TI CD74HCT175 High speed cmos logic quad d-type flip-flop with reset Datasheet

[ /Title
(CD74
HC175
,
CD74
HCT17
5)
/Subject
(High
Speed
CMOS
Logic
Quad
DType
Flip-
CD74HC175,
CD74HCT175
Data sheet acquired from Harris Semiconductor
SCHS160
High Speed CMOS Logic
Quad D-Type Flip-Flop with Reset
August 1997
Features
Description
• Common Clock and Asynchronous Reset on Four
D-Type Flip-Flops
The Harris CD74HC175 and CD74HCT175 are high speed
Quad D-type Flip-Flops with individual D-inputs and Q, Q
complementary outputs. The devices are fabricated using
silicon gate CMOS technology. They have the low power
consumption advantage of standard CMOS ICs and the
ability to drive 10 LSTTL devices.
• Positive Edge Pulse Triggering
• Complementary Outputs
• Buffered Inputs
• Fanout (Over Temperature Range)
- Standard Outputs . . . . . . . . . . . . . . . 10 LSTTL Loads
- Bus Driver Outputs . . . . . . . . . . . . . 15 LSTTL Loads
Information at the D input is transferred to the Q, Q outputs on
the positive going edge of the clock pulse. All four Flip-Flops
are controlled by a common clock (CP) and a common reset
(MR). Resetting is accomplished by a low voltage level
independent of the clock. All four Q outputs are reset to a
logic 0 and all four Q outputs to a logic 1.
• Wide Operating Temperature Range . . . -55oC to 125oC
Ordering Information
• Typical fMAX = 50MHz at VCC = 5V, CL = 15pF,
TA = 25oC
• Balanced Propagation Delay and Transition Times
• Significant Power Reduction Compared to LSTTL
Logic ICs
PART NUMBER
• HC Types
- 2V to 6V Operation
- High Noise Immunity: NIL = 30%, NIH = 30% of VCC
at VCC = 5V
• HCT Types
- 4.5V to 5.5V Operation
- Direct LSTTL Input Logic Compatibility,
VIL= 0.8V (Max), VIH = 2V (Min)
- CMOS Input Compatibility, Il ≤ 1µA at VOL, VOH
TEMP. RANGE
(oC)
PKG.
NO.
PACKAGE
CD74HC175E
-55 to 125
16 Ld PDIP
E16.3
CD74HCT175E
-55 to 125
16 Ld PDIP
E16.3
CD74HC175M
-55 to 125
16 Ld SOIC
M16.15
CD74HCT175M
-55 to 125
16 Ld SOIC
M16.15
CD74HCT175W
-55 to 125
Wafer
NOTES:
1. When ordering, use the entire part number. Add the suffix 96 to
obtain the variant in the tape and reel.
2. Die for this part number is available which meets all electrical
specifications. Please contact your local sales office or Harris
customer service for ordering information.
Pinout
CD74HC175, CD74HCT175
(PDIP, SOIC)
TOP VIEW
MR 1
16 VCC
Q0 2
15 Q3
Q0 3
14 Q3
D0 4
13 D3
D1 5
12 D2
Q1 6
11 Q2
Q1 7
10 Q2
GND 8
9 CP
CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures.
Copyright
© Harris Corporation 1997
1
File Number
1474.1
CD74HC175, CD74HCT175
Functional Diagram
4
D0
2
D
Q
9
CP
CP
1
MR
Q
R
5
D1
Q
CP
Q1
6
Q
R
12
Q1
10
D
Q
CP
Q2
11
Q
R
13
D3
Q0
7
D
D2
Q0
3
Q2
15
D
Q
CP
Q3
14
Q
R
Q3
TRUTH TABLE
INPUTS
OUTPUTS
RESET (MR)
CLOCK CP
DATA Dn
Qn
Qn
L
X
X
L
H
H
↑
H
H
L
H
↑
L
L
H
H
L
X
Q0
Q0
NOTE: H = High Voltage Level, L = Low Voltage Level, X = Don’t Care, ↑ = Transition from Low to High Level,
Q0 = Level Before the Indicated Steady-State Input Conditions Were Established.
