Rohm BU12JA2MNVX-TL Ultra-small package full cmos ldo regulator Datasheet

CMOS LDO Regulator Series for Automotive
Ultra-Small Package
FULL CMOS LDO Regulator
BUxxJA2MNVX-C series
General Description
Key Specifications






BUxxJA2MNVX-C series are high-performance FULL
CMOS regulators with 200mA output, which are mounted
on versatile package SSON004R1010 (1.00mm x 1.00
mm x 0.60mm). These device have excellent noise
characteristics and load responsiveness characteristics
despite its low circuit current consumption of 35μA. They
are most appropriate for various applications such as
power supplies for radar and camera of the automotive.
Input Voltage Range:
1.7V to 6.0V
Output Voltage:
1.0V to 3.4V
Output Voltage Accuracy: ±2.0%(Ta=-40°C to 125°C)
Output Current:
200mA(Max)
Standby Current:
35μA (Typ)
Operating Temperature Range:
-40°C to +125°C
Package
SSON004R1010 :
W(Typ) x D(Typ) x H(Max)
1.00mm x 1.00mm x 0.60mm
Features



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AEC-Q100 Qualified(NoteE1)
High Accuracy Output
Low Current Consumption
Compatible With Small Ceramic Capacitor(CIN=CO=0.47μF)
With Built-in Output Discharge Circuit
High Ripple Rejection
ON/OFF Control of Output Voltage
Built-in Over Current Protection Circuit
Built-in Thermal Shutdown Circuit
(Note1) Grade1
SSON004R1010
Applications
Radar and camera for automotive, etc.
Typical Application Circuit
STBY
VIN
CIN
0.47μF
STBY
VOUT
VIN
VOUT
CO
0.47μF
GND
GND
GND
Figure 1. Application Circuit
○Product structure:Silicon monolithic integrated circuit
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BUxxJA2MNVX-C series
Ordering Information
B
U
Part Number
x
x
J
A
2
M
N
Output Voltage Output Current Category
10 : 1.0V
200mA
M:Automotive
↓
33 : 3.3V
Output Voltage
Part Number
1.0V
BU10
1.2V
BU12
1.25V
BU1C
1.5V
BU15
V
X
-
Package
Product Rank
C:for Automotive
Packaging and forming
specification
TL: Embossed tape and reel
NVX:SSON004R1010
1.8V
BU18
2.5V
BU25
2.8V
BU28
C TL
2.85V
BU2J
3.0V
BU30
3.3V
BU33
Block Diagram
Figure 2. Block Diagram
Pin Configurations
4 VIN
1 VOUT
3 STBY
2 GND
SSON004R1010 (TOP VIEW)
Pin Descriptions
Pin No.
1
2
3
4
Back side
Pin name
VOUT
GND
STBY
VIN
FIN
Pin Function
Output Voltage
Ground
ON/OFF control of output voltage (High: ON, Low: OFF)
Power Supply Voltage
Connect to GND
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Absolute Maximum Ratings (Ta=25°C)
Parameter
Power Supply Voltage
STBY Voltage
Power Dissipation
SSON004R1010
Operating Temperature Range
Storage Temperature Range
Maximum junction temperature
Symbol
Rating
Unit
VIN
-0.3 to +6.5
V
VSTBY
-0.3 to +6.5
V
Pd
0.69 (Note1)
W
Topr
-40 to +125
°C
Tstg
-55 to +150
°C
Tjmax
+150
°C
(Note1) Mounted on 70mm x 70mm x 1.6mm glass epoxy board. Reduce 5.52mW per 1°C above 25°C
Recommended Operating Range
Parameter
Power Supply Voltage
STBY Voltage
Maximum Output Current
Symbol
Min
Max
Unit
VIN
1.7
6.0
V
VSTBY
0.0
6.0
V
IOUT
-
200
mA
Recommended Operating Conditions
Parameter
Symbol
Min
0.22
Input Capacitor
CIN
(Note2)
Output Capacitor
CO
(Note2)
0.22
Conditions
Typ
Max
Unit
0.47
-
µF
Ceramic capacitor recommended
0.47
-
µF
Ceramic capacitor recommended
(Note2) Caution that the capacitance to be kept higher than this specified values under all conditions considering temperature, DC bias, etc.
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Electrical Characteristics
(VIN=VOUT+1.0V(Note3)、STBY=VIN、CIN=0.47μF、CO=0.47μF, unless otherwise specified.)
