AAVID BW63-4G How to use this catalog Datasheet

General Information
How to Use This Standard Part Catalog.................................................................................................................................................................................................................... 2
Index by Part Number..................................................................................................................................................................................................................................................... 3
Index by Device and Thermal Resistance............................................................................................................................................................................................................ 4–5
Index by Style and Thermal Resistance................................................................................................................................................................................................................6–8
How to Select a Heat Sink...................................................................................................................................................................................................................................... 9–10
How to Read a Thermal Graph...................................................................................................................................................................................................................................11
Board Mounted Heat Sinks
Heat Sinks for IC Packages
BGA......................................................................................................................................................................................................................................................... 12–19
DIP........................................................................................................................................................................................................................................................... 21–23
Surface Mount Discrete Semiconductor Packages
D-PAK..................................................................................................................................................................................................................................................... 24–25
SO................................................................................................................................................................................................................................................................... 24
SMT Footprints.......................................................................................................................................................................................................................................... 26
Thru-Hole Discrete Semiconductor Packages
TO-220.................................................................................................................................................................................................................................................. 27–50
TO-220 and TO-262.......................................................................................................................................................................................................................... 51–53
TO-220, TO-218, and TO-247......................................................................................................................................................................................................... 53–58
TO-220 and TO-202.................................................................................................................................................................................................................................. 59
TO-220, TO-218, TO-247, and Multiwatt.................................................................................................................................................................................... 60–61
TO-218.......................................................................................................................................................................................................................................................... 62
TO-202................................................................................................................................................................................................................................................... 63–64
TO-126.......................................................................................................................................................................................................................................................... 65
SIP............................................................................................................................................................................................................................................................ 66–67
TO-92............................................................................................................................................................................................................................................................. 68
TO-3........................................................................................................................................................................................................................................................ 69–73
TO-66............................................................................................................................................................................................................................................................. 74
TO-5........................................................................................................................................................................................................................................................ 75–76
Axial Lead Devices.................................................................................................................................................................................................................................... 77
Bridge Rectifiers........................................................................................................................................................................................................................................ 77
Options
Table of Contents.................................................................................................................................................................................................................................................... 78–79
How to Decipher an Aavid 12 Digit Part Number.............................................................................................................................................................................................. 80
How to Decipher a "Thermalloy" Origin Part Number...................................................................................................................................................................................... 81
Index A, B, C = Aavid Standard Parts w/Options.......................................................................................................................................................................................... 82–84
Index D = "Thermalloy" Origin Parts w/Options................................................................................................................................................................................................. 85
Interface Materials
In-Sil™, Kondux™, Grafoil® Pads.............................................................................................................................................................................................................................. 86
Hi-Flow®, Alignment Pads.......................................................................................................................................................................................................................................... 87
Double Sided Tape Options (Factory Applied).................................................................................................................................................................................................... 88
Labor Saving Heat Sink to Board and Semiconductor Mounts
Wave-On™ Mounts, Semiconductor Mounts, Shur-Lock™ Tabs, Solderable Tabs, Solderable Pins......................................................................................... 89–94
Solderable Nuts, Clinch Nuts, Solderable Studs, Device Mounting Studs.......................................................................................................................................... 94–96
Clips
Kool-Klips™....................................................................................................................................................................................................................................................................... 97
Thermal Clips....................................................................................................................................................................................................................................................................98
Accessories
Mounting Kits........................................................................................................................................................................................................................................................................................ 99
Insulating Shoulder Washers......................................................................................................................................................................................................................................................... 100
Insulators–Thermalfilm™ and Thermalfilm™ MT......................................................................................................................................................................................................... 101–102
Insulators–Mica and Thermasil™ III............................................................................................................................................................................................................................................. 103
Insulating Washers/Aluminum Oxide......................................................................................................................................................................................................................................... 104
Insulating Stanchion Pads.............................................................................................................................................................................................................................................................. 105
Insulating Covers................................................................................................................................................................................................................................................................................106
Mounting Pads.......................................................................................................................................................................................................................................................................... 107–109
Finishes.................................................................................................................................................................................................................................................................................................. 110
Card Ejectors & Guides.................................................................................................................................................................................................................................................................... 111
Thermal Greases and Epoxies..............................................................................................................................................................................................................................................112–115
AMERICA
EUROPE
www.aavidthermalloy.com
USA Tel: +1 (603) 224-9988 email: [email protected]
Italy Tel: +39 051 764011 email: [email protected]
United Kingdom Tel: +44 1793 401400 email: [email protected]
ASIA
Singapore Tel: +65 6362 8388 email: [email protected]
Taiwan Tel: +886(2) 2698-9888 email: [email protected]
TABLE OF CONTENTS
Table of Contents
1
How to Use This Catalog
Base part
number
Semiconductor
device
Icons indicate that
a mounting kit, grease
or epoxy can be used
with the heat sink
Style description
for heat sink
TO-220 Heat Sinks
Grease
&
Epoxy
page112
Channel style heat sink with folded back fins
Semiconductor devices
have been included in photos to
assist in determining mounting
position.
Thermal graphs show natural and forced
convection based on black anodize finish.
For information on how to use a thermal graph,
please refer to page 11.
Detailed description
illustrates the heat sink’s
differentiating features.
5
80
4
60
3
40
2
20
1
0
0
0
Channel style heat sink with
folded back fins for increased
cooling surface area. Available
with tin plated solderable tabs
for easy attachment to the
printed circuit card.
4
8
12
16
Heat Dissipated—Watts
Part Number
Finish
7022BG
Channel heat sink with folded back fins
Black anodize
7022PBG
Channel heat sink with folded back fins
Pre-black anodize*
With solderable tabs
Black anodize
2.90 (0.114)
7022PB-MTG
With solderable tabs
Pre-black anodize*
2.90 (0.114)
Base part no.
A
TC11-MT
G
A RoHS Compliant
Description
Insulated device mounting clip for T0-220 and solderable tabs
Location
Details
Hole X
Page
AMERICA
EUROPE
www.aavidthermalloy.com
14.48
(0.570)
2x 3.81
(0.150)
3.18
(0.125)
2.29
(0.090)
2.67
(0.105)
TAB
2.02
(0.080)
2x 2.03
(0.080)
24.16
(0.951)
Material: 1.27 (0.050) Thick Aluminum
Finish: See Table
Aavid has a large selection of popular
options to enhance your heat sink selection.
This section will indicate the most popular
options available.
Detailed indexes are available
to select additional options.
For additional options see page xx
2
4.83
(0.190)
Material and finish
information is shown
for each part
* Edges cut during the manufacturing process will be unfinished.
See page XX for more information
Code
49.99
(1.968)
21.03
(0.828)
Dia of PCB
Plated Thru
Hole for Tabs
7022B-MTG
Position
"X"
20
Ordering information will
specify the base heat sink with
available accessories.
Description
POPULAR OPTIONS: 7022B-
2x ø 3.81
(0.150)
4.44
(0.175)
ORDERING INFORMATION
23.01
(0.906)
50.44
(1.986)
1000
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
0
Mounting
Kits
page 99
Mechanical drawing
dimensions as shown
are mm (inches)
9.52
(0.375)
Air Velocity—Feet Per Minute
400
200
600
800
100
Mounting Surface Temp
Rise Above Ambient—°C
GENERAL INFORMATION
7022
USA Tel: +1 (603) 224-9988 email: [email protected]
Italy Tel: +39 051 764011 email: [email protected]
United Kingdom Tel: +44 1793 401400 email: [email protected]
ASIA
Singapore Tel: +65 6362 8388 email: [email protected]
Taiwan Tel: +886(2) 2698-9888 email: [email protected]
Part Number
Page
10-5597-02G
14
10-5597-22G
14
10-5597-33G
14
10-5607-04G
14
10-5607-05G
14
10-5634-01G
12
10-6326-27G
14
10-6326-28G
14
10-6327-01G
14
10-BRD1-01G
12
10-BRD1-03G
12
10-BRD1-04G
12
10-BRD1-05G
12
10-BRD1-07G
12
10-BRD2-01G
12
10-CLS1-01G
12
10-CLS2-01G
12
10-L4LB-03G
14
10-L4LB-05G
14
10-L4LB-11G
14
10-THMA-01G
12
10-TNT2-01G
14
2317B-EP11-BGS1G 18
2319B-TACHG
17
2321B-TACHG
17
2327B-CP50G
16
2327B-TACHG
16
2332B-TACHG
17
2338B-TACHG
17
2342B-TACHG
17
2518B-EP11-BGS2G 18
2519B-EP11-BGS5G 18
2520B-EP04-BGS5G 18
2522B-EP04-BGS5G 18
320105B00000G
76
320205B00000G
76
323005B00000G
76
325705B00000G
76
326005B00000G
76
335114B00032G
19
335211B00000G
19
335211B00032G
19
335214B00000G
19
335214B00032G
19
335214B00034G
19
335224B00032G
17
335224B00034G
16
335314B00000G
19
335314B00032G
19
335314B00035G
19
335324B00032G
16
335714B00000G
19
335714B00032G
19
335724B00032G
17
335814B00000G
19
335814B00032G
19
335824B00032G
17
335824B00034G
16
336314B00000G
19
336624B00032G
17
364424B00032G
17
364424B00034G
16
371824B00032G
17
371824B00034G
16
372024B00032G
17
372024B00034G
16
372924M02000G
14
373024B00032G
17
373024B00034G
16
373224M00032G
17
373324M00032G
17
374024B00032G
17
374024B00035G
16
374024B60023G
12
374124B00032G
17
374124B00035G
16
374124B60023G
12
374224B00032G
17
374224B00035G
16
374224B60023G
12
374324B00032G
17
374324B00035G
16
374324B60023G
12
Part Number
374424B00032G
374424B00035G
374424B60023G
374524B00032G
374524B00035G
374524B60023G
374624B00032G
374624B00035G
374624B60024G
374724B00032G
374724B00035G
374724B60024G
374824B00032G
374824B00035G
374824B60024G
374924B00032G
374924B00035G
374924B60024G
375024B00032G
375024B00035G
375024B60024G
375124B00032G
375124B00035G
375124B60024G
375224B00032G
375324B00035G
375424B00034G
500103B00000G
500203B00000G
500303B00000G
500403B00000G
501000B00000G
501000J00000G
501100B00000G
501200B00000G
501303B00000G
501403B00000G
501503B00000G
501603B00000G
501706B00000G
501806B00000G
501906B00000G
502006B00000G
504102B00000G
504222B00000G
505103B00000G
505303B00000G
505403B00000G
506003B00000G
506304B00000G
506902B00000G
507002B00000G
507102B00000G
507222B00000G
507302B00000G
507302J00000G
508500B00000G
508600B00000G
508700B00000G
513001B02500G
513002B02500G
513101B02500G
513102B02500G
513201B02500G
513202B02500G
513301B02500G
513302B02500G
519703B00000G
519803B00000G
519903B00000G
520103B00000G
520327B00000G
520328B00000G
520329B00000G
529701B02500G
529702B02500G
529801B02500G
529802B02500G
529901B02500G
529902B02500G
530001B02500G
530002B02500G
530101B00100G
Page
17
16
12
17
16
12
17
16
12
17
16
12
17
16
12
17
16
12
17
16
12
17
16
12
17
16
16
72
72
72
72
20
20
23
23
70
70
70
70
74
74
74
74
38
38
72
72
72
69
63
41
41
41
41
38
38
23
23
23
58
58
58
58
58
58
58
58
71
71
71
71
69
69
69
56
56
56
56
56
56
56
56
54
AMERICA
EUROPE
www.aavidthermalloy.com
Part Number
530101B00150G
530102B00100G
530102B00150G
530161B00162G
530162B00162G
530401B00100G
530401B00150G
530402B00100G
530402B00150G
530510B00000G
530510U00000G
530613B00000G
530614B00000G
530714B00000G
530801B05100G
530801B05150G
530802B05100G
530802B05150G
530861B05162G
530862B05162G
531002B02500G
531002V02500G
531102B02500G
531102V02500G
531202B02500G
531202V02500G
531302B02500G
531302V02500G
532602B02500G
532702B02500G
532802B02500G
533001B02551G
533002B02551G
533101B02551G
533102B02551G
533201B02551G
533202B02551G
533301B02551G
533302B02551G
533401B02552G
533402B02552G
533421B02552G
533422B02552G
533501B02552G
533502B02552G
533521B02552G
533522B02552G
533601B02552G
533602B02552G
533621B02552G
533622B02552G
533701B02552G
533702B02552G
533721B02552G
533722B02552G
533802B02554G
533902B02554G
534002B02554G
534202B02853G
534202B03453G
542502B00000G
542502D00000G
551002B00000G
560200B00000G
560200W00000G
563002B00000G
563002D00000G
566010B00000G
566010B03100G
566010B03400G
566902B00000G
566902B03100G
566902B04000G
569003B00000G
569022B00000G
573100D00000G
573100D00010G
573300D00000G
573300D00010G
573400D00000G
573400D00010G
574004B00000G
574004U00000G
Page
54
54
54
54
54
55
55
55
55
66
66
40
40
40
54
54
54
54
54
54
59
59
59
59
59
59
59
59
50
50
50
55
55
55
55
55
55
55
55
57
57
57
57
57
57
57
57
57
57
57
57
57
57
57
57
50
50
50
37
37
49
49
29
20
20
33
33
66
66
66
53
53
53
71
42
24
24
24
24
25
25
63
63
Part Number
574102B00000G
574102B03300G
574204B00000G
574204B03300G
574402B00000G
574402B03200G
574502B00000G
574502B03300G
574602B00000G
574602B03300G
574802B00000G
574802B03300G
574902B00000G
574902B03300G
575002B00000G
575002D00000G
575102B00000G
575200B00000G
575300B00000G
575400B00000G
575603B00000G
575703B00000G
575803B00000G
575903B00000G
576012B00000G
576014B00000G
576103B00000G
576203B00000G
576303B00000G
576403B00000G
576602B00000G
576602D00000G
576802B00000G
576802B03100G
576802B04000G
576802V00000G
576802V03100G
576802V04000G
576802U00000G
576802U03100G
576802U04000G
576904B00000G
577002B00000G
577002B04000G
577102B00000G
577102B04000G
577202B00000G
577202B04000G
577304B00000G
577404B00000G
577500B00000G
577500U00000G
577922B00000G
578105B00000G
578205B00000G
578305B00000G
578405B00000G
578505B00000G
578622B03200G
579003B00000G
579103B00000G
579103V00000G
579206B00000G
579206V00000G
579302B00000G
579402B00000G
579604B00000G
579604B03300G
579704B00000G
579704B03300G
579802B00000G
579802B03300G
579902B00000G
579902B03300G
580100B00000G
580100W00000G
580200B00000G
580200W00000G
580300B00000G
580400B00000G
580500B00000G
580600B00000G
581001B02500G
USA Tel: +1 (603) 224-9988 email: [email protected]
Italy Tel: +39 051 764011 email: [email protected]
United Kingdom Tel: +44 1793 401400 email: [email protected]
Page
45
45
63
63
45
45
45
45
45
45
43
43
45
45
33
33
46
68
68
68
70
70
70
70
40
40
73
73
73
73
33
33
52
52
52
52
52
52
52
52
52
64
34
34
34
34
34
34
64
64
65
65
40
75
75
75
75
75
40
71
69
69
74
74
46
46
63
63
63
63
43
43
43
43
20
20
20
20
21
22
22
21
61
ASIA
Part Number
581002B02500G
581101B02500G
581102B02500G
581201B02500G
581202B02500G
584000B00000G
584000B03500G
5900PBG
590102B03600G
590302B03600G
591202B00000G
591202B03100G
591202B04000G
591302B00000G
591302B02800G
591302B04000G
592201B03400G
592502B03400G
592502U03400G
592902B03400G
593002B03400G
593101B03600G
593202B03500G
5FG
6000DG
6000UG
6021BG
6021PBG
6022BG
6022PBG
6025DG
6032DG
6038BG
6043PBG
6046PBG
6047PBG
6049PBG
6094PBG
6109PBG
6110PBG
615653B00250G
6201PBG
6202PBG
6203PBG
6221PBG
6222BG
6223BG
6224BG
6225B-MTG
6230DG
6232B-MTG
6232PB-MTG
6236BG
6236PBG
6237BG
6237PBG
6238BG
6238B-MTG
6239B-MTG
6284BG
6374BG
6380BG
6381BG
6382BG
6396BG
6396B-P2G
6398BG
6398B-P2G
6399BG
6399B-P2G
6400BG
6400B-P2G
700353U01100G
7019BG
7019B-MTG
7019PBG
7020BG
7020B-MTG
7021BG
7021B-MTG
7022BG
7022B-MTG
7022PBG
Page
61
61
61
61
61
67
67
32
34
34
51
51
51
51
51
51
62
49
49
33
33
62
48
75
77
77
30
30
47
47
48
47
36
43
64
64
43
43
35
35
19
75
75
75
30
77
77
77
47
30
48
48
39
39
42
42
37
37
37
23
61
60
60
60
60
60
60
60
60
60
60
60
19
27
27
27
27
27
28
28
29
29
29
Part Number
7022PB-MTG
7023BG
7023B-MTG
7025BG
7025B-MTG
7038BG
709203B00400G
7106DG
7106D/TRG
7109DG
7109D/TRG
7128DG
7130DG
7136DG
7137DG
7139DG
7140DG
7141DG
7142DG
7148DG
7173DG
7178DG
799403B01500G
92FG
BW38-2G
BW38-4G
BW50-2G
BW50-4G
BW63-2G
BW63-4G
ML26AAG
PF432G
PF433G
PF434G
PF435G
PF436G
PF523G
PF526G
PF527G
PF720G
PF723G
PF730G
PF732G
PF750G
PF752G
PF758G
SW25-2G
SW25-4G
SW25-6G
SW38-2G
SW38-4G
SW38-6G
SW50-2G
SW50-4G
SW63-2G
SW63-4G
TV1500G
TV1505G
TV265G
TV35G
TV4G
TV40G
TV46G
TV47G
TV58G
TV96G
TV97G
YB32-4G
Singapore Tel: +65 6362 8388 email: [email protected]
Taiwan Tel: +886(2) 2698-9888 email: [email protected]
Page
29
28
28
27
27
67
19
24
24
25
25
36
62
35
42
35
42
38
36
67
39
35
19
68
58
58
58
58
58
58
50
52
52
52
52
52
73
73
73
44
44
65
65
44
44
44
56
56
59
56
56
59
56
56
56
56
32
32
32
31
65
39
31
31
31
53
53
61
INDEX
Index by Part Number
3
Index by Device Cooled and Thermal Resistance
Part Number
θn
Board
Mounting Page
AXIAL LEAD
6000UG
6000DG
15.0
15.0
V
V
77
77
BRIDGE RECTIFIERS
INDEX
6222BG
6223BG
6224BG
9.4
9.4
9.4
V
V
V
77
77
77
DIPS
501200B00000G
501100B00000G
501000J00000G
501000B00000G
580300B00000G
580400B00000G
508500B00000G
508600B00000G
580100B00000G
580100W00000G
508700B00000G
6284BG
560200B00000G
560200W00000G
580200B00000G
580200W00000G
580500B00000G
580600B00000G
Part Number
D2PAK TO-263
573300D00010G
16.0
573300D00000G
16.0
7109D/TRG
9.0
7109DG
9.0
2
D PAK TO-263 SO-10
7106D/TRG
14.0
7106DG
14.0
3
D PAK TO-268
573400D00010G
11.0
573400D00000G
11.0
68.0
67.0
60.0
60.0
39.0
39.0
34.0
32.0
30.0
30.0
27.2
25.0
20.0
20.0
20.0
20.0
20.0
20.0
Bi Directional Air Flow
Solder Anchor
Push Pin
Clip Attachment
Tape Attachment
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
23
23
20
20
21
22
23
23
20
20
23
23
20
20
20
20
22
21
H
H
H
H
H
19
12
14
18
16
V
V
V
V
V
V
V
V
V
V
V
V
V
61
60
60
60
60
61
60
60
60
60
60
60
60
MULTIWATT
8.4
6.8
5.8
5.6
5.6
5.0
4.4
4.4
4.2
3.3
3.3
2.7
2.7
SIPS
530510U00000G
530510B00000G
7038BG
7148DG
566010B00000G
566010B03400G
566010B03100G
584000B00000G
584000B03500G
6380BG
6381BG
6382BG
20.6
20.6
16.0
16.0
11.5
11.5
11.5
10.0
10.0
6.8
5.8
4.2
V
V
V
V
H-V
V
H
V
V
V
V
V
66
66
67
67
66
66
66
67
67
60
60
60
25.0
25.0
H
H
24
24
SMT
D-PAK TO-252
573100D00010G
573100D00000G
4
Board
Mounting Page
575603B00000G
575703B00000G
579103B00000G
579103V00000G
501303B00000G
519803B00000G
575803B00000G
PF523G
501403B00000G
505103B00000G
575903B00000G
PF526G
θn
Board
Mounting Page
24
24
25
25
H
H
24
24
H
H
25
25
H
H
H
H
H
H
H
H
H
H
H
H
70
70
69
69
70
71
70
73
70
72
70
73
579206B00000G
579206V00000G
501706B00000G
501806B00000G
501906B00000G
502006B00000G
22.0
22.0
12.0
9.6
8.0
8.0
H
H
H
H
H
H
74
74
74
74
74
74
60.0
50.0
40.0
36.1
V
V
V
V
68
68
68
68
35.8
35.8
26.0
26.0
21.6
H-V
H-V
V
V
H
65
65
65
65
65
TO-92
575200B00000G
575300B00000G
575400B00000G
92FG
TO-126
PF730G
PF732G
577500B00000G
577500U00000G
TV4G
KEY
H = Horizontal mount
V = Vertical mount
H–V = Either horizontal or vertical
depending on device leads
θn = Natural convection thermal resistance
based on a 75°C heat sink temperature rise
501503B00000G
501603B00000G
505303B00000G
PF527G
500103B00000G
576103B00000G
506003B00000G
500203B00000G
576203B00000G
579003B00000G
505403B00000G
576303B00000G
500303B00000G
569003B00000G
520103B00000G
576403B00000G
500403B00000G
519703B00000G
520329B00000G
520328B00000G
520327B00000G
519903B00000G
8.4
7.8
7.8
7.4
7.2
7.2
7.0
6.2
6.2
6.0
6.0
6.0
5.8
5.5
5.4
5.1
5.0
4.8
4.7
4.7
4.7
4.2
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
70
70
72
73
72
73
69
72
73
71
72
73
72
71
71
73
72
71
69
69
69
71
63.0
63.0
60.0
57.0
56.0
54.0
45.2
43.0
40.0
38.0
38.0
35.0
31.0
28.0
V
V
V
V
V
V
V
V
V
V
V
V
V
V
76
76
76
76
76
75
75
75
75
75
75
75
75
75
TO-5
320105B00000G
320205B00000G
325705B00000G
326005B00000G
323005B00000G
6201PBG
5FG
6202PBG
578105B00000G
578205B00000G
6203PBG
578305B00000G
578405B00000G
578505B00000G
AMERICA
EUROPE
www.aavidthermalloy.com
15.6
13.4
12.5
12.5
12.0
11.4
11.0
10.1
10.0
10.0
9.8
8.9
Part Number
TO-66
H
H
H
H
TO-3
IC PACKAGES, BGA, PGA, QFP, LCC
YB32-4G
6380BG
6381BG
6396BG
6396B-P2G
6374BG
6398BG
6398B-P2G
6382BG
6399BG
6399B-P2G
6400BG
6400B-P2G
θn
TO-202
576904B00000G
574004B00000G
574004U00000G
577304B00000G
6046PBG
6047PBG
579604B00000G
579604B03300G
579704B00000G
579704B03300G
577404B00000G
574204B00000G
574204B03300G
506304B00000G
531002B02500G
531002V02500G
SW25-6G
531102B02500G
531102V02500G
SW38-6G
531302B02500G
531302V02500G
531202V02500G
531202B02500G
USA Tel: +1 (603) 224-9988 email: [email protected]
Italy Tel: +39 051 764011 email: [email protected]
United Kingdom Tel: +44 1793 401400 email: [email protected]
533101B02551G
513101B02500G
SW38-2G
SW38-4G
533201B02551G
513201B02500G
SW50-2G
SW50-4G
593101B03600G
YB32-4G
513301B02500G
533301B02551G
530001B02500G
BW63-4G
BW38-2G
BW38-4G
SW63-2G
SW63-4G
6380BG
592201B03400G
530101B00100G
530101B00150G
530801B05100G
530801B05150G
530401B00100G
530401B00150G
6381BG
BW50-2G
BW50-4G
533701B02552G
533721B02552G
6396BG
6396B-P2G
529701B02500G
6374BG
533401B02552G
533421B02552G
529801B02500G
BW63-2G
529901B02500G
533501B02552G
533521B02552G
530161B00162G
530861B05162G
6398BG
6398B-P2G
6382BG
533601B02552G
533621B02552G
6399BG
6399B-P2G
6400BG
6400B-P2G
θn
Board
Mounting Page
11.0
11.0
10.2
10.2
9.0
9.0
8.8
8.8
8.6
8.4
8.0
8.0
8.0
7.4
7.2
7.2
7.0
7.0
6.8
6.8
6.3
6.3
6.3
6.3
6.3
6.3
5.8
5.8
5.8
5.7
5.7
5.6
5.6
5.5
5.0
5.0
5.0
5.0
4.7
4.5
4.5
4.5
4.4
4.4
4.4
4.4
4.2
3.8
3.8
3.3
3.3
2.7
2.7
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
55
58
56
56
55
58
56
56
62
61
58
55
56
58
58
58
56
56
60
62
54
54
54
54
55
55
60
58
58
57
57
60
60
56
61
57
57
56
58
56
57
57
54
54
60
60
60
57
57
60
60
60
60
40.5
35.8
35.8
35.7
34.1
32.6
32.6
32.6
32.6
32.6
32.6
32.0
32.0
29.9
28.9
28.9
28.3
27.3
27.3
27.3
27.1
27.1
26.8
26.8
H
V
V
V
V
V
V
H
H
V
V
H–V
V
H–V
V
V
H
V
H
V
H–V
H–V
H–V
H
43
65
65
35
43
52
52
52
52
52
52
34
34
31
44
44
35
52
52
52
31
31
51
51
32.0
28.0
28.0
27.2
25.0
25.0
24.0
24.0
24.0
24.0
24.0
16.8
16.8
14.4
13.4
13.4
13.0
10.4
10.4
10.0
8.0
8.0
7.5
7.5
H–V
V
V
H–V
V
V
V
V
V
V
H–V
V
V
H–V
V
V
V
V
V
V
V
V
V
V
64
63
63
64
64
64
63
63
63
63
64
63
63
63
59
59
59
59
59
59
59
59
59
59
24.0
23.1
20.0
19.6
16.8
12.8
13.4
13.0
11.4
11.4
H
V
H
V
V
V
V
V
V
V
53
62
53
61
61
61
58
55
56
56
ASIA
Singapore Tel: +65 6362 8388 email: [email protected]
Taiwan Tel: +886(2) 2698-9888 email: [email protected]
TO-218
TV96G
7130DG
TV97G
581001B02500G
581101B02500G
581201B02500G
513001B02500G
533001B02551G
SW25-2G
SW25-4G
Part Number
TO-220
6094PBG
PF730G
PF732G
7178DG
6049PBG
576802V00000G
576802U00000G
576802V03100G
576802U03100G
576802V04000G
576802U04000G
577002B00000G
577002B04000G
TV58G
PF720G
PF723G
7139DG
576802B00000G
576802B03100G
576802B04000G
TV46G
TV47G
591202B00000G
591202B03100G
Index by Device Cooled and Thermal Resistance
591202B04000G
591302B00000G
591302B02800G
591302B04000G
579802B00000G
579802B03300G
579902B00000G
579902B03300G
577102B00000G
577102B04000G
7173DG
6236BG
6236PBG
6237BG
6237PBG
577202B00000G
577202B04000G
507302B00000G
507302J00000G
542502B00000G
542502D00000G
TV96G
PF752G
576014B00000G
574402B00000G
574402B03200G
574102B00000G
574102B03300G
6043PBG
592502B03400G
592502U03400G
574602B00000G
574602B03300G
574502B00000G
574502B03300G
6110PBG
576012B00000G
7137DG
7140DG
574802B00000G
574802B03300G
PF750G
7142DG
7141DG
530714B00000G
PF432G
PF433G
PF434G
PF435G
PF436G
506902B00000G
TV97G
7136DG
7128DG
566902B00000G
566902B03100G
566902B04000G
6038BG
592902B03400G
6025DG
6025B-TTG
ML26AAG
581002B02500G
PF758G
TV1505G
6109PBG
575102B00000G
579302B00000G
579402B00000G
581102B02500G
530614B00000G
530613B00000G
6022PBG
6022BG
576602B00000G
576602D00000G
574902B00000G
574902B03300G
504102B00000G
507002B00000G
θn
26.8
26.8
26.8
26.8
26.4
26.4
26.4
26.4
25.9
25.9
25.8
25.0
25.0
25.0
25.0
24.4
24.4
24.0
24.0
24.0
24.0
24.0
23.7
23.2
23.2
23.2
23.2
23.2
23.0
22.0
22.0
21.6
21.6
21.2
21.2
21.0
20.8
20.8
20.8
20.4
20.4
20.3
20.3
20.3
20.3
20.3
20.3
20.3
20.3
20.3
20.0
20.0
19.7
19.2
18.8
18.8
18.8
18.0
17.9
17.9
17.9
17.9
17.4
17.3
17.0
17.0
16.8
16.8
16.8
16.8
16.7
16.7
16.7
16.7
16.6
16.6
16.0
16.0
15.6
15.6
Board
Mounting Page
V
H–V
V
H
V
V
V
V
H–V
V
V
V
V
H
H
H–V
V
H–V
H–V
H
H
H
V
H–V
H–V
H
H–V
V
V
V
V
H–V
V
H–V
V
H–V
H–V
V
H
H–V
V
V
H
V
H–V
V
V
H
V
H
V
H–V
V
V
H-V
H
V
V
V
V
V
H
V
V
V
H–V
H–V
V
V
V
H–V
H–V
V
V
V
V
H–V
V
H–V
H–V
51
51
51
51
43
43
43
43
34
34
39
39
39
42
42
34
34
38
38
49
49
53
44
40
45
45
45
45
43
49
49
45
45
45
45
35
40
42
42
43
43
44
36
38
40
52
52
52
52
52
41
53
35
36
53
53
53
36
33
48
48
50
61
44
32
35
46
46
46
61
40
40
47
47
33
33
45
45
38
41
Part Number
507102B00000G
6225B-MTG
TV1500G
575002B00000G
575002D00000G
6238BG
6238B-MTG
6239B-MTG
593002B03400G
534202B02853G
534202B03453G
513002B02500G
531002B02500G
531002V02500G
577922B00000G
578622B03200G
TV265G
5900PBG
563002B00000G
563002D00000G
533802B02554G
533002B02551G
SW25-6G
581202B02500G
6021BG
6021PBG
15.6
15.0
14.2
13.6
13.6
13.6
13.6
13.6
13.4
13.4
13.4
13.4
13.4
13.4
13.2
13.2
13.0
13.0
13.0
13.0
13.0
13.0
13.0
12.8
12.5
12.5
Board
Mounting Page
H–V
V
V
V
V
H–V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
41
47
32
33
33
37
37
37
33
37
37
58
59
59
40
40
32
32
33
33
50
55
59
61
30
30
Part Number
θn
TV35G
BW38-2G
BW38-4G
SW63-2G
SW63-4G
7025BG
7025B-MTG
7021BG
7021B-MTG
6380BG
7022BG
7022PBG
7022B-MTG
7022PB-MTG
504222B00000G
530102B00100G
530102B00150G
530802B05100G
530802B05150G
530402B00100G
530402B00150G
6381BG
BW50-2G
BW50-4G
533702B02552G
533722B02552G
7.2
7.2
7.2
7.0
7.0
6.8
6.8
6.8
6.8
6.8
6.5
6.5
6.5
6.5
6.4
6.3
6.3
6.3
6.3
6.3
6.3
5.8
5.8
5.8
5.7
5.7
Board
Mounting Page
H
V
V
V
V
V
V
V
V
V
V
V
V
V
H
V
V
V
V
V
V
V
V
V
V
V
31
58
58
56
56
27
27
28
28
60
29
29
29
29
38
54
54
54
54
55
55
60
58
58
57
57
V
V
H
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
60
60
42
50
56
61
57
57
50
58
58
56
57
28
28
54
54
60
60
50
60
57
57
60
56
60
60
60
57
56
H
H–V
V
V
53
53
58
55
NEED HIGHER PERFORMANCE?
Aavid Thermalloy also offers the
Max Clip SystemTM for discrete power
semiconductors featuring simple
assembly and high reliability.
www.aavidthermalloy.com/products/maxclip
6221PBG
6230DG
551002B00000G
SW25-2G
SW25-4G
590302B03600G
7019BG
7019PBG
7019B-MTG
533902B02554G
513102B02500G
533102B02551G
593202B03500G
531102B02500G
531102V02500G
SW38-2G
SW38-4G
590102B03600G
6232B-MTG
6232PB-MTG
SW38-6G
TV40G
507222B00000G
534002B02554G
533202B02551G
513202B02500G
SW50-2G
SW50-4G
7020BG
7020B-MTG
YB32-4G
6032DG
533302B02551G
513302B02500G
531302B02500G
531302V02500G
531202V02500G
531202B02500G
AMERICA
EUROPE
www.aavidthermalloy.com
θn
12.5
12.5
12.4
11.4
11.4
11.2
11.0
11.0
11.0
11.0
11.0
11.0
10.4
10.4
10.4
10.2
10.2
10.0
10.0
10.0
10.0
9.9
9.6
9.0
9.0
9.0
8.8
8.8
8.7
8.7
8.4
8.3
8.0
8.0
8.0
8.0
7.5
7.5
V
V
H
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
H
H
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
30
30
29
56
56
34
27
27
27
50
58
55
48
59
59
56
56
34
48
48
59
39
41
50
55
58
56
56
27
27
61
47
55
58
59
59
59
59
6396BG
6396B-P2G
569022B00000G
532602B02500G
529702B02500G
6374BG
533402B02552G
533422B02552G
532702B02500G
BW63-2G
BW63-4G
529902B02500G
533502B02552G
7023BG
7023B-MTG
530162B00162G
530862B05162G
6398BG
6398B-P2G
532802B02500G
6382BG
533602B02552G
533622B02552G
6399BG
529802B02500G
6399B-P2G
6400BG
6400B-P2G
533522B02552G
530002B02500G
5.6
5.6
5.5
5.5
5.5
5.0
5.0
5.0
4.8
4.7
4.7
4.5
4.5
4.4
4.4
4.4
4.4
4.4
4.4
4.2
4.2
3.8
5.0
5.0
3.7
3.3
2.7
2.7
2.7
2.6
TO-247
TV96G
TV97G
513001B02500G
533001B02551G
24.0
20.0
13.4
13.0
USA Tel: +1 (603) 224-9988 email: [email protected]
Italy Tel: +39 051 764011 email: [email protected]
United Kingdom Tel: +44 1793 401400 email: [email protected]
ASIA
Part Number
SW25-2G
SW25-4G
533101B02551G
513101B02500G
SW38-2G
SW38-4G
533201B02551G
513201B02500G
SW50-2G
SW50-4G
YB32-4G
533301B02551G
530001B02500G
513301B02500G
BW38-2G
BW38-4G
SW63-2G
SW63-4G
6380BG
530101B00100G
530101B00150G
530801B05100G
530801B05150G
530401B00100G
530401B00150G
6381BG
BW50-2G
BW50-4G
533701B02552G
533721B02552G
6396BBG
6396B-P2G
529701B02500G
6374BG
533401B02552G
533421B02552G
529801B02500G
BW63-2G
BW63-4G
529901B02500G
533501B02552G
533521B02552G
6398BG
6398B-P2G
530161B00162G
530861B05162G
6382BG
533601B02552G
533621B02552G
6399BG
6399B-P2G
6400BG
6400B-P2G
θn
Board
Mounting Page
11.4
11.4
11.0
11.0
10.2
10.2
9.0
9.0
8.8
8.8
8.4
8.0
2.6
8.0
7.2
7.2
7.0
7.0
6.8
6.3
6.3
6.3
6.3
6.3
6.3
5.8
5.8
5.8
5.7
5.7
5.6
5.6
5.5
5.0
5.0
5.0
5.0
4.7
4.7
4.5
4.5
4.5
4.4
4.4
4.4
4.4
4.2
3.8
3.8
3.3
3.3
2.7
2.7
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
56
56
55
58
56
56
55
58
56
56
61
55
56
58
58
58
56
56
60
54
54
54
54
55
55
60
58
58
57
57
60
60
56
61
57
57
56
58
58
56
57
57
60
60
54
54
60
57
57
60
60
60
60
27.3
32.6
32.6
27.3
32.6
32.6
27.3
32.6
32.6
26.8
26.8
26.8
26.8
26.8
26.8
20.3
20.3
20.3
20.3
20.3
18.8
18.8
18.8
H–V
H–V
H–V
H
H
H
V
V
V
H-V
H
V
H-V
V
H
V
V
H
V
H
H-V
H
V
52
52
52
52
52
52
52
52
52
51
51
51
51
51
51
52
52
52
52
52
53
53
53
INDEX
Part Number
TO-262
576802B00000G
576802V00000G
576802U00000G
576802B03100G
576802V03100G
576802U03100G
576802B04000G
576802V04000G
576802U04000G
591202B00000G
591202B03100G
591202B04000G
591302B00000G
591302B02800G
591302B04000G
PF432G
PF433G
PF434G
PF435G
PF436G
566902B00000G
566902B03100G
566902B04000G
Singapore Tel: +65 6362 8388 email: [email protected]
Taiwan Tel: +886(2) 2698-9888 email: [email protected]
5
Index by Device Cooled, Heat Sink Style, and Thermal Resistance
Part Number
θn
Board
Mounting Page
θn
Part Number
AXIAL LEAD
Board
Mounting Page
Part Number
SMT
15.0
V
77
D-Pak TO-252
6000DG
15.0
V
77
573100D00010G
573100D00000G
Extruded Collar Heat Sinks
15.0
15.0
H
H
24
24
18.0
18.0
H
H
24
24
7109D/TRG
11.0
H
7109DG
11.0
H
D2 Pak TO-263 SO10 (MO-184)
25
25
15.0
15.0
H
H
24
24
23
7106D/TRG
7106DG
D3 Pak TO-268
23
23
573400D00010G
573400D00000G
14.0
14.0
H
H
25
25
D Pak TO-263
2
INDEX
6222BG
6223BG
9.4
9.4
V
V
77
77
6224BG
9.4
V
77
573300D00010G
573300D00000G
DIPS
Extruded Heat Sinks
501200B00000G
68.0
H
501100B00000G
508700B00000G
67.0
27.2
H
H
6284BG
25.0
H
23
580500B00000G
20.0
580600B00000G
20.0
Slide On Heat Sinks
H
H
22
21
60.0
H
20
575603B00000G
15.6
H
70
501000B00000G
580300B00000G
60.0
39.0
H
H
20
21
575703B00000G
501303B00000G
13.4
12.0
H
H
70
70
580400B00000G
508500B00000G
39.0
34.0
H
H
22
23
508600B00000G
580100B00000G
580100W00000G
560200B00000G
560200W00000G
32.0
30.0
30.0
20.0
20.0
H
H
H
H
H
23
20
20
20
20
H =
Horizontal mount
V =
Vertical mount
580200B00000G
580200W00000G
20.0
20.0
H
H
20
20
H–V =
MULTI-WATT
Extruded Heat Sinks
YB32-4G
8.4
6380BG
6.8
6381BG
5.8
6396BG
5.6
6396B-P2G
5.6
6374BG
5.0
6398BG
4.4
V
V
V
V
V
V
V
61
60
60
60
60
61
60
6398B-P2G
6382BG
6399BG
6399B-P2G
6400BG
6400B-P2G
V
V
V
V
V
V
60
60
60
60
60
60
V
V
66
66
V
V
67
67
V
V
V
60
60
60
H–V
V
H
66
66
66
V
V
67
67
4.4
4.2
3.3
3.3
2.7
2.7
SIPS
Channel Style Heat Sinks
530510U00000G
20.6
530510B00000G
20.6
Clip On Style Heat Sinks
584000B00000G
10.0
584000B03500G
10.0
Extruded Heat Sinks
6380BG
6.8
6381BG
5.8
6382BG
4.2
Plug In Style Heat Sinks
566010B00000G
11.5
566010B03400G
11.5
566010B03100G
11.5
Slide On Style Heat Sinks
7038BG
16.0
7148DG
16.0
6
AMERICA
EUROPE
www.aavidthermalloy.com
V
V
76
76
325705B00000G
326005B00000G
60.0
57.0
V
V
76
76
323005B00000G
56.0
Low Cost Push On Heat Sink
V
76
5FG
V
75
Snap On Cooler Heat Sinks
578105B00000G
40.0
45.2
V
75
578205B00000G
578305B00000G
38.0
35.0
V
V
75
75
578405B00000G
578505B00000G
31.0
28.0
V
V
75
75
54.0
43.0
38.0
V
V
V
KEY
θn =
Either horizontal or vertical
depending on device leads
575803B00000G
PF523G
11.0
10.1
H
H
70
73
501403B00000G
575903B00000G
10.0
9.8
H
H
70
70
PF526G
8.9
H
501503B00000G
8.4
H
501603B00000G
7.8
H
PF527G
7.4
H
Hat Section Heat Sink
506003B00000G
7.0
H
Space Saving Collar Heat Sinks
579103B00000G
12.5
H
579103V00000G
12.5
H
Square Basket Heat Sinks
519803B00000G
11.4
H
505103B00000G
10.0
H
505303B00000G
7.8
H
500103B00000G
7.2
H
576103B00000G
7.2
H
500203B00000G
6.2
H
576203B00000G
6.2
H
73
70
70
73
69
71
72
72
72
73
72
73
71
72
73
72
71
71
73
72
71
71
H
H
H
69
69
69
USA Tel: +1 (603) 224-9988 email: [email protected]
74
579206V00000G
H
74
V
68
V
V
V
68
68
68
H
65
H-V
H-V
V
65
65
65
V
65
22.0
Clip On Style Heat Sink
92FG
36.1
Slip On Style Heat Sinks
575200B00000G
60.0
575300B00000G
50.0
575400B00000G
40.0
74
74
74
TO-126
Channel Style Heat Sink
TV4G
21.6
Slip On Style Heat Sinks
PF730G
35.8
PF732G
35.8
577500B00000G
26.0
577500U00000G
69
69
H
H
H
H
H
H
H
H
H
H
Italy Tel: +39 051 764011 email: [email protected]
United Kingdom Tel: +44 1793 401400 email: [email protected]
74
501806B00000G
9.6
H
501906B00000G
8.0
H
502006B00000G
8.0
H
Space Saving Collar Heat Sinks
579206B00000G
22.0
H
TO-92
Natural convection thermal resistance
based on a 75°C heat sink temperature rise
579003B00000G
6.0
505403B00000G
6.0
576303B00000G
6.0
500303B00000G
5.8
569003B00000G
5.5
520103B00000G
5.4
576403B00000G
5.1
500403B00000G
5.0
519703B00000G
4.8
519903B00000G
4.2
Two Piece Heat Sinks
520329B00000G
4.7
520328B00000G
4.7
520327B00000G
4.7
75
75
75
TO-66
Diamond Shaped Basket Heat Sinks
501706B00000G
12.0
H
IC PACKAGES, BGA, PGA, QFP, LCC
19
12
14
18
16
63.0
63.0
6201PBG
6202PBG
6203PBG
Diamond Shaped Basket Heat Sinks
H
H
H
H
H
320105B00000G
320205B00000G
Space Saving Collar Heat Sinks
TO-3
501000J00000G
Bi Directional Air Flow
Solder Anchor
Push Pin
Clip Attachment
Tape Attachment
Board
Mounting Page
TO-5
6000UG
BRIDGE RECTIFIERS
θn
ASIA
26.0
TO-202
Channel Style Heat Sinks
576904B00000G
32.0
H–V
577304B00000G
27.2
H–V
577404B00000G
24.0
H–V
Compact Slide On Heat Sinks
6046PBG
25.0
V
6047PBG
25.0
V
Extruded Heat Sinks
531002B02500G
13.4
V
531002V02500G
13.4
V
SW25-6G
13.0
V
531102B02500G
10.4
V
531102V02500G
10.4
V
SW38-6G
10.0
V
531302B02500G
8.0
V
531302V02500G
8.0
V
531202V02500G
7.5
V
531202B02500G
7.5
V
Low Cost Slide On Heat Sinks
574004B00000G
28.0
V
574004U00000G
28.0
V
Singapore Tel: +65 6362 8388 email: [email protected]
Taiwan Tel: +886(2) 2698-9888 email: [email protected]
64
64
64
64
64
59
59
59
59
59
59
59
59
59
59
63
63
Index by Device Cooled, Heat Sink Style, and Thermal Resistance
θn
Board
Mounting Page
Part Number
θn
Board
Mounting Page
Hat Section Heat Sinks
TO-202 CONTINUED
TV96G
TV97G
Low Cost Slide On Cooler Heat Sinks
24.0
20.0
Part Number
θn
Board
Mounting Page
534202B02853G
13.4
V
38
H
H–V
53
53
534202B03453G
577922B00000G
13.4
13.2
V
V
38
41
579604B00000G
579604B03300G
24.0
24.0
V
V
63
63
High Rise Style Heat Sinks
530101B00100G
6.3
V
54
578622B03200G
563002B00000G
13.2
13.0
V
V
41
34
579704B00000G
579704B03300G
24.0
24.0
V
V
63
63
530101B00150G
530801B05100G
6.3
6.3
V
V
54
54
563002D00000G
TV265G
13.0
13.0
V
V
34
32
574204B00000G
574204B03300G
16.8
16.8
V
V
63
63
530801B05150G
6.3
V
54
5900PBG
13.0
V
32
530401B00100G
530401B00150G
6.3
6.3
V
V
55
55
6021BG
6021PBG
12.5
12.5
V
V
30
30
506304B00000G
14.4
H–V
Space Saving Staggered Heat Sink
63
Plug In Style Heat Sink
592201B03400G
6.8
V
62
6221PBG
6230DG
12.5
12.5
V
V
30
30
6034DG
64
Slide On Heat Sink
7130DG
23.1
V
62
551002B00000G
590302B03600G
12.4
11.2
H
V
30
34
Low Profile Hat Section Heat Sink
8.3
V
TO-218
TO-220
Channel Style Heat Sink
593101B03600G
8.6
Dual Extruded Heat Sinks
533721B02552G
5.7
V
62
V
57
533421B02552G
533521B02552G
533621B02552G
V
V
V
57
57
57
Dual High Rise Style Heat Sinks
530161B00162G
4.4
V
54
5.0
4.5
3.8
530861B05162G
4.4
Extruded Heat Sinks
581001B02500G
19.6
581101B02500G
16.8
513001B02500G
13.4
V
54
V
V
V
61
61
58
533001B02551G
581201B02500G
13.0
12.8
V
V
55
61
SW25-2G
SW25-4G
533101B02551G
513101B02500G
SW38-2G
SW38-4G
533201B02551G
513201B02500G
SW50-2G
11.4
11.4
11.0
11.0
10.2
10.2
9.0
9.0
8.8
V
V
V
V
V
V
V
V
V
56
56
55
58
56
56
55
58
56
SW50-4G
YB32-4G
533301B02551G
530001B02500G
513301B02500G
BW63-4G
BW38-2G
BW38-4G
8.8
8.4
8.0
8.0
8.0
7.4
7.2
7.2
V
V
V
V
V
V
V
V
56
61
55
56
58
58
58
58
SW63-2G
SW63-4G
6380BG
BW50-2G
BW50-4G
6381BG
533701B02552G
6396BG
6396B-P2G
529701B02500G
533401B02552G
529801B02500G
BW63-2G
529901B02500G
533501B02552G
6398BG
6398B-P2G
6382BG
533601B02552G
6399BG
6399B-P2G
6400BG
6400B-P2G
6374BG
7.0
7.0
6.8
5.8
5.8
5.8
5.7
5.6
5.6
5.5
5.0
5.0
4.7
4.5
4.5
4.4
4.4
4.2
3.8
3.3
3.3
2.7
2.7
5.0
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
56
56
60
58
58
60
57
60
60
56
57
56
58
56
57
60
60
60
57
60
60
60
60
61
AMERICA
EUROPE
www.aavidthermalloy.com
Channel Style Heat Sinks
7019BG
11.0
V
27
7019PBG
7019B-MTG
590102B03600G
11.0
11.0
10.0
V
V
V
27
27
34
7178DG
35.7
V
35
TV40G
9.9
H
39
577002B04000G
577002B00000G
32.0
32.0
V
H-V
35
35
7020BG
7020B-MTG
8.7
8.7
V
V
27
27
TV58G
7139DG
29.9
28.3
H-V
H
31
35
TV35G
7025BG
7.2
6.8
H
V
31
27
7025B-MTG
7021BG
7021B-MTG
7022BG
7022PBG
6.8
6.8
6.8
6.5
6.5
V
V
V
V
V
27
28
28
29
29
7022B-MTG
7022PB-MTG
6.5
6.5
V
V
29
29
H
V
V
39
28
28
H
V
V
V
V
43
43
44
44
44
V
V
H–V
V
44
43
44
44
NEED HIGHER PERFORMANCE?
Aavid Thermalloy also offers the
Max Clip SystemTM for discrete power
semiconductors featuring simple
assembly and high reliability.
