AVAGO ADNV-6340 High performance laser mouse bundle Datasheet

ADNB-6011-EV and ADNB-6012-EV
High Performance Laser Mouse Bundles
Data Sheet
Description
The Avago Technologies ADNB-6011-EV and ADNB-6012EV laser mouse bundles are the world’s first laser-illuminated systems enabled for high performance navigation.
Driven by Avago Technologies’ LaserStream Technology,
the mouse can operate on many surfaces that prove
difficult for traditional LED-based optical navigation.
Its high-performance architecture is capable of sensing
high-speed mouse motion – with resolution up to 2000
counts per inch, velocities up to 45 inches per second
(ips) and accelerations up to 20G. This sensor is powered
for the extremely high sensitive user.
The ADNS-6010 sensor along with the ADNS-6120 or
ADNS-6130-001 lens, ADNS-6230-001 clip and ADNV-
6340 laser diode form a complete and compact laser
mouse tracking system. There are no moving parts,
which means high reliability and less maintenance for
the end user. In addition, precision optical alignment is
not required, facilitating high volume assembly. Avago
Technologies Lasers must be used with Avago Technologies sensors and lenses to ensure proper product operation and compliance to eye safety regulations.
This document will begin with some general information
and usage guidelines on the bundles, followed by individual detailed information on ADNS-6010 laser mouse
sensor, ADNV-6340 VCSEL, ADNS-6120 and ADNS-6130001 lenses, and ADNS-6230-001 clip.
ADNB-6011-EV and ADNB-6012-EV High Performance Laser Mouse Bundles include:
Bundle Part Number
Part Number
Description
ADNB-6011-EV
ADNS-6010
Laser Mouse Sensor
ADNV-6340
Single-Mode Vertical-Cavity Surface Emitting Laser (VCSEL)
ADNS-6120
Laser Mouse Round Lens
ADNS-6230-001
Laser Mouse VCSEL Assembly Clip
Bundle Part Number
Part Number
Description
ADNB-6012-EV
ADNS-6010
Laser Mouse Sensor
ADNV-6340
Single-Mode Vertical-Cavity Surface Emitting Laser (VCSEL)
ADNS-6130-001
Laser Mouse Trim Lens
ADNS-6230-001
Laser Mouse VCSEL Assembly Clip
Overview of Laser Mouse Sensor Assembly
Figure 1. Assembly drawing of ADNB-6011-EV (top, front and cross-sectional view)
2D Assembly Drawing of ADNB-6011-EV, PCBs and Base Plate
Customer Supplied VCSEL PCB
ADNS-6010 (sensor)
ADNV-6340 (VCSEL)
Customer Supplied PCB
ADNS-6230-001 (clip)
ADNS-6120 (lens)*
Customer Supplied Base Plate
With Recommended Features
Per IGES Drawing
*or ADNS-6130-001 for trim lens
Figure 2. Exploded view drawing
Shown with ADNS-6120 or ADNS-6130-001 Laser Mouse
Lens, ADNS-6230-001 VCSEL Assembly Clip and ADNV6340 VCSEL. The components interlock as they are
mounted onto defined features on the base plate.
The ADNS-6010 laser mouse sensor is designed for
mounting on a through hole PCB, looking down. There
is an aperture stop and features on the package that
align to the lens.
The ADNV-6340 VCSEL provides a laser diode with a
single longitudinal and a single transverse mode. It is
particularly suited as lower power consumption and
highly coherent replacement of LEDs. It also provides
wider operation range while still remaining within singlemode, reliable operating conditions.
The ADNS-6120 or ADNS-6130-001 Laser Mouse Lens is
designed for use with ADNS-6010 sensor and the illumination subsystem provided by the VCSEL assembly clip
and the VCSEL. Together with the VCSEL, the ADNS-6120
or ADNS-6130-001 lens provides the directed illumination and optical imaging necessary for proper operation
of the Laser Mouse Sensor. ADNS-6120 or ADNS-6130001 is a precision molded optical component and should
be handled with care to avoid scratching of the optical
surfaces. ADNS-6120 has a large round flange to provide
a long creepage path for any ESD events that occur at the
opening of the base plate.
The ADNS-6230-001 VCSEL Assembly Clip is designed to
provide mechanical coupling of the ADNV-6340 VCSEL
to the ADNS-6120 or ADNS-6130-001 lens. This coupling
is essential to achieve the proper illumination alignment
required for the sensor to operate on a wide variety of
surfaces.
Avago Technologies provides an IGES file drawing describing the base plate molding features for lens and
PCB alignment.
Assembly Recommendation
1. Insert the sensor and all other electrical components
into the application PCB (main PCB board and VCSEL
PCB board).
2. Wave solder the entire assembly in a no-wash solder
process utilizing a solder fixture. The solder fixture is
needed to protect the sensor during the solder process. It also sets the correct sensor-to -PCB distance,
as the lead shoulders do not normally rest on the PCB
surface. The fixture should be designed to expose
the sensor leads to solder while shielding the optical
aperture from direct solder contact.
3. Place the lens onto the base plate.
4. Remove the protective kapton tape from the optical
aperture of the sensor. Care must be taken to keep
contaminants from entering the aperture.
5. Insert the PCB assembly over the lens onto the base
plate. The sensor aperture ring should self-align to the
lens. The optical position reference for the PCB is set
by the base plate and lens. Note that the PCB motion
due to button presses must be minimized to maintain
optical alignment.
Figure 3. Recommended PCB mechanical cutouts and spacing
6. Remove the protective kapton tape from the VCSEL.
7. Insert the VCSEL assembly into the lens.
8. Slide the clip in place until it latches. This locks the
VCSEL and lens together.
9. Tune the laser output power from the VCSEL to meet
the Eye Safe Class I Standard as detailed in the LASER
Power Adjustment Procedure.
10. Install the mouse top case. There must be a feature
in the top case (or other area) to press down onto the
sensor to ensure the sensor and lens are interlocked
to the correct vertical height.
Design considerations for improving ESD Performance
Typical Distance
Millimeters
For improved electrostatic discharge performance,
typical creepage and clearance distance are shown in
the table below. Assumption: base plate construction as
per the Avago Technologies supplied IGES file and ADNS6130-001 trim lens (or ADNS-6120 round lens).
Creepage
12.0
Clearance
2.1
The lens flange can be sealed (i.e. glued) to the base
plate. Note that the lens material is polycarbonate and
therefore, cyanoacrylate based adhesives or other adhesives that may damage the lens should NOT be used.
VCSEL PCB
SENSOR
CLIP
LENS
VCSEL
BASE PLATE
PCB
Figure 4. Cross section of PCB assembly
16 KBit EEPROM (optional)
R7 100K
3.3V Regulator
+3.3V
1
SW2
SW1
6
middle
5
right
2
SW3
__
VCC
___
WP
____
HLD
CS
SCLK
SI
S0
left
Vcc
USB
microcontroller
8
3
C1
0.1
16
USB Port
VBUS
GND
D+
D-
17
1
P1.1
VDD3
P0.6
P1.6
P1.7
16
15
4
P0.5 *
P0.4 *
P0.2
P0.3
13
11
12
22
2
23
4
24
3
1
R9
7
4
D+/SCLK
P1.4
D-/SDAT
XTALOUT
18
5
15
MOSI
REFC
C3
0.1
17
C10
470pF
RESET
NPD
REFB
LASER_NEN
N/C
OSC_IN
N/C
RBIN
OSC_OUT
Vcc
1
9
QA
QB
SW4
ALPS
EC10E
2
Scroll wheel encoder
Rbin
Selected
to match
laser
Q2
2N3906
19
11
C8
2.2
GUARD
13
VPP
Figure 5. Schematic Diagram for 3-Button Scroll Wheel USB PS/2 Mouse
GND
R6 2.7K
C9
0.1
D1
VCSEL
12
20
14
8
X1
Murata
24 CSALS24MOX53-B0
MHz
9
10
3
XTALIN/P2.1
R4 20K
MISO
Vcc
1
P0.1 2
10
R3 20K
R1
20K
P0.0
Vreg
GND
SCLK
XY_LASER
R2
20K
7
GND
* Outputs configured as open drain
C2
0.1
NCS
6
10 K
R10
10 K
P1.5
R5
1.30K
3
P0.7 * 21
P1.3
2
3
18
P1.0
CYPRESS
CY7C63743-PXC
8
C6
4.7
U1 25LC160A
P1.2
Vcc
C4
0.1
2
14
6
19
Vcc
3
4
ADNS-6010
5
Vin
GND
Vcc
20
Vout
Gnd
C7
4.7
C5
0.1
7
VDD3
Buttons
U4 LP2950ACZ-3.3
1
Optional
Ground
Plane
Notes (for Figure 5)
· Caps for pins 11, 12, 16 and 18 MUST have trace lengths LESS than
5 mm on each side.
· Pins 16 and 18 caps MUST use pin 17 GND.
· Pin 9, if used, should not be connected to PCB GND to reduce potential RF emissions.
· The 0.1 uF caps must be ceramic.
· Caps should have less than 5 nH of self inductance.
· Caps should have less than 0.2 W ESR.
· NC pins should not be connected to any traces.
· Surface mount parts are recommended.
· Care must be taken when interfacing a 5V microcontroller to
the ADNS-6010. Serial port inputs on the sensor should be connected to open-drain outputs from the microcontroller or use an
active drive level shifter. NPD and RESET should be connected
to 5V microcontroller outputs through a resistor divider or other
level shifting technique.
· VDD3 and GND should have low impedance connections to the
power supply.
· Because the RBIN pin sets the XY_LASER current, the following PC
board layout practices should be followed to reduce the chance
of uncontrolled laser drive current caused from a leakage path
between RBIN and ground. One hypothetical source of such a
leakage path is PC board contamination due to a liquid, such as a
soft drink, being deposited on the printed circuit board.
o The RBIN resistor should be located close to the sensor pin 13. The
traces between the resistor and the sensor should be short.
o The pin 13 solder pad and all exposed conductors connected to
pin 13 should be surrounded by a guard trace connected to VDD3
and devoid of a solder mask.
o The pin 13 solder pad, the traces connected to pin 13, and the
RBIN resistor should be covered with a conformal coating.
o The RBIN resistor should be a thru-hole style to increase the distance between its terminals. This does not apply if a conformal
coating is used.
