Microsemi AX250 Axcelerator family fpgas Datasheet

Revision 18
Axcelerator Family FPGAs
Leading-Edge Performance
•
•
•
•
350+ MHz System Performance
500+ MHz Internal Performance
High-Performance Embedded FIFOs
700 Mb/s LVDS Capable I/Os
Specifications
•
•
•
•
•
Up to 2 Million Equivalent System Gates
Up to 684 I/Os
Up to 10,752 Dedicated Flip-Flops
Up to 295 kbits Embedded SRAM/FIFO
Manufactured on Advanced 0.15 μm CMOS Antifuse Process
Technology, 7 Layers of Metal
Features
•
•
•
•
•
Single-Chip, Nonvolatile Solution
Up to 100% Resource Utilization with 100% Pin Locking
1.5 V Core Voltage for Low Power
Footprint Compatible Packaging
Flexible, Multi-Standard I/Os:
– 1.5 V, 1.8 V, 2.5 V, 3.3 V Mixed Voltage Operation
– Bank-Selectable I/Os – 8 Banks per Chip
– Single-Ended I/O Standards: LVTTL, LVCMOS, 3.3V PCI,
and 3.3 V PCI-X
– Differential I/O Standards: LVPECL and LVDS
•
•
•
•
•
•
•
– Voltage-Referenced I/O Standards: GTL+, HSTL Class 1,
SSTL2 Class 1 and 2, SSTL3 Class 1 and 2
– Registered I/Os
– Hot-Swap Compliant I/Os (except PCI)
– Programmable Slew Rate and Drive Strength on Outputs
– Programmable Delay and Weak Pull-Up/Pull-Down Circuits
on Inputs
Embedded Memory:
– Variable-Aspect 4,608-bit RAM Blocks (x1, x2, x4, x9, x18,
x36 Organizations Available)
– Independent, Width-Configurable Read and Write Ports
– Programmable Embedded FIFO Control Logic
Segmentable Clock Resources
Embedded Phase-Locked Loop:
– 14-200 MHz Input Range
– Frequency Synthesis Capabilities up to 1 GHz
Deterministic, User-Controllable Timing
Unique In-System Diagnostic and Debug Capability with
Microsemi Silicon Explorer II
Boundary-Scan Testing Compliant with IEEE Standard 1149.1
(JTAG)
FuseLock™ Programming Technology Protects Against
Reverse Engineering and Design Theft
Table 1 • Axcelerator Family Product Profile
Device
Capacity (in Equivalent System Gates)
Typical Gates
Modules
Register (R-cells)
Combinatorial (C-cells)
Maximum Flip-Flops
Embedded RAM/FIFO
Number of Core RAM Blocks
Total Bits of Core RAM
Clocks (Segmentable)
Hardwired
Routed
PLLs
I/Os
I/O Banks
Maximum User I/Os
Maximum LVDS Channels
Total I/O Registers
Package
PQ
BG
FG
CQ
CG
March 2012
© 2012 Microsemi Corporation
AX125
AX250
AX500
AX1000
AX2000
125,000
82,000
250,000
154,000
500,000
286,000
1,000,000
612,000
2,000,000
1,060,000
672
1,344
1,344
1,408
2,816
2,816
2,688
5,376
5,376
6,048
12,096
12,096
10,752
21,504
21,504
4
18,432
12
55,296
16
73,728
36
165,888
64
294,912
4
4
8
4
4
8
4
4
8
4
4
8
4
4
8
8
168
84
504
8
248
124
744
8
336
168
1,008
8
516
258
1,548
8
684
342
2,052
208
208
256, 484
208, 352
484, 676
208, 352
729
484, 676, 896
352
624
896, 1152
256, 352
624
256, 324
i
Axcelerator Family FPGAs
Ordering Information
AX1000 _
1
FG
G
896
I
Application
Blank = Commercial (0 to +70° C)
PP = Pre-Production
I = Industrial (-40 to +85° C)
M = Military (-55 to +125° C)
Package Lead Count
Lead-Free Packaging
Blank = Standard Packaging
G= RoHS-Compliant Packaging
Package Type
BG = Ball Grid Array (1.27mm pitch)
FG = Fine Ball Grid Array (1.0mm pitch)
PQ = Plastic Quad Flat Pack (0.5mm pitch)
CQ = Ceramic Quad Flat Pack (0.5mm pitch)
CG = Ceramic Column Grid Array
Speed Grade
Blank = Standard Speed
1 = Approximately 15% Faster than Standard
2 = Approximately 25% Faster than Standard
Part Number
AX125 = 125,000 Equivalent System Gates
AX250 = 250,000 Equivalent System Gates
AX500 = 500,000 Equivalent System Gates
AX1000 = 1,000,000 Equivalent System Gates
AX2000 = 2,000,000 Equivalent System Gates
Device Resources
User I/Os (Including Clock Buffers)
Package
AX125
AX250
AX500
AX1000
AX2000
PQ208
–
115
115
–
–
CQ208
–
115
115
–
–
CQ256
–
–
–
–
136
FG256
138
138
–
–
–
FG324
168
–
–
–
–
CQ352
–
198
198
198
198
FG484
–
248
317
317
–
CG624
–
–
–
418
418
FG676
–
–
336
418
–
BG729
–
–
–
516
–
FG896
–
–
–
516
586
FG1152
–
–
–
–
684
Note: The FG256, FG324, and FG484 are footprint compatible with one another. The FG676, FG896, and FG1152 are also footprint
compatible with one another.
ii
R evis i o n 18
Axcelerator Family FPGAs
Axcelerator Family Device Status
Axcelerator® Devices
Status
AX125
Production
AX250
Production
AX500
Production
AX1000
Production
AX2000
Production
Temperature Grade Offerings
Package
AX125
AX250
AX500
AX1000
AX2000
PQ208
–
C, I, M
C, I, M
–
–
CQ208
–
M
M
–
–
CQ256
–
–
–
–
M
FG256
C, I
C, I, M
–
–
–
FG324
C, I
–
–
–
–
CQ352
–
M
M
M
M
FG484
–
C, I, M
C, I, M
C, I, M
–
CG624
–
–
–
M
M
FG676
–
–
C, I, M
C, I, M
–
BG729
–
–
–
C, I, M
–
FG896
–
–
–
C, I, M
C, I, M
FG1152
–
–
–
–
C, I, M
C = Commercial
I = Industrial
M = Military
Speed Grade and Temperature Grade Matrix
Temperature Grade
Std
–1
–2
C
3
3
3
I
3
3
3
M
3
3
–
C = Commercial
I = Industrial
M = Military
R ev i si o n 1 8
iii
Axcelerator Family FPGAs
Packaging Data
Refer to the following documents located on the Microsemi SoC Products Group website for additional packaging information.
Package Mechanical Drawings
Package Thermal Characteristics and Weights
Hermatic Package Mechanical Information
Contact your local Microsemi representative for device availability.
iv
Revision 18
Axcelerator Family FPGAs
Table of Contents
General Description
Device Architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Design Environment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Related Documents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1-1
1-7
1-8
1-8
Detailed Specifications
Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1
Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-6
I/O Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-9
Voltage-Referenced I/O Standards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-43
Differential Standards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-50
Module Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-54
Routing Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-61
Global Resources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-66
Axcelerator Clock Management System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-75
Embedded Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-86
Other Architectural Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-106
Programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-110
Package Pin Assignments
BG729 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1
FG256 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-9
FG324 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-16
FG484 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-21
FG676 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-37
FG896 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-52
FG1152 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-71
PQ208 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-84
CQ208 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-89
CQ256 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-94
CQ352 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-98
CG624 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-115
Datasheet Information
List of Changes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-1
Datasheet Categories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-7
Safety Critical, Life Support, and High-Reliability Applications Policy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-7
R ev i si o n 1 8
v
1 – General Description
Axcelerator devices offer high performance at densities of up to two million equivalent system gates.
Based upon the Microsemi AX architecture, Axcelerator has several system-level features such as
embedded SRAM (with complete FIFO control logic), PLLs, segmentable clocks, chip-wide highway
routing, and carry logic.
Device Architecture
AX architecture, derived from the highly-successful SX-A sea-of-modules architecture, has been
designed for high performance and total logic module utilization (Figure 1-1). Unlike in traditional FPGAs,
the entire floor of the Axcelerator device is covered with a grid of logic modules, with virtually no chip
area lost to interconnect elements or routing.
Programmable Interconnect Element
The Axcelerator family uses a patented metal-to-metal antifuse programmable interconnect element that
resides between the upper two layers of metal (Figure 1-2 on page 1-2). This completely eliminates the
channels of routing and interconnect resources between logic modules (as implemented on traditional
FPGAs) and enables the efficient sea-of-modules architecture. The antifuses are normally open circuit
and, when programmed, form a permanent, passive, low-impedance connection, leading to the fastest
signal propagation in the industry. In addition, the extremely small size of these interconnect elements
gives the Axcelerator family abundant routing resources.
The very nature of Microsemi's nonvolatile antifuse technology provides excellent protection against
design pirating and cloning (FuseLock technology). Typical cloning attempts are impossible (even if the
security fuse is left unprogrammed) as no bitstream or programming file is ever downloaded or stored in
the device. Reverse engineering is virtually impossible due to the difficulty of trying to distinguish
between programmed and unprogrammed antifuses and also due to the programming methodology of
antifuse devices (see "Security" on page 2-108).
Routing
Switch
Matrix
Logic Block
Sea-of-Modules
Architecture
Traditional FPGA
Architecture
Logic
Modules
Figure 1-1 •
Sea-of-Modules Comparison
R ev i si o n 1 8
1 -1
General Description
Figure 1-2 •
Axcelerator Family Interconnect Elements
Logic Modules
Microsemi's Axcelerator family provides two types of logic modules: the register cell (R-cell) and the
combinatorial cell (C-cell). The Axcelerator device can implement more than 4,000 combinatorial
functions of up to five inputs (Figure 1-3).
FCI
A[1:0]
D
B[1:0]
D[3:0]
C-cell
Y
DB
E
CLK
PSET
Q
CLR
CFN
(Positive Edge Triggered)
FCO
C-Cell
Figure 1-3 •
R-Cell
AX C-Cell and R-Cell
The R-cell contains a flip-flop featuring asynchronous clear, asynchronous preset, and active-low enable
control signals (Figure 1-3). The R-cell registers feature programmable clock polarity selectable on a
register-by-register basis. This provides additional flexibility (e.g., easy mapping of dual-data-rate
functions into the FPGA) while conserving valuable clock resources. The clock source for the R-cell can
be chosen from the hardwired clocks, routed clocks, or internal logic.
1- 2
R ev isio n 1 8
Axcelerator Family FPGAs
Two C-cells, a single R-cell, two Transmit (TX), and two Receive (RX) routing buffers form a Cluster,
while two Clusters comprise a SuperCluster (Figure 1-4). Each SuperCluster also contains an
independent Buffer (B) module, which supports buffer insertion on high-fanout nets by the place-androute tool, minimizing system delays while improving logic utilization.
C
Figure 1-4 •
C
R
TX
TX
RX
RX
B
TX
TX
RX
RX
C
C
R
AX SuperCluster
The logic modules within the SuperCluster are arranged so that two combinatorial modules are side-byside, giving a C–C–R – C–C–R pattern to the SuperCluster. This C–C–R pattern enables efficient
implementation (minimum delay) of two-bit carry logic for improved arithmetic performance (Figure 1-5
on page 1-3).
FCI
DCOUT
C-Cell
C-Cell
Y
Y
Carry Logic
FCO
Figure 1-5 •
AX 2-Bit Carry Logic
The AX architecture is fully fracturable, meaning that if one or more of the logic modules in a
SuperCluster are used by a particular signal path, the other logic modules are still available for use by
other paths.
At the chip level, SuperClusters are organized into core tiles, which are arrayed to build up the full chip.
For example, the AX1000 is composed of a 3x3 array of nine core tiles. Surrounding the array of core
tiles are blocks of I/O Clusters and the I/O bank ring (Table 1-1). Each core tile consists of an array of 336
SuperClusters and four SRAM blocks (176 SuperClusters and three SRAM blocks for the AX250).
Table 1-1 • Number of Core Tiles per Device
Device
Number of Core Tiles
AX125
1 regular tile
AX250
4 smaller tiles
AX500
4 regular tiles
AX1000
9 regular tiles
AX2000
16 regular tiles
R ev i si o n 1 8
1 -3
General Description
The SRAM blocks are arranged in a column on the west side of the tile (Figure 1-6 on page 1-4).
SuperCluster
C
4k
RAM/
FIFO
4k
RAM/
FIFO
Chip Layout
4k
RAM/
FIFO
4k
RAM/
FIFO
C
R
TX
TX
RX
RX
RAMC
SC
SC
SC
SC
SC
SC
RD
SC
SC
SC
SC
SC
SC
RAMC
SC
SC
SC
SC
SC
SC
RD
SC
SC
SC
SC
SC
SC
RAMC
SC
SC
SC
SC
SC
SC
RD
SC
SC
SC
SC
SC
SC
RAMC
SC
SC
SC
SC
SC
SC
RD
SC
SC
SC
SC
SC
SC
RAMC
SC
SC
SC
SC
SC
SC
RD
SC
SC
SC
SC
SC
SC
RAMC
SC
SC
SC
SC
SC
SC
RD
SC
SC
SC
SC
SC
SC
RAMC
SC
SC
SC
SC
SC
SC
RD
SC
SC
SC
SC
SC
SC
RAMC
SC
SC
SC
SC
SC
SC
RD
SC
SC
SC
SC
SC
SC
RAMC
SC
SC
SC
SC
SC
SC
RD
SC
SC
SC
SC
SC
SC
RAMC
SC
SC
SC
SC
SC
SC
RD
SC
SC
SC
SC
SC
SC
RAMC
SC
SC
SC
SC
SC
SC
RD
SC
SC
SC
SC
SC
SC
RAMC
SC
SC
SC
SC
SC
SC
RD
SC
SC
SC
SC
SC
SC
RAMC
SC
SC
SC
SC
SC
SC
RD
SC
SC
SC
SC
SC
RAMC
SC
SC
SC
SC
SC
SC
RD
SC
SC
SC
SC
SC
SC
TX
TX
RX
RX
C
C
R
SC
HD
HD
HD
HD
HD
HD
HD
HD
HD
HD
HD
HD
HD
RAMC
SC
SC
SC
SC
SC
SC
RD
SC
SC
SC
SC
SC
SC
RAMC
SC
SC
SC
SC
SC
SC
RD
SC
SC
SC
SC
SC
SC
RAMC
SC
SC
SC
SC
SC
SC
RD
SC
SC
SC
SC
SC
SC
RAMC
SC
SC
SC
SC
SC
SC
RD
SC
SC
SC
SC
SC
SC
RAMC
SC
SC
SC
SC
SC
SC
RD
SC
SC
SC
SC
SC
SC
RAMC
SC
SC
SC
SC
SC
SC
RD
SC
SC
SC
SC
SC
SC
RAMC
SC
SC
SC
SC
SC
SC
RD
SC
SC
SC
SC
SC
SC
RAMC
SC
SC
SC
SC
SC
SC
RD
SC
SC
SC
SC
SC
SC
RAMC
SC
SC
SC
SC
SC
SC
RD
SC
SC
SC
RAMC
SC
SC
SC
SC
SC
SC
RD
SC
SC
SC
SC
SC
SC
RAMC
SC
SC
SC
SC
SC
SC
RD
SC
SC
SC
SC
SC
SC
RAMC
SC
SC
SC
SC
SC
SC
RD
SC
SC
SC
SC
SC
SC
RAMC
SC
SC
SC
SC
SC
SC
RD
SC
SC
SC
SC
SC
SC
RAMC
SC
SC
SC
SC
SC
SC
RD
SC
SC
SC
SC
SC
SC
SC
SC
Core
TileSC
B
I/O Structure
See Figure 7
Figure 1-6 •
AX Device Architecture (AX1000 shown)
Embedded Memory
As mentioned earlier, each core tile has either three (in a smaller tile) or four (in the regular tile)
embedded SRAM blocks along the west side, and each variable-aspect-ratio SRAM block is 4,608 bits in
size. Available memory configurations are: 128x36, 256x18, 512x9, 1kx4, 2kx2 or 4kx1 bits. The
individual blocks have separate read and write ports that can be configured with different bit widths on
each port. For example, data can be written in by eight and read out by one.
In addition, every SRAM block has an embedded FIFO control unit. The control unit allows the SRAM
block to be configured as a synchronous FIFO without using core logic modules. The FIFO width and
depth are programmable. The FIFO also features programmable ALMOST-EMPTY (AEMPTY) and
ALMOST-FULL (AFULL) flags in addition to the normal EMPTY and FULL flags. In addition to the flag
logic, the embedded FIFO control unit also contains the counters necessary for the generation of the
read and write address pointers as well as control circuitry to prevent metastability and erroneous
operation. The embedded SRAM/FIFO blocks can be cascaded to create larger configurations.
I/O Logic
The Axcelerator family of FPGAs features a flexible I/O structure, supporting a range of mixed voltages
with its bank-selectable I/Os: 1.5V, 1.8V, 2.5V, and 3.3V. In all, Axcelerator FPGAs support at least 14
different I/O standards (single-ended, differential, voltage-referenced). The I/Os are organized into
banks, with eight banks per device (two per side). The configuration of these banks determines the I/O
standards supported (see "User I/Os" on page 2-11 for more information). All I/O standards are available
in each bank.
Each I/O module has an input register (InReg), an output register (OutReg), and an enable register
(EnReg) (Figure 1-7 on page 1-5). An I/O Cluster includes two I/O modules, four RX modules, two TX
modules, and a buffer (B) module.
1- 4
R ev isio n 1 8
Axcelerator Family FPGAs
I/O Module
InReg
I
O
B
A
N
K
4k
RAM/
FIFO
I/O
Module
TX
RX
RX
OutReg
TX
B
RX
RX
EnReg
I/O
Module
I/O Cluster
4k
RAM/
FIFO
4k
RAM/
FIFO
CoreTile
4k
RAM/
FIFO
Figure 1-7 •
I/O Cluster Arrangement
Routing
The AX hierarchical routing structure ties the logic modules, the embedded memory blocks, and the I/O
modules together (Figure 1-8 on page 1-6). At the lowest level, in and between SuperClusters, there are
three local routing structures: FastConnect, DirectConnect, and CarryConnect routing. DirectConnects
provide the highest performance routing inside the SuperClusters by connecting a C-cell to the adjacent
R-cell. DirectConnects do not require an antifuse to make the connection and achieve a signal
propagation time of less than 0.1 ns.
FastConnects provide high-performance, horizontal routing inside the SuperCluster and vertical routing
to the SuperCluster immediately below it. Only one programmable connection is used in a FastConnect
path, delivering a maximum routing delay of 0.4 ns.
CarryConnects are used for routing carry logic between adjacent SuperClusters. They connect the FCO
output of one two-bit, C-cell carry logic to the FCI input of the two-bit, C-cell carry logic of the
SuperCluster below it. CarryConnects do not require an antifuse to make the connection and achieve a
signal propagation time of less than 0.1 ns.
The next level contains the core tile routing. Over the SuperClusters within a core tile, both vertical and
horizontal tracks run across rows or columns, respectively. At the chip level, vertical and horizontal tracks
extend across the full length of the device, both north-to-south and east-to-west. These tracks are
composed of highway routing that extend the entire length of the device (segmented at core tile
boundaries) as well as segmented routing of varying lengths.
R ev i si o n 1 8
1 -5
General Description
Figure 1-8 •
AX Routing Structures
Global Resources
Each family member has three types of global signals available to the designer: HCLK, CLK, and
GCLR/GPSET. There are four hardwired clocks (HCLK) per device that can directly drive the clock input
of each R-cell. Each of the four routed clocks (CLK) can drive the clock, clear, preset, or enable pin of an
R-cell or any input of a C-cell (Figure 1-3 on page 1-2).
Global clear (GCLR) and global preset (GPSET) drive the clear and preset inputs of each R-cell as well
as each I/O Register on a chip-wide basis at power-up.
Each HCLK and CLK has an associated analog PLL (a total of eight per chip). Each embedded PLL can
be used for clock delay minimization, clock delay adjustment, or clock frequency synthesis. The PLL is
capable of operating with input frequencies ranging from 14 MHz to 200 MHz and can generate output
frequencies between 20 MHz and 1 GHz. The clock can be either divided or multiplied by factors ranging
from 1 to 64. Additionally, multiply and divide settings can be used in any combination as long as the
resulting clock frequency is between 20 MHz and 1 GHz. Adjacent PLLs can be cascaded to create
complex frequency combinations.
The PLL can be used to introduce either a positive or a negative clock delay of up to 3.75 ns in 250 ps
increments. The reference clock required to drive the PLL can be derived from three sources: external
input pad (either single-ended or differential), internal logic, or the output of an adjacent PLL.
Low Power (LP) Mode
The AX architecture was created for high-performance designs but also includes a low power mode
(activated via the LP pin). When the low power mode is activated, I/O banks can be disabled (inputs
disabled, outputs tristated), and PLLs can be placed in a power-down mode. All internal register states
are maintained in this mode. Furthermore, individual I/O banks can be configured to opt out of the LP
mode, thereby giving the designer access to critical signals while the rest of the chip is in low power
mode.
The power can be further reduced by providing an external voltage source (VPUMP) to the device to
bypass the internal charge pump (See "Low Power Mode" on page 2-106 for more information).
1- 6
R ev isio n 1 8
Axcelerator Family FPGAs
Design Environment
The Axcelerator family of FPGAs is fully supported by both Microsemi's Libero® Integrated Design
Environment and Designer FPGA Development software. Libero IDE is an integrated design manager
that seamlessly integrates design tools while guiding the user through the design flow, managing all
design and log files, and passing necessary design data among tools. Additionally, Libero IDE allows
users to integrate both schematic and HDL synthesis into a single flow and verify the entire design in a
single environment (see the Libero IDE Flow diagram located on the Microsemi SoC Products Group
website). Libero IDE includes Synplify® Actel Edition (AE) from Synplicity®, ViewDraw® AE from Mentor
Graphics®, ModelSim® HDL Simulator from Mentor Graphics, WaveFormer Lite™ AE from
SynaptiCAD®, and Designer software from Microsemi.
Designer software is a place-and-route tool and provides a comprehensive suite of backend support
tools for FPGA development. The Designer software includes the following:
•
Timer – a world-class integrated static timing analyzer and constraints editor which support
timing-driven place-and-route
•
NetlistViewer – a design netlist schematic viewer
•
ChipPlanner – a graphical floorplanner viewer and editor
•
SmartPower – allows the designer to quickly estimate the power consumption of a design
•
PinEditor – a graphical application for editing pin assignments and I/O attributes
•
I/O Attribute Editor – displays all assigned and unassigned I/O macros and their attributes in a
spreadsheet format
With the Designer software, a user can lock the design pins before layout while minimally impacting the
results of place-and-route. Additionally, Microsemi’s back-annotation flow is compatible with all the major
simulators and the simulation results can be cross-probed with Silicon Explorer II, Microsemi’s integrated
verification and logic analysis tool. Another tool included in the Designer software is the SmartGen core
generator, which easily creates popular and commonly used logic functions for implementation into your
schematic or HDL design.
Designer software is compatible with the most popular FPGA design entry and verification tools from
EDA vendors, such as Mentor Graphics, Synplicity, Synopsys, and Cadence Design Systems. The
Designer software is available for both the Windows and UNIX operating systems.
Programming
Programming support is provided through Silicon Sculptor II, a single-site programmer driven via a PCbased GUI. In addition, BP Microsystems offers multi-site programmers that provide qualified support for
Microsemi devices. Factory programming is available for high-volume production needs.
In-System Diagnostic and Debug Capabilities
The Axcelerator family of FPGAs includes internal probe circuitry, allowing the designer to dynamically
observe and analyze any signal inside the FPGA without disturbing normal device operation (Figure 1-9).
Axcelerator FPGAs
16 Pin
Connection
TDI
TCK
Serial
Connection
TMS
Silicon Explorer II
TDO
PRA
PRB
22 Pin
Connection
CH3/PRC
CH4/PRD
Additional 14 Channels
(Logic Analyzer)
Figure 1-9 •
Probe Setup
R ev i si o n 1 8
1 -7
General Description
Up to four individual signals can be brought out to dedicated probe pins (PRA/B/C/D) on the device. The
probe circuitry is accessed and controlled via Silicon Explorer II, Microsemi's integrated verification and
logic analysis tool that attaches to the serial port of a PC and communicates with the FPGA via the JTAG
port (See "Silicon Explorer II Probe Interface" on page 2-109).
Summary
Microsemi’s Axcelerator family of FPGAs extends the successful SX-A architecture, adding embedded
RAM/FIFOs, PLLs, and high-speed I/Os. With the support of a suite of robust software tools, design
engineers can incorporate high gate counts and fixed pins into an Axcelerator design yet still achieve
high performance and efficient device utilization.
Related Documents
Application Notes
Simultaneous Switching Noise and Signal Integrity
http://www.microsemi.com/soc/documents/SSN_AN.pdf
Axcelerator Family PLL and Clock Management
http://www.microsemi.com/soc/documents/AX_PLL_AN.pdf
Implementation of Security in Actel Antifuse FPGAs
http://www.microsemi.com/soc/documents/Antifuse_Security_AN.pdf
User’s Guides and Manuals
Antifuse Macro Library Guide
http://www.microsemi.com/soc/documents/libguide_UG.pdf
SmartGen, FlashROM, Analog System Builder, and Flash Memory System Builder
http://www.microsemi.com/soc/documents/genguide_ug.pdf
Silicon Sculptor II User’s Guide
http://www.microsemi.com/soc/documents/silisculptII_sculpt3_ug.pdf
White Paper
Design Security in Nonvolatile Flash and Antifuse FPGAs
http://www.microsemi.com/soc/documents/DesignSecurity_WP.pdf
Understanding Actel Antifuse Device Security
http://www.microsemi.com/soc/documents/DesignSecurity_WP.pdf
Miscellaneous
Libero IDE flow diagram
http://www.microsemi.com/soc/products/tools/libero/flow.html
1- 8
R ev isio n 1 8
2 – Detailed Specifications
Operating Conditions
Table 2-1 lists the absolute maximum ratings of Axcelerator devices. Stresses beyond the ratings may
cause permanent damage to the device. Exposure to Absolute Maximum rated conditions for extended
periods may affect device reliability. Devices should not be operated outside the recommendations in
Table 2-2.
Table 2-1 • Absolute Maximum Ratings
Symbol
Parameter
Limits
Units
VCCA
DC Core Supply Voltage
–0.3 to 1.7
V
VCCI
DC I/O Supply Voltage
–0.3 to 3.75
V
VREF
DC I/O Reference Voltage
–0.3 to 3.75
V
VI
Input Voltage
–0.5 to 4.1
V
VO
Output Voltage
–0.5 to 3.75
V
TSTG
Storage Temperature
–60 to +150
°C
VCCDA*
Supply Voltage for Differential I/Os
–0.3 to 3.75
V
Note: * Should be the maximum of all VCCI.
Table 2-2 •
Recommended Operating Conditions
Parameter Range
Commercial
Industrial
Military
Units
Ambient Temperature (TA)1
0 to +70
–40 to +85
–55 to +125
°C
1.5 V Core Supply Voltage
1.425 to 1.575
1.425 to 1.575
1.425 to 1.575
V
1.5 V I/O Supply Voltage
1.425 to 1.575
1.425 to 1.575
1.425 to 1.575
V
1.8 V I/O Supply Voltage
1.71 to 1.89
1.71 to 1.89
1.71 to 1.89
V
2.5 V I/O Supply Voltage
2.375 to 2.625
2.375 to 2.625
2.375 to 2.625
V
3.3 V I/O Supply Voltage
3.0 to 3.6
3.0 to 3.6
3.0 to 3.6
V
VCCDA Supply Voltage
3.0 to 3.6
3.0 to 3.6
3.0 to 3.6
V
VPUMP Supply Voltage
3.0 to 3.6
3.0 to 3.6
3.0 to 3.6
V
Notes:
1. Ambient temperature (TA) is used for commercial and industrial grades; case temperature (TC) is used for
military grades.
2. TJ max = 125°C
Power-Up/Down Sequence
All Axcelerator I/Os are tristated during power-up until normal device operating conditions are reached,
when I/Os enter user mode. VCCDA should be powered up before (or coincidentally with) VCCA and
VCCI to ensure the behavior of user I/Os at system start-up. Conversely, VCCDA should be powered
down after (or coincidentally with) VCCA and VCCI. Note that VCCI and VCCA can be powered up in any
sequence with respect to each other, provided the requirement with respect to VCCDA is satisfied.
R ev i si o n 1 8
2 -1
Detailed Specifications
Calculating Power Dissipation
Table 2-3 • Standby Current
ICCA
ICCDA
Standby
Standby Current,
Current Differential
(Core)
I/O
ICCBANK
Standby Current
per
I/O Bank
2.5 V
VCCI
3.3 V
VCCI
ICCCP1
ICCPLL
Standby Current,
Charge Pump
Standby
Current
Bypassed IIH, IIL,
IOZ2 Units
per PLL Active
Mode
Device
Temperature
AX125
Typical at 25°C
1.5
1.5
0.2
0.3
0.2
0.3
0.01
±0.01
mA
70°C
15
6
0.5
0.75
1
0.4
0.01
±0.01
mA
85°C
25
6
0.6
0.8
1
0.4
0.2
±0.01
mA
125°C
50
8
1
1.5
2
0.4
0.5
±0.01
mA
Typical at 25°C
1.5
1.4
0.25
0.4
0.2
0.3
0.01
±0.01
mA
70°C
30
7
0.8
0.9
1
0.4
0.01
±0.01
mA
85°C
40
7
0.8
1
1
0.4
0.2
±0.01
mA
125°C
70
9
1.3
1.8
2
0.4
0.5
±0.01
mA
Typical at 25°C
5
1.4
0.4
0.75
0.2
0.3
0.01
±0.01
mA
70°C
60
7
1
1.5
1
0.4
0.01
±0.01
mA
85°C
80
7
1
1.9
1
0.4
0.2
±0.01
mA
125°C
180
9
1.75
2.5
1.5
0.4
0.5
±0.01
mA
Typical at 25°C
7.5
1.5
0.5
1.25
0.2
0.3
0.01
±0.01
mA
70°C
80
8
1.5
3
1
0.4
0.01
±0.01
mA
85°C
120
8
1.5
3.4
1
0.4
0.2
±0.01
mA
125°C
200
10
3
4
1.5
0.4
0.5
±0.01
mA
Typical at 25°C
20
1.6
0.7
1.5
0.2
0.3
0.01
±0.01
mA
70°C
160
10
2
7
1
0.4
0.01
±0.01
mA
85°C
200
10
3
8
1
0.4
0.2
±0.01
mA
125°C
500
15
4
10
1.5
0.4
0.5
±0.01
mA
AX250
AX500
AX1000
AX2000
Notes:
1. ICCCP Active is the ICCDA or the Internal Charge Pump current. ICCCP Bypassed mode is the External Charge Pump
current IIH (VPUMP pin).
2. IIH, IIL, or IOZ values are measured with inputs at the same level as VCCI for IIH and GND for IIL and IOZ.
2- 2
R ev isio n 1 8
Axcelerator Family FPGAs
Table 2-4 • Default CLOAD/VCCI
CLOAD (pF)
VCCI (V)
PLOAD
(mw/MHz)
P10 (mw/MHz)
PI/O (mW/MHz)*
LVTTL 24 mA High Slew
35
3.3
381.2
267.5
648.7
LVTTL 16 mA High Slew
35
3.3
381.2
225.1
606.3
LVTTL 12 mA High Slew
35
3.3
381.2
165.9
547.1
LVTTL 8 mA High Slew
35
3.3
381.2
130.3
511.5
LVTTL 24 mA Low Slew
35
3.3
381.2
169.2
550.4
LVTTL 16 mA Low Slew
35
3.3
381.2
150.8
532.0
LVTTL 12 mA Low Slew
35
3.3
381.2
138.6
519.8
LVTTL 8 mA Low Slew
35
3.3
381.2
118.7
499.9
LVCMOS – 25
35
2.5
218.8
148.0
366.8
LVCMOS – 18
35
1.8
113.4
73.4
186.8
LVCMOS – 15 (JESD8-11)
35
1.5
78.8
49.5
128.3
PCI
10
3.3
108.9
218.5
327.4
PCI-X
10
3.3
108.9
162.9
271.8
HSTL-I
20
1.5
–
40.9
40.9
SSTL2-I
30
2.5
–
171.2
171.2
SSTL2-II
30
2.5
–
147.8
147.8
SSTL3-I
30
3.3
–
327.2
327.2
SSTL3-II
30
3.3
–
288.4
288.4
GTLP – 25
10
2.5
–
61.5
61.5
GTLP – 33
10
3.3
–
68.5
68.5
N/A
3.3
–
260.6
260.6
N/A
2.5
–
145.8
145.8
Single-Ended without VREF
Single-Ended with VREF
Differential
LVPECL – 33
LVDS – 25
Note: *PI/O = P10 + CLOAD *
VCCI2
R ev i si o n 1 8
2 -3
Detailed Specifications
Table 2-5 • Different Components Contributing to the Total Power Consumption in Axcelerator Devices
Device Specific Value (in µW/MHz)
Component
Definition
AX125 AX250 AX500 AX1000 AX2000
P1
Core tile HCLK power component
33
49
71
130
216
P2
R-cell power component
0.2
0.2
0.2
0.2
0.2
P3
HCLK signal power dissipation
4.5
4.5
9
13.5
18
P4
Core tile RCLK power component
33
49
71
130
216
P5
R-cell power component
0.3
0.3
0.3
0.3
0.3
P6
RCLK signal power dissipation
6.5
6.5
13
19.5
26
P7
Power dissipation due to the switching activity on the R-cell
1.6
1.6
1.6
1.6
1.6
P8
Power dissipation due to the switching activity on the C-cell
1.4
1.4
1.4
1.4
1.4
P9
Power component associated with the input voltage
10
10
10
10
10
P10
Power component associated with the output voltage
P11
Power component associated with the read operation in the
RAM block
25
25
25
25
25
P12
Power component associated with the write operation in
the RAM block
30
30
30
30
30
P13
Core PLL power component
1.5
1.5
1.5
1.5
1.5
See table Per pin contribution
Ptotal = Pdc + Pac
Pdc =
ICCA * VCCA
Pac =
PHCLK + PCLK + PR-cells + PC-cells + Pinputs + Poutputs + Pmemory + PPLL
PHCLK = (P1 + P2 * s + P3 * sqrt[s]) * Fs
s
= the number of R-cells clocked by this clock
Fs
= the clock frequency
PCLK = (P4 + P5 * s + P6 * sqrt[s]) * Fs
s
= the number of R-cells clocked by this clock
Fs
= the clock frequency
PR-cells = P7 * ms * Fs
ms =
the number of R-cells switching at each Fs cycle
Fs
the clock frequency
=
PC-cells = P8 * mc * Fs
mc = the number of C-cells switching at each Fs cycle
Fs
= the clock frequency
Pinputs = P9 * pi * Fpi
pi
= the number of inputs
Fpi = the average input frequency
2- 4
R ev isio n 1 8
Axcelerator Family FPGAs
Poutputs = PI/O * po * Fpo
Cload =
VCCI =
po
=
Fpo
=
the output load (technology dependent)
the output voltage (technology dependent)
the number of outputs
the average output frequency
Pmemory = P11 * Nblock * FRCLK + P12 * Nblock * FWCLK
Nblock = the number of RAM/FIFO blocks (1 block = 4k)
FRCLK = the read-clock frequency of the memory
FWCLK = the write-clock frequency of the memory
PPLL = P13 * FCLK
FRefCLK
FCLK
= the clock frequency of the clock input of the PLL
= the clock frequency of the first clock output of the PLL
Power Estimation Example
This example employs an AX1000 shift-register design with 1,080 R-cells, one C-cell, one reset input,
and one LVTTL 12 mA output, with high slew.
This design uses one HCLK at 100 MHz.
ms =
Fs =
s
=
=>
1,080 (in a shift register - 100% of R-cells are toggling at each clock cycle)
100 MHz
1080
PHCLK = (P1 + P2 * s + P3 * sqrt[s]) * Fs = 79 mW
and Fs = 100 MHz
=> PR-cells = P7 * ms * Fs = 173 mW
mc = 1 (1 C-cell in this shift-register)
and Fs = 100 MHz
=> PC-cells = P8 * mc * Fs = 0.14 mW
Fpi ~ 0 MHz
and pi= 1 (1 reset input => this is why Fpi=0)
=> Pinputs = P9 * pi * Fpi = 0 mW
Fpo = 50 MHz
and po = 1
=> Poutputs = PI/O * po * Fpo= 27.10 mW
No RAM/FIFO in this shift-register
=> Pmemory = 0 mW
No PLL in this shift-register
=> PPLL = 0 mW
Pac = PHCLK + PCLK + PR-cells + PC-cells + Pinputs + Poutputs + Pmemory + PPLL = 276 mW
Pdc = 7.5mA * 1.5V = 11.25 mW
Ptotal = Pdc + Pac = 11.25 mW + 276mW = 290.30 mW
R ev i si o n 1 8
2 -5
Detailed Specifications
Thermal Characteristics
Introduction
The temperature variable in Microsemi’s Designer software refers to the junction temperature, not the
ambient temperature. This is an important distinction because dynamic and static power consumption
cause the chip junction temperature to be higher than the ambient temperature. EQ 1 can be used to
calculate junction temperature.
TJ = Junction Temperature = ΔT + Ta
EQ 1
Where:
Ta
= Ambient Temperature
ΔT = Temperature gradient between junction (silicon) and ambient
ΔT = θja * P
EQ 2
Where:
P
= Power
θja = Junction to ambient of package. θja numbers are located under Table 2-6 on page 2-7.
Package Thermal Characteristics
The device junction-to-case thermal characteristic is θjc, and the junction-to-ambient air characteristic is
θja. The thermal characteristics for θja are shown with two different air flow rates. θjc values are provided
for reference. The absolute maximum junction temperature is 125°C.
The maximum power dissipation allowed for commercial- and industrial-grade devices is a function of θja.
A sample calculation of the absolute maximum power dissipation allowed for an 896-pin FBGA package
at commercial temperature and still air is as follows:
junction temp. (°C) – Max. ambient temp. (°C) 125°C – 70°C
Maximum Power Allowed = Max.
-------------------------------------------------------------------------------------------------------------------------------------------------- = --------------------------------------- = 4.04 W
θ ja (° C/W)
13.6°C/W
2- 6
R ev isio n 1 8
Axcelerator Family FPGAs
The maximum power dissipation allowed for Military temperature and Mil-Std 883B devices is specified
as a function of θjc.
Table 2-6 • Package Thermal Characteristics
Package Type
Chip Scale Package (CSP)
Pin Count
θjc
180
N/A
θja Still Air θja 1.0m/s θja 2.5m/s Units
57.8
51.0
50
°C/W
Plastic Quad Flat Pack (PQFP)
208
8.0
26
23.5
20.9
°C/W
Plastic Ball Grid Array (PBGA)
729
2.2
13.7
10.6
9.6
°C/W
Fine Pitch Ball Grid Array (FBGA)
256
3.0
26.6
22.8
21.5
°C/W
Fine Pitch Ball Grid Array (FBGA)
324
3.0
25.8
22.1
20.9
°C/W
Fine Pitch Ball Grid Array (FBGA)
484
3.2
20.5
17.0
15.9
°C/W
Fine Pitch Ball Grid Array (FBGA)
676
3.2
16.4
13.0
12.0
°C/W
Fine Pitch Ball Grid Array (FBGA)
896
2.4
13.6
10.4
9.4
°C/W
Fine Pitch Ball Grid Array (FBGA)
12.0
8.9
7.9
°C/W
1152
1.8
1
Ceramic Quad Flat Pack (CQFP)
208
2.0
22
19.8
18.0
°C/W
Ceramic Quad Flat Pack (CQFP)1
352
2.0
17.9
16.1
14.7
°C/W
Ceramic Column Grid Array (CCGA)2
624
6.5
8.9
8.5
8
°C/W
Notes:
1. θjc for the 208-pin and 352-pin CQFP refers to the thermal resistance between the junction and the
bottom of the package.
2. θjc for the 624-pin CCGA refers to the thermal resistance between the junction and the top surface of the
package. Thermal resistance from junction to board (θjb) for CCGA 624 package is 3.4°C/W.
Timing Characteristics
Axcelerator devices are manufactured in a CMOS process, therefore, device performance varies
according to temperature, voltage, and process variations. Minimum timing parameters reflect maximum
operating voltage, minimum operating temperature, and best-case processing. Maximum timing
parameters reflect minimum operating voltage, maximum operating temperature, and worst-case
processing. The derating factors shown in Table 2-7 should be applied to all timing data contained within
this datasheet.
Table 2-7 • Temperature and Voltage Timing Derating Factors
(Normalized to Worst-Case Commercial, TJ = 70°C, VCCA = 1.425V)
Junction Temperature
VCCA
–55°C
–40°C
0°C
25°C
70°C
85°C
125°C
1.4 V
0.83
0.86
0.91
0.96
1.02
1.05
1.15
1.425 V
0.82
0.84
0.90
0.94
1.00
1.04
1.13
1.5 V
0.78
0.80
0.85
0.89
0.95
0.98
1.07
1.575 V
0.74
0.76
0.81
0.85
0.90
0.94
1.02
1.6 V
0.73
0.75
0.80
0.84
0.89
0.92
1.01
Notes:
1. The user can set the junction temperature in Designer software to be any integer value in the range of –
55°C to 175°C.
2. The user can set the core voltage in Designer software to be any value between 1.4V and 1.6V.
All timing numbers listed in this datasheet represent sample timing characteristics of Axcelerator devices.
Actual timing delay values are design-specific and can be derived from the Timer tool in Microsemi’s
Designer software after place-and-route.
R ev i si o n 1 8
2 -7
Detailed Specifications
Timing Model
I/O Module
(Nonregistered)
Carry Chain
Combinatorial
Cell
tPY = 2.24 ns
Combinatorial
Cell
I/O
LVPECL
FCO
+
LVPECL
tDP = 1.66 ns
tICKLQ = 0.67 ns
tSUD = 0.23 ns
tRD2 = 0.53 ns
Buffer
Module
I/O Module
(Nonregistered)
Combinatorial
Cell
Buffer
Module
LVTTL
Output Drive
Strength = 4 (24 mA)
High Slew Rate
tBFPD = 0.12 ns
tRD1 = 0.45 ns
tRD2 = 0.53 ns
tRD3 = 0.56 ns
Hardwired Clock
I/O Module
(Non- registered)
tPY = 2.99 ns
Y
tBFPD = 0.12 ns tPD = 0.74 ns
tHCKH = 3.03 ns
FMAX (external) = 350 MHz
FMAX (internal) = 870 MHz
I/O
tCCY = 0.61 ns
tPDC = 0.57 ns
I/O Module
(Registered)
Register Cell
Combinatorial
Cell
tRD1 = 0.45 ns
D
Q
Y
I/O Module
Register Cell
tRCO = 0.67 ns
tSUD = 0.23 ns
D Q
Buffer
Module
tIOCLKY = 0.67 ns
tSUD = 0.23 ns
D
Q
tBPFD = 0.12 ns
tPD = 0.74 ns
+
LVDS
tRCO = 0.67 ns
tSUD = 0.23 ns
tRCKL = 3.08 ns
FMAX (external) = 350 MHz
FMAX (internal) = 870 MHz
Routed Clock
tDP = 1.80 ns
Hardwired or
Routed Clock
tHCKL = 3.02 ns
tRCKL = 3.08 ns
Note: Worst case timing data for the AX1000, –2 speed grade
Figure 2-1 • Worst Case Timing Data
Hardwired Clock – Using LVTTL 24 mA High Slew Clock I/O
External Setup
= (tDP + tRD2 + tSUD) – tHCKL
= (1.72 + 0.53 + 0.23) – 3.02 = –0.54 ns
Clock-to-Out (Pad-to-Pad)
= tHCKL + tRCO + tRD1 + tPY
= 3.02 + 0.67 + 0.45 + 2.99 = 7.13 ns
Routed Clock – Using LVTTL 24 mA High Slew Clock I/O
External Setup
= (tDP + tRD2 + tSUD) – tRCKH
= (1.72 + 0.53 + 0.23) – 3.13 = –0.65 ns
Clock-to-Out (Pad-to-Pad)
= tRCKH + tRCO + tRD1 + tPY
= 3.13 + 0.67 + 0.45 + 3.03 = 7.24 ns
2- 8
R ev isio n 1 8
tPY = 1.13 ns
GTL + 3.3 V
Axcelerator Family FPGAs
I/O Specifications
Pin Descriptions
Supply Pins
GND
Ground
Low supply voltage.
VCCA
Supply Voltage
Supply voltage for array (1.5V). See "Operating Conditions" on page 2-1 for more information.
VCCIBx
Supply Voltage
Supply voltage for I/Os. Bx is the I/O Bank ID – 0 to 7. See "Operating Conditions" on page 2-1 for more
information.
VCCDA
Supply Voltage
Supply voltage for the I/O differential amplifier and JTAG and probe interfaces. See "Operating
Conditions" on page 2-1 for more information. VCCDA should be tied to 3.3V.
VCCPLA/B/C/D/E/F/G/H
Supply Voltage
PLL analog power supply (1.5V) for internal PLL. There are eight in each device. VCCPLA supports the
PLL associated with global resource HCLKA, VCCPLB supports the PLL associated with global resource
HCLKB, etc. The PLL analog power supply pins should be connected to 1.5V whether PLL is used or not.
VCOMPLA/B/C/D/E/F/G/H Supply Voltage
Compensation reference signals for internal PLL. There are eight in each device. VCOMPLA supports
the PLL associated with global resource HCLKA, VCOMPLE supports the PLL associated with global
resource CLKE, etc. (see Figure 2-2 on page 2-9 for correct external connection to the supply). The
VCOMPLX pins should be left floating if PLL is not used.
VPUMP
Supply Voltage (External Pump)
In the low power mode, VPUMP will be used to access an external charge pump (if the user desires to
bypass the internal charge pump to further reduce power). The device starts using the external charge
pump when the voltage level on VPUMP reaches VIH1. In normal device operation, when using the
internal charge pump, VPUMP should be tied to GND.
Axcelerator Chip
250 Ω
1.5 V Supply
VCCPLX
10 μf
0.1 μf
VCOMPLX
Figure 2-2 •
1.
VCCPLX and VCOMPLX Power Supply Connect
When VPUMP = VIH, it shuts off the internal charge pump. See "Low Power Mode" on page 2-106.
R ev i si o n 1 8
2 -9
Detailed Specifications
User-Defined Supply Pins
VREF
Supply Voltage
Reference voltage for I/O banks. VREF pins are configured by the user from regular I/O pins; VREF pins
are not in fixed locations. There can be one or more VREF pins in an I/O bank.
Global Pins
HCLKA/B/C/D
Dedicated (Hardwired) Clocks A, B, C and D
These pins are the clock inputs for sequential modules or north PLLs. Input levels are compatible with all
supported I/O standards. There is a P/N pin pair for support of differential I/O standards. Single-ended
clock I/Os can only be assigned to the P side of a paired I/O. This input is directly wired to each R-cell
and offers clock speeds independent of the number of R-cells being driven. When the HCLK pins are
unused, it is recommended that they are tied to ground.
CLKE/F/G/H
Routed Clocks E, F, G, and H
These pins are clock inputs for clock distribution networks or south PLLs. Input levels are compatible with
all supported I/O standards. There is a P/N pin pair for support of differential I/O standards. Single-ended
clock I/Os can only be assigned to the P side of a paired I/O. The clock input is buffered prior to clocking
the R-cells. When the CLK pins are unused, Microsemi recommends that they are tied to ground.
JTAG/Probe Pins
PRA/B/C/D
Probe A, B, C and D
The Probe pins are used to output data from any user-defined design node within the device (controlled
with Silicon Explorer II). These independent diagnostic pins can be used to allow real-time diagnostic
output of any signal path within the device. The pins’ probe capabilities can be permanently disabled to
protect programmed design confidentiality. The probe pins are of LVTTL output levels.
TCK
Test Clock
Test clock input for JTAG boundary-scan testing and diagnostic probe (Silicon Explorer II).
TDI
Test Data Input
Serial input for JTAG boundary-scan testing and diagnostic probe. TDI is equipped with an internal 10 kΩ
pull-up resistor.
TDO
Test Data Output
Serial output for JTAG boundary-scan testing.
TMS
Test Mode Select
The TMS pin controls the use of the IEEE 1149.1 boundary-scan pins (TCK, TDI, TDO, TRST). TMS is
equipped with an internal 10 kΩ pull-up resistor.
TRST
Boundary Scan Reset Pin
The TRST pin functions as an active-low input to asynchronously initialize or reset the boundary scan
circuit. The TRST pin is equipped with a 10 kΩ pull-up resistor.
Special Functions
LP
Low Power Pin
The LP pin controls the low power mode of Axcelerator devices. The device is placed in the low power
mode by connecting the LP pin to logic high. To exit the low power mode, the LP pin must be set Low.
Additionally, the LP pin must be set Low during chip powering-up or chip powering-down operations. See
"Low Power Mode" on page 2-106 for more details.
NC
No Connection
This pin is not connected to circuitry within the device. These pins can be driven to any voltage or can be
left floating with no effect on the operation of the device.
2- 10
R ev i sio n 1 8
Axcelerator Family FPGAs
User I/Os2
Introduction
The Axcelerator family features a flexible I/O structure, supporting a range of mixed voltages (1.5 V,
1.8 V, 2.5 V, and 3.3 V) with its bank-selectable I/Os. Table 2-8 on page 2-12 contains the I/O standards
supported by the Axcelerator family, and Table 2-10 on page 2-12 compares the features of the different
I/O standards.
Each I/O provides programmable slew rates, drive strengths, and weak pull-up and weak pull-down
circuits. The slew rate setting is effective for both rising and falling edges.
I/O standards, except 3.3 V PCI and 3.3 V PCI-X, are capable of hot insertion. 3.3 V PCI and 3.3 V PCIX are 5 V tolerant with the aid of an external resistor.
The input buffer has an optional user-configurable delay element. The element can reduce or eliminate
the hold time requirement for input signals registered within the I/O cell. The value for the delay is set on
a bank-wide basis. Note that the delay WILL be a function of process variations as well as temperature
and voltage changes.
Each I/O includes three registers: an input (InReg), an output (OutReg), and an enable register (EnReg).
I/Os are organized into banks, and there are eight banks per device—two per side (Figure 2-6 on
page 2-18). Each I/O bank has a common VCCI, the supply voltage for its I/Os.
For voltage-referenced I/Os, each bank also has a common reference-voltage bus, VREF. While VREF
must have a common voltage for an entire I/O bank, its location is user-selectable. In other words, any
user I/O in the bank can be selected to be a VREF.
The location of the VREF pin should be selected according to the following rules:
•
Any pin that is assigned as a VREF can control a maximum of eight user I/O pad locations in each
direction (16 total maximum) within the same I/O bank.
•
I/O pad locations listed as no connects are counted as part of the 16 maximum. In many cases,
this leads to fewer than eight user I/O package pins in each direction being controlled by a VREF
pin.
•
Dedicated I/O pins such as GND and VCCI are counted as part of the 16.
•
The two user I/O pads immediately adjacent on each side of the VREF pin (four in total) may only
be used as inputs. The exception is when there is a VCCI/GND pair separating the VREF pin and
the user I/O pad location.
•
The user does not need to assign VREF pins for OUTBUF and TRIBUF. VREF pins are needed
only for input and bidirectional I/Os.
The differential amplifier supply voltage VCCDA should be connected to 3.3 V.
A user can gain access to the various I/O standards in three ways:
•
Instantiate specific library macros that represent the desired specific standard.
•
Use generic I/O macros and then use Designer’s PinEditor to specify the desired I/O standards
(please note that this is not applicable to differential standards).
•
A combination of the first two methods.
Refer to the I/O Features in Axcelerator Family Devices application note and the Antifuse Macro Library
Guide for more details.
2.
Do not use an external resister to pull the I/O above VCCI for a higher logic “1” voltage level. The desired higher logic “1”
voltage level will be degraded due to a small I/O current, which exists when the I/O is pulled up above VCCI.
R ev i si o n 1 8
2- 11
Detailed Specifications
Table 2-8 • I/O Standards Supported by the Axcelerator Family
Input/Output Supply
Voltage (VCCI)
Input Reference
Voltage (VREF)
Board Termination
Voltage (VTT)
LVTTL
3.3
N/A
N/A
LVCMOS 2.5 V
2.5
N/A
N/A
LVCMOS 1.8 V
1.8
N/A
N/A
LVCMOS 1.5 V (JDEC8-11)
1.5
N/A
N/A
3.3V PCI/PCI-X
3.3
N/A
N/A
GTL+ 3.3 V
3.3
1.0
1.2
I/O Standard
GTL+ 2.5
V*
2.5
1.0
1.2
HSTL Class 1
1.5
0.75
0.75
SSTL3 Class 1 and II
3.3
1.5
1.5
SSTL2 Class1 and II
2.5
1.25
1.25
LVDS
2.5
N/A
N/A
LVPECL
3.3
N/A
N/A
Note: *2.5 V GTL+ is not supported across the full military temperature range.
Table 2-9 • Supply Voltages
VCCA
VCCI
Input Tolerance
Output Drive Level
1.5 V
1.5 V
3.3 V
1.5 V
1.5 V
1.8 V
3.3 V
1.8 V
1.5 V
2.5 V
3.3 V
2.5 V
1.5 V
3.3 V
3.3 V
3.3 V
Table 2-10 • I/O Features Comparison
I/O Assignment
LVTTL
Clamp
Diode
Hot
Insertion
5V
Tolerance
No
Yes
Yes1
Yes
1, 2
Input
Buffer
Enabled/Disabled
Enabled/Disabled
3.3 V PCI, 3.3 V PCI-X
Yes
No
LVCMOS 2.5 V
No
Yes
No
Enabled/Disabled
LVCMOS 1.8 V
No
Yes
No
Enabled/Disabled
LVCMOS 1.5 V (JESD8-11)
No
Yes
No
Enabled/Disabled
Voltage-Referenced Input Buffer
No
Yes
No
Differential, LVDS/LVPECL, Input
No
Yes
No
Enabled
Enabled/Disabled
Disabled3
Differential, LVDS/LVPECL, Output
No
Yes
No
Disabled
Enabled4
Notes:
1.
2.
3.
4.
2- 12
Output
Buffer
Can be implemented with an IDT bus switch.
Can be implemented with an external resistor.
The OE input of the output buffer must be deasserted permanently (handled by software).
The OE input of the output buffer must be asserted permanently (handled by software).
R ev i sio n 1 8
Axcelerator Family FPGAs
5 V Tolerance
There are two schemes to achieve 5 V tolerance:
1. 3.3 V PCI and 3.3 V PCI-X are the only I/O standards that directly allow 5 V tolerance. To
implement this, an internal clamp diode between the input pad and the VCCI pad is enabled so
that the voltage at the input pin is clamped, as shown in EQ 3:
Vinput = VCCI + Vdiode = 3.3 V + 0.7 V = 4.0 V
EQ 3
The internal VCCI clamp diode is only enabled while the device is powered on, so the voltage at the input
will not be clamped if the VCCI or VCCA are powered off. An external series resistor (~100 Ω) is required
between the input pin and the 5 V signal source to limit the current to less than 20 mA (Figure 2-3). The
100 Ω resistor was chosen to meet the input Tr/Tf requirement (Table 2-19 on page 2-21). The GND
clamp diode is available for all I/O standards and always enabled.
Non-Microsemi Part
5V
Mirosemi FPGA
3.3 V
3.3 V
VCCI
clamp
diode
Rext
Figure 2-3 •
GND
Clamp
Diode
Use of an External Resistor for 5 V Tolerance
2. 5 V tolerance can also be achieved with 3.3 V I/O standards (3.3 V PCI, 3.3 V PCI-X, and LVTTL)
using a bus-switch product (e.g. IDTQS32X2384). This will convert the 5 V signal to a 3.3 V signal
with minimum delay (Figure 2-4).
Figure 2-4 •
5V
3.3 V
20X
5V
3.3 V
Bus Switch IDTQS32X2384
Simultaneous Switching Outputs (SSO)
When multiple output drivers switch simultaneously, they induce a voltage drop in the chip/package
power distribution. This simultaneous switching momentarily raises the ground voltage within the device
relative to the system ground. This apparent shift in the ground potential to a non-zero value is known as
simultaneous switching noise (SSN) or more commonly, ground bounce.
SSN becomes more of an issue in high pin count packages and when using high performance devices
such as the Axcelerator family. Based upon testing, Microsemi recommends that users not exceed eight
simultaneous switching outputs (SSO) per each VCCI/GND pair. To ease this potential burden on
designers, Microsemi has designed all of the Axcelerator BGAs3 to not exceed this limit with the
exception of the CS180, which has an I/O to VCCI/GND pair ratio of nine to one.
Please refer to the Simultaneous Switching Noise and Signal Integrity application note for more
information.
3.
The user should note that in Bank 8 of both AX1000-FG484 and AX500-FG484, there are local violations of this 8:1 ratio.
R ev i si o n 1 8
2- 13
Detailed Specifications
I/O Banks and Compatibility
Since each I/O bank has its own user-assigned input reference voltage (VREF) and an input/output
supply voltage (VCCI), only I/Os with compatible standards can be assigned to the same bank.
Table 2-11 shows the compatible I/O standards for a common VREF (for voltage-referenced standards).
Similarly, Table 2-12 shows compatible standards for a common VCCI.
Table 2-11 • Compatible I/O Standards for Different VREF Values
VREF
Compatible Standards
1.5 V
SSTL 3 (Class I and II)
1.25 V
SSTL 2 (Class I and II)
1.0 V
GTL+ (2.5V and 3.3V Outputs)
0.75 V
HSTL (Class I)
Table 2-12 • Compatible I/O Standards for Different VCCI Values
VCCI1
3.3 V
Compatible Standards
LVTTL, PCI, PCI-X, LVPECL, GTL+ 3.3 V
1.0
3.3 V
SSTL 3 (Class I and II), LVTTL, PCI, LVPECL
1.5
2.5 V
LVCMOS 2.5 V, GTL+ 2.5 V, LVDS2
1.0
2.5 V
LVCMOS 2.5 V, SSTL 2 (Classes I and II), LVDS2
1.25
1.8 V
LVCMOS 1.8 V
N/A
1.5 V
LVCMOS 1.5 V, HSTL Class I
0.75
Notes:
1. VCCI is used for both inputs and outputs
2. VCCI tolerance is ±5%
2- 14
VREF
R ev i sio n 1 8
Axcelerator Family FPGAs
Table 2-13 summarizes the different combinations of voltages and I/O standards that can be used
together in the same I/O bank.
HSTL Class I (1. 5V)
SSTL2 Class I & II (2.5 V)
SSTL3 Class I & II (3.3 V)
LVDS (2.5 V)
–
–
3
3
–
–
–
–
–
3
LVTTL 3.3 V(VREF=1.5 V)
3
–
–
–
3
–
–
–
–
3
–
3
LVCMOS 2.5 V (VREF=1.0 V)
–
3
–
–
–
–
3
–
–
–
3
–
LVCMOS 2.5 V (VREF=1.25V)
–
3
–
–
–
–
–
–
3
–
3
–
LVCMOS1.8 V
–
–
3
–
–
–
–
–
–
–
–
–
LVCMOS1.5 V (VREF = 1.75 V) (JESD8-11)
–
–
–
3
–
–
–
3
–
–
–
–
3.3 V PCI/PCI-X (VREF = 1.0 V)
3
–
–
–
3
3
–
–
–
–
–
3
3.3 V PCI/PCI-X (VREF= 1.5 V)
3
–
–
–
3
–
–
–
–
3
–
3
GTL + (3.3 V)
3
–
–
–
3
3
–
–
–
–
–
3
GTL + (2.5 V)
–
3
–
–
–
–
3
–
–
–
–
–
HSTL Class I
–
–
–
3
–
–
–
3
–
–
–
–
SSTL2 Class I & II
–
3
–
–
–
–
–
–
3
–
3
–
SSTL3 Class I & II
3
–
–
–
3
–
–
–
–
3
–
3
LVDS (VREF = 1.0 V)
–
3
–
–
–
–
3
–
–
–
3
–
LVDS (VREF = 1.25 V)
–
3
–
–
–
–
–
–
3
–
3
–
LVPECL (VREF = 1.0 V)
3
–
–
–
3
3
–
–
–
–
–
3
LVPECL (VREF = 1.5 V)
3
–
–
–
3
–
–
–
–
3
–
3
LVPECL (3.3 V)
GTL + (2.5 V)
–
GTL + (3.3 V)
LVCMOS1.5 V (JESD8-11)
3
I/O Standard
3.3V PCI/PCI-X
LVCMOS1.8 V
LVTTL 3.3 V (VREF=1.0 V)
LVTTL 3.3 V
LVCMOS 2.5 V
Table 2-13 • Legal I/O Usage Matrix
Notes:
1. Note that GTL+ 2.5 V is not supported across the full military temperature range.
2. A "✓" indicates whether standards can be used within a bank at the same time.
Examples:
a) LVTTL can be used with 3.3V PCI and GTL+ (3.3V), when VREF = 1.0V (GTL+ requirement).
b) LVTTL can be used with 3.3V PCI and SSTL3 Class I and II, when VREF = 1.5V (SSTL3 requirement).
Note that two I/O standards are compatible if:
•
Their VCCI values are identical.
•
Their VREF standards are identical (if applicable).
For example, if LVTTL 3.3 V (VREF= 1.0 V) is used, then the other available (i.e. compatible) I/O
standards in the same bank are LVTTL 3.3 V PCI/PCI-X, GTL+, and LVPECL.
Also note that when multiple I/O standards are used within a bank, the voltage tolerance will be limited to
the minimum tolerance of all I/O standards used in the bank.
R ev i si o n 1 8
2- 15
Detailed Specifications
I/O Clusters
Each I/O cluster incorporates two I/O modules, four RX modules, two TX modules, and a buffer module.
In turn, each I/O module contains one Input Register (InReg), one Output Register (OutReg), and one
Enable Register (EnReg) (Figure 2-5).
I/O Cluster
Routed Input Track
EnReg
DIN YOUT
Routed Input Track
OEP
Routed Input Track
OutReg
DIN YOUT
Routed Input Track
UOP
Output Track
InReg
DCIN
Output Track
UIP
I/O
Slew Rate
Drive Strength
Programmable Delay
VREF
FPGA Logic Core
Y
BSR
P PAD
N PAD
EnReg
DIN YOUT
Routed Input Track
Routed Input Track
OutReg
DIN YOUT
Routed Input Track
InReg
DCIN
Output Track
Output Track
Y
Figure 2-5 •
OEN
UON
UIN
BSR
Routed Input Track
I/O
Slew Rate
Drive Strength
Programmable Delay
VREF
I/O Cluster Interface
Using an I/O Register
To access the I/O registers, registers must be instantiated in the netlist and then connected to the I/Os.
Usage of each I/O register (register combining) is individually controlled and can be selected/deselected
using the PinEditor tool in the Designer software. I/O register combining can also be controlled at the
device level, affecting all I/Os. Please note, the I/O register option is deselected by default in any given
design.4
In addition, Designer software provides a global option to enable/disable the usage of registers in the
I/Os. This option is design-specific. The setting for each individual I/O overrides this global option.
Furthermore, the global set fuse option in the Designer software, when checked, causes all I/O registers
to output logic High at device power-up.
4.
2- 16
Please note that register combining for multi fanout nets is not supported.
R ev i sio n 1 8
Axcelerator Family FPGAs
Using the Weak Pull-Up and Pull-Down Circuits
Each Axcelerator I/O comes with a weak pull-up/down circuit (on the order of 10 kΩ). These are weak
transistors with the gates tied on, so the on resistance of the transistor emulates a resistor. The weak
pull-up and pull-down is active only when the device is powered up, and they must be biased to be on.
When the rails are coming up, they are not biased fully, so they do not behave as resistors until the
voltage is at sufficient levels to bias the transistors. The key is they really are transistors; they are not
traces of poly silicon, which is another way to do an on-chip resistor (those take much more room). I/O
macros are provided for combinations of pull up/down for LVTTL, LVCMOS (2.5 V, 1.8 V, and 1.5 V)
standards. These macros can be instantiated if a keeper circuit for any input buffer is required.
Customizing the I/O
•
A five-bit programmable input delay element is associated with each I/O. The value of this delay is
set on a bank-wide basis (Table 2-14). It is optional for each input buffer within the bank (i.e. the
user can enable or disable the delay element for the I/O). When the input buffer drives a register
within the I/O, the delay element is activated by default to ensure a zero hold-time. The default
setting for this property can be set in Designer. When the input buffer does not drive a register, the
delay element is deactivated to provide higher performance. Again, this can be overridden by
changing the default setting for this property in Designer.
•
The slew-rate value for the LVTTL output buffer can be programmed and can be set to either slow
or fast.
•
The drive strength value for LVTTL output buffers can be programmed as well. There are four
different drive strength values – 8 mA, 12 mA, 16 mA, or 24 mA – that can be specified in
Designer.5
Table 2-14 • Bank-Wide Delay Values
Bits Setting
Delay (ns)
Bits Setting
Delay (ns)
0
0.54
16
2.01
1
0.65
17
2.13
2
0.71
18
2.19
3
0.83
19
2.3
4
0.9
20
2.38
5
1.01
21
2.49
6
1.08
22
2.55
7
1.19
23
2.67
8
1.27
24
2.75
9
1.39
25
2.87
10
1.45
26
2.93
11
1.56
27
3.04
12
1.64
28
3.12
13
1.75
29
3.23
14
1.81
30
3.29
15
1.93
31
3.41
Note: Delay values are approximate and will vary with process, temperature, and voltage.
5.
These values are minimum drive strengths.
R ev i si o n 1 8
2- 17
Detailed Specifications
Using the Differential I/O Standards
Differential I/O macros should be instantiated in the netlist. The settings for these I/O standards cannot
be changed inside Designer. Note that there are no tristated or bidirectional I/O buffers for differential
standards.
Using the Voltage-Referenced I/O Standards
Using these I/O standards is similar to that of single-ended I/O standards. Their settings can be changed
in Designer.
Using DDR (Double Data Rate)
In Double Data Rate mode, new data is present on every transition of the clock signal. Clock and data
lines have identical bandwidth and signal integrity requirements, making it very efficient for implementing
very high-speed systems.
To implement a DDR, users need to:
1. Instantiate an input buffer (with the required I/O standard)
2. Instantiate the DDR_REG macro (Figure 2-6)
3. Connect the output from the Input buffer to the input of the DDR macro
D
D
PSET
QR
QF
CLK
CLR
Figure 2-6 •
DDR Register
Macros for Specific I/O Standards
There are different macro types for any I/O standard or feature that determine the required VCCI and
VREF voltages for an I/O. The generic buffer macros require the LVTTL standard with slow slew rate and
24 mA-drive strength. LVTTL can support high slew rate but this should only be used for critical signals.
Most of the macro symbols represent variations of the six generic symbol types:
•
CLKBUF: Clock Buffer
•
HCLKBUF: Hardwired Clock Buffer
•
INBUF: Input Buffer
•
OUTBUF: Output Buffer
•
TRIBUF: Tristate Buffer
•
BIBUF: Bidirectional Buffer
Other macros include the following:
2- 18
•
Differential I/O standard macros: The LVDS and LVPECL macros either have a pair of differential
inputs (e.g. INBUF_LVDS) or a pair of differential outputs (e.g. OUTBUF_LVPECL).
•
Pull-up and pull-down variations of the INBUF, BIBUF, and TRIBUF macros. These are available
only with TTL and LVCMOS thresholds. They can be used to model the behavior of the pull-up
and pull-down resistors available in the architecture. Whenever an input pin is left unconnected,
the output pin will either go high or low rather than unknown. This allows users to leave inputs
unconnected without having the negative effect on simulation of propagating unknowns.
•
DDR_REG macro. It can be connected to any I/O standard input buffers (i.e. INBUF) to
implement a double data rate register. Designer software will map it to the I/O module in the same
way it maps the other registers to the I/O module.
R ev i sio n 1 8
Axcelerator Family FPGAs
Table 2-15, Table 2-16, and Table 2-17 list all the available macro names differentiated by I/O standard,
type, slew rate, and drive strength.
Table 2-15 • Macros for Single-Ended I/O Standards
Standard
VCCI
Macro Names
LVTTL
3.3 V
CLKBUF, HCLKBUF INBUF, OUTBUF,
OUTBUF_S_8, OUTBUF_S_12, OUTBUF_S_16, OUTBUF_S_24,
OUTBUF_H_8, OUTBUF_H_12, OUTBUF_H_16, OUTBUF_H_24,
TRIBUF, TRIBUF_S_8, TRIBUF_S_12, TRIBUF_S_16, TRIBUF_S_24,
TRIBUF_H_8, TRIBUF_H_12, TRIBUF_H_16, TRIBUF_H_24,
BIBUF, BIBUF_S_8, BIBUF_S_12, BIBUF_S_16, BIBUF_S_24,
BIBUF_H_8, BIBUF_H_12, BIBUF_H_16, BIBUF_H_24
3.3 V PCI
3.3 V
CLKBUF_PCI, HCLKBUF_PCI, INBUF_PCI, OUTBUF_PCI,
TRIBUF_PCI, BIBUF_PCI
3.3 V PCI-X
3.3 V
CLKBUF_PCI-X, HCLKBUF_PCI-X, INBUF_PCI-X, OUTBUF_PCI-X,
TRIBUF_PCI-X, BIBUF_PCI-X
LVCMOS25
2.5 V
CLKBUF_LVCMOS25, HCLKBUF_LVCMOS25, INBUF_LVCMOS25,
OUTBUF_LVCMOS25, TRIBUF_LVCMOS25, BIBUF_LVCMOS25
LVCMOS18
1.8 V
CLKBUF_LVCMOS18, HCLKBUF_LVCMOS18, INBUF_LVCMOS18,
OUTBUF_LVCMOS18, TRIBUF_LVCMOS18, BIBUF_LVCMOS18
LVCMOS15
(JESD8-11)
1.5 V
CLKBUF_LVCMOS15, HCLKBUF_LVCMOS15, INBUF_LVCMOS15,
OUTBUF_LVCMOS15, TRIBUF_LVCMOS15, BIBUF_LVCMOS15
Table 2-16 • I/O Macros for Differential I/O Standards
Standard
VCCI
Macro Names
LVPECL
3.3 V
CLKBUF_LVPECL, HCLKBUF_LVPECL, INBUF_LVPECL, OUTBUF_LVPECL
LVDS
2.5 V
CLKBUF_LVDS, HCLKBUF_LVDS, INBUF_LVDS, OUTBUF_LVDS
Table 2-17 • I/O Macros for Voltage-Referenced I/O Standards
Standard
VCCI
VREF
Macro Names
GTL+
3.3 V
1.0 V
CLKBUF_GTP33, HCLKBUF_GTP33, INBUF_GTP33,
OUTBUF_GTP33, TRIBUF_GTP33, BIBUF_GTP33
GTL+
2.5 V
1.0 V
CLKBUF_GTP25, HCLKBUF_GTP25, INBUF_GTP25,
OUTBUF_GTP25, TRIBUF_GTP25, BIBUF_GTP25
SSTL2 Class I
2.5 V
1.25 V CLKBUF_SSTL2_I, HCLKBUF_SSTL2_I, INBUF_SSTL2_I,
OUTBUF_SSTL2_I, TRIBUF_SSTL2_I, BIBUF_SSTL2_I
SSTL2 Class II
2.5 V
1.25 V CLKBUF_SSTL2_II, HCLKBUF_SSTL2_II, INBUF_SSTL2_II,
OUTBUF_SSTL2_II, TRIBUF_SSTL2_II, BIBUF_SSTL2_II
SSTL3 Class I
3.3 V
1.5 V
CLKBUF_SSTL3_I, HCLKBUF_SSTL3_I, INBUF_SSTL3_I,
OUTBUF_SSTL3_I, TRIBUF_SSTL3_I, BIBUF_SSTL3_I
SSTL3 Class II
3.3 V
1.5 V
CLKBUF_SSTL3_II, HCLKBUF_SSTL3_II, INBUF_SSTL3_II,
OUTBUF_SSTL3_II, TRIBUF_SSTL3_II, BIBUF_SSTL3_II
HSTL Class I
1.5 V
0.75 V CLKBUF_HSTL_I, HCLKBUF_HSTL_I, INBUF_HSTL_I,
OUTBUF_HSTL_I, TRIBUF_HSTL_I, BIBUF_HSTL_I
R ev i si o n 1 8
2- 19
Detailed Specifications
User I/O Naming Conventions
Due to the complex and flexible nature of the Axcelerator family’s user I/Os, a naming scheme is used to
show the details of the I/O. The naming scheme explains to which bank an I/O belongs, as well as the
pairing and pin polarity for differential I/Os (Figure 2-7).