TV46G
27.1
H–V
31
504222B00000G
6.4
7023BG
4.4
7023B-MTG
4.4
Clip On Style Heat Sinks
6094PBG
40.5
6049PBG
34.1
579802B00000G
26.4
579802B03300G
26.4
579902B00000G
26.4
TV47G
577102B00000G
577102B04000G
7173DG
6236BG
6236PBG
577202B00000G
577202B04000G
27.1
25.9
25.9
25.8
25.0
25.0
24.4
24.4
H–V
H-V
V
V
V
V
H-V
V
31
35
35
39
39
39
35
35
579902B03300G
26.4
6043PBG
23.0
574802B00000G
20.4
574802B03300G
20.4
Dual Extruded Heat Sinks
6380BG
6.8
6381BG
5.8
533722B02552G
5.7
V
V
V
60
60
57
507302B00000G
507302J00000G
576014B00000G
6110PBG
576012B00000G
7142DG
7141DG
530714B00000G
7136DG
7128DG
6038BG
592902B03400G
6109PBG
TV1505G
530614B00000G
530613B00000G
576602B00000G
576602D00000G
504102B00000G
TV1500G
575002B00000G
575002D00000G
6238BG
6238B-MTG
6239B-MTG
593002B03400G
24.0
24.0
23.2
21.0
20.8
20.3
20.3
20.3
19.7
19.2
18.0
17.9
17.0
17.0
16.7
16.7
16.6
16.6
15.6
14.2
13.6
13.6
13.6
13.6
13.6
13.4
H-V
H-V
H-V
H-V
H-V
H
V
H-V
V
V
V
V
H-V
V
H-V
H-V
V
V
H–V
V
V
V
H–V
V
V
V
39
39
41
35
41
36
38
41
35
36
36
33
35
32
41
41
34
34
39
32
34
34
37
37
37
33
533422B02552G
5.0
V
6374BG
5.0
V
6382BG
4.2
V
533622B02552G
3.8
V
533522B02552G
2.7
V
Dual High Rise Style Heat Sinks
530162B00162G
4.4
V
530862B05162G
4.4
V
Extruded Heat Sinks
ML26AAG
17.9
H
581002B02500G
17.4
V
581102B02500G
16.8
V
513002B02500G
13.4
V
531002B02500G
13.4
V
531002V02500G
13.4
V
533802B02554G
13.0
V
533002B02551G
13.0
V
SW25-6G
13.0
V
581202B02500G
12.8
V
SW25-2G
11.4
V
SW25-4G
11.4
V
533902B02554G
11.0
V
533102B02551G
11.0
V
513102B02500G
11.0
V
531102B02500G
10.4
V
531102V02500G
10.4
V
57
61
60
57
57
www.aavidthermalloy.com/products/maxclip
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ASIA
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Taiwan Tel: +886(2) 2698-9888 email: [email protected]
INDEX
Part Number
54
54
50
61
61
58
59
59
50
55
59
61
56
56
50
55
58
59
59
7
Index by Device Cooled, Heat Sink Style, and Thermal Resistance
Part Number
θn
Board
Mounting Page
INDEX
TO-220 CONTINUED
SW38-2G
10.2
V
56
SW38-4G
SW38-6G
10.2
10.0
V
V
56
59
534002B02554G
533202B02551G
9.0
9.0
V
V
50
55
513202B02500G
SW50-2G
9.0
8.8
V
V
58
56
SW50-4G
YB32-4G
8.8
8.4
V
V
56
61
533302B02551G
8.0
V
55
530002B02500G
513302B02500G
2.6
8.0
V
V
56
58
531302B02500G
531302V02500G
8.0
8.0
V
V
59
59
531202V02500G
531202B02500G
7.5
7.5
V
V
59
59
BW38-2G
7.2
V
58
BW38-4G
SW63-2G
SW63-4G
7.2
7.0
7.0
V
V
V
58
56
56
BW50-2G
5.8
V
58
BW50-4G
533702B02552G
5.8
5.7
V
V
58
57
6396BG
6396B-P2G
532602B02500G
529702B02500G
533402B02552G
5.6
5.6
5.5
5.5
5.0
V
V
V
V
V
60
60
50
56
57
532702B02500G
BW63-2G
4.8
4.7
V
V
50
58
BW63-4G
529902B02500G
533502B02552G
6398BG
6398B-P2G
532802B02500G
533602B02552G
529802B02500G
6399BG
4.7
4.5
4.5
4.4
4.4
4.2
3.8
3.7
3.3
V
V
V
V
V
V
V
V
V
58
56
57
60
60
50
57
56
60
6399B-P2G
3.3
6400BG
2.7
6400B-P2G
2.7
Hat Section Heat Sinks
6237BG
25.0
6237PBG
25.0
TV96G
24.0
7137DG
20.8
V
V
V
60
60
60
H
H
H
V
42
42
53
42
H
V
H–V
H–V
H–V
H
42
42
53
42
42
42
V
V
54
54
V
V
V
V
54
54
55
55
V
V
V
H
H
H
V
V
V
H-V
H
V
H-V
V
52
52
52
52
52
52
52
52
52
51
51
51
51
51
7140DG
20.8
506902B00000G
20.0
TV97G
20.0
507002B00000G
15.6
507102B00000G
15.6
507222B00000G
9.6
High Rise Style Heat Sinks
530102B00100G
6.3
530102B00150G
6.3
530802B05100G
6.3
530802B05150G
6.3
530402B00100G
6.3
530402B00150G
6.3
Plug In Style Heat Sinks
576802B00000G
27.3
576802V00000G
32.6
576802U00000G
32.6
576802B03100G
27.3
576802V03100G
32.6
576802U03100G
32.6
576802B04000G
27.3
576802V04000G
32.6
576802U04000G
32.6
591202B00000G
26.8
591202B03100G
26.8
591202B04000G
26.8
591302B00000G
26.8
591302B02800G
26.8
8
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Board
Mounting Page
Part Number
θn
591302B04000G
26.8
H
PF432G
PF433G
20.3
20.3
V
V
PF434G
PF435G
20.3
20.3
PF436G
566902B00000G
566902B03100G
θn
51
533101B02551G
11.0
V
55
52
52
513101B02500G
SW38-2G
11.0
10.2
V
V
58
56
H
V
52
52
SW38-4G
533201B02551G
10.2
9.0
V
V
56
55
20.3
18.8
H
H-V
52
53
513201B02500G
SW50-2G
9.0
8.8
V
V
58
56
SW50-4G
YB32-4G
8.8
8.4
V
V
56
61
18.8
H
53
566902B04000G
18.8
Slide On Heat Sinks
V
53
533301B02551G
8.0
V
55
PF730G
PF732G
35.8
35.8
V
V
65
65
530001B02500G
513301B02500G
8.0
8.0
V
V
56
58
PF720G
PF723G
28.9
28.9
V
V
44
44
BW38-2G
BW38-4G
7.2
7.2
V
V
58
58
SW63-2G
SW63-4G
7.0
7.0
V
V
56
56
PF752G
23.7
V
44
574402B00000G
574402B03200G
574102B00000G
23.2
23.2
23.2
H-V
H
H–V
45
45
45
574102B03300G
23.2
V
45
574602B00000G
574602B03300G
21.6
21.6
H-V
V
45
45
574502B00000G
574502B03300G
21.2
21.2
H-V
V
45
45
PF750G
PF758G
574902B00000G
574902B03300G
20.3
17.3
16.0
16.0
V
V
H-V
V
44
44
45
45
KEY
H =
Horizontal mount
V =
Vertical mount
H–V =
θn =
Board
Mounting Page
Part Number
Either horizontal or vertical
depending on device leads
Natural convection thermal resistance
based on a 75°C heat sink temperature rise
Snap Down Style Heat Sinks
575102B00000G
16.8
579302B00000G
16.8
579402B00000G
16.8
Space Saving Heat Sinks
542502B00000G
24.0
542502D00000G
24.0
592502B03400G
22.0
592502U03400G
22.0
6025DG
17.9
6022PBG
16.7
6022BG
16.7
6225B-MTG
15.0
593202B03500G
10.4
6232B-MTG
10.0
6232PB-MTG
10.0
6032DG
8.3
Square Basket Heat Sink
569022B00000G
5.5
H–V
V
V
46
46
46
H
H
49
49
V
V
V
V
V
V
V
V
V
V
49
49
48
47
47
47
48
48
48
47
H
42
TO-247
Dual Extruded Heat Sinks
533721B02552G
5.7
V
533421B02552G
5.0
V
533521B02552G
4.5
V
533621B02552G
3.8
V
Dual High Rise Style Heat Sinks
530161B00162G
4.4
V
530861B05162G
4.4
V
Extruded Heat Sinks
513001B02500G
13.4
V
533001B02551G
13.0
V
SW25-2G
11.4
V
SW25-4G
11.4
V
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57
57
57
57
54
54
58
55
56
56
ASIA
6380BG
6.8
V
60
BW50-2G
BW50-4G
6381BG
5.8
5.8
5.8
V
V
V
58
58
60
533701B02552G
5.7
V
57
6396BG
6396B-P2G
5.6
5.6
V
V
60
60
529701B02500G
533401B02552G
6374BG
529801B02500G
BW63-2G
5.5
5.0
5.0
5.0
4.7
V
V
V
V
V
56
57
61
56
58
BW63-4G
529901B02500G
4.7
4.5
V
V
58
56
533501B02552G
6398BG
6398B-P2G
6382BG
533601B02552G
6399BG
6399B-P2G
6400BG
6400B-P2G
4.5
4.4
4.4
4.2
3.8
3.3
3.3
2.7
2.7
V
V
V
V
V
V
V
V
V
57
60
60
60
57
60
60
60
60
H
H–V
53
53
V
V
V
V
54
54
54
54
V
V
55
55
Plug In Style Heat Sinks
576802B00000G
27.3
576802V00000G
32.6
576802U00000G
32.6
H–V
H–V
H–V
52
52
52
576802B03100G
576802V03100G
576802U03100G
576802B04000G
576802V04000G
576802U04000G
591202B00000G
591202B03100G
591202B04000G
591302B00000G
591302B02800G
591302B04000G
566902B00000G
566902B03100G
566902B04000G
PF432G
PF433G
PF434G
PF435G
PF436G
H
H
H
V
V
V
H-V
H
V
H-V
V
H
H-V
H
V
V
V
H
V
H
52
52
52
52
52
52
51
51
51
51
51
51
53
53
53
52
52
52
52
52
Hat Section Heat Sinks
TV96G
24.0
TV97G
20.0
High Rise Style Heat Sinks
530101B00100G
6.3
530101B00150G
6.3
530801B05100G
6.3
530801B05150G
6.3
530401B00100G
530401B00150G
6.3
6.3
TO-262
27.3
32.6
32.6
27.3
32.6
32.6
26.8
26.8
26.8
26.8
26.8
26.8
18.8
18.8
18.8
20.3
20.3
20.3
20.3
20.3
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How To Select a Heat Sink
How to select a heat sink
The basic equation for heat transfer or power dissipation may be stated as follows:
HOW TO SELECT A HEAT SINK
ΔT
PD =
ΣRθ
Where:
PD = the power dissipated by the semiconductor device in watts.
ΔT = the temperature difference of driving potential which causes the flow of heat.
ΣRθ = the sum of the thermal resistances of the heat flow path across which ΔT exists.
The above relationship may be stated in the following forms:
TC–TA
TS–TA
TJ–TA
PD =
PD =
PD =
RθCS + RθSA
RθSA
RθJC + RθCS + RθSA
Where:
TJ = the junction temperature in °C (maximum is usually stated by the manufacturer of the semiconductor device).
TC = case temperature of the semiconductor device in °C.
TS = temperature of the heat sink mounting surface in thermal contact with the semiconductor device in °C.
TA = ambient air temperature in °C.
RθJC = thermal resistance from junction to case of the semiconductor device in °C per watt
(usually stated by manufacturer of semiconductor device).
RθCS = thermal resistance through the interface between the semiconductor device
and the surface on which it is mounted in °C per watt.
RθSA = thermal resistance from mounting surface to ambient or thermal resistance of heat sink in °C per watt.
The above equations are generally used to determine the required thermal resistance of the heat sink (RθSA),
since the heat dissipation, maximum junction and/or case temperature, and ambient temperature are known or set.
The common practice is to represent the system with
a network of resistances in series as shown in Figure 2.
Figure 1 indicates the location of the various heat
flow paths, temperatures and thermal resistances.
FIGURE 2
FIGURE 1
Mounting surface
(cooler/dissipator)
Atmosphere
or ambient
Interface
T
Junction
(heat source)
A
TC
TJ
P
P
D
TS
TA
D
Semiconductor case
RθJC
R
R
θCS
RθCS
RθSA
θSA
Heat flow path mounting
surface to ambient, equation (3)
R
T
θJC
T
T
C
S
Heat flow path case
to ambient equation (2)
Heat flow path junction
to ambient, equation (1)
T
J
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A
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ASIA
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9
Example A
Example B
Find a space saving heat sink to keep a TO-220 device below the
maximum 150°C junction temperature in natural convection. Device
will be screw mounted with an electrically conductive interface.
Find a heat sink to keep a TO-220 device below the maximum
150 °C junction temperature in forced convection at 400 ft/min.
Device must be electrically insulated and mounted with a labor
saving clip.
Given:
PD = 6 watts
RθJC = 3°C/W (from semiconductor manufacturer)
TJ max = 150°C (from semiconductor manufacturer)
TA max = 65°C
A KonduxTM pad is a good choice for electrically conductive
applications. Thermal resistance for KonduxTM can be determined
from the following graph.
Typical TO-220 Performance
0.60
R
Given:
PD = 12 watts
RθJC = 2.5°C/W (from semiconductor manufacturer)
TJ max = 140°C (from semiconductor manufacturer)
TA max = 50°C
A Hi-Flow® pad works great with clip mounting and provides the
necessary electrical insulation. Thermal resistance for
Hi-Flow® at low pressure is 1.15°C/W (from page 87).
Using equation 1, solve for RθSA
RθSA = 140 – 50 - (2.5 + 1.15) = 3.85°C/W
12
0.40
0.30
0.20
0.10
0.00
0
1
2
3
4
Screw Torque (in-lb)
5
6
Many styles are available. If board space is a concern,
533202B02551G (pg 55) meets the requirements.
0
At 2 in-lb of torque the thermal resistance
is approximately RθCS = 0.5°C/W
Mounting Surface Temp
Rise Above Ambient—°C
RθSA = 150 – 65 - ( 3 + 0.5) = 10.7°C/W
6
8
60
6
40
4
20
2
0
0
0
The Index by Heat Sink Style on page 8 lists space saving heat sinks.
Several models are in the 10 °C/W range. Choose the one that best
fits the application and verify thermal resistance from graph.
200
Air Velocity—Feet Per Minute
400
600
800
Mounting Surface Temp
Rise Above Ambient—°C
1000
10
80
8
60
6
40
4
20
2
0
0
0
2
4
6
Heat Dissipated—Watts
8
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
Part number 593202B03500G shows
a 60 °C temperature rise at 6 watts.
1000
10
80
53320X
53330X
0
Air Velocity—Feet Per Minute
400
600
800
100
Using equation 1, solve for RθSA
100
200
2
4
6
Heat Dissipated—Watts
8
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
(ºC/W)
0.50
CS
HOW TO SELECT A HEAT SINK
How To Select a Heat Sink
10
According to the above graph, an airflow of 400 ft/min results
in a thermal resistance of 3°C/W. This is less than the required
thermal resistance of 3.85°C/W and is therefore acceptable
under these airflow conditions.
If height is a concern, 533702B02552G would meet the
requirements and is only 1.0” tall
Hi-Flow® is a trademark of the Bergquist Company
10
RθSA = 60 = 10.0°C/W
6
Which meets the above requirement in natural convection.
10
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200
Air Velocity—Feet Per Minute
400
600
800
1000
20
80
16
60
12
40
8
20
4
0
0
0
1
2
3
4
Heat Dissipated—Watts
EXAMPLE: The output air volume
of a fan is given as 80 CFM. The output area
is 6 inches by 6 inches or 36 in2 or 25 ft2.
To find velocity:
1000
20
80
16
60
12
40
8
20
4
0
0
1
2
3
Heat Dissipated—Watts
4
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
Air Velocity—Feet Per Minute
400
600
800
100
200
5
GRAPH A is used to show heat sink performance when used in a natural convection environment (i.e. without forced air). This graph
starts in the lower left hand corner with the
horizontal axis representing the heat dissipation (watts) and the vertical left hand axis
representing the rise in heat sink mounting
surface temperature above ambient (°C). By
knowing the power to be dissipated, the
temperature rise of the mounting surface
can be predicted. Thermal resistance in natural convection is determined by dividing this
temperature rise by the power input (°C/W).
EXAMPLE A: Aavid Thermalloy part number
579802 is to be used to dissipate 3 watts of
power in natural convection. Because we are
dealing with natural convection, we refer to
graph “A”. Knowing that 3 watts are to be dissipated, follow the grid line to the curve and
find that at 3 watts there is a temperature
rise of 75°C. To get the thermal resistance,
divide the temperature rise by the power
dissipated, which yields 25°C/W.
Although most fans are normally rated and
compared at their free air delivery at zero
back pressure, this is rarely the case in most
applications. For accuracy, the volume of
output must be derated 60%–80% for
the anticipation of back pressure.
5
GRAPH B
0
0
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
0
100
GRAPH A
Mounting Surface Temp
Rise Above Ambient—°C
CONVERTING VOLUME
TO VELOCITY
579802
Mounting Surface Temp
Rise Above Ambient—°C
The performance graphs you will see in this
catalog (see graph 579802) are actually a
composite of two separate graphs which
have been combined to save space. The small
arrows on each curve indicate to which axis
the curve corresponds. Thermal graphs are
published assuming the device to be cooled
is properly mounted and the heat sink is in
its recommended mounting position.
GRAPH B is used to show heat sink performance when used in a forced convection environment (i.e. with forced air flow
through the heat sink). This graph has its
origin in the top right hand corner with
the horizontal axis representing air velocity
over the heat sink LFM* and the vertical
axis representing the thermal resistance of
the heat sink (°C/W). Air velocity is calculated by dividing the output volumetric flow
rate of the fan by the cross-sectional area
of the outflow air passage.
Velocity (LFM) =
Volume (CFM)
area (ft2)
Velocity = 80 = 320
0.25
Velocity is 320 LFM, which at 80%,
derates to 256 LFM.
READING A THERMAL PERFORMANCE GRAPH
Reading a Thermal Performance Graph
DESIGN ASSISTANCE
Aavid Thermalloy can assist in the design
of heat sinks for both forced and natural
convection applications. Contact us for help
with your next thermal challenge. For more
information, visit our web site at:
www.aavidthermalloy.com
Velocity (LFM)* = Volume (CFM)**
area (ft2)
EXAMPLE B: For the same application
we add a fan which blows air over the heat
sink at a velocity of 400 LFM.
The addition of a fan indicates the use of
forced convection and therefore we refer
to graph “B”. This resistance of 9.50°C/W is
then multiplied by the power to be dissipated, 3 watts. This yields a temperature
rise of 28.5°C.
* Linear feet per minute
** Cubic feet per minute
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11
BGA–Solder Anchor
HEAT SINKS FOR IC PACKAGES
Solder anchor attachment
Aavid's unique Solder anchor attachment method
uses two or four small Solder anchors attached to
the circuit card and a wire spring clip to securely
fasten the heat sink to the device. This method is
rugged, compact and allows for easy removal in
case of rework.
All products include a phase change pad suitable
for most IC package styles to optimize thermal
performance. Models are available with a single
or dual spring clips for additional thermal interface
pressure. Solder anchors are ordered separately.
ORDERING INFORMATION
IC Pkg Style
Part Number
“W” (mm)
θn1
θf 2
Finish
Fig. 4
PCB Fig. 4
#Anchors 3
23 x 23
All
374024B60023G
23.00
23.00
10.00
49.70
40.00
11.69
Black anodize
1
A
2
23 x 23
All
374124B60023G
23.00
23.00
18.00
49.70
23.40
7.39
Black anodize
1
A
2
23 x 23
All
374224B60023G
23.00
23.00
25.00
49.70
19.70
6.37
Black anodize
1
A
2
27 x 27
All
374324B60023G
27.00
27.00
10.00
49.70
30.60
9.35
Black anodize
1
A
2
27 x 27
All
374424B60023G
27.00
27.00
18.00
49.70
20.30
6.46
Black anodize
1
A
2
27 x 27
All
374524B60023G
27.00
27.00
25.00
49.70
16.50
5.47
Black anodize
1
A
2
35 x 35
Flip chip
10-5634-01G
31.00
34.90
23.00
11.50
4.20
Black anodize
2
C
2
35 x 35
Flip chip
10-THMA-01G
31.00
34.90
35.00
10.70
3.95
Black anodize
2
C
2
35 x 35
All
374624B60024G
35.00
35.00
10.00
62.30
23.40
7.55
Black anodize
1
B
2
35 x 35
All
374724B60024G
35.00
35.00
18.00
62.30
15.30
5.15
Black anodize
1
B
2
35 x 35
All
374824B60024G
35.00
35.00
25.00
62.30
12.00
4.27
Black anodize
1
B
2
37.5 x 37.5
Flip chip
10-BRD2-01G
35.70
37.30
23.00
11.50
4.20
Clear anodize
2
B
2
37.5 x 37.5
Flip chip
10-BRD1-01G
37.50
37.50
23.00
10.10
3.83
Black anodize
2
B
2
37.5 x 37.5
Flip chip
10-BRD1-03G
37.50
37.50
23.00
10.10
3.83
Black anodize
3
D
4
37.5 x 37.5
Flip chip
10-BRD1-04G
37.50
37.50
23.00
10.10
3.83
Black anodize
2
B
2
37.5 x 37.5
Flip chip
10-BRD1-05G
37.50
37.50
23.00
10.10
3.83
Clear anodize
3
D
4
37.5 x 37.5
Flip chip
10-BRD1-07G
37.50
37.50
23.00
10.10
3.83
Clear anodize
2
B
2
40 x 40
All
374924B60024G
40.00
40.00
10.00
62.30
20.30
6.46
Black anodize
1
B
2
40 x 40
All
375024B60024G
40.00
40.00
18.00
62.30
12.20
4.34
Black anodize
1
B
2
42 x 40
All
375124B60024G
40.00
40.00
25.00
62.30
10.30
3.83
Black anodize
1
B
2
42.5 x 42.5
Flip chip
10-CLS1-01G
42.30
42.30
23.00
8.80
3.51
Black anodize
2
E
2
42.5 x 42.5
Flip chip
10-CLS2-01G
42.30
42.30
35.00
8.30
3.44
Black anodize
2
E
2
IC Pkg Size (mm)
“L” (mm) “H” (mm) “A” (mm)
SOLDER ANCHOR
Part Number
PCB Thickness (mm)
“A” Dim (mm)
125700D00000G
1.60
3.61
125800D00000G
2.54-2.79
4.70
2.49
(0.098)
7.19
(0.283)
"A"
0.64
(0.025)
5.08
(0.200)
7.62
(0.300)
1. Natural convection thermal resistance based on a 75º C heat sink temperature rise.
2. Force convection thermal resistance based on an entering 1.0 m/s (200LFM) airflow.
3. Solder anchors are sold separately refer to drawing above.
4. Solder anchor mechanical drawings and board mounting drawings see page 13.
12
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ASIA
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Taiwan Tel: +886(2) 2698-9888 email: [email protected]
BGA–Solder Anchor
Solder anchor heat sinks mechanical drawings
FIGURE 1
FIGURE 2
12.70
(0.500)
"W"
"L"
54.74
(2.155) "W"
12.70
(0.500)
"A"
"L"
"H"
FIGURE 3
HEAT SINKS FOR IC PACKAGES
"H"
15.00
(0.591)
45.88 "W"
(1.806)
15.00
(0.591)
"H"
"L"
Board mounting pattern information for solder anchor heat sinks
FIGURE A
FIGURE B
48.26
(1.900)
35.56
(1.400)
ø 0.97 ± 0.03
(0.038 ± 0.001)
PLATED THROUGH
HOLES 4 X
Ø 0.97 0.03
(0.038 0.001)
PLATED THROUGH
HOLES 4X
26.67
(1.050)
53.34
(2.100)
66.04
(2.600)
33.02
(1.300)
17.78
(0.700)
24.13
(0.950)
5.08
(0.200) 2X
FIGURE D
FIGURE C
FIGURE E
Ø0.97 ± 0.03
(0.038 ± 0.001)
PLATED THROUGH
HOLES 2X
45.72
(1.800)
Ø 0.97 0.03
0.001)
(0.038
PLATED THROUGH
HOLES 4X
48.26
(1.900) 2X
29.21
(1.150)
5.08
(0.200)2X
AMERICA
EUROPE
www.aavidthermalloy.com
55.88
(2.200)
Ø 0.97 0.03
(0.038 0.001)
PLATED THROUGH
HOLES 4X
24.13
(0.950)
58.42
(2.300)
22.86
(0.900)
5.08
(0.200) 2x
66.04
(2.600)
33.02
(1.300)
5.08
(0.200) 4X
33.02
(1.300)
27.94
(1.100)
66.04
(2.600) 2X
USA Tel: +1 (603) 224-9988 email: [email protected]
Italy Tel: +39 051 764011 email: [email protected]
United Kingdom Tel: +44 1793 401400 email: [email protected]
ASIA
5.08
(0.200) 2X
Singapore Tel: +65 6362 8388 email: [email protected]
Taiwan Tel: +886(2) 2698-9888 email: [email protected]
13
BGA–Push Pin Attachment
HEAT SINKS FOR IC PACKAGES
Push pin attachment
Push pin heat sinks require two 3.10mm holes in the circuit card
to quickly attach the heat sink over the device. The one piece
design makes assembly a snap. Pressure is maintained by the
tension of the push pin coil springs to ensure even pressure
across the device. Push pins provide a greater margin of reliability in applications where gravity or vibration may cause tapes or
adhesives to fail. The addition of a phase change pad optimizes
thermal performance.
ORDERING INFORMATION
IC Pkg. Size (mm)
Part Number
“W” (mm)
“L” (mm)
“H” (mm)
“S” (mm)
“T” (mm)
θn2
θf 3
Finish
Fig.
PCB Fig. 1
Pin Style
28 x 28
10-6326-27G
28.00
28.00
6.00
46.60
6.50
44.10
13.13
Black anodize
1
A
Plastic
Yes
28 x 28
10-6326-28G
28.00
28.00
6.00
46.60
6.50
44.10
13.13
Black anodize
1
A
Brass
Yes
28 x 28
10-6327-01G
28.50
28.50
10.00
46.60
7.00
30.60
9.26
Black anodize
2
A
Plastic
No
35 x 35
10-TNT2-01G
36.10
48.00
11.60
6.50
18.80
6.13
Black anodize
3
D
Plastic
No
37.5 x 37.5
10-5597-02G
37.40
37.40
6.00
59.00
6.50
33.30
9.91
Green anodize
5
B
Plastic
No
37.5 x 37.5
10-5597-22G
37.40
37.40
6.00
59.00
6.50
33.30
9.91
Gold anodize
5
B
Plastic
Yes
37.5 x 37.5
10-5597-33G
37.40
37.40
6.00
59.00
6.50
33.30
9.91
Gold anodize
5
B
Brass
Yes
37.5 x 37.5
10-5607-04G
37.40
37.40
10.00
59.00
7.00
22.10
6.99
Black anodize
5
B
Plastic
Yes
37.5 x 37.5
10-5607-05G
37.40
37.40
10.00
59.00
7.00
22.10
6.99
Black anodize
5
B
Brass
Yes
37.5 x 37.5
372924M02000G
37.40
37.40
6.00
59.00
6.50
32.60
9.91
Green anodize
5
B
Plastic
No
45 x 45
10-L4LB-03G
45.20
41.40
11.89
58.80
8.00
16.70
5.60
Black anodize
4
C
Plastic
Yes
45 x 45
10-L4LB-05G
45.20
41.40
11.89
58.80
8.00
16.70
5.60
Black anodize
4
C
Brass
Yes
45 x 45
10-L4LB-11G
45.20
41.40
11.70
58.80
8.00
14.20
4.91
Black anodize
4
C
Plastic
No
1. Push pin mechanical drawings and board mounting drawings see page 15
2. Natural convection thermal resistance based on a 75° C heat sink temperature rise.
3. Forced convection thermal resistance based on an entering 1.0 m/s (200LFM) airflow.
14
Pad
AMERICA
EUROPE
www.aavidthermalloy.com
USA Tel: +1 (603) 224-9988 email: [email protected]
Italy Tel: +39 051 764011 email: [email protected]
United Kingdom Tel: +44 1793 401400 email: [email protected]
ASIA
Singapore Tel: +65 6362 8388 email: [email protected]
Taiwan Tel: +886(2) 2698-9888 email: [email protected]
BGA–Push Pin Attachment
Mechanical drawings
FIGURE 2
FIGURE 3
"T"
"T"
46.60
(1.835)
"H"
41.70
(1.642)
"H"
"S"
41.50
(1.634)
"L"
"L"
"L"
"W"
"W"
"T"
"H"
"W"
FIGURE 5
FIGURE 4
"T"
"S"
"H"
HEAT SINKS FOR IC PACKAGES
FIGURE 1
"S"
"L"
20.02
"L" (0.788)
"T"
"W"
10.69
(0.421)
"H"
"W"
Board mounting pattern information
FIGURE A
FIGURE B
ø 3.10 ± 0.030
(0.122 ± 0.001)
THROUGH HOLES
(UNPLATED) 2X
46.60
(1.830) REF
32.95
(1.297)
59.00
(2.320)REF
Ø 3.10 0.03
(0.122 0.001)
THROUGH HOLES
16.48 (UNPLATED) 2X
(0.649)
16.48
(0.649)
41.74
(1.643)
20.87
(0.822)
32.95
(1.297)
20.87
(0.822)
41.74
(1.643)
FIGURE D
FIGURE C
Ø 3.10 ± 0.03
( Ø 0.122 ± 0.001)
THROUGH HOLES
(UNPLATED) 2X
20.02
(0.788)
Ø 3.10 ± 0.03
(Ø 0.122 ± 0.001)
THROUGH HOLES
(UNPLA TED) 2X
41.50
(1.634)
10.01
(0.394)
41.70
(1.642)
50.80
(2.000)
AMERICA
EUROPE
www.aavidthermalloy.com
20.85
(0.821)
20.75
(0.817)
25.40
(1.000)
USA Tel: +1 (603) 224-9988 email: [email protected]
Italy Tel: +39 051 764011 email: [email protected]
United Kingdom Tel: +44 1793 401400 email: [email protected]
ASIA
Singapore Tel: +65 6362 8388 email: [email protected]
Taiwan Tel: +886(2) 2698-9888 email: [email protected]
15
BGA–Tape Attachment
HEAT SINKS FOR IC PACKAGES
Heat sinks for plastic BGA packages
"H"
"L"
"W"
Pressure sensitive, thermally conductive adhesive tape
easily and reliably bonds a heat sink to an integrated
circuit package. Tapes provide high thermal conductivity and exceptional bonding properties. Adhesives are
formulated for plastic and metal/ceramic packages.
Material: Aluminum
ORDERING INFORMATION
Part Number
“W” (mm)
“L” (mm)
“H” (mm)
θn2
θf 3
Finish
Tape code1
10 x 10
Plastic
375324B00035G
10.20
10.20
10.20
71.40
21.20
Black anodize
35
15 x 15
Plastic
375424B00034G
15.20
15.20
6.40
62.50
17.60
Black anodize
34
23 x 23
Plastic
374024B00035G
23.00
23.00
10.00
40.00
11.69
Black anodize
35
23 x 23
Plastic
374124B00035G
23.00
23.00
18.00
23.40
7.39
Black anodize
35
23 x 23
Plastic
374224B00035G
23.00
23.00
25.00
19.70
6.370
Black anodize
35
25 x 25
Plastic
335224B00034G
25.00
25.00
9.90
34.00
10.39
Black anodize
34
27 x 27
Plastic
374324B00035G
27.00
27.00
10.00
30.60
9.35
Black anodize
35
27 x 27
Plastic
374424B00035G
27.00
27.00
18.00
20.30
6.46
Black anodize
35
27 x 27
Plastic
374524B00035G
27.00
27.00
25.00
16.50
5.47
Black anodize
35
28 x 28
Plastic
373024B00034G
27.90
27.90
8.90
33.30
10.00
Black anodize
34
28 x 28
Plastic
2327B-CP50G
27.90
28.10
15.20
23.40
7.43
Black anodize
34
31 x 31
Plastic
335824B00034G
30.00
30.00
9.40
29.40
9.11
Black anodize
34
35 x 35
Plastic
371824B00034G
35.00
35.00
7.00
31.90
9.67
Black anodize
34
35 x 35
Plastic
374624B00035G
35.00
35.00
10.00
23.40
7.55
Black anodize
35
35 x 35
Plastic
374724B00035G
35.00
35.00
18.00
15.30
5.15
Black anodize
35
35 x 35
Plastic
374824B00035G
35.00
35.00
25.00
12.00
4.27
Black anodize
35
35 x 35
Plastic
372024B00034G
35.00
35.00
27.90
11.90
4.28
Black anodize
34
40 x 40
Plastic
374924B00035G
40.00
40.00
10.00
20.30
6.46
Black anodize
35
40 x 40
Plastic
364424B00034G
40.10
40.00
11.40
18.40
6.02
Black anodize
34
40 x 40
Plastic
375024B00035G
40.00
40.00
18.00
12.20
4.34
Black anodize
35
40 x 40
Plastic
375124B00035G
40.00
40.00
25.00
10.30
3.83
Black anodize
35
IC Pkg. Size (mm) IC Pkg. Style
1. For tape specifications see page 88
2. Natural convection thermal resistance based on a 75° C heat sink temperature rise.
3. Forced convection thermal resistance based on an entering 1.0 m/s (200LFM) airflow.
16
AMERICA
EUROPE
www.aavidthermalloy.com
USA Tel: +1 (603) 224-9988 email: [email protected]
Italy Tel: +39 051 764011 email: [email protected]
United Kingdom Tel: +44 1793 401400 email: [email protected]
ASIA
Singapore Tel: +65 6362 8388 email: [email protected]
Taiwan Tel: +886(2) 2698-9888 email: [email protected]
BGA–Tape Attachment
"H"
"L"
"W"
HEAT SINKS FOR IC PACKAGES
Heat sinks for metal/ceramic BGA packages
Material: Aluminum
ORDERING INFORMATION
Part Number
“W” (mm)
“L” (mm)
“H” (mm)
θn 2
θf 3
Finish
Tape Code1
10 x 10
Metal / Ceramic
375224B00032G
10.20
11.10
10.20
71.40
21.20
Black anodize
32
23 x 23
Metal / Ceramic
374024B00032G
23.00
23.00
10.00
40.00
11.69
Black anodize
32
23 x 23
Metal / Ceramic
374124B00032G
23.00
23.00
18.00
23.40
7.39
Black anodize
32
23 x 23
Metal / Ceramic
374224B00032G
23.00
23.00
25.00
19.70
6.370
Black anodize
32
25 x 25
Metal / Ceramic
335224B00032G
25.00
25.00
9.90
34.00
10.39
Black anodize
32
27 x 27
Metal / Ceramic
335324B00032G
26.90
26.90
11.40
27.70
8.71
Black anodize
32
27 x 27
Metal / Ceramic
374324B00032G
27.00
27.00
10.00
30.60
9.35
Black anodize
32
27 x 27
Metal / Ceramic
374424B00032G
27.00
27.00
18.00
20.30
6.46
Black anodize
32
27 x 27
Metal / Ceramic
374524B00032G
27.00
27.00
25.00
16.50
5.47
Black anodize
32
28 x 28
Metal / Ceramic
373024B00032G
27.90
27.90
8.89
33.30
10.00
Black anodize
32
28 x 28
Metal / Ceramic
373224M00032G
28.00
28.00
6.00
44.10
13.13
Green anodize
32
28 x 28
Metal / Ceramic
2327B-TACHG
27.90
28.10
15.20
23.40
7.43
Black anodize
32
31 x 31
Metal / Ceramic
335724B00032G
30.10
30.10
6.60
35.70
10.84
Black anodize
32
31 x 31
Metal / Ceramic
335824B00032G
30.00
30.00
9.40
29.40
9.11
Black anodize
32
32.5 x 32.5
Metal / Ceramic
2338B-TACHG
33.00
31.40
12.50
23.10
7.23
Black anodize
32
35 x 35
Metal / Ceramic
371824B00032G
35.00
35.00
7.00
31.90
9.67
Black anodize
32
35 x 35
Metal / Ceramic
374624B00032G
35.00
35.00
10.00
23.40
7.55
Black anodize
32
35 x 35
Metal / Ceramic
374724B00032G
35.00
35.00
18.00
15.30
5.15
Black anodize
32
35 x 35
Metal / Ceramic
374824B00032G
35.00
35.00
25.00
12.00
4.27
Black anodize
32
35 x 35
Metal / Ceramic
372024B00032G
35.00
35.00
27.90
11.90
4.28
Black anodize
32
37.5 x 37.5
Metal / Ceramic
373324M00032G
37.40
37.40
6.00
32.60
9.91
Green anodize
32
37.5 x 37.5
Metal / Ceramic
2319B-TACHG
38.10
38.10
10.16
12.50
3.50
Black anodize
32
IC Pkg. Size (mm) IC Pkg. Style
37.5 x 37.5
Metal / Ceramic
336624B00032G
38.10
38.10
16.00
15.30
5.15
Black anodize
32
40 x 40
Metal / Ceramic
374924B00032G
40.00
40.00
10.00
20.30
6.46
Black anodize
32
40 x 40
Metal / Ceramic
364424B00032G
40.10
40.00
11.40
18.40
6.02
Black anodize
32
40 x 40
Metal / Ceramic
375024B00032G
40.00
40.00
18.00
12.20
4.34
Black anodize
32
40 x 40
Metal / Ceramic
375124B00032G
40.00
40.00
25.00
10.30
3.83
Black anodize
32
42.5 x 42.5
Metal / Ceramic
2321B-TACHG
43.20
41.30
8.90
22.10
6.93
Black anodize
32
42.5 x 42.5
Metal / Ceramic
2332B-TACHG
43.20
41.30
16.50
12.90
4.53
Black anodize
32
45 x 45
Metal / Ceramic
2342B-TACHG
45.70
44.60
7.00
23.10
7.26
Black anodize
32
50 +
Metal / Ceramic
3334B-TACHG
50.50
50.20
16.50
6.0
3.3
Black anodize
32
1. For tape specifications see page 88
2. Natural convection thermal resistance based on a 75° C heat sink temperature rise.
3. Forced convection thermal resistance based on an entering 1.0 m/s (200LFM) airflow.
AMERICA
EUROPE
www.aavidthermalloy.com
USA Tel: +1 (603) 224-9988 email: [email protected]
Italy Tel: +39 051 764011 email: [email protected]
United Kingdom Tel: +44 1793 401400 email: [email protected]
ASIA
Singapore Tel: +65 6362 8388 email: [email protected]
Taiwan Tel: +886(2) 2698-9888 email: [email protected]
17
BGA–Clip Attachment
HEAT SINKS FOR IC PACKAGES
Clip attachment
"H"
"L"
Aavid's BGS Clip heat sinks provide a mechanical
attachment alternative to tape applications
where it is desirable to attach the heat sink
directly to the device. The unique clip uses
spring pressure to ensure even contact across
the device while the end plates firmly engage
the edge of the package, locking the heat sink
in place. Each heat sink uses pre-applied thermal
grease for optimum thermal performance.
"W"
Material: Aluminum
Finish: Black Anodize
ORDERING INFORMATION
IC Pkg. Size (mm)
27 x 27
Part Number
“W” (mm)
“L” (mm)
“H” (mm)
IC Pkg. Style
θn1
θf 2
Interface
Clip
2317B-EP11-BGS1G
26.14
20.47
15.24
All
32.60
9.94
EP11
BGS1
35 x 35
2518B-EP11-BGS2G
30.50
28.10
15.60
All
22.70
7.05
EP11
BGS2
42.5 x 42.5
2519B-EP11-BGS5G
34.50
31.40
15.60
All
19.70
6.30
EP11
BGS5
42.5 x 42.5
2520B-EP04-BGS5G
38.10
38.00
15.60
All
15.60
5.17
EP04
BGS5
42.5 x 42.5
2522B-EP04-BGS5G
38.10
38.00
10.16
All
22.10
6.94
EP04
BGS5
1. Natural convection thermal resistance based on a 75° C heat sink temperature rise.
2. Forced convection thermal resistance based on an entering 1.0 m/s (200LFM) airflow.
THERMALCOTE
GREASE
TM
"E"
PULL TAB
"D"
TAPE TYPE AND INTERFACE MATERIAL INFORMATION
Material
Description
Adhesive
Thermal Resistance
Color
Carrier
“D” Dim
“E” Dim
EP11
ThermalcoteTM grease with release liner
None
0.18
White
None
13.34 (0.525)
13.34 (0.525)
EP04
ThermalcoteTM grease with release liner
None
0.03
White
None
31.75 (1.250)
31.75 (1.250)
For more information on Thermalcote see page 113.
TM
18
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ASIA
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BGA – Bi Directional
"W"
"L"
"H"
Designed for applications with airflow traveling
in a single direction, these heat sinks are suitable
for a variety of standard square IC packages.
Models are available with pre-applied thermal
tape for easy attachment to the IC. Epoxy attach
models are also available.
Material: Aluminum
HEAT SINKS FOR IC PACKAGES
Bi Directional
ORDERING INFORMATION
IC Pkg Style
Part Number
“W” (mm)
“L” (mm)
“H” (mm)
θn3
θf 4
Finish
Attachment
Tape Code 2
10 X 10
All
615653B00250G
6.00
6.00
5.00
142.58
76.26
Black anodize
Epoxy1
N/A
10 X 10
All
709203B00400G
10.00
10.00
10.00
55.98
29.94
Black anodize
Epoxy1
N/A
24 X 24
Metal
335114B00032G
24.00
24.00
24.00
13.60
7.27
Black anodize
Tape
32
25 X 25
Metal
335214B00032G
25.00
25.00
10.00
10.00
5.35
Black anodize
Tape
32
25 X 25
Metal
335211B00032G
25.00
25.00
10.00
10.00
5.35
Black anodize
Tape
32
25 X 25
All
335214B00000G
25.00
25.00
10.00
10.00
5.35
Black anodize
Epoxy1
N/A
25 X 25
All
335211B00000G
25.00
25.00
10.00
10.00
5.35
Black anodize
Epoxy1
N/A
25 X 25
Plastic
335214B00034G
25.00
25.00
10.00
10.00
5.35
Black anodize
Tape
34
27 X 27
Plastic
335314B00035G
27.00
27.00
11.00
10.00
5.35
Black anodize
Tape
35
27 X 27
Metal
335314B00032G
27.00
27.00
11.00
10.00
5.35
Black anodize
Tape
32
IC Pkg Size
27 X 27
All
335314B00000G
27.00
27.00
11.00
10.00
5.35
Black anodize
Epoxy1
N/A
28 X 28
All
700353U01100G
28.00
28.00
9.00
18.49
9.89
Unfinished
Epoxy1
N/A
30 X 30
All
335814B00000G
30.00
30.00
9.00
10.50
5.61
Black anodize
Epoxy1
N/A
30 X 30
All
335714B00000G
30.00
30.00
7.00
15.20
8.13
Black anodize
Epoxy1
N/A
30 X 30
Metal
335814B00032G
30.00
30.00
9.00
9.20
4.92
Black anodize
Tape
32
30 X 30
Metal
335714B00032G
30.00
30.00
7.00
15.20
8.13
Black anodize
Tape
32
37.5 X 37.5
All
799403B01500G
38.00
38.00
10.00
12.21
6.53
Black anodize
Epoxy1
N/A
37.5 X 37.5
All
336314B00000G
36.00
36.00
17.00
11.00
5.88
Black anodize
Epoxy1
N/A
1. Epoxy ordered separately for information on Epoxy see page 114,115.
2. For tape specifications see page 88.
3. Natural convection thermal resistance based on a 75°C heat sink temperature rise.
4. Forced convection thermal resistance based on an entering 1.0 m/s (200LFM) airflow.
AMERICA
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ASIA
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19
DIPS
0
200
Air Velocity—Feet Per Minute
400
600
800
1000
20
Mounting Surface Temp
Rise Above Ambient—°C
100
Slide on heat sink with staggered fins
attaches to 8 pin DIP packages quickly and
easily. The heat sink features double spring
action and locking catch to firmly attach
the device creating a thermal conduction
path on both the top and bottom surfaces.
Available in two finishes.
80
16
60
12
40
8
20
4
0
0
0
0.4
0.8
1.2
1.6
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
Slide on heat sink with staggered fins
14.27
(0.562)
15.24
(0.600)
2.0
11.43
(0.450)
LOCKING
CATCH
ORDERING INFORMATION
Finish
580100B00000G
Black anodize
580100W00000G
Black anodize with black paint on bottom side
5010
6.35
(0.250)
Grease
&
Epoxy
page112
Angle fin heat sink
0
Air Velocity—Feet Per Minute
400
200
600
800
100
Angle fin heat sink is a simple low
cost solution for cooling DIP devices.
Suitable for 14 and 16 pin packages
and available in two finish options.
Easily attaches using thermal epoxy.
1000
100
80
80
60
60
40
40
20
20
0
0
0
0.4
0.8
1.2
1.6
Heat Dissipated—Watts
19.05
(0.750)
2.0
15.34
(0.604)
REF
5.39
(0.212)
ORDERING INFORMATION
Part Number
Finish
501000J00000G
Pre black anodize*
501000B00000G
Black anodize
5.33
(0.210)
Material: 0.63 (0.025) Thick Aluminum
Finish: See Table
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
Part Number
10.54
(0.415)
Mounting Surface Temp
Rise Above Ambient—°C
THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
5801
6.35
(0.250)
Material: 1.27 (0.050) Thick Aluminum
Finish: See Table
* Edges cut during the manufacturing process will be unfinished.
See page 110 for more information.
Slide on heat sink with angled fins
0
200
Air Velocity—Feet Per Minute
400
600
800
Slide on heat sink with angled fins
attaches to 14 and 16 pin DIP packages
quickly and easily. The heat sink features
double spring action and locking catch
to firmly attach the device creating a
thermal conduction path on both the
top and bottom surfaces. Available in
two finishes.
Mounting Surface Temp
Rise Above Ambient—°C
100
1000
20
80
16
60
12
40
8
20
4
0
0
0
0.4
0.8
1.2
1.6
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
5602, 5802
22.61
(0.890)
15.24
(0.600)
2.0
10.42
(0.410)
21.34
(0.840)
LOCKING
CATCH 5.08
(0.200)
"A"
ORDERING INFORMATION
Part Number
20
Device Pkg Style
Finish
“A” Dim
560200B00000G
Ceramic
Black anodize
7.87 (0.310)
560200W00000G
Ceramic
Black anodize with black paint on bottom side
7.87 (0.310)
580200B00000G
Plastic
Black anodize
6.35 (0.250)
580200W00000G
Plastic
Black anodize with black paint on bottom side
6.35 (0.250)
AMERICA
EUROPE
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USA Tel: +1 (603) 224-9988 email: [email protected]
Italy Tel: +39 051 764011 email: [email protected]
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Material: 0.63 (0.025) Thick Aluminum
Finish: See Table
ASIA
Singapore Tel: +65 6362 8388 email: [email protected]
Taiwan Tel: +886(2) 2698-9888 email: [email protected]
Slide on heat sink with staggered fins
0
200
Air Velocity—Feet Per Minute
400
600
800
Mounting Surface Temp
Rise Above Ambient—°C
100
1000
10
80
8
60
6
40
4
20
2
0
0
Slide on heat sink with staggered fins
attaches to 28 pin DIP packages quickly
and easily. The heat sink features double
spring action and locking catch to firmly
attach the device creating a thermal
conduction path on both the top and
bottom surfaces.
0
0.4
0.8
1.2
1.6
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
5806
42.67
(1.680)
2.0
14.86
(0.585)
37.47
(1.475)
LOCKING
CATCH
12.70
(0.500)
13.72
(0.540)
Material: 0.81 (0.032) Thick Aluminum
Finish: Black Anodize
ORDERING INFORMATION
Part Number
Description
580600B00000G
Slide on heat sink with staggered fins
Slide on heat sink with staggered fins
0
Air Velocity—Feet Per Minute
400
200
600
800
Mounting Surface Temp
Rise Above Ambient—°C
100
1000
20
80
16
60
12
40
8
20
4
0
0
0
Slide on heat sink with staggered fins
attaches to 18 pin DIP packages quickly
and easily. The heat sink features double
spring action and locking catch to firmly
attach the device creating a thermal
conduction path on both the top and
bottom surfaces.
28.58
(1.125)
0.4
0.8
1.2
1.6
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
5803
25.40
(1.000)
THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
DIPS
23.62
(0.930)
2.0
14.12
(0.556)
LOCKING CATCH
5.33
(0.210)
6.35
(0.250)
ORDERING INFORMATION
Material: 0.63 (0.025) Thick Aluminum
Finish: Black Anodize
Part Number
Description
580300B00000G
Slide on heat sink with staggered fins
AMERICA
EUROPE
www.aavidthermalloy.com
17.78
(0.700)
USA Tel: +1 (603) 224-9988 email: [email protected]
Italy Tel: +39 051 764011 email: [email protected]
United Kingdom Tel: +44 1793 401400 email: [email protected]
ASIA
Singapore Tel: +65 6362 8388 email: [email protected]
Taiwan Tel: +886(2) 2698-9888 email: [email protected]
21
DIPS
Slide on heat sink with staggered fins
Air Velocity—Feet Per Minute
400
200
600
800
100
1000
20
80
16
60
12
40
8
20
4
0
0
Slide on heat sink with staggered fins
attaches to 20 pin DIP packages quickly
and easily. The heat sink features double
spring action and locking catch to firmly
attach the device creating a thermal
conduction path on both the top and
bottom surfaces.
0
0.4
0.8
1.2
1.6
Heat Dissipated—Watts
28.58
(1.125)
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
0
Mounting Surface Temp
Rise Above Ambient—°C
26.80
(1.055)
14.12
(0.556)
LOCKING CATCH
5.33
(0.210)
6.35
(0.250)
Material: 0.63 (0.025) Thick Aluminum
Finish: Black Anodize
ORDERING INFORMATION
Part Number
Description
580400B00000G
Slide on heat sink with staggered fins
5805
17.78
(0.700)
2.0
Slide on heat sink with staggered fins
0
Air Velocity—Feet Per Minute
400
200
600
800
Mounting Surface Temp
Rise Above Ambient—°C
100
80
8
60
6
40
4
20
2
0
0
0
Slide on heat sink with staggered fins
attaches to 24 pin DIP packages quickly
and easily. The heat sink features double
spring action and locking catch to firmly
attach the device creating a thermal
conduction path on both the top and
bottom surfaces.
1000
10
0.4
0.8
1.2
1.6
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
5804
37.08
(1.460)
2.0
25.60
(1.008)
14.73
(0.580)
LOCKING
CATCH
32.51
(1.280)
12.19
(0.480)
13.72
(0.540)
ORDERING INFORMATION
22
Material: 0.81 (0.032) Thick Aluminum
Finish: Black Anodize
Part Number
Description
580500B00000G
Slide on heat sink with staggered fins
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ASIA
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Taiwan Tel: +886(2) 2698-9888 email: [email protected]
Grease
&
Epoxy
page112
Extruded epoxy attach on heat sink with straight fins
0
200
Air Velocity—Feet Per Minute
400
600
800
Mounting Surface Temp
Rise Above Ambient—°C
100
Extruded epoxy attach on heat sink
with straight fins attaches to 24, 28,
and 40 pin DIP packages quickly and
easily. May be added before or after
final board assembly. No additional
board space is required.
1000
20
80
16
60
12
40
8
20
4
0
0
0
1
508700
508600
508500
2
3
Heat Dissipated—Watts
4
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
5085, 5086, 5087
13.46
(0.530)
"A"
4.83
(0.190)
5
Material: Aluminum
Finish: Black Anodize
ORDERING INFORMATION
Part Number
DIP Package
“A” Dim
508500B00000G
24 pin
31.75 (1.250)
508600B00000G
28 pin
36.83 (1.450)
508700B00000G
40 pin
50.80 (2.000)
For epoxy information see pages 114-115.
Grease
&
Epoxy
page112
Extruded epoxy attach heat sink
0
Air Velocity—Feet Per Minute
400
200
600
800
Mounting Surface Temp
Rise Above Ambient—°C
100
Extruded epoxy attach heat sink
which requires no additional board
space is suitable for narrow DIP
packages. May be added before
or after final board assembly. No
additional board space is required.
Attaches to 28 pin DIP.
