-ball, 4.7- × 5.1-mm, 0.4-mm pitch wafer-level chip scale
package (WLCSP)
■
EZ-USB® software and development kit (DVK) for easy code
development
Applications
■
Digital video camcorders
■
Digital still cameras
■
Printers
■
Scanners
■
Video capture cards
■
Test and measurement equipment
■
Surveillance cameras
■
Personal navigation devices
■
Medical imaging devices
■
Video IP phones
■
Portable media players
■
Industrial cameras
198 Champion Court
•
San Jose, CA 95134-1709
• 408-943-2600
Revised May 31, 2013
TDO
TCK
TMS
TDI
Logic Block Diagram
TRST#
CYUSB301X
FSLC[0]
FSLC[1]
FSLC[2]
JTAG
CLKIN
CLKIN_32
Embedded
SRAm
(512 kB/
256 KB)
XTALIN
ARM926EJ -S
XTALOUT
HS/FS/LS
OTG Host
OTG_ID
SSRX -
DQ[31:0]/
DQ[15:0]
PMODE[2:0]
32
EPs
GPIF™ II
HS/FS
Peripheral
SSRX +
USB INTERFACE
SS
Peripheral
CTL[12:0]
SSTX SSTX +
D+
D-
INT#
RESET #
EZ-Dtect™
I2S_MSCLK
I2S_SD
I2S_WS
MOSI
I2S
I2S_CLK
SCK
MISO
SSN
SPI
RTS
RX
TX
I2C_SDA
I2C_SCL
Document Number: 001-52136 Rev. *N
CTS
UART
I2C
Page 2 of 45
CYUSB301X
Contents
Functional Overview ..........................................................4
Application Examples ....................................................4
USB Interface ......................................................................5
OTG ...............................................................................5
ReNumeration ...............................................................6
EZ-Dtect ........................................................................6
VBUS Overvoltage Protection .......................................6
Carkit UART Mode ........................................................6
GPIF II ..................................................................................7
CPU ......................................................................................7
JTAG Interface ....................................................................8
Other Interfaces ..................................................................8
UART Interface ..............................................................8
I2C Interface ..................................................................8
I2S Interface ..................................................................8
SPI Interface ..................................................................8
Boot Options .......................................................................9
Reset ....................................................................................9
Hard Reset ....................................................................9
Soft Reset ......................................................................9
Clocking ..............................................................................9
32-kHz Watchdog Timer Clock Input ...........................10
Power .................................................................................10
Power Modes ..............................................................10
Configuration Options .....................................................13
Digital I/Os .........................................................................13
GPIOs .................................................................................13
System-level ESD .............................................................13
Pin Configurations ...........................................................13
Document Number: 001-52136 Rev. *N
Pin Description .................................................................15
Absolute Maximum Ratings ............................................22
Operating Conditions .......................................................22
DC Specifications .............................................................22
AC Timing Parameters .....................................................24
GPIF II Timing .............................................................24
Slave FIFO Interface ...................................................27
Synchronous Slave FIFO
Write Sequence Description ...............................................28
Asynchronous Slave FIFO
Read Sequence Description ...............................................29
Asynchronous Slave FIFO
Write Sequence Description ...............................................30
Serial Peripherals Timing ............................................33
Reset Sequence ................................................................38
Package Diagram ..............................................................39
Ordering Information ........................................................41
Ordering Code Definitions ...........................................41
Acronyms ..........................................................................42
Document Conventions ...................................................42
Units of Measure .........................................................42
Document History Page ...................................................43
Sales, Solutions, and Legal Information ........................45
Worldwide Sales and Design Support .........................45
Products ......................................................................45
PSoC Solutions ...........................................................45
Page 3 of 45
CYUSB301X
Functional Overview
FX3 contains 512 KB or 256 KB of on-chip SRAM (see Ordering
Information on page 41) for code and data. EZ-USB FX3 also
provides interfaces to connect to serial peripherals such as
UART, SPI, I2C, and I2S.
Cypress’s EZ-USB FX3 is the next-generation USB 3.0
peripheral controller, providing integrated and flexible features.
FX3 comes with application development tools. The software
development kit comes with application examples for
accelerating time to market.
FX3 has a fully configurable, parallel, general programmable
interface called GPIF II, which can connect to any processor,
ASIC, or FPGA. GPIF II is an enhanced version of the GPIF in
FX2LP, Cypress’s flagship USB 2.0 product. It provides easy and
glueless connectivity to popular interfaces, such as
asynchronous SRAM, asynchronous and synchronous address
data multiplexed interfaces, and parallel ATA.
FX3 complies with the USB 3.0 v1.0 specification and is also
backward compatible with USB 2.0. It also complies with the
Battery Charging Specification v1.1 and USB 2.0 OTG
Specification v2.0.
FX3 has integrated the USB 3.0 and USB 2.0 physical layers
(PHYs) along with a 32-bit ARM926EJ-S microprocessor for
powerful data processing and for building custom applications. It
implements an architecture that enables 375-MBps data transfer
from GPIF II to the USB interface.
Application Examples
In a typical application (see Figure 1), FX3 functions as a coprocessor and connects to an external processor, which manages
system-level functions. Figure 2 shows a typical application
diagram when FX3 functions as the main processor.
An integrated USB 2.0 OTG controller enables applications in
which FX3 may serve dual roles; for example, EZ-USB FX3 may
function as an OTG Host to MSC as well as HID-class devices.
Figure 1. EZ-USB FX3 as a Coprocessor
External Processor
(Example:text
MCU/CPU/
ASIC/FPGA)
GPIF II
Power
Subsystem
XTALOUT
XTALIN
Crystal *
EZ- USB FX3
( ARM9 Core)
USB
Port
USB Host
Serial Interfaces
( example: I2C)
*
A clock input may be provided on the
CLKIN pin instead of a crystal input
External Serial Peripheral
(Example:: EEPROM)
Note
1. Assuming that GPIF II is configured for a 32-bit data bus (available with certain part numbers; see Ordering Information on page 41), synchronous interface operating
at 100 MHz. This number also includes protocol overheads.
Document Number: 001-52136 Rev. *N
Page 4 of 45
CYUSB301X
Figure 2. EZ-USB FX3 as Main Processor
External Slave Device
(Example: Image sensor)
GPIF II
XTALIN
XTALOUT
Crystal *
EZ-USB FX3
(ARM9 Core)
USB
Port
USB Host
I2C
*
A clock input may be provided on the
CLKIN pin instead of a crystal input
EEPROM
Figure 3. USB Interface Signals
EZ-USB FX3
FX3 complies with the following specifications and supports the
following features:
■
Supports USB peripheral functionality compliant with USB 3.0
Specification Revision 1.0 and is also backward compatible
with the USB 2.0 Specification.
■
Complies with OTG Supplement Revision 2.0. It supports
High-Speed, Full-Speed, and Low-Speed OTG dual-role device
capability. As a peripheral, FX3 is capable of SuperSpeed,
High-Speed, and Full-Speed. As a host, it is capable of
High-Speed, Full-Speed, and Low-Speed.
■
Supports Carkit Pass-Through UART functionality on USB
D+/D– lines based on the CEA-936A specification.
■
Supports up to 16 IN and 16 OUT endpoints.
■
Supports the USB 3.0 Streams feature. It also supports USB
Attached SCSI (UAS) device-class to optimize mass-storage
access performance.
■
■
As a USB peripheral, FX3 supports UAS, USB Video Class
(UVC), Mass Storage Class (MSC), and Media Transfer
Protocol (MTP) USB peripheral classes. As a USB peripheral,
all other device classes are supported only in pass-through
mode when handled entirely by a host processor external to
the device.
VBATT
VBUS
OTG_ID
SSRXSSRX+
SSTXSSTX+
DD+
USB Interface
USB Interface
OTG
FX3 is compliant with the OTG Specification Revision 2.0. In
OTG mode, FX3 supports both A and B device modes and
supports Control, Interrupt, Bulk, and Isochronous data
transfers.
FX3 requires an external charge pump (either standalone or
integrated into a PMIC) to power VBUS in the OTG A-device
mode.
The Target Peripheral List for OTG host implementation consists
of MSC- and HID-class devices.
FX3 does not support Attach Detection Protocol (ADP).
As an OTG host, FX3 supports MSC and HID device classes.
Note When the USB port is not in use, disable the PHY and
transceiver to save power.
Document Number: 001-52136 Rev. *N
Page 5 of 45
CYUSB301X
OTG Connectivity
VBUS Overvoltage Protection
In OTG mode, FX3 can be configured to be an A, B, or dual-role
device. It can connect to the following:
The maximum input voltage on FX3's VBUS pin is 6 V. A charger
can supply up to 9 V on VBUS. In this case, an external
overvoltage protection (OVP) device is required to protect FX3
from damage on VBUS. Figure 4 shows the system application
diagram with an OVP device connected on VBUS. Refer to
Table 7 for the operating range of VBUS and VBATT.
■
HNP-capable host
■
OTG device
POWER SUBSYSTEM
ReNumeration
Because of FX3's soft configuration, one chip can take on the
identities of multiple distinct USB devices.
EZ-Dtect
FX3 supports USB Charger and accessory detection (EZ-Dtect).
The charger detection mechanism complies with the Battery
Charging Specification Revision 1.1. In addition to supporting
this version of the specification, FX3 also provides hardware
support to detect the resistance values on the ID pin.
FX3 can detect the following resistance ranges:
■
Less than 10 
■
Less than 1 k
■
65 k to 72 k
■
35 kto 39 k
■
99.96 k to 104.4 k (102 k2%)
■
119 k to 132 k
■
Higher than 220 k
■
431.2 k to 448.8 k (440 k2%)
EZ-USB FX3
1
OVP device
2
USB Connector
When first plugged into USB, FX3 enumerates automatically with
the Cypress Vendor ID (0x04B4) and downloads firmware and
USB descriptors over the USB interface. The downloaded
firmware executes an electrical disconnect and connect. FX3
enumerates again, this time as a device defined by the
downloaded information. This patented two-step process, called
ReNumeration, happens instantly when the device is plugged in.
VIO5
OTG host
AVDD
VDD
■
Figure 4. System Diagram with OVP Device For VBUS
VIO4
HNP-capable USB peripheral
CVDDQ
■
VIO3
SRP-capable USB peripheral
VIO2
■
VIO1
Targeted USB peripheral
U3TXVDDQ
■
U3RXVDDQ
ACA device
SSRXSSRX+
SSTXSSTX+
DD+
3
4
5
6
7
8
9
VBUS
OTG_ID
USB-Port
■
GND
Carkit UART Mode
The USB interface supports the Carkit UART mode (UART over
D+/D–) for non-USB serial data transfer. This mode is based on
the CEA-936A specification.
In the Carkit UART mode, the output signaling voltage is 3.3 V.
When configured for the Carkit UART mode, TXD of UART
(output) is mapped to the D– line, and RXD of UART (input) is
mapped to the D+ line.
In the Carkit UART mode, FX3 disables the USB transceiver and
D+ and D– pins serve as pass-through pins to connect to the
UART of the host processor. The Carkit UART signals may be
routed to the GPIF II interface or to GPIO[48] and GPIO[49], as
shown in Figure 5 on page 7.
In this mode, FX3 supports a rate of up to 9600 bps.
FX3's charger detects a dedicated wall charger, Host/Hub
charger, and Host/Hub.
Document Number: 001-52136 Rev. *N
Page 6 of 45
CYUSB301X
Figure 5. Carkit UART Pass-through Block Diagram
Ctrl
Carkit UART Pass-through
UART_ TXD
TXD
UART_RXD
RXD
RXD(DP)
USB-Port
( )
Carkit UART Pass-through
Interface on GPIF II
Carkit UART Pass-through
Interface on GPIOs
MUX
DP
GPIO[48]
(UART_TX)
USB PHY DM
GPIO[49]
( UART_RX)
GPIF II
The high-performance GPIF II interface enables functionality
similar to, but more advanced than, FX2LP’s GPIF and Slave
FIFO interfaces.
Note Access to all 32 buffers is also supported over the slave
FIFO interface. For details, contact Cypress Applications
Support.
Figure 6. Slave FIFO Interface
SLCS#
The GPIF II is a programmable state machine that enables a
flexible interface that may function either as a master or slave in
industry-standard or proprietary interfaces. Both parallel and
serial interfaces may be implemented with GPIF II.
