CERAMIC CHIP INDUCTORS C2 SERIES 1. PART NO. EXPRESSION : C 2 - 1 N 0 S - □□ (a) (b) (c) (a) Series code (d) (d) 10: Standard (b) Inductance code : 1N0 = 1.0nH 11 ~ 99 : Internal control number (c) Tolerance code : S = ± 0.3nH, J = ± 5% 2. CONFIGURATION & DIMENSIONS : A D C B Unit:m/m A B C D 1.6± 0.15 0.8± 0.15 0.8± 0.15 0.2 ~ 0.6 3. SCHEMATIC : 4. MATERIALS : b a Ag(100%) Ni(100%)-1.5um(min.) (a) Body : ceramic ( Pb Free ) (b) Termination : ( Pb Free ) Sn(100%)-3.0um(min.) 5. GENERAL SPECIFICATION : a) Operating temp. : -40° C to +85° C b) Storage condition (component in its packaging) i) Temperature : -10 to 40° C ii) Humidity : 60% NOTE : Specifications subject to change without notice. Please check our website for latest information. 30.01.2015 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 1 CERAMIC CHIP INDUCTORS C2 SERIES 6. ELECTRICAL CHARACTERISTICS : Inductance ( nH ) Part Number AT 100MHz 250mV Q Min. Test Frequency ( MHz ) SRF ( GHz ) Min. DCR (Ω) Max. Rated Current ( mA ) Max. C2-1N0S-10 1.0 8 100 10 0.05 300 C2-1N2S-10 1.2 8 100 10 0.05 300 C2-1N5S-10 1.5 8 100 6 0.10 300 C2-1N8S-10 1.8 8 100 6 0.10 300 C2-2N2S-10 2.2 8 100 6 0.10 300 C2-2N7S-10 2.7 10 100 6 0.10 300 C2-3N3S-10 3.3 10 100 6 0.12 300 0.14 300 C2-3N9S-10 3.9 10 100 6 C2-4N7S-10 4.7 10 100 4 0.16 300 C2-5N6S-10 5.6 10 100 4 0.18 300 C2-6N8J-10 6.8 10 100 4 0.22 300 C2-8N2J-10 8.2 10 100 3.5 0.24 300 C2-10NJ-10 10 12 100 3.4 0.26 300 C2-12NJ-10 12 12 100 2.6 0.28 300 C2-15NJ-10 15 12 100 2.3 0.32 300 0.35 300 C2-18NJ-10 18 12 100 2.0 C2-22NJ-10 22 12 100 1.6 0.40 300 C2-27NJ-10 27 12 100 1.4 0.45 300 C2-33NJ-10 33 12 100 1.2 0.55 300 C2-39NJ-10 39 12 100 1.1 0.60 300 C2-47NJ-10 47 12 100 0.9 0.70 300 C2-56NJ-10 56 12 100 0.9 0.75 300 C2-68NJ-10 68 12 100 0.7 0.85 300 0.6 0.95 300 C2-82NJ-10 82 12 100 C2-R10J-10 100 12 100 0.6 1.00 300 C2-R12J-10 120 8 50 0.5 1.20 300 C2-R15J-10 150 8 50 0.5 1.20 300 C2-R18J-10 180 8 50 0.4 1.30 300 C2-R22J-10 220 8 50 0.4 1.50 300 Tolerance code : S : ± 0.3nH J : ± 5% NOTE : Specifications subject to change without notice. Please check our website for latest information. 30.01.2015 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 2 CERAMIC CHIP INDUCTORS C2 SERIES 7. CHARACTERISTICS CURVES : INDUCTANCE VS FREQUENCY CHARACTERISTICS Q VS FREQUENCY CHARACTERISTICS NOTE : Specifications subject to change without notice. Please check our website for latest information. 30.01.2015 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 3 CERAMIC CHIP INDUCTORS C2 SERIES 8. SOLDERING AND MOUNTING : 8-1. Reflow soldering conditions Pre－heating should be in such a way that the temperature difference between solder and ferrite surface is limited to 150° C max.Also cooling into solvent after soldering should be in such a way that the temperature difference is limited to 100° C max. Unenough pre－heating may cause cracks on the ferrite, resulting in the deterioration of product quality. Temperature(℃) Products should be soldered within the following allowable range indicated by the slanted line. The excessive soldering conditions may cause the corrosion of the electrode, When soldering is repeated, allowable time is the accumulated time. 270 260 250 240 230 0 10 20 30 40 50 60 70 TEMPERATURE ° C Slope of temp. rise 1 to 5 ° C/sec Heat time 50 to 150 sec Heat