GND
VCCDA
Corner2
I/O BANK 2
I/O BANK 1
VPUMP
GND
VCCA
GND
AX125
I/O BANK 6
VCCI6
GND
VCCA
GND
GND
VCCDA
Corner4
VCCI2
GND
VCCA
GND
Corner3
VCCI3
GND
VCCA
GND
GND
VCCDA
GND
VCCDA
VCCI4
GND
I/O Bank and Dedicated Pin Layout
IOxxXBxFx
Pair number in the
bank, starting at 00,
clockwise from IOB NW
P - Positive Pin/ N - Negative Pin
Bank I/D 0 through 7,
clockwise from IOB NW
Fx refers to an
unimplemented feature
and can be ignored.
Figure 2-8 •
I/O BANK 4
VCCA
GND
VCOMPLE
VCCPLE
VCOMPLF
VCCPLF
PRC
PRD
VCOMPLG
VCCPLG
VCOMPLH
VCCPLH
GND
VCCDA
VCCI5
GND
VCCA
GND
VCCDA
GND
Figure 2-7 •
I/O BANK 5
GND
VCCDA
GND
VCCDA
I/O BANK 3
VCCDA
GND
2- 20
VCCI1
I/O BANK 0
I/O BANK 7
VCCI7
GND
VCCA
GND
VCOMPLD
VCCPLD
VCOMPLC
VCCPLC
VCCDA
GND
VCOMPLB
VCCPLB
VCOMPLA
VCCPLA
Corner1
PRB
PRA
VCCI0
GND
VCCA
GND
TDO
TDI
TCK
TMS
TRST
LP
GND
VCCDA
Examples:
IO12PB1F1 is the positive pin of the thirteenth pair of the
first I/O bank (IOB NE). IO12PB1 combined
with IO12NB1 form a differential pair.
For those I/Os that can be employed
either as a user I/O or as a special
function, the following nomenclature
is used:
IOxxXBxFx/special_function_name
IOxxPB1Fx/xCLKx this pin can be configured as a clock
input or as a user I/O.
General Naming Schemes
R ev i sio n 1 8
Axcelerator Family FPGAs
I/O Standard Electrical Specifications
Table 2-18 • Input Capacitance
Symbol
Parameter
Conditions
Min.
Max.
Units
CIN
Input Capacitance
VIN = 0, f = 1.0 MHz
10
pF
CINCLK
Input Capacitance on HCLK and RCLK Pin
VIN = 0, f = 1.0 MHz
10
pF
Table 2-19 • I/O Input Rise Time and Fall Time*
Input Buffer
Input Rise/Fall Time (min.)
Input Rise/Fall Time (max.)
LVTTL
No Requirement
50 ns
LVCMOS 2.5V
No Requirement
50 ns
LVCMOS 1.8V
No Requirement
50 ns
LVCMOS 1.5V
No Requirement
50 ns
PCI
No Requirement
50 ns
PCIX
No Requirement
50 ns
GTL+
No Requirement
50 ns
HSTL
No Requirement
50 ns
SSTL2
No Requirement
50 ns
HSTL3
No Requirement
50 ns
LVDS
No Requirement
50 ns
LVPECL
No Requirement
50 ns
Note: *Input Rise/Fall time applies to all inputs, be it clock or data. Inputs have to ramp up/down linearly,
in a monotonic way. Glitches or a plateau may cause double clocking. They must be avoided. For
output rise/fall time, refer to the IBIS models for extraction.
IN
PAD
INBUF
Y
Input High
ln
VTRIP
VTRIP
0V
VCCA
GND
Figure 2-9 •
50%
50%
Y
tDP
tDP
(Rising)
(Falling)
Input Buffer Delays
R ev i si o n 1 8
2- 21
Detailed Specifications
TRIBUF
ln
OUT Pad
To AC Test Loads (shown below)
En
VCCA
ln
50%
VCCA
50%
GND
En
VCCA
50%
VTRIP
VTRIP
Out
50%
50%
GND
VTT
VTRIP
VOH
10%
tPY
tPY
(tDLH)
(tDHL)
VOL
tENZL
tENLZ
Figure 2-10 • Output Buffer Delays
2- 22
En
GND
VCCI / VTT
VOH
Out
VOL
50%
R ev i sio n 1 8
Out
GND / VTT
tENZH
VTRIP
90%
tENHZ
VTT
Axcelerator Family FPGAs
I/O Module Timing Characteristics
Output Register
D
E
Q
OutReg
Input Register
PRE/CLR
D
Q
InReg
E
Output Enable Register
PRE/CLR
D
E
Q
EnReg
PRE/CLR
CLK
(Routed or
Hardwired)
Figure 2-11 • Timing Model
D
tSUD
tHD
CLK
tCPWHL
tICLKQ
tCPWLH
Q
CLR
tHASYN
tREASYN
tWASYN
tCLR
tHASYN
tPRESET
tREASYN
tWASYN
PRESET
tSUE
tHE
E
Figure 2-12 • Input Register Timing Characteristics
R ev i si o n 1 8
2- 23
Detailed Specifications
D
tSUD
tHD
CLK
tCPWHL
tOCLKQ
tCPWLH
Q
CLR
tHASYN
tREASYN
tWASYN
tCLR
tPRESET
tHASYN
tREASYN
tHASYN
tREASYN
tWASYN
PRESET
tSUE
tHE
E
Figure 2-13 • Output Register Timing Characteristics
D
tSUD
tHD
CLK
tCPWHL
tOCLKQ
tCPWLH
Q
CLR
tHASYN
tREASYN
tWASYN
tCLR
tPRESET
tWASYN
PRESET
tSUE
tHE
E
Figure 2-14 • Output Enable Register Timing Characteristics
2- 24
R ev i sio n 1 8
Axcelerator Family FPGAs
3.3 V LVTTL
Low-Voltage Transistor-Transistor Logic is a general purpose standard (EIA/JESD) for 3.3 V applications.
It uses an LVTTL input buffer and push-pull output buffer.
Table 2-20 • DC Input and Output Levels
VIL
VIH
VOL
VOH
IOL
IOH
Min., V
Max., V
Min., V
Max., V
Max., V
Min., V
mA
mA
–0.3
0.8
2.0
3.6
0.4
2.4
24
–24
AC Loadings
R=1k
Test Point
for tpd
35 pF
Test Point
for tristate
R to VCCI for tplz / tpzl
R to GND for tphz / tpzh
35 pF for tpzh / tpzl
5 pF for tphz / tplz
Figure 2-15 • AC Test Loads
Table 2-21 • AC Waveforms, Measuring Points, and Capacitive Load
Input Low (V)
Input High (V)
Measuring Point* (V)
VREF (typ) (V)
Cload (pF)
0
3.0
1.40
N/A
35
Note: * Measuring Point = VTRIP
R ev i si o n 1 8
2- 25
Detailed Specifications
Timing Characteristics
Table 2-22 • 3.3 V LVTTL I/O Module
Worst-Case Commercial Conditions VCCA = 1.425 V, VCCI = 3.0 V, TJ = 70°C
–2 Speed
Parameter
Description
Min.
Max.
–1 Speed
Min.
Max.
Std Speed
Min.
Max. Units
LVTTL Output Drive Strength = 1 (8 mA) / Low Slew Rate
tDP
Input Buffer
1.68
1.92
2.26
ns
tPY
Output Buffer
14.28
16.27
19.13
ns
tENZL
Enable to Pad Delay through the Output Buffer—Z to
Low
15.25
17.37
20.42
ns
tENZH
Enable to Pad Delay through the Output Buffer—Z to
High
14.26
16.24
19.09
ns
tENLZ
Enable to Pad Delay through the Output Buffer—Low
to Z
1.56
1.57
1.58
ns
tENHZ
Enable to Pad Delay through the Output Buffer—High
to Z
1.95
1.96
1.97
ns
tIOCLKQ
Sequential Clock-to-Q for the I/O Input Register
0.67
0.77
0.90
ns
tIOCLKY
Clock-to-output Y for the I/O Output Register and the
I/O Enable Register
0.67
0.77
0.90
ns
tSUD
Data Input Set-Up
0.23
0.27
0.31
ns
tSUE
Enable Input Set-Up
0.26
0.30
0.35
ns
tHD
Data Input Hold
0.00
0.00
0.00
ns
tHE
Enable Input Hold
0.00
0.00
0.00
ns
tCPWHL
Clock Pulse Width High to Low
0.39
0.39
0.39
ns
tCPWLH
Clock Pulse Width Low to High
0.39
0.39
039
ns
tWASYN
Asynchronous Pulse Width
0.37
0.37
0.37
ns
tREASYN
Asynchronous Recovery Time
0.13
0.15
0.17
ns
tHASYN
Asynchronous Removal Time
0.00
0.00
0.00
ns
tCLR
Asynchronous Clear-to-Q
0.23
0.27
0.31
ns
tPRESET
Asynchronous Preset-to-Q
0.23
0.27
0.31
ns
2- 26
R ev i sio n 1 8
Axcelerator Family FPGAs
Table 2-22 • 3.3 V LVTTL I/O Module
Worst-Case Commercial Conditions VCCA = 1.425 V, VCCI = 3.0 V, TJ = 70°C (continued)
–2 Speed
Parameter
Description
Min.
Max.
–1 Speed
Min.
Max.
Std Speed
Min.
Max. Units
LVTTL Output Drive Strength = 2 (12 mA) / Low Slew Rate
tDP
Input Buffer
1.68
1.92
2.26
ns
tPY
Output Buffer
12.14
13.83
16.26
ns
tENZL
Enable to Pad Delay through the Output Buffer—Z to
Low
12.43
14.16
16.65
ns
tENZH
Enable to Pad Delay through the Output Buffer—Z to
High
12.17
13.86
16.30
ns
tENLZ
Enable to Pad Delay through the Output Buffer—Low
to Z
1.73
1.74
1.75
ns
tENHZ
Enable to Pad Delay through the Output Buffer—High
to Z
2.22
2.23
2.24
ns
tIOCLKQ
Sequential Clock-to-Q for the I/O Input Register
0.67
0.77
0.90
ns
tIOCLKY
Clock-to-output Y for the I/O Output Register and the
I/O Enable Register
0.67
0.77
0.90
ns
tSUD
Data Input Set-Up
0.23
0.27
0.31
ns
tSUE
Enable Input Set-Up
0.26
0.30
0.35
ns
tHD
Data Input Hold
0.00
0.00
0.00
ns
tHE
Enable Input Hold
0.00
0.00
0.00
ns
tCPWHL
Clock Pulse Width High to Low
0.39
0.39
0.38
ns
tCPWLH
Clock Pulse Width Low to High
0.39
0.39
0.39
ns
tWASYN
Asynchronous Pulse Width
0.37
0.37
0.37
ns
tREASYN
Asynchronous Recovery Time
0.13
0.15
0.17
ns
tHASYN
Asynchronous Removal Time
0.00
0.00
0.00
ns
tCLR
Asynchronous Clear-to-Q
0.23
0.27
0.31
ns
tPRESET
Asynchronous Preset-to-Q
0.23
0.27
0.31
ns
R ev i si o n 1 8
2- 27
Detailed Specifications
Table 2-22 • 3.3 V LVTTL I/O Module
Worst-Case Commercial Conditions VCCA = 1.425 V, VCCI = 3.0 V, TJ = 70°C (continued)
–2 Speed
Parameter
Description
Min.
Max.
–1 Speed
Min.
Max.
Std Speed
Min.
Max. Units
LVTTL Output Drive Strength =3 (16 mA) / Low Slew Rate
tDP
Input Buffer
1.68
1.92
2.26
ns
tPY
Output Buffer
11.03
12.56
14.77
ns
tENZL
Enable to Pad Delay through the Output Buffer—Z to
Low
11.42
13.01
15.29
ns
tENZH
Enable to Pad Delay through the Output Buffer—Z to
High
11.04
12.58
14.79
ns
tENLZ
Enable to Pad Delay through the Output Buffer—Low
to Z
1.86
1.88
1.88
ns
tENHZ
Enable to Pad Delay through the Output Buffer—High
to Z
2.50
2.51
2.52
ns
tIOCLKQ
Sequential Clock-to-Q for the I/O Input Register
0.67
0.77
0.90
ns
tIOCLKY
Clock-to-output Y for the I/O Output Register and the
I/O Enable Register
0.67
0.77
0.90
ns
tSUD
Data Input Set-Up
0.23
0.27
0.31
ns
tSUE
Enable Input Set-Up
0.26
0.30
0.35
ns
tHD
Data Input Hold
0.00
0.00
0.00
ns
tHE
Enable Input Hold
0.00
0.00
0.00
ns
tCPWHL
Clock Pulse Width High to Low
0.39
0.39
0.39
ns
tCPWLH
Clock Pulse Width Low to High
0.39
0.39
0.39
ns
tWASYN
Asynchronous Pulse Width
0.37
0.37
0.37
ns
tREASYN
Asynchronous Recovery Time
0.13
0.15
0.17
ns
tHASYN
Asynchronous Removal Time
0.00
0.00
0.00
ns
tCLR
Asynchronous Clear-to-Q
0.23
0.27
0.31
ns
tPRESET
Asynchronous Preset-to-Q
0.23
0.27
0.31
ns
2- 28
R ev i sio n 1 8
Axcelerator Family FPGAs
Table 2-22 • 3.3 V LVTTL I/O Module
Worst-Case Commercial Conditions VCCA = 1.425 V, VCCI = 3.0 V, TJ = 70°C (continued)
–2 Speed
Parameter
Description
Min.
Max.
–1 Speed
Min.
Max.
Std Speed
Min.
Max. Units
LVTTL Output Drive Strength = 4 (24 mA) / Low Slew Rate
tDP
Input Buffer
1.68
1.92
2.26
ns
tPY
Output Buffer
10.45
11.90
13.99
ns
tENZL
Enable to Pad Delay through the Output Buffer—Z to
Low
10.61
12.08
14.21
ns
tENZH
Enable to Pad Delay through the Output Buffer—Z to
High
10.47
11.93
14.02
ns
tENLZ
Enable to Pad Delay through the Output Buffer—Low
to Z
1.92
1.94
1.94
ns
tENHZ
Enable to Pad Delay through the Output Buffer—High
to Z
2.57
2.58
2.59
ns
tIOCLKQ
Sequential Clock-to-Q for the I/O Input Register
0.67
0.77
0.90
ns
tIOCLKY
Clock-to-output Y for the I/O Output Register and the
I/O Enable Register
0.67
0.77
0.90
ns
tSUD
Data Input Set-Up
0.23
0.27
0.31
ns
tSUE
Enable Input Set-Up
0.26
0.30
0.35
ns
tHD
Data Input Hold
0.00
0.00
0.00
ns
tHE
Enable Input Hold
0.00
0.00
0.00
ns
tCPWHL
Clock Pulse Width High to Low
0.39
0.39
0.39
ns
tCPWLH
Clock Pulse Width Low to High
0.39
0.39
0.39
ns
tWASYN
Asynchronous Pulse Width
0.37
0.37
0.37
ns
tREASYN
Asynchronous Recovery Time
0.13
0.15
0.17
ns
tHASYN
Asynchronous Removal Time
0.00
0.00
0.00
ns
tCLR
Asynchronous Clear-to-Q
0.23
0.27
0.31
ns
tPRESET
Asynchronous Preset-to-Q
0.23
0.27
0.31
ns
R ev i si o n 1 8
2- 29
Detailed Specifications
Table 2-22 • 3.3 V LVTTL I/O Module
Worst-Case Commercial Conditions VCCA = 1.425 V, VCCI = 3.0 V, TJ = 70°C (continued)
–2 Speed
Parameter
Description
Min.
Max.
–1 Speed
Min.
Max.
Std Speed
Min.
Max. Units
LVTTL Output Drive Strength = 1 (8 mA) / High Slew Rate
tDP
Input Buffer
1.68
1.92
2.26
ns
tPY
Output Buffer
4.23
4.81
5.66
ns
tENZL
Enable to Pad Delay through the Output Buffer—Z to
Low
4.64
5.28
6.21
ns
tENZH
Enable to Pad Delay through the Output Buffer—Z to
High
4.23
4.81
5.66
ns
tENLZ
Enable to Pad Delay through the Output Buffer—Low
to Z
1.89
1.91
1.91
ns
tENHZ
Enable to Pad Delay through the Output Buffer—High
to Z
2.01
2.02
2.03
ns
tIOCLKQ
Sequential Clock-to-Q for the I/O Input Register
0.67
0.77
0.90
ns
tIOCLKY
Clock-to-output Y for the I/O Output Register and the
I/O Enable Register
0.67
0.77
0.90
ns
tSUD
Data Input Set-Up
0.23
0.27
0.31
ns
tSUE
Enable Input Set-Up
0.26
0.30
0.35
ns
tHD
Data Input Hold
0.00
0.00
0.00
ns
tHE
Enable Input Hold
0.00
0.00
0.00
ns
tCPWHL
Clock Pulse Width High to Low
0.39
0.39
0.39
ns
tCPWLH
Clock Pulse Width Low to High
0.39
0.39
0.39
ns
tWASYN
Asynchronous Pulse Width
0.37
0.37
0.37
ns
tREASYN
Asynchronous Recovery Time
0.13
0.15
0.17
ns
tHASYN
Asynchronous Removal Time
0.00
0.00
0.00
ns
tCLR
Asynchronous Clear-to-Q
0.23
0.27
0.31
ns
tPRESET
Asynchronous Preset-to-Q
0.23
0.27
0.31
ns
2- 30
R ev i sio n 1 8
Axcelerator Family FPGAs
Table 2-22 • 3.3 V LVTTL I/O Module
Worst-Case Commercial Conditions VCCA = 1.425 V, VCCI = 3.0 V, TJ = 70°C (continued)
–2 Speed
Parameter
Description
Min.
Max.
–1 Speed
Min.
Max.
Std Speed
Min.
Max. Units
LVTTL Output Drive Strength = 2 (12 mA) / High Slew Rate
tDP
Input Buffer
1.68
1.92
2.26
ns
tPY
Output Buffer
3.30
3.76
4.42
ns
tENZL
Enable to Pad Delay through the Output Buffer—Z to
Low
3.74
4.26
5.00
ns
tENZH
Enable to Pad Delay through the Output Buffer—Z to
High
3.06
3.49
4.10
ns
tENLZ
Enable to Pad Delay through the Output Buffer—Low
to Z
1.89
1.91
1.91
ns
tENHZ
Enable to Pad Delay through the Output Buffer—High
to Z
2.29
2.30
2.31
ns
tIOCLKQ
Sequential Clock-to-Q for the I/O Input Register
0.67
0.77
0.90
ns
tIOCLKY
Clock-to-output Y for the I/O Output Register and the
I/O Enable Register
0.67
0.77
0.90
ns
tSUD
Data Input Set-Up
0.23
0.27
0.31
ns
tSUE
Enable Input Set-Up
0.26
0.30
0.35
ns
tHD
Data Input Hold
0.00
0.00
0.00
ns
tHE
Enable Input Hold
0.00
0.00
0.00
ns
tCPWHL
Clock Pulse Width High to Low
0.39
0.39
0.39
ns
tCPWLH
Clock Pulse Width Low to High
0.39
0.39
0.39
ns
tWASYN
Asynchronous Pulse Width
0.37
0.37
0.37
ns
tREASYN
Asynchronous Recovery Time
0.13
0.15
0.17
ns
tHASYN
Asynchronous Removal Time
0.00
0.00
0.00
ns
tCLR
Asynchronous Clear-to-Q
0.23
0.27
0.31
ns
tPRESET
Asynchronous Preset-to-Q
0.23
0.27
0.31
ns
R ev i si o n 1 8
2- 31
Detailed Specifications
Table 2-22 • 3.3 V LVTTL I/O Module
Worst-Case Commercial Conditions VCCA = 1.425 V, VCCI = 3.0 V, TJ = 70°C (continued)
–2 Speed
Parameter
Description
Min.
Max.
–1 Speed
Min.
Max.
Std Speed
Min.
Max. Units
LVTTL Output Drive Strength =3 (16 mA) / High Slew Rate
tDP
Input Buffer
1.68
1.92
2.26
ns
tPY
Output Buffer
3.12
3.56
4.18
ns
tENZL
Enable to Pad Delay through the Output Buffer—Z to
Low
3.54
4.04
4.75
ns
tENZH
Enable to Pad Delay through the Output Buffer—Z to
High
2.78
3.17
3.72
ns
tENLZ
Enable to Pad Delay through the Output Buffer—Low
to Z
1.91
1.93
1.93
ns
tENHZ
Enable to Pad Delay through the Output Buffer—High
to Z
2.58
2.59
2.60
ns
tIOCLKQ
Sequential Clock-to-Q for the I/O Input Register
0.67
0.77
0.90
ns
tIOCLKY
Clock-to-output Y for the I/O Output Register and the
I/O Enable Register
0.67
0.77
0.90
ns
tSUD
Data Input Set-Up
0.23
0.27
0.31
ns
tSUE
Enable Input Set-Up
0.26
0.30
0.35
ns
tHD
Data Input Hold
0.00
0.00
0.00
ns
tHE
Enable Input Hold
0.00
0.00
0.00
ns
tCPWHL
Clock Pulse Width High to Low
0.39
0.39
0.39
ns
tCPWLH
Clock Pulse Width Low to High
0.39
0.39
0.39
ns
tWASYN
Asynchronous Pulse Width
0.37
0.37
0.37
ns
tREASYN
Asynchronous Recovery Time
0.13
0.15
0.17
ns
tHASYN
Asynchronous Removal Time
0.00
0.00
0.00
ns
tCLR
Asynchronous Clear-to-Q
0.23
0.27
0.31
ns
tPRESET
Asynchronous Preset-to-Q
0.23
0.27
0.31
ns
2- 32
R ev i sio n 1 8
Axcelerator Family FPGAs
Table 2-22 • 3.3 V LVTTL I/O Module
Worst-Case Commercial Conditions VCCA = 1.425 V, VCCI = 3.0 V, TJ = 70°C (continued)
–2 Speed
Parameter
Description
Min.
Max.
–1 Speed
Min.
Max.
Std Speed
Min.
Max. Units
LVTTL Output Drive Strength = 4 (24mA) / High Slew Rate
tDP
Input Buffer
1.68
1.92
2.26
ns
tPY
Output Buffer
2.99
3.41
4.01
ns
tENZL
Enable to Pad Delay through the Output Buffer—Z to
Low
2.49
2.51
2.51
ns
tENZH
Enable to Pad Delay through the Output Buffer—Z to
High
2.59
2.95
3.46
ns
tENLZ
Enable to Pad Delay through the Output Buffer—Low
to Z
1.91
1.93
1.93
ns
tENHZ
Enable to Pad Delay through the Output Buffer—High
to Z
3.56
4.06
4.77
ns
tIOCLKQ
Sequential Clock-to-Q for the I/O Input Register
0.67
0.77
0.90
ns
tIOCLKY
Clock-to-output Y for the I/O Output Register and the
I/O Enable Register
0.67
0.77
0.90
ns
tSUD
Data Input Set-Up
0.23
0.27
0.31
ns
tSUE
Enable Input Set-Up
0.26
0.30
0.35
ns
tHD
Data Input Hold
0.00
0.00
0.00
ns
tHE
Enable Input Hold
0.00
0.00
0.00
ns
tCPWHL
Clock Pulse Width High to Low
0.39
0.39
0.39
ns
tCPWLH
Clock Pulse Width Low to High
0.39
0.39
0.39
ns
tWASYN
Asynchronous Pulse Width
0.37
0.37
0.37
ns
tREASYN
Asynchronous Recovery Time
0.13
0.15
0.17
ns
tHASYN
Asynchronous Removal Time
0.00
0.00
0.00
ns
tCLR
Asynchronous Clear-to-Q
0.23
0.27
0.31
ns
tPRESET
Asynchronous Preset-to-Q
0.23
0.27
0.31
ns
R ev i si o n 1 8
2- 33
Detailed Specifications
2.5 V LVCMOS
Low-Voltage Complementary Metal-Oxide Semiconductor for 2.5 V is an extension of the LVCMOS
standard (JESD8-5) used for general-purpose 2.5 V applications. It uses a 3.3 V tolerant CMOS input
buffer and a push-pull output buffer.
Table 2-23 • DC Input and Output Levels
VOL
VOH
IOL
IOH
Min., V
VIL
Max., V
Min., V
VIH
Max., V
Max., V
Min., V
mA
mA
-0.3
0.7
1.7
3.6
0.4
2.0
12
–12
AC Loadings
R=1k
Test Point
for tpd
35 pF
Test Point
for tristate
R to VCCI for tplz / tpzl
R to GND for tphz / tpzh
35 pF for tpzh / tpzl
5 pF for tphz / tplz
Figure 2-16 • AC Test Loads
Table 2-24 • AC Waveforms, Measuring Points, and Capacitive Loads
Input Low (V)
Input High (V)
Measuring Point* (V)
VREF (typ) (V)
Cload (pF)
0
2.5
1.25
N/A
35
Note: * Measuring Point = VTRIP
2- 34
R ev i sio n 1 8
Axcelerator Family FPGAs
Timing Characteristics
Table 2-25 • 2.5V LVCMOS I/O Module
Worst-Case Commercial Conditions VCCA = 1.425 V, VCCI = 2.3 V, TJ = 70°C
–2 Speed
Parameter
Description
Min.
Max.
–1 Speed
Min.
Max.
Std Speed
Min.
Max.
Units
LVCMOS25 I/O Module Timing
tDP
Input Buffer
1.95
2.22
2.61
ns
tPY
Output Buffer
3.29
3.74
4.40
ns
tENZL
Enable to Pad Delay through the Output
Buffer—Z to Low
2.48
2.50
2.51
ns
tENZH
Enable to Pad Delay through the Output
Buffer—Z to High
2.48
2.50
2.51
ns
tENLZ
Enable to Pad Delay through the Output
Buffer—Low to Z
5.74
6.54
7.69
ns
tENHZ
Enable to Pad Delay through the Output
Buffer—High to Z
6.60
7.51
8.83
ns
tIOCLKQ
Sequential Clock-to-Q for the I/O Input
Register
0.67
0.77
0.90
ns
tIOCLKY
Clock-to-output Y for the I/O Output Register
and the I/O Enable Register
0.67
0.77
0.90
ns
tSUD
Data Input Set-Up
0.23
0.27
0.31
ns
tSUE
Enable Input Set-Up
0.26
0.30
0.35
ns
tHD
Data Input Hold
0.00
0.00
0.00
ns
tHE
Enable Input Hold
0.00
0.00
0.00
ns
tCPWHL
Clock Pulse Width High to Low
0.39
0.39
0.39
ns
tCPWLH
Clock Pulse Width Low to High
0.39
0.39
0.39
ns
tWASYN
Asynchronous Pulse Width
0.37
0.37
0.37
ns
tREASYN
Asynchronous Recovery Time
0.13
0.15
0.17
ns
tHASYN
Asynchronous Removal Time
0.00
0.00
0.00
ns
tCLR
Asynchronous Clear-to-Q
0.23
0.27
0.31
ns
tPRESET
Asynchronous Preset-to-Q
0.23
0.27
0.31
ns
R ev i si o n 1 8
2- 35
Detailed Specifications
1.8 V LVCMOS
Low-Voltage Complementary Metal-Oxide Semiconductor for 1.8 V is an extension of the LVCMOS
standard (JESD8-5) used for general-purpose 1.8 V applications. It uses a 3.3 V tolerant CMOS input
buffer and a push-pull output buffer.
Table 2-26 • DC Input and Output Levels
VOL
VOH
IOL
IOH
Min., V
VIL
Max., V
Min., V
VIH
Max., V
Max., V
Min., V
mA
mA
–0.3
0.2 VCCI
0.7 VCCI
3.6
0.2
VCCI – 0.2
8 mA
–8 mA
AC Loadings
R=1k
Test Point
for tpd
35 pF
Test Point
for tristate
R to VCCI for tplz / tpzl
R to GND for tphz / tpzh
35 pF for tpzh / tpzl
5 pF for tphz / tplz
Figure 2-17 • AC Test Loads
Table 2-27 • AC Waveforms, Measuring Points, and Capacitive Loads
Input Low (V)
Input High (V)
Measuring Point* (V)
VREF (typ) (V)
Cload (pF)
0
1.8
0.5 VCCI
N/A
35
Note: * Measuring Point = VTRIP
2- 36
R ev i sio n 1 8
Axcelerator Family FPGAs
Timing Characteristics
Table 2-28 • 1.8V LVCMOS I/O Module
Worst-Case Commercial Conditions VCCA = 1.425 V, VCCI = 1.7 V, TJ = 70°C
–2 Speed
Parameter
Description
Min.
Max.
–1 Speed
Min.
Max.
Std Speed
Min.
Max.
Units
LVCMOS18 Output Module Timing
tDP
Input Buffer
3.26
3.71
4.37
ns
tPY
Output Buffer
4.55
5.18
6.09
ns
tENZL
Enable to Pad Delay through the Output
Buffer—Z to Low
2.82
2.83
2.84
ns
tENZH
Enable to Pad Delay through the Output
Buffer—Z to High
3.43
3.45
3.46
ns
tENLZ
Enable to Pad Delay through the Output
Buffer—Low to Z
6.01
6.85
8.05
ns
tENHZ
Enable to Pad Delay through the Output
Buffer—High to Z
6.73
7.67
9.01
ns
tIOCLKQ
Sequential Clock-to-Q for the I/O Input
Register
0.67
0.77
0.90
ns
tIOCLKY
Clock-to-output Y for the I/O Output
Register and the I/O Enable Register
0.67
0.77
0.90
ns
tSUD
Data Input Set-Up
0.23
0.27
0.31
ns
tSUE
Enable Input Set-Up
0.26
0.30
0.35
ns
tHD
Data Input Hold
0.00
0.00
0.00
ns
tHE
Enable Input Hold
0.00
0.00
0.00
ns
tCPWHL
Clock Pulse Width High to Low
0.39
0.39
0.39
ns
tCPWLH
Clock Pulse Width Low to High
0.39
0.39
0.39
ns
tWASYN
Asynchronous Pulse Width
0.37
0.37
0.37
ns
tREASYN
Asynchronous Recovery Time
tHASYN
Asynchronous Removal Time
0.00
0.00
0.00
ns
tCLR
Asynchronous Clear-to-Q
0.23
0.27
0.31
ns
tPRESET
Asynchronous Preset-to-Q
0.23
0.27
0.31
ns
0.13
R ev i si o n 1 8
0.15
0.17
ns
2- 37
Detailed Specifications
1.5 V LVCMOS (JESD8-11)
Low-Voltage Complementary Metal-Oxide Semiconductor for 1.5 V is an extension of the LVCMOS
standard (JESD8-5) used for general-purpose 1.5 V applications. It uses a 3.3 V tolerant CMOS input
buffer and a push-pull output buffer.
Table 2-29 • DC Input and Output Levels
VOL
VOH
IOL
IOH
Min., V
VIL
Max., V
Min., V
VIH
Max., V
Max., V
Min., V
mA
mA
–0.3
0.35 VCCI
0.65 VCCI
3.6
0.4
VCCI – 0.4
8 mA
–8 mA
AC Loadings
R=1k
Test Point
for tpd
35 pF
Test Point
for tristate
R to VCCI for tplz / tpzl
R to GND for tphz / tpzh
35 pF for tpzh / tpzl
5 pF for tphz / tplz
Table 2-30 • AC Test Loads
Table 2-31 • AC Waveforms, Measuring Points, and Capacitive Loads
Input Low (V)
Input High (V)
Measuring Point* (V)
VREF (typ) (V)
Cload (pF)
0
1.5
0.5VCCI
N/A
35
Note: * Measuring Point = VTRIP
2- 38
R ev i sio n 1 8
Axcelerator Family FPGAs
Timing Characteristics
Table 2-32 • 1.5V LVCMOS I/O Module
Worst-Case Commercial Conditions VCCA = 1.425 V, VCCI = 1.4 V, TJ = 70°C
–2 Speed
Parameter
Description
Min.
Max.
–1 Speed
Min.
Max.
Std Speed
Min.
Max.
Units
LVCMOS15 (JESD8-11) I/O Module Timing
tDP
Input Buffer
3.59
4.09
4.81
ns
tPY
Output Buffer
6.05
6.89
8.10
ns
tENZL
Enable to Pad Delay through the Output
Buffer—Z to Low
3.31
3.34
3.34
ns
tENZH
Enable to Pad Delay through the Output
Buffer—Z to High
4.56
4.58
4.59
ns
tENLZ
Enable to Pad Delay through the Output
Buffer—Low to Z
6.37
7.25
8.52
ns
tENHZ
Enable to Pad Delay through the Output
Buffer—High to Z
6.94
7.90
9.29
ns
tIOCLKQ
Sequential Clock-to-Q for the I/O Input
Register
0.67
0.77
0.90
ns
tIOCLKY
Clock-to-output Y for the I/O Output
Register and the I/O Enable Register
0.67
0.77
0.90
ns
tSUD
Data Input Set-Up
0.23
0.27
0.31
ns
tSUE
Enable Input Set-Up
0.26
0.30
0.35
ns
tHD
Data Input Hold
0.00
0.00
0.00
ns
tHE
Enable Input Hold
0.00
0.00
0.00
ns
tCPWHL
Clock Pulse Width High to Low
0.39
0.39
0.39
ns
tCPWLH
Clock Pulse Width Low to High
0.39
0.39
0.39
ns
tWASYN
Asynchronous Pulse Width
0.37
0.37
0.37
ns
tREASYN
Asynchronous Recovery Time
0.13
0.15
0.17
ns
tHASYN
Asynchronous Removal Time
0.00
0.00
0.00
ns
tCLR
Asynchronous Clear-to-Q
0.23
0.27
0.31
ns
tPRESET
Asynchronous Preset-to-Q
0.23
0.27
0.31
ns
R ev i si o n 1 8
2- 39
Detailed Specifications
3.3 V PCI, 3.3 V PCI-X
Peripheral Component Interface for 3.3 V standard specifies support for both 33 MHz and 66 MHz PCI
bus applications. It uses an LVTTL input buffer and a push-pull output buffer. The input and output buffers
are 5 V tolerant with the aid of external components. Axcelerator 3.3 V PCI and 3.3 V PCI-X buffers are
compliant with the PCI Local Bus Specification Rev. 2.1.
The PCI Compliance Specification requires the clamp diodes to be able to withstand for 11 ns, –3.5 V in
undershoot, and 7.1 V in overshoot.
Table 2-33 • DC Input and Output Levels
VIL
VIH
VOL
VOH
IOL
IOH
Max., V
Min., V
mA
mA
Min., V
Max., V
Min., V
Max., V
PCI
–0.3
0.3 VCCI
0.5 VCCI
VCCI + 0.5
(per PCI specification)
PCI-X
–0.5
0.35 VCCI
0.5 VCCI
VCCI + 0.5
(per PCI specification)
AC Loadings
R = 1k
R to VCCI for tplz / tpzl
R to GND for tphz / tpzh
Test Point
for tristate
R = 25
R to VCCI for tpl
R to GND for tph
Test point for data
10 pF
35 pF for tpzl / tpzh
5 pF for tphz / tplz
GND
Figure 2-18 • AC Test Loads
Table 2-34 • AC Waveforms, Measuring Points, and Capacitive Loads
Input Low (V)
Input High (V)
Measuring Point* (V)
(Per PCI Spec and PCI-X Spec)
Note: * Measuring Point = VTRIP
2- 40
R ev i sio n 1 8
VREF (typ) (V)
Cload (pF)
N/A
10
Axcelerator Family FPGAs
Timing Characteristics
Table 2-35 • 3.3 V PCI I/O Module
Worst-Case Commercial Conditions VCCA = 1.425 V, VCCI = 3.0 V, TJ = 70°C
–2 Speed
Parameter
Description
Min.
Max.
–1 Speed
Min.
Max.
Std Speed
Min.
Max.
Units
3.3 V PCI Output Module Timing
tDP
Input Buffer
1.57
1.79
2.10
ns
tPY
Output Buffer
1.91
2.18
2.56
ns
tENZL
Enable to Pad Delay through the Output
Buffer—Z to Low
1.61
1.62
1.63
ns
tENZH
Enable to Pad Delay through the Output
Buffer—Z to High
1.45
1.47
1.47
ns
tENLZ
Enable to Pad Delay through the Output
Buffer—Low to Z
2.55
2.90
3.41
ns
tENHZ
Enable to Pad Delay through the Output
Buffer—High to Z
3.52
4.01
4.72
ns
tIOCLKQ
Sequential
Register
Input
0.67
0.77
0.90
ns
tIOCLKY
Clock-to-output Y for the I/O Output Register
and the I/O Enable Register
0.67
0.77
0.90
ns
tSUD
Data Input Set-Up
0.23
0.27
0.31
ns
tSUE
Enable Input Set-Up
0.26
0.30
0.35
ns
tHD
Data Input Hold
0.00
0.00
0.00
ns
tHE
Enable Input Hold
0.00
0.00
0.00
ns
tCPWHL
Clock Pulse Width High to Low
0.39
0.39
0.39
ns
tCPWLH
Clock Pulse Width Low to High
0.39
0.39
0.39
ns
tWASYN
Asynchronous Pulse Width
0.37
0.37
0.37
ns
tREASYN
Asynchronous Recovery Time
0.13
0.15
0.17
ns
tHASYN
Asynchronous Removal Time
0.00
0.00
0.00
ns
tCLR
Asynchronous Clear-to-Q
0.23
0.27
0.31
tPRESET
Asynchronous Preset-to-Q
0.23
0.27
0.31
Clock-to-Q
for
the
I/O
R ev i si o n 1 8
ns
2- 41
Detailed Specifications
Table 2-36 • 3.3 V PCI-X I/O Module
Worst-Case Commercial Conditions VCCA = 1.425 V, VCCI = 3.0 V, TJ = 70°C
–2 Speed
Parameter
Description
Min.
Max.
–1 Speed
Min.
Max.
Std Speed
Min.
Max.
Units
3.3 V PCI-X Output Module Timing
tDP
Input Buffer
1.57
1.79
2.10
ns
tPY
Output Buffer
2.10
2.40
2.82
ns
tENZL
Enable to Pad Delay through the Output
Buffer—Z to Low
1.61
1.62
1.63
ns
tENZH
Enable to Pad Delay through the Output
Buffer—Z to High
1.59
1.60
1.61
ns
tENLZ
Enable to Pad Delay through the Output
Buffer—Low to Z
2.65
3.02
3.55
ns
tENHZ
Enable to Pad Delay through the Output
Buffer—High to Z
3.11
3.55
4.17
ns
tIOCLKQ
Sequential Clock-to-Q for the I/O Input
Register
0.67
0.77
0.90
ns
tIOCLKY
Clock-to-output Y for the I/O Output
Register and the I/O Enable Register
0.67
0.77
0.90
ns
tSUD
Data Input Set-Up
0.23
0.27
0.31
ns
tSUE
Enable Input Set-Up
0.26
0.30
0.35
ns
tHD
Data Input Hold
0.00
0.00
0.00
ns
tHE
Enable Input Hold
0.00
0.00
0.00
ns
tCPWHL
Clock Pulse Width High to Low
0.39
0.39
0.39
ns
tCPWLH
Clock Pulse Width Low to High
0.39
0.39
0.39
ns
tWASYN
Asynchronous Pulse Width
0.37
0.37
0.37
ns
tREASYN
Asynchronous Recovery Time
0.13
0.15
0.17
ns
tHASYN
Asynchronous Removal Time
0.00
0.00
0.00
ns
tCLR
Asynchronous Clear-to-Q
0.23
0.27
0.31
ns
tPRESET
Asynchronous Preset-to-Q
0.23
0.27
0.31
ns
2- 42
R ev i sio n 1 8
Axcelerator Family FPGAs
Voltage-Referenced I/O Standards
GTL+
Gunning Transceiver Logic Plus is a high-speed bus standard (JESD8-3). It requires a differential
amplifier input buffer and an Open Drain output buffer. The VCCI pin should be connected to 2.5 V or
3.3 V. Note that 2.5 V GTL+ is not supported across the full military temperature range.
Table 2-37 • DC Input and Output Levels
VIL
VIH
VOL
VOH
IOL
IOH
Min., V
Max., V
Min., V
Max., V
Max., V
Min., V
mA
mA
N/A
VREF – 0.1
VREF + 0.1
N/A
0.6
NA
NA
NA
AC Loadings
VTT
25
Test Point
10 pF
Figure 2-19 • AC Test Loads
Table 2-38 • AC Waveforms, Measuring Points, and Capacitive Loads
Input Low (V)
Input High (V)
Measuring Point* (V)
VREF (typ) (V)
Cload (pF)
VREF – 0.2
VREF + 0.2
VREF
1.0
10
Note: * Measuring Point = VTRIP
Timing Characteristics
Table 2-39 • 2.5 V GTL+ I/O Module
Worst-Case Commercial Conditions VCCA = 1.425 V, VCCI = 2.3 V, TJ = 70°C
–2 Speed
Parameter
Description
Min.
Max.
–1 Speed
Min.
Max.
Std Speed
Min.
Max.
Units
2.5 V GTL+ I/O Module Timing
tDP
Input Buffer
1.71
1.95
2.29
ns
tPY
Output Buffer
1.13
1.29
1.52
ns
tICLKQ
Clock-to-Q for the I/O input register
0.67
0.77
0.90
ns
tOCLKQ
Clock-to-Q for the I/O output register and
the I/O enable register
0.67
0.77
0.90
ns
tSUD
Data Input Set-Up
0.23
0.27
0.31
ns
tSUE
Enable Input Set-Up
0.26
0.30
0.35
ns
tHD
Data Input Hold
0.00
0.00
0.00
ns
tHE
Enable Input Hold
0.00
ns
tCPWHL
Clock Pulse Width High to Low
tCPWLH
Clock Pulse Width Low to High
tWASYN
Asynchronous Pulse Width
tREASYN
Asynchronous Recovery Time
0.13
0.15
0.17
ns
tHASYN
Asynchronous Removal Time
0.00
0.00
0.00
ns
tCLR
Asynchronous Clear-to-Q
0.23
0.27
0.31
ns
tPRESET
Asynchronous Preset-to-Q
0.23
0.27
0.31
ns
0.00
0.39
0.00
0.39
0.39
ns
0.39
0.39
0.39
ns
0.37
0.37
0.37
ns
R ev i si o n 1 8
2- 43
Detailed Specifications
Table 2-40 • 3.3 V GTL+ I/O Module
Worst-Case Commercial Conditions VCCA = 1.425 V, VCCI = 3.0 V, TJ = 70°C
–2 Speed
Parameter
Description
Min.
Max.
–1 Speed
Min.
Max.
Std Speed
Min.
Max.
Units
3.3 V GTL+I/O Module Timing
tDP
Input Buffer
1.71
1.95
2.29
ns
tPY
Output Buffer
1.13
1.29
1.52
ns
tICLKQ
Clock-to-Q for the I/O input register
0.67
0.77
0.90
ns
tOCLKQ
Clock-to-Q for the I/O output register and
the I/O enable register
0.67
0.77
0.90
ns
tSUD
Data Input Set-Up
0.23
0.27
0.31
ns
tSUE
Enable Input Set-Up
0.26
0.30
0.35
ns
tHD
Data Input Hold
0.00
0.00
0.00
ns
tHE
Enable Input Hold
0.00
0.00
0.00
ns
tCPWHL
Clock Pulse Width High to Low
0.39
0.39
0.39
ns
tCPWLH
Clock Pulse Width Low to High
0.39
0.39
0.39
ns
tWASYN
Asynchronous Pulse Width
0.37
0.37
0.37
ns
tREASYN
Asynchronous Recovery Time
0.13
0.15
0.17
ns
tHASYN
Asynchronous Removal Time
0.00
0.00
0.00
ns
tCLR
Asynchronous Clear-to-Q
0.23
0.27
0.31
ns
tPRESET
Asynchronous Preset-to-Q
0.23
0.27
0.31
ns
2- 44
R ev i sio n 1 8
Axcelerator Family FPGAs
HSTL Class I
High-Speed Transceiver Logic is a general-purpose high-speed 1.5 V bus standard (EIA/JESD8-6). The
Axcelerator devices support Class I. This requires a differential amplifier input buffer and a push-pull
output buffer.
Table 2-41 • DC Input and Output Levels
VIL
VIH
VOL
VOH
IOL
IOH
Min., V
Max., V
Min., V
Max., V
Max., V
Min., V
mA
mA
-0.3
VREF – 0.1
VREF + 0.1
3.6
0.4
VCC – 0.4
8
-8
AC Loadings
VTT
50
Test Point
20 pF
Figure 2-20 • AC Test Loads
Table 2-42 • AC Waveforms, Measuring Points, and Capacitive Loads
Input Low (V)
Input High (V)
Measuring Point* (V)
VREF (typ) (V)
Cload (pF)
VREF –0.5
VREF + 0.5
VREF
0.75
20
Note: * Measuring Point = VTRIP
Timing Characteristics
Table 2-43 • 1.5 V HSTL Class I I/O Module
Worst-Case Commercial Conditions VCCA = 1.425 V, VCCI = 1.425 V, TJ = 70°C
–2 Speed
Parameter
Description
Min.
Max.
–1 Speed
Min.
Max.
Std Speed
Min.
Max.
Units
1.5 V HSTL Class I I/O Module Timing
tDP
Input Buffer
1.80
2.05
2.41
ns
tPY
Output Buffer
4.90
5.58
6.56
ns
tICLKQ
Clock-to-Q for the I/O input register
0.67
0.77
0.90
ns
tOCLKQ
Clock-to-Q for the I/O output register
and the I/O enable register
0.67
0.77
0.90
ns
tSUD
Data Input Set-Up
0.23
0.27
0.31
ns
tSUE
Enable Input Set-Up
0.26
0.30
0.35
ns
tHD
Data Input Hold
0.00
0.00
0.00
ns
tHE
Enable Input Hold
0.00
0.00
0.00
ns
tCPWHL
Clock Pulse Width High to Low
0.39
0.39
0.39
ns
tCPWLH
Clock Pulse Width Low to High
0.39
0.39
0.39
ns
tWASYN
Asynchronous Pulse Width
0.37
0.37
0.37
ns
tREASYN
Asynchronous Recovery Time
0.13
0.15
0.17
ns
tHASYN
Asynchronous Removal Time
0.00
0.00
0.00
ns
tCLR
Asynchronous Clear-to-Q
0.23
0.27
0.31
ns
tPRESET
Asynchronous Preset-to-Q
0.23
0.27
0.31
ns
R ev i si o n 1 8
2- 45
Detailed Specifications
SSTL2
Stub Series Terminated Logic for 2.5 V is a general-purpose 2.5 V memory bus standard (JESD8-9). The
Axcelerator devices support both classes of this standard. This requires a differential amplifier input
buffer and a push-pull output buffer.
Class I
Table 2-44 • DC Input and Output Levels
VOL
VOH
IOL
Min., V
VIL
Max., V
Min., V
VIH
Max., V
Max., V
Min., V
mA
IOH
mA
–0.3
VREF – 0.2
VREF + 0.2
3.6
VREF – 0.57
VREF + 0.57
7.6
–7.6
AC Loadings
VTT
50
Test Point
25
30 pF
Figure 2-21 • AC Test Loads
Table 2-45 • AC Waveforms, Measuring Points, and Capacitive Loads
Input Low (V)
Input High (V)
Measuring Point* (V)
VREF (typ) (V)
Cload (pF)
VREF – 0.75
VREF + 0.75
VREF
1.25
30
Note: * Measuring Point = VTRIP
Timing Characteristics
Table 2-46 • 2.5 V SSTL2 Class I I/O Module
Worst-Case Commercial Conditions VCCA = 1.425 V, VCCI = 2.3 V, TJ = 70°C
–2 Speed
Parameter
Description
Min.
Max.
–1 Speed
Min.
Max.
Std Speed
Min.
Max.
Units
2.5 V SSTL2 Class I I/O Module Timing
tDP
Input Buffer
1.83
2.08
2.45
ns
tPY
Output Buffer
2.39
2.72
3.20
ns
tICLKQ
Clock-to-Q for the I/O input register
0.67
0.77
0.90
ns
tOCLKQ
Clock-to-Q for the I/O output register
and the I/O enable register
0.67
0.77
0.90
ns
tSUD
Data Input Set-Up
0.23
0.27
0.31
ns
tSUE
Enable Input Set-Up
0.26
0.30
0.35
ns
tHD
Data Input Hold
0.00
0.00
0.00
ns
tHE
Enable Input Hold
0.00
ns
tCPWHL
Clock Pulse Width High to Low
0.39
0.39
0.39
ns
tCPWLH
Clock Pulse Width Low to High
0.39
0.39
0.39
ns
tWASYN
Asynchronous Pulse Width
0.37
tREASYN
Asynchronous Recovery Time
0.13
0.15
0.17
ns
tHASYN
Asynchronous Removal Time
0.00
0.00
0.00
ns
tCLR
Asynchronous Clear-to-Q
0.23
0.27
0.31
ns
tPRESET
Asynchronous Preset-to-Q
0.23
0.27
0.31
ns
2- 46
0.00
0.00
0.37
R ev i sio n 1 8
0.37
ns
Axcelerator Family FPGAs
Class II
Table 2-47 • DC Input and Output Levels
VIL
VIH
VOL
VOH
IOL
IOH
Min., V
Max., V
Min., V
Max., V
Max., V
Min,. V
mA
mA
-0.3
VREF – 0.2
VREF + 0.2
3.6
VREF – 0.8
VREF + 0.8
15.2
-15.2
AC Loadings
VTT
25
Test Point
25
30 pF
Figure 2-22 • AC Test Loads
Table 2-48 • AC Waveforms, Measuring Points, and Capacitive Loads
Input Low (V)
Input High (V)
Measuring Point* (V)
VREF (typ) (V)
Cload (pF)
VREF – 0.75
VREF + 0.75
VREF
1.25
30
Note: * Measuring Point = Vtrip
Timing Characteristics
Table 2-49 • 2.5 V SSTL2 Class II I/O Module
Worst-Case Commercial Conditions VCCA = 1.425 V, VCCI = 2.3 V, TJ = 70°C
–2 Speed
Parameter
Description
Min.
Max.
–1 Speed
Min.
Max.
Std Speed
Min.
Max.
Units
2.5 V SSTL2 Class II I/O Module Timing
tDP
Input Buffer
1.89
2.16
2.53
ns
tPY
Output Buffer
2.39
2.72
3.20
ns
tICLKQ
Clock-to-Q for the I/O input register
0.67
0.77
0.90
ns
tOCLKQ
Clock-to-Q for the I/O output register and
the I/O enable register
0.67
0.77
0.90
ns
tSUD
Data Input Set-Up
0.23
0.27
0.31
ns
tSUE
Enable Input Set-Up
0.26
0.30
0.35
ns
tHD
Data Input Hold
0.00
0.00
0.00
ns
tHE
Enable Input Hold
tCPWHL
Clock Pulse Width High to Low
0.39
0.39
0.39
ns
tCPWLH
Clock Pulse Width Low to High
0.39
0.39
0.39
ns
tWASYN
Asynchronous Pulse Width
0.37
0.37
0.37
ns
tREASYN
Asynchronous Recovery Time
0.13
0.15
0.17
ns
tHASYN
Asynchronous Removal Time
0.00
0.00
0.00
ns
tCLR
Asynchronous Clear-to-Q
0.23
0.27
0.31
ns
tPRESET
Asynchronous Preset-to-Q
0.23
0.27
0.31
ns
0.00
R ev i si o n 1 8
0.00
0.00
ns
2- 47
Detailed Specifications
SSTL3
Stub Series Terminated Logic for 3.3 V is a general-purpose 3.3 V memory bus standard (JESD8-8). The
Axcelerator devices support both classes of this standard. This requires a differential amplifier input
buffer and a push-pull output buffer.
Class I
Table 2-50 • DC Input and Output Levels
VOL
VOH
IOL
IOH
Min., V
VIL
Max., V
Min., V
VIH
Max., V
Max., V
Min., V
mA
mA
-0.3
VREF – 0.2
VREF +0.2
3.6
VREF – 0.6
VREF + 0.6
8
–8
AC Loadings
VTT
50
Test Point
25
30 pF
Figure 2-23 • AC Test Loads
Table 2-51 • AC Waveforms, Measuring Points, and Capacitive Loads
Input Low (V)
Input High (V)
Measuring Point* (V)
VREF (typ) (V)
Cload (pF)
VREF – 1.0
VREF + 1.0
VREF
1.50
30
Note: *Measuring Point = VTRIP
Timing Characteristics
Table 2-52 • 3.3 V SSTL3 Class I I/O Module
Worst-Case Commercial Conditions VCCA = 1.425 V, VCCI = 3.0 V, TJ = 70°C
–2 Speed
Parameter
Description
Min.
Max.
–1 Speed
Min.
Max.
Std Speed
Min.
Max.
Units
3.3 V SSTL3 Class I I/O Module Timing
tDP
Input Buffer
1.78
2.03
2.39
ns
tPY
Output Buffer
2.17
2.47
2.91
ns
tICLKQ
Clock-to-Q for the I/O input register
0.67
0.77
0.90
ns
tOCLKQ
Clock-to-Q for the I/O output register and
the I/O enable register
0.67
0.77
0.90
ns
tSUD
Data Input Set-Up
0.23
0.27
0.31
ns
tSUE
Enable Input Set-Up
0.26
0.30
0.35
ns
tHD
Data Input Hold
0.00
0.00
0.00
ns
tHE
Enable Input Hold
tCPWHL
Clock Pulse Width High to Low
tCPWLH
Clock Pulse Width Low to High
tWASYN
Asynchronous Pulse Width
tREASYN
Asynchronous Recovery Time
0.13
0.15
0.17
ns
tHASYN
Asynchronous Removal Time
0.00
0.00
0.00
ns
tCLR
Asynchronous Clear-to-Q
0.23
0.27
0.31
ns
tPRESET
Asynchronous Preset-to-Q
0.23
0.27
0.31
ns
2- 48
0.00
0.39
0.00
0.00
ns
0.39
0.39
ns
0.39
0.39
0.39
ns
0.37
0.37
0.37
ns
R ev i sio n 1 8
Axcelerator Family FPGAs
Class II
Table 2-53 • DC Input and Output Levels
VIL
VIH
VOL
VOH
IOL
IOH
Min., V
Max., V
Min., V
Max., V
Max., V
Min., V
mA
mA
-0.3
VREF – 0.2
VREF + 0.2
3.6
VREF – 0.8
VREF + 0.8
16
–16
AC Loadings
VTT
25
Test Point
25
30 pF
Figure 2-24 • AC Test Loads
Table 2-54 • AC Waveforms, Measuring Points, and Capacitive Loads
Input Low (V)
Input High (V)
Measuring Point* (V)
VREF (typ) (V)
Cload (pF)
VREF – 1.0
VREF + 1.0
VREF
1.50
30
Note: * Measuring Point = VTRIP
Timing Characteristics
Table 2-55 • 3.3 V SSTL3 Class II I/O Module
Worst-Case Commercial Conditions VCCA = 1.425 V, VCCI = 3.0V, TJ = 70°C
–2 Speed
Parameter
Description
Min.
Max.
–1 Speed
Min.
Max.
Std Speed
Min.
Max.
Units
3.3 V SSTL3 Class II I/O Module Timing
tDP
Input Buffer
1.85
2.10
2.47
ns
tPY
Output Buffer
2.17
2.47
2.91
ns
tICLKQ
Clock-to-Q for the I/O input register
0.67
0.77
0.90
ns
tOCLKQ
Clock-to-Q for the I/O output register
and the I/O enable register
0.67
0.77
0.90
ns
tSUD
Data Input Set-Up
0.23
0.27
0.31
ns
tSUE
Enable Input Set-Up
0.26
0.30
0.35
ns
tHD
Data Input Hold
0.00
0.00
0.00
ns
tHE
Enable Input Hold
0.00
ns
tCPWHL
Clock Pulse Width High to Low
0.39
0.39
0.39
ns
tCPWLH
Clock Pulse Width Low to High
0.39
0.39
0.39
ns
tWASYN
Asynchronous Pulse Width
0.37
0.37
0.37
ns
tREASYN
Asynchronous Recovery Time
0.13
0.15
0.17
ns
tHASYN
Asynchronous Removal Time
0.00
0.00
0.00
ns
tCLR
Asynchronous Clear-to-Q
0.23
0.27
0.31
ns
tPRESET
Asynchronous Preset-to-Q
0.23
0.27
0.31
ns
0.00
R ev i si o n 1 8
0.00
2- 49
Detailed Specifications
Differential Standards
Physical Implementation
Implementing differential I/O standards requires the configuration of a pair of external I/O pads, resulting
in a single internal signal. To facilitate construction of the differential pair, a single I/O Cluster contains the
resources for a pair of I/Os. Configuration of the I/O Cluster as a differential pair is handled by Designer
software when the user instantiates a differential I/O macro in the design.
Differential I/Os can also be used in conjunction with the embedded Input Register (InReg), Output
Register (OutReg), Enable Register (EnReg), and Double Data Rate (DDR). However, there is no
support for bidirectional I/Os or tristates with these standards.
LVDS
Low-Voltage Differential Signal (ANSI/TIA/EIA-644) is a high-speed, differential I/O standard. It requires
that one data bit is carried through two signal lines, so two pins are needed. It also requires an external
resistor termination. The voltage swing between these two signal lines is approximately 350 mV.
OUTBUF_LVDS
FPGA
P
165 Ω
FPGA
P
ZO = 50 Ω
INBUF_LVDS
+
100 Ω
140 Ω
–
165 Ω
N
ZO = 50 Ω
N
Figure 2-25 • LVDS Board-Level Implementation
The LVDS circuit consists of a differential driver connected to a terminated receiver through a constantimpedance transmission line. The receiver is a wide-common-mode-range differential amplifier. The
common-mode range is from 0.2 V to 2.2 V for a differential input with 400 mV swing.
To implement the driver for the LVDS circuit, drivers from two adjacent I/O cells are used to generate the
differential signals (note that the driver is not a current-mode driver). This driver provides a nominal
constant current of 3.5 mA. When this current flows through a 100 Ω termination resistor on the receiver
side, a voltage swing of 350 mV is developed across the resistor. The direction of the current flow is
controlled by the data fed to the driver.
An external-resistor network (three resistors) is needed to reduce the voltage swing to about 350 mV.
Therefore, four external resistors are required, three for the driver and one for the receiver.
Table 2-56 • DC Input and Output Levels
DC Parameter
Min.
Typ.
Max.
Units
Supply Voltage
2.375
2.5
2.625
V
VOH
Output High Voltage
1.25
1.425
1.6
V
VOL
Output Low Voltage
0.9
1.075
1.25
V
VODIFF
Differential Output Voltage
250
350
450
mV
VOCM
Output Common Mode Voltage
1.125
1.25
1.375
V
VICM2
Input Common Mode Voltage
0.2
1.25
2.2
V
VCCI
1
Description
Notes:
1. ±5%
2. Differential input voltage = ±350 mV.
2- 50
R ev i sio n 1 8
Axcelerator Family FPGAs
Table 2-57 • AC Waveforms, Measuring Points, and Capacitive Loads
Input Low (V)
Input High (V)
Measuring Point* (V)
1.2 – 0.125
1.2 + 0.125
1.2
Note: * Measuring Point = VTRIP
Timing Characteristics
Table 2-58 • LVDS I/O Module
Worst-Case Commercial Conditions VCCA = 1.425 V, VCCI = 2.3 V, TJ = 70°C
–2 Speed
Parameter
Description
Min.
Max.
–1 Speed
Min.
Max.
Std Speed
Min.
Max.
Units
LVDS Output Module Timing
tDP
Input Buffer
1.80
2.05
2.41
ns
tPY
Output Buffer
2.32
2.64
3.11
ns
tICLKQ
Clock-to-Q for the I/O input register
0.67
0.77
0.90
ns
tOCLKQ
Clock-to-Q for the I/O output register and
the I/O enable register
0.67
0.77
0.90
ns
tSUD
Data Input Set-Up
0.23
0.27
0.31
ns
tSUE
Enable Input Set-Up
0.26
0.30
0.35
ns
tHD
Data Input Hold
0.00
0.00
0.00
ns
tHE
Enable Input Hold
0.00
0.00
0.00
ns
tCPWHL
Clock Pulse Width High to Low
0.39
0.39
0.39
ns
tCPWLH
Clock Pulse Width Low to High
0.39
0.39
0.39
ns
tWASYN
Asynchronous Pulse Width
0.37
0.37
0.37
ns
tREASYN
Asynchronous Recovery Time
0.13
0.15
0.17
ns
tHASYN
Asynchronous Removal Time
0.00
0.00
0.00
ns
tCLR
Asynchronous Clear-to-Q
0.23
0.27
0.31
ns
tPRESET
Asynchronous Preset-to-Q
0.23
0.27
0.31
ns
R ev i si o n 1 8
2- 51
Detailed Specifications
LVPECL
Low-Voltage Positive Emitter-Coupled Logic (LVPECL) is another differential I/O standard. It requires
that one data bit is carried through two signal lines. Like LVDS, two pins are needed. It also requires
external resistor termination. The voltage swing between these two signal lines is approximately 850 mV.
FPGA
OUTBUF_LVPECL
P
100 Ω
ZO = 50 Ω
N
+
100 Ω
187Ω
ZO = 50 Ω
100 Ω
FPGA
P
INBUF_LVPECL
–
N
Figure 2-26 • LVPECL Board-Level Implementation
The LVPECL circuit is similar to the LVDS scheme. It requires four external resistors, three for the driver
and one for the receiver. The values for the three driver resistors are different from that of LVDS since the
output voltage levels are different. Please note that the VOH levels are 200 mV below the standard
LVPECL levels.
Table 2-59 • DC Input and Output Levels
Min.
DC Parameter
Min.
VCCI
Typ.
Max.
Min.
3
Max.
Max.
Min.
3.3
Max.
3.6
Units
V
VOH
1.8
2.11
1.92
2.28
2.13
2.41
V
VOL
0.96
1.27
1.06
1.43
1.3
1.57
V
VIH
1.49
2.72
1.49
2.72
1.49
2.72
V
VIL
0.86
2.125
0.86
2.125
0.86
2.125
V
Differential Input
Voltage
0.3
0.3
0.3
V
Table 2-60 • AC Waveforms, Measuring Points, and Capacitive Loads
Input Low (V)
Input High (V)
Measuring Point* (V)
1.6 – 0.3
1.6 + 0.3
1.6
Note: * Measuring Point = VTRIP
2- 52
R ev i sio n 1 8
Axcelerator Family FPGAs
Timing Characteristics
Table 2-61 • LVPECL I/O Module
Worst-Case Commercial Conditions VCCA = 1.425 V, VCCI = 3.0 V, TJ = 70°C
–2 Speed
Parameter
Description
Min.
Max.
–1 Speed
Min.
Max.
Std Speed
Min.
Max.
Units
LVPECL Output Module Timing
tDP
Input Buffer
1.66
1.89
2.22
ns
tPY
Output Buffer
2.24
2.55
3.00
ns
tICLKQ
Clock-to-Q for the I/O input register
0.67
0.77
0.90
ns
tOCLKQ
Clock-to-Q for the IO output register and
the I/O enable register
0.67
0.77
0.90
ns
tSUD
Data Input Set-Up
0.23
0.27
0.31
ns
tSUE
Enable Input Set-Up
0.26
0.30
0.35
ns
tHD
Data Input Hold
0.00
0.00
0.00
ns
tHE
Enable Input Hold
0.00
0.00
0.00
ns
tCPWHL
Clock Pulse Width High to Low
0.39
0.39
0.39
ns
tCPWLH
Clock Pulse Width Low to High
0.39
0.39
0.39
ns
tWASYN
Asynchronous Pulse Width
0.37
0.37
0.37
ns
tREASYN
Asynchronous Recovery Time
0.13
0.15
0.17
ns
tHASYN
Asynchronous Removal Time
0.00
0.00
0.00
ns
tCLR
Asynchronous Clear-to-Q
0.23
0.27
0.31
ns
tPRESET
Asynchronous Preset-to-Q
0.23
0.27
0.31
ns
R ev i si o n 1 8
2- 53
Detailed Specifications
Module Specifications
C-Cell
Introduction
The C-cell is one of the two logic module types in the AX architecture. It is the combinatorial logic
resource in the Axcelerator device. The AX architecture implements a new combinatorial cell that is an
extension of the C-cell implemented in the SX-A family. The main enhancement of the new C-cell is the
addition of carry-chain logic.
The C-cell can be used in a carry-chain mode to construct arithmetic functions. If carry-chain logic is not
required, it can be disabled.
The C-cell features the following (Figure 2-27):
•
Eight-input MUX (data: D0-D3, select: A0, A1, B0, B1). User signals can be routed to any one of
these inputs. Any of the C-cell inputs (D0-D3, A0, A1, B0, B1) can be tied to one of the four routed
clocks (CLKE/F/G/H).
•
Inverter (DB input) can be used to drive a complement signal of any of the inputs to the C-cell.
•
A carry input and a carry output. The carry input signal of the C-cell is the carry output from the Ccell directly to the north.
•
Carry connect for carry-chain logic with a signal propagation time of less than 0.1 ns.
•
A hardwired connection (direct connect) to the adjacent R-cell (Register Cell) for all C-cells on the
east side of a SuperCluster with a signal propagation time of less than 0.1 ns.
This layout of the C-cell (and the C-cell Cluster) enables the implementation of over 4,000 functions of up
to five bits. For example, two C-cells can be used together to implement a four-input XOR function in a
single cell delay.
The carry-chain configuration is handled automatically for the user with Microsemi's extensive macro
library (please see the Antifuse Macro Library Guide for a complete listing of available Axcelerator
macros).
CFN FCI
D1 D3 B0 B1
0
1
0
1
0
1
0 1
0
1
D0 D2
DB
A0
A1
Figure 2-27 • C-Cell
2- 54
R ev i sio n 1 8
FCO Y
Axcelerator Family FPGAs
Timing Model and Waveforms
VCCA
50%
50%
A, B, D, FCI
GND
VCCA
50%
Y, FCO
GND
50%
tPD, tPDC
tPD, tPDC
VCCA
Y, FCO
50%
50%
GND
tPD, tPDC
tPD, tPDC
Figure 2-28 • C-Cell Timing Model and Waveforms
Timing Characteristics
Table 2-62 • C-Cell
Worst-Case Commercial Conditions VCCA = 1.425 V, VCCI = 3.0 V, TJ = 70°C
–2 Speed
Parameter
Description
Min.
Max.
–1 Speed
Min.
Max.
Std Speed
Min.
Max.
Units
C-Cell Propagation Delays
tPD
Any input to output Y
0.74
0.84
0.99
ns
tPDC
Any input to carry chain output (FCO)
0.57
0.64
0.76
ns
tPDB
Any input through DB when one input is used
0.95
1.09
1.28
ns
tCCY
Input to carry chain (FCI) to Y
0.61
0.69
0.82
ns
tCC
Input to carry chain (FCI) to carry chain output
(FCO)
0.08
0.09
0.11
ns
R ev i si o n 1 8
2- 55
Detailed Specifications
Carry-Chain Logic
The Axcelerator dedicated carry-chain logic offers a very compact solution for implementing arithmetic
functions without sacrificing performance.
To implement the carry-chain logic, two C-cells in a Cluster are connected together so the FCO (i.e. carry
out) for the two bits is generated in a carry look-ahead scheme to achieve minimum propagation delay
from the FCI (i.e. carry in) into the two-bit Cluster. The two-bit carry logic is shown in Figure 2-29.
The FCI of one C-cell pair is driven by the FCO of the C-cell pair immediately above it. Similarly, the FCO
of one C-cell pair, drives the FCI input of the C-cell pair immediately below it (Figure 1-4 on page 1-3 and
Figure 2-30 on page 2-57).
The carry-chain logic is selected via the CFN input. When carry logic is not required, this signal is
deasserted to save power. Again, this configuration is handled automatically for the user through
Microsemi's macro library.
CFN
D1
D3
B0
B1
0
1
0
1
DCOUT
0
1
0
1
0
1
0
1
0
1
0
1
FCI
D1
D3
B0
B1
CFN
The signal propagation delay between two C-cells in the carry-chain sequence is 0.1 ns.
2- 56
R ev i sio n 1 8
A1
A0
DB
D0
D2
Y
Figure 2-29 • Axcelerator’s Two-Bit Carry Logic
0
1
FCO
Y
0
1
A1
A0
DB
D0
D2
0
1
Axcelerator Family FPGAs
FCI1
C-cell1
C-cell2
DCOUT
R-cell1
DCIN
FCO2
FCI3
DCOUT
DCIN
FCO4
FCI5
n-2
Clusters
FCI(2n-1)
C-cell
(2n-1)
C-cell2n
DCOUT
R-celln
CDIN
FCO2n
Note: The carry-chain sequence can end on either C-cell.