PKTEND
FLAGB
FLAGA
External
Processor
Here are a list of GPIF II features:
■
Functions as master or slave
■
Provides 256 firmware programmable states
■
Supports 8-bit, 16-bit, and 32-bit parallel data bus
■
Enables interface frequencies up to 100 MHz
■
Supports 14 configurable control pins when a 32- bit data bus
is used. All control pins can be either input/output or bidirectional.
■
Supports 16 configurable control pins when a 16/8 data bus is
used. All control pins can be either input/output or bi-directional.
GPIF II state transitions are based on control input signals. The
control output signals are driven as a result of the GPIF II state
transitions. The INT# output signal can be controlled by GPIF II.
Refer to the GPIFII Designer tool. The GPIF II state machine’s
behavior is defined by a GPIF II descriptor. The GPIF II
descriptor is designed such that the required interface specifications are met. 8 kB of memory (separate from the 512 kB of
embedded SRAM) is dedicated to the GPIF II waveform where
the GPIF II descriptor is stored in a specific format.
Cypress’s GPIFII Designer Tool enables fast development of
GPIF II descriptors and includes examples for common interfaces.
Example implementations of GPIF II are the asynchronous slave
FIFO and synchronous slave FIFO interfaces.
Slave FIFO interface
The Slave FIFO interface signals are shown in Figure 6. This
interface allows an external processor to directly access up to
four buffers internal to FX3. Further details of the Slave FIFO
interface are described on page 27.
Document Number: 001-52136 Rev. *N
TXD(DM)
A[1:0]
D[31:0]
EZ-USB FX3
SLWR#
SLRD#
SLOE#
Note: Multiple Flags may be configured.
CPU
FX3 has an on-chip 32-bit, 200-MHz ARM926EJ-S core CPU.
The core has direct access to 16 kB of Instruction Tightly
Coupled Memory (TCM) and 8 kB of Data TCM. The
ARM926EJ-S core provides a JTAG interface for firmware
debugging.
FX3 offers the following advantages:
■
Integrates 512 KB of embedded SRAM for code and data and
8 kB of Instruction cache and Data cache.
■
Implements efficient and flexible DMA connectivity between the
various peripherals (such as, USB, GPIF II, I2S, SPI, UART),
requiring firmware only to configure data accesses between
peripherals, which are then managed by the DMA fabric.
■
Allows easy application development on industry-standard
development tools for ARM926EJ-S.
Examples of the FX3 firmware are available with the Cypress
EZ-USB FX3 Development Kit. Software APIs that can be ported
to an external processor are available with the Cypress EZ-USB
FX3 Software Development Kit.
Page 7 of 45
CYUSB301X
JTAG Interface
I2C Interface
FX3’s JTAG interface has a standard five-pin interface to connect
to a JTAG debugger in order to debug firmware through the
CPU-core's on-chip-debug circuitry.
FX3’s I2C interface is compatible with the I2C Bus Specification
Revision 3. This I2C interface is capable of operating only as I2C
master; therefore, it may be used to communicate with other I2C
slave devices. For example, FX3 may boot from an EEPROM
connected to the I2C interface, as a selectable boot option.
Industry-standard debugging tools for the ARM926EJ-S core
can be used for the FX3 application development.
Other Interfaces
FX3 supports the following serial peripherals:
■
UART
■
I2C
2
■I S
■
SPI
The SPI, UART, and I2S interfaces are multiplexed on the serial
peripheral port.
The CYUSB3012 and CYUSB3014 Pin List (GPIF II with 32-bit
Data Bus Width) on page 15 shows details of how these interfaces are multiplexed. Note that when GPIF II is configured for a
32-bit data bus width (CYUSB3012 and CYUSB3014), only the
UART interface is available on GPIO[53] to GPIO[56].
UART Interface
The UART interface of FX3 supports full-duplex communication.
It includes the signals noted in Table 1.
Table 1. UART Interface Signals
Signal
TX
RX
CTS
RTS
Description
Output signal
Input signal
Flow control
Flow control
The UART is capable of generating a range of baud rates, from
300 bps to 4608 Kbps, selectable by the firmware. If flow control
is enabled, then FX3's UART only transmits data when the CTS
input is asserted. In addition to this, FX3’s UART asserts the RTS
output signal, when it is ready to receive data.
Document Number: 001-52136 Rev. *N
FX3’s I2C Master Controller also supports multi-master mode
functionality.
The power supply for the I2C interface is VIO5, which is a
separate power domain from the other serial peripherals. This
gives the I2C interface the flexibility to operate at a different
voltage than the other serial interfaces.
The I2C controller supports bus frequencies of 100 kHz,
400 kHz, and 1 MHz. When VIO5 is 1.2 V, the maximum
operating frequency supported is 100 kHz. When VIO5 is 1.8 V,
2.5 V, or 3.3 V, the operating frequencies supported are 400 kHz
and 1 MHz. The I2C controller supports the clock-stretching
feature to enable slower devices to exercise flow control.
The I2C interface’s SCL and SDA signals require external pull-up
resistors. The pull-up resistors must be connected to VIO5.
I2S Interface
FX3 has an I2S port to support external audio codec devices.
FX3 functions as I2S Master as transmitter only. The I2S interface
consists of four signals: clock line (I2S_CLK), serial data line
(I2S_SD), word select line (I2S_WS), and master system clock
(I2S_MCLK). FX3 can generate the system clock as an output
on I2S_MCLK or accept an external system clock input on
I2S_MCLK.
The sampling frequencies supported by the I2S interface are
32 kHz, 44.1 kHz, and 48 kHz.
SPI Interface
FX3 supports an SPI Master interface on the Serial Peripherals
port. The maximum operation frequency is 33 MHz.
The SPI controller supports four modes of SPI communication
(see SPI Timing Specification on page 36 for details on the
modes) with the Start-Stop clock. This controller is a
single-master controller with a single automated SSN control. It
supports transaction sizes ranging from 4 bits to 32 bits.
Page 8 of 45
CYUSB301X
Boot Options
Clocking
FX3 can load boot images from various sources, selected by the
configuration of the PMODE pins. Following are the FX3 boot
options:
FX3 allows either a crystal to be connected between the XTALIN
and XTALOUT pins or an external clock to be connected at the
CLKIN pin. The XTALIN, XTALOUT, CLKIN, and CLKIN_32 pins
can be left unconnected if they are not used.
■
Boot from USB
■
Boot from I2C
■
Boot from SPI (SPI devices supported are M25P16 (16 Mbit),
M25P80 (8 Mbit), and M25P40 (4 Mbit)) or their equivalents
■
Boot from GPIF II ASync ADMux mode
■
Boot from GPIF II Sync ADMux mode
■
Boot from GPIF II ASync SRAM mode
Crystal frequency supported is 19.2 MHz, while the external
clock frequencies supported are 19.2, 26, 38.4, and 52 MHz.
Table 2. FX3 Booting Options
PMODE[2:0] [2]
F00
F01
F11
F0F
F1F
1FF
0F1
Boot From
Sync ADMux (16-bit)
Async ADMux (16-bit)
USB boot
Async SRAM (16-bit)
I2C, On Failure, USB Boot is Enabled
I2C only
SPI, On Failure, USB Boot is Enabled
FX3 has an on-chip oscillator circuit that uses an external
19.2-MHz (±100 ppm) crystal (when the crystal option is used).
An appropriate load capacitance is required with a crystal. Refer
to the specification of the crystal used to determine the appropriate load capacitance. The FSLC[2:0] pins must be configured
appropriately to select the crystal- or clock-frequency option. The
configuration options are shown in Table 3.
Clock inputs to FX3 must meet the phase noise and jitter requirements specified in Table 4 on page 10.
The input clock frequency is independent of the clock and data
rate of the FX3 core or any of the device interfaces (including
P-Port and S-Port). The internal PLL applies the appropriate
clock multiply option depending on the input frequency.
Table 3. Crystal/Clock Frequency Selection
FSLC[2]
FSLC[1]
FSLC[0]
Crystal/Clock
Frequency
0
0
0
19.2-MHz crystal
1
0
0
19.2-MHz input CLK
Hard Reset
1
0
1
26-MHz input CLK
A hard reset is initiated by asserting the Reset# pin on FX3. The
specific reset sequence and timing requirements are detailed in
Figure 19 on page 38 and Table 16 on page 38. All I/Os are
tristated during a hard reset.
1
1
0
38.4-MHz input CLK
1
1
1
52-MHz input CLK
Reset
Soft Reset
In a soft reset, the processor sets the appropriate bits in the
PP_INIT control register. There are two types of Soft Reset:
■
CPU Reset – The CPU Program Counter is reset. Firmware
does not need to be reloaded following a CPU Reset.
■
Whole Device Reset – This reset is identical to Hard Reset.
■
The firmware must be reloaded following a Whole Device
Reset.
Note
2. F indicates Floating.
Document Number: 001-52136 Rev. *N
Page 9 of 45
CYUSB301X
Table 4. FX3 Input Clock Specifications
Parameter
Specification
Description
Phase noise
Units
Min
Max
100-Hz offset
–
–75
dB
1- kHz offset
–
–104
dB
10-kHz offset
–
–120
dB
100-kHz offset
–
–128
dB
1-MHz offset
–
–130
dB
Maximum frequency deviation
–
150
ppm
Duty cycle
30
70
%
Overshoot
–
3
%
Undershoot
–
–3
%
Rise time/fall time
–
3
ns
❐
32-kHz Watchdog Timer Clock Input
❐
FX3 includes a watchdog timer. The watchdog timer can be used
to interrupt the ARM926EJ-S core, automatically wake up the
FX3 in Standby mode, and reset the ARM926EJ-S core. The
watchdog timer runs a 32-kHz clock, which may be optionally
supplied from an external source on a dedicated FX3 pin.
The firmware can disable the watchdog timer.
Requirements for the optional 32-kHz clock input are listed in
Table 5.
■
Table 5. 32-kHz Clock Input Requirements
Parameter
Min
Max
Units
Duty cycle
40
60
%
Frequency deviation
–
±200
ppm
Rise time/fall time
–
200
ns
FX3 supports the following power modes:
■
Normal mode: This is the full-functional operating mode. The
internal CPU clock and the internal PLLs are enabled in this
mode.
❐ Normal operating power consumption does not exceed the
sum of ICC Core max and ICC USB max (see Table 7 for
current consumption specifications).
❐ The I/O power supplies VIO2, VIO3, VIO4, and VIO5 can be
turned off when the corresponding interface is not in use.
VIO1 cannot be turned off at any time if the GPIF II interface
is used in the application.
■
Low-power modes (see Table 6 on page 11):
❐ Suspend mode with USB 3.0 PHY enabled (L1)
❐ Suspend mode with USB 3.0 PHY disabled (L2)
❐ Standby mode (L3)
❐ Core power-down mode (L4)
FX3 has the following power supply domains:
IO_VDDQ: This is a group of independent supply domains for
digital I/Os. The voltage level on these supplies is 1.8 V to 3.3 V.
FX3 provides six independent supply domains for digital I/Os
listed as follows (see Table 7 for details on each of the power
domain signals):
❐ VIO1: GPIF II I/O
❐ VIO2: IO2
❐ VIO3: IO3
2
❐ VIO4: UART-/SPI/I S
2
❐ VIO5: I C and JTAG (supports 1.2 V to 3.3 V)
Document Number: 001-52136 Rev. *N
VBATT/VBUS: This is the 3.2-V to 6-V battery power supply
for the USB I/O and analog circuits. This supply powers the
USB transceiver through FX3's internal voltage regulator.
VBATT is internally regulated to 3.3 V.
Power Modes
Power
■
CVDDQ: Clock
VDD: This is the supply voltage for the logic core. The nominal
supply-voltage level is 1.2 V. This supplies the core logic
circuits. The same supply must also be used for the following:
• AVDD: This is the 1.2-V supply for the PLL, crystal oscillator, and other core analog circuits
• U3TXVDDQ/U3RXVDDQ: These are the 1.2-V supply voltages for the USB 3.0 interface.
