a FEATURES Fast 12-Bit ADC with 1.47 s Conversion Time 600 kSPS Throughput Rate (AD7892-3) 500 kSPS Throughput Rate (AD7892-1, AD7892-2) Single Supply Operation On-Chip Track/Hold Amplifier Selection of Input Ranges: ⴞ10 V or ⴞ5 V for AD7892-1 0 V to +2.5 V for AD7892-2 ⴞ2.5 V for AD7892-3 High Speed Serial and Parallel Interface Low Power, 60 mW typ Overvoltage Protection on Analog Inputs (AD7892-1 and AD7892-3) LC2MOS Single Supply, 12-Bit 600 kSPS ADC AD7892 FUNCTIONAL BLOCK DIAGRAM REF OUT/REF IN VDD 2k⍀ +2.5V AD7892 MODE REFERENCE DB0 DB2 DB3/RFS 12-BIT DB4/SCLK DB5/SDATA DB10/LOW DB11/LOW ADC VIN1 SIGNAL VIN2 SCALING TRACK/HOLD CLOCK CONTROL LOGIC CS GENERAL DESCRIPTION The AD7892 is a high speed, low power, 12-bit A/D converter that operates from a single +5 V supply. The part contains a 1.47 µs successive approximation ADC, an on-chip track/hold amplifier, an internal +2.5 V reference and on-chip versatile interface structures that allow both serial and parallel connection to a microprocessor. The part accepts an analog input range of ± 10 V or ± 5 V (AD7892-1), 0 V to +2.5 V (AD7892-2) and ± 2.5 V (AD7892-3). Overvoltage protection on the analog inputs for the AD7892-1 and AD7892-3 allows the input voltage to go to ± 17 V or ± 7 V respectively without damaging the ports. The AD7892 offers a choice of two data output formats: a single, parallel, 12-bit word or serial data. Fast bus access times and standard control inputs ensure easy parallel interface to microprocessors and digital signal processors. A high speed serial interface allows direct connection to the serial ports of microcontrollers and digital signal processors. In addition to the traditional dc accuracy specifications such as linearity, full-scale and offset errors, the part is also specified for dynamic performance parameters including harmonic distortion and signal-to-noise ratio. RD EOC CONVST AGND DGND STANDBY The AD7892 is fabricated in Analog Devices’ Linear Compatible CMOS (LC2MOS) process, a mixed technology process that combines precision bipolar circuits with low power CMOS logic. It is available in a 24-lead, 0.3" wide, plastic or hermetic DIP or in a 24-lead SOIC. PRODUCT HIGHLIGHTS 1. The AD7892-3 features a conversion time of 1.47 µs and a track/hold acquisition time of 200 ns. This allows a throughput rate for the part up to 600 kSPS. The AD7892-1 and AD7892-2 operate with throughput rates of 500 kSPS. 2. The AD7892 operates from a single +5 V supply and consumes 60 mW typ making it ideal for low power and portable applications. 3. The part offers a high speed, flexible interface arrangement with parallel and serial interfaces for easy connection to microprocessors, microcontrollers and digital signal processors. REV. C Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781/329-4700 World Wide Web Site: http://www.analog.com Fax: 781/326-8703 © Analog Devices, Inc., 2000 AD7892* PRODUCT PAGE QUICK LINKS Last Content Update: 02/23/2017 COMPARABLE PARTS DESIGN RESOURCES View a parametric search of comparable parts. • AD7892 Material Declaration • PCN-PDN Information EVALUATION KITS • Quality And Reliability • AD7892 Evaluation Board • Symbols and Footprints DOCUMENTATION DISCUSSIONS Application Notes View all AD7892 EngineerZone Discussions. • AN-414: Low Cost, Low Power Devices for HDSL Applications SAMPLE AND BUY Data Sheet Visit the product page to see pricing options. 2 • AD7892: LC MOS Single Supply, 12-Bit 600 kSPS ADC Data Sheet • AD7892: Military Data Sheet TECHNICAL SUPPORT Product Highlight Submit a technical question or find your regional support number. • 8- to 18-Bit SAR ADCs ... From the Leader in High Performance Analog DOCUMENT FEEDBACK REFERENCE MATERIALS Submit feedback for this data sheet. Technical Articles • MS-2210: Designing Power Supplies for High Speed ADC This page is dynamically generated by Analog Devices, Inc., and inserted into this data sheet. A dynamic change to the content on this page will not trigger a change to either the revision number or the content of the product data sheet. This dynamic page may be frequently modified. V ⴞ 5%, AGND = DGND = 0 V, REF IN = +2.5 V. All specifications T AD7892–SPECIFICATIONS (Vunless= +5otherwise noted.) DD MIN to TMAX A Versions1 B Versions S Version2 Unit 70 –78 –79 70 –78 –79 70 –78 –79 dB min dB max dB max typ –84 dB –78 –78 –78 –78 –78 –78 dB max dB max fa = 49 kHz, fb = 50 kHz typ –84 dB typ –84 dB fIN = 100 kHz. fSAMPLE = 600 kSPS 70 –78 –79 70 –78 –79 dB min dB max dB max –78 –78 –78 –78 dB max dB max 12 12 12 Bits 12 ± 1.5 ±1 12 ±1 ±1 12 ±1 ±1 Bits LSB max LSB max ±4 ±4 ±3 ±4 ±4 ±2 ±5 ±5 ±3 LSB max LSB max LSB max ±4 ±4 ±4 ±4 ±4 ±3 ±5 ±4 ±5 ±3 ±5 ±4 LSB max LSB max ± 10 ±5 8 ± 10 ±5 8 ± 10 ±5 8 Volts Volts kΩ min Input Applied to VIN1 with VIN2 Grounded Input Applied to VIN1 and VIN2 Input Applied to VIN1 with VIN2 Grounded 0 to +2.5 10 ± 50 0 to +2.5 10 ± 50 0 to +2.5 50 ± 50 Volts nA max mV max Input Applied to VIN1 ± 2.5 2 ± 2.5 2 Volts kΩ min Input Applied to VIN1 REFERENCE OUTPUT/INPUT REF IN Input Voltage Range Input Impedance Input Capacitance4 REF OUT Output Voltage REF OUT Error @ +25°C TMIN to TMAX REF OUT Temperature Coefficient REF OUT Output Impedance 2.375/2.625 1.6 10 2.5 ± 10 ± 20 25 5.5 2.375/2.625 1.6 10 2.5 ± 10 ± 20 25 5.5 2.375/2.625 1.6 10 2.5 ± 10 ± 25 25 5.5 V min/V max kΩ min pF max V nom mV max mV max ppm/°C typ kΩ nom 2.5 V ± 5% Resistor Connected to Internal Reference Node LOGIC INPUTS Input High Voltage, VINH Input Low Voltage, VINL Input Current, IIN Input Capacitance, CIN4 2.4 0.8 ± 10 10 2.4 0.8 ± 10 10 2.4 0.8 ± 10 10 V min V max µA max pF max VDD = 5 V ± 5% VDD = 5 V ± 5% VIN = 0 V to VDD Parameter