Figure 2-30 • Carry-Chain Sequencing of C-Cells
Timing Characteristics
Refer to Table 2-62 on page 2-55 for more information on carry-chain timing.
R ev i si o n 1 8
2- 57
Detailed Specifications
R-Cell
Introduction
The R-cell, the sequential logic resource of the Axcelerator devices, is the second logic module type in
the AX family architecture. It includes clock inputs for all eight global resources of the Axcelerator
architecture as well as global presets and clears (Figure 2-31).
The main features of the R-cell include the following:
•
Direct connection to the adjacent logic module through the hardwired connection DCIN. DCIN is
driven by the DCOUT of an adjacent C-cell via the Direct-Connect routing resource, providing a
connection with less than 0.1 ns of routing delay.
•
The R-cell can be used as a standalone flip-flop. It can be driven by any C-cell or I/O modules
through the regular routing structure (using DIN as a routable data input). This gives the option of
using the R-Cell as a 2:1 MUXed flip-flop as well.
•
Provision of data enable-input (S0).
•
Independent active-low asynchronous clear (CLR).
•
Independent active-low asynchronous preset (PSET). If both CLR and PSET are low, CLR has
higher priority.
•
Clock can be driven by any of the following (CKP selects clock polarity):
•
–
One of the four high performance hardwired fast clocks (HCLKs)
–
One of the four routed clocks (CLKs)
–
User signals
Global power-on clear (GCLR) and preset (GPSET), which drive each flip-flop on a chip-wide
basis.
–
When the Global Set Fuse option in the Designer software is unchecked (by default),
GCLR = 0 and GPSET = 1 at device power-up. When the option is checked, GCLR = 1 and
GPSET = 0. Both pins are pulled High when the device is in user mode. Refer to the
"Simulation Support for GCLR/GPSET in Axcelerator" section of the Antifuse Macro Library
Guide for information on simulation support for GCLR and GPSET.
•
S0, S1, PSET, and CLR can be driven by routed clocks CLKE/F/G/H or user signals.
•
DIN and S1 can be driven by user signals.
CKP
As with the C-cell, the configuration of the R-cell to perform various functions is handled automatically for
the user through Microsemi's extensive macro library (see the Antifuse Macro Library Guide for a
complete listing of available AX macros).
DIN(user signals)
DCIN
HCLKA/B/C/D
CLKE/F/G/H
Figure 2-31 • R-Cell
2- 58
R ev i sio n 1 8
Y
PSET
GPSET
CLR
GCLR
S0
S1
CKS
Internal Logic
Axcelerator Family FPGAs
Timing Models and Waveforms
D
tSUD
tHD
CLK
tCPWHL
tRCO
tCPWLH
Q
CLR
tHASYN
tREASYN
tWASYN
tCLR
tHASYN
tPRESET
tWASYN
PRESET
E
tREASYN
tSUE
tHE
Figure 2-32 • R-Cell Delays
Timing Characteristics
Table 2-63 • R-Cell
Worst-Case Commercial Conditions VCCA = 1.425 V, VCCI = 3.0 V, TJ = 70°C
–2 Speed
Parameter
Description
Min.
Max.
–1 Speed
Min.
Max.
Std Speed
Min.
Max.
Units
R-Cell Propagation Delays
tRCO
Sequential Clock-to-Q
0.67
0.77
0.90
ns
tCLR
Asynchronous Clear-to-Q
0.67
0.77
0.90
ns
tPRESET
Asynchronous Preset-to-Q
0.36
0.36
0.36
ns
tSUD
Flip-Flop Data Input Set-Up
0.34
0.34
0.34
ns
tSUE
Flip-Flop Enable Input Set-Up
0.00
0.00
0.00
ns
tHD
Flip-Flop Data Input Hold
0.67
0.77
0.90
ns
tHE
Flip-Flop Enable Input Hold
0.67
0.77
0.90
ns
tWASYN
Asynchronous Pulse Width
tREASYN
Asynchronous Recovery Time
0.23
0.27
0.31
ns
tHASYN
Asynchronous Removal Time
0.36
0.36
0.36
ns
tCPWHL
Clock Pulse Width High to Low
0.36
0.36
0.36
ns
tCPWLH
Clock Pulse Width Low to High
0.36
0.36
0.36
ns
0.48
0.48
R ev i si o n 1 8
0.48
ns
2- 59
Detailed Specifications
Buffer Module
Introduction
An additional resource inside each SuperCluster is the Buffer (B) module (Figure 1-4 on page 1-3). When
a fanout constraint is applied to a design, the synthesis tool inserts buffers as needed. The buffer module
has been added to the AX architecture to avoid logic duplication resulting from the hard fanout
constraints. The router utilizes this logic resource to save area and reduce loading and delays on
medium-to-high-fanout nets.
Timing Models and Waveforms
IN
OUT
Figure 2-33 • Buffer Module Timing Model
VCCA
50%
50%
GND
IN
VCCA
OUT
GND
50%
50%
tBFPD
tBFPD
Figure 2-34 • Buffer Module Waveform
Timing Characteristics
Table 2-64 • Buffer Module
Worst-Case Commercial Conditions VCCA = 1.425 V, VCCI = 3.0 V, TJ = 70°C
–2 Speed
Parameter
Description
Min.
Max.
–1 Speed
Min.
Max.
Std Speed
Min.
Max.
Units
0.16
ns
Buffer Module Propagation Delays
tBFPD
2- 60
Any input to output Y
0.12
R ev i sio n 1 8
0.14
Axcelerator Family FPGAs
Routing Specifications
Routing Resources
The routing structure found in Axcelerator devices enables any logic module to be connected to any
other logic module while retaining high performance. There are multiple paths and routing resources that
can be used to route one logic module to another, both within a SuperCluster and elsewhere on the chip.
There are four primary types of routing within the AX architecture: DirectConnect, CarryConnect,
FastConnect, and Vertical and Horizontal Routing.
DirectConnect
DirectConnects provide a high-speed connection between an R-cell and its adjacent C-cell (Figure 2-35).
This connection can be made from DCOUT of the C-cell to DCIN of the R-cell by configuring of the S1
line of the R-cell. This provides a connection that does not require an antifuse and has a delay of less
than 0.1 ns.
Figure 2-35 • DirectConnect and CarryConnect
CarryConnect
CarryConnects are used to build carry chains for arithmetic functions (Figure 2-35). The FCO output of
the right C-cell of a two-C-cell Cluster drives the FCI input of the left C-cell in the two-C-cell Cluster
immediately below it. This pattern continues down both sides of each SuperCluster column.
Similar to the DirectConnects, CarryConnects can be built without an antifuse connection. This
connection has a delay of less than 0.1 ns from the FCO of one two-C-cell cluster to the FCI of the twoC-cell cluster immediately below it (see the "Carry-Chain Logic" section on page 2-56 for more
information).
FastConnect
For high-speed routing of logic signals, FastConnects can be used to build a short distance connection
using a single antifuse (Figure 2-36 on page 2-62). FastConnects provide a maximum delay of 0.3 ns.
The outputs of each logic module connect directly to the Output Tracks within a SuperCluster. Signals on
the Output Tracks can then be routed through a single antifuse connection to drive the inputs of logic
modules either within one SuperCluster or in the SuperCluster immediately below it.
R ev i si o n 1 8
2- 61
Detailed Specifications
Vertical and Horizontal Routing
Vertical and Horizontal Tracks provide both local and long distance routing (Figure 2-37 on page 2-62).
These tracks are composed of both short-distance, segmented routing and across-chip routing tracks
(segmented at core tile boundaries). The short-distance, segmented routing resources can be
concatenated through antifuse connections to build longer routing tracks.
These short-distance routing tracks can be used within and between SuperClusters or between modules
of non-adjacent SuperClusters. They can be connected to the Output Tracks and to any logic module
input (R-cell, C-cell, Buffer, and TX module).
The across-chip horizontal and vertical routing provides long-distance routing resources. These
resources interface with the rest of the routing structures through the RX and TX modules (Figure 2-37).
The RX module is used to drive signals from the across-chip horizontal and vertical routing to the Output
Tracks within the SuperCluster. The TX module is used to drive vertical and horizontal across-chip
routing from either short-distance horizontal tracks or from Output Tracks. The TX module can also be
used to drive signals from vertical across-chip tracks to horizontal across-chip tracks and vice versa.
Figure 2-36 • FastConnect Routing
Figure 2-37 • Horizontal and Vertical Tracks
2- 62
R ev i sio n 1 8
Axcelerator Family FPGAs
Timing Characteristics
Table 2-65 • AX125 Predicted Routing Delays
Worst-Case Commercial Conditions VCCA = 1.425 V, TJ = 70°C
Parameter
Description
–2 Speed
–1 Speed
Std Speed
Typical
Typical
Typical
Units
Predicted Routing Delays
tDC
DirectConnect Routing Delay, FO1
0.11
0.12
0.15
ns
tFC
FastConnect Routing Delay, FO1
0.35
0.39
0.46
ns
tRD1
Routing delay for FO1
0.35
0.40
0.47
ns
tRD2
Routing delay for FO2
0.38
0.43
0.51
ns
tRD3
Routing delay for FO3
0.43
0.48
0.57
ns
tRD4
Routing delay for FO4
0.48
0.55
0.64
ns
tRD5
Routing delay for FO5
0.55
0.62
0.73
ns
tRD6
Routing delay for FO6
0.64
0.72
0.85
ns
tRD7
Routing delay for FO7
0.79
0.89
1.05
ns
tRD8
Routing delay for FO8
0.88
0.99
1.17
ns
tRD16
Routing delay for FO16
1.49
1.69
1.99
ns
tRD32
Routing delay for FO32
2.32
2.63
3.10
ns
Table 2-66 • AX250 Predicted Routing Delays
Worst-Case Commercial Conditions VCCA = 1.425 V, TJ = 70°C
Parameter
Description
–2 Speed
–1 Speed
Std Speed
Typical
Typical
Typical
Units
Predicted Routing Delays
tDC
DirectConnect Routing Delay, FO1
0.11
0.12
0.15
ns
tFC
FastConnect Routing Delay, FO1
0.35
0.39
0.46
ns
tRD1
Routing delay for FO1
0.39
0.45
0.53
ns
tRD2
Routing delay for FO2
0.41
0.46
0.54
ns
tRD3
Routing delay for FO3
0.48
0.55
0.64
ns
tRD4
Routing delay for FO4
0.56
0.63
0.75
ns
tRD5
Routing delay for FO5
0.60
0.68
0.80
ns
tRD6
Routing delay for FO6
0.84
0.96
1.13
ns
tRD7
Routing delay for FO7
0.90
1.02
1.20
ns
tRD8
Routing delay for FO8
1.00
1.13
1.33
ns
tRD16
Routing delay for FO16
2.17
2.46
2.89
ns
tRD32
Routing delay for FO32
3.55
4.03
4.74
ns
R ev i si o n 1 8
2- 63
Detailed Specifications
Table 2-67 • AX500 Predicted Routing Delays
Worst-Case Commercial Conditions VCCA = 1.425 V, TJ = 70°C
Parameter
Description
–2 Speed
–1 Speed
Std Speed
Typical
Typical
Typical
Units
Predicted Routing Delays
tDC
DirectConnect Routing Delay, FO1
0.11
0.12
0.15
ns
tFC
FastConnect Routing Delay, FO1
0.35
0.39
0.46
ns
tRD1
Routing delay for FO1
0.39
0.45
0.53
ns
tRD2
Routing delay for FO2
0.41
0.46
0.54
ns
tRD3
Routing delay for FO3
0.48
0.55
0.64
ns
tRD4
Routing delay for FO4
0.56
0.63
0.75
ns
tRD5
Routing delay for FO5
0.60
0.68
0.80
ns
tRD6
Routing delay for FO6
0.84
0.96
1.13
ns
tRD7
Routing delay for FO7
0.90
1.02
1.20
ns
tRD8
Routing delay for FO8
1.00
1.13
1.33
ns
tRD16
Routing delay for FO16
2.17
2.46
2.89
ns
tRD32
Routing delay for FO32
3.55
4.03
4.74
ns
Table 2-68 • AX1000 Predicted Routing Delays
Worst-Case Commercial Conditions VCCA = 1.425 V, TJ = 70°C
Parameter
Description
–2 Speed
–1 Speed
Std Speed
Typical
Typical
Typical
Units
Predicted Routing Delays
tDC
DirectConnect Routing Delay, FO1
0.12
0.13
0.15
ns
tFC
FastConnect Routing Delay, FO1
0.35
0.39
0.46
ns
tRD1
Routing delay for FO1
0.45
0.51
0.60
ns
tRD2
Routing delay for FO2
0.53
0.60
0.71
ns
tRD3
Routing delay for FO3
0.56
0.63
0.74
ns
tRD4
Routing delay for FO4
0.63
0.71
0.84
ns
tRD5
Routing delay for FO5
0.73
0.82
0.97
ns
tRD6
Routing delay for FO6
0.99
1.13
1.32
ns
tRD7
Routing delay for FO7
1.02
1.15
1.36
ns
tRD8
Routing delay for FO8
1.48
1.68
1.97
ns
tRD16
Routing delay for FO16
2.57
2.91
3.42
ns
tRD32
Routing delay for FO32
4.24
4.81
5.65
ns
2- 64
R ev i sio n 1 8
Axcelerator Family FPGAs
Table 2-69 • AX2000 Predicted Routing Delays
Worst-Case Commercial Conditions VCCA = 1.425 V, TJ = 70°C
Parameter
Description
–2 Speed
–1 Speed
Std Speed
Typical
Typical
Typical
Units
Predicted Routing Delays
tDC
DirectConnect Routing Delay, FO1
0.12
0.13
0.15
ns
tFC
FastConnect Routing Delay, FO1
0.35
0.39
0.46
ns
tRD1
Routing delay for FO1
0.50
0.56
0.66
ns
tRD2
Routing delay for FO2
0.59
0.67
0.79
ns
tRD3
Routing delay for FO3
0.70
0.80
0.94
ns
tRD4
Routing delay for FO4
0.76
0.87
1.02
ns
tRD5
Routing delay for FO5
0.98
1.11
1.31
ns
tRD6
Routing delay for FO6
1.48
1.68
1.97
ns
tRD7
Routing delay for FO7
1.65
1.87
2.20
ns
tRD8
Routing delay for FO8
1.73
1.96
2.31
ns
tRD16
Routing delay for FO16
2.58
2.92
3.44
ns
tRD32
Routing delay for FO32
4.24
4.81
5.65
ns
R ev i si o n 1 8
2- 65
Detailed Specifications
Global Resources
One of the most important aspects of any FPGA architecture is its global resources or clocks. The
Axcelerator family provides the user with flexible and easy-to-use global resources, without the
limitations normally found in other FPGA architectures.
The AX architecture contains two types of global resources, the HCLK (hardwired clock) and CLK (routed
clock). Every Axcelerator device is provided with four HCLKs and four CLKs for a total of eight clocks,
regardless of device density.
Hardwired Clocks
The hardwired (HCLK) is a low-skew network that can directly drive the clock inputs of all sequential
modules (R-cells, I/O registers, and embedded RAM/FIFOs) in the device with no antifuse in the path. All
four HCLKs are available everywhere on the chip.
Timing Characteristics
Table 2-70 • AX125 Dedicated (Hardwired) Array Clock Networks
Worst-Case Commercial Conditions VCCA = 1.425 V, VCCI = 3.0 V, TJ = 70°C
–2 Speed
Parameter
Description
Min.
Max.
–1 Speed
Min.
Max.
Std Speed
Min.
Max.
Units
Dedicated (Hardwired) Array Clock Networks
tHCKL
Input Low to High
3.02
3.44
4.05
ns
tHCKH
Input High to Low
3.03
3.46
4.06
ns
tHPWH
Minimum Pulse Width High
0.58
tHPWL
Minimum Pulse Width Low
0.52
tHCKSW
Maximum Skew
tHP
Minimum Period
tHMAX
Maximum Frequency
0.65
0.77
0.59
0.06
1.15
0.69
0.07
1.31
870
ns
ns
0.08
1.54
763
ns
ns
649
MHz
Table 2-71 • AX250 Dedicated (Hardwired) Array Clock Networks
Worst-Case Commercial Conditions VCCA = 1.425 V, VCCI = 3.0 V, TJ = 70°C
–2 Speed
Parameter
Description
Min.
Max.
–1 Speed
Min.
Max.
Std Speed
Min.
Max.
Units
3.45
ns
Dedicated (Hardwired) Array Clock Networks
tHCKL
Input Low to High
tHCKH
Input High to Low
tHPWH
Minimum Pulse Width High
0.58
0.65
0.77
ns
tHPWL
Minimum Pulse Width Low
0.52
0.59
0.69
ns
tHCKSW
Maximum Skew
tHP
Minimum Period
tHMAX
Maximum Frequency
2- 66
2.57
2.93
2.61
2.97
0.06
1.15
0.07
1.31
870
R ev i sio n 1 8
3.50
0.08
ns
649
MHz
1.54
763
ns
ns
Axcelerator Family FPGAs
Table 2-72 • AX500 Dedicated (Hardwired) Array Clock Networks
Worst-Case Commercial Conditions VCCA = 1.425 V, VCCI = 3.0 V, TJ = 70°C
–2 Speed
Parameter
Description
Min.
Max.
–1 Speed
Min.
Max.
Std Speed
Min.
Max.
Units
Dedicated (Hardwired) Array Clock Networks
tHCKL
Input Low to High
2.35
2.68
3.15
ns
tHCKH
Input High to Low
2.44
2.79
3.27
ns
tHPWH
Minimum Pulse Width High
0.58
0.65
0.77
ns
tHPWL
Minimum Pulse Width Low
0.52
0.59
0.69
ns
tHCKSW
Maximum Skew
tHP
Minimum Period
tHMAX
Maximum Frequency
0.06
1.15
0.07
1.31
870
0.08
1.54
763
ns
ns
649
MHz
Table 2-73 • AX1000 Dedicated (Hardwired) Array Clock Networks
Worst-Case Commercial Conditions VCCA = 1.425 V, VCCI = 3.0 V, TJ = 70°C
–2 Speed
Parameter
Description
Min.
Max.
–1 Speed
Min.
Max.
Std Speed
Min.
Max.
Units
Dedicated (Hardwired) Array Clock Networks
tHCKL
Input Low to High
3.02
3.44
4.05
ns
tHCKH
Input High to Low
3.03
3.46
4.06
ns
tHPWH
Minimum Pulse Width High
0.58
0.65
0.77
ns
tHPWL
Minimum Pulse Width Low
0.52
0.59
0.69
ns
tHCKSW
Maximum Skew
tHP
Minimum Period
tHMAX
Maximum Frequency
0.06
1.15
0.07
1.31
870
0.08
1.54
763
ns
ns
649
MHz
Table 2-74 • AX2000 Dedicated (Hardwired) Array Clock Networks
Worst-Case Commercial Conditions VCCA = 1.425 V, VCCI = 3.0 V, TJ = 70°C
–2 Speed
Parameter
Description
Min.
Max.
–1 Speed
Min.
Max.
Std Speed
Min.
Max.
Units
Dedicated (Hardwired) Array Clock Networks
tHCKL
Input Low to High
3.02
3.44
4.05
ns
tHCKH
Input High to Low
3.03
3.46
4.06
ns
tHPWH
Minimum Pulse Width High
0.58
0.65
0.77
ns
tHPWL
Minimum Pulse Width Low
0.52
0.59
0.69
ns
tHCKSW
Maximum Skew
tHP
Minimum Period
tHMAX
Maximum Frequency
0.06
1.15
0.07
1.31
870
R ev i si o n 1 8
0.08
1.54
763
ns
ns
649
MHz
2- 67
Detailed Specifications
Routed Clocks
The routed clock (CLK) is a low-skew network that can drive the clock inputs of all sequential modules in
the device (logically equivalent to the HCLK), but has the added flexibility in that it can drive the S0
(Enable), S1, PSET, and CLR input of a register (R-cells and I/O registers) as well as any of the inputs of
any C-cell in the device. This allows CLKs to be used not only as clocks, but also for other global signals
or high fanout nets. All four CLKs are available everywhere on the chip.
Timing Characteristics
Table 2-75 • AX125 Routed Array Clock Networks
Worst-Case Commercial Conditions VCCA = 1.425 V, VCCI = 3.0 V, TJ = 70°C
–2 Speed
Parameter
Description
Min.
Max.
–1 Speed
Min.
Max.
Std Speed
Min.
Max.
Units
Routed Array Clock Networks
tRCKL
Input Low to High
3.08
3.50
4.12
ns
tRCKH
Input High to Low
3.13
3.56
4.19
ns
tRPWH
Minimum Pulse Width High
0.57
0.64
0.75
ns
tRPWL
Minimum Pulse Width Low
0.52
0.59
0.69
ns
tRCKSW
Maximum Skew
tRP
Minimum Period
tRMAX
Maximum Frequency
0.35
1.15
0.39
1.31
870
0.46
1.54
763
ns
ns
649
MHz
Table 2-76 • AX250 Routed Array Clock Networks
Worst-Case Commercial Conditions VCCA = 1.425 V, VCCI = 3.0 V, TJ = 70°C
–2 Speed
Parameter
Description
Min.
Max.
–1 Speed
Min.
Max.
Std Speed
Min.
Max.
Units
Routed Array Clock Networks
tRCKL
Input Low to High
2.52
2.87
3.37
ns
tRCKH
Input High to Low
2.59
2.95
3.47
ns
tRPWH
Minimum Pulse Width High
0.57
0.64
0.75
ns
tRPWL
Minimum Pulse Width Low
0.52
0.59
0.69
ns
tRCKSW
Maximum Skew
tRP
Minimum Period
tRMAX
Maximum Frequency
2- 68
0.35
1.15
0.39
1.31
870
R ev i sio n 1 8
0.46
1.54
763
ns
ns
649
MHz
Axcelerator Family FPGAs
Table 2-77 • AX500 Routed Array Clock Networks
Worst-Case Commercial Conditions VCCA = 1.425 V, VCCI = 3.0 V, TJ = 70°C
–2 Speed
Parameter
Description
Min.
Max.
–1 Speed
Min.
Max.
Std Speed
Min.
Max.
Units
Routed Array Clock Networks
tRCKL
Input Low to High
2.31
2.63
3.09
ns
tRCKH
Input High to Low
2.44
2.78
3.27
ns
tRPWH
Minimum Pulse Width High
0.57
0.64
0.75
ns
tRPWL
Minimum Pulse Width Low
0.52
0.59
0.69
ns
tRCKSW
Maximum Skew
tRP
Minimum Period
tRMAX
Maximum Frequency
0.35
1.15
0.39
1.31
870
0.46
1.54
763
ns
ns
649
MHz
Table 2-78 • AX1000 Routed Array Clock Networks
Worst-Case Commercial Conditions VCCA = 1.425 V, VCCI = 3.0 V, TJ = 70°C
–2 Speed
Parameter
Description
Min.
Max.
–1 Speed
Min.
Max.
Std Speed
Min.
Max.
Units
Routed Array Clock Networks
tRCKL
Input Low to High
3.08
3.50
4.12
ns
tRCKH
Input High to Low
3.13
3.56
4.19
ns
tRPWH
Minimum Pulse Width High
0.57
0.64
0.75
ns
tRPWL
Minimum Pulse Width Low
0.52
0.59
0.69
ns
tRCKSW
Maximum Skew
tRP
Minimum Period
tRMAX
Maximum Frequency
0.35
1.15
0.39
1.31
870
0.46
1.54
763
ns
ns
649
MHz
Table 2-79 • AX2000 Routed Array Clock Networks
Worst-Case Commercial Conditions VCCA = 1.425 V, VCCI = 3.0 V, TJ = 70°C
–2 Speed
Parameter
Description
Min.
Max.
–1 Speed
Min.
Max.
Std Speed
Min.
Max.
Units
Routed Array Clock Networks
tRCKL
Input Low to High
3.08
3.50
4.12
ns
tRCKH
Input High to Low
3.13
3.56
4.19
ns
tRPWH
Minimum Pulse Width High
0.57
0.64
0.75
ns
tRPWL
Minimum Pulse Width Low
0.52
0.59
0.69
ns
tRCKSW
Maximum Skew
tRP
Minimum Period
tRMAX
Maximum Frequency
0.35
1.15
0.39
1.31
870
R ev i si o n 1 8
0.46
1.54
763
ns
ns
649
MHz
2- 69
Detailed Specifications
Global Resource Distribution
At the root of each global resource is a PLL. There are two groups of four PLLs for every device. One
group, located at the center of the north edge (in the I/O ring) of the chip, sources the four HCLKs. The
second group, located at the center of the south edge (again in the I/O ring), sources the four CLKs
(Figure 2-38).
Regardless of the type of global resource, HCLK or CLK, each of the eight resources reach the
ClockTileDist (CTD) Cluster located at the center of every core tile with zero skew. From the
ClockTileDist Cluster, all four HCLKs and four CLKs are distributed through the core tile (Figure 2-39).
PLL
P N
PLL
P N
PLL
P N
PLL
P N
PLL Cluster
HCLKA HCLKB HCLKC HCLKD
CLKE
CLKF
CLKG
CLKH
PLL Cluster
P N
PLL
P N
PLL
P N
PLL
P N
PLL
Figure 2-38 • PLL Group
HCLK
CLK
PLL Group
ClockTileDist Cluster
4
4
PLL Group
Figure 2-39 • Example of HCLK and CLK Distributions on the AX2000
2- 70
R ev i sio n 1 8
Axcelerator Family FPGAs
The ClockTileDist Cluster contains an HCLKMux (HM) module for each of the four HCLK trees and a
CLKMux (CM) module for each of the CLK trees. The HCLK branches then propagate horizontally
through the middle of the core tile to HCLKColDist (HD) modules in every SuperCluster column. The CLK
branches propagate vertically through the center of the core tile to CLKRowDist (RD) modules in every
SuperCluster row. Together, the HCLK and CLK branches provide for a low-skew global fanout within the
core tile (Figure 2-40 and Figure 2-41).
Figure 2-40 • CTD, CD, and HD Module Layout
Figure 2-41 • HCLK and CLK Distribution within a Core Tile
R ev i si o n 1 8
2- 71
Detailed Specifications
The HM and CM modules can select between:
•
The HCLK or CLK source respectively
•
A local signal routed on generic routing resources
This allows each core tile to have eight clocks independent of the other core tiles in the device.
Both HCLK and CLK are segmentable, meaning that individual branches of the global resource can be
used independently.
Like the HM and CM modules, the HD and RD modules can select between:
•
The HCLK or CLK source from the HM or CM module respectively
•
A local signal routed on generic routing resources
The AX architecture is capable of supporting a large number of local clocks—24 segments per HCLK
driving north-south and 28 segments per CLK driving east-west per core tile.
Microsemi's Designer software’s place-and-route takes advantage of the segmented clock structure
found in Axcelerator devices by turning off any unused clock segments. This results in not only better
performance but also lower power consumption.
Global Resource Access Macros
Global resources can be driven by one of three sources: external pad(s), an internal net, or the output of
a PLL. These connections can be made by using one of three types of macros: CLKBUF, CLKINT, and
PLLCLK.
CLKBUF and HCLKBUF
CLKBUF (HCLKBUF) is used to drive a CLK (HCLK) from external pads. These macros can be used
either generically or with the specific I/O standard desired (e.g. CLKBUF_LVCMOS25, HCLKBUF_LVDS,
etc.) (Figure 2-42).
P
Clock
Network
CLKBUF
HCLKBUF
N
Figure 2-42 • CLKBUF and HCLKBUF
Package pins CLKEP and CLKEN are associated with CLKE; package pins HCLKAP and HCLKAN are
associated with HCLKA, etc.
Note that when CLKBUF (HCLKBUF) is used with a single-ended I/O standard, it must be tied to the
P-pad of the CLK (HCLK) package pin. In this case, the CLK (HCLK) N-pad can be used for user signals.
CLKINT and HCLKINT
CLKINT (HCLKINT) is used to access the CLK (HCLK) resource internally from the user signals
(Figure 2-43).
Clock
Network
Logic
CLKINT
HCLKINT
Figure 2-43 • CLKINT and HCLKINT
2- 72
R ev i sio n 1 8
Axcelerator Family FPGAs
PLLRCLK and PLLHCLK
PLLRCLK (PLLHCLK) is used to drive global resource CLK (HCLK) from a PLL (Figure 2-44).
RefCLK
Clock
Network
CLK1
PLL
FB
PLLRCLK
PLLHCLK
CLK2
Figure 2-44 • PLLRCLK and PLLHCLK
Using Global Resources with PLLs
Each global resource has an associated PLL at its root. For example, PLLA can drive HCLKA, PLLE can
drive CLKE, etc. (Figure 2-45).
HCLKAP
RefCLK
HCLKA
Network
CLK1
PLLA
FB
HCLKAN
CLK2
PLLHCLK
Figure 2-45 • Example of HCLKA Driven from a PLL with External Clock Source
In addition, each clock pin of the package can be used to drive either its associated global resource or
PLL. For example, package pins CLKEP and CLKEN can drive either the RefCLK input of PLLE or
CLKE.
There are two macros required when interfacing the embedded PLLs with the global resources: PLLINT
and PLLOUT.
PLLINT
This macro is used to drive the RefCLK input of the PLL internally from user signals.
PLLOUT
This macro is used to connect either the CLK1 or CLK2 output of a PLL to the regular routing network
(Figure 2-46).
PLLHCLK
PLLINT
Logic
RefCLK
HCLKA
Network
CLK1
PLLA
FB
CLK2
Logic
PLLOUT
Figure 2-46 • Example of PLLINT and PLLOUT Usage
R ev i si o n 1 8
2- 73
Detailed Specifications
Implementation Example:
Figure 2-47 shows a complex clock distribution example. The reference clock (RefCLK) of PLLE is being
sourced from non-clock signal pins (INBUF to PLLINT). The CLK1 output of PLLE is being fed to the
RefCLK input of PLLF. The CLK2 output of PLLE is driving logic (via PLLOUT). In turn, this logic is driving
the global resource CLKE. PLLF is driving both CLKF and CLKG global resources.
Non-Clock
Pins
P
INBUF
PLLINT
PLLRCLK
N
RefCLK
CLK1
PLLE
FB
CLK2
CLKINT
PLLOUT
Logic
PLLRCLK
RefCLK
CLK1
CLKF
CLK2
CLKG
PLLF
FB
PLLRCLK
Figure 2-47 • Complex Clock Distribution Example
2- 74
R ev i sio n 1 8
CLKE
Axcelerator Family FPGAs
Axcelerator Clock Management System
Introduction
Each member of the Axcelerator family6 contains eight phase-locked loop (PLL) blocks which perform
the following functions:
•
Programmable Delay (32 steps of 250 ps)
•
Clock Skew Minimization
•
Clock Frequency Synthesis
Each PLL has the following key features:
•
Input Frequency Range – 14 to 200 MHz
•
Output Frequency Range – 20 MHz to 1 GHz
•
Output Duty Cycle Range – 45% to 55%
•
Maximum Long-Term Jitter – 1% or 100ps (whichever is greater)
•
Maximum Short-Term Jitter – 50ps + 1% of Output Frequency
•
Maximum Acquisition Time (lock) – 20µs
Physical Implementation
The eight PLL blocks are arranged in two groups of four. One group is located in the center of the
northern edge of the chip, while the second group is centered on the southern edge. The northern group
is associated with the four HCLK networks (e.g. PLLA can drive HCLKA), while the southern group is
associated with the four CLK networks (e.g. PLLE can drive CLKE).
Each PLL cell is connected to two I/O pads and a PLL Cluster that interfaces with the FPGA core.
Figure 2-48 illustrates a PLL block. The VCCPLL pin should be connected to a 1.5V power supply
through a 250 Ω resistor. Furthermore, 0.1 μF and 10 μF decoupling capacitors should be connected
across the VCCPLL and VCOMPPLL pins.
DIVJ
6
PowerDown
RefCLK
Delay Line
/i Delay
Match
/j
CLK1
/j Delay
Match
CLK2
PLL
FB
Delay Line
FBMuxSel
5
DelayLine
Lock
/i
6
DIVJ
LowFreq
3
Osc
Figure 2-48 • PLL Block Diagram
Note: The VCOMPPLL pin should never be grounded (Figure 2-2 on page 2-9)!
The I/O pads associated with the PLL can also be configured for regular I/O functions except when it is
used as a clock buffer. The I/O pads can be configured in all the modes available to the regular I/O pads
in the same I/O bank. In particular, the [H]CLKxP pad can be configured as a differential pair,
6.
AX2000-CQ256 does not support operation of the phase-locked loops. This is in order to support full pin compatibility with
RTAX2000S/SL-CQ256.
R ev i si o n 1 8
2- 75
Detailed Specifications
single-ended, or voltage-referenced standard. The [H]CLKxN pad can only be used as a differential pair
with [H]CLKxP.
The block marked “/i Delay Match” is a fixed delay equal to that of the i divider. The “/j Delay Match” block
has the same function as its j divider counterpart.
Functional Description
Figure 2-48 on page 2-75 illustrates a block diagram of the PLL. The PLL contains two dividers, i and j,
that allow frequency scaling of the clock signal:
•
The i divider in the feedback path allows multiplication of the input clock by integer factors ranging
from 1 to 64, and the resultant frequency is available at the output of the PLL block.
•
The j divider divides the PLL output by integer factors ranging from 1 to 64, and the divided clock
is available at CLK1.
•
The two dividers together can implement any combination of multiplication and division up to a
maximum frequency of 1 GHz on CLK1. Both the CLK1 and CLK2 outputs have a fixed 50/50
duty cycle.
•
The output frequencies of the two clocks are given by the following formulas (fREF is the reference
clock frequency):
fCLK1 = fREF * (DividerI) / (DividerJ)
EQ 4
fCLK2 = fREF * (DividerI)
EQ 5
•
CLK2 provides the PLL output directly—without division
The input and output frequency ranges are selected by LowFreq and Osc(2:0), respectively. These
functions and their possible values are detailed in Table 2-80 on page 2-77.
The delay lines shown in Figure 2-48 on page 2-75 are programmable. The feedback clock path can be
delayed (using the five DelayLine bits) relative to the reference clock (or vice versa) by up to 3.75 ns in
increments of 250 ps. Table 2-80 on page 2-77 describes the usage of these bits. The delay increments
are independent of frequency, so this results in phase changes that vary with frequency. The delay value
is highly dependent on VCC and the speed grade.
Figure 2-49 is a logical diagram of the various control signals to the PLL and shows how the PLL
interfaces with the global and routing networks of the FPGA. Note that not all signals are useraccessible. These non-user-accessible signals are used by the place-and-route tool to control the
configuration of the PLL. The user gains access to these control signals either based upon the
connections built in the user's design or through the special macros (Table 2-84 on page 2-81) inserted
into the design. For example, connecting the macro PLLOUT to CLK2 will control the OUTSEL signal.
ROOTSEL
REFSEL
CLKINT
CLK1 (PLLn-1)
CLK1 (PLLn-1)
RefCLK
[H]CLKINT
0
1
2
3
CLK1
[H]CLKxP
I/O
Core net
CLK net
PLL
CLK2
FBINT
PLLSEL
1
FB
[H]CLKxN
OUTSEL
FBMuxSEL
To PLLn+1
Note: Not all signals are available to the user.
Figure 2-49 • PLL Logical Interface
2- 76
0
R ev i sio n 1 8
[H]CLK
CLK Out
(Routed net out pin)
Axcelerator Family FPGAs
Table 2-80 • PLL Interface Signals
Signal Name
Type
User
Accessible
RefCLK
Input
Yes
Reference Clock for the PLL
FB
Input
Yes
Feedback port for the PLL
PowerDown
Input
Yes
PLL power down control
DIVI[5:0]
Input
Yes
DIVJ[5:0]
Input
Yes
LowFreq
Input
Yes
Allowable
Values
0
PLL powered down
1
PLL active
1 to 64, in
Sets value for feedback divider (multiplier)
unsigned binary Sets value for CLK1 divider
notation offset by
-1
Input frequency range selector
0
1
Osc[2:0]
Input
Function
Yes
50–200 MHz
14–50 MHz
Output frequency range selector
XX0
400–1000 MHZ
001
200–400 MHZ
011
100–200 MHZ
101
50–100 MHZ
111
20–50 MHZ
DelayLine[4:0]
Input
Yes
–15 to +15
Clock Delay (positive/negative) in increments
(increments), in of 250 ps, with maximum value of ± 3.75 ns
signed-andmagnitude binary
representation
FBMuxSel
Input
No
Selects the source for the feedback input
REFSEL
Input
No
Selects the source for the reference clock
OUTSEL
Input
No
Selects the source for the routed net output
PLLSEL
Input
No
ROOTSEL & PLLSEL are used to select the
source of the global clock network
ROOTSEL
Input
No
Lock
Output
Yes
High value indicates PLL has locked
CLK1
Output
Yes
PLL clock output
CLK2
Output
Yes
PLL clock output
Note: If the input RefClk is taken outside its operating range, the outputs Lock, CLK1 and CLK2 are
indeterminate.
R ev i si o n 1 8
2- 77
Detailed Specifications
PLL Configurations
The following rules apply to the different PLL inputs and outputs:
Reference Clock
The RefCLK can be driven by (Figure 2-50):
1. Global routed clocks (CLKE/F/G/H) or user-created clock network
2. CLK1 output of an adjacent PLL
3. [H]CLKxP (single-ended or voltage-referenced)
4. [H]CLKxP/[H]CLKxN pair (differential modes like LVPECL or LVDS)
Feedback Clock
The feedback clock can be driven by (Figure 2-51 on page 2-78):
1. Global routed clocks (CLKE/F/G/H) or user-created clock network
2. External [H]CLKxP/N I/O pad(s) from the adjacent PLL cell
3. An internal signal from the PLL block
Regular, LVPECL, or LVDS IOPAD
Non-clock
Pins
INBUF
RefCLK
P
PLL
N
Any macro from the core, except HCLK nets
RefCLK
Logic
PLL
For cascading
PLL
CLK1 RefCLK
PLL
Figure 2-50 • Reference Clock Connections
PLLOUT/PLLRCLK
FB
PLL
Any macro except HCLK macros
FB
PLL
Figure 2-51 • Feedback Clock Connections
2- 78
R ev i sio n 1 8
Axcelerator Family FPGAs
CLK1 and CLK2
Both PLL outputs, CLK1 and CLK2, can be used to drive a global resource, an adjacent PLL RefCLK
input, or a net in the FPGA core. Not all drive combinations are possible (Table 2-81).
Table 2-81 • PLL General Connections Rules
CLK1
CLK2
HCLK
HCLK
CLK
CLK
HCLK
Routed net output
Routed net output
HCLK
HCLK
NONE
NONE
HCLK
CLK
NONE
NONE
CLK
Note: The PLL outputs remain Low when REFCLK is constant (either Low or High).
Restrictions on CLK1 and CLK2
•
When both are driving global resources, they must be driving the same type of global resource
(i.e. either HCLK or CLK).
•
Only one can drive a routed net at any given time.
Table 2-82 and Table 2-83 specify all the possible CLK1 and CLK2 connections for the north and south
PLLs. HCLK1 and HCLK2 are used to denote the different HCLK networks when two are being driven at
the same time by a single PLL (Note that HCLK1 is the primary clock resource associated with the PLL,
and HCLK2 is the clock resource associated with the adjacent PLL). Likewise, CLK1 and CLK2 are used
to denote the different CLK networks when two are being driven at the same time by a single PLL
(Figure 2-48 on page 2-75).
Table 2-82 • North PLL Connections
CLK1
CLK2
HCLK1
Routed net
HCLK1
Unused
HCLK2
HCLK1
HCLK2
Routed net
HCLK2
Both HCLK1 and routed net
HCLK2
Unused
Unused
HCLK1
Unused
Routed net
Unused
Both HCLK1 and routed net
Unused
Unused
Routed net
HCLK1
Routed net
Unused
Both HCLK1 and HCLK2
Routed net
Both HCLK1 and HCLK2
Unused
Both HCLK1 and routed net
Unusable
Both HCLK2 and routed net
HCLK1
Both HCLK2 and routed net
Unused
HCLK1, HCLK2, and routed net
Unusable
Note: Designer software currently does not support all of these connections. Only exclusive connections
where one output connects to a single net are supported at this time (e.g.CLK1 driving HCLK1,
and HCLK2 is not supported).
R ev i si o n 1 8
2- 79
Detailed Specifications
Table 2-83 • South PLL Connections
CLK1
CLK2
CLK1
Routed net
CLK1
Unused
CLK2
CLK1
CLK2
Routed net
CLK2
Both CLK1 and routed net
CLK2
Unused
Unused
CLK1
Unused
Routed net
Unused
Both CLK1 and routed net
Unused
Unused
Routed net
CLK1
Routed net
Unused
Both CLK1 and CLK2
Routed net
Both CLK1 and CLK2
Unused
Both CLK1 and routed net
Unusable
Both CLK2 and routed net
CLK1
Both CLK2 and routed net
Unused
CLK1, CLK2, and routed net
Unusable
Note: Designer software currently does not support all of these connections. Only exclusive connections
where one output connects to a single net are supported at this time (e.g., CLK1 driving both
CLK1 and CLK2 is not supported).
2- 80
R ev i sio n 1 8
Axcelerator Family FPGAs
Special PLL Macros
Table 2-84 shows the macros used to connect the RefCLK input and CLK1 and CLK2 outputs using the
different routing resources.
Table 2-84 • PLL Special Macros
Macro Name
Usage
PLLINT
Connects RefCLK to a regular routed net or a pad.
PLLRCLK
Connects CLK1 or CLK2 to the CLK network.
PLLHCLK
Connects CLK1 or CLK2 to the HCLK network.
PLLOUT
Connects CLK1 or CLK2 to a regular routed net.
Table 2-85 • Electrical Specifications
Parameter
Value
Notes
Frequency Ranges
Reference Frequency (min.)
14 MHz
Lowest input frequency
Reference Frequency (max.)
200 MHz
Highest input frequency
OSC Frequency (min.)
20 MHz
Lowest output frequency
OSC Frequency (max.)
1 GHz
Highest output frequency
Jitter
Long-Term Jitter (max.)
1%
Long-Term Jitter (max.)
100ps
Short-Term Jitter (max.)
50ps+1%
Percentage
frequencies
of
period,
low
reference
clock
High reference clock frequencies
Percentage of output frequency
Acquisition Time (lock) from Cold Start
Acquisition Time (max.)*
400 cycles
Acquisition Time (max.)*
1.5 µs
Period of low reference clock frequencies
High reference clock frequencies
Analog Supply Current (low freq.)
200 µA
Current at minimum oscillator frequency
Analog Supply Current (high freq.)
200 µA
Frequency-dependent current
Power Consumption
Digital Supply Current (low freq.)
Digital Supply Current (high freq.)
0.5 µA/MHz Current at maximum oscillator frequency, unloaded
1 µA/MHz
Frequency-dependent current
Duty Cycle
Minimum Output Duty Cycle
45%
Maximum Output Duty Cycle
55%
Note: *The lock bit remains Low until RefCLK reaches the minimum input frequency.
R ev i si o n 1 8
2- 81
Detailed Specifications
User Flow
There are two methods of including a PLL in a design:
•
The recommended method of using a PLL is to create custom PLL blocks using Microsemi's
macro generator, SmartGen, that can be instantiated in a design.
•
The alternative method is to instantiate one of the generic library primitives (PLL or PLLFB) into
either a schematic or HDL netlist, using inverters for polarity control and tying all unused address
and data bits to ground.
Timing Model
Lock
CLK1
tPCLK*
CLK
FB
Note: tPCLK is the delay in the clock signal
Figure 2-52 • PLL Model
2- 82
R ev i sio n 1 8
5
3
OSC
6
DividerI/DividerJ
Configuration Pins
6
Delay Line
FBMux
CLK2
Axcelerator Family FPGAs
Sample Implementations
Frequency Synthesis
Figure 2-53 illustrates an example where the PLL is used to multiply a 155.5 MHz external clock up to
622 MHz. Note that the same PLL schematic could use an external 350 MHz clock, which is divided
down to 155 MHz by the FPGA internal logic.
Figure 2-54 illustrates the PLL using both dividers to synthesize a 133 MHz output clock from a 155 MHz
input reference clock. The input frequency of 155 MHz is multiplied by 6 and divided by 7, giving a CLK1
output frequency of 132.86 MHz. When dividers are used, a given ratio can be generated in multiple
ways, allowing the user to stay within the operating frequency ranges of the PLL.
DividerJ
6
Power-Down
RefCLK
155.5 MHz
Delay Line
Lock
/i Delay
Match
/j
PLL
CLK1
FB
Delay Line
/i
/j Delay
Match
CLK2
622 MHz
FBMuxSel
5
DelayLine
6
DividerI
LowFreq
3
Osc
+4
Figure 2-53 • Using the PLL 155.5 MHz In, 622 MHz Out
Adjustable Clock Delay
Figure 2-55 illustrates using the PLL to delay the reference clock by employing one of the adjustable
delay lines. In this case, the output clock is delayed relative to the reference clock. Delaying the
reference clock relative to the output clock is accomplished by using the delay line in the feedback path.
R ev i si o n 1 8
2- 83
Detailed Specifications
/7
DividerJ
6
Power-Down
RefCLK
155 MHz
Delay Line
/i Delay
Match
155 MHz
Lock
132.8 MHz
930 MHz
PLL
CLK1
/j
FB
Delay Line
155 MHz
/i
CLK2
/j Delay
Match
Yes
FBMuxSel
3
6
5
DelayLine
DividerI
LowFreq
Osc
+6
Figure 2-54 • Using the PLL 155 MHz In, 133 MHz Out
DividerJ
6
PowerDown
Lock
RefCLK
Delay Line
133 MHz
/i Delay
Match
PLL
CLK1
/j
FB
Delay Line
/j
/j Delay
Match
CLK2
133 MHz
5
FBMuxSel
DelayLine
3
6
DividerI
LowFreq
1
Figure 2-55 • Using the PLL Delaying the Reference Clock
2- 84
R ev i sio n 1 8
Osc
Axcelerator Family FPGAs
Clock Skew Minimization
Figure 2-56 indicates how feedback from the clock network can be used to create minimal skew between
the distributed clock network and the input clock. The input clock is fed to the reference clock input of the
PLL. The output clock (CLK2) feeds a routed clock network. The feedback input to the PLL uses a clock
input delayed by a routing network. The PLL then adjusts the phase of the input clock to match the
delayed clock, thus providing nearly zero effective skew between the two clocks. Refer to the Axcelerator
Family PLL and Clock Management application note for more information.
DividerJ
6
Lock
Power-Down
RefCLK
Input Clock
/i Delay
Match
Delay Line
133 MHz
133 MHz
PLL
FB
Delay Line
/j
/i
/i Delay
Match
CLK1
CLK2
133 MHz
FBMuxSel
6
DividerI
1
5
DelayLine
Q
LowFreq
3
Osc
SET
D
QCLR
Clock Network
Figure 2-56 • Using the PLL for Clock Deskewing
R ev i si o n 1 8
2- 85
Detailed Specifications
Embedded Memory
The AX architecture provides extensive, high-speed memory resources to the user. Each 4,608 bit block
of RAM contains its own embedded FIFO controller, allowing the user to configure each block as either
RAM or FIFO.
To meet the needs of high performance designs, the memory blocks operate in synchronous mode for
both read and write operations. However, the read and write clocks are completely independent, and
each may operate up to and above 500 MHz.
No additional core logic resources are required to cascade the address and data buses when cascading
different RAM blocks. Dedicated routing runs along each column of RAM to facilitate cascading.
The AX memory block includes dedicated FIFO control logic to generate internal addresses and external
flag logic (FULL, EMPTY, AFULL, AEMPTY). Since read and write operations can occur asynchronously
to one another, special control circuitry is included to prevent metastability, overflow, and underflow. A
block diagram of the memory module is illustrated in Figure 2-57.
During RAM operation, read (RA) and write (WA) addresses are sourced by user logic and the FIFO
controller is ignored. In FIFO mode, the internal addresses are generated by the FIFO controller and
routed to the RAM array by internal MUXes. Enables with programmable polarity are provided to create
upper address bits for cascading up to 16 memory blocks. When cascading memory blocks, the bussed
signals WA, WD, WEN, RA, RD, and REN are internally linked to eliminate external routing congestion.
RA [K:0]
REN
RCLK
WD [(M-1):0]
WA [J:0]
WEN
WCLK
PIPE
RW [2:0]
WW [2:0]
Figure 2-57 • Axcelerator Memory Module
2- 86
R ev i sio n 1 8
RD [(N-1):0]
Axcelerator Family FPGAs
RAM
Each memory block consists of 4,608 bits that can be organized as 128x36, 256x18, 512x9, 1kx4, 2kx2,
or 4kx1 and are cascadable to create larger memory sizes. This allows built-in bus width conversion
(Table 2-86). Each block has independent read and write ports which enable simultaneous read and write
operations.
Table 2-86 • Memory Block WxD Options
Data-word (in bits)
Depth
Address Bus
Data Bus
1
4,096
RA/WA[11:0]
RD/WD[0]
2
2,048
RA/WA[10:0]
RD/WD[1:0]
4
1,024
RA/WA[9:0]
RD/WD[3:0]
9
512
RA/WA[8:0]
RD/WD[8:0]
18
256
RA/WA[7:0]
RD/WD[17:0]
36
128
RA/WA[6:0]
RD/WD[35:0]
Clocks
The RCLK and the WCLK have independent source polarity selection and can be sourced by any global
or local signal.
RAM Configurations
The AX architecture allows the read side and write side of RAMs to be organized independently, allowing
for bus conversion. For example, the write side can be set to 256x18 and the read side to 512x9.
Both the write width and read width for the RAM blocks can be specified independently and changed
dynamically with the WW (write width) and RW (read width) pins. The D x W different configurations are:
128 x 36, 256 x 18, 512 x 9, 1k x 4, 2k x 2, and 4k x 1. The allowable RW and WW values are shown in
Table 2-87.
Table 2-87 • Allowable RW and WW Values
RW(2:0)
WW(2:0)
DxW
000
000
4k x 1
001
001
2k x 2
010
010
1k x 4
011
011
512 x 9
100
100
256 x 18
101
101
128 x 36
11x
11x
reserved
When widths of one, two, and four are selected, the ninth bit is unused. For example, when writing ninebit values and reading four-bit values, only the first four bits and the second four bits of each nine-bit
value are addressable for read operations. The ninth bit is not accessible. Conversely, when writing fourbit values and reading nine-bit values, the ninth bit of a read operation will be undefined.
R ev i si o n 1 8
2- 87
Detailed Specifications
Note that the RAM blocks employ little-endian byte order for read and write operations.
Table 2-88 • RAM Signal Description
Signal
Direction
Description
WCLK
Input
Write clock (can be active on either edge).
WA[J:0]
Input
Write address bus.The value J is dependent on the RAM configuration and the
number of cascaded memory blocks. The valid range for J is from 6 to15.
WD[M-1:0] Input
Write data bus. The value M is dependent on the RAM configuration and can
be 1, 2, 4, 9, 18, or 36.
RCLK
Input
Read clock (can be active on either edge).
RA[K:0]
Input
Read address bus. The value K is dependent on the RAM configuration and
the number of cascaded memory blocks. The valid range for K is from 6 to 15.
RD[N-1:0]
Output
Read data bus. The value N is dependent on the RAM configuration and can
be 1, 2, 4, 9, 18, or 36.
REN
Input
Read enable. When this signal is valid on the active edge of the clock, data at
location RA will be driven onto RD.
WEN
Input
Write enable. When this signal is valid on the active edge of the clock, WD data
will be written at location WA.
RW[2:0]
Input
Width of the read operation dataword.
WW[2:0]
Input
Width of the write operation dataword.
Pipe
Input
Sets the pipe option to be on or off.
Modes of Operation
There are two read modes and one write mode:
•
Read Nonpipelined (synchronous – one clock edge)
•
Read Pipelined (synchronous – two clock edges)
•
Write (synchronous – one clock edge)
In the standard read mode, new data is driven onto the RD bus in the clock cycle immediately following
RA and REN valid. The read address is registered on the read-port active-clock edge and data appears
at read-data after the RAM access time. Setting the PIPE to OFF enables this mode.
The pipelined mode incurs an additional clock delay from address to data, but enables operation at a
much higher frequency. The read-address is registered on the read-port active-clock edge, and the read
data is registered and appears at RD after the second read clock edge. Setting the PIPE to ON enables
this mode.
On the write active-clock edge, the write data are written into the SRAM at the write address when WEN
is high. The setup time of the write address, write enables, and write data are minimal with respect to the
write clock.
Write and read transfers are described with timing requirements beginning in the "Timing Characteristics"
section on page 2-89.
2- 88
R ev i sio n 1 8
Axcelerator Family FPGAs
Timing Characteristics
WD
RD
WA
RA
WCLK
RCLK
WEN
REN
Figure 2-58 • SRAM Model
tWCKH
tWCKP
tWCKL
WCLK
tWxxSU
tWxxHD
WA<11:0>, WD<35:0>, WEN<4:0>
Figure 2-59 • RAM Write Timing Waveforms
tRCKH
tRCKP
tRCKL
RCLK
tRxxSU tRxxHD
RA<11:0>, REN<4:0>
tRCK2RD1
tRCK2RD2
RD <35:0>
Figure 2-60 • RAM Read Timing Waveforms
R ev i si o n 1 8
2- 89
Detailed Specifications
Table 2-89 • One RAM Block
Worst-Case Commercial Conditions VCCA = 1.425 V, VCCI = 3.0 V, TJ = 70°C
–2 Speed
Parameter
Description
Min.
Max.
–1 Speed
Min.
Max.
Std Speed
Min.
Max.
Units
Write Mode
tWDASU
Write Data Setup vs. WCLK
1.08
1.23
1.45
ns
tWDAHD
Write Data Hold vs. WCLK
0.22
0.25
0.30
ns
tWADSU
Write Address Setup vs. WCLK
1.08
1.23
1.45
ns
tWADHD
Write Address Hold vs. WCLK
0.00
0.00
0.00
ns
tWENSU
Write Enable Setup vs. WCLK
1.08
1.23
1.45
ns
tWENHD
Write Enable Hold vs. WCLK
0.22
0.25
0.30
ns
tWCKH
WCLK Minimum High Pulse Width
0.75
0.75
0.75
ns
tWCLK
WCLK Minimum Low Pulse Width
0.88
0.88
0.88
ns
tWCKP
WCLK Minimum Period
1.63
1.63
1.63
ns
Read Mode
tRADSU
Read Address Setup vs. RCLK
0.81
0.92
1.08
ns
tRADHD
Read Address Hold vs. RCLK
0.00
0.00
0.00
ns
tRENSU
Read Enable Setup vs. RCLK
0.81
0.92
1.08
ns
tRENHD
Read Enable Hold vs. RCLK
0.00
0.00
0.00
ns
tRCK2RD1
RCLK-to-OUT (Pipelined)
1.32
1.51
1.77
ns
tRCK2RD2
RCLK-to-OUT (Non-Pipelined)
2.16
2.46
2.90
ns
tRCLKH
RCLK Minimum High Pulse Width
0.77
0.77
0.77
ns
tRCLKL
RCLK Minimum Low Pulse Width
0.93
0.93
0.93
ns
tRCKP
RCLK Minimum Period
1.70
1.70
1.70
ns
Note: Timing data for this single block RAM has a depth of 4,096. For all other combinations, use Microsemi’s timing
software.
2- 90
R ev i sio n 1 8
Axcelerator Family FPGAs
Table 2-90 • Two RAM Blocks Cascaded
Worst-Case Commercial Conditions VCCA = 1.425 V, VCCI = 3.0 V, TJ = 70°C
–2 Speed
Parameter
Description
Min.
Max.
–1 Speed
Min.
Max.
Std Speed
Min.
Max.
Units
Write Mode
tWDASU
Write Data Setup vs. WCLK
1.39
1.59
1.87
ns
tWDAHD
Write Data Hold vs. WCLK
0.00
0.00
0.00
ns
tWADSU
Write Address Setup vs. WCLK
1.39
1.59
1.87
ns
tWADHD
Write Address Hold vs. WCLK
0.00
0.00
0.00
ns
tWENSU
Write Enable Setup vs. WCLK
1.39
1.59
1.87
ns
tWENHD
Write Enable Hold vs. WCLK
0.00
0.00
0.00
ns
tWCKH
WCLK Minimum High Pulse Width
0.75
0.75
0.75
ns
tWCLK
WCLK Minimum Low Pulse Width
1.76
1.76
1.76
ns
tWCKP
WCLK Minimum Period
2.51
2.51
2.51
ns
Read Mode
tRADSU
Read Address Setup vs. RCLK
1.71
1.94
2.28
ns
tRADHD
Read Address Hold vs. RCLK
0.00
0.00
0.00
ns
tRENSU
Read Enable Setup vs. RCLK
1.71
1.94
2.28
ns
tRENHD
Read Enable Hold vs. RCLK
0.00
0.00
0.00
ns
tRCK2RD1
RCLK-To-OUT (Pipelined)
1.43
1.63
1.92
ns
tRCK2RD2
RCLK-To-OUT (Non-Pipelined)
2.26
2.58
3.03
ns
tRCLKH
RCLK Minimum High Pulse Width
0.73
0.73
0.73
ns
tRCLKL
RCLK Minimum Low Pulse Width
1.89
1.89
1.89
ns
tRCKP
RCLK Minimum Period
2.62
2.62
2.62
ns
Note: Timing data for these two cascaded RAM blocks uses a depth of 8,192. For all other combinations, use
Microsemi’s timing software.
R ev i si o n 1 8
2- 91
Detailed Specifications
Table 2-91 • Four RAM Blocks Cascaded
Worst-Case Commercial Conditions VCCA = 1.425 V, VCCI = 3.0 V, TJ = 70°C
–2 Speed
Parameter
Description
Min.
Max.
–1 Speed
Min.
Max.
Std Speed
Min.
Max.
Units
Write Mode
tWDASU
Write Data Setup vs. WCLK
2.37
2.70
3.17
ns
tWDAHD
Write Data Hold vs. WCLK
0.00
0.00
0.00
ns
tWADSU
Write Address Setup vs. WCLK
2.37
2.70
3.17
ns
tWADHD
Write Address Hold vs. WCLK
0.00
0.00
0.00
ns
tWENSU
Write Enable Setup vs. WCLK
2.37
2.70
3.17
ns
tWENHD
Write Enable Hold vs. WCLK
0.00
0.00
0.00
ns
tWCKH
WCLK Minimum High Pulse Width
0.75
0.75
0.75
ns
tWCLK
WCLK Minimum Low Pulse Width
2.51
2.51
2.51
ns
tWCKP
WCLK Minimum Period
3.26
3.26
3.26
ns
Read Mode
tRADSU
Read Address Setup vs. RCLK
3.08
3.51
4.13
ns
tRADHD
Read Address Hold vs. RCLK
0.00
0.00
0.00
ns
tRENSU
Read Enable Setup vs. RCLK
3.08
3.51
4.13
ns
tRENHD
Read Enable Hold vs. RCLK
0.00
0.00
0.00
ns
tRCK2RD1
RCLK-To-OUT (Pipelined)
2.36
2.69
3.16
ns
tRCK2RD2
RCLK-To-OUT (Non-Pipelined)
2.83
3.23
3.79
ns
tRCLKH
RCLK Minimum High Pulse Width
0.73
0.73
0.73
ns
tRCLKL
RCLK Minimum Low Pulse Width
2.96
2.96
2.96
ns
tRCKP
RCLK Minimum Period
3.69
3.69
3.69
ns
Note: Timing data for these four cascaded RAM blocks uses a depth of 16,384. For all other combinations, use
Microsemi’s timing software.
2- 92
R ev i sio n 1 8
Axcelerator Family FPGAs
Table 2-92 • Eight RAM Blocks Cascaded
Worst-Case Commercial Conditions VCCA = 1.425 V, VCCI = 3.0 V, TJ = 70°C
–2 Speed
Parameter
Description
Min.
Max.
–1 Speed
Min.
Max.
Std Speed
Min.
Max.
Units
Write Mode
tWDASU
Write Data Setup vs. WCLK
5.78
6.58
7.74
ns
tWDAHD
Write Data Hold vs. WCLK
0.00
0.00
0.00
ns
tWADSU
Write Address Setup vs. WCLK
5.78
6.58
7.74
ns
tWADHD
Write Address Hold vs. WCLK
0.00
0.00
0.00
ns
tWENSU
Write Enable Setup vs. WCLK
5.78
6.58
7.74
ns
tWENHD
Write Enable Hold vs. WCLK
0.00
0.00
0.00
ns
tWCKH
WCLK Minimum High Pulse Width
0.75
0.75
0.75
ns
tWCLK
WCLK Minimum Low Pulse Width
5.13
5.13
5.13
ns
tWCKP
WCLK Minimum Period
5.88
5.88
5.88
ns
Read Mode
tRADSU
Read Address Setup vs. RCLK
6.75
7.69
9.04
ns
tRADHD
Read Address Hold vs. RCLK
0.00
0.00
0.00
ns
tRENSU
Read Enable Setup vs. RCLK
6.75
7.69
9.04
ns
tRENHD
Read Enable Hold vs. RCLK
0.00
0.00
0.00
ns
tRCK2RD1
RCLK-To-OUT (Pipelined)
3.39
3.86
4.54
ns
tRCK2RD2
RCLK-To-OUT (Non-Pipelined)
4.93
5.62
6.61
ns
tRCLKH
RCLK Minimum High Pulse Width
0.73
0.73
0.73
ns
tRCLKL
RCLK Minimum Low Pulse Width
5.77
5.77
5.77
ns
tRCKP
RCLK Minimum Period
6.50
6.50
6.50
ns
Note: Timing data for these eight cascaded RAM blocks uses a depth of 32,768. For all other combinations, use
Microsemi’s timing software.
R ev i si o n 1 8
2- 93
Detailed Specifications
Table 2-93 • Sixteen RAM Blocks Cascaded
Worst-Case Commercial Conditions VCCA = 1.425 V, VCCI = 3.0 V, TJ = 70°C
–2 Speed
Parameter
Description
Min.
Max.
–1 Speed
Min.
Max.
Std Speed
Min.
Max.
Units
Write Mode
tWDASU
Write Data Setup vs. WCLK
16.54
18.84
22.15
ns
tWDAHD
Write Data Hold vs. WCLK
0.00
0.00
0.00
ns
tWADSU
Write Address Setup vs. WCLK
16.54
18.84
22.15
ns
tWADHD
Write Address Hold vs. WCLK
0.00
0.00
0.00
ns
tWENSU
Write Enable Setup vs. WCLK
16.54
18.84
22.15
ns
tWENHD
Write Enable Hold vs. WCLK
0.00
0.00
0.00
ns
tWCKH
WCLK Minimum High Pulse Width
0.75
0.75
0.75
ns
tWCLK
WCLK Minimum Low Pulse Width
13.40
13.40
13.40
ns
tWCKP
WCLK Minimum Period
14.15
14.15
14.15
ns
Read Mode
tRADSU
Read Address Setup vs. RCLK
18.13
20.65
24.27
ns
tRADHD
Read Address Hold vs. RCLK
0.00
0.00
0.00
ns
tRENSU
Read Enable Setup vs. RCLK
18.13
20.65
24.27
ns
tRENHD
Read Enable Hold vs. RCLK
0.00
0.00
0.00
ns
tRCK2RD1
RCLK-To-OUT (Pipelined)
12.08
13.76
16.17
ns
tRCK2RD2
RCLK-To-OUT (Non-Pipelined)
12.83
14.62
17.18
ns
tRCLKH
RCLK Minimum High Pulse Width
0.73
0.73
0.73
ns
tRCLKL
RCLK Minimum Low Pulse Width
14.41
14.41
14.41
ns
tRCKP
RCLK Minimum Period
15.14
15.14
15.14
ns
Note: Timing data for these sixteen cascaded RAM blocks uses a depth of 65,536. For all other combinations, use
Microsemi’s timing software.
2- 94
R ev i sio n 1 8
Axcelerator Family FPGAs
FIFO
Every memory block has its own embedded FIFO controller. Each FIFO block has one read port and one
write port. This embedded FIFO controller uses no internal FPGA logic and features:
•
Glitch-free FIFO Flags
•
Gray-code address counters/pointers to prevent metastability problems
•
Overflow and underflow control
Both ports are configurable in various sizes from 4k x 1 to 128 x 36, similar to the RAM block size. Each
port is fully synchronous.
Read and write operations can be completely independent. Data on the appropriate WD pins are written
to the FIFO on every active WCLK edge as long as WEN is high. Data is read from the FIFO and output
on the appropriate RD pins on every active RCLK edge as long as REN is asserted.
The FIFO block offers programmable almost-empty (AEMPTY) and almost-full (AFULL) flags as well as
EMPTY and FULL flags (Figure 2-61):
•
The FULL flag is synchronous to WCLK. It allows the FIFO to inhibit writing when full.
•
The EMPTY flag is synchronous to RCLK. It allows the FIFO to inhibit reading at the empty
condition.
Gray code counters are used to prevent metastability problems associated with flag logic. The depth of
the FIFO is dependent on the data width and the number of memory blocks used to create the FIFO. The
write operations to the FIFO are synchronous with respect to the WCLK, and the read operations are
synchronous with respect to the RCLK.
The FIFO block may be reset to the empty state.
RD [n-1:0]
RD
WD [n-1:0]
RCLK
WCLK
RCLK
WCLK
RAM
REN
WEN
PIPE
RA [J:0]
WA [J:0]
RW[2:0]
WW[2:0]
WD
FREN
CNT 16
E
FULL
=
AFULL
AFVAL
SUB 16
>
AEMPTY
>=
AEVAL
FWEN
CNT 16
E
WIDTH[2:0]
DEPTH[3:0]
=
EMPTY
CLR
Figure 2-61 • Axcelerator RAM with Embedded FIFO Controller
R ev i si o n 1 8
2- 95
Detailed Specifications
FIFO Flag Logic
The FIFO is user configurable into various DEPTHs and WIDTHs. Figure 2-62 shows the FIFO address
counter details.
•
Bits 11 to 5 are active for all modes.
•
As the data word size is reduced, more least-significant bits are added to the address.
•
As the number of cascaded blocks increases, the number of significant bits in the address
increases.
For example, if four blocks are cascaded as a 1kx16 FIFO with each block having a 1kx4 aspect ratio,
bits 11 to 2 of the address will be used to specify locations within each RAM block, whereas bits 13 and
12 will be used to specify the RAM block.
FIFO Address Counters
Mode when
Active
Counter
Bits
FIFO Address
Alignment of
Threshold bits
Cas 16 blks
CNTR [15]
activate
R/W EN[3]
Cas 8 blks
CNTR [14]
activate
R/W EN[2]
AEVAL/AFVAL[6]
Cas 4 blks
CNTR [13]
activate
R/W EN[1]
AEVAL/AFVAL[5]
CNTR [12]
activate
R/W EN[0]
AEVAL/AFVAL[4]
Cas 2 blks
by 36
R/W ADD[11:8]
CNTR [11:5]
R/W
ADD[7:5]
always active
AEVAL/AFVAL[7]
AEVAL/AFVAL[3:0]
not compared
by 18
CNTR [4]
activate
R/W ADD[4]
not compared
by 9
CNTR [3]
activate
R/W ADD[3]
not compared
by 4
CNTR [2]
activate
R/W ADD[2]
not compared
by 2
CNTR [1]
activate
R/W ADD[1]
not compared
by 1
CNTR [0]
activate
R/W ADD[0]
not compared
[15:W]
[14:W]
[13:W]
[12:W]
128x36 256x18
[11:5]
512x9
[11:4]
1kx4
2kx2
4kx1
[11:3]
[11:2]
CNTR [15:0]
[11:1]
[11:0]
Variable Active Address Space
>> REN [4:0], RAD [11:0]
>> WEN [4:0], WAD [11:0]
Note: Inactive counter bits are set to zero.
Figure 2-62 • FIFO Address Counters
The AFULL and AEMPTY flag threshold values are programmable. The threshold values are AFVAL and
AEVAL, respectively. Although the trigger threshold for each flag is defined with eight bits, the effective
number of threshold bits in the comparison depends on the configuration. The effective number of
threshold bits corresponds to the range of active bits in the FIFO address space (Table 2-94).
Table 2-94 • FIFO Flag Logic
Inactive
AEVAL/AFVAL Bits
Inactive DIFF
Bits (set to 0)
Non-cascade
[7:4]
[15:12]
DIFF[11:8] withAE/FVAL[3:0]
Cascade 2 blocks
[7:5]
[15:13]
DIFF[12:8] withAE/FVAL[4:0]
Cascade 4 blocks
[7:6]
[15:14]
DIFF[13:8] withAE/FVAL[5:0]
Cascade 8 blocks
[7]
[15]
DIFF[14:8] withAE/FVAL[6:0]
Cascade 16 blocks
None
None
DIFF[15:8] withAE/FVAL[7:0]
Mode
2- 96
R ev i sio n 1 8
DIFF Comparison to AFVAL/AEVAL
Axcelerator Family FPGAs
Figure 2-63 illustrates flag generation.
ALMOST EMPTY and ALMOST FULL Logic
AEMPTY
AEVAL [7:0], GND [7:0] (MSB....LSB)
X
WCLK
Y
16
WCNTR
[15:0]
X>=Y
(16 bit)
DIFF [15:0]
RCLK
16
RCNTR
[15:0]
AFULL
X
AFVAL [7:0], GND [7:0] (MSB....LSB) Y
Figure 2-63 • ALMOST-EMPTY and ALMOST-FULL Logic
The Verilog codes for the flags are:
assign AF = (DIFF[15:0] >={AFVAL[7:0],8'b00000000})?1:0;
assign AE = ({AEVAL[7:0],8'b00000000}>=DIFF[15:0])?1:0;
The number of DIFF-bits active depends on the configuration depth and width (Table 2-95).
Table 2-95 • Number of Available Configuration Bits
Number of Blocks
Block DxW
Number of AEVAL/AFVAL Bits
1
1x1
4
2
1x2
4
2
2x1
5
4
1x4
4
4
2x2
5
4
4x1
6
8
1x8
4
8
2x4
5
8
4x2
6
8
8x1
7
16
1x16
4
16
2x8
5
16
4x4
6
16
8x2
7
16
16x1
8
The active-high CLR pin is used to reset the FIFO to the empty state, which sets FULL and AFULL low,
and EMPTY and AEMPTY high.
Assuming that the EMPTY flag is not set, new data is read from the FIFO when REN is valid on the active
edge of the clock. Write and read transfers are described with timing requirements in "Timing
Characteristics" on page 2-100.