temperature 120 to 180 ° C C Slope of temp. rise 1 to 5 ° C/sec D Time over 230° C 90~120 sec Peak temperature 255~260 ° C Peak hold time 10 max. sec 3 times A main heating E 230° C B 180° C 120° C pre-heating normal temperature A B C E D No. of mounting TIME(sec.) (Melting area of solder) 8-2. Reworking with soldering iron Preheating 150° C, 1 minute Tip temperature 280° C max Soldering time 3seconds max. Soldering iron output 30w max. End of soldering iron Ø3mm max. Reworking should be limited to only one time. Note：Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on the ferrite material due to the thermal shock. NOTE : Specifications subject to change without notice. Please check our website for latest information. 30.01.2015 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 6 CERAMIC CHIP INDUCTORS C2 SERIES 8-3. Solder Volume Accordingly increasing the solder volume, the mechanical stress to product is also increased. Exceeding solder volume may cause the failure of mechanical or electrical performance. Solder shall be used not to be exceed as shown in Fig. 1. Minimum fillet height = soldering thickness + 25% product height Upper limit t Recommendable Figure 1 NOTE : Specifications subject to change without notice. Please check our website for latest information. 30.01.2015 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 6 CERAMIC CHIP INDUCTORS C2 SERIES 9. PACKAGING INFORMATION : 9-1. Reel Dimension Unit:m/m W1 A(mm) N(mm) W1(mm) W2(mm) 178± 2.0 50 Min. 10± 1.5 20 Max. A N R1.0 21.8± 0.8 13.0± 0.5 2± 0.5 W2 9-2. Tape Dimension Cavity (chip insert) Sprocket hole A Series C2 H F A(mm) C D E J T Unreeling direction G B(mm) C(mm) D(mm) E(mm) F(mm) 1.03± 0.05 1.85± 0.05 8.00± 0.10 3.50± 0.05 1.75± 0.10 G(mm) H(mm) J(mm) 4.00± 0.10 2.00± 0.05 4.00± 0.10 1.55± 0.05 T(mm) 0.95± 0.05 9-3. Packaging Quantity Chip size C2 Reel 4000 Pcs 9-4. Leader / Trailer Tape Empty compar tments Trailer Components Leader Start End 110mm of more H.W 20 pitch of more 400. 560mm NOTE : Specifications subject to change without notice. Please check our website for latest information. 30.01.2015 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 7 CERAMIC CHIP INDUCTORS C2 SERIES 9-5. Tearing Off Force Peeling Strength of Cover Tape F 165° to 180° Carrier Tape 10g ~ 100g Top cover tape Base tape peel angle：165°~180° vs carrier tape Peel Speed : 300mm/min 9-6. Packaging 1. Reel and a bag of desiccant shall be packed in Nylon or plastic bag 2. Maximum of 5 bags shall be packed in an inner box 3. Maximum of 6 inner boxes shall be packed in an outer box Application Notice 1. Storage Conditions : To maintain the solderabililty of terminal electrodes : a) Recommended products should be used within 12 months from the time of delivery. b) The packaging material should be kept where no chlorine or sulfur exists in the air. 2. Transportation : a) Products should be handled with care to avoid damage or contamination from perspiration and skin oils. b) The use of tweezers or vacuum pick up is strongly recommended for individual components. c) Bulk handling should ensure that abrasion and mechanical shock are minimized. NOTE : Specifications subject to change without notice. Please check our website for latest information. 30.01.2015 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 8