25
80
20
60
15
40
10
20
5
0
0
0
1
2
3
4
Heat Dissipated—Watts
12.06
(0.475)
REF
1000
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
6284
THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
DIPS
36.83 REF
(1.450)
5
13.46
(0.530)
ORDERING INFORMATION
Material: Aluminum
Finish: Black Anodize
Part Number
Description
6284BG
Extruded epoxy attach heat sink for 28 pin DIP
For epoxy information see pages 114-115.
5011, 5012
Grease
&
Epoxy
page112
Extruded epoxy attach heat sink with straight fins
FIGURE B
FIGURE A
4.83
(0.190)
6.35 REF
(0.250)
19.05
(0.750)
18.57
(0.730)
4.82 REF
(0.190)
0
Mounting Surface Temp
Rise Above Ambient—°C
ORDERING INFORMATION
Part Number
Description
501100B00000G
Extruded epoxy attach heat sink with straight fins
A
501200B00000G
Figure
Extruded epoxy attach heat sink with straight fins
B
USA Tel: +1 (603) 224-9988 email: [email protected]
Italy Tel: +39 051 764011 email: [email protected]
United Kingdom Tel: +44 1793 401400 email: [email protected]
80
1
501
60
–5
1000
100
80
012
60
40
40
20
20
0
0
0.0
501100
501200
For epoxy information see pages 114-115.
www.aavidthermalloy.com
Air Velocity—Feet Per Minute
400
200
600
800
100
ASIA
0.4
0.8
1.2
1.6
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
Material: Aluminum
Finish: Black Anodize
Extruded epoxy attach heat sink with
straight fins attaches to 14 and 16 pin
DIP packages quickly and easily. May be
added before or after final board assembly.
No additional board space is required.
Available in two fin directions.
AMERICA
EUROPE
6.35
(0.250)
2.0
Singapore Tel: +65 6362 8388 email: [email protected]
Taiwan Tel: +886(2) 2698-9888 email: [email protected]
23
SMT
Surface mount heat sink for D-PAK (TO-252) package semiconductors
80
20
60
15
40
10
Case Temp Rise
Rise Above Ambient—°C
20
5
0
0
0.0
0.5
1.0
1.5
2.0
Heat Dissipated—Watts
8.00
(0.315)
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
1000
25
0
Surface mount heat sink for D-PAK
(TO-252) package semiconductors
remove the heat indirectly without
contacting the device like traditional
through hole heat sinks. The device
and the heat sink are soldered directly
to a modified drain pad creating a
thermal transfer path from package
tab to the heat sink.
Air Velocity—Feet Per Minute
400
200
600
800
100
22.86
(0.900)
10.16
(0.400)
2.5
1.3
(0.05)
8.13
(0.320)
10.41
(0.410)
Material: 0.63 (0.025) Thick Copper
Finish: Tin Plated
Refer to Figure A and B on page 26 for board footprint information
ORDERING INFORMATION
Part Number
Packaging
573100D00010G
13" Reel, 250 per reel
573100D00000G
Bulk, 500 per bag
See page 25 for tape and reel information
Surface mount heat sink for D 2 PAK (TO-263) package semiconductors
Surface mount heat sink for D2 PAK
(TO-263) package semiconductors
remove the heat indirectly without
contacting the device like traditional
through hole heat sinks. The device
and the heat sink are soldered directly
to a modified drain pad creating a
thermal transfer path from package
tab to the heat sink.
Air Velocity—Feet Per Minute
400
200
600
800
50
1000
20
40
16
30
12
20
8
10
4
0
0
0
0.0
0.5
1.0
1.5
2.0
Heat Dissipated—Watts
12.70
(0.500)
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
5733
Case Temp Rise
Rise Above Ambient—°C
THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
5731
26.16
(1.030)
10.16
(0.400)
7.37
(0.290)
2.5
12.70
(0.500)
1.3
(0.05)
Material: 0.63 (0.025) Thick Copper
Finish: Tin Plated
Refer to Figure A and B on page 26 for board footprint information
ORDERING INFORMATION
Part Number
Packaging
573300D00010G
13" Reel, 250 per reel
573300D00000G
Bulk, 500 per bag
See page 25 for tape and reel information
Surface mount heat sink for D 2 PAK (TO-263), power SO-10 (MO-184) and SO-10 package semiconductors
Mounting Surface Temp
Rise Above Ambient—°C
Surface mount heat sink for D2 PAK
(TO-263), power SO-10 (MO-184)
and SO-10 package semiconductors
remove the heat indirectly without
contacting the device like traditional
through hole heat sinks. The device
and the heat sink are soldered directly
to a modified drain pad creating a
thermal transfer path from package
tab to the heat sink.
Air Velocity—Feet Per Minute
400
200
600
800
5.33
(0.210)
100
1000
10
80
8
60
6
40
4
20
2
0
0
0
0
1
2
3
Heat Dissipated—Watts
4
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
7106
25.91
(1.020)
10.16
(0.400)
5
9.52
(0.375)
7.62
(0.300)
Material: 0.63 (0.025) Thick Copper
Finish: Tin Plated
ORDERING INFORMATION
Part Number
Packaging
7106D/TRG
13" Reel, 200 per reel
7106DG
Bulk, 500 per bag
10.92 14.99
(0.430) (0.590)
14.99
(0.590)
Refer to Figure C on page 26 for board footprint information
See page 25 for tape and reel information
24
AMERICA
EUROPE
www.aavidthermalloy.com
USA Tel: +1 (603) 224-9988 email: [email protected]
Italy Tel: +39 051 764011 email: [email protected]
United Kingdom Tel: +44 1793 401400 email: [email protected]
ASIA
Singapore Tel: +65 6362 8388 email: [email protected]
Taiwan Tel: +886(2) 2698-9888 email: [email protected]
Surface mount heat sink for D 2 PAK (TO-263) package semiconductors
Air Velocity—Feet Per Minute
400
200
600
800
0
1000
Mounting Surface Temp
Rise Above Ambient—°C
100
Surface mount heat sink for D2 PAK
(TO-263) package semiconductors
remove the heat indirectly without
contacting the device like traditional
through hole heat sinks. The device
and the heat sink are soldered directly
to a modified drain pad creating a
thermal transfer path from package
tab to the heat sink.
5
80
4
60
3
40
2
20
1
0
0
0
1
2
3
Heat Dissipated—Watts
4
19.38
(0.763)
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
7109
25.40
(1.000)
15.24
(0.600)
5
11.43
(0.450)
11.43
(0.450)
Refer to Figure D on page 26 for board footprint information
ORDERING INFORMATION
Part Number
Packaging
7109D/TRG
13" Reel, 125 per reel
7109DG
Bulk, 500 per bag
Material: 0.63 (0.025) Thick Copper
Finish: Tin Plated
See below for tape and reel information
Surface mount heat sink for D 3 PAK (TO-268) package semiconductors
1000
20
40
16
30
12
20
8
Case Temp Rise
Rise Above Ambient—°C
0
Surface mount heat sink for D3 PAK
(TO-268) package semiconductors
remove the heat indirectly without
contacting the device like traditional
through hole heat sinks. The device
and the heat sink are soldered directly
to a modified drain pad creating a
thermal transfer path from package
tab to the heat sink.
Air Velocity—Feet Per Minute
400
200
600
800
50
10
4
0
0
0.0
0.5
1.0
1.5
2.0
Heat Dissipated—Watts
12.70
(0.500)
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
5734
THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
SMT
30.99
(1.220)
10.16
(0.400)
7.37
(0.290)
2.5
1.3
(0.05)
17.53
(0.690)
Refer to Figure A and B on page 26 for board footprint information
ORDERING INFORMATION
Material: 0.63 (0.025) Thick Copper
Finish: Tin Plated
Part Number
Packaging
573400D00010G
13" Reel, 250 per reel
573400D00000G
Bulk, 500 per bag
See below for tape and reel information
Tape and Reel information
D
B
C
A
ORDERING INFORMATION
Part Number
“A” Dim
“B” Dim
“C” Dim
“D” Dim
7106D/TRG
44.00 (1.730)
40.40 (1.590)
24.00 (0.940)
4.06 (0.160)
7109D/TRG
44.00 (1.730)
40.40 (1.590)
36.00 (1.420)
4.06 (0.160)
573100D00010G
44.00 (1.730)
40.40 (1.590)
16.00 (0.630)
4.06 (0.160)
573300D00010G
44.00 (1.730)
40.40 (1.590)
24.00 (0.940)
4.06 (0.160)
573400D00010G
44.00 (1.730)
40.40 (1.590)
24.00 (0.940)
4.06 (0.160)
AMERICA
EUROPE
www.aavidthermalloy.com
USA Tel: +1 (603) 224-9988 email: [email protected]
Italy Tel: +39 051 764011 email: [email protected]
United Kingdom Tel: +44 1793 401400 email: [email protected]
ASIA
Singapore Tel: +65 6362 8388 email: [email protected]
Taiwan Tel: +886(2) 2698-9888 email: [email protected]
25
THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
SMT Footprints
FIGURE A
FIGURE B
Recommended copper heat speader drain pad footprint
Recommended heat sink solder mask opening
W1
W
W2
Note: The thickness of
the drain pad is variable
depending on the amount
of heat generated by the
SMT device, design limitations and process.
L
L
1.40
(0.060)
0.80
(0.030)
“L”
“W”
“L”
“W1”
“W2”
573100
9.53 (0.375)
13.97 (0.550)
573100
9.02 (0.355)
13.46 (0.530)
8.89 (0.350)
573300
14.22 (0.560)
16.26 (0.640)
573300
13.72 (0.540)
15.75 (0.620)
11.18 (0.440)
573400
14.22 (0.560)
21.08 (0.830)
573400
13.72 (0.540)
20.57 (0.810)
16.00 (0.630)
Part Number
Part Number
FIGURE C
FIGURE D
Recommended copper pad size
for heat sink and device mounting footprint
Recommended copper pad size
for heat sink and device mounting footprint
10.41
(0.410)
2.29
(0.090)
10.67
(0.420)
15.49
(0.610)
2.54
(0.100)
For MO-184 and SO-10
AMERICA
EUROPE
www.aavidthermalloy.com
10.67
(0.420)
16.76
(0.660)
7.62
(0.300)
For D Pak (TO-263)
26
20.32
(0.800)
2.54
(0.100)
15.49
(0.610)
USA Tel: +1 (603) 224-9988 email: [email protected]
Italy Tel: +39 051 764011 email: [email protected]
United Kingdom Tel: +44 1793 401400 email: [email protected]
ASIA
Singapore Tel: +65 6362 8388 email: [email protected]
Taiwan Tel: +886(2) 2698-9888 email: [email protected]
Grease
&
Epoxy
page112
Channel style heat sink with folded back fins
0
200
Air Velocity—Feet Per Minute
400
600
800
Channel style heat sink with folded
back fins for increased cooling surface
area. Available with tin plated solderable tabs for easy attachment to the
printed circuit card.
Mounting Surface Temp
Rise Above Ambient—°C
100
5
80
4
60
3
40
2
20
1
0
0
0
4
6
Heat Dissipated—Watts
8
5.08
14.48 (0.200)
(0.570)
28.70 23.62
(1.130) (0.930)
2.02
(0.080)
10
3.18
(0.125)
4.45
(0.175)
2.29
(0.090)
2.54
(0.100)
TAB
28.03
(1.104)
19.05
(0.750)
48.26
(1.900)
26.67
(1.050)
Dia of PCB
Plated Thru
Hole for Tabs
ORDERING INFORMATION
Part Number
2
Mounting
Kits
page 99
ø 3.81 THRU
(0.150)
1000
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
7025
Description
7025BG
Channel heat sink with no solderable tabs
7025B-MTG
With solderable mounting tabs
24.13
(0.950)
Material: 1.27 (0.050) Thick Aluminum
Finish: Black Anodize
2.90 ( 0.114)
For additional options see page 85
Grease
&
Epoxy
page112
Narrow channel style heat sink with folded back fins
0
200
Air Velocity—Feet Per Minute
400
600
800
Narrow channel style heat sink with
folded back fins for increased cooling
surface area. Available with tin plated
solderable tabs for easy attachment to
the printed circuit card.
Mounting Surface Temp
Rise Above Ambient—°C
100
1000
10
80
8
60
6
40
4
20
2
0
0
0
2
4
6
8
Heat Dissipated—Watts
11.94
(0.470)
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
7019
25.40
(1.000)
Part Number
Description
Finish
7019BG
Channel heat sink with no solderable tabs Black anodize
7019PBG
Channel heat sink with no solderable tabs Pre black anodize*
7019B-MTG
With solderable tabs
Black anodize
ø 3.81
(0.150)
THRU
14.48
(0.570)
4.83
(0.190)
TAB
38.23
(1.505)
39.37
(1.550)
10
2.03
(0.080)
3.18
5.08 (0.125)
(0.200)
9.52
(0.375)
Dia of PCB
Plated Thru
Hole for Tabs
ORDERING INFORMATION
Mounting
Kits
page 99
THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
TO-220 Heat Sinks
2.28
(0.090)
Material: 1.02 (0.040) Thick Aluminum
Finish: See Table
2.90 ( 0.114)
*Edges cut during the manufacturing process will be unfinished.
See page 110 for more information
For additional options see page 85
Mounting Surface Temp
Rise Above Ambient—°C
Narrow channel style heat sink with
folded back fins for increased cooling
surface area. Available with tin plated
solderable tabs for easy attachment to
the printed circuit card.
100
80
8
60
6
40
4
2
0
0
0
2
4
6
8
Heat Dissipated—Watts
ø 3.81 2x
(0.150)
"x"
Description
Narrow channel heat sink with no solderable tabs
7020B-MTG
With solderable tabs
7.87
(0.310)
36.83
(1.450)
CL
14.48
(0.570)
4.83
(0.190)
10
Dia of PCB
Plated Thru
Hole for Tabs
7020BG
Mounting
Kits
page 99
33.02
(1.300)
TAB
Part Number
11.94
(0.470)
2.02
(0.080)
31.88
(1.255)
17.78
(0.700)
6.10
(0.240)
3.18
(0.125)
Material: 1.27 (0.050) Thick Aluminum
Finish: Black Anodize
2.90 (0.114)
POPULAR OPTIONS: 7020B-
A
200
20
ORDERING INFORMATION
Base part no.
Air Velocity—Feet Per Minute
400
600
800
1000
10
0
Position
Grease
&
Epoxy
page112
Narrow channel style heat sink with folded back fins
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
7020
G
A
Code
Description
TC10-MT
Insulating device mounting clip
and solderable tabs
Location
Details
Hole X
Page 93, 98
For additional options see page 85
AMERICA
EUROPE
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USA Tel: +1 (603) 224-9988 email: [email protected]
Italy Tel: +39 051 764011 email: [email protected]
United Kingdom Tel: +44 1793 401400 email: [email protected]
ASIA
Singapore Tel: +65 6362 8388 email: [email protected]
Taiwan Tel: +886(2) 2698-9888 email: [email protected]
27
TO-220 Heat Sinks
Grease
&
Epoxy
page112
Channel style heat sink with folded back fins
Air Velocity—Feet Per Minute
400
200
600
800
44.45
(1.750)
100
5
80
4
60
3
40
2
20
1
0
0
0
Channel style heat sink with
folded back fins for increased
cooling surface area. Available
with tin plated solderable tabs
for easy attachment to the
printed circuit card.
2
4
6
8
Heat Dissipated—Watts
7.87
(0.310)
"X"
36.83
(1.450)
4.83
(0.190)
3.18
(0.125)
14.48
(0.570)
10
TAB
Mounting
Kits
page 99
2x ø 3.81
(0.150)
1000
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
0
Mounting Surface Temp
Rise Above Ambient—°C
THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
7021
2.02
(0.080)
43.05
(1.695)
2.67
(0.105)
5.58
(0.220)
17.78
(0.700)
9.65
(0.380)
2.28
(0.090)
Dia of PCB
Plated Thru
Hole for Tabs
ORDERING INFORMATION
Part Number
Description
7021BG
Channel heat sink with no solderable tabs
7021B-MTG
With solderable tabs
2.90 ( 0.114)
POPULAR OPTIONS: 7021BBase part no.
Material: 1.27 (0.050) Thick Aluminum
Finish: Black Anodize
G
A
Position
Code
A
TC10-MT
Description
A
MT5
Bifurcated tabs with 0.205 stand off
A
MT6
Bifurcated tabs with 0.115 stand off
A
TC10-MT5
Locking device mounting clip and solderable tabs
Location
Details
Hole X
Page 93, 98
Page 93
Page 93
Locking device mounting clip and bifurcated tabs
Hole X
Page 93, 98
For additional options see page 85
Grease
&
Epoxy
page112
Channel style heat sink with folded back fins
Mounting Surface Temp
Rise Above Ambient—°C
0
200
Air Velocity—Feet Per Minute
400
600
800
2x ø 3.81 THRU
(0.150)
100
5
80
4
60
3
40
2
20
1
0
0
0
2
Channel style heat sink with
folded back fins for increased
cooling surface area. Available
with tin plated solderable tabs
for easy attachment to the
printed circuit card.
8
15.49
(0.610)
49.53
(1.950)
"X"
5.08
(0.200)
A
2.54
(0.100)
14.48
(0.570)
10
TAB
28.03
(1.104)
4.83
(0.190)
A
Dia of PCB
Plated Thru
Hole for Tabs
Part Number
Description
7023BG
Channel heat sink with no solderable tabs
7023B-MTG
With solderable tabs
19.05
(0.750)
3.18 SECTION A-A
(0.125)
2.29
(0.090)
24.13
(0.950)
Material: 1.27 (0.050) Thick Aluminum
Finish: Black Anodize
2.90 ( 0.114)
POPULAR OPTIONS: 7023B-
G
A
Position
Code
A
TC6-MT
Locking device mounting clip and solderable tabs
Description
Location
Hole X Page 93, 98
Details
A
TC7-MT
Insulating device mounting clip and solderable tabs
Hole X
Page93, 98
For additional options see page 85
28
AMERICA
EUROPE
www.aavidthermalloy.com
4.45
(0.175)
48.26
(1.900)
26.67
(1.050)
ORDERING INFORMATION
Base part no.
4
6
Heat Dissipated—Watts
Mounting
Kits
page 99
1000
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
7023
USA Tel: +1 (603) 224-9988 email: [email protected]
Italy Tel: +39 051 764011 email: [email protected]
United Kingdom Tel: +44 1793 401400 email: [email protected]
ASIA
Singapore Tel: +65 6362 8388 email: [email protected]
Taiwan Tel: +886(2) 2698-9888 email: [email protected]
Grease
&
Epoxy
page112
Channel style heat sink with folded back fins
0
200
Air Velocity—Feet Per Minute
400
600
800
Mounting Surface Temp
Rise Above Ambient—°C
5
80
4
60
3
40
2
20
1
0
0
0
4
Channel style heat sink with
folded back fins for increased
cooling surface area. Available
with tin plated solderable tabs
for easy attachment to the
printed circuit card.
8
12
16
Heat Dissipated—Watts
9.52
(0.375)
1000
100
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
7022
"X"
Description
7022BG
Channel heat sink with no solderable tabs
Black anodize
7022PBG
Channel heat sink with no solderable tabs
Pre black anodize*
7022B-MTG
With solderable tabs
Black anodize
2.90 ( 0.114)
7022PB-MTG
With solderable tabs
Pre black anodize*
2.90 ( 0.114)
14.48
(0.570)
2x 3.81
(0.150)
2.02
(0.080)
TAB
2.67
(0.105)
3.18
(0.125)
2.29
(0.090)
Dia of PCB
Plated Thru
Hole for Tabs
Finish
49.99
(1.968)
21.03
(0.828)
20
4.44
(0.175)
Part Number
23.01
(0.906)
50.44
(1.986)
2x ø 3.81
(0.150)
4.83
(0.190)
ORDERING INFORMATION
Mounting
Kits
page 99
2x 2.03
(0.080)
24.16
(0.951)
Material: 1.27 (0.050) Thick Aluminum
Finish: See Table
* Edges cut during the manufacturing process will be unfinished.
See page 110 for more information
POPULAR OPTIONS: 7022BBase part no.
Position
Code
A
TC11-MT
THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
TO-220 Heat Sinks
G
A
Description
Insulated device mounting clip for T0-220 and solderable tabs
Location
Details
Hole X
Page 93, 98
For additional options see page 85
Grease
&
Epoxy
page112
High performance channel style heat sink with folded back fins
Air Velocity—Feet Per Minute
400
200
600
800
100
1000
10
80
8
60
6
40
4
20
2
Mounting Surface Temp
Rise Above Ambient—°C
0
0
High performance channel style
heat sink with folded back fins
for greater cooling capacity in a
minimum of space when mounted
horizontally. Folded back fin design
maximizes surface area without
increasing the vertical space
required by the heat sink.
0
0
1
2
3
4
Heat Dissipated—Watts
Mounting
Kits
page 99
ø 3.68 THRU
(0.145)
12.78
25.55 (0.503)
(1.006)
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
5510
CL
9.91
(0.390)
13.21
(0.520)
13.46
(0.530)
13.46
(0.530)
5
19.99
(0.787)
36.83
(1.450)
Material: 1.27 (0.050) Thick Aluminum
Finish: Black Anodize
ORDERING INFORMATION
Part Number
Description
551002B00000G
High performance channel style heat sink with folded back fins
POPULAR OPTIONS: 551002B0 00 00G
Base part no.
Position
A
A
Code
Description
Details
01
6-32 Wave On threaded insert
0.100 stand off
Page 89
For additional options see page 82
AMERICA
EUROPE
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United Kingdom Tel: +44 1793 401400 email: [email protected]
ASIA
Singapore Tel: +65 6362 8388 email: [email protected]
Taiwan Tel: +886(2) 2698-9888 email: [email protected]
29
TO-220 Heat Sinks
Grease
&
Epoxy
page112
Channel style heat sink with straight fins
Mounting
Kits
page 99
FIGURE B
FIGURE A
25.40
(1.000)
1.02
(0.040)
ø 3.38
(0.133)
3.81 WIDE X
(0.150)
9.52 LONG SLOT
(0.375)
12.70
(0.500)
25.40
(1.000)
12.70
(0.500)
1.02
(0.040)
"X"
29.97
(1.180)
29.97
(1.180) 17.78
(0.700)
17.78
(0.700) 3.81
(0.150)
0.80
(0.032)
24.38
(0.960)
"B"
Channel style heat sink with
straight fins features integrated
solderable tabs for easy mounting
to the printed circuit card. Available
with a single device mounting hole
or slotted hole to accomodate
varying device lead lengths.
0.80
(0.032)
24.59
(0.968)
3.80
(0.150)
"A"
"B"
"A"
0
200
Air Velocity—Feet Per Minute
400
600
800
100
80
8
60
6
40
4
20
2
0
0
0
2
4
6
Heat Dissipated—Watts
Part Number
Description
Finish
Figure
Dia of PCB
Plated Thru
Hole for Tabs
“A” Dim
“B” Dim
6021BG
Channel heat sink with straight fins and integrated tabs
Black anodize
A
2.21 (0.087)
10.16 (0.400)
1.78 (0.070)
6021PBG
Channel heat sink with straight fins and integrated tabs
Pre-black anodize*
A
2.21 (0.087)
10.16 (0.400)
1.78 (0.070)
6221PBG
With slotted device mounting hole
Pre-black anodize*
B
3.18 (0.125)
6.99 (0.275)
2.54 (0.100)
ORDERING INFORMATION
1000
10
8
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
Material: 1.02 (0.040) Thick Aluminum
Finish: See Table
Mounting Surface Temp
Rise Above Ambient—°C
THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
6021, 6221
10
* Edges cut during the manufacturing process will be unfinished.
See page 110 for more information
6021-
POPULAR OPTIONS:
Available on the 6021 only
-
Base part no.
Position
Code
Description
A
B
Black anodize
A
G
B
A
PB
Pre-black anodize*
B
SF1
4-40 UNC-2A device mounting stud
Location
Details
Hole X
Page 96
For additional options for part 6021 see page 85
0
Air Velocity—Feet Per Minute
400
200
600
800
Mounting Surface Temp
Rise Above Ambient—°C
100
Copper channel style heat sink
with straight fins features integrated
tabs which can be twisted to attach
the heat sink to the board prior to
wave solder.
8
6
40
4
20
2
0
0
2
4
6
8
Heat Dissipated—Watts
Description
6230DG
Channel heat sink with straight fins and integrated tabs
AMERICA
EUROPE
9.53
(0.375)
29.97
(1.180)
17.78
(0.700)
3.81
(0.150)
2.54
(0.100)
25.40
(1.000)
10
12.70
(0.500)
6.98
(0.275)
Material: 0.63 (0.025) Thick Copper
Finish: Tin Plated
Dia of PCB
Plated Thru
Hole for Tabs
Part Number
www.aavidthermalloy.com
1000
10
60
0
Mounting
Kits
page 99
3.81
(0.150)
80
ORDERING INFORMATION
30
Grease
&
Epoxy
page112
Copper channel style heat sink with straight fins
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
6230
3.00 (0.118)
USA Tel: +1 (603) 224-9988 email: [email protected]
Italy Tel: +39 051 764011 email: [email protected]
United Kingdom Tel: +44 1793 401400 email: [email protected]
ASIA
Singapore Tel: +65 6362 8388 email: [email protected]
Taiwan Tel: +886(2) 2698-9888 email: [email protected]
Grease
&
Epoxy
page112
Narrow channel style heat sink features twisted fins
0
Air Velocity—Feet Per Minute
400
200
600
800
Mounting Surface Temp
Rise Above Ambient—°C
100
1000
10
80
8
60
6
40
4
20
2
0
0
0
2
4
6
Heat Dissipated—Watts
8
Mounting
Kits
page 99
2X 4.00 ø THRU
(0.158)
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
TV35
CL
10
14.00
(0.552)
10.00
(0.394)
Narrow channel style heat sink
features twisted fins for increased
air turbulence and better cooling.
Mounts horizontally to accommodate two TO-220 devices.
42.00
(1.655)
25.00
(0.985)
ORDERING INFORMATION
Part Number
Description
TV35G
Channel style heat sink with twisted fins
35.00
(1.380)
38.00
(1.497)
Material: 0.81 (0.032) Thick Aluminum
Finish: Black Anodize
0
Air Velocity —Feet Per Minute
400
200
600
800
Mounting Surface Temp
Rise Above Ambient—°C
100
Narrow channel style
heat sink features twisted
fins for increased air turbulence and better cooling. Can be
mounted vertically or horizontally.
1000
20
80
16
60
12
40
8
20
4
0
0
0
TV58
TV46, TV47
1
2
3
4
Heat Dissipated —Watts
4.00 ø THRU
(0.157)
CL
“B”
5
22.00
(0.887)
MAX
"A"
11.00
(0.433)
MIN
“A” Dim
“B” Dim
TV46G
13.00 (0.512)
9.50 (0.374)
TV47G
13.00 (0.512)
6.30 (0.248)
TV58G
11.00 (0.433)
6.30 (0.248)
AMERICA
EUROPE
www.aavidthermalloy.com
Mounting
Kits
page 99
19.00
(0.749)
ORDERING INFORMATION
Part Number
Grease
&
Epoxy
page112
Narrow channel style heat sink features twisted fins
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
TV46, TV47, TV58
THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
TO-220 Heat Sinks
Material: 0.81 (0.032) Thick Aluminum
Finish: Black Anodize
USA Tel: +1 (603) 224-9988 email: [email protected]
Italy Tel: +39 051 764011 email: [email protected]
United Kingdom Tel: +44 1793 401400 email: [email protected]
ASIA
Singapore Tel: +65 6362 8388 email: [email protected]
Taiwan Tel: +886(2) 2698-9888 email: [email protected]
31
TO-220 Heat Sinks
Grease
&
Epoxy
page112
Channel style heat sink features twisted fins
Mounting Surface Temp
Rise Above Ambient—°C
100
80
16
60
12
40
8
20
4
0
0
0
2
TV1500
TV1505
0
4
6
Heat Dissipated—Watts
8
Air Velocity—Feet Per Minute
400
200
600
800
1000
20
16
12
40
8
20
4
0
0
TV 265
2
3
Heat Dissipated—Watts
Part Number
Description
TV265G
Channel style heat sink with twisted fins and solderable tabs
4
A
2.39 (0.094)
Channel style heat sink with twisted fins
B
TV1505G
With integrated twist tabs
B
0.75
(0.030)
25.40
(1.000)
10.15
(0.400)
FIGURE B
30.00
(1.181)
12.70
(0.500)
5.08
(0.200)
R 1.90
(0.075)
CL
30.20
(1.187)
Figure
TV1500G
1.90
(0.075)
5
Dia of PCB
Plated Thru
Hole for Tabs
ORDERING INFORMATION
5.08
(0.200)
CL
45.00
(1.772)
4.50
(0.177)
60
1
R 1.90
(0.075)
10
80
0
30.00
(1.181)
22.10
(0.870)
12.70
(0.500)
15.24
(0.600)
100
Channel style heat sink features
twisted fins for increased air turbulence and better cooling. Can be
mounted vertically or horizontally.
Models are available with integrated
twist tabs or mounting solderable tabs.
Mounting
Kits
page 99
FIGURE A
1000
20
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
Air Velocity—Feet Per Minute
400
200
600
800
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
0
Mounting Surface Temp
Rise Above Ambient—°C
THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
TV265, TV1500, TV1505
15.24
(0.600)
TAB
TV1505
ONLY
3.80
(0.150)
1.20
(0.047)
2.54
(0.100)
24.13
(0.950)
5.80
(0.228)
3.30 (0.130)
Material: 1.27 (0.050) Thick Aluminum
Finish: Black Anodize
Grease
&
Epoxy
page112
Channel style heat sink features solderable tabs and twisted fins
1000
10
80
8
60
6
40
4
0
Mounting Surface Temp
Rise Above Ambient—°C
Air Velocity—Feet Per Minute
400
200
600
800
100
2
20
0
0
0
2
4
6
Heat Dissipated—Watts
8
5.10
(0.201)
Description
Channel style heat sink with twisted fins and solderable tabs
Slots for
clip attach
15.20
5.00 (0.598)
(0.197)
10
1.90
(0.075)
0.80
(0.031)
24.20
(0.953)
25.00
(0.984)
Material: 1.19 (0.047) Thick Aluminum
Finish: Pre Black Anodize*
Dia of PCB
Plated Thru
Hole for Tabs
5900PBG
CL
31.20
(1.228)
11.10
(0.437)
Part Number
3.81
(0.150)
12.50
(0.492)
Channel style heat sink features
solderable tabs and twisted fins
for increased air turbulence for better cooling. For ease of assembly use
with clip 7701 (sold separately) to
attach device. See page 97 for clip
information.
ORDERING INFORMATION
Mounting
Kits
page 99
30.40
(1.197)
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
5900
2.40 (0.094)
* Edges cut during the manufacturing process will be unfinished.
See page 110 for more information.
32
AMERICA
EUROPE
www.aavidthermalloy.com
USA Tel: +1 (603) 224-9988 email: [email protected]
Italy Tel: +39 051 764011 email: [email protected]
United Kingdom Tel: +44 1793 401400 email: [email protected]
ASIA
Singapore Tel: +65 6362 8388 email: [email protected]
Taiwan Tel: +886(2) 2698-9888 email: [email protected]
0
200
Air Velocity—Feet Per Minute
400
600
800
Channel style heat sink features
twisted fins for increased air turbulence for better cooling. Two heights
are available and include wave solderable tin plated tabs for easy attachment
to the PC board.
“A” Dim
Dia of PCB
Plated Thru
Hole for Tabs
592902B03400G
24.89 (0.980)
2.36 (0.093)
593002B03400G
29.97 (1.180)
2.36 (0.093)
ORDERING INFORMATION
Mounting Surface Temp
Rise Above Ambient—°C
100
Part Number
Grease
&
Epoxy
page112
Channel style heat sink featuring twisted fins
1000
20
80
16
60
12
40
8
20
4
0
0
0
2
593002
592902
4
6
Heat Dissipated—Watts
8
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
5929, 5930
Mounting
Kits
page 99
ø 3.18
(0.125)
THRU
"X"
"A"
17.78
(0.700)
10
0.81
(0.032)
1.90
(0.075)
4.27
(0.170)
10.16
(0.400)
23.93
(0.942)
12.70
(0.500)
Material: 1.27 (0.050) Thick Aluminum
Finish: Black Anodize
POPULAR OPTIONS: 59 _ _ 02B034 00G
A
Base part no.
Position
Code
A
05
Description
Location Details
4-40 male semiconductor mount 0.380 LG
Hole X
Page 90
For additional options see page 82
0
Air Velocity—Feet Per Minute
400
200
600
800
Channel style heat sink features three
integrated tabs for greater stability and
slotted mounting hole to accommodate a
variety of device lead lengths. Available in
two heights. Mounting tabs are designed
for either soldering (tin finish) or twisted.
ORDERING INFORMATION
29.97 (1.180)
Finish
Black anodize
80
8
60
6
40
4
20
2
0
0
0
2
563002
576602
4
6
Heat Dissipated—Watts
8
12.70
(0.500)
9.52
(0.375)
"A"
CL
17.78
(0.700)
10
Material: 1.27 (0.050) Thick Aluminum
Finish: See Table
3.10 (0.122)
29.97 (1.180)
Tin plated
3.10 (0.122)
24.13 (0.950)
Black anodize
3.10 (0.122)
576602D00000G
24.13 (0.950)
Tin plated
3.10 (0.122)
Grease
&
Epoxy
page112
Channel style heat sink with two integrated tabs
0
Air Velocity—Feet Per Minute
400
200
600
800
ORDERING INFORMATION
Finish
80
8
60
6
40
4
20
2
0
0
0
2
4
6
Heat Dissipated—Watts
8
9.52
(0.375)
Black anodize
3.10 (0.122)
575002D00000G
Tin plated
3.10 (0.122)
AMERICA
EUROPE
Mounting
Kits
page 99
12.70
(0.500)
25.40
(1.000)
1000
10
29.97
(1.180)
CL
10
3.81
(0.150)
Dia of PCB
Plated Thru
Hole for Tabs
575002B00000G
www.aavidthermalloy.com
Mounting Surface Temp
Rise Above Ambient—°C
100
Channel style heat sink features two
integrated tabs and slotted mounting
hole to accommodate a variety of device
lead lengths. Mounting tabs are designed
for either soldering (tin finish) or twisted.
8.89
(0.350)
2.54 TYP
(0.100)
Dia of PCB
Plated Thru
Hole for Tabs
576602B00000G
Part Number
3.81
(0.150)
Mounting
Kits
page 99
5.08
(0.200)
563002D00000G
5750
25.40
(1.000)
1000
10
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
563002B00000G
“A” Dim
Mounting Surface Temp
Rise Above Ambient—°C
100
Part Number
Grease
&
Epoxy
page112
Channel style heat sink featuring three integrated tabs
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
5630, 5766
THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
TO-220 Heat Sinks
17.78
(0.700)
5.08
(0.200)
10.16
(0.400)
2.54
(0.100)
Material: 1.27 (0.050) Thick Aluminum
Finish: See Table
USA Tel: +1 (603) 224-9988 email: [email protected]
Italy Tel: +39 051 764011 email: [email protected]
United Kingdom Tel: +44 1793 401400 email: [email protected]
ASIA
Singapore Tel: +65 6362 8388 email: [email protected]
Taiwan Tel: +886(2) 2698-9888 email: [email protected]
33
TO-220 Heat Sinks
Grease
&
Epoxy
page112
Channel style heat sink featuring recessed lower fins
Air Velocity—Feet Per Minute
400
200
600
800
1000
10
Mounting Surface Temp
Rise Above Ambient—°C
100
Channel style heat sink features
recessed lower fins to allow closer component spacing and longer upper fins for
maximum cooling. Includes two solderable
tabs for easy attachment to the PC card.
80
8
60
6
40
4
20
2
0
0
0
2
3
4
Heat Dissipated—Watts
Description
590102B03600G High performance heat sink with recessed lower fins
ø 3.96 x 9.53 SLOT
(0.156) (0.375)
CL
42.54
(1.675)
17.78
(0.700)
5
1.27
(0.050)
2.54
(0.100)
12.70
(0.500)
Dia of PCB
Plated Thru
Hole for Tabs
Mounting
Kits
page 99
25.40
(1.000)
23.50
(0.925)
5.08
(0.200)
ORDERING INFORMATION
Part Number
1
25.40
(1.000)
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
0
23.98
(0.944)
Material: 1.27 (0.050) Thick Aluminum
Finish: Black Anodize
2.92 (0.115)
For additional options see page 82
Grease
&
Epoxy
page112
Channel style heat sink featuring slotted mounting hole
0
Air Velocity—Feet Per Minute
400
200
600
800
1000
10
100
Channel style heat sink features slotted
mounting hole to accommodate a variety of
devices and lead lengths. Includes two solderable tabs for easy attachment to the PC card.
8
60
6
40
4
20
2
0
0
0
1
2
3
4
Heat Dissipated—Watts
Description
590302B03600G High performance heat sink with solderable tabs
ø 3.96 x 9.52
(0.156) (0.375)
42.54
(1.675)
17.78
(0.700)
5
2.54
(0.100)
5.08
(0.200)
Dia of PCB
Plated Thru
Hole for Tabs
ORDERING INFORMATION
Part Number
80
Mounting
Kits
page 99
12.70 CL
(0.500)
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
5903
Mounting Surface Temp
Rise Above Ambient—°C
THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
5901
0.81
(0.032)
11.43
(0.450)
24.89
(0.980)
2.92 (0.115)
Material: 1.27 (0.050) Thick Aluminum
Finish: Black Anodize
For additional options see page 82
Grease
&
Epoxy
page112
Slim low cost channel style heat sink
1000
20
80
16
60
12
40
8
Mounting Surface Temp
Rise Above Ambient—°C
Slim low cost channel style heat sink
is ideal where space and cost are limited.
Available in 3 fin heights with or without
solderable mounting tab.
Air Velocity—Feet Per Minute
400
600
800
100
0
20
4
0
0
0
577002
577102
577202
200
1
2
3
Heat Dissipated—Watts
4
"A"
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
5770, 5771, 5772
13.21
(0.520)
CL
Part Number
Description
577002B00000G
Slim, low cost channel style heat sink with no solderable tabs
6.35 (0.250)
“A” Dim
577002B04000G
With solderable tab
6.35 (0.250)
577102B00000G
Slim, low cost channel style heat sink with no solderable tabs
9.52 (0.375)
577102B04000G
With solderable tab
9.52 (0.375)
577202B00000G
Slim, low cost channel style heat sink with no solderable tabs
12.70 (0.500)
577202B04000G
With solderable tab
12.70 (0.500)
ø 3.81
(0.150) THRU
19.05
(0.750) 13.33
(0.525)
5
6.35
(0.250)
TAB
1.27
(0.050)
0.81
(0.032)
ORDERING INFORMATION
Mounting
Kits
page 99
10.67
(0.420)
Dia of PCB
Plated Thru
Hole for Tabs
1.73 (0.068)
1.73 (0.068)
Material: 1.27 (0.050) Thick Aluminum
Finish: Black Anodize
1.73 (0.068)
POPULAR OPTIONS: 577_ _02B 0 4000G
Base part no.
A
Position
Code
Description
Details
A
3
In-Sil-8TM pad
Page 86
For additional options see page 82
34
AMERICA
EUROPE
www.aavidthermalloy.com
USA Tel: +1 (603) 224-9988 email: [email protected]
Italy Tel: +39 051 764011 email: [email protected]
United Kingdom Tel: +44 1793 401400 email: [email protected]
ASIA
Singapore Tel: +65 6362 8388 email: [email protected]
Taiwan Tel: +886(2) 2698-9888 email: [email protected]
6109, 6110
Grease
&
Epoxy
page112
Low cost channel style heat sink featuring integrated alignment tabs
FIGURE A
FIGURE B
12.70
(0.500)
Mounting
Kits
page 99
25.40
(1.000)
AT BASE
ø 3.81
(0.150)
12.70
(0.500)
29.97
(1.180)
18.03
(0.710)
10.92
(0.430)
25.40
(1.000)
AT BASE
Description
Figure
6109PBG
Low cost channel heat sink with device locating tabs
A
6110PBG
Low cost channel heat sink with device locating tabs
B
0
* Edges cut during the manufacturing process will be unfinished.
See page 110 for more information
A
G
Code
Description
Details
Solderable mounting tabs
Page 93
40
8
20
4
0
0
0
1
2
3
Heat Dissipated—Watts
Mounting Surface Temp
Rise Above Ambient—°C
Copper narrow channel style heat sink
includes a single integrated tab to allow
easy attachment to the PC board. Tin plated
finish ensures easy solderability.
Air Velocity—Feet Per Minute
400
600
800
100
1000
10
80
8
60
6
40
4
200
20
2
0
0
0.0
0.4
0.8
1.2
1.6
Heat Dissipated—Watts
4
5
Grease
&
Epoxy
page112
Copper narrow channel style heat sink with a single integrated tab
0
13.21
(0.520)
AT BASE
CL
ø 3.81
(0.150)
19.05
(0.750) 13.34
(0.525)
Mounting
Kits
page 99
6.60
(0.260)
3.81
(0.150)
3.81
(0.150)
2.0
6.35
(0.250)
9.52
(0.375)
1.27
(0.050)
Dia of PCB
Plated Thru
Hole for Tabs
ORDERING INFORMATION
Part Number
Description
7178DG
Narrow channel copper heat sink
7136, 7139
12
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
7178
16
60
6109
6110
For additional options see page 85
1000
20
80
A
MT
Air Velocity—Feet Per Minute
400
600
800
Material: 0.63 (0.025) Thick Copper
Finish: Tin Plated
2.54 (0.100)
Copper channel style slide on heat sink featuring integrated mounting clip
FIGURE A
21.54
(0.848)
2x 2.79
(0.110)
17.78
(0.700)
19.81
(0.780)
2x 1.27
(0.050)
4.19
(0.165)
2x 1.27
(0.050)
Copper channel style slide on heat
sink features integrated mounting
clip for easy no hardware attachment to the device. Also includes
solderable mounting tabs for easy
attachment to the PC board.
16.51
14.86 (0.650)
(0.580)
13.08
(0.515)
13.08
(0.515)
2.79
(0.110)
2.03
(0.080)
13.21
(0.520)
13.21
(0.520)
Material: 0.63 (0.025) Thick Copper
Finish: Tin Plated
0
200
Air Velocity—Feet Per Minute
400
600
800
Part Number
Description
Figure
Dia of PCB
Plated Thru
Hole for Tabs
7136DG
Vertical mount
A
2.54 (0.100)
7139DG
Horizontal mount
B
2.54 (0.100)
Mounting Surface Temp
Rise Above Ambient—°C
100
ORDERING INFORMATION
AMERICA
EUROPE
USA Tel: +1 (603) 224-9988 email: [email protected]
Italy Tel: +39 051 764011 email: [email protected]
United Kingdom Tel: +44 1793 401400 email: [email protected]
ASIA
1000
20
80
16
60
12
40
8
20
4
0
0
0
7136
7139
www.aavidthermalloy.com
Top is cut away
to show detail
FIGURE B
1
2
3
Heat Dissipated—Watts
4
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
Position
200
ø 3.81
(0.150)
CL
100
Mounting Surface Temp
Rise Above Ambient—°C
Part Number
Base part no.
10.92
(0.430)
Material: 1.27 (0.050) Thick Aluminum
Finish: Pre-Black Anodize*
ORDERING INFORMATION
POPULAR OPTIONS: 61_ _PB -
8.89
(0.350)
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
11.68
(0.460)
Low cost channel style heat sink features
integrated alignment tabs to prevent the
device from rotating while applying torque
to the mounting hardware. Available in two
lengths with a pre-black anodized finish.
5.72
(0.225)
8.89
(0.350)
THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
TO-220 Heat Sinks
5
Singapore Tel: +65 6362 8388 email: [email protected]
Taiwan Tel: +886(2) 2698-9888 email: [email protected]
35
TO-220 Heat Sinks
Copper channel style heat sink with integrated clip
1000
10
80
8
60
6
40
4
20
2
0
Copper channel style heat sink with
integrated clip and locking tab for
secure attachment to the device. Narrow
profile uses less board space. Includes
tin plated solderable tabs for easy
attachment to the printed circuit card.
Top is cut
away to
show detail
Thermal Resistance From
Case to Ambient—°C/Watt
Air Velocity—Feet Per Minute
400
200
600
800
100
0
Case Temp Rise
Rise Above Ambient—°C
27.94
(1.100)
1
2
3
4
Heat Dissipated—Watts
1.27
(0.050)
2.79–3.43
(0.110–0.135)
20.32
(0.800)
0
0
6.12
(0.241)
10.80 1.68
(0.425) (0.066)
1.07
(0.042)
1.27
(0.050)
5
22.00
(0.866)
4.47
(0.176)
5.31
(0.209)
9.52
(0.375)
Material: 0.63 (0.025) Thick Copper
Finish: Tin Plated
Dia of PCB
Plated Thru
Hole for Tabs
ORDERING INFORMATION
Part Number
Description
7128DG
Slide on channel heat sink with integrated clip and locking tabs
6038
Channel style heat sink with integrated clip
0
2.92 (0.115)
Air Velocity—Feet Per Minute
400
200
600
800
Mounting Surface Temp
Rise Above Ambient—°C
100
Channel style heat sink with
integrated clip and locking tab
for secure attachment to the device.
Tabs can be bent for mounting.
2.54
(0.100)
1000
10
80
8
60
6
40
4
20
2
0
0
0
1
2
3
4
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
7128
5
29.97
(1.180)
31.24
(1.230)
18.29
(0.720)
6.35
(0.250)
16.51
(0.650)
2.54
(0.100)
8.26
(0.325)
5.89
(0.232)
10.16
(0.400)
12.70
(0.500)
ORDERING INFORMATION
Part Number
Description
6038BG
Slide on channel heat sink with integrated clip and locking tabs
3.81 (0.150)
0
Air Velocity—Feet Per Minute
400
200
600
800
Case Temp Rise
Above Ambient—°C
100
Narrow channel style heat sink with
integrated clip and locking tab for
secure attachment to the device.
Device can be mounted horizontally
using a single center tab that can be
soldered directly to the PC board.
1000
10
8
60
6
40
4
20
2
0
1
2
3
Heat Dissipated—Watts
4
14.86 16.51
(0.585) (0.650)
19.81
(0.780)
2.54
(0.100)
CL
0
0
13.08
(0.515)
5
0.64
(0.025)
2.79
(0.110)
13.21
(0.520)
Material: 0.63 (0.025) Thick Copper
Finish: Tin Plated
Dia of PCB
Plated Thru
Hole for Tabs
Part Number
Description
7142DG
Slide on narrow channel heat sink with integrated clip and locking tabs
AMERICA
EUROPE
www.aavidthermalloy.com
Top is cut
away to
show detail
80
ORDERING INFORMATION
36
Material: 0.81(0.032) Thick Aluminum
Finish: Black Anodize
Narrow channel style heat sink with integrated clip
Thermal Resistance From
Case to Ambient—°C/Watt
7142
11.43
(0.450)
25.40
(1.000)
AT BASE
Dia of PCB
Plated Thru
Hole for Tabs
3.18 (0.125)
USA Tel: +1 (603) 224-9988 email: [email protected]
Italy Tel: +39 051 764011 email: [email protected]
United Kingdom Tel: +44 1793 401400 email: [email protected]
ASIA
Singapore Tel: +65 6362 8388 email: [email protected]
Taiwan Tel: +886(2) 2698-9888 email: [email protected]
TO-220 Heat Sinks
Channel style heat sink with integrated clip
B
THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
6238, 6239
1.90
(0.075)
5.08
(0.200)
8.00
(0.315)
2.67
(0.105)
10.80
(0.425)
TAB
SECTION B-B
3.17
(0.125)
2.02
(0.080)
Channel style heat sink with
integrated clip features strong
spring tension and device locking tab to attach device securely
to the heat sink. Available with
solderable tabs for vertical
mount or without tabs for
mounting horizontally.
19.05
(0.750)
"A"
24.38
(0.960)
B
16.51
(0.650)
15.49
(0.610)
Material: 1.02 (0.040) Thick Aluminum
Finish: Black Anodize
25.53
(1.005)
AT BASE
200
Air Velocity—Feet Per Minute
400
600
800
“A” Dim
Dia of PCB
Plated Thru
Hole for Tabs
With solderable mounting tabs
10.16 (0.400)
2.90 (0.114)
With solderable mounting tabs
6.99 (0.275)
2.90 (0.114)
ORDERING INFORMATION
Part Number
Description
6238BG
Channel heat sink with integral clip, no solderable tab
6238B-MTG
6239B-MTG
Mounting Surface Temp
Rise Above Ambient—°C
100
80
8
60
6
40
4
20
2
0
0
0
For additional options see page 85
1
2
3
4
Heat Dissipated—Watts
FIGURE A
CLIP 53
17.78
(0.700)
CL
3.96
(0.156)
3.17
(0.125)
14.12
(0.556)
“A”
9.78
(0.385)
29.97
(1.180)
0.762 (0.063)
(0.030)
9.27
(0.365)
12.70
(0.500)
Dia of PCB
Plated Thru
Hole for Tabs
With Shur-Lock tabs and clip
A
Dia 3.05(0.120) x 0.64(0.025) High Dittin
2.39 (0.094)
With solderable mounting tabs and clip
B
Dia 3.05(0.120) x 0.64(0.025) High Dittin
2.39 (0.094)
534265B02853G
With Shur-Lock tabs and clip
A
No Dittin
2.39 (0.094)
534265B03453G
With solderable mounting tabs and clip
B
No Dittin
2.39 (0.094)
534202B03453G
TM
TM
For additional options see page 82
0
www.aavidthermalloy.com
1.90
(0.075)
USA Tel: +1 (603) 224-9988 email: [email protected]
Italy Tel: +39 051 764011 email: [email protected]
United Kingdom Tel: +44 1793 401400 email: [email protected]
ASIA
Air Velocity—Feet Per Minute
400
200
600
800
100
10.16
(0.400)
12.70
(0.500)
1000
10
80
8
60
6
40
4
20
2
0
0
0
AMERICA
EUROPE
29.97
(1.180)
9.78
(0.385)
Material: 1.27 (0.050) Thick Aluminum
Finish: Black Anodize
“A” Dim
534202B02853G
“A”
0.81
(0.032)
23.93
(0.942)
4.27
(0.170)
Figure
Description
CL
17.78
(0.700)
1.60
22.35
(0.880)
3.12
(0.123)
ORDERING INFORMATION
Part Number
25.40
(1.000)
12.06
(0.475)
2
4
6
8
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
Channel style heat sink features
a dittin to locate the device and
a convenient clip to eliminate the
need for mounting hardware. The
twisted fins increase cooling efficiency. Available in two solderable
mounting tab styles. Can be ordered
without the ditton if electrical isolation is required or for mounting
tabless packages.