R ev i si o n 1 8
2- 97
Detailed Specifications
Glitch Elimination
An analog filter is added to each FIFO controller to guarantee glitch-free FIFO-flag logic.
Overflow and Underflow Control
The counter MSB keeps track of the difference between the read address (RA) and the write address
(WA). The EMPTY flag is set when the read and write addresses are equal. To prevent underflow, the
write address is double-sampled by the read clock prior to comparison with the read address (part A in
Figure 2-64). To prevent overflow, the read address is double-sampled by the write clock prior to
comparison to the write address (part B in Figure 2-64).
A
B
RA
WA
RCLK
RA
=
=
EMPTY WCLK
WA
FULL
Figure 2-64 • Overflow and Underflow Control
FIFO Configurations
Unlike the RAM, the FIFO's write width and read width cannot be specified independently. For the FIFO,
the write and read widths must be the same. The WIDTH pins are used to specify one of six allowable
word widths, as shown in Table 2-96.
Table 2-96 • FIFO Width Configurations
WIDTH(2:0)
WxD
000
1 x 4k
001
2 x 2k
010
4 x 1k
011
9 x 512
100
18 x 256
101
36 x 128
11x
reserved
The DEPTH pins allow RAM cells to be cascaded to create larger FIFOs. The four pins allow depths of 2,
4, 8, and 16 to be specified. Table 2-86 on page 2-87 describes the FIFO depth options for various data
width and memory blocks.
Interface
Figure 2-65 on page 2-99 shows a logic block diagram of the Axcelerator FIFO module.
Cascading FIFO Blocks
FIFO blocks can be cascaded to create deeper FIFO functions. When building larger FIFO blocks, if the
word width can be fractured in a multi-bit FIFO, the fractured word configuration is recommended over a
cascaded configuration. For example, 256x36 can be configured as two blocks of 256x18. This should be
taken into account when building the FIFO blocks manually. However, when using SmartGen, the user
only needs to specify the depth and width of the necessary FIFO blocks. SmartGen automatically
configures these blocks to optimize performance.
2- 98
R ev i sio n 1 8
Axcelerator Family FPGAs
Clock
As with RAM configuration, the RCLK and WCLK pins have independent polarity selection.
DEPTH [3:0]
RD [35:0]
WIDTH [2:0]
PIPE
FREN
FULL
RCLK
AEVAL [7:0]
EMPTY
AFULL
AEMPTY
AFVAL [7:0]
WD [35:0]
FWEN
WCLK
CLR
Figure 2-65 • FIFO Block Diagram
Table 2-97 • FIFO Signal Description
Signal
Direction
Description
WCLK
Input
Write clock (active either edge).
FWEN
Input
FIFO write enable. When this signal is asserted, the WD bus data is
latched into the FIFO, and the internal write counters are incremented.
WD[N-1:0]
Input
Write data bus. The value N is dependent on the RAM configuration and
can be 1, 2, 4, 9, 18, or 36.
FULL
Output
Active high signal indicating that the FIFO is FULL. When this signal is
set, additional write requests are ignored.
AFULL
Output
Active high signal indicating that the FIFO is AFULL.
AFVAL
Input
8-bit input defining the AFULL value of the FIFO.
RCLK
Input
Read clock (active either edge).
FREN
Input
FIFO read enable.
RD[N-1:0]
Output
Read data bus. The value N is dependent on the RAM configuration and
can be 1, 2, 4, 9, 18, or 36.
EMPTY
Output
Empty flag indicating that the FIFO is EMPTY. When this signal is
asserted, attempts to read the FIFO will be ignored.
AEMPTY
Output
Active high signal indicating that the FIFO is AEMPTY.
AEVAL
Input
8-bit input defining the almost-empty value of the FIFO.
PIPE
Input
Sets the pipe option on or off.
CLR
Input
Active high clear input.
DEPTH
Input
Determines the depth of the FIFO and the number of FIFOs to be
cascaded.
WIDTH
Input
Determines the width of the dataword/FIFO, and the number of the
FIFOs to be cascaded.
R ev i si o n 1 8
2- 99
Timing Characteristics
WD
RD
AEMPTY
EMPTY
AFULL
FULL
FWEN
FREN
WCLK
RCLK
Clr
Figure 2-66 • FIFO Model
tWCKP
tWCKH
tWCKL
WCLK
tWSU
tWHD
WD<35:0>, FWEN
tCLR2HF
CLR
tCLR2xF
EMPTY, AEMPTY, AFULL, FULL
Figure 2-67 • FIFO Write Timing
tCK2xF
Axcelerator Family FPGAs
tRCKH
tRCKP
RCLK
tRSU
tRCKL
tRHD
FREN
tRCK2RD1
tRCK2RD2
RD <35:0>
tCLRHF
CLR
tCLR2xF
tCK2xF
EMPTY, AEMPTY, AFULL, FULL
Figure 2-68 • FIFO Read Timing
R ev i si o n 1 8
2- 101
Detailed Specifications
Table 2-98 • One FIFO Block
Worst-Case Commercial Conditions VCCA = 1.425 V, VCCI = 3.0 V, TJ = 70°C
–2 Speed
Parameter
Description
Min.
Max.
–1 Speed
Min.
Max.
Std Speed
Min.
Max.
Units
FIFO Module Timing
tWSU
Write Setup
11.40
12.98
15.26
ns
tWHD
Write Hold
0.22
0.25
0.30
ns
tWCKH
WCLK High
0.75
0.75
0.75
ns
tWCKL
WCLK Low
0.88
0.88
0.88
ns
tWCKP
Minimum WCLK Period
tRSU
Read Setup
11.63
13.25
15.58
ns
tRHD
Read Hold
0.00
0.00
0.00
ns
tRCKH
RCLK High
0.77
0.77
0.77
ns
tRCKL
RCLK Low
0.93
0.93
0.93
ns
tRCKP
Minimum RCLK period
tCLRHF
Clear High
0.00
0.00
0.00
ns
tCLR2FF
Clear-to-flag (EMPTY/FULL)
1.92
2.18
2.57
ns
tCLR2AF
Clear-to-flag (AEMPTY/AFULL)
4.39
5.00
5.88
ns
tCK2FF
Clock-to-flag (EMPTY/FULL)
2.13
2.42
2.85
ns
tCK2AF
Clock-to-flag (AEMPTY/AFULL)
5.04
5.75
6.75
ns
tRCK2RD1
RCLK-To-OUT (Pipelined)
1.32
1.51
1.77
ns
tRCK2RD2
RCLK-To-OUT (Non-Pipelined)
2.16
2.46
2.90
ns
1.63
1.63
1.70
1.63
1.70
ns
1.70
ns
Note: Timing data for this single block FIFO has a depth of 4,096. For all other combinations, use Microsemi’s timing
software.
2- 10 2
R ev isio n 1 8
Axcelerator Family FPGAs
Table 2-99 • Two FIFO Blocks Cascaded
Worst-Case Commercial Conditions VCCA = 1.425 V, VCCI = 3.0 V, TJ = 70°C
–2 Speed
Parameter
Description
Min.
Max.
–1 Speed
Min.
Max.
Std Speed
Min.
Max.
Units
FIFO Module Timing
tWSU
Write Setup
13.75
15.66
18.41
ns
tWHD
Write Hold
0.00
0.00
0.00
ns
tWCKH
WCLK High
0.75
0.75
0.75
ns
tWCKL
WCLK Low
1.76
1.76
1.76
ns
tWCKP
Minimum WCLK Period
tRSU
Read Setup
14.33
16.32
19.19
ns
tRHD
Read Hold
0.00
0.00
0.00
ns
tRCKH
RCLK High
0.73
0.73
0.73
ns
tRCKL
RCLK Low
1.89
1.89
1.89
ns
tRCKP
Minimum RCLK period
tCLRHF
Clear High
0.00
0.00
0.00
ns
tCLR2FF
Clear-to-flag (EMPTY/FULL)
1.92
2.18
2.57
ns
tCLR2AF
Clear-to-flag (AEMPTY/AFULL)
4.39
5.00
5.88
ns
tCK2FF
Clock-to-flag (EMPTY/FULL)
2.13
2.42
2.85
ns
tCK2AF
Clock-to-flag (AEMPTY/AFULL)
5.04
5.75
6.75
ns
tRCK2RD1
RCLK-To-OUT (Pipelined)
1.43
1.63
1.92
ns
tRCK2RD2
RCLK-To-OUT (Nonpipelined)
2.26
2.58
3.03
ns
2.51
2.51
2.62
2.51
2.62
ns
2.62
ns
Note: Timing data for these two cascaded FIFO blocks uses a depth of 8,192. For all other combinations, use
Microsemi’s timing software.
R ev i si o n 1 8
2- 103
Detailed Specifications
Table 2-100 • Four FIFO Blocks Cascaded
Worst-Case Commercial Conditions VCCA = 1.425 V, VCCI = 3.0 V, TJ = 70°C
–2 Speed
Parameter
Description
Min.
Max.
–1 Speed
Min.
Max.
Std Speed
Min.
Max.
Units
FIFO Module Timing
tWSU
Write Setup
14.60
16.63
19.55
ns
tWHD
Write Hold
0.00
0.00
0.00
ns
tWCKH
WCLK High
0.75
0.75
0.75
ns
tWCKL
WCLK Low
2.51
2.51
2.51
ns
tWCKP
Minimum WCLK Period
tRSU
Read Setup
15.27
17.39
20.44
ns
tRHD
Read Hold
0.00
0.00
0.00
ns
tRCKH
RCLK High
0.73
0.73
0.73
ns
tRCKL
RCLK Low
2.96
2.96
2.96
ns
tRCKP
Minimum RCLK period
tCLRHF
Clear High
0.00
0.00
0.00
ns
tCLR2FF
Clear-to-flag (EMPTY/FULL)
1.92
2.18
2.57
ns
tCLR2AF
Clear-to-flag (AEMPTY/AFULL)
4.39
5.00
5.88
ns
tCK2FF
Clock-to-flag (EMPTY/FULL)
2.13
2.42
2.85
ns
tCK2AF
Clock-to-flag (AEMPTY/AFULL)
5.04
5.75
6.75
ns
tRCK2RD1
RCLK-To-OUT (Pipelined)
2.36
2.69
3.16
ns
tRCK2RD2
RCLK-To-OUT (Nonpipelined)
2.83
3.23
3.79
ns
3.26
3.26
3.69
3.26
3.69
ns
3.69
ns
Note: Timing data for these four cascaded FIFO blocks uses a depth of 16,384. For all other combinations, use
Microsemi’s timing software.
2- 10 4
R ev isio n 1 8
Axcelerator Family FPGAs
Table 2-101 • Eight FIFO Blocks Cascaded
Worst-Case Commercial Conditions VCCA = 1.425 V, VCCI = 3.0 V, TJ = 70°C
–2 Speed
Parameter
Description
Min.
Max.
–1 Speed
Min.
Max.
Std Speed
Min.
Max.
Units
FIFO Module Timing
tWSU
Write Setup
15.46
17.61
20.70
ns
tWHD
Write Hold
0.00
0.00
0.00
ns
tWCKH
WCLK High
0.75
0.75
0.75
ns
tWCKL
WCLK Low
5.13
5.13
5.13
ns
tWCKP
Minimum WCLK Period
tRSU
Read Setup
16.22
18.47
21.72
ns
tRHD
Read Hold
0.00
0.00
0.00
ns
tRCKH
RCLK High
0.73
0.73
0.73
ns
tRCKL
RCLK Low
5.77
5.77
5.77
ns
tRCKP
Minimum RCLK period
tCLRHF
Clear High
0.00
0.00
0.00
ns
tCLR2FF
Clear-to-flag (EMPTY/FULL)
1.92
2.18
2.57
ns
tCLR2AF
Clear-to-flag (AEMPTY/AFULL)
4.39
5.00
5.88
ns
tCK2FF
Clock-to-flag (EMPTY/FULL)
2.13
2.42
2.85
ns
tCK2AF
Clock-to-flag (AEMPTY/AFULL)
5.04
5.75
6.75
ns
tRCK2RD1
RCLK-To-OUT (Pipelined)
3.39
3.86
4.54
ns
tRCK2RD2
RCLK-To-OUT (Nonpipelined)
4.93
5.62
6.61
ns
5.88
5.88
6.50
5.88
6.50
ns
6.50
ns
Note: Timing data for these eight cascaded FIFO blocks uses a depth of 32,768. For all other combinations, use
Microsemi’s timing software.
R ev i si o n 1 8
2- 105
Detailed Specifications
Table 2-102 • Sixteen FIFO Blocks Cascaded
Worst-Case Commercial Conditions VCCA = 1.425 V, VCCI = 3.0 V, TJ = 70°C
–2 Speed
Parameter
Description
Min.
Max.
–1 Speed
Min.
Max.
Std Speed
Min.
Max.
Units
FIFO Module Timing
tWSU
Write Setup
16.32
18.60
21.86
ns
tWHD
Write Hold
0.00
0.00
0.00
ns
tWCKH
WCLK High
0.75
0.75
0.75
ns
tWCKL
WCLK Low
13.40
13.40
13.40
ns
tWCKP
Minimum WCLK Period
tRSU
Read Setup
17.16
19.54
22.97
ns
tRHD
Read Hold
0.00
0.00
0.00
ns
tRCKH
RCLK High
0.73
0.73
0.73
ns
tRCKL
RCLK Low
14.41
14.41
14.41
ns
tRCKP
Minimum RCLK period
tCLRHF
Clear High
0.00
0.00
0.00
ns
tCLR2FF
Clear-to-flag (EMPTY/FULL)
1.92
2.18
2.57
ns
tCLR2AF
Clear-to-flag (AEMPTY/AFULL)
4.39
5.00
5.88
ns
tCK2FF
Clock-to-flag (EMPTY/FULL)
2.13
2.42
2.85
ns
tCK2AF
Clock-to-flag (AEMPTY/AFULL)
5.04
5.75
6.75
ns
tRCK2RD1
RCLK-To-OUT (Pipelined)
12.08
13.76
16.17
ns
tRCK2RD2
RCLK-To-OUT (Nonpipelined)
12.83
14.62
17.18
ns
14.15
14.15
15.14
14.15
15.14
ns
15.14
ns
Note: Timing data for these sixteen cascaded FIFO blocks uses a depth of 65,536. For all other combinations, use
Microsemi’s timing software.
Building RAM and FIFO Modules
RAM and FIFO modules can be generated and included in a design in two different ways:
•
Using the SmartGen Core Generator where the user defines the depth and width of the
FIFO/RAM, and then instantiates this block into the design (refer to the SmartGen, FlashROM,
Analog System Builder, and Flash Memory System Builder User’s Guide for more information).
•
The alternative is to instantiate the RAM/FIFO blocks manually, using inverters for polarity control
and tying all unused data bits to ground.
Other Architectural Features
Low Power Mode
Although designed for high performance, the AX architecture also allows the user to place the device into
a low power mode. Each I/O bank in an Axcelerator device can be configured individually, when in low
power mode, to tristate all outputs, disable inputs, or both. The low power mode is activated by asserting
the LP pin, which is grounded in normal operation.
While in the low power mode, the device is still fully functional and all internal logic states are preserved.
This allows a user to disable all but a few signals and operate the part in a low-frequency, watchdog
2- 10 6
R ev isio n 1 8
Axcelerator Family FPGAs
mode if desired. Please note, if the I/O bank is not disabled, differential I/Os belonging to the I/O bank will
still consume normal power, even when operating in the low power mode.
The Axcelerator device will resume normal operation 10μs after the LP pin is pulled Low.
To further reduce power consumption, the internal charge pump can be bypassed and an external power
supply voltage can be used instead. This saves the internal charge-pump operating current, resulting in
no DC current draw. The Axcelerator family devices have a dedicated "VPUMP" pin that can be used to
access an external charge pump device. In normal chip operation, when using the internal charge pump,
VPUMP should be tied to GND. When the voltage level on VPUMP is set to 3.3V, the internal charge pump
is turned off, and the VPUMP voltage will be used as the charge pump voltage. Adequate voltage
regulation (i.e. high drive, low output impedance, and good decoupling) should be used at VPUMP.
In addition, any PLL in use can be powered down to further reduce power consumption. This can be
done with the PowerDown pin driven Low. Driving this pin High restarts the PLL with the output clock(s)
being stable once lock is restored.
JTAG
Axcelerator offers a JTAG interface that is compliant with the IEEE 1149.1 standard. The user can
employ the JTAG interface for probing a design and performing any JTAG Public Instructions as defined
in the Table 2-103.
Table 2-103 • JTAG Instruction Code
Instruction (IR4:IR0)
Binary Code
Extest
00000
Preload / Sample
00001
Intest
00010
USERCODE
00011
IDCODE
00100
HIGHZ
01110
CLAMP
01111
Diagnostic
10000
Reserved
All others
Bypass
11111
Interface
The interface consists of four inputs: Test Mode Select (TMS), Test Data In (TDI), Test Clock (TCK), TAP
Controller Reset (TRST), and an output, Test Data Out (TDO). TMS, TDI, and TRST have on-chip pull-up
resistors.
TRST
TRST (Test-Logic Reset) is an active-low, asynchronous reset signal to the TAP controller. The TRST
input can be used to reset the Test Access Port (TAP) Controller to the TRST state. The TAP Controller
can be held at this state permanently by grounding the TRST pin. To hold the JTAG TAP controller in the
TRST state, it is recommended to connect TRST to ground via a 1 kΩ resistor.
There is an optional internal pull-up resistor available for the TRST input that can be set by the user at
programming. Care should be exercised when using this option in combination with an external tie-off to
ground.
An on-chip power-on-reset (POWRST) circuit is included. POWRST has the same function as "TRST,"
but it only occurs at power-up or during recovery from a VCCA and/or VCCDA voltage drop.
R ev i si o n 1 8
2- 107
Detailed Specifications
TDO
TDO is normally tristated, and it is active only when the TAP controller is in the "Shift_DR" state or
"Shift_IR" state. The least significant bit of the selected register (i.e. IR or DR) is clocked out to TDO first
by the falling edge of TCK.
TAP Controller
The TAP Controller is compliant with the IEEE Standard 1149.1. It is a state machine of 16 states that
controls the Instruction Register (IR) and the Data Registers (such as BSR, IDCODE, USRCODE,
BYPASS, etc.). The TAP Controller steps into one of the states depending on the sequence of TMS at
the rising edges of TCK.
Instruction Register (IR)
The IR has five bits (IR4 to IR0). At the TRST state, IR is reset to IDCODE. Each time when IR is
selected, it goes through "select IR-Scan," "Capture-IR," "Shift-IR," all the way through "Update-IR."
When there is no test error, the first five data bits coming out of TDO during the "Shift-IR" will be "10111".
If a test error occurs, the last three bits will contain one to three zeroes corresponding to negatively
asserted signals: "TDO_ERRORB," "PROBA_ERRORB," and "PROBB_ERRORB." The error(s) will be
erased when the TAP is at the "Update-IR" or the TRST state. When in user mode start-up sequence, if
the micro-probe has not been used, the "PROBA_ERRORB" is used as a "Power-up done successfully"
flag.
Data Registers (DRs)
Data registers are distributed throughout the chip. They store testing/programming vectors. The MSB of
a data register is connected to TDI, while the LSB is connected to TDO. There are different types of data
registers. Descriptions of the main registers are as follow:
1. IDCODE:
The IDCODE is a 20-bit hard coded JTAG Silicon Signature. It is a hardwired device ID code,
which contains the Microsemi identity, part number, and version number in a specific JTAG
format.
2. USERCODE:
The USERCODE is a 33-bit programmable register. However, only 20 bits are allocated to use as
JTAG Silicon Signature. It is a supplementary identity code for the user to program information to
distinguish different programmed parts. USERCODE fuses will read out as "zeroes" when not
programmed, so only the "1" bits need to be programmed.
3. Boundary-Scan Register (BSR):
Each I/O contains three Boundary-Scan Cells. Each cell has a shift register bit, a latch, and two
MUXes. The boundary-scan cells are used for the Output-enable (E), Output (O), and Input (I)
registers. The bit order of the boundary-scan cells for each of them is E-O-I. The boundary-scan
cells are then chained serially to form the Boundary-Scan Register (BSR). The length of the BSR
is the number of I/Os in the die multiplied by three.
4. Bypass Register (BYR):
This is the "1-bit" register. It is used to shorten the TDI-TDO serial chain in board-level testing to
only one bit per device not being tested. It is also selected for all "reserved" or unused
instructions.
Probing
Internal activities of the JTAG interface can be observed via the Silicon Explorer II probes: "PRA," "PRB,"
"PRC," and "PRD."
Special Fuses
Security
Microsemi antifuse FPGAs, with FuseLock technology, offer the highest level of design security available
in a programmable logic device. Since antifuse FPGAs are live-at power-up, there is no bitstream that
can be intercepted, and no bitstream or programming data is ever downloaded to the device during
power-up, thus protecting against device cloning. In addition, special security fuses are hidden
2- 10 8
R ev isio n 1 8
Axcelerator Family FPGAs
throughout the fabric of the device and may be programmed by the user to thwart attempts to reverse
engineer the device by attempting to exploit either the programming or probing interfaces. Both invasive
and noninvasive attacks against an Axcelerator device that access or bypass these security fuses will
destroy access to the rest of the device. (refer to the Design Security in Nonvolatile Flash and Antifuse
FPGAs white paper).
Look for this symbol to ensure your valuable IP is protected with highest level of security in the industry.
™
u e
Figure 2-69 • FuseLock Logo
To ensure maximum security in Axcelerator devices, it is recommended that the user program the device
security fuse (SFUS). When programmed, the Silicon Explorer II testing probes are disabled to prevent
internal probing, and the programming interface is also disabled. All JTAG public instructions are still
accessible by the user.
For more information, refer to the Implementation of Security in Actel Antifuse FPGAs application note.
Global Set Fuse
The Global Set Fuse determines if all R-cells and I/O registers (InReg, OutReg, and EnReg) are either
cleared or preset by driving the GCLR and GPSET inputs of all R-cells and I/O Registers (Figure 2-31 on
page 2-58). Default setting is to clear all registers (GCLR = 0 and GPSET =1) at device power-up. When
the GBSETFUS option is checked during FUSE file generation, all registers are preset (GCLR = 1 and
GPSET= 0). A local CLR or PRESET will take precedence over this setting. Both pins are pulled High
during normal device operation. For use details, see the Libero IDE online help.
Silicon Explorer II Probe Interface
Silicon Explorer II is an integrated hardware and software solution that, in conjunction with the Designer
tools, allows users to examine any of the internal nets (except I/O registers) of the device while it is
operating in a prototype or a production system. The user can probe up to four nodes at a time without
changing the placement and routing of the design and without using any additional device resources.
Highlighted nets in Designer’s ChipPlanner can be accessed using Silicon Explorer II in order to observe
their real time values.
Silicon Explorer II's noninvasive method does not alter timing or loading effects, thus shortening the
debug cycle. In addition, Silicon Explorer II does not require relayout or additional MUXes to bring signals
out to external pins, which is necessary when using programmable logic devices from other suppliers. By
eliminating multiple place-and-route program cycles, the integrity of the design is maintained throughout
the debug process.
Each member of the Axcelerator family has four external pads: PRA, PRB, PRC, and PRD. These can be
used to bring out four probe signals from the Axcelerator device (note that the AX125 only has two probe
signals that can be observed: PRA and PRB). Each core tile has up to two probe signals. To disallow
probing, the SFUS security fuse in the silicon signature has to be programmed (see "Special Fuses" on
page 2-108).
Silicon Explorer II connects to the host PC using a standard serial port connector. Connections to the
circuit board are achieved using a nine-pin D-Sub connector (Figure 1-9 on page 1-7). Once the design
has been placed-and-routed, and the Axcelerator device has been programmed, Silicon Explorer II can
be connected and the Explorer software can be launched.
Silicon Explorer II comes with an additional optional PC hosted tool that emulates an 18-channel logic
analyzer. Four channels are used to monitor four internal nodes, and 14 channels are available to probe
external signals. The software included with the tool provides the user with an intuitive interface that
allows for easy viewing and editing of signal waveforms.
R ev i si o n 1 8
2- 109
Detailed Specifications
Programming
Device programming is supported through the Silicon Sculptor II, a single-site, robust and compact
device programmer for the PC. Up to four Silicon Sculptor IIs can be daisy-chained and controlled from a
single PC host. With standalone software for the PC, Silicon Sculptor II is designed to allow concurrent
programming of multiple units from the same PC when daisy-chained.
Silicon Sculptor II programs devices independently to achieve the fastest programming times possible.
Each fuse is verified by Silicon Sculptor II to ensure correct programming. Furthermore, at the end of
programming, there are integrity tests that are run to ensure that programming was completed properly.
Not only does it test programmed and nonprogrammed fuses, Silicon Sculptor II also provides a self-test
to test its own hardware extensively.
Programming an Axcelerator device using Silicon Sculptor II is similar to programming any other antifuse
device. The procedure is as follows:
1. Load the *.AFM file.
2. Select the device to be programmed.
3. Begin programming.
When the design is ready to go to production, Microsemi offers device volume-programming services
either through distribution partners or via our In-House Programming Center.
In addition, BP Microsystems offers multi-site programmers that provide qualified support for Axcelerator
devices.
For more details on programming the Axcelerator devices, please refer to the Silicon Sculptor II User’s
Guide.
2- 11 0
R ev isio n 1 8
Axcelerator Family FPGAs
R ev i si o n 1 8
2- 111
3 – Package Pin Assignments
BG729
A1 Ball Pad Corner
27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
AD
AE
AF
AG
Note
For Package Manufacturing and Environmental information, visit Resource center at
http://www.microsemi.com/soc/products/rescenter/package/index.html.
R ev i si o n 1 8
3 -1
Package Pin Assignments
BG729
BG729
AX1000 Function
Pin
Number
Bank 0
3- 2
BG729
AX1000 Function
Pin
Number
AX1000 Function
Pin
Number
IO18NB0F1
C10
IO36NB1F3
H15
IO00NB0F0
E6
IO18PB0F1
C9
IO36PB1F3
G15
IO00PB0F0
F6
IO19NB0F1
E11
IO37NB1F3
C17
IO01NB0F0
G8
IO19PB0F1
F11
IO37PB1F3
C16
IO01PB0F0
G7
IO20NB0F1
G12
IO38NB1F3
B18
IO02NB0F0
D7
IO20PB0F1
H12
IO38PB1F3
B17
IO02PB0F0
E7
IO21NB0F1
D11
IO39NB1F3
A18
IO03NB0F0
D5
IO21PB0F1
D10
IO39PB1F3
A17
IO03PB0F0
E5
IO22NB0F2
A10
IO40NB1F3
H16
IO04NB0F0
G9
IO22PB0F2
A9
IO40PB1F3
G16
IO04PB0F0
H9
IO23NB0F2
B11
IO41NB1F4
B19
IO05NB0F0
E8
IO23PB0F2
B10
IO41PB1F4
A19
IO05PB0F0
F8
IO24NB0F2
G13
IO42NB1F4
C19
IO06NB0F0
C6
IO24PB0F2
H13
IO42PB1F4
C18
IO06PB0F0
D6
IO25NB0F2
C12
IO43NB1F4
D18
IO07NB0F0
B5
IO25PB0F2
C11
IO43PB1F4
D17
IO07PB0F0
C5
IO26NB0F2
E12
IO44NB1F4
H17
IO08NB0F0
A6
IO26PB0F2
D12
IO44PB1F4
G17
IO08PB0F0
A5
IO27NB0F2
E13
IO45NB1F4
F17
IO09NB0F0
E9
IO27PB0F2
F13
IO45PB1F4
E17
IO09PB0F0
F9
IO28NB0F2
G14
IO46NB1F4
B20
IO10NB0F0
G10
IO28PB0F2
H14
IO46PB1F4
A20
IO10PB0F0
H10
IO29NB0F2
A12
IO47NB1F4
C21
IO11NB0F0
B7
IO29PB0F2
B12
IO47PB1F4
C20
IO11PB0F0
B6
IO30NB0F2/HCLKAN
C13
IO48NB1F4
H18
IO12NB0F1
C8
IO30PB0F2/HCLKAP
D13
IO48PB1F4
G18
IO12PB0F1
C7
IO31NB0F2/HCLKBN
F14
IO49NB1F4
F18
IO13NB0F1
E10
IO31PB0F2/HCLKBP
E14
IO49PB1F4
E18
IO13PB0F1
F10
Bank 1
IO50NB1F4
D20
IO14NB0F1
G11
IO32NB1F3/HCLKCN
C14
IO50PB1F4
D19
IO14PB0F1
H11
IO32PB1F3/HCLKCP
B14
IO51NB1F4
A22
IO15NB0F1
D9
IO33NB1F3/HCLKDN
D16
IO51PB1F4
A21
IO15PB0F1
D8
IO33PB1F3/HCLKDP
D15
IO52NB1F4
B22
IO16NB0F1
A8
IO34NB1F3
B16
IO52PB1F4
B21
IO16PB0F1
A7
IO34PB1F3
A16
IO53NB1F4
F19
IO17NB0F1
B9
IO35NB1F3
E15
IO53PB1F4
E19
IO17PB0F1
B8
IO35PB1F3
F15
IO54NB1F5
F20
R ev isio n 1 8
Axcelerator Family FPGAs
BG729
BG729
BG729
AX1000 Function
Pin
Number
AX1000 Function
Pin
Number
AX1000 Function
Pin
Number
IO54PB1F5
E20
IO72PB2F6
J23
IO91NB2F8
N25
IO55NB1F5
E21
IO73NB2F6
H24
IO91PB2F8
N24
IO55PB1F5
D21
IO73PB2F6
H23
IO92NB2F8
N27
IO56NB1F5
H19
IO74NB2F7
L21
IO92PB2F8
N26
IO56PB1F5
G19
IO74PB2F7
K21
IO93NB2F8
P26
IO57NB1F5
D22
IO75NB2F7
G27
IO93PB2F8
P27
IO57PB1F5
C22
IO75PB2F7
F27
IO94NB2F8
N19
IO58NB1F5
B23
IO76NB2F7
K23
IO94PB2F8
N20
IO58PB1F5
A23
IO76PB2F7
K22
IO95NB2F8
P23
IO59NB1F5
D23
IO77NB2F7
H26
IO95PB2F8
P22
IO59PB1F5
C23
IO77PB2F7
H25
IO60NB1F5
G21
IO78NB2F7
K25
IO96NB3F9
P25
IO60PB1F5
G20
IO78PB2F7
K24
IO96PB3F9
P24
IO61NB1F5
E23
IO79NB2F7
J26
IO97NB3F9
R26
IO61PB1F5
E22
IO79PB2F7
J25
IO97PB3F9
R27
IO62NB1F5
F22
IO80NB2F7
M20
IO98NB3F9
P21
IO62PB1F5
F21
IO80PB2F7
L20
IO98PB3F9
P20
IO63NB1F5
H20
IO81NB2F7
J27
IO99NB3F9
R24
IO63PB1F5
J19
IO81PB2F7
H27
IO99PB3F9
R25
IO82NB2F7
L23
IO100NB3F9
T26
Bank 2
Bank 3
IO64NB2F6
J21
IO82PB2F7
L22
IO100PB3F9
T27
IO64PB2F6
H21
IO83NB2F7
L25
IO101NB3F9
T24
IO65NB2F6
F24
IO83PB2F7
L24
IO101PB3F9
T25
IO65PB2F6
F23
IO84NB2F7
N21
IO102NB3F9
R20
IO66NB2F6
F26
IO84PB2F7
M21
IO102PB3F9
R21
IO66PB2F6
F25
IO85NB2F8
K27
IO103NB3F9
R23
IO67NB2F6
E26
IO85PB2F8
K26
IO103PB3F9
R22
IO67PB2F6
E25
IO86NB2F8
M23
IO104NB3F9
U26
IO68NB2F6
J22
IO86PB2F8
M22
IO104PB3F9
U27
IO68PB2F6
H22
IO87NB2F8
M25
IO105NB3F9
U24
IO69NB2F6
G24
IO87PB2F8
M24
IO105PB3F9
U25
IO69PB2F6
G23
IO88NB2F8
L27
IO106NB3F9
R19
IO70NB2F6
K20
IO88PB2F8
L26
IO106PB3F9
P19
IO70PB2F6
J20
IO89NB2F8
M27
IO107NB3F10
V26
IO71NB2F6
G26
IO89PB2F8
M26
IO107PB3F10
V27
IO71PB2F6
G25
IO90NB2F8
N23
IO108NB3F10
T23
IO72NB2F6
J24
IO90PB2F8
N22
IO108PB3F10
T22
R ev i si o n 1 8
3 -3
Package Pin Assignments
BG729
3- 4
BG729
BG729
AX1000 Function
Pin
Number
AX1000 Function
Pin
Number
AX1000 Function
Pin
Number
IO109NB3F10
V24
IO127PB3F11
AC27
IO145PB4F13
AD19
IO109PB3F10
V25
IO128NB3F11
Y20
IO146NB4F13
AC18
IO110NB3F10
T20
IO128PB3F11
W19
IO146PB4F13
AB18
IO110PB3F10
T21
IO147NB4F13
Y17
IO111NB3F10
W26
IO129NB4F12
AA20
IO147PB4F13
AA17
IO111PB3F10
W27
IO129PB4F12
Y21
IO148NB4F13
AF19
IO112NB3F10
U22
IO130NB4F12
AB22
IO148PB4F13
AF20
IO112PB3F10
U23
IO130PB4F12
AB23
IO149NB4F13
AC17
IO113NB3F10
Y26
IO131NB4F12
AC22
IO149PB4F13
AB17
IO113PB3F10
Y27
IO131PB4F12
AC23
IO150NB4F13
AE18
IO114NB3F10
U20
IO132NB4F12
AD23
IO150PB4F13
AE19
IO114PB3F10
U21
IO132PB4F12
AD24
IO151NB4F13
AA16
IO115NB3F10
W24
IO133NB4F12
AF23
IO151PB4F13
Y16
IO115PB3F10
W25
IO133PB4F12
AE23
IO152NB4F14
AG18
IO116NB3F10
V22
IO134NB4F12
AC21
IO152PB4F14
AG19
IO116PB3F10
V23
IO134PB4F12
AB21
IO153NB4F14
AC16
IO117NB3F10
Y24
IO135NB4F12
AC20
IO153PB4F14
AB16
IO117PB3F10
Y25
IO135PB4F12
AB20
IO154NB4F14
AF17
IO118NB3F11
V20
IO136NB4F12
AD21
IO154PB4F14
AF18
IO118PB3F11
V21
IO136PB4F12
AD22
IO155NB4F14
AB15
IO119NB3F11
AA26
IO137NB4F12
Y19
IO155PB4F14
AC15
IO119PB3F11
AA27
IO137PB4F12
AA19
IO156NB4F14
AE16
IO120NB3F11
W22
IO138NB4F12
AE21
IO156PB4F14
AE17
IO120PB3F11
W23
IO138PB4F12
AE22
IO157NB4F14
Y15
IO121NB3F11
AA24
IO139NB4F13
AF21
IO157PB4F14
AA15
IO121PB3F11
AA25
IO139PB4F13
AF22
IO158NB4F14
AG16
IO122NB3F11
W20
IO140NB4F13
AG22
IO158PB4F14
AG17
IO122PB3F11
W21
IO140PB4F13
AG23
IO159NB4F14/CLKEN
AF15
IO123NB3F11
AB26
IO141NB4F13
Y18
IO159PB4F14/CLKEP
AF16
IO123PB3F11
AB27
IO141PB4F13
AA18
IO160NB4F14/CLKFN
AD14
IO124NB3F11
Y22
IO142NB4F13
AE20
IO160PB4F14/CLKFP
AD15
IO124PB3F11
Y23
IO142PB4F13
AD20
IO125NB3F11
AB24
IO143NB4F13
AG20
IO161NB5F15/CLKGN
AE14
IO125PB3F11
AB25
IO143PB4F13
AG21
IO161PB5F15/CLKGP
AE15
IO126NB3F11
AA22
IO144NB4F13
AC19
IO162NB5F15/CLKHN
AC13
IO126PB3F11
AA23
IO144PB4F13
AB19
IO162PB5F15/CLKHP
AD13
IO127NB3F11
AC26
IO145NB4F13
AD18
IO163NB5F15
Y14
Bank 4
R ev isio n 1 8
Bank 5
Axcelerator Family FPGAs
BG729
BG729
BG729
AX1000 Function
Pin
Number
AX1000 Function
Pin
Number
AX1000 Function
Pin
Number
IO163PB5F15
AA14
IO182NB5F17
AF7
IO200NB6F18
AA4
IO164NB5F15
AE13
IO182PB5F17
AG7
IO200PB6F18
AA5
IO164PB5F15
AF13
IO183NB5F17
AD7
IO201NB6F18
W5
IO165NB5F15
AF12
IO183PB5F17
AE7
IO201PB6F18
W6
IO165PB5F15
AG12
IO184NB5F17
AC7
IO202NB6F18
AB1
IO166NB5F15
AD12
IO184PB5F17
AC8
IO202PB6F18
AC1
IO166PB5F15
AE12
IO185NB5F17
AF6
IO203NB6F19
Y3
IO167NB5F15
Y13
IO185PB5F17
AG6
IO203PB6F19
AA3
IO167PB5F15
AA13
IO186NB5F17
AB7
IO204NB6F19
AA2
IO168NB5F15
AD11
IO186PB5F17
AB8
IO204PB6F19
AB2
IO168PB5F15
AE11
IO187NB5F17
Y9
IO205NB6F19
U8
IO169NB5F15
AG11
IO187PB5F17
AA9
IO205PB6F19
V8
IO169PB5F15
AF11
IO188NB5F17
AD6
IO206NB6F19
V5
IO170NB5F15
AB11
IO188PB5F17
AE6
IO206PB6F19
V6
IO170PB5F15
AC11
IO189NB5F17
AB6
IO207NB6F19
Y1
IO171NB5F16
AF10
IO189PB5F17
AC6
IO207PB6F19
AA1
IO171PB5F16
AG10
IO190NB5F17
AF5
IO208NB6F19
W4
IO172NB5F16
AD10
IO190PB5F17
AG5
IO208PB6F19
Y4
IO172PB5F16
AE10
IO191NB5F17
AA6
IO209NB6F19
T7
IO173NB5F16
Y12
IO191PB5F17
AA7
IO209PB6F19
U7
IO173PB5F16
AA12
IO192NB5F17
Y8
IO210NB6F19
W2
IO174NB5F16
AB10
IO192PB5F17
AA8
IO210PB6F19
Y2
IO174PB5F16
AC10
IO211NB6F19
U5
IO175NB5F16
AF9
IO193NB6F18
W8
IO211PB6F19
U6
IO175PB5F16
AG9
IO193PB6F18
Y7
IO212NB6F19
V3
IO176NB5F16
AD9
IO194NB6F18
AB5
IO212PB6F19
W3
IO176PB5F16
AE9
IO194PB6F18
AC5
IO213NB6F19
R9
IO177NB5F16
Y11
IO195NB6F18
AC2
IO213PB6F19
T8
IO177PB5F16
AA11
IO195PB6F18
AC3
IO214NB6F20
U4
IO178NB5F16
AF8
IO196NB6F18
AC4
IO214PB6F20
V4
IO178PB5F16
AG8
IO196PB6F18
AD4
IO215NB6F20
T5
IO179NB5F16
AD8
IO197NB6F18
Y5
IO215PB6F20
T6
IO179PB5F16
AE8
IO197PB6F18
Y6
IO216NB6F20
V1
IO180NB5F16
AB9
IO198NB6F18
AB3
IO216PB6F20
W1
IO180PB5F16
AC9
IO198PB6F18
AB4
IO217NB6F20
R7
IO181NB5F17
Y10
IO199NB6F18
V7
IO217PB6F20
R8
IO181PB5F17
AA10
IO199PB6F18
W7
IO218NB6F20
U2
Bank 6
R ev i si o n 1 8
3 -5
Package Pin Assignments
BG729
BG729
AX1000 Function
Pin
Number
AX1000 Function
Pin
Number
AX1000 Function
Pin
Number
IO218PB6F20
V2
IO236PB7F22
L1
IO255NB7F23
F5
IO219NB6F20
T1
IO237NB7F22
L4
IO255PB7F23
G5
IO219PB6F20
U1
IO237PB7F22
L3
IO256NB7F23
F3
IO220NB6F20
R5
IO238NB7F22
L6
IO256PB7F23
F4
IO220PB6F20
R6
IO238PB7F22
M6
IO257NB7F23
H7
IO221NB6F20
T3
IO239NB7F22
M8
IO257PB7F23
J7
IO221PB6F20
T4
IO239PB7F22
M7
IO222NB6F20
R2
IO240NB7F22
K2
GND
A1
IO222PB6F20
T2
IO240PB7F22
K1
GND
A2
IO223NB6F20
P8
IO241NB7F22
K4
GND
A25
IO223PB6F20
P9
IO241PB7F22
K3
GND
A26
IO224NB6F20
R3
IO242NB7F22
K5
GND
A27
IO224PB6F20
R4
IO242PB7F22
L5
GND
A3
IO243NB7F22
J2
GND
AC24
Bank 7
3- 6
BG729
Dedicated I/O
IO225NB7F21
P1
IO243PB7F22
J1
GND
AE1
IO225PB7F21
R1
IO244NB7F22
J4
GND
AE2
IO226NB7F21
P3
IO244PB7F22
J3
GND
AE25
IO226PB7F21
P2
IO245NB7F22
H2
GND
AE26
IO227NB7F21
N7
IO245PB7F22
H1
GND
AE27
IO227PB7F21
P7
IO246NB7F22
H4
GND
AE3
IO228NB7F21
P5
IO246PB7F22
H3
GND
AE5
IO228PB7F21
P4
IO247NB7F23
L8
GND
AF1
IO229NB7F21
N2
IO247PB7F23
L7
GND
AF2
IO229PB7F21
N1
IO248NB7F23
J6
GND
AF25
IO230NB7F21
N6
IO248PB7F23
K6
GND
AF26
IO230PB7F21
P6
IO249NB7F23
H5
GND
AF27
IO231NB7F21
N9
IO249PB7F23
J5
GND
AF3
IO231PB7F21
N8
IO250NB7F23
G2
GND
AG1
IO232NB7F21
N4
IO250PB7F23
G1
GND
AG2
IO232PB7F21
N3
IO251NB7F23
K8
GND
AG25
IO233NB7F21
M2
IO251PB7F23
K7
GND
AG26
IO233PB7F21
M1
IO252NB7F23
G4
GND
AG27
IO234NB7F21
M4
IO252PB7F23
G3
GND
AG3
IO234PB7F21
M3
IO253NB7F23
F2
GND
B1
IO235NB7F21
M5
IO253PB7F23
F1
GND
B2
IO235PB7F21
N5
IO254NB7F23
G6
GND
B25
IO236NB7F22
L2
IO254PB7F23
H6
GND
B26
R ev isio n 1 8
Axcelerator Family FPGAs
BG729
BG729
BG729
AX1000 Function
Pin
Number
AX1000 Function
Pin
Number
AX1000 Function
Pin
Number
GND
B27
GND
R11
VCCA
K11
GND
B3
GND
R12
VCCA
K17
GND
C1
GND
R13
VCCA
K18
GND
C2
GND
R14
VCCA
L10
GND
C25
GND
R15
VCCA
L18
GND
C26
GND
R16
VCCA
U10
GND
C27
GND
R17
VCCA
U18
GND
C3
GND
T11
VCCA
V10
GND
E27
GND
T12
VCCA
V11
GND
L11
GND
T13
VCCA
V17
GND
L12
GND
T14
VCCA
V18
GND
L13
GND
T15
VCCPLA
A13
GND
L14
GND
T16
VCCPLB
J13
GND
L15
GND
T17
VCCPLC
B15
GND
L16
GND
U11
VCCPLD
C15
GND
L17
GND
U12
VCCPLE
AG14
GND
M11
GND
U13
VCCPLF
AF14
GND
M12
GND
U14
VCCPLG
AB13
GND
M13
GND
U15
VCCPLH
AG13
GND
M14
GND
U16
VCCDA
A11
GND
M15
GND
U17
VCCDA
AB12
GND
M16
GND/LP
J8
VCCDA
AC12
GND
M17
NC
U3
VCCDA
AC25
GND
N11
PRA
J14
VCCDA
AD16
GND
N12
PRB
D14
VCCDA
AD17
GND
N13
PRC
V14
VCCDA
E16
GND
N14
PRD
AB14
VCCDA
E2
GND
N15
TCK
E4
VCCDA
E24
GND
N16
TDI
D4
VCCDA
F12
GND
N17
TDO
J9
VCCDA
F16
GND
P11
TMS
H8
VCCDA
F7
GND
P12
TRST
E3
VCCDA
K14
GND
P13
VCCA
AA21
VCCDA
P10
GND
P14
VCCA
AD5
VCCDA
P18
GND
P15
VCCA
E1
VCCDA
W14
GND
P16
VCCA
G22
VCCDA
W9
GND
P17
VCCA
K10
VCCIB0
A4
R ev i si o n 1 8
3 -7
Package Pin Assignments
BG729
3- 8
BG729
AX1000 Function
Pin
Number
AX1000 Function
Pin
Number
VCCIB0
B4
VCCIB4
W17
VCCIB0
C4
VCCIB4
W18
VCCIB0
J10
VCCIB5
AE4
VCCIB0
J11
VCCIB5
AF4
VCCIB0
J12
VCCIB5
AG4
VCCIB0
K12
VCCIB5
V12
VCCIB0
K13
VCCIB5
V13
VCCIB1
A24
VCCIB5
W10
VCCIB1
B24
VCCIB5
W11
VCCIB1
C24
VCCIB5
W12
VCCIB1
J16
VCCIB6
AD1
VCCIB1
J17
VCCIB6
AD2
VCCIB1
J18
VCCIB6
AD3
VCCIB1
K15
VCCIB6
R10
VCCIB1
K16
VCCIB6
T10
VCCIB2
D25
VCCIB6
T9
VCCIB2
D26
VCCIB6
U9
VCCIB2
D27
VCCIB6
V9
VCCIB2
K19
VCCIB7
D1
VCCIB2
L19
VCCIB7
D2
VCCIB2
M18
VCCIB7
D3
VCCIB2
M19
VCCIB7
K9
VCCIB2
N18
VCCIB7
L9
VCCIB3
AD25
VCCIB7
M10
VCCIB3
AD26
VCCIB7
M9
VCCIB3
AD27
VCCIB7
N10
VCCIB3
R18
VCOMPLA
B13
VCCIB3
T18
VCOMPLB
A14
VCCIB3
T19
VCOMPLC
A15
VCCIB3
U19
VCOMPLD
J15
VCCIB3
V19
VCOMPLE
AG15
VCCIB4
AE24
VCOMPLF
W15
VCCIB4
AF24
VCOMPLG
AC14
VCCIB4
AG24
VCOMPLH
W13
VCCIB4
V15
VPUMP
D24
VCCIB4
V16
VCCIB4
W16
R ev isio n 1 8
Axcelerator Family FPGAs
FG256
A1 Ball Pad Corner
16 15 14 13 12 11 10 9
8
7
6
5
4
3
2
1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
Note
For Package Manufacturing and Environmental information, visit Resource center at
http://www.microsemi.com/soc/products/rescenter/package/index.html.
R ev i si o n 1 8
3 -9
Package Pin Assignments
FG256-Pin FBGA
AX125 Function
FG256-Pin FBGA
Pin
Number
Bank 0
FG256-Pin FBGA
AX125 Function
Pin
Number
AX125 Function
Pin
Number
IO20NB2F2
F15
IO41PB3F3
L14
IO01NB0F0
B4
IO20PB2F2
E15
IO01PB0F0
B3
IO21NB2F2
C16
IO42NB4F4
N12
IO03NB0F0
A4
IO21PB2F2
B16
IO42PB4F4
N13
IO03PB0F0
A3
IO22NB2F2
H13
IO43NB4F4
T14
IO04NB0F0
B6
IO22PB2F2
G13
IO43PB4F4
R14
IO04PB0F0
B5
IO23NB2F2
E16
IO44PB4F4
T15
IO06NB0F0
A6
IO23PB2F2
D16
IO45NB4F4
R12
IO06PB0F0
A5
IO25NB2F2
H15
IO45PB4F4
R13
IO07NB0F0/HCLKAN
B8
IO25PB2F2
G15
IO46NB4F4
P11
IO07PB0F0/HCLKAP
B7
IO26NB2F2
H14
IO46PB4F4
P12
IO08NB0F0/HCLKBN
A9
IO26PB2F2
G14
IO47PB4F4
T11
IO08PB0F0/HCLKBP
A8
IO27NB2F2
G16
IO48NB4F4
T12
IO27PB2F2
F16
IO48PB4F4
T13
Bank 1
Bank 4
IO09NB1F1/HCLKCN
C10
IO28NB2F2
K15
IO49NB4F4/CLKEN
R9
IO09PB1F1/HCLKCP
C9
IO28PB2F2
K16
IO49PB4F4/CLKEP
R10
IO10NB1F1/HCLKDN
B11
IO29NB2F2
J16
IO50NB4F4/CLKFN
T8
IO10PB1F1/HCLKDP
B10
IO29PB2F2
H16
IO50PB4F4/CLKFP
T9
IO12NB1F1
A13
IO12PB1F1
A12
IO30NB3F3
K13
IO51NB5F5/CLKGN
P7
IO13NB1F1
B13
IO30PB3F3
J13
IO51PB5F5/CLKGP
P8
IO13PB1F1
B12
IO31NB3F3
K14
IO52NB5F5/CLKHN
R6
IO14NB1F1
C12
IO31PB3F3
J14
IO52PB5F5/CLKHP
R7
IO14PB1F1
C11
IO33NB3F3
L15
IO54NB5F5
T5
IO15NB1F1
A15
IO33PB3F3
L16
IO54PB5F5
T6
IO15PB1F1
B14
IO35NB3F3
P16
IO55NB5F5
P5
IO16NB1F1
C15
IO35PB3F3
N16
IO55PB5F5
P6
IO16PB1F1
C14
IO36PB3F3
M16
IO56NB5F5
T3
IO17NB1F1
D13
IO37NB3F3
P15
IO56PB5F5
T4
IO17PB1F1
D12
IO37PB3F3
R16
IO57NB5F5
R3
IO39NB3F3
N15
IO57PB5F5
R4
Bank 2
3- 10
Bank 3
Bank 5
IO18NB2F2
F13
IO39PB3F3
M15
IO58NB5F5
R1
IO18PB2F2
E13
IO40NB3F3
M13
IO58PB5F5
T2
IO19NB2F2
F14
IO40PB3F3
L13
IO59NB5F5
N4
IO19PB2F2
E14
IO41NB3F3
M14
IO59PB5F5
N5
R ev i sio n 1 8
Axcelerator Family FPGAs
FG256-Pin FBGA
AX125 Function
FG256-Pin FBGA
Pin
Number
Bank 6
FG256-Pin FBGA
AX125 Function
Pin
Number
AX125 Function
Pin
Number
IO81NB7F7
C2
GND
M12
IO60NB6F6
L4
IO81PB7F7
B1
GND
M5
IO60PB6F6
M4
IO82NB7F7
D2
GND
P13
IO61NB6F6
L3
IO82PB7F7
D3
GND
P3
IO61PB6F6
M3
IO83NB7F7
E3
GND
R15
IO63NB6F6
P2
IO83PB7F7
F3
GND
R2
IO63PB6F6
N2
GND
T1
IO64NB6F6
J4
VCCDA
E4
GND
T16
IO64PB6F6
K4
GND
A1
GND/LP
D4
IO65NB6F6
N1
GND
A16
NC
A11
IO65PB6F6
P1
GND
B15
NC
R11
IO67NB6F6
L2
GND
B2
NC
R5
IO67PB6F6
M2
GND
D15
PRA
D8
IO69NB6F6
L1
GND
E12
PRB
C8
IO69PB6F6
M1
GND
E5
PRC
N9
IO70NB6F6
J3
GND
F11
PRD
P9
IO70PB6F6
K3
GND
F6
TCK
D5
IO71NB6F6
J2
GND
G10
TDI
C6
IO71PB6F6
K2
GND
G7
TDO
C4
GND
G8
TMS
C3
Bank 7
Dedicated I/O
IO72NB7F7
J1
GND
G9
TRST
C5
IO72PB7F7
K1
GND
H10
VCCA
D14
IO73NB7F7
G2
GND
H7
VCCA
F10
IO73PB7F7
H2
GND
H8
VCCA
F4
IO74NB7F7
G3
GND
H9
VCCA
F7
IO74PB7F7
H3
GND
J10
VCCA
F8
IO75NB7F7
E1
GND
J7
VCCA
F9
IO75PB7F7
F1
GND
J8
VCCA
G11
IO76NB7F7
G1
GND
J9
VCCA
G6
IO77NB7F7
E2
GND
K10
VCCA
H11
IO77PB7F7
F2
GND
K7
VCCA
H6
IO78NB7F7
G4
GND
K8
VCCA
J11
IO78PB7F7
H4
GND
K9
VCCA
J6
IO79NB7F7
C1
GND
L11
VCCA
K11
IO79PB7F7
D1
GND
L6
VCCA
K6
R ev i si o n 1 8
3- 11
Package Pin Assignments
FG256-Pin FBGA
FG256-Pin FBGA
AX125 Function
Pin
Number
AX125 Function
Pin
Number
VCCA
L10
VCCIB4
M11
VCCA
L7
VCCIB4
M9
VCCA
L8
VCCIB5
M6
VCCA
L9
VCCIB5
M7
VCCA
N3
VCCIB5
M8
VCCA
P14
VCCIB6
J5
VCCPLA
C7
VCCIB6
K5
VCCPLB
D6
VCCIB6
L5
VCCPLC
A10
VCCIB7
F5
VCCPLD
D10
VCCIB7
G5
VCCPLE
P10
VCCIB7
H5
VCCPLF
N11
VCOMPLA
A7
VCCPLG
T7
VCOMPLB
D7
VCCPLH
N7
VCOMPLC
B9
VCCDA
A2
VCOMPLD
D11
VCCDA
C13
VCOMPLE
T10
VCCDA
D9
VCOMPLF
N10
VCCDA
H1
VCOMPLG
R8
VCCDA
J15
VCOMPLH
N6
VCCDA
N14
VPUMP
A14
VCCDA
N8
VCCDA
P4
VCCIB0
E6
VCCIB0
E7
VCCIB0
E8
VCCIB1
E10
VCCIB1
E11
VCCIB1
E9
VCCIB2
F12
VCCIB2
G12
VCCIB2
H12
VCCIB3
J12
VCCIB3
K12
VCCIB3
L12
VCCIB4
M10
3- 12
R ev i sio n 1 8
Axcelerator Family FPGAs
FG256
AX250 Function
FG256
Pin
Number
Bank 0
FG256
AX250 Function
Pin
Number
AX250 Function
Pin
Number
IO32NB2F2
C16
IO61PB3F3
L14
IO01NB0F0
B4
IO32PB2F2
B16
IO01PB0F0
B3
IO33NB2F2
F15
IO62NB4F4
N12
IO03NB0F0
A4
IO33PB2F2
E15
IO62PB4F4
N13
IO03PB0F0
A3
IO35NB2F2
H13
IO63NB4F4
T14
IO05NB0F0
B6
IO35PB2F2
G13
IO63PB4F4
R14
IO05PB0F0
B5
IO36NB2F2
E16
IO66PB4F4
T15
IO07NB0F0
A6
IO36PB2F2
D16
IO67NB4F4
R12
IO07PB0F0
A5
IO38NB2F2
H15
IO67PB4F4
R13
IO12NB0F0/HCLKAN
B8
IO38PB2F2
G15
IO69NB4F4
P11
IO12PB0F0/HCLKAP
B7
IO39NB2F2
H14
IO69PB4F4
P12
IO13NB0F0/HCLKBN
A9
IO39PB2F2
G14
IO70PB4F4
T11
IO13PB0F0/HCLKBP
A8
IO40NB2F2
G16
IO73NB4F4
T12
IO40PB2F2
F16
IO73PB4F4
T13
Bank 1
Bank 4
IO14NB1F1/HCLKCN
C10
IO43NB2F2
K15
IO74NB4F4/CLKEN
R9
IO14PB1F1/HCLKCP
C9
IO43PB2F2
K16
IO74PB4F4/CLKEP
R10
IO15NB1F1/HCLKDN
B11
IO44NB2F2
J16
IO75NB4F4/CLKFN
T8
IO15PB1F1/HCLKDP
B10
IO44PB2F2
H16
IO75PB4F4/CLKFP
T9
IO17NB1F1
A13
IO17PB1F1
A12
IO45NB3F3
K13
IO76NB5F5/CLKGN
P7
IO19NB1F1
B13
IO45PB3F3
J13
IO76PB5F5/CLKGP
P8
IO19PB1F1
B12
IO46NB3F3
K14
IO77NB5F5/CLKHN
R6
IO21NB1F1
C12
IO46PB3F3
J14
IO77PB5F5/CLKHP
R7
IO21PB1F1
C11
IO52NB3F3
L15
IO79NB5F5
T5
IO23NB1F1
A15
IO52PB3F3
L16
IO79PB5F5
T6
IO23PB1F1
B14
IO54NB3F3
P16
IO81NB5F5
P5
IO26NB1F1
C15
IO54PB3F3
N16
IO81PB5F5
P6
IO26PB1F1
C14
IO55PB3F3
M16
IO83NB5F5
T3
IO27NB1F1
D13
IO56NB3F3
P15
IO83PB5F5
T4
IO27PB1F1
D12
IO56PB3F3
R16
IO85NB5F5
R3
IO58NB3F3
N15
IO85PB5F5
R4
Bank 2
Bank 3
Bank 5
IO29NB2F2
F13
IO58PB3F3
M15
IO88NB5F5
R1
IO29PB2F2
E13
IO59NB3F3
M13
IO88PB5F5
T2
IO30NB2F2
F14
IO59PB3F3
L13
IO89NB5F5
N4
IO30PB2F2
E14
IO61NB3F3
M14
IO89PB5F5
N5
R ev i si o n 1 8
3- 13
Package Pin Assignments
FG256
AX250 Function
FG256
Pin
Number
Bank 6
AX250 Function
Pin
Number
AX250 Function
Pin
Number
IO117NB7F7
C2
GND
M12
IO91NB6F6
L4
IO117PB7F7
B1
GND
M5
IO91PB6F6
M4
IO118NB7F7
D2
GND
P13
IO92NB6F6
L3
IO118PB7F7
D3
GND
P3
IO92PB6F6
M3
IO119NB7F7
E3
GND
R15
IO94NB6F6
P2
IO119PB7F7
F3
GND
R2
IO94PB6F6
N2
GND
T1
IO97NB6F6
J4
VCCDA
E4
GND
T16
IO97PB6F6
K4
GND
A1
GND/LP
D4
IO98NB6F6
N1
GND
A16
PRA
D8
IO98PB6F6
P1
GND
B15
PRB
C8
IO100NB6F6
L2
GND
B2
PRC
N9
IO100PB6F6
M2
GND
D15
PRD
P9
IO102NB6F6
L1
GND
E12
TCK
D5
IO102PB6F6
M1
GND
E5
TDI
C6
IO103NB6F6
J3
GND
F11
TDO
C4
IO103PB6F6
K3
GND
F6
TMS
C3
IO104NB6F6
J2
GND
G10
TRST
C5
IO104PB6F6
K2
GND
G7
VCCA
D14
GND
G8
VCCA
F10
Bank 7
3- 14
FG256
Dedicated I/O
IO107NB7F7
J1
GND
G9
VCCA
F4
IO107PB7F7
K1
GND
H10
VCCA
F7
IO108NB7F7
G2
GND
H7
VCCA
F8
IO108PB7F7
H2
GND
H8
VCCA
F9
IO111NB7F7
G3
GND
H9
VCCA
G11
IO111PB7F7
H3
GND
J10
VCCA
G6
IO112NB7F7
E1
GND
J7
VCCA
H11
IO112PB7F7
F1
GND
J8
VCCA
H6
IO113NB7F7
G1
GND
J9
VCCA
J11
IO114NB7F7
E2
GND
K10
VCCA
J6
IO114PB7F7
F2
GND
K7
VCCA
K11
IO115NB7F7
G4
GND
K8
VCCA
K6
IO115PB7F7
H4
GND
K9
VCCA
L10
IO116NB7F7
C1
GND
L11
VCCA
L7
IO116PB7F7
D1
GND
L6
VCCA
L8
R ev i sio n 1 8
Axcelerator Family FPGAs
FG256
FG256
AX250 Function
Pin
Number
AX250 Function
Pin
Number
VCCA
L9
VCCIB4
M11
VCCA
N3
VCCIB4
M9
VCCA
P14
VCCIB5
M6
VCCPLA
C7
VCCIB5
M7
VCCPLB
D6
VCCIB5
M8
VCCPLC
A10
VCCIB6
J5
VCCPLD
D10
VCCIB6
K5
VCCPLE
P10
VCCIB6
L5
VCCPLF
N11
VCCIB7
F5
VCCPLG
T7
VCCIB7
G5
VCCPLH
N7
VCCIB7
H5
VCCDA
A11
VCOMPLA
A7
VCCDA
A2
VCOMPLB
D7
VCCDA
C13
VCOMPLC
B9
VCCDA
D9
VCOMPLD
D11
VCCDA
H1
VCOMPLE
T10
VCCDA
J15
VCOMPLF
N10
VCCDA
N14
VCOMPLG
R8
VCCDA
N8
VCOMPLH
N6
VCCDA
P4
VPUMP
A14
VCCDA
R11
VCCDA
R5
VCCIB0
E6
VCCIB0
E7
VCCIB0
E8
VCCIB1
E10
VCCIB1
E11
VCCIB1
E9
VCCIB2
F12
VCCIB2
G12
VCCIB2
H12
VCCIB3
J12
VCCIB3
K12
VCCIB3
L12
VCCIB4
M10
R ev i si o n 1 8
3- 15
Package Pin Assignments
FG324
A1 Ball Pad Corner
18 17 16 15 14 13 12 11 10 9
8
7
6
5
4
3
2
1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
Note
For Package Manufacturing and Environmental information, visit Resource center at
http://www.microsemi.com/soc/products/rescenter/package/index.html.
3- 16
R ev i sio n 1 8
Axcelerator Family FPGAs
FG324
AX125 Function
FG324
Pin
Number
Bank 0
AX125 Function
FG324
Pin
Number
AX125 Function
Pin
Number
IO16PB1F1
C15
IO33NB3F3
R18
IO00NB0F0
C5
IO17NB1F1
E14
IO33PB3F3
P18
IO00PB0F0
C4
IO17PB1F1
E13
IO34NB3F3
N15
IO01NB0F0
A3
IO34PB3F3
M15
IO01PB0F0
A2
IO18NB2F2
G14
IO35NB3F3
M16
IO02NB0F0
C7
IO18PB2F2
F14
IO35PB3F3
M17
IO02PB0F0
C6
IO19NB2F2
D16
IO36NB3F3
P16
IO03NB0F0
B5
IO19PB2F2
D15
IO36PB3F3
N16
IO03PB0F0
B4
IO20NB2F2
C18
IO37NB3F3
R17
IO04NB0F0
A5
IO20PB2F2
B18
IO37PB3F3
P17
IO04PB0F0
A4
IO21NB2F2
D17
IO38NB3F3
N14
IO05NB0F0
A7
IO21PB2F2
C17
IO38PB3F3
M14
IO05PB0F0
A6
IO22NB2F2
F17
IO39NB3F3
U18
IO06NB0F0
B7
IO22PB2F2
E17
IO39PB3F3
T18
IO06PB0F0
B6
IO23NB2F2
G16
IO40NB3F3
R16
IO07NB0F0/HCLKAN
C9
IO23PB2F2
F16
IO40PB3F3
T17
IO07PB0F0/HCLKAP
C8
IO24NB2F2
E18
IO41NB3F3
P13
IO08NB0F0/HCLKBN
B10
IO24PB2F2
D18
IO41PB3F3
P14
IO08PB0F0/HCLKBP
B9
IO25NB2F2
G18
IO25PB2F2
F18
IO42NB4F4
T13
Bank 1
Bank 2
Bank 4
IO09NB1F1/HCLKCN
D11
IO26NB2F2
H17
IO42PB4F4
T14
IO09PB1F1/HCLKCP
D10
IO26PB2F2
G17
IO43NB4F4
U15
IO10NB1F1/HCLKDN
C12
IO27NB2F2
J16
IO43PB4F4
T15
IO10PB1F1/HCLKDP
C11
IO27PB2F2
H16
IO44NB4F4
U13
IO11NB1F1
A15
IO28NB2F2
J18
IO44PB4F4
U14
IO11PB1F1
A14
IO28PB2F2
H18
IO45NB4F4
V15
IO12NB1F1
B14
IO29NB2F2
K17
IO45PB4F4
V16
IO12PB1F1
B13
IO29PB2F2
J17
IO46NB4F4
V13
IO13NB1F1
A17
IO46PB4F4
V14
IO13PB1F1
A16
IO30NB3F3
N18
IO47NB4F4
V12
IO14NB1F1
D13
IO30PB3F3
M18
IO47PB4F4
U12
IO14PB1F1
D12
IO31NB3F3
L18
IO48NB4F4
V10
IO15NB1F1
C14
IO31PB3F3
K18
IO48PB4F4
V11
IO15PB1F1
C13
IO32NB3F3
L16
IO49NB4F4/CLKEN
T10
IO16NB1F1
B16
IO32PB3F3
L17
IO49PB4F4/CLKEP
T11
Bank 3
R ev i si o n 1 8
3- 17
Package Pin Assignments
FG324
AX125 Function
FG324
Pin
Number
AX125 Function
FG324
Pin
Number
AX125 Function
IO50NB4F4/CLKFN
U9
IO66PB6F6
N3
IO50PB4F4/CLKFP
U10
IO67NB6F6
M2
IO67PB6F6
N2
VCCDA
F5
Bank 5
IO83PB7F7
Pin
Number
C1
Dedicated I/O
IO51NB5F5/CLKGN
R8
IO68NB6F6
M1
GND
A1
IO51PB5F5/CLKGP
R9
IO68PB6F6
N1
GND
A18
IO52NB5F5/CLKHN
T7
IO69NB6F6
K4
GND
B17
IO52PB5F5/CLKHP
T8
IO69PB6F6
L4
GND
B2
IO53NB5F5
U6
IO70NB6F6
K1
GND
C16
IO53PB5F5
U7
IO70PB6F6
L1
GND
C3
IO54NB5F5
V8
IO71NB6F6
K3
GND
E16
IO54PB5F5
V9
IO71PB6F6
L3
GND
F13
IO55NB5F5
V6
GND
F6
IO55PB5F5
V7
IO72NB7F7
H4
GND
G12
IO56NB5F5
U4
IO72PB7F7
J4
GND
G7
IO56PB5F5
U5
IO73NB7F7
K2
GND
H10
IO57NB5F5
T4
IO73PB7F7
L2
GND
H11
IO57PB5F5
T5
IO74NB7F7
H2
GND
H8
IO58NB5F5
V4
IO74PB7F7
H1
GND
H9
IO58PB5F5
V5
IO75NB7F7
H3
GND
J10
IO59NB5F5
V2
IO75PB7F7
J3
GND
J11
IO59PB5F5
V3
IO76NB7F7
F2
GND
J8
IO76PB7F7
G2
GND
J9
Bank 6
3- 18
Bank 7
IO60NB6F6
P5
IO77NB7F7
F1
GND
K10
IO60PB6F6
P6
IO77PB7F7
G1
GND
K11
IO61NB6F6
T2
IO78NB7F7
D2
GND
K8
IO61PB6F6
U3
IO78PB7F7
E2
GND
K9
IO62NB6F6
T1
IO79NB7F7
F3
GND
L10
IO62PB6F6
U1
IO79PB7F7
G3
GND
L11
IO63NB6F6
P1
IO80NB7F7
E3
GND
L8
IO63PB6F6
R1
IO80PB7F7
E4
GND
L9
IO64NB6F6
R3
IO81NB7F7
D1
GND
M12
IO64PB6F6
P3
IO81PB7F7
E1
GND
M7
IO65NB6F6
P2
IO82NB7F7
D3
GND
N13
IO65PB6F6
R2
IO82PB7F7
C2
GND
N6
IO66NB6F6
M3
IO83NB7F7
B1
GND
R14
R ev i sio n 1 8
Axcelerator Family FPGAs
FG324
AX125 Function
FG324
Pin
Number
AX125 Function
FG324
Pin
Number
AX125 Function
Pin
Number
GND
R4
NC
N4
VCCA
M8
GND
T16
NC
N5
VCCA
M9
GND
T3
NC
R12
VCCA
P4
GND
U17
NC
R13
VCCA
R15
GND
U2
NC
R6
VCCPLA
D8
GND
V1
NC
R7
VCCPLB
E7
GND
V18
NC
T12
VCCPLC
B11
GND/LP
E5
NC
T6
VCCPLD
E11
NC
A10
NC
U16
VCCPLE
R11
NC
A11
NC
V17
VCCPLF
P12
NC
A12
PRA
E9
VCCPLG
U8
NC
A13
PRB
D9
VCCPLH
P8
NC
A8
PRC
P10
VCCDA
B3
NC
A9
PRD
R10
VCCDA
D14
NC
B12
TCK
E6
VCCDA
E10
NC
F15
TDI
D7
VCCDA
J2
NC
F4
TDO
D5
VCCDA
K16
NC
G15
TMS
D4
VCCDA
P15
NC
G4
TRST
D6
VCCDA
P9
NC
H14
VCCA
E15
VCCDA
R5
NC
H15
VCCA
G10
VCCIB0
F7
NC
H5
VCCA
G11
VCCIB0
F8
NC
J1
VCCA
G5
VCCIB0
F9
NC
J14
VCCA
G8
VCCIB1
F10
NC
J15
VCCA
G9
VCCIB1
F11
NC
J5
VCCA
H12
VCCIB1
F12
NC
K14
VCCA
H7
VCCIB2
G13
NC
K15
VCCA
J12
VCCIB2
H13
NC
K5
VCCA
J7
VCCIB2
J13
NC
L14
VCCA
K12
VCCIB3
K13
NC
L15
VCCA
K7
VCCIB3
L13
NC
L5
VCCA
L12
VCCIB3
M13
NC
M4
VCCA
L7
VCCIB4
N10
NC
M5
VCCA
M10
VCCIB4
N11
NC
N17
VCCA
M11
VCCIB4
N12
R ev i si o n 1 8
3- 19
Package Pin Assignments
FG324
AX125 Function
3- 20
Pin
Number
VCCIB5
N7
VCCIB5
N8
VCCIB5
N9
VCCIB6
K6
VCCIB6
L6
VCCIB6
M6
VCCIB7
G6
VCCIB7
H6
VCCIB7
J6
VCOMPLA
B8
VCOMPLB
E8
VCOMPLC
C10
VCOMPLD
E12
VCOMPLE
U11
VCOMPLF
P11
VCOMPLG
T9
VCOMPLH
P7
VPUMP
B15
R ev i sio n 1 8
Axcelerator Family FPGAs
FG484
A1 Ball Pad Corner
22 21 20 19 18 17 16 15 14 13 12 11 10 9 8
7 6 5 4 3 2 1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
Note
For Package Manufacturing and Environmental information, visit Resource center at
http://www.microsemi.com/soc/products/rescenter/package/index.html.