The ADNS-6010 and the associated components in the
schematic of Figure 5 are intended to comply with Class
1 Eye Safety Requirements of IEC 60825-1. Avago Technologies suggests that manufacturers perform testing to
verify eye safety on each mouse. It is also recommended
to review possible single fault mechanisms beyond those
described below in the section “Single Fault Detection”.
Under normal conditions, the ADNS-6010 generates the
drive current for the laser diode (ADNV-6340). In order
to stay below the Class 1 power requirements, resistor
Rbin must be set at least as high as the value in the bin
table of Figure 5, based on the bin number of the laser
diode and LP_CFG0 and LP_CFG1 must be programmed
to appropriate values. Avago Technologies recommends
using the exact Rbin value specified in the bin table to
ensure sufficient laser power for navigation. The system comprised of the ADNS-6010 and ADNV-6340 is
designed to maintain the output beam power within
Class 1 requirements over component manufacturing
tolerances and the recommended temperature range
when adjusted per the procedure below and when
implemented as shown in the recommended application
circuit of Figure 5. For more information, please refer
to Avago Technologies ADNB-6001, ADNB-6002, ADNB6011 and ADNB-6012 Laser Mouse Eye Safety Calculation
Application Note 5088.
LASER Power Adjustment Procedure
1. The ambient temperature should be 25C +/- 5C.
LASER Drive Mode
2. Set VDD3 to its permanent value.
The LASER has 2 modes of operation: DC and Shutter. In
DC mode, the LASER is on at all times the chip is powered
except when in the power down mode via the NPD pin.
In shutter mode the LASER is on only during the portion
of the frame that light is required. The LASER mode is set
by the LASER_MODE bit in the Configuration_bits register. For optimum product lifetime, Avago Technologies
recommends the default Shutter mode setting (except
for calibration and test).
Laser Bin Table
Bin Number
Rbin Resistor
Value (kohm)
Match_Bit
(Reg 0x2C, Bit7)
2A
18.7
0
3A
12.7
0
Eye Safety
3. Ensure that the laser drive is at 100% duty cycle.
4. Program the LP_CFG0 and LP_CFG1 registers to
achieve an output power as close to 506uW as possible without exceeding it.
Good engineering practices should be used to guarantee performance, reliability and safety for the product
design. Avago Technologies has additional information
and detail, such as firmware practices, PCB layout suggestions, and manufacturing procedures and specifications
that could be provided.
Parameter
Symbol
Laser output power
LOP
Minimum
Maximum
Units
Notes
716
uW
Per conditions above
LASER Output Power
Single Fault Detection
The laser beam output power as measured at the navigation surface plane is specified below. The following
conditions apply:
ADNS-6010 is able to detect a short circuit, or fault,
condition at the RBIN and XY_LASER pins, which could
lead to excessive laser power output. A low resistance
path to ground on either of these pins will trigger the
fault detection circuit, which will turn off the laser drive
current source and set the LASER_NEN output high.
When used in combination with external components
as shown in the block diagram below, the system will
prevent excess laser power for a single short to ground
at RBIN or XY_LASER by shutting off the laser. Refer to the
PC board layout notes for recommendations to reduce
the chance of high resistance paths to ground existing
due to PC board contamination.
1. The system is adjusted according to the above procedure.
2. The system is operated within the recommended operating temperature range.
3. The VDD3 value is no greater than 50mV above its
value at the time of adjustment.
4. No allowance for optical power meter accuracy is assumed.
Disabling the LASER
LASER_NEN is connected to the base of a PNP transistor
which when ON connects VDD3 to the LASER. In normal
operation, LASER_NEN is low. In the case of a fault condition (ground at XY_LASER or RBIN), LASER_NEN goes
high to turn the transistor off and disconnect VDD3 from
the LASER.
In addition to the continuous fault detection described
above, an additional test is executed automatically
whenever the LP_CFG0 register is written to. This test
will check for a short to ground on the XY_LASER pin,
a short to VDD3 on the XY_LASER pin, and will test the
fault detection circuit on the XY_LASER pin.
VDD3
Microcontroller
ADNS-6010
LASER
DRIVER
RESET
LASER_NEN
VDD3
fault control
block
LASER
XY_LASER
voltage sense
NPD
current set
RBIN
Figure 6. Single Fault Detection and Eye-safety Feature Block Diagram
GND
ADNS-6010
Laser Mouse Sensor
Theory of Operation
Features
The ADNS-6010 is based on LaserStream Technology,
which measures changes in position by optically acquiring sequential images (frames) and mathematically determining the direction and magnitude of movement.
• High speed motion detection – up to 45 ips and 20G
ADNS-6010 contains an Image Acquisition System (IAS),
a Digital Signal Processor (DSP), and a four wire serial
port. The IAS acquires microscopic surface images via
the lens and illumination system. These images are
processed by the DSP to determine the direction and
distance of motion. The DSP calculates the ∆x and ∆y
relative displacement values. An external microcontroller
reads the ∆x and ∆y information from the sensor serial
port. The microcontroller then translates the data into
PS2 or USB signals before sending them to the host PC
or game console.
Pin
Name
Description
1
NCS
Chip select
(active low input)
2
MISO
Serial data output (Master
In/Slave Out)
3
SCLK
Serial clock input
4
MOSI
Serial data input (Master
Out/Slave In)
5
NC
No Connection
6
RESET
Reset input
7
NPD
Power down(active low
input)
• New LaserStream architecture for greatly improved
optical navigation technology
• Programmable frame rate over 7080 frames per second
• SmartSpeed self-adjusting frame rate for optimum
performance
• Serial port burst mode for fast data transfer
• 400, 800, 1600 or 2000 cpi selectable resolution
• Single 3.3 volt power supply
• Four-wire serial port along with Power Down, and
Reset pins
• Laser fault detect circuitry on-chip for Eye Safety Compliance
Applications
• Mice for game consoles and computer games
• Mice for desktop PC’s, Workstations, and portable
PC’s
• Laser Trackballs
• Integrated input devices
Pinout
TOP VIEW
NCS
1
MISO
2
SCLK
3
MOSI
4
8
OSC_OUT
Oscillator output
9
GUARD
Oscillator GND for PCB guard
(optional)
10
OSC_IN
Oscillator input
11
REFC
Reference capacitor
NC
5
12
REFB
Reference capacitor
RESET
6
13
RBIN
Set XY_LASER current
14
XY_LASER
LASER current output
NPD
7
15
NC
No Connection
OSC_OUT
8
16
VDD3
Supply voltage
GUARD
9
17
GND
Ground
OSC_IN
10
18
VDD3
Supply voltage
19
GND
Ground
20
LASER_NEN
Laser enable (active low)
A6010
XYYWWZ
PINOUT
Figure 7. Package outline drawing (top view)
20
LASER_NEN
19
GND
18
VDD3
17
GND
16
VDD3
15
NC
14
XY_LASER
13
RBIN
12
REFB
11
REFC
A6010
XYYWWZ
A
A
SECTION A-A
Notes.
1. Dimensions in millimeters (inches)
2. Dimenstional tolerance: ±0.1 mm
3. Coplanarity of leads: 0.1 mm
4. Lead pitch tolerance: ±0.15 mm
5. Cummulative pitch tolerance. ±0.15 mm
6. Angular tolerance: ±3.0˚
7. Maximum flash +0.2 mm
8. Chamfer (25˚ x 2) on the taper side of the lead
Figure 8. Package outline drawing
CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to prevent
damage and/or degradation which may be induced by ESD
External PROM
Regulatory Requirements
The ADNS-6010 must operate from externally loaded
programming. This architecture enables immediate
adoption of new features and improved performance
algorithms. The external program is supplied by Avago
Technologies as a file, which may be burned into a programmable device. The example application shown in
this document uses an EEPROM to store and load the
external program memory. A micro-controller with sufficient memory may be used instead. On power-up and
reset, the ADNS-6010 program is downloaded into volatile memory using the burst-mode procedure described
in the Synchronous Serial Port section. The program size
is 1986 x 8 bits.
• Passes FCC B and worldwide analogous emission
limits when assembled into a mouse with shielded
cable and following Avago Technologies recommendations.
RESET
VOLTAGE REGULATOR
AND POWER CONTROL
Serial Port
REFB
IMAGE
PROCESSOR
CTRL
LASER DRIVER
Figure 9. Block diagram of ADNS-6010 optical mouse sensor
10
VCSEL
RESONATOR
OSC_OUT
MISO
RBIN
• UL flammability level UL94 V-0.
VCSEL Clip
OSCILLATOR
MOSI
• Passes EN61000-4-4/IEC801-4 EFT tests when assembled into a mouse with shielded cable and following
Avago Technologies recommendations.
OSC_IN
NCS
SCLK
• Passes IEC-1000-4-3 radiated susceptibility level when
assembled into a mouse with shielded cable and following Avago Technologies recommendations.
REFC
REFERENCE
VOLTAGE
FILTER NODE
Sensor
Sensor
PCB
NPD
V DD3
VCSEL PCB
3.3 V POWER
GND
XY_LASER
LASER_NEN
Lens
2.40
0.094
Figure 10. Distance from lens reference plane to surface
Surface
Absolute Maximum Ratings
Parameter
Symbol
Minimum
Maximum
Units
Storage Temperature
TS
-40
85
°C
Operating Temperature
TA
-15
55
°C
260
°C
3.7
V
2
kV
All pins, human body model MIL
883 Method 3015
VDD3+0.5
V
NPD, NCS, MOSI, SCLK, RESET,
OSC_IN, OSC_OUT, REFC, RBIN
Lead Solder Temp
Supply Voltage
VDD3
-0.5
ESD
-0.5
Notes
For 10 seconds, 1.6mm below seating plane.