Logic Diagram
4 (5, 12, 13)
Dn
D
CL
CL
p
p
n
n
CL
CL
3( 6, 11, 14)
Qn
CL
CL
p
p
n
n
CL
CL
R
ONE OF FOUR F/F
CL
CL
2( 7, 10, 15)
Qn
CP
1
MR
TO OTHER THREE F/F
8
16
9
CP
TO OTHER THREE F/F
GND
2
VCC
CD74HC175, CD74HCT175
Absolute Maximum Ratings
Thermal Information
DC Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7V
DC Input Diode Current, IIK
For VI < -0.5V or VI > VCC + 0.5V . . . . . . . . . . . . . . . . . . . . . .±20mA
DC Output Diode Current, IOK
For VO < -0.5V or VO > VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±20mA
DC Output Source or Sink Current per Output Pin, IO
For VO > -0.5V or VO < VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±25mA
DC VCC or Ground Current, ICC or IGND . . . . . . . . . . . . . . . . . .±50mA
Thermal Resistance (Typical, Note 3)
θJA (oC/W)
PDIP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
90
SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
110
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . 150oC
Maximum Storage Temperature Range . . . . . . . . . .-65oC to 150oC
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300oC
(SOIC - Lead Tips Only)
Operating Conditions
Temperature Range (TA) . . . . . . . . . . . . . . . . . . . . . -55oC to 125oC
Supply Voltage Range, VCC
HC Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2V to 6V
HCT Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5V to 5.5V
DC Input or Output Voltage, VI, VO . . . . . . . . . . . . . . . . . 0V to VCC
Input Rise and Fall Time
2V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1000ns (Max)
4.5V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500ns (Max)
6V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400ns (Max)
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
3. θJA is measured with the component mounted on an evaluation PC board in free air.
DC Electrical Specifications
TEST
CONDITIONS
PARAMETER
SYMBOL
VI (V)
VIH
-
25oC
IO (mA) VCC (V)
-40oC TO +85oC
-55oC TO 125oC
MIN
TYP
MAX
MIN
MAX
MIN
MAX
UNITS
2
1.5
-
-
1.5
-
1.5
-
V
4.5
3.15
-
-
3.15
-
3.15
-
V
6
4.2
-
-
4.2
-
4.2
-
V
HC TYPES
High Level Input
Voltage
Low Level Input
Voltage
High Level Output
Voltage
CMOS Loads
VIL
VOH
-
VIH or
VIL
High Level Output
Voltage
TTL Loads
Low Level Output
Voltage
CMOS Loads
VOL
VIH or
VIL
Low Level Output
Voltage
TTL Loads
Input Leakage
Current
Quiescent Device
Current
-
-
2
-
-
0.5
-
0.5
-
0.5
V
4.5
-
-
1.35
-
1.35
-
1.35
V
6
-
-
1.8
-
1.8
-
1.8
V
-0.02
2