Parameter
Symbol
Limit
Min
Typ
Max
Unit
Conditions
[Regulator Block]
Output Voltage 1
Output Voltage 2
Operating Current
Operating Current (STBY)
VOUT1
VOUT2
Line Regulation
-
VOUT
×1.02
VOUT
+36mV
VOUT
×1.03
VOUT
+54mV
IOUT=0.01mA, VOUT≥1.8V
V
IOUT=0.01mA, VOUT<1.8V
V
IOUT=0.01mA to 200mA
VOUT≥1.8V
IOUT=0.01mA to 200mA
VOUT<1.8V
-
35
-
90
2.0
μA
μA
IOUT=0mA
STBY=0V
RR
45
70
-
dB
VRR=-20dBv, fRR=1kHz
IOUT=10mA, Ta=25°C
-
800
600
1100
900
mV 1.0V ≤ VOUT < 1.2V(IOUT=200mA)
mV 1.2V ≤ VOUT < 1.5V(IOUT=200mA)
-
440
380
830
710
mV 1.5V ≤ VOUT < 1.8V(IOUT=200mA)
mV 1.8V ≤ VOUT < 2.5(IOUT=200mA)
-
280
260
620
580
mV 2.5V ≤ VOUT ≤ 2.6(IOUT=200mA)
mV 2.7V ≤ VOUT ≤ 2.85(IOUT=200mA)
-
240
220
530
490
mV 2.9V ≤ VOUT ≤ 3.1V(IOUT=200mA)
mV 3.2V ≤ VOUT ≤ 3.4V(IOUT=200mA)
-
2
20
mV
-
10
80
mV IOUT=0.01mA to 100mA
ILMAX
ISHORT
220
20
400
70
700
150
mA ILMAX@VOUT×0.95, Ta=25°C
mA VOUT=0V, Ta=25°C
RDSC
20
50
80
Ω
ISTB
VSTBH
0.1
1.2
0.6
-
2.0
6.0
μA
V
VSTBL
0
-
0.3
V
VSAT
VDL
Load Regulation
VDLO
[Over Current Protection (OCP) Block]
Limit Current
Short Current
-
IIN
ISTBY
Ripple Rejection Ratio
Dropout Voltage
VOUT
×0.98
VOUT
-36mV
VOUT
×0.97
VOUT
-54mV
VIN=VOUT+1.0V to 5.5V(Note4)
IOUT=0.01mA
[Standby Block]
Discharge
Resistor
STBY Pin Pull-down Current
ON
STBY Control Voltage
OFF
VIN=4.0V, STBY=0V
VOUT=4.0V, Ta=25°C
STBY=1.5V
(Note3) VIN=2.5V for VOUT≤1.5V
(Note4) VIN=2.5V to 3.6V for VOUT≤1.5V
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BUxxJA2MNVX-C series
Reference data
BU33JA2MNVX-C
(Ta=25ºC unless otherwise specified.)
Ta=25°C
Ta=25°C
IOUT=0mA
IOUT=50mA
IOUT=200mA
IOUT=0mA
IOUT=0.1mA
IOUT=50mA
IOUT=200mA
VIN=STBY
VIN=STBY
VIN (V)
VIN (V)
Figure 3. Output Voltage
Figure 4. Output Voltage
Ta=-40°C
Ta=25°C
Ta=125°C
Ta=-40°C
Ta=25°C
Ta=125°C
Circuit Current (μA)
IOUT=0mA
VIN=STBY
VIN=STBY
VIN (V)
VIN (V)
Figure 5. Circuit Current
IIN
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Figure 6. VSTBY - ISTB
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BUxxJA2MNVX-C series
Reference data
BU33JA2MNVX-C
(Ta=25ºC unless otherwise specified.)
VIN=4.3V
VSTBY=1.5V
Ta=25°C
Ta=-40°C
Ta=25°C
Ta=125°C
Ta=-40°C
Ta=125°C
VIN=4.3V
VSTBY=1.5V
Figure 8. Load Regulation
Figure 7. IOUT - IGND
VIN=0.98×VOUT
VSTBY=1.5V
VIN=3.8V
Ta=125°C
VIN=4.3V
Ta=25°C
VIN=5.5V
Ta=-40°C
Temp=25°C
VSTBY=1.5V
Figure 10. OCP Threshold
Figure 9. Dropout Voltage
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BUxxJA2MNVX-C series
Reference data
BU33JA2MNVX-C
(Ta=25ºC unless otherwise specified.)