Input Voltage
VIN
Output current
IOUT
7
mA
MISO, LASER_NEN
Input Current
IIN
15
mA
XY_LASER current with RBIN 12.7KΩ
LP-CFG0 = 0x00; LP_CFG1 = 0xFF
Recommended Operating Conditions
Parameter
Symbol
Minimum
Operating Temperature
TA
0
Power supply voltage
VDD3
3.10
Power supply rise time
VRT
1
Supply noise(Sinusoidal)
VNB
Oscillator Frequency
fCLK
Serial Port Clock Frequency
Typical
3.30
Maximum
Units
40
°C
3.60
Volts
Notes
us
0 to 3.0V
3080
mV p-p
10kHz- 300KHZ300KHz50MHz
25
MHz
Set by ceramic resonator
fSCLK
2500
MHzkHz
Active drive, 50% duty
cycleOpen drain drive with
pull-ups on, 50 pF load
Resonator Impedance
XRES
55
W
Distance from lens reference plane to surface
Z
2.62
mm
Speed
S
45
in/sec
Acceleration
A
20
G
Frame Rate
FR
2000
7080
Frames/
s
See Frame_Period register
section
Resistor value for LASER
Drive Current set
Rbin
See Bin Table in Figure 5
kOhms
ADNV-6340 VCSEL
Voltage at XY_LASER
Vxy_laser 0.7
11
23
2.18
24
2.40
VDD3
V
Results in +/- 0.2 mm minimum DOF, see Figure 10
AC Electrical Specifications
Electrical Characteristics over recommended operating conditions. Typical values at 25 °C, VDD3=3.3V, fclk=24MHz.
Parameter
VDD to RESET
Symbol
tOP
Data delay after
RESET
Min.
Typ.
Max.
250
Units
ms
Notes
From VDD = 3.0V to RESET sampled
tPU-RESET
180
ms
From RESET falling edge to valid motion data at 2000 fps
and shutter bound 20k.
Input delay after
reset
TIN-RST
550
ms
From RESET falling edge to inputs active (NPD, MOSI,
NCS, SCLK)
Power Down
tPD
600
ms
From NPD falling edge to initiate the power down cycle
at 2000 fps (tpd = 1 frame period + 100ms )
Wake from NPD
tPUPD
tCOMPUTE 75
ms
From NPD rising edge to valid motion data at 2000 fps
and shutter bound 20k. Max assumes surface change
while NPD is low
Data delay after
NPD
tCOMPUTE
3.1
ms
From NPD rising edge to all registers contain data from
new images at 2000 fps (See Figure 11).
RESET pulse width
tPW-RESET
MISO rise time
tr-MISO
40
200
ns
CL = 50pF
MISO fall time
tf-MISO
40
200
ns
CL = 50pF
MISO delay after
SCLK
tDLY-MISO
120
ns
From SCLK falling edge to MISO data valid, no load
conditions
MISO hold time
thold-
250
ns
Data held until next falling SCLK edge
200
ns
Amount of time data is valid after SCLK rising edge
120
ns
From data valid to SCLK rising edge
ms
10
MISO
MOSI hold time
tholdMOSI
MOSI setup time
tsetupMOSI
SPI time between
write commands
tSWW
50
ms
From rising SCLK for last bit of the first data byte, to rising
SCLK for last bit of the second data byte.
SPI time between
write and read
commands
tSWR
50
ms
From rising SCLK for last bit of the first data byte, to rising
SCLK for last bit of the second address byte.
SPI time between
read and subsequent commands
tSRWtSRR
250
ns
From rising SCLK for last bit of the first data byte, to falling SCLK for first bit of the second address byte.
SPI read addressdata delay
tSRAD
50
ms
From rising SCLK for last bit of the address byte, to falling
SCLK for first bit of data being read. All registers except
Motion & Motion_Burst
SPI motion read
address-data
delay
tSRAD-
75
ms
From rising SCLK for last bit of the address byte, to falling
SCLK for first bit of data being read. Applies to 0x02 Motion, and 0x50 Motion_Burst, registers
NCS to SCLK active tNCS-SCLK
120
ns
From NCS falling edge to first SCLK rising edge
SCLK to NCS inactive
tSCLK-NCS
120
ns
From last SCLK falling edge to NCS rising edge, for valid
MISO data transfer
NCS to MISO
high-Z
PROM download
and frame capture
byte-to-byte delay
tNCS-MISO
ns
From NCS rising edge to MISO high-Z state
tLOAD
10
ms
(See Figure 24 and 25)
NCS to burst
mode exit
tBEXIT
4
ms
Time NCS must be held high to exit burst mode
Transient Supply
Current
IDDT
mA
Max supply current during a VDD3 ramp from 0 to 3.6 V
Input Capacitance
C IN
pF
OSC_IN, OSC_OUT
12
MOT
250
68
14-22
DC Electrical Specifications
Electrical Characteristics over recommended operating conditions. Typical values at 25 °C, VDD3=3.3 V.
Parameter
Symbol
Minimum
Typical
Maximum
Units
Notes
DC Supply Current
IDD_AVG
53
mA
DC average at 7080 fps. No
DC load on XY_LASER, MISO.
Power Down Supply
Current
IDDPD
90
mA
NPD=GND; SCLK, MOSI,
NCS=GND or VDD3; RESET=0V
or GND
Input Low Voltage
VIL
0.8
V
SCLK, MOSI, NPD, NCS, RESET
Input High Voltage
VIH
V
SCLK, MOSI, NPD, NCS, RESET
Input hysteresis
VI_HYS
200
mV
SCLK, MOSI, NPD, NCS, RESET
Input current, pull-up
disabled
IIH_DPU
0
±10
mA
Vin=0.8*VDD3, SCLK, MOSI,
NCS
Input current, CMOS
inputs
IIH
0
±10
mA
NPD, RESET, Vin=0.8*VDD3
Output current, pulledup inputs
IOH_PU
300
600
mA
Vin=0.2V, SCLK, MOSI, NCS;
See bit 2 in Extended_Config
register
XY_LASER Current
ILAS
A
Vxy_laser >= 0.7 VLP_CFG0 =
0x00, LP_CFG1 = 0xFF
XY_LASER Current (fault
mode)
ILAS
500
uA
Rbin < 50 Ohms, or VXY_LASER
<0.2V
Output Low Voltage,
MISO, LASER_NEN
VOL
0.5
V
Iout=2mA, MISOIout= 1mA,
LASER_NEN
Output High Voltage,
MISO, LASER_NEN
VOH
V
Iout=-2mA, MISOIout= -0.5
mA, LASER_NEN
XY_LASER Current (no
Rbin)
ILAS_NRB
mA
Rbin = open
5
0.7 * VDD3
150
146/
Rbin
0.8*VDD3
1
NPD
Reset
Count
Oscillator Start
250 us
340 us
Frame
1
Frame
2
Frame
3
Frame
4
Frame
5
LASER
CURRENT
(shutter mode)
SCLK
590 us
Optional SPI transactions
with old image data
tCOMPUTE = 590us + 5 Frame Periods
Figure 11. NPD Rising Edge Timing Detail
13
“Motion” bit set if
motion was detected.
First read dX = dY = 0
Typical Performance Characteristics
Resolution (counts/inch)
Typical Resolution vs. Z
2400
Black Formica
2000
White Melamine
Bookshelf
Manila
Z
Photo Paper
1600
DOF
1200
DOF
800
Recommended
Operating Region
400
0
1.5 1.6 1.7 1.8 1.9 2.0 2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3
Distance from Lens Refremce Plane to Surface, Z (mm)
Figure 12. Mean Resolution vs. Z at 2000cpi
Typical Path Deviation
Largest Single Perpendicular Deviation From A Straight Line At 45 Degrees
Path Length = 4 inches; Speed = 6 ips ; Resolution = 2000 cpi
Maximun Distance (mouse count)
50
Black Formica
45
White Melamine
Bookshelf
Manila
Photo Paper
40
35
30
25
20
15
10
5
0
1.5 1.6 1.7 1.8 1.9 2.0 2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3
Distance From Lens Reference Plane To Navigation Surface (mm)
Relationship of mouse count to distance = m (mouse count) / n (cpi)
eg: Deviation of 7 mouse count = 7/800 = 0.00875 inch ~ 0.009 inch; where m = 7, n = 800
Figure 13. Average Error vs. Distance at 2000cpi (mm)
Average Supply Current vs. Frame Rate
VDD = 3.6 V
100.0%
100%
Relative Current
90.0%
94%
80.0%
79%
70.0%
60.0%
50.0%
60%
50%
40.0%
30.0%
2000
3000
4000
5000
Frame Rate (Hz)
Figure 14. Average Supply Current vs. Frame Rate
14
6000
7000
8000
Relative Responsivity for ADNS-6010
1
0.9
0.8
Relative responsivity
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
400
500
600
700
Wavelength (nm)
800
900
1000
Figure 15. Relative Responsivity
Synchronous Serial Port
Chip Select Operation
The synchronous serial port is used to set and read parameters in the ADNS-6010, and to read out the motion
information. The serial port is also used to load PROM
data into the ADNS-6010.
The serial port is activated after NCS goes low. If NCS
is raised during a transaction, the entire transaction is
aborted and the serial port will be reset. This is true
for all transactions including PROM download. After a
transaction is aborted, the normal address-to-data or
transaction-to-transaction delay is still required before
beginning the next transaction. To improve communication reliability, all serial transactions should be framed by
NCS. In other words, the port should not remain enabled
during periods of non-use because ESD and EFT/B events
could be interpreted as serial communication and put
the chip into an unknown state. In addition, NCS must
be raised after each burst-mode transaction is complete
to terminate burst-mode. The port is not available for
further use until burst-mode is terminated.
The port is a four wire port. The host micro-controller always initiates communication; the ADNS-6010 never initiates data transfers. The serial port cannot be activated
while the chip is in power down mode (NPD low) or reset
(RESET high). SCLK, MOSI, and NCS may be driven directly
by a 3.3V output from a micro-controller, or they may be
driven by an open drain configuration by enabling onchip pull-up current sources. The open drain drive allows
the use of a 5V micro-controller without any level shifting
components. The port pins may be shared with other SPI
slave devices. When the NCS pin is high, the inputs are
ignored and the output is tri-stated.