Mounting
Kits
page 99
FIGURE B
13.84
(0.545)
25.40
(1.000)
14.12
(0.556)
5
Grease
&
Epoxy
page112
Channel style heat sink with convenient clip
Mounting Surface Temp
Rise Above Ambient—°C
5342
1000
10
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
0
10
Singapore Tel: +65 6362 8388 email: [email protected]
Taiwan Tel: +886(2) 2698-9888 email: [email protected]
37
TO-220 Heat Sinks
Copper narrow channel style heat sink with integrated clip
80
8
60
6
40
4
Case Temp Rise
Above Ambient—°C
2
0
0
0
1
2
3
Heat Dissipated—Watts
4
16.51
(0.650)
3.05
(0.120)
5.72
(0.225)
5
Dia of PCB
Plated Thru
Hole for Tabs
ORDERING INFORMATION
Description
7141DG
Narrow channel heat sink with integrated clip
13.21
(0.520)
2.77 (0.109)
Material: 0.63 (0.025) Thick Copper
Finish: Tin Plated
Grease
&
Epoxy
page112
Economy, narrow base, low profile channel style heat sink
100
80
16
60
12
40
8
20
4
0
0
0
1
2
3
Heat Dissipated—Watts
4
"X"
19.05
(0.750)
13.34
(0.525)
9.52
CL (0.375)
5
9.65
(0.380)
Material: 1.27 (0.050) Thick Aluminum
Finish: See Table
ORDERING INFORMATION
Part Number
Mounting
Kits
page 99
19.05
(0.750)
ø 3.81
(0.150)
THRU
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
Air Velocity—Feet Per Minute
400
200
600
800
1000
20
0
Economy, narrow base, low profile
channel style heat sink is perfect for use
on printed circuit boards with 0.500 inch
centering. When mounted horizontally, the
total height of the heat sink is just 0.380.
2.54
(0.100)
MAX
1.27
(0.050)
3.81
(0.150)
13.08
(0.515)
Part Number
5073
20
19.81
(0.780)
Thermal Resistance From
Case to Ambient—°C/Watt
1000
10
0
Copper narrow channel style heat
sink with integrated clip and locking
tab for secure attachment to the device.
Single center tab can be soldered
directly to the PC board.
Top is cut
away to
show detail
Air Velocity—Feet Per Minute
400
200
600
800
100
Mounting Surface Temp
Rise Above Ambient—°C
THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
7141
Finish
507302B00000G
Black anodize
507302J00000G
Pre-black anodize*
* Edges cut during the manufacturing process will be unfinished. See page 110 for more information
POPULAR OPTIONS: 507302 _ 000 00G
Base part no.
Position
Code
A
09
A
Description
Stud 4–40 x 0.350 LG
Location
Details
Hole X
Page 96
For additional options see page 82
5041, 5042
Grease
&
Epoxy
page112
Economy, narrow base, low profile channel style heat sink
ø 3.66 THRU
(0.144)
FIGURE A
Mounting
Kits
page 99
ø 3.66 THRU TYP 2
(0.144)
FIGURE B
"X"
17.80
(0.700)
"X"
13.46
(0.530)
"X"
19.81
(0.780)
9.91
(0.390)
13.47
(0.530)
Economy, narrow base, low profile
channel style heat sink is perfect for
use on printed circuit boards with tight
component spacing. Models are available
for single and dual device mounting.
0
100
Economy, narrow base channel style heat sink
A
504222B00000G
For dual devices
B
Mounting Surface Temp
Rise Above Ambient—°C
Figure
504102B00000G
POPULAR OPTIONS: 504_ _2B0 00 00G
Position
Code
A
01
A
Description
6-32 Wave On threaded insert 0.100 stand off
Location
Details
Hole X
Page 89
AMERICA
EUROPE
www.aavidthermalloy.com
USA Tel: +1 (603) 224-9988 email: [email protected]
Italy Tel: +39 051 764011 email: [email protected]
United Kingdom Tel: +44 1793 401400 email: [email protected]
ASIA
1000
10
80
8
60
6
40
4
20
2
0
0
0
504102
504222
For additional options see page 82
38
Air Velocity—Feet Per Minute
400
200
600
800
2
4
6
Heat Dissipated—Watts
8
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
19.80
(0.780)
Description
Base part no.
21.59
(0.850)
36.83
(1.450)
Material: 1.02 (0.040) Thick Aluminum
Finish: Black Anodize
ORDERING INFORMATION
Part Number
13.47
(0.530)
21.60
(0.850)
10
Singapore Tel: +65 6362 8388 email: [email protected]
Taiwan Tel: +886(2) 2698-9888 email: [email protected]
Grease
&
Epoxy
page112
Narrow channel style heat sink features twisted fins
0
Air Velocity—Feet Per Minute
400
200
600
800
Mounting Surface Temp
Rise Above Ambient—°C
100
1000
10
80
8
60
6
40
4
20
2
0
0
0
2
4
6
Heat Dissipated—Watts
8
Mounting
Kits
page 99
4.00
(0.158)
2X THRU
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
TV40
CL
13.00
(0.512)
6.00
(0.236)
28.00
(1.103)
10
22.00
(0.866)
Narrow channel style heat
sink features twisted fins
for increased air turbulence
and better cooling. Mounts
horizontally to accommodate
two TO-220 devices.
38.00
(1.497)
Material: 0.81 (0.032) Thick Aluminum
Finish: Black Anodize
ORDERING INFORMATION
Part Number
Description
TV40G
Narrow channel style heat sink with twisted fins
Grease
&
Epoxy
page112
Copper channel style heat sink featuring two integrated tabs
0
200
Air Velocity—Feet Per Minute
400
600
800
Copper channel style heat sink
features two integrated tabs.
The heat sink is tin plated and
can be soldered to the PC board.
80
8
60
6
40
4
20
2
0
0
0
1
2
3
4
Heat Dissipated—Watts
Description
7173DG
Copper channel style heat sink
Mounting
Kits
page 99
ø 3.81
(0.150) THRU
19.05
(0.750) 13.34
3.81
6.35 (0.150)
(0.250)
(0.525)
3.81
(0.150)
1.27
(0.050)
19.05
(0.750)
5
9.52
(0.375)
Dia of PCB
Plated Thru
Hole for Tabs
ORDERING INFORMATION
Part Number
6236
Mounting Surface Temp
Rise Above Ambient—°C
100
1000
10
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
7173
THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
TO-220 Heat Sinks
4.11
(0.162)
Material: 0.63 (0.025) Thick Copper
Finish: Tin Plated
2.54 (0.100)
Channel style heat sink featuring an integrated device retaining clip
Locking Catch
1000
20
80
16
60
12
40
8
20
4
Mounting Surface Temp
Rise Above Ambient—°C
0
0
0
2
4
6
8
Heat Dissipated—Watts
Top is cut away
to show detail
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
100
0
Channel style heat sink features
an integrated device retaining clip
that eliminates the need for attachment
hardware. Available in two finish options.
Air Velocity—Feet Per Minute
400
200
600
800
17.78
(0.700)
2.54
(0.100)
CL
12.95
(0.510)
10
13.21
(0.520)
ORDERING INFORMATION
Part Number
14.22
(0.560)
Finish
6236BG
Black anodize
6236PBG
Pre-black anodize*
Material: 1.02 (0.040) Thick Aluminum
Finish: See Table
* Edges cut during the manufacturing process will be unfinished.
See page 110 for more information.
AMERICA
EUROPE
www.aavidthermalloy.com
USA Tel: +1 (603) 224-9988 email: [email protected]
Italy Tel: +39 051 764011 email: [email protected]
United Kingdom Tel: +44 1793 401400 email: [email protected]
ASIA
Singapore Tel: +65 6362 8388 email: [email protected]
Taiwan Tel: +886(2) 2698-9888 email: [email protected]
39
TO-220 Heat Sinks
Grease
&
Epoxy
page112
Channel style heat sink with wide mounting surface
FIGURE A
FIGURE B
ø 3.81
(0.150)
THRU
CL
29.97 "B"
(1.180)
"A"
"B"
Lightweight, low cost channel style
heat sink with wide mounting surface
and selection of lengths to accept a
variety of packages. Models accomodate
one or two devices.
"A"
12.70
(0.500)
"C"
25.40
(1.000)
AT BASE
ORDERING INFORMATION
Figure
“A” Dim
“B” Dim
530613B00000G
B
12.19 (0.480)
10.16 (0.400)
“C” Dim
530614B00000G
A
29.97 (1.180)
11.68 (0.460)
12.70 (0.500)
530714B00000G
A
18.03 (0.710)
12.32 (0.485)
12.70 (0.500)
25.40
(1.000)
AT BASE
Material: 1.27 (0.050) Thick Aluminum
Finish: Black Anodize
576012B00000G
A
22.86 (0.900)
11.43 (0.450)
9.65 (0.380)
576014B00000G
A
22.86 (0.900)
8.13 (0.320)
9.65 (0.380)
Air Velocity—Feet Per Minute
400
200
600
800
0
100
For additional options see page 82
1000
10
80
8
60
6
40
4
20
2
0
0
0
1
2
3
Heat Dissipated—Watts
4
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
Part Number
Mounting
Kits
page 99
ø 3.81
(0.150)
THRU 2X
CL
Mounting Surface Temp
Rise Above Ambient—°C
THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
5306, 5307, 5760
5
576012, 530714 or 576014
530613 or 530614
5779, 5786
Grease
&
Epoxy
page112
Twin channel style heat sink
FIGURE A
FIGURE B
9.65
(0.380)
TYP 2
25.40
19.30
(1.000)
(0.760)
19.30 26.16
(1.030)
(0.760)
2.54
(0.100)
35.56
(1.400)
37.59
(1.480)
5.08
(0.200)
37.59
(1.480)
12.70
(0.500)
ø 3.81 THRU
(0.150) TYP 2
ø 3.81 THRU
(0.150) TYP 2
30.15
(1.187)
Twin channel style heat sink
vertically mounts two TO-220 devices
to a single heat sink. Center fins
increase cooling capacity. Available
with integrated twist tabs or staked
on solder tabs for easy attachment
to the PC board.
Mounting
Kits
page 99
9.65
(0.380)
TYP 2
1.57
(0.062)
5.59
(0.220)
12.70
(0.500)
12.70
(0.500)
15.49
(0.610)
TYP 2
14.99
(0.590)
Twin channel style heat sink with integrated tabs
A
3.10 (0.122)
With staked on solderable tabs
B
1.91 (0.075)
Part Number
Description
577922B00000G
578622B03200G
0
For additional options see page 82
AMERICA
EUROPE
www.aavidthermalloy.com
USA Tel: +1 (603) 224-9988 email: [email protected]
Italy Tel: +39 051 764011 email: [email protected]
United Kingdom Tel: +44 1793 401400 email: [email protected]
Air Velocity—Feet Per Minute
400
600
800
ASIA
1000
10
80
8
60
6
40
4
20
2
0
0
0
40
200
100
Mounting Surface Temp
Rise Above Ambient—°C
Figure
Dia of PCB
Plated Thru
Hole for Tabs
ORDERING INFORMATION
1
2
3
4
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
Material: 1.27 (0.050) Thick Aluminum
Finish: Black Anodize
5
Singapore Tel: +65 6362 8388 email: [email protected]
Taiwan Tel: +886(2) 2698-9888 email: [email protected]
3.43
(0.135)
Grease
&
Epoxy
page112
5069, 5070, 5071, 5072 Hat section style heat sink
FIGURE A
FIGURE B
ø 3.66
(0.144)
THRU
17.78
(0.700) 13.46
(0.530)
Mounting
Kits
page 99
ø 3.66
(0.144)
THRU TYP 2
CL
37.34
(1.470)
10.16
(0.400)
CL
13.59
(0.535)
"A"
Hat section style heat sinks are low
profile and perfect for use on printed
circuit cards with 0.500 inch centering
between boards. For higher power
applications the 5071 hat can be added
to the 5070 or 5072 for double sided
cooling of a TO-220 device.
17.78
(0.700)
17.78
(0.700)
9.52
(0.375)
9.52
(0.375)
44.45
(1.750)
Material: 1.02 (0.040) Thick Aluminum
Finish: Black Anodize
FIGURE C
44.45
(1.750)
10.67
(0.420)
10.29
(0.405)
ORDERING INFORMATION
Part Number
Description
Figure
“A” Dim
506902B00000G
Hat section heat sink
A
31.75 (1.250)
507002B00000G
Wide hat section heat sink
A
44.45 (1.750)
507102B00000G
Hat section heat sink with cut out
C
507222B00000G
Dual device hat section heat sink
B
13.46
(0.530)
17.78
(0.700)
ø 3.66
(0.144)
12.70
(0.500)
12.70
(0.500)
POPULAR OPTIONS: 50_ _ _2B 0 0000G
Description
Details
Kon DuxTM pad
Page 86
0
Air Velocity—Feet Per Minute
400
200
600
800
100
Mounting Surface Temp
Rise Above Ambient—°C
For additional options see page 82
80
8
60
6
40
4
20
2
0
0
0
2
4
6
Heat Dissipated—Watts
507222
507222 with 507102 attached
7137, 7140
1000
10
8
0
Air Velocity—Feet Per Minute
400
200
600
800
100
Mounting Surface Temp
Rise Above Ambient—°C
1
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
Code
A
1000
10
80
8
60
6
40
4
20
2
0
0
0
10
1
506902
2
3
Heat Dissipated—Watts
4
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
A
Base part no.
Position
THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
TO-220 Heat Sinks
5
507102
507002
Copper, hat section, slide on heat sink
FIGURE A
FIGURE B
Top is cut away
to show detail
22.86
(0.900)
Copper, hat section, slide on heat sink
features integrated mounting clip
for easy no hardware attachment to
the device. Also included are solderable
mounting tabs for easy attachment
to the PC card.
17.78
(0.700)
19.05
(0.750)
22.86
(0.900)
2.54
(0.100)
9.52
(0.375)
9.52
(0.375)
13.21
(0.520)
13.21
(0.520)
Material: 0.63 (0.025) Thick Copper
Finish: Tin Plated
Description
Figure
Dia of PCB
Plated Thru
Hole for Tabs
7137DG
Vertical mount
A
2.54 (0.100)
7140DG
Horizontal mount
B
2.54 (0.100)
www.aavidthermalloy.com
USA Tel: +1 (603) 224-9988 email: [email protected]
Italy Tel: +39 051 764011 email: [email protected]
United Kingdom Tel: +44 1793 401400 email: [email protected]
ASIA
1000
10
80
8
60
6
40
4
20
2
0
0
0
AMERICA
EUROPE
Air Velocity—Feet Per Minute
400
200
600
800
100
Mounting Surface Temp
Rise Above Ambient—°C
Part Number
3.05
(0.120)
1.57
(0.062)
0
ORDERING INFORMATION
11.05
(0.435)
1
2
3
4
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
21.54
(0.848)
5
Singapore Tel: +65 6362 8388 email: [email protected]
Taiwan Tel: +886(2) 2698-9888 email: [email protected]
41
TO-220 Heat Sinks
Hat section style heat sink featuring an integrated clip
200
Air Velocity—Feet Per Minute
400
600
800
100
Hat section style heat sink
features an integrated clip
for secure attachment to the
device without added hardware. Available in two finishes.
1000
20
80
16
60
12
40
8
20
4
0
0
0
2
4
6
8
Heat Dissipated—Watts
Top is cut away
to show detail
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
0
Mounting Surface Temp
Rise Above Ambient—°C
17.78
(0.700)
14.22
(0.560)
10
2.54
(0.100)
22.86
(0.900)
9.52
(0.375)
13.21
(0.520)
Material: 1.02 (0.040) Thick Aluminum
Finish: See Table
ORDERING INFORMATION
Part Number
Finish
6237BG
Black anodize
6237PBG
Pre-black anodize*
* Edges cut during the manufacturing process will be unfinished.
See page 110 for more information
5690
Grease
&
Epoxy
page112
High power, square basket heat sink with folded back fins
0
200
Air Velocity—Feet Per Minute
400
600
800
1000
Mounting Surface Temp
Rise Above Ambient—°C
100
5
80
4
60
3
40
2
20
1
0
0
0
4
8
12
16
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
6237
33.27
(1.310)
@ BASE
CL 1
"X"
6.35
(0.25)
REF
2.41
(0.095)
4.83
(0.190)
ORDERING INFORMATION
CL2
Description
High power, square basket, folded back fin heat sink
R 1.98
(0.078)
TYP 6
Base part no.
Code
A
01
11.18
(0.440)
33.27
(1.31) REF
1.78 TYP 2
(0.070)
ø 3.56
(0.140) TYP 2
DETAIL-A
Material: 1.60 (0.063) Thick Aluminum
Finish: Black Anodize
POPULAR OPTIONS: 569022B0 00 00G
Position
46.48 SQ.
(1.83) REF
15.49
(0.61)
REF
4.19 TYP 2
(0.165)
CL1
14.73 TYP 2
(0.580)
569022B00000G
27.69
(1.09)
REF
CL 2
20
High power, square basket heat sink
accommodates two TO-220 devices.
Features folded back fins for increased
surface area for maximum cooling.
Part Number
ø 3.66 THRU
(0.144) TYP 8
SEE DETAIL "A"
"X"
Mounting
Kits
page 99
A
Description
6–32 Wave On threaded insert, 0.100 stand off 0.062 Bd
Location
Details
Hole X
Page 89
For additional options see page 82
42
AMERICA
EUROPE
www.aavidthermalloy.com
USA Tel: +1 (603) 224-9988 email: [email protected]
Italy Tel: +39 051 764011 email: [email protected]
United Kingdom Tel: +44 1793 401400 email: [email protected]
ASIA
Singapore Tel: +65 6362 8388 email: [email protected]
Taiwan Tel: +886(2) 2698-9888 email: [email protected]
Clip on style heat sink featuring an integrated clip
FIGURE A
FIGURE B
ø 3.18 LOCKING CATCH
(0.125)
ø 3.18 LOCKING CATCH
(0.125)
22.86
(0.900)
5.97
(0.240)
13.56
(0.530)
0.50
(0.020)
25.15
(0.990)
TAB
Clip on style heat sink features
an integrated clip to retain the
device meaning no mounting
hardware is required. Models
have fins on both sides, left or
right side and are available with
solderable tabs for easy attachment to the PC board.
25.91
(1.020)
9.52
(0.380)
10.67
(0.420)
Description
Figure
574802B00000G
Clip on heat sink, left & right side fins, no solderable tabs
A
574802B03300G
Left & right side fins with solderable tabs
A
579802B00000G
Left side fin, no solderable tabs
B
579802B03300G
Left side fin with solderable tab
B
579902B00000G
Right side fin, no solderable tabs
B
579902B03300G
Right side fin with solderable tab
B
1.57
(0.062)
5.08
(0.200)
10.67
(0.420)
Dia of PCB
Plated Thru
Hole for Tabs
Note: Fins on left or right. Right hand side model shown
0
200
Air Velocity—Feet Per Minute
400
600
800
100
Mounting Surface Temp
Rise Above Ambient—°C
Part Number
9.52
(0.375)
19.05
(0.750)
Material: 0.63 (0.025) Thick Aluminum
Finish: Black Anodize
ORDERING INFORMATION
1.91 (0.075)
1.91 (0.075)
1.91 (0.075)
1000
20
80
16
60
12
40
8
20
4
0
0
0
For additional options see page 82
1
574802
579902
579802
2
3
4
Heat Dissipated—Watts
5
Low cost, clip on style heat sink featuring a locking tab
0
200
Air Velocity—Feet Per Minute
400
600
800
Mounting Surface Temp
Rise Above Ambient—°C
100
Low cost, clip on style heat sink
features a locking tab to prevent
the device from dislodging from
the heat sink. Also includes slide
runners to ensure proper device
alignment. Available in a pre-black
anodize finish.
"B"
1000
20
80
16
60
12
40
8
20
4
0
0
0
1
6094
6049
6043
2
3
Heat Dissipated—Watts
4
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
6043, 6049, 6094
0.51
(0.020)
TAB
1.57
(0.062)
5.08
(0.200)
10.67
(0.420)
22.86
(0.900)
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
5748, 5798, 5799
THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
TO-220 Heat Sinks
"D"
"C"
"A"
5
"E"
Material: 0.63 (0.025) Thick Aluminum
Finish: Pre-Black Anodize*
ORDERING INFORMATION
Part Number
“A” Dim
“B” Dim
“C” Dim
“D” Dim
“E” Dim
6043PBG
25.40 (1.000)
16.51 (0.650)
10.16 (0.400)
20.32 (0.800)
6.81 (0.268)
6049PBG
25.40 (1.000)
16.51 (0.650)
10.16 (0.400)
13.97 (0.550)
6.81 (0.268)
6094PBG
19.71 (0.776)
14.73 (0.580)
10.92 (0.430)
20.32 (0.800)
6.45 (0.254)
*Edges cut during the manufacturing process will be unfinished.
See page 110 for more information
AMERICA
EUROPE
www.aavidthermalloy.com
USA Tel: +1 (603) 224-9988 email: [email protected]
Italy Tel: +39 051 764011 email: [email protected]
United Kingdom Tel: +44 1793 401400 email: [email protected]
ASIA
Singapore Tel: +65 6362 8388 email: [email protected]
Taiwan Tel: +886(2) 2698-9888 email: [email protected]
43
TO-220 Heat Sinks
0
Air Velocity—Feet Per Minute
400
200
600
800
Mounting Surface Temp
Rise Above Ambient—°C
100
Slip on heat sink is tin plated and has
integrated tabs for soldering to the PC
board. Locating features provide simple
device alignment and spring action holds
the device for good thermal contact.
1000
20
80
16
60
12
40
8
20
4
0
0
0
1
PF750
PF758
2
3
Heat Dissipated—Watts
4
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
Slip on heat sink featuring integrated tabs
22.00
(0.866)
9.50
(0.374)
"B"
5
"A"
11.00
(0.433)
1.70
(0.067)
11.00
(0.433)
ORDERING INFORMATION
Part Number
Description
“A” Dim
“B” Dim
PF750G
Slip on heat sink with tabs
19.00(0.748)
3.00(0.118)
PF758G
Slip on heat sink with tabs
24.00(0.945)
5.20(0.205)
Material: 0.71 (0.028) Thick Aluminum
Finish: Tin Plate
Slip on heat sink
Air Velocity—Feet Per Minute
400
200
600
800
100
1000
20
80
16
0
60
12
40
8
20
4
0
Slip on heat sink has locating features
for simple device alignment. Spring action
holds the device for good thermal contact.
0
0
1
2
3
Heat Dissipated—Watts
4
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
PF752
Mounting Surface Temp
Rise Above Ambient—°C
THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
PF750, PF758
19.00
(0.748)
22.00
(0.866)
5.00
(0.197)
11.00
(0.433)
3.00
(0.118)
10.70
(0.421)
15.00
(0.590)
5
Material: 0.71 (0.028) Thick Aluminum
Finish: Black Anodize
ORDERING INFORMATION
Part Number
Description
PF752G
Slip on heat sink
PF720, PF723
Slip on heat sink
Mounting Surface Temp
Rise Above Ambient—°C
100
8.10
(0.319)
80
DIA 3.00
(0.118)
60
40
20.00
(0.787)
16.00
(0.630)
20
4.50
(0.177)
0
0
Slip on heat sink has locating features
for simple device alignment. Spring
action holds the device for good thermal
contact. Available with or without solderable mounting tabs
3.00
(0.118)
19.84
(0.781)
1
2
3
Heat Dissipated – Watts
4
5
TAB
2.10
(0.083)
10.80
(0.425)
18.30
(0.720)
1.30
(0.051)
Material: 0.71 (0.028) Thick Aluminum
Finish: Pre-Black Paint*
ORDERING INFORMATION
Part Number
Description
PF720G
Slip on heat sink, no solderable tabs
PF723G
With solderable tabs
* Edges cut during manufacturing process will be unfinished
44
AMERICA
EUROPE
www.aavidthermalloy.com
USA Tel: +1 (603) 224-9988 email: [email protected]
Italy Tel: +39 051 764011 email: [email protected]
United Kingdom Tel: +44 1793 401400 email: [email protected]
ASIA
Singapore Tel: +65 6362 8388 email: [email protected]
Taiwan Tel: +886(2) 2698-9888 email: [email protected]
5744, 5745, 5746, 5749
Low cost, labor saving, slide on heat sink featuring spring action
FIGURE A
FIGURE B
HOLDING TABS
21.08
(0.830)
HOLDING TABS
3.18
(0.125)
9.02
(0.355)
4.19
(0.165)
21.84
(0.860)
9.02
(0.355)
21.84
(0.860)
DITTIN
ø 3.81
(0.150)
DITTIN
"A"
Low cost, labor saving, slide on
heat sink features spring action
to firmly hold the device tab to the
heat sink providing maximum metal
to metal contact and good thermal
conduction. Available with solderable tabs for horizontal or vertical
mounting to the PC board.
"A"
14.99 10.03
(0.590) (0.395)
11.81 14.99
(0.465) (0.590)
1.57
(0.062)
11.81
(0.465)
9.52
(0.375)
9.52
(0.375)
TAB
Figure
“A” Dim
574402B00000G
574402B03200G
Low cost slide on heat sink, no solderable tabs
A
19.05 (0.750)
With solderable tabs for horizontal mounting
A
19.05 (0.750)
Low cost slide on heat sink, no solderable tabs
B
19.05 (0.750)
574502B03300G
With solderable tabs for vertical mounting
B
19.05 (0.750)
574602B00000G
Low cost slide on heat sink , no solderable tabs
B
17.53 (0.690)
574602B03300G
With solderable tabs for vertical mounting
B
17.53 (0.690)
574902B00000G
Low cost slide on heat sink , no solderable tabs
B
35.05 (1.380)
574902B03300G
With solderable tabs for vertical mounting
B
35.05 (1.380)
1.91 (0.075)
1.91 (0.075)
80
16
60
12
40
8
20
4
0
0
0
1
0
200
574402
574502
1.91 (0.075)
1.91 (0.075)
For additional options see page 82
Air Velocity—Feet Per Minute
400
600
800
16
12
40
8
20
4
0
0
1
2
3
Heat Dissipated—Watts
Mounting Surface Temp
Rise Above Ambient—°C
Low cost, labor saving, slide on heat sink
features spring action to firmly hold the device
tab to the heat sink providing maximum metal
to metal contact and good thermal conduction.
Includes a clearance hole in the top side to allow
the use of optional hardware to attach device
and heat sink to circuit board or other surface.
Also available with solderable tabs for vertical
mounting to the PC board.
1000
20
80
16
60
12
40
8
20
4
0
0
0
1
2
3
4
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
Air Velocity—Feet Per Minute
400
200
600
800
Part Number
Description
574102B00000G
Low cost slide on heat sink, no solderable tabs
574102B03300G
With solderable tabs
5
9.02
(0.355)
21.84
(0.860)
7.62
(0.300)
CLEARANCE
ø 3.81
(0.150)
THRU
5
TAB
19.05
(0.750)
14.99
11.81 (0.590)
(0.465)
DITTIN
Dia of PCB
Plated Thru
Hole for Tabs
ORDERING INFORMATION
4
Mounting
Kits
page 99
Low cost, labor saving, slide on heat sink featuring spring action
0
1000
20
60
0
100
5
80
574602
574902
5741
2
3
4
Heat Dissipated—Watts
100
Mounting Surface Temp
Rise Above Ambient—°C
574502B00000G
1000
20
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
Description
Dia of PCB
Plated Thru
Hole for Tabs
Mounting Surface Temp
Rise Above Ambient—°C
ORDERING INFORMATION
Air Velocity—Feet Per Minute
400
200
600
800
100
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
Material: 0.63 (0.025) Thick Aluminum
Finish: Black Anodize
0
Part Number
1.57
(0.062)
10.03
(0.400)
5.33
(0.210)
20.57
(0.810)
THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
TO-220 Heat Sinks
9.52
(0.375)
20.57
(0.810)
1.57
(0.062)
5.33
(0.210)
10.03
(0.395)
1.91 (0.075)
POPULAR OPTIONS: 574102B0 00 00G
Base part no.
Position
Code
A
37
A
Material: 0.63 (0.025) Thick Aluminum
Finish: Black Anodize
Description
Details
Solderable tab with step to limit insertion depth
Page 92
For additional options see page 82
AMERICA
EUROPE
www.aavidthermalloy.com
USA Tel: +1 (603) 224-9988 email: [email protected]
Italy Tel: +39 051 764011 email: [email protected]
United Kingdom Tel: +44 1793 401400 email: [email protected]
ASIA
Singapore Tel: +65 6362 8388 email: [email protected]
Taiwan Tel: +886(2) 2698-9888 email: [email protected]
45
TO-220 Heat Sinks
Snap down style heat sink featuring two side fins
FIGURE A
FIGURE B
ø 3.15
(0.124)
LOCKING CATCH
12.32
(0.485)
14.22
(0.560)
19.05
(0.750)
ø 3.81
(0.150)
THRU
24.89
(0.980)
"A"
Snap down style heat sink features
two side fins that act as springs
to hold the semiconductor firmly
to the heat sink. Models include an
integrated clip and device locking
catch for more robust applications.
Available for both standard and
bevel edged TO-220 packages.
19.05
(0.750)
"A"
28.45
(1.120)
11.18
(0.440)
11.18
(0.440)
View A-A
579302
11.18
(0.440)
View A-A
579402
200
Air Velocity—Feet Per Minute
400
600
800
100
ORDERING INFORMATION
Part Number
Description
575102B00000G
Snap down heat sink
A
579302B00000G
With integrated clip and locking catch
B
579402B00000G
Figure
With integrated clip and locking catch
for TO-220 with beveled edge
B
For additional options see page 82
80
8
60
6
40
4
20
2
0
0
0
1
0
200
579302
579402
2
3
4
Heat Dissipated—Watts
Air Velocity—Feet Per Minute
400
600
800
Mounting Surface Temp
Rise Above Ambient—°C
100
46
AMERICA
EUROPE
www.aavidthermalloy.com
USA Tel: +1 (603) 224-9988 email: [email protected]
Italy Tel: +39 051 764011 email: [email protected]
United Kingdom Tel: +44 1793 401400 email: [email protected]
ASIA
5
1000
20
80
16
60
12
40
8
20
4
0
0
0
575102
1000
10
1
2
3
4
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
0
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
Material: 0.63 (0.025) Thick Aluminum
Finish: Black Anodize
Mounting Surface Temp
Rise Above Ambient—°C
THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
5751, 5793, 5794
5
Singapore Tel: +65 6362 8388 email: [email protected]
Taiwan Tel: +886(2) 2698-9888 email: [email protected]
Grease
&
Epoxy
page112
Space saving staggered fin heat sink
0
200
Air Velocity—Feet Per Minute
400
600
800
Mounting Surface Temp
Rise Above Ambient—°C
100
Space saving staggered fin heat sink
for vertical mounting TO-220 devices.
Features solderable mounting tabs for
easy attachment to the PC board.
1000
10
80
8
60
6
40
4
20
2
0
0
0
1
2
3
4
Heat Dissipated—Watts
27.18
(1.070)
ø3.18
(0.125)
THRU
15.16
(0.597)
Part Number
Description
6225B-MTG
Space saving staggered fin heat sink
4.83
(0.190)
5
2.02
(0.080)
3.18
(0.125)
2.28
(0.090)
17.78
(0.700)
26.01
(1.024)
Dia of PCB
Plated Thru
Hole for Tabs
ORDERING INFORMATION
Mounting
Kits
page 99
8.00
(0.315)
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
6225
Material: 1.02 (0.040) Thick Aluminum
Finish: Black Anodize
2.90 (0.114)
For additional options see page 85
1000
10
80
8
60
6
40
4
200
20
2
0
0
0
2
4
6
8
Heat Dissipated—Watts
35.05
(1.380)
ø 3.18 2x
(0.125)
50.80
(2.000)
10
25.40
(1.000)
4.75
(0.187)
2.46
(0.097)
Dia of PCB
Plated Thru
Hole for Tabs
ORDERING INFORMATION
Part Number
Description
6032DG
Copper space saving staggered fin heat sink
3.10 (0.122)
Mounting Surface Temp
Rise Above Ambient—°C
Space saving staggered fin
heat sink for vertical mounting
TO-220 devices. Features staked
on solderable mounting tabs for
easy attachment to the PC board.
ORDERING INFORMATION
Air Velocity—Feet Per Minute
400
600
800
1000
10
80
8
60
6
40
4
200
20
2
0
0
2
4
6
8
Heat Dissipated—Watts
Finish
6022PBG
Pre-black anodize*
2.36 (0.093)
6022BG
Black anodize
2.36 (0.093)
Mounting
Kits
page 99
6.35
(0.250)
22.23
(0.875)
ø 3.18
(0.125)
30.73
(1.210)
10
18.54
(0.730)
1.07
(0.042)
2.79
(0.110)
Dia of PCB
Plated Thru
Hole for Tabs
Part Number
25.40
(1.000)
Grease
&
Epoxy
page112
100
0
18.28
(0.720)
Material: 1.27 (0.050) Thick Copper
Finish: Tin Plated
Space saving staggered fin heat sink
0
Mounting
Kits
page 99
12.70
(0.500)
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
Mounting Surface Temp
Rise Above Ambient—°C
Copper, space saving staggered
fin heat sink for vertical mounting
TO-220 devices. Features solderable
mounting tabs for easy attachment
to the PC board.
Air Velocity—Feet Per Minute
400
600
800
100
0
6022
Grease
&
Epoxy
page112
Copper, space saving staggered fin heat sink
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
6032
THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
TO-220 Heat Sinks
1.78
(0.070)
17.78
(0.700)
Material: 1.02 (0.040) Thick Aluminum
Finish: See Table
*Edges cut during the manufacturing process will be unfinished.
See page 110 for more information
For additional options see page 85
AMERICA
EUROPE
www.aavidthermalloy.com
USA Tel: +1 (603) 224-9988 email: [email protected]
Italy Tel: +39 051 764011 email: [email protected]
United Kingdom Tel: +44 1793 401400 email: [email protected]
ASIA
Singapore Tel: +65 6362 8388 email: [email protected]
Taiwan Tel: +886(2) 2698-9888 email: [email protected]
47
TO-220 Heat Sinks
Grease
&
Epoxy
page112
Space saving staggered fin heat sink
Space saving staggered fin heat sink
for vertical mounting TO-220 devices.
Features solderable mounting tabs
with triangular base for easy attachment to the PC board.
1000
100
5
80
4
60
3
40
2
20
1
0
0
0
2
4
6
8
Heat Dissipated—Watts
13.00
(0.512)
ø 3.18 2x
(0.125)
45.06
(1.774)
20.04
(0.789)
10
4.83
(0.190)
12.70
(0.500)
13.34
(0.525)
Finish
6232B-MTG
Black anodize
3.10 (0.122)
6232PB-MTG
Pre-black anodize*
3.10 (0.122)
Mounting
Kits
page 99
35.00
(1.378)
Dia of PCB
Plated Thru
Hole for Tabs
ORDERING INFORMATION
Part Number
Air Velocity—Feet Per Minute
400
200
600
800
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
Mounting Surface Temp
Rise Above Ambient—°C
0
25.40
(1.000)
2.29
(0.090)
2.67
(0.105)
Material: 1.27 (0.050) Thick Aluminum
Finish: See Table
*Edges cut during the manufacturing process will be unfinished.
See page 110 for more information
For additional options see page 85
Grease
&
Epoxy
page112
Copper, space saving staggered fin heat sink
0
Air Velocity—Feet Per Minute
400
200
600
800
100
Copper, space saving staggered fin
heat sink for vertical mounting TO-220
devices. Features integrated solderable
mounting tabs for easy attachment to
the PC board.
1000
10
80
8
60
6
40
4
20
2
0
0
0
1
2
3
Heat Dissipated—Watts
4
ø 3.18
(0.125)
THRU
31.75
(1.250)
19.56
(0.770)
8.89
(0.350)
5
17.78
(0.700)
6.34
(0.250)
Part Number
Description
6025DG
Copper, space saving staggered fin heat sink with solderable tabs
3.96
(0.156)
1.57
(0.062)
22.22
(0.875)
Dia of PCB
Plated Thru
Hole for Tabs
ORDERING INFORMATION
Mounting
Kits
page 99
10.67
(0.420)
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
6025
Mounting Surface Temp
Rise Above Ambient—°C
THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
6232
Material: 1.27 (0.050) Thick Copper
Finish: Tin Plated
2.54 (0.100)
For additional options see page 85
Grease
&
Epoxy
page112
Space saving twisted fin heat sink
1000
10
80
8
60
6
40
4
Mounting Surface Temp
Rise Above Ambient—°C
0
Space saving twisted fin heat sink
for vertical mounting TO-220 devices.
Features solderable mounting tabs for
easy attachment to the PC board.
Air Velocity—Feet Per Minute
400
600
800
100
200
20
2
0
0
0
2
4
6
8
Heat Dissipated—Watts
35.05
(1.380)
16.51
(0.650)
CL
10
50.80
(2.000)
25.40
(1.000)
Dia of PCB
Plated Thru
Hole for Tabs
ORDERING INFORMATION
Part Number
Description
593202B03500G
Space saving twisted fin heat sink with solderable tabs
Mounting
Kits
page 99
12.20
(0.480)
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
5932
4.75
(0.187)
2.84 (0.112)
ø 3.17
(0.125)
THRU
TYP 2
18.30
(0.720)
0.81
(0.032)
2.46
(0.097)
25.40
(1.000)
POPULAR OPTIONS: 593202B0 00 00G
Base part no.
Position
Code
A
34
A
Description
Details
Solderable tab for 0.094 plated thru hole
Page 92
Material: 1.27 (0.050) Thick Aluminum
Finish: Black Anodize
For additional options see page 82
48
AMERICA
EUROPE
www.aavidthermalloy.com
USA Tel: +1 (603) 224-9988 email: [email protected]
Italy Tel: +39 051 764011 email: [email protected]
United Kingdom Tel: +44 1793 401400 email: [email protected]
ASIA
Singapore Tel: +65 6362 8388 email: [email protected]
Taiwan Tel: +886(2) 2698-9888 email: [email protected]
Grease
&
Epoxy
page112
Space saving staggered fin heat sink
ORDERING INFORMATION
Mounting Surface Temp
Rise Above Ambient—°C
Space saving staggered fin heat
sink for vertical mounting TO-220
devices. Features integrated solderable
mounting tabs that can be twisted for
attachment to the PC board. Heat sink
is also available with tin plating for
soldering directly to the PC board.
Air Velocity—Feet Per Minute
400
200
600
800
100
1000
20
80
16
60
12
40
8
20
4
0
0
0
0
1
2
3
4
Heat Dissipated—Watts
ø 3.17
(0.125)
THRU
19.56
(0.770)
Finish
542502B00000G
Black anodize
2.39 (0.094)
542502D00000G
Tin plated
2.39 (0.094)
1.57
(0.062)
17.78
(0.700)
22.22
(0.875)
6.35
(0.250)
Material: 1.27 (0.050) Thick Aluminum
Finish: See Table
1000
20
80
16
60
12
40
8
Finish
200
20
4
0
0
0
1
2
3
4
Heat Dissipated—Watts
5
ø 3.17 THRU
(0.125)
Black anodize
2.39 (0.094)
592502U03400G
Unfinished
2.39 (0.094)
6.35
(0.250)
CL
31.75
(1.250)
19.56
(0.770)
Dia of PCB
Plated Thru
Hole for Tabs
592502B03400G
Mounting
Kits
page 99
22.20
(0.875)
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
Mounting Surface Temp
Rise Above Ambient—°C
Space savings twisted fin heat sink
for vertical mounting TO-220 devices.
Features staked on solderable mounting
tabs for easy attachment to the PC board.
Air Velocity—Feet Per Minute
400
600
800
100
0
Part Number
Grease
&
Epoxy
page112
Space saving twisted fin heat sink
ORDERING INFORMATION
1.27
(0.050)
3.96
(0.156)
8.89
(0.350)
For additional options see page 82
5925
31.75
(1.250)
5
Dia of PCB
Plated Thru
Hole for Tabs
Part Number
Mounting
Kits
page 99
10.67
(0.420)
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
5425
THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
TO-220 Heat Sinks
17.78
(0.700)
1.91 2x
(0.075)
5.03
(0.198)
Material: 1.27 (0.050) Thick Aluminum
Finish: See Table
For additional options see page 82
AMERICA
EUROPE
www.aavidthermalloy.com
USA Tel: +1 (603) 224-9988 email: [email protected]
Italy Tel: +39 051 764011 email: [email protected]
United Kingdom Tel: +44 1793 401400 email: [email protected]
ASIA
Singapore Tel: +65 6362 8388 email: [email protected]
Taiwan Tel: +886(2) 2698-9888 email: [email protected]
49
TO-220 Heat Sinks
Grease
&
Epoxy
page112
Extruded heat sink with radial fins
ORDERING INFORMATION
Mounting Surface Temp
Rise Above Ambient—°C
Extruded heat sink with radial fins
and channel clip attach feature
make device attachment easy.
Includes clip and two solderable
mounting pins which permit vertical
mounting and eliminate stress on
device leads. Available in three
heights for TO-220 devices.
1000
8
60
6
40
4
20
2
0
0
2
533802
534002
533902
“A” Dim
Dia of PCB
Plated Thru
Hole for Pins
533802B02554G
25.40 (1.000)
2.67 (0.105)
533902B02554G
38.10 (1.500)
2.67 (0.105)
534002B02554G
50.80 (2.000)
2.67 (0.105)
Part Number
10
80
0
4
6
8
Heat Dissipated—Watts
12.32
(0.485)
6.15
(0.242)
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
0
Air Velocity—Feet Per Minute
400
200
600
800
100
10
2.34
(0.092)
7.92
"A"
ø 1.78 x 10.19 (0.312)
(0.070) (0.401)
SLOT TYP 2
1.52
(0.060)
10.92
(0.430)
18.29
(0.720)
11.10
(0.437)
25.40
(1.000)
9.91
(0.390)
3.18
(0.125)
3.96
(0.156)
14.22
(0.560)
3.18
(0.125)
CLIP 54
12.70
(0.500)
15.88
(0.625)
34.93
(1.375)
Material: Aluminum
Finish: Black Anodize
For additional options see page 83
0
“A” Dim
Dia of PCB
Plated Thru
Hole for Pins
532602B02500G
38.10 (1.500)
2.67 (0.105)
532702B02500G
50.80 (2.000)
2.67 (0.105)
532802B02500G
63.50 (2.500)
2.67 (0.105)
ORDERING INFORMATION
Part Number
Grease
&
Epoxy
page112
High power extruded heat sink with large radial fins
Air Velocity—Feet Per Minute
400
200
600
800
1000
100
5
80
4
60
3
40
2
20
1
0
0
0
4
532602
532702
532802
8
12
16
Heat Dissipated—Watts
ø 3.66
(0.144)
THRU
"A"
19.05
(0.750)
20
12.70
25.40 (0.500)
(1.000)
Material: Aluminum
Finish: Black Anodize
41.91
(1.650)
Grease
&
Epoxy
page112
Extruded channel style heat sink featuring serrated fins
Mounting Surface Temp
Rise Above Ambient—°C
Extruded channel style heat sink
features serrated fins for increased
cooling capacity. The base of the heat
sink is notched to clear the device
leads when mounted horizontally on
the printed circuit card. Narrow channel accommodates a TO-220 device.
80
16
60
12
40
8
20
4
0
0
0
2
4
6
8
Heat Dissipated—Watts
20.00
(0.787)
2.15
(0.085)
10
15.00
(0.591)
ø 3.15
(0.124)
THRU
7.49
(0.295)
25.00
(0.984)
19.50
6.00
(0.768) (0.236)
ORDERING INFORMATION
Description
10.30
(0.406)
Extruded channel style heat sink
AMERICA
EUROPE
www.aavidthermalloy.com
Mounting
Kits
page 99
2.00
(0.079)
1000
20
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
Air Velocity—Feet Per Minute
400
200
600
800
100
ML26AAG
25.40
(1.000)
2.54
(0.100)
11.68
(0.460)
0
Part Number
3.96
(0.156)
2.36
(0.093)
For additional options see page 83
ML26AA
Mounting
Kits
page 99
20.96
(0.825)
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
5326, 5327, 5328
High power extruded heat sink
with large radial fins and
increased fin count for additional
cooling capacity. Solderable pins
allow vertical mounting without
stress on the device leads. Available
in three heights for TO-220 devices.
50
2.41 2x
(0.095)
ø 3.18 x 0.63
(0.125) (0.025)
HIGH DITTIN
ø 2.36
(0.093)
Mounting Surface Temp
Rise Above Ambient—°C
THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
5338, 5339, 5340
USA Tel: +1 (603) 224-9988 email: [email protected]
Italy Tel: +39 051 764011 email: [email protected]
United Kingdom Tel: +44 1793 401400 email: [email protected]
ASIA
Material: Aluminum
Finish: Black Anodize
Singapore Tel: +65 6362 8388 email: [email protected]
Taiwan Tel: +886(2) 2698-9888 email: [email protected]
5912
Plug in style heat sink featuring four spring action clips
FIGURE B
FIGURE A
TAB
1.27
(0.050)
14.48
(0.570)
MAX
Plug in style heat sink features
four spring action clips to firmly
hold the device to the heat sink
ensuring maximum metal to
metal thermal contact. Available
with solderable mounting tabs
for both horizontal and vertical
mounting to the PC board.
12.70
4.10 (0.500)
(0.160)
0.81
(0.032)
1.27
(0.050)
0.81
(0.032)
3.81
(0.150)
12.70
(0.500)
15.24
(0.600)
Part Number
Description
591202B00000G
Plug in style heat sink, no mounting tab
A
591202B03100G
With horizontal mounting tab
A
1.73 (0.068)
591202B04000G
With vertical mounting tab
B
1.75 (0.069)
0
200
Air Velocity—Feet Per Minute
400
600
800
100
Mounting Surface Temp
Rise Above Ambient—°C
Figure
Dia of PCB
Plated Thru
Hole for Tabs
For additional options see page 84
1000
20
80
16
60
12
40
8
20
4
0
0
0
1
2
3
4
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
Material: 0.81 (0.032) Thick Aluminum
Finish: Black Anodize
ORDERING INFORMATION
5913
12.70
(0.500)
6.22
(0.245)
15.24
(0.600)
12.70
(0.500)
14.48
(0.570)
MAX
THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
TO-220 & TO-262 Heat Sinks
5
Plug in style heat sink featuring four spring action clips
FIGURE A
FIGURE B
1.27
(0.050)
TAB
MAX
14.48
(0.570)
1.02
(0.040)
Plug in style heat sink features four
spring action clips to firmly hold the
device to the heat sink ensuring maximum metal to metal thermal contact.
Includes 2 integrated standoffs to steady
the heat sink during wave soldering.
Available with solderable mounting tabs
for vertical mounting to the PC board.
3.15
(0.124)
12.70
(0.500)
12.70
(0.500)
2.67
(0.105)
19.05
(0.750)
1.02
(0.040)
3.15
(0.124)
0.81
(0.032)
19.05
(0.750)
12.70
(0.500)
6.22
(0.245)
Air Velocity—Feet Per Minute
400
600
800
Figure
Mounting Surface Temp
Rise Above Ambient—°C
ORDERING INFORMATION
Dia of PCB
Plated Thru
Hole for Tabs
Part Number
Description
591302B00000G
Plug in style heat sink with integrated standoffs, no mounting tab
B
591302B02800G
With Shur-LockTM tab for vertical mounting
A
1.73 (0.068)
591302B04000G
With tab for vertical mounting
B
1.75 (0.069)
For additional options see page 84
80
8
60
6
40
4
20
2
0
0
0
USA Tel: +1 (603) 224-9988 email: [email protected]
Italy Tel: +39 051 764011 email: [email protected]
United Kingdom Tel: +44 1793 401400 email: [email protected]
ASIA
1000
10
1
2
3
4
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
200
100
www.aavidthermalloy.com
12.70
(0.500)
Material: 0.81 (0.032) Thick Aluminum
Finish: Black Anodize
0
AMERICA
EUROPE
14.48
(0.570)
MAX
5
Singapore Tel: +65 6362 8388 email: [email protected]
Taiwan Tel: +886(2) 2698-9888 email: [email protected]
51
TO-220 & TO-262 Heat Sinks
Plug in style heat sink featuring four spring action clips
FIGURE B
FIGURE A
14.48
(0.570)
MAX
19.05
(0.750)
Plug in style heat sink features
four spring action clips to firmly
hold the device to the heat sink
ensuring maximum metal to
metal thermal contact. Available
with solderable mounting tabs
for both horizontal and vertical
mounting to the PC board.
14.48
(0.570)
MAX
19.05
(0.750)
12.70
(0.500)
1.27
(0.050)
0.813
(0.032)
4.19
(0.165)
4.06
(0.160)
12.70
(0.500)
12.70
(0.500)
6.22
(0.245) TAB
0.81
(0.032)
1.27
(0.050)
12.70
(0.500)
ORDERING INFORMATION
Figure
Dia of PCB
Plated Thru
Hole for Tabs
Part Number
Description
Finish
576802B00000G
Slim plug in heat sink, no mounting tab
A
576802V00000G
Slim plug in heat sink, no mounting tab
A
Black anodize
AavSHIELD3
576802U00000G
Slim plug in heat sink, no mounting tab
A
Unfinished
576802B03100G
With single tab for horizontal mounting
A
576802V03100G
With single tab for horizontal mounting
A
Black anodize
AavSHIELD3
576802U03100G
With single tab for horizontal mounting
A
Unfinished
1.73 (0.068)
576802B04000G
With single tab for vertical mounting
B
1.75 (0.069)
1.75 (0.069)
1.75 (0.069)
576802V04000G
With single tab for vertical mounting
B
Black anodize
AavSHIELD3
576802U04000G
With single tab for vertical mounting
B
Unfinished
0
Air Velocity—Feet Per Minute
400
200
600
800
100
1.73 (0.068)
1.73 (0.068)
1000
10
80
8
60
6
40
4
20
2
0
0
0
1
2
3
Heat Dissipated—Watts
576802B
576802V
579602U
4
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
Material: 0.81 (0.032) Thick Aluminum
Finish: See Table
Mounting Surface Temp
Rise Above Ambient—°C
THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
5768
5
For additional options see page 84
Plug in style heat sink features pre-blackened finish
FIGURE A
FIGURE C
FIGURE B
4.00
(0.157)
19.50
(0.768)
19.50
(0.768)
13.00
(0.512)
5.00
(0.197)
0.40
(0.016)
ø 3.00
(0.118)
5.70
(0.224)
Part Number
Description
Figure
Dim “A”
PF432G
Plug in style heat sink with solderable tab, vertical mount
A
6.20 (0.244)
1.60 (0.063)
PF433G
With vertical mount no tab
A
PF434G
With solderable tab, horizontal mount
B
PF435G
With solderable tab, vertical mount
A
ORDERING INFORMATION
With solderable tab offset from center, horizontal mount
0
1.60 (0.063)
9.50 (0.374)
C
AMERICA
EUROPE
1.60 (0.063)
1.60 (0.063)
www.aavidthermalloy.com
USA Tel: +1 (603) 224-9988 email: [email protected]
Italy Tel: +39 051 764011 email: [email protected]
United Kingdom Tel: +44 1793 401400 email: [email protected]
200
Air Velocity—Feet Per Minute
400
600
800
100
ASIA
1000
10
80
8
60
6
40
4
20
2
0
0
0
*Edges cut during the manufacturing process will be unfinished.
