DS26C31M, DS26C31T www.ti.com SNLS375B – JUNE 1998 – REVISED APRIL 2013 DS26C31T/DS26C31M CMOS Quad TRI-STATE® Differential Line Driver Check for Samples: DS26C31M, DS26C31T FEATURES DESCRIPTION • • • • • The DS26C31 is a quad differential line driver designed for digital data transmission over balanced lines. The DS26C31T meets all the requirements of EIA standard RS-422 while retaining the low power characteristics of CMOS. The DS26C31M is compatible with EIA standard RS-422; however, one exception in test methodology is taken (1). This enables the construction of serial and terminal interfaces while maintaining minimal power consumption. 1 23 • • • • • TTL Input Compatible Typical Propagation Delays: 6 ns Typical Output Skew: 0.5 ns Outputs Will Not Load Line when VCC = 0V DS26C31T Meets the Requirements of EIA Standard RS-422 Operation from Single 5V Supply TRI-STATE Outputs for Connection to System Buses Low Quiescent Current Available in Surface Mount Mil-Std-883C Compliant The DS26C31 accepts TTL or CMOS input levels and translates these to RS-422 output levels. This part uses special output circuitry that enables the drivers to power down without loading down the bus. This device has enable and disable circuitry common to all four drivers. The DS26C31 is pin compatible to the AM26LS31 and the DS26LS31. All inputs are protected against damage due to electrostatic discharge by diodes to VCC and ground. (1) The DS26C31M (−55°C to +125°C) is tested with VOUT between +6V and 0V while RS-422A condition is +6V and −0.25V. Connection Diagrams Figure 1. Dual-In-Line Package, Top View See Package Number D0016A or NFG0016E For Complete Military Product Specifications, refer to the appropriate SMD or MDS. See Package Number NAJ0020A, NFE0016A or NAD0016A 1 2 3 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. TRI-STATE is a registered trademark of Texas Instruments. All other trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 1998–2013, Texas Instruments Incorporated DS26C31M, DS26C31T SNLS375B – JUNE 1998 – REVISED APRIL 2013 www.ti.com Figure 2. 20-Lead Ceramic Leadless Chip Carrier (NAJ) Truth Table (1) ENABLE ENABLE L H Input Non-Inverting Inverting Output Output X Z Z All other L L H combinations of H H L enable inputs (1) 2 L = Low logic state X = Irrelevant H = High logic state Z = TRI-STATE (high impedance) Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: DS26C31M DS26C31T DS26C31M, DS26C31T www.ti.com SNLS375B – JUNE 1998 – REVISED APRIL 2013 These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Absolute Maximum Ratings (1) (2) (3) −0.5V to 7.0V Supply Voltage (VCC) −1.5V to VCC +1.5V DC Input Voltage (VIN) −0.5V to 7V DC Output Voltage (VOUT) Clamp Diode Current (IIK, IOK) ±20 mA DC Output Current, per pin (IOUT) ±150 mA DC VCC or GND Current, per pin (ICC) −65°C to +150°C Storage Temperature Range (TSTG) Max. Power Dissipation (PD) @25°C (4) Lead Temperature (TL) This device does not meet 2000V ESD Rating. (1) (2) (3) (4) (5) Ceramic “NFE” Pkg. 2419 mW Plastic “NFG” Pkg. 1736 mW SOIC “D” Pkg. 1226 mW Ceramic “NAD” Pkg. 1182 mW Ceramic “NAJ” Pkg. 2134 mW (Soldering, 4 sec.) 260°C (5) Unless otherwise specified, all voltages are referenced to ground. All currents into device pins are positive, all currents out of device pins are negative. Absolute Maximum Ratings are those values beyond which the safety of the device cannot be verified. They are not meant to imply that the device should be operated at these limits. The table of “Electrical Characteristics” provide conditions for actual device operation. If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications. Ratings apply to ambient temperature at 25°C. Above this temperature derate NFG package at 13.89 mW/°C, NFE package 16.13 mW/°C, D package 9.80 mW/°C, NAJ package 12.20 mW/°C, and NAD package 6.75 mW/°C. ESD Rating: HBM (1.5 kΩ, 100 pF); Inputs ≥ 1500V; Outputs ≥ 1000V; EIAJ (0Ω, 200 pF) ≥ 350V Operating Conditions Supply Voltage (VCC) Min Max Units 4.50 5.50 V DC Input or Output Voltage (VIN, VOUT) 0 VCC V Operating Temperature Range (TA) DS26C31T −40 +85 °C DS26C31M −55 +125 °C 500 ns Input Rise or Fall Times (tr, tf) Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: DS26C31M DS26C31T Submit Documentation Feedback 3 DS26C31M, DS26C31T SNLS375B – JUNE 1998 – REVISED APRIL 2013 www.ti.com DC Electrical Characteristics VCC = 5V ± 10% (unless otherwise specified) (1) Symbol Parameter VIH High Level Input Voltage VIL Low Level Input Voltage VOH High Level Output