The lines that comprise the SPI port are:
SCLK:
Clock input. It is always generated by the master
(the micro-controller.)
MOSI:
Input data. (Master Out/Slave In)
MISO:
Output data. (Master In/Slave Out)
NCS:
Chip select input (active low). NCS needs to be
low to activate the serial port; otherwise, MISO
will be high Z, and MOSI & SCLK will be ignored.
NCS can also be used to reset the serial port in
case of an error.
15
Write Operation
Read Operation
Write operation, defined as data going from the microcontroller to the ADNS-6010, is always initiated by the
micro-controller and consists of two bytes. The first byte
contains the address (seven bits) and has a “1” as its MSB
to indicate data direction. The second byte contains
the data. The ADNS-6010 reads MOSI on rising edges
of SCLK.
A read operation, defined as data going from the ADNS6010 to the micro-controller, is always initiated by the
micro-controller and consists of two bytes. The first byte
contains the address, is sent by the micro-controller over
MOSI, and has a “0” as its MSB to indicate data direction.
The second byte contains the data and is driven by the
ADNS-6010 over MISO. The sensor outputs MISO bits on
falling edges of SCLK and samples MOSI bits on every rising edge of SCLK.
NOTE: The 250 ns minimum high state of SCLK is also the
minimum MISO data hold time of the ADNS-6010. Since
the falling edge of SCLK is actually the start of the next
read or write command, the ADNS-6010 will hold the
state of data on MISO until the falling edge of SCLK.
SCLK
MOSI
t Hold,MOSI
tsetup , MOSI
Figure 16. MOSI Setup and Hold Time
NCS
1
2
1
A
3
4
5
6
7
8
9
10
12
11
13
15
14
16
1
2
1
A
SCLK
MOSI
A
6
5
A
4
A
3
A
2
A
A
1
D
0
7
D
6
D
D
5
D
4
D
3
2
D
1
D
0
MISO
MOSI Driven by Micro
Figure 17. Write Operation
NCS
SCLK
Cycle #
1
2
3
4
5
6
7
A6
A5
A4
A3
A2
A1
8
9
10
D7
D6
11
12
13
14
D4
D3
D2
15
16
SCLK
MOSI
0
MISO
Figure 18. Read Operation
16
A0
tSRAD delay
D5
D1
D0
6
Required timing between Read and Write Commands
(tsxx)
The falling edge of SCLK for the first address bit of either
the read or write command must be at least 250 ns after
the last SCLK rising edge of the last data bit of the previous read operation. In addition, during a read operation
SCLK should be delayed after the last address data bit
to ensure that the ADNS-6010 has time to prepare the
requested data.
There are minimum timing requirements between read
and write commands on the serial port.
Burst Mode Operation
SCLK
MISO
Burst mode is a special serial port operation mode which
may be used to reduce the serial transaction time for
three predefined operations: motion read and PROM
download and frame capture. The speed improvement is
achieved by continuous data clocking to or from multiple
registers without the need to specify the register address,
and by not requiring the normal delay period between
data bytes.
t HOLD-MISO
t DLY-MISO
D0
Figure 19. MISO Delay and Hold Time
If the rising edge of the SCLK for the last data bit of the
second write command occurs before the 50 microsecond required delay, then the first write command may
not complete correctly.
If the rising edge of SCLK for the last address bit of
the read command occurs before the 50 microsecond
required delay, the write command may not complete
correctly.
≥ tSWW 50 µs
SCLK
Address
Data
Address
Write Operation
Data
Write Operation
Figure 20. Timing between two write commands
≥t SWR 50 µs
SCLK
Address
Data
Address
Write Operation
Next Read
Operation
Figure 21. Timing between write and read commands
≥t
t
SRAD
SRAD MOT
50 µs for non-motion read
75 µs for register 0x02
tSRW & tSRR >250 ns
SCLK
Address
Data
Read Operation
Figure 22. Timing between read and either write or subsequent read commands
17
Address
Next Read or
Write Operation
Motion Read
Reading the Motion_Burst register activates this mode.
The ADNS-6010 will respond with the contents of the
Motion, Delta_X, Delta_Y, SQUAL, Shutter_Upper, Shutter_Lower, and Maximum_Pixel registers in that order.
After sending the register address, the micro-controller must wait tSRAD-MOT and then begin reading data.
All 64 data bits can be read with no delay between
bytes by driving SCLK at the normal rate. The data are
latched into the output buffer after the last address bit
is received. After the burst transmission is complete, the
micro-controller must raise the NCS line for at least tBEXIT
to terminate burst mode. The serial port is not available
for use until it is reset with NCS, even for a second burst
transmission.
PROM Download
This function is used to load the Avago Technologiessupplied firmware file contents into the ADNS-6010. The
firmware file is an ASCII text file with each 2-character
byte on a single line.
controller must write subsequent bytes by presenting
the data on the MOSI line and driving SCLK at the normal
rate. A delay of at least tLOAD must exist between data
bytes as shown. After the download is complete, the
micro-controller must raise the NCS line for at least tBEXIT
to terminate burst mode. The serial port is not available
for use until it is reset with NCS, even for a second burst
transmission.
Avago Technologies recommends reading the SROM_ID
register to verify that the download was successful. In
addition, a self-test may be executed, which performs a
CRC on the SROM contents and reports the results in a
register. The test is initiated by writing a particular value
to the SROM_Enable register; the result is placed in the
Data_Out register. See those register descriptions for
more details.
Avago Technologies provides the data file for download;
the file size is 1986 data bytes. The chip will ignore any
additional bytes written to the SROM_Load register after
the SROM file.
The following steps activate this mode:
1. Perform hardware reset by toggling the RESET pin
2. Write 0x1D to register 0x14 (SROM_Enable register)
3. Wait at least 1 frame period
4. Write 0x18 to register 0x14 (SROM_Enable register)
5. Begin burst mode write of data file to register 0x60
(SROM_Load register)
After the first data byte is complete, the PROM or micro≥ t SRAD-MOT 75 µs
SCLK
Motion_Burst Register Address
Read First Byte
First Read Operation
Read Second Byte
Read Third Byte
Figure 23. Motion burst timing.
exit burst mode
tBEXIT ≥ 4 µs
NCS
SROM_Enable reg write
MOSI
SROM_Enable reg write
address
key data
SROM_Load reg write
address
byte 0
byte 1
byte 1985
address
enter burst
mode
≥1 frame
period
SCLK
tNCS-SCLK
>120ns
≥ 40 µs
tLOAD
≥ 10 µs
tLOAD
≥ 10 µs
≥ 10 µs
soonest to read SROM_ID
Figure 24. PROM Download Burst Mode
18
≥ 100 µs
Frame Capture
This is a fast way to download a full array of pixel values
from a single frame. This mode disables navigation and
overwrites any downloaded firmware. A hardware reset
is required to restore navigation, and the firmware must
be reloaded.
To trigger the capture, write to the Frame_Capture register. The next available complete 1 2/3 frames (1536
values) will be stored to memory. The data are retrieved
by reading the Pixel_Burst register once using the normal read method, after which the remaining bytes are
clocked out by driving SCLK at the normal rate. The byte
time must be at least tLOAD. If the Pixel_Burst register is
read before the data is ready, it will return all zeros.
set to 1. If the Pixel_Burst register is read past the end of
the data (1537 reads and on) , the data returned will be
zeros. Pixel data is in the lower six bits of each byte.
After the download is complete, the micro-controller
must raise the NCS line for at least tBEXIT to terminate
burst mode. The read may be aborted at any time by
raising NCS.
Alternatively, the frame data can also be read one byte at
a time from the Frame_Capture register. See the register
description for more information.
To read a single frame, read a total of 900 bytes. The next
636 bytes will be approximately 2/3 of the next frame.
The first pixel of the first frame (1st read) has bit 6 set to
1 as a start-of-frame marker. The first pixel of the second
partial frame (901st read) will also have bit 6 set to 1. All
other bytes have bit 6 set to zero. The MSB of all bytes is
exit burst mode
tBEXIT ≥ 4 µs
NCS
frame capture reg write
MOSI
address
frame capture reg
address
pixel dump reg read
address
data
enter burst
mode
≥ 10 µs
soonest to begin again
SCLK
tNCS-SCLK
>120ns
tCAPTURE
tSRAD ≥ 50 µs
MISO
tLOAD
tLOAD
≥ 10 µs
≥ 10 µs
P0
P0 bit 6 set to 1
P1
all MSB = 1
P899
see note 2
Notes:
1. MSB = 1 for all bytes. Bit 6 = 0 for all bytes except pixel 0 of both frames which has bit 6 = 1 for use as a frame marker.
2. Reading beyond pixel 899 will return the first pixel of the second partial frame.
3. tCAPTURE = 10 s + 3 frame periods.
4. This figure illustrates reading a single complete frame of 900 pixels. An additional 636 pixels from the next frame are available.
Figure 25. Frame capture burst mode timing
19
The pixel output order as related to the surface is shown below.
Cable
Top Xray View of Mouse
Positive Y
LB
RB
Positive X
1
A6010
10
20
11
expanded view of the
surface as viewed
through the lens
last output
899 898 897 896 895 894 893 892 891 890 889 888 887 886 885 884 883 882 881 880 879 878 877 876 875 874 873 872 871 870
869 868 867 866 865 864 863 862 861 860 859 858 857 856 855 854 853 852 851 850 849 848 847 846 845 844 843 842 841 840
839 838
61
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
etc.
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
first output
Figure 26. Pixel address map (surface referenced)
Error detection and recovery
1. The ADNS-6010 and the micro-controller might get
out of synchronization due to ESD events, power supply droops or micro-controller firmware flaws. In such
a case, the micro-controller should pulse NCS high for
at least 1 ms. The ADNS-6010 will reset the serial port
(but not the control registers) and will be prepared for
the beginning of a new transmission after the normal
transaction delay.
2. Invalid addresses: Writing to an invalid address will
have no effect. Reading from an invalid address will
return all zeros.
3. Termination of a transmission by the micro-controller
may sometimes be required (for example, due to a
USB suspend interrupt during a read operation). To
accomplish this the micro-controller should raise NCS.