R ev i si o n 1 8
3- 21
Package Pin Assignments
FG484
AX250 Function
FG484
Pin Number
Bank 0
AX250 Function
FG484
Pin Number
AX250 Function
Pin Number
IO17NB1F1
B14
IO34PB2F2
D22
IO00NB0F0
D7
IO17PB1F1
B13
IO35NB2F2
J18
IO00PB0F0
D6
IO18NB1F1
A14
IO35PB2F2
H18
IO01NB0F0
E7
IO18PB1F1
A13
IO36NB2F2
G21
IO01PB0F0
E6
IO19NB1F1
A16
IO36PB2F2
F21
IO02NB0F0
C5
IO19PB1F1
A15
IO37NB2F2
K19
IO02PB0F0
C4
IO20NB1F1
B16
IO37PB2F2
J19
IO03NB0F0
C7
IO20PB1F1
B15
IO38NB2F2
J20
IO03PB0F0
C6
IO21NB1F1
C17
IO38PB2F2
H20
IO04NB0F0
E9
IO21PB1F1
C16
IO39NB2F2
L16
IO04PB0F0
E8
IO22NB1F1
F15
IO39PB2F2
K16
IO05NB0F0
D9
IO22PB1F1
F14
IO40NB2F2
J21
IO05PB0F0
D8
IO23NB1F1
D16
IO40PB2F2
H21
IO06NB0F0
B7
IO23PB1F1
D15
IO41NB2F2
L17
IO06PB0F0
B6
IO24NB1F1
E16
IO41PB2F2
K17
IO07NB0F0
C9
IO24PB1F1
E15
IO42NB2F2
J22
IO07PB0F0
C8
IO25NB1F1
F18
IO42PB2F2
H22
IO08NB0F0
A7
IO25PB1F1
F17
IO43NB2F2
L18
IO08PB0F0
A6
IO26NB1F1
D18
IO43PB2F2
K18
IO09NB0F0
B9
IO26PB1F1
E17
IO44NB2F2
L20
IO09PB0F0
B8
IO27NB1F1
G16
IO44PB2F2
K20
IO10NB0F0
A9
IO27PB1F1
G15
IO10PB0F0
A8
IO11NB0F0
B10
IO28NB2F2
IO11PB0F0
A10
IO12NB0F0/HCLKAN
Bank 3
IO45NB3F3
M19
F19
IO45PB3F3
L19
IO28PB2F2
E19
IO46NB3F3
M21
E11
IO29NB2F2
J16
IO46PB3F3
L21
IO12PB0F0/HCLKAP
E10
IO29PB2F2
H16
IO47NB3F3
N17
IO13NB0F0/HCLKBN
D12
IO30NB2F2
E20
IO47PB3F3
M17
IO13PB0F0/HCLKBP
D11
IO30PB2F2
D20
IO48NB3F3
N18
IO31NB2F2
J17
IO48PB3F3
N19
Bank 1
Bank 2
IO14NB1F1/HCLKCN
F13
IO31PB2F2
H17
IO49NB3F3
N16
IO14PB1F1/HCLKCP
F12
IO32NB2F2
G20
IO49PB3F3
M16
IO15NB1F1/HCLKDN
E14
IO32PB2F2
F20
IO50NB3F3
N20
IO15PB1F1/HCLKDP
E13
IO33NB2F2
H19
IO50PB3F3
M20
IO16NB1F1
C13
IO33PB2F2
G19
IO51NB3F3
P21
IO16PB1F1
C12
IO34NB2F2
E22
IO51PB3F3
N21
3- 22
R ev i sio n 1 8
Axcelerator Family FPGAs
FG484
AX250 Function
FG484
Pin Number
AX250 Function
FG484
Pin Number
AX250 Function
Pin Number
IO52NB3F3
P18
IO69PB4F4
AA17
IO87NB5F5
Y4
IO52PB3F3
P19
IO70NB4F4
AB14
IO87PB5F5
Y5
IO53NB3F3
R20
IO70PB4F4
AB15
IO88NB5F5
V6
IO53PB3F3
P20
IO71NB4F4
Y14
IO88PB5F5
V7
IO54NB3F3
T21
IO71PB4F4
W14
IO89NB5F5
T7
IO54PB3F3
R21
IO72NB4F4
AA14
IO89PB5F5
T8
IO55NB3F3
R17
IO72PB4F4
AA15
IO55PB3F3
P17
IO73NB4F4
AA13
IO90NB6F6
V4
IO56NB3F3
U20
IO73PB4F4
AB13
IO90PB6F6
W5
IO56PB3F3
T20
IO74NB4F4/CLKEN
V12
IO91NB6F6
P7
IO57NB3F3
T18
IO74PB4F4/CLKEP
V13
IO91PB6F6
R7
IO57PB3F3
R18
IO75NB4F4/CLKFN
W11
IO92NB6F6
U5
IO58NB3F3
U19
IO75PB4F4/CLKFP
W12
IO92PB6F6
T5
IO58PB3F3
T19
Bank 5
IO93NB6F6
P6
IO59NB3F3
R16
IO76NB5F5/CLKGN
U10
IO93PB6F6
R6
IO59PB3F3
P16
IO76PB5F5/CLKGP
U11
IO94NB6F6
T4
IO60NB3F3
W20
IO77NB5F5/CLKHN
V9
IO94PB6F6
U4
IO60PB3F3
V20
IO77PB5F5/CLKHP
V10
IO95NB6F6
P5
IO61NB3F3
U18
IO78NB5F5
AA9
IO95PB6F6
R5
IO61PB3F3
V19
IO78PB5F5
AA10
IO96NB6F6
T3
IO79NB5F5
AB9
IO96PB6F6
U3
Bank 4
Bank 6
IO62NB4F4
T15
IO79PB5F5
AB10
IO97NB6F6
P3
IO62PB4F4
T16
IO80NB5F5
AA7
IO97PB6F6
R3
IO63NB4F4
W17
IO80PB5F5
AA8
IO98NB6F6
R2
IO63PB4F4
V17
IO81NB5F5
W8
IO98PB6F6
T2
IO64NB4F4
V15
IO81PB5F5
W9
IO99NB6F6
P4
IO64PB4F4
V16
IO82NB5F5
AB5
IO99PB6F6
R4
IO65NB4F4
Y19
IO82PB5F5
AB6
IO100NB6F6
P1
IO65PB4F4
W18
IO83NB5F5
AA5
IO100PB6F6
R1
IO66NB4F4
AB18
IO83PB5F5
AA6
IO101NB6F6
M7
IO66PB4F4
AB19
IO84NB5F5
U8
IO101PB6F6
N7
IO67NB4F4
W15
IO84PB5F5
U9
IO102NB6F6
N2
IO67PB4F4
W16
IO85NB5F5
Y6
IO102PB6F6
P2
IO68NB4F4
U14
IO85PB5F5
Y7
IO103NB6F6
M6
IO68PB4F4
U15
IO86NB5F5
W6
IO103PB6F6
N6
IO69NB4F4
AA16
IO86PB5F5
W7
IO104NB6F6
M4
R ev i si o n 1 8
3- 23
Package Pin Assignments
FG484
AX250 Function
FG484
Pin Number
Pin Number
AX250 Function
Pin Number
IO104PB6F6
N4
IO122NB7F7
G5
GND
J9
IO105NB6F6
M5
IO122PB7F7
G6
GND
K10
IO105PB6F6
N5
IO123NB7F7
F5
GND
K11
IO106NB6F6
M3
IO123PB7F7
E4
GND
K12
IO106PB6F6
N3
GND
K13
Bank 7
3- 24
AX250 Function
FG484
Dedicated I/O
VCCDA
H7
GND
L1
IO107NB7F7
M2
GND
A1
GND
L10
IO107PB7F7
N1
GND
A11
GND
L11
IO108NB7F7
L3
GND
A12
GND
L12
IO108PB7F7
L2
GND
A2
GND
L13
IO109NB7F7
K2
GND
A21
GND
L22
IO109PB7F7
K1
GND
A22
GND
M1
IO110NB7F7
K5
GND
AA1
GND
M10
IO110PB7F7
L5
GND
AA2
GND
M11
IO111NB7F7
K6
GND
AA21
GND
M12
IO111PB7F7
L6
GND
AA22
GND
M13
IO112NB7F7
K4
GND
AB1
GND
M22
IO112PB7F7
K3
GND
AB11
GND
N10
IO113NB7F7
K7
GND
AB12
GND
N11
IO113PB7F7
L7
GND
AB2
GND
N12
IO114NB7F7
H1
GND
AB21
GND
N13
IO114PB7F7
J1
GND
AB22
GND
P14
IO115NB7F7
H2
GND
B1
GND
P9
IO115PB7F7
J2
GND
B2
GND
R15
IO116NB7F7
H4
GND
B21
GND
R8
IO116PB7F7
J4
GND
B22
GND
U16
IO117NB7F7
H5
GND
C20
GND
U6
IO117PB7F7
J5
GND
C3
GND
V18
IO118NB7F7
F2
GND
D19
GND
V5
IO118PB7F7
G2
GND
D4
GND
W19
IO119NB7F7
H6
GND
E18
GND
W4
IO119PB7F7
J6
GND
E5
GND
Y20
IO120NB7F7
F1
GND
G18
GND
Y3
IO120PB7F7
G1
GND
H15
GND/LP
G7
IO121NB7F7
F4
GND
H8
NC
A17
IO121PB7F7
G4
GND
J14
NC
A18
R ev i sio n 1 8
Axcelerator Family FPGAs
FG484
AX250 Function
FG484
Pin Number
AX250 Function
FG484
Pin Number
AX250 Function
Pin Number
NC
A19
NC
G22
PRA
G11
NC
A4
NC
G3
PRB
F11
NC
A5
NC
H3
PRC
T12
NC
AA11
NC
J3
PRD
U12
NC
AA12
NC
K21
TCK
G8
NC
AA18
NC
K22
TDI
F9
NC
AA19
NC
N22
TDO
F7
NC
AA4
NC
P22
TMS
F6
NC
AB16
NC
R19
TRST
F8
NC
AB17
NC
R22
VCCA
G17
NC
AB4
NC
T1
VCCA
J10
NC
AB7
NC
T22
VCCA
J11
NC
AB8
NC
U1
VCCA
J12
NC
B11
NC
U2
VCCA
J13
NC
B12
NC
U21
VCCA
J7
NC
B17
NC
U22
VCCA
K14
NC
B18
NC
V1
VCCA
K9
NC
B19
NC
V2
VCCA
L14
NC
B4
NC
V21
VCCA
L9
NC
B5
NC
V22
VCCA
M14
NC
C10
NC
V3
VCCA
M9
NC
C11
NC
W1
VCCA
N14
NC
C14
NC
W2
VCCA
N9
NC
C15
NC
W21
VCCA
P10
NC
C18
NC
W22
VCCA
P11
NC
C19
NC
W3
VCCA
P12
NC
D1
NC
Y10
VCCA
P13
NC
D2
NC
Y11
VCCA
T6
NC
D21
NC
Y12
VCCA
U17
NC
D3
NC
Y13
VCCPLA
F10
NC
E1
NC
Y15
VCCPLB
G9
NC
E2
NC
Y16
VCCPLC
D13
NC
E21
NC
Y17
VCCPLD
G13
NC
E3
NC
Y18
VCCPLE
U13
NC
F22
NC
Y8
VCCPLF
T14
NC
F3
NC
Y9
VCCPLG
W10
R ev i si o n 1 8
3- 25
Package Pin Assignments
FG484
FG484
AX250 Function
3- 26
Pin Number
AX250 Function
Pin Number
VCCPLH
T10
VCCIB4
R14
VCCDA
D14
VCCIB5
AA3
VCCDA
D5
VCCIB5
AB3
VCCDA
F16
VCCIB5
R10
VCCDA
G12
VCCIB5
R11
VCCDA
L4
VCCIB5
R9
VCCDA
M18
VCCIB6
M8
VCCDA
T11
VCCIB6
N8
VCCDA
T17
VCCIB6
P8
VCCDA
U7
VCCIB6
Y1
VCCDA
V14
VCCIB6
Y2
VCCDA
V8
VCCIB7
C1
VCCIB0
A3
VCCIB7
C2
VCCIB0
B3
VCCIB7
J8
VCCIB0
H10
VCCIB7
K8
VCCIB0
H11
VCCIB7
L8
VCCIB0
H9
VCOMPLA
D10
VCCIB1
A20
VCOMPLB
G10
VCCIB1
B20
VCOMPLC
E12
VCCIB1
H12
VCOMPLD
G14
VCCIB1
H13
VCOMPLE
W13
VCCIB1
H14
VCOMPLF
T13
VCCIB2
C21
VCOMPLG
V11
VCCIB2
C22
VCOMPLH
T9
VCCIB2
J15
VPUMP
D17
VCCIB2
K15
VCCIB2
L15
VCCIB3
M15
VCCIB3
N15
VCCIB3
P15
VCCIB3
Y21
VCCIB3
Y22
VCCIB4
AA20
VCCIB4
AB20
VCCIB4
R12
VCCIB4
R13
R ev i sio n 1 8
Axcelerator Family FPGAs
FG484
AX500 Function
FG484
Pin
Number
Bank 0
FG484
AX500 Function
Pin
Number
AX500 Function
Pin
Number
IO19NB0F1/HCLKAN
E11
IO37PB1F3
F17
IO00NB0F0
E3
IO19PB0F1/HCLKAP
E10
IO38NB1F3
D18
IO00PB0F0
D3
IO20NB0F1/HCLKBN
D12
IO38PB1F3
E17
IO01NB0F0
E7
IO20PB0F1/HCLKBP
D11
IO39NB1F3
E21
IO01PB0F0
E6
Bank 1
IO39PB1F3
D21
IO02NB0F0
C5
IO21NB1F2/HCLKCN
F13
IO40NB1F3
E20
IO02PB0F0
C4
IO21PB1F2/HCLKCP
F12
IO40PB1F3
D20
IO03NB0F0
D7
IO22NB1F2/HCLKDN
E14
IO41NB1F3
G16
IO03PB0F0
D6
IO22PB1F2/HCLKDP
E13
IO41PB1F3
G15
IO04NB0F0
B5
IO24NB1F2
A14
IO04PB0F0
B4
IO24PB1F2
A13
IO42NB2F4
F19
IO05NB0F0
C7
IO25NB1F2
B14
IO42PB2F4
E19
IO05PB0F0
C6
IO25PB1F2
B13
IO43NB2F4
J16
IO06NB0F0
A5
IO26NB1F2
C15
IO43PB2F4
H16
IO06PB0F0
A4
IO27NB1F2
A16
IO44NB2F4
E22
IO07NB0F0
A7
IO27PB1F2
A15
IO44PB2F4
D22
IO07PB0F0
A6
IO28NB1F2
B16
IO45NB2F4
H19
IO08NB0F0
B7
IO28PB1F2
B15
IO45PB2F4
G19
IO08PB0F0
B6
IO29NB1F2
D16
IO46NB2F4
G22
IO10NB0F0
B9
IO29PB1F2
D15
IO46PB2F4
F22
IO10PB0F0
B8
IO30NB1F2
A18
IO47NB2F4
J17
IO11NB0F0
E9
IO30PB1F2
A17
IO47PB2F4
H17
IO11PB0F0
E8
IO31NB1F2
F15
IO48NB2F4
G20
IO12NB0F1
D9
IO31PB1F2
F14
IO48PB2F4
F20
IO12PB0F1
D8
IO32NB1F3
C17
IO49NB2F4
J18
IO13NB0F1
C9
IO32PB1F3
C16
IO49PB2F4
H18
IO13PB0F1
C8
IO33NB1F3
E16
IO50NB2F4
G21
IO14NB0F1
A9
IO33PB1F3
E15
IO50PB2F4
F21
IO14PB0F1
A8
IO34NB1F3
B18
IO51NB2F4
K19
IO15NB0F1
B10
IO34PB1F3
B17
IO51PB2F4
J19
IO15PB0F1
A10
IO35NB1F3
B19
IO52NB2F5
J21
IO16NB0F1
B12
IO35PB1F3
A19
IO52PB2F5
H21
IO16PB0F1
B11
IO36NB1F3
C19
IO53NB2F5
J20
IO18NB0F1
C13
IO36PB1F3
C18
IO53PB2F5
H20
IO18PB0F1
C12
IO37NB1F3
F18
IO54NB2F5
J22
R ev i si o n 1 8
Bank 2
3- 27
Package Pin Assignments
FG484
FG484
FG484
AX500 Function
Pin
Number
AX500 Function
Pin
Number
AX500 Function
Pin
Number
IO54PB2F5
H22
IO72PB3F6
P20
IO90NB4F8
Y17
IO55NB2F5
L17
IO73PB3F6
R19
IO90PB4F8
Y18
IO55PB2F5
K17
IO74NB3F7
V21
IO91NB4F8
V15
IO56NB2F5
K21
IO74PB3F7
U21
IO91PB4F8
V16
IO56PB2F5
K22
IO75NB3F7
V22
IO92PB4F8
AB17
IO58NB2F5
L20
IO75PB3F7
U22
IO93NB4F8
Y15
IO58PB2F5
K20
IO76NB3F7
U20
IO93PB4F8
Y16
IO59NB2F5
L18
IO76PB3F7
T20
IO94NB4F9
AA16
IO59PB2F5
K18
IO77NB3F7
R17
IO94PB4F9
AA17
IO60NB2F5
M21
IO77PB3F7
P17
IO95NB4F9
AB14
IO60PB2F5
L21
IO78NB3F7
W21
IO95PB4F9
AB15
IO61NB2F5
L16
IO78PB3F7
W22
IO96NB4F9
W15
IO61PB2F5
K16
IO79NB3F7
T18
IO96PB4F9
W16
IO62NB2F5
M19
IO79PB3F7
R18
IO97NB4F9
AA13
IO62PB2F5
L19
IO80NB3F7
W20
IO97PB4F9
AB13
IO80PB3F7
V20
IO98NB4F9
AA14
Bank 3
3- 28
IO63NB3F6
N16
IO81NB3F7
U19
IO98PB4F9
AA15
IO63PB3F6
M16
IO81PB3F7
T19
IO100NB4F9
Y14
IO64NB3F6
P22
IO82NB3F7
U18
IO100PB4F9
W14
IO64PB3F6
N22
IO82PB3F7
V19
IO101NB4F9
Y12
IO65NB3F6
N20
IO83NB3F7
R16
IO101PB4F9
Y13
IO65PB3F6
M20
IO83PB3F7
P16
IO102NB4F9
AA11
IO66NB3F6
P21
IO102PB4F9
AA12
IO66PB3F6
N21
IO84NB4F8
AB18
IO103NB4F9/CLKEN
V12
IO67NB3F6
N18
IO84PB4F8
AB19
IO103PB4F9/CLKEP
V13
IO67PB3F6
N19
IO85NB4F8
T15
IO104NB4F9/CLKFN
W11
IO68NB3F6
T22
IO85PB4F8
T16
IO104PB4F9/CLKFP
W12
IO68PB3F6
R22
IO86NB4F8
AA18
IO69NB3F6
N17
IO86PB4F8
AA19
IO105NB5F10/CLKGN
U10
IO69PB3F6
M17
IO87NB4F8
W17
IO105PB5F10/CLKGP
U11
IO70NB3F6
T21
IO87PB4F8
V17
IO106NB5F10/CLKHN
V9
IO70PB3F6
R21
IO88NB4F8
Y19
IO106PB5F10/CLKHP
V10
IO71NB3F6
P18
IO88PB4F8
W18
IO107NB5F10
Y10
IO71PB3F6
P19
IO89NB4F8
U14
IO107PB5F10
Y11
IO72NB3F6
R20
IO89PB4F8
U15
IO108NB5F10
AA9
Bank 4
R ev i sio n 1 8
Bank 5
Axcelerator Family FPGAs
FG484
FG484
FG484
AX500 Function
Pin
Number
AX500 Function
Pin
Number
AX500 Function
Pin
Number
IO108PB5F10
AA10
IO127NB6F12
P7
IO146NB6F13
M3
IO110NB5F10
AB9
IO127PB6F12
R7
IO146PB6F13
N3
IO110PB5F10
AB10
IO128NB6F12
V1
IO111NB5F10
Y8
IO128PB6F12
W1
IO147NB7F14
K7
IO111PB5F10
Y9
IO129NB6F12
U5
IO147PB7F14
L7
IO112NB5F10
AB7
IO129PB6F12
T5
IO148NB7F14
M2
IO113NB5F10
W8
IO130NB6F12
T1
IO148PB7F14
N1
IO113PB5F10
W9
IO130PB6F12
U1
IO149NB7F14
K5
IO114NB5F11
AA7
IO131NB6F12
P6
IO149PB7F14
L5
IO114PB5F11
AA8
IO131PB6F12
R6
IO150NB7F14
L3
IO115NB5F11
AB5
IO132NB6F12
T4
IO150PB7F14
L2
IO115PB5F11
AB6
IO132PB6F12
U4
IO151NB7F14
K6
IO116NB5F11
Y6
IO133NB6F12
U2
IO151PB7F14
L6
IO116PB5F11
Y7
IO134NB6F12
T3
IO152NB7F14
K2
IO117NB5F11
U8
IO134PB6F12
U3
IO152PB7F14
K1
IO117PB5F11
U9
IO135NB6F12
P5
IO153NB7F14
K4
IO118NB5F11
AA5
IO135PB6F12
R5
IO153PB7F14
K3
IO118PB5F11
AA6
IO136NB6F13
R2
IO154NB7F14
H3
IO119NB5F11
AA4
IO136PB6F13
T2
IO154PB7F14
J3
IO119PB5F11
AB4
IO138NB6F13
P4
IO155NB7F14
H5
IO120NB5F11
Y4
IO138PB6F13
R4
IO155PB7F14
J5
IO120PB5F11
Y5
IO139NB6F13
N2
IO156NB7F14
H4
IO121NB5F11
W6
IO139PB6F13
P2
IO156PB7F14
J4
IO121PB5F11
W7
IO140NB6F13
P3
IO157NB7F14
H2
IO122NB5F11
V3
IO140PB6F13
R3
IO157PB7F14
J2
IO122PB5F11
W3
IO141NB6F13
M6
IO158NB7F15
H1
IO123NB5F11
T7
IO141PB6F13
N6
IO158PB7F15
J1
IO123PB5F11
T8
IO142NB6F13
P1
IO159NB7F15
F1
IO124NB5F11
V4
IO142PB6F13
R1
IO159PB7F15
G1
IO124PB5F11
W5
IO143NB6F13
M5
IO160NB7F15
F2
IO125NB5F11
V6
IO143PB6F13
N5
IO160PB7F15
G2
IO125PB5F11
V7
IO144NB6F13
M4
IO161NB7F15
H6
IO144PB6F13
N4
IO161PB7F15
J6
Bank 6
Bank 7
IO126NB6F12
V2
IO145NB6F13
M7
IO162NB7F15
F3
IO126PB6F12
W2
IO145PB6F13
N7
IO162PB7F15
G3
R ev i si o n 1 8
3- 29
Package Pin Assignments
FG484
FG484
FG484
AX500 Function
Pin
Number
AX500 Function
Pin
Number
AX500 Function
Pin
Number
IO163NB7F15
G5
GND
D4
GND
V5
IO163PB7F15
G6
GND
E18
GND
W19
IO164NB7F15
D1
GND
E5
GND
W4
IO164PB7F15
E1
GND
G18
GND
Y20
IO165NB7F15
F4
GND
H15
GND
Y3
IO165PB7F15
G4
GND
H8
GND/LP
G7
IO166NB7F15
D2
GND
J14
NC
AB8
IO166PB7F15
E2
GND
J9
NC
AB16
IO167NB7F15
F5
GND
K10
NC
C10
IO167PB7F15
E4
GND
K11
NC
C11
GND
K12
NC
C14
Dedicated I/O
3- 30
VCCDA
H7
GND
K13
PRA
G11
GND
A1
GND
L1
PRB
F11
GND
A11
GND
L10
PRC
T12
GND
A12
GND
L11
PRD
U12
GND
A2
GND
L12
TCK
G8
GND
A21
GND
L13
TDI
F9
GND
A22
GND
L22
TDO
F7
GND
AA1
GND
M1
TMS
F6
GND
AA2
GND
M10
TRST
F8
GND
AA21
GND
M11
VCCA
G17
GND
AA22
GND
M12
VCCA
J10
GND
AB1
GND
M13
VCCA
J11
GND
AB11
GND
M22
VCCA
J12
GND
AB12
GND
N10
VCCA
J13
GND
AB2
GND
N11
VCCA
J7
GND
AB21
GND
N12
VCCA
K14
GND
AB22
GND
N13
VCCA
K9
GND
B1
GND
P14
VCCA
L14
GND
B2
GND
P9
VCCA
L9
GND
B21
GND
R15
VCCA
M14
GND
B22
GND
R8
VCCA
M9
GND
C20
GND
U16
VCCA
N14
GND
C3
GND
U6
VCCA
N9
GND
D19
GND
V18
VCCA
P10
R ev i sio n 1 8
Axcelerator Family FPGAs
FG484
FG484
FG484
AX500 Function
Pin
Number
AX500 Function
Pin
Number
AX500 Function
Pin
Number
VCCA
P11
VCCIB2
C22
VCOMPLG
V11
VCCA
P12
VCCIB2
J15
VCOMPLH
T9
VCCA
P13
VCCIB2
K15
VPUMP
D17
VCCA
T6
VCCIB2
L15
VCCA
U17
VCCIB3
M15
VCCPLA
F10
VCCIB3
N15
VCCPLB
G9
VCCIB3
P15
VCCPLC
D13
VCCIB3
Y21
VCCPLD
G13
VCCIB3
Y22
VCCPLE
U13
VCCIB4
AA20
VCCPLF
T14
VCCIB4
AB20
VCCPLG
W10
VCCIB4
R12
VCCPLH
T10
VCCIB4
R13
VCCDA
D14
VCCIB4
R14
VCCDA
D5
VCCIB5
AA3
VCCDA
F16
VCCIB5
AB3
VCCDA
G12
VCCIB5
R10
VCCDA
L4
VCCIB5
R11
VCCDA
M18
VCCIB5
R9
VCCDA
T11
VCCIB6
M8
VCCDA
T17
VCCIB6
N8
VCCDA
U7
VCCIB6
P8
VCCDA
V14
VCCIB6
Y1
VCCDA
V8
VCCIB6
Y2
VCCIB0
A3
VCCIB7
C1
VCCIB0
B3
VCCIB7
C2
VCCIB0
H10
VCCIB7
J8
VCCIB0
H11
VCCIB7
K8
VCCIB0
H9
VCCIB7
L8
VCCIB1
A20
VCOMPLA
D10
VCCIB1
B20
VCOMPLB
G10
VCCIB1
H12
VCOMPLC
E12
VCCIB1
H13
VCOMPLD
G14
VCCIB1
H14
VCOMPLE
W13
VCCIB2
C21
VCOMPLF
T13
R ev i si o n 1 8
3- 31
Package Pin Assignments
FG484
AX1000 Function
FG484
Pin
Number
Bank 0
3- 32
FG484
AX1000 Function
Pin
Number
AX1000 Function
Pin
Number
IO29NB0F2
B12
IO51PB1F4
D22
IO01NB0F0
E3
IO29PB0F2
B11
IO52NB1F4
E16
IO01PB0F0
D3
IO30NB0F2/HCLKAN
E11
IO52PB1F4
E15
IO02NB0F0
E7
IO30PB0F2/HCLKAP
E10
IO57NB1F5
E21
IO02PB0F0
E6
IO31NB0F2/HCLKBN
D12
IO57PB1F5
D21
IO05NB0F0
D2
IO31PB0F2/HCLKBP
D11
IO60NB1F5
G16
IO05PB0F0
E2
Bank 1
IO60PB1F5
G15
IO06NB0F0
C5
IO32NB1F3/HCLKCN
F13
IO61NB1F5
D18
IO06PB0F0
C4
IO32PB1F3/HCLKCP
F12
IO61PB1F5
E17
IO12NB0F1
D7
IO33NB1F3/HCLKDN
E14
IO63NB1F5
E20
IO12PB0F1
D6
IO33PB1F3/HCLKDP
E13
IO63PB1F5
D20
IO13NB0F1
B5
IO34NB1F3
C13
IO13PB0F1
B4
IO34PB1F3
C12
IO64NB2F6
F18
IO14NB0F1
E9
IO37NB1F3
B14
IO64PB2F6
F17
IO14PB0F1
E8
IO37PB1F3
B13
IO67NB2F6
F19
IO15NB0F1
C7
IO38NB1F3
A16
IO67PB2F6
E19
IO15PB0F1
C6
IO38PB1F3
A15
IO68NB2F6
J16
IO16NB0F1
A5
IO40NB1F3
C15
IO68PB2F6
H16
IO16PB0F1
A4
IO42NB1F4
A18
IO70NB2F6
J17
IO17NB0F1
B7
IO42PB1F4
A17
IO70PB2F6
H17
IO17PB0F1
B6
IO43NB1F4
B16
IO74NB2F7
J18
IO18NB0F1
A7
IO43PB1F4
B15
IO74PB2F7
H18
IO18PB0F1
A6
IO44NB1F4
B18
IO75NB2F7
G20
IO19NB0F1
C9
IO44PB1F4
B17
IO75PB2F7
F20
IO19PB0F1
C8
IO45NB1F4
B19
IO79NB2F7
H19
IO20NB0F1
D9
IO45PB1F4
A19
IO79PB2F7
G19
IO20PB0F1
D8
IO46NB1F4
C19
IO80NB2F7
L16
IO21NB0F1
B9
IO46PB1F4
C18
IO80PB2F7
K16
IO21PB0F1
B8
IO48NB1F4
F15
IO84NB2F7
L17
IO22NB0F2
A9
IO48PB1F4
F14
IO84PB2F7
K17
IO22PB0F2
A8
IO49NB1F4
D16
IO85NB2F8
G21
IO23NB0F2
B10
IO49PB1F4
D15
IO85PB2F8
F21
IO23PB0F2
A10
IO50NB1F4
C17
IO86NB2F8
G22
IO26NB0F2
A14
IO50PB1F4
C16
IO86PB2F8
F22
IO26PB0F2
A13
IO51NB1F4
E22
IO87NB2F8
J20
R ev i sio n 1 8
Bank 2
Axcelerator Family FPGAs
FG484
FG484
FG484
AX1000 Function
Pin
Number
AX1000 Function
Pin
Number
AX1000 Function
Pin
Number
IO87PB2F8
H20
IO106PB3F9
P17
IO142PB4F13
V20
IO88NB2F8
L18
IO107NB3F10
T21
IO143NB4F13
W15
IO88PB2F8
K18
IO107PB3F10
R21
IO143PB4F13
W16
IO89NB2F8
K19
IO110NB3F10
V22
IO144NB4F13
AA18
IO89PB2F8
J19
IO110PB3F10
U22
IO144PB4F13
AA19
IO90NB2F8
J21
IO113NB3F10
V21
IO145NB4F13
U14
IO90PB2F8
H21
IO113PB3F10
U21
IO145PB4F13
U15
IO91NB2F8
J22
IO114NB3F10
P18
IO146NB4F13
Y15
IO91PB2F8
H22
IO114PB3F10
P19
IO146PB4F13
Y16
IO93NB2F8
K21
IO116PB3F10
R19
IO147NB4F13
AB18
IO93PB2F8
K22
IO117NB3F10
U20
IO147PB4F13
AB19
IO94NB2F8
L20
IO117PB3F10
T20
IO149NB4F13
Y14
IO94PB2F8
K20
IO118NB3F11
T18
IO149PB4F13
W14
IO95NB2F8
M21
IO118PB3F11
R18
IO150NB4F13
AA16
IO95PB2F8
L21
IO121NB3F11
U19
IO150PB4F13
AA17
IO121PB3F11
T19
IO152NB4F14
AA14
Bank 3
IO96NB3F9
N16
IO124NB3F11
R16
IO152PB4F14
AA15
IO96PB3F9
M16
IO124PB3F11
P16
IO154NB4F14
AB14
IO97NB3F9
M19
IO127NB3F11
W21
IO154PB4F14
AB15
IO97PB3F9
L19
IO127PB3F11
W22
IO155NB4F14
AA13
IO98NB3F9
P22
IO155PB4F14
AB13
IO98PB3F9
N22
IO129PB4F12
AB17
IO158NB4F14
Y12
IO99NB3F9
N20
IO132NB4F12
Y19
IO158PB4F14
Y13
IO99PB3F9
M20
IO132PB4F12
W18
IO159NB4F14/CLKEN
V12
IO100NB3F9
N17
IO133NB4F12
W17
IO159PB4F14/CLKEP
V13
IO100PB3F9
M17
IO133PB4F12
V17
IO160NB4F14/CLKFN
W11
IO101NB3F9
P21
IO135NB4F12
T15
IO160PB4F14/CLKFP
W12
IO101PB3F9
N21
IO135PB4F12
T16
IO103NB3F9
R20
IO138NB4F12
Y17
IO161NB5F15/CLKGN
U10
IO103PB3F9
P20
IO138PB4F12
Y18
IO161PB5F15/CLKGP
U11
IO104NB3F9
N18
IO139NB4F13
V15
IO162NB5F15/CLKHN
V9
IO104PB3F9
N19
IO139PB4F13
V16
IO162PB5F15/CLKHP
V10
IO105NB3F9
T22
IO140NB4F13
U18
IO163NB5F15
Y10
IO105PB3F9
R22
IO140PB4F13
V19
IO163PB5F15
Y11
IO106NB3F9
R17
IO142NB4F13
W20
IO167NB5F15
AA11
Bank 4
R ev i si o n 1 8
Bank 5
3- 33
Package Pin Assignments
FG484
FG484
FG484
AX1000 Function
Pin
Number
AX1000 Function
Pin
Number
AX1000 Function
Pin
Number
IO167PB5F15
AA12
IO194NB6F18
V2
IO223NB6F20
M7
IO169NB5F15
AA9
IO194PB6F18
W2
IO223PB6F20
N7
IO169PB5F15
AA10
IO195NB6F18
U5
IO224NB6F20
M4
IO170NB5F15
AB9
IO195PB6F18
T5
IO224PB6F20
N4
IO170PB5F15
AB10
IO200NB6F18
T4
IO171NB5F16
W8
IO200PB6F18
U4
IO225NB7F21
M2
IO171PB5F16
W9
IO201NB6F18
P6
IO225PB7F21
N1
IO172NB5F16
Y8
IO201PB6F18
R6
IO226NB7F21
K2
IO172PB5F16
Y9
IO203NB6F19
U2
IO226PB7F21
K1
IO173NB5F16
U8
IO204NB6F19
T3
IO228NB7F21
L3
IO173PB5F16
U9
IO204PB6F19
U3
IO228PB7F21
L2
IO174NB5F16
AA7
IO205NB6F19
P5
IO229NB7F21
K5
IO174PB5F16
AA8
IO205PB6F19
R5
IO229PB7F21
L5
IO175NB5F16
AB5
IO208NB6F19
V1
IO230NB7F21
H1
IO175PB5F16
AB6
IO208PB6F19
W1
IO230PB7F21
J1
IO176NB5F16
AA5
IO209NB6F19
P7
IO231NB7F21
H2
IO176PB5F16
AA6
IO209PB6F19
R7
IO231PB7F21
J2
IO177NB5F16
AA4
IO212NB6F19
P4
IO232NB7F21
K4
IO177PB5F16
AB4
IO212PB6F19
R4
IO232PB7F21
K3
IO178NB5F16
Y6
IO214NB6F20
P3
IO233NB7F21
K6
IO178PB5F16
Y7
IO214PB6F20
R3
IO233PB7F21
L6
IO179NB5F16
T7
IO215NB6F20
M6
IO234NB7F21
F1
IO179PB5F16
T8
IO215PB6F20
N6
IO234PB7F21
G1
IO180NB5F16
W6
IO216NB6F20
R2
IO235NB7F21
F2
IO180PB5F16
W7
IO216PB6F20
T2
IO235PB7F21
G2
IO181NB5F17
Y4
IO217NB6F20
T1
IO236NB7F22
H3
IO181PB5F17
Y5
IO217PB6F20
U1
IO236PB7F22
J3
IO184NB5F17
AB7
IO219NB6F20
M5
IO237NB7F22
K7
IO187NB5F17
V3
IO219PB6F20
N5
IO237PB7F22
L7
IO187PB5F17
W3
IO220NB6F20
P1
IO241NB7F22
H6
IO188NB5F17
V4
IO220PB6F20
R1
IO241PB7F22
J6
IO188PB5F17
W5
IO221NB6F20
N2
IO242NB7F22
H4
IO192NB5F17
V6
IO221PB6F20
P2
IO242PB7F22
J4
IO192PB5F17
V7
IO222NB6F20
M3
IO243NB7F22
H5
IO222PB6F20
N3
IO243PB7F22
J5
Bank 6
3- 34
R ev i sio n 1 8
Bank 7
Axcelerator Family FPGAs
FG484
FG484
FG484
AX1000 Function
Pin
Number
AX1000 Function
Pin
Number
AX1000 Function
Pin
Number
IO246NB7F22
F3
GND
D4
GND
V5
IO246PB7F22
G3
GND
E18
GND
W19
IO250NB7F23
F4
GND
E5
GND
W4
IO250PB7F23
G4
GND
G18
GND
Y20
IO253NB7F23
G5
GND
H15
GND
Y3
IO253PB7F23
G6
GND
H8
GND/LP
G7
IO254NB7F23
D1
GND
J14
PRA
G11
IO254PB7F23
E1
GND
J9
PRB
F11
IO257NB7F23
F5
GND
K10
PRC
T12
IO257PB7F23
E4
GND
K11
PRD
U12
GND
K12
TCK
G8
Dedicated I/O
VCCDA
H7
GND
K13
TDI
F9
GND
A1
GND
L1
TDO
F7
GND
A11
GND
L10
TMS
F6
GND
A12
GND
L11
TRST
F8
GND
A2
GND
L12
VCCA
G17
GND
A21
GND
L13
VCCA
J10
GND
A22
GND
L22
VCCA
J11
GND
AA1
GND
M1
VCCA
J12
GND
AA2
GND
M10
VCCA
J13
GND
AA21
GND
M11
VCCA
J7
GND
AA22
GND
M12
VCCA
K14
GND
AB1
GND
M13
VCCA
K9
GND
AB11
GND
M22
VCCA
L14
GND
AB12
GND
N10
VCCA
L9
GND
AB2
GND
N11
VCCA
M14
GND
AB21
GND
N12
VCCA
M9
GND
AB22
GND
N13
VCCA
N14
GND
B1
GND
P14
VCCA
N9
GND
B2
GND
P9
VCCA
P10
GND
B21
GND
R15
VCCA
P11
GND
B22
GND
R8
VCCA
P12
GND
C20
GND
U16
VCCA
P13
GND
C3
GND
U6
VCCA
T6
GND
D19
GND
V18
VCCA
U17
R ev i si o n 1 8
3- 35
Package Pin Assignments
FG484
FG484
FG484
AX1000 Function
Pin
Number
AX1000 Function
Pin
Number
AX1000 Function
Pin
Number
VCCPLA
F10
VCCIB2
C22
VCOMPLG
V11
VCCPLB
G9
VCCIB2
J15
VCOMPLH
T9
VCCPLC
D13
VCCIB2
K15
VPUMP
D17
VCCPLD
G13
VCCIB2
L15
VCCPLE
U13
VCCIB3
M15
VCCPLF
T14
VCCIB3
N15
VCCPLG
W10
VCCIB3
P15
VCCPLH
T10
VCCIB3
Y21
VCCDA
AB16
VCCIB3
Y22
VCCDA
AB8
VCCIB4
AA20
VCCDA
C10
VCCIB4
AB20
VCCDA
C11
VCCIB4
R12
VCCDA
C14
VCCIB4
R13
VCCDA
D14
VCCIB4
R14
VCCDA
D5
VCCIB5
AA3
VCCDA
F16
VCCIB5
AB3
VCCDA
G12
VCCIB5
R10
VCCDA
L4
VCCIB5
R11
VCCDA
M18
VCCIB5
R9
VCCDA
T11
VCCIB6
M8
VCCDA
T17
VCCIB6
N8
VCCDA
U7
VCCIB6
P8
VCCDA
V14
VCCIB6
Y1
VCCDA
V8
VCCIB6
Y2
VCCIB0
A3
VCCIB7
C1
VCCIB0
B3
VCCIB7
C2
VCCIB0
H10
VCCIB7
J8
VCCIB0
H11
VCCIB7
K8
VCCIB0
H9
VCCIB7
L8
VCCIB1
A20
VCOMPLA
D10
VCCIB1
B20
VCOMPLB
G10
VCCIB1
H12
VCOMPLC
E12
VCCIB1
H13
VCOMPLD
G14
VCCIB1
H14
VCOMPLE
W13
VCCIB2
C21
VCOMPLF
T13
3- 36
R ev i sio n 1 8
Axcelerator Family FPGAs
FG676
A1 Ball Pad Corner
26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8
7 6
5 4
3
2 1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
AD
AE
AF
Note
For Package Manufacturing and Environmental information, visit Resource center at
http://www.microsemi.com/soc/products/rescenter/package/index.html.
R ev i si o n 1 8
3- 37
Package Pin Assignments
FG676
AX500 Function
FG676
Pin
Number
Bank 0
3- 38
FG676
AX500 Function
Pin
Number
AX500 Function
Pin
Number
IO17NB0F1
F12
IO34NB1F3
D20
IO00NB0F0
F8
IO17PB0F1
G12
IO34PB1F3
C20
IO00PB0F0
E8
IO18NB0F1
C12
IO35NB1F3
D21
IO01NB0F0
A5
IO18PB0F1
C11
IO35PB1F3
C21
IO01PB0F0
A4
IO19NB0F1/HCLKAN
A12
IO36NB1F3
D22
IO02NB0F0
E7
IO19PB0F1/HCLKAP
B12
IO36PB1F3
C22
IO02PB0F0
E6
IO20NB0F1/HCLKBN
C13
IO37NB1F3
F19
IO03NB0F0
D6
IO20PB0F1/HCLKBP
B13
IO37PB1F3
E19
IO03PB0F0
D5
Bank 1
IO38NB1F3
B23
IO04NB0F0
B5
IO21NB1F2/HCLKCN
C15
IO38PB1F3
A23
IO04PB0F0
C5
IO21PB1F2/HCLKCP
C14
IO39NB1F3
E21
IO05NB0F0
B6
IO22NB1F2/HCLKDN
A15
IO39PB1F3
E20
IO05PB0F0
C6
IO22PB1F2/HCLKDP
B15
IO40NB1F3
D23
IO06NB0F0
C7
IO23NB1F2
F15
IO40PB1F3
C23
IO06PB0F0
D7
IO23PB1F2
G15
IO41NB1F3
D25
IO07NB0F0
A7
IO24NB1F2
B16
IO41PB1F3
C25
IO07PB0F0
A6
IO24PB1F2
A16
IO08NB0F0
C8
IO25NB1F2
A18
IO42NB2F4
G24
IO08PB0F0
D8
IO25PB1F2
A17
IO42PB2F4
G23
IO09NB0F0
F10
IO26NB1F2
D16
IO43NB2F4
G26
IO09PB0F0
F9
IO26PB1F2
E16
IO43PB2F4
F26
IO10NB0F0
B8
IO27NB1F2
F16
IO44NB2F4
F25
IO10PB0F0
B7
IO27PB1F2
G16
IO44PB2F4
E25
IO11NB0F0
D10
IO28NB1F2
C18
IO45NB2F4
J21
IO11PB0F0
E10
IO28PB1F2
C17
IO45PB2F4
J22
IO12NB0F1
B9
IO29NB1F2
B19
IO46NB2F4
H25
IO12PB0F1
C9
IO29PB1F2
B18
IO46PB2F4
G25
IO13NB0F1
F11
IO30NB1F2
D19
IO47NB2F4
K23
IO13PB0F1
G11
IO30PB1F2
C19
IO47PB2F4
J23
IO14NB0F1
D11
IO31NB1F2
F17
IO48NB2F4
J24
IO14PB0F1
E11
IO31PB1F2
E17
IO48PB2F4
H24
IO15NB0F1
B10
IO32NB1F3
B20
IO49NB2F4
K21
IO15PB0F1
C10
IO32PB1F3
A20
IO49PB2F4
K22
IO16NB0F1
A10
IO33NB1F3
B22
IO50NB2F4
K25
IO16PB0F1
A9
IO33PB1F3
B21
IO50PB2F4
J25
R ev i sio n 1 8
Bank 2
Axcelerator Family FPGAs
FG676
FG676
FG676
AX500 Function
Pin
Number
AX500 Function
Pin
Number
AX500 Function
Pin
Number
IO51NB2F4
L20
IO68NB3F6
V26
IO85NB4F8
AE23
IO51PB2F4
L21
IO68PB3F6
U26
IO85PB4F8
AE24
IO52NB2F5
K26
IO69NB3F6
V25
IO86NB4F8
AC21
IO52PB2F5
J26
IO69PB3F6
U25
IO86PB4F8
AC22
IO53NB2F5
L23
IO70NB3F6
Y25
IO87NB4F8
AF22
IO53PB2F5
L22
IO70PB3F6
W25
IO87PB4F8
AF23
IO54NB2F5
L24
IO71NB3F6
W24
IO88NB4F8
AD22
IO54PB2F5
K24
IO71PB3F6
V24
IO88PB4F8
AD23
IO55NB2F5
M20
IO72NB3F6
V23
IO89NB4F8
AC19
IO55PB2F5
M21
IO72PB3F6
U23
IO89PB4F8
AC20
IO56NB2F5
L26
IO73NB3F6
T21
IO90NB4F8
AE21
IO56PB2F5
L25
IO73PB3F6
T20
IO90PB4F8
AE22
IO57NB2F5
M23
IO74NB3F7
AA26
IO91NB4F8
AA17
IO57PB2F5
M22
IO74PB3F7
Y26
IO91PB4F8
AA18
IO58NB2F5
M26
IO75NB3F7
AA24
IO92NB4F8
AD20
IO58PB2F5
M25
IO75PB3F7
Y24
IO92PB4F8
AD21
IO59NB2F5
N22
IO76NB3F7
Y23
IO93NB4F8
AF20
IO59PB2F5
N23
IO76PB3F7
W23
IO93PB4F8
AF21
IO60NB2F5
N24
IO77NB3F7
V21
IO94NB4F9
AE19
IO60PB2F5
M24
IO77PB3F7
U21
IO94PB4F9
AE20
IO61NB2F5
N20
IO78NB3F7
AB25
IO95NB4F9
AC17
IO61PB2F5
N21
IO78PB3F7
AA25
IO95PB4F9
AC18
IO62NB2F5
P25
IO79NB3F7
AC26
IO96NB4F9
AD18
IO62PB2F5
N25
IO79PB3F7
AB26
IO96PB4F9
AD19
IO80NB3F7
AC24
IO97NB4F9
AA16
Bank 3
IO63NB3F6
T26
IO80PB3F7
AB24
IO97PB4F9
Y16
IO63PB3F6
R26
IO81NB3F7
AB23
IO98NB4F9
AE17
IO64NB3F6
R24
IO81PB3F7
AA23
IO98PB4F9
AE18
IO64PB3F6
P24
IO82NB3F7
AA22
IO99NB4F9
AC16
IO65NB3F6
P20
IO82PB3F7
Y22
IO99PB4F9
AB16
IO65PB3F6
P21
IO83NB3F7
AE26
IO100NB4F9
AF17
IO66NB3F6
T25
IO83PB3F7
AD26
IO100PB4F9
AF18
IO66PB3F6
R25
IO101NB4F9
AA15
IO67NB3F6
T23
IO84NB4F8
AB21
IO101PB4F9
Y15
IO67PB3F6
R23
IO84PB4F8
AA21
IO102NB4F9
AC15
Bank 4
R ev i si o n 1 8
3- 39
Package Pin Assignments
FG676
FG676
FG676
AX500 Function
Pin
Number
AX500 Function
Pin
Number
AX500 Function
Pin
Number
IO102PB4F9
AB15
IO119PB5F11
AE6
IO136PB6F13
U5
IO103NB4F9/CLKEN
AE16
IO120NB5F11
AE5
IO137NB6F13
T6
IO103PB4F9/CLKEP
AF16
IO120PB5F11
AF5
IO137PB6F13
T7
IO104NB4F9/CLKFN
AE14
IO121NB5F11
AF4
IO138NB6F13
T5
IO104PB4F9/CLKFP
AE15
IO121PB5F11
AE4
IO138PB6F13
T4
IO122NB5F11
AC5
IO139NB6F13
R6
Bank 5
IO105NB5F10/CLKGN
AE12
IO122PB5F11
AC6
IO139PB6F13
R7
IO105PB5F10/CLKGP
AE13
IO123NB5F11
AD4
IO140NB6F13
T3
IO106NB5F10/CLKHN
AE11
IO123PB5F11
AD5
IO140PB6F13
U3
IO106PB5F10/CLKHP
AF11
IO124NB5F11
AB6
IO141NB6F13
U1
IO107NB5F10
Y12
IO124PB5F11
AB7
IO141PB6F13
U2
IO107PB5F10
AA13
IO125NB5F11
AE3
IO142NB6F13
R2
IO108NB5F10
AC12
IO125PB5F11
AF3
IO142PB6F13
T2
IO108PB5F10
AB12
IO143NB6F13
P3
IO109NB5F10
AC10
IO126NB6F12
AB3
IO143PB6F13
R3
IO109PB5F10
AC11
IO126PB6F12
AC3
IO144NB6F13
P5
IO110NB5F10
AF9
IO127NB6F12
AA2
IO144PB6F13
P4
IO110PB5F10
AF10
IO127PB6F12
AB2
IO145NB6F13
P6
IO111NB5F10
Y11
IO128NB6F12
AC2
IO145PB6F13
P7
IO111PB5F10
AA12
IO128PB6F12
AD2
IO146NB6F13
R1
IO112NB5F10
AE9
IO129NB6F12
Y1
IO146PB6F13
T1
IO112PB5F10
AE10
IO129PB6F12
AA1
IO113NB5F10
AC9
IO130NB6F12
Y3
IO147NB7F14
N6
IO113PB5F10
AD9
IO130PB6F12
AA3
IO147PB7F14
N7
IO114NB5F11
AF6
IO131NB6F12
U6
IO148NB7F14
N5
IO114PB5F11
AF7
IO131PB6F12
V6
IO148PB7F14
N4
IO115NB5F11
AA10
IO132NB6F12
W2
IO149NB7F14
N2
IO115PB5F11
AB10
IO132PB6F12
Y2
IO149PB7F14
N3
IO116NB5F11
AE7
IO133NB6F12
V4
IO150NB7F14
L1
IO116PB5F11
AE8
IO133PB6F12
W4
IO150PB7F14
M1
IO117NB5F11
AD7
IO134NB6F12
V3
IO151NB7F14
M2
IO117PB5F11
AD8
IO134PB6F12
W3
IO151PB7F14
M3
IO118NB5F11
AC7
IO135NB6F12
V1
IO152NB7F14
M5
IO118PB5F11
AC8
IO135PB6F12
V2
IO152PB7F14
M4
IO119NB5F11
AD6
IO136NB6F13
U4
IO153NB7F14
M7
3- 40
Bank 6
R ev i sio n 1 8
Bank 7
Axcelerator Family FPGAs
FG676
FG676
FG676
AX500 Function
Pin
Number
AX500 Function
Pin
Number
AX500 Function
Pin
Number
IO153PB7F14
M6
GND
A8
GND
L11
IO154NB7F14
K2
GND
AC23
GND
L12
IO154PB7F14
L2
GND
AC4
GND
L13
IO155NB7F14
K3
GND
AD24
GND
L14
IO155PB7F14
L3
GND
AD3
GND
L15
IO156NB7F14
L5
GND
AE2
GND
L16
IO156PB7F14
L4
GND
AE25
GND
L17
IO157NB7F14
L6
GND
AF1
GND
M10
IO157PB7F14
L7
GND
AF13
GND
M11
IO158NB7F15
J1
GND
AF14
GND
M12
IO158PB7F15
K1
GND
AF19
GND
M13
IO159NB7F15
J4
GND
AF26
GND
M14
IO159PB7F15
K4
GND
AF8
GND
M15
IO160NB7F15
H2
GND
B2
GND
M16
IO160PB7F15
J2
GND
B25
GND
M17
IO161NB7F15
K6
GND
B26
GND
N1
IO161PB7F15
K5
GND
C24
GND
N10
IO162NB7F15
H3
GND
C3
GND
N11
IO162PB7F15
J3
GND
G20
GND
N12
IO163NB7F15
G2
GND
G7
GND
N13
IO163PB7F15
G1
GND
H1
GND
N14
IO164NB7F15
G4
GND
H19
GND
N15
IO164PB7F15
H4
GND
H26
GND
N16
IO165NB7F15
F3
GND
H8
GND
N17
IO165PB7F15
G3
GND
J18
GND
N26
IO166NB7F15
E2
GND
J9
GND
P1
IO166PB7F15
F2
GND
K10
GND
P10
IO167NB7F15
F5
GND
K11
GND
P11
IO167PB7F15
G5
GND
K12
GND
P12
GND
K13
GND
P13
Dedicated I/O
GND
A1
GND
K14
GND
P14
GND
A13
GND
K15
GND
P15
GND
A14
GND
K16
GND
P16
GND
A19
GND
K17
GND
P17
GND
A26
GND
L10
GND
P26
R ev i si o n 1 8
3- 41
Package Pin Assignments
FG676
FG676
FG676
AX500 Function
Pin
Number
AX500 Function
Pin
Number
AX500 Function
Pin
Number
GND
R10
NC
A22
NC
C4
GND
R11
NC
A24
NC
D1
GND
R12
NC
A25
NC
D13
GND
R13
NC
AA11
NC
D14
GND
R14
NC
AA19
NC
D17
GND
R15
NC
AA20
NC
D18
GND
R16
NC
AA4
NC
D2
GND
R17
NC
AA5
NC
D26
GND
T10
NC
AA6
NC
D3
GND
T11
NC
AA7
NC
D9
GND
T12
NC
AA8
NC
E1
GND
T13
NC
AA9
NC
E18
GND
T14
NC
AB1
NC
E23
GND
T15
NC
AB11
NC
E24
GND
T16
NC
AB17
NC
E26
GND
T17
NC
AB18
NC
E3
GND
U10
NC
AB19
NC
E4
GND
U11
NC
AB20
NC
E9
GND
U12
NC
AB8
NC
F1
GND
U13
NC
AB9
NC
F18
GND
U14
NC
AC1
NC
F20
GND
U15
NC
AC13
NC
F21
GND
U16
NC
AC14
NC
F22
GND
U17
NC
AC25
NC
F23
GND
V18
NC
AD1
NC
F24
GND
V9
NC
AD11
NC
F4
GND
W1
NC
AD16
NC
F6
GND
W19
NC
AD25
NC
F7
GND
W26
NC
AE1
NC
G21
GND
W8
NC
AF2
NC
G22
GND
Y20
NC
AF25
NC
H21
GND
Y7
NC
B11
NC
H22
GND/LP
C2
NC
B24
NC
H23
NC
A11
NC
B4
NC
H5
NC
A21
NC
C16
NC
H6
3- 42
R ev i sio n 1 8
Axcelerator Family FPGAs
FG676
FG676
FG676
AX500 Function
Pin
Number
AX500 Function
Pin
Number
AX500 Function
Pin
Number
NC
J5
VCCA
J10
VCCDA
AD10
NC
J6
VCCA
J11
VCCDA
AD13
NC
P22
VCCA
J12
VCCDA
AD17
NC
R20
VCCA
J13
VCCDA
B1
NC
R21
VCCA
J14
VCCDA
B17
NC
R22
VCCA
J15
VCCDA
D24
NC
R4
VCCA
J16
VCCDA
E14
NC
R5
VCCA
J17
VCCDA
P2
NC
T22
VCCA
K18
VCCDA
P23
NC
T24
VCCA
K9
VCCIB0
G10
NC
U22
VCCA
L18
VCCIB0
G8
NC
U24
VCCA
L9
VCCIB0
G9
NC
V22
VCCA
M18
VCCIB0
H10
NC
V5
VCCA
M9
VCCIB0
H11
NC
W21
VCCA
N18
VCCIB0
H12
NC
W22
VCCA
N9
VCCIB0
H13
NC
W5
VCCA
P18
VCCIB0
H9
NC
W6
VCCA
P9
VCCIB1
G17
NC
Y21
VCCA
R18
VCCIB1
G18
NC
Y4
VCCA
R9
VCCIB1
G19
NC
Y5
VCCA
T18
VCCIB1
H14
NC
Y6
VCCA
T9
VCCIB1
H15
PRA
E13
VCCA
U18
VCCIB1
H16
PRB
B14
VCCA
U9
VCCIB1
H17
PRC
Y14
VCCA
V10
VCCIB1
H18
PRD
AD14
VCCA
V11
VCCIB2
H20
TCK
E5
VCCA
V12
VCCIB2
J19
TDI
B3
VCCA
V13
VCCIB2
J20
TDO
G6
VCCA
V14
VCCIB2
K19
TMS
D4
VCCA
V15
VCCIB2
K20
TRST
A2
VCCA
V16
VCCIB2
L19
VCCA
AB4
VCCA
V17
VCCIB2
M19
VCCA
AF24
VCCDA
A3
VCCIB2
N19
VCCA
C1
VCCDA
AB22
VCCIB3
P19
VCCA
C26
VCCDA
AB5
VCCIB3
R19
R ev i si o n 1 8
3- 43
Package Pin Assignments
FG676
FG676
AX500 Function
Pin
Number
AX500 Function
Pin
Number
VCCIB3
T19
VCCIB7
L8
VCCIB3
U19
VCCIB7
M8
VCCIB3
U20
VCCIB7
N8
VCCIB3
V19
VCCPLA
E12
VCCIB3
V20
VCCPLB
F13
VCCIB3
W20
VCCPLC
E15
VCCIB4
W14
VCCPLD
G14
VCCIB4
W15
VCCPLE
AF15
VCCIB4
W16
VCCPLF
AA14
VCCIB4
W17
VCCPLG
AF12
VCCIB4
W18
VCCPLH
AB13
VCCIB4
Y17
VCOMPLA
D12
VCCIB4
Y18
VCOMPLB
G13
VCCIB4
Y19
VCOMPLC
D15
VCCIB5
W10
VCOMPLD
F14
VCCIB5
W11
VCOMPLE
AD15
VCCIB5
W12
VCOMPLF
AB14
VCCIB5
W13
VCOMPLG
AD12
VCCIB5
W9
VCOMPLH
Y13
VCCIB5
Y10
VPUMP
E22
VCCIB5
Y8
VCCIB5
Y9
VCCIB6
P8
VCCIB6
R8
VCCIB6
T8
VCCIB6
U7
VCCIB6
U8
VCCIB6
V7
VCCIB6
V8
VCCIB6
W7
VCCIB7
H7
VCCIB7
J7
VCCIB7
J8
VCCIB7
K7
VCCIB7
K8
3- 44
R ev i sio n 1 8
Axcelerator Family FPGAs
FG676
AX1000 Function
FG676
Pin Number
Bank 0
FG676
AX1000 Function
Pin Number
AX1000 Function
Pin Number
IO21PB0F1
C10
IO48NB1F4
F17
IO00NB0F0
B4
IO22NB0F2
F11
IO48PB1F4
E17
IO00PB0F0
C4
IO22PB0F2
G11
IO49NB1F4
A22
IO02NB0F0
E7
IO24NB0F2
D11
IO49PB1F4
A21
IO02PB0F0
E6
IO24PB0F2
E11
IO50NB1F4
E18
IO03NB0F0
D6
IO26NB0F2
C12
IO50PB1F4
F18
IO03PB0F0
D5
IO26PB0F2
C11
IO51NB1F4
D19
IO04NB0F0
B5
IO28NB0F2
F12
IO51PB1F4
C19
IO04PB0F0
C5
IO28PB0F2
G12
IO52NB1F4
D20
IO05NB0F0
A5
IO30NB0F2/HCLKAN
A12
IO52PB1F4
C20
IO05PB0F0
A4
IO30PB0F2/HCLKAP
B12
IO54NB1F5
B22
IO06NB0F0
F7
IO31NB0F2/HCLKBN
C13
IO54PB1F5
B21
IO06PB0F0
F6
IO31PB0F2/HCLKBP
B13
IO55NB1F5
D21
IO07NB0F0
B6
Bank 1
IO55PB1F5
C21
IO07PB0F0
C6
IO32NB1F3/HCLKCN
C15
IO56NB1F5
F19
IO08NB0F0
C7
IO32PB1F3/HCLKCP
C14
IO56PB1F5
E19
IO08PB0F0
D7
IO33NB1F3/HCLKDN
A15
IO57NB1F5
B23
IO10NB0F0
F8
IO33PB1F3/HCLKDP
B15
IO57PB1F5
A23
IO10PB0F0
E8
IO35NB1F3
B16
IO58NB1F5
D22
IO11NB0F0
A7
IO35PB1F3
A16
IO58PB1F5
C22
IO11PB0F0
A6
IO36NB1F3
F15
IO59NB1F5
B24
IO12NB0F1
C8
IO36PB1F3
G15
IO59PB1F5
A24
IO12PB0F1
D8
IO38NB1F3
F16
IO60NB1F5
E21
IO13NB0F1
B8
IO38PB1F3
G16
IO60PB1F5
E20
IO13PB0F1
B7
IO40NB1F3
A18
IO62NB1F5
D23
IO14NB0F1
D9
IO40PB1F3
A17
IO62PB1F5
C23
IO14PB0F1
E9
IO41NB1F4
C18
IO63NB1F5
F21
IO16NB0F1
F10
IO41PB1F4
C17
IO63PB1F5
F20
IO16PB0F1
F9
IO42NB1F4
D16
IO18NB0F1
B9
IO42PB1F4
E16
IO64NB2F6
H21
IO18PB0F1
C9
IO44NB1F4
D18
IO64PB2F6
G21
IO19NB0F1
A10
IO44PB1F4
D17
IO65NB2F6
G22
IO19PB0F1
A9
IO45NB1F4
B19
IO65PB2F6
F22
IO20NB0F1
D10
IO45PB1F4
B18
IO66NB2F6
F24
IO20PB0F1
E10
IO46NB1F4
B20
IO66PB2F6
F23
IO21NB0F1
B10
IO46PB1F4
A20
IO67NB2F6
E24
R ev i si o n 1 8
Bank 2
3- 45
Package Pin Assignments
FG676
FG676
FG676
AX1000 Function
Pin Number
AX1000 Function
Pin Number
AX1000 Function
Pin Number
IO67PB2F6
E23
IO88PB2F8
M22
IO110NB3F10
T21
IO68NB2F6
H23
IO89NB2F8
M26
IO110PB3F10
T20
IO68PB2F6
H22
IO89PB2F8
M25
IO112NB3F10
V23
IO69NB2F6
D25
IO90NB2F8
M20
IO112PB3F10
U23
IO69PB2F6
C25
IO90PB2F8
M21
IO113NB3F10
Y25
IO70NB2F6
G24
IO91NB2F8
N24
IO113PB3F10
W25
IO70PB2F6
G23
IO91PB2F8
M24
IO114NB3F10
V21
IO71NB2F6
F25
IO92NB2F8
N22
IO114PB3F10
U21
IO71PB2F6
E25
IO92PB2F8
N23
IO115NB3F10
W24
IO72NB2F6
G26
IO94NB2F8
N20
IO115PB3F10
V24
IO72PB2F6
F26
IO94PB2F8
N21
IO116NB3F10
AA26
IO73NB2F6
E26
IO95NB2F8
P25
IO116PB3F10
Y26
IO73PB2F6
D26
IO95PB2F8
N25
IO118NB3F11
AC26
IO74NB2F7
J21
IO118PB3F11
AB26
IO74PB2F7
J22
IO98NB3F9
P20
IO119NB3F11
AB25
IO75NB2F7
J24
IO98PB3F9
P21
IO119PB3F11
AA25
IO75PB2F7
H24
IO99NB3F9
R24
IO120NB3F11
W22
IO76NB2F7
K23
IO99PB3F9
P24
IO120PB3F11
V22
IO76PB2F7
J23
IO100NB3F9
R22
IO121NB3F11
Y23
IO77NB2F7
H25
IO100PB3F9
P22
IO121PB3F11
W23
IO77PB2F7
G25
IO101NB3F9
T26
IO122NB3F11
AA24
IO78NB2F7
K25
IO101PB3F9
R26
IO122PB3F11
Y24
IO78PB2F7
J25
IO102NB3F9
R21
IO123NB3F11
AE26
IO80NB2F7
K21
IO102PB3F9
R20
IO123PB3F11
AD26
IO80PB2F7
K22
IO103NB3F9
T25
IO124NB3F11
Y21
IO81NB2F7
K26
IO103PB3F9
R25
IO124PB3F11
W21
IO81PB2F7
J26
IO105NB3F9
V26
IO125NB3F11
AD25
IO82NB2F7
L24
IO105PB3F9
U26
IO125PB3F11
AC25
IO82PB2F7
K24
IO106NB3F9
T23
IO126NB3F11
AB23
IO83NB2F7
L23
IO106PB3F9
R23
IO126PB3F11
AA23
IO83PB2F7
L22
IO107NB3F10
U24
IO127NB3F11
AC24
IO84NB2F7
L20
IO107PB3F10
T24
IO127PB3F11
AB24
IO84PB2F7
L21
IO108NB3F10
U22
IO128NB3F11
AA22
IO86NB2F8
L26
IO108PB3F10
T22
IO128PB3F11
Y22
IO86PB2F8
L25
IO109NB3F10
V25
IO88NB2F8
M23
IO109PB3F10
U25
3- 46
Bank 3
R ev i sio n 1 8
Bank 4
IO129NB4F12
AB21
Axcelerator Family FPGAs
FG676
FG676
FG676
AX1000 Function
Pin Number
AX1000 Function
Pin Number
AX1000 Function
Pin Number
IO129PB4F12
AA21
IO153PB4F14
AE18
IO177NB5F16
AA10
IO131NB4F12
AD22
IO154NB4F14
AF17
IO177PB5F16
AB10
IO131PB4F12
AD23
IO154PB4F14
AF18
IO179NB5F16
AD7
IO132NB4F12
AE23
IO155NB4F14
AA15
IO179PB5F16
AD8
IO132PB4F12
AE24
IO155PB4F14
Y15
IO180NB5F16
AC7
IO133NB4F12
AB20
IO157NB4F14
AC15
IO180PB5F16
AC8
IO133PB4F12
AA20
IO157PB4F14
AB15
IO181NB5F17
AA9
IO134NB4F12
AC21
IO159NB4F14/CLKEN
AE16
IO181PB5F17
AB9
IO134PB4F12
AC22
IO159PB4F14/CLKEP
AF16
IO183NB5F17
AD6
IO135NB4F12
AF22
IO160NB4F14/CLKFN
AE14
IO183PB5F17
AE6
IO135PB4F12
AF23
IO160PB4F14/CLKFP
AE15
IO184NB5F17
AE5
IO137NB4F12
AB19
Bank 5
IO184PB5F17
AF5
IO137PB4F12
AA19
IO161NB5F15/CLKGN
AE12
IO185NB5F17
AA8
IO139NB4F13
AC19
IO161PB5F15/CLKGP
AE13
IO185PB5F17
AB8
IO139PB4F13
AC20
IO162NB5F15/CLKHN
AE11
IO187NB5F17
AC5
IO140NB4F13
AE21
IO162PB5F15/CLKHP
AF11
IO187PB5F17
AC6
IO140PB4F13
AE22
IO163NB5F15
AC12
IO188NB5F17
AD4
IO141NB4F13
AD20
IO163PB5F15
AB12
IO188PB5F17
AD5
IO141PB4F13
AD21
IO165NB5F15
Y12
IO189NB5F17
AB6
IO143NB4F13
AB17
IO165PB5F15
AA13
IO189PB5F17
AB7
IO143PB4F13
AB18
IO167NB5F15
Y11
IO190NB5F17
AF4
IO144NB4F13
AE19
IO167PB5F15
AA12
IO190PB5F17
AE4
IO144PB4F13
AE20
IO168NB5F15
AF9
IO191NB5F17
AE3
IO145NB4F13
AC17
IO168PB5F15
AF10
IO191PB5F17
AF3
IO145PB4F13
AC18
IO169NB5F15
AB11
IO192NB5F17
AA6
IO146NB4F13
AD18
IO169PB5F15
AA11
IO192PB5F17
AA7
IO146PB4F13
AD19
IO171NB5F16
AE9
IO147NB4F13
AA17
IO171PB5F16
AE10
IO193NB6F18
Y5
IO147PB4F13
AA18
IO173NB5F16
AC10
IO193PB6F18
AA5
IO148NB4F13
AF20
IO173PB5F16
AC11
IO194NB6F18
AB3
IO148PB4F13
AF21
IO174NB5F16
AE7
IO194PB6F18
AC3
IO149NB4F13
AA16
IO174PB5F16
AE8
IO195NB6F18
Y4
IO149PB4F13
Y16
IO175NB5F16
AC9
IO195PB6F18
AA4
IO151NB4F13
AC16
IO175PB5F16
AD9
IO196NB6F18
AC2
IO151PB4F13
AB16
IO176NB5F16
AF6
IO196PB6F18
AD2
IO153NB4F14
AE17
IO176PB5F16
AF7
IO197NB6F18
W6
R ev i si o n 1 8
Bank 6
3- 47
Package Pin Assignments
FG676
FG676
FG676
AX1000 Function
Pin Number
AX1000 Function
Pin Number
AX1000 Function
Pin Number
IO197PB6F18
Y6
IO217PB6F20
R4
IO241NB7F22
K6
IO198NB6F18
AD1
IO218NB6F20
R2
IO241PB7F22
K5
IO198PB6F18
AE1
IO218PB6F20
T2
IO242NB7F22
H2
IO199NB6F18
AA2
IO219NB6F20
P3
IO242PB7F22
J2
IO199PB6F18
AB2
IO219PB6F20
R3
IO243NB7F22
J4
IO200NB6F18
Y3
IO220NB6F20
R1
IO243PB7F22
K4
IO200PB6F18
AA3
IO220PB6F20
T1
IO244NB7F22
H3
IO201NB6F18
V5
IO221NB6F20
P6
IO244PB7F22
J3
IO201PB6F18
W5
IO221PB6F20
P7
IO245NB7F22
G2
IO202NB6F18
AB1
IO223NB6F20
P5
IO245PB7F22
G1
IO202PB6F18
AC1
IO223PB6F20
P4
IO247NB7F23
J6
IO203NB6F19
V4
IO247PB7F23
J5
IO203PB6F19
W4
IO225NB7F21
N5
IO248NB7F23
E1
IO204NB6F19
V3
IO225PB7F21
N4
IO248PB7F23
F1
IO204PB6F19
W3
IO226NB7F21
N2
IO249NB7F23
E2
IO205NB6F19
U6
IO226PB7F21
N3
IO249PB7F23
F2
IO205PB6F19
V6
IO227NB7F21
N6
IO250NB7F23
G4
IO206NB6F19
W2
IO227PB7F21
N7
IO250PB7F23
H4
IO206PB6F19
Y2
IO229NB7F21
M7
IO251NB7F23
F3
IO207NB6F19
U4
IO229PB7F21
M6
IO251PB7F23
G3
IO207PB6F19
U5
IO231NB7F21
M5
IO253NB7F23
H6
IO208NB6F19
Y1
IO231PB7F21
M4
IO253PB7F23
H5
IO208PB6F19
AA1
IO232NB7F21
L1
IO254NB7F23
D2
IO209NB6F19
T6
IO232PB7F21
M1
IO254PB7F23
D1
IO209PB6F19
T7
IO233NB7F21
M2
IO255NB7F23
E4
IO211NB6F19
T3
IO233PB7F21
M3
IO255PB7F23
F4
IO211PB6F19
U3
IO235NB7F21
K2
IO256NB7F23
D3
IO212NB6F19
V1
IO235PB7F21
L2
IO256PB7F23
E3
IO212PB6F19
V2
IO236NB7F22
L5
IO257NB7F23
F5
IO213NB6F19
T5
IO236PB7F22
L4
IO257PB7F23
G5
IO213PB6F19
T4
IO237NB7F22
L6
IO214NB6F20
U1
IO237PB7F22
L7
GND
A1
IO214PB6F20
U2
IO238NB7F22
K3
GND
A13
IO215NB6F20
R6
IO238PB7F22
L3
GND
A14
IO215PB6F20
R7
IO240NB7F22
J1
GND
A19
IO217NB6F20
R5
IO240PB7F22
K1
GND
A26
3- 48
Bank 7
R ev i sio n 1 8
Dedicated I/O
Axcelerator Family FPGAs
FG676
FG676
FG676
AX1000 Function
Pin Number
AX1000 Function
Pin Number
AX1000 Function
Pin Number
GND
A8
GND
L12
GND
R12
GND
AC23
GND
L13
GND
R13
GND
AC4
GND
L14
GND
R14
GND
AD24
GND
L15
GND
R15
GND
AD3
GND
L16
GND
R16
GND
AE2
GND
L17
GND
R17
GND
AE25
GND
M10
GND
T10
GND
AF1
GND
M11
GND
T11
GND
AF13
GND
M12
GND
T12
GND
AF14
GND
M13
GND
T13
GND
AF19
GND
M14
GND
T14
GND
AF26
GND
M15
GND
T15
GND
AF8
GND
M16
GND
T16
GND
B2
GND
M17
GND
T17
GND
B25
GND
N1
GND
U10
GND
B26
GND
N10
GND
U11
GND
C24
GND
N11
GND
U12
GND
C3
GND
N12
GND
U13
GND
G20
GND
N13
GND
U14
GND
G7
GND
N14
GND
U15
GND
H1
GND
N15
GND
U16
GND
H19
GND
N16
GND
U17
GND
H26
GND
N17
GND
V18
GND
H8
GND
N26
GND
V9
GND
J18
GND
P1
GND
W1
GND
J9
GND
P10
GND
W19
GND
K10
GND
P11
GND
W26
GND
K11
GND
P12
GND
W8
GND
K12
GND
P13
GND
Y20
GND
K13
GND
P14
GND
Y7
GND
K14
GND
P15
GND/LP
C2
GND
K15
GND
P16
NC
A25
GND
K16
GND
P17
NC
AC13
GND
K17
GND
P26
NC
AC14
GND
L10
GND
R10
NC
AF2
GND
L11
GND
R11
NC
AF25
R ev i si o n 1 8
3- 49
Package Pin Assignments
FG676
FG676
FG676
AX1000 Function
Pin Number
AX1000 Function
Pin Number
AX1000 Function
Pin Number
NC
D13
VCCA
T9
VCCIB0
G10
NC
D14
VCCA
U18
VCCIB0
G8
PRA
E13
VCCA
U9
VCCIB0
G9
PRB
B14
VCCA
V10
VCCIB0
H10
PRC
Y14
VCCA
V11
VCCIB0
H11
PRD
AD14
VCCA
V12
VCCIB0
H12
TCK
E5
VCCA
V13
VCCIB0
H13
TDI
B3
VCCA
V14
VCCIB0
H9
TDO
G6
VCCA
V15
VCCIB1
G17
TMS
D4
VCCA
V16
VCCIB1
G18
TRST
A2
VCCA
V17
VCCIB1
G19
VCCA
AB4
VCCPLA
E12
VCCIB1
H14
VCCA
AF24
VCCPLB
F13
VCCIB1
H15
VCCA
C1
VCCPLC
E15
VCCIB1
H16
VCCA
C26
VCCPLD
G14
VCCIB1
H17
VCCA
J10
VCCPLE
AF15
VCCIB1
H18
VCCA
J11
VCCPLF
AA14
VCCIB2
H20
VCCA
J12
VCCPLG
AF12
VCCIB2
J19
VCCA
J13
VCCPLH
AB13
VCCIB2
J20
VCCA
J14
VCCDA
A11
VCCIB2
K19
VCCA
J15
VCCDA
A3
VCCIB2
K20
VCCA
J16
VCCDA
AB22
VCCIB2
L19
VCCA
J17
VCCDA
AB5
VCCIB2
M19
VCCA
K18
VCCDA
AD10
VCCIB2
N19
VCCA
K9
VCCDA
AD11
VCCIB3
P19
VCCA
L18
VCCDA
AD13
VCCIB3
R19
VCCA
L9
VCCDA
AD16
VCCIB3
T19
VCCA
M18
VCCDA
AD17
VCCIB3
U19
VCCA
M9
VCCDA
B1
VCCIB3
U20
VCCA
N18
VCCDA
B11
VCCIB3
V19
VCCA
N9
VCCDA
B17
VCCIB3
V20
VCCA
P18
VCCDA
C16
VCCIB3
W20
VCCA
P9
VCCDA
D24
VCCIB4
W14
VCCA
R18
VCCDA
E14
VCCIB4
W15
VCCA
R9
VCCDA
P2
VCCIB4
W16
VCCA
T18
VCCDA
P23
VCCIB4
W17
3- 50
R ev i sio n 1 8
Axcelerator Family FPGAs
FG676
FG676
AX1000 Function
Pin Number
AX1000 Function
Pin Number
VCCIB4
W18
VCOMPLH
Y13
VCCIB4
Y17
VPUMP
E22
VCCIB4
Y18
VCCIB4
Y19
VCCIB5
W10
VCCIB5
W11
VCCIB5
W12
VCCIB5
W13
VCCIB5
W9
VCCIB5
Y10
VCCIB5
Y8
VCCIB5
Y9
VCCIB6
P8
VCCIB6
R8
VCCIB6
T8
VCCIB6
U7
VCCIB6
U8
VCCIB6
V7
VCCIB6
V8
VCCIB6
W7
VCCIB7
H7
VCCIB7
J7
VCCIB7
J8
VCCIB7
K7
VCCIB7
K8
VCCIB7
L8
VCCIB7
M8
VCCIB7
N8
VCOMPLA
D12
VCOMPLB
G13
VCOMPLC
D15
VCOMPLD
F14
VCOMPLE
AD15
VCOMPLF
AB14
VCOMPLG
AD12
R ev i si o n 1 8
3- 51
Package Pin Assignments
FG896
A1 Ball Pad Corner
30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
AD
AE
AF
AG
AH
AJ
AK
Note
For Package Manufacturing and Environmental information, visit Resource center at
http://www.microsemi.com/soc/products/rescenter/package/index.html.