VIN=4.3V
VSTBY=1.5V
IOUT=0.1mA
Ta=-40°C
Ta=25°C
Ta=125°C
VIN=4.3V
Figure 12. VOUT - Temp
Figure 11. STBY Threshold
VIN=4.3V
VSTBY=1.5V
IOUT=0.1mA
VIN=4.3V
VSTBY=0.0V
Figure 13. IGND - Temp
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Figure 14. IGND - Temp (STBY)
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BUxxJA2MNVX-C series
Reference data
BU33JA2MNVX-C
(Ta=25ºC unless otherwise specified.)
100
Output Voltage (V)
0
3.3
0
3.1
0
Ta=-40°C
Ta=25°C
Ta=125°C
VIN=4.3V
VSTBY=1.5V
CO=0.47μF
0
3.5
0
3.3
0
3.1
0
200
IOUT=100mA→0mA
VIN=4.3V
VSTBY=1.5V
CO=0.47μF
Figure 17. Load Response
100
0
Output Voltage (V)
Output Voltage (V)
0
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VIN=4.3V
VSTBY=1.5V
CO=0.47μF
3.5
0
3.3
0
3.1
0
Ta=-40°C
Ta=25°C
Ta=125°C
Output Current (mA)
100
Output Current (mA)
200
IOUT=0mA→100mA
Ta=-40°C
Ta=25°C
Ta=125°C
Ta=-40°C
Ta=25°C
Ta=125°C
Figure 16. Load Response
Figure 15. Load Response
3.5
0
3.3
0
3.1
0
100
IOUT=50mA→0mA
Output Voltage (V)
3.5
0
200
Output Current (mA)
IOUT=0mA→50mA
Output Current (mA)
200
VIN=4.3V
VSTBY=1.5V
CO=0.47μF
Figure 18. Load Response
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BUxxJA2MNVX-C series
Reference data
BU33JA2MNVX-C
(Ta=25ºC unless otherwise specified.)
3.5
0
3.3
0
3.1
0
Ta=-40°C
Ta=25°C
Ta=125°C
100
0
Output Voltage (V)
Output Voltage (V)
0
200
IOUT=200mA→0mA
VIN=4.3V
VSTBY=1.5V
CO=0.47μF
3.5
0
3.3
0
3.1
0
Ta=-40°C
Ta=25°C
Ta=125°C
VIN=4.3V
VSTBY=1.5V
CO=0.47μF
Figure 20. Load Response
Figure 19. Load Response
0
200
IOUT=100mA→50mA
100
0
Output Current (mA)
100
Output Current (mA)
200
IOUT=50mA→100mA
3.5
0
Output Voltage (V)
Output Voltage (V)
Output Current (mA)
100
Output Current (mA)
200
IOUT=0mA→200mA
3.3
0
3.1
0
Ta=-40°C
Ta=25°C
Ta=125°C
VIN=4.3V
VSTBY=1.5V
CO=0.47μF
3.1
0
Ta=-40°C
Ta=25°C
Ta=125°C
VIN=4.3V
VSTBY=1.5V
CO=0.47μF
Figure 22. Load Response
Figure 21. Load Response
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3.5
0
3.3
0
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BUxxJA2MNVX-C series
Reference data
BU33JA2MNVX-C
(Ta=25ºC unless otherwise specified.)
1.0
4.0
2.0
0.0
CO=0.47μF
CO=1.0μF
CO=2.2μF
0.0
4.0
2.0
0.0
CO=0.47μF
CO=1.0μF
CO=2.2μF
VIN=4.3V
IOUT=0mA
Figure 23. Start Up Time
IOUT=0mA
4.0
2.0
VIN=4.3V
IOUT=0mA
2.0
0.0
Output Voltage (V)
Output Voltage (V)
0.0
4.0
VSTBY=0V→VIN
Figure 25. Start Up Time
(VIN=STBY) IOUT=0mA
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STBY Voltage (V)
2.0
STBY Voltage (V)
4.0
CO=0.47μF
CO=1.0μF
CO=2.2μF
VIN=4.3V
IOUT=200mA
Figure 24. Start Up Time
IOUT=200mA
VSTBY=0V→VIN
0.0
2.0
1.0
Output Voltage (V)
Output Voltage (V)
0.0
VSTBY=0V→1.5V
STBY Voltage (V)
2.0
STBY Voltage (V)
VSTBY=0V→1.5V
4.0
2.0
0.0
CO=0.47μF
CO=1.0μF
CO=2.2μF
VIN=4.3V
IOUT=200mA
Figure 26. Start Up Time
(VIN=STBY) IOUT=200mA
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BUxxJA2MNVX-C series
Reference data
BU33JA2MNVX-C
(Ta=25ºC unless otherwise specified.)