The ADNS-6010 will not write to any register and will
reset the serial port (but not the control registers) and
be prepared for the beginning of future transmissions
20
after NCS goes low. The normal delays between reads
or writes (tSWW, tswr, tSRAD, tSRAD-mot) are still required
after aborted transmissions.
4. The micro-controller can verify success of write operations by issuing a read command to the same address
and comparing written data to read data.
5. The micro-controller can verify the synchronization of
the serial port by periodically reading the product ID
and inverse product ID registers.
6. The microcontroller can read the SROM_ID register to
verify that the sensor is running downloaded PROM
code. ESD or similar noise events may cause the sensor to revert to native ROM execution. If this should
happen, pulse RESET and reload the SROM code.
Notes on Power-up and the serial port
Power Down Circuit
Reset Circuit
The following table lists the pin states during power
down.
The ADNS-6010 does not perform an internal power up
self-reset; the reset pin must be raised and lowered to
reset the chip. This should be done every time power is
applied. During power-up there will be a period of time
after the power supply is high but before any clocks are
available. The table below shows the state of the various
pins during power-up and reset when the RESET pin is
driven high by a micro-controller.
The chip is put into the power down (PD) mode by lowering the NPD input. When in PD mode, the oscillator is
stopped but all register contents are retained. To achieve
the lowest current state, all inputs must be held externally within 200mV of a rail, either ground or VDD3. The
chip outputs are driven low or hi-Z during PD to prevent
current consumption by an external load.
State of Signal Pins After VDD is Valid
Pin
Before Reset
During Reset
After Reset
SPI pullups
undefined
off
on (default)
NCS
hi-Z control functional
hi-Z control functional
functional
MISO
driven or hi-Z (per driven or hi-Z (per
NCS)
NCS)
low or hi-Z (per
NCS)
SCLK
undefined
ignored
functional
MOSI
undefined
ignored
functional
XY_LASER
undefined
hi-Z
functional
RESET
functional
high (externally
driven)
functional
NPD
undefined
ignored
functional
LASER_NEN
undefined
high (off )
functional
State of Signal Pins During Power Down
Pin
NPD low
After wake from PD
SPI pullups
off
pre-PD state
NCS
hi-Z control functional
functional
MISO
low or hi-Z (per NCS)
pre-PD state or hi-Z
SCLK
ignored
functional
MOSI
ignored
functional
XY_LASER
high (off )
functional
RESET
functional
functional
NPD
low (driven externally)
functional
REFC
VDD3
REFC
OSC_IN
low
OSC_IN
OSC_OUT
high
OSC_OUT
LASER_NEN
high (off )
functional
21
Registers
The ADNS-6010 registers are accessible via the serial port. The registers are used to read motion data and status as
well as to set the device configuration.
Address
Register
Read/Write
Default Value
0x00
Product_ID
R
0x1C
0x01
Revision_ID
R
0x20
0x02
Motion
R
0x20
0x03
Delta_X
R
0x00
0x04
Delta_Y
R
0x00
0x05
SQUAL
R
0x00
0x06
Pixel_Sum
R
0x00
0x07
Maximum_Pixel
R
0x00
0x08
Reserved
0x09
Reserved
0x0a
Configuration_bits
R/W
0x49
0x0b
Extended_Config
R/W
0x08
0x0c
Data_Out_Lower
R
Any
0x0d
Data_Out_Upper
R
Any
0x0e
Shutter_Lower
R
0x85
0x0f
Shutter_Upper
R
0x00
0x10
Frame_Period_Lower
R
Any
0x11
Frame_Period_Upper
R
Any
0x12
Motion_Clear
W
Any
0x13
Frame_Capture
R/W
0x00
0x14
SROM_Enable
W
0x00
0x15
Reserved
0x16
Configuration II
R/W
0x34
0x17
Reserved
0x18
Reserved
0x19
Frame_Period_Max_Bound Lower
R/W
0x90
0x1a
Frame_Period_Max_Bound_Upper
R/W
0x65
0x1b
Frame_Period_Min_Bound_Lower
R/W
0x7E
0x1c
Frame_Period_Min_Bound_Upper
R/W
0x0E
0x1d
Shutter_Max_Bound_Lower
R/W
0x20
0x1e
Shutter_Max_Bound_Upper
R/W
0x4E
0x1f
SROM_ID
R
Version dependent
0x20-0x2b
Reserved
0x2c
LP_CFG0
R/W
0x7F
0x2d
LP_CFG1
R/W
0x80
0x2e-0x3c
Reserved
0x3d
Observation
R/W
0x00
0x3e
Reserved
0x3f
Inverse Product ID
R
0xE3
0x40
Pixel_Burst
R
0x00
0x50
Motion_Burst
R
0x00
0x60
SROM_Load
W
Any
22
Product_ID
Address: 0x00
Access: Read
Default Value: 0x1C
Bit
7
6
5
4
3
2
1
0
Field
PID7
PID6
PID5
PID4
PID3
PID2
PID1
PID0
Data Type: 8-Bit unsigned integer
USAGE: This register contains a unique identification assigned to the ADNS-6010. The value in this register does not
change; it can be used to verify that the serial communications link is functional.
Revision_ID
Address: 0x01
Access: Read
Default Value: 0x20
Bit
7
6
5
4
3
2
1
0
Field
RID7
RID6
RID5
RID4
RID3
RID2
RID1
RID0
Data Type: 8-Bit unsigned integer.
USAGE: This register contains the IC revision. It is subject to change when new IC versions are released.
NOTE: The downloaded SROM firmware revision is a separate value and is available in the SROM_ID register.
23
Motion
Address: 0x02
Access: Read
Default Value: 0x00
Bit
7
6
5
4
3
2
1
0
Field
MOT
Reserved
LP_Valid
OVF
Reserved
RES1
Fault
RES0
Data Type: Bit field.
USAGE: Register 0x02 allows the user to determine if motion has occurred since the last time it was read. If so, then
the user should read registers 0x03 and 0x04 to get the accumulated motion. It also tells if the motion buffers have
overflowed, if fault is detected, and the current resolution setting.
Field Name
Description
MOT
Motion since last report
0 = No motion
1 = Motion occurred, data ready for reading in Delta_X and Delta_Y registers
LP_Valid
This bit is an indicator of complementary value contained in registers 0x2C and 0x2D.
0 = register 0x2C and 0x2D do not have complementary values
1 = register 0x2C and 0x2D contain complementary values
OVF
Motion overflow, DY and/or DX buffer has overflowed since last report
0 = no overflow
1 = overflow has occurred
Fault
Indicates that the RBIN and/or XY_LASER pin is shorted to GND.
0 = no fault detected
1 = fault detected
RES1, RES0
Resolution in counts per inch (cpi). Resolution values are approximate.
Cpi Bit2(RES1)
400 0
0
800 0
1600 1
2000 1
Bit0(RES0)
1
0
1
Please see register 0x0a to set cpi
Notes for Motion:
1. Reading this register freezes the Delta_X and Delta_Y register values. Read this register before reading the Delta_X
and Delta_Y registers. If Delta_X and Delta_Y are not read before the motion register is read a second time, the
data in Delta_X and Delta_Y will be lost.
2. Avago Technologies RECOMMENDS that registers 0x02, 0x03 and 0x04 be read sequentially. See Motion burst
mode also.
3. Internal buffers can accumulate more than eight bits of motion for X or Y. If either one of the internal buffers overflows, then absolute path data is lost and the OVF bit is set. This bit is cleared once some motion has been read
from the Delta_X and Delta_Y registers, and if the buffers are not at full scale. Since more data is present in the
buffers, the cycle of reading the Motion, Delta_X and Delta_Y registers should be repeated until the motion bit
(MOT) is cleared. Until MOT is cleared, either the Delta_X or Delta_Y registers will read either positive or negative
full scale. If the motion register has not been read for long time, at 400 cpi it may take up to 16 read cycles to clear
the buffers, at 2000 cpi, up to 80 cycles. Alternatively, writing to the Motion_Clear register (register 0x12) will clear
all stored motion at once.
24
Delta_X
Address: 0x03
Access: Read
Default Value: 0x00
Bit
7
6
5
4
3
2
1
0
Field
X7
X6
X5
X4
X3
X2
X1
X0
Data Type: Eight bit 2’s complement number.
USAGE: X movement is counts since last report. Absolute value is determined by resolution. Reading clears the register.
Motion
Delta_X
-128
-127
-2
-1
0
+1
+2
+126
+127
80
81
FE
FF
00
01
02
7E
7F
Delta_Y
Address: 0x04
Access: Read
Default Value: 0x00
Bit
7
6
5
4
3
2
1
0
Field
Y7
Y6
Y5
Y4
Y3
Y2
Y1
Y0
Data Type: Eight bit 2’s complement number.
USAGE: Y movement is counts since last report. Absolute value is determined by resolution. Reading clears the register.
Motion
Delta_Y
25
-128
-127
-2
-1
0
+1
+2
+126
+127
80
81
FE
FF
00
01
02
7E
7F
SQUAL
Address: 0x05
Access: Read
Default Value: 0x00
Bit
7
6
5
4
3
2
1
0
Field
SQ7
SQ6
SQ5
SQ4
SQ3
SQ2
SQ1
SQ0
Data Type: Upper 8 bits of a 10-bit unsigned integer.
USAGE: SQUAL (Surface Quality) is a measure of ¼ of the number of valid features visible by the sensor in the current
frame. Use the following formula to find the total number of valid features.
Number of features = SQUAL register value *4
The maximum SQUAL register value is 169. Since small changes in the current frame can result in changes in SQUAL,
variations in SQUAL when looking at a surface are expected. The graph below shows 700 sequentially acquired SQUAL
values, while a sensor was moved slowly over white paper. SQUAL is nearly equal to zero if there is no surface below
the sensor. SQUAL remains fairly high throughout the Z-height range.