DYNAMIC PERFORMANCE AD7892-1, AD7892-2 Signal to (Noise + Distortion) Ratio3 Total Harmonic Distortion3 Peak Harmonic or Spurious Noise3 Intermodulation Distortion3 2nd Order Terms 3rd Order Terms AD7892-3 Signal to (Noise + Distortion) Ratio3 Total Harmonic Distortion3 Peak Harmonic or Spurious Noise3 Intermodulation Distortion3 2nd Order Terms 3rd Order Terms DC ACCURACY Resolution Minimum Resolution for Which No Missing Codes Are Guaranteed Relative Accuracy3 Differential Nonlinearity3 AD7892-1 Positive Full-Scale Error3 Negative Full-Scale Error3 Bipolar Zero Error3 AD7892-3 Positive Full-Scale Error3 Negative Full-Scale Error3 Bipolar Zero Error3 AD7892-2 Positive Full-Scale Error3 Unipolar Offset Error3 ANALOG INPUT AD7892-1 Input Voltage Range Input Voltage Range Input Resistance AD7892-2 Input Voltage Range on VIN1 Input Current Input Voltage Range on VIN2 AD7892-3 Input Voltage Range on VIN1 Input Resistance Test Conditions/Comments fIN = 100 kHz. fSAMPLE = 500 kSPS fa = 49 kHz, fb = 50 kHz LSB max LSB max LSB max –2– REV. C AD7892 Parameter LOGIC OUTPUTS Output High Voltage, VOH Output Low Voltage, VOL DB11–DB0 Floating-State Leakage Current Floating-State Capacitance4 Output Coding AD7892-1 and AD7892-3 AD7892-2 CONVERSION RATE Conversion Time Track/Hold Acquisition Time3 Conversion Time Track/Hold Acquisition Time3 POWER REQUIREMENTS VDD IDD5 Normal Operation Standby Mode6 AD7892-2 AD7892-3, AD7892-1 Power Dissipation5 Normal Operation Standby Mode6 AD7892-2 AD7892-3, AD7892-1 A Versions 1 2 B Versions S Version Unit Test Conditions/Comments 4.0 0.4 4.0 0.4 4.0 0.4 V min V max ISOURCE = 200 µA ISINK = 1.6 mA ± 10 15 ± 10 15 ± 10 15 µA max pF max Two’s Complement Straight (Natural) Binary 1.68 0.32 µs max µs max µs max µs max AD7892-3 AD7892-3 AD7892-1 and AD7892-2 AD7892-1 and AD7892-2 +5 +5 V nom ± 5% for Specified Performance 18 18 19 mA max 250 80 250 80 100 µA typ µA max typ 15 µA 90 90 95 mW max VDD = +5 V. Typically 60 mW 1.25 400 1.25 400 500 mW typ µW max VDD = +5 V. Typically 75 µW 1.47 0.2 1.6 0.4 1.47 0.2 1.6 0.4 +5 NOTES 1 Temperature ranges are as follows: A, B Versions: –40°C to +85°C; S Version: –55°C to +125°C. 2 S Version available on AD7892-1 and AD7892-2 only. 3 See Terminology. 4 Sample tested @ +25°C to ensure compliance. 5 These normal mode and standby mode currents are achieved with resistors (in the range 10 kΩ to 100 kΩ) to either DGND or V DD on Pins 8, 9, 16 and 17. 6 A conversion should not be initiated on the part within 30 µs of exiting standby mode. Specifications subject to change without notice. ABSOLUTE MAXIMUM RATINGS* (TA = +25°C unless otherwise noted) VDD to AGND . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V VDD to DGND . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V Analog Input Voltage to AGND AD7892-1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 17 V AD7892-2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, VDD AD7892-3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 7 V Reference Input Voltage to AGND . . . –0.3 V to VDD + 0.3 V Digital Input Voltage to DGND . . . . . –0.3 V to VDD + 0.3 V Digital Output Voltage to DGND . . . . –0.3 V to VDD + 0.3 V Operating Temperature Range Commercial (A, B Versions) . . . . . . . . . . . –40°C to +85°C Extended (S Version) . . . . . . . . . . . . . . . . –55°C to +125°C Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C REV. C –3– Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . +150°C Plastic DIP Package, Power Dissipation . . . . . . . . . . 450 mW θJA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 105°C/W Lead Temperature (Soldering, 10 sec) . . . . . . . . . . . +260°C Cerdip Package, Power Dissipation . . . . . . . . . . . . . . 450 mW θJA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 70°C/W Lead Temperature (Soldering, 10 sec) . . . . . . . . . . . +300°C SOIC Package, Power Dissipation . . . . . . . . . . . . . . . 450 mW θJA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 75°C/W Lead Temperature, Soldering Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215°C Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220°C *Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. AD7892 TIMING CHARACTERISTICS1, 2 (V Parameter tCONV tACQ Parallel Interface t1 t2 t3 t4 t5 t6 3 t7 4 t8 t9 Serial Interface t10 t113 t12 t13 t143 t153 t16 t174 t17A4 A, B Versions DD = +5 V ⴞ 5%, AGND = DGND = 0 V, REF IN = +2.5 V) S Version Unit Test Conditions/Comments Conversion Time for AD7892-3 Conversion Time for AD7892-1, AD7892-2 Acquisition Time for AD7892-3 Acquisition Time for AD7892-1, AD7892-2 1.47 1.6 200 400 320 µs max µs max ns min ns min 35 60 0 0 35 35 5 30 0 200 45 60 0 0 45 40 5 40 0 200 ns min ns min ns min ns min ns min ns max ns min ns max ns min ns min CONVST Pulsewidth EOC Pulsewidth EOC Falling Edge to CS Falling Edge Setup Time CS to RD Setup Time Read Pulsewidth Data Access Time After Falling Edge of RD Bus Relinquish Time After Rising Edge of RD 30 25 25 25 5 25 20 0 30 0 30 35 30 25 25 5 30 30 0 30 0 30 ns min ns max ns min ns min ns min ns max ns min ns min ns max ns min ns max RFS Low to SCLK Falling Edge Setup Time RFS Low to Data Valid Delay SCLK High Pulsewidth SCLK Low Pulsewidth SCLK Rising Edge to Data Valid Hold Time SCLK Rising Edge to Data Valid Delay RFS to SCLK Falling Edge Hold Time Bus Relinquish Time after Rising Edge of RFS 1.68 CS to RD Hold Time RD to CONVST Setup Time Bus Relinquish Time after Rising Edge of SCLK NOTES 1 Sample tested at +25°C to ensure compliance. All input signals are measured with tr = tf = 1 ns (10% to 90% of +5 V) and timed from a voltage level of +1.6 V. 2 See Figures 2 and 3. 