3- 52
R ev i sio n 1 8
Axcelerator Family FPGAs
FG896
AX1000 Function
FG896
Pin
Number
Bank 0
FG896
AX1000 Function
Pin
Number
AX1000 Function
Pin
Number
IO17NB0F1
B11
IO34NB1F3
A17
IO00NB0F0
D6
IO17PB0F1
B10
IO34PB1F3
B17
IO00PB0F0
E6
IO18NB0F1
D11
IO35NB1F3
D18
IO01NB0F0
A5
IO18PB0F1
E11
IO35PB1F3
C18
IO01PB0F0
B5
IO19NB0F1
C12
IO36NB1F3
H17
IO02NB0F0
G9
IO19PB0F1
C11
IO36PB1F3
J17
IO02PB0F0
G8
IO20NB0F1
F12
IO37NB1F3
B19
IO03NB0F0
F8
IO20PB0F1
G12
IO37PB1F3
A19
IO03PB0F0
F7
IO21NB0F1
D12
IO38NB1F3
H18
IO04NB0F0
D7
IO21PB0F1
E12
IO38PB1F3
J18
IO04PB0F0
E7
IO22NB0F2
H13
IO39NB1F3
B20
IO05NB0F0
C7
IO22PB0F2
J13
IO39PB1F3
A20
IO05PB0F0
C6
IO23NB0F2
A12
IO40NB1F3
C20
IO06NB0F0
H9
IO23PB0F2
A11
IO40PB1F3
C19
IO06PB0F0
H8
IO24NB0F2
F13
IO41NB1F4
E20
IO07NB0F0
D8
IO24PB0F2
G13
IO41PB1F4
E19
IO07PB0F0
E8
IO25NB0F2
B13
IO42NB1F4
F18
IO08NB0F0
E9
IO25PB0F2
B12
IO42PB1F4
G18
IO08PB0F0
F9
IO26NB0F2
E14
IO43NB1F4
A22
IO09NB0F0
A7
IO26PB0F2
E13
IO43PB1F4
A21
IO09PB0F0
B7
IO27NB0F2
B14
IO44NB1F4
F20
IO10NB0F0
H10
IO27PB0F2
A14
IO44PB1F4
F19
IO10PB0F0
G10
IO28NB0F2
H14
IO45NB1F4
D21
IO11NB0F0
C9
IO28PB0F2
J14
IO45PB1F4
D20
IO11PB0F0
C8
IO29NB0F2
B15
IO46NB1F4
D22
IO12NB0F1
E10
IO29PB0F2
A15
IO46PB1F4
C22
IO12PB0F1
F10
IO30NB0F2/HCLKAN
C14
IO47NB1F4
A25
IO13NB0F1
D10
IO30PB0F2/HCLKAP
D14
IO47PB1F4
A24
IO13PB0F1
D9
IO31NB0F2/HCLKBN
E15
IO48NB1F4
H19
IO14NB0F1
F11
IO31PB0F2/HCLKBP
D15
IO48PB1F4
G19
IO14PB0F1
G11
Bank 1
IO49NB1F4
C24
IO15NB0F1
A10
IO32NB1F3/HCLKCN
E17
IO49PB1F4
C23
IO15PB0F1
A9
IO32PB1F3/HCLKCP
E16
IO50NB1F4
G20
IO16NB0F1
H12
IO33NB1F3/HCLKDN
C17
IO50PB1F4
H20
IO16PB0F1
H11
IO33PB1F3/HCLKDP
D17
IO51NB1F4
F21
R ev i si o n 1 8
3- 53
Package Pin Assignments
FG896
FG896
FG896
AX1000 Function
Pin
Number
AX1000 Function
Pin
Number
AX1000 Function
Pin
Number
IO51PB1F4
E21
IO68PB2F6
K24
IO86NB2F8
N28
IO52NB1F4
F22
IO69NB2F6
F27
IO86PB2F8
N27
IO52PB1F4
E22
IO69PB2F6
E27
IO87NB2F8
P29
IO53NB1F4
B25
IO70NB2F6
J26
IO87PB2F8
P30
IO53PB1F4
B24
IO70PB2F6
J25
IO88NB2F8
P25
IO54NB1F5
D24
IO71NB2F6
H27
IO88PB2F8
P24
IO54PB1F5
D23
IO71PB2F6
G27
IO89NB2F8
P28
IO55NB1F5
F23
IO72NB2F6
J28
IO89PB2F8
P27
IO55PB1F5
E23
IO72PB2F6
H28
IO90NB2F8
P22
IO56NB1F5
H21
IO73NB2F6
G28
IO90PB2F8
P23
IO56PB1F5
G21
IO73PB2F6
F28
IO91NB2F8
R26
IO57NB1F5
D25
IO74NB2F7
L23
IO91PB2F8
P26
IO57PB1F5
C25
IO74PB2F7
L24
IO92NB2F8
R24
IO58NB1F5
F24
IO75NB2F7
L26
IO92PB2F8
R25
IO58PB1F5
E24
IO75PB2F7
K26
IO93NB2F8
R29
IO59NB1F5
D26
IO76NB2F7
M25
IO93PB2F8
R30
IO59PB1F5
C26
IO76PB2F7
L25
IO94NB2F8
R22
IO60NB1F5
G23
IO77NB2F7
K27
IO94PB2F8
R23
IO60PB1F5
G22
IO77PB2F7
J27
IO95NB2F8
T27
IO61NB1F5
B27
IO78NB2F7
M27
IO95PB2F8
R27
IO61PB1F5
A27
IO78PB2F7
L27
IO62NB1F5
F25
IO79NB2F7
K30
IO96NB3F9
T29
IO62PB1F5
E25
IO79PB2F7
K29
IO96PB3F9
T30
IO63NB1F5
H23
IO80NB2F7
M23
IO97NB3F9
U29
IO63PB1F5
H22
IO80PB2F7
M24
IO97PB3F9
U30
IO81NB2F7
M28
IO98NB3F9
T22
Bank 2
3- 54
Bank 3
IO64NB2F6
K23
IO81PB2F7
L28
IO98PB3F9
T23
IO64PB2F6
J23
IO82NB2F7
N26
IO99NB3F9
U26
IO65NB2F6
J24
IO82PB2F7
M26
IO99PB3F9
T26
IO65PB2F6
H24
IO83NB2F7
N25
IO100NB3F9
U24
IO66NB2F6
H26
IO83PB2F7
N24
IO100PB3F9
T24
IO66PB2F6
H25
IO84NB2F7
N22
IO101NB3F9
V28
IO67NB2F6
G26
IO84PB2F7
N23
IO101PB3F9
U28
IO67PB2F6
G25
IO85NB2F8
M29
IO102NB3F9
U23
IO68NB2F6
K25
IO85PB2F8
L29
IO102PB3F9
U22
R ev i sio n 1 8
Axcelerator Family FPGAs
FG896
FG896
FG896
AX1000 Function
Pin
Number
AX1000 Function
Pin
Number
AX1000 Function
Pin
Number
IO103NB3F9
V27
IO120PB3F11
Y24
IO137PB4F12
AC21
IO103PB3F9
U27
IO121NB3F11
AB25
IO138NB4F12
AK24
IO104NB3F9
W29
IO121PB3F11
AA25
IO138PB4F12
AK25
IO104PB3F9
V29
IO122NB3F11
AC26
IO139NB4F13
AE21
IO105NB3F9
Y28
IO122PB3F11
AB26
IO139PB4F13
AE22
IO105PB3F9
W28
IO123NB3F11
AG28
IO140NB4F13
AG23
IO106NB3F9
V25
IO123PB3F11
AF28
IO140PB4F13
AG24
IO106PB3F9
U25
IO124NB3F11
AB23
IO141NB4F13
AF22
IO107NB3F10
W26
IO124PB3F11
AA23
IO141PB4F13
AF23
IO107PB3F10
V26
IO125NB3F11
AF27
IO142NB4F13
AJ23
IO108NB3F10
W24
IO125PB3F11
AE27
IO142PB4F13
AJ24
IO108PB3F10
V24
IO126NB3F11
AD25
IO143NB4F13
AD19
IO109NB3F10
Y27
IO126PB3F11
AC25
IO143PB4F13
AD20
IO109PB3F10
W27
IO127NB3F11
AE26
IO144NB4F13
AG21
IO110NB3F10
V23
IO127PB3F11
AD26
IO144PB4F13
AG22
IO110PB3F10
V22
IO128NB3F11
AC24
IO145NB4F13
AE19
IO111NB3F10
AA29
IO128PB3F11
AB24
IO145PB4F13
AE20
IO111PB3F10
Y29
IO146NB4F13
AF20
IO112NB3F10
Y25
IO129NB4F12
AD23
IO146PB4F13
AF21
IO112PB3F10
W25
IO129PB4F12
AC23
IO147NB4F13
AC19
IO113NB3F10
AB27
IO130NB4F12
AK26
IO147PB4F13
AC20
IO113PB3F10
AA27
IO130PB4F12
AK27
IO148NB4F13
AH22
IO114NB3F10
Y23
IO131NB4F12
AF24
IO148PB4F13
AH23
IO114PB3F10
W23
IO131PB4F12
AF25
IO149NB4F13
AC18
IO115NB3F10
AA26
IO132NB4F12
AG25
IO149PB4F13
AB18
IO115PB3F10
Y26
IO132PB4F12
AG26
IO150NB4F13
AK21
IO116NB3F10
AC28
IO133NB4F12
AD22
IO150PB4F13
AJ21
IO116PB3F10
AB28
IO133PB4F12
AC22
IO151NB4F13
AE18
IO117NB3F10
AE29
IO134NB4F12
AE23
IO151PB4F13
AD18
IO117PB3F10
AD29
IO134PB4F12
AE24
IO152NB4F14
AJ20
IO118NB3F11
AE28
IO135NB4F12
AH24
IO152PB4F14
AK20
IO118PB3F11
AD28
IO135PB4F12
AH25
IO153NB4F14
AG19
IO119NB3F11
AD27
IO136NB4F12
AJ25
IO153PB4F14
AG20
IO119PB3F11
AC27
IO136PB4F12
AJ26
IO154NB4F14
AH19
IO120NB3F11
AA24
IO137NB4F12
AD21
IO154PB4F14
AH20
Bank 4
R ev i si o n 1 8
3- 55
Package Pin Assignments
FG896
FG896
FG896
AX1000 Function
Pin
Number
AX1000 Function
Pin
Number
AX1000 Function
Pin
Number
IO155NB4F14
AC17
IO172NB5F16
AK9
IO189PB5F17
AD9
IO155PB4F14
AB17
IO172PB5F16
AK10
IO190NB5F17
AH6
IO156NB4F14
AK19
IO173NB5F16
AE12
IO190PB5F17
AG6
IO156PB4F14
AJ19
IO173PB5F16
AE13
IO191NB5F17
AG5
IO157NB4F14
AE17
IO174NB5F16
AG9
IO191PB5F17
AH5
IO157PB4F14
AD17
IO174PB5F16
AG10
IO192NB5F17
AC8
IO158NB4F14
AJ17
IO175NB5F16
AE11
IO192PB5F17
AC9
IO158PB4F14
AJ18
IO175PB5F16
AF11
IO159NB4F14/CLKEN
AG18
IO176NB5F16
AH8
IO193NB6F18
AB7
IO159PB4F14/CLKEP
AH18
IO176PB5F16
AH9
IO193PB6F18
AC7
IO160NB4F14/CLKFN
AG16
IO177NB5F16
AC12
IO194NB6F18
AD5
IO160PB4F14/CLKFP
AG17
IO177PB5F16
AD12
IO194PB6F18
AE5
IO178NB5F16
AJ7
IO195NB6F18
AB6
Bank 5
Bank 6
IO161NB5F15/CLKGN
AG14
IO178PB5F16
AJ8
IO195PB6F18
AC6
IO161PB5F15/CLKGP
AG15
IO179NB5F16
AF9
IO196NB6F18
AE4
IO162NB5F15/CLKHN
AG13
IO179PB5F16
AF10
IO196PB6F18
AF4
IO162PB5F15/CLKHP
AH13
IO180NB5F16
AE9
IO197NB6F18
AA8
IO163NB5F15
AE14
IO180PB5F16
AE10
IO197PB6F18
AB8
IO163PB5F15
AD14
IO181NB5F17
AC11
IO198NB6F18
AF3
IO164NB5F15
AJ12
IO181PB5F17
AD11
IO198PB6F18
AG3
IO164PB5F15
AJ13
IO182NB5F17
AK6
IO199NB6F18
AC4
IO165NB5F15
AB14
IO182PB5F17
AK7
IO199PB6F18
AD4
IO165PB5F15
AC15
IO183NB5F17
AF8
IO200NB6F18
AB5
IO166NB5F15
AK11
IO183PB5F17
AG8
IO200PB6F18
AC5
IO166PB5F15
AK12
IO184NB5F17
AG7
IO201NB6F18
Y7
IO167NB5F15
AB13
IO184PB5F17
AH7
IO201PB6F18
AA7
IO167PB5F15
AC14
IO185NB5F17
AC10
IO202NB6F18
AD3
IO168NB5F15
AH11
IO185PB5F17
AD10
IO202PB6F18
AE3
IO168PB5F15
AH12
IO186NB5F17
AJ5
IO203NB6F19
Y6
IO169NB5F15
AD13
IO186PB5F17
AJ6
IO203PB6F19
AA6
IO169PB5F15
AC13
IO187NB5F17
AE7
IO204NB6F19
Y5
IO170NB5F15
AJ10
IO187PB5F17
AE8
IO204PB6F19
AA5
IO170PB5F15
AJ11
IO188NB5F17
AF6
IO205NB6F19
W8
IO171NB5F16
AG11
IO188PB5F17
AF7
IO205PB6F19
Y8
IO171PB5F16
AG12
IO189NB5F17
AD8
IO206NB6F19
AA4
3- 56
R ev i sio n 1 8
Axcelerator Family FPGAs
FG896
FG896
FG896
AX1000 Function
Pin
Number
AX1000 Function
Pin
Number
AX1000 Function
Pin
Number
IO206PB6F19
AB4
IO224NB6F20
R2
IO241NB7F22
M8
IO207NB6F19
W6
IO224PB6F20
T2
IO241PB7F22
M7
IO207PB6F19
W7
IO242NB7F22
K4
IO208NB6F19
AB3
IO225NB7F21
R7
IO242PB7F22
L4
IO208PB6F19
AC3
IO225PB7F21
R6
IO243NB7F22
L6
IO209NB6F19
V8
IO226NB7F21
R4
IO243PB7F22
M6
IO209PB6F19
V9
IO226PB7F21
R5
IO244NB7F22
K5
IO210NB6F19
AA2
IO227NB7F21
R8
IO244PB7F22
L5
IO210PB6F19
AA1
IO227PB7F21
R9
IO245NB7F22
J4
IO211NB6F19
V5
IO228NB7F21
P1
IO245PB7F22
J3
IO211PB6F19
W5
IO228PB7F21
R1
IO246NB7F22
G2
IO212NB6F19
Y3
IO229NB7F21
P9
IO246PB7F22
H2
IO212PB6F19
Y4
IO229PB7F21
P8
IO247NB7F23
L8
IO213NB6F19
V7
IO230NB7F21
N2
IO247PB7F23
L7
IO213PB6F19
V6
IO230PB7F21
P2
IO248NB7F23
G3
IO214NB6F20
W3
IO231NB7F21
P7
IO248PB7F23
H3
IO214PB6F20
W4
IO231PB7F21
P6
IO249NB7F23
G4
IO215NB6F20
U8
IO232NB7F21
N3
IO249PB7F23
H4
IO215PB6F20
U9
IO232PB7F21
P3
IO250NB7F23
J6
IO216NB6F20
W1
IO233NB7F21
P4
IO250PB7F23
K6
IO216PB6F20
W2
IO233PB7F21
P5
IO251NB7F23
H5
IO217NB6F20
U7
IO234NB7F21
L1
IO251PB7F23
J5
IO217PB6F20
U6
IO234PB7F21
M1
IO252NB7F23
F2
IO218NB6F20
U4
IO235NB7F21
M4
IO252PB7F23
F1
IO218PB6F20
V4
IO235PB7F21
N4
IO253NB7F23
K8
IO219NB6F20
T5
IO236NB7F22
N7
IO253PB7F23
K7
IO219PB6F20
U5
IO236PB7F22
N6
IO254NB7F23
F4
IO220NB6F20
U3
IO237NB7F22
N8
IO254PB7F23
F3
IO220PB6F20
V3
IO237PB7F22
N9
IO255NB7F23
G6
IO221NB6F20
T8
IO238NB7F22
M5
IO255PB7F23
H6
IO221PB6F20
T9
IO238PB7F22
N5
IO256NB7F23
F5
IO222NB6F20
U2
IO239NB7F22
L2
IO256PB7F23
G5
IO222PB6F20
V2
IO239PB7F22
M2
IO257NB7F23
H7
IO223NB6F20
T7
IO240NB7F22
L3
IO257PB7F23
J7
IO223PB6F20
T6
IO240PB7F22
M3
Bank 7
R ev i si o n 1 8
Dedicated I/O
3- 57
Package Pin Assignments
FG896
FG896
FG896
AX1000 Function
Pin
Number
AX1000 Function
Pin
Number
AX1000 Function
Pin
Number
GND
A13
GND
AK18
GND
M13
GND
A18
GND
AK2
GND
M14
GND
A2
GND
AK23
GND
M15
GND
A23
GND
AK29
GND
M16
GND
A29
GND
AK8
GND
M17
GND
A8
GND
B1
GND
M18
GND
AA10
GND
B2
GND
M19
GND
AA21
GND
B22
GND
N1
GND
AA28
GND
B29
GND
N12
GND
AA3
GND
B30
GND
N13
GND
AB2
GND
B9
GND
N14
GND
AB22
GND
C10
GND
N15
GND
AB29
GND
C15
GND
N16
GND
AB9
GND
C16
GND
N17
GND
AC1
GND
C21
GND
N18
GND
AC30
GND
C28
GND
N19
GND
AE25
GND
C3
GND
N30
GND
AE6
GND
D27
GND
P12
GND
AF26
GND
D28
GND
P13
GND
AF5
GND
D4
GND
P14
GND
AG27
GND
E26
GND
P15
GND
AG4
GND
E5
GND
P16
GND
AH10
GND
H1
GND
P17
GND
AH15
GND
H30
GND
P18
GND
AH16
GND
J2
GND
P19
GND
AH21
GND
J22
GND
R12
GND
AH28
GND
J29
GND
R13
GND
AH3
GND
J9
GND
R14
GND
AJ1
GND
K10
GND
R15
GND
AJ2
GND
K21
GND
R16
GND
AJ22
GND
K28
GND
R17
GND
AJ29
GND
K3
GND
R18
GND
AJ30
GND
L11
GND
R19
GND
AJ9
GND
L20
GND
R28
GND
AK13
GND
M12
GND
R3
3- 58
R ev i sio n 1 8
Axcelerator Family FPGAs
FG896
FG896
FG896
AX1000 Function
Pin
Number
AX1000 Function
Pin
Number
AX1000 Function
Pin
Number
GND
T12
GND
W19
NC
AJ4
GND
T13
GND
Y11
NC
AK14
GND
T14
GND
Y20
NC
AK15
GND
T15
GND/LP
E4
NC
AK16
GND
T16
NC
A16
NC
AK17
GND
T17
NC
A26
NC
AK22
GND
T18
NC
A4
NC
AK4
GND
T19
NC
A6
NC
AK5
GND
T28
NC
AA30
NC
B16
GND
T3
NC
AB1
NC
B18
GND
U12
NC
AB30
NC
B21
GND
U13
NC
AC2
NC
B23
GND
U14
NC
AC29
NC
B26
GND
U15
NC
AD1
NC
B4
GND
U16
NC
AD2
NC
B6
GND
U17
NC
AD30
NC
B8
GND
U18
NC
AE1
NC
C27
GND
U19
NC
AE15
NC
D1
GND
V1
NC
AE16
NC
D2
GND
V12
NC
AE2
NC
D29
GND
V13
NC
AE30
NC
D30
GND
V14
NC
AF1
NC
E1
GND
V15
NC
AF2
NC
E2
GND
V16
NC
AF29
NC
E29
GND
V17
NC
AF30
NC
E30
GND
V18
NC
AG1
NC
F15
GND
V19
NC
AG2
NC
F16
GND
V30
NC
AG29
NC
F29
GND
W12
NC
AG30
NC
F30
GND
W13
NC
AH27
NC
G1
GND
W14
NC
AH4
NC
G29
GND
W15
NC
AJ14
NC
G30
GND
W16
NC
AJ15
NC
H29
GND
W17
NC
AJ16
NC
J1
GND
W18
NC
AJ27
NC
J30
R ev i si o n 1 8
3- 59
Package Pin Assignments
FG896
FG896
FG896
AX1000 Function
Pin
Number
AX1000 Function
Pin
Number
AX1000 Function
Pin
Number
NC
K1
VCCA
N20
VCCDA
AF19
NC
K2
VCCA
P11
VCCDA
C13
NC
L30
VCCA
P20
VCCDA
C5
NC
M30
VCCA
R11
VCCDA
D13
NC
N29
VCCA
R20
VCCDA
D19
NC
T1
VCCA
T11
VCCDA
D3
NC
U1
VCCA
T20
VCCDA
E18
NC
W30
VCCA
U11
VCCDA
F26
NC
Y1
VCCA
U20
VCCDA
G16
NC
Y2
VCCA
V11
VCCDA
T25
NC
Y30
VCCA
V20
VCCDA
T4
PRA
G15
VCCA
W11
VCCIB0
A3
PRB
D16
VCCA
W20
VCCIB0
B3
PRC
AB16
VCCA
Y12
VCCIB0
J10
PRD
AF16
VCCA
Y13
VCCIB0
J11
TCK
G7
VCCA
Y14
VCCIB0
J12
TDI
D5
VCCA
Y15
VCCIB0
K11
TDO
J8
VCCA
Y16
VCCIB0
K12
TMS
F6
VCCA
Y17
VCCIB0
K13
TRST
C4
VCCA
Y18
VCCIB0
K14
VCCA
AD6
VCCA
Y19
VCCIB0
K15
VCCA
AH26
VCCPLA
G14
VCCIB1
A28
VCCA
E28
VCCPLB
H15
VCCIB1
B28
VCCA
E3
VCCPLC
G17
VCCIB1
J19
VCCA
L12
VCCPLD
J16
VCCIB1
J20
VCCA
L13
VCCPLE
AH17
VCCIB1
J21
VCCA
L14
VCCPLF
AC16
VCCIB1
K16
VCCA
L15
VCCPLG
AH14
VCCIB1
K17
VCCA
L16
VCCPLH
AD15
VCCIB1
K18
VCCA
L17
VCCDA
AD24
VCCIB1
K19
VCCA
L18
VCCDA
AD7
VCCIB1
K20
VCCA
L19
VCCDA
AF12
VCCIB2
C29
VCCA
M11
VCCDA
AF13
VCCIB2
C30
VCCA
M20
VCCDA
AF15
VCCIB2
K22
VCCA
N11
VCCDA
AF18
VCCIB2
L21
3- 60
R ev i sio n 1 8
Axcelerator Family FPGAs
FG896
FG896
AX1000 Function
Pin
Number
AX1000 Function
Pin
Number
VCCIB2
L22
VCCIB5
AK3
VCCIB2
M21
VCCIB6
AA9
VCCIB2
M22
VCCIB6
AH1
VCCIB2
N21
VCCIB6
AH2
VCCIB2
P21
VCCIB6
T10
VCCIB2
R21
VCCIB6
U10
VCCIB3
AA22
VCCIB6
V10
VCCIB3
AH29
VCCIB6
W10
VCCIB3
AH30
VCCIB6
W9
VCCIB3
T21
VCCIB6
Y10
VCCIB3
U21
VCCIB6
Y9
VCCIB3
V21
VCCIB7
C1
VCCIB3
W21
VCCIB7
C2
VCCIB3
W22
VCCIB7
K9
VCCIB3
Y21
VCCIB7
L10
VCCIB3
Y22
VCCIB7
L9
VCCIB4
AA16
VCCIB7
M10
VCCIB4
AA17
VCCIB7
M9
VCCIB4
AA18
VCCIB7
N10
VCCIB4
AA19
VCCIB7
P10
VCCIB4
AA20
VCCIB7
R10
VCCIB4
AB19
VCOMPLA
F14
VCCIB4
AB20
VCOMPLB
J15
VCCIB4
AB21
VCOMPLC
F17
VCCIB4
AJ28
VCOMPLD
H16
VCCIB4
AK28
VCOMPLE
AF17
VCCIB5
AA11
VCOMPLF
AD16
VCCIB5
AA12
VCOMPLG
AF14
VCCIB5
AA13
VCOMPLH
AB15
VCCIB5
AA14
VPUMP
G24
VCCIB5
AA15
VCCIB5
AB10
VCCIB5
AB11
VCCIB5
AB12
VCCIB5
AJ3
R ev i si o n 1 8
3- 61
Package Pin Assignments
FG896
AX2000 Function
FG896
Pin
Number
Bank 0
3- 62
FG896
AX2000 Function
Pin
Number
IO19NB0F1
D11
Bank 1
AX2000 Function
Pin
Number
IO00NB0F0
B4
IO19PB0F1
E11
IO43NB1F4/HCLKCN
E17
IO00PB0F0
A4
IO20PB0F1
B8
IO43PB1F4/HCLKCP
E16
IO01NB0F0
F8
IO21NB0F1
H12
IO44NB1F4/HCLKDN
C17
IO01PB0F0
F7
IO21PB0F1
H11
IO44PB1F4/HCLKDP
D17
IO02NB0F0
D6
IO23NB0F2
A10
IO45NB1F4
A16
IO02PB0F0
E6
IO23PB0F2
A9
IO45PB1F4
B16
IO04NB0F0
A5
IO25NB0F2
F12
IO47NB1F4
H17
IO04PB0F0
B5
IO25PB0F2
G12
IO47PB1F4
J17
IO05NB0F0
H8
IO26NB0F2
B11
IO48NB1F4
A17
IO05PB0F0
G8
IO26PB0F2
B10
IO48PB1F4
B17
IO06NB0F0
D7
IO27NB0F2
D12
IO49NB1F4
H18
IO06PB0F0
E7
IO27PB0F2
E12
IO49PB1F4
J18
IO07NB0F0
D8
IO28NB0F2
C12
IO51NB1F4
F18
IO07PB0F0
E8
IO28PB0F2
C11
IO51PB1F4
G18
IO08NB0F0
C7
IO30NB0F2
A12
IO52NB1F4
B18
IO08PB0F0
C6
IO30PB0F2
A11
IO53NB1F4
D18
IO09NB0F0
G9
IO31NB0F2
F13
IO53PB1F4
C18
IO09PB0F0
H9
IO31PB0F2
G13
IO55NB1F5
H19
IO10NB0F0
A6
IO33NB0F2
H13
IO55PB1F5
G19
IO10PB0F0
B6
IO33PB0F2
J13
IO56NB1F5
B19
IO11NB0F0
H10
IO34NB0F3
B13
IO56PB1F5
A19
IO11PB0F0
G10
IO34PB0F3
B12
IO57NB1F5
E20
IO12NB0F1
E9
IO37NB0F3
E14
IO57PB1F5
E19
IO12PB0F1
F9
IO37PB0F3
E13
IO58NB1F5
C20
IO13NB0F1
E10
IO38NB0F3
B14
IO58PB1F5
C19
IO13PB0F1
F10
IO38PB0F3
A14
IO59NB1F5
B20
IO15NB0F1
F11
IO39NB0F3
H14
IO59PB1F5
A20
IO15PB0F1
G11
IO39PB0F3
J14
IO61NB1F5
F20
IO16NB0F1
A7
IO40NB0F3
B15
IO61PB1F5
F19
IO16PB0F1
B7
IO40PB0F3
A15
IO62NB1F5
A22
IO17NB0F1
D10
IO41NB0F3/HCLKAN
C14
IO62PB1F5
A21
IO17PB0F1
D9
IO41PB0F3/HCLKAP
D14
IO63NB1F5
D21
IO18NB0F1
C9
IO42NB0F3/HCLKBN
E15
IO63PB1F5
D20
IO18PB0F1
C8
IO42PB0F3/HCLKBP
D15
IO65NB1F6
G20
R ev i sio n 1 8
Axcelerator Family FPGAs
FG896
FG896
FG896
AX2000 Function
Pin
Number
AX2000 Function
Pin
Number
AX2000 Function
Pin
Number
IO65PB1F6
H20
IO85NB1F7
F25
IO102PB2F9
D30
IO66NB1F6
B23
IO85PB1F7
E25
IO103NB2F9
L26
IO66PB1F6
B21
IO103PB2F9
K26
IO67NB1F6
H21
IO86NB2F8
G26
IO104NB2F9
F29
IO67PB1F6
G21
IO86PB2F8
G25
IO105NB2F9
M25
IO68NB1F6
D22
IO87NB2F8
K23
IO105PB2F9
L25
IO68PB1F6
C22
IO87PB2F8
J23
IO106NB2F9
K30
IO69NB1F6
A25
IO88NB2F8
J24
IO106PB2F9
K29
IO69PB1F6
A24
IO88PB2F8
H24
IO107NB2F10
M23
IO70NB1F6
F22
IO89NB2F8
E29
IO107PB2F10
M24
IO70PB1F6
E22
IO89PB2F8
D29
IO109NB2F10
M27
IO71NB1F6
F21
IO90NB2F8
F27
IO109PB2F10
L27
IO71PB1F6
E21
IO90PB2F8
E27
IO110NB2F10
M28
IO73NB1F6
C24
IO91NB2F8
H26
IO110PB2F10
L28
IO73PB1F6
C23
IO91PB2F8
H25
IO111NB2F10
N22
IO74NB1F6
D24
IO92NB2F8
G28
IO111PB2F10
N23
IO74PB1F6
D23
IO92PB2F8
F28
IO112NB2F10
M29
IO75NB1F6
H23
IO93NB2F8
J26
IO112PB2F10
L29
IO75PB1F6
H22
IO93PB2F8
J25
IO113NB2F10
N26
IO76NB1F7
B25
IO94NB2F8
H27
IO113PB2F10
M26
IO76PB1F7
B24
IO94PB2F8
G27
IO114NB2F10
M30
IO78NB1F7
B26
IO95NB2F8
H29
IO114PB2F10
L30
IO78PB1F7
A26
IO95PB2F8
G29
IO115NB2F10
N28
IO79NB1F7
F23
IO96NB2F9
G30
IO115PB2F10
N27
IO79PB1F7
E23
IO96PB2F9
F30
IO117NB2F10
N25
IO80NB1F7
D25
IO97NB2F9
K25
IO117PB2F10
N24
IO80PB1F7
C25
IO97PB2F9
K24
IO118NB2F11
N29
IO81NB1F7
G23
IO98NB2F9
J28
IO119NB2F11
P22
IO81PB1F7
G22
IO98PB2F9
H28
IO119PB2F11
P23
IO82NB1F7
B27
IO99NB2F9
L23
IO121NB2F11
P25
IO82PB1F7
A27
IO99PB2F9
L24
IO121PB2F11
P24
IO83NB1F7
F24
IO100NB2F9
K27
IO122NB2F11
P28
IO83PB1F7
E24
IO100PB2F9
J27
IO122PB2F11
P27
IO84NB1F7
D26
IO101PB2F9
J30
IO123NB2F11
R26
IO84PB1F7
C26
IO102NB2F9
E30
IO123PB2F11
P26
Bank 2
R ev i si o n 1 8
3- 63
Package Pin Assignments
FG896
FG896
FG896
AX2000 Function
Pin
Number
AX2000 Function
Pin
Number
AX2000 Function
Pin
Number
IO124NB2F11
P29
IO145NB3F13
W24
IO163NB3F15
AC26
IO124PB2F11
P30
IO145PB3F13
V24
IO163PB3F15
AB26
IO125NB2F11
R22
IO146NB3F13
W27
IO164NB3F15
AE28
IO125PB2F11
R23
IO146PB3F13
W28
IO164PB3F15
AD28
IO127NB2F11
R24
IO147NB3F13
Y28
IO165NB3F15
AC24
IO127PB2F11
R25
IO147PB3F13
Y27
IO165PB3F15
AB24
IO128NB2F11
R29
IO148NB3F13
Y30
IO166NB3F15
AG28
IO128PB2F11
R30
IO148PB3F13
W30
IO166PB3F15
AF28
IO149NB3F13
Y25
IO167NB3F15
AE26
Bank 3
3- 64
IO129NB3F12
T27
IO149PB3F13
W25
IO167PB3F15
AD26
IO129PB3F12
R27
IO150NB3F14
AA29
IO168NB3F15
AD25
IO130NB3F12
T29
IO150PB3F14
Y29
IO168PB3F15
AC25
IO130PB3F12
T30
IO151NB3F14
AC29
IO169NB3F15
AF27
IO131NB3F12
T22
IO152NB3F14
AA26
IO169PB3F15
AE27
IO131PB3F12
T23
IO152PB3F14
Y26
IO170NB3F15
AB23
IO132NB3F12
U26
IO153NB3F14
Y23
IO170PB3F15
AA23
IO132PB3F12
T26
IO153PB3F14
W23
IO133NB3F12
U24
IO154NB3F14
AB30
IO171NB4F16
AG29
IO133PB3F12
T24
IO154PB3F14
AA30
IO171PB4F16
AG30
IO135NB3F12
U23
IO155NB3F14
AB27
IO172NB4F16
AF24
IO135PB3F12
U22
IO155PB3F14
AA27
IO172PB4F16
AF25
IO136NB3F12
U29
IO156NB3F14
AC28
IO173NB4F16
AG25
IO136PB3F12
U30
IO156PB3F14
AB28
IO173PB4F16
AG26
IO137NB3F12
V28
IO157NB3F14
AA24
IO174NB4F16
AJ25
IO137PB3F12
U28
IO157PB3F14
Y24
IO174PB4F16
AJ26
IO138NB3F12
V27
IO158NB3F14
AF29
IO175NB4F16
AK26
IO138PB3F12
U27
IO158PB3F14
AF30
IO175PB4F16
AK27
IO139NB3F13
V25
IO159NB3F14
AB25
IO176NB4F16
AE23
IO139PB3F13
U25
IO159PB3F14
AA25
IO176PB4F16
AE24
IO141NB3F13
V23
IO160NB3F14
AE30
IO177NB4F16
AH24
IO141PB3F13
V22
IO160PB3F14
AD30
IO177PB4F16
AH25
IO142NB3F13
W29
IO161NB3F15
AE29
IO178NB4F16
AD23
IO142PB3F13
V29
IO161PB3F15
AD29
IO178PB4F16
AC23
IO143NB3F13
W26
IO162NB3F15
AD27
IO179PB4F16
AJ27
IO143PB3F13
V26
IO162PB3F15
AC27
IO180NB4F16
AG23
R ev i sio n 1 8
Bank 4
Axcelerator Family FPGAs
FG896
FG896
FG896
AX2000 Function
Pin
Number
AX2000 Function
Pin
Number
AX2000 Function
Pin
Number
IO180PB4F16
AG24
IO201PB4F18
AJ19
IO225NB5F21
AH11
IO181NB4F17
AK24
IO202NB4F18
AC18
IO225PB5F21
AH12
IO181PB4F17
AK25
IO202PB4F18
AB18
IO226NB5F21
AC13
IO182NB4F17
AD22
IO206NB4F19
AE18
IO226PB5F21
AD13
IO182PB4F17
AC22
IO206PB4F19
AD18
IO227NB5F21
AE12
IO183NB4F17
AF22
IO207NB4F19
AJ17
IO227PB5F21
AE13
IO183PB4F17
AF23
IO207PB4F19
AJ18
IO228NB5F21
AG11
IO184NB4F17
AE21
IO208NB4F19
AE17
IO228PB5F21
AG12
IO184PB4F17
AE22
IO208PB4F19
AD17
IO229NB5F21
AK11
IO185NB4F17
AJ23
IO209NB4F19
AK17
IO229PB5F21
AK12
IO185PB4F17
AJ24
IO210NB4F19
AC17
IO230NB5F21
AC12
IO187NB4F17
AH22
IO210PB4F19
AB17
IO230PB5F21
AD12
IO187PB4F17
AH23
IO211NB4F19
AJ16
IO232NB5F21
AE11
IO188NB4F17
AD21
IO211PB4F19
AK16
IO232PB5F21
AF11
IO188PB4F17
AC21
IO212NB4F19/CLKEN
AG18
IO233NB5F21
AJ10
IO189PB4F17
AK22
IO212PB4F19/CLKEP
AH18
IO233PB5F21
AJ11
IO190NB4F17
AF20
IO213NB4F19/CLKFN
AG16
IO234NB5F21
AC11
IO190PB4F17
AF21
IO213PB4F19/CLKFP
AG17
IO234PB5F21
AD11
IO191NB4F17
AG21
Bank 5
IO236NB5F22
AK9
IO191PB4F17
AG22
IO214NB5F20/CLKGN
AG14
IO236PB5F22
AK10
IO192NB4F17
AE19
IO214PB5F20/CLKGP
AG15
IO237NB5F22
AG9
IO192PB4F17
AE20
IO215NB5F20/CLKHN
AG13
IO237PB5F22
AG10
IO195NB4F18
AK21
IO215PB5F20/CLKHP
AH13
IO238NB5F22
AF9
IO195PB4F18
AJ21
IO216NB5F20
AB14
IO238PB5F22
AF10
IO196NB4F18
AD19
IO216PB5F20
AC15
IO239NB5F22
AH8
IO196PB4F18
AD20
IO217NB5F20
AK15
IO239PB5F22
AH9
IO197NB4F18
AJ20
IO217PB5F20
AJ15
IO240NB5F22
AC10
IO197PB4F18
AK20
IO218NB5F20
AE14
IO240PB5F22
AD10
IO198NB4F18
AC19
IO218PB5F20
AD14
IO242NB5F22
AE9
IO198PB4F18
AC20
IO219NB5F20
AK14
IO242PB5F22
AE10
IO199NB4F18
AG19
IO219PB5F20
AJ14
IO243NB5F22
AJ7
IO199PB4F18
AG20
IO222NB5F20
AB13
IO243PB5F22
AJ8
IO200NB4F18
AH19
IO222PB5F20
AC14
IO244NB5F22
AK6
IO200PB4F18
AH20
IO223NB5F21
AJ12
IO244PB5F22
AK7
IO201NB4F18
AK19
IO223PB5F21
AJ13
IO245NB5F23
AF8
R ev i si o n 1 8
3- 65
Package Pin Assignments
FG896
FG896
FG896
AX2000 Function
Pin
Number
AX2000 Function
Pin
Number
AX2000 Function
Pin
Number
IO245PB5F23
AG8
IO263NB6F24
AD3
IO281PB6F26
Y2
IO246NB5F23
AD8
IO263PB6F24
AE3
IO282NB6F26
V5
IO246PB5F23
AD9
IO264NB6F24
AB6
IO282PB6F26
W5
IO247NB5F23
AG7
IO264PB6F24
AC6
IO284NB6F26
V7
IO247PB5F23
AH7
IO265NB6F24
AD1
IO284PB6F26
V6
IO248NB5F23
AK5
IO265PB6F24
AE1
IO285NB6F26
W3
IO249NB5F23
AJ5
IO266NB6F24
AA8
IO285PB6F26
W4
IO249PB5F23
AJ6
IO266PB6F24
AB8
IO286NB6F26
U8
IO250NB5F23
AC8
IO267NB6F25
AB5
IO286PB6F26
U9
IO250PB5F23
AC9
IO267PB6F25
AC5
IO287NB6F26
W1
IO251NB5F23
AH6
IO268NB6F25
AB3
IO287PB6F26
W2
IO251PB5F23
AG6
IO268PB6F25
AC3
IO288NB6F26
U7
IO252NB5F23
AF6
IO269NB6F25
AC2
IO288PB6F26
U6
IO252PB5F23
AF7
IO269PB6F25
AD2
IO290NB6F27
U4
IO253NB5F23
AG2
IO270NB6F25
Y7
IO290PB6F27
V4
IO253PB5F23
AG1
IO270PB6F25
AA7
IO291NB6F27
U3
IO254NB5F23
AE7
IO271NB6F25
AA4
IO291PB6F27
V3
IO254PB5F23
AE8
IO271PB6F25
AB4
IO292NB6F27
T5
IO255NB5F23
AG5
IO272NB6F25
Y6
IO292PB6F27
U5
IO255PB5F23
AH5
IO272PB6F25
AA6
IO293NB6F27
U2
IO256NB5F23
AJ4
IO273NB6F25
AB1*
IO293PB6F27
V2
IO256PB5F23
AK4
IO273PB6F25
AE2*
IO294NB6F27
T8
IO274NB6F25
W8
IO294PB6F27
T9
Bank 6
3- 66
IO257NB6F24
AE4
IO274PB6F25
Y8
IO296NB6F27
T1
IO257PB6F24
AF4
IO275NB6F25
Y5
IO296PB6F27
U1
IO258NB6F24
AB7
IO275PB6F25
AA5
IO298NB6F27
T7
IO258PB6F24
AC7
IO277NB6F25
AA2
IO298PB6F27
T6
IO259NB6F24
AD5
IO277PB6F25
AA1
IO299NB6F27
R2
IO259PB6F24
AE5
IO278NB6F26
W6
IO299PB6F27
T2
IO260NB6F24
AF1
IO278PB6F26
W7
IO260PB6F24
AF2
IO279NB6F26
Y3
IO300NB7F28
R8
IO261NB6F24
AF3
IO279PB6F26
Y4
IO300PB7F28
R9
IO261PB6F24
AG3
IO280NB6F26
V8
IO302NB7F28
R4
IO262NB6F24
AC4
IO280PB6F26
V9
IO302PB7F28
R5
IO262PB6F24
AD4
IO281NB6F26
Y1
IO303NB7F28
P1
R ev i sio n 1 8
Bank 7
Axcelerator Family FPGAs
FG896
FG896
FG896
AX2000 Function
Pin
Number
AX2000 Function
Pin
Number
AX2000 Function
Pin
Number
IO303PB7F28
R1
IO324NB7F30
K5
GND
A13
IO304NB7F28
R7
IO324PB7F30
L5
GND
A18
IO304PB7F28
R6
IO326NB7F30
G1*
GND
A2
IO306NB7F28
N2
IO326PB7F30
K2*
GND
A23
IO306PB7F28
P2
IO327NB7F30
J4
GND
A29
IO307NB7F28
N3
IO327PB7F30
J3
GND
A8
IO307PB7F28
P3
IO328NB7F30
L8
GND
AA10
IO308NB7F28
P9
IO328PB7F30
L7
GND
AA21
IO308PB7F28
P8
IO329NB7F30
G2
GND
AA28
IO309NB7F28
P4
IO329PB7F30
H2
GND
AA3
IO309PB7F28
P5
IO330NB7F30
G3
GND
AB2
IO310NB7F29
P7
IO330PB7F30
H3
GND
AB22
IO310PB7F29
P6
IO331NB7F30
K8
GND
AB29
IO311NB7F29
L1
IO331PB7F30
K7
GND
AB9
IO311PB7F29
M1
IO332NB7F31
J6
GND
AC1
IO312NB7F29
M5
IO332PB7F31
K6
GND
AC30
IO312PB7F29
N5
IO333NB7F31
D1
GND
AE25
IO313NB7F29
M4
IO333PB7F31
D2
GND
AE6
IO313PB7F29
N4
IO334NB7F31
G4
GND
AF26
IO315NB7F29
L2
IO334PB7F31
H4
GND
AF5
IO315PB7F29
M2
IO335NB7F31
F2
GND
AG27
IO316NB7F29
N7
IO335PB7F31
F1
GND
AG4
IO316PB7F29
N6
IO336NB7F31
H5
GND
AH10
IO317NB7F29
L3
IO336PB7F31
J5
GND
AH15
IO317PB7F29
M3
IO337NB7F31
E2
GND
AH16
IO318NB7F29
N8
IO337PB7F31
E1
GND
AH21
IO318PB7F29
N9
IO338NB7F31
H7
GND
AH28
IO320NB7F29
L6
IO338PB7F31
J7
GND
AH3
IO320PB7F29
M6
IO339NB7F31
F4
GND
AJ1
IO321NB7F30
K4
IO339PB7F31
F3
GND
AJ2
IO321PB7F30
L4
IO340NB7F31
F5
GND
AJ22
IO322NB7F30
M8
IO340PB7F31
G5
GND
AJ29
IO322PB7F30
M7
IO341NB7F31
G6
GND
AJ30
IO323NB7F30
J1
IO341PB7F31
H6
GND
AJ9
IO323PB7F30
K1
GND
AK13
Dedicated I/O
R ev i si o n 1 8
3- 67
Package Pin Assignments
FG896
FG896
FG896
AX2000 Function
Pin
Number
AX2000 Function
Pin
Number
AX2000 Function
Pin
Number
GND
AK18
GND
M13
GND
T12
GND
AK2
GND
M14
GND
T13
GND
AK23
GND
M15
GND
T14
GND
AK29
GND
M16
GND
T15
GND
AK8
GND
M17
GND
T16
GND
B1
GND
M18
GND
T17
GND
B2
GND
M19
GND
T18
GND
B22
GND
N1
GND
T19
GND
B29
GND
N12
GND
T28
GND
B30
GND
N13
GND
T3
GND
B9
GND
N14
GND
U12
GND
C10
GND
N15
GND
U13
GND
C15
GND
N16
GND
U14
GND
C16
GND
N17
GND
U15
GND
C21
GND
N18
GND
U16
GND
C28
GND
N19
GND
U17
GND
C3
GND
N30
GND
U18
GND
D27
GND
P12
GND
U19
GND
D28
GND
P13
GND
V1
GND
D4
GND
P14
GND
V12
GND
E26
GND
P15
GND
V13
GND
E5
GND
P16
GND
V14
GND
H1
GND
P17
GND
V15
GND
H30
GND
P18
GND
V16
GND
J2
GND
P19
GND
V17
GND
J22
GND
R12
GND
V18
GND
J29
GND
R13
GND
V19
GND
J9
GND
R14
GND
V30
GND
K10
GND
R15
GND
W12
GND
K21
GND
R16
GND
W13
GND
K28
GND
R17
GND
W14
GND
K3
GND
R18
GND
W15
GND
L11
GND
R19
GND
W16
GND
L20
GND
R28
GND
W17
GND
M12
GND
R3
GND
W18
3- 68
R ev i sio n 1 8
Axcelerator Family FPGAs
FG896
FG896
FG896
AX2000 Function
Pin
Number
AX2000 Function
Pin
Number
AX2000 Function
Pin
Number
GND
W19
VCCA
U11
VCCDA
G16
GND
Y11
VCCA
U20
VCCDA
T25
GND
Y20
VCCA
V11
VCCDA
T4
GND/LP
E4
VCCA
V20
VCCIB0
A3
PRA
G15
VCCA
W11
VCCIB0
B3
PRB
D16
VCCA
W20
VCCIB0
J10
PRC
AB16
VCCA
Y12
VCCIB0
J11
PRD
AF16
VCCA
Y13
VCCIB0
J12
TCK
G7
VCCA
Y14
VCCIB0
K11
TDI
D5
VCCA
Y15
VCCIB0
K12
TDO
J8
VCCA
Y16
VCCIB0
K13
TMS
F6
VCCA
Y17
VCCIB0
K14
TRST
C4
VCCA
Y18
VCCIB0
K15
VCCA
AD6
VCCA
Y19
VCCIB1
A28
VCCA
AH26
VCCDA
AD24
VCCIB1
B28
VCCA
E28
VCCDA
AD7
VCCIB1
J19
VCCA
E3
VCCDA
AE15
VCCIB1
J20
VCCA
L12
VCCDA
AE16
VCCIB1
J21
VCCA
L13
VCCDA
AF12
VCCIB1
K16
VCCA
L14
VCCDA
AF13
VCCIB1
K17
VCCA
L15
VCCDA
AF15
VCCIB1
K18
VCCA
L16
VCCDA
AF18
VCCIB1
K19
VCCA
L17
VCCDA
AF19
VCCIB1
K20
VCCA
L18
VCCDA
AH27
VCCIB2
C29
VCCA
L19
VCCDA
AH4
VCCIB2
C30
VCCA
M11
VCCDA
C13
VCCIB2
K22
VCCA
M20
VCCDA
C27
VCCIB2
L21
VCCA
N11
VCCDA
C5
VCCIB2
L22
VCCA
N20
VCCDA
D13
VCCIB2
M21
VCCA
P11
VCCDA
D19
VCCIB2
M22
VCCA
P20
VCCDA
D3
VCCIB2
N21
VCCA
R11
VCCDA
E18
VCCIB2
P21
VCCA
R20
VCCDA
F15
VCCIB2
R21
VCCA
T11
VCCDA
F16
VCCIB3
AA22
VCCA
T20
VCCDA
F26
VCCIB3
AH29
Note: *Not routed on the same package layer and to adjacent LGA pads as its differential pair complement.
Recommended to be used as a single-ended I/O.
R ev i si o n 1 8
3- 69
Package Pin Assignments
FG896
FG896
AX2000 Function
Pin
Number
AX2000 Function
Pin
Number
VCCIB3
AH30
VCCIB6
W9
VCCIB3
T21
VCCIB6
Y10
VCCIB3
U21
VCCIB6
Y9
VCCIB3
V21
VCCIB7
C1
VCCIB3
W21
VCCIB7
C2
VCCIB3
W22
VCCIB7
K9
VCCIB3
Y21
VCCIB7
L10
VCCIB3
Y22
VCCIB7
L9
VCCIB4
AA16
VCCIB7
M10
VCCIB4
AA17
VCCIB7
M9
VCCIB4
AA18
VCCIB7
N10
VCCIB4
AA19
VCCIB7
P10
VCCIB4
AA20
VCCIB7
R10
VCCIB4
AB19
VCCPLA
G14
VCCIB4
AB20
VCCPLB
H15
VCCIB4
AB21
VCCPLC
G17
VCCIB4
AJ28
VCCPLD
J16
VCCIB4
AK28
VCCPLE
AH17
VCCIB5
AA11
VCCPLF
AC16
VCCIB5
AA12
VCCPLG
AH14
VCCIB5
AA13
VCCPLH
AD15
VCCIB5
AA14
VCOMPLA
F14
VCCIB5
AA15
VCOMPLB
J15
VCCIB5
AB10
VCOMPLC
F17
VCCIB5
AB11
VCOMPLD
H16
VCCIB5
AB12
VCOMPLE
AF17
VCCIB5
AJ3
VCOMPLF
AD16
VCCIB5
AK3
VCOMPLG
AF14
VCCIB6
AA9
VCOMPLH
AB15
VCCIB6
AH1
VPUMP
G24
VCCIB6
AH2
VCCIB6
T10
VCCIB6
U10
VCCIB6
V10
VCCIB6
W10
3- 70
R ev i sio n 1 8
Axcelerator Family FPGAs
FG1152
A1 Ball Pad Corner
34 33 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
AD
AE
AF
AG
AH
AJ
AK
AL
AM
AN
AP
Note
For Package Manufacturing and Environmental information, visit Resource center at
http://www.microsemi.com/soc/products/rescenter/package/index.html.