SQUAL Values (White Paper)
At Z=0mm, [email protected]" diameter, Speed-6ips
90
80
70
SQUAL Value (counts)
60
50
40
30
20
10
0
1
51
101
151
201
251
301
351
401
451
501
551
601
651
Counts
Figure 27. SQUAL Values at 2000cpi (White Paper)
Mean SQUAL vs. Z (White Paper)
2000 cpi, [email protected]" diameter, Speed-6ips
120
Avg-3sigma
Avg
Avg+3sigma
SQUAL Vaalue (counts)
100
80
60
40
20
0
-0.8
-0.6
-0.4
-0.2
0
0.2
0.4
Distance of Lens Reference Plane to Surface, Z (mm)
Figure 28. Mean SQUAL vs. Z (White Paper)
26
0.6
0.8
Pixel_Sum
Address: 0x06
Access: Read
Default Value: 0x00
Bit
7
6
5
4
3
2
1
0
Field
AP7
AP6
AP5
AP4
AP3
AP2
AP1
AP0
Data Type: High 8 bits of an unsigned 16-bit integer.
USAGE: This register is used to find the average pixel value. It reports the upper byte of a 16-bit counter which sums
all 900 pixels in the current frame. It may be described as the full sum divided by 256. To find the average pixel value,
use the following formula:
Average Pixel = Register Value * 256 / 900 = Register Value/3.51
The maximum register value is 221 (63 * 900/256 truncated to an integer). The minimum
is 0. The pixel sum value can change on every frame.
Maximum_Pixel
Address: 0x07
Access: Read
Default Value: 0x00
Bit
7
6
5
4
3
2
1
0
Field
0
0
MP5
MP4
MP3
MP2
MP1
MP0
Data Type: Six bit number.
USAGE: Maximum Pixel value in current frame. Minimum value = 0, maximum value = 63. The maximum pixel value
can vary with every frame.
Reserved Address: 0x08
Reserved Address: 0x09
27
Configuration_bits Address: 0x0a
Access: Read/Write Default Value: 0x49
Bit
7
6
5
4
3
2
1
0
Field
0
LASER_MODE
Sys Test
RES1
1
RES0
Reserved
Reserved
Data Type: Bit field
USAGE: Register 0x0a allows the user to change the configuration of the sensor. Shown below are the bits, their default
values, and optional values.
Field Name
Description
BIT 7
Must always be zero
LASER_MODE
LASER Shutter Mode
0 = Shutter mode off (LASER always on)
1 = Shutter mode on (LASER only on when illumination is required)
Sys Test
System Tests
0 = no tests
1 = perform all system tests, output 16 bit CRC via Data_Out_Upper and Data_Out_Lower
registers.
NOTE: The test will fail if SROM is loaded. Perform a hardware reset before executing this test.
Reload SROM after the test is completed.
NOTE: The test will fail if a laser fault condition exists.
NOTE: Since part of the system test is a RAM test, the RAM and SROM will be overwritten with the
default values when the test is done. If any configuration changes from the default are needed for
operation, make the changes AFTER the system test is run.
The system test takes 200ms (@24MHz) to complete.
NOTE: Do not access the Synchronous Serial Port during system test.
RES
Resolution in counts per inch. Resolution values are approximate.
Cpi Bit4(RES1)
400 0
0
800 1
1600 0
2000 1
Bit2(RES0)
0
1
1
Also see register 0x02i
BIT 3
28
Must always be one
Extended_Config Address: 0x0b
Access: Read/Write Default Value: 0x08
Bit
7
6
5
4
3
2
1
0
Field
Busy
Reserved
Reserved
Reserved
1
Serial_NPU
NAGC
Fixed_FR
Data Type: Bit field
USAGE: Register 0x0b allows the user to change the configuration of the sensor. Shown below are the bits, their default
values, and optional values.
Field Name
Description
Busy
Read-only bit. Indicates if it is safe to write to one or more of the following registers:
Frame_Period_Max_Bound_Upper and Frame_Period_Max_Bound_Lower
Frame_Period_Min_Bound_Upper and Frame_Period_Min_Bound_Lower
Shutter_Max_Bound_Upper and Shutter_Max_Bound_Lower
After writing to the Frame_Period_Maximum_Bound_Upper register, at least two frames
must pass before writing again to any of the above registers. This bit may be used in lieu of a
timer since the actual frame rate may not be known when running in auto mode.
0 = writing to the registers is allowed
1 = do not write to the registers yet
BIT 3
Must always be one
Serial_NPU
Disable serial port pull-up current sources on SCLK, MOSI and NCS
0 = no, current sources are on
1 = yes, current sources are off
NAGC
Disable AGC. Shutter will be set to the value in the Shutter_Maximum_Bound registers.
0 = no, AGC is active
1 = yes, AGC is disabled
Fixed_FR
Fixed frame rate (disable automatic frame rate control). When this bit is set, the frame rate
will be determined by the value in the Frame_Period_Maximum_Bound registers.
0 = automatic frame rate
1 = fixed frame rate
29
Data_Out_Lower Address: 0x0c
Access: Read Default Value: Undefined
Bit
7
6
5
4
3
2
1
0
Field
DO7
DO6
DO5
DO4
DO3
DO2
DO1
DO0
Data_Out_Upper
Address: 0x0d
Access: Read Default Value: Undefined
Bit
7
6
5
4
3
2
1
0
Field
DO15
DO14
DO13
DO12
DO11
DO10
DO9
DO8
Data Type: Sixteen bit word
USAGE: Data in these registers come from the system self test or the SROM CRC test. The data can be read out in
either order.
Data_Out_Upper
Data_Out_Lower
System test results:
0xA9
0xD5
SROM CRC Test Result:
0xBE
0xEF
System Test: This test is initiated via the Configuration_Bits register. It performs several tests to verify that the hardware
is functioning correctly. Perform a hardware reset just prior to running the test. SROM contents and register settings
will be lost.
SROM Content: Performs a CRC on the SROM contents. The test is initiated by writing a particular value to the SROM_
Enable register.
30
Shutter_Lower
Address: 0x0e
Access: Read
Default Value: 0x85
Bit
7
6
5
4
3
2
1
0
Field
S7
S6
S5
S4
S3
S2
S1
S0
Shutter_Upper
Address: 0x0f
Access: Read
Default Value: 0x00
Bit
7
6
5
4
3
2
1
0
Field
S15
S14
S13
S12
S11
S10
S9
S8
Data Type: Sixteen bit unsigned integer.
USAGE: Units are clock cycles. Read Shutter_Upper first, then Shutter_Lower. They should be read consecutively. The
shutter is adjusted to keep the average and maximum pixel values within normal operating ranges. The shutter value
is checked and automatically adjusted to a new value if needed on every frame when operating in default mode. When
the shutter adjusts, it changes by ± 1/16 of the current value. The shutter value can be set manually by setting the
AGC mode to Disable using the Extended_Config register and writing to the Shutter_Max_Bound registers. Because
the automatic frame rate feature is related to shutter value it may also be appropriate to enable the Fixed Frame Rate
mode using the Extended_Config register.
Shown below is a graph of 700 sequentially acquired shutter values, while the sensor was moved slowly over white
paper.
Shutter Value (White Paper)
At Z=0mm, [email protected]" diameter, Speed-6ips
160
Shutter Value (counts)
140
120
100
80
60
40
20
0
1
51
101
151
201
251
Figure 29. Shutter Values at 2000cpi (White Paper)
31
301
351 401
Counts
451
501
551
601
651
Shutter Value (counts)
Mean Shutter vs. Z (White Paper)
2000dpi, [email protected]" diameter, Speed-6ips
200
180
160
140
120
100
80
60
40
20
0
Avg-3sigma
Avg
Avg+3sigma
-0.8
-0.6
-0.4
-0.2
0
0.2
0.4
0.6
0.8
Distance from Lens Reference Plane to Surface, Z (mm)
Figure 30. Mean Shutter vs. Z (White Paper)
The maximum value of the shutter is dependent upon the setting in the Shutter_Max_
Bound_Upper and Shutter_Max_Bound_Lower registers.
32
Frame_Period_Lower Address: 0x10
Access: Read Default Value: Undefined
Bit
7
6
5
4
3
2
1
0
Field
FP7
FP6
FP5
FP4
FP3
FP2
FP1
FP0
Frame_Period_Upper Address: 0x11
Access: Read Default Value: Undefined
Bit
7
6
5
4
3
2
1
0
Field
FP15
FP14
FP13
FP12
FP11
FP10
FP9
FP8
Data Type: Sixteen bit unsigned integer.
USAGE: Read these registers to determine the current frame period and to calculate the frame rate. Units are clock
cycles. The formula is
Frame Rate = Clock Frequency/Register value
To read from the registers, read Frame_Period_Upper first followed by Frame_Period Lower. To set the frame rate
manually, disable automatic frame rate mode via the Extended_Config register and write the desired count value to
the Frame_Period_Max_Bound registers.
The following table lists some Frame_Period values for popular frame rates with a 24MHz clock.
Frames/second
Counts
Frame_Period
Decimal
Hex
Upper
Lower
7080
3,390
0D3E
0D
3E
5000
4,800
12C0
12
C0
3000
8,000
1F40
1F
40
2000
12,000
2EE0
2E
E0
Motion_Clear
Address: 0x12
Access: Write
Default Value: Undefined
Data Type: Any.
USAGE: Writing any value to this register will cause the Delta_X, Delta_Y, and internal motion registers to be cleared.
Use this as a fast way to reset the motion counters to zero without resetting the entire chip.
33
Frame_Capture
Address: 0x13
Access: Read/Write
Default Value: 0x00
Bit
7
6
5
4
3
2
1
0
Field
FC7
FC6
FC5
FC4
FC3
FC2
FC1
FC0
Data Type: Bit field.
USAGE: Writing 0x83 to this register will cause the next available complete 1 2/3 frames of pixel values to be stored
to SROM RAM. Writing to this register is required before using the Frame Capture burst mode to read the pixel values
(see the Synchronous Serial Port section for more details). Writing to this register will stop navigation and cause any
firmware loaded in the SROM to be overwritten. A hardware reset is required to restore navigation, and the firmware
must be reloaded using the PROM Download burst method.