3 Measured with the load circuit of Figure 1 and defined as the time required for an output to cross 0.8 V or 2.4 V. 4 These times are derived from the measured time taken by the data outputs to change 0.5 V when loaded with the circuit of Figure 1. The measured number is then extrapolated back to remove the effects of charging or discharging the 50 pF capacitor. This means that the times quoted in the timing characteristics are the true bus relinquish times of the part and as such are independent of external bus loading capacitances. 5 Assumes CMOS loads on the data bits. With TTL loads, more current is drawn from the data lines and the RD to CONVST time needs to be extended to 400 ns min. Specifications subject to change without notice. 1.6mA TO +1.6V OUTPUT PIN 50pF 200A Figure 1. Load Circuit for Access Time and Bus Relinquish Time CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the AD7892 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. –4– WARNING! ESD SENSITIVE DEVICE REV. C AD7892 ORDERING GUIDE Model Input Range Sample Rate AD7892AN-1 AD7892BN-1 AD7892AR-1 AD7892BR-1 AD7892SQ-1 AD7892AN-2 AD7892BN-2 AD7892AR-2 AD7892BR-2 AD7892AN-3 AD7892BN-3 AD7892AR-3 AD7892BR-3 EVAL-AD7892-2CB2 EVAL-AD7892-3CB2 EVAL-CONTROL BOARD3 ± 5 V or ± 10 V ± 5 V or ± 10 V ± 5 V or ± 10 V ± 5 V or ± 10 V ± 5 V or ± 10 V 0 V to +2.5 V 0 V to +2.5 V 0 V to +2.5 V 0 V to +2.5 V ± 2.5 V ± 2.5 V ± 2.5 V ± 2.5 V Evaluation Board Evaluation Board Controller Board 500 kSPS 500 kSPS 500 kSPS 500 kSPS 500 kSPS 500 kSPS 500 kSPS 500 kSPS 500 kSPS 600 kSPS 600 kSPS 600 kSPS 600 kSPS Relative Accuracy ± 1 LSB ± 1 LSB ± 1 LSB ± 1 LSB ± 1 LSB ± 1 LSB ± 1 LSB Temperature Range Package Option1 –40°C to +85°C –40°C to +85°C –40°C to +85°C –40°C to +85°C –55°C to +125°C –40°C to +85°C –40°C to +85°C –40°C to +85°C –40°C to +85°C –40°C to +85°C –40°C to +85°C –40°C to +85°C –40°C to +85°C N-24 N-24 R-24 R-24 Q-24 N-24 N-24 R-24 R-24 N-24 N-24 R-24 R-24 NOTES 1 N = Plastic DIP; Q = Cerdip; R = SOIC. 2 These boards can be used as stand-alone evaluation boards or in conjunction with the EVAL-CONTROL BOARD for evaluation/demonstration purposes. 3 This board is a complete unit allowing a PC to control and communicate with all Analog Devices’ evaluation boards ending in the CB designators. REV. C –5– AD7892 PIN FUNCTION DESCRIPTION Pin No. Mnemonic Description 1 VDD Positive Supply Voltage, +5 V ± 5%. 2 STANDBY Standby Input. Logic Input. With this input at a logic high, the part is in its normal operating mode; with this input at a logic low, the part is placed in its standby or power-down mode, which reduces power consumption to 5 mW typical. 3 VIN2 Analog Input 2. For the AD7892-1, this input either connects to AGND or to VIN1 to determine the analog input voltage range. With VIN2 connected to AGND on the AD7892-1, the analog input range at the VIN1 input is ± 10 V. With VIN2 connected to VIN1 on the AD7892-1, the analog input range to the part is ± 5 V. For the AD7892-2 and AD7892-3, this input can be left unconnected but must not be connected to a potential other than AGND. 4 VIN1 Analog Input 1. The analog input voltage to be converted by the AD7892 is applied to this input. For the AD7892-1, the input voltage range is either ± 5 V or ± 10 V depending on where the VIN2 input is connected. For the AD7892-2, the voltage range on the VIN1 input is 0 V to +2.5 V with respect to the voltage appearing at the VIN2 input. For the AD7892-3, the voltage range on the VIN1 input is ± 2.5 V. 5 REF OUT/REF IN Voltage Reference Output/Input. The part can be used with either its own internal reference or with an external reference source. The on-chip +2.5 V reference is provided at this pin. When using this internal reference as the reference source for the part, REF OUT should be decoupled to AGND with a 0.1 µF disc ceramic capacitor. The output impedance of this reference source is typically 5.5 kΩ. When using an external reference source as the reference voltage for the part, the reference source should be connected to this pin. This overdrives the internal reference and provides the reference source for the part. The REF IN input is buffered on-chip but must be able to sink or source current through the resistor to the output of the on-chip reference. The nominal reference voltage for correct operation of the AD7892 is +2.5 V. 6 AGND Analog Ground. Ground reference for track/hold, comparator and DAC. 7 MODE Mode. Control input which determines the interface mode for the AD7892. With this pin at a logic low, the device is in its serial interface mode; with this pin at a logic high, the device is in its parallel interface mode. 8 DB11/LOW Data Bit 11/Test Pin. When the device is in its parallel mode, this pin is Data Bit 11 (MSB), a three-state TTL-compatible output. When the device is in its serial mode, this is used as a test pin which must be tied to a logic low for correct operation of the AD7892. 9 DB10/LOW Data Bit 10/Test Pin. When the device is in its parallel mode, this pin is Data Bit 10, a three-state TTL-compatible output. When the device is in its serial mode, this is used as a test pin which must be tied to a logic low for correct operation of the AD7892. 10 DB9 Data Bit 9. Three-state TTL-compatible output. This output should be left unconnected when the device is in its serial mode. 11 DB8 Data Bit 8. Three-state TTL-compatible output. This output should be left unconnected when the device is in its serial mode. 12 DB7 Data Bit 7. Three-state TTL-compatible output. This output should be left unconnected when the device is in its serial mode. 13 DB6 Data Bit 6. Three-state TTL-compatible output. This output should be left unconnected when the device is in its serial mode. 14 DGND Digital Ground. Ground reference for digital circuitry. 