Page 10 of 45
CYUSB301X
Table 6. Entry and Exit Methods for Low-Power Modes
Low-Power Mode
Suspend Mode with
USB 3.0 PHY
Enabled (L1)
Characteristics
■
The power consumption in this mode does
not exceed ISB1
■
USB 3.0 PHY is enabled and is in U3 mode
(one of the suspend modes defined by the
USB 3.0 specification). This one block
alone is operational with its internal clock
while all other clocks are shut down
■
All I/Os maintain their previous state
■
Power supply for the wakeup source and
core power must be retained. All other
power domains can be turned on/off
individually
■
Suspend Mode with
USB 3.0 PHY
Disabled (L2)
Methods of Entry
■
■
Firmware executing on
ARM926EJ-S core can put FX3 into
suspend mode. For example, on
USB suspend condition, firmware
may decide to put FX3 into suspend
mode
External Processor, through the use
of mailbox registers, can put FX3 into
suspend mode
The states of the configuration registers,
buffer memory, and all internal RAM are
maintained
■
All transactions must be completed before
FX3 enters Suspend mode (state of
outstanding transactions are not
preserved)
■
The firmware resumes operation from
where it was suspended (except when
woken up by RESET# assertion) because
the program counter does not reset
■
The power consumption in this mode does
not exceed ISB2
■
USB 3.0 PHY is disabled and the USB
interface is in suspend mode
■
The clocks are shut off. The PLLs are
disabled
■
All I/Os maintain their previous state
■
USB interface maintains the previous
state
■
■
Firmware executing on
ARM926EJ-S core can put FX3 into
suspend mode. For example, on
USB suspend condition, firmware
may decide to put FX3 into suspend
mode
External Processor, through the use
of mailbox registers can put FX3 into
suspend mode
Methods of Exit
■
D+ transitioning to low
or high
■
D- transitioning to low
or high
■
Impedance change on
OTG_ID pin
■
Resume condition on
SSRX±
■
Detection of VBUS
■
Level detect on
UART_CTS (programmable polarity)
■
GPIF II interface
assertion of CTL[0]
■
Assertion of RESET#
■
D+ transitioning to low
or high
■
D- transitioning to low
or high
■
Impedance change on
OTG_ID pin
■
Resume condition on
SSRX±
■
Detection of VBUS
■
Power supply for the wakeup source and
core power must be retained. All other
power domains can be turned on/off
individually
■
Level detect on
UART_CTS
(programmable
polarity)
■
The states of the configuration registers,
buffer memory and all internal RAM are
maintained
■
GPIF II interface
assertion of CTL[0]
■
Assertion of RESET#
■
All transactions must be completed before
FX3 enters Suspend mode (state of
outstanding transactions are not
preserved)
■
The firmware resumes operation from
where it was suspended (except when
woken up by RESET# assertion) because
the program counter does not reset
Document Number: 001-52136 Rev. *N
Page 11 of 45
CYUSB301X
Table 6. Entry and Exit Methods for Low-Power Modes (continued)
Low-Power Mode
Standby Mode (L3)
Core Power Down
Mode (L4)
Characteristics
■
The power consumption in this mode does
not exceed ISB3
■
All configuration register settings and
program/data RAM contents are
preserved. However, data in the buffers or
other parts of the data path, if any, is not
guaranteed. Therefore, the external
processor should take care that the data
needed is read before putting FX3 into this
Standby Mode
■
The program counter is reset after waking
up from Standby
■
GPIO pins maintain their configuration
■
Crystal oscillator is turned off
■
Internal PLL is turned off
■
USB transceiver is turned off
■
ARM926EJ-S core is powered down.
Upon wakeup, the core re-starts and runs
the program stored in the program/data
RAM
■
Power supply for the wakeup source and
core power must be retained. All other
power domains can be turned on/off
individually
■
The power consumption in this mode does
not exceed ISB4
■
Core power is turned off
■
All buffer memory, configuration registers,
and the program RAM do not maintain
state. After exiting this mode, reload the
firmware
■
In this mode, all other power domains can
be turned on/off individually
Document Number: 001-52136 Rev. *N
Methods of Entry
■
■
Firmware executing on
ARM926EJ-S core or external
processor configures the appropriate
register
Turn off VDD
Methods of Exit
■
Detection of VBUS
■
Level detect on
UART_CTS
(Programmable
Polarity)
■
GPIF II interface
assertion of CTL[0]
■
Assertion of RESET#
■
Reapply VDD
■
Assertion of RESET#
Page 12 of 45
CYUSB301X
Configuration Options
Configuration options are available for specific usage models.
Contact Cypress Applications or Marketing for details.
Digital I/Os
FX3 has internal firmware-controlled pull-up or pull-down
resistors on all digital I/O pins. An internal 50-k resistor pulls
the pins high, while an internal 10-k resistor pulls the pins low
to prevent them from floating. The I/O pins may have the
following states:
■
Tristated (High-Z)
■
Weak pull-up (via internal 50 k)
■
Pull-down (via internal 10 k)
■
Hold (I/O hold its value) when in low-power modes
■
The JTAG TDI, TMC, and TRST# signals have fixed 50-k
internal pull-ups, and the TCK signal has a fixed 10-k
pull-down resistor.
Similarly, any unused pins on the serial peripheral interfaces may
be configured as GPIOs. See Pin Configurations for pin
configuration options.
All GPIF II and GPIO pins support an external load of up to 16 pF
for every pin.
EMI
FX3 meets EMI requirements outlined by FCC 15B (USA) and
EN55022 (Europe) for consumer electronics. FX3 can tolerate
reasonable EMI, conducted by the aggressor, outlined by these
specifications and continue to function as expected.
System-level ESD
FX3 has built-in ESD protection on the D+, D–, and GND pins on
the USB interface. The ESD protection levels provided on these
ports are:
All unused I/Os should be pulled high by using the internal
pull-up resistors. All unused outputs should be left floating. All
I/Os can be driven at full-strength, three-quarter strength,
half-strength, or quarter-strength. These drive strengths are
configured separately for each interface.
GPIOs
EZ-USB enables a flexible pin configuration both on the GPIF II
and the serial peripheral interfaces. Any unused control pins
(except CTL[15]) on the GPIF II interface can be used as GPIOs.
■
±2.2-KV human body model (HBM) based on JESD22-A114
Specification
■
±6-KV contact discharge and ±8-KV air gap discharge based
on IEC61000-4-2 level 3A
■
± 8-KV Contact Discharge and ±15-KV Air Gap Discharge
based on IEC61000-4-2 level 4C.
This protection ensures the device continues to function after
ESD events up to the levels stated in this section.
The SSRX+, SSRX–, SSTX+, and SSTX– pins only have up to
±2.2-KV HBM internal ESD protection.
Pin Configurations
Figure 7. FX3 121-ball BGA Ball Map (Top View)
A
1
2
3
4
5
6
7
8
9
10
11
U3VSSQ
U3RXVDDQ
SSRXM
SSRXP
SSTXP
SSTXM
AVDD
VSS
DP
DM
NC
TRST#
B
VIO4
FSLC[0]
R_USB3
FSLC[1]
U3TXVDDQ
CVDDQ
AVSS
VSS
VSS
VDD
C
GPIO[54]
GPIO[55]
VDD
GPIO[57]
RESET#
XTALIN
XTALOUT
R_USB2
OTG_ID
TDO
D
GPIO[50]
GPIO[51]
GPIO[52]
GPIO[53]
GPIO[56]
CLKIN_32
CLKIN
VSS
E
GPIO[47]
VSS
VIO3
GPIO[49]
GPIO[48]
FSLC[2]
TDI
TMS
F
VIO2
GPIO[45]
GPIO[44]
GPIO[41]
GPIO[46]
TCK
GPIO[2]
G
VSS
GPIO[42]
GPIO[43]
GPIO[30]
GPIO[25]
GPIO[22]
GPIO[21]
H
VDD
GPIO[39]
GPIO[40]
GPIO[31]
GPIO[29]
GPIO[26]
GPIO[20]
GPIO[24]
I2C_GPIO[58] I2C_GPIO[59]
VIO5
O[60]
VDD
VBATT
VBUS
GPIO[5]
GPIO[1]
GPIO[0]
VDD
GPIO[15]
GPIO[4]
GPIO[3]
VSS
GPIO[7]
GPIO[6]
VIO1
J
GPIO[38]
GPIO[36]
GPIO[37]
GPIO[34]
GPIO[28]
GPIO[16]
GPIO[19]
GPIO[14]
GPIO[9]
GPIO[8]
VDD
K
GPIO[35]
GPIO[33]
VSS
VSS
GPIO[27]
GPIO[23]
GPIO[18]
GPIO[17]
GPIO[13]
GPIO[12]
GPIO[10]
L
VSS
VSS
VSS
GPIO[32]
VDD
VSS
VDD
INT#
VIO1
GPIO[11]
VSS
Document Number: 001-52136 Rev. *N
Page 13 of 45
CYUSB301X
Figure 8. FX3 131-Ball CSP Ball Map (Bottom View)
12
11
10
A
VSS
VSS
SSRXM
B
GPIO[55]
VIO4
SSRXP
C
GPIO[56]
VIO3
U3RXVDDQ
D
GPIO[49]
GPIO[50]
9
8
7
6
5
4
3
2
1
SSTXM
FSLC[0]
AVSS
AVDD
DP
VSS
DM
VDD
R_USB3
SSTXP
FSLC[2]
XTALIN
XTALOUT
NC
R_USB2
NC
VDD
U3VSSQ
U3TXVDDQ
CVDDQ
CLKIN_32
CLKIN
VSS
OTG_ID
TDO
TRST#
VDD
I2C_GPIO[58
]
VIO5
TCK
I2C_GPIO[59
]
VSS
GPIO[53]
GPIO[54]
RESET#
TMS
E
GPIO[57]
GPIO[48]
GPIO[51]
GPIO[52]
O[60]
VSS
VSS
VSS
VSS
GPIO[3]
VBATT
VBUS
F
VSS
GPIO[46]
GPIO[47]
FSLC[1]
TDI
VDD
VDD
VDD
VDD
GPIO[4]
GPIO[1]
GPIO[0]
G
VIO2
GPIO[43]
GPIO[44]
GPIO[45]
VSS
VSS
VDD
VSS
GPIO[9]
GPIO[7]
GPIO[6]
GPIO[2]
H
VSS
GPIO[40]
GPIO[41]
GPIO[42]
GPIO[39]
VSS
GPIO[20]
GPIO[18]
GPIO[14]
GPIO[12]
GPIO[8]
VIO1
J
VIO2
GPIO[38]
GPIO[37]
GPIO[36]
GPIO[31]
GPIO[27]
GPIO[25]
GPIO[22]
GPIO[19]
GPIO[15]
GPIO[10]
GPIO[5]
K
GPIO[35]
GPIO[34]
GPIO[33]
GPIO[32]
GPIO[28]
GPIO[26]
GPIO[16]
GPIO[21]
INT#
GPIO[24]
GPIO[11]
VSS
L
VDD
VSS
VDD
GPIO[30]
GPIO[29]
VIO1
GPIO[23]
VSS
VIO1
GPIO[17]
GPIO[13]
VSS
Note No ball is populated at location A9
Document Number: 001-52136 Rev. *N
Page 14 of 45
CYUSB301X
Pin Description
Table 7. CYUSB3012 and CYUSB3014 Pin List (GPIF II with 32-bit Data Bus Width)
BGA
WLCSP
I/O
Name
Description
GPIF II (VIO1 Power Domain)
GPIF II Interface
Slave FIFO Interface
F10
F1
VIO1
I/O
GPIO[0]
DQ[0]
DQ[0]
F9
F2
VIO1
I/O
GPIO[1]
DQ[1]
DQ[1]
F7
G1
VIO1
I/O
GPIO[2]
DQ[2]
DQ[2]
G10
E3
VIO1
I/O
GPIO[3]
DQ[3]
DQ[3]
G9
F3
VIO1
I/O
GPIO[4]
DQ[4]
DQ[4]
F8
J1
VIO1
I/O
GPIO[5]
DQ[5]
DQ[5]
H10
G2
VIO1
I/O
GPIO[6]
DQ[6]
DQ[6]
H9
G3
VIO1
I/O
GPIO[7]
DQ[7]
DQ[7]
J10
H2
VIO1
I/O
GPIO[8]
DQ[8]
DQ[8]
J9
G4
VIO1
I/O
GPIO[9]
DQ[9]
DQ[9]
DQ[10]
K11
J2
VIO1
I/O
GPIO[10]
DQ[10]
L10
K2
VIO1
I/O
GPIO[11]
DQ[11]
DQ[11]
K10
H3
VIO1
I/O
GPIO[12]
DQ[12]
DQ[12]
K9
L2
VIO1
I/O
GPIO[13]
DQ[13]
DQ[13]
J8
H4
VIO1
I/O
GPIO[14]
DQ[14]
DQ[14]
DQ[15]
G8
J3
VIO1
I/O
GPIO[15]
DQ[15]
J6
K6
VIO1
I/O
GPIO[16]
PCLK
CLK
K8
L3
VIO1
I/O
GPIO[17]
CTL[0]
SLCS#
K7
H5
VIO1
I/O
GPIO[18]
CTL[1]
SLWR#
J7
J4
VIO1
I/O
GPIO[19]
CTL[2]
SLOE#
H7
H6
VIO1
I/O
GPIO[20]
CTL[3]
SLRD#
G7
K5
VIO1
I/O
GPIO[21]
CTL[4]
FLAGA
G6
J5
VIO1
I/O
GPIO[22]
CTL[5]
FLAGB
K6
L6
VIO1
I/O
GPIO[23]
CTL[6]
GPIO
H8
K3
VIO1
I/O
GPIO[24]
CTL[7]
PKTEND#
G5
J6
VIO1
I/O
GPIO[25]
CTL[8]
GPIO
H6
K7
VIO1
I/O
GPIO[26]
CTL[9]
GPIO
K5
J7
VIO1
I/O
GPIO[27]
CTL[10]
GPIO
J5
K8
VIO1
I/O
GPIO[28]
CTL[11]
A1
H5
L8
VIO1
I/O
GPIO[29]
CTL[12]
A0
G4
L9
VIO1
I/O
GPIO[30]
PMODE[0]
PMODE[0]
H4
J8
VIO1
I/O
GPIO[31]
PMODE[1]
PMODE[1]
L4
K9
VIO1
I/O
GPIO[32]
PMODE[2]
PMODE[2]
L8
K4
VIO1
I/O
INT#
INT#/CTL[15]
CTL[15]
C5
D8
CVDDQ
I
RESET#
RESET#
RESET#
Note
3. When GPIF II is configured for the 32-bit data bus width, GPIO[50]-GPIO[52] may be configured as GPIOs or I2S, and GPIO[53] to GPIO[56] may be configured as
GPIOs or UART interface only.