See page 110 for more information
52
ø 3.00
(0.118)
7.50
(0.295)
Material: 0.71 (0.028) Thick Aluminum
Finish: Pre-Black Anodize*
Dia of PCB
Plated Thru
Hole for Tabs
PF436G
0.27
(0.010)
12.70
(0.500)
7.50 ø 3.00
(0.295) (0.118)
"A"
1.30
(0.051)
2.85
(0.112)
12.70
(0.500)
12.00
(0.472)
13.00
(0.512)
4.00
(0.157)
1.30
(0.051)
Case Temp Rise
Above Ambient—°C
Plug in style heat sink features
pre-blackened finish and two
spring action clips to firmly hold
the device to the heat sink
ensuring maximum metal to
metal thermal contact. Available
with solderable mounting tabs
for both horizontal and vertical
mounting to the PC board.
12.70
(0.500)
0.40
(0.016)
TAB
13.00
(0.512)
16.80
(0.661)
19.50
(0.768)
1
2
3
Heat Dissipated—Watts
4
Thermal Resistance From
Case to Ambient—°C/Watt
PF432, PF433, PF434, PF435, PF436
5
Singapore Tel: +65 6362 8388 email: [email protected]
Taiwan Tel: +886(2) 2698-9888 email: [email protected]
TO-220 & TO-262 Heat Sinks
Plug in style heat sink with folded back fins
FIGURE A
FIGURE B
21.59
(0.850)
25.40
(1.000)
Plug in style heat sink with folded
back fins for extra cooling capacity.
Features four spring action clips to
firmly hold the device to the heat sink
ensuring maximum metal to metal
thermal contact. Available with or
without solderable mounting tabs
for both horizontal and vertical
mounting to the PC board.
6.20
(0.245)
TAB
1.27
(0.050)
25.40
(1.000)
21.59
(0.850)
CL
12.70
(0.500)
4.06
(0.160)
0.81
(0.032)
12.70
(0.500)
TAB
1.27
(0.050)
14.86
(0.585)
12.70
(0.500)
0.81
(0.032)
12.70
(0.500)
ORDERING INFORMATION
Figure
Dia of PCB
Plated Thru
Hole for Tabs
Part Number
Description
566902B00000G
Plug in style heat sink with no mounting tab
A
566902B03100G
With horizontal mounting tab
A
1.73 (0.068)
566902B04000G
With vertical mounting tab
B
1.75 (0.069)
0
200
Air Velocity—Feet Per Minute
400
600
800
Mounting Surface Temp
Rise Above Ambient—°C
100
For additional options see page 82
1000
10
80
8
60
6
40
4
20
2
0
0
0
1
2
3
4
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
Material: 0.81 (0.032) Thick Aluminum
Finish: Black Anodize
THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
5669
5
TO-220 & TO-218 & TO-247 Heat Sinks
Grease
&
Epoxy
page112
Hat section heat sink with twisted fins
0
Air Velocity—Feet Per Minute
400
200
600
800
Mounting Surface Temp
Rise Above Ambient—°C
100
1000
25
80
20
60
15
40
10
20
5
0
0
0
Hat section heat sink with
twisted fins is low profile and
perfect for use on circuit cards
with 0.500 spacing. The twisted
fins increase air turbulence for
better thermal performance.
TV96
TV97
1
2
3
Heat Dissipated—Watts
4
Mounting
Kits
page 99
17.80
(0.701)
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
TV96, TV97
5
10.20
(0.402)
ø 3.66
(0.144)
CL
17.80
(0.701)
13.50
(0.531)
"A"
Material: 0.99 (0.039) Thick Aluminum
Finish: Black Anodize
ORDERING INFORMATION
Part Number
“A” Dim
TV96G
31.70 (1.248)
TV97G
44.40 (1.748)
AMERICA
EUROPE
www.aavidthermalloy.com
USA Tel: +1 (603) 224-9988 email: [email protected]
Italy Tel: +39 051 764011 email: [email protected]
United Kingdom Tel: +44 1793 401400 email: [email protected]
ASIA
Singapore Tel: +65 6362 8388 email: [email protected]
Taiwan Tel: +886(2) 2698-9888 email: [email protected]
53
TO-220 & TO-218 & TO-247 Heat Sinks
Grease
&
Epoxy
page112
High rise style heat sink features twisted fins and Wave-OnTM solderable mounts
10.16
(0.400)
High rise style heat sink features
twisted fins and Wave-OnTM solderable mounts for easy attachment
to the PC card. Models include thru
holes on one side to attach devices
using standard hardware and dittins
with special slots on the other for
easy device attachment using a convenient spring clip. Dual models use
two dittins and clips to locate and
attach devices.
FIGURE A
FIGURE B
30.61
(1.205)
30.61
(1.205)
4.06
(0.160)
TYP
CLIP 50
4.06
(0.160)
TYP
CLIP 62
6.60
(0.260)
ø 2.79 x 0.76
(0.110) (0.030)
HIGH DITTIN
44.45
(1.750)
2.54
(0.100)
1.57
(0.062)
2.54
(0.100)
3.00
(0.118)
2.54
(0.100)
14.99
(0.590)
14.99
(0.590)
12.45
(0.490)
12.45
(0.490)
3.48
(0.137)
4.24
(0.167)
6.60
(0.260)
Ø 2.79 x 0.76
(0.110) (0.030)
2X HIGH DITTIN
1.57
(0.062)
7.50
(0.295)
7.62
(0.300)
12.70
(0.500)
12.70
(0.500)
24.13
(0.950)
44.45
(1.750)
ø 3.20
(0.126)
THRU
"A"
Mounting
Kits
page 99
Material: 1.60 (0.063) Thick Aluminum
Finish: Black Anodize
0
200
Air Velocity—Feet Per Minute
400
600
800
1000
100
“A” Dim
Dia of PCB
Plated Thru
Hole for Tabs
21.08 (0.830)
4.75 (0.187)
21.08 (0.830)
4.75 (0.187)
ORDERING INFORMATION
Part Number
Description
Device
Figure
530101B00100G Heat sink twisted fin
TO-218, TO-247
530101B00150G With device clip #50
TO-218, TO-247
530102B00100G Heat sink twisted fin
A
TO-220
18.29 (0.720)
4.75 (0.187)
530102B00150G With device clip #50
TO-220
A
18.29 (0.720)
4.75 (0.187)
530161B00162G With two device clips #62
Dual TO-218, TO-247
B
21.08 (0.830)
4.75 (0.187)
530162B00162G With two device clips #62
Dual TO-220
B
18.29 (0.720)
5
80
4
60
3
40
2
20
1
0
0
0
4
8
12
Heat Dissipated—Watts
16
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
BASE PART
Mounting Surface Temp
Rise Above Ambient—°C
THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
5301
20
530161 or 530162
530101 or 530102
4.75 (0.187)
For additional options see page 82
5308
Grease
&
Epoxy
page112
High rise style heat sink features twisted fins and solderable tabs
BASE PART
FIGURE B
30.61
(1.205)
30.61
(1.205)
ø 2.95 THRU 2x
(0.116)
RECOMMENDED
HOLE PATTERN
43.13
(1.698)
45.72
(1.800)
High rise style heat sink features
twisted fins and solderable tabs
for easy attachment to the PC card.
Models include thru holes on one
side to attach devices using standard hardware and dittins with
special slots on the other for easy
device attachment using a convenient spring clip. Dual models use
two dittins and clips to locate and
attach devices.
FIGURE A
12.70
(0.500)
CLIP 50
ø 3.20
(0.126)
4.06
(0.160)
TYP
CLIP 62
6.60
(0.260)
ø 2.79 x 0.76
(0.110) (0.030)
HIGH DITTIN
44.45
(1.750)
"A"
Mounting
Kits
page 99
12.70
(0.500)
4.06
(0.160)
TYP
6.60
(0.260)
ø 2.79 X 0.76
(0.110) (0.030)
2X HIGH DITTIN
7.62
(0.300)
10.16
(0.400)
14.99 14.99
(0.590) (0.590)
2.54
(0.100)
3.00
(0.118)
22.90
(0.900)
12.45
(0.490)
12.45
(0.490)
3.48
(0.137)
Material: 1.60 (0.063) Thick Aluminum
Finish: Black Anodize
46.74
(1.841)
21.08 (0.830)
2.95 (0.116)
ORDERING INFORMATION
Part Number
Description
Device
530801B05100G
Heat sink twisted fin and solderable tabs
TO-218, TO-247
530801B05150G
With device clip #50
TO-218, TO-247
530802B05100G
Heat sink twisted fin and solderable tabs
TO-220
530802B05150G
With device clip #50
TO-220
530861B05162G
With two device clips #62
530862B05162G
With two device clips #62
Figure
A
21.08 (0.830)
2.95 (0.116)
18.29 (0.720)
2.95 (0.116)
A
18.29 (0.720)
2.95 (0.116)
Dual TO-218, TO-247
B
21.08 (0.830)
2.95 (0.116)
Dual TO-220
B
18.29 (0.720)
2.95 (0.116)
Air Velocity—Feet Per Minute
400
600
800
1000
100
Mounting Surface Temp
Rise Above Ambient—°C
“A” Dim
Dia of PCB
Plated Thru
Hole for Tabs
200
5
80
4
60
3
40
2
20
1
0
0
0
4
8
12
Heat Dissipated—Watts
16
20
530861 or 530862
530801 or 530802
For additional options see page 82
54
AMERICA
EUROPE
www.aavidthermalloy.com
USA Tel: +1 (603) 224-9988 email: [email protected]
Italy Tel: +39 051 764011 email: [email protected]
United Kingdom Tel: +44 1793 401400 email: [email protected]
ASIA
Singapore Tel: +65 6362 8388 email: [email protected]
Taiwan Tel: +886(2) 2698-9888 email: [email protected]
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
0
Grease
&
Epoxy
page112
High rise style heat sink features staggered fins and Wave-OnTM solderable mounts
0
200
Air Velocity—Feet Per Minute
400
600
800
5
80
4
60
3
40
2
20
1
Mounting Surface Temp
Rise Above Ambient—°C
100
High rise style heat sink features
staggered fins and Wave-OnTM
solderable mounts for easy attachment to the PC card. Models include
thru holes on one side to attach
devices using standard hardware
and dittins with special slots on the
other for easy device attachment
using a convenient spring clip.
0
0
0
4
8
12
16
Heat Dissipated—Watts
Mounting
Kits
page 99
30.61
(1.205)
1000
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
5304
12.70
(0.500)
10.16
(0.400)
CLIP 50
24.13
(0.950)
44.45
(1.750)
4.06 TYP
(0.160)
19.05
(0.750)
ø 3.20 THRU
(0.126)
ø 2.79 x 0.76
(0.110) (0.030)
HIGH DITTIN
20
7.49
(0.295)
44.45
(1.750)
6.60
(0.260)
"A"
ORDERING INFORMATION
“A” Dim
Dia of PCB
Plated Thru
Hole for Tabs
TO-218, TO-247
21.08 (0.830)
4.75 (0.187)
TO-218, TO-247
21.08 (0.830)
4.75 (0.187)
High rise style heat sink staggered fins
TO-220
18.29 (0.720)
4.75 (0.187)
With device clip #50
TO-220
18.29 (0.720)
4.75 (0.187)
Part Number
Description
Device
530401B00100G
High rise style heat sink staggered fins
530401B00150G
With device clip #50
530402B00100G
530402B00150G
1.57
7.62
(0.300) (0.060)
2.54
(0.100)
3.00
(0.118)
4.24
(0.167)
14.99
(0.590)
3.48
(0.137)
2.54
(0.100)
12.45
(0.490)
14.99
(0.590)
Material: 1.60 (0.063) Thick Aluminum
Finish: Black Anodize
THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
TO-220 & TO-218 & TO-247 Heat Sinks
For additional options see page 82
Grease
&
Epoxy
page112
Air Velocity—Feet Per Minute
400
200
600
800
Mounting Surface Temp
Rise Above Ambient—°C
1000
10
80
8
60
6
40
4
20
2
0
0
0
2
53300X
53310X
8
Air Velocity—Feet Per Minute
400
600
800
"B"
NOTCH
FOR CLIP 2x
1000
10
80
8
60
6
40
4
20
2
200
0
0
0
53320X
53330X
2
4
6
Heat Dissipated—Watts
8
"A"
10
100
0
Mounting Surface Temp
Rise Above Ambient—°C
Extruded heat sink with radial
fins and clip attach feature
makes device attachment easy.
Includes two solderable mounting
pins which permit vertical mounting and eliminate stress on device
leads. Available in four heights for
TO-220, TO-218 and TO-247 devices.
4
6
Heat Dissipated—Watts
ø 3.18 X 0.64
(0.125) (0.025)
HIGH DITTIN
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
0
100
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
5330, 5331, 5332, 5333 Extruded heat sink with radial fins
3.96 2x
(0.156)
2.36 2x
(0.093)
25.40
(1.000)
"C"
12.70
(0.500)
34.92
(1.375)
6.60
(0.260)
39.10
(1.540)
10
13.50
(0.530)
CLIP 51
ORDERING INFORMATION
“A” Dim
“B” Dim
“C” Dim
Dia of PCB
Plated Thru
Hole for Pins
Part Number
Device
533001B02551G
TO-218, TO-247
25.40 (1.000)
21.59 (0.850)
17.02 (0.670)
2.67 (0.105)
533002B02551G
TO-220
25.40 (1.000)
18.29 (0.720)
15.88 (0.625)
2.67 (0.105)
533101B02551G
TO-218, TO-247
38.10 (1.500)
21.59 (0.850)
17.02 (0.670)
2.67 (0.105)
533102B02551G
TO-220
38.10 (1.500)
18.29 (0.720)
15.88 (0.625)
2.67 (0.105)
533201B02551G
TO-218, TO-247
50.80 (2.000)
21.59 (0.850)
17.02 (0.670)
2.67 (0.105)
533202B02551G
TO-220
50.80 (2.000)
18.29 (0.720)
15.88 (0.625)
2.67 (0.105)
533301B02551G
TO-218, TO-247
63.50 (2.500)
21.59 (0.850)
17.02 (0.670)
2.67 (0.105)
533302B02551G
TO-220
63.50 (2.500)
18.29 (0.720)
15.88 (0.625)
2.67 (0.105)
Material: Aluminum
Finish: Black Anodize
For additional options see page 83
AMERICA
EUROPE
www.aavidthermalloy.com
USA Tel: +1 (603) 224-9988 email: [email protected]
Italy Tel: +39 051 764011 email: [email protected]
United Kingdom Tel: +44 1793 401400 email: [email protected]
ASIA
Singapore Tel: +65 6362 8388 email: [email protected]
Taiwan Tel: +886(2) 2698-9888 email: [email protected]
55
TO-220 & TO-218 & TO-247 Heat Sinks
80
8
60
6
40
4
20
2
0
0
0
2
SW25
SW38
0
4
6
Heat Dissipated—Watts
8
Air Velocity—Feet Per Minute
400
200
600
800
100
1000
10
8
60
6
40
4
20
2
0
0
0
2
4
6
Heat Dissipated—Watts
8
ORDERING INFORMATION
“A” Dim
34.50
(1.358)
2.00
(0.079)
12.50
(0.492)
SEE NOTE 1
"A"
25.00
(0.984) 19.90
(0.783) 15.00
(0.591)
4.00
(0.157)
2.50
(0.098)
Dia of PCB
Plated Thru
Hole for Pins
Description
SW25-2G
Extruded heat sink with unequal channel widths front and back
25.00 (0.984)
No
3.00 (0.118)
SW25-4G
With device mounting holes
25.00 (0.984)
Yes
3.00 (0.118)
SW38-2G
Extruded heat sink with unequal channel widths front and back
38.00 (1.496)
No
3.00 (0.118)
SW38-4G
With device mounting holes
38.00 (1.496)
Yes
3.00 (0.118)
SW50-2G
Extruded heat sink with unequal channel widths front and back
50.00 (1.968)
No
3.00 (0.118)
SW50-4G
With device mounting holes
50.00 (1.968)
Yes
3.00 (0.118)
SW63-2G
Extruded heat sink with unequal channel widths front and back
63.00 (2.480)
No
3.00 (0.118)
SW63-4G
With device mounting holes
63.00 (2.480)
Yes
3.00 (0.118)
NOTE 1: This hole not present in SW25 model
Material: Aluminum
Finish: Black Anodize
Grease
&
Epoxy
page112
Extruded heat sink with large radial fins
Mounting Surface Temp
Rise Above Ambient—°C
5
80
4
60
3
40
2
20
1
0
0
0
0
8
12
Heat Dissipated—Watts
16
20
Air Velocity—Feet Per Minute
400
200
600
800
1000
5
80
4
60
3
40
2
20
1
0
0
0
52990X
53000X
4
8
12
Heat Dissipated—Watts
Part Number
Device
“A” Dim
“B” Dim
“C” Dim
Dia of PCB
Plated Thru
Hole for Pins
529701B02500G
TO-218, TO-247
25.40 (1.000)
21.59 (0.850)
3.66 (0.144)
2.67 (0.105)
529702B02500G
TO-220
25.40 (1.000)
18.29 (0.720)
3.17 (0.125)
2.67 (0.105)
529801B02500G
TO-218, TO-247
38.10 (1.500)
21.59 (0.850)
3.66 (0.144)
2.67 (0.105)
529802B02500G
TO-220
38.10 (1.500)
18.29 (0.720)
3.17 (0.125)
2.67 (0.105)
529901B02500G
TO-218, TO-247
50.80 (2.000)
21.59 (0.850)
3.66 (0.144)
2.67 (0.105)
529902B02500G
TO-220
50.80 (2.000)
18.29 (0.720)
3.17 (0.125)
2.67 (0.105)
530001B02500G
TO-218, TO-247
63.50 (2.500)
21.59 (0.850)
3.66 (0.144)
2.67 (0.105)
530002B02500G
TO-220
63.50 (2.500)
18.29 (0.720)
3.17 (0.125)
2.67 (0.105)
ORDERING INFORMATION
16
"C"
"A"
"B"
100
Mounting Surface Temp
Rise Above Ambient—°C
Extruded heat sink with large radial
fins features equal channel widths on
both sides for single or dual device
mounting. Includes two solderable
mounting pins which permit vertical
mounting and eliminate stress on
device leads. Available in four heights
for TO-220, TO-218, and TO-247 devices.
4
52970X
52980X
Mounting
Kits
page 99
20.96
(0.825)
1000
100
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
Air Velocity—Feet Per Minute
400
200
600
800
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
0
ø 3.20
(0.126) TYP
25.40
(1.000)
10
Part Number
5297, 5298, 5299, 5300
Holes
Mounting
Kits
page 99
10
80
SW50
SW63
6.25
(0.246)
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
1000
10
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
Mounting Surface Temp
Rise Above Ambient—°C
Air Velocity—Feet Per Minute
400
200
600
800
100
0
Extruded heat sink with unequal
channel widths front and back
can accommodate a TO-220, TO-218,
or TO-247 devices. Includes two solderable mounting pins which permit vertical mounting and eliminate stress on
device leads. Available in three heights.
Version without hole uses clip 5901
(sold separately) to attach device.
See page 97 for clip information.
Grease
&
Epoxy
page112
Extruded heat sink with unequal channel widths
Mounting Surface Temp
Rise Above Ambient—°C
THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
SW25, SW38, SW50, SW63
3.18
(0.125)
14.22
(0.560)
3.96
(0.156)
2x
13.72
(0.540)
ø 2.36
(0.093) 2x
25.40
(1.000)
20
1.57
(0.062)
25.40
(1.000)
17.02
(0.670)
41.91
(1.650)
Material: Aluminum
Finish: Black Anodize
For additional options see page 83
56
AMERICA
EUROPE
www.aavidthermalloy.com
USA Tel: +1 (603) 224-9988 email: [email protected]
Italy Tel: +39 051 764011 email: [email protected]
United Kingdom Tel: +44 1793 401400 email: [email protected]
ASIA
Singapore Tel: +65 6362 8388 email: [email protected]
Taiwan Tel: +886(2) 2698-9888 email: [email protected]
Grease
&
Epoxy
page112
5334, 5335, 5336, 5337 Extruded heat sink with large radial fins
Air Velocity—Feet Per Minute
400
200
600
800
1000
5
80
4
60
3
40
2
Mounting Surface Temp
Rise Above Ambient—°C
100
1
20
0
Extruded heat sink with large
radial fins and channel clip
attach feature makes device
attachment easy. Includes clip
and two solderable mounting
pins which permit vertical
mounting and eliminate stress
on device leads. Available in
four heights for TO-220, TO-218,
and TO-247 devices.
0
0
4
5335XX
5334XX
8
12
Heat Dissipated—Watts
16
ø 3.18 (0.125)
X 0.64 (0.025)
HIGH DITTIN
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
0
"A"
3.17
(0.125)
25.40
(1.000)
CLIP 52
A
VIEW A-A
SINGLE HEAT SINK DEVICE
1000
5
4
60
3
40
2
20
1
0
0
4
5337XX
5336XX
8
12
16
Heat Dissipated—Watts
Material: Aluminum
Finish: Black Anodize
25.40
(1.000)
17.02
(0.670)
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
Air Velocity—Feet Per Minute
400
200
600
800
80
Mounting Surface Temp
Rise Above Ambient—°C
7.62
(0.300)
2x ø 2.39
(0.093)
A
100
0
6.60
(0.260)
16.51
(0.650)
13.72
(0.540)
20
SEE NOTE 1
0
2x 3.96
(0.156)
"B"
25.65
(1.01)
REF
41.91
(1.650)
VIEW A-A
DUAL HEAT SINK DEVICE
12.70
(0.500)
20
25.40
(1.000)
17.02
(0.670)
SEE NOTE 1
THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
TO-220 & TO-218 & TO-247 Heat Sinks
41.91
(1.650)
NOTE 1: Graph depicts single device models. Dual device models
exhibit a 15% performance increase.
Part Number
Device
Description
“A” Dim
“B” Dim
Dia of PCB
Plated Thru
Hole for Pins
533401B02552G
TO-218, TO-247
Extruded heat sink with radial fins and device clip #52
38.10 (1.500)
21.59 (0.850)
2.67 (0.105)
533402B02552G
TO-220
Extruded heat sink with radial fins and device clip #52
38.10 (1.500)
18.29 (0.720)
2.67 (0.105)
533421B02552G
Dual TO-218, TO-247
With 2 device clips #52
38.10 (1.500)
21.59 (0.850)
2.67 (0.105)
ORDERING INFORMATION
533422B02552G
Dual TO-220
With 2 device clips #52
38.10 (1.500)
18.29 (0.720)
2.67 (0.105)
533501B02552G
TO-218, TO-247
Extruded heat sink with radial fins and device clip #52
50.80 (2.000)
21.59 (0.850)
2.67 (0.105)
533502B02552G
TO-220
Extruded heat sink with radial fins and device clip #52
50.80 (2.000)
18.29 (0.720)
2.67 (0.105)
533521B02552G
Dual TO-218, TO-247
With 2 device clips #52
50.80 (2.000)
21.59 (0.850)
2.67 (0.105)
533522B02552G
Dual TO-220
With 2 device clips #52
50.80 (2.000)
18.29 (0.720)
2.67 (0.105)
533601B02552G
TO-218, TO-247
Extruded heat sink with radial fins and device clip #52
63.50 (2.500)
21.59 (0.850)
2.67 (0.105)
533602B02552G
TO-220
Extruded heat sink with radial fins and device clip #52
63.50 (2.500)
18.29 (0.720)
2.67 (0.105)
533621B02552G
Dual TO-218, TO-247
With 2 device clips #52
63.50 (2.500)
21.59 (0.850)
2.67 (0.105)
533622B02552G
Dual TO-220
With 2 device clips #52
63.50 (2.500)
18.29 (0.720)
2.67 (0.105)
533701B02552G
TO-218, TO-247
Extruded heat sink with radial fins and device clip #52
25.40 (1.000)
21.59 (0.850)
2.67 (0.105)
533702B02552G
TO-220
Extruded heat sink with radial fins and device clip #52
25.40 (1.000)
18.29 (0.720)
2.67 (0.105)
533721B02552G
Dual TO-218, TO-247
With 2 device clips #52
25.40 (1.000)
21.59 (0.850)
2.67 (0.105)
533722B02552G
Dual TO-220
With 2 device clips #52
25.40 (1.000)
18.29 (0.720)
2.67 (0.105)
For additional options see page 83
AMERICA
EUROPE
www.aavidthermalloy.com
USA Tel: +1 (603) 224-9988 email: [email protected]
Italy Tel: +39 051 764011 email: [email protected]
United Kingdom Tel: +44 1793 401400 email: [email protected]
ASIA
Singapore Tel: +65 6362 8388 email: [email protected]
Taiwan Tel: +886(2) 2698-9888 email: [email protected]
57
TO-220 & TO-218 & TO-247 Heat Sinks
Grease
&
Epoxy
page112
0
Air Velocity—Feet Per Minute
400
200
600
800
100
Wide extruded heat sink with
unequal channel widths on front
and back can accommodate a TO-220,
TO-218, or TO-247 device. Includes two
solderable mounting pins which permit
vertical mounting and eliminate stress
on device leads. Available in three heights.
Versions without hole use clip 6801 (sold
separately) to attach device. See page 97
for clip information.
1000
10
80
8
60
6
40
4
20
2
0
0
0
4
8
12
16
Heat Dissipated—Watts
BW38
BW50
BW63
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
Wide extruded heat sink with unequal channel
Mounting Surface Temp
Rise Above Ambient—°C
Mounting
Kits
page 99
ø 3.6
(0.144)
"A"
21.60
(0.850)
20
4.00
2.60
(0.101) (0.157)
25.40
(1.000)
34.90
(1.375)
25.40
(1.000)
12.70
(0.500)
2.00
(0.079)
Part Number
Description
BW38-2G
Extruded heat sink with unequal channel widths front and back
38.00 (1.496)
No
3.00 (0.118)
BW38-4G
With device mounting hole
38.00 (1.496)
Yes
3.00 (0.118)
BW50-2G
Extruded heat sink with unequal channel widths front and back
50.00 (1.968)
No
3.00 (0.118)
BW50-4G
With device mounting hole
50.00 (1.968)
Yes
3.00 (0.118)
BW63-2G
Extruded heat sink with unequal channel widths front and back
63.00 (2.480)
No
3.00 (0.118)
BW63-4G
With device mounting hole
63.00 (2.480)
Yes
3.00 (0.118)
“A” Dim
Grease
&
Epoxy
page112
Extruded heat sink with radial fins
0
200
Air Velocity—Feet Per Minute
400
600
800
Mounting Surface Temp
Rise Above Ambient—°C
100
1000
10
80
8
60
6
40
4
20
2
0
0
0
2
51300X
51310X
4
6
Heat Dissipated—Watts
8
"C"
"A"
10
0
200
Air Velocity—Feet Per Minute
400
600
800
5
80
4
60
3
40
2
20
1
0
0
51320X
51330X
2
4
6
Heat Dissipated—Watts
8
3.18
(0.125)
1000
0
“B” Dim
“C” Dim
“D” Dim
"E"
2x ø 2.37
(0.093)
25.40
(1.000)
1.57
(0.062)
12.70
(0.500)
10
"D"
34.92
(1.375)
Dia of PCB
Plated Thru
Hole for Pins
ORDERING INFORMATION
“A” Dim
2x 3.96
(0.156)
"B"
100
Mounting Surface Temp
Rise Above Ambient—°C
Extruded heat sink with radial fins
feature equal channel widths on
both sides for single or dual device
mounting. Includes two solderable
mounting pins which permit vertical
mounting and eliminate stress on
device leads. Available in four heights
for TO-220,TO-218, and TO-247 devices.
Mounting
Kits
page 99
17.48
(0.688)
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
5130, 5131, 5132, 5133
Material: Aluminum
Finish: Black Anodize
Dia of PCB
Plated Thru
Holes Hole for Pins
ORDERING INFORMATION
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
BW38, BW50, BW63
Part Number
Device
“E” Dim
513001B02500G
TO-218, TO-247
25.40 (1.000)
21.59 (0.850)
3.66 (0.144)
17.02 (0.670)
13.72 (0.540)
2.67 (0.105)
513002B02500G
TO-220
25.40 (1.000)
18.29 (0.720)
3.17 (0.125)
15.88 (0.625)
11.10 (0.437)
2.67 (0.105)
513101B02500G
TO-218, TO-247
38.10 (1.500)
21.59 (0.850)
3.66 (0.144)
17.02 (0.670)
13.72 (0.540)
2.67 (0.105)
513102B02500G
TO-220
38.10 (1.500)
18.29 (0.720)
3.17 (0.125)
15.88 (0.625)
11.10 (0.437)
2.67 (0.105)
513201B02500G
TO-218, TO-247
50.80 (2.000)
21.59 (0.850)
3.66 (0.144)
17.02 (0.670)
13.72 (0.540)
2.67 (0.105)
513202B02500G
TO-220
50.80 (2.000)
18.29 (0.720)
3.17 (0.125)
15.88 (0.625)
11.10 (0.437)
2.67 (0.105)
513301B02500G
TO-218, TO-247
63.50 (2.500)
21.59 (0.850)
3.66 (0.144)
17.02 (0.670)
13.72 (0.540)
2.67 (0.105)
513302B02500G
TO-220
63.50 (2.500)
18.29 (0.720)
3.17 (0.125)
15.88 (0.625)
11.10 (0.437)
2.67 (0.105)
Material: Aluminum
Finish: Black Anodize
For additional options see page 83
58
AMERICA
EUROPE
www.aavidthermalloy.com
USA Tel: +1 (603) 224-9988 email: [email protected]
Italy Tel: +39 051 764011 email: [email protected]
United Kingdom Tel: +44 1793 401400 email: [email protected]
ASIA
Singapore Tel: +65 6362 8388 email: [email protected]
Taiwan Tel: +886(2) 2698-9888 email: [email protected]
80
8
60
6
40
4
Mounting Surface Temp
Rise Above Ambient—°C
200
20
2
0
0
2
531002
531102
4
6
Heat Dissipated—Watts
8
1000
10
80
8
Mounting Surface Temp
Rise Above Ambient—°C
60
6
40
4
20
2
0
0
0
2
531202
531302
ORDERING INFORMATION
“A” Dim
531002B02500G 25.40 (1.000)
531002V02500G 25.40 (1.000)
531102B02500G 38.10 (1.500)
531102V02500G 38.10 (1.500)
531202B02500G 50.80 (2.000)
531202V02500G 50.80 (2.000)
531302B02500G 63.50 (2.500)
531302V02500G 63.50 (2.500)
Finish
4
6
Heat Dissipated—Watts
"A"
10
100
0
SEE NOTE 1
3x ø 3.18
(0.125)
25.40
(1.000) 18.29
(0.720)
Air Velocity—Feet Per Minute
400
200
600
800
8
13.46
(0.530)
9.40
(0.370)
2.67 (0.105)
Black anodize
AavSHIELD3
2.67 (0.105)
Black anodize
AavSHIELD3
2.67 (0.105)
Black anodize
AavSHIELD3
2.67 (0.105)
2x 3.96
(0.156)
11.10
(0.437)
25.40
(1.000)
2x ø 2.37
(0.093)
1.57
(0.062)
12.70
(0.500)
10
15.88
(0.625)
34.92
(1.375)
Dia of PCB
Plated Thru
Hole for Pins
Black anodize
AavSHIELD3
Mounting
Kits
page 99
17.48
(0.688)
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
1000
10
0
Extruded heat sink with radial
fins and notched base features
equal channel widths on both sides
and mounting holes to accomodate
TO-220 and TO-202 devices. Includes
two solderable mounting pins which
permit vertical mounting and eliminate stress on device leads. Available
in four heights.
Air Velocity—Feet Per Minute
400
600
800
100
0
Part Number
Grease
&
Epoxy
page112
Extruded heat sink with radial fins & notched base
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
5310, 5311, 5312, 5313
Material: Aluminum
Finish: See Table
NOTE 1: This hole not present in 5310 series
2.67 (0.105)
THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
TO-220 & TO-202 Heat Sinks
2.67 (0.105)
2.67 (0.105)
2.67 (0.105)
For additional options see page 83
Grease
&
Epoxy
page112
Extruded heat sink with unequal channel widths
0
Air Velocity—Feet Per Minute
400
200
600
800
Mounting Surface Temp
Rise Above Ambient—°C
100
1000
10
80
8
60
6
40
4
20
2
0
0
0
Extruded heat sink with unequal
channel widths front and back
can accommodate a TO-220 or
TO-202 device. Includes two solderable mounting pins which permit
vertical mounting and eliminate stress
on device leads. Clip 5901 (sold separately) can be used to attach device.
See page 97 for clip information.
2
SW25
SW38
4
6
Heat Dissipated—Watts
8
6.25
(0.246)
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
SW25-6, SW38-6
12.50
(0.492)
Mounting
Kits
page 99
34.50
(1.358)
2.00
(0.079)
SEE NOTE 1
10
"A"
25.00
(0.984) 19.90
(0.783) 15.00
(0.591)
4.00
(0.157)
NOTCH
11mm DEEP
10.4mm WIDE
ø 3.20
(0.126) TYP
2.50
(0.098)
25.40
(1.000)
Part Number
Description
“A” Dim
Dia of PCB
Plated Thru
Hole for Pins
SW25-6G
Extruded heat sink with unequal channel widths front and back
25.00 (0.984)
3.00 (0.118)
SW38-6G
Extruded heat sink with unequal channel widths front and back.
38.00 (1.496)
3.00 (0.118)
ORDERING INFORMATION
NOTE 1: This hole not present in SW25 series
AMERICA
EUROPE
www.aavidthermalloy.com
USA Tel: +1 (603) 224-9988 email: [email protected]
Italy Tel: +39 051 764011 email: [email protected]
United Kingdom Tel: +44 1793 401400 email: [email protected]
ASIA
Material: Aluminum
Finish: Black Anodize
Singapore Tel: +65 6362 8388 email: [email protected]
Taiwan Tel: +886(2) 2698-9888 email: [email protected]
59
TO-220 & TO-218 & TO-247 & Multiwatt Heat Sinks
Grease
&
Epoxy
page112
High power extruded heat sink with large radial fins
Mounting Surface Temp
Rise Above Ambient—°C
5
80
4
60
3
40
2
20
1
0
0
0
High power extruded heat sink
with large radial fins and solderable shoulder pins allows vertical
mounting without stress on the
device leads. Available with shoulder pins to provide fixed clearance
between the bottom of the heat
sink and the board. Available in
four heights for TO-220, TO-218,
TO-247and multiwatt devices.
4
6396
6398
0
8
12
16
Heat Dissipated—Watts
Air Velocity—Feet Per Minute
400
200
600
800
1000
80
4
60
3
40
2
20
1
0
0
4
8
12
16
Heat Dissipated—Watts
ORDERING INFORMATION
“A” Dim
"A"
19.05
(0.750)
5
0
ø 3.81
(0.150)
20
100
6399
6400
Mounting
Kits
page 99
1000
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
Air Velocity—Feet Per Minute
400
200
600
800
3.96
(0.156)
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
0
100
Mounting Surface Temp
Rise Above Ambient—°C
THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
6396, 6398, 6399, 6400
2.21
(0.087)
SEE DETAIL A
P2 MODEL ONLY
25.40
(1.000)
41.91
(1.650)
0.78
(0.031)
25.40
(1.000)
20
1.57
(0.062)
Dia of PCB
Plated Thru
Hole for Pins
Part Number
Description
6396BG
Extruded heat sink with large radial fins and straight pins
25.40 (1.000)
2.89 (0.114)
6396B-P2G
With solderable shoulder pins
25.40 (1.000)
3.10 (0.122)
6398BG
Extruded heat sink with large radial fins and straight pins
38.10 (1.500)
2.89 (0.114)
6398B-P2G
With solderable shoulder pins
38.10 (1.500)
3.10 (0.122)
6399BG
Extruded heat sink with large radial fins and straight pins
50.80 (2.000)
2.89 (0.114)
6399B-P2G
With solderable shoulder pins
50.80 (2.000)
3.10 (0.122)
6400BG
Extruded heat sink with large radial fins and straight pins
63.50 (2.500)
2.89 (0.114)
6400B-P2G
With solderable shoulder pins
63.50 (2.500)
3.10 (0.122)
1.27
(0.050)
DETAIL A
P2 MODEL ONLY
2.46 REF
(0.097)
2.41
(0.095)
5.49 REF
(0.216)
Material: Aluminum
Finish: Black Anodize
For additional options see page 85
Grease
&
Epoxy
page112
High power extruded heat sink
0
Air Velocity—Feet Per Minute
400
200
600
800
Mounting Surface Temp
Rise Above Ambient—°C
5
80
4
60
3
40
2
20
1
0
0
0
High power extruded heat sink
for SIP packages. Solderable pins
allow vertical mounting without
stress on the device leads. Available
in three heights. Can also be used
for dual TO-220, TO-218, TO-247
and multiwatt devices.
4
6380
6381
6382
8
12
16
Heat Dissipated—Watts
ø 3.81
(0.150)
"A"
20
18.29
(0.720)
3.96
(0.156)
2.21
(0.087)
Part Number
Description
“A” Dim
Dia of PCB
Plated Thru
Hole for Pins
6380BG
Extruded heat sink with solderable pins
25.40 (1.000)
2.89 (0.114)
6381BG
Extruded heat sink with solderable pins
38.10 (1.500)
2.89 (0.114)
6382BG
Extruded heat sink with solderable pins
50.80 (2.000)
2.89 (0.114)
ORDERING INFORMATION
Mounting
Kits
page 99
1000
100
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
6380, 6381, 6382
11.91
(0.469)
9.93
(0.391)
19.86
(0.782)
33.05
(1.301)
31.74
(1.250)
1.58
(0.062)
25.40
(1.000)
2.64
(0.104)
28.70
(1.130)
41.91
(1.650)
For additional options see page 85
Material: Aluminum
Finish: Black Anodize
60
AMERICA
EUROPE
www.aavidthermalloy.com
USA Tel: +1 (603) 224-9988 email: [email protected]
Italy Tel: +39 051 764011 email: [email protected]
United Kingdom Tel: +44 1793 401400 email: [email protected]
ASIA
Singapore Tel: +65 6362 8388 email: [email protected]
Taiwan Tel: +886(2) 2698-9888 email: [email protected]
Grease
&
Epoxy
page112
Extruded heat sink for SIP packages
0
Air Velocity—Feet Per Minute
400
200
600
800
5
80
4
Mounting Surface Temp
Rise Above Ambient—°C
100
Extruded heat sink for SIP
packages. Solderable pins
allow vertical mounting
without stress on the device
leads. Can also be used for
dual TO-220, TO-218, TO-247,
and multiwatt devices.
60
3
40
2
20
1
0
0
0
2
4
6
8
Heat Dissipated—Watts
Mounting
Kits
page 99
ø 3.81
(0.150) 2X
1000
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
6374
DETAIL A
31.75
(1.250)
17.78
(0.700)
3.96
(0.156)
24.38
(0.960)
59.99
(2.362)
38.10
(1.500)
32.00
(1.260)
17.50
(0.689)
10
2.18
(0.086)
SEE DETAIL A
16.00
(0.630)
Dia of PCB
Plated Thru
Hole for Pins
ORDERING INFORMATION
Part Number
Description
6374BG
Extruded heat sink with solderable pins
2.92
(0.115)
8.00
(0.315)
2.89 (0.114)
Material: Aluminum
Finish: Black Anodize
For additional options see page 85
Grease
&
Epoxy
page112
High power flat back extruded channel style heat sink
0
Air Velocity—Feet Per Minute
400
200
600
800
Mounting Surface Temp
Rise Above Ambient—°C
100
High power flat back extruded channel
style heat sink features a wide channel
to accommodate several devices. Includes
two solderable pins to allow vertical
mounting without stress on the device
leads. Can be used with TO-220, TO-218,
TO-247, and multiwatt devices.
80
8
60
6
40
4
20
2
0
0
0
2
4
6
Heat Dissipated—Watts
8
Part Number
Description
YB32-4G
High power flat back extruded heat sink
2X 4.00
(0.157)
10
38.30
(1.508)
8.00
(0.315)
3.48 (0.137)
Material: Aluminum
Finish: Black Anodize
Grease
&
Epoxy
page112
Mounting Surface Temp
Rise Above Ambient—°C
1000
10
80
8
60
6
40
4
20
2
0
0
58100X
58110X
58120X
1
2
3
Heat Dissipated—Watts
4
#6 - 32 UNC THRU
"A"
5
"B"
Part Number
Device
“A” Dim
“B” Dim
Dia of PCB
Plated Thru
Hole for Pins
581001B02500G
TO-218
25.40 (1.000)
21.59 (0.850)
2.67 (0.105)
581002B02500G
TO-220
25.40 (1.000)
18.29 (0.720)
2.67 (0.105)
581101B02500G
TO-218
38.10 (1.500)
21.59 (0.850)
2.67 (0.105)
581102B02500G
TO-220
38.10 (1.500)
18.29 (0.720)
2.67 (0.105)
581201B02500G
TO-218
50.80 (2.000)
21.59 (0.850)
2.67 (0.105)
581202B02500G
TO-220
50.80 (2.000)
18.29 (0.720)
2.67 (0.105)
ORDERING INFORMATION
Mounting
Kits
page 99
8.13
(0.320)
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
Air Velocity—Feet Per Minute
400
200
600
800
0
3.96
(0.156)
USA Tel: +1 (603) 224-9988 email: [email protected]
Italy Tel: +39 051 764011 email: [email protected]
United Kingdom Tel: +44 1793 401400 email: [email protected]
10.29
(0.405)
16.26
(0.640)
ASIA
2.36
(0.093)
TYP 2
3.45
(0.136)
16.26
(0.640)
For additional options see page 83
AMERICA
EUROPE
4.70
(0.185)
60.00
(2.362)
Flat back extruded heat sink featuring solderable pins
Flat back extruded heat sink features
solderable pins which allow vertical
mounting without stess on the device
leads. Available in three heights for
TO-220 and TO-218 devices.
2X 3.00
(0.118)
16.00
(0.630)
100
www.aavidthermalloy.com
32.00
(1.260)
19.00
(0.748)
32.00
(1.260)
0
Mounting
Kits
page 99
Ø 3.10 THRU
(0.122)
Dia of PCB
Plated Thru
Hole for Pins
ORDERING INFORMATION
5810, 5811, 5812
1000
10
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
YB32-4
THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
TO-220 & TO-218 & TO-247 & Multiwatt Heat Sinks
Material: Aluminum
Finish: Black Anodize
Singapore Tel: +65 6362 8388 email: [email protected]
Taiwan Tel: +886(2) 2698-9888 email: [email protected]
61
TO-218 Heat Sinks
Mounting
Kits
page 99
Plug in style heat sink
200
Air Velocity—Feet Per Minute
400
600
800
Mounting Surface Temp
Rise Above Ambient—°C
100
Plug in style heat sink requires no
hardware to attach to the device.
The four spring action clips apply
even pressure eliminating gaps
between the heat sink and device
which rob thermal performance.
25.40
(1.000)
1000
2.0
80
1.6
60
1.2
40
0.8
20
0.4
0
0
0
4
8
12
16
Heat Dissipated—Watts
11.94
(0.470)
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
0
12.70
(0.500)
49.53
(1.950)
26.54
(1.045)
50.04
(1.970)
20
1.02
(0.040)
5.08
(0.200)
1.27
(0.050)
1.90
(0.075)
0.81
(0.032)
24.89
(0.980)
Dia of PCB
Plated Thru
Hole for Tabs
ORDERING INFORMATION
Part Number
Description
592201B03400G
High power plug in heat sink with folded back fins
and solderable mounting tabs
Material: 1.27 (0.050) Thick Aluminum
Finish: Black Anodize
2.39 (0.094)
For additional options see page 82
Grease
&
Epoxy
page112
Channel style heat sink with folded back fins
Air Velocity—Feet Per Minute
400
200
600
800
100
1000
10
80
8
60
6
40
4
20
2
0
Channel style heat sink with
folded back fins for extra cooling
capacity. The heat sink features solderable tabs for easy attachment
to the PC board.
0
0
0
2
4
6
Heat Dissipated—Watts
8
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
5931
Mounting Surface Temp
Rise Above Ambient—°C
THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
5922
10
ø 3.81 THRU
(0.150)
41.66
(1.640)
CL
6.22
(0.245)
24.77
(0.975)
20.57
(0.810)
Dia of PCB
Plated Thru
Hole for Tabs
Part Number
Description
593101B03600G
Channel style heat sink with folded back fins
and solderable tabs
5.08
(0.200)
2.54
(0.100)
0.81
(0.032)
1.27
(0.050)
43.18
(1.700)
ORDERING INFORMATION
Mounting
Kits
page 99
1.02
(0.040)
12.70
(0.500)
8.89
(0.350)
2.92 (0.115)
Material: 1.27 (0.050) Thick Aluminum
Finish: Black Anodize
POPULAR OPTIONS: 593101B 0 0000G
Base part no.
Position
Code
Description
A
Details
A
1
Kon-DuxTM pad Page 86
A
3
In-Sil-8TM pad
Page 86
For additional options see page 82
Copper slide on heat sink
0
Air Velocity—Feet Per Minute
400
200
600
800
Mounting Surface Temp
Rise Above Ambient—°C
100
Copper slide on heat sink
requires no hardware to
attach the device. In addition,
the copper heat sink is tin/lead
plated to allow easy soldering
to the PC board.
8
60
6
40
4
20
2
0
0
0
1
2
3
4
Heat Dissipated—Watts
26.04
(1.025)
17.15
(0.675)
16.51
(0.650)
5
3.81
(0.150)
1.27
(0.050)
1.27
(0.050)
2.79
(0.110)
9.52
(0.375)
15.49
(0.610)
25.53
(1.005)
Dia of PCB
Plated Thru
Hole for Tabs
Part Number
Description
7130DG
Slide on, channel style heat sink with integrated tabs
AMERICA
EUROPE
www.aavidthermalloy.com
1000
10
80
ORDERING INFORMATION
62
Top cut away
to show detail
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
7130
Material: 0.63 (0.025) Thick Copper
Finish: Tin Plated
2.54 (0.100)
USA Tel: +1 (603) 224-9988 email: [email protected]
Italy Tel: +39 051 764011 email: [email protected]
United Kingdom Tel: +44 1793 401400 email: [email protected]
ASIA
Singapore Tel: +65 6362 8388 email: [email protected]
Taiwan Tel: +886(2) 2698-9888 email: [email protected]
Grease
&
Epoxy
page112
Low profile hat section heat sink
1000
20
80
16
60
12
40
8
20
4
Mounting Surface Temp
Rise Above Ambient—°C
0
Low profile hat section heat sink
has a total height of 0.375 making
it perfect for mounting to printed
circuit boards with 0.500 centering
between boards.
Air Velocity—Feet Per Minute
400
200
600
800
100
0
0
0
1
2
3
Heat Dissipated—Watts
4
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
5063
10.41
(0.410)
44.45
(1.750)
5.59
(0.220)
17.78
(0.700)
ø3.66
(0.144)
THRU
5
7.78
(0.700)
9.52
(0.375)
Part Number
Description
506304B00000G
Hat section heat sink
Material: 1.02 (0.040) Thick Aluminum
Finish: Black Anodize
For additional options see page 84
Low cost slide on heat sink
1000
20
Mounting Surface Temp
Rise Above Ambient—°C
Low cost slide on heat sink
provides positive retention with
an integral locking tab. The spring
tension ensures excellent thermal
contact for maximum performance.
Requires no hardware to mount.
80
16
60
12
40
8
20
4
0
0
0
1
2
3
Heat Dissipated—Watts
4
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
0
20.32
(0.800)
Air Velocity—Feet Per Minute
400
200
600
800
100
ø 2.36
(0.093)
DITTIN
9.40
(0.370)
10.16
(0.400)
14.66
(0.577)
5
Material: 0.63 (0.025) Thick Aluminum
Finish: See Table
Finish
574004B00000G
Black anodize
574004U00000G
Unfinished
6.35
(0.250)
7.75
(0.305)
ORDERING INFORMATION
Part Number
NOTCH IS
0.410 WIDE
X 0.220 DEEP
13.46
(0.530)
ORDERING INFORMATION
5740
Mounting
Kits
page 99
THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
TO-202 Heat Sinks
5742, 5796, 5797 Low cost slide on cooler heat sink
FIGURE A
FIGURE B
ø 2.36
(0.093)
22.86
5.97
(0.240) 15.88 (0.900)
(0.630)
22.86
(0.900)
25.15
(0.990)
Low cost slide on cooler heat sink
is easy to assemble to the device
and requires no mounting hardware.
Models have fins on both sides, or
the left or right. Available with or
without staked on solderable tab
for easy board mounting.
25.91
(1.020)
10.67
(0.420)
0.51
(0.020)
TAB
9.52
(0.380)
18.54
(0.730)
1.57
(0.062)
10.67
(0.420)
REF
1.57
(0.062)
18.92
(0.750)
10.67
(0.420)
10.67
(0.420)
REF
Material: 0.63 (0.025) Thick Aluminum
Finish: Black Anodize
Low cost slide on cooler, no solderable tabs
Figure
A
574204B03300G
With solderable tabs
A
579604B00000G
With left side fin only, no solderable tabs
B
579604B03300G
With left side fin only and solderable tabs
B
579704B00000G
With right side fin only, no solderable tabs
B
579704B03300G
With right side fin only and solderable tabs
B
100
1.910 (0.075)
1.910 (0.075)
574204
579604
579704
For additional options see page 84
USA Tel: +1 (603) 224-9988 email: [email protected]
ASIA
1000
20
80
16
60
12
40
8
20
4
0
0
0
1.910 (0.075)
Italy Tel: +39 051 764011 email: [email protected]
United Kingdom Tel: +44 1793 401400 email: [email protected]
Air Velocity—Feet Per Minute
400
200
600
800
1
2
3
Heat Dissipated—Watts
4
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
Description
574204B00000G
0
Dia of PCB
Plated Thru
Hole for Tabs
Mounting Surface Temp
Rise Above Ambient—°C
Part Number
www.aavidthermalloy.com
9.52
(0.380)
TAB
Note: Fins on Left or Right. Right hand fin model shown.
ORDERING INFORMATION
AMERICA
EUROPE
0.51
(0.020)
5
Singapore Tel: +65 6362 8388 email: [email protected]
Taiwan Tel: +886(2) 2698-9888 email: [email protected]
63
TO-202 Heat Sinks
Grease
&
Epoxy
page112
16
60
12
40
8
20
4
0
0
1
576904
577304
577404
2
3
Heat Dissipated—Watts
4
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
80
0
ORDERING INFORMATION
Part Number
ø 3.81 THRU
(0.150)
100
Mounting Surface Temp
Rise Above Ambient—°C
Slim low profile channel style
heat sink is notched to accommodate the TO-202 center tab
packages. Available in 3 heights.
Air Velocity—Feet Per Minute
400
200
600
800
1000
20
0
Mounting
Kits
page 99
3.81
(0.150)
13.21 REF
(0.520)
13.34
(0.525)
19.05
(0.750) REF
5
"A"
“A” Dim
576904B00000G
6.35 (0.250)
577304B00000G
9.53 (0.375)
Material: 1.27 (0.050) Thick Aluminum
Finish: Black Anodize
577404B00000G 12.70 (0.500)
For additional options see page 84
Grease
&
Epoxy
page112
Space saving staggered fin heat sink
0
Air Velocity—Feet Per Minute
400
200
600
800
100
Space saving heat sink features
staggered fins for increased cooling
efficiency. This verticle mount heat
sink features integrated matte tin
plated tabs to solder directly to the
PC board.