1.9
-
-
1.9
-
1.9
-
V
-0.02
4.5
4.4
-
-
4.4
-
4.4
-
V
-0.02
6
5.9
-
-
5.9
-
5.9
-
V
-4
4.5
3.98
-
-
3.84
-
3.7
-
V
-5.2
6
5.48
-
-
5.34
-
5.2
-
V
0.02
2
-
-
0.1
-
0.1
-
0.1
V
0.02
4.5
-
-
0.1
-
0.1
-
0.1
V
0.02
6
-
-
0.1
-
0.1
-
0.1
V
4
4.5
-
-
0.26
-
0.33
-
0.4
V
5.2
6
-
-
0.26
-
0.33
-
0.4
V
II
VCC or
GND
-
6
-
-
±0.1
-
±1
-
±1
µA
ICC
VCC or
GND
0
6
-
-
8
-
80
-
160
µA
3
CD74HC175, CD74HCT175
DC Electrical Specifications
(Continued)
TEST
CONDITIONS
SYMBOL
VI (V)
High Level Input
Voltage
VIH
-
-
Low Level Input
Voltage
VIL
-
High Level Output
Voltage
CMOS Loads
VOH
VIH or
VIL
PARAMETER
25oC
IO (mA) VCC (V)
-40oC TO +85oC
-55oC TO 125oC
MIN
TYP
MAX
MIN
MAX
MIN
MAX
UNITS
4.5 to
5.5
2
-
-
2
-
2
-
V
-
4.5 to
5.5
-
-
0.8
-
0.8
-
0.8
V
-0.02
4.5
4.4
-
-
4.4
-
4.4
-
V
-4
4.5
3.98
-
-
3.84
-
3.7
-
V
0.02
4.5
-
-
0.1
-
0.1
-
0.1
V
4
4.5
-
-
0.26
-
0.33
-
0.4
V
HCT TYPES
High Level Output
Voltage
TTL Loads
Low Level Output
Voltage
CMOS Loads
VOL
VIH or
VIL
Low Level Output
Voltage
TTL Loads
Input Leakage
Current
Quiescent Device
Current
Additional Quiescent
Device Current Per
Input Pin: 1 Unit Load
(Note 4)
II
VCC to
GND
0
5.5
-
-
±0.1
-
±1
-
±1
µA
ICC
VCC or
GND
0
5.5
-
-
8
-
80
-
160
µA
∆ICC
VCC
-2.1
-
4.5 to
5.5
-
100
360
-
450
-
490
µA
NOTES:
4. For dual-supply systems theorectical worst case (VI = 2.4V, VCC = 5.5V) specification is 1.8mA.
5. Die for this part number is available which meets all electrical specifications.
HCT Input Loading Table
INPUT
UNIT LOADS
MR
1
CP
0.60
D
0.15
NOTE: Unit Load is ∆ICC limit specified in DC Electrical
Specifications table, e.g. 360µA max at 25oC.
Prerequisite For Switching Specifications
PARAMETER
25oC
-40oC TO 85oC -55oC TO 125oC
SYMBOL
TEST
CONDITIONS
VCC
(V)
MIN
TYP
MAX
MIN
MAX
MIN
MAX
UNITS
tw
-
2
80
-
-
100
-
120
-
ns
4.5
16
-
-
20
-
24
-
ns
6
14
-
-
17
-
20
-
ns
2
80
-
-
100
-
120
-
ns
4.5
16
-
-
20
-
24
-
ns
6
14
-
-
17
-
20
-
ns
HC TYPES
Clock Pulse Width
MR Pulse Width
tw
-
4
CD74HC175, CD74HCT175
Prerequisite For Switching Specifications
PARAMETER
Setup Time, Data to Clock
-40oC TO 85oC -55oC TO 125oC
SYMBOL
VCC
(V)
MIN
TYP
MAX
MIN
MAX
MIN
MAX
UNITS
tSU
-
2
80
-
-
100
-
120
-
ns
4.5
16
-
-
20
-
24
-
ns
6
14
-
-
17
-
20
-
ns
2
5
-
-
5
-
5
-
ns
4.5
5
-
-
5
-
5
-
ns
6
5
-
-
5
-
5
-
ns
2
5
-
-
5
-
5
-
ns
4.5
5
-
-
5
-
5
-
ns
6
5
-
-
5
-
5
-
ns
2
6
-
-
5
-
4
-
MHz
4.5
30
-
-
25
-
20
-
MHz
6
35
-
-
29
-
23
-
MHz
tH
-
tREM
Clock Frequency
25oC
TEST
CONDITIONS
Hold Time, Data to Clock