Document Number: 001-52136 Rev. *N
Page 15 of 45
CYUSB301X
Table 7. CYUSB3012 and CYUSB3014 Pin List (GPIF II with 32-bit Data Bus Width) (continued)
BGA
WLCSP
I/O
Name
Description
IO2 (VIO2 Power Domain)
GPIF II (32-bit data mode)
K2
K10
VIO2
I/O
GPIO[33]
DQ[16]
GPIO
J4
K11
VIO2
I/O
GPIO[34]
DQ[17]
GPIO
K1
K12
VIO2
I/O
GPIO[35]
DQ[18]
GPIO
J2
J9
VIO2
I/O
GPIO[36]
DQ[19]
GPIO
J3
J10
VIO2
I/O
GPIO[37]
DQ[20]
GPIO
J1
J11
VIO2
I/O
GPIO[38]
DQ[21]
GPIO
H2
H8
VIO2
I/O
GPIO[39]
DQ[22]
GPIO
H3
H11
VIO2
I/O
GPIO[40]
DQ[23]
GPIO
GPIO
F4
H10
VIO2
I/O
GPIO[41]
DQ[24]
G2
H9
VIO2
I/O
GPIO[42]
DQ[25]
GPIO
G3
G11
VIO2
I/O
GPIO[43]
DQ[26]
GPIO
F3
G10
VIO2
I/O
GPIO[44]
DQ[27]
GPIO
F2
G09
VIO2
I/O
GPIO[45]
GPIO
IO3 (VIO3 Power Domain)
GPIO + SPI
GPIO + UART
GPIO
only
GPIF II - 32b +
I2S + UART[3]
GPIO +
I2S
UART +
SPI + I2S
F5
F11
VIO3
I/O
GPIO[46]
GPIO
GPIO
GPIO
DQ[28]
GPIO
UART_RT
S
E1
F10
VIO3
I/O
GPIO[47]
GPIO
GPIO
GPIO
DQ[29]
GPIO
UART_CT
S
E5
E11
VIO3
I/O
GPIO[48]
GPIO
GPIO
GPIO
DQ[30]
GPIO
UART_TX
E4
D12
VIO3
I/O
GPIO[49]
GPIO
GPIO
GPIO
DQ[31]
GPIO
UART_R
X
D1
D11
VIO3
I/O
GPIO[50]
GPIO
GPIO
GPIO
I2S_CLK
GPIO
I2S_CLK
D2
E10
VIO3
I/O
GPIO[51]
GPIO
GPIO
GPIO
I2S_SD
GPIO
I2S_SD
D3
E9
VIO3
I/O
GPIO[52]
GPIO
GPIO
GPIO
I2S_WS
GPIO
I2S_WS
D4
D10
VIO4
I/O
GPIO[53]
SPI_SCK
UART_RTS
GPIO
UART_RTS
GPIO
SPI_SCK
C1
D9
VIO4
I/O
GPIO[54]
SPI_SSN
UART_CTS
GPIO
UART_CTS
I2S_CLK
SPI_SSN
C2
B12
VIO4
I/O
GPIO[55]
SPI_MISO
UART_TX
GPIO
UART_TX
I2S_SD
SPI_MIS
O
D5
C12
VIO4
I/O
GPIO[56]
SPI_MOSI
UART_RX
GPIO
UART_RX
I2S_WS
SPI_MOS
I
C4
E12
VIO4
I/O
GPIO[57]
GPIO
GPIO
GPIO
I2S_MCLK
I2S_MCL
K
I2S_MCL
K
C9
C3
VBUS/
VBATT
I
OTG_ID
A3
A10
U3RXVD
DQ
I
SSRXM
SSRX-
A4
B10
U3RXVD
DQ
I
SSRXP
SSRX+
A6
A8
U3TXVD
DQ
O
SSTXM
SSTX-
A5
B8
U3TXVD
DQ
O
SSTXP
SSTX+
IO4 (VIO4) Power Domain
USB Port (VBATT/VBUS Power Domain)
OTG_ID
USB Port (U3TXVDDQ/U3RXVDDQ Power Domain)
Document Number: 001-52136 Rev. *N
Page 16 of 45
CYUSB301X
Table 7. CYUSB3012 and CYUSB3014 Pin List (GPIF II with 32-bit Data Bus Width) (continued)
BGA
WLCSP
I/O
Name
Description
USB Port (VBATT/VBUS Power Domain)
A9
A4
VBUS/V
BATT
I/O
DP
D+
A10
A2
VBUS/V
BATT
I/O
DM
D–
B4
NC
No connect
B2
NC
A11
No connect
Crystal/Clocks (CVDDQ Power Domain)
B2
A7
CVDDQ
I
FSLC[0]
C6
B6
AVDD
I/O
XTALIN
FSLC[0]
XTALIN
C7
B5
AVDD
I/O
XTALOUT
XTALOUT
B4
F9
CVDDQ
I
FSLC[1]
FSLC[1]
FSLC[2]
E6
B7
CVDDQ
I
FSLC[2]
D7
C5
CVDDQ
I
CLKIN
CLKIN
D6
C6
CVDDQ
I
CLKIN_32
CLKIN_32
D9
D6
VIO5
I/O
I2C_GPIO[58]
I2C_SCL
D10
D2
VIO5
I/O
I2C_GPIO[59]
I2C_SDA
I2C and JTAG (VIO5 Power Domain)
E7
F8
VIO5
I
TDI
TDI
C10
C2
VIO5
O
TDO
TDO
B11
C1
VIO5
I
TRST#
TRST#
E8
D5
VIO5
I
TMS
TMS
F6
D3
VIO5
I
TCK
TCK
D11
E8
VIO5
O
O[60]
Charger detect output
E10
E2
PWR
VBATT
B10
B1
PWR
VDD
A1
PWR
VDD
Power
A1
C9
PWR
U3VSSQ
E11
E1
PWR
VBUS
D8
C4
PWR
VSS
H11
H1
PWR
VIO1
E2
K1
PWR
VSS
L9
L4
PWR
VIO1
G1
L5
PWR
VSS
L7
PWR
VIO1
F1
G11
L1
PWR
VSS
J12
PWR
VIO2
H12
PWR
VSS
G12
PWR
VIO2
E3
C11
PWR
VIO3
L1
F12
PWR
VSS
B1
B11
PWR
VIO4
L6
A11
PWR
VSS
A12
PWR
VSS
B6
C7
PWR
CVDDQ
B5
C8
PWR
U3TXVDDQ
A2
C10
PWR
U3RXVDDQ
C11
D4
PWR
VIO5
Document Number: 001-52136 Rev. *N
Page 17 of 45
CYUSB301X
Table 7. CYUSB3012 and CYUSB3014 Pin List (GPIF II with 32-bit Data Bus Width) (continued)
BGA
WLCSP
I/O
Name
L11
A3
PWR
VSS
Description
A7
A5
PWR
AVDD
B7
A6
PWR
AVSS
C3
F4
PWR
VDD
B8
D1
PWR
VSS
E9
F5
PWR
VDD
B9
E4
PWR
VSS
F11
F6
PWR
VDD
E5
PWR
VSS
F7
PWR
VDD
E6
PWR
VSS
GND
E7
PWR
VSS
GND
H1
G6
PWR
VDD
L7
D7
PWR
VDD
J11
L10
PWR
VDD
L5
L12
PWR
VDD
K4
H7
PWR
VSS
L3
G7
PWR
VSS
K3
L11
PWR
VSS
L2
G8
PWR
VSS
A8
G5
PWR
VSS
GND
Precision Resistors
C8
B3
VBUS/V
BATT
I/O
R_usb2
Precision resistor for USB 2.0 (Connect a 6.04 k±1% resistor between this pin and GND)
B3
B9
U3TXVD
DQ
I/O
R_usb3
Precision resistor for USB 3.0 (Connect a 200 ±1% resistor between this pin and GND)
Table 8. CYUSB3011 and CYUSB3013 Pin List (GPIF II with 16-bit Data Bus Width)
Pin
I/O
Name
Description
GPIF II (VIO1 Power Domain)
GPIF II Interface
Slave FIFO Interface
F10
VIO1
I/O
GPIO[0]
DQ[0]
DQ[0]
F9
VIO1
I/O
GPIO[1]
DQ[1]
DQ[1]
F7
VIO1
I/O
GPIO[2]
DQ[2]
DQ[2]
G10
VIO1
I/O
GPIO[3]
DQ[3]
DQ[3]
G9
VIO1
I/O
GPIO[4]
DQ[4]
DQ[4]
F8
VIO1
I/O
GPIO[5]
DQ[5]
DQ[5]
H10
VIO1
I/O
GPIO[6]
DQ[6]
DQ[6]
H9
VIO1
I/O
GPIO[7]
DQ[7]
DQ[7]
J10
VIO1
I/O
GPIO[8]
DQ[8]
DQ[8]
J9
VIO1
I/O
GPIO[9]
DQ[9]
DQ[9]
K11
VIO1
I/O
GPIO[10]
DQ[10]
DQ[10]
L10
VIO1
I/O
GPIO[11]
DQ[11]
DQ[11]
K10
VIO1
I/O
GPIO[12]
DQ[12]
DQ[12]
K9
VIO1
I/O
GPIO[13]
DQ[13]
DQ[13]
J8
VIO1
I/O
GPIO[14]
DQ[14]
DQ[14]
G8
VIO1
I/O
GPIO[15]
DQ[15]
DQ[15]
Document Number: 001-52136 Rev. *N
Page 18 of 45
CYUSB301X
Table 8. CYUSB3011 and CYUSB3013 Pin List (GPIF II with 16-bit Data Bus Width) (continued)
I/O
Name
J6
Pin
VIO1
I/O
GPIO[16]
PCLK
Description
CLK
K8
VIO1
I/O
GPIO[17]
CTL[0]
SLCS#
SLWR#
K7
VIO1
I/O
GPIO[18]
CTL[1]
J7
VIO1
I/O
GPIO[19]
CTL[2]
SLOE#
H7
VIO1
I/O
GPIO[20]
CTL[3]
SLRD#
G7
VIO1
I/O
GPIO[21]
CTL[4]
FLAGA
G6
VIO1
I/O
GPIO[22]
CTL[5]
FLAGB
K6
VIO1
I/O
GPIO[23]
CTL[6]
GPIO
H8
VIO1
I/O
GPIO[24]
CTL[7]
PKTEND#
G5
VIO1
I/O
GPIO[25]
CTL[8]
GPIO
H6
VIO1
I/O
GPIO[26]
CTL[9]
GPIO
K5
VIO1
I/O
GPIO[27]
CTL[10]
GPIO
J5
VIO1
I/O
GPIO[28]
CTL[11]
A1
H5
VIO1
I/O
GPIO[29]
CTL[12]
A0
G4
VIO1
I/O
GPIO[30]
PMODE[0]
PMODE[0]
H4
VIO1
I/O
GPIO[31]
PMODE[1]
PMODE[1]
L4
VIO1
I/O
GPIO[32]
PMODE[2]
PMODE[2]
L8
VIO1
I/O
INT#
INT#/CTL[15]
CTL[15]
C5
CVDDQ
I
RESET#
RESET#
RESET#
IO2 (VIO2 Power Domain)
K2
VIO2
I/O
GPIO[33]
GPIO
J4
VIO2
I/O
GPIO[34]
GPIO
K1
VIO2
I/O
GPIO[35]
GPIO
J2
VIO2
I/O
GPIO[36]
GPIO
J3
VIO2
I/O
GPIO[37]
GPIO
J1
VIO2
I/O
GPIO[38]
GPIO
H2
VIO2
I/O
GPIO[39]
GPIO
H3
VIO2
I/O
GPIO[40]
GPIO
F4
VIO2
I/O
GPIO[41]
GPIO
G2
VIO2
I/O
GPIO[42]
GPIO
G3
VIO2
I/O
GPIO[43]
GPIO
F3
VIO2
I/O
GPIO[44]
GPIO
F2
VIO2
I/O
GPIO[45]
GPIO
IO3 (VIO3 Power Domain)
F5
VIO3
I/O
GPIO[46]
GPIO
E1
VIO3
I/O
GPIO[47]
GPIO
E5
VIO3
I/O
GPIO[48]
GPIO
E4
VIO3
I/O
GPIO[49]
GPIO
D1
VIO3
I/O
GPIO[50]
GPIO
GPIO
GPIO
I2S_CLK
GPIO
D2
VIO3
I/O
GPIO[51]
GPIO
GPIO
GPIO
I2S_SD
GPIO
I2S_CLK
I2S_SD
D3
VIO3
I/O
GPIO[52]
GPIO
GPIO
GPIO
I2S_WS
GPIO
I2S_WS
IO4 (VIO4) Power Domain
D4
VIO4
I/O
GPIO[53]
SPI_SCK
UART_RTS
GPIO
UART_RTS
GPIO
SPI_SCK
C1
VIO4
I/O
GPIO[54]
SPI_SSN
UART_CTS
GPIO
UART_CTS
I2S_CLK
SPI_SSN
C2
VIO4
I/O
GPIO[55]
SPI_MISO
UART_TX
GPIO
UART_TX
UART_TX
SPI_MISO
D5
VIO4
I/O
GPIO[56]
SPI_MOSI
UART_RX
GPIO
UART_RX
UART_RX
SPI_MOSI
Document Number: 001-52136 Rev. *N