15 DB5/SDATA Data Bit 5/Serial Data. When the device is in its parallel mode, this pin is Data Bit 5, a three-state TTL-compatible output. When the device is in its serial mode, this becomes the serial data output line. Sixteen bits of serial data are provided with four leading zeros preceding the 12 bits of valid data. Serial data is valid on the falling edge of SCLK for sixteen edges after RFS goes low. Output coding is two’s complement for AD7892-1 and AD7892-3 and straight (natural) binary for AD7892-2. –6– REV. C AD7892 Pin No. Mnemonic Description 16 DB4/SCLK Data Bit 4/Serial Clock. When the device is in its parallel mode, this pin is Data Bit 4, a three-state TTL-compatible output. When the device is in its serial mode, this becomes the serial clock pin, SCLK. SCLK is an input and an external serial clock must be provided at this pin to obtain serial data from the AD7892. Serial data is clocked out from the output shift register on the rising edges of SCLK after RFS goes low. 17 DB3/RFS Data Bit 3/Receive Frame Synchronization. When the device is in its parallel mode, this pin is Data Bit 3, a three-state TTL-compatible output. When the device is in its serial mode, this becomes the receive frame synchronization input with RFS provided externally to obtain serial data from the AD7892. 18 DB2 Data Bit 2. Three-state TTL-compatible output. This output should be left unconnected when the device is in its serial mode. 19 DB1 Data Bit 1. Three-state TTL-compatible output. This output should be left unconnected when the device is in its serial mode. 20 DB0 Data Bit 0 (LSB). Three-state TTL-compatible output. Output coding is two’s complement for AD7892-1 and AD7892-3 and straight (natural) binary for AD7892-2. This output should be left unconnected when the device is in its serial mode. 21 RD Read. Active low logic input which is used in conjunction with CS low to enable the data outputs. 22 CS Chip Select. Active low logic input which is used in conjunction with RD to enable the data outputs. 23 EOC End-of-Conversion. Active low logic output indicating converter status. The end of conversion is signified by a low going pulse on this line. The duration of this EOC pulse is nominally 100 ns. 24 CONVST Convert Start. Logic Input. A low-to-high transition on this input puts the track/hold into its hold mode and starts conversion. PIN CONFIGURATION DIP and SOIC VDD 1 24 CONVST STANDBY 2 23 EOC VIN2 3 22 CS VIN1 4 21 RD REF OUT/REF IN 5 AGND 6 MODE 7 DB11/LOW 8 DB10/LOW 9 20 DB0 (LSB) AD7892 19 DB1 TOP VIEW 18 DB2 (Not to Scale) 17 DB3/RFS 16 DB4/SCLK DB9 10 REV. C 15 DB5/SDATA DB8 11 14 DGND DB7 12 13 DB6 –7– AD7892 TERMINOLOGY Signal to (Noise + Distortion) Ratio Relative Accuracy This is the measured ratio of signal to (noise + distortion) at the output of the A/D converter. The signal is the rms amplitude of the fundamental. Noise is the rms sum of all nonfundamental signals up to half the sampling frequency (fS/2), excluding dc. The ratio is dependent upon the number of quantization levels in the digitization process; the more levels, the smaller the quantization noise. The theoretical signal to (noise + distortion) ratio for an ideal N-bit converter with a sine wave input is given by: Signal to (Noise + Distortion) = (6.02 N + 1.76) dB Relative accuracy or endpoint nonlinearity is the maximum deviation from a straight line passing through the endpoints of the ADC transfer function. Differential Nonlinearity This is the difference between the measured and the ideal 1 LSB change between any two adjacent codes in the ADC. Positive Full-Scale Error (AD7892-1) This is the deviation of the last code transition (01 . . . 110 to 01 . . . 111) from the ideal 4 × REF IN – 3/2 LSB (± 10 V range) or 2 × REF IN – 3/2 LSB (± 5 V range) after the bipolar zero error has been adjusted out. Thus for a 12-bit converter, this is 74 dB. Positive Full-Scale Error (AD7892-2) Total Harmonic Distortion This is the deviation of the last code transition (11 . . . 110 to 11 . . . 111) from the ideal (REF IN – 3/2 LSB) after the unipolar offset error has been adjusted out. Total harmonic distortion (THD) is the ratio of the rms sum of harmonics to the fundamental. For the AD7892, it is defined as: 2 2 2 2 V 2 +V 3 +V 4 +V 5 +V 6 THD (dB) = 20 log V1 2 where V1 is the rms amplitude of the fundamental and V2, V3, V4, V5 and V6 are the rms amplitudes of the second through the sixth harmonics. Peak Harmonic or Spurious Noise Peak harmonic or spurious noise is defined as the ratio of the rms value of the next largest component in the ADC output spectrum (up to fS/2 and excluding dc) to the rms value of the fundamental. Normally, the value of this specification is determined by the largest harmonic in the spectrum, but for parts where the harmonics are buried in the noise floor, it will be a noise peak. Positive Full-Scale Error (AD7892-3) This is the deviation of the last code transition (01 . . . 110 to 01 . . . 111) from the ideal (REF IN – 3/2 LSB) after the bipolar zero error has been adjusted out. Bipolar Zero Error (AD7892-1, AD7892-3) This is the deviation of the midscale transition (all 1s to all 0s) from the ideal (AGND – 1/2 LSB). Unipolar Offset Error (AD7892-2) This is the deviation of the first code transition (00 . . . 000 to 00 . . . 001) from the ideal (AGND + 1/2 LSB). Negative Full-Scale Error (AD7892-1) This is the deviation of the first code transition (10 . . . 000 to 10 . . . 