1000
10
80
8
60
6
40
4
20
2
0
0
0
2
4
6
8
Heat Dissipated—Watts
Mounting
Kits
page 99
3.15
(0.124)
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
6034
Mounting Surface Temp
Rise Above Ambient—°C
THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
5769, 5773, 5774 Slim low profile channel style heat sink
12.70
(0.500)
9.35
(0.368)
50.80
(2.000)
17.87
(0.704)
10
2.46
(0.097)
1.27
(0.050)
4.75
(0.187)
25.40
(1.000)
35.05
(1.380)
Dia of PCB
Plated Thru
Hole for Tabs
ORDERING INFORMATION
Part Number
Description
6034DG
Space saving staggered fin heat sink with
integrated tin plated tabs
6046, 6047
Material: 1.27 (0.050) Thick Copper
Finish: Tin Plated
3.10 (0.122)
Compact slide on heat sink
FIGURE A
15.24
(0.600)
7.62 O.D.
(0.300)
FIGURE B
"A"
15.24
(0.600)
21.59
(0.850)
REF
7.62 O.D.
(0.300)
21.59
(0.850)
REF
6.35
(0.250)
Compact slide on heat sink
makes assembly easy. The 6046
features a positive device catch
to lock the heat sink to the device.
SECTION A–A
"A"
6.35
(0.250)
"A"
SECTION A–A
10.41
(0.410)
"A"
10.41
(0.410)
Material: 0.63 (0.025) Thick Aluminum
Finish: Pre-Black Anodize*
Description
Figure
6046PBG
With device catch
A
6047PBG
Compact slide on heat sink
B
Mounting Surface Temp
Rise Above Ambient—°C
Part Number
*Edges cut during the manufacturing process will be unfinished.
See page 110 for more information.
AMERICA
EUROPE
www.aavidthermalloy.com
Air Velocity—Feet Per Minute
400
600
800
1000
20
80
16
60
12
40
8
20
4
0
0
0
64
200
100
USA Tel: +1 (603) 224-9988 email: [email protected]
Italy Tel: +39 051 764011 email: [email protected]
United Kingdom Tel: +44 1793 401400 email: [email protected]
ASIA
1
2
3
4
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
0
ORDERING INFORMATION
5
Singapore Tel: +65 6362 8388 email: [email protected]
Taiwan Tel: +886(2) 2698-9888 email: [email protected]
Slip on heat sink
1000
20
80
16
60
12
40
8
20
4
0
0
Mounting Surface Temp
Rise Above Ambient—°C
0
Slip on heat sink requires no
hardware to attach to the device.
Spring pressure ensures excellent
retention. May be assembled
before or after the device is
attached to the board.
Air Velocity—Feet Per Minute
400
200
600
800
100
0
1
2
3
Heat Dissipated—Watts
4
13.21
(0.520)
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
5775
19.81
(0.780)
0.63
(0.025)
5
8.13
(0.320)
7.87
(0.310)
ORDERING INFORMATION
Part Number
Finish
577500B00000G
Black anodize
577500U00000G
Unfinished
TV4
10.67
(0.420)
Material: 0.63 (0.025) Thick Aluminum
Finish: See Table
Grease
&
Epoxy
page112
Narrow channel style heat sink featuring twisted fins
Mounting
Kits
page 99
CL
1000
20
Mounting Surface Temp
Rise Above Ambient—°C
100
80
16
60
12
40
8
20
4
0
0
0
Narrow channel style heat
sink features twisted fins
for increased air turbulance for
better cooling. Can be mounted
horizontally or vertically.
1
2
3
4
Heat Dissipated—Watts
4.00
(0.158)
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
0
Air Velocity—Feet Per Minute
400
200
600
800
THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
TO-126 Heat Sinks
22.00
(0.866)
5
19.00
(0.749)
ORDERING INFORMATION
Part Number
Description
TV4G
Narrow channel style heat sink with twisted fins
19.00
(0.749)
13.40
(0.528)
Material: 1.63 (0.064) Thick Aluminum
Finish: Black Anodize
Slip on heat sink
FIGURE A
FIGURE B
3.20
(0.126)
13.20
(0.520)
8.60
(0.338)
8.60 17.90
(0.338) (0.705)
3.00
(0.118)
4.00
(0.157)
Slip on heat sink has locating
features for simple device alignment. Spring action holds the
device for good thermal contact.
The tabbed version is made from
tin plated copper and the no tab
version is lightweight aluminum.
4.00
(0.157)
TAB
11.50
(0.453)
11.50
(0.453)
1.30
(0.511)
3.40
(0.139)
0
Mounting Surface Temp
Rise Above Ambient —°C
Description
PF730G
Slip on heat sink
PF732G
With solderable tabs
Material
Finish
Figure
Aluminum
Black anodize
B
Copper
Tin plated
A
AMERICA
EUROPE
www.aavidthermalloy.com
19.70
(0.775)
3.00
(0.118)
ORDERING INFORMATION
Part Number
8.10
(0.319)
13.20
(0.520)
8.10
(0.319)
USA Tel: +1 (603) 224-9988 email: [email protected]
Italy Tel: +39 051 764011 email: [email protected]
United Kingdom Tel: +44 1793 401400 email: [email protected]
Air Velocity—Feet Per Minute
400
200
600
800
1000
100
50
80
40
60
30
40
20
20
10
0
0
0
ASIA
1
2
3
Heat Dissipated—Watts
4
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
PF730, PF732
5
Singapore Tel: +65 6362 8388 email: [email protected]
Taiwan Tel: +886(2) 2698-9888 email: [email protected]
65
SIPS
Plug in style heat sink
FIGURE B
FIGURE A
10.67
(0.420)
TAB
22.86
(0.900)
CL
0.81
(0.032) 1.91
(0.075)
12.70
(0.500)
12.70
(0.500)
8.13
(0.320)
5.03
(0.198)
30.99
(1.220)
25.40
(1.000)
15.88
CL (0.625)
30.99
(1.220)
Material: 1.27 (0.050) Thick Aluminum
Finish: Black Anodize
ORDERING INFORMATION
Dia of PCB
Plated Thru
Hole for Tabs
Part Number
Description
566010B00000G
Plug in style heat sink, no solderable tabs
B
566010B03100G
With solderable tab for horizontal mounting
B
1.73 (0.068)
566010B03400G
With solderable tabs for vertical mounting
A
2.39 (0.094)
POPULAR OPTIONS:
Figure
Code
A
28
200
A
Description
Details
Solderable Shur-LockTM Tab for vertical mounting
Page 91
1.27
(0.050)
12.06
(0.475)
25.40
(1.000)
Air Velocity—Feet Per Minute
400
600
800
100
566010B0 00 00G
Base part no.
Position
0
4.06
(0.160)
1000
10
80
8
60
6
40
4
20
2
0
0
0
2
4
6
Heat Dissipated—Watts
8
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
Plug in style heat sink features
four spring action clips to firmly
hold the device to the heat sink
ensuring maximum metal to metal
contact. Available with or without
solderable tabs for horizontal or
vertical mounting to the PC board.
Mounting Surface Temp
Rise Above Ambient—°C
THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
5660
10
For additional options see page 84
Channel style heat sink with integrated clip
0
200
Air Velocity—Feet Per Minute
400
600
800
Mounting Surface Temp
Rise Above Ambient—°C
100
80
16
60
12
40
8
20
4
0
0
0
Channel style heat sink with
integrated clip features strong
spring tension and device locking
catch to attach device securely to
the heat sink. Available in two finishes.
1000
20
1
2
3
Heat Dissipated—Watts
4
CL
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
5305
ø 3.30
(0.130)
LOCKING CATCH
3.73
(0.147)
15.75
(0.620)
3.81
(0.150)
12.70
(0.500)
5
9.65
(0.380)
0.64
(0.025)
21.46
(0.845)
Material: 0.81 (0.032) Thick Aluminum
Finish: See Table
ORDERING INFORMATION
66
Part Number
Finish
530510U00000G
Unfinished
530510B00000G
Black anodize
AMERICA
EUROPE
www.aavidthermalloy.com
USA Tel: +1 (603) 224-9988 email: [email protected]
Italy Tel: +39 051 764011 email: [email protected]
United Kingdom Tel: +44 1793 401400 email: [email protected]
ASIA
Singapore Tel: +65 6362 8388 email: [email protected]
Taiwan Tel: +886(2) 2698-9888 email: [email protected]
SIPS
0
Air Velocity—Feet Per Minute
400
200
600
800
Mounting Surface Temp
Rise Above Ambient—°C
100
A
1000
10
80
8
60
6
40
4
20
2
0
0
0
1
Channel style slide on heat sink
features an integrated clip and
device retaining tab to hold the
heat sink to the device. Small footprint consumes less board space.
2
3
Heat Dissipated—Watts
4
1.65
(0.065)
15.75
(0.620)
SECTION A–A
5
15.24
(0.600)
6.35
(0.250)
9.65
(0.380)
23.24
(0.915)
Material: 0.81 (0.032) Thick Aluminum
Finish: Black Anodize
Part Number
Description
7038BG
Channel style slide on heat sink
Copper channel style slide on heat sink featuring an integrated clip and solderable tabs
100
1000
10
80
8
60
6
40
4
20
2
0
0
0
Mounting Surface Temp
Rise Above Ambient—°C
Air Velocity—Feet Per Minute
400
200
600
800
0
Copper channel style slide on
heat sink features an integrated
clip and solderable tabs. Includes
a device retaining tab to securely
hold the heat sink to the device.
Small footprint consumes less
board space.
1
2
3
Heat Dissipated—Watts
4
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
A
15.24
(0.600)
SECTION A–A
17.78
(0.700)
20.19
(0.795)
4.06
(0.160)
MAX
A
5
DETAIL E
23.24
(0.915)
MAX AT BASE
Description
7148DG
Slide on heat sink with integrated clip
5.08
(0.200)
2.79 - 3.18
(0.110) - (0.125)
Dia of PCB
Plated Thru
Hole for Tabs
Part Number
E
1.90
(0.075)
9.65
(0.380)
ORDERING INFORMATION
1.27
(0.050)
3.81
(0.150)
2.54 (0.100)
Material: 0.81 (0.032) Thick Copper
Finish: Tin Plated
Clip on heat sink featuring louvers
Mounting Surface Temp
Rise Above Ambient—°C
0
Air Velocity—Feet Per Minute
400
200
600
800
100
5
80
4
60
3
40
2
20
1
0
0
0
Clip on heat sink features louvers
to provide excellent cooling in natural
or forced air convection. Spring action
provides strong clamping force to
securely hold the heat sink to the
device. Available with or without
solderable tabs.
31.75
(1.250)
1000
2
4
6
Heat Dissipated—Watts
8
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
5840
3.95
(0.155)
A
ORDERING INFORMATION
7148
13.28
(0.523)
THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
Channel style slide on heat sink featuring an integrated clip and device retaining tab
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
7038
9.91
(0.390)
ø 3.18
(0.125)
DITTIN
TYP 2
43.18
(1.700)
10
5.84
(0.230)
TAB
2.46
(0.097)
9.91
(0.390)
3.18
(0.125)
0.81
(0.032)
29.21
(1.150)
Dia of PCB
Plated Thru
Hole for Tabs
ORDERING INFORMATION
Part Number
Description
584000B00000G
Clip on heat sink. no solderable tabs
584000B03500G
With solderable tabs for vertical mounting
Material: 1.02 (0.040) Thick Aluminum
Finish: Black Anodize
2.84 (0.112)
For additional options see page 84
AMERICA
EUROPE
www.aavidthermalloy.com
USA Tel: +1 (603) 224-9988 email: [email protected]
Italy Tel: +39 051 764011 email: [email protected]
United Kingdom Tel: +44 1793 401400 email: [email protected]
ASIA
Singapore Tel: +65 6362 8388 email: [email protected]
Taiwan Tel: +886(2) 2698-9888 email: [email protected]
67
TO-92 Heat Sinks
Mounting Surface Temp
Rise Above Ambient—°C
Low cost slip on heat sink
features an expandable collar
that tightly grips the device
meaning no extra mounting
hardware is required. Three
heights to choose from.
80
20
60
15
40
10
20
5
0
18.29 (0.720)
575300B00000G
24.64 (0.970)
575400B00000G
30.99 (1.220)
0.2
575400
575200
0
Air Velocity—Feet Per Minute
400
200
600
800
1000
25
20
60
15
40
10
20
5
0
0
0.0
0.2
0.4
0.6
0.8
Heat Dissipated—Watts
"A"
5.59
(0.220)
Material: 0.63 (0.025) Thick Aluminum
Finish: Black Anodize
1.0
Low cost brass clip on heat sink
Air Velocity – Feet Per Minute
400
200
600
800
Mounting Surface Temp
Rise Above Ambient – °C
Low cost brass clip on heat sink
requires no hardware to attach
to the device. Includes integrated
tabs that can be soldered or twisted
to attach the heat sink to the board
reducing stress on the device leads.
ORDERING INFORMATION
80
20
60
15
40
10
20
5
0
0
1
2
3
Heat Dissipated – Watts
4
8.50
(0.335)
13.80
(0.543)
2.50
(0.098)
1.00
(0.039)
10.16
(0.400)
5
11.40
(0.449)
0.40
(0.016)
4.27
(0.039)
Material: 0.38 (0.015) Thick Brass
Finish: Unfinished
Dia of PCB
Plated Thru
Hole for Tabs
Part Number
Description
92FG
Brass clip on heat sink
1.73 (0.068)
AMERICA
EUROPE
www.aavidthermalloy.com
25
0
13.70
(0.539)
1000
Thermal Resistance From MTG
Surface to Ambient – °C/Watt
0
100
68
15.29
(0.602)
1.0
80
575300
92F
0.4
0.6
0.8
Heat Dissipated—Watts
100
“A” Dim
575200B00000G
0
0.0
ORDERING INFORMATION
Part Number
1000
25
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
Air Velocity—Feet Per Minute
400
200
600
800
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
0
100
Mounting Surface Temp
Rise Above Ambient—°C
THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
5752, 5753, 5754 Low cost slip on heat sink
USA Tel: +1 (603) 224-9988 email: [email protected]
Italy Tel: +39 051 764011 email: [email protected]
United Kingdom Tel: +44 1793 401400 email: [email protected]
ASIA
Singapore Tel: +65 6362 8388 email: [email protected]
Taiwan Tel: +886(2) 2698-9888 email: [email protected]
Grease
&
Epoxy
page112
Two piece heat sink
FIGURE A
FIGURE B
ø 2x 5.54
(0.218)
THRU
ø 2x 4.78
(0.188)
THRU
Two piece heat sink adds
extra cooling in the same
amount of board space as
other solutions. Base and
top can be ordered separately.
16.89
(0.665)
30.15
(1.187)
38.86
(1.530)
7.87
(0.310)
3.71
(0.146)
THRU TYP 2
5.46
(0.215)
4.34
(0.171)
38.95
(1.534)
30.65
(1.206)
14.17
(0.558)
31.75
(1.250)
10.92
(0.430)
Mounting
Kits
page 99
12.70
(0.500)
4.06
(0.160) THRU TYP 2
2.81
(0.110)
9.27
(0.365)
21.34
(0.840)
Material: 1.60 (0.063) Thick Aluminum
Finish: Black Anodize
Air Velocity—Feet Per Minute
400
200
600
800
0
100
Part Number
Description
Mounting Surface Temp
Rise Above Ambient—°C
ORDERING INFORMATION
Figure
520327B00000G
Two piece heat sink assembly, base and top
520328B00000G
Top only
B
520329B00000G
Base only
A
For additional options see page 84
80
8
60
6
40
4
20
2
0
0
0
2
520327
520328
520329
4
6
Heat Dissipated—Watts
0
Air Velocity—Feet Per Minute
400
200
600
800
Space saving expandable collar heat sink
has the same footprint as the device being
cooled meaning no extra board space is
required to fit the heat sink. The expandable
collar tightly grips the device meaning no
extra hardware is required. May also be used
with any diamond or square basket heat sink
to form a two piece heat sink for additional
cooling. Available in conductive AavSHIELD3
or black anodize finish.
Mounting Surface Temp
Rise Above Ambient—°C
100
10
Mounting
Kits
page 99
1000
20
80
16
60
12
40
8
20
4
0
0
0
1
2
3
4
Heat Dissipated—Watts
ø 4.06 x 4.83
(0.160) (0.190)
SLOT
28.57
(1.125)
30.15
(1.187)
39.12
(1.540) REF
5
9.91
(0.390)
Part Number
Finish
579103B00000G
Black anodize
AavSHIELD3
579103V00000G
Grease
&
Epoxy
page112
Low profile hat section heat sink
Air Velocity—Feet Per Minute
400
200
600
800
Low profile hat section heat sink
is ideal for applications where low
component heights are required
such as card cages with PCBs
mounted on 0.500 centers.
Mounting Surface Temp
Rise Above Ambient—°C
100
1000
10
80
8
60
6
40
4
20
2
0
0
0
4
8
12
16
Heat Dissipated—Watts
Mounting
Kits
page 99
30.15
(1.187)
CL 1
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
0
9.52
(0.375)
10.92
(0.430)
30.48
(1.200)
CL 2
44.45
(1.750)
5.46
(0.215)
20
2x ø 5.54
(0.218)
THRU
ORDERING INFORMATION
1.82
(0.072)
15.06
(0.593)
2x ø 4.78
(0.188)
THRU
50.80
(2.000)
Part Number
Description
506003B00000G
Low profile hat section heat sink
Material: 1.27 (0.050) Thick Aluminum
Finish: Black Anodize
For additional options see page 84
AMERICA
EUROPE
www.aavidthermalloy.com
22.10
(0.870)
Material: 1.27 (0.050) Thick Aluminum
Finish: See Table
ORDERING INFORMATION
5060
8
Space saving expandable collar heat sink
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
5791
1000
10
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
5203
THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
TO-3 Heat Sinks
USA Tel: +1 (603) 224-9988 email: [email protected]
Italy Tel: +39 051 764011 email: [email protected]
United Kingdom Tel: +44 1793 401400 email: [email protected]
ASIA
Singapore Tel: +65 6362 8388 email: [email protected]
Taiwan Tel: +886(2) 2698-9888 email: [email protected]
69
TO-3 Heat Sinks
80
8
60
6
40
4
20
2
575803B00000G
25.40 (1.000)
575903B00000G
31.75 (1.250)
8
"X"
15.07
(0.594)
41.40
(1.630)
30.15
(1.187)
CL 2
1.83
(0.072)
"X"
10
5.46
(0.215)
0
Air Velocity—Feet Per Minute
400
200
600
800
80
4
60
3
40
2
20
1
0
0
0
2
575903
575803
32.77
(1.290)
1000
5
4
6
8
Heat Dissipated—Watts
Mounting
Kits
page 99
ø 4.78
(0.188)
TYP 2
CL1
5.54
(0.218)
TYP 2
10.92
(0.430)
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
Mounting Surface Temp
Rise Above Ambient—°C
19.05 (0.750)
4
6
Heat Dissipated—Watts
100
“A” Dim
575703B00000G
2
575703
575603
ORDERING INFORMATION
12.70 (0.500)
0
0
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
1000
10
0
Space saver diamond shaped
basket heat sink featuring a
narrow base with slanted fins to
increase air turbulence in natural
and forced convection applications.
Made from heavy gauge material.
Four heights to choose from.
575603B00000G
Air Velocity—Feet Per Minute
400
200
600
800
100
0
Part Number
Grease
&
Epoxy
page112
Space saver diamond shaped basket heat sink
Mounting Surface Temp
Rise Above Ambient—°C
THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
5756, 5757, 5758, 5759
"A"
Material: 2.29 (0.090) Thick Aluminum
Finish: Black Anodize
10
POPULAR OPTIONS: 575_03B 0 00 00G
A B
Base part no.
Position
Code
Description
A
1
Kon-DuxTM pad
Location
A
3
In-Sil-8TM pad
B
01
6-23 Wave-OnTM threaded insert
0.100 stand off
Details
Page 86
Page 86
Hole X
Page 89
For additional options see page 84
Air Velocity—Feet Per Minute
400
200
600
800
Mounting Surface Temp
Rise Above Ambient—°C
100
501503B00000G
25.40 (1.000)
501603B00000G
31.75 (1.250)
POPULAR OPTIONS:
40
4
20
2
0
0
2
4
6
Heat Dissipated—Watts
8
Air Velocity—Feet Per Minute
400
200
600
800
80
8
60
6
40
4
20
2
0
0
501603
501503
2
4
6
Heat Dissipated—Watts
8
ø 4.75
(0.187)
TYP 2
CL
"X"
15.07
(0.594)
30.15
(1.187)
Mounting
Kits
page 99
ø5.54
(0.218)
TYP 2
47.75
(1.880)
CL
AT BASE
"X"
100
0
1.83
(0.072)
10
1000
10
Mounting Surface Temp
Rise Above Ambient—°C
12.70 (0.500)
19.05 (0.750)
6
0
“A” Dim
501403B00000G
8
60
501403
501303
ORDERING INFORMATION
501303B00000G
80
0
Low cost diamond shaped
basket heat sink with
straight fins. High fin count
enhances efficiency. Four
heights to choose from.
1000
10
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
0
Part Number
Grease
&
Epoxy
page112
Low cost diamond shaped basket heat sink
35.56
(1.400)
5.46 AT BASE
(2.150)
10.92
(0.430)
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
5013, 5014, 5015, 5016
"A"
Material: 1.60 (0.063) Thick Aluminum
Finish: Black Anodize
10
501_03B 0 00 00G
Base part no. A B
C
Position
Code
Description
A
1
Kon-DuxTM pad
Location
Details
B
01
6-23 Wave-OnTM threaded insert 0.100 stand off
Hole X
Page 89
C
08
6-32 x 0.350 Solderable stud
Hole X
Page 96
Page 86
For additional options see page 84
70
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United Kingdom Tel: +44 1793 401400 email: [email protected]
ASIA
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Grease
&
Epoxy
page112
5197, 5198, 5199, 5201 Heavy gauge square basket heat sink
Air Velocity—Feet Per Minute
400
600
800
4
60
3
40
2
20
1
0
0
4
8
12
16
Heat Dissipated—Watts
Mounting Surface Temp
Rise Above Ambient—°C
“A” Dim
519703B00000G
38.10 (1.500)
519803B00000G
44.45 (1.750)
519903B00000G
50.80 (2.000)
520103B00000G
31.12 (1.225)
32.02
(1.300)
200
Air Velocity—Feet Per Minute
400
600
800
5.46
(0.215)
"A"
Material: 3.17 (0.125) Thick Aluminum
Finish: Black Anodize
5
4
60
3
40
2
20
1
0
0
0
5
10
15
20
Heat Dissipated—Watts
10.92
(0.430)
1000
80
520103
519903
39.37
(1.550)
"X"
1.83
30.15 (0.072)
(1.187)
20
100
Part Number
"X"
ø 4.75
(0.187) C 2
TYP 2 L
15.09
(0.594)
48.26
(1.900)
@ BASE
0
ORDERING INFORMATION
10.41
(0.410)
ø 5.54
(0.218)
TYP 2
CL 1
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
Mounting Surface Temp
Rise Above Ambient—°C
80
519803
519703
12.24
(0.482)
1000
5
0
Heavy gauge square basket
heat sink provides excellent
performance by using 1/8 thick
aluminum to maximize efficiency.
Available in 4 heights.
200
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
0
100
Mounting
Kits
page 99
25
POPULAR OPTIONS: 5_ _ _03B 0 00 00G
Base part no.
THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
TO-3 Heat Sinks
A B
Position
Code
Description
A
1
Kon-DuxTM pad
Location
B
01
6-32 Wave-OnTM theaded insert 0.100 stand off
Details
Page 86
Hole X
Page 89
For additional options see page 84
Grease
&
Epoxy
page112
Square basket heat sink features folded back fins
0
Air Velocity—Feet Per Minute
400
200
600
800
30.23
(1.190)
1000
Mounting Surface Temp
Rise Above Ambient—°C
100
Square basket heat sink
features folded back fins
to increase surface area
and power dissipation.
Two heights are available.
5
80
4
60
3
40
2
20
0
1
0
0
569003
579003
4
8
12
16
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
5690, 5790
20
1.78
(0.070)
ø 4.83
(0.190)
THRU
TYP 2
10.92
(0.430)
33.27 (1.310)
579003B00000G
25.40 (1.000)
ø 3.66 THRU
(0.144) TYP 8
46.48 SQ.
(1.830) REF
5.46
(0.215)
CL
ø 5.59 THRU
(0.220) TYP 2
6.35
(0.250)
REF
"A"
Material: 1.60 (0.063) Thick Aluminum
Finish: Black Anodize
“A” Dim
569003B00000G
15.11
(0.595)
27.69
(1.090)
REF
CL
ORDERING INFORMATION
Part Number
Mounting
Kits
page 99
POPULAR OPTIONS: 5_9003B 0 0000G
Base part no.
Position
Code
A
A
A
Description
Details
1
Kon-DuxTM pad
Page 86
3
In-Sil-8TM pad
Page 86
For additional options see page 84
AMERICA
EUROPE
www.aavidthermalloy.com
USA Tel: +1 (603) 224-9988 email: [email protected]
Italy Tel: +39 051 764011 email: [email protected]
United Kingdom Tel: +44 1793 401400 email: [email protected]
ASIA
Singapore Tel: +65 6362 8388 email: [email protected]
Taiwan Tel: +886(2) 2698-9888 email: [email protected]
71
TO-3 Heat Sinks
Grease
&
Epoxy
page112
5
80
4
60
3
40
2
20
1
0
0
0
4
500103
500203
0
8
12
16
Heat Dissipated—Watts
Air Velocity—Feet Per Minute
400
200
600
800
“A” Dim
500103B00000G
12.70 (0.500)
500203B00000G
19.05 (0.750)
500303B00000G
25.40 (1.000)
500403B00000G
31.75 (1.250)
4
60
3
40
2
20
1
0
0
0
4
500303
500403
8
12
16
Heat Dissipated—Watts
38.10
(1.500)
5.46
(0.215)
10.92
(0.430)
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
Part Number
5
45.97 SQ.
(1.810)
CL 2
ø 5.54
(0.218)
TYP 2
1000
80
CL 1
ø 4.78
(0.188)
TYP 2
20
100
ORDERING INFORMATION
30.15
(1.187)
Mounting
Kits
page 99
ø 3.81
(0.150)
THRU TYP 4
1000
100
Mounting Surface Temp
Rise Above Ambient—°C
Square basket heat sink featuring
a slanted fin design for increased
air turbulence and four integrated
mounting holes. Four heights to
choose from.
Air Velocity—Feet Per Minute
400
200
600
800
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
0
Mounting Surface Temp
Rise Above Ambient—°C
THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
5001, 5002, 5003, 5004 Square basket heat sink featuring slanted fins
15.06
(0.593)
1.83
(0.072)
"A"
Material: 2.29 (0.090) Thick Aluminum
Finish: Black Anodize
20
POPULAR OPTIONS: 500_03B 0 0000G
Base part no.
Description
A
Position
Code
Details
A
1
Kon-DuxTM pad Page 86
A
3
In-Sil-8TM pad
Page 86
For additional options see page 84
Grease
&
Epoxy
page112
Square basket heat sink featuring straight fins
0
CL1
5
80
4
60
3
40
2
20
1
0
0
0
2
505103
505303
505403
4
6
Heat Dissipated—Watts
8
ø 5.54
(0.218)
TYP 2
"X"
10
10.92
(0.430)
12.70 (0.500)
505303B00000G
25.40 (1.000)
505403B00000G
31.75 (1.250)
45.21
(1.780)
5.46
(0.215)
1.83
(0.072)
15.06
(0.593)
30.15
(1.187)
"A"
Material: 2.29 (0.090) Thick Aluminum
Finish: Black Anodize
“A” Dim
505103B00000G
"X"
ø 4.78
(0.188)
TYP 2
CL 2
ORDERING INFORMATION
Part Number
Mounting
Kits
page 99
1000
100
Mounting Surface Temp
Rise Above Ambient—°C
Square basket heat sink
features straight fins and
0.090 thick aluminum for
increased cooling capacity.
Three heights to choose from.
Air Velocity—Feet Per Minute
400
200
600
800
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
5051, 5053, 5054
POPULAR OPTIONS: 505_03B0 00 00G
Base part no.
Position
Code
A
01
A
Description
6-23 Wave-OnTM threaded insert 0.100 stand off
Location
Details
Hole X
Page 89
For additional options see page 84
72
AMERICA
EUROPE
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Italy Tel: +39 051 764011 email: [email protected]
United Kingdom Tel: +44 1793 401400 email: [email protected]
ASIA
Singapore Tel: +65 6362 8388 email: [email protected]
Taiwan Tel: +886(2) 2698-9888 email: [email protected]
Grease
&
Epoxy
page112
5761, 5762, 5763, 5764 Square basket heat sink featuring slanted vane fins
Mounting
Kits
page 99
CL1
12.32
(0.485)
ø 4.77
(0.188)
TYP 2
"X"
ø 5.54
(0.218)
TYP 2
45.97
(1.810)
REF
CL 2
"X"
Square basket heat sink features
slanted vane fins for efficient heat
dissipation. Air movement from any
direction is diverted into the center
of the heat sink to create turbulence
and improve heat transfer. Four
heights to choose from.
576303B00000G
25.40 (1.000)
576403B00000G
31.75 (1.250)
100
5
80
4
60
3
40
2
20
1
0
0
0
POPULAR OPTIONS: 576 _ 03B 0 00 00G
Code
Description
A
1
Kon-DuxTM pad
B
01
6-32 Wave-OnTM theaded insert
0.100 stand off
4
576103
576203
A B
Base part no.
Position
Location
0
8
12
16
Heat Dissipated—Watts
200
Air Velocity—Feet Per Minute
400
600
800
1000
100
5
80
4
60
3
40
2
20
1
0
0
20
0
576303
576403
4
8
12
16
Heat Dissipated—Watts
20
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
19.05 (0.750)
1000
Mounting Surface Temp
Rise Above Ambient—°C
576203B00000G
Air Velocity—Feet Per Minute
400
200
600
800
Thermal Resistance From MTG
Surface to Ambient—C/Watt
0
Mounting Surface Temp
Rise Above Ambient—°C
12.70 (0.500)
"A"
Material: 2.29 (0.090) Thick Aluminum
Finish: Black Anodize
“A” Dim
576103B00000G
30.15
1.83
(0.072) (1.187)
5.46
(0.215)
10.92
(0.430)
ORDERING INFORMATION
Part Number
15.09
(0.594)
12.32
(0.485)
THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
TO-3 Heat Sinks
Details
Page 86
Hole X
Page 89
For additional options see page 84
PF523, PF526, PF527
Diamond shaped heat sink
DIA 22.90
(0.902)
"A"
3.40
(0.134)
Approx DIA 8.00(0.315)
area flat around holes
30.15
(1.19)
CTRS
Diamond shaped heat sink
is the same profile as the device
which saves space on the board.
This rugged design is made from
cast aluminum and is available
in three different heights.
DIA 4.20 (0.165)
4.10 (0.161)
TYP (2)
40.80
(1.606)
26.90
(1.060)
Material: Cast Aluminum
Finish: Black Anodize
“A” Dim
PF523G
12.50 (0.492)
PF526G
19.00 (0.748)
PF527G
25.00 (0.984)
0
Air Velocity—Feet Per Minute
400
600
800
AMERICA
EUROPE
1000
10
80
8
60
6
40
4
20
2
0
0
0
PF523
PF526
PF527
www.aavidthermalloy.com
200
100
Mounting Surface Temp
Rise Above Ambient—°C
Part Number
3
6
9
Heat Dissipated—Watts
12
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
ORDERING INFORMATION
15
USA Tel: +1 (603) 224-9988 email: [email protected]
Italy Tel: +39 051 764011 email: [email protected]
United Kingdom Tel: +44 1793 401400 email: [email protected]
ASIA
Singapore Tel: +65 6362 8388 email: [email protected]
Taiwan Tel: +886(2) 2698-9888 email: [email protected]
73
TO-66 Heat Sinks
Grease
&
Epoxy
page112
1000
10
80
8
60
6
Mounting Surface Temp
Rise Above Ambient—°C
40
4
20
2
0
0
0
Low cost diamond shaped
basket heat sink with straight
fins. High fin count enhances
efficiency. Four heights to
choose from.
2
501706
501806
4
6
Heat Dissipated—Watts
8
ORDERING INFORMATION
“A” Dim
501706B00000G
12.70 (0.500)
501806B00000G
19.05 (0.750)
501906B00000G
25.40 (1.000)
502006B00000G
31.75 (1.250)
Air Velocity—Feet Per Minute
400
200
600
800
1000
10
80
8
60
6
40
4
20
2
0
0
0
2
501906
502006
4
6
Heat Dissipated—Watts
8
"A"
Material: 1.60 (0.063) Thick Aluminum
Finish: Black Anodize
10
Mounting Surface Temp
Rise Above Ambient—°C
Air Velocity—Feet Per Minute
400
200
600
800
100
1000
20
80
16
60
12
40
8
20
4
0
Space saving expandable collar
heat sink has the same footprint
as the device being cooled meaning
no extra board space is required to
fit the heat sink. The expandable
collar tightly grips the device.
Mounting
Kits
page 99
0
0
1
2
3
Heat Dissipated—Watts
4
20.62
(0.812)
Part Number
Finish
579206B00000G
Black anodize
AavSHIELD3
ø 3.96 x 4.95
(0.156)(0.195)
SLOT
5
13.72
(0.540)
9.27
(0.365)
4.44
(0.175)
Material: 1.27 (0.050) Thick Aluminum
Finish: See Table
AMERICA
EUROPE
www.aavidthermalloy.com
ø 11.68
(0.460)
24.38
(0.960)
31.00
(1.220)
ORDERING INFORMATION
74
39.37
(1.550)
@ BASE
CL2
Space saving expandable collar heat sink
0
579206V00000G
ø 3.96
(0.156)
TYP 4
12.19
(0.480)
24.38
(0.960)
2.54
(0.100)
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
5792
10
2.54
(0.100)
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
0
Part Number
CL1
26.42
(1.040)
@ BASE
100
Mounting
Kits
page 99
5.08
(0.200)
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
Air Velocity—Feet Per Minute
400
200
600
800
100
0
Mounting Surface Temp
Rise Above Ambient—°C
THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
5017, 5018, 5019, 5020 Low cost diamond shaped basket heat sink
USA Tel: +1 (603) 224-9988 email: [email protected]
Italy Tel: +39 051 764011 email: [email protected]
United Kingdom Tel: +44 1793 401400 email: [email protected]
ASIA
Singapore Tel: +65 6362 8388 email: [email protected]
Taiwan Tel: +886(2) 2698-9888 email: [email protected]
TO-05 Heat Sinks
Mounting Surface Temp
Rise Above Ambient—°C
80
40
60
30
40
20
20
10
0
0
0.0
0
Mounting Surface Temp
Rise Above Ambient—°C
“A” Dim
578105B00000G
3.96 (0.156)
578205B00000G
6.35 (0.250)
578305B00000G
12.70 (0.500)
578405B00000G
19.05 (0.750)
578505B00000G
25.40 (1.000)
200
0.8
1.2
1.6
Heat Dissipated—Watts
Air Velocity—Feet Per Minute
400
600
800
100
ORDERING INFORMATION
Part Number
0.4
578105
578205
Snap on cooler features easy
no tools installation. Folded
back fins provide maximum
surface area while preserving
valuable board space.
1000
50
40
30
40
20
20
10
0
0
578405
578305
30
40
20
20
10
0
0
0.4
578505
60
0.4
40
60
0.0
1000
50
0.8
1.2
1.6
Heat Dissipated—Watts
1000
50
80
2.0
80
0.0
Air Velocity—Feet Per Minute
400
200
600
800
0
100
0.8
1.2
1.6
Heat Dissipated—Watts
2.0
10.03
(0.395)
ø 8.03
(0.316)
21.08
(0.830)
"A"
2.0
6.35
(0.250)
Material: 0.63 (0.025) Thick Aluminum
Finish: Black Anodize
Space saving expandable heat sink
0
Air Velocity—Feet Per Minute
400
200
600
800
Space saving expandable heat sink
features a collar that tightly grips the
device meaning no extra hardware is
required. Heat sinks are constructed of
pre-black anodize material to lower cost.
Mounting Surface Temp
Rise Above Ambient—°C
100
1000
50
80
40
60
30
40
20
20
10
0
0
0.0
0.4
6201
6202
6203
0.8
1.2
1.6
Heat Dissipated—Watts
32.51
(1.280)
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
6201, 6202, 6203
THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
Air Velocity—Feet Per Minute
400
600
800
Mounting Surface Temp
Rise Above Ambient—°C
200
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
0
100
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
Snap on cooler heat sink
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
5781, 5782, 5783, 5784, 5785
"A"
6.35
(0.250)
2.0
ORDERING INFORMATION
Part Number
“A” Dim
# Fins
6201PBG
6.35 (0.250)
1
6202PBG
12.70 (0.500)
2
6203PBG
19.56 (0.770)
3
ø 8.03 I.D.
(0.316)
Material: 0.63 (0.025) Thick Aluminum
Finish: Pre Black Anodize*
* Edges cut during the manufacturing process will be unfinished.
See page 110 more more information
Low cost push on heat sink
0
Air Velocity—Feet Per Minute
400
200
600
800
Mounting Surface Temp
Rise Above Ambient —°C
100
Low cost push on heat sink
uses spring pressure to firmly
grip the device case creating
a good thermal interface.
1000
50
80
40
60
30
40
20
20
10
0
0
0
0.5
1
1.5
Heat Dissipated—Watts
2
ø 16.00
(0.630)
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
5F
12.70
(0.500)
ø 7.90
(0.311)
2.5
Material: Aluminum
Finish: Black Anodize
ORDERING INFORMATION
Part Number
Description
5FG
Low cost push on heat sink
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75
TO-5 Heat Sinks
1000
50
80
40
60
30
40
20
20
10
Mounting Surface Temp
Rise Above Ambient—°C
Extruded collar style heat
sink with radial fins. The split
collar design provides a press fit
between the transistor and the
heat sink creating an excellent
thermal conduction path.
Available in two heights.
Air Velocity—Feet Per Minute
400
600
800
100
0
200
0
0
0.0
0.4
326005
325705
0.8
1.2
1.6
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
Extruded collar style heat sink with radial fins
12.70
(0.500)
ø 8.07
(0.318) THRU
2.0
"A"
Material: Aluminum
Finish: Black Anodize
ORDERING INFORMATION
“A” Dim
325705B00000G
6.35 (0.250)
326005B00000G
9.53 (0.375)
3201, 3202
Extruded collar style heat sink with swept back fins
0
200
Air Velocity—Feet Per Minute
400
600
800
100
Extruded collar style heat sink with
swept back fins for increased surface
area in a small volume. The split collar
design provides a press fit between
the transistor and the heat sink creating
an excellent thermal conduction path.
Available in two inside diameters.
"A"
1000
50
80
40
60
30
40
20
20
10
0
0
0.0
0.4
0.8
1.2
1.6
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
Part Number
Mounting Surface Temp
Rise Above Ambient—°C
THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
3257, 3260
12.70
(0.500)
6.35
(0.250)
2.0
Material: Aluminum
Finish: Black Anodize
ORDERING INFORMATION
“A” Dim
320105B00000G
8.07 (0.318)
320205B00000G
7.75 (0.305)
3230
Extruded collar style heat sink with mounting hole
0
Air Velocity—Feet Per Minute
400
200
600
800
Extruded collar style heat sink
with mounting hole for hardware
attachment to the circuit card. The heat
sink includes a mount boss that will
accept a 4-40 screw for secure mounting
in high vibration environments. The split
collar design provides a press fit between
the transistor and the heat sink creating
an excellent thermal conduction path.
Mounting Surface Temp
Rise Above Ambient—°C
100
1000
50
80
40
60
30
40
20
20
10
0
0
0.0
0.4
0.8
1.2
1.6
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
Part Number
ø 8.08
(0.318)
R 7.62
(0.300)
ø 3.17
(0.125)
2.0
19.05
(0.750)
6.35
(0.250)
Material: Aluminum
Finish: Black Anodize
ORDERING INFORMATION
76
Part Number
Description
323005B00000G
Extruded collar style heat sink with mounting boss
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Copper heat sink for axial lead devices
0
200
Air Velocity—Feet Per Minute
400
600
800
Mounting Surface Temp
Rise Above Ambient—°C
100
1000
10
80
8
60
6
40
4
20
2
0
0
0
2
4
6
Heat Dissipated—Watts
8
25.40
(1.000)
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
6000
6.35
(0.250)
@ BASE
CL SYM
15.24 REF
(0.600)
25.40
(1.000)
30.48
(1.200)
REF
27.30
(1.075)
10
Copper heat sink for axial
lead device requires no extra
board space to mount. One lead
of the heat sink is soldered to
the device while the other solders to the PC board. Available
in two finishes.
1.90
(0.075)
14.20
(0.559)
1.27
(0.050)
FIGURE A
20.32
(0.800)
15.24
(0.600)
DIA as required
for lead size
2.36
(0.093)
ORDERING INFORMATION
Dia of PCB
Plated Thru
Hole for Tabs
Part Number
Description
Finish
6000UG
Heat sink for axial lead device
Unfinished
See figure A
6000DG
Heat sink for axial lead device
Tin plated*
See figure A
Material: 0.53 (0.021) Thick Copper
Finish: See Table
* See page 110 for more information
THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
Axial Lead Devices
Bridge Rectifiers
6222, 6223, 6224 Square basket style heat sink for bridge rectifiers
200
Air Velocity—Feet Per Minute
400
600
800
Mounting Surface Temp
Rise Above Ambient—°C
80
8
60
6
40
4
20
2
0
0
0
Square basket style heat sink
for bridge rectifiers uses no
additional board space. Available
with three different mounting
hole diameters.
1000
10
2
4
6
Heat Dissipated—Watts
8
"A"
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
0
100
31.75
(1.250)
15.24
(0.600)
10
26.92
SQ
(1.060)
Material: 1.27 (0.050) Thick Aluminum
Finish: Black Anodize
ORDERING INFORMATION
Part Number
“A” Dim
6222BG
3.61 (0.142) Dia Thru
6223BG
4.14 (0.163) Dia Thru
6224BG
4.77 (0.188) Dia Thru
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77
OPTIONS & ACCESSORIES CONTENTS
Thermal solutions go beyond the heat dissipator itself.
Aavid Thermalloy offers a total solution package,
which includes a number of options and accessory
items described in this section of the catalog.
A total thermal solution includes an efficient thermal
interface and means of mechanical attachment. Aavid
Thermalloy has a full-line of interface materials that
can be pre-applied or supplied as an accessory item.
Mechanical assembly options include attachment of
semiconductors to heat sinks, heat sinks to printed
circuit boards, and heat sinks to sockets of CPUs.
Aavid Thermalloy offers the most complete line
of value added options of any supplier in the industry.
Our full line of accessories includes mounting kits,
shoulder washers, insulators, mounting pads,
and various grease products and epoxies, which
are sold separately, and can be used with a variety
of Aavid heat sinks.
This section will provide the most complete solution
to your thermal requirement.
CONTENTS
How to decipher or construct an Aavid 12 digit part number....................... 80
How to decipher or construct a "Thermalloy" origin part number............... 81
Indexes................................................................................................................................. 82
Interface Materials
Pads
In-Sil-8TM Pads....................................................................................................................
Kon-DuxTM/Grafoil® Pads..............................................................................................
Hi-Flow® Pads...................................................................................................................
Alignment Pads................................................................................................................
86
86
87
87
Double Sided Tape Options (factory applied)
T414...................................................................................................................................... 88
T405R.................................................................................................................................... 88
T412...................................................................................................................................... 88
T411...................................................................................................................................... 88
T410R.................................................................................................................................... 88
Labor Saving Heat Sink to Board and Device to Heat Sink Mounts
Wave-OnTM Mounts.......................................................................................................... 89
Semiconductor Mounts................................................................................................. 90
Shur-LockTM Tabs............................................................................................................... 91
Solderable Staked on Tabs........................................................................................... 91
Solderable Mounting Tabs............................................................................................ 93
Solderable Pins................................................................................................................. 94
Solderable Nuts................................................................................................................. 94
Clinch Nuts.......................................................................................................................... 95
Solderable Studs............................................................................................................... 96
Device Mounting Studs.................................................................................................. 96
Clips
Aavid Kool-KlipsTM............................................................................................................ 97
Thermal Clips..................................................................................................................... 98
78
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ASIA
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Taiwan Tel: +886 (2) 2698-9888 email: [email protected]
CONTENTS
Accessories
Mounting Kits
TO-220/TO-3 Mounting Kits......................................................................................................................... 99
OPTIONS & ACCESSORIES CONTENTS
Insulating Shoulder Washers
Polyphenylene Sulfide (PPS) Shoulder Washers................................................................................... 100
Nylon Shoulder Washers................................................................................................................................100
Insulators
ThermalfilmTM Polymide Plastic Films........................................................................................................101
ThermalfilmTM/ ThermalfilmTM MT................................................................................................................ 102
Mica, ThermalsilTMlll.......................................................................................................................................... 103
Aluminum Oxide Ceramic Insulators........................................................................................................ 104
Stanchion Pads..................................................................................................................................................105
Insulating Covers
TO-3 Insulating Covers................................................................................................................................... 106
Teflon-Filled Acetal Insulators..................................................................................................................... 106
Teflon-Filled Acetal Bushings.......................................................................................................................106
Mounting Pads
(TO-5, TO-18, IC, Universal, TO-18 Lead Conversion, Epoxy Lead Conversion)................ 107
Finishes .............................................................................................................................................................. 110
Card Ejectors
Snap-On Ejectors..............................................................................................................................................111
Standard Ejectors............................................................................................................................................. 111
Thermal Greases and Epoxies
Sil-FreeTM.............................................................................................................................................................. 112
Ther-O-LinkTM..................................................................................................................................................... 112
UltrastickTM.......................................................................................................................................................... 112
ThermalCoteTM................................................................................................................................................... 113
ThermalCoteTM II............................................................................................................................................... 113
Ther-O-BondTM 1500........................................................................................................................................ 114
Ther-O-BondTM 1600........................................................................................................................................ 114
Ther-O-BondTM 2000........................................................................................................................................ 114
ThermalbondTM.................................................................................................................................................. 115
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79
HOW TO DECIPHER A 12 DIGIT PART NUMBER
How to decipher an Aavid standard 12 digit part number
Aavid Thermalloy's standard product line in most cases consists of a 12-digit part number sequence. In most standard offerings, Digits 1 through 4,
define the model basic part number. Digits 5 and 6 designate the package style that a particular heat sink is designed to cool. The 7th digit determines the finish, and the 8th identifies the interface material, if one can be used for that particular style heat sink. The 9th and 10th digits define
the PC board mounting method, and the 11th and 12th digits define the method of attachment of the package to the heat sink. For digits
8,9,10,11 and 12, the absence of any of those options is always designated by a zero in those positions. Important NOTE: The 12 digit part number
sequence is a general format. Due to the different variations and styles of heat sinks, we have included an Option Index on pages 82–84 to show
available options and accessories for the products covered in this catalog.
Standard board level:
A = Base Part Number
B = Package Style
C = Finish
D = Interface Material
E = PC Board Mounting
F = Package Mounting
G = RoHS Compliant
5748 02 B 0 37 00 G
A
B C D E
F G
To order most Aavid Thermalloy heat sinks, you must use a 12 digit part number using the following options:
Digits 5-6: Package style
Digit 7: Finish
Digit 8: Interface material
CODE
00
01
02
03
04
05
06
08
10
21
22
CODE
B
D
J
M
U
V
W
CODE
0
1
2
3
4
7
8
DEVICE
Blank
TO-218
TO-220, TO-216, TO-217
TO-3
TO-202
TO-5, TO-39
TO-66
TO-247
Multiwatt/SIP
Dual TO-218
Dual TO-220
DESCRIPTION
Black Anodize
Solderable 100% Tin Finish
Pre-Black Anodize
Green Anodize
Unfinished
AavSHIELD3
Black Anodize w/Black Paint
For additional information see page 110
Digits 9-10: PC Board mounting
Solderable pins
for board mounted extrusions
CODE
DESCRIPTION
21
Solid Pin with
Stand Off Shoulder 0.050”
25
Solid Solderable Pin
Solderable Wave-On™ mounts
CODE
01
02
03
04*
05
07
09
13
STAND-OFF
0.100”
0.100”
0.045”
0.100”
0.045”
0.100”
0.200”
0.129”
THREAD
#6-32
#4-40
#4-40
#6-32
#6-32
3.5mm
#6-32
#6-32
For additional information see page 94
Solderable nut
CODE
DESCRIPTION
13
SNE-2 6-32 UNC-2B
14
SNE-1 4-40 UNC-2B
* 0.090 PCB (others 0.062”)
For additional information see page 89
LENGTH
0.305”
0.305”
For additional information see page 94
DESCRIPTION
None
One Kon-Dux™ Pad
Two Kon-Dux™ Pads
One In-Sil-8™ Pad
Two In-Sil-8™ Pad
One Hi-Flow® Pad
Two Hi-Flow® Pads
For additional information see pages 86 and 87
Solderable staked on **tabs
CODE
DESCRIPTION
28
Shur-Lock™ Tab
(0.130 for 0.062” PC Boards)
31
Centered Horizontal
(0.050 W x 0.130 L)
32
Centered Horizontal
(0.050 W x 0.130 L)
33
Centered Vertical
(0.062 W x 0.340 L)
34
Vertical Pair L & R
(0.075 W x 0.170 L)
35
Vertical Pair L & R
(0.097 W x 0.200 L)
36
Centered Vertical
(0.100 W x 0.150 L)
37
Centered Step
(0.062 W x 0.250 L with 0.125 wide step)
39
Centered Vertical
(0.050 W x 0.375 L)
40
Centered Vertical
(0.050 W x 0.245 L)
43
Centered Step
(0.050 W x 0.375 L)
48
Centered Vertical
(0.062 W x 0.280 L)
53
MT Tab Vertical Pair
(0.090 W x 0.125 L)
54
MT2 Tab Vertical Pair
(0.090 W x 0.125 L)
55
MT3 Tab Vertical Pair
(0.090 W x 0.125 L)
56
Bifurcated Tab Vertical Pair
(0.110 W x 0.125 with 0.190 step)
57
Bifurcated Tab Vertical Pair
(0.110 W x 0.125 with 0.100 step)
For additional information see pages 91–93
** For additional tab options, please contact
Application Engineering at (603) 224-9988
Digits 11-12: Package mounting
Semiconductor mounts
CODE
DESCRIPTION
LENGTH
01
#6-32 Female
02
#4-40 Female
03
M-3 Female
04
#6-32 Male
0.380”
05
#4-40 Male
0.380”
For additional information see page 90
Standard clips
Kool-Klips™
Sold separately
CODE
PART#
50
115000
51
115100
52
115200
53
115300
54
115400
62
116200
For additional information see page 97
Thermal clips
Factory applied to heat sink
CODE
PART#
32
TC-1
33
TC-10
34
TC-11
35
TC-12
For additional information see page 98
80
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Studs
CODE
DESCRIPTION
06
SE-2 Stud #6-32
07
SM-3 M-3 Male
08
SE-1 Stud #6-32
09
SE-3 Stud #4-40
11
SF-1 M3 x 0.5
14
SE-4 Stud #6-32
17
SM-1M-3 Male
For additional information see page 96
LENGTH
0.485"
0.350”
0.350"
0.350"
0.302"
0.350"
0.350"
Clinch nuts
CODE
DESCRIPTION
12
CNE-42 4-40 Clinch nut
13
CNM-1 M3 X 0.5 Clinch nut
For additional information see page 95
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ASIA
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Taiwan Tel: +886 (2) 2698-9888 email: [email protected]
Aavid Thermalloy features a variety of Thermalloy origin standard products that consist of a different part
number sequence than the standard Aavid 12 digit part numbering system. In most cases, digits 1 through
4, designate the basic model number of the heat sink. Digits 5-6, designate the finish of the heat sink. Digits
6-13 can designate any number of different options that come with a specific model number. (Please refer
to Option Index D on page 85 to see Aavid Thermalloy‘s offerings per base number.)