Page 19 of 45
CYUSB301X
Table 8. CYUSB3011 and CYUSB3013 Pin List (GPIF II with 16-bit Data Bus Width) (continued)
Pin
C4
VIO4
I/O
Name
I/O
GPIO[57]
Description
GPIO
GPIO
GPIO
I2S_MCLK
I2S_MCLK
I2S_MCLK
USB Port (VBATT/VBUS Power Domain)
C9
VBUS/
VBATT
I
OTG_ID
OTG_ID
A3
U3RXVDDQ
I
SSRXM
SSRX-
A4
U3RXVDDQ
I
SSRXP
SSRX+
A6
U3TXVDDQ
O
SSTXM
SSTX-
A5
U3TXVDDQ
O
SSTXP
USB Port (U3TXVDDQ/U3RXVDDQ Power Domain)
SSTX+
USB Port (VBATT/VBUS Power Domain)
A9
VBUS/VBATT
I/O
DP
D+
A10
VBUS/VBATT
I/O
DM
D–
A11
NC
No connect
Crystal/Clocks (CVDDQ Power Domain)
B2
CVDDQ
I
FSLC[0]
FSLC[0]
C6
AVDD
I/O
XTALIN
XTALIN
C7
AVDD
I/O
XTALOUT
XTALOUT
B4
CVDDQ
I
FSLC[1]
FSLC[1]
E6
CVDDQ
I
FSLC[2]
FSLC[2]
D7
CVDDQ
I
CLKIN
CLKIN
D6
CVDDQ
I
CLKIN_32
CLKIN_32
I2C and JTAG (VIO5 Power Domain)
D9
VIO5
I/O
I2C_GPIO[58]
I2C_SCL
D10
VIO5
I/O
I2C_GPIO[59]
I2C_SDA
E7
VIO5
I
TDI
TDI
C10
VIO5
O
TDO
TDO
B11
VIO5
I
TRST#
TRST#
E8
VIO5
I
TMS
TMS
F6
VIO5
I
TCK
TCK
D11
VIO5
O
O[60]
Charger detect output
E10
PWR
VBATT
B10
PWR
VDD
A1
PWR
U3VSSQ
E11
PWR
VBUS
D8
PWR
VSS
H11
PWR
VIO1
E2
PWR
VSS
L9
PWR
VIO1
G1
PWR
VSS
VIO2
Power
F1
PWR
G11
PWR
VSS
E3
PWR
VIO3
L1
PWR
VSS
B1
PWR
VIO4
L6
PWR
VSS
Document Number: 001-52136 Rev. *N
Page 20 of 45
CYUSB301X
Table 8. CYUSB3011 and CYUSB3013 Pin List (GPIF II with 16-bit Data Bus Width) (continued)
I/O
Name
B6
Pin
PWR
CVDDQ
B5
PWR
U3TXVDDQ
A2
PWR
U3RXVDDQ
C11
PWR
VIO5
L11
PWR
VSS
A7
PWR
AVDD
B7
PWR
AVSS
C3
PWR
VDD
B8
PWR
VSS
E9
PWR
VDD
B9
PWR
VSS
F11
PWR
VDD
H1
PWR
VDD
L7
PWR
VDD
J11
PWR
VDD
L5
PWR
VDD
K4
PWR
VSS
L3
PWR
VSS
K3
PWR
VSS
L2
PWR
VSS
A8
PWR
VSS
Description
Precision Resistors
C8
VBUS/VBATT
I/O
R_usb2
Precision resistor for USB 2.0 (Connect a 6.04 k±1% resistor between this pin and GND)
B3
U3TXVDDQ
I/O
R_usb3
Precision resistor for USB 3.0 (Connect a 200 ±1% resistor between this pin and GND)
Document Number: 001-52136 Rev. *N
Page 21 of 45
CYUSB301X
Absolute Maximum Ratings
■
Exceeding maximum ratings may shorten the useful life of the
device.
Latch-up current .........................................................> 200 mA
Storage temperature .................................... –65 °C to +150 °C
Ambient temperature with
power supplied (Industrial) ............................ –40 °C to +85 °C
Ambient temperature with
power supplied (Commercial) ............................. 0 °C to +70 °C
Supply voltage to ground potential
VDD, AVDDQ ......................................................................1.25 V
VIO1,VIO2, VIO3, VIO4, VIO5 ............................................. ...3.6 V
U3TXVDDQ, U3RXVDDQ .............................................. .....1.25 V
DC input voltage to any input pin ........................... .VCC + 0.3 V
± 6-KV contact discharge, ± 8-KV air gap discharge based on
IEC61000-4-2 level 3A, ± 8-KV contact discharge, and ± 15-KV
air gap discharge based on IEC61000-4-2 level 4C
Maximum output short-circuit current
for all I/O configurations. (Vout = 0 V) ........................ –100 mA
Operating Conditions
TA (ambient temperature under bias)
Industrial ........................................................ –40 °C to +85 °C
Commercial ....................................................... 0 °C to +70 °C
VDD, AVDDQ, U3TXVDDQ, U3RXVDDQ
Supply voltage ..................................................1.15 V to 1.25 V
VBATT supply voltage ...............................................3.2 V to 6 V
DC voltage applied to
outputs in high Z state ............................................ VCC + 0.3 V
(VCC is the corresponding I/O voltage)
VIO1, VIO2, VIO3, VIO4, CVDDQ
Static discharge voltage ESD protection levels:
VIO5 supply voltage ............................................ 1.15 V to 3.6 V
■
± 2.2-KV HBM based on JESD22-A114
■
Additional ESD protection levels on D+, D–, and GND pins, and
serial peripheral pins
Supply voltage ......................................................1.7 V to 3.6 V
DC Specifications
Min
Max
Units
VDD
Parameter
Core voltage supply
Description
1.15
1.25
V
AVDD
Analog voltage supply
1.15
1.25
V
1.2-V typical
VIO1
GPIF II I/O power supply domain
1.7
3.6
V
1.8-, 2.5-, and 3.3-V typical
VIO2
IO2 power supply domain
1.7
3.6
V
1.8-, 2.5-, and 3.3-V typical
VIO3
IO3 power supply domain
1.7
3.6
V
1.8-, 2.5-, and 3.3-V typical
VIO4
UART/SPI/I2S power supply domain
1.7
3.6
V
1.8-, 2.5-, and 3.3-V typical
VBATT
USB voltage supply
3.2
6
V
3.7-V typical
VBUS
USB voltage supply
4.0
6
V
5-V typical
U3TXVDDQ
USB 3.0 1.2-V supply
1.15
1.25
V
1.2-V typical. A 22-µF bypass capacitor is
required on this power supply.
U3RXVDDQ
USB 3.0 1.2-V supply
1.15
1.25
V
1.2-V typical. A 22-µF bypass capacitor is
required on this power supply.
CVDDQ
Clock voltage supply
1.7
3.6
V
1.8-, 3.3-V typical
2
VIO5
I C and JTAG voltage supply
VIH1
Input HIGH voltage 1
VIH2
Input HIGH voltage 2
VIL
Input LOW voltage
VOH
Output HIGH voltage
Document Number: 001-52136 Rev. *N
Notes
1.2-V typical
1.15
3.6
V
1.2-, 1.8-, 2.5-, and 3.3-V typical
0.625 ×
VCC
VCC + 0.3
V
For 2.0 V  VCC  3.6 V (except USB
port).VCC is the corresponding I/O
voltage supply.
VCC – 0.4 VCC + 0.3
V
For 1.7 V  VCC 2.0 V
(except USB port).VCC is the corresponding I/O voltage supply.
–0.3
0.25 × VCC
V
VCC is the corresponding I/O voltage
supply.
0.9 × VCC
–
V
IOH (max) = –100 µA tested at quarter
drive strength. VCC is the corresponding
I/O voltage supply.
Page 22 of 45
CYUSB301X
DC Specifications (continued)
Min
Max
Units
Notes
VOL
Parameter
Output LOW voltage
Description
–
0.1 × VCC
V
IOL (min) = +100 µA tested at quarter
drive strength. VCC is the corresponding
I/O voltage supply.
IIX
Input leakage current for all pins except
SSTXP/SSXM/SSRXP/SSRXM
–1
1
µA
All I/O signals held at VDDQ
(For I/Os with a pull-up or pull-down
resistor connected, the leakage current
increases by VDDQ/Rpu or VDDQ/RPD
IOZ
Output High-Z leakage current for all pins
except SSTXP/ SSXM/ SSRXP/SSRXM
–1
1
µA
All I/O signals held at VDDQ
ICC Core
Core and analog voltage operating
current
–
200
mA
Total current through AVDD, VDD
ICC USB
USB voltage supply operating current
–
60
mA
ISB1
Total suspend current during suspend
mode with USB 3.0 PHY enabled (L1)
–
–
mA
Core current: 1.5 mA
I/O current: 20 µA
USB current: 2 mA
For typical PVT (typical silicon, all power
supplies at their respective nominal
levels at 25 °C.)