This register can also be used to read the frame capture data. The same data available by reading the Pixel_Burst
register using burst mode is available by reading this register in the normal fashion. The data pointer is automatically
incremented after each read so all 1536 pixel values (1 and 2/3 frames) may be obtained by reading this register 1536
times in a row. Both methods share the same pointer such that reading pixel values from this register will increment
the pointer causing subsequent reads from the Pixel_Burst register (without initiating a new frame dump) to start at
the current pointer location. This register will return all zeros if read before the frame capture data is ready. See the
Frame Capture description in the Synchronous Serial Port section for more information.
This register will not retain the last value written. Reads will return zero or frame capture data.
SROM_Enable
Address: 0x14
Access: Write
Default Value: 0x00
Bit
7
6
5
4
3
2
1
0
Field
SE7
SE6
SE5
SE4
SE3
SE2
SE1
SE0
Data Type: 8-bit number.
USAGE: Write to this register to start either PROM download or SROM CRC test.
Write 0x1D to this register, wait at least 1 frame period, and write 0x18 to this register before downloading PROM
firmware to the SROM_Load register. The download will not be successful unless this sequence is followed. See the
Synchronous Serial port section for details.
Write 0xA1 to start the SROM CRC test. Wait 7ms plus one frame period, then read result from the Data_Out_Lower
and Data_Out_Upper registers. Navigation is halted and the SPI port should not be used during this test.
Reserved
34
Address: 0x15
Configuration II
Address: 0x16
Access: Read/Write
Default Value: 0x34
Bit
7
6
5
4
3
2
1
0
Field
Reserved
Reserved
Reserved
Reserved
Reserved
1
Force_disable
Reserved
Data Type: Bit field
USAGE: Write to this register
Field Name
Description
BIT 2
Must be set to one
Force_disable
0 = LASER_NEN functions as normal
1 = LASER_NEN output high. May be useful for product test.
Reserved
35
Address: 0x17-0x18
Frame_Period_Max_Bound_Lower
Address: 0x19
Access: Read/Write
Default Value: 0x90
Bit
7
6
5
4
3
2
1
0
Field
FBM7
FBM6
FBM5
FBM4
FBM3
FBM2
FBM1
FBM0
Frame_Period_Max_Bound_Upper
Address: 0x1A
Access: Read/Write
Default Value: 0x65
Bit
7
6
5
4
3
2
1
0
Field
FBM15
FBM14
FBM13
FBM13
FBM11
FBM10
FBM9
FBM8
Data Type: 16-bit unsigned integer.
USAGE: This value sets the maximum frame period (the MINIMUM frame rate) which may be selected by the automatic frame rate control, or sets the actual frame period when operating in manual mode. Units are clock cycles. The
formula is
Frame Rate = Clock Frequency / Register value
To read from the registers, read Upper first followed by Lower. To write to the registers, write Lower first, followed by
Upper. To set the frame rate manually, disable automatic frame rate mode via the Extended_Config register and write
the desired count value to these registers.
Writing to the Frame_Period_Max_Bound_Upper and Lower registers also activates any new values in the following
registers:
·
Frame_Period_Max_Bound_Upper and Lower
·
Frame_Period_Min_Bound_Upper and Lower
·
Shutter_Max_Bound_Upper and Lower
Any data written to these registers will be saved but will not take effect until the write to the Frame_Period_Max_
Bound_Upper and Lower is complete. After writing to this register, two complete frame times are required to implement the new settings. Writing to any of the above registers before the implementation is complete may put the chip
into an undefined state requiring a reset. The “Busy” bit in the Extended_Config register may be used in lieu of a timer
to determine when it is safe to write. See the Extended_Config register for more details.
The following table lists some Frame_Period values for popular frame rates (clock rate = 24MHz). In addition, the three
bound registers must also follow this rule when set to non-default values:
Frame_Period_Max_Bound ≥ Frame_Period_Min_Bound + Shutter_Max_Bound.
Frames/second
36
Counts
Frame_Period
Decimal
Hex
Upper
Lower
7080
3,390
0D3E
0D
3E
5000
4,800
12C0
12
C0
3000
8,000
1F40
1F
40
2000
12,000
2EE0
2E
E0
Frame_Period_Min_Bound_Lower
Access: Read/Write
Address: 0x1B
Default Value: 0x7E
Bit
7
6
5
4
3
2
1
0
Field
FBm7
FBm6
FBm5
FBm4
FBm3
FBm2
FBm1
FBm0
Frame_Period_Min_Bound_Upper
Access: Read/Write
Address: 0x1C
Default Value: 0x0E
Bit
7
6
5
4
3
2
1
0
Field
FBm15
FBm14
FBm13
FBm13
FBm11
FBm10
FBm9
FBm8
Data Type: 16-bit unsigned integer.
USAGE: This value sets the minimum frame period (the MAXIMUM frame rate) which may be selected by the automatic
frame rate control. Units are clock cycles. The formula is
Frame Rate = Clock Rate / Register value
To read from the registers, read Upper first followed by Lower. To write to the registers, write Lower first, followed by
Upper, then execute a write to the Frame_Period_Max_Bound_Upper and Lower registers. The minimum allowed write
value is 0x0E7E; the maximum is 0xFFFF.
Reading this register will return the most recent value that was written to it. However, the value will take effect only
after a write to the Frame_Period_Max_Bound_Upper and Lower registers. After writing to Frame_Period_Max_
Bound_Upper, wait at least two frame times before writing to Frame_Period_Min_Bound_Upper or Lower again. The
“Busy” bit in the Extended_Config register may be used in lieu of a timer to determine when it is safe to write. See the
Extended_Config register for more details.
In addition, the three bound registers must also follow this rule when set to non-default values:
Frame_Period_Max_Bound ≥ Frame_Period_Min_Bound + Shutter_Max_Bound.
37
Shutter_Max_Bound_Lower
Address: 0x1D
Access: Read/Write
Default Value: 0x20
Bit
7
6
5
4
3
2
1
0
Field
SB7
SB6
SB5
SB4
SB3
SB2
SB1
SB0
Shutter_Max_Bound_Upper
Address: 0x1E
Access: Read/Write
Default Value: 0x4E
Bit
7
6
5
4
3
2
1
0
Field
SB15
SB14
SB13
SB12
SB11
SB10
SB9
SB8
Data Type: 16-bit unsigned integer.
USAGE: This value sets the maximum allowable shutter value when operating in automatic mode. Units are clock cycles.
Since the automatic frame rate function is based on shutter value, the value in these registers can limit the range of the
frame rate control. To read from the registers, read Upper first followed by Lower. To write to the registers, write Lower
first, followed by Upper, then execute a write to the Frame_Period_Max_Bound_Upper and Lower registers. To set the
shutter manually, disable the AGC via the Extended_Config register and write the desired value to these registers.
Reading this register will return the most recent value that was written to it. However, the value will take effect only
after a write to the Frame_Period_Max_Bound_Upper and Lower registers. After writing to Frame_Period_Max_Bound_
Upper, wait at least two frame times before writing to Shutter_Max_Bound_Upper or Lower again. The “Busy” bit in the
Extended_Config register may be used in lieu of a timer to determine when it is safe to write. See the Extended_Config
register for more details.
In addition, the three bound registers must also follow this rule when set to non-default values:
Frame_Period_Max_Bound ≥ Frame_Period_Min_Bound + Shutter_Max_Bound.
SROM_ID
Address: 0x1F
Access: Read
Default Value: Version dependent
Bit
7
6
5
4
3
2
1
0
Field
SR7
SR6
SR5
SR4
SR3
SR2
SR1
SR0
Data Type:8-Bit unsigned integer.
USAGE: Contains the revision of the downloaded Shadow ROM firmware. If the firmware has been successfully downloaded and the chip is operating out of SROM, this register will contain the SROM firmware revision, otherwise it will
contain 0x00.
Note: The IC hardware revision is available by reading the Revision_ID register (register 0x01).
38
LP_CFG0
Address: 0x2C
Access: Read/Write
Default Value: 0x7F
Bit
7
6
5
4
3
2
1
0
Field
Match
LP6
LP5
LP4
LP3
LP2
LP1
LP0
Data Type: 8-bit unsigned integer
USAGE: This register is used to set the laser current and bin matching parameter. It is to be used together with register
0x2D where register 0x2D must contain the complement of register 0x2C in order for the laser current to be programmed. Writing to this register causes a fault test to be performed on the XY_LASER pin. The test checks for stuck
low and stuck high conditions. During the test, LASER_NEN will be driven high and XY_LASER will pulse high for 12us
and pulse low for 12us (times are typical). Both pins will return to normal operation if no fault is detected.
Field Name
Description
Match
Match the sensor to the VCSEL characteristics. Set per the bin table specification for the
VCSEL bin in use.
LP6 - LP0
Controls the 7 bit DAC for adjusting laser current.One step is equivalent to (1/192)*100% =
0.5208% drop of relative laser current.Refer to the table below for example of relative laser
current settings.
LP6- LP3
LP2
LP1
LP0
Relative Laser Current
0000
0
0
0
100%
0000
0
0
1
99.48%
0000
0
1
0
98.96%
0000
0
1
1
98.43%
0000
1
0
0
97.92%
:
:
:
:
:
1111
1
0
1
34.90%
1111
1
1
0
34.38%
1111
1
1
1
33.85%
LP_CFG1
Address: 0x2D
Access: Read/Write
Default Value: 0x80
Bit
7
6
5
4
3
2
1
0
Field
LPC7
LPC6
LPC5
LPC4
LPC3
LPC2
LPC1
LPC0
Data Type: 8-bit unsigned integer
USAGE: The value in this register must be a complement of register 0x2C for laser current to be as programmed, otherwise the laser current is set to 33.85%. Registers 0x2C and 0x2D may be written in any order after power ON reset
or SROM download.
39
Reserved Address: 0x2f-0x3C
Observation
Address: 0x3D
Access: Read/Write
Default Value: 0x00
Bit
7
6
5
4
3
2
1
0
Field
OB7
Reserved
OB5
Reserved
Reserved
Reserved
OB1
OB0
Data Type: Bit field
USAGE: Each bit is set by some process or action at regular intervals, or when the event occurs. The user must clear
the register by writing 0x00, wait an appropriate delay, and read the register. The active processes will have set their
corresponding bit(s). This register may be used as part of a recovery scheme to detect a problem caused by EFT/B or
ESD.