To order most Thermalloy origin heat sinks you must use the basic part numbering system below:
Standard board level:
6021
A
–
B
C
G
D
Popular finishes*
(followed after base number in location B above)
B=Black Anodize
PB= Pre-Black Anodized
D=Tin Plated
U=Clean, No Finish
V=AavSHIELD3
*For additional information see page 110
E
A = Model Number
B = Finish
C = Productivity Enhancement (if applicable)
D = Second Productivity Enhancement (if applicable)
E = RoHS Compliant Suffix
Popular productivity enhancing options:
Digits (Figure C-D above)
P_= Solderable Roll Pins (see page 94)
TC_ _ = Thermal Clip (see page 98)
CNE_ _ = Clinch Nuts (see page 95)
CNM_= Clinch Nuts Metric (see page 95)
MT= Mounting Tabs (see page 93)
8223-CL03,8241-CL11 = Alignment Pad (see page 87)
SE-_= Solderable Studs (see page 96)
SF_= Mounting Studs (see page 96)
G_= Grafoil® Pad (see page 86)
SNM_= Solderable Nuts Metric (see page 94)
SNE= Solderable Nuts (see page 94)
BGS_= BGS Clip (page 18)
HOW TO DECIPHER A THERMALLOY ORIGIN PART NUMBER
How to decipher a Thermalloy origin part number?
Note: For a wide range of part number specific options, please see our Aavid Option Index D on page 85
AMERICA
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81
Option Index A
Available option codes for Aavid 12 digit part numbers. For additional information on option codes see "How to decipher
an Aavid 12 digit part number" on page 80. To find the appropriate Option Index for a selected part number please refer
to the main product section in the front of the catalog or "How to use this catalog" on page 2.
Ordering Codes
OPTION INDEX
Base part
82
504102
504222
506902
507002
507102
507222
507302
530101
530102
530161
530162
530401
530402
530613
530614
530714
530801
530802
530861
530862
534202
534265
542502
551002
563002
569022
574102
574402
574502
574602
574802
574902
575002
575102
576012
576014
576602
577002
577102
577202
577922
578622
579302
579402
579802
579902
590102
590302
592201
592502
592902
593002
593101
593202
Finishes
(page 110)
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
Solderable tabs
(page 91–93)
53
J
J
J
J
J
J
V
V
V
V
V
J
56
57
53
54 55
56
57
53
33
54 55
36 39
56
40
57
50
50
62
62
50
50
53
53
53
28
28
J
54 55
Clips
(page 97)
54 55
54 55
54 55
56
56
56
Wave-OnTM mounts
(page 89)
KonduxTM pads In-Sil-8TM pads Hi-Flow® pads
(page 86)
(page 86)
(page 87)
01
01
01
01
02
02
02
02
03
03
03
03
05
05
05
05
1
2
1
1
01
01
01
01
01
01
01
01
02
02
04
04
04
04
04
04
03
03
05
05
05
05
05
05
05
05
07
07
07
07
07
07
1
1
1
1
1
1
1
1
01
01
01
01
04
04
04
04
05
05
05
05
07
07
07
07
1
1
1
1
1
01 02
05
03 05
1
1
01 02
03 05
57
57
57
50
50
62
62
53
53
34 35
34 35
D
V
33
33
33
33
37
33
37
37
37
37
48
43
37
43
D
V
V
V
4
3
3
2
2
2
2
2
2
2
1
1
1
2
2
2
2
1
1
1
J
V
V
28
28
33
33 36
33 36
36 38
39
39
39
28
32 34
35
33
33
36
36
34
28
28
28
36
28
01 02
01 02
01 02
03 05
03 05
03 05
37
34 35
34
34 35
01 02
03 05
34 35
01 02
03 05
1
1
1
3
1
1
1
1
1
3
3
3
3
3
USA Tel: +1 (603) 224-9988 email: [email protected]
01
02 03 05 07 08
01
02 03 05 07 08
01
01
02 03 05 07 08
02 03 05 07 08
01
01
02 03 05 07 08
02 03 05 07 08
01
02 03 05 07 08
01
01
01
02 03 05 07 08
02 03 05 07 08
02 03 05 07 08
01
02 03 05 07 08
7
7
7
7
7
7
7
4
4
1
1
1
Italy Tel: +39 051 764011 email: [email protected]
United Kingdom Tel: +44 1793 401400 email: [email protected]
4
3
3
3
3
3
3
3
2
2
02
AMERICA
EUROPE
www.aavidthermalloy.com
40
40
40
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
D
V
V
V
V
V
Studs
(page 96)
3
D
32
32
32
32
33
28
Semiconductor mnts
(page 90)
05
ASIA
01
01
01
01
01
02 03 05 07 08
02 03 05 07 08
02 03 05 07 08
02 03 05 07 08
Singapore Tel: +65 6362 8388 email: [email protected]
Taiwan Tel: +886 (2) 2698-9888 email: [email protected]
Option Index B
Available Option codes for Aavid 12 digit part numbers. For additional information on option codes see "How to decipher
an Aavid 12 digit part number" on page 80. To find the appropriate Option Index for a selected part number please refer
to the main product section in the front of the catalog or "How to use this catalog" on page 2.
513001
513002
513101
513102
513201
513202
513301
513302
529701
529702
529801
529802
529901
529902
530001
530002
531002
531102
531202
531302
532602
532702
532802
533001
533002
533101
533102
533201
533202
533301
533302
533401
533402
533421
533422
533501
533502
533521
533522
533601
533602
533621
533622
533701
533702
533721
533722
533802
533902
534002
581001
581002
581101
581102
581201
581202
Finishes
(page 110)
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
U
U
U
U
U
U
U
U
U
U
U
U
U
U
Clips
(page 97–98)
V
V
33 34
33 34
33
V
V
V
V
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
51
51
51
51
51
51
51
51
52
52
52
52
52
52
52
52
52
52
52
52
52
52
52
52
54
54
54
V
AMERICA
EUROPE
www.aavidthermalloy.com
KonduxTM pads
(page 86)
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
In-Sil-8TM pads
(page 86)
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
Hi-Flow® pads Semiconductor mounts Solderable pins
(page 87)
(page 90)
(page 94)
4
4
4
4
4
4
4
4
4
4
4
4
4
4
01
01
01
01
02
01
02
05
02
01
01
01
01
01
02
02
02
02
02
02
01
02
01
01
02
03
02
7
7
7
7
7
7
7
7
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
03
7
7
7
USA Tel: +1 (603) 224-9988 email: [email protected]
Italy Tel: +39 051 764011 email: [email protected]
United Kingdom Tel: +44 1793 401400 email: [email protected]
ASIA
03
03
02
02
05
05
21
21
21
21
21
21
21
21
21
21
21
21
21
21
21
21
21
21
21
21
21
21
21
21
21
21
21
21
21
21
21
21
21
21
21
21
21
21
21
21
21
21
21
21
21
21
21
21
21
21
21
21
21
21
21
21
25
25
25
25
25
25
25
25
25
25
25
25
25
25
25
25
25
25
25
25
25
25
25
25
25
25
25
25
25
25
25
25
25
25
25
25
25
25
25
25
25
25
25
25
25
25
25
25
25
25
25
25
25
25
25
25
Studs
(page 96)
Clinch nuts
(page 95)
11
11
11
12
12
13
Singapore Tel: +65 6362 8388 email: [email protected]
Taiwan Tel: +886(2) 2698-9888 email: [email protected]
OPTION INDEX
Ordering Codes
Base part
83
Option Index C
Available option codes for Aavid 12 digit part numbers. For additional information on option codes see "How to decipher
an Aavid 12 digit part number" on page 80. To find the appropriate Option Index for a selected part number please refer
to the main product section in the front of the catalog or "How to use this catalog" on page 2.
Ordering Codes
Base part
Finishes
(page 110)
Wave-OnTM mounts
OPTION INDEX
(page 89)
84
500103
500203
500303
500403
501303
501403
501503
501603
505103
505303
505403
506003
506304
519703
519803
519903
520103
520328
520329
566010
566902
569003
574204
575603
575703
575803
575903
576103
576203
576303
576403
576802
576904
577304
577404
579003
579604
579704
584000
591202
591302
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
V
V
01
01
01
01
01
01
01
01
01
01
01
02
02
02
02
03
02
03
02
02
02
02
04
04
03
03
04
03
05
04
03
03
03
07
09
05
05
07
07
09
07
05
05
05
In-Sil-8TM
pads
(page 86)
1
1
1
1
1
1
1
1
1
1
1
3
3
3
3
3
3
3
3
3
3
3
Semiconductor
mounts
(page 90)
Solderable
tabs
(page 91–93)
Solderable
nuts
(page 94)
13
13
04
13
13
V
V
V
V
01
01
01
01
01
53
03
03
03
04
04
04
04
05
05
05
05
07
07
07
09
09
1
1
1
1
13
14
Solderable
studs
(page 96)
06
06
06
06
06
06
06
08
08
08
08
07
08
08
08
09
09
09
09
08 09
17
17
17
14
14
3
3
3
3
08
28 31 34 37
31 37 39 40
V
01
02
04 05
1
3
06
08
17
09
11
32 33
V
V
V
V
V
V
01
01
01
01
01
01
01
01
03
03
04
03
02
02
02
02
04
04
05
04
03
03
04
04
01
01
01
02
02
02
05
03 05
03 05
03 05
05
05
07
05
04
04
05
05
09
07
05
05
1
1
1
1
1
1
1
1
3
3
3
3
3
3
3
3
31 32 33 37 39 40
01
05
32
32
33
31
28
AMERICA
EUROPE
www.aavidthermalloy.com
05
05
04
04
05
05
07
05
04
04
04
KonduxTM
pads
(page 86)
USA Tel: +1 (603) 224-9988 email: [email protected]
Italy Tel: +39 051 764011 email: [email protected]
United Kingdom Tel: +44 1793 401400 email: [email protected]
33
33
35
33 37 38 39 40
40
ASIA
Singapore Tel: +65 6362 8388 email: [email protected]
Taiwan Tel: +886 (2) 2698-9888 email: [email protected]
Option Index D
Available option codes for Thermalloy origin part numbers. For additional information on option codes see "How to decipher
a Thermalloy Origin part number" on page 81. To find the appropriate Option Index for a selected part number, refer to the
main product section in the front of the catalog or "How to use this catalog" on page 2.
Ordering Codes
Finishes
Mounting
tabs
(page 93)
(page 110)
6021
6022
6025
6109
6110
6225
6230
6232
6238
6239
6374
6380
6396
6398
6399
6400
7019
7020
7021
7022
7023
7025
B U
B U
PB
B U
B U
B U
B U
B U
B U
B U
B
B
B
B
B
B
B U
B U
B U
B U
B U
B U
Clips
(page 98)
PB
PB
D
PB
PB
PB
PB D
PB
PB
TC-10
MT MT3 MT5
MT MT5 MT6
MT
TC-1
PB
MT
MT6
MT MT2 MT5 MT6 TC-10
MT MT5 MT6
TC-10
MT
MT5
TC-1
MT
MT5
TC-1 TC-6
MT MT3 MT6
TC-12
AMERICA
EUROPE
www.aavidthermalloy.com
Clinch
nuts
(page 95)
Solderable
nuts
(page 94)
CNM1
CNM1
CNE42
CNE42
CNE42
TC-11
TC-11
TC-11
TC-7
P2
P2
P2
P2
P2
P2
SE3
TC-12 SE3
TC-12
TC-12 SE3
TC-12
SE3
Grafoil®
pads
(page 86)
G5
G5
G5
G5
G5
CNE42
CNM1 CNM2
CNE42 CNE43
CNM2
P3
Alignment
pads
(page 87)
G5
SF1
TC-6
TC-6
PB
Device
mtg. studs
(page 96)
SF1
SF1 SF2
SF1 SF3
SE3 SE1 SF1
SE1 SM3
SF1
TC-10
TC-1
MT MT5
MT
MT
Solderable
studs & pins
(page 94–96)
SF1
OPTION INDEX
Base
part
G7
G7
SNM1
CNM1 CNE42
CNE42
SF1
USA Tel: +1 (603) 224-9988 email: [email protected]
Italy Tel: +39 051 764011 email: [email protected]
United Kingdom Tel: +44 1793 401400 email: [email protected]
SNE2
ASIA
8223-CL03
G5 G4
8223-CL03
G5
8241-CL11 8223-CL03
G4
8223-CL03
Singapore Tel: +65 6362 8388 email: [email protected]
Taiwan Tel: +886(2) 2698-9888 email: [email protected]
85
Interface Material/Pads
In-Sil-8TM
TO-3
INTERFACE MATERIALS
These silicone based pads provide both thermal
conductivity and electrical isolation. In-Sil-8TM
pads have a fiberglass carrier that withstands
the rigors of assembly, harsh environments
and aging under continuous use. In-Sil-8TM pads
install faster than traditional mica and grease
and will not contaminate solder baths. Screw
mounting is recommended to achieve the best
thermal performance.
TO-218
TO-220
2X ø 3.56
(0.140)
12.70
(0.500)
41.91
(1.650)
19.05
(0.750)
2X ø 2.36
(0.093)
18.80
(0.740)
3.73 DIA
(0.147)
14.30
(0.563)
21.84
(0.860)
16.76
(0.660)
28.96
(1.140)
ORDERING INFORMATION
example 12 digit part 507222B _ 0000G
MATERIAL PROPERTIES
Color
Ordering code
Grey
Thickness
0.18 (0.007)
Breakdown voltage
3500
Dielectric constant
5.5
The shape and hole pattern of the heat sink will determine the shape and hole
pattern of the pad. If you are ordering a heat sink which mounts to a semiconductor on both sides, the ordering code for two pads should be used. To order
additional In-SilTM pads separate, or factory applied variations please contact
an Aavid sales rep for inquiries.
TO-3
TO-220
Thermal resistance (approx.)
0.33
1.25
0.77
Ordering code
Screw size
6-32
4-40
4-40
Torque in–lbs
6–8
4–6
4–6
Description
0
No pads
3
One In-Sil-8TM pad
4
Two In-Sil-8TM pads
TO-218
KonDux™ / Grafoil® Conducta-Pad**
Kondux™ interface pads are a cost effective
alternative to thermally conductive grease
compounds. Kondux™ pads are electrically
conductive and ideal for use with small,
discrete semiconductors. Aavid pre-applies
Kondux™ to your heatsink to enhance heat
conductance from the semiconductor case
and speed your manufacturing process.
Figure A
Figure B
2X ø 3.56
(0.140)
"C"
"B"
41.91
(1.650)
"A"
ORDERING INFORMATION
example 12 digit part 575703B _ 0000G
Ordering code
The shape and hole pattern of the heat sink will determine the shape and hole
pattern of the pad. If you are ordering a heat sink which mounts to a semiconductor on both sides, the ordering code for two pads should be used.
Ordering code
Device
Figure
1 or 2*
TO-3
A
1 or 2*
TO-218
1 or 2*
TO-220
2X ø 2.36
(0.093)
"A" Dim
"B" Dim
"C" Dim
B
19.05 (0.750)
4.57 (0.180)
15.24 (0.600)
B
15.88 (0.625)
2.68 (0.105)
10.67 (0.420)
28.96
(1.140)
MATERIAL PROPERTIES
*Factory applied only
One KonDuxTM pad
Color
example
Thermalloy origin part 6109B A
Suffix
G1
Device
Figure
TO-3
A
G
B
C
"A" Dim
A = Model number
B = Grafoil® pad
C = RoHS compliant
"B" Dim
"C" Dim
TO-218
B
19.30 (0.760)
4.83 (0.190)
15.75 (0.620)
G5
TO-220
B
16.51 (0.650)
3.43 (0.135)
10.67 (0.420)
Multiwatt
B
17.53 (0.690)
2.92 (0.115)
20.07 (0.790)
0.13 (0.005)
Thermal resistance
See Graph pg 10
Electrical resistivity
15 x 10-6 Ohms
Compression strength:
for 10% reduction in thickness
Tensile strength
G4
G7
Black (metallic)
Thickness
Ultimate compression strength
Service temperature
Liner
580 psi
650 psi
12500 psi
-240°C to +300°C
None
** The Grafoil® name was originally marketed by Thermalloy and is the same material as KonduxTM
Grafoil® is a registered trademark of the Union Carbide Company
86
AMERICA
EUROPE
www.aavidthermalloy.com
USA Tel: +1 (603) 224-9988 email: [email protected]
Italy Tel: +39 051 764011 email: [email protected]
United Kingdom Tel: +44 1793 401400 email: [email protected]
ASIA
2.69 DIA
(0.160)
Singapore Tel: +65 6362 8388 email: [email protected]
Taiwan Tel: +886 (2) 2698-9888 email: [email protected]
Interface Material/Pads
Hi-Flow® *
TO-3
Aavid Thermalloy has added a phase change
pad to its line-up. These pads provide low
thermal resistance and electrical isolation
for low pressure spring mount applications.
Above the phase change temperature the
material flows to fill in surface irregularities
and maximize the heat conduction path.
41.91
(1.650)
19.05
(0.750)
18.80
(0.740)
3.73 DIA
(0.147)
2.69 DIA
(0.160)
21.84
(0.860)
14.30
(0.563)
16.76
(0.660)
INTERFACE MATERIALS
12.70
(0.500)
2X ø 2.36
(0.093)
28.96
(1.140)
MATERIAL PROPERTIES
ORDERING INFORMATION
example 12 digit part 530101B _ 5150G
Reinforcement carrier
Ordering code
Polymide
Thickness
The shape and hole pattern of the heat sink will determine the shape and hole
pattern of the pad. If you are ordering a heat sink which mounts to a semiconductor on both sides, the ordering code for two pads should be used. To order
additional Hi-Flow® pads separate, or factory applied variations please contact
an Aavid sales rep for inquiries.
Ordering code
TO-218
TO-220
2X ø 3.56
(0.140)
0.127 (0.005)
Continuous use temp (°C)
150
Phase change temp(°C)
55
Dielectric breakdown voltage (Vac)
5000
Dielectric constant (1000 Hz)
4.5
Volume resistivity (Ohm-meter)
Description
1012
0
No pads
7
One Hi-Flow® pad
Pressure
8
Two Hi-Flow® pads
TO-220 Thermal performance (ºC/W)
Thermal impedance vs. pressure
10
25
50
200
1.15
1.14
1.12
1.1
* Hi-Flow® is a registered trademark of the Bergquist Company
Alignment Pads
Solderable alignment pads are an innovative
way to attach the heat sink to your transistor that
could cut your assembly time by more than half.
Alignment pads provide cost effective solderability,
while providing numerous additional benefits.
Alignment pads are factory applied and can be
bought separately as well. Please refer to accessory
Index D on page 85.
ORDERING INFORMATION
example
Thermalloy origin part 7022B–8223–CL03 G
A
Suffix
Device
Figure
8223-CL03G
TO-220
B
8241-CL11G
TO-218
A
C
B
Figure A
Figure B
30.48
(1.200)
7.62
(0.300)
13.21
(0.520)
25.02
(0.985)
11.68
(0.460)
3.25
(0.128)
9.40
(0.370)
3.10
(0.122)
25.40
(1.000)
A = Model number
B = Alignment pad
C = RoHS compliant
20.07
(0.790)
17.02
(0.670)
5.08 21.84
(0.200) (0.860)
0.76
(0.030)
21.84
(0.860)
0.76
(0.030)
14.22
(0.560)
0.51
(0.020) 3.18
TYP THK (0.125)
5.08
(0.200)
Typical installation
Shown with part number 8241-CL11
Recommended hole pattern for 8223-CL03G
PLATED THRU HOLE PER
DEVICE MANUFACTURERS
RECOMMENDATION
2.54
(0.100)
2.95 DIA PLATED
(0.116) THRU HOLE
2.54
(0.100)
CLIP ASSEMBLY
AMERICA
EUROPE
14.73
(0.580)
USA Tel: +1 (603) 224-9988 email: [email protected]
Italy Tel: +39 051 764011 email: [email protected]
United Kingdom Tel: +44 1793 401400 email: [email protected]
2.95 DIA PLATED
(0.116) THRU HOLE
TYP(2)
1.60 DIA PLATED
(0.063) THRU HOLE
TYP(3)
5.46
(0.215)
5.46
(0.215)
12.70
(0.500)
7.37
(0.290)
CL1
www.aavidthermalloy.com
Recommended hole pattern for 8241-CL11G
25.40
(1.000)
ASIA
Singapore Tel: +65 6362 8388 email: [email protected]
Taiwan Tel: +886 (2) 2698-9888 email: [email protected]
87
Interface Material / Double Sided Tape
INTERFACE MATERIALS
Double-sided thermal tapes adhere the heat sink to the device and offer
good thermal characteristics. They are easy to apply, require no curing time,
can be electrically conductive or isolating, and need no mechanical support
to provide thermal or physical contact between the device and the heat sink.
Aavid can apply one side to a heat sink.
ORDERING INFORMATION
example 12 digit part 375224B000 _ _G
Ordering code
Ordering code
Tape option
31
T414
32
T405R
33
T412
34
T410R
35
T411
T414 for ceramic or metal packages
T405R for ceramic or metal packages
Uses a 0.001 inch (0.03 mm) Kapton MTTM filled polymide
film coated on both sides with high-bond strength, pressuresensitive acrylic adhesive that is loaded with aluminum oxide
particles. This provides both good thermal performance and
excellent electrical isolation.
Uses a 0.002 inch (0.05 mm) aluminum foil core coated on both sides
with high-bond strength, pressure-sensitive acrylic adhesive that is
loaded with aluminum oxide particles. The aluminum foil provides
added thermal conductivity for applications where electrical isolation
is not required. The combination of filter, expanded metal and embossed
surface enhances both tape conformability and thermal performance.
Color
Beige
Color
White
Electrical function
Insulating
Electrical function
Conductive
Thickness
0.127 mm (0.005)
Thickness
0.006 (0.015)
Carrier
Kapton MTTM
Carrier
Aluminum
Thermal impedance
0.60 °C-in2/w
Thermal impedance
0.54 °C-in2/w
Thermal conductivity
0.37 w/m-k
Thermal conductivity
0.50 w/m-k
Breakdown voltage
5000 VAC
Breakdown voltage
N/A
Volume resistivity
5 x 1015 Ohm-cm
Volume resistivity
3 x 10-2 Ohm-cm
Lap shear adhesion
125 (0.862) psi
UL flammability
94V-0
Rating
U.L.94
Lap shear adhesion
134 psi
Die shear adhesion
Aluminum 25°C
Aluminum 150°C
Alum.oxide 25°C
Alum.oxide 150°C
125 psi
55 psi
145 psi
60 psi
Creep adhesion
25°C @ 12 psi
150°C @ 12 psi
>50 days
>50 days
Die shear adhesion
Aluminum 25°C
Aluminum 150°C
150 psi
15 psi
Creep adhesion
25°C @ 12psi
150°C @ 12psi
>50 days
>10 days
T412 for ceramic or metal packages
T410R / T411 for plastic packages
Uses an expanded foil carrier coated on both sides with
high-bond strength, pressure sensitive acrylic that is
loaded with titanium diboride particles. The combination
of filter, expanded metal and embossed surface enhances
both tape conformability and thermal performance.
T410R thermally conductive tape consists of a high bond strength,
pressure sensitive acrylic adhesive loaded with aluminum oxide and
coated onto a 0.002 inch (0.05mm) aluminum foil carrier. The other
side of the foil carrier has a silicone pressure sensitive adhesive which
provides excellent adhesion to silicone-contaminated plastics and
other low energy surfaces.
T411 thermally conductive tape consists of a high bond strength,
pressure sensitive adhesive with an aluminum mesh carrier layer. The
mesh carrier allows the tape to conform to curved surfaces of plastic
molded IC packages, providing a high adhesive strength attachment
for heat sinks. The high performance silicone PSA allows adhesion to
silicone-contaminated plastics and other low energy surfaces.
Color
Grey
Electrical function
Conductive
Thickness
0.009 (0.23 )
Carrier
Expanded aluminum
Thermal impedance
0.25 °C-in2/w
Thermal conductivity
1.40 w/m-k
Breakdown voltage
N/A
Typical properties
T410R
T411
Volume resistivity
N/A
Acrylic
Silicone
UL flammability
N/A
Construction
Adhesive (to heat sink side)
Lap shear adhesion
70 psi
Color
White
Clear (silver)
Carrier
Aluminum foil
Aluminum mesh
Adhesive (onto component side)
Silicone
Silicone
Color (to component side)
Clear (Silver)
Clear (Silver)
Thickness, mm (inch)
0.18 (0.007)
0.28 (0.011)
Thermal impedance @<1 psi °C-cm2/w (°C-in2/w)
Operating temperature range, °C
7.1 (1.1)
-50 to + 150
6.5 (1.0)
-50 to + 150
Lap shear adhesion, psi (MPa)
Die shear adhesion, psi (MPa) steel/FR4
25°C
125 °C
60 (0.414)
14 (0.094)
170 (1.172)
40 (0.276)
80 (0.552)
20 (0.138)
Die shear adhesion
Aluminum 25°C
Aluminum 150°C
Alum.oxide 25°C
Alum.oxide 150°C
Creep adhesion
25°C @ 12 psi
150°C @ 12 psi
135 psi
25 psi
125 psi
40 psi
>50 days
>10 days
Note: Double Sided Tapes are factory applied only.
88
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ASIA
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Wave-OnTM Mounts
Solderable mounts can be factory installed to practically
every board-mountable heat sink and flat sided extrusion.
The female threaded through holes permit pre-assembly
to the semiconductor via machine screws , allowing the
heat sink/semiconductor package to be treated as one unit
when fitted in PC board through holes for wave soldering.
Typical Wave-OnTM mount installation
HEAT SINK
DIM "C"
STAND-OFF LENGTH
FEATURES
Saves production time and cost
• Cuts production steps by half
DIM "T"
PC BOARD
• Factory installation eliminates steps
• Permits soldering in one step
• All the benefits of female threaded mount
• Automated fastening
7.92
(0.312)
• Excellent solderability
"D"
Better thermal performance
• Built in stand-off adds air space between PCB
and heat sink for improved air flow and easier
cleaning
"C"
• No lockwashers, nuts or separate
mounts with various thread lengths
"B"
"A"
ORDERING INFORMATION
example part 574802B0 _ _ 00G
Ordering code
Model
“A” Dim
“B” Dim
“C” Dim
“D” Dim
Threaded
thru holes
01
E
4.32 (0.170)
2.54 (0.100)
2.54 (0.100)
0.96 (0.038)
#6-32
02
EA
3.43 (0.135)
2.54 (0.100)
2.54 (0.100)
0.96 (0.038)
#4-40
03
EG
3.43 (0.135)
2.54 (0.100)
1.14 (0.045)
0.96 (0.038)
#4-40
04
EH
4.32 (0.170)
3.43 (0.135)
2.54 (0.100)
0.96 (0.038)
#6-32
05
EK
4.32 (0.170)
2.54 (0.100)
1.14 (0.045)
0.96 (0.038)
#6-32
07
EM
4.32 (0.170)
2.54 (0.100)
2.54 (0.100)
0.96 (0.038)
3.5MM
09
ER
4.32 (0.170)
2.54 (0.100)
5.08 (0.200)
0.96 (0.038)
#6-32
Ordering code
Model
Dia of PCB plated
thru hole
PCB
thickness “T”
EA, EG
3.68 (0.145)
1.57 (0.062)
E, EK, EM, ER
4.75 (0.187)
1.57 (0.062)
EH
4.75 (0.187)
2.29 (0.090)
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LABOR SAVING HEAT SINK TO BOARD & DEVICE TO HEAT SINK MOUNTS
Wave-OnTM Mounts
89
LABOR SAVING HEAT SINK TO BOARD & DEVICE TO HEAT SINK MOUNTS
Semiconductor Mounts
Female Semiconductor Mounts
"A"
• Fastens semiconductor to heat sink fast and efficiently
"C"
• Up to 10 times faster than fastening
with standard nuts and bolts
• Used with most JEDEC case sizes, factory installed
"A"
"B"
INSTALL
MOUNT
ORDERING INFORMATION
example 12 digit part 542502B000 _ _G
"C"
"D"
Ordering code
Ordering code
01
Thread
“A” Dim
“B” Dim
“C” Dim
“D” Dim
#6-32
7.11 (0.280)
4.75 (0.187)
1.78 (0.070)
2.74 (0.108)
02
#4-40
6.35 (0.250)
4.19 (0.165)
1.78 (0.070)
2.74 (0.108)
03
3.00 (0.118)
6.35 (0.250)
4.22 (0.166)
1.50 (0.059)
2.47 (0.097)
Male Semiconductor Mounts
• Captive male studs for semiconductor attachments
• Used with most JEDEC case sizes, factory installed
MALE SEMICONDUCTOR
MOUNT
9.65
(0.380)
0.63
(0.025)
ORDERING INFORMATION
example 12 digit part 507302B000 _ _G
Ordering code
Ordering code
90
Thread
04
#6-32
05
#4-40
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ASIA
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TM
Shur-Lock
TM
Tabs
Aavid’s Shur-Lock™ self locking stand-off tab (U.S. Patent
#5,437,561) positively secures any heat sink to the printed circuit
board. This Shur-Lock™ tab exhibits many unique design features.
FEATURES
• Positive PCB engagement
• Integrated PCB stand-off
The rounded and bifurcated tip of the Shur-Lock™ solderable tab
has been designed to easily snap into any 0.093” diameter hole.
Once through the hole, the tab provides a positive resistance to
backing or falling out of the hole. In addition, the spring action
between the tab and the plated through hole prevents leaning
or lift-off of the heat sink prior to or during the soldering process.
The tip extension of the Shur-Lock™ tab has been designed to
protrude less than 0.060” beyond the back of a standard 0.0625”
PC board, which is below the normal lead trimming allowance
for assembled PCBs.
Shur-Lock’s™ stand-off design facilitates the cleaning of assembled PCBs and permits electrical traces to be routed under the
heat sink. The wide base supports of the tab further improve
the stability of the heat sink assembly.
• Quick “snap-in” assembly design
• Reduces installed assembly cost
• Designed for rugged shock
and vibration environments
• Can be installed on a variety of stamped
and extruded board level heat sinks
Factory applied only
Tab ordering code 28
1.58
(0.062)
ORDERING INFORMATION
example 12 digit part 574802B0 _ _ 00G
Ordering code
PRODUCT INFORMATION
Material
Spring steel
Finish
Tin plating over a copper flash
Pull-out force*
70 lbs/tab minimum
Recommended
PCB hole diameter
PCB thickness
0.092” – 0.096”
0.065” – 0.068”
0.76
(0.030)
6.35
(0.250)
2.67
(0.105)
6.35
(0.250)
Variations of the above specifications are possible. Contact Aavid Thermalloy for
additional details for use with thicker PCB sizes, such as 0.093” or other hole diameters.
*Vertical force applied to the sink-tab joint.
10.41
(0.410)
TM
Solderable Staked on Tabs
Aavid solderable tabs stake onto heat sinks for solder mounting into the
PC board. The tabs are available in a variety of lengths, widths and thicknesses.
LABOR SAVING HEAT SINK TO BOARD & DEVICE TO HEAT SINK MOUNTS
Tabs
Tabs are factory applied for both vertical and horizontal mountings including:
step tabs, which keep the heat sink elevated above the board, and tabs with a
triangular base for extra stability.
Many of Aavid’s tabs are customized. Below are examples of standard tabs.
Please consult Aavid’s customer service department for information about
other tab options.
ORDERING INFORMATION
example 12 digit part 574802B0 _ _ 00G
Ordering code
Tab ordering code 31
Tab ordering code 32
3.56
(0.140)
1.27
(0.050)
1.57
(0.062)
6.10
(0.240)
6.35
(0.250)
0.51
(0.020)
6.10
(0.240)
0.76
(0.030)
4.37
(0.172)
9.53
(0.375)
1.02
(0.040)
2.79
(0.110)
4.06
(0.160)
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ASIA
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Taiwan Tel: +886 (2) 2698-9888 email: [email protected]
91
LABOR SAVING HEAT SINK TO BOARD & DEVICE TO HEAT SINK MOUNTS
Tabs
Tab ordering code 33
Tab ordering code 34
7.87
(0.310)
0.76
(0.030)
1.57
(0.062)
1.90
(0.075)
6.10
(0.240)
6.10 C
(0.240) L
0.64
(0.025)
0.76 R
(0.030)
5.03
(0.198)
7.11
(0.280)
8.89
(0.350)
0.51
(0.020)
15.62
(0.615)
1.75
(0.069)
0.81
(0.032)
12.14
(0.478)
Note: The drawing above shows the right hand of a matched pair
which are supplied mounted to the heat sink.
Tab ordering code 36
Tab ordering code 35
5.08
(0.200)
7.11
(0.280)
5.08
(0.200)
6.10
(0.240)
2.41
(0.095)
2.46
(0.097)
8.89
(0.350)
12.95
(0.510)
0.81
(0.032)
1.63
(0.064)
1.78
(0.070)
0.81
(0.032)
Tab ordering code 37
Tab ordering code 39
9.53
(0.375)
6.35
(0.250)
3.18
1.60 (0.125)
(0.063)
6.35
(0.250)
1.27
(0.050)
6.35
(0.250)
0.51
(0.020)
15.88
(0.625)
9.53
(0.375)
15.88
(0.625)
1.02
(0.040)
0.81
(0.032)
92
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1.63
(0.064)
ASIA
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Taiwan Tel: +886 (2) 2698-9888 email: [email protected]
Tab ordering code 40
Tab ordering code 43
6.32
(0.245)
6.35
(0.250)
3.18
(0.125)
6.35 C
(0.250) L
3.18
1.27 (0.125)
(0.050)
6.35
(0.250)
1.27
(0.050)
15.88
(0.625)
12.57
(0.495)
1.63
(0.064)
0.51
(0.020)
1.02
(0.040)
0.81
(0.032)
Solderable Mounting Tabs
FIGURE A
Heat sinks ordered with solderable mounting
tabs have tin-plated spring steel tabs permanently locked onto the heat sink to provide
wave solderability. The solderable tabs are
mounted on the heat sink after anodizing,
thus eliminating any special coating or handling. The result is a wave solderable heat
sink with black anodized performance.
FIGURE B
7.62
(0.300)
7.62
(0.300)
"A"
"A"
"B"
"B"
3.18
(0.125)
2.79
(0.110)
3.18
(0.125)
ORDERING INFORMATION
example 12 digit part 574802B0 _ _ 00G
Ordering code
example
Thermalloy origin part 6070B–
A
G
B
C
2.28
(0.090)
4.83
(0.190)
MT3 ONLY
7.87
(0.310)
A = Model number
B = Mounting tab suffix
C = RoHS compliant
7.87
(0.310)
2.03
(0.080)
LABOR SAVING HEAT SINK TO BOARD & DEVICE TO HEAT SINK MOUNTS
Tabs
SEE DETAIL B
BEVELED
CORNERS
MT3 ONLY
3.09
(0.122)
DETAIL B
Typical Installation
ADD TO
HEIGHT OF PART
"A" REF
TRIANGULAR
TAB
Suffix
Features
Figure
Recommended
PCB plated
thru hole:
Ordering code
Stand-off height
“A” Dim
“B” Dim
MT
53
5.21 (0.205)
Solderable mounting tab
15.88 (0.625)
4.83 (0.190)
A
2.90 ± 0.10 (0.114 ± 0.004)
MT2
54
8.51 (0.335)
Solderable mounting tab
19.18 (0.755)
8.13 (0.320)
A
2.90 ± 0.10 (0.114 ± 0.004)
MT3
55
5.21 (0.205)
50 degree beveled corners on stand-off portion reducing board footprint
from 7.87 (0.310) to 4.83 (0.190) width. Only tab with this feature.
15.88 (0.625)
4.83 (0.190)
A
2.90 ± 0.10 (0.114 ± 0.004)
MT5
56
5.21 (0.205)
Bifurcated tabs in lieu of triangular shape
15.88 (0.625)
4.83 (0.190)
B
2.95 ± 0.05 (0.116 ± 0.002)
MT6
57
2.92 (0.115)
Bifurcated tabs in lieu of triangular shape
13.59 (0.535)
2.54 (0.100)
B
2.95 ± 0.05 (0.116 ± 0.002)
Notes: Mounting tabs have unique locking features built into their design. Aavid Thermalloy adds
to standard and custom heat sinks. For this reason, the tabs are factory applied, and cannot be sold
separately. Please see page 85 for additional tab options.
AMERICA
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ASIA
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Taiwan Tel: +886 (2) 2698-9888 email: [email protected]
93
LABOR SAVING HEAT SINK TO BOARD & DEVICE TO HEAT SINK MOUNTS
Solderable Pins / Solderable Nuts
Solderable Pins
FIGURE A
Vertically mounted, extruded heat sinks are
converted to wave solderable with the addition
of solderable roll pins. Roll pins are available
with stand-off shoulders in different heights
for easier cleaning after wave soldering.
2.34
(0.092)
ø 5.49 ø 2.46
(0.216) (0.097)
4.45
(0.175)
2.41
(0.095)
Pin P2-P3
B C
Suffix
Ordering code
1.27
(0.500)
2.41
(0.095) REF
5.49
(0.216)
REF
Ordering code
A
Typical installation P2-P3
3.96
(0.156)
ORDERING INFORMATION
example 12 digit part 529902B0 _ _ 00G
G
2.46
(0.097) REF
A = Model number
B = Solid pin suffix
C = RoHS compliant
Description
12.70
(0.500)
"A"
Pin 25
example
Thermalloy origin part 6396B–
FIGURE B
12.70
(0.500)
Heat sink
"A"
“A” Dim
Figure
P2
21
Solid pin w/stand-off shoulder 0.050"
0.050
A
P3
N/A
Solid pin w/stand-off shoulder 0.125"
0.125
A
N/A
25
Solid solderable pin
PC Board
Stand-Off Shoulder
B
Solderable Nuts
Solderable nuts are permanently swaged into the heat sink
for quick pre-assembly with the transistor. Screws are used
to mount to the heat sink and are installed from the top.
Solderable nuts feature a closed end that prevents solder
from wicking into threads and trapping contaminants or flux.
Heat sink and transistor are then handled as a single component and dropped into plated-thru holes in the PC board for
wave soldering. (Solderable nuts require slightly larger printed
circuit board hole sizes)
FEATURES
• Pre-mounted to heat sink at factory
• Ease of pre-assembly in production
• Mechanical and electrical integrity
• Wave solderability
ORDERING INFORMATION
example 12 digit part 506003B0 _ _ 00G
3.56
(0.140)
3.28
(0.129)
Ordering code
example
Thermalloy origin part 7019B–
A
G
B
A = Model number
B = Solderable nut suffix
C = RoHS compliant
C
Suffix
Ordering code
Dia of PCB thru hole
SNM-1
N/A
4.95 (0.195)
M3X0.5
SNE-1
14
4.95 (0.195)
4-40 UNC-2B
SNE-2
13
4.95 (0.195)
6-32 UNC-2B
ø 7.62
(0.300)
4.32
(0.170)
Thread
7.75
(0.305)
Note: If a part number requires 2 solderable nuts, simply add a "/2" after the solderable
nut character suffix on Thermalloy origin parts.
THREAD
Mechanical drawings showing heat sinks with solderable nuts
1.27
(0.050)
3.28
(0.129)
ø 4.32
(0.170)
CL
SOLDERABLE
NUT
3.56
(0.140)
ø 4.32
(0.170)
1.65
(0.065)
3.56
(0.140)
3.28
(0.129)
SOLDERABLE NUT
94
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Clinch Nuts
Clinch nuts are threaded nuts that allow quick assembly of the
transistor to the heat sink. A single screw mounts the transistor
to the heat sink, reducing your hardware requirements. Clinch
nuts are permanently pressed into the heat sink, and come in a
variety of English and Metric threads–CNE designates an English
thread, and CNM designates a Metric thread.
FIGURE A
FIGURE B
SECTION A-A
1.50
(0.059)
1.78
(0.070)
"A"
"A"
"A"
"B"
"A"
6.35
(0.250
6.30
(0.248)
Mechanical drawing showing heat sink with clinch nut
ORDERING INFORMATION
example 12 digit part 529801B000 _ _ G
example
Thermalloy origin part 7019B–
A
CLINCH NUT
Ordering code
G
B
C
A = Model number
B = Clinch nut suffix
C = RoHS compliant
Suffix
Ordering code
Thread
“A” Dim
CNE42
12
4-40 UNC-2B
0.96 (0.038)
CNE43
N/A
4-40 UNC-2B
1.37 (0.054)
CNM1
13
M3 X 0.5
0.76 (0.030)
4.06 (0.160)
B
CNM2
N/A
M3 X 0.5
0.96 (0.038)
4.22 (0.166)
B
AMERICA
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“B” Dim
CLINCH NUT
INSTALLED
Figure
A
A
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Italy Tel: +39 051 764011 email: [email protected]
United Kingdom Tel: +44 1793 401400 email: [email protected]
ASIA
Singapore Tel: +65 6362 8388 email: [email protected]
Taiwan Tel: +886 (2) 2698-9888 email: [email protected]
LABOR SAVING HEAT SINK TO BOARD & DEVICE TO HEAT SINK MOUNTS
Clinch Nuts
95
LABOR SAVING HEAT SINK TO BOARD & DEVICE TO HEAT SINK MOUNTS
Studs
Solderable Studs
Threaded solderable studs are permanently swaged in place
for quick pre-assembly with the transistor. The device is
placed over the stud (s) followed by the lock washer and
nut. This entire component is then dropped into plated-thru
holes in the printed circuit board for wave soldering. The
end of the stud is tin-plated for excellent solderability and
extends only 0.040" below a 0.062" PC board to clear lead
trimming saws.
"A"
ø 5.49
(0.216)
"B"
"C"
ORDERING INFORMATION
example 12 digit part 501303B000 _ _ G
example
Thermalloy origin part
FIGURE A
Ordering code
7022B–
A
Suffix
Typical installation
A = Model number
B = Stud suffix
C = RoHS compliant
G
B
FIGURE B
C
Ordering code
Dia of PCB thru hole
“A” Dim
“B” Dim
“C” Dim
Figure
SE-1
08
3.68 (0.145)
8.89 (0.350)
6-32
1.13-1.26 (0.045-0.050)
A
SE-2
06
3.68 (0.145)
12.32 (0.485)
6-32
1.14-1.27 (0.045-0.050)
A
SE-3
09
3.68 (0.145)
8.89 (0.350)
4-40
1.14-1.26 (0.045-0.050)
A
SE-4
14
3.68 (0.145)
8.89 (0.350)
6-32
3.05 (0.120)
B
SM-1
17
3.68 (0.145)
8.89 (0.350)
M3 x 0.5
3.05 (0.120)
B
SM-3
07
3.68 (0.145)
8.89 (0.350)
M3 x 0.5
1.13-1.26 (0.045-0.050)
A
HEAT
SINK
HEAT
SINK
"C"
"C"
PC BOARD
PC BOARD
Note: Factory installed only
Device Mounting Studs
Device mounting studs for "Thermalloy-origin"
items are available as options on certain vertical
and board mount heat sinks as a labor-saving aid
for mounting semiconductors. This optional feature
speeds production assembly time and reduces
hardware requirements.
"A"
"D"
"B"
"C"
ORDERING INFORMATION
example 12 digit part 529801B000 _ _G
Mechanical drawing showing heat sink with device mounting studs
Ordering code
example
Thermalloy origin part 7019B–
A
Suffix
G
B
C
A = Model number
B = Stud suffix
C = RoHS compliant
Ordering code
“A” Dim
“B” Dim
“C” Dim
“D” Dim
SF1
11
7.92 (0.312)
4-40 UNC-2A
0.25 (0.010)
4.75 (0.187)
SF2
N/A
8.00 (0.315)
M3 x 0.5
0.25 (0.010)
4.60 (0.181)
SF3
N/A
7.92 (0.312)
6-32 UNC-2A
0.25 (0.010)
5.23 (0.206)
CL
Device
Mounting
Stud
Note: Factory installed only
96
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Aavid Kool-KlipsTM
These one piece stainless steel clips eliminate the need for
screws, lock washers and nuts in the assembly process, therefore reducing assembly time and cost. These can be bought
separately, or found in the 11th or 12th position when deciphering an Aavid Standard product. Please reference Indexes
to see which clips are popular with which product offering.
6801G
14.25
(0.561)
37.10
(1.461)
ORDERING INFORMATION
To order clips seperately use part number below.
To order a clip as an option use ordering code.
example 12 digit part 530101B000 _ _ G
7.54
(0.297)
5901G
Ordering code
Part number
Transistor case style
115000F00000G
TO-220, TO-218
50
115100F00000G
TO-220, TO-218
51
115200F00000G
TO-220, TO-218
52
115300F00000G
TO-220, TO-218
53
115400F00000G
TO-220
54
7.24
(0.285)
Ordering code
3.99
(0.157)
37.08
(1.460)
7701G
116200F00000G
TO-220, TO-218
5901G
TO-220, TO-218, TO-247
Sold separately only
62
6801G
TO-220, TO-218, TO-247
Sold separately only
7701G
TO-220
Sold separately only
6.60
(0.260)
16.00
(0.630)
11.00
(0.433)
4.75
(0.187)
115000F00000G Code 50
115100F00000G Code 51
30.60
(1.205)
6.60
(0.260)
39.10
(1.540)
8.70
(0.342)
12.70
(0.500)
13.50
(0.530)
LABOR SAVING HEAT SINK TO BOARD & DEVICE TO HEAT SINK MOUNTS
Clips
6.60
(0.260)
115200F00000G Code 52
115300F00000G Code 53
3.18
(0.125)
13.84
(0.545)
6.60
(0.260)
25.65
(1.010)
12.06
(0.475)
7.62
(0.300)
115400F00000G Code 54
116200F00000G Code 62
7.92
(0.312)
6.60
(0.260)
30.61
(1.205)
8.69
(0.342)
10.92
(0.430)
12.70
(0.500)
5.97
(0.235)
14.22
(0.560)
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97
LABOR SAVING HEAT SINK TO BOARD & DEVICE TO HEAT SINK MOUNTS
Clips
Thermal Clips
Factory-Installed ONLY thermal clips, available on many
standard heat sinks (shown below) eliminate the use of screws
and nuts in assembling the heat sink and transistor. Plastic
case transistors slip into place for easy assembly. Thermal clips
are available in a variety of configurations. Locking clips have
an internal tab to lock the transistor permanently in place.
ORDERING INFORMATION
example 12 digit part 530600B000 _ _ G
example
Thermalloy origin part 7023B–
A
Suffix
Ordering code
A = Model number
B = Clip suffix
C = RoHS compliant
G
B
C
Ordering code Transistor case style
Clip/Cover features
TC1
32
TO-220
TC6
36
TO-218, TO-220, Multiwatt
Locking
Locking
TC7
N/A
TO-218, TO-220, Multiwatt
Insulated
TC10
33
TO-220, TO-218
Locking
TC11
34
TO-220
Insulated
TC12
35
TO-218, TO-220
Locking
TC-1 Code 32
TC-6 Code 36
17.78
(0.700)
17.78
(0.700)
6.35
(0.250)
3.94
(0.155)
11.82
(0.465)
19.90
(0.783)
28.88
(1.137)
TC-7 Code N/A
10.16
(0.400)
11.82
(0.465)
5.13
(0.202)
28.90
(1.138)
TC-10 Code 33
17.78
(0.700)
5.26
(0.207)
12.70
(0.500)
19.05
(0.750)
28.91
(1.138)
6.35
(0.250)
10.16
(0.400)
10.16
(0.400)
11.81
(0.465)
28.91
(1.138)
TC-11 Code 34
TC-12 Code 35
6.35
(0.250)
6.35
(0.250)
10.16
(0.400)
6.98
(0.275)
10.16
(0.400)
12.70
(0.500)
19.05
(0.750)
28.91
(1.138)
98
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12.70
(0.500)
28.90
(1.138)
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Mounting Kits
Mounting Kits
FEATURES
• Pre-packaged in heat-sealed plastic bags for use on assembly line.
• Stock mounting hardware using one number
for better control and identification.
• Three different insulating materials available:
Low cost ThermalfilmTM
High temperature Mica
High performance ThermalsilTM lll
ACCESSORIES
• Other insulator materials available for special order include:
hard anodized aluminum and aluminum oxide.
• Individually packaged for convenient stocking and handling
of mounting hardware. Kits contain all hardware necessary to
electrically isolate the transistor from the heat sink.
TO-220 Mounting kit part number 4880
ORDERING INFORMATION
Part number
Description
4880G
Kit with ThermalfilmTM
4880MG
Kit with Mica Insulator
4880SG
Kit with Thermalsil III
TRANSISTOR
NOT INCLUDED
5
TM
2
EACH KIT INCLUDES:
Part number
Item
Qty
1
1
Insulator
ThermalfilmTM (see page 101)
Mica (see page 103)
ThermalsilTM III (see page 103)
3
7721-7PPS
2
1
Shoulder washer
6
MS15795-804
3
1
Flat washer #4
No. 4-40 UNC-2B
4
MS35649-244
4
1
Hex nut
No. 4-40 UNC-2A X
43-77-9
(56-77-9)
(53-77-9)
Description
MS51957-17
5
1
1/2 Long phillips pan head screw
MS35338-135
6
1
Lock washer, No. 4
1
Note: Smooth side of flat washer should be placed against insulator when using the kit.
TO-3 Mounting kit part number 4804
ORDERING INFORMATION
Part number
Description
4804G
Kit with ThermalfilmTM
4804MG
Kit with Mica Insulator
4804SG
Kit with ThermalsilTM III
TRANSISTOR
NOT INCLUDED
5
EACH KIT INCLUDES:
Part number
Item
Qty
1
1
43-03-2
(56-03-2)
(53-03-2)
1
Description
Insulator
ThermalfilmTM (see page 101)
Mica (see page 103)
ThermalsilTM III (see page 103)
7721-5PPS
2
2
Shoulder washer
MS15795-805
3
2
Flat washer #6
MS35649-264
4
2
No. 6-32 UNC-2B
Hex nut
MS 51957-30
5
2
No. 6-32 UNC-2A X
1/2 Long phillips pan head screw
MS35338-136
6
2
Lock washer, No. 6
322-156
7
1
Solder lug
2
3
7
6
4
Note: Smooth side of flat washer should be placed against insulator when using the kit.