R ev i si o n 1 8
3- 71
Package Pin Assignments
FG1152
AX2000 Function
FG1152
Pin
Number
Bank 0
3- 72
FG1152
AX2000 Function
Pin
Number
AX2000 Function
Pin
Number
IO17NB0F1
F12
IO34PB0F3
D14
IO00NB0F0
D6
IO17PB0F1
F11
IO35NB0F3
A15
IO00PB0F0
C6
IO18NB0F1
E11
IO35PB0F3
B15
IO01NB0F0
H10
IO18PB0F1
E10
IO36NB0F3
B16
IO01PB0F0
H9
IO19NB0F1
F13
IO36PB0F3
A16
IO02NB0F0
F8
IO19PB0F1
G13
IO37NB0F3
G16
IO02PB0F0
G8
IO20NB0F1
A10
IO37PB0F3
G15
IO03NB0F0
A6
IO20PB0F1
A9
IO38NB0F3
D16
IO03PB0F0
B6
IO21NB0F1
K14
IO38PB0F3
C16
IO04NB0F0
C7
IO21PB0F1
K13
IO39NB0F3
K16
IO04PB0F0
D7
IO22NB0F2
B11
IO39PB0F3
L16
IO05NB0F0
K10
IO22PB0F2
B10
IO40NB0F3
D17
IO05PB0F0
J10
IO23NB0F2
C12
IO40PB0F3
C17
IO06NB0F0
F9
IO23PB0F2
C11
IO41NB0F3/HCLKAN
E16
IO06PB0F0
G9
IO24NB0F2
A12
IO41PB0F3/HCLKAP
F16
IO07NB0F0
F10
IO24PB0F2
A11
IO42NB0F3/HCLKBN
G17
IO07PB0F0
G10
IO25NB0F2
H14
IO42PB0F3/HCLKBP
F17
IO08NB0F0
E9
IO25PB0F2
J14
Bank 1
IO08PB0F0
E8
IO26NB0F2
D13
IO43NB1F4/HCLKCN
G19
IO09NB0F0
J11
IO26PB0F2
D12
IO43PB1F4/HCLKCP
G18
IO09PB0F0
K11
IO27NB0F2
F14
IO44NB1F4/HCLKDN
E19
IO10NB0F0
C8
IO27PB0F2
G14
IO44PB1F4/HCLKDP
F19
IO10PB0F0
D8
IO28NB0F2
E14
IO45NB1F4
C18
IO11NB0F0
K12
IO28PB0F2
E13
IO45PB1F4
D18
IO11PB0F0
J12
IO29NB0F2
B13
IO46NB1F4
A18
IO12NB0F1
G11
IO29PB0F2
B12
IO46PB1F4
B18
IO12PB0F1
H11
IO30NB0F2
C14
IO47NB1F4
K19
IO13NB0F1
G12
IO30PB0F2
C13
IO47PB1F4
L19
IO13PB0F1
H12
IO31NB0F2
H15
IO48NB1F4
C19
IO14NB0F1
A7
IO31PB0F2
J15
IO48PB1F4
D19
IO14PB0F1
B7
IO32NB0F2
A14
IO49NB1F4
K20
IO15NB0F1
H13
IO32PB0F2
B14
IO49PB1F4
L20
IO15PB0F1
J13
IO33NB0F2
K15
IO50NB1F4
A19
IO16NB0F1
C9
IO33PB0F2
L15
IO50PB1F4
B19
IO16PB0F1
D9
IO34NB0F3
D15
IO51NB1F4
H20
R ev i sio n 1 8
Axcelerator Family FPGAs
FG1152
FG1152
FG1152
AX2000 Function
Pin
Number
AX2000 Function
Pin
Number
AX2000 Function
Pin
Number
IO51PB1F4
J20
IO69NB1F6
C27
IO86NB2F8
J28
IO52NB1F4
B20
IO69PB1F6
C26
IO86PB2F8
J27
IO52PB1F4
A20
IO70NB1F6
H24
IO87NB2F8
M25
IO53NB1F4
F20
IO70PB1F6
G24
IO87PB2F8
L25
IO53PB1F4
E20
IO71NB1F6
H23
IO88NB2F8
L26
IO54NB1F5
B21
IO71PB1F6
G23
IO88PB2F8
K26
IO54PB1F5
A21
IO72NB1F6
B28
IO89NB2F8
G31
IO55NB1F5
K21
IO72PB1F6
A28
IO89PB2F8
F31
IO55PB1F5
J21
IO73NB1F6
E26
IO90NB2F8
H29
IO56NB1F5
D21
IO73PB1F6
E25
IO90PB2F8
G29
IO56PB1F5
C21
IO74NB1F6
F26
IO91NB2F8
K28
IO57NB1F5
G22
IO74PB1F6
F25
IO91PB2F8
K27
IO57PB1F5
G21
IO75NB1F6
K25
IO92NB2F8
J30
IO58NB1F5
E22
IO75PB1F6
K24
IO92PB2F8
H30
IO58PB1F5
E21
IO76NB1F7
D27
IO93NB2F8
L28
IO59NB1F5
D22
IO76PB1F7
D26
IO93PB2F8
L27
IO59PB1F5
C22
IO77NB1F7
B29
IO94NB2F8
K29
IO60NB1F5
B23
IO77PB1F7
A29
IO94PB2F8
J29
IO60PB1F5
A23
IO78NB1F7
D28
IO95NB2F8
K31
IO61NB1F5
H22
IO78PB1F7
C28
IO95PB2F8
J31
IO61PB1F5
H21
IO79NB1F7
H25
IO96NB2F9
J32
IO62NB1F5
C24
IO79PB1F7
G25
IO96PB2F9
H32
IO62PB1F5
C23
IO80NB1F7
F27
IO97NB2F9
M27
IO63NB1F5
F23
IO80PB1F7
E27
IO97PB2F9
M26
IO63PB1F5
F22
IO81NB1F7
J25
IO98NB2F9
L30
IO64NB1F6
B24
IO81PB1F7
J24
IO98PB2F9
K30
IO64PB1F6
A24
IO82NB1F7
D29
IO99NB2F9
N25
IO65NB1F6
J22
IO82PB1F7
C29
IO99PB2F9
N26
IO65PB1F6
K22
IO83NB1F7
H26
IO100NB2F9
M29
IO66NB1F6
B25
IO83PB1F7
G26
IO100PB2F9
L29
IO66PB1F6
A25
IO84NB1F7
F28
IO101NB2F9
L33
IO67NB1F6
K23
IO84PB1F7
E28
IO101PB2F9
L32
IO67PB1F6
J23
IO85NB1F7
H27
IO102NB2F9
K34
IO68NB1F6
F24
IO85PB1F7
G27
IO102PB2F9
K33
IO68PB1F6
E24
IO103NB2F9
N28
Bank 2
R ev i si o n 1 8
3- 73
Package Pin Assignments
FG1152
FG1152
FG1152
AX2000 Function
Pin
Number
AX2000 Function
Pin
Number
AX2000 Function
Pin
Number
IO103PB2F9
M28
IO121NB2F11
T27
IO138NB3F12
Y29
IO104NB2F9
M34
IO121PB2F11
T26
IO138PB3F12
W29
IO104PB2F9
L34
IO122NB2F11
T30
IO139NB3F13
Y27
IO105NB2F9
P27
IO122PB2F11
T29
IO139PB3F13
W27
IO105PB2F9
N27
IO123NB2F11
U28
IO140NB3F13
AA33
IO106NB2F9
M32
IO123PB2F11
T28
IO140PB3F13
Y33
IO106PB2F9
M31
IO124NB2F11
T31
IO141NB3F13
Y25
IO107NB2F10
P25
IO124PB2F11
T32
IO141PB3F13
Y24
IO107PB2F10
P26
IO125NB2F11
U24
IO142NB3F13
AA31
IO108NB2F10
N33
IO125PB2F11
U25
IO142PB3F13
Y31
IO108PB2F10
M33
IO126NB2F11
U33
IO143NB3F13
AA28
IO109NB2F10
P29
IO126PB2F11
U34
IO143PB3F13
Y28
IO109PB2F10
N29
IO127NB2F11
U26
IO144NB3F13
AA34
IO110NB2F10
P30
IO127PB2F11
U27
IO144PB3F13
Y34
IO110PB2F10
N30
IO128NB2F11
U31
IO145NB3F13
AA26
IO111NB2F10
R24
IO128PB2F11
U32
IO145PB3F13
Y26
IO111PB2F10
R25
IO146NB3F13
AA29
IO112NB2F10
P31
IO129NB3F12
V29
IO146PB3F13
AA30
IO112PB2F10
N31
IO129PB3F12
U29
IO147NB3F13
AB30
IO113NB2F10
R28
IO130NB3F12
V31
IO147PB3F13
AB29
IO113PB2F10
P28
IO130PB3F12
V32
IO148NB3F13
AB32
IO114NB2F10
P32
IO131NB3F12
V24
IO148PB3F13
AA32
IO114PB2F10
N32
IO131PB3F12
V25
IO149NB3F13
AB27
IO115NB2F10
R30
IO132NB3F12
W28
IO149PB3F13
AA27
IO115PB2F10
R29
IO132PB3F12
V28
IO150NB3F14
AC31
IO116NB2F10
P34
IO133NB3F12
W26
IO150PB3F14
AB31
IO116PB2F10
P33
IO133PB3F12
V26
IO151NB3F14
AD33
IO117NB2F10
R27
IO134NB3F12
W33
IO151PB3F14
AC33
IO117PB2F10
R26
IO134PB3F12
V33
IO152NB3F14
AC28
IO118NB2F11
R34
IO135NB3F12
W25
IO152PB3F14
AB28
IO118PB2F11
R33
IO135PB3F12
W24
IO153NB3F14
AB25
IO119NB2F11
T24
IO136NB3F12
W31
IO153PB3F14
AA25
IO119PB2F11
T25
IO136PB3F12
W32
IO154NB3F14
AD32
IO120NB2F11
T33
IO137NB3F12
Y30
IO154PB3F14
AC32
IO120PB2F11
T34
IO137PB3F12
W30
IO155NB3F14
AD29
3- 74
Bank 3
R ev i sio n 1 8
Axcelerator Family FPGAs
FG1152
FG1152
FG1152
AX2000 Function
Pin
Number
AX2000 Function
Pin
Number
AX2000 Function
Pin
Number
IO155PB3F14
AC29
IO172PB4F16
AH27
IO190NB4F17
AH22
IO156NB3F14
AE30
IO173NB4F16
AJ27
IO190PB4F17
AH23
IO156PB3F14
AD30
IO173PB4F16
AJ28
IO191NB4F17
AJ23
IO157NB3F14
AC26
IO174NB4F16
AL27
IO191PB4F17
AJ24
IO157PB3F14
AB26
IO174PB4F16
AL28
IO192NB4F17
AG21
IO158NB3F14
AH33
IO175NB4F16
AM28
IO192PB4F17
AG22
IO158PB3F14
AG33
IO175PB4F16
AM29
IO193NB4F18
AP23
IO159NB3F14
AD27
IO176NB4F16
AG25
IO193PB4F18
AP24
IO159PB3F14
AC27
IO176PB4F16
AG26
IO194NB4F18
AN22
IO160NB3F14
AG32
IO177NB4F16
AK26
IO194PB4F18
AN23
IO160PB3F14
AF32
IO177PB4F16
AK27
IO195NB4F18
AM23
IO161NB3F15
AG31
IO178NB4F16
AF25
IO195PB4F18
AL23
IO161PB3F15
AF31
IO178PB4F16
AE25
IO196NB4F18
AF21
IO162NB3F15
AF29
IO179NB4F16
AP28
IO196PB4F18
AF22
IO162PB3F15
AE29
IO179PB4F16
AN28
IO197NB4F18
AL22
IO163NB3F15
AE28
IO180NB4F16
AJ25
IO197PB4F18
AM22
IO163PB3F15
AD28
IO180PB4F16
AJ26
IO198NB4F18
AE21
IO164NB3F15
AG30
IO181NB4F17
AM26
IO198PB4F18
AE22
IO164PB3F15
AF30
IO181PB4F17
AM27
IO199NB4F18
AJ21
IO165NB3F15
AE26
IO182NB4F17
AF24
IO199PB4F18
AJ22
IO165PB3F15
AD26
IO182PB4F17
AE24
IO200NB4F18
AK21
IO166NB3F15
AJ30
IO183NB4F17
AH24
IO200PB4F18
AK22
IO166PB3F15
AH30
IO183PB4F17
AH25
IO201NB4F18
AM21
IO167NB3F15
AG28
IO184NB4F17
AG23
IO201PB4F18
AL21
IO167PB3F15
AF28
IO184PB4F17
AG24
IO202NB4F18
AE20
IO168NB3F15
AF27
IO185NB4F17
AL25
IO202PB4F18
AD20
IO168PB3F15
AE27
IO185PB4F17
AL26
IO203NB4F19
AN21
IO169NB3F15
AH29
IO186NB4F17
AP25
IO203PB4F19
AP21
IO169PB3F15
AG29
IO186PB4F17
AP26
IO204NB4F19
AP20
IO170NB3F15
AD25
IO187NB4F17
AK24
IO204PB4F19
AN20
IO170PB3F15
AC25
IO187PB4F17
AK25
IO205NB4F19
AN19
IO188NB4F17
AF23
IO205PB4F19
AP19
Bank 4
IO171NB4F16
AP29
IO188PB4F17
AE23
IO206NB4F19
AG20
IO171PB4F16
AN29
IO189NB4F17
AN24
IO206PB4F19
AF20
IO172NB4F16
AH26
IO189PB4F17
AM24
IO207NB4F19
AL19
R ev i si o n 1 8
3- 75
Package Pin Assignments
FG1152
FG1152
FG1152
AX2000 Function
Pin
Number
AX2000 Function
Pin
Number
AX2000 Function
Pin
Number
IO207PB4F19
AL20
IO224PB5F21
AP14
IO242NB5F22
AG11
IO208NB4F19
AG19
IO225NB5F21
AK13
IO242PB5F22
AG12
IO208PB4F19
AF19
IO225PB5F21
AK14
IO243NB5F22
AL9
IO209NB4F19
AN18
IO226NB5F21
AE15
IO243PB5F22
AL10
IO209PB4F19
AP18
IO226PB5F21
AF15
IO244NB5F22
AM8
IO210NB4F19
AE19
IO227NB5F21
AG14
IO244PB5F22
AM9
IO210PB4F19
AD19
IO227PB5F21
AG15
IO245NB5F23
AH10
IO211NB4F19
AL18
IO228NB5F21
AJ13
IO245PB5F23
AJ10
IO211PB4F19
AM18
IO228PB5F21
AJ14
IO246NB5F23
AF10
IO212NB4F19/CLKEN
AJ20
IO229NB5F21
AM13
IO246PB5F23
AF11
IO212PB4F19/CLKEP
AK20
IO229PB5F21
AM14
IO247NB5F23
AJ9
IO213NB4F19/CLKFN
AJ18
IO230NB5F21
AE14
IO247PB5F23
AK9
IO213PB4F19/CLKFP
AJ19
IO230PB5F21
AF14
IO248NB5F23
AN7
IO231NB5F21
AN12
IO248PB5F23
AP7
Bank 5
IO214NB5F20/CLKGN
AJ16
IO231PB5F21
AP12
IO249NB5F23
AL7
IO214PB5F20/CLKGP
AJ17
IO232NB5F21
AG13
IO249PB5F23
AL8
IO215NB5F20/CLKHN
AJ15
IO232PB5F21
AH13
IO250NB5F23
AE10
IO215PB5F20/CLKHP
AK15
IO233NB5F21
AL12
IO250PB5F23
AE11
IO216NB5F20
AD16
IO233PB5F21
AL13
IO251NB5F23
AK8
IO216PB5F20
AE17
IO234NB5F21
AE13
IO251PB5F23
AJ8
IO217NB5F20
AM17
IO234PB5F21
AF13
IO252NB5F23
AH8
IO217PB5F20
AL17
IO235NB5F22
AN11
IO252PB5F23
AH9
IO218NB5F20
AG16
IO235PB5F22
AP11
IO253NB5F23
AN6
IO218PB5F20
AF16
IO236NB5F22
AM11
IO253PB5F23
AP6
IO219NB5F20
AM16
IO236PB5F22
AM12
IO254NB5F23
AG9
IO219PB5F20
AL16
IO237NB5F22
AJ11
IO254PB5F23
AG10
IO220NB5F20
AP16
IO237PB5F22
AJ12
IO255NB5F23
AJ7
IO220PB5F20
AN16
IO238NB5F22
AH11
IO255PB5F23
AK7
IO221NB5F20
AN15
IO238PB5F22
AH12
IO256NB5F23
AL6
IO221PB5F20
AP15
IO239NB5F22
AK10
IO256PB5F23
AM6
IO222NB5F20
AD15
IO239PB5F22
AK11
IO222PB5F20
AE16
IO240NB5F22
AE12
IO257NB6F24
AG6
IO223NB5F21
AL14
IO240PB5F22
AF12
IO257PB6F24
AH6
IO223PB5F21
AL15
IO241NB5F22
AN10
IO258NB6F24
AD9
IO224NB5F21
AN14
IO241PB5F22
AP10
IO258PB6F24
AE9
3- 76
R ev i sio n 1 8
Bank 6
Axcelerator Family FPGAs
FG1152
FG1152
FG1152
AX2000 Function
Pin
Number
AX2000 Function
Pin
Number
AX2000 Function
Pin
Number
IO259NB6F24
AF7
IO276PB6F25
AD2
IO294NB6F27
V10
IO259PB6F24
AG7
IO277NB6F25
AC4
IO294PB6F27
V11
IO260NB6F24
AH3
IO277PB6F25
AC3
IO295NB6F27
Y1
IO260PB6F24
AH4
IO278NB6F26
AA8
IO295PB6F27
Y2
IO261NB6F24
AH5
IO278PB6F26
AA9
IO296NB6F27
W1
IO261PB6F24
AJ5
IO279NB6F26
AB5
IO296PB6F27
W2
IO262NB6F24
AE6
IO279PB6F26
AB6
IO297NB6F27
V1
IO262PB6F24
AF6
IO280NB6F26
Y10
IO297PB6F27
V2
IO263NB6F24
AF5
IO280PB6F26
Y11
IO298NB6F27
V9
IO263PB6F24
AG5
IO281NB6F26
AB3
IO298PB6F27
V8
IO264NB6F24
AD8
IO281PB6F26
AB4
IO299NB6F27
U4
IO264PB6F24
AE8
IO282NB6F26
Y7
IO299PB6F27
V4
IO265NB6F24
AF3
IO282PB6F26
AA7
IO265PB6F24
AG3
IO283NB6F26
AC2
IO300NB7F28
U10
IO266NB6F24
AC10
IO283PB6F26
AC1
IO300PB7F28
U11
IO266PB6F24
AD10
IO284NB6F26
Y9
IO301NB7F28
U2
IO267NB6F25
AD7
IO284PB6F26
Y8
IO301PB7F28
U1
IO267PB6F25
AE7
IO285NB6F26
AA5
IO302NB7F28
U6
IO268NB6F25
AD5
IO285PB6F26
AA6
IO302PB7F28
U7
IO268PB6F25
AE5
IO286NB6F26
W10
IO303NB7F28
T3
IO269NB6F25
AE4
IO286PB6F26
W11
IO303PB7F28
U3
IO269PB6F25
AF4
IO287NB6F26
AA3
IO304NB7F28
U9
IO270NB6F25
AB9
IO287PB6F26
AA4
IO304PB7F28
U8
IO270PB6F25
AC9
IO288NB6F26
W9
IO305NB7F28
R2
IO271NB6F25
AC6
IO288PB6F26
W8
IO305PB7F28
R1
IO271PB6F25
AD6
IO289NB6F27
AA1
IO306NB7F28
R4
IO272NB6F25
AB8
IO289PB6F27
AA2
IO306PB7F28
T4
IO272PB6F25
AC8
IO290NB6F27
W6
IO307NB7F28
R5
IO273NB6F25
AE1
IO290PB6F27
Y6
IO307PB7F28
T5
IO273PB6F25
AE2
IO291NB6F27
W5
IO308NB7F28
T11
IO274NB6F25
AA10
IO291PB6F27
Y5
IO308PB7F28
T10
IO274PB6F25
AB10
IO292NB6F27
V7
IO309NB7F28
T6
IO275NB6F25
AB7
IO292PB6F27
W7
IO309PB7F28
T7
IO275PB6F25
AC7
IO293NB6F27
W4
IO310NB7F29
T9
IO276NB6F25
AD1
IO293PB6F27
Y4
IO310PB7F29
T8
R ev i si o n 1 8
Bank 7
3- 77
Package Pin Assignments
FG1152
FG1152
FG1152
AX2000 Function
Pin
Number
AX2000 Function
Pin
Number
AX2000 Function
Pin
Number
IO311NB7F29
N3
IO328PB7F30
N9
GND
A33
IO311PB7F29
P3
IO329NB7F30
J4
GND
A4
IO312NB7F29
P7
IO329PB7F30
K4
GND
A8
IO312PB7F29
R7
IO330NB7F30
J5
GND
AA14
IO313NB7F29
P6
IO330PB7F30
K5
GND
AA15
IO313PB7F29
R6
IO331NB7F30
M10
GND
AA16
IO314NB7F29
M2
IO331PB7F30
M9
GND
AA17
IO314PB7F29
N2
IO332NB7F31
L8
GND
AA18
IO315NB7F29
N4
IO332PB7F31
M8
GND
AA19
IO315PB7F29
P4
IO333NB7F31
F2
GND
AA20
IO316NB7F29
R9
IO333PB7F31
F1
GND
AA21
IO316PB7F29
R8
IO334NB7F31
J6
GND
AB1
IO317NB7F29
N5
IO334PB7F31
K6
GND
AB13
IO317PB7F29
P5
IO335NB7F31
H4
GND
AB22
IO318NB7F29
R10
IO335PB7F31
H3
GND
AB34
IO318PB7F29
R11
IO336NB7F31
K7
GND
AC12
IO319NB7F29
L2
IO336PB7F31
L7
GND
AC23
IO319PB7F29
L1
IO337NB7F31
G4
GND
AC30
IO320NB7F29
N8
IO337PB7F31
G3
GND
AC5
IO320PB7F29
P8
IO338NB7F31
K9
GND
AD11
IO321NB7F30
M6
IO338PB7F31
L9
GND
AD24
IO321PB7F30
N6
IO339NB7F31
H6
GND
AD31
IO322NB7F30
P10
IO339PB7F31
H5
GND
AD4
IO322PB7F30
P9
IO340NB7F31
H7
GND
AE3
IO323NB7F30
L3
IO340PB7F31
J7
GND
AE32
IO323PB7F30
M3
IO341NB7F31
J8
GND
AF2
IO324NB7F30
M7
IO341PB7F31
K8
GND
AF33
IO324PB7F30
N7
GND
AG1
IO325NB7F30
K2
GND
A13
GND
AG27
IO325PB7F30
K1
GND
A2
GND
AG34
IO326NB7F30
G2
GND
A22
GND
AG8
IO326PB7F30
H2
GND
A27
GND
AH28
IO327NB7F30
L6
GND
A3
GND
AH7
IO327PB7F30
L5
GND
A31
GND
AJ29
IO328NB7F30
N10
GND
A32
GND
AJ6
3- 78
Dedicated I/O
R ev i sio n 1 8
Axcelerator Family FPGAs
FG1152
FG1152
FG1152
AX2000 Function
Pin
Number
AX2000 Function
Pin
Number
AX2000 Function
Pin
Number
GND
AK12
GND
AN34
GND
D1
GND
AK17
GND
AN4
GND
D11
GND
AK18
GND
AN9
GND
D2
GND
AK23
GND
AP13
GND
D24
GND
AK30
GND
AP2
GND
D3
GND
AK5
GND
AP22
GND
D31
GND
AL1
GND
AP27
GND
D32
GND
AL11
GND
AP3
GND
D33
GND
AL2
GND
AP31
GND
D34
GND
AL24
GND
AP32
GND
D4
GND
AL3
GND
AP33
GND
E12
GND
AL31
GND
AP4
GND
E17
GND
AL32
GND
AP8
GND
E18
GND
AL33
GND
B1
GND
E23
GND
AL34
GND
B2
GND
E30
GND
AL4
GND
B26
GND
E5
GND
AM1
GND
B3
GND
F29
GND
AM10
GND
B31
GND
F30
GND
AM15
GND
B32
GND
F6
GND
AM2
GND
B33
GND
G28
GND
AM20
GND
B34
GND
G7
GND
AM25
GND
B4
GND
H1
GND
AM3
GND
B9
GND
H34
GND
AM31
GND
C1
GND
J2
GND
AM32
GND
C10
GND
J33
GND
AM33
GND
C15
GND
K3
GND
AM34
GND
C2
GND
K32
GND
AM4
GND
C20
GND
L11
GND
AN1
GND
C25
GND
L24
GND
AN2
GND
C3
GND
L31
GND
AN26
GND
C31
GND
L4
GND
AN3
GND
C32
GND
M12
GND
AN31
GND
C33
GND
M23
GND
AN32
GND
C34
GND
M30
GND
AN33
GND
C4
GND
M5
R ev i si o n 1 8
3- 79
Package Pin Assignments
FG1152
FG1152
FG1152
AX2000 Function
Pin
Number
AX2000 Function
Pin
Number
AX2000 Function
Pin
Number
GND
N1
GND
U19
NC
A26
GND
N13
GND
U20
NC
AB2
GND
N22
GND
U21
NC
AB33
GND
N34
GND
U30
NC
AC34
GND
P14
GND
U5
NC
AD3
GND
P15
GND
V14
NC
AD34
GND
P16
GND
V15
NC
AE31
GND
P17
GND
V16
NC
AE33
GND
P18
GND
V17
NC
AE34
GND
P19
GND
V18
NC
AF1
GND
P20
GND
V19
NC
AF34
GND
P21
GND
V20
NC
AG2
GND
R14
GND
V21
NC
AG4
GND
R15
GND
V30
NC
AH1
GND
R16
GND
V5
NC
AH2
GND
R17
GND
W14
NC
AH31
GND
R18
GND
W15
NC
AH32
GND
R19
GND
W16
NC
AH34
GND
R20
GND
W17
NC
AJ1
GND
R21
GND
W18
NC
AJ2
GND
R3
GND
W19
NC
AJ3
GND
R32
GND
W20
NC
AJ31
GND
T14
GND
W21
NC
AJ32
GND
T15
GND
Y14
NC
AJ33
GND
T16
GND
Y15
NC
AJ34
GND
T17
GND
Y16
NC
AJ4
GND
T18
GND
Y17
NC
AL29
GND
T19
GND
Y18
NC
AM19
GND
T20
GND
Y19
NC
AM7
GND
T21
GND
Y20
NC
AN13
GND
U14
GND
Y21
NC
AN17
GND
U15
GND
Y3
NC
AN25
GND
U16
GND
Y32
NC
AN27
GND
U17
GND/LP
G6
NC
AN8
GND
U18
NC
A17
NC
AP17
3- 80
R ev i sio n 1 8
Axcelerator Family FPGAs
FG1152
FG1152
FG1152
AX2000 Function
Pin
Number
AX2000 Function
Pin
Number
AX2000 Function
Pin
Number
NC
AP9
PRB
F18
VCCA
T22
NC
B17
PRC
AD18
VCCA
U13
NC
B22
PRD
AH18
VCCA
U22
NC
B27
TCK
J9
VCCA
V13
NC
B8
TDI
F7
VCCA
V22
NC
D10
TDO
L10
VCCA
W13
NC
D20
TMS
H8
VCCA
W22
NC
D23
TRST
E6
VCCA
Y13
NC
D25
VCCA
AA13
VCCA
Y22
NC
F3
VCCA
AA22
VCCDA
AF26
NC
F32
VCCA
AB14
VCCDA
AF9
NC
F33
VCCA
AB15
VCCDA
AG17
NC
F34
VCCA
AB16
VCCDA
AG18
NC
F4
VCCA
AB17
VCCDA
AH14
NC
G1
VCCA
AB18
VCCDA
AH15
NC
G32
VCCA
AB19
VCCDA
AH17
NC
G33
VCCA
AB20
VCCDA
AH20
NC
G34
VCCA
AB21
VCCDA
AH21
NC
H31
VCCA
AF8
VCCDA
AK29
NC
H33
VCCA
AK28
VCCDA
AK6
NC
J1
VCCA
G30
VCCDA
E15
NC
J3
VCCA
G5
VCCDA
E29
NC
J34
VCCA
N14
VCCDA
E7
NC
M1
VCCA
N15
VCCDA
F15
NC
M4
VCCA
N16
VCCDA
F21
NC
P1
VCCA
N17
VCCDA
F5
NC
P2
VCCA
N18
VCCDA
G20
NC
R31
VCCA
N19
VCCDA
H17
NC
T1
VCCA
N20
VCCDA
H18
NC
T2
VCCA
N21
VCCDA
H28
NC
V3
VCCA
P13
VCCDA
J18
NC
V34
VCCA
P22
VCCDA
V27
NC
W3
VCCA
R13
VCCDA
V6
NC
W34
VCCA
R22
VCCIB0
A5
PRA
J17
VCCA
T13
VCCIB0
B5
R ev i si o n 1 8
3- 81
Package Pin Assignments
FG1152
FG1152
FG1152
AX2000 Function
Pin
Number
AX2000 Function
Pin
Number
AX2000 Function
Pin
Number
VCCIB0
C5
VCCIB3
AA24
VCCIB6
AA11
VCCIB0
D5
VCCIB3
AB23
VCCIB6
AA12
VCCIB0
L12
VCCIB3
AB24
VCCIB6
AB11
VCCIB0
L13
VCCIB3
AC24
VCCIB6
AB12
VCCIB0
L14
VCCIB3
AK31
VCCIB6
AC11
VCCIB0
M13
VCCIB3
AK32
VCCIB6
AK1
VCCIB0
M14
VCCIB3
AK33
VCCIB6
AK2
VCCIB0
M15
VCCIB3
AK34
VCCIB6
AK3
VCCIB0
M16
VCCIB3
V23
VCCIB6
AK4
VCCIB0
M17
VCCIB3
W23
VCCIB6
V12
VCCIB1
A30
VCCIB3
Y23
VCCIB6
W12
VCCIB1
B30
VCCIB4
AC18
VCCIB6
Y12
VCCIB1
C30
VCCIB4
AC19
VCCIB7
E1
VCCIB1
D30
VCCIB4
AC20
VCCIB7
E2
VCCIB1
L21
VCCIB4
AC21
VCCIB7
E3
VCCIB1
L22
VCCIB4
AC22
VCCIB7
E4
VCCIB1
L23
VCCIB4
AD21
VCCIB7
M11
VCCIB1
M18
VCCIB4
AD22
VCCIB7
N11
VCCIB1
M19
VCCIB4
AD23
VCCIB7
N12
VCCIB1
M20
VCCIB4
AL30
VCCIB7
P11
VCCIB1
M21
VCCIB4
AM30
VCCIB7
P12
VCCIB1
M22
VCCIB4
AN30
VCCIB7
R12
VCCIB2
E31
VCCIB4
AP30
VCCIB7
T12
VCCIB2
E32
VCCIB5
AC13
VCCIB7
U12
VCCIB2
E33
VCCIB5
AC14
VCCPLA
J16
VCCIB2
E34
VCCIB5
AC15
VCCPLB
K17
VCCIB2
M24
VCCIB5
AC16
VCCPLC
J19
VCCIB2
N23
VCCIB5
AC17
VCCPLD
L18
VCCIB2
N24
VCCIB5
AD12
VCCPLE
AK19
VCCIB2
P23
VCCIB5
AD13
VCCPLF
AE18
VCCIB2
P24
VCCIB5
AD14
VCCPLG
AK16
VCCIB2
R23
VCCIB5
AL5
VCCPLH
AF17
VCCIB2
T23
VCCIB5
AM5
VCOMPLA
H16
VCCIB2
U23
VCCIB5
AN5
VCOMPLB
L17
VCCIB3
AA23
VCCIB5
AP5
VCOMPLC
H19
3- 82
R ev i sio n 1 8
Axcelerator Family FPGAs
FG1152
AX2000 Function
Pin
Number
VCOMPLD
K18
VCOMPLE
AH19
VCOMPLF
AF18
VCOMPLG
AH16
VCOMPLH
AD17
VPUMP
J26
R ev i si o n 1 8
3- 83
Package Pin Assignments
PQ208
1
208
208-Pin PQFP
Note
For Package Manufacturing and Environmental information, visit Resource center at
http://www.microsemi.com/soc/products/rescenter/package/index.html.
3- 84
R ev i sio n 1 8
Axcelerator Family FPGAs
PQ208
PQ208
AX250 Function
Pin
Number
Bank 0
AX250 Function
PQ208
Pin
Number
AX250 Function
Pin
Number
IO43PB2F2
134
IO76PB5F5/CLKGP
77
IO02NB0F0
197
IO44NB2F2
131
IO77NB5F5/CLKHN
70
IO03NB0F0
198
IO44PB2F2
133
IO77PB5F5/CLKHP
71
IO03PB0F0
199
IO78NB5F5
66
IO12NB0F0/HCLKAN
191
IO45NB3F3
127
IO78PB5F5
67
IO12PB0F0/HCLKAP
192
IO45PB3F3
129
IO86NB5F5
62
IO13NB0F0/HCLKBN
185
IO46NB3F3
126
IO87NB5F5
60
IO13PB0F0/HCLKBP
186
IO46PB3F3
128
IO87PB5F5
61
IO48NB3F3
122
IO88NB5F5
56
Bank 1
Bank 3
IO14NB1F1/HCLKCN
180
IO48PB3F3
123
IO88PB5F5
57
IO14PB1F1/HCLKCP
181
IO50NB3F3
120
IO89NB5F5
54
IO15NB1F1/HCLKDN
174
IO50PB3F3
121
IO89PB5F5
55
IO15PB1F1/HCLKDP
175
IO55NB3F3
116
IO16NB1F1
170
IO55PB3F3
117
IO91NB6F6
47
IO16PB1F1
171
IO57NB3F3
114
IO91PB6F6
49
IO24NB1F1
165
IO57PB3F3
115
IO92NB6F6
48
IO24PB1F1
166
IO59NB3F3
110
IO92PB6F6
50
IO26NB1F1
161
IO59PB3F3
111
IO93NB6F6
42
IO26PB1F1
162
IO60NB3F3
108
IO93PB6F6
43
IO27NB1F1
159
IO60PB3F3
109
IO94PB6F6
44
IO27PB1F1
160
IO61NB3F3
106
IO96NB6F6
40
IO61PB3F3
107
IO96PB6F6
41
IO101NB6F6
35
Bank 2
Bank 6
IO29NB2F2
151
IO29PB2F2
153
IO62NB4F4
100
IO101PB6F6
36
IO30NB2F2
152
IO62PB4F4
103
IO102PB6F6
37
IO30PB2F2
154
IO63NB4F4
101
IO103NB6F6
33
IO31PB2F2
148
IO63PB4F4
102
IO103PB6F6
34
IO32NB2F2
146
IO64NB4F4
96
IO105NB6F6
28
IO32PB2F2
147
IO64PB4F4
97
IO105PB6F6
30
IO34NB2F2
144
IO72NB4F4
91
IO106NB6F6
27
IO34PB2F2
145
IO72PB4F4
92
IO106PB6F6
29
IO39NB2F2
139
IO74NB4F4/CLKEN
87
IO39PB2F2
140
IO74PB4F4/CLKEP
88
IO107NB7F7
23
IO40PB2F2
141
IO75NB4F4/CLKFN
81
IO107PB7F7
25
IO41NB2F2
137
IO75PB4F4/CLKFP
82
IO108NB7F7
22
IO41PB2F2
138
Bank 5
IO108PB7F7
24
IO43NB2F2
132
IO76NB5F5/CLKGN
IO110NB7F7
18
Bank 4
R ev i si o n 1 8
76
Bank 7
3- 85
Package Pin Assignments
PQ208
AX250 Function
PQ208
Pin
Number
Pin
Number
AX250 Function
Pin
Number
IO110PB7F7
19
GND
94
VCCPLB
187
IO112NB7F7
16
GND
99
VCCPLC
178
IO112PB7F7
17
GND
113
VCCPLD
176
IO117NB7F7
12
GND
119
VCCPLE
85
IO117PB7F7
13
GND
125
VCCPLF
83
IO119NB7F7
10
GND
136
VCCPLG
74
IO119PB7F7
11
GND
143
VCCPLH
72
IO121PB7F7
7
GND
150
VCCIB0
193
IO122NB7F7
5
GND
155
VCCIB0
200
IO122PB7F7
6
GND
164
VCCIB1
163
IO123NB7F7
3
GND
169
VCCIB1
172
IO123PB7F7
4
GND
173
VCCIB2
135
GND
194
VCCIB2
149
Dedicated I/O
3- 86
AX250 Function
PQ208
VCCDA
1
GND
196
VCCIB3
112
VCCDA
26
GND
201
VCCIB3
124
VCCDA
53
GND/LP
208
VCCIB4
89
VCCDA
63
PRA
184
VCCIB4
98
VCCDA
78
PRB
183
VCCIB5
58
VCCDA
95
PRC
80
VCCIB5
68
VCCDA
105
PRD
79
VCCIB6
31
VCCDA
130
TCK
205
VCCIB6
45
VCCDA
157
TDI
204
VCCIB7
8
VCCDA
167
TDO
203
VCCIB7
20
VCCDA
182
TMS
206
VCOMPLA
190
VCCDA
202
TRST
207
VCOMPLB
188
GND
104
VCCA
2
VCOMPLC
179
GND
9
VCCA
52
VCOMPLD
177
GND
15
VCCA
156
VCOMPLE
86
GND
21
VCCA
14
VCOMPLF
84
GND
32
VCCA
38
VCOMPLG
75
GND
39
VCCA
64
VCOMPLH
73
GND
46
VCCA
93
VPUMP
158
GND
51
VCCA
118
GND
59
VCCA
142
GND
65
VCCA
168
GND
69
VCCA
195
GND
90
VCCPLA
189
R ev i sio n 1 8
Axcelerator Family FPGAs
PQ208
PQ208
AX500 Function
Pin
Number
Bank 0
PQ208
AX500 Function
Pin
Number
AX500 Function
Pin
Number
IO61PB2F5
134
IO105PB5F10/CLKGP
77
IO03NB0F0
198
IO62NB2F5
131
IO106NB5F10/CLKHN
70
IO03PB0F0
199
IO62PB2F5
133
IO106PB5F10/CLKHP
71
IO04NB0F0
197
IO107NB5F10
66
IO19NB0F1/HCLKAN
191
IO63NB3F6
127
IO107PB5F10
67
IO19PB0F1/HCLKAP
192
IO63PB3F6
129
IO119NB5F11
62
IO20NB0F1/HCLKBN
185
IO64NB3F6
126
IO121NB5F11
60
IO20PB0F1/HCLKBP
186
IO64PB3F6
128
IO121PB5F11
61
IO66NB3F6
122
IO123NB5F11
56
Bank 1
Bank 3
IO21NB1F2/HCLKCN
180
IO66PB3F6
123
IO123PB5F11
57
IO21PB1F2/HCLKCP
181
IO68NB3F6
120
IO125NB5F11
54
IO22NB1F2/HCLKDN
174
IO68PB3F6
121
IO125PB5F11
55
IO22PB1F2/HCLKDP
175
IO77NB3F7
116
IO23NB1F2
170
IO77PB3F7
117
IO127NB6F12
47
IO23PB1F2
171
IO79NB3F7
114
IO127PB6F12
49
IO37NB1F3
165
IO79PB3F7
115
IO128NB6F12
48
IO37PB1F3
166
IO81NB3F7
110
IO128PB6F12
50
IO39NB1F3
161
IO81PB3F7
111
IO129NB6F12
42
IO39PB1F3
162
IO82NB3F7
108
IO129PB6F12
43
IO41NB1F3
159
IO82PB3F7
109
IO130PB6F12
44
IO41PB1F3
160
IO83NB3F7
106
IO132NB6F12
40
IO83PB3F7
107
IO132PB6F12
41
IO141NB6F13
35
Bank 2
Bank 6
IO43NB2F4
151
IO43PB2F4
153
IO84PB4F8
103
IO141PB6F13
36
IO44NB2F4
152
IO85NB4F8
100
IO142PB6F13
37
IO44PB2F4
154
IO86NB4F8
101
IO143NB6F13
33
IO45PB2F4
148
IO86PB4F8
102
IO143PB6F13
34
IO46NB2F4
146
IO87NB4F8
96
IO145NB6F13
28
IO46PB2F4
147
IO87PB4F8
97
IO145PB6F13
30
IO48NB2F4
144
IO101NB4F9
91
IO146NB6F13
27
IO48PB2F4
145
IO101PB4F9
92
IO146PB6F13
29
IO57NB2F5
139
IO103NB4F9/CLKEN
87
IO57PB2F5
140
IO103PB4F9/CLKEP
88
IO147NB7F14
23
IO58PB2F5
141
IO104NB4F9/CLKFN
81
IO147PB7F14
25
IO59NB2F5
137
IO104PB4F9/CLKFP
82
IO148NB7F14
22
IO59PB2F5
138
Bank 5
IO148PB7F14
24
IO61NB2F5
132
IO150NB7F14
18
Bank 4
IO105NB5F10/CLKGN
R ev i si o n 1 8
76
Bank 7
3- 87
Package Pin Assignments
PQ208
PQ208
AX500 Function
Pin
Number
AX500 Function
Pin
Number
AX500 Function
Pin
Number
IO150PB7F14
19
GND
94
VCCPLB
187
IO152NB7F14
16
GND
99
VCCPLC
178
IO152PB7F14
17
GND
113
VCCPLD
176
IO161NB7F15
12
GND
119
VCCPLE
85
IO161PB7F15
13
GND
125
VCCPLF
83
IO163NB7F15
10
GND
143
VCCPLG
74
IO163PB7F15
11
GND
136
VCCPLH
72
IO165PB7F15
7
GND
150
VCCIB0
200
IO166NB7F15
5
GND
155
VCCIB0
193
IO166PB7F15
6
GND
164
VCCIB1
172
IO167NB7F15
3
GND
169
VCCIB1
163
IO167PB7F15
4
GND
173
VCCIB2
149
GND
194
VCCIB2
135
Dedicated I/O
3- 88
PQ208
VCCDA
1
GND
196
VCCIB3
124
VCCDA
26
GND
201
VCCIB3
112
VCCDA
53
GND/LP
208
VCCIB4
98
VCCDA
63
PRA
184
VCCIB4
89
VCCDA
78
PRB
183
VCCIB5
68
VCCDA
95
PRC
80
VCCIB5
58
VCCDA
105
PRD
79
VCCIB6
45
VCCDA
130
TCK
205
VCCIB6
31
VCCDA
157
TDI
204
VCCIB7
20
VCCDA
167
TDO
203
VCCIB7
8
VCCDA
182
TMS
206
VCOMPLA
190
VCCDA
202
TRST
207
VCOMPLB
188
GND
104
VCCA
2
VCOMPLC
179
GND
9
VCCA
14
VCOMPLD
177
GND
15
VCCA
38
VCOMPLE
86
GND
21
VCCA
52
VCOMPLF
84
GND
32
VCCA
64
VCOMPLG
75
GND
39
VCCA
93
VCOMPLH
73
GND
46
VCCA
118
VPUMP
158
GND
51
VCCA
142
GND
59
VCCA
156
GND
65
VCCA
168
GND
69
VCCA
195
GND
90
VCCPLA
189
R ev i sio n 1 8
Axcelerator Family FPGAs
208
207
206
205
160
159
158
157
CQ208
Pin 1
1
2
3
4
156
155
154
153
Ceramic
Tie Bar
208-Pin CQFP
49
50
51
52
101
102
103
104
53
54
55
56
108
107
106
105
Note
For Package Manufacturing and Environmental information, visit Resource center at
http://www.microsemi.com/soc/products/rescenter/package/index.html.
R ev i si o n 1 8
3- 89
Package Pin Assignments
CQ208
CQ208
AX250 Function
Pin
Number
Bank 0
CQ208
AX250 Function
Pin
Number
AX250 Function
Pin
Number
IO43PB2F2
134
IO76PB5F5/CLKGP
77
IO02NB0F0
197
IO44NB2F2
131
IO77NB5F5/CLKHN
70
IO03NB0F0
198
IO44PB2F2
133
IO77PB5F5/CLKHP
71
IO03PB0F0
199
IO78NB5F5
66
IO12NB0F0/HCLKAN
191
IO45NB3F3
127
IO78PB5F5
67
IO12PB0F0/HCLKAP
192
IO45PB3F3
129
IO86NB5F5
62
IO13NB0F0/HCLKBN
185
IO46NB3F3
126
IO87NB5F5
60
IO13PB0F0/HCLKBP
186
IO46PB3F3
128
IO87PB5F5
61
IO48NB3F3
122
IO88NB5F5
56
Bank 1
Bank 3
IO14NB1F1/HCLKCN
180
IO48PB3F3
123
IO88PB5F5
57
IO14PB1F1/HCLKCP
181
IO50NB3F3
120
IO89NB5F5
54
IO15NB1F1/HCLKDN
174
IO50PB3F3
121
IO89PB5F5
55
IO15PB1F1/HCLKDP
175
IO55NB3F3
116
IO16NB1F1
170
IO55PB3F3
117
IO91NB6F6
47
IO16PB1F1
171
IO57NB3F3
114
IO91PB6F6
49
IO24NB1F1
165
IO57PB3F3
115
IO92NB6F6
48
IO24PB1F1
166
IO59NB3F3
110
IO92PB6F6
50
IO26NB1F1
161
IO59PB3F3
111
IO93NB6F6
42
IO26PB1F1
162
IO60NB3F3
108
IO93PB6F6
43
IO27NB1F1
159
IO60PB3F3
109
IO94PB6F6
44
IO27PB1F1
160
IO61NB3F3
106
IO96NB6F6
40
IO61PB3F3
107
IO96PB6F6
41
IO101NB6F6
35
Bank 2
3- 90
Bank 6
IO29NB2F2
151
IO29PB2F2
153
IO62NB4F4
100
IO101PB6F6
36
IO30NB2F2
152
IO62PB4F4
103
IO102PB6F6
37
IO30PB2F2
154
IO63NB4F4
101
IO103NB6F6
33
IO31PB2F2
148
IO63PB4F4
102
IO103PB6F6
34
IO32NB2F2
146
IO64NB4F4
96
IO105NB6F6
28
IO32PB2F2
147
IO64PB4F4
97
IO105PB6F6
30
IO34NB2F2
144
IO72NB4F4
91
IO106NB6F6
27
IO34PB2F2
145
IO72PB4F4
92
IO106PB6F6
29
IO39NB2F2
139
IO74NB4F4/CLKEN
87
IO39PB2F2
140
IO74PB4F4/CLKEP
88
IO107NB7F7
23
IO40PB2F2
141
IO75NB4F4/CLKFN
81
IO107PB7F7
25
IO41NB2F2
137
IO75PB4F4/CLKFP
82
IO108NB7F7
22
IO41PB2F2
138
IO108PB7F7
24
IO43NB2F2
132
IO110NB7F7
18
Bank 4
Bank 5
IO76NB5F5/CLKGN
R ev i sio n 1 8
76
Bank 7
Axcelerator Family FPGAs
CQ208
CQ208
CQ208
AX250 Function
Pin
Number
AX250 Function
Pin
Number
AX250 Function
Pin
Number
IO110PB7F7
19
GND
194
VCCIB0
200
IO112NB7F7
16
GND
196
VCCIB1
163
IO112PB7F7
17
GND
201
VCCIB1
172
IO117NB7F7
12
GND/LP
208
VCCIB2
135
IO117PB7F7
13
PRA
184
VCCIB2
149
IO119NB7F7
10
PRB
183
VCCIB3
112
IO119PB7F7
11
PRC
80
VCCIB3
124
IO121PB7F7
7
PRD
79
VCCIB4
89
IO122NB7F7
5
TCK
205
VCCIB4
98
IO122PB7F7
6
TDI
204
VCCIB5
58
IO123NB7F7
3
TDO
203
VCCIB5
68
IO123PB7F7
4
TMS
206
VCCIB6
31
TRST
207
VCCIB6
45
Dedicated I/O
GND
9
VCCA
2
VCCIB7
8
GND
15
VCCA
14
VCCIB7
20
GND
21
VCCA
38
VCCPLA
189
GND
32
VCCA
52
VCCPLB
187
GND
39
VCCA
64
VCCPLC
178
GND
46
VCCA
93
VCCPLD
176
GND
51
VCCA
118
VCCPLE
85
GND
59
VCCA
142
VCCPLF
83
GND
65
VCCA
156
VCCPLG
74
GND
69
VCCA
168
VCCPLH
72
GND
90
VCCA
195
VCOMPLA
190
GND
94
VCCDA
1
VCOMPLB
188
GND
99
VCCDA
26
VCOMPLC
179
GND
104
VCCDA
53
VCOMPLD
177
GND
113
VCCDA
63
VCOMPLE
86
GND
119
VCCDA
78
VCOMPLF
84
GND
125
VCCDA
95
VCOMPLG
75
GND
136
VCCDA
105
VCOMPLH
73
GND
143
VCCDA
130
VPUMP
158
GND
150
VCCDA
157
GND
155
VCCDA
167
GND
164
VCCDA
182
GND
169
VCCDA
202
GND
173
VCCIB0
193
R ev i si o n 1 8
3- 91
Package Pin Assignments
CQ208
CQ208
AX500 Function
Pin
Number
Bank 0
CQ208
AX500 Function
Pin
Number
AX500 Function
Pin
Number
IO61PB2F5
134
IO105PB5F10/CLKGP
77
IO03NB0F0
198
IO62NB2F5
131
IO106NB5F10/CLKHN
70
IO03PB0F0
199
IO62PB2F5
133
IO106PB5F10/CLKHP
71
IO04NB0F0
197
IO107NB5F10
66
IO19NB0F1/HCLKAN
191
IO63NB3F6
127
IO107PB5F10
67
IO19PB0F1/HCLKAP
192
IO63PB3F6
129
IO119NB5F11
62
IO20NB0F1/HCLKBN
185
IO64NB3F6
126
IO121NB5F11
60
IO20PB0F1/HCLKBP
186
IO64PB3F6
128
IO121PB5F11
61
IO66NB3F6
122
IO123NB5F11
56
Bank 1
Bank 3
IO21NB1F2/HCLKCN
180
IO66PB3F6
123
IO123PB5F11
57
IO21PB1F2/HCLKCP
181
IO68NB3F6
120
IO125NB5F11
54
IO22NB1F2/HCLKDN
174
IO68PB3F6
121
IO125PB5F11
55
IO22PB1F2/HCLKDP
175
IO77NB3F7
116
IO23NB1F2
170
IO77PB3F7
117
IO127NB6F12
47
IO23PB1F2
171
IO79NB3F7
114
IO127PB6F12
49
IO37NB1F3
165
IO79PB3F7
115
IO128NB6F12
48
IO37PB1F3
166
IO81NB3F7
110
IO128PB6F12
50
IO39NB1F3
161
IO81PB3F7
111
IO129NB6F12
42
IO39PB1F3
162
IO82NB3F7
108
IO129PB6F12
43
IO41NB1F3
159
IO82PB3F7
109
IO130PB6F12
44
IO41PB1F3
160
IO83NB3F7
106
IO132NB6F12
40
IO83PB3F7
107
IO132PB6F12
41
IO141NB6F13
35
Bank 2
3- 92
Bank 6
IO43NB2F4
151
IO43PB2F4
153
IO84PB4F8
103
IO141PB6F13
36
IO44NB2F4
152
IO85NB4F8
100
IO142PB6F13
37
IO44PB2F4
154
IO86NB4F8
101
IO143NB6F13
33
IO45PB2F4
148
IO86PB4F8
102
IO143PB6F13
34
IO46NB2F4
146
IO87NB4F8
96
IO145NB6F13
28
IO46PB2F4
147
IO87PB4F8
97
IO145PB6F13
30
IO48NB2F4
144
IO101NB4F9
91
IO146NB6F13
27
IO48PB2F4
145
IO101PB4F9
92
IO146PB6F13
29
IO57NB2F5
139
IO103NB4F9/CLKEN
87
IO57PB2F5
140
IO103PB4F9/CLKEP
88
IO147NB7F14
23
IO58PB2F5
141
IO104NB4F9/CLKFN
81
IO147PB7F14
25
IO59NB2F5
137
IO104PB4F9/CLKFP
82
IO148NB7F14
22
IO59PB2F5
138
IO148PB7F14
24
IO61NB2F5
132
IO150NB7F14
18
Bank 4
Bank 5
IO105NB5F10/CLKGN
R ev i sio n 1 8
76
Bank 7
Axcelerator Family FPGAs
CQ208
CQ208
CQ208
AX500 Function
Pin
Number
AX500 Function
Pin
Number
AX500 Function
Pin
Number
IO150PB7F14
19
GND
173
VCCIB0
200
IO152NB7F14
16
GND
194
VCCIB1
163
IO152PB7F14
17
GND
196
VCCIB1
172
IO161NB7F15
12
GND
201
VCCIB2
135
IO161PB7F15
13
GND/LP
208
VCCIB2
149
IO163NB7F15
10
PRA
184
VCCIB3
112
IO163PB7F15
11
PRB
183
VCCIB3
124
IO165PB7F15
7
PRC
80
VCCIB4
89
IO166NB7F15
5
PRD
79
VCCIB4
98
IO166PB7F15
6
TCK
205
VCCIB5
58
IO167NB7F15
3
TDI
204
VCCIB5
68
IO167PB7F15
4
TDO
203
VCCIB6
31
TMS
206
VCCIB6
45
Dedicated I/O
VCCDA
1
TRST
207
VCCIB7
8
GND
9
VCCA
2
VCCIB7
20
GND
15
VCCA
14
VCCPLA
189
GND
21
VCCA
38
VCCPLB
187
GND
32
VCCA
52
VCCPLC
178
GND
39
VCCA
64
VCCPLD
176
GND
46
VCCA
93
VCCPLE
85
GND
51
VCCA
118
VCCPLF
83
GND
59
VCCA
142
VCCPLG
74
GND
65
VCCA
156
VCCPLH
72
GND
69
VCCA
168
VCOMPLA
190
GND
90
VCCA
195
VCOMPLB
188
GND
94
VCCDA
26
VCOMPLC
179
GND
99
VCCDA
53
VCOMPLD
177
GND
104
VCCDA
63
VCOMPLE
86
GND
113
VCCDA
78
VCOMPLF
84
GND
119
VCCDA
95
VCOMPLG
75
GND
125
VCCDA
105
VCOMPLH
73
GND
136
VCCDA
130
VPUMP
158
GND
143
VCCDA
157
GND
150
VCCDA
167
GND
155
VCCDA
182
GND
164
VCCDA
202
GND
169
VCCIB0
193
R ev i si o n 1 8
3- 93
Package Pin Assignments
256
255
254
253
196
195
194
193
CQ256
Pin 1
1
2
3
4
192
191
190
189
Ceramic
Tie Bar
256-Pin CQFP
132
131
130
129
65
66
67
68
125
126
127
128
61
62
63
64
Note
For Package Manufacturing and Environmental information, visit the Resource center at
http://www.microsemi.com/soc/products/solutions/package/docs.aspx.
3- 94
R ev i sio n 1 8
Axcelerator Family FPGAs
CQ256
AX2000 Function
CQ256
Pin
Number
Bank 0
CQ256
AX2000 Function
Pin
Number
AX2000 Function
Pin
Number
IO87PB2F8
188
IO149PB3F13
137
IO89PB2F8
186
IO01NB0F0
248
IO01PB0F0
249
IO04NB0F0
246
IO107NB2F10
IO04PB0F0
247
IO05NB0F0
Bank 3
IO165NB3F15
135
184
IO167NB3F15
133
IO107PB2F10
185
IO167PB3F15
134
242
IO110NB2F10
180
IO05PB0F0
243
IO110PB2F10
181
IO181NB4F17
124
IO08NB0F0
240
IO111NB2F10
178
IO181PB4F17
125
IO08PB0F0
241
IO111PB2F10
179
IO182NB4F17
122
IO112NB2F10
174
IO182PB4F17
123
Bank 0
Bank 2
Bank 4
IO37NB0F3
234
IO112PB2F10
175
IO183NB4F17
118
IO37PB0F3
235
IO113NB2F10
172
IO183PB4F17
119
IO41NB0F3/HCLKAN
232
IO113PB2F10
173
IO184NB4F17
116
IO41PB0F3/HCLKAP
233
IO114NB2F10
168
IO184PB4F17
117
IO42NB0F3/HCLKBN
228
IO114PB2F10
169
IO190NB4F17
112
IO42PB0F3/HCLKBP
229
IO115NB2F10
166
IO190PB4F17
113
IO115PB2F10
167
IO192NB4F17
110
IO192PB4F17
111
Bank 1 IO43NB1F4/HCLKCN
220
IO117NB2F10
162
IO43PB1F4/HCLKCP
221
IO117PB2F10
163
IO44NB1F4/HCLKDN
216
IO44PB1F4/HCLKDP
217
Bank 1
Bank 3
Bank 4
IO212NB4F19/CLKEN
104
IO139NB3F13
158
IO212PB4F19/CLKEP
105
IO139PB3F13
159
IO213NB4F19/CLKFN
100
IO213PB4F19/CLKFP
101
IO65NB1F6
210
IO141NB3F13
154
IO65PB1F6
211
IO141PB3F13
155
IO69NB1F6
208
IO142NB3F13
152
IO214NB5F20/CLKGN
92
IO69PB1F6
209
IO142PB3F13
153
IO214PB5F20/CLKGP
93
IO70NB1F6
199
IO145NB3F13
148
IO215NB5F20/CLKHN
88
IO71NB1F6
204
IO145PB3F13
149
IO215PB5F20/CLKHP
89
IO71PB1F6
205
IO146NB3F13
146
IO73NB1F6
202
IO146PB3F13
147
IO236NB5F22
82
IO73PB1F6
203
IO147NB3F13
140
IO236PB5F22
83
IO74NB1F6
197
IO147PB3F13
141
IO238NB5F22
80
IO74PB1F6
198
IO148NB3F13
142
IO238PB5F22
81
IO148PB3F13
143
IO240NB5F22
76
IO149NB3F13
136
IO240PB5F22
77
Bank 2
IO87NB2F8
187
R ev i si o n 1 8
Bank 5
Bank 5
3- 95
Package Pin Assignments
CQ256
CQ256
AX2000 Function
Pin
Number
AX2000 Function
Pin
Number
AX2000 Function
Pin
Number
IO242NB5F22
74
IO315PB7F29
21
GND
121
IO242PB5F22
75
IO316NB7F29
18
GND
128
IO243NB5F22
70
IO316PB7F29
19
GND
129
IO243PB5F22
71
IO317NB7F29
14
GND
132
IO244NB5F22
68
IO317PB7F29
15
GND
139
IO244PB5F22
69
IO318NB7F29
12
GND
145
IO318PB7F29
13
GND
151
Bank 6
IO257PB6F24
60
IO320NB7F29
8
GND
157
IO258NB6F24
58
IO320PB7F29
9
GND
161
IO258PB6F24
59
GND
165
Bank 6
Bank 7
IO341NB7F31
6
GND
171
IO341PB7F31
7
GND
177
GND
183
IO279NB6F26
56
IO279PB6F26
57
Dedicated I/O
IO280NB6F26
52
GND
1
GND
190
IO280PB6F26
53
GND
5
GND
192
IO281NB6F26
50
GND
11
GND
193
IO281PB6F26
51
GND
17
GND
201
IO282NB6F26
46
GND
23
GND
207
IO282PB6F26
47
GND
29
GND
213
IO284NB6F26
44
GND
33
GND
219
IO284PB6F26
45
GND
37
GND
225
IO285NB6F26
40
GND
43
GND
231
IO285PB6F26
41
GND
49
GND
239
IO286NB6F26
38
GND
55
GND
245
IO286PB6F26
39
GND
62
GND
256
IO287NB6F26
34
GND
64
PRA
227
IO287PB6F26
35
GND
65
PRB
226
GND
73
PRC
99
Bank 7 9
3- 96
CQ256
IO310NB7F29
30
GND
79
PRD
98
IO310PB7F29
31
GND
85
TCK
253
IO311NB7F29
26
GND
91
TDI
252
IO311PB7F29
27
GND
97
TDO
250
IO312NB7F29
24
GND
103
TMS
254
IO312PB7F29
25
GND
109
TRST
255
IO315NB7F29
20
GND
115
VCCA
3
R ev i sio n 1 8
Axcelerator Family FPGAs
CQ256
CQ256
AX2000 Function
Pin
Number
AX2000 Function
Pin
Number
VCCA
4
VCCDA
224
VCCA
22
VCCDA
236
VCCA
42
VCCDA
237
VCCA
61
VCCDA
251
VCCA
63
VCCIB0
230
VCCA
84
VCCIB0
244
VCCA
108
VCCIB1
200
VCCA
127
VCCIB1
206
VCCA
131
VCCIB1
218
VCCA
150
VCCIB2
164
VCCA
170
VCCIB2
176
VCCA
189
VCCIB2
182
VCCA
191
VCCIB3
138
VCCA
212
VCCIB3
144
VCCA
238
VCCIB3
156
VCCDA
2
VCCIB4
102
VCCDA
32
VCCIB4
114
VCCDA
66
VCCIB4
120
VCCDA
67
VCCIB5
72
VCCDA
86
VCCIB5
78
VCCDA
87
VCCIB5
90
VCCDA
94
VCCIB6
36
VCCDA
95
VCCIB6
48
VCCDA
96
VCCIB6
54
VCCDA
106
VCCIB7
10
VCCDA
107
VCCIB7
16
VCCDA
126
VCCIB7
28
VCCDA
130
VPUMP
195
VCCDA
160
VCCDA
194
VCCDA
196
VCCDA
214
VCCDA
215
VCCDA
222
VCCDA
223
R ev i si o n 1 8
3- 97
Package Pin Assignments
268
267
266
265
339
338
337
336
335
334
333
332
331
352
351
350
349
CQ352
Pin 1
1
2
3
4
264
263
262
261
Ceramic
Tie Bar
41
42
43
44
45
46
47
48
49
223
222
221
220
219
218
217
216
215
352-Pin CQFP
180
179
178
177
173
174
175
176
127
128
129
130
131
132
133
134
135
89
90
91
92
85
86
87
88
Note
For Package Manufacturing and Environmental information, visit Resource center at
http://www.microsemi.com/soc/products/rescenter/package/index.html.
3- 98
R ev i sio n 1 8
Axcelerator Family FPGAs
CQ352
AX250 Function
CQ352
Pin
Number
Bank 0
CQ352
AX250 Function
Pin
Number
IO24NB1F1
275
AX250 Function
Pin
Number
Bank 3
IO00NB0F0
341
IO24PB1F1
276
IO45NB3F3
217
IO00PB0F0
342
IO25NB1F1
271
IO45PB3F3
218
IO01NB0F0
343
IO25PB1F1
272
IO46NB3F3
219
IO02NB0F0
337
IO27NB1F1
269
IO46PB3F3
220
IO02PB0F0
338
IO27PB1F1
270
IO47NB3F3
213
IO04NB0F0
335
IO47PB3F3
214
IO04PB0F0
336
IO29NB2F2
261
IO48NB3F3
211
IO06NB0F0
331
IO29PB2F2
262
IO48PB3F3
212
IO06PB0F0
332
IO30NB2F2
259
IO49NB3F3
207
IO08NB0F0
325
IO30PB2F2
260
IO49PB3F3
208
IO08PB0F0
326
IO31NB2F2
255
IO51NB3F3
205
IO10NB0F0
323
IO31PB2F2
256
IO51PB3F3
206
IO10PB0F0
324
IO33NB2F2
249
IO52NB3F3
201
IO12NB0F0/HCLKAN
319
IO33PB2F2
250
IO52PB3F3
202
IO12PB0F0/HCLKAP
320
IO34NB2F2
253
IO53NB3F3
199
IO13NB0F0/HCLKBN
313
IO34PB2F2
254
IO53PB3F3
200
IO13PB0F0/HCLKBP
314
IO35NB2F2
247
IO54NB3F3
195
IO35PB2F2
248
IO54PB3F3
196
Bank 1
Bank 2
IO14NB1F1/HCLKCN
305
IO36NB2F2
243
IO55NB3F3
193
IO14PB1F1/HCLKCP
306
IO36PB2F2
244
IO55PB3F3
194
IO15NB1F1/HCLKDN
299
IO37NB2F2
241
IO56NB3F3
187
IO15PB1F1/HCLKDP
300
IO37PB2F2
242
IO56PB3F3
188
IO16NB1F1
289
IO38NB2F2
237
IO57NB3F3
189
IO16PB1F1
290
IO38PB2F2
238
IO57PB3F3
190
IO17NB1F1
295
IO39NB2F2
235
IO59NB3F3
183
IO17PB1F1
296
IO39PB2F2
236
IO59PB3F3
184
IO18NB1F1
287
IO41NB2F2
231
IO60NB3F3
181
IO18PB1F1
288
IO41PB2F2
232
IO60PB3F3
182
IO20NB1F1
283
IO42NB2F2
229
IO61NB3F3
179
IO20PB1F1
284
IO42PB2F2
230
IO61PB3F3
180
IO22NB1F1
277
IO43NB2F2
225
IO22PB1F1
278
IO43PB2F2
226
IO62NB4F4
172
IO23NB1F1
281
IO44NB2F2
223
IO62PB4F4
173
IO23PB1F1
282
IO44PB2F2
224
IO64NB4F4
166
R ev i si o n 1 8
Bank 4
3- 99
Package Pin Assignments
CQ352
CQ352
CQ352
AX250 Function
Pin
Number
AX250 Function
Pin
Number
AX250 Function
Pin
Number
IO64PB4F4
167
IO85PB5F5
105
IO106NB6F6
46
IO65NB4F4
170
IO86NB5F5
98
IO106PB6F6
47
IO65PB4F4
171
IO86PB5F5
99
Bank 7
IO66NB4F4
164
IO87NB5F5
94
IO107NB7F7
40
IO66PB4F4
165
IO87PB5F5
95
IO107PB7F7
41
IO67NB4F4
160
IO89NB5F5
92
IO108NB7F7
42
IO67PB4F4
161
IO89PB5F5
93
IO108PB7F7
43
IO68NB4F4
158
IO109NB7F7
36
IO68PB4F4
159
IO90PB6F6
86
IO109PB7F7
37
IO70NB4F4
154
IO91NB6F6
84
IO110NB7F7
34
IO70PB4F4
155
IO91PB6F6
85
IO110PB7F7
35
IO72NB4F4
152
IO92NB6F6
78
IO111NB7F7
30
IO72PB4F4
153
IO92PB6F6
79
IO111PB7F7
31
IO73NB4F4
146
IO93NB6F6
82
IO113NB7F7
28
IO73PB4F4
147
IO93PB6F6
83
IO113PB7F7
29
IO74NB4F4/CLKEN
142
IO95NB6F6
76
IO114NB7F7
24
IO74PB4F4/CLKEP
143
IO95PB6F6
77
IO114PB7F7
25
IO75NB4F4/CLKFN
136
IO96NB6F6
72
IO115NB7F7
22
IO75PB4F4/CLKFP
137
IO96PB6F6
73
IO115PB7F7
23
IO97NB6F6
70
IO116NB7F7
18
Bank 5
Bank 6
IO76NB5F5/CLKGN
128
IO97PB6F6
71
IO116PB7F7
19
IO76PB5F5/CLKGP
129
IO98NB6F6
66
IO117NB7F7
16
IO77NB5F5/CLKHN
122
IO98PB6F6
67
IO117PB7F7
17
IO77PB5F5/CLKHP
123
IO99NB6F6
64
IO118NB7F7
12
IO78NB5F5
112
IO99PB6F6
65
IO118PB7F7
13
IO78PB5F5
113
IO100NB6F6
60
IO119NB7F7
10
IO79NB5F5
118
IO100PB6F6
61
IO119PB7F7
11
IO79PB5F5
119
IO101NB6F6
58
IO121NB7F7
6
IO80NB5F5
110
IO101PB6F6
59
IO121PB7F7
7
IO80PB5F5
111
IO103NB6F6
54
IO123NB7F7
4
IO82NB5F5
106
IO103PB6F6
55
IO123PB7F7
5
IO82PB5F5
107
IO104NB6F6
52
Dedicated I/O
IO84NB5F5
100
IO104PB6F6
53
GND
1
IO84PB5F5
101
IO105NB6F6
48
GND
9
IO85NB5F5
104
IO105PB6F6
49
GND
15
3- 10 0
R ev isio n 1 8
Axcelerator Family FPGAs
CQ352
CQ352
CQ352
AX250 Function
Pin
Number
AX250 Function
Pin
Number
AX250 Function
Pin
Number
GND
21
GND
240
TDI
348
GND
27
GND
246
TDO
347
GND
33
GND
252
TMS
350
GND
39
GND
258
TRST
351
GND
45
GND
264
VCCA
3
GND
51
GND
265
VCCA
14
GND
57
GND
274
VCCA
32
GND
63
GND
280
VCCA
56
GND
69
GND
286
VCCA
74
GND
75
GND
292
VCCA
87
GND
81
GND
298
VCCA
102
GND
88
GND
310
VCCA
114
GND
89
GND
322
VCCA
150
GND
97
GND
330
VCCA
162
GND
103
GND
334
VCCA
175
GND
109
GND
340
VCCA
191
GND
115
GND
345
VCCA
209
GND
121
GND
352
VCCA
233
GND
133
NC
91
VCCA
251
GND
145
NC
117
VCCA
263
GND
151
NC
130
VCCA
279
GND
157
NC
131
VCCA
291
GND
163
NC
148
VCCA
329
GND
169
NC
174
VCCA
339
GND
176
NC
268
VCCDA
2
GND
177
NC
294
VCCDA
44
GND
186
NC
307
VCCDA
90
GND
192
NC
308
VCCDA
116
GND
198
NC
327
VCCDA
132
GND
204
NC
328
VCCDA
149
GND
210
PRA
312
VCCDA
178
GND
216
PRB
311
VCCDA
221
GND
222
PRC
135
VCCDA
266
GND
228
PRD
134
VCCDA
293
GND
234
TCK
349
VCCDA
309
R ev i si o n 1 8
3- 101
Package Pin Assignments
CQ352
CQ352
3- 10 2
AX250 Function
Pin
Number
AX250 Function
Pin
Number
VCCDA
346
VCCPLG
126
VCCIB0
321
VCCPLH
124
VCCIB0
333
VCOMPLA
318
VCCIB0
344
VCOMPLB
316
VCCIB1
273
VCOMPLC
304
VCCIB1
285
VCOMPLD
302
VCCIB1
297
VCOMPLE
141
VCCIB2
227
VCOMPLF
139
VCCIB2
239
VCOMPLG
127
VCCIB2
245
VCOMPLH
125
VCCIB2
257
VPUMP
267
VCCIB3
185
VCCIB3
197
VCCIB3
203
VCCIB3
215
VCCIB4
144
VCCIB4
156
VCCIB4
168
VCCIB5
96
VCCIB5
108
VCCIB5
120
VCCIB6
50
VCCIB6
62
VCCIB6
68
VCCIB6
80
VCCIB7
8
VCCIB7
20
VCCIB7
26
VCCIB7
38
VCCPLA
317
VCCPLB
315
VCCPLC
303
VCCPLD
301
VCCPLE
140
VCCPLF
138
R ev isio n 1 8
Axcelerator Family FPGAs
CQ352
AX500 Function
CQ352
Pin
Number
Bank 0
CQ352
AX500 Function
Pin
Number
IO35NB1F3
275
AX500 Function
Pin
Number
Bank 3
IO00PB0F0
343
IO35PB1F3
276
IO63NB3F6
217
IO03NB0F0
341
IO37NB1F3
271
IO63PB3F6
218
IO03PB0F0
342
IO37PB1F3
272
IO64NB3F6
219
IO05NB0F0
337
IO41NB1F3
269
IO64PB3F6
220
IO05PB0F0
338
IO41PB1F3
270
IO65NB3F6
213
IO07NB0F0
335
IO65PB3F6
214
IO07PB0F0
336
IO43NB2F4
261
IO67NB3F6
207
IO09NB0F0
331
IO43PB2F4
262
IO67PB3F6
208
IO09PB0F0
332
IO45NB2F4
259
IO68NB3F6
211
IO15NB0F1
325
IO45PB2F4
260
IO68PB3F6
212
IO15PB0F1
326
IO47NB2F4
255
IO69NB3F6
205
IO17NB0F1
323
IO47PB2F4
256
IO69PB3F6
206
IO17PB0F1
324
IO49NB2F4
253
IO71NB3F6
201
IO19NB0F1/HCLKAN
319
IO49PB2F4
254
IO71PB3F6
202
IO19PB0F1/HCLKAP
320
IO50NB2F4
247
IO73NB3F6
199
IO20NB0F1/HCLKBN
313
IO50PB2F4
248
IO73PB3F6
200
IO20PB0F1/HCLKBP
314
IO51NB2F4
249
IO75NB3F7
193
IO51PB2F4
250
IO75PB3F7
194
Bank 1
Bank 2
IO21NB1F2/HCLKCN
305
IO53NB2F5
243
IO76NB3F7
195
IO21PB1F2/HCLKCP
306
IO53PB2F5
244
IO76PB3F7
196
IO22NB1F2/HCLKDN
299
IO54NB2F5
241
IO77NB3F7
189
IO22PB1F2/HCLKDP
300
IO54PB2F5
242
IO77PB3F7
190
IO23NB1F2
289
IO55NB2F5
237
IO79NB3F7
187
IO23PB1F2
290
IO55PB2F5
238
IO79PB3F7
188
IO24NB1F2
295
IO57NB2F5
235
IO80NB3F7
183
IO24PB1F2
296
IO57PB2F5
236
IO80PB3F7
184
IO25NB1F2
287
IO58NB2F5
231
IO81NB3F7
181
IO25PB1F2
288
IO58PB2F5
232
IO81PB3F7
182
IO27NB1F2
283
IO59NB2F5
229
IO83NB3F7
179
IO27PB1F2
284
IO59PB2F5
230
IO83PB3F7
180
IO29NB1F2
281
IO61NB2F5
225
IO29PB1F2
282
IO61PB2F5
226
IO85NB4F8
172
IO31NB1F2
277
IO62NB2F5
223
IO85PB4F8
173
IO31PB1F2
278
IO62PB2F5
224
IO87NB4F8
170
R ev i si o n 1 8
Bank 4
3- 103
Package Pin Assignments
CQ352
CQ352
CQ352
AX500 Function
Pin
Number
AX500 Function
Pin
Number
AX500 Function
Pin
Number
IO87PB4F8
171
IO119PB5F11
101
IO146NB6F13
46
IO89NB4F8
166
IO121NB5F11
98
IO146PB6F13
47
IO89PB4F8
167
IO121PB5F11
99
IO94NB4F9
164
IO123NB5F11
94
IO147NB7F14
40
IO94PB4F9
165
IO123PB5F11
95
IO147PB7F14
41
IO95NB4F9
160
IO125NB5F11
92
IO148NB7F14
42
IO95PB4F9
161
IO125PB5F11
93
IO148PB7F14
43
IO97NB4F9
158
IO149NB7F14
36
IO97PB4F9
159
IO126PB6F12
86
IO149PB7F14
37
IO99NB4F9
154
IO127NB6F12
84
IO151NB7F14
30
IO99PB4F9
155
IO127PB6F12
85
IO151PB7F14
31
IO100NB4F9
146
IO129NB6F12
82
IO152NB7F14
34
IO100PB4F9
147
IO129PB6F12
83
IO152PB7F14
35
IO101NB4F9
152
IO131NB6F12
78
IO153NB7F14
28
IO101PB4F9
153
IO131PB6F12
79
IO153PB7F14
29
IO103NB4F9/CLKEN
142
IO133NB6F12
76
IO155NB7F14
24
IO103PB4F9/CLKEP
143
IO133PB6F12
77
IO155PB7F14
25
IO104NB4F9/CLKFN
136
IO134NB6F12
72
IO157NB7F14
22
IO104PB4F9/CLKFP
137
IO134PB6F12
73
IO157PB7F14
23
IO135NB6F12
70
IO159NB7F15
16
Bank 5
Bank 6
Bank 7
IO105NB5F10/CLKGN
128
IO135PB6F12
71
IO159PB7F15
17
IO105PB5F10/CLKGP
129
IO137NB6F13
66
IO160NB7F15
18
IO106NB5F10/CLKHN
122
IO137PB6F13
67
IO160PB7F15
19
IO106PB5F10/CLKHP
123
IO138NB6F13
64
IO161NB7F15
12
IO107NB5F10
118
IO138PB6F13
65
IO161PB7F15
13
IO107PB5F10
119
IO139NB6F13
60
IO163NB7F15
10
IO114NB5F11
112
IO139PB6F13
61
IO163PB7F15
11
IO114PB5F11
113
IO141NB6F13
54
IO165NB7F15
6
IO115NB5F11
110
IO141PB6F13
55
IO165PB7F15
7
IO115PB5F11
111
IO142NB6F13
58
IO167NB7F15
4
IO116NB5F11
106
IO142PB6F13
59
IO167PB7F15
5
IO116PB5F11
107
IO143NB6F13
52
Dedicated I/O
IO117NB5F11
104
IO143PB6F13
53
GND
1
IO117PB5F11
105
IO145NB6F13
48
GND
9
IO119NB5F11
100
IO145PB6F13
49
GND
15
3- 10 4
R ev isio n 1 8
Axcelerator Family FPGAs
CQ352
CQ352
CQ352
AX500 Function
Pin
Number
AX500 Function
Pin
Number
AX500 Function
Pin
Number
GND
21
GND
240
TDI
348
GND
27
GND
246
TDO
347
GND
33
GND
252
TMS
350
GND
39
GND
258
TRST
351
GND
45
GND
264
VCCA
3
GND
51
GND
265
VCCA
14
GND
57
GND
274
VCCA
32
GND
63
GND
280
VCCA
56
GND
69
GND
286
VCCA
74
GND
75
GND
292
VCCA
87
GND
81
GND
298
VCCA
102
GND
88
GND
310
VCCA
114
GND
89
GND
322
VCCA
150
GND
97
GND
330
VCCA
162
GND
103
GND
334
VCCA
175
GND
109
GND
340
VCCA
191
GND
115
GND
345
VCCA
209
GND
121
GND/LP
352
VCCA
233
GND
133
NC
91
VCCA
251
GND
145
NC
117
VCCA
263
GND
151
NC
130
VCCA
279
GND
157
NC
131
VCCA
291
GND
163
NC
148
VCCA
329
GND
169
NC
174
VCCA
339
GND
176
NC
268
VCCDA
2
GND
177
NC
294
VCCDA
44
GND
186
NC
307
VCCDA
90
GND
192
NC
308
VCCDA
116
GND
198
NC
327
VCCDA
132
GND
204
NC
328
VCCDA
149
GND
210
PRA
312
VCCDA
178
GND
216
PRB
311
VCCDA
221
GND
222
PRC
135
VCCDA
266
GND
228
PRD
134
VCCDA
293
GND
234
TCK
349
VCCDA
309
R ev i si o n 1 8
3- 105
Package Pin Assignments
CQ352
CQ352
3- 10 6
AX500 Function
Pin
Number
AX500 Function
Pin
Number
VCCDA
346
VCCPLG
126
VCCIB0
321
VCCPLH
124
VCCIB0
333
VCOMPLA
318
VCCIB0
344
VCOMPLB
316
VCCIB1
273
VCOMPLC
304
VCCIB1
285
VCOMPLD
302
VCCIB1
297
VCOMPLE
141
VCCIB2
227
VCOMPLF
139
VCCIB2
239
VCOMPLG
127
VCCIB2
245
VCOMPLH
125
VCCIB2
257
VPUMP
267
VCCIB3
185
VCCIB3
197
VCCIB3
203
VCCIB3
215
VCCIB4
144
VCCIB4
156
VCCIB4
168
VCCIB5
96
VCCIB5
108
VCCIB5
120
VCCIB6
50
VCCIB6
62
VCCIB6
68
VCCIB6
80
VCCIB7
8
VCCIB7
20
VCCIB7
26
VCCIB7
38
VCCPLA
317
VCCPLB
315
VCCPLC
303
VCCPLD
301
VCCPLE
140
VCCPLF
138
R ev isio n 1 8
Axcelerator Family FPGAs
CQ352
AX1000 Function
CQ352
Pin
Number
Bank 0
CQ352
AX1000 Function
Pin
Number
IO60NB1F5
275
AX1000 Function
Pin
Number
Bank 3
IO02NB0F0
341
IO60PB1F5
276
IO96NB3F9
217
IO02PB0F0
342
IO61NB1F5
271
IO96PB3F9
218
IO03PB0F0
343
IO61PB1F5
272
IO97NB3F9
219
IO04NB0F0
337
IO63NB1F5
269
IO97PB3F9
220
IO04PB0F0
338
IO63PB1F5
270
IO99NB3F9
213
IO08NB0F0
331
IO99PB3F9
214
IO08PB0F0
332
IO64NB2F6
259
IO108NB3F10
211
IO09NB0F0
335
IO64PB2F6
260
IO108PB3F10
212
IO09PB0F0
336
IO67NB2F6
261
IO109NB3F10
207
IO24NB0F2
325
IO67PB2F6
262
IO109PB3F10
208
IO24PB0F2
326
IO68NB2F6
255
IO111NB3F10
205
IO25NB0F2
323
IO68PB2F6
256
IO111PB3F10
206
IO25PB0F2
324
IO69NB2F6
253
IO112NB3F10
199
IO30NB0F2/HCLKAN
319
IO69PB2F6
254
IO112PB3F10
200
IO30PB0F2/HCLKAP
320
IO74NB2F7
249
IO113NB3F10
201
IO31NB0F2/HCLKBN
313
IO74PB2F7
250
IO113PB3F10
202
IO31PB0F2/HCLKBP
314
IO75NB2F7
247
IO115NB3F10
195
IO75PB2F7
248
IO115PB3F10
196
Bank 1
Bank 2
IO32NB1F3/HCLKCN
305
IO76NB2F7
243
IO116NB3F10
193
IO32PB1F3/HCLKCP
306
IO76PB2F7
244
IO116PB3F10
194
IO33NB1F3/HCLKDN
299
IO77NB2F7
241
IO117NB3F10
189
IO33PB1F3/HCLKDP
300
IO77PB2F7
242
IO117PB3F10
190
IO38NB1F3
295
IO78NB2F7
237
IO124NB3F11
183
IO38PB1F3
296
IO78PB2F7
238
IO124PB3F11
184
IO54NB1F5
287
IO79NB2F7
235
IO125NB3F11
187
IO54PB1F5
288
IO79PB2F7
236
IO125PB3F11
188
IO55NB1F5
289
IO82NB2F7
231
IO127NB3F11
181
IO55PB1F5
290
IO82PB2F7
232
IO127PB3F11
182
IO56NB1F5
281
IO83NB2F7
229
IO128NB3F11
179
IO56PB1F5
282
IO83PB2F7
230
IO128PB3F11
180
IO57NB1F5
283
IO94NB2F8
225
IO57PB1F5
284
IO94PB2F8
226
IO130NB4F12
172
IO59NB1F5
277
IO95NB2F8
223
IO130PB4F12
173
IO59PB1F5
278
IO95PB2F8
224
IO131NB4F12
170
R ev i si o n 1 8
Bank 4
3- 107
Package Pin Assignments
CQ352
CQ352
CQ352
AX1000 Function
Pin
Number
AX1000 Function
Pin
Number
AX1000 Function
Pin
Number
IO131PB4F12
171
IO187PB5F17
99
IO224NB6F20
46
IO132NB4F12
166
IO188NB5F17
100
IO224PB6F20
47
IO132PB4F12
167
IO188PB5F17
101
IO133NB4F12
164
IO190NB5F17
94
IO225NB7F21
40
IO133PB4F12
165
IO190PB5F17
95
IO225PB7F21
41
IO134NB4F12
160
IO192NB5F17
92
IO226NB7F21
42
IO134PB4F12
161
IO192PB5F17
93
IO226PB7F21
43
IO136NB4F12
158
IO237NB7F22
34
IO136PB4F12
159
IO193PB6F18
86
IO237PB7F22
35
IO137NB4F12
154
IO194NB6F18
84
IO238NB7F22
36
IO137PB4F12
155
IO194PB6F18
85
IO238PB7F22
37
IO138NB4F12
152
IO196NB6F18
78
IO240NB7F22
30
IO138PB4F12
153
IO196PB6F18
79
IO240PB7F22
31
IO153NB4F14
146
IO197NB6F18
82
IO241NB7F22
28
IO153PB4F14
147
IO197PB6F18
83
IO241PB7F22
29
IO159NB4F14/CLKEN
142
IO198NB6F18
76
IO242NB7F22
24
IO159PB4F14/CLKEP
143
IO198PB6F18
77
IO242PB7F22
25
IO160NB4F14/CLKFN
136
IO203NB6F19
72
IO244NB7F22
22
IO160PB4F14/CLKFP
137
IO203PB6F19
73
IO244PB7F22
23
IO204NB6F19
70
IO245NB7F22
18
Bank 5
Bank 6
Bank 7
IO161NB5F15/CLKGN
128
IO204PB6F19
71
IO245PB7F22
19
IO161PB5F15/CLKGP
129
IO205NB6F19
66
IO246NB7F22
16
IO162NB5F15/CLKHN
122
IO205PB6F19
67
IO246PB7F22
17
IO162PB5F15/CLKHP
123
IO206NB6F19
64
IO249NB7F23
12
IO167NB5F15
118
IO206PB6F19
65
IO249PB7F23
13
IO167PB5F15
119
IO207NB6F19
60
IO250NB7F23
10
IO183NB5F17
110
IO207PB6F19
61
IO250PB7F23
11
IO183PB5F17
111
IO208NB6F19
58
IO256NB7F23
4
IO184NB5F17
112
IO208PB6F19
59
IO256PB7F23
5
IO184PB5F17
113
IO211NB6F19
54
IO257NB7F23
6
IO185NB5F17
104
IO211PB6F19
55
IO257PB7F23
7
IO185PB5F17
105
IO212NB6F19
52
Dedicated I/O
IO186NB5F17
106
IO212PB6F19
53
GND
1
IO186PB5F17
107
IO223NB6F20
48
GND
9
IO187NB5F17
98
IO223PB6F20
49
GND
15
3- 10 8
R ev isio n 1 8
Axcelerator Family FPGAs
CQ352
CQ352
CQ352
AX1000 Function
Pin
Number
AX1000 Function
Pin
Number
AX1000 Function
Pin
Number
GND
21
GND
240
VCCA
14
GND
27
GND
246
VCCA
32
GND
33
GND
252
VCCA
56
GND
39
GND
258
VCCA
74
GND
45
GND
264
VCCA
87
GND
51
GND
265
VCCA
102
GND
57
GND
274
VCCA
114
GND
63
GND
280
VCCA
150
GND
69
GND
286
VCCA
162
GND
75
GND
292
VCCA
175
GND
81
GND
298
VCCA
191
GND
88
GND
310
VCCA
209
GND
89
GND
322
VCCA
233
GND
97
GND
330
VCCA
251
GND
103
GND
334
VCCA
263
GND
109
GND
340
VCCA
279
GND
115
GND
345
VCCA
291
GND
121
GND
352
VCCA
329
GND
133
NC
91
VCCA
339
GND
145
NC
130
VCCDA
2
GND
151
NC
131
VCCDA
44
GND
157
NC
174
VCCDA
90
GND
163
NC
268
VCCDA
116
GND
169
NC
307
VCCDA
117
GND
176
NC
308
VCCDA
132
GND
177
PRA
312
VCCDA
148
GND
186
PRB
311
VCCDA
149
GND
192
PRC
135
VCCDA
178
GND
198
PRD
134
VCCDA
221
GND
204
TCK
349
VCCDA
266
GND
210
TDI
348
VCCDA
293
GND
216
TDO
347
VCCDA
294
GND
222
TMS
350
VCCDA
309
GND
228
TRST
351
VCCDA
327
GND
234
VCCA
3
VCCDA
328
R ev i si o n 1 8
3- 109
Package Pin Assignments
CQ352
CQ352
AX1000 Function
Pin
Number
AX1000 Function
Pin
Number
VCCDA
346
VCCPLG
126
VCCIB0
321
VCCPLH
124
VCCIB0
333
VCOMPLA
318
VCCIB0
344
VCOMPLB
316
VCCIB1
273
VCOMPLC
304
VCCIB1
285
VCOMPLD
302
VCCIB1
297
VCOMPLE
141
VCCIB2
227
VCOMPLF
139
VCCIB2
239
VCOMPLG
127
VCCIB2
245
VCOMPLH
125
VCCIB2
257
VPUMP
267
VCCIB3
185
VCCIB3
197
VCCIB3
203
VCCIB3
215
VCCIB4
144
VCCIB4
156
VCCIB4
168
VCCIB5
96
VCCIB5
108
VCCIB5
120
VCCIB6
50
VCCIB6
62
VCCIB6
68
VCCIB6
80
VCCIB7
8
VCCIB7
20
VCCIB7
26
VCCIB7
38
VCCPLA
317
VCCPLB
315
VCCPLC
303
VCCPLD
301
VCCPLE
140
VCCPLF
138
3- 11 0
R ev isio n 1 8
Axcelerator Family FPGAs
CQ352
AX2000 Function
CQ352
Pin
Number
Bank 0
CQ352
AX2000 Function
Pin
Number
IO71NB1F6
277
AX2000 Function
Pin
Number
Bank 3
IO01NB0F0
341
IO71PB1F6
278
IO129NB3F12
219
IO01PB0F0
342
IO73NB1F6
269
IO129PB3F12
220
IO02PB0F0
343
IO73PB1F6
270
IO132NB3F12
217
IO04NB0F0
337
IO74NB1F6
271
IO132PB3F12
218
IO04PB0F0
338
IO74PB1F6
272
IO137NB3F12
213
IO05NB0F0
335
IO137PB3F12
214
IO05PB0F0
336
IO87NB2F8
261
IO139NB3F13
211
IO08NB0F0
331
IO87PB2F8
262
IO139PB3F13
212
IO08PB0F0
332
IO88NB2F8
255
IO141NB3F13
205
IO37NB0F3
325
IO88PB2F8
256
IO141PB3F13
206
IO37PB0F3
326
IO89NB2F8
259
IO142NB3F13
207
IO38NB0F3
323
IO89PB2F8
260
IO142PB3F13
208
IO38PB0F3
324
IO91NB2F8
253
IO145NB3F13
199
IO41NB0F3/HCLKAN
319
IO91PB2F8
254
IO145PB3F13
200
IO41PB0F3/HCLKAP
320
IO99NB2F9
249
IO146NB3F13
201
IO42NB0F3/HCLKBN
313
IO99PB2F9
250
IO146PB3F13
202
IO42PB0F3/HCLKBP
314
IO100NB2F9
247
IO147NB3F13
193
IO100PB2F9
248
IO147PB3F13
194
Bank 1
Bank 2
IO43NB1F4/HCLKCN
305
IO107NB2F10
243
IO148NB3F13
195
IO43PB1F4/HCLKCP
306
IO107PB2F10
244
IO148PB3F13
196
IO44NB1F4/HCLKDN
299
IO110NB2F10
241
IO149NB3F13
189
IO44PB1F4/HCLKDP
300
IO110PB2F10
242
IO149PB3F13
190
IO48NB1F4
295
IO111NB2F10
237
IO161NB3F15
183
IO48PB1F4
296
IO111PB2F10
238
IO161PB3F15
184
IO65NB1F6
283
IO112NB2F10
235
IO163NB3F15
187
IO65PB1F6
284
IO112PB2F10
236
IO163PB3F15
188
IO66NB1F6
289
IO113NB2F10
231
IO165NB3F15
181
IO66PB1F6
290
IO113PB2F10
232
IO165PB3F15
182
IO68NB1F6
287
IO114NB2F10
229
IO167NB3F15
179
IO68PB1F6
288
IO114PB2F10
230
IO167PB3F15
180
IO69NB1F6
275
IO115NB2F10
225
IO69PB1F6
276
IO115PB2F10
226
IO181NB4F17
172
IO70NB1F6
281
IO117NB2F10
223
IO181PB4F17
173
IO70PB1F6
282
IO117PB2F10
224
IO182NB4F17
170
R ev i si o n 1 8
Bank 4
3- 111
Package Pin Assignments
CQ352
CQ352
CQ352
AX2000 Function
Pin
Number
AX2000 Function
Pin
Number
AX2000 Function
Pin
Number
IO182PB4F17
171
IO240PB5F22
101
IO296NB6F27
46
IO183NB4F17
166
IO242NB5F22
94
IO296PB6F27
47
IO183PB4F17
167
IO242PB5F22
95
IO184NB4F17
164
IO243NB5F22
98
IO300NB7F28
42
IO184PB4F17
165
IO243PB5F22
99
IO300PB7F28
43
IO185NB4F17
160
IO244NB5F22
92
IO303NB7F28
40
IO185PB4F17
161
IO244PB5F22
93
IO303PB7F28
41
IO190NB4F17
158
IO310NB7F29
34
IO190PB4F17
159
IO257PB6F24
86
IO310PB7F29
35
IO191NB4F17
154
IO258NB6F24
84
IO311NB7F29
36
IO191PB4F17
155
IO258PB6F24
85
IO311PB7F29
37
IO192NB4F17
152
IO261NB6F24
82
IO312NB7F29
28
IO192PB4F17
153
IO261PB6F24
83
IO312PB7F29
29
IO207NB4F19
146
IO262NB6F24
78
IO315NB7F29
30
IO207PB4F19
147
IO262PB6F24
79
IO315PB7F29
31
IO212NB4F19/CLKEN
142
IO265NB6F24
76
IO316NB7F29
22
IO212PB4F19/CLKEP
143
IO265PB6F24
77
IO316PB7F29
23
IO213NB4F19/CLKFN
136
IO279NB6F26
72
IO317NB7F29
24
IO213PB4F19/CLKFP
137
IO279PB6F26
73
IO317PB7F29
25
IO280NB6F26
70
IO318NB7F29
18
Bank 5
Bank 6
Bank 7
IO214NB5F20/CLKGN
128
IO280PB6F26
71
IO318PB7F29
19
IO214PB5F20/CLKGP
129
IO281NB6F26
66
IO320NB7F29
16
IO215NB5F20/CLKHN
122
IO281PB6F26
67
IO320PB7F29
17
IO215PB5F20/CLKHP
123
IO282NB6F26
64
IO334NB7F31
10
IO217NB5F20
118
IO282PB6F26
65
IO334PB7F31
11
IO217PB5F20
119
IO284NB6F26
60
IO335NB7F31
12
IO236NB5F22
110
IO284PB6F26
61
IO335PB7F31
13
IO236PB5F22
111
IO285NB6F26
58
IO338NB7F31
6
IO237NB5F22
112
IO285PB6F26
59
IO338PB7F31
7
IO237PB5F22
113
IO286NB6F26
54
IO341NB7F31
4
IO238NB5F22
104
IO286PB6F26
55
IO341PB7F31
5
IO238PB5F22
105
IO287NB6F26
52
IO239NB5F22
106
IO287PB6F26
53
GND
1
IO239PB5F22
107
IO294NB6F27
48
GND
9
IO240NB5F22
100
IO294PB6F27
49
GND
15
3- 11 2
R ev isio n 1 8
Dedicated I/O
Axcelerator Family FPGAs
CQ352
CQ352
CQ352
AX2000 Function
Pin
Number
AX2000 Function
Pin
Number
AX2000 Function
Pin
Number
GND
21
GND
240
VCCA
150
GND
27
GND
246
VCCA
162
GND
33
GND
252
VCCA
175
GND
39
GND
258
VCCA
191
GND
45
GND
264
VCCA
209
GND
51
GND
265
VCCA
233
GND
57
GND
274
VCCA
251
GND
63
GND
280
VCCA
263
GND
69
GND
286
VCCA
279
GND
75
GND
292
VCCA
291
GND
81
GND
298
VCCA
329
GND
88
GND
310
VCCA
339
GND
89
GND
322
VCCDA
2
GND
97
GND
330
VCCDA
44
GND
103
GND
334
VCCDA
90
GND
109
GND
340
VCCDA
91
GND
115
GND
345
VCCDA
116
GND
121
GND
352
VCCDA
117
GND
133
PRA
312
VCCDA
130
GND
145
PRB
311
VCCDA
131
GND
151
PRC
135
VCCDA
132
GND
157
PRD
134
VCCDA
148
GND
163
TCK
349
VCCDA
149
GND
169
TDI
348
VCCDA
174
GND
176
TDO
347
VCCDA
178
GND
177
TMS
350
VCCDA
221
GND
186
TRST
351
VCCDA
266
GND
192
VCCA
3
VCCDA
268
GND
198
VCCA
14
VCCDA
293
GND
204
VCCA
32
VCCDA
294
GND
210
VCCA
56
VCCDA
307
GND
216
VCCA
74
VCCDA
308
GND
222
VCCA
87
VCCDA
309
GND
228
VCCA
102
VCCDA
327
GND
234
VCCA
114
VCCDA
328
R ev i si o n 1 8
3- 113
Package Pin Assignments
CQ352
CQ352
AX2000 Function
Pin
Number
AX2000 Function
Pin
Number
VCCDA
346
VCCPLG
126
VCCIB0
321
VCCPLH
124
VCCIB0
333
VCOMPLA
318
VCCIB0
344
VCOMPLB
316
VCCIB1
273
VCOMPLC
304
VCCIB1
285
VCOMPLD
302
VCCIB1
297
VCOMPLE
141
VCCIB2
227
VCOMPLF
139
VCCIB2
239
VCOMPLG
127
VCCIB2
245
VCOMPLH
125
VCCIB2
257
VPUMP
267
VCCIB3
185
VCCIB3
197
VCCIB3
203
VCCIB3
215
VCCIB4
144
VCCIB4
156
VCCIB4
168
VCCIB5
96
VCCIB5
108
VCCIB5
120
VCCIB6
50
VCCIB6
62
VCCIB6
68
VCCIB6
80
VCCIB7
8
VCCIB7
20
VCCIB7
26
VCCIB7
38
VCCPLA
317
VCCPLB
315
VCCPLC
303
VCCPLD
301
VCCPLE
140
VCCPLF
138
3- 11 4
R ev isio n 1 8
Axcelerator Family FPGAs
CG624
25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8
7 6
5 4 3 2 1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
AD
AE
Note
For Package Manufacturing and Environmental information, visit Resource center at
http://www.microsemi.com/soc/products/rescenter/package/index.html.