4.0
2.0
5.3
Output Voltage (V)
Output Voltage (V)
0.0
6.3
VIN=4.3V→5.3V→4.3V
CO=0.47μF
CO=1.0μF
CO=2.2μF
0.0
Ta=-40°C
Ta=25°C
Ta=125°C
3.31
4.3
Input Voltage (V)
1.0
VSTBY=1.5V→0V
STBY Voltage (V)
2.0
3.30
3.29
Ta=-40°C
Ta=25°C
Ta=125°C
VIN=4.3V
IOUT=0mA
Figure 28. VIN Response
Figure 27. Discharge Time
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BUxxJA2MNVX-C series
About power dissipation (Pd)
As for power dissipation, an approximate estimate of the heat reduction characteristics and internal power consumption of
IC are shown, so please use these for reference. Since power dissipation changes substantially depending on the
implementation conditions (board size, board thickness, metal wiring rate, number of layers and through holes, etc.), it is
recommended to measure Pd on a set board. Exceeding the power dissipation of IC may lead to deterioration of the original
IC performance, such as causing operation of the thermal shutdown circuit or reduction in current capability. Therefore, be
sure to prepare sufficient margin within power dissipation for usage.
Calculation of the maximum internal power consumption of IC (PMAX)
PMAX=(VIN-VOUT)×IOUT(MAX)
(VIN: Input voltage
VOUT: Output voltage
IOUT(MAX): Maximum output current)
Measurement conditions
Standard ROHM Board
Evaluation Board 1
Top Layer (Top View)
Top Layer (Top View)
Layout of Board for
Measurement
IC
Implementation
Position
Bottom Layer (Bottom View)
Bottom Layer (Bottom View)
Measurement State
With board implemented (Wind speed 0 m/s)
With board implemented (Wind speed 0 m/s)
Board Material
Glass epoxy resin (Double-side board)
Glass epoxy resin (Double-side board)
Board Size
70 mm x 70 mm x 1.6 mm
40 mm x 40 mm x 1.6 mm
Metal (GND) wiring rate: Approx. 0%
Metal (GND) wiring rate: Approx. 50%
Metal (GND) wiring rate: Approx. 50%
Metal (GND) wiring rate: Approx. 50%
Diameter 0.5mm x 6 holes
Diameter 0.5mm x 25 holes
0.69W
0.48W
θja=178.6°C/W
θja=256.4°C/W
Top layer
Bottom
layer
Through Hole
Wiring
Rate
Power Dissipation
Thermal Resistance
* Please design the margin that PMAX
will be less than the Pd (PMAX < Pd)
within the usage temperature range.
Figure 29. SSON004R1010
Power dissipation
heat reduction characteristics (Reference)
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BUxxJA2MNVX-C series
Operation Notes
1. Absolute maximum ratings
Use of the IC exceeding the absolute maximum ratings (such as the input voltage or operating temperature range) may result in damage to the
IC. Damage mode of the IC in such case can not be assumed (e.g. short mode or open mode). If operational values are expected to exceed
the maximum ratings for the device, consider adding protective circuitry (such as fuses) to eliminate the risk of damaging the IC.
2. GND potential
The potential of the GND pin must be the minimum potential in the system in all operating conditions.
Never connect a potential lower than GND to any pin, even if only transiently.
3. Thermal design
Use a thermal design which ensure sufficient margin to the power dissipation rating (Pd) under actual operating conditions.
4. Inter-pin shorts and mounting errors
Caution on the orientation and positioning of the IC for mounting on printed circuit boards. Improper mounting or shorts between pins may
result in damage to the IC.
5. Common impedance
Wiring traces should be as short and wide as possible to minimize common impedance. Bypass capacitors should be use え to keep ripple to a
minimum.
6. Voltage of STBY pin
To enable standby mode for all channels, set the STBY pin to 0.3 V or less, and for normal operation, to 1.2 V or more. Setting STBY to a
voltage between 0.3 and 1.2 V may cause malfunction and should be avoided. Keep transition time between high and low (or vice versa) to a
minimum.
Additionally, if STBY is shorted to VIN, the IC will switch to standby mode and disable the output discharge circuit, causing a temporary voltage
to remain on the output pin. If the IC is switched on again while this voltage is present, overshoot may occur on the output. Therefore, in
applications where these pins are shorted, the output should always be completely discharged before turning the IC on.
7. Over-current protection circuit (OCP)
This IC features an integrated over-current and short-protection circuitry on the output to prevent destruction of the IC when the output is
shorted. The OCP circuitry is designed only to protect the IC from irregular conditions (such as motor output shorts) and is not designed to be
used as an active security device for the application. Therefore, applications should not be designed under the assumption that this circuitry
will engage.