001) from the ideal –4 × REF IN + 1/2 LSB (± 10 V range) or –2 × REF IN + 1/2 LSB (± 5 V range) after bipolar zero error has been adjusted out. Intermodulation Distortion Negative Full-Scale Error (AD7892-3) With inputs consisting of sine waves at two frequencies, fa and fb, any active device with nonlinearities will create distortion products at sum and difference frequencies of mfa ± nfb where m, n = 0, 1, 2, 3, etc. Intermodulation terms are those for which neither m nor n are equal to zero. For example, the second order terms include (fa + fb) and (fa – fb), while the third order terms include (2fa + fb), (2fa – fb), (fa + 2fb) and (fa – 2fb). This is the deviation of the first code transition (10 . . . 000 to 10 . . . 001) from the ideal – REF IN + 1/2 LSB after bipolar zero error has been adjusted out. The AD7892 is tested using two input frequencies away from the bottom end of the input bandwidth. In this case, the second and third order terms are of different significance. The second order terms are usually distanced in frequency from the original sine waves while the third order terms are usually at a frequency close to the input frequencies. As a result, the second and third order terms are specified separately. The calculation of the intermodulation distortion is as per the THD specification where it is the ratio of the rms sum of the individual distortion products to the rms amplitude of the fundamental expressed in dBs. Track/Hold Acquisition Time Track/Hold acquisition time is the time required for the output of the track/hold amplifier to reach its final value, within ±1/2 LSB, after the end of conversion (the point at which the track/hold returns to track mode). It also applies to situations where there is a step input change on the input voltage applied to the VIN input of the AD7892. It means that the user must wait for the duration of the track/hold acquisition time after the end of conversion or after a step input change to VIN before starting another conversion, to ensure that the part operates to specification. –8– REV. C AD7892 CIRCUIT DESCRIPTION The AD7892 is a fast, 12-bit single supply A/D converter. It provides the user with signal scaling, track/hold, reference, A/D converter and versatile interface logic functions on a single chip. The signal scaling on the AD7892-1 allows the part to handle either ± 5 V or ± 10 V input signals while operating from a single +5 V supply. The AD7892-2 handles a 0 V to +2.5 V analog input range, while signal scaling on the AD7892-3 allows it to handle ±2.5 V input signals when operating from a single supply. The part requires a +2.5 V reference which can be provided from the part’s own internal reference or from an external reference source. Conversion is initiated on the AD7892 by pulsing the CONVST input. On the rising edge of CONVST, the track/hold goes from track mode to hold mode and the conversion sequence is started. At the end of conversion (falling edge of EOC), the track/hold returns to tracking mode and the acquisition time begins. Conversion time for the part is 1.47 µs (AD7892-3) and the track/hold acquisition time is 200 ns (AD7892-3). This allows the AD7892-3 to operate at throughput rates up to 600 kSPS. The AD7892-1 and AD7892-2 are specified with a 1.6 µs conversion and 400 ns acquisition time allowing a throughput rate of 500 kSPS. Track/Hold Section The track/hold amplifier on the AD7892 allows the ADC to accurately convert an input sine wave of full-scale amplitude to 12-bit accuracy. The input bandwidth of the track/hold is greater than the Nyquist rate of the ADC even when the ADC is operated at its maximum throughput rate of 600 kHz (i.e., the track/ hold can handle input frequencies in excess of 300 kHz). The track/hold amplifier acquires an input signal to 12-bit accuracy in less than 200 ns. The operation of the track/hold is essentially transparent to the user. The track/hold amplifier goes from its tracking mode to its hold mode on the rising edge of CONVST. The aperture time for the track/hold (i.e., the delay time between the external CONVST signal and the track/ hold actually going into hold) is typically 15 ns. At the end of conversion, the part returns to its tracking mode. The acquisition time of the track/hold amplifier begins at this point. Reference Section The AD7892 contains a single reference pin, labelled REF OUT/ REF IN, which either provides access to the part’s own +2.5 V reference or to which an external +2.5 V reference can be connected to provide the reference source for the part. The part is specified with a +2.5 V reference voltage. Errors in the reference source will result in gain errors in the AD7892’s transfer function and will add to the specified full-scale errors on the part. On the AD7892-1 and AD7892-3, it will also result in an offset error injected in the attenuator stage. The AD7892 contains an on-chip +2.5 V reference. To use this reference as the reference source for the AD7892, simply connect a 0.1 µF disc ceramic capacitor from the REF OUT/ REF IN pin to AGND. The voltage that appears at this pin is internally buffered before being applied to the ADC. If this reference is required for use external to the AD7892, it should be buffered as the part has a FET switch in series with the reference output resulting in a source impedance for this output of 5.5 kΩ nominal. The tolerance on the internal reference is ± 10 mV at 25°C with a typical temperature coefficient of 25 ppm/°C and a maximum error over temperature of ± 25 mV. If the application requires a reference with a tighter tolerance or the AD7892 needs to be used with a system reference, then the user has the option of connecting an external reference to this REF OUT/REF IN pin. The external reference will effectively overdrive the