Low-Power HDMI/DVI Transmitter ADV7520NK Preliminary Technical Data FEATURES General Low-power HDMITM/DVI transmitter ideal for portable applications CEC controller and buffer reduces system overhead. Compatible with HDMI v1.3, DVI v1.0, and HDCP 1.3 Single 1.8V power supply Video/audio inputs accept logic level s from 1.8V to 3.3V Digital video 80 MHz operation supports all video resolutions from 480i to 1080i Programmable two-way color space converter Supports RGB, YCbCr, DDR Supports ITU656 based embedded syncs Auto input video format timing detection (CEA-861D) Digital audio Supports standard S/PDIF for stereo LPCM or compressed audio up to 192 kHz 8-channel uncompressed LPCM I2S audio up to 192 kHz Special features for easy system design On-chip MPU with I2C® master to perform HDCP operations and EDID reading operations 5 V tolerant I2C and HPD I/Os, no extra device needed No audio master clock needed for supporting S/PDIF and I2S On-chip MPU reports HDMI events through interrupts and registers APPLICATIONS Digital video cameras, Digital still cameras Personal media players Cellular handsets DVD players and recorders Digital set-top boxes A/V receivers HDMI repeater GENERAL DESCRIPTION The ADV7520NK is an 80 MHz, high definition multimedia interface (HDMI) v.1.3 transmitter. It supports HDTV formats up to 1080i and 720p, and computer graphic resolutions up to XGA (1024 x 768 @ 75 Hz). With the inclusion of HDCP (available in the BGA package only), the FUNCTIONAL BLOCK DIAGRAM CEC Controller/ Buffer S/PDIF MCLK I2S[3:0] LRCLK Audio Data Capture SCLK HSYNC DE 4:2:2 4:4:4 & Color Space Converter D[23:0] VSYNC Tx0 TMDS Outputs CLK SDA SCL HDCP Encryption Video Data Capture Registers & Config. Logic HPD INT I2 C Slave CEC HDCP & EDID Microcontroller Tx1 Tx2 TxC I2C Master DDCSDA DDCSCL ADV7520NK Figure 1. ADV7520NK allows the secure transmission of protected content as specified by the HDCP v1.3 protocol. The ADV7520NK supports both S/PDIF and 8-channel I2S audio. Its high fidelity 8-channel I2S can transmit either stereo or 7.1 surround audio at 192 kHz. The S/PDIF can carry stereo LPCM audio or compressed audio including Dolby® Digital and DTS®. The ADV7520NK helps to reduce system design complexity and cost by incorporating such features as an internal MPU for HDCP operations, an I2C master for EDID reading, a single 1.8V power supply and 5 V tolerance on I2C and hot plug detect pins. Fabricated in an advanced CMOS process, the ADV7520NK is available in a space saving, 76-ball, CSP_BGA or 64-lead LFCSP surface-mount package. Both packages are available as RoHS compliant and are specified from −25°C to +85°C operational. Rev. PrA Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.461.3113 ©2007 Analog Devices, Inc. All rights reserved. ADV7520NK Preliminary Technical Data TABLE OF CONTENTS Features .............................................................................................. 1 Applications........................................................................................3 Applications....................................................................................... 1 Design Resources ..........................................................................3 General Description ......................................................................... 1 Outline Dimensions ..........................................................................4 Functional Block Diagram .............................................................. 1 Ordering Guide .............................................................................4 Revision History ............................................................................... 2 REVISION HISTORY Rev. PrA | Page 2 of 5 Preliminary Technical Data ADV7520NK APPLICATIONS DESIGN RESOURCES Analog Devices, Inc. evaluation kits, reference design schematics, and other support documentation are available under NDA from [email protected]. Other resources include: EIA/CEA-861D that describes audio and video infoframes as well as the E-EDID structure for HDMI. It is available from Consumer Electronics Association (CEA). The HDMI v1.3, a defining document for HDMI Version 1.3, and the HDMI Compliance Test Specification Version 1.3 are available from HDMI Licensing, LLC. The HDCP v1.3 is the defining document for HDCP Version 1.3. available from Digital Content Protection, LLC. Rev. PrA | Page 3 of 5 ADV7520NK Preliminary Technical Data OUTLINE DIMENSIONS 64 PIN LFCSP PACKAGE DIMENSIONS 9.00 BSC SQ 0.30 0.25 0.18 0.60 MAX 0.60 MAX 49 48 PIN 1 INDICATOR 64 1 PIN 1 INDICATOR + 8.75 BSC SQ TOP VIEW (BOTTO M VIEW) 0.45 0.40 0.35 1.00 0.85 0.80 33 32 17 16 7.50 REF 0.80 MAX 0.65 TYP 12° MAX 4.85 4.70 SQ* 4.55 EXPOSED PAD** 0.05 MAX 0.02 NOM 0.50 BSC SEATING PLANE 0.20 REF 64 LFCSP (LEAD FRAME CHIP SCALE PACKAGE) * COMPLIANT TO JEDEC STANDARDS MO-220-VMMD EXCEPT FOR EXPOSED PAD DIMENSION **Note: PAD is CONNECTED to GND DIMENSIONS in Millimeters Figure 6. 64-pin LFCSP Dimensions shown in millimeters A1 CORNER INDEX AREA 6.10 6.00 SQ 5.90 10 9 8 7 6 5 4 3 2 1 A B BALL A1 PAD CORNER TOP VIEW C 4.50 BSC SQ D E 0.50 BSC F G H J K DETAIL A BOTTOM VIEW 0.75 REF *1.40 MAX DETAILA 0.65 MIN 0.15 MIN COPLANARITY 0.08 MAX *COMPLIANT TO JEDEC STANDARDS MO-225 WITH THE EXCEPTION TO PACKAGE HEIGHT. 012006-0 0.35 SEATING 0.30 PLANE 0.25 BALL DIAMETER Figure 7. 76-Ball Chip Scale Package Ball Grid Array [CSP_BGA] 6 mm × 6 mm × 1.4 mm (BC-76) Dimensions shown in millimeters ORDERING GUIDE Model ADV7520NKBCPZ-801 ADV7520NKBBCZ-80 ADV7520NKBBCZRL-80 ADV7520NK/PCBZ 1 Temp. Range −25°C to +85°C −25°C to +85°C −25°C to +85°C Package Description 64-pin Lead Formed Chip Scale Package 76-Ball Chip Scale Package Ball Grid Array [CSP_BGA] 76-Ball Chip Scale Package Ball Grid Array [CSP_BGA] Evaluation Board All packages are RoHS compliant Rev. PrA | Page 4 of 5 Package Option CP-64 BC-76 BC-76 Preliminary Technical Data ADV7520NK NOTES ©2007 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. PR06968-0-8/07(PrA) Rev. 0 | Page 5 of 5