Voltage Conditions Min Typ Max 2.0 V 0.8 VIN = VIH or VIL, 2.5 Units 3.4 V V IOUT = −20 mA VOL Low Level Output Voltage VIN = VIH or VIL, 0.3 0.5 V IOUT = 20 mA VT Differential Output Voltage RL = 100Ω See |VT| − |VT | Difference In Differential Output 2.0 3.1 V (2) RL = 100Ω 0.4 V 3.0 V 0.4 V ±1.0 μA See (2) VOS Common Mode Output Voltage RL = 100Ω 1.8 See (2) |VOS − VOS | Difference In Common Mode Output RL = 100Ω IIN Input Current VIN = VCC, GND, VIH, or VIL ICC Quiescent Supply Current (3) DS26C31T VIN = VCC or GND 200 500 μA IOUT = 0 μA VIN = 2.4V or 0.5V (3) 0.8 2.0 mA DS26C31M VIN = VCC or GND 200 500 μA IOUT = 0 μA VIN = 2.4V or 0.5V (3) 0.8 2.1 mA ±0.5 ±5.0 μA −150 mA 100 μA −100 μA 100 μA −100 μA IOZ TRI-STATE Output Leakage Current See (2) VOUT = VCC or GND ENABLE = VIL ENABLE = VIH ISC Output Short Circuit Current VIN = VCC or GND (2) (4) IOFF Output Leakage Current Power Off (2) DS26C31T VOUT = 6V VCC = 0V VOUT = −0.25V DS26C31M VOUT = 6V VCC = 0V VOUT = 0V (5) (1) (2) (3) (4) (5) −30 Unless otherwise specified, min/max limits apply across the recommended operating temperature range. All typicals are given for VCC = 5V and TA = 25°C. See EIA Specification RS-422 for exact test conditions. Measured per input. All other inputs at VCC or GND. This is the current sourced when a high output is shorted to ground. Only one output at a time should be shorted. The DS26C31M (−55°C to +125°C) is tested with VOUT between +6V and 0V while RS-422A condition is +6V and −0.25V. Switching Characteristics VCC = 5V ±10%, tr ≤ 6 ns, tf ≤ 6 ns (Figure 3, Figure 4, Figure 5, Figure 6) (1) Symbol Parameter Conditions Min Typ Max 2 6 11 14 ns S1 Open 0.5 2.0 3.0 ns DS26C31T tPLH, tPHL Propagation Delays Input to Output (2) Skew S1 Open Units CS26C31M tTLH, tTHL Differential Output Rise And Fall Times S1 Open 6 10 14 ns tPZH Output Enable Time S1 Closed 11 19 22 ns tPZL Output Enable Time S1 Closed 13 21 28 ns (1) (2) 4 Unless otherwise specified, min/max limits apply across the recommended operating temperature range. All typicals are given for VCC = 5V and TA = 25°C. Skew is defined as the difference in propagation delays between complementary outputs at the 50% point. Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: DS26C31M DS26C31T DS26C31M, DS26C31T www.ti.com SNLS375B – JUNE 1998 – REVISED APRIL 2013 Switching Characteristics (continued) VCC = 5V ±10%, tr ≤ 6 ns, tf ≤ 6 ns (Figure 3, Figure 4, Figure 5, Figure 6)(1) Symbol Parameter Conditions Min Typ Max Units DS26C31T CS26C31M tPHZ Output Disable Time (3) S1 Closed 5 9 12 tPLZ Output Disable Time (3) S1 Closed 7 11 14 CPD Power Dissipation Capacitance (4) 50 pF CIN Input Capacitance 6 pF (3) (4) ns ns Output disable time is the delay from ENABLE or ENABLE being switched to the output transistors turning off. The actual disable times are less than indicated due to the delay added by the RC time constant of the load. CPD determines the no load dynamic power consumption, PD = CPD VCC2 f + ICC VCC, and the no load dynamic current consumption, IS = CPD VCC f + ICC. Comparison Table of Switching Characteristics into “LS-Type” Load VCC = 5V, TA = 25°C, tr ≤ 6 ns, tf ≤ 6 ns (Figure 4, Figure 6, Figure 7, Figure 8) Symbol tPLH, tPHL Parameter Conditions Propagation Delays Input to Output (1) DS26C31T DS26LS31C Units Typ Max Typ Max 6 8 10 15 ns 0.5 1.0 2.0 6.0 ns 4 6 6 9 15 35 ns 4 7 15 25 ns 14 20 20 30 ns 11 17 20 30 ns CL = 30 pF S1 Closed S2 Closed Skew See (2) CL = 30 pF S1 Closed S2 Closed tTHL, tTLH Differential Output Rise and Fall Times CL = 30 pF S1 Closed ns S2 Closed tPLZ Output Disable Time (3) CL = 10 pF S1 Closed S2 Open tPHZ Output Disable Time (3) CL = 10 pF S1 Open S2 Closed tPZL Output Enable Time CL = 30 pF S1 Closed S2 Open tPZH Output Enable Time CL = 30 pF S1 Open S2 Closed (1) (2) (3) This table is provided for comparison purposes only. The values in this table for the DS26C31 reflect the performance of the device but are not tested or verified. Skew is defined as the difference in propagation delays between complementary outputs at the 50% point. Output disable time is the delay from ENABLE or ENABLE being switched to the output transistors turning off. The actual disable times are less than indicated due to the delay added by the RC time constant of the load. Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: DS26C31M DS26C31T Submit Documentation Feedback 5 DS26C31M, DS26C31T SNLS375B – JUNE 1998 – REVISED APRIL 2013 www.ti.com Logic Diagram AC Test Circuit and Switching Time Waveforms Note: C1 = C2 = C3 = 40 pF (Including Probe and Jig Capacitance), R1 = R2 = 50Ω, R3 = 500Ω. Figure 3. AC Test Circuit Figure 4. Propagation Delays Figure 5. Enable and Disable Times 6 Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: DS26C31M DS26C31T DS26C31M, DS26C31T www.ti.com SNLS375B – JUNE 1998 – REVISED APRIL 2013 Input pulse; f = 1 MHz, 50%; tr ≤ 6 ns, tf ≤ 6 ns Figure 6. Differential Rise and Fall Times Figure 7. Load AC Test Circuit for “LS-Type” Load Figure 8. Enable and Disable Times for “LS-Type” Load Typical Applications *RT is optional although highly recommended to reduce reflection. Figure 9. Two-Wire Balanced System, RS-422 Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: DS26C31M DS26C31T Submit Documentation Feedback 7 DS26C31M, DS26C31T SNLS375B – JUNE 1998 – REVISED APRIL 2013 www.ti.com Typical Performance Characteristics 8 Differential Propagation Delay vs Temperature Differential Propagation Delay vs Power Supply Voltage Figure 10. Figure 11. Differential Skew vs Temperature Differential Skew vs Power Supply Voltage Figure 12. Figure 13. Differential Transition Time vs Temperature Differential Transition Time vs Power Supply Voltage Figure 14. Figure 15. Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: DS26C31M DS26C31T DS26C31M, DS26C31T www.ti.com SNLS375B – JUNE 1998 – REVISED APRIL 2013 Typical Performance Characteristics (continued) Complementary Skew vs Temperature Complementary Skew vs Power Supply Voltage Figure 16. Figure 17. Differential Output Voltage vs Output Current Differential Output Voltage vs Output Current Figure 18. Figure 19. Output High Voltage vs Output High Current Output High Voltage vs Output High Current Figure 20. Figure 21. Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: DS26C31M DS26C31T Submit Documentation Feedback 9 DS26C31M, DS26C31T SNLS375B – JUNE 1998 – REVISED APRIL 2013 www.ti.com Typical Performance Characteristics (continued) 10 Output Low Voltage vs Output Low Current Output Low Voltage vs Output Low Current Figure 22. Figure 23. Supply Current vs Temperature Output Low Voltage vs Output Low Current Figure 24. Figure 25. Output Low Voltage vs Output Low Current Supply Current vs Temperature Figure 26. Figure 27. Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: DS26C31M DS26C31T DS26C31M, DS26C31T www.ti.com SNLS375B – JUNE 1998 – REVISED APRIL 2013 Typical Performance Characteristics (continued) Supply Current vs Power Supply Voltage No Load Supply Current vs Data Rate Figure 28. Figure 29. Loaded Supply Current vs Data Rate Output Short Circuit Current vs Temperature Figure 30. Figure 31. Output Short Circuit Current vs Power Supply Voltage Figure 32. Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: DS26C31M DS26C31T Submit Documentation Feedback 11 DS26C31M, DS26C31T SNLS375B – JUNE 1998 – REVISED APRIL 2013 www.ti.com REVISION HISTORY Changes from Revision A (April 2013) to Revision B • 12 Page Changed layout of National Data Sheet to TI format .......................................................................................................... 11 Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: DS26C31M DS26C31T PACKAGE OPTION ADDENDUM www.ti.com 15-Apr-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) (4) DS26C31TM ACTIVE SOIC D 16 48 TBD Call TI Call TI -40 to 85 DS26C31TM DS26C31TM/NOPB ACTIVE SOIC D 16 48 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 DS26C31TM DS26C31TMX ACTIVE SOIC D 16 2500 TBD Call TI Call TI -40 to 85 DS26C31TM DS26C31TMX/NOPB ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 DS26C31TM DS26C31TN ACTIVE PDIP NFG 16 25 TBD Call TI Call TI -40 to 85 DS26C31TN DS26C31TN/NOPB ACTIVE PDIP NFG 16 25 Green (RoHS & no Sb/Br) CU SN Level-1-NA-UNLIM -40 to 85 DS26C31TN (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. 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Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 24-Apr-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant DS26C31TMX SOIC D 16 2500 330.0 16.4 6.5 10.3 2.3 8.0 16.0 Q1 DS26C31TMX/NOPB SOIC D 16 2500 330.0 16.4 6.5 10.3 2.3 8.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 24-Apr-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) DS26C31TMX SOIC D 16 2500 367.0 367.0 35.0 DS26C31TMX/NOPB SOIC D 16 2500 367.0 367.0 35.0 Pack Materials-Page 2 MECHANICAL DATA NFG0016E N0016E N16E (Rev G) www.ti.com IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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