internal reference and thus provide the reference source for the ADC. The reference input is buffered before being applied to the ADC with the maximum input current is ± 100 µA. Suitable reference sources for the AD7892 include the AD680, AD780 and REF43 precision +2.5 V references. INTERFACING The part provides two interface options, a 12-bit parallel interface and a three-wire serial interface. The required interface mode is selected via the MODE pin. The two interface modes are discussed in the following sections. Parallel Interface Mode The parallel interface mode is selected by tying the MODE input to a logic high. Figure 2 shows a timing diagram illustrating the operational sequence of the AD7892. The on-chip track/hold goes into hold mode, and conversion is initiated on the rising edge of the CONVST signal. When conversion is complete, the end of conversion line (EOC) pulses low to indicate that new data is available in the AD7892’s output register. This EOC line can be used to drive an edge-triggered interrupt of a microprocessor. The falling edge of the RD signal should occur 200 ns prior to the next rising edge of CONVST. CS and RD going low accesses the 12-bit conversion result. In systems where the part is interfaced to a gate array or ASIC, this EOC CONVST (I) tACQ t1 t2 EOC (O) tCONV t9 t3 CS (I) t4 t8 t5 RD (I) t6 THREE-STATE DB0–DB11 (O) t7 VALID DATA NOTE: I = INPUT; O = OUTPUT Figure 2. Parallel Mode Timing Diagram REV. C –9– THREE-STATE AD7892 pulse can be applied to the CS and RD inputs to latch data out of the AD7892 and into the gate array or ASIC. This eliminates the logic required in the gate array or ASIC to recognize the end of conversion and generate the read signal for the AD7892. To obtain optimum performance from the AD7892, it is not recommended to tie CS and RD permanently low as this keeps the three-state active during conversion. Serial Interface Mode The AD7892 is configured for serial mode interfacing by tying the MODE input low. It provides for a three-wire, serial link between the AD7892 and industry-standard microprocessors, microcontrollers and digital signal processors. SCLK and RFS of the AD7892 are inputs, and the AD7892’s serial interface is designed for direct interface to systems that provide a serial clock input that is synchronized to the serial data output including microcontrollers such as the 80C51, 87C51, 68HC11 and 68HC05 and most digital signal processors. Figure 3 shows the timing diagram for reading from the AD7892 in the serial interface mode. RFS goes low to access data from the AD7892. The serial clock input does not have to be continuous. The serial data can be accessed in a number of bytes. However, RFS must remain low for the duration of the data transfer operation. Sixteen bits of data are transmitted with four leading zeros followed by the 12-bit conversion result starting with the MSB. Serial data is clocked out of the device on the rising edge of SCLK. Old data is guaranteed to be valid for 5 ns after this edge. This is useful for high speed serial clocks where the access time of the part would not allow sufficient set-up time for the data to be accepted on the falling edge of the clock. In this case, care must be taken that RFS does not go just prior to a rising edge of SCLK. For slower serial clocks data is valid on the falling edge of SCLK. At the end of the read operation, the SDATA line is three-stated by a rising edge on either the SCLK or RFS inputs, whichever occurs first. Serial data cannot be read during conversion to avoid feedthrough problems from the serial clock to the conversion process. For optimum performance of the AD7892-3, a serial read should also be avoided within 200 ns of the rising edge of CONVST to avoid feedthrough into the track/hold during its acquisition time. The serial read should, therefore, occur between the end of conversion (EOC falling edge) and 200 ns prior to the next rising edge of CONVST. For the AD7892-1 and AD7892-2, a serial read should also be avoided within 400 ns of the rising edge of CONVST. This limits the maximum achievable throughput rate in serial mode (assuming 20 MHz serial clock) to 400 kSPS for the AD7892-3 and 357 kSPS for the AD7892-1 and AD7892-2. Analog Input Section The AD7892 is offered as three part types allowing for four different analog input voltage ranges. The AD7892-1 handles either ± 5 V or ± 10 V input voltage ranges. The AD7892-2 handles a 0 V to +2.5 V input voltage range while the AD7892-3 handles an input range of ± 2.5 V. AD7892-1 Figure 4 shows the analog input section for the AD7892-1. The analog input range is pin-strappable (using VIN2) for either ± 5 V or ± 10 V on the VIN1 input. With VIN2 connected to AGND, the input range on VIN1 is ± 10 V, and the input resistance on VIN1 is 15 kΩ nominal. With VIN2 connected to VIN1, the input range on VIN1 is ± 5 V, and the input resistance on VIN1 is 8 kΩ nominal. As a result, the VIN1 and VIN2 inputs should be driven from a low impedance source. The resistor attenuator stage is followed by the high input impedance stage of the track/hold amplifier. This resistor attenuator stage allows the input voltage to go to ± 17 V without damaging the AD7892-1. +2.5 REFERENCE 2k⍀ REF OUT/ REF IN 3.25k⍀ TO ADC REFERENCE CIRCUITRY 6.5k⍀ TO HIGH IMPEDANCE SHA INPUT 13k⍀ VIN1 13k⍀ VIN2 AGND Figure 4. AD7892-1 Analog Input Structure RFS (I) t10 t12 t16 SCLK (I) t13 t11 FOUR LEADING ZEROS SDATA (O) t14 t15 DB11 DB10 t17A t17 DB0 THREESTATE NOTE: I = INPUT; O = OUTPUT Figure 3. Serial Mode Timing Diagram –10– REV. C AD7892 The designed code transitions occur midway between successive integer LSB values (i.e., 1/2 LSB, 3/2 LSBs, 5/2 LSBs). Output coding is two’s complement binary with 1 LSB = FSR/4096 = 20 V/4096 = 4.88 mV for the ± 10 V range and 1 LSB = FSR/ 4096 = 10 V/4096 = 2.44 mV for the ± 5 V range. The ideal input/output transfer function for the AD7892-1 is shown in Table I. AD7892-2 The analog input section for the AD7892-2 contains no biasing resistors. The analog input looks directly into the track/hold input stage. The analog input range on the VIN1 input is 0 V to +2.5 V. The VIN2 input can be left unconnected but if it is connected to a potential then that potential must be AGND. The VIN1 input connects directly to the input sampling capacitor of the AD7892-2’s track/hold. The value of this input sampling capacitor is nominally 10 pF. AD7892-3 Figure 5 shows the analog input section for the AD7892-3. The analog input range is ± 2.5 V on the VIN1 input. The VIN2 input can be left unconnected but if it is connected to a potential then that potential must be AGND. The input resistance on the VIN1 is 1.8 kΩ nominal. As a result, the VIN1 input should be driven from a low impedance source. The resistor attenuator stage is followed by the high input impedance stage of the track/hold amplifier. This resistor attenuator stage allows the input voltage to go to ± 7 V without damaging the AD7892-3. The designed code transitions occur midway between successive integer LSB values (i.e., 1/2 LSB, 3/2 LSBs, 5/2 LSBs). Output coding is two’s complement binary with 1 LSB = FSR/ 4096 = 5 V/4096 = 1.22 mV with REF IN = +2.5 V. The ideal input/output transfer function for the AD7892-3 is shown in Table III. Once again, the designed code transitions occur midway between successive integer LSB values (i.e., 1/2 LSB, 3/2 LSBs, 5/2 LSBs). Output coding is straight (natural) binary with 1 LSB = FSR/4096 = 2.5 V/4096 = 0.61 mV. The ideal input/ output transfer function for the AD7892-2 is shown in Table II. 2k⍀ +2.5 REFERENCE REF OUT/ REF IN Table I. Ideal Input/Output Code Table for the AD7892-1 3.25k⍀ Digital Output Code Transition Analog Input 1, 2 3 +FSR/2 – 3/2 LSB (9.99268 or 4.99634) +FSR/2 – 5/2 LSBs (9.98779 or 4.99390) +FSR/2 – 7/2 LSBs (9.98291 or 4.99146) 011 . . . 110 to 011 . . . 111 011 . . . 101 to 011 . . . 110 011 . . . 100 to 011 . . . 101 AGND + 3/2 LSB (0.00732 or 0.00366) AGND + 1/2 LSB (0.00244 or 0.00122) AGND – 1/2 LSB (–0.00244 or –0.00122) AGND – 3/2 LSB (–0.00732 or –0.00366) 000 . . . 001 000 . . . 000 111 . . . 111 111 . . . 110 –FSR/2 + 5/2 LSB (–9.98779 or –4.99390) –FSR/2 + 3/2 LSB (–9.99268 or –4.99634) –FSR/2 + 1/2 LSB (–9.99756 or –4.99878) 100 . . . 010 to 100 . . . 011 100 . . . 001 to 100 . . . 010 100 . . . 000 to 100 . . . 001 to to to to 3.25k⍀ Table II. Ideal Input/Output Code Table for the AD7892-2 Analog Input Digital Output Code Transition +FSR – 3/2 LSB1, 2 (2.499084 V) +FSR – 5/2 LSBs (2.498474 V) +FSR – 7/2 LSBs (2.497864 V) 111 . . . 110 to 111 . . . 111 111 . . . 110 to 111 . . . 110 111 . . . 100 to 111 . . . 101 AGND + 5/2 LSB (0.001526 V) AGND + 3/2 LSB (0.00916 V) AGND + 1/2 LSB (0.000305 V) 000 . . . 010 to 010 . . . 011 000 . . . 001 to 001 . . . 010 000 . . . 000 to 000 . . . 001 VIN2* AGND * UNCONNECTED INTERNALLY ON THE AD7892-3 Figure 5. AD7892-3 Analog Input Structure Table III. Ideal Input/Output Code Table for the AD7892-3 Analog Input Digital Output Code Transition +FSR/2 – 3/2 LSB1, 2 (2.49817) +FSR/2 – 5/2 LSBs (2.49695) +FSR/2 – 7/2 LSBs (2.49573) 011 . . . 110 to 011 . . . 111 011 . . . 110 to 011 . . . 110 011 . . . 110 to 011 . . . 101 AGND + 3/2 LSB (0.00183) AGND + 1/2 LSB (0.00061) AGND – 1/2 LSB (–0.00061) AGND – 3/2 LSB (–0.00183) 000 . . . 001 000 . . . 000 111 . . . 111 111 . . . 110 –FSR/2 + 5/2 LSB (–2.49695) –FSR/2 + 3/2 LSB (–2.49817) –FSR/2 + 1/2 LSB (–2.49939) 100 . . . 010 to 100 . . . 011 100 . . . 001 to 100 . . . 010 100 . . . 000 to 100 . . . 001 NOTES 1 FSR is full-scale range and is 5 V with REF IN = +2.5 V. 2 1 LSB = FSR/4096 = 1.22 mV with REF IN = +2.5 V. NOTES 1 FSR is full-scale range and is 2.5 V with REF IN = +2.5 V. 2 1 LSB = FSR/4096 = 0.61 mV with REF IN = +2.5 V. REV. C TO HIGH IMPEDANCE SHA INPUT VIN1 000 . . . 010 000 . . . 001 000 . . . 000 111 . . . 111 NOTES 1 FSR is full-scale range and REF IN = +2.5 V, is 20 V for the ± 10 V range and 10 V for the ± 5 V range. 2 1 LSB = FSR/4096 = 4.88 mV (± 10 V range) and 2.44 mV (± 5 V range) with REF IN = +2.5 V. 3 ± 10 V range or ± 5 V range. TO ADC REFERENCE CIRCUITRY –11– to to to to 000 . . . 010 000 . . . 001 000 . . . 000 111 . . . 111 AD7892 MICROPROCESSOR INTERFACING EOC Pulse Provides CS and RD The AD7892 features both high speed parallel and serial interfaces, allowing considerable flexibility in interfacing to microprocessor systems. To obtain optimum performance from the part, data should not be read during conversion and this limits the achievable throughput rate in serial mode to 400 kSPS for the AD7892-3. Figure 8 shows a parallel interface between the AD7892 and a gate array or ASIC. CONVST starts conversion and at the end of conversion the falling edge of the EOC output provides the CS and RD pulse to latch data out of the AD7892 and into the gate array/ASIC. This scheme allows for the fastest possible throughput rate with the part as no time is lost in interrupt service routines and as soon as data is available from the part it is transferred out of it. Figures 6, 7 and 9 show some typical interface circuits between the AD7892 and popular DSP processors. Figure 8 shows an interface between the part and a gate array or ASIC where data is clocked into the ASIC by the AD7892 itself at the end of conversion. In all cases, the CONVST signal is generated from an external timer to ensure equidistant sampling. TIMER AD7892 to ADSP-2101 Interface AD7892 GATE ARRAY/ASIC Figure 6 shows a parallel interface between the AD7892 and the ADSP-2101 DSP processor. CONVST starts conversion and at the end of conversion the falling edge of the EOC output provides an interrupt request to the ADSP-2101. CONVST EOC ENABLE RD CS TIMER DMA13–DMA0 ADSP-2101 ADDRESS BUS DB11–DB0 ADDRESS DECODE LOGIC DMS AD7892 EN CONVST CS IRQn DMD15–DMD0 RD DATA BUS Figure 8. AD7892 to Gate Array/ASIC Interface AD7892 to DSP56000 Interface DB11–DB0 TIMER DSP56000 Figure 6. AD7892 to ADSP-2101 IRQA Figure 7 shows a parallel interface between the AD7892 and the TMS320C25 DSP processor. CONVST starts conversion and at the end of conversion the falling edge of the EOC output provides an interrupt request to the TMS320C25. IS EOC SCK SCLK SRD SDATA SC1 RFS Figure 9. AD7892 to DSP56000 Interface TIMER TMS320C25 AD7892 CONVST AD7892 to TMS320C25 Interface A15–A0 DB11–DB0 Figure 9 shows a serial interface between the AD7892 and the DSP56000 DSP processor. CONVST starts conversion and at the end of conversion the falling edge of the EOC output provides an interrupt request to the DSP56000. EOC RD DATA BUS ADDRESS BUS ADDRESS DECODE LOGIC EN CS CONVST READY G2 AD7892 MSC STRB RD R/W EOC INT D15–D0 DATA BUS DB11–DB0 Figure 7. AD7892 to TMS320C25 Interface –12– REV. C AD7892 Grounding and Layout The AD7892 has a single supply voltage pin, VDD, which supplies both the analog and digital circuitry on the part. For optimum performance from the part, it is recommended that this +5 V is taken from the +5 V analog supply in the system. The analog and digital grounds to the AD7892 are independent and separately pinned out to minimize coupling between the analog and digital sections of the device. The part exhibits good immunity to noise on the supplies but care must still be taken with regard to grounding and layout especially when using switching mode supplies. The printed circuit board which houses the AD7892 should be designed such that the analog and digital sections are separated and confined to certain areas of the board. This facilitates the use of ground planes which can be separated easily. A minimum etch technique is generally best for ground planes as it gives the best shielding. Digital and analog ground planes should only be joined in one place. If the AD7892 is the only device requiring an AGND to DGND connection, then the ground planes should be connected at the AGND and DGND pins of the AD7892. If the AD7892 is in a system where multiple devices require AGND to DGND connections, the connection should still be made at one point only, a star ground point which should be established as close as possible to the AD7892. Evaluating the AD7892 Performance The recommended layout for the AD7892 is outlined in the evaluation board for the AD7892. The evaluation board package includes a fully assembled and tested evaluation board, documentation and software for controlling the board from a PC using the EVAL-CONTROL BOARD. The EVAL-CONTROL BOARD can be used in conjunction with the AD7892 evaluation board, as well as many other Analog Devices evaluation boards ending in the CB designator. Using the EVAL-CONTROL BOARD with the AD7892 evaluation board allows the user to evaluate the ac and dc performance of the AD7892 on a PC. Avoid running digital lines under the device as these will couple noise onto the die. The analog ground plane should be allowed to run under the AD7892 to avoid noise coupling. The power supply lines to the AD7892 should use as large a trace as possible to provide low impedance paths and reduce the effects of glitches on the power supply line. Fast switching signals like clocks should be shielded with digital ground to avoid radiating noise to other sections of the board and clock signals should never be run near the analog inputs. Avoid crossover of digital and analog signals. Traces on opposite sides of the board should run at right angles to each other. This will reduce the effects of feedthrough through the board. A microstrip technique is by far the best but is not always possible with a double-sided board. In this technique, the component side of the board is dedicated to ground planes while signals are placed on the solder side. REV. C Good decoupling is important when using high resolution ADCs. All analog supplies should be decoupled with 10 µF tantalum in parallel with 0.1 µF capacitors to AGND. To achieve the best from these decoupling components, they have to be placed as close as possible to the device, ideally right up against the device. All logic chips should be decoupled with 0.1 µF disc ceramic capacitors to DGND. It is recommended that the system’s AVDD supply is used to supply the VDD for the AD7892. This supply should have the recommended analog supply decoupling capacitors between the VDD pin of the AD7892 and AGND and the recommended digital supply decoupling capacitor between the VDD pin of the AD7892 and DGND. The software provided with the evaluation board allows the user to perform ac (Fast Fourier Transform) and dc (histogram of codes) tests on the AD7892. The evaluation board can also be used in a stand-alone fashion without the EVAL-CONTROL BOARD but in this case, the user has to write their own software to evaluate the part. There are two versions of the evaluation board available, one for the AD7892-2 and one for the AD7892-3. To order the AD7892-2 evaluation board, the order number is EVAL-AD7892-2CB and to order the AD7892-3 evaluation board, the order number is EVAL-AD7892-3CB. –13– AD7892 OUTLINE DIMENSIONS Dimensions shown in inches and (mm). Plastic