ISB2
Total suspend current during suspend
mode with USB 3.0 PHY disabled (L2)
–
–
mA
Core current: 250 µA
I/O current: 20 µA
USB current: 1.2 mA
For typical PVT (Typical silicon, all power
supplies at their respective nominal
levels at 25 °C.)
ISB3
Total standby current during standby
mode (L3)
–
–
µA
Core current: 60 µA
I/O current: 20 µA
USB current: 40 µA
For typical PVT (typical silicon, all power
supplies at their respective nominal
levels at 25 °C.)
ISB4
Total standby current during core
power-down mode (L4)
–
–
µA
Core current: 0 µA
I/O current: 20 µA
USB current: 40 µA
For typical PVT (typical silicon, all power
supplies at their respective nominal
levels at 25 °C.)
VRAMP
Voltage ramp rate on core and I/O
supplies
0.2
50
VN
Noise level permitted on VDD and I/O
supplies
–
100
mV
Max p-p noise level permitted on all
supplies except AVDD
VN_AVDD
Noise level permitted on AVDD supply
–
20
mV
Max p-p noise level permitted on AVDD
Document Number: 001-52136 Rev. *N
V/ms Voltage ramp must be monotonic
Page 23 of 45
CYUSB301X
AC Timing Parameters
GPIF II Timing
Figure 9. GPIF II Timing in Synchronous Mode
tC LK H tC LKL
C LK
tC LK
tC O
tLZ
- [31:0]
DQ
tD S
tD O H
tLZ
tD O H
D ata 2
( O U T)
D ata 1
( O U T)
D ata ( IN)
tS
tH Z
tC O E
tD H
tH
C TL(IN)
tC TLO
tC O H
C TL ( O U T)
Table 9. GPIF II Timing Parameters in Synchronous Mode [4]
Parameter
Description
Min
Max
Units
Frequency
Interface clock frequency
–
100
MHz
tCLK
Interface clock period
10
–
ns
tCLKH
Clock high time
4
–
ns
tCLKL
Clock low time
4
–
ns
tS
CTL input to clock setup time
2
–
ns
tH
CTL input to clock hold time
0.5
–
ns
tDS
Data in to clock setup time
2
–
ns
tDH
Data in to clock hold time
0.5
–
ns
tCO
Clock to data out propagation delay when DQ bus is already in
output direction
–
8
ns
tCOE
Clock to data out propagation delay when DQ lines change to
output from tristate and valid data is available on the DQ bus
-
9
tCTLO
Clock to CTL out propagation delay
–
8
ns
tDOH
Clock to data out hold
2
–
ns
tCOH
Clock to CTL out hold
0
–
ns
tHZ
Clock to high-Z
–
8
ns
tLZ
Clock to low-Z
0
–
ns
Note
4. All parameters guaranteed by design and validated through characterization.
Document Number: 001-52136 Rev. *N
Page 24 of 45
CYUSB301X
Figure 10. GPIF II Timing in Asynchronous Mode
tDS/ tAS
tDH/tAH
DATA IN
DATA/ ADDR
tCHZ
CTL#
(I/P , ALE/ DLE)
tCTLassert_DQlatch
tCTLdeassert_DQlatch
tAA/tDO
tCHZ/tOEHZ
tCLZ/ tOELZ
DATA OUT
DATA OUT
CTL#
(I/P, non ALE/ DLE
tCTLdeassert
tCTLassert
tCTLalpha
ALPHA
O/P
tCTLbeta
BETA
O/P
1
tCTLassert
tCTLdeassert
1
tCTL#
(O/P)
1. n is an integer >= 0
tDST
tDHT
DATA/
ADDR
tCTLdeassert_DQassert
tCTLassert_DQassert
CTL#
I/P (non DLE/ALE)
Figure 11. GPIF II Timing in Asynchronous DDR Mode
tDS
tCTLdeassert_DqlatchDDR
tCTLassert_DQlatchDDR
CTL#
(I/P)
tDS
tDH
tDH
DATA IN
Document Number: 001-52136 Rev. *N
Page 25 of 45
CYUSB301X
Table 10. GPIF II Timing in Asynchronous Mode[5, 6]
Note The following parameters assume one state transition
Parameter
Description
Min
Max
Units
tDS
Data In to DLE setup time. Valid in DDR async mode.
2.3
–
ns
tDH
Data In to DLE hold time. Valid in DDR async mode.
2
–
ns
tAS
Address In to ALE setup time
2.3
–
ns
tAH
Address In to ALE hold time
2
–
ns
tCTLassert
CTL I/O asserted width for CTRL inputs without DQ input association
and for outputs.
7
–
ns
tCTLdeassert
CTL I/O deasserted width for CTRL inputs without DQ input association and for outputs.
7
–
ns
tCTLassert_DQassert
CTL asserted pulse width for CTL inputs that signify DQ inputs valid
at the asserting edge but do not employ in-built latches (ALE/DLE) for
those DQ inputs.
20
–
ns
tCTLdeassert_DQassert
CTL deasserted pulse width for CTL inputs that signify DQ input valid
at the asserting edge but do not employ in-built latches (ALE/DLE) for
those DQ inputs.
7
–
ns
tCTLassert_DQdeassert
CTL asserted pulse width for CTL inputs that signify DQ inputs valid
at the deasserting edge but do not employ in-built latches (ALE/DLE)
for those DQ inputs.
7
–
ns
tCTLdeassert_DQdeassert
CTL deasserted pulse width for CTL inputs that signify DQ inputs valid
at the deasserting edge but do not employ in-built latches (ALE/DLE)
for those DQ inputs.
20
–
ns
tCTLassert_DQlatch
CTL asserted pulse width for CTL inputs that employ in-built latches
(ALE/DLE) to latch the DQ inputs. In this non-DDR case, in-built
latches are always close at the deasserting edge.
7
–
ns
tCTLdeassert_DQlatch
CTL deasserted pulse width for CTL inputs that employ in-built latches
(ALE/DLE) to latch the DQ inputs. In this non-DDR case, in-built
latches always close at the deasserting edge.
10
–
ns
tCTLassert_DQlatchDDR
CTL asserted pulse width for CTL inputs that employ in-built latches
(DLE) to latch the DQ inputs in DDR mode.
10
–
ns
tCTLdeassert_DQlatchDDR
CTL deasserted pulse width for CTL inputs that employ in-built latches
(DLE) to latch the DQ inputs in DDR mode.
10
–
ns
tAA
DQ/CTL input to DQ output time when DQ change or CTL change
needs to be detected and affects internal updates of input and output
DQ lines.
–
30
ns
tDO
CTL to data out when the CTL change merely enables the output flop
update whose data was already established.
–
25
ns
tOELZ
CTL designated as OE to low-Z. Time when external devices should
stop driving data.
0
–
ns
tOEHZ
CTL designated as OE to high-Z
8
8
ns
tCLZ
CTL (non-OE) to low-Z. Time when external devices should stop
driving data.
0
–
ns
tCHZ
CTL (non-OE) to high-Z
30
30
ns
tCTLalpha
CTL to alpha change at output
–
25
ns
tCTLbeta
CTL to beta change at output
–
30
ns
tDST
Addr/data setup when DLE/ALE not used
2
–
ns
tDHT
Addr/data hold when DLE/ALE not used
20
–
ns
Notes
5. All parameters guaranteed by design and validated through characterization.
6. "alpha" output corresponds to "early output" and "beta" corresponds to "delayed output". Please refer to the GPIFII Designer Tool for the use of these outputs.
Document Number: 001-52136 Rev. *N
Page 26 of 45
CYUSB301X
Slave FIFO Interface
PCLK), the new data value is present. N is the first data value
read from the FIFO. To have data on the FIFO data bus, SLOE
must also be asserted.
Synchronous Slave FIFO Sequence Description
■
FIFO address is stable and SLCS is asserted
The same sequence of events is shown for a burst read.
■
SLOE is asserted. SLOE is an output-enable only, whose sole
function is to drive the data bus.
■
SLRD is asserted
■
The FIFO pointer is updated on the rising edge of the PCLK,
while the SLRD is asserted. This starts the propagation of data
from the newly addressed location to the data bus. After a
propagation delay of tco (measured from the rising edge of
Note For burst mode, the SLRD# and SLOE# are asserted
during the entire duration of the read. When SLOE# is asserted,
the data bus is driven (with data from the previously addressed
FIFO). For each subsequent rising edge of PCLK, while the
SLRD# is asserted, the FIFO pointer is incremented and the next
data value is placed on the data bus.
Figure 12. Synchronous Slave FIFO Read Mode
Synchronous Read Cycle Timing
tCYC
PCLK
tCH
tCL
2-cycle latency
from SLRD to data
3- cycle latency
from addr to data
SLCS
tAS tAH
FIFO ADDR
An
tRDS
Am
tRDH
SLRD
SLOE
2 cycle latency from
SLRD to FLAG
t CFLG
FLAGA
(dedicated thread Flag for An)
( 1 = Not Empty0 = Empty)
t CFLG
FLAGB
(dedicated thread Flag for Am)
( 1 = Not Empty0= Empty)
tOELZ
Data Out
High-Z
tOEZ
Data
driven:DN (An)
tCDH
tOELZ
DN+1 (An)
tOEZ
tCO
DN (Am)
DN+1 (Am) DN+2 (Am)
SLWR (HIGH)
Document Number: 001-52136 Rev. *N
Page 27 of 45
CYUSB301X
Synchronous Slave FIFO Write Sequence Description
■
FIFO address is stable and the signal SLCS# is asserted
■
External master or peripheral outputs the data to the data bus
■
SLWR# is asserted
■
While the SLWR# is asserted, data is written to the FIFO and
on the rising edge of the PCLK, the FIFO pointer is incremented
■
The FIFO flag is updated after a delay of t WFLG from the rising
edge of the clock
edge of PCLK. The FIFO pointer is updated on each rising edge
of PCLK.
Short Packet: A short packet can be committed to the USB host
by using the PKTEND#. The external device or processor should
be designed to assert the PKTEND# along with the last word of
data and SLWR# pulse corresponding to the last word. The
FIFOADDR lines must be held constant during the PKTEND#
assertion.
The same sequence of events is also shown for burst write
Zero-Length Packet: The external device or processor can
signal a Zero-Length Packet (ZLP) to FX3 simply by asserting
PKTEND#, without asserting SLWR#. SLCS# and address must
be driven as shown in Figure 13 on page 28.
Note For the burst mode, SLWR# and SLCS# are asserted for
the entire duration, during which all the required data values are
written. In this burst write mode, after the SLWR# is asserted, the
data on the FIFO data bus is written to the FIFO on every rising
FLAG Usage: The FLAG signals are monitored for flow control
by the external processor. FLAG signals are outputs from FX3
that may be configured to show empty, full, or partial status for a
dedicated thread or the current thread that is addressed.
Figure 13. Synchronous Slave FIFO Write Mode
Synchronous Write Cycle Timing
tCYC
PCLK
tCH
tCL
SLCS
tAS tAH
Am
An
FIFO ADDR
tWRS
tWRH
SLWR
3 cycle latency from SLWR# to FLAG t CFLG
FLAGA
dedicated thread FLAG for An
(1 = Not Full 0= Full)
3 cycle latency from SLWR # to FLAG tCFLG
FLAGB
current thread FLAG for Am
(1 = Not Full 0= Full)
Data IN
tDS tDH
High-Z
tDS tDH
DN(Am)
DN(An)
tDH
DN+1(Am) DN+2(Am)
tPES tPEH
PKTEND
SLOE
(HIGH)
Synchronous ZLP Write Cycle Timing
tCYC
PCLK
tCH
tCL
SLCS
tAS tAH
An
FIFO ADDR
SLWR
(HIGH)
tPES tPEH
PKTEND
tCFLG
FLAGA
dedicated thread FLAG for An
(1 = Not Full 0= Full)
FLAGB
current thread FLAG for Am
(1 = Not Full 0= Full)
Data IN
High-Z
SLOE
(HIGH)
Document Number: 001-52136 Rev. *N
Page 28 of 45
CYUSB301X
Table 11. Synchronous Slave FIFO Parameters[7]
Min
Max
Units
FREQ
Parameter
Interface clock frequency
Description
–
100
MHz
tCYC
Clock period
10
–
ns
tCH
Clock high time
4
–
ns
tCL
Clock low time
4
–
ns
tRDS
SLRD# to CLK setup time
2
–
ns
tRDH
SLRD# to CLK hold time
0.5
–
ns
tWRS
SLWR# to CLK setup time
2
–
ns
tWRH
SLWR# to CLK hold time
0.5
–
ns
tCO
Clock to valid data
–
8
ns
tDS
Data input setup time
2
–
ns
tDH
CLK to data input hold
0.5
–
ns
tAS
Address to CLK setup time
tAH
CLK to address hold time
2
–
ns
0.5
–
ns
tOELZ
tCFLG
SLOE# to data low-Z
0
–
ns
CLK to flag output propagation delay
–
8
ns
tOEZ
SLOE# deassert to Data Hi Z
–
8
ns
tPES
PKTEND# to CLK setup
2
–
ns
tPEH
CLK to PKTEND# hold
0.5
–
tCDH
CLK to data output hold
2
–
ns
Note Three-cycle latency from ADDR to DATA/FLAGS
Asynchronous Slave FIFO Read Sequence
Description
In Figure 14, data N is the first valid data read from the FIFO. For
data to appear on the data bus during the read cycle, SLOE#
must be in an asserted state. SLRD# and SLOE# can also be
tied.