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99
Insulating Shoulder Washers
FEATURES
• Available in nylon or polyphenylene sulfide
• Chemically inert [no known solvents under 200°C (392°F)]
• Maximum recommended service temperature of 260°C (500°F)
• Recommended torque is 0.565Nm to 0.678Nm (5 to 6 inch-pounds)
on all shoulder washers except –7, which has recommended torque
of 0.452Nm (4 inch-pounds)
Polyphenylene Sulfide PPS Shoulder Washers
FIGURE B
ACCESSORIES
FIGURE A
"B"
"A"
"A"
"D"
DIA
5.59
(0.220)
"E"
DIA
"C"
"E"
Note: This figure is common to
figures A and B
Part number
“A” Dim
“B” Dim
“C" Dim
"D" Dim
"E" Dim
Screw size
Figure
7721-1PPSG
7.11 (0.280)
3.18 (0.125)
1.07 (0.042)
2.84 (0.112)
3.81 (0.150)
4
A
7721-2PPSG
7.11 (0.280)
4.70 (0.185)
1.07 (0.042)
2.84 (0.112)
3.81 (0.150)
4
A
7721-3PPSG
7.11 (0.280)
3.18 (0.125)
1.07 (0.042)
2.84 (0.112)
3.56 (0.140)
4
A
7721-5PPSG
7.92 (0.312)
0.79 (0.031)
1.19 (0.047)
3.66 (0.144)
4.50 (0.177)
6
A
7721-6PPSG
7.11 (0.280)
0.79 (0.031)
1.19 (0.047)
3.00 (0.118)
3.68 (0.145)
4
A
7721-7PPSG*
5.46 (0.215)
0.81 (0.032)
1.02 (0.040)
2.95 (0.116)
3.43 (0.135)
4
A
7721-10PPSG
7.62 (0.300)
2.41 (0.095)
1.40 (0.055)
2.97 (0.117)
3.56 (0.140)
4 **
B
Note: A single gate extension, not to exceed 0.64 (0.025) in length, is allowable on the outside of all shoulder washers.
* Design allows insertion in the tab of a TO-220.
** Also for M3 screw.
Nylon Shoulder Washers
"C"
"A"
"E"
Shoulder
Washer
"D"
0.33
(0.013)
"B"
Material is nylon type 6
Part number
100
“A” Dim
“B” Dim
"C" Dim
"D" Dim
"E" Dim
7721-11NG
7.80/8.05 (0.307/0.317)
2.87/3.00 (0.113/0.118)
3.56/3.81 (0.140/0.150)
3.76/3.89 (0.148/0.153)
1.09/1.35 (0.043/0.053)
7721-13NG
5.89/6.05 (0.232/0.238)
2.87/3.00 (0.113/0.118)
N/A
3.43/3.56 (0.135/0.140)
1.19/1.40 (0.047/0.055)
7721-15NG
5.59/6.10 (0.220/0.240)
2.90/2.95 (0.114/0.116)
1.73/1.91 (0.068/0.075)
3.43/3.58 (0.135/0.140)
0.51/0.64 (0.020/0.025)
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Thermalfilm™ and Thermalfilm™ MT
Thermalfilm™ Polyimide Plastic Films
Thermalfilm™ and Thermalfilm™ MT are low cost polymide plastic insulating films designed
to be an improved replacement for mica. These insulators have a distinctive amber color and
can be easily recognized and assembled on a production line.
ACCESSORIES
Thermalfilm™ MT, made from high performance Kapton™ MT material, provides thermal
conductivity nearly 2-5 times greater than standard Thermalfilm™. Both insulators have an
extremely high resistance to flow or thin out under high compressive stresses, particularly at
elevated temperatures. Excellent physical, mechanical and electrical properties remain nearly
constant over a wide range of temperatures and frequencies. They are radiation resistant,
have no melting points, and have no known organic solvents. The polymide plastic film is UL
listed as a component in UL’s publication “Component – Plastic Material” dated September
18, 1969. The UL card number is E39505R, Guide QMFZ2 filed by E. I. du Pont de Nemours
& Co., Inc. ThermalfilmTM is rated 94-V/0.
ORDERING INFORMATION
For standard pre-cut sizes of ThermalfilmTM
and ThermafilmTM MT see page 102.
ELECTRICAL – TYPICAL VALUE @ 25° C
THERMALFILM™
PROPERTY
0.03mm (1-mil)
240 x 103 volts/mm
(6,100 volts/mil)
3.5
Dielectric constant
0.002
Dissipation factor
1017 ohm-cm
Volume resistivity
1016 ohms
Surface resistivity
Corona start voltage 0.025mm (1-mil) 465 volts
100.000 megohm mfds.
Insulation resistance
Dielectric strength
THERMALFILM™ MT
TEST METHOD
177.2 x 103 volts/mm
(4500 volts/mm)
ASTM D149-64
4.3
0.002
1017 ohm-cm
1016 ohms
465 volts
100.000 megohm mfds.
ASTM D150-64T
ASTM D150-64T
ASTM D257-61
ASTM D257-61
ASTM D1868-61T
Based on 0.05 mfd wound
capacitor using 0.25 mm
(1-mil) Film
PHYSICAL
Material thickness
Ultimate tensile strength (MD)
Bursting strength test (Mullen)
Tear strength – initial
Density
Folding endurance (MIT)
0.05mm (0.002”)
1.72 x 108 Pa (25,000 psi)
3.10 x 105 Pa (45 psi)
27,559 gm/mm (700 gm/mil)
1.42 gm/cm3 (88.7 lb/ft3)
>10,000 cycles
Melting point
Zero strength temperature
Cut through temperature
NONE
815ºC (1499ºF)
435ºC (815ºF)
525ºC (977ºF)
-260ºC to 240ºC
(-436ºF to 464ºF)
0.156W/m ºC
(0.09 BTU/hr-ft-ºF)
V-0, UL “E” card E39505
0.05mm (0.002”)
103 MPa (1500 psi)
0.31 MPa (45 psi)
35,433 gm/mm (900 gm/mil)
1.78 gm/cm3 (111.1 lb/ft3)
>10,000 cycles
ASTM D882-64T
ASTM 0774-63
ASTM D1004-61
ASTM D1505-63T
ASTM D2176-63T
THERMAL
Service temperature
Thermal conductivity
Flammability
NONE
815ºC (1499ºF)
435ºC (815ºF)
525ºC (977ºF)
-260ºC to 240ºC
(-436ºF to 464ºF)
0.379 W/m ºC
(0.219 BTU/hr-ft-ºF)
V-0, UL “E” card E39505
Hot Bar (Du Pont test)
Weighted probe on heated film
(Du Pont test)
Model TC-1000 twin heatmeter
Comparative tester
UL 94
Notes: One mil equals 0.001 inch
Dimensional tolerances are ± 0.38mm (0.015”), hole diameters are ± 0.25mm (0.010”) and angularity is ± 1 1/2° unless otherwise specified.
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101
Insulators – Thermalfilm™ and Thermalfilm™ MT
Thermalfilm™ for TO-3
"A"
1.83
(0.072)
ORDERING INFORMATION
Part number
“A” Dim
“B” Dim
“C” Dim
“D” Dim
43-03-2G
42.04 (1.655)
27.00 (1.063)
3.96 (0.156)
1.57 (0.062)
43-03-4G
39.70 (1.563)
26.67 (1.050)
3.56 (0.140)
1.57 (0.062)
"D"
DIA
TYP (2)
10.92
(0.430) "B"
"C"
DIA
TYP (2)
ThermalfilmTM information on page 101
Dimensional tolerances are ± 0.38mm (0.015), hole diameters are ± 0.25mm (0.010)
and angularity is ± 1 1/2° unless otherwise specified.
ACCESSORIES
30.15
(1.187)
Thermalfilm™ for TO-5 and TO-18
ORDERING INFORMATION
Part number
43-05-1G
Device
Figure
“A” Dim
“B” Dim
“C” Dim
TO-5
A
9.91 (0.390)
5.08 (0.200)
0.91 (0.036)
43-05-2G
TO-5
B
9.91 (0.390)
5.08 (0.200)
0.91 (0.036)
43-18-1G
TO-18
A
6.35 (0.250)
2.54 (0.100)
0.91 (0.036)
ThermalfilmTM information on page 101
Dimensional tolerances are ± 0.38mm (0.015), hole diameters are ± 0.25mm (0.010)
and angularity is ± 1 1/2° unless otherwise specified.
FIGURE B
FIGURE A
"A"
"A"
"C"
DIA
TYP (4)
"C"
DIA
TYP (3)
"B"
"B"
Thermalfilm™ for TO-220, TO-126, Case 77, Case 199, Case 90, TO-218 and TO-3P
ORDERING INFORMATION
Part number
Device
“A” Dim
“B” Dim
“C” Dim
“D” Dim
43-77-1G
TO-126, Case 77
11.10 (0.437)
7.92 (0.312)
3.56 (0.140)
2.36 (0.093)
43-77-2G
Case 90, Case 199
17.45 (0.687)
14.27 (0.562)
5.54 (0.218)
3.18 (0.125)
43-77-8G
Case 90, Case 199
18.92 (0.745)
13.84 (0.545)
5.38 (0.212)
3.81 (0.150)
43-77-9G
TO-220
18.42 (0.725)
13.21 (0.520)
4.32 (0.170)
2.92 (0.115)
46-77-9G*
TO-220
18.42 (0.725)
13.21 (0.520)
4.32 (0.170)
2.92 (0.115)
43-77-20G
TO-220, TO-218, TO-3P
23.24 (0.915)
18.80 (0.740)
6.98 (0.275)
3.66 (0.144)
"A"
"D"
DIA
"B"
"C"
* ThermalfilmTM MT part numbers begin with “46”
Thermalfilm information on page 101
Dimensional tolerances are ± 0.38mm (0.015), hole diameters are ± 0.25mm (0.010)
and angularity is ± 1 1/2° unless otherwise specified.
TM
102
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Insulators – Mica and ThermalsilTM III
Mica and ThermalsilTM III
FIGURE A
Thermalsil™ III provides excellent thermal conductivity
and electrical resistance. It is used as an electrically-isolating interface material composed of silicone elastomer
binder with a thermally conductive filler. It is reinforced
with glass cloth to resist tearing and cut-through due to
burrs on transistors or heat sinks.
"A"
"A"
1.83
(0.072)
"D"
DIA
TYP (2)
"D"
DIA
10.92
(0.430) "B"
"B"
"C"
DIA
TYP (2)
"C"
30.15
(1.187)
Mica insulators provide high maximum operating temperatures (550°C) and excellent electrical properties.
ACCESSORIES
Thermalsil™ III eliminates the need for grease application
and conforms to mounting surfaces under clamping pressure for optimum heat conduction. The finely woven glass
cloth provides the thinnest possible matrix for enhanced
thermal resistance. Thermalsil™ III is available in any configuration with adhesive backing.
FIGURE B
ORDERING INFORMATION
Part number
Description
Device
"A" Dim
"B" Dim
"C" Dim
"D" Dim
56-77-9G
Mica
TO-220
18.42 (0.725)
13.21 (0.520)
4.32 (0.170)
2.92 (0.115)
Figure
B
56-03-2G
Mica
TO-3
42.04 (1.655)
27.00 (1.063)
3.96 (0.156)
1.57 (0.062)
A
53-77-9G
ThermalsilTM III
TO-220
18.42 (0.725)
13.21 (0.520)
4.32 (0.170)
2.92 (0.115)
B
53-03-2G
ThermalsilTM III
TO-3
42.04 (1.655)
27.00 (1.063)
3.96 (0.156)
1.57 (0.062)
A
TYPICAL PROPERTIES FOR MICA INSULATORS
TYPICAL PROPERTIES FOR THERMALSILTM III
Property
Property
Typical value 25°C
Test method
Electrical
Electrical
Dielectric strength
172 X 103 volts/mm (4500 volts/mil)
0.025 mm to 0.076 mm thick in air (1 to 3 mils thick in air)
Dielectric constant
2.5@50 Hz
2.5@103 Hz
2.5@106 Hz
ASTM D-150
Dielectric constant
6.5 to 8.7
Dissipation factor
0.0001-0.0004 @ 106 Hz
Dielectric breakdown voltage 26.3 x 103 volts/mm (667 volts/mil)
Volume resistivity
10 ohm-cm
Volume resistivity
5.7 x 1015 ohm-cm
ASTM D-257
Physical
Dielectric dissipation factor
0.008@50 Hz
0.004 @103 Hz
0.004 @106 Hz
ASTM D-150
15
Modules of elasticity in tension
172 X 103 Mpa (25 X 106) psi
Tensile strength
310 Mpa (45,000 psi)
Hardness mohs, shore
3.0, 115
Compressive strength
2.21 X 108 Pa (32,000 psi)
Specific gravity
Physical
Thickness
0.15mm
(0.006 inch)
2.9
Color
Gray-Green
Thermal
Tensile strength
6.1 x 107 Pa (8786 psi)
Thermal conductivity
0.528 W/(m °C ) (0.30 Btu/hr-ft °F)
Hardness, shore A
87
Coefficient of thermal expansion
3.24 X 10-5 °C (1.8 X 10-5 °F)
Elongation
Specific heat
0.084 KJ/Kg °C (0.02 Btu/Lb °F)
Melting point
1275°C (2327 °F)
Thermal conductivity
0.92 W/(m °C ) (0.532 Btu/hr. ft °F)
Max. operating temperature
550 °C (1022 ºF)
Flame resistance
UL 94V-0
Service temperature
-60°C to 180°C
(-76°F to 356°F)
AMERICA
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ASTM D-149
2% or less
Thermal
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ASIA
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103
Insulators – Aluminum Oxide
Aluminum Oxide
Aluminum oxide has unique thermal conductivity qualities
and features low loss factors at high frequencies. It has high
compressive strength, high volume resistivity, low thermal
expansion and resists radiation.
Aluminum oxide insulating washers have a dielectric strength
of approximately 21.7 x 103 volts/mm for .76mm material (550
volts/mil for 0.030 inch material) and 16.9 x 103 volts/mm for
1.57mm material (430 volts/mil for 0.062 inch material). The
thermal conductivity of aluminum oxide is 15.06W/(m°C) at 75°C.
PROPERTY
A1203
CHEMICAL – TYPICAL VALUE
94% nominal
Dielectric constant 25‚°C (77°F)
ELECTRICAL
8.9 (1MHz)
8.9 (10GHz)
0.0001 (MHz)
0.0010 (10GHz)
>1014 ohm-cm
8.66 x 103 volts/mm (6.35mm thick)
[220 volts/mil (0.250” thick)]
16.73 x 103 volts/mm (1.27mm thick)
[425 volts/mil (0.050” thick)]
28.35 x 103 volts/mm (0.25mm thick)
[720 volts/mil (0.010” thick)]
PHYSICAL
3.62 g/cm3 (226 lb/ft3)
78 (Rockwell 45 N)
MECHANICAL
3.17 x 108 Pa (minimum) [46.00 psi (minimum)]
3.52 x 108 Pa (typical) [51,000 psi (typical)]
2.83 x 1011 Pa (41 x 106 psi)
0.21
1.93 x 108 Pa (28,000 psi)
2.10 x 109 Pa (305,000 psi)
THERMAL
7.9 x 106/°C (4.4 x 106/°F)
18.01 W/(m°C) @ 25°C
14.24 W/(m°C) @ 100°C
79.56 W/(m°C) @ 400°C
8.79 x 104 KJ/kg°C [2.1 x 104 Btu/lb °F]
>3600°C (6512°F)
1700°C (3100°F)
Dissipation factor 25°C (77°F)
ACCESSORIES
Electrical resistivity 25°C (77°F)
Dielectric strength (AC)
Density
Hardness
Flexural strength 25°C (77°F)
Modules of elasticity
Poisson’s ratio
Tensile strength 25°C (77°F)
Compressive strength 25°C (77°F)
Coefficient of thermal expansion
Thermal conductivity
Specific heat (100°C)
Melting point
Maximum temperature for
continuous use
Aluminum Oxide for TO-3
Part number Thickness
“A” Dim
“B” Dim
4103G*
1.91 (0.075)
39.70 (1.563)
26.67 (1.050)
13.34 (0.525) 4.75 (0.187) 30.40 (1.197)
“C” Dim
“D” Dim
4104G*
1.78 (0.070)
44.45 (1.750)
31.75 (1.250)
15.88 (0.625) 7.16 (0.282) 30.15 (1.187)
ASTM D150-70
ASTM D2520-70
ASTM D150-70
ASTM D2520-70
ASTM D1829-66
ASTM D116-69
ASTM C20-70
ASTM E18-67
ACMA Test #2
ASTM C623-69T
ASTM C623-69T
ACMA Test #4
ASTM C528-63T
ASTM C372-56
ASTM C408-58
ASTM C351-61
"C" RAD
TYP (2)
3.68
(0.145)
DIA TYP (4)
ORDERING INFORMATION
TEST METHOD
Spectrographic analysis
(100%-% by wt. of total
metallic impurity)
"A"
1.83
(0.072)
“E” Dim
10.92
"B"
(0.430)
5.46
(0.215)
"D"
RAD
TYP (2)
15.09
(0.594)
"E"
Aluminum Oxide Ceramic for TO-220
"D"
"C"
ORDERING INFORMATION
Part number
Thickness
4169G*
1.57 (0.062)
4170G**
1.78 (0.070)
4171G**
4177G**
“A” Dim
“B” Dim
“C” Dim
“D” Dim
“E” Dim
19.30 (0.760) 13.97 (0.550) 4.78 (0.188)
6.98 (0.275)
3.68 (0.145)
19.30 (0.760) 13.97 (0.550) 4.78 (0.188)
6.98 (0.275)
3.68 (0.145)
1.78 (0.070)
16.51 (0.650) 12.70 (0.500) 4.32 (0.170)
6.35 (0.250)
3.81 (0.150)
1.78 (0.070)
17.45 (0.687) 14.27 (0.562) 5.54 (0.218)
7.14 (0.281)
3.18 (0.125)
"A"
"E"
DIA
"B"
"B"
Aluminum Oxide Ceramic for TO-218, TO-247, and TO-3P
"D"
ORDERING INFORMATION
Part number
Thickness
4180G*
1.78 (0.070) 23.24 (0.915)
“A” Dim
“B” Dim
“C” Dim
18.80 (0.740) 6.98 (0.275)
“D” Dim
“E” Dim
9.40 (0.370)
3.96 (0.156)
"A"
"C"
"E"
104
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ASIA
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Insulators – Stanchion Pads
8923-1, 8923-2, 8924 Stanchion Pads
FEATURES
• Reduces stress on leads during wave solder and post-soldering operations
• Provides stable mount to resist shock and vibration damage to leads
2.54
(0.100)
2.54
(0.100)
• 8923-1, 8923-2, and 8924 fit the TO-220
SEE DETAIL "D"
(8924 ONLY)
4.06
(0.160)
1.52
(0.060)
1.02
(0.040)
ORDERING INFORMATION
“A” Dim
“B” Dim
“C” Dim
8923-1G
2.54 (0.100)
20.32 (0.800)
8.00 (0.315)
8923-2G
1.27 (0.050)
19.05 (0.750)
8.00 (0.315)
8924G
1.27 (0.050)
19.05 (0.750)
7.87 (0.310)
Note: Tolerances ± 0.25 (0.010) unless otherwise specified.
Material is nylon 6/6 rated 94 V-O
DETAIL "D"
(8924 ONLY)
3.05
(0.120)
10.16
(0.400)
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USA Tel: +1 (603) 224-9988 email: [email protected]
11.18
(0.440)
3.05
(0.120)
1.52
(0.060)
SQ TYP (4)
Italy Tel: +39 051 764011 email: [email protected]
United Kingdom Tel: +44 1793 401400 email: [email protected]
1.40
(0.055)
"B"
8.26
(0.325)
AMERICA
EUROPE
ACCESSORIES
Part number
"A"
ASIA
2.03
(0.080)
DIA THRU
TYP (3)
"C"
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105
Insulating Covers
TO-3 Insulating Covers
Insulating covers are designed to provide protection from accidental shock
during field service or repair.
Pan head screws not provided–MS 51957-30 or equivalent recommended–secure the cover
to the TO-3. At the typical mounting screw torque of 0.68–0.90 Nm (6-8 inch pounds), the
TO-3 cover material cold-flows around the screw head to securely fasten the cover.
ACCESSORIES
Included are No.6 split washers as inserts to provide electrical connection of mounting screws
to the TO-3 collector and an insulating snap-in cover for the screw heads. A test probe hole is
provided in the top of the cover.
The 8903VB is made from thermoplastic polyester that meets the requirements of UL Bulletin
94 V-O. In addition to its excellent flammability rating, thermoplastic polyester offers resistance
to most chemical environments, heat deflection temperature to 215.6°C (420°F) and UL continuous use temperature of 130°C (266°F).
41.91
(1.650)
ORDERING INFORMATION
Part number
Material
Color
Flammability standards
8903NWG
Nylon
White
Self-extinguishing UL 94 V-2
8903VBG
Thermoplastic polyester
Black
Self-extinguishing UL 94 V-0 UL 492 Type 1
1.19
(0.047)
DIA THRU
28.45
(1.120)
30.23
(1.190)
6.22
(0.245)
DIA THRU TYP (2)
4.57
(0.180)
9.91
(0.390)
22.61
(0.890)
39.88
(1.570)
Teflon-filled Acetal Insulators for TO-3
Part number
Fits notch
“A” Dim
103G
4.83 (0.190)
4.90 (0.193)
109G
6.35 (0.250)
6.35 (0.250)
1.47
(0.058)
"A"
Ø 3.58 Ø 9.52
(0.141) (0.375)
5.54
(0.218)
Teflon-filled Acetal Bushings for TO-3
Part number
“I.D.”
“O.D.”
“T”
110G
5.03/5.21(0.198/0.205)
6.81/6.98 (0.268/0.275)
1.57/1.40 (0.062/0.055)
113G
6.43/6.60 (0.253/0.260)
7.82/8.00 (0.308/0.315)
1.57/1.40 (0.062/0.055)
"O.D."
"I.D."
"T"
106
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ASIA
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Mounting Pads
FEATURES
PRODUCT INFORMATION
• Prevent heat damage during soldering
Suffix
Base material
NG
Nylon base resin
per ASTM STD
D4066-82-PA111
121.0°C 250°F
243.3°C 470°F
Natural
DAPG*
Diallyl Phthalate
per MIL-M-14G
type SDG
204.4°C 400°F
282.2°C 540°F
Black only
• Facilitate board clean-up
• Prevent solder bridges
• Assure uniform device height
MAXIMUM OPERATING TEMPERATURE
Continuous
Deflection
Color
* All “DAP” mounting pads meet UL 94 V-0
Note: Please specify material for each mounting pad: “N” = nylon; “DAP” = Diallyl Phtalate.
Example: 7717-3NG, 7717-86DAPG
ACCESSORIES
Index of Semiconductor Lead Conversion Pads
ORDERING INFORMATION
Part number
Converts lead
spacing from
To
# of Leads
Outside dia
Thickness
5.84 (0.230)
1.02 (0.040)
For epoxy transistors
7717-130G
0.05 In-Line
TO-92 & TO-15
3
For TO-18
7717-247G
TO-18
TO-5
3
7.11 (0.280)
3.81 (0.170)
7717-26G
TO-18
TO-5
3
8.71 (0.343)
3.05 (0.120)
7717-44G
TO-18
TO-5
4
7.75 (0.305)
3.18 (0.125)
See pages 108 and 109 for mechanical drawings
Index of Semiconductor Mounting Pads
ORDERING INFORMATION
Part number
Leads
Outside dia
Thickness
For TO-5
7717-86G
3
8.71 (0.343)
1.91 (0.075)
7717-178G
3
8.89 (0.350)
0 .53 (0.021)
7717-79G
3
9.02 (0.355)
0.97 (0.038)
7717-3G
3–4
8.64 (0.340)
1.91 (0.075)
7717-15G
4
8.89 (0.350)
0.51 (0.020)
7717-5G
4
8.89 (0.350)
3.18 (0.125)
7717-4G
4
9.53 (0.375)
1.91 (0.075)
For TO-18
7717-16G
4
5.08 (0.200)
7717-18G
4
5.08 (0.200)
0.51 (0.020)
2.54 (0.100)
7717-108G
4
5.16 (0.203)
1.78 (0.070)
7717-89G
4
6.35 (0.250)
2.03 (0.080)
7717-7G
4
6.35 (0.250)
3.18 (0.125)
For integrated circuits
7717-122G
8
9.27 (0.365)
7717-8G
8
9.53 (0.375)
1.78 (0.070)
1.91 (0.075)
7717-156G
14
19.05 x 11.43 (0.750 x 0.450)
1.27 (0.050)
Misc. mounting pads
7717-175G Crystal Can Relay
10.16 / 20.32 (0.400 x 0.800)
1.27 (0.050)
See pages 108 and 109 for mechanical drawings
AMERICA
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107
Mounting Pads
7717-3G
7717-4G
2.54
(0.100)
TYP
1.27
(0.050)
1.40
(0.055)
1.90
(0.075)
0.13
(0.005)
Ø 8.64
(0.340)
Ø 1.52 DIA
(0.060)
TYP (4)
Ø 9.52
(0.375)
Ø 5.08
(0.200)
Ø 5.08
(0.200)
0.64
(0.025)
Ø 0.91
(0.036)
TYP (4)
1.91
(0.075)
0.64
(0.025)
7717-7G
7717-5G
ACCESSORIES
Ø 1.27
(0.050)
C SINK
TYP (4)
Ø 1.90
(0.075)
TYP(8)
1.27
(0.050)
0.51
(0.020)
1.27
(0.050)
0.51
(0.020)
TYP
Ø 5.08
(0.200)
8.89
(0.350)
Ø 1.27
(0.050)
C SINK TYP (4)
ø 2.54
(0.100)
B.C.
0.64
(0.025)
Ø 0.71
(0.028)
TYP (4)
6.35
(0.250)
3.18
(0.125)
ø 1.65
(0.065)
TYP
ø 0.71
(0.028)
TYP
3.18
(0.125)
MAX
7717-15G
7717-8G
1.90
(0.075)
Ø 0.91
(0.036)
TYP (8)
Ø 1.52
(0.060)
TYP (4)
1.40
(0.055)
0.51
(0.020)
Ø 5.08
(0.200)
9.52
(0.375)
Ø 1.27
(0.050)
TYP (8)
8.89
(0.350)
Ø 0.91
(0.036)
TYP (4)
Ø 5.08
(0.200) B.C.
0.64
(0.025)
7717-18G
7717-16G
2.54
(0.100)
0.51
(0.020)
Ø 2.54
(0.100)
B.C.
Ø 1.52
(0.060)
Ø 5.08
(0.200)
5.08
(0.200)
Ø 0.64
(0.025)
TYP (4)
THRU
Ø 0.91
(0.036)
TYP (4)
7717-26G
Lead Conversion
7717-44G
2.67
(0.105)
Ø 1.57
(0.062)
TYP (6)
3.05
(0.120)
AMERICA
EUROPE
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0.51
(0.020)
1.02
(0.040)
0.51
(0.020)
Ø 6.48
(0.255)
B.C.
1.40
(0.055) TYP
8.71
(0.343)
108
1.02
(0.040)
0.51
(0.020)
Lead Conversion
1.14
(0.045)
Ø 5.08
(0.200)
Ø 1.02
(0.040)
7.75
(0.305)
Ø 0.83
(0.033)
THRU
TYP (4)
Ø 5.08
(0.200)
B.C.
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ASIA
Ø 1.02
(0.040)
OPP TYP (4)
0.25
(0.010)
0.51
(0.020)
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Mounting Pads
7717-79G
7717-86G
0.43
(0.017)
Ø 5.08
(0.200)
Ø 9.02
(0.355)
Ø 1.57
(0.062) TYP (3)
0.25
(0.010)
Ø 1.14
(0.045)
1.90
(0.075)
DIA TYP (3)
Ø 5.08
(0.200)
Ø 1.52
(0.060)
Ø 8.74
(0.344)
Ø 1.14
(0.045)
TYP (3)
Ø 1.27
(0.050)
TYP (6)
0.51
(0.020)
0.97
(0.038)
7717-89G
1.91
(0.075)
2.03
(0.080)
1.14
(0.045)
Ø 2.54
(0.100) B.C.
Ø 4.78
(0.188)
Ø 0.71
(0.028)
TYP (4)
7717-130G
Ø 8.00
(0.315)
B.C.
Ø 5.08
(0.200)
1.02
(0.040)
0.51
(0.020)
0.71
(0.028)
TYP (2)
0.64
(0.025)
7717-156G
12.70
(0.500)
1.78
(0.070)
Epoxy Transistors
Ø 1.02
(0.040)
TYP (4)
0.13
(0.005)
1.78
(0.070)
Ø 0.79
(0.031) TYP
Ø 0.63
(0.025)
TYP (3)
9.27
(0.365)
Ø 1.02
(0.040)
TYP (4)
Ø 1.02
(0.040) TYP
0.51
(0.020)
5.84
(0.230)
MAX
2.54
(0.100)
0.76
(0.030)
1.02
(0.040)
5.16
(0.203)
Ø 1.40
(0.055)
TYP (4)
2.67
(0.105)
0.56
(0.022)
7717-122G
0.25
(0.010)
2.67
(0.105)
2.39
(0.094)
6.35
(0.250)
Ø 1.27
(0.050)
C SINK
TYP (4)
2.39
(0.094)
Ø 0.64
(0.025)
THRU TYP (4)
ACCESSORIES
7717-108G
Ø 1.52
(0.060)
OPP
TYP (4)
Ø 1.57
(0.062)
TYP (4)
0.76
(0.030)
7717-175G
1.43
(0.450)
1.27
(0.050)
19.05
(0.750)
2.54
(0.100)
TYP 6 PLCS
2.54
(0.100) TYP
5.08
(0.200)
TYP
Ø 0.89
(0.035)
THRU TYP (8)
Ø 1.27
(0.050)
C SINK TYP (14)
4.19
(0.165)
7717-178G
7717-247G
0.53
(0.021)
Ø 1.52
(0.060)
C SINK
TYP (3)
2.54
(0.100)
0.51
(0.020)
20.32
(0.800)
Ø 1.27
(0.050)
TYP (8)
C SINK
0.51
(0.020)
Lead Conversion
3.81
(0.150)
2.54
(0.100)
5.08
(0.200) P.C.
0.56
(0.022)
0.25
(0.010)
Ø 7.11
(0.280)
Ø 8.89
(0.350)
Ø 5.08
(0.200)
AMERICA
EUROPE
Ø 1.02
(0.04)
4 BOSSES
6.35
(0.250)
Ø 1.14
(0.045)
THRU TYP (3)
www.aavidthermalloy.com
Ø 1.57
(0.062)
TYP (6)
5.08
(0.200)
TYP
6.35
(0.250)
7.62
(0.300)
9.86
(0.388)
0.76
(0.030)
10.16
(0.400)
0.51
(0.020)
Ø 0.89
(0.035)
THRU TYP (14)
2.03
(0.080)
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ASIA
0.51
(0.020)
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109
Finishes
ACCESSORIES
Finish
Aavid Code
Thermalloy Suffix
Description
Black Anodize
B
B
Recommended for increased thermal performance.
Anodize is electrically isolating and does not provide
electrical insulation.
AavSHIELD3
V
V
For corrosion protection or painting only.
Color variation may be expected with this finish.
Chromate is electrically conductive.
Does not provide electrical insulation.
Tin Plating
D
D
Allows heat sink to be soldered to the PC Board.
Pre-Black Anodized
J
PB
Edges cut during the manufacturing process will be unfinished.
Green Anodize
M
Unfinished
U
Black Anodize w/Black Paint
W
Alternative finish to Black anodize.
Recommended for increased thermal performance.
Electrically isolating but does not provide electrical insulation.
U
Clean, no finish.
Paint on mounting surface prevents metal
from contacting the circuit thus avoiding shorts.
ORDERING INFORMATION
Aavid Thermalloy code – Finish option must be noted by one of the above letters in the 7th position.
Aavid's standard finish is black anodize (B) unless otherwise noted.
example 12 digit part 530122B00000G
A
B
C
A = Base part
B = Finish code
C = RoHS compliant
Thermalloy origin suffix – The suffixes should be added after the model number to indicate the desired finish.
example
Thermalloy origin part 6396B G
A
B C
A = Model number
B = Finish suffix
C = RoHS compliant
Note : All thermal graphs reflect black anodize finish.
110
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ASIA
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Card Ejectors
Snap-On Ejectors / Pullers
FEATURES
5021NG Ejector
• Saves time – no roll pin required
17.02
(0.670)
13.97
(0.550)
7.14
(0.281)
• Excellent for retrofit applications
Ø 2.49
(0.098)
• Material is nylon per ASTM D4066-82PA162F11
21.26
(0.837)
• Cost no more than conventional ejector/puller
31.75
(1.250)
• Rated at 222.5N (50 lbs.) / ejector force per pair
• One piece – no assembly required
0.89
(0.035)
0.51
(0.020)
ACCESSORIES
• May be heat stamped
ORDERING INFORMATION
2.67
(0.105)
Part number
7.24
(0.285)
5021NG
Standard Ejectors / Pullers
FEATURES
• Lever action releases card from its connector safely and quickly
• Cards, their components and connectors are less frequently damaged when extracting PC boards
• No special extraction tools are needed for board removal
• Material is nylon per ASTM D4066-82 PA120B4413F24, UL 94 V-O rated (natural color)
• Roll pins are provided (NAS 561-P3-4)
FIGURE A
5005-09NG PULLER *
11.12
(0.438)
ORDERING INFORMATION
Part number
Figure
5005-09NG
A
5005-08NG
B
5005-25NG
C
22.22
(0.875)
9.52
(0.375)
1.90
(0.075)
63.50
(2.500)
11.12
(0.438)
3.18
(0.125)
DIA TYP(2)
6.55
(0.258)
50.80
(2.000)
4.70
(0.185)
*No roll pins provided
FIGURE B
5005-08NG SLIM FACE/ FLAT
FIGURE C
7.24
(0.285)
31.75
(1.250)
11.10
(0.437)
5005-25NG COMBINATION EJECTOR/PULLER
30.48
(1.200)
15.88
(0.625)
22.22
(1.875)
14.27
(0.562)
Ø 2.46
(0.097)
7.14
(0.281)
3.05
(0.120)
1.57
(0.062)
ø 2.36
(0.093)
AMERICA
EUROPE
www.aavidthermalloy.com
6.35
(0.250)
USA Tel: +1 (603) 224-9988 email: [email protected]
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United Kingdom Tel: +44 1793 401400 email: [email protected]
ASIA
7.14
(0.281)
1.78
(0.070)
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Taiwan Tel: +886 (2) 2698-9888 email: [email protected]
111
Grease & Epoxy
Sil-FreeTM
Sil-FreeTM 1020 is a metal-oxide-filled, silicone-free synthetic grease
specially formulated to enhance heat transfer across the interface
between the semiconductor case and the heat sink without the
migration or contamination associated with silicone-based products.
Color
White
Thermal
conductivity
0.79 W/(m-°C)
Dry interface case-to-sink thermal resistance is typically reduced
50% to 75% with proper application of Sil-FreeTM 1020.
Operating
temperature range
-40°C to +200°C
Volume
1012 Ohm-cm 2.3 ± 0.5
Weight
47.5 grams
Dielectric strength
225 volts/mil
Consistency
Paste
Bleed
0.09 max
% after 24hr @ 200°C
Specific gravity
2.8 ± 0.2
Shelf life
Indefinite
(unopened)*
ACCESSORIES
This virtually "no-bleed", high-performance compound will not dry
out, harden, melt, or run, even after long-term continuous exposure
to temperatures up to 200°C. Even in a vacuum atmosphere (10-5
Torr, 24 hours@100°C), Sil-FreeTM 1020 exhibits virtually "no bleed"
or evaporation.
ORDERING INFORMATION
Part number
Package
Size
101700F00000G
Syringe
43 grams (1.5 oz)
101800F00000G
Tube
57 grams (2.0 oz)
101900F00000G
Jar
57 grams (2.0 oz)
102000F00000G
Tube
143 grams (5.0 oz)
102100F00000G
Jar
457 grams (16.0 oz)
PRODUCT INFORMATION
* It is recommended that the containers be turned over
every 6 months to minimize settling for ease of mixing
Ther-O-LinkTM
Ther-O-LinkTM is a silicone-based thermal compound that
cost effectively enhances the heat transfer between a semiconductor case and a heat sink. Easy to apply, Ther-O-LinkTM
substantially reduces dry interface thermal resistance, while
providing long life under a variety of conditions.
ORDERING INFORMATION
Part number
Package
Size
100000F00000G
Ampule
1 gram (0.03 oz)
100100F00000G
Syringe
35.7 grams (1.25 oz)
100200F00000G
Tube
57 grams (2.0 oz)
100500F00000G
Tube
143 grams (5.0 oz)
100800F00000G
Tube
228.6 grams (8.0 oz)
101600F00000G
Can
0.45 kg (1 lb)
108000F00000G
Can
2.27 kg (5 lb)
132000F00000G
Can
9.07 kg (20 lb)
PRODUCT INFORMATION
Color
White
Thermal conductivity
0.73 W/(m-°C)
Operating
temperature range
-40°C to +200°C
Volume resistivity
1.0 x 1015 Ohm-cm
Dielectric strength
250 volts/mil
Consistency
Paste
Bleed
0.6 max
Specific gravity
2.8
Shelf life
Indefinite (unopened)*
* It is recommended that the containers be turned over
every 6 months to minimize settling for ease of mixing
UltrastickTM
Aavid's UltrastickTM is a unique phase-change thermal interface material that surpasses grease in thermal performance
and long-term stability. This solid, silicone-free, paraffinbased thermal compound changes phase at 60°C, with a
concurrent volumetric expansion that fills gaps between the
mating surfaces. UltrastickTM comes in a convenient applicator bar, allowing for neat, fast application to both heat sink
and component surfaces. One cost-effective application
leaves a thin, film-like deposit, providing excellent heat
transfer and low interface thermal resistance.
PRODUCT INFORMATION
Temperature range
-40°C to +200°C
Volume resistivity
1.0 X 1.015 Ohm-cm
Dielectric strength
250 volts/mil
Consistency
Paste
Bleed
0.6 max
Specific gravity
0.28
Color
Opaque White
Thermal resistance
0.03°C/W per square inch @ 20 psi
0.02°C/W per square inch @ 100 psi
Shelf life
Indefinite*
ORDERING INFORMATION
* Recommended max. storage temperature: 40ºC (105ºF)
Part number
100300F00000G
112
Package
Bar
Size
47.5 grams (0.16 oz)
AMERICA
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United Kingdom Tel: +44 1793 401400 email: [email protected]
ASIA
Singapore Tel: +65 6362 8388 email: [email protected]
Taiwan Tel: +886 (2) 2698-9888 email: [email protected]
Grease & Epoxy
ThermalcoteTM
ThermalcoteTM is a superior thermal joint compound of thermally loaded silicone based grease for use with all heat sinks.
It improves the transfer of thermal energy across the metal
to metal interfaces between the transistor or rectifier case
and the heat sink. ThermalcoteTM conducts heat approximately
15 times better than air and more than 4 times better than
unloaded silicone grease. It is non-toxic, extremely stable,
and neither cakes or runs from -40° to 204°C (-40°F to 399°F).
PRODUCT INFORMATION
Color
Opaque white
Operating
temperature range
-40°C to 204°C (-40°F to 399°F)
Thermal conductivity
0.765W/(m °C )(.226 Btu/hr ft °F)
Dielectric strength
11.8 x 103 volts/mm (300 volts/mil)
1.27 mm gap (0.050" gap)
Cleaning solvent
Mineral spirits or turpentine
Specific gravity
1.6
Evaporation
24 hours@200°C (392°F), wt%
1
Shelf life
Indefinite (unopened)*
Part number
Net weight
249G
28 grams (1 oz) tube
250G
57 grams (2 oz) tube
251G
0.45 kg (1 lb) can
252G
2.27kg (5 lb) can
253G
4.54 kg(10 lb) can
* It is recommended that the containers be turned over
every 6 months to minimize settling for ease of mixing
ACCESSORIES
ORDERING INFORMATION
ThermalcoteTM ll
Thermalcote™ II was developed as the sensible alternative
to silicone-based thermal greases. ThermalcoteTM II employs
a highly conductive synthetic base fluid that enables the
finished product to exhibit the same thermal characteristics as the silicone-based products.
Thermalcote™ II contains no silicone. The high lubricity of
the base oil permits efficient application to both semiconductor case or heat sink, and it will effectively fill the microscopic air gaps on the metal-to-metal mating surfaces. It is
non-toxic, extremely stable, and neither cakes or runs from
-40° to 200°C (-40°F to 392°F).
PRODUCT INFORMATION
Color
Blue
Operating
temperature range
-40°C to 200°C (-40°F to 392°F)
Thermal conductivity
0.699W/(M °C) (0.204 Btu/hr ft °F)
Dielectric strength
7.9 x 103volts/mm (200volts/mil)
1.27 mm gap (0.050" gap)
Cleaning solvent
Mineral spirits or turpentine
Specific gravity
2.93@60°F (15.6°C)
Evaporation,
24 hours@200°C (392°F), wt%
0.6 max
Shelf life
Indefinite (unopened)*
ORDERING INFORMATION
Part number
* It is recommended that the containers be turned over
every 6 months to minimize settling for ease of mixing
Net weight
349G
28 grams (1 oz) tube
350G
57 grams (2 oz) jar
351G
0.45 kg (1 lb) can
AMERICA
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113
Grease & Epoxy
Ther-O-BondTM Adhesive
ACCESSORIES
ORDERING INFORMATION
Part number
Description
Package/Kit
Size
159900F00000G
Ther-O-BondTM 1500
Resin and hardener
0.946 liter (1 qt)
161000F00000G
Ther-O-BondTM 1600
2-Part plastic kit
10gm (0.35 oz)
164000F00000G
Ther-O-BondTM 1600
2-Part plastic kit
40gm (1.40 oz)
200000F00000G
Ther-O-BondTM 2000
Adhesive syringe
Activator bottle
25ml
13ml
Ther-O-BondTM 1500
Ther-O-BondTM 1600
Ther-O-BondTM 1500 is a versatile epoxy casting system developed
for high performance, production potting and encapsulating applications where low shrinkage and rapid air evacuation are required.
This formulation has a very low surface tension and a flowable
viscosity, which affords excellent air release. Ther-O-BondTM 1500
adhers to rigid plastics and laminates, metals and ceramics, has
a low coefficient of thermal expansion and is readily machined
and shaped with ordinary shop tools. The fully cured epoxy system
is an excellent electrical insulator which provides good resistance
to electrolysis, leakage and corrosion room water, weather, gases
and chemical compounds.
For smaller applications, Ther-O-BondTM 1600 produces a stable,
durable, high-impact bond, with good heat transfer characteristics. It is a thixotropic (smooth paste) thermally conductive epoxy
system used for staking thermistors, diodes, resistors, integrated
circuits and other heat sensitive components to printed circuit
boards. This two-part adhesive develops strong, durable, high
impact bonds at room temperature, which improve heat transfer
while maintaining electrical insulation. Ther-O-bondTM 1600 bonds
readily to itself, to metals, silica, steatie, alumina, sapphire and
other ceramics, glass, plastics and many other materials because
its coefficient of thermal expansion provides a good match for
those materials over a fairly wide temperature range.
HANDLING CHARACTERISTICS
HANDLING CHARACTERISTICS
Mix ratio by weight,
resin to hardener:
100 to 15
Mix ratio by weight,
resin to hardener:
100 to 5
Mixed viscosity @ 25°C, cps:
1000 - 1500
Mixed viscosity @ 25°C, cps:
33,000
Work-life @ 25°C
45 Minutes
Work-life @ 25°C
45 Minutes
Gel time @ 25°C
3-6 Hours
Gel time @ 25°C
3-6 Hours
Cure schedule @ 25°C
8 Hours
Cure schedule @ 25°C
8 Hours
Cure schedule @ 65°C
1 Hour
Cure schedule @ 65°C
1 Hour
Cure schedule @ 100°C
0.5 Hour
Cure schedule @ 100°C
0.5 Hour
PHYSICAL PROPERTIES
PHYSICAL PROPERTIES
Color
Black
Color
Blue
Specific gravity
1.5
Specific gravity:
2.30
Operating temp, °C
-60 to 155
Operating temp, °C
-70 to 115
Heat distortion temp, °C
100
Hardness, shore D:
90
Hardness, shore D:
88
Izod impact, F1 Lbs/Inch of notch
0.49
Thermal
conductivity W/(m°C)
1.26
Thermal
conductivity W/(m-°C)
0.85
Compressive strength, psi
14,000
C.T.E. (ppm/°C)
25
Dissipation factor,
0.01
Tensile strength (@25°C)
9200 psi
Self extinguishing:
yes
Tensile lap shear, psi
2900
C.T.E. (ppm/°C)
25
Dielectric strength (volts/mil)
410
Tensile strength (@25°C)
9200 psi
Dielectric constant (1 KHz @ 25°C)
5.9
Dielectric
800
Dissipation factor, KH@ 25°C
5.9
Shelf life
18 months*
Shelf life
18 months*
* Stated shelf life is from date of manufacture. To allow for inventory cycle, product shipped from Aavid will
have less than 18 months remaining shelf life. Aavid guarantees a minimum of 3 months remaining shelf life.
Please adjust order quantity so all product will be consumed within 3 months of date of shipment.
Ther-O-BondTM 2000
Ther-O-BondTM 2000 acrylic adhesive cures rapidly
at room temperature, while providing a repairable,
thermally conductive bond.
PRODUCT INFORMATION
Color
White
Thermal
conductivity W/(m-°C)
0.48
C.T.E. (ppm/°C)
25
Tensile strength (@25°C)
2360 psi
Dielectric strength (volts/mil)
220
Shelf life
18 months*
* Stated shelf life is from date of manufacture. To allow for inventory cycle, product shipped from Aavid will
have less than 18 months remaining shelf life. Aavid guarantees a minimum of 3 months remaining shelf life.
Please adjust order quantity so all product will be consumed within 3 months of date of shipment.
114
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United Kingdom Tel: +44 1793 401400 email: [email protected]
ASIA
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Taiwan Tel: +886 (2) 2698-9888 email: [email protected]
Grease & Epoxy
Thermalbond™
Thermalbond™ is a thermally conductive, high strength epoxy
adhesive. It provides exceptional adhesion to copper, aluminum,
steel, glass, ceramics, and most plastics. ThermalbondTM also has a
coefficient of thermal expansion compatible with aluminum, copper,
and brass, making it particularly well suited for thermally bonding
semiconductors and other components to chassis or heat sinks.
ORDERING INFORMATION
HANDLING CHARACTERISTICS
Net weight
Typical electrical and physical properties at room temperature with RT-7 hardener
4949G
0.8 oz (25 gram kit)
Color
Green
4950G
1.7 oz (50 gram kit)
Specific gravity
2.35
4951G
3.5 oz (100 gram kit)
Working viscosity
25,000 cps
4952G
7.0 oz (200 gram kit)
Thermal conductivity
1.34W/(m °C) (0.77 Btu/hr •ft• °F)
4953G
4 lbs (1814 grams)
Thermal resistivity
29.4°C in/watt
Tensile strength
6.34 x 107 Pa (9,2000 psi)
Compressive strength
1.44 x 108 Pa (20,9000 psi)
Bond shear strength
aluminum to aluminum, 25.4mm (1") overlap @ 25°C, (77°F)
3.17 x 107 Pa (4,6000 psi)
Thermal coefficient of expansion
24 x 10-6/°C (1.32 x 10-6/°F)
Water absorption, % after 10 days@ 25°C (77°F)
0.20
Hardness, Shore D
86
Volume resistivity
1.0 x 1016
Dielectric strength
59.1 x 103 volts/mm (1500 volts/mil)
Dielectric constant@25°C (77°F) 100KHz
6.1
Dielectric factor@25°C (77°F) 100KHz
0.020
Operating temperatures
-65°C to 155°C (-85°F to 311°F)
Linear shrinkage
0.002 in/in
Shelf life
12 months*
Pot life@25°C (77°F)
2-3 hours
Suggested stripping agent
Miller-Stephenson MS 111
Cleaning solvent
Acetone
MIXING INSTRUCTIONS
Mix resin thoroughly before removing material.
Add 7.1 parts of RT-7 hardener to 100 parts of resin
by weight, or 17 parts of RT-7 hardener to 100 parts
of resin by volume. Adhesive will set up in:
24 hrs at 25°C (77°F)
2 hrs. at 65°C (149°F)
1 hr. at 100°C (212°F)
30min. at 130°C (266°F)
Note: For maximum electrical and physical properties, a post cure is neccessary.
Post cure at room temperature for 4 days or for 4 hours at 93°C (200°F).
ACCESSORIES
Part number
* Stated shelf life is from date of manufacture. To allow for inventory cycle, product shipped from Aavid will
have less than 12 months remaining shelf life. Aavid guarantees a minimum of 3 months remaining shelf life.
Please adjust order quantity so all product will be consumed within 3 months of date of shipment.
AMERICA
EUROPE
www.aavidthermalloy.com
USA Tel: +1 (603) 224-9988 email: [email protected]
Italy Tel: +39 051 764011 email: [email protected]
United Kingdom Tel: +44 1793 401400 email: [email protected]
ASIA
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115
THE TOTAL INTEGRATED SOLUTION FOR COOLING ELECTRONICS
The Total Integrated Solution for Cooling Electronics®
Aavid Thermalloy has the expertise to design and
manufacture cooling solutions spanning the entire
range of thermal efficiency and mechanical complexity.
The board level products displayed in this catalog
represent only a fraction of our capabilities. Most
applications require custom solutions, which is why
so many leading electronics companies partner with
Aavid Thermalloy.
For demanding applications Aavid Thermalloy
can design and validate custom innovative solutions
utilizing the most advanced engineering resources
saving you precious development time. Our manufacturing facilities, located in strategic markets around
the globe, deliver cost effective products providing
you a competitive advantage. From concept to
production, Aavid Thermalloy can enable your
design anywhere in the world.
Experts at solving cooling challenges ranging from
networking, telecom and consumer electronics, to
power and biomedical devices. Our clients include
Cisco, Nortel, HP, Apple, Sun, Bio-Rad, Mitsubishi and
other industry leading companies worldwide. Utilizing
the latest CFD/FEA and experimental techniques we can:
• Perform conjugate analyses with conduction,
convection and radiation
• Optimize venting and fan placement
• Increase power density
• Reduce noise, cost and size.
• Increase MTBF
Dedicated thermal engineers characterize your system
and provide the most advanced and effective cooling
solutions, saving thousands in engineering resources,
thermal modeling software, and test hardware.
There are 4 cooling mechanisms that Aavid Thermalloy and Applied Thermal Technologies take pride in
having expertise in: natural convection, forced convection, fluid phase change and liquid cooling. The
above graph is a starting point to determine which technology can be used for your system configuration.
For more information regarding any of these cooling mechanisms, please contact Aavid Thermalloy at:
www.aavidthermalloy.com
116
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ASIA
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Taiwan Tel: +886 (2) 2698-9888 email: [email protected]