8. Thermal shutdown circuit (TSD)
This IC also features a thermal shutdown circuit that is designed to turn the output off when the junction temperature of the IC exceeds
approximately 150°C. This feature is intended to protect the IC only in the event of thermal overload and is not designed to guarantee
operation or act as an active security device for the application. Therefore, applications should not be designed under the assumption that this
circuitry will engage.
9. Input/output capacitor
Capacitors must be connected between the input/output pins and GND for stable operation, and should be physically mounted as close to the
IC pins as possible. The input capacitor helps to counteract increases in power supply impedance, and increases stability in applications with
long or winding power supply traces. The output capacitance value is directly related to the overall stability and transient response of the
regulator, and should be set to the largest possible value for the application to increase these characteristics. During design, keep in mind that
in general, ceramic capacitors have a wide range of tolerances, temperature coefficients and DC bias characteristics, and that their
capacitance values tend to decrease over time. Confirm these details before choosing appropriate capacitors for your application. (Refer to the
technical note of the intended ceramic capacitors.)
10. About the equivalent series resistance (ESR) of a ceramic capacitor
Capacitors generally have ESR (equivalent series resistance) and it operates stably in the ESR-IOUT area shown on the below. Since ceramic
capacitors, tantalum capacitors, electrolytic capacitors, etc. generally have different ESR, please check the ESR of the capacitor to be used
and use it within the stability area range shown in the right graph for evaluation of the actual application.
CIN=0.47μF, CO=0.47μF, Temp=25°C
100
Unstable region
ESR[Ω
[Ω]]
ESR
10
1
0.1
0.01
0
50
100
150
200
IOUT [mA]
Figure 30. Stable region
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BUxxJA2MNVX-C series
Input/Output Capacitor
It is recommended that an input capacitor is placed near pins between the VIN pin and GND as well as an output capacitor
between the VOUT pin and GND. The input is valid when the power supply impedance is high or when the PCB trace has
significant length. For the output capacitor, the greater the capacitance, the more stable the output will be depending on the
load and line voltage variations. However, please check the actual functionality of this capacitor by mounting it on a board for
the actual application. Ceramic capacitors usually have different, thermal and equivalent series resistance characteristics,
and may degrade gradually over continued use. For additional details, please check with the manufacturer, and select the
best ceramic capacitor for your application.
10V withstand voltage
B1 characteristics
GRM188B11A105KA61D
10
0
10V withstand
voltage
B characteristics
Capacitance Change [%]
-10
-20
6.3V withstand
voltage
B characteristics
-30
10V withstand
voltage
F characteristics
-40
-50
4V withstand
voltage
X6S characteristics
-60
-70
-80
-90
-100
0
1
2
DC Bias Voltage [V]
3
4
Figure 31. Capacity-bias characteristics
I/O Equivalence Circuits
1pin (VOUT)
3pin (STBY)
VIN
VIN
VOUT
STBY
Figure 32. Input / Output equivalent circuit
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BUxxJA2MNVX-C series
Marking Diagram
SSON004R1010 (TOP VIEW)
LOT Number
X
Part Number Marking
1PIN MARK
Marking
Output Voltage
Part Number
5
1.0V
BU10
4
1.2V
BU12
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TSZ22111・15・001
3
1.25V
BU1C
2
1.5V
BU15
Q
1.8V
BU18
15/17
1
2.5V
BU25
U
2.8V
BU28
0
2.85V
BU2J
Y
3.0V
BU30
R
3.3V
BU33
TSZ02201-0G5G0A300030-1-2
11.Apr.2016 Rev.003
BUxxJA2MNVX-C series
Physical Dimension Tape and Reel Information
Package Name
www.rohm.com
© 2016 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
SSON004R1010
16/17
TSZ02201-0G5G0A300030-1-2
11.Apr.2016 Rev.003
BUxxJA2MNVX-C series
Revision History
Date
Revision
26.Dec.2014
001
New Release.
27.Aug.2015
002
11.Apr.2016
003
P2 Add Line up
Applied the ROHM Standard Style and improved understandability.
Add Equivalence Circuits
www.rohm.com
© 2016 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
Changes
17/17
TSZ02201-0G5G0A300030-1-2
11.Apr.2016 Rev.003
Notice
Precaution on using ROHM Products
1.
(Note 1)
If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment
,
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PAA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.003
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PAA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.003
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001
Datasheet
BU10JA2MNVX-C - Web Page
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Distribution Inventory
Part Number
Package
Unit Quantity
Minimum Package Quantity
Packing Type
Constitution Materials List
RoHS
BU10JA2MNVX-C
SSON004R1010
5000
5000
Taping
inquiry
Yes
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