R ev i si o n 1 8
3- 115
Package Pin Assignments
CG624
AX1000 Function
CG624
Pin
Number
Bank 0
3- 11 6
CG624
AX1000 Function
Pin
Number
AX1000 Function
Pin
Number
IO23NB0F2
E11
IO42NB1F4
G21
IO00NB0F0
F8
IO23PB0F2
F11
IO42PB1F4
G20
IO00PB0F0
F7
IO24NB0F2
D7
IO43NB1F4
A16
IO02NB0F0
G7
IO24PB0F2
E7
IO43PB1F4
A15
IO02PB0F0
G6
IO25PB0F2
B12
IO44NB1F4
A20
IO04NB0F0
E9
IO26NB0F2
H11
IO44PB1F4
A19
IO04PB0F0
D8
IO26PB0F2
G11
IO45NB1F4
B17
IO06NB0F0
G9
IO27NB0F2
C11
IO45PB1F4
B16
IO06PB0F0
G8
IO27PB0F2
B8
IO46NB1F4
G17
IO07PB0F0
B6
IO28NB0F2
J13
IO46PB1F4
H17
IO08NB0F0
F10
IO28PB0F2
K13
IO47NB1F4
A17
IO08PB0F0
F9
IO29NB0F2
J8
IO48NB1F4
C19
IO09PB0F0
C7
IO29PB0F2
J7
IO48PB1F4
C18
IO10NB0F0
H8
IO30NB0F2/HCLKAN
G13
IO49NB1F4
B20
IO10PB0F0
H7
IO30PB0F2/HCLKAP
G12
IO49PB1F4
B19
IO11NB0F0
D10
IO31NB0F2/HCLKBN
C13
IO50NB1F4
H20
IO11PB0F0
D9
IO31PB0F2/HCLKBP
C12
IO50PB1F4
H19
IO12NB0F1
B5
Bank 1
IO51NB1F4
A22
IO12PB0F1
B4
IO32NB1F3/HCLKCN
G15
IO51PB1F4
A21
IO13NB0F1
A7
IO32PB1F3/HCLKCP
G14
IO52NB1F4
C21
IO13PB0F1
A6
IO33NB1F3/HCLKDN
B14
IO52PB1F4
C20
IO14NB0F1
C9
IO33PB1F3/HCLKDP
B13
IO53NB1F4
B22
IO14PB0F1
C8
IO34NB1F3
G16
IO53PB1F4
B21
IO15PB0F1
B7
IO34PB1F3
H16
IO54NB1F5
J18
IO16NB0F1
A5
IO35NB1F3
C17
IO54PB1F5
J19
IO16PB0F1
A4
IO35PB1F3
B18
IO55NB1F5
D18
IO17NB0F1
A9
IO36NB1F3
H18
IO55PB1F5
D17
IO17PB0F1
B9
IO36PB1F3
H15
IO56NB1F5
F20
IO18NB0F1
D12
IO37NB1F3
H13
IO56PB1F5
F19
IO18PB0F1
D11
IO38NB1F3
E15
IO58NB1F5
E17
IO20NB0F1
B11
IO38PB1F3
F15
IO58PB1F5
F17
IO20PB0F1
B10
IO39NB1F3
D14
IO60NB1F5
D20
IO21NB0F1
A11
IO39PB1F3
C14
IO60PB1F5
D19
IO21PB0F1
A10
IO40NB1F3
D16
IO62NB1F5
E18
IO22NB0F2
H10
IO40PB1F3
D15
IO62PB1F5
F18
IO22PB0F2
H9
IO41NB1F4
F16
IO63NB1F5
G19
R ev isio n 1 8
Axcelerator Family FPGAs
CG624
CG624
CG624
AX1000 Function
Pin
Number
AX1000 Function
Pin
Number
AX1000 Function
Pin
Number
IO63PB1F5
G18
IO84NB2F7
M20
IO105NB3F9
R23
IO84PB2F7
M21
IO105PB3F9
P23
Bank 2
IO64NB2F6
M17
IO86NB2F8
E25
IO106NB3F9
R19
IO64PB2F6
G22
IO86PB2F8
D25
IO106PB3F9
R20
IO65NB2F6
J21
IO87NB2F8
L24
IO107NB3F10
AB24
IO65PB2F6
J20
IO87PB2F8
K24
IO108NB3F10
R25
IO66NB2F6
L23
IO88NB2F8
G24
IO108PB3F10
P25
IO66PB2F6
K20
IO88PB2F8
F24
IO109NB3F10
U25
IO67NB2F6
F23
IO89NB2F8
J25
IO109PB3F10
T25
IO67PB2F6
E23
IO90NB2F8
G25
IO110NB3F10
U24
IO68NB2F6
L18
IO90PB2F8
F25
IO110PB3F10
U23
IO68PB2F6
K18
IO91NB2F8
L25
IO112NB3F10
T24
IO70NB2F6
E24
IO91PB2F8
K25
IO112PB3F10
R24
IO70PB2F6
D24
IO92NB2F8
J24
IO113NB3F10
Y25
IO71NB2F6
H23
IO92PB2F8
H24
IO113PB3F10
W25
IO71PB2F6
G23
IO93PB2F8
J23
IO114NB3F10
V23
IO72NB2F6
L19
IO94NB2F8
N24
IO114PB3F10
V24
IO72PB2F6
K19
IO94PB2F8
M24
IO116NB3F10
AA24
IO74NB2F7
J22
IO95NB2F8
N25
IO116PB3F10
Y24
IO74PB2F7
H22
IO95PB2F8
M25
IO117NB3F10
AB25
IO75NB2F7
N23
IO117PB3F10
AA25
IO75PB2F7
M23
IO96NB3F9
T18
IO118NB3F11
T20
IO76NB2F7
N17
IO96PB3F9
R18
IO118PB3F11
R21
IO76PB2F7
N16
IO97NB3F9
N20
IO120NB3F11
W22
IO77NB2F7
L22
IO97PB3F9
P24
IO120PB3F11
W23
IO77PB2F7
K22
IO98NB3F9
P20
IO122NB3F11
V22
IO78NB2F7
M19
IO98PB3F9
P19
IO122PB3F11
U22
IO78PB2F7
M18
IO99NB3F9
P21
IO124NB3F11
Y23
IO79NB2F7
N19
IO100NB3F9
T22
IO124PB3F11
AA23
IO79PB2F7
N18
IO100PB3F9
W24
IO126NB3F11
V21
IO80NB2F7
L21
IO101NB3F9
R22
IO126PB3F11
U21
IO80PB2F7
L20
IO101PB3F9
P22
IO128NB3F11
Y22
IO82NB2F7
P18
IO102NB3F9
U19
IO128PB3F11
Y21
IO82PB2F7
P17
IO102PB3F9
T19
IO83NB2F7
N22
IO104NB3F9
V20
IO129NB4F12
W20
IO83PB2F7
M22
IO104PB3F9
U20
IO129PB4F12
Y20
Bank 3
R ev i si o n 1 8
Bank 4
3- 117
Package Pin Assignments
CG624
CG624
CG624
AX1000 Function
Pin
Number
AX1000 Function
Pin
Number
AX1000 Function
Pin
Number
IO131NB4F12
V19
IO153NB4F14
Y15
IO173PB5F16
Y11
IO131PB4F12
W19
IO153PB4F14
Y16
IO174NB5F16
AB10
IO133NB4F12
Y18
IO155NB4F14
V15
IO174PB5F16
AB11
IO133PB4F12
Y19
IO155PB4F14
V16
IO175NB5F16
AC9
IO135NB4F12
W18
IO156NB4F14
AB14
IO175PB5F16
AE9
IO135PB4F12
V18
IO156PB4F14
AB15
IO177NB5F16
AA8
IO137NB4F12
Y17
IO157NB4F14
AE14
IO177PB5F16
Y8
IO137PB4F12
AA17
IO157PB4F14
AC18
IO178NB5F16
Y6
IO138NB4F12
AB19
IO158NB4F14
AC15
IO178PB5F16
W6
IO138PB4F12
AB18
IO158PB4F14
AC19
IO179NB5F16
Y10
IO139NB4F13
AA19
IO159NB4F14/CLKEN
W14
IO179PB5F16
W10
IO139PB4F13
U18
IO159PB4F14/CLKEP
W15
IO180NB5F16
Y7
IO140NB4F13
AC20
IO160NB4F14/CLKFN
AC13
IO180PB5F16
W7
IO140PB4F13
AC21
IO160PB4F14/CLKFP
AD13
IO181NB5F17
AD9
IO141NB4F13
AD17
IO181PB5F17
AD10
IO141PB4F13
AD18
IO161NB5F15/CLKGN
W13
IO182NB5F17
AE10
IO142NB4F13
AD21
IO161PB5F15/CLKGP
Y13
IO182PB5F17
AE11
IO142PB4F13
AD22
IO162NB5F15/CLKHN
AC12
IO183NB5F17
AD7
IO143NB4F13
AB17
IO162PB5F15/CLKHP
AD12
IO183PB5F17
AD8
IO143PB4F13
AC17
IO163NB5F15
V9
IO184NB5F17
AB9
IO144PB4F13
AE22
IO163PB5F15
V10
IO185NB5F17
AE6
IO145NB4F13
AE15
IO164NB5F15
V11
IO185PB5F17
AE7
IO145PB4F13
AE16
IO164PB5F15
T13
IO186NB5F17
AE4
IO146NB4F13
AD19
IO165NB5F15
U13
IO186PB5F17
AE5
IO146PB4F13
AD20
IO165PB5F15
V13
IO187NB5F17
AA9
IO147NB4F13
AD15
IO167NB5F15
W11
IO187PB5F17
Y9
IO147PB4F13
AD16
IO167PB5F15
W12
IO188NB5F17
U8
IO148PB4F13
AE21
IO168NB5F15
AB6
IO189NB5F17
AD5
IO149NB4F13
AD14
IO168PB5F15
AA6
IO189PB5F17
AD6
IO149PB4F13
AC14
IO169NB5F15
V8
IO191NB5F17
AC5
IO150NB4F13
AE19
IO169PB5F15
V7
IO191PB5F17
AC6
IO150PB4F13
AE20
IO171NB5F16
W8
IO192NB5F17
AB7
IO151NB4F13
V17
IO171PB5F16
W9
IO192PB5F17
AC7
IO151PB4F13
W17
IO172NB5F16
AB8
IO152NB4F14
AB16
IO172PB5F16
AC8
IO193NB6F18
U6
IO152PB4F14
W16
IO173NB5F16
AA11
IO193PB6F18
U5
3- 11 8
Bank 5
R ev isio n 1 8
Bank 6
Axcelerator Family FPGAs
CG624
CG624
CG624
AX1000 Function
Pin
Number
AX1000 Function
Pin
Number
AX1000 Function
Pin
Number
IO194NB6F18
Y3
IO215PB6F20
V4
IO237NB7F22
N8
IO194PB6F18
AA3
IO216NB6F20
P8
IO237PB7F22
N7
IO195NB6F18
V6
IO216PB6F20
R3
IO238NB7F22
M5
IO195PB6F18
W4
IO217NB6F20
P7
IO239NB7F22
L6
IO197NB6F18
R5
IO217PB6F20
R7
IO239PB7F22
L5
IO197PB6F18
U3
IO219NB6F20
R4
IO240NB7F22
M4
IO198NB6F18
P6
IO219PB6F20
T4
IO241NB7F22
L7
IO199NB6F18
Y5
IO220NB6F20
P2
IO241PB7F22
M7
IO199PB6F18
W5
IO220PB6F20
R2
IO242NB7F22
J3
IO200NB6F18
V3
IO221NB6F20
N4
IO243NB7F22
M9
IO200PB6F18
W3
IO221PB6F20
P4
IO243PB7F22
M8
IO201NB6F18
T7
IO223NB6F20
M2
IO244NB7F22
P9
IO201PB6F18
U7
IO223PB6F20
N2
IO244PB7F22
N6
IO202NB6F18
V2
IO224NB6F20
N3
IO245NB7F22
K8
IO203NB6F19
W2
IO224PB6F20
P3
IO245PB7F22
L8
IO203PB6F19
Y2
IO246NB7F22
F3
IO204NB6F19
AA1
IO225NB7F21
J2
IO246PB7F22
E3
IO204PB6F19
AB1
IO225PB7F21
J1
IO247NB7F23
K7
IO205NB6F19
R6
IO226PB7F21
G2
IO247PB7F23
K6
IO205PB6F19
T6
IO227NB7F21
H3
IO248NB7F23
D2
IO206NB6F19
W1
IO227PB7F21
H2
IO249NB7F23
G4
IO206PB6F19
Y1
IO229NB7F21
K2
IO249PB7F23
G3
IO207NB6F19
T2
IO229PB7F21
L2
IO251NB7F23
N10
IO207PB6F19
U2
IO230NB7F21
K1
IO251PB7F23
N9
IO208NB6F19
T1
IO230PB7F21
L1
IO253NB7F23
H4
IO208PB6F19
U1
IO231NB7F21
E2
IO253PB7F23
J4
IO209NB6F19
AA2
IO231PB7F21
F2
IO255NB7F23
J6
IO209PB6F19
AB2
IO232NB7F21
F1
IO255PB7F23
J5
IO210NB6F19
P5
IO232PB7F21
G1
IO257NB7F23
H5
IO211NB6F19
M1
IO233NB7F21
L3
IO257PB7F23
H6
IO211PB6F19
N1
IO233PB7F21
M3
IO212NB6F19
P1
IO234NB7F21
D1
GND
K5
IO212PB6F19
R1
IO234PB7F21
E1
GND
A18
IO213NB6F19
R8
IO235NB7F21
K4
GND
A2
IO213PB6F19
T8
IO235PB7F21
L4
GND
A24
IO215NB6F20
U4
IO236NB7F22
M6
GND
A25
Bank 7
R ev i si o n 1 8
Dedicated I/O
3- 119
Package Pin Assignments
CG624
CG624
CG624
AX1000 Function
Pin
Number
AX1000 Function
Pin
Number
AX1000 Function
Pin
Number
GND
A8
GND/LP
E8
GND
V1
GND
AA10
GND
H1
GND
V25
GND
AA16
GND
H21
GND
V5
GND
AA18
GND
H25
NC
A14
GND
AA21
GND
K21
NC
AA20
GND
AA5
GND
K23
NC
AB13
GND
AB22
GND
K3
NC
AD4
GND
AB4
GND
L11
NC
AE12
GND
AC10
GND
L12
NC
F21
GND
AC16
GND
L13
NC
G10
GND
AC23
GND
L14
PRA
F13
GND
AC3
GND
L15
PRB
A13
GND
AD1
GND
M11
PRC
AB12
GND
AD2
GND
M12
PRD
AE13
GND
AD24
GND
M13
TCK
F5
GND
AD25
GND
M14
TDI
C5
GND
AE1
GND
M15
TDO
F6
GND
AE18
GND
N11
TMS
D6
GND
AE2
GND
N12
TRST
E6
GND
AE24
GND
N13
VCCA
AB20
GND
AE25
GND
N14
VCCA
F22
GND
AE8
GND
N15
VCCA
F4
GND
B1
GND
P11
VCCA
J17
GND
B2
GND
P12
VCCA
J9
GND
B24
GND
P13
VCCA
K10
GND
B25
GND
P14
VCCA
K11
GND
C10
GND
P15
VCCA
K15
GND
C16
GND
R11
VCCA
K16
GND
C23
GND
R12
VCCA
L10
GND
C3
GND
R13
VCCA
L16
GND
D22
GND
R14
VCCA
R10
GND
D4
GND
R15
VCCA
R16
GND
E10
GND
T21
VCCA
T10
GND
E16
GND
T23
VCCA
T11
GND
E21
GND
T3
VCCA
T15
GND
E5
GND
T5
VCCA
T16
3- 12 0
R ev isio n 1 8
Axcelerator Family FPGAs
CG624
CG624
CG624
AX1000 Function
Pin
Number
AX1000 Function
Pin
Number
AX1000 Function
Pin
Number
VCCA
U17
VCCIB2
D23
VCCIB7
E4
VCCA
U9
VCCIB2
E22
VCCIB7
K9
VCCA
Y4
VCCIB2
K17
VCCIB7
L9
VCCDA
A12
VCCIB2
L17
VCCIB7
M10
VCCDA
AA13
VCCIB2
M16
VCCPLA
E12
VCCDA
AA15
VCCIB3
AA22
VCCPLB
J12
VCCDA
AA7
VCCIB3
AB23
VCCPLC
E14
VCCDA
AC11
VCCIB3
AC24
VCCPLD
H14
VCCDA
AD11
VCCIB3
AC25
VCCPLE
Y14
VCCDA
AE17
VCCIB3
P16
VCCPLF
U14
VCCDA
B15
VCCIB3
R17
VCCPLG
Y12
VCCDA
C15
VCCIB3
T17
VCCPLH
U12
VCCDA
C6
VCCIB4
AB21
VCOMPLA
F12
VCCDA
D13
VCCIB4
AC22
VCOMPLB
H12
VCCDA
E13
VCCIB4
AD23
VCOMPLC
F14
VCCDA
E19
VCCIB4
AE23
VCOMPLD
J14
VCCDA
G5
VCCIB4
T14
VCOMPLE
AA14
VCCDA
N21
VCCIB4
U15
VCOMPLF
V14
VCCDA
N5
VCCIB4
U16
VCOMPLG
AA12
VCCDA
W21
VCCIB5
AB5
VCOMPLH
V12
VCCIB0
A3
VCCIB5
AC4
VPUMP
E20
VCCIB0
B3
VCCIB5
AD3
VCCIB0
C4
VCCIB5
AE3
VCCIB0
D5
VCCIB5
T12
VCCIB0
J10
VCCIB5
U10
VCCIB0
J11
VCCIB5
U11
VCCIB0
K12
VCCIB6
AA4
VCCIB1
A23
VCCIB6
AB3
VCCIB1
B23
VCCIB6
AC1
VCCIB1
C22
VCCIB6
AC2
VCCIB1
D21
VCCIB6
P10
VCCIB1
J15
VCCIB6
R9
VCCIB1
J16
VCCIB6
T9
VCCIB1
K14
VCCIB7
C1
VCCIB2
C24
VCCIB7
C2
VCCIB2
C25
VCCIB7
D3
R ev i si o n 1 8
3- 121
Package Pin Assignments
CG624
AX2000 Function
CG624
Pin
Number
Bank 0
Pin
Number
AX2000 Function
Pin
Number
IO27NB0F2
H10
IO51NB1F4
E15
IO00NB0F0
D7*
IO27PB0F2
H9
IO51PB1F4
F15
IO00PB0F0
E7*
IO28NB0F2
A9
IO52NB1F4
A17
IO01NB0F0
G7
IO28PB0F2
B9
IO55NB1F5
G16
IO01PB0F0
G6
IO30NB0F2
B11
IO55PB1F5
H16
IO02NB0F0
B5
IO30PB0F2
B10
IO56NB1F5
A20
IO02PB0F0
B4
IO31NB0F2
E11
IO56PB1F5
A19
IO04PB0F0
C7
IO31PB0F2
F11
IO57NB1F5
D16
IO05NB0F0
F8
IO33NB0F2
D12
IO57PB1F5
D15
IO05PB0F0
F7
IO33PB0F2
D11
IO58NB1F5
A22
IO06NB0F0
H8
IO34NB0F3
A11
IO58PB1F5
A21
IO06PB0F0
H7
IO34PB0F3
A10
IO59NB1F5
F16
IO11NB0F0
J8
IO37NB0F3
J13
IO61NB1F5
G17
IO11PB0F0
J7
IO37PB0F3
K13
IO61PB1F5
H17
IO12PB0F1
B6
IO38NB0F3
H11
IO62NB1F5
B17
IO13NB0F1
E9*
IO38PB0F3
G11
IO62PB1F5
B16
IO13PB0F1
D8*
IO40PB0F3
B12
IO63NB1F5
H18
IO15NB0F1
C9
IO41NB0F3/HCLKAN
G13
IO65NB1F6
C17
IO15PB0F1
C8
IO41PB0F3/HCLKAP
G12
IO66PB1F6
B18
IO16NB0F1
A5
IO42NB0F3/HCLKBN
C13
IO67NB1F6
J18
IO16PB0F1
A4
IO42PB0F3/HCLKBP
C12
IO67PB1F6
J19
IO17NB0F1
D10
IO68NB1F6
B20
IO17PB0F1
D9
IO43NB1F4/HCLKCN
G15
IO68PB1F6
B19
IO18NB0F1
A7
IO43PB1F4/HCLKCP
G14
IO69NB1F6
E17
IO18PB0F1
A6
IO44NB1F4/HCLKDN
B14
IO69PB1F6
F17
IO19NB0F1
G9
IO44PB1F4/HCLKDP
B13
IO70NB1F6
B22
IO19PB0F1
G8
IO45NB1F4
H13
IO70PB1F6
B21
IO20PB0F1
B7
IO47NB1F4
D14
IO71PB1F6
G18
IO23NB0F2
F10
IO47PB1F4
C14
IO73NB1F6
G19
IO23PB0F2
F9
IO48NB1F4
A16
IO74NB1F6
C19
IO26NB0F2
C11*
IO48PB1F4
A15
IO74PB1F6
C18
IO26PB0F2
B8*
IO49PB1F4
H15
IO75NB1F6
D18
Note: *Not routed on the same
package layer and to adjacent
LGA pads as its differential
pair complement.
Recommended to be used as
a single-ended I/O.
3- 12 2
AX2000 Function
CG624
Bank 1
Note: *Not routed on the same
package layer and to adjacent
LGA pads as its differential
pair complement.
Recommended to be used as
a single-ended I/O.
R ev isio n 1 8
Note: *Not routed on the same
package layer and to adjacent
LGA pads as its differential
pair complement.
Recommended to be used as
a single-ended I/O.
Axcelerator Family FPGAs
CG624
AX2000 Function
CG624
Pin
Number
AX2000 Function
CG624
Pin
Number
AX2000 Function
Pin
Number
IO75PB1F6
D17
IO99PB2F9
K19
IO127NB2F11
P18
IO76NB1F7
C21
IO100NB2F9
E25
IO127PB2F11
P17
IO76PB1F7
C20
IO100PB2F9
D25
IO128NB2F11
N25
IO79NB1F7
H20
IO103PB2F9
K20
IO128PB2F11
M25
IO79PB1F7
H19
IO105NB2F9
M19
IO80NB1F7
E18
IO105PB2F9
M18
IO129NB3F12
N20
IO80PB1F7
F18
IO106NB2F9
J24
IO130PB3F12
P24
IO81NB1F7
G21
IO106PB2F9
H24
IO131NB3F12
P21
IO81PB1F7
G20
IO107NB2F10
L23*
IO133NB3F12
P20
IO82NB1F7
F20
IO107PB2F10
N16*
IO133PB3F12
P19
IO82PB1F7
F19
IO109NB2F10
L22
IO138NB3F12
R23
IO85NB1F7
D20*
IO109PB2F10
K22
IO138PB3F12
P23
IO85PB1F7
D19*
IO110NB2F10
G25
IO139NB3F13
R22
IO110PB2F10
F25
IO139PB3F13
P22
Bank 2
Bank 3
IO86NB2F8
F23
IO111NB2F10
L21
IO141NB3F13
R19
IO86PB2F8
E23
IO111PB2F10
L20
IO142NB3F13
R25
IO87NB2F8
H23
IO112NB2F10
L24
IO142PB3F13
P25
IO87PB2F8
G23
IO112PB2F10
K24
IO143PB3F13
R21
IO88NB2F8
E24
IO113NB2F10
N17
IO145NB3F13
T18
IO88PB2F8
D24
IO115NB2F10
M20
IO145PB3F13
R18
IO89NB2F8
M17*
IO115PB2F10
M21
IO146NB3F13
T24
IO89PB2F8
G22*
IO117NB2F10
N19
IO146PB3F13
R24
IO91NB2F8
J22
IO117PB2F10
N18
IO147NB3F13
T20
IO91PB2F8
H22
IO118NB2F11
J25
IO147PB3F13
R20
IO92NB2F8
L18
IO121NB2F11
N24
IO148NB3F13
U25
IO92PB2F8
K18
IO121PB2F11
M24
IO148PB3F13
T25
IO96NB2F9
G24
IO122NB2F11
L25
IO149NB3F13
T22
IO96PB2F9
F24
IO122PB2F11
K25
IO153NB3F14
U19
IO97NB2F9
J21
IO123NB2F11
N22
IO153PB3F14
T19
IO97PB2F9
J20
IO123PB2F11
M22
IO154NB3F14
Y25
IO98PB2F9
J23
IO124NB2F11
N23
IO154PB3F14
W25
IO99NB2F9
L19
IO124PB2F11
M23
IO157NB3F14
V20
Note: *Not routed on the same
package layer and to adjacent
LGA pads as its differential
pair complement.
Recommended to be used as
a single-ended I/O.
Note: *Not routed on the same
package layer and to adjacent
LGA pads as its differential
pair complement.
Recommended to be used as
a single-ended I/O.
R ev i si o n 1 8
Note: *Not routed on the same
package layer and to adjacent
LGA pads as its differential
pair complement.
Recommended to be used as
a single-ended I/O.
3- 123
Package Pin Assignments
CG624
AX2000 Function
CG624
Pin
Number
Pin
Number
AX2000 Function
Pin
Number
IO157PB3F14
U20
IO177PB4F16
AB18
IO208PB4F19
W16
IO158NB3F14
AB25
IO182NB4F17
V19
IO209NB4F19
AE14
IO158PB3F14
AA25
IO182PB4F17
W19
IO210NB4F19
V15
IO160PB3F14
W24
IO183PB4F17
AC19
IO210PB4F19
V16
IO161NB3F15
U24
IO184NB4F17
AB17
IO211NB4F19
AD14
IO161PB3F15
U23
IO184PB4F17
AC17
IO211PB4F19
AC14
IO162NB3F15
AA24
IO185NB4F17
AD19
IO212NB4F19/CLKEN
W14
IO162PB3F15
Y24
IO185PB4F17
AD20
IO212PB4F19/CLKEP
W15
IO163NB3F15
V22
IO187PB4F17
AC18
IO213NB4F19/CLKFN
AC13
IO163PB3F15
U22
IO188NB4F17
Y17
IO213PB4F19/CLKFP
AD13
IO164NB3F15
V23
IO188PB4F17
AA17
IO164PB3F15
V24
IO189PB4F17
AE22
IO214NB5F20/CLKGN
W13
IO166NB3F15
AB24
IO191NB4F17
W18
IO214PB5F20/CLKGP
Y13
IO167NB3F15
V21
IO191PB4F17
V18
IO215NB5F20/CLKHN
AC12
IO167PB3F15
U21
IO192PB4F17
U18
IO215PB5F20/CLKHP
AD12
IO168NB3F15
Y23
IO195PB4F18
AE21
IO216NB5F20
U13
IO168PB3F15
AA23
IO196NB4F18
AB16
IO216PB5F20
V13
IO169NB3F15
W22*
IO197NB4F18
AD17
IO217NB5F20
AE10
IO169PB3F15
W23*
IO197PB4F18
AD18
IO217PB5F20
AE11
IO170NB3F15
Y22
IO198NB4F18
V17
IO218NB5F20
W11
IO170PB3F15
Y21
IO198PB4F18
W17
IO218PB5F20
W12
IO199NB4F18
AE19
IO222NB5F20
AA11
Bank 4
Bank 5
IO171NB4F16
AC20*
IO199PB4F18
AE20
IO222PB5F20
Y11
IO171PB4F16
AC21*
IO200NB4F18
AC15
IO223PB5F21
AE9
IO172NB4F16
W20
IO201NB4F18
AD15
IO225NB5F21
AE6
IO172PB4F16
Y20
IO201PB4F18
AD16
IO225PB5F21
AE7
IO173NB4F16
AD21
IO202NB4F18
Y15
IO226NB5F21
Y10
IO173PB4F16
AD22
IO202PB4F18
Y16
IO226PB5F21
W10
IO174NB4F16
AA19
IO206NB4F19
AB14
IO227PB5F21
T13
IO176NB4F16
Y18
IO206PB4F19
AB15
IO228NB5F21
AB10
IO176PB4F16
Y19
IO207NB4F19
AE15
IO228PB5F21
AB11
IO177NB4F16
AB19
IO207PB4F19
AE16
IO229NB5F21
AD9
Note: *Not routed on the same
package layer and to adjacent
LGA pads as its differential
pair complement.
Recommended to be used as
a single-ended I/O.
3- 12 4
AX2000 Function
CG624
Note: *Not routed on the same
package layer and to adjacent
LGA pads as its differential
pair complement.
Recommended to be used as
a single-ended I/O.
R ev isio n 1 8
Note: *Not routed on the same
package layer and to adjacent
LGA pads as its differential
pair complement.
Recommended to be used as
a single-ended I/O.
Axcelerator Family FPGAs
CG624
AX2000 Function
CG624
Pin
Number
AX2000 Function
IO229PB5F21
AD10
IO230NB5F21
V11
IO233NB5F21
AD7
IO257NB6F24
IO233PB5F21
AD8
IO234NB5F21
CG624
Pin
Number
AA6*
Pin
Number
IO284NB6F26
R8
IO284PB6F26
T8
Y3
IO285NB6F26
W1
IO257PB6F24
AA3
IO285PB6F26
Y1
V9
IO258NB6F24
V3
IO286NB6F26
P2
IO234PB5F21
V10
IO258PB6F24
W3
IO286PB6F26
R2
IO236NB5F22
AC9
IO259NB6F24
AA2
IO287NB6F26
T1
IO238NB5F22
W8
IO259PB6F24
AB2
IO287PB6F26
U1
IO238PB5F22
W9
IO260NB6F24
V6*
IO288NB6F26
P5
IO239NB5F22
AE4
IO260PB6F24
W4*
IO290NB6F27
P6
IO239PB5F22
AE5
IO262NB6F24
U4
IO291NB6F27
P1
IO240NB5F22
AB9
IO262PB6F24
V4
IO291PB6F27
R1
IO242NB5F22
AA9
IO263NB6F24
Y5
IO292NB6F27
P7
IO242PB5F22
Y9
IO263PB6F24
W5
IO292PB6F27
R7
IO243NB5F22
AD5
IO268NB6F25
U6
IO293NB6F27
M1
IO243PB5F22
AD6
IO268PB6F25
U5
IO293PB6F27
N1
IO244NB5F22
U8
IO269PB6F25
U3
IO294NB6F27
P8
IO246NB5F23
AB8
IO272NB6F25
T2
IO296NB6F27
N3
IO246PB5F23
AC8
IO272PB6F25
U2
IO296PB6F27
P3
IO247NB5F23
AB7
IO273NB6F25
W2
IO298NB6F27
N4
IO247PB5F23
AC7
IO273PB6F25
Y2
IO298PB6F27
P4
IO250NB5F23
AA8
IO274NB6F25
R6
IO299NB6F27
M2
IO250PB5F23
Y8
IO274PB6F25
T6
IO299PB6F27
N2
IO251NB5F23
V8
IO275NB6F25
T7
IO251PB5F23
V7
IO275PB6F25
U7
IO300NB7F28
P9*
IO252NB5F23
Y7
IO277NB6F25
V2
IO300PB7F28
N6*
IO252PB5F23
W7
IO278NB6F26
R4
IO302NB7F28
M6
IO253NB5F23
AC5
IO278PB6F26
T4
IO304NB7F28
N8
IO253PB5F23
AC6
IO279PB6F26
R3
IO304PB7F28
N7
IO254NB5F23
Y6
IO280NB6F26
R5
IO308NB7F28
M4
IO254PB5F23
W6
IO281NB6F26
AA1
IO309NB7F28
L3
IO256NB5F23
AB6*
IO281PB6F26
AB1
IO309PB7F28
M3
Note: *Not routed on the same
package layer and to adjacent
LGA pads as its differential
pair complement.
Recommended to be used as
a single-ended I/O.
IO256PB5F23
AX2000 Function
Bank 6
Note: *Not routed on the same
package layer and to adjacent
LGA pads as its differential
pair complement.
Recommended to be used as
a single-ended I/O.
R ev i si o n 1 8
Bank 7
Note: *Not routed on the same
package layer and to adjacent
LGA pads as its differential
pair complement.
Recommended to be used as
a single-ended I/O.
3- 125
Package Pin Assignments
CG624
AX2000 Function
CG624
Pin
Number
Pin
Number
AX2000 Function
Pin
Number
IO310NB7F29
N10
IO335PB7F31
H6
GND
AE1
IO310PB7F29
N9
IO337NB7F31
D2
GND
AE18
IO311NB7F29
K1
IO338NB7F31
J6
GND
AE2
IO311PB7F29
L1
IO338PB7F31
J5
GND
AE24
IO313NB7F29
M5
IO339NB7F31
F3
GND
AE25
IO316NB7F29
L6
IO339PB7F31
E3
GND
AE8
IO316PB7F29
L5
IO340NB7F31
G4*
GND
B1
IO317NB7F29
K2
IO340PB7F31
G3*
GND
B2
IO317PB7F29
L2
IO341NB7F31
K8
GND
B24
IO318NB7F29
K4
IO341PB7F31
L8
GND
B25
IO318PB7F29
L4
GND
C10
IO320NB7F29
J3
GND
K5
GND
C16
IO321NB7F30
J2
GND
A18
GND
C23
IO321PB7F30
J1
GND
A2
GND
C3
IO323NB7F30
L7
GND
A24
GND
D22
IO323PB7F30
M7
GND
A25
GND
D4
IO324NB7F30
M9
GND
A8
GND
E10
IO324PB7F30
M8
GND
AA10
GND
E16
IO327NB7F30
F1
GND
AA16
GND
E21
IO327PB7F30
G1
GND
AA18
GND
E5
IO328NB7F30
K7
GND
AA21
GND
E8
IO328PB7F30
K6
GND
AA5
GND
H1
IO329NB7F30
D1
GND
AB22
GND
H21
IO329PB7F30
E1
GND
AB4
GND
H25
IO331PB7F30
G2
GND
AC10
GND
K21
IO332NB7F31
H3
GND
AC16
GND
K23
IO332PB7F31
H2
GND
AC23
GND
K3
IO333NB7F31
E2
GND
AC3
GND
L11
IO333PB7F31
F2
GND
AD1
GND
L12
IO334NB7F31
H4
GND
AD2
GND
L13
IO334PB7F31
J4
GND
AD24
GND
L14
IO335NB7F31
H5
GND
AD25
GND
L15
Note: *Not routed on the same
package layer and to adjacent
LGA pads as its differential
pair complement.
Recommended to be used as
a single-ended I/O.
3- 12 6
AX2000 Function
CG624
Dedicated I/O
Note: *Not routed on the same
package layer and to adjacent
LGA pads as its differential
pair complement.
Recommended to be used as
a single-ended I/O.
R ev isio n 1 8
Note: *Not routed on the same
package layer and to adjacent
LGA pads as its differential
pair complement.
Recommended to be used as
a single-ended I/O.
Axcelerator Family FPGAs
CG624
AX2000 Function
CG624
Pin
Number
AX2000 Function
CG624
Pin
Number
AX2000 Function
Pin
Number
GND
M11
TDI
C5
VCCDA
AD11
GND
M12
TDO
F6
VCCDA
AD4
GND
M13
TMS
D6
VCCDA
AE12
GND
M14
TRST
E6
VCCDA
AE17
GND
M15
VCCA
AB20
VCCDA
B15
GND
N11
VCCA
F22
VCCDA
C15
GND
N12
VCCA
F4
VCCDA
C6
GND
N13
VCCA
J17
VCCDA
D13
GND
N14
VCCA
J9
VCCDA
E13
GND
N15
VCCA
K10
VCCDA
E19
GND
P11
VCCA
K11
VCCDA
F21
GND
P12
VCCA
K15
VCCDA
G10
GND
P13
VCCA
K16
VCCDA
G5
GND
P14
VCCA
L10
VCCDA
N21
GND
P15
VCCA
L16
VCCDA
N5
GND
R11
VCCA
R10
VCCDA
W21
GND
R12
VCCA
R16
VCCIB0
A3
GND
R13
VCCA
T10
VCCIB0
B3
GND
R14
VCCA
T11
VCCIB0
C4
GND
R15
VCCA
T15
VCCIB0
D5
GND
T21
VCCA
T16
VCCIB0
J10
GND
T23
VCCA
U17
VCCIB0
J11
GND
T3
VCCA
U9
VCCIB0
K12
GND
T5
VCCA
Y4
VCCIB1
A23
GND
V1
VCCDA
A12
VCCIB1
B23
GND
V25
VCCDA
A14
VCCIB1
C22
GND
V5
VCCDA
AA13
VCCIB1
D21
PRA
F13
VCCDA
AA15
VCCIB1
J15
PRB
A13
VCCDA
AA20
VCCIB1
J16
PRC
AB12
VCCDA
AA7
VCCIB1
K14
PRD
AE13
VCCDA
AB13
VCCIB2
C24
TCK
F5
VCCDA
AC11
VCCIB2
C25
Note: *Not routed on the same
package layer and to adjacent
LGA pads as its differential
pair complement.
Recommended to be used as
a single-ended I/O.
Note: *Not routed on the same
package layer and to adjacent
LGA pads as its differential
pair complement.
Recommended to be used as
a single-ended I/O.
R ev i si o n 1 8
Note: *Not routed on the same
package layer and to adjacent
LGA pads as its differential
pair complement.
Recommended to be used as
a single-ended I/O.
3- 127
Package Pin Assignments
CG624
CG624
AX2000 Function
Pin
Number
AX2000 Function
Pin
Number
VCCIB2
D23
VCCIB6
T9
VCCIB2
E22
VCCIB7
C1
VCCIB2
K17
VCCIB7
C2
VCCIB2
L17
VCCIB7
D3
VCCIB2
M16
VCCIB7
E4
VCCIB3
AA22
VCCIB7
K9
VCCIB3
AB23
VCCIB7
L9
VCCIB3
AC24
VCCIB7
M10
VCCIB3
AC25
VCCPLA
E12
VCCIB3
P16
VCCPLB
J12
VCCIB3
R17
VCCPLC
E14
VCCIB3
T17
VCCPLD
H14
VCCIB4
AB21
VCCPLE
Y14
VCCIB4
AC22
VCCPLF
U14
VCCIB4
AD23
VCCPLG
Y12
VCCIB4
AE23
VCCPLH
U12
VCCIB4
T14
VCOMPLA
F12
VCCIB4
U15
VCOMPLB
H12
VCCIB4
U16
VCOMPLC
F14
VCCIB5
AB5
VCOMPLD
J14
VCCIB5
AC4
VCOMPLE
AA14
VCCIB5
AD3
VCOMPLF
V14
VCCIB5
AE3
VCOMPLG
AA12
VCCIB5
T12
VCOMPLH
V12
VCCIB5
U10
VPUMP
E20
VCCIB5
U11
VCCIB6
AA4
VCCIB6
AB3
VCCIB6
AC1
VCCIB6
AC2
VCCIB6
P10
VCCIB6
R9
Note: *Not routed on the same
package layer and to adjacent
LGA pads as its differential
pair complement.
Recommended to be used as
a single-ended I/O.
Note: *Not routed on the same
package layer and to adjacent
LGA pads as its differential
pair complement.
Recommended to be used as
a single-ended I/O.
3- 12 8
R ev isio n 1 8
4 – Datasheet Information
List of Changes
The following table lists critical changes that were made in the current version of the document.
Revision
Revision 18
(March 2012)
Changes
Page
Table 2-1 • Absolute Maximum Ratings was updated to correct the maximum
DC core supply voltage (VCCA) from 1.6 V to 1.7 V (SAR 36786). The
maximum input voltage (VI) was corrected from 3.75 V to 4.1 V (SAR 35419).
2-1
Values for tristate leakage current IOZ, and IIH and IIL were added to Table 2-3
• Standby Current (SARs 35774, 32021).
2-2
Figure 2-2 • VCCPLX and VCOMPLX Power Supply Connect was updated to
correct the units for the resistance from "W" to Ω (SAR 36415).
2-9
In the Introduction to the "User I/Os" section, the following sentence was added
to clarify the slew rate setting (SAR 34943):
2-11
The slew rate setting is effective for both rising and falling edges.
Revision 17
(September 2011)
Figure 2-3 • Use of an External Resistor for 5 V Tolerance was revised to show
the VCCI and GND clamp diodes. The explanatory text above the figure was
revised as well (SAR 34942).
2-13
EQ 3 for 5 V tolerance was corrected to change Vdiode from 0.6 V to 0.7 V
(SAR 36786).
2-13
Additional information was added to the "Using the Weak Pull-Up and Pull-Down
Circuits" section to clarify how the weak pull-up and pull-down resistors are
physically implemented (SAR 34945).
2-17
The description for the CINCLK parameter in Table 2-18 • Input Capacitance was
changed from "Input capacitance on clock pin" to "Input capacitance on HCLK
and RCLK pin" (SAR 34944).
2-21
Table 2-19 • I/O Input Rise Time and Fall Time* is new (SAR 34942).
2-21
The minimum VIL for 1.5 V LVCMOS and PCI was corrected from –0.5 to –0.3 in
Table 2-29 • DC Input and Output Levels and Table 2-33 • DC Input and Output
Levels (SAR 34358).
2-38, 2-40
Support for simulating the GCLR/ GPSET feature in the Axcelerator Family was
added in Libero software v9.0 SPI1. Reference to the section explaining this in
the Antifuse Macro Library Guide was added to the "R-Cell" section (SAR
26413).
2-58
The enable signal in Figure 2-32 • R-Cell Delays was corrected to show it is
active low rather than active high (SAR 34946).
2-59
The versioning system for datasheets has been changed. Datasheets are
assigned a revision number that increments each time the datasheet is revised.
The "Axcelerator Family Device Status" table indicates the status for each
device in the device family.
iii
The "Features" section, "Programmable Interconnect Element" section, and
"Security" section were revised to clarify that although no existing security
measures can give an absolute guarantee, Microsemi FPGAs implement the
best security available in the industry (SAR 32865).
i, 1-1, 2-108
R ev i si o n 1 8
4 -1
Datasheet Information
Revision
Revision 17
(continued)
Changes
Page
The C180 package was removed from product tables and the "Package Pin
Assignments" section (PDN 0909).
3-1
Package names used in the"Axcelerator Family Product Profile" and "Package
Pin Assignments" section were revised to match standards given in Package
Mechanical Drawings (SAR 27395).
i, 3-1
The "Introduction" section for "User I/Os" was updated as follows:
2-11
"The user does not need to assign VREF pins for OUTBUF and TRIBUF. VREF
pins are needed only for input and bidirectional I/Os" (SARs 24181, 24309).
Power values in Table 2-4 • Default CLOAD/VCCI were updated to reflect those
of SmartPower (SAR 33945).
2-3
Two parameter names were corrected in Figure 2-10 • Output Buffer Delays.
One occurrence of tENLZ was changed to tENZL and one occurrence of tENHZ
was changed to tENZH (SAR 33890).
2-22
The "Timing Model" section was updated with new timing values. Timing tables
in the "I/O Specifications" section were updated to include enable paths. Values
in the timing tables in the "Voltage-Referenced I/O Standards" section and
"Differential Standards" section were updated. Table 2-63 • R-Cell was updated
(SAR 33945).
2-8, 2-26 to
2-53
Figure 2-11 • Timing Model was replaced (SAR 33043).
The timing tables for "RAM" and "FIFO" were updated (SAR 33945).
Revision 16
(v2.8, Oct. 2009)
2-23
2-90 to 2-106
"Data Registers (DRs)" values were modified for IDCODE and USERCODE
(SARs 18257, 26406).
2-108
The package diagram for the "CQ208" package was incorrect and has been
replaced with the correct diagram (SARs 23865, 26345).
3-89
The datasheet was updated to include AX2000-CQ2526 information.
N/A
MIL-STD-883 Class B is no longer supported by Axcelerator FPGAs and as a
result was removed.
N/A
A footnote was added to the "Introduction" in the "Axcelerator Clock
Management System" section.
2-75
Revision 15
(v2.7, Nov. 2008)
RoHS-compliant information was added to the "Ordering Information".
ACTgen was changed to SmartGen because ACTgen is obsolete.
N/A
Revision 14
(v2.6)
In Table 2-4, the units for the PLOAD, P10, and PI/O were updated from mW/MHz
to mW/MHz.
2-3
In the "Pin Descriptions"section, the HCLK and CLK descriptions were updated
to include tie-off information.
2-9
The "Global Resource Distribution" section was updated.
2-70
The " CG624" table was updated.
3-116
Revision 13
(v2.5)
4- 2
ii
A note was added to Table 2-2.
2-1
In the "Package Thermal Characteristics", the temperature was changed from
150°C to 125°C.
2-6
R ev isio n 1 8
Axcelerator Family FPGAs
Revision
Revision 12
(v2.4)
Revision 11
(v2.3)
Revision 10
(v2.2)
Changes
Page
Revised ordering information and timing data to reflect phase out of –3 speed
grade options.
Table 2-3 was updated.
2
The "Packaging Data" section is new.
iv
Table 2-2 was updated.
2-1
"VCCDA Supply Voltage" was updated.
2-9
"PRA/B/C/D Probe A, B, C and D" was updated.
2-10
The "User I/Os" was updated.
2-11
Figure 1-3 was updated.
1-2
Table 2-2 was updated.
2-1
The "Power-Up/Down Sequence" section was updated.
2-1
Table 2-4 was updated.
2-3
Table 2-5 was updated.
2-4
The "Timing Characteristics" section was added.
2-7
Table 2-7 was updated.
2-7
Figure 2-1 was updated.
2-8
The External Setup and Clock-to-Out (Pad-to-Pad) equations in the "Hardwired
Clock – Using LVTTL 24 mA High Slew Clock I/O" section were updated.
2-8
The External Setup and Clock-to-Out (Pad-to-Pad) in the "Routed Clock – Using
LVTTL 24 mA High Slew Clock I/O" section were updated.
2-8
The "Global Pins" section was updated.
2-10
The "User I/Os" section was updated.
2-11
Table 2-17 was updated.
2-19
Figure 2-8 was updated.
2-20
Figure 2-13 and Figure 2-14 were updated.
2-24
The following timing parameters were renamed in I/O timing characteristic
tables from Table 2-22 to Table 2-60:
2-26 to 2-52
tIOCLKQ > tICLKQ
tIOCLKY > tOCLKQ
Timing numbers were updated from Table 2-22 to Table 2-78.
2-26 to 2-69
The "R-Cell" section was updated.
2-58
Figure 2-59 was updated.
2-89
Figure 2-60 was updated.
2-89
Figure 2-67 was updated.
2-100
Figure 2-68 was updated.
2-101
Table 2-89 to Table 2-93 were updated.
2-90 to 2-94
Table 2-98 to Table 2-102 were updated.
2-102 to
2-106
R ev i si o n 1 8
4 -3
Datasheet Information
Revision
Revision 10
(continued)
Revision 9
(v2.1)
Revision 8
(v2.0)
Changes
The "TRST" section was updated.
2-107
The "Global Set Fuse" section was added.
2-109
A footnote was added to "FG896" for the AX2000 regarding pins AB1, AE2, G1,
and K2.
3-52
Pinouts for the AX250, AX500, and AX1000 were added for "CQ352".
3-98
Pinout for the AX1000 was added for "CG624".
3-115
Table 2-79 was updated.
2-69
The "Low Power Mode" section was updated.
2-106
Table 1 has been updated.
i
The "Ordering Information" section has been updated.
ii
The "Device Resources" section has been updated.
ii
The "Temperature Grade Offerings" section is new.
iii
The "Speed Grade and Temperature Grade Matrix" section has been updated.
iii
Table 2-9 has been updated.
2-12
Table 2-10 has been updated.
2-12
Table 2-1 has been updated.
2-1
Table 2-2 has been updated.
2-1
Table 2-3 has been updated.
2-2
Table 2-4 has been updated.
2-3
Table 2-5 has been updated.
2-4
The "Power Estimation Example" section has been updated.
2-5
The "Thermal Characteristics" section has been updated.
2-6
The "Package Thermal Characteristics" section has been updated.
2-6
The "Timing Characteristics" section has been updated.
2-7
The "Pin Descriptions" section has been updated.
2-9
Timing numbers have been updated from the "3.3 V LVTTL" section to the
"Timing Characteristics" section. Many AC Loads were updated as well.
2-25 to 2-59
Timing characteristics for the "Hardwired Clocks" and "Routed Clocks" sections
were updated.
2-66, 2-68
Table 2-89 to Table 2-92 and Table 2-98 to Table 2-99 were updated.
The following sections were updated:
"Low Power Mode", "Interface", "Data Registers (DRs)", "Security", "Silicon
Explorer II Probe Interface", and "Programming"
In the "PQ208" (AX500) section, pins 2, 52, and 156 changed from VCCDA to
VCCA. For pins 170 and 171, the I/O names refer to pair 23 instead of 24.
4- 4
Page
R ev isio n 1 8
2-90 to 2-93,
2-102 to
2-103
2-106 to
2-110
3-84
Axcelerator Family FPGAs
Revision
Revision 8
(continued)
Changes
The following changes were made in the "FG676"(AX500) section:
AE2, AE25
Change from NC to GND.
AF2, AF25
Changed from GND to NC
AB4, AF24, C1, C26
Changed from VCCDA to VCCA
AD15
Change from VCCDA to VCOMPLE
AD17
Changed from VCOMPLE to VCCDA
3-37
In the "FG896" (AX2000) section, the AK28 changed from VCCIB5 to VCCIB4.
3-52
The "CQ352" and "CG624" sections are new.
Revision 7
(Advance v1.6)
Revision 6
(Advance v1.5)
Revision 5
(Advance v1.4)
Page
All I/O FIFO capability was removed.
Table 1 was updated.
3-98, 3-115
n/a
i
Figure 1-9 was updated.
1-7
Figure 2-5 was updated.
2-16
The "Using an I/O Register" section was updated.
2-16
The AX250 and AX1000 descriptions were added to the "FG484"section.
3-21
Table 2-3 was updated.
2-2
Figure 2-1 was updated.
2-8
Figure 2-48 was updated.
2-75
Figure 2-52 was updated.
2-82
In the "PQ208" table, pin 196 was missing, but it has been added in this version
with a function of GND.
3-84
The following pins in the "FG484" table for AX500 were changed:
3-21
Pin G7 is GND/LP
Pins AB8, C10, C11, C14, AB16 are NC.
The "FG676" table was updated.
Revision 4
(Advance v1.3)
Revision 3
(Advance v1.2)
3-37
The "Device Resources" section was updated for the CS180.
The "Programmable Interconnect Element" and Figure 1-2 are new.
ii
1-1 and 1-2
The "CS180" table is new.
3-1
The "PQ208" tables for the AX500 were updated. The following pins were not
defined in the previous version:
GND 21
IO106PB5F10/CLKHP 71
GND 136
3-84
Table 1, "Ordering Information", "Device Resources", and the Product Plan table
were updated.
i, ii
The following figures and tables were updated:
Figure 1-3
Figure 1-8 (new)
Table 2-3
Figure 2-2
Table 2-8
Figure 2-11
1-2
1-6
2-2
2-9
2-12
2-23
The "Design Environment" section was updated.
1-7
The "Package Thermal Characteristics" was updated.
2-6
R ev i si o n 1 8
4 -5
Datasheet Information
Revision
Revision 3
(continued)
Changes
The timing characteristics tables from pages 2-26 to 2-60 were updated.
The "Global Resources" section was updated.
The timing characteristics tables from pages 2-102 to 2-103 were updated.
The "PQ208", "FG256", and "FG324" tables are new.
4- 6
R ev isio n 1 8
Page
2-26 to 2-60
2-66
2-102 to
2-103
3-9,3-16, 3-84
Axcelerator Family FPGAs
Datasheet Categories
Categories
In order to provide the latest information to designers, some datasheet parameters are published before
data has been fully characterized from silicon devices. The data provided for a given device, as
highlighted in the "Axcelerator Family Device Status" table on page iii, is designated as either "Product
Brief," "Advance," "Preliminary," or "Production." The definitions of these categories are as follows:
Product Brief
The product brief is a summarized version of a datasheet (advance or production) and contains general
product information. This document gives an overview of specific device and family information.
Advance
This version contains initial estimated information based on simulation, other products, devices, or speed
grades. This information can be used as estimates, but not for production. This label only applies to the
DC and Switching Characteristics chapter of the datasheet and will only be used when the data has not
been fully characterized.
Preliminary
The datasheet contains information based on simulation and/or initial characterization. The information is
believed to be correct, but changes are possible.
Production
This version contains information that is considered to be final.
Export Administration Regulations (EAR)
The products described in this document are subject to the Export Administration Regulations (EAR).
They could require an approved export license prior to export from the United States. An export includes
release of product or disclosure of technology to a foreign national inside or outside the United States.
Safety Critical, Life Support, and High-Reliability Applications
Policy
The products described in this advance status document may not have completed the Microsemi
qualification process. Products may be amended or enhanced during the product introduction and
qualification process, resulting in changes in device functionality or performance. It is the responsibility of
each customer to ensure the fitness of any product (but especially a new product) for a particular
purpose, including appropriateness for safety-critical, life-support, and other high-reliability applications.
Consult the Microsemi SoC Products Group Terms and Conditions for specific liability exclusions relating
to life-support applications. A reliability report covering all of the SoC Products Group’s products is
available at http://www.microsemi.com/soc/documents/ORT_Report.pdf. Microsemi also offers a variety
of enhanced qualification and lot acceptance screening procedures. Contact your local sales office for
additional reliability information.
R ev i si o n 1 8
4 -7
Microsemi Corporation (NASDAQ: MSCC) offers a comprehensive portfolio of semiconductor
solutions for: aerospace, defense and security; enterprise and communications; and industrial
and alternative energy markets. Products include high-performance, high-reliability analog and
RF devices, mixed signal and RF integrated circuits, customizable SoCs, FPGAs, and
complete subsystems. Microsemi is headquartered in Aliso Viejo, Calif. Learn more at
www.microsemi.com.
Microsemi Corporate Headquarters
One Enterprise, Aliso Viejo CA 92656 USA
Within the USA: +1 (949) 380-6100
Sales: +1 (949) 380-6136
Fax: +1 (949) 215-4996
© 2012 Microsemi Corporation. All rights reserved. Microsemi and the Microsemi logo are trademarks of
Microsemi Corporation. All other trademarks and service marks are the property of their respective owners.
5172160-18/3.12