■
FIFO address is stable and the SLCS# signal is asserted.
■
SLOE# is asserted. This results in driving the data bus.
The same sequence of events is also shown for a burst read.
■
SLRD # is asserted.
■
Data from the FIFO is driven after assertion of SLRD#. This
data is valid after a propagation delay of tRDO from the falling
edge of SLRD#.
Note In the burst read mode, during SLOE# assertion, the data
bus is in a driven state (data is driven from a previously
addressed FIFO). After assertion of SLRD# data from the FIFO
is driven on the data bus (SLOE# must also be asserted). The
FIFO pointer is incremented after deassertion of SLRD#.
■
FIFO pointer is incremented on deassertion of SLRD#
Note
7. All parameters guaranteed by design and validated through characterization.
Document Number: 001-52136 Rev. *N
Page 29 of 45
CYUSB301X
Figure 14. Asynchronous Slave FIFO Read Mode
SLCS
tAS
tAH
An
FIFO ADDR
tRDl
Am
tRDh
SLRD
SLOE
tFLG
tRFLG
FLAGA
dedicated thread Flag for An
(1=Not empty 0 = Empty)
FLAGB
dedicated thread Flag for Am
(1=Not empty 0 = Empty)
tOE
tRDO
tOH
tOE
tRDO
tRDO
tOH
tLZ
Data Out
High-Z
DN(An)
DN(An)
DN(Am)
DN+1(Am)
DN+2(Am)
SLWR
(HIGH)
Asynchronous Slave FIFO Write Sequence
Description
■
FIFO address is driven and SLCS# is asserted
■
SLWR# is asserted. SLCS# must be asserted with SLWR# or
before SLWR# is asserted
■
Data must be present on the tWRS bus before the deasserting
edge of SLWR#
■
Deassertion of SLWR# causes the data to be written from the
data bus to the FIFO, and then the FIFO pointer is incremented
■
The FIFO flag is updated after the tWFLG from the deasserting
edge of SLWR.
The same sequence of events is shown for a burst write.
Short Packet: A short packet can be committed to the USB host
by using the PKTEND#. The external device or processor should
be designed to assert the PKTEND# along with the last word of
data and SLWR# pulse corresponding to the last word. The
FIFOADDR lines must be held constant during the PKTEND#
assertion.
Zero-Length Packet: The external device or processor can
signal a zero-length packet (ZLP) to FX3 simply by asserting
PKTEND#, without asserting SLWR#. SLCS# and the address
must be driven as shown in Figure 15 on page 31.
FLAG Usage: The FLAG signals are monitored by the external
processor for flow control. FLAG signals are FX3 outputs that
can be configured to show empty, full, and partial status for a
dedicated address or the current address.
Note that in the burst write mode, after SLWR# deassertion, the
data is written to the FIFO, and then the FIFO pointer is incremented.
Document Number: 001-52136 Rev. *N
Page 30 of 45
CYUSB301X
Figure 15. Asynchronous Slave FIFO Write Mode
Asynchronous Write Cycle Timing
SLCS
tAS
tAH
An
FIFO ADDR
tWRl
Am
tWRh
SLWR
tFLG
tWFLG
FLAGA
dedicated thread Flag for An
(1=Not Full 0 = Full)
tWFLG
FLAGB
dedicated thread Flag for Am
(1=Not Full 0 = Full)
tWR
S
High-Z
DATA In
tWRH
tWR
tWRH
S
DN(Am)
DN(An)
DN+1(Am)
DN+2(Am)
tWRPEt
PEh
PKTEND
SLOE
(HIGH)
tWRPE: SLWR# de-assert to PKTEND deassert = 2ns min (This means that PKTEND should not be be deasserted before SLWR#)
Note: PKTEND must be asserted at the same time as SLWR#.
Asynchronous ZLP Write Cycle Timing
SLCS
tAS
tAH
An
FIFO ADDR
SLWR
(HIGH)
tPEl tPEh
PKTEND
tWFLG
FLAGA
dedicated thread Flag for An
(1=Not Full 0 = Full)
FLAGB
dedicated thread Flag for Am
(1=Not Full 0 = Full)
DATA In
High-Z
SLOE
(HIGH)
Document Number: 001-52136 Rev. *N
Page 31 of 45
CYUSB301X
Table 12. Asynchronous Slave FIFO Parameters[8]
Parameter
Min
Max
Units
SLRD# low
20
–
ns
tRDh
SLRD# high
10
–
ns
tAS
Address to SLRD#/SLWR# setup time
7
–
ns
tAH
SLRD#/SLWR#/PKTEND to address hold time
2
–
ns
tRFLG
SLRD# to FLAGS output propagation delay
–
35
ns
tRDI
Description
tFLG
ADDR to FLAGS output propagation delay
tRDO
SLRD# to data valid
–
22.5
25
ns
tOE
OE# low to data valid
–
25
ns
tLZ
OE# low to data low-Z
0
–
ns
tOH
SLOE# deassert data output hold
–
22.5
ns
tWRI
SLWR# low
20
–
ns
tWRh
SLWR# high
10
–
ns
tWRS
Data to SLWR# setup time
7
–
ns
tWRH
SLWR# to Data Hold time
2
–
ns
tWFLG
SLWR#/PKTEND to Flags output propagation delay
–
35
ns
tPEI
PKTEND low
20
–
ns
tPEh
PKTEND high
7.5
–
ns
tWRPE
SLWR# deassert to PKTEND deassert
2
–
Note
8. All parameters guaranteed by design and validated through characterization.
Document Number: 001-52136 Rev. *N
Page 32 of 45
CYUSB301X
Serial Peripherals Timing
I2C Timing
Figure 16. I2C Timing Definition
Document Number: 001-52136 Rev. *N
Page 33 of 45
CYUSB301X
Table 13. I2C Timing Parameters[9]
Parameter
Description
Min
Max
Units
I2C Standard Mode Parameters
fSCL
SCL clock frequency
0
100
kHz
tHD:STA
Hold time START condition
4
–
µs
tLOW
LOW period of the SCL
4.7
–
µs
tHIGH
HIGH period of the SCL
4
–
µs
tSU:STA
Setup time for a repeated START condition
4.7
–
µs
tHD:DAT
Data hold time
0
–
µs
tSU:DAT
Data setup time
250
–
ns
tr
Rise time of both SDA and SCL signals
–
1000
ns
tf
Fall time of both SDA and SCL signals
–
300
ns
tSU:STO
Setup time for STOP condition
4
–
µs
tBUF
Bus free time between a STOP and START condition
4.7
–
µs
tVD:DAT
Data valid time
–
3.45
µs
tVD:ACK
Data valid ACK
–
3.45
µs
tSP
Pulse width of spikes that must be suppressed by input filter
n/a
n/a
0
400
kHz
I2C
Fast Mode Parameters
fSCL
SCL clock frequency
tHD:STA
Hold time START condition
0.6
–
µs
tLOW
LOW period of the SCL
1.3
–
µs
tHIGH
HIGH period of the SCL
0.6
–
µs
tSU:STA
Setup time for a repeated START condition
0.6
–
µs
tHD:DAT
Data hold time
0
–
µs
tSU:DAT
Data setup time
100
–
ns
tr
Rise time of both SDA and SCL signals
–
300
ns
tf
Fall time of both SDA and SCL signals
–
300
ns
tSU:STO
Setup time for STOP condition
0.6
–
µs
tBUF
Bus free time between a STOP and START condition
1.3
–
µs
tVD:DAT
Data valid time
–
0.9
µs
tVD:ACK
Data valid ACK
–
0.9
µs
tSP
Pulse width of spikes that must be suppressed by input filter
0
50
ns
Note
9. All parameters guaranteed by design and validated through characterization.
Document Number: 001-52136 Rev. *N
Page 34 of 45
CYUSB301X
Table 13. I2C Timing Parameters[9] (continued)
Parameter
Description
Min
Max
Units
I2
C Fast Mode Plus Parameters (Not supported at I2C_VDDQ=1.2 V)
fSCL
SCL clock frequency
0
1000
kHz
tHD:STA
Hold time START condition
0.26
–
µs
tLOW
LOW period of the SCL
0.5
–
µs
tHIGH
HIGH period of the SCL
0.26
–
µs
tSU:STA
Setup time for a repeated START condition
0.26
–
µs
tHD:DAT
Data hold time
0
–
µs
tSU:DAT
Data setup time
50
–
ns
tr
Rise time of both SDA and SCL signals
–
120
ns
tf
Fall time of both SDA and SCL signals
–
120
ns
tSU:STO
Setup time for STOP condition
0.26
–
µs
tBUF
Bus-free time between a STOP and START condition
0.5
–
µs
tVD:DAT
Data valid time
–
0.45
µs
tVD:ACK
Data valid ACK
–
0.55
µs
tSP
Pulse width of spikes that must be suppressed by input filter
0
50
ns
I2S Timing Diagram
Figure 17. I2S Transmit Cycle
tT
tTR
tTF
tTL
tTH
SCK
tThd
SA,
WS (output)
tTd
Table 14. I2S Timing Parameters[10]
Parameter
Description
Min
Max
Units
Ttr
–
ns
transmitter cycle LOW period
0.35 Ttr
–
ns
transmitter cycle HIGH period
0.35 Ttr
–
ns
–
0.15 Ttr
ns
–
0.15 Ttr
ns
transmitter data hold time
0
–
ns
transmitter delay time
–
0.8tT
ns
tT
I2S transmitter clock cycle
tTL
I 2S
tTH
I 2S
tTR
I 2S
transmitter rise time
tTF
I2S transmitter fall time
tThd
I 2S
tTd
I 2S
Note tT is selectable through clock gears. Max Ttr is designed for 96-kHz codec at 32 bits to be 326 ns (3.072 MHz).
Note
10. All parameters guaranteed by design and validated through characterization.
Document Number: 001-52136 Rev. *N
Page 35 of 45
CYUSB301X
SPI Timing Specification
Figure 18. SPI Timing
SSN
(output)
tssnh
tsck
tlead
SCK
(CPOL=0,
Output)
trf
twsck
SCK
(CPOL=1,
Output)
tsdi
MISO
(input)
tlag
twsck
thoi
MSB
LSB
td
tsdd
MOSI
(output)
tdis
tdi
v
LSB
MSB
SPI Master Timing for CPHA = 0
SSN
(output)
SCK
(CPOL=0,
Output)
tssnh
tsck
tlead
twsck
trf
tlag
twsck
SCK
(CPOL=1,
Output)
tsdi
MISO
(input)
thoi
LSB
tdis
tdi
tdv
MOSI
(output)
MSB
LSB
MSB
SPI Master Timing for CPHA = 1
Document Number: 001-52136 Rev. *N
Page 36 of 45
CYUSB301X
Table 15. SPI Timing Parameters[11]
Min
Max
Units
fop
Parameter
Operating frequency
Description
0
33
MHz
tsck
Cycle time
30
–
ns
twsck
Clock high/low time
13.5
–
ns
tsck[12 ]-5
5
ns
0.5
1.5 tsck[12]+5
ns
Rise/fall time
–
8
ns
tsdd
Output SSN to valid data delay time
–
5
ns
tdv
Output data valid time
–
5
ns
tdi
Output data invalid
0
–
ns
tssnh
Minimum SSN high time
10
–
ns
tsdi
Data setup time input
8
–
ns
thoi
Data hold time input
0
–
ns
tdis
Disable data output on SSN high
0
–
ns
tlead
SSN-SCK lead time
tlag
Enable lag time
trf
1/2
1.5
tsck[12]+
Notes
11. All parameters guaranteed by design and validated through characterization.
12. Depends on LAG and LEAD setting in the SPI_CONFIG register.
Document Number: 001-52136 Rev. *N
Page 37 of 45
CYUSB301X
Reset Sequence
FX3’s hard reset sequence requirements are specified in this section.