Removal Time, MR to Clock
(Continued)
-
fMAX
-
HCT TYPES
Clock Pulse Width
tw
-
4.5
20
-
-
25
-
30
-
ns
MR Pulse Width
tw
-
4.5
20
-
-
25
-
30
-
ns
Setup Time Data to Clock
tSU
-
4.5
20
-
-
25
-
30
-
ns
Hold Time Data to Clock
tH
-
4.5
5
-
-
5
-
5
-
ns
Removal Time MR to Clock
tREM
-
4.5
5
-
-
5
-
5
-
ns
Clock Frequency
fMAX
-
4.5
25
-
-
20
-
16
-
MHz
Switching Specifications
PARAMETER
Input tr, tf = 6ns
SYMBOL
TEST
CONDITIONS
tPLH, tPHL
CL = 50pF
25oC
-40oC TO 85oC
-55oC TO
125oC
VCC (V)
TYP
MAX
MAX
MAX
UNITS
2
-
175
220
265
ns
4.5
-
35
44
53
ns
6
-
30
37
45
ns
CL = 15pF
5
14
-
-
-
ns
CL = 50pF
2
-
175
220
265
ns
4.5
-
35
44
53
ns
6
-
30
37
45
ns
CL = 15pF
5
14
-
-
-
ns
CL = 50pF
2
-
75
95
110
ns
4.5
-
15
19
22
ns
6
-
13
16
19
ns
HC TYPES
Propagation Delay, Clock to
Q or Q
Propagation Delay,
MR to Q or Q
Output Transition Times
tPLH, tPHL
tTLH, tTHL
Input Capacitance
CIN
-
-
-
10
10
10
pF
Power Dissipation
Capacitance
(Notes 6, 7)
CPD
-
5
65
-
-
-
pF
5
CD74HC175, CD74HCT175
Switching Specifications
Input tr, tf = 6ns (Continued)
SYMBOL
TEST
CONDITIONS
Propagation Delay,
Clock to Q or Q
tPLH, tPHL
Propagation Delay,
MR to Q or Q
tPLH, tPHL
Output Transition Times
tTLH, tTHL
PARAMETER
25oC
-40oC TO 85oC
-55oC TO
125oC
VCC (V)
TYP
MAX
MAX
MAX
UNITS
CL = 50pF
4.5
-
33
41
50
ns
CL = 15pF
5
13
-
-
-
ns
CL = 50pF
4.5
-
35
44
53
ns
CL = 15pF
5
17
-
-
-
ns
CL = 50pF
4.5
-
15
19
22
ns
HCT TYPES
Input Capacitance
CIN
-
-
-
10
10
10
pF
Power Dissipation
Capacitance
(Notes 6, 7)
CPD
-
5
67
-
-
-
pF
NOTES:
6. CPD is used to determine the dynamic power consumption, per flip-flop.
7. PD = VCC2 fi + ∑ (CL VCC2 + fO) where fi = Input Frequency, fO = Input Frequency, CL = Output Load Capacitance, VCC = Supply Voltage.
Test Circuits and Waveforms
CLOCK
INPUT
trCL
tfCL
trCL
VCC
90%
GND
tH(H)
GND
tH(H)
VCC
DATA
INPUT
50%
tH(L)
3V
1.3V
1.3V
1.3V
GND
tSU(H)
tSU(H)
tSU(L)
tTLH
90%
OUTPUT
tTHL
90%
50%
10%
tTLH
90%
1.3V
OUTPUT
tREM
3V
SET, RESET
OR PRESET
GND
tTHL
1.3V
10%
FIGURE 1. HC SETUP TIMES, HOLD TIMES, REMOVAL TIME,
AND PROPAGATION DELAY TIMES FOR EDGE
TRIGGERED SEQUENTIAL LOGIC CIRCUITS
tPHL
1.3V
GND
IC
CL
50pF
GND
90%
tPLH
50%
IC
tSU(L)
tPHL
tPLH
tREM
VCC
SET, RESET
OR PRESET
1.3V
0.3V
tH(L)
DATA
INPUT
3V
2.7V
CLOCK
INPUT
50%
10%
tfCL
CL
50pF
FIGURE 2. HCT SETUP TIMES, HOLD TIMES, REMOVAL TIME,
AND PROPAGATION DELAY TIMES FOR EDGE
TRIGGERED SEQUENTIAL LOGIC CIRCUITS
6
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