Field Name
Description
OB7
0 = Chip is not running SROM code
1 = Chip is running SROM code
OB5
0 = NPD pulse was not detected
1 = NPD pulse was detected
OB1
Set once per frame
OB0
Set once per frame
Reserved Address: 0x3E
Inverse_Product_ID
Address: 0x3F
Access: Read
Default Value: 0xE3
Bit
7
6
5
4
3
2
1
0
Field
NPID7
NPID6
NPID5
NPID4
NPID3
NPID2
NPID1
NPID0
Data Type: Inverse 8-Bit unsigned integer
USAGE: This value is the inverse of the Product_ID, located at the inverse address. It can be used to test the SPI port.
40
Pixel_Burst
Address: 0x40
Access: Read
Default Value: 0x00
Bit
7
6
5
4
3
2
1
0
Field
PB7
PB6
PB5
PB4
PB3
PB2
PB1
PB0
Data Type: Eight bit unsigned integer
USAGE: The Pixel_Burst register is used for high-speed access to all the pixel values from one and 2/3 complete frame.
See the Synchronous Serial Port section for use details.
Motion_Burst
Address: 0x50
Access: Read
Default Value: 0x00
Bit
7
6
5
4
3
2
1
0
Field
MB7
MB6
MB5
MB4
MB3
MB2
MB1
MB0
Data Type: Various, depending on data
USAGE: The Motion_Burst register is used for high-speed access to the Motion, Delta_X, Delta_Y, SQUAL, Shutter_Upper, Shutter_Lower, and Maximum_Pixel registers. See the Synchronous Serial Port section for use details.
SROM_Load
Address: 0x 60
Access: Write
Default Value: N/A
Bit
7
6
5
4
3
2
1
0
Field
SL7
SL6
SL5
SL4
SL3
SL2
SL1
SL0
Data Type: Eight bit unsigned integer
USAGE: The SROM_Load register is used for high-speed programming of the ADNS-6010 from an external PROM or
microcontroller. See the Synchronous Serial Port section for use details.
41
ADNV-6340
Single-Mode Vertical-Cavity Surface Emitting Laser (VCSEL)
Description
Features
This advanced class of VCSELs was engineered by Avago
Technologies providing a laser diode with a single longitudinal as well as a single transverse mode. In contrast
to most oxide-based single-mode VCSELs, these VCSELs
remain within a single mode operation over a wide range
of output power. When compared to an LED, the ADNV6340 has a significantly lower power consumption making it an ideal choice for optical navigation applications.
• Advanced Technology VCSEL chip
• Single Mode Lasing operation
• Non-hermetic plastic package
• 832-865 nm wavelength
• Enhanced ESD up to 2-KV
4.3
KAPTON TAPE
W
X
Y
Z
5.36
= BIN NUMBER
= BIN LETTER
= SUBCONTRACTOR CODE
= DIE SOURCE
1° MAX.
4.70 ± 0.05
(BASE)
(5.25)
AT SHOULDER
CATHODE
FLAT
3.28
0.90
+3°
2X 90°- 5 °
5.72
7.22
0.50
0.25
5.25 ± 0.65
AT LEAD TIP
Figure 31. Outline drawing for ADNV-6340 VCSEL.
Note: Since the VCSEL package is not sealed, the protective kapton
tape should not be removed until just prior to assembly into the
ADNS-6120 or ADNS-6130-001 lens.
42
11.00
7.20 MAX.
CABLE/WIRE CONNECTION
5.00
RECOMMENDED PCB THICKNESS: 1.5 Ð 1.6 mm
1.70
PLASTIC VCSEL PACKAGE: 5.00 PITCH
LEADS: 0.5 x 0.25
Figure 32. Suggested ADNV-6340 PCB mounting guide.
Absolute Maximum Ratings
Parameter
DC Forward Current
Peak Pulsing Current
Power Dissipation
Reverse Voltage
Laser Junction Temperature
Operating Case Temperature
Storage Case Temperature
Lead Soldering Temperature
ESD (Human-Body Model)
Rating
12
19
24
5
150
5 to 45
-40 to +85
260
2
Comments:
1. Stresses greater than those listed under “Absolute
Maximum Ratings” may cause permanent damage
to the device. These are the stress ratings only and
functional operation of the device at these or any
other condition beyond those indicated for extended
period of time may affect device reliability.
2. The maximum ratings do not reflect eye-safe operation. Eye safe operating conditions are listed in the
power adjustment procedure section in the ADNS7050 laser sensor datasheet.
3. The inherent design of this component causes it to be
sensitive to electrostatic discharge. The ESD threshold is listed above. To prevent ESD-induced damage,
take adequate ESD precautions when handling this
product.
43
Units
mA
mA
mW
V
˚C
˚C
˚C
˚C
KV
Notes
Duration = 100ms, 10% duty cycle
I = 10µA
See IR reflow profile (Figure 32)
Optical/Electrical Characteristics (at Tc = 5 °C to 45 °C):
Parameter
Peak Wavelength
Maximum Radiant Power [1]
Symbol
l
LOPmax
Wavelength Temperature Coefficient
Wavelength Current Coefficient
Beam Divergence
Threshold Current
Slope Efficiency
Forward Voltage [2]
dλ /dT
dλ /dI
θ FW@1/e^2
Ith
SE
VF
Min.
832
Typ.
842
4.5
Max.
865
Units
nm
mW
0.065
0.21
15
4.2
0.4
1.9
Notes
Maximum output power under any condition.
This is not a recommended operating condition
and does not meet eye safety requirements.
nm/ºC
nm/mA
deg
mA
W/A
V
At 500 µW output power
Comments:
VCSELs are sorted into bins as specified in the power
adjustment procedure section in the ADNS-6XXX laser
sensor datasheets. Appropriate binning resistor and
register data values are used in the application circuit to
achieve the target output power.
Danger:
When driven with current or temperature range greater
than specified in the power adjustment procedure section, eye safety limits may be exceeded. At this level, the
VCSEL should be treated as a Class IIIb laser, potentially
an eye safety hazard.
Typical Characteristics
4.5
2.5
4.0
OPTICAL POWER, LOP (mW)
FORWARD VOLTAGE (V)
2.0
1.5
1.0
0.5
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
0
2
4
6
FORWARD CURRENT (I F)
Figure 33. Forward voltage vs. forward current .
44
8
10
0
0
5
10
15
20
FORWARD CURRENT, I F (mA)
Figure 34. Optical power vs. forward current.
25
50
dT
TEMPERATURE RISE ( ˚C)
40
30
20
10
0
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15
I (mA)
Figure 35. Junction temperature rise vs. forward current.
300
10-20 SEC
TEMPERATURE (˚C)
250
217˚C
120 SEC
200
60-150 SEC
150
125˚C
100
50
40˚C
0
0
22 45
66 87 108 129 150 171 192 213 235 256 278 299 320 341 363 384
TIME
Figure 36. Recommended reflow soldering profile.
45
255˚C
250˚C
ADNS-6120 and ADNS-6130-001
Laser Mouse Lens
Description
The ADNS-6120 and ADNS-6130-001 laser mouse lens are
designed for use with Avago Technologies laser mouse
sensors and the illumination subsystem provided by the
ADNS-6230-001 VCSEL assembly clip and the ADNV-6340
Single-Mode Vertical-Cavity Surface Emitting Lasers
(VCSEL). Together with the VCSEL, the ADNS-6120 or
ADNS-6130-001 laser mouse lens provides the directed
illumination and optical imaging necessary for proper
Figure 37. ADNS-6120 laser mouse round lens outline drawings and details
46
operation of the laser mouse sensor. ADNS-6120 or
ADNS-6130-001 laser mouse lens is a precision molded
optical component and should be handled with care to
avoid scratching of the optical surfaces.
Part Number
Description
ADNS-6120
Laser Mouse Round Lens
ADNS-6130-001
Laser Mouse Trim Lens
Figure 38. ADNS-6130-001 laser mouse trim lens outline drawings and details
MOUSE SENSOR LID
ADNS-6120
B
A
OBJECT SURFACE
Figure 39. Optical system assembly cross-section diagram
47
Mechanical Assembly Requirements
All specifications reference Figure 39, Optical System Assembly Diagram
Figure 40. Logo locations
48
Lens Design Optical Performance Specifications
All specifications are based on the Mechanical Assembly Requirements.
Parameters
Symbol
Design Wavelength
l
Lens Material* Index of Refraction
N
Min.
Typical
Max.
842
1.5693
1.5713
Units
Conditions
nm
1.5735
l = 842 nm
*Lens material is polycarbonate. Cyanoacrylate based adhesives should not be used as they will cause lens material
deformation.
Mounting Instructions for the ADNS-6120 and ADNS-6130-001 Laser Mouse Lenses to the Base Plate
An IGES format drawing file with design specifications for laser mouse base plate features is available. These features
are useful in maintaining proper positioning and alignment of the ADNS-6120 or ADNS-6130-001 laser mouse lens
when used with the Avago Technologies Laser Mouse Sensor. This file can be obtained by contacting your local Avago
Technologies sales representative.
Figure 41. Illustration of base plate mounting features for ADNS-6120 laser mouse round lens
Figure 42. Illustration of base plate mounting features for ADNS-6130-001 laser mouse trim lens
50
ADNS-6230-001
Laser Mouse VCSEL Assembly Clip
Description
The ADNS-6230-001 VCSEL Assembly Clip is designed to
provide mechanical coupling of the ADNV-6340 VCSEL
to the ADNS-6120 or ADNS-6130-001 Laser Mouse Lens.
This coupling is essential to achieve the proper illumination alignment required for the sensor to operate on a
wide variety of surfaces.
Figure 43. Outline Drawing for ADNS-6230-001 VCSEL Assembly Clip
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Limited in the United States and other countries.
Data subject to change. Copyright © 2007 Avago Technologies Limited. All rights reserved. Obsoletes AV01-0104EN
AV02-0118EN - August 17, 2007