Table 16. Reset and Standby Timing Parameters
Parameter
tRPW
Definition
Minimum RESET# pulse width
tRH
Minimum high on RESET#
tRR
Reset recovery time (after which Boot loader begins
firmware download)
tSBY
Time to enter standby/suspend (from the time
MAIN_CLOCK_EN/ MAIN_POWER_EN bit is set)
tWU
Time to wakeup from standby
tWH
Minimum time before Standby/Suspend source may
be reasserted
Conditions
Min (ms)
Max (ms)
Clock Input
1
–
Crystal Input
1
–
–
5
–
Clock Input
1
–
Crystal Input
5
–
–
1
Clock Input
1
–
Crystal Input
5
–
–
5
–
Figure 19. Reset Sequence
VDD
( core )
xVDDQ
XTALIN/
CLKIN
XTALIN/ CLKIN must be stable
before exiting Standby/Suspend
Mandatory
Reset Pulse
tRh
tRR
Hard Reset
RESET #
tWH
tRPW
Standby/
Suspend
Source
tSBY
Standby/Suspend source Is asserted
(MAIN_POWER_EN/ MAIN_CLK_EN bit
is set)
Document Number: 001-52136 Rev. *N
tWU
Standby/Suspend
source Is deasserted
Page 38 of 45
CYUSB301X
Package Diagram
Figure 20. 121-ball FBGA Package Diagram
001-54471 *D
Document Number: 001-52136 Rev. *N
Page 39 of 45
CYUSB301X
Figure 21. 131-ball WLCSP Package Diagram
1
2 3 4
5 6 7 8
9 10 11 12
12 11 10 9 8
A
7
6 5 4
3 2
1
A
B
B
C
C
D
D
E
E
F
F
G
G
H
H
J
J
K
K
L
L
001-62221 *B
Note Underfill is required on the board design. Contact Cypress Applications for details.
Document Number: 001-52136 Rev. *N
Page 40 of 45
CYUSB301X
Ordering Information
Table 17. Ordering Information
Ordering Code
SRAM (kB)
GPIF II Data Bus Width
Operating Temperature
Package Type
CYUSB3011-BZXC
256
16-bit
0 °C to +70 °C
121-ball BGA
CYUSB3012-BZXC
256
32-bit
0 °C to +70 °C
121-ball BGA
CYUSB3013-BZXC
512
16-bit
0 °C to +70 °C
121-ball BGA
CYUSB3014-BZXC
512
32-bit
0 °C to +70 °C
121-ball BGA
CYUSB3014-BZXI
512
32-bit
–40°C to +85°C
121-ball BGA
CYUSB3014-FBXCT
512
32-bit
0 °C to +70 °C
131-ball CSP
CYUSB3014-FBXIT
512
32-bit
–40 °C to +85 °C
131-ball CSP
Ordering Code Definitions
Document Number: 001-52136 Rev. *N
Page 41 of 45
CYUSB301X
Acronyms
Document Conventions
Acronym
Description
Units of Measure
DMA
direct memory access
HNP
host negotiation protocol
°C
degree Celsius
MMC
multimedia card
µA
microamperes
MTP
media transfer protocol
µs
microseconds
PLL
phase locked loop
mA
milliamperes
PMIC
power management IC
Mbps
Megabits per second
SD
secure digital
MBps
Megabytes per second
SD
secure digital
MHz
mega hertz
SDIO
secure digital input / output
ms
milliseconds
SLC
single-level cell
ns
nanoseconds
SLCS
Slave Chip Select

ohms
SLOE
Slave Output Enable
pF
pico Farad
SLRD
Slave Read
V
volts
SLWR
Slave Write
SPI
serial peripheral interface
SRP
session request protocol
USB
universal serial bus
WLCSP
wafer level chip scale package
Document Number: 001-52136 Rev. *N
Symbol
Unit of Measure
Page 42 of 45
CYUSB301X
Document History Page
Document Title: CYUSB301X, EZ-USB® FX3: SuperSpeed USB Controller
Document Number: 001-52136
Revision
ECN
**
*A
2669761
2758370
*B
2779196
*C
2823531
*D
3080927
Orig. of
Submission
Description of Change
Change
Date
VSO/PYRS
03/06/09
New data sheet
VSO
09/01/09
Updated the part# from CYX01XXBB to CYUSB3011-BZXI
Changed the title from “ADVANCE” to “ADVANCE INFORMATION”
In page 1, the second bullet (Flexible Host Interface), add “32-bit, 100 MHz” to
first sub bullet.
In page 1, changed the second bullet “Flexible Host Interface” to General
Programmable Interface”.
In page 1, the second bullet (Flexible Host Interface), removed "DMA Slave
Support” and "MMC Slave support with Pass through Boot" sub bullets.
In page 1, third bullet, changed "50 A with Core Power" to "60 A with Core
Power"
In page 1, fifth bullet, added "at 1 MHz"
In page 1, seventh bullet, added "up to 4MHz" to UART
In page 1, Applications Section, move “Digital Still Cameras” to second line.
In page 1, Applications Section, added “Machine Vision” and Industrial
Cameras”
Added ™ to GPIF and FX3.
In page 1, updated Logic Block Diagram.
In page 2, section of “Functional Overview”, updated the whole section.
In page 2, removed the section of “Product Interface”
In page 2, removed the section of “Processor Interface (P-Port)”
In page 2, removed the section of “USB Interface (U-Port)”
In page 2, removed the section of “Other Interfaces”
In page 2, added a section of "GPIF II"
In page 2, added a section of "CPU"
In page 2, added a section of "JTAG Interface"
In page 2, added a section of "Boot Options"
In page 2, added a section of "ReNumeration"
In page 2, added a section of "Power"
In the section of “Package”, replaced “West Bridge USB 3.0 Platform” by FX3.
In the section of “Package”, added 0.8 mm pitch in front of BGA.
Added Pin List (Table 1)
VSO/PYRS
09/29/09
Features:
Added the thrid bullet “Fully accessible 32-bit ARM9 core with 512kB of
embedded SRAM”
Added the thrid line “EZ USB™ Software and DVK for easy code development”
Table 1: Pin 74, corrected to NC - No Connect.
Changed title to EZ-USB™ FX3: SuperSpeed USB Controller
OSG
12/08/09
Added data sheet to the USB 3.0 EROS spec 001-51884. No technical
updates.
OSG
11/08/2010 Changed status from Advance to Preliminary
Changed part number from CYUSB3011 to CYUSB3014
Added the following sections: Power, Configuration Options, Digital I/Os,
System-level ESD, Absolute Maximum Ratings, AC Timing Parameters, Reset
Sequence, Package Diagram
Added DC Specifications table
Updated feature list
Updated Pin List
Added support for selectable clock input frequencies.
Updated block diagram
Updated part number
Updated package diagram
Document Number: 001-52136 Rev. *N
Page 43 of 45
CYUSB301X
Document History Page (continued)
Document Title: CYUSB301X, EZ-USB® FX3: SuperSpeed USB Controller
Document Number: 001-52136
Orig. of
Submission
Revision
ECN
Description of Change
Change
Date
*E
3204393
OSG
03/24/2011 Updated Slave FIFO protocol and added ZLP signaling protocol
Changed GPIFII asynchronous tDO parameter
Changed Async Slave FIFO tOE parameter
Changed Async Slave FIFO tRDO parameter
Added tCOE parameter to GPIFII Sync mode timing parameters
Renamed GPIFII Sync mode tDO to tCO and tDO_ss0 to tCO_ss0
Modified description of GPIFII Sync tCO (previously tDO) parameter
Changed tAH(address hold time) parameter in Async Slave FIFO modes to be
with respect to rising edge of SLWR#/SLRD# instead of falling edge.
Correspondingly, changed the tAH number.
Removed 24 bit data bus support for GPIFII.
*F
3219493
OSG
04/07/2011 Minor ECN - Release to web. No content changes.
*G
3235250
GSZ
04/20/2011 Minor updates in Features.
*H
3217917
OSG
04/06/2011 Updated GPIFII Synchronous Timing diagram. Added SPI Boot option.
Corrected values of R_USB2 and R_USB3. Corrected TCK and TRST#
pull-up/pull-down configuration. Minor updates to block diagrams.
Corrected Synchronous Slave FIFO tDH parameter.
*I
3305568
DSG
07/07/2011 Minor ECN - Correct ECN number in revision *F. No content changes.
*J
3369042
OSG
12/06/2011 Changed tWRPE parameter to 2ns
Updated tRR and tRPW for crystal input
Added clarification regarding IOZ and IIX
Updated Sync SLave FIFO Read timing diagram
Updated SPI timing diagram
Removed tGRANULARITY parameter
Updated I2S Timing diagram and tTd parameter
Updated 121-ball FBGA package diagram.
Added clarification regarding VCC in DC Specifications table
In Power Modes description, stated that VIO1 cannot be turned off at any time
if the GPIFII is used in the application
Updated Absolute Maximum Ratings
Added requirement for by-pass capacitor on U3RXVDDQ and U3TXVDDQ
Updated tPEI parameter in Async Slave FIFO timing table
Updated Sync Slave FIFO write and read timing diagrams
Updated I2C interface tVD:ACK parameter for 1MHz operation
Clarified that CTL[15] is not usable as a GPIO
Changed datasheet status from Preliminary to Final.
*K
3534275
OSG
02/24/2012 Corrected typo in the block diagram.
*L
3649782
OSG
08/16/2012 Changed part number to CYUSB301X.
Added 256 KB range for embedded SRAM.
Updated Functional Overview, Other Interfaces, and Clocking sections.
Added Pin List for CYUSB3011 and CYUSB3013 parts.
Updated Ordering Information with new part numbers.
*M
3848148
OSG
12/20/2012 Updated 121-ball FBGA package diagram to current revision.
*N
4016006
OSG
05/31/2013 Updated Features (Added 131-ball WLCSP under Package option).
Updated Pin Configurations (Added FX3 131-ball WLCSP Ball Map (Figure 8)).
Updated Pin Description (Updated Table 7).
Updated Absolute Maximum Ratings (Included Commercial Temperature
Range related information).
Updated Operating Conditions (Included Commercial Temperature Range
related information).
Updated Package Diagram (Added 131-ball WLCSP Package Diagram
(Figure 21)).
Updated Ordering Information (Updated part numbers).
Document Number: 001-52136 Rev. *N
Page 44 of 45
CYUSB301X
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© Cypress Semiconductor Corporation, 2009-2013. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of
any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for
medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as
critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support systems
application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.
Any Source Code (software and/or firmware) is owned by Cypress Semiconductor Corporation (Cypress) and is protected by and subject to worldwide patent protection (United States and foreign),
United States copyright laws and international treaty provisions. Cypress hereby grants to licensee a personal, non-exclusive, non-transferable license to copy, use, modify, create derivative works of,
and compile the Cypress Source Code and derivative works for the sole purpose of creating custom software and or firmware in support of licensee product to be used only in conjunction with a Cypress
integrated circuit as specified in the applicable agreement. Any reproduction, modification, translation, compilation, or representation of this Source Code except as specified above is prohibited without
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Disclaimer: CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS MATERIAL, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES
OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. Cypress reserves the right to make changes without further notice to the materials described herein. Cypress does not
assume any liability arising out of the application or use of any product or circuit described herein. Cypress does not authorize its products for use as critical components in life-support systems where
a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress’ product in a life-support systems application implies that the manufacturer
assumes all risk of such use and in doing so indemnifies Cypress against all charges.
Use may be limited by and subject to the applicable Cypress software license agreement.
Document Number: 001-52136 Rev. *N
®
Revised May 31, 2013
Page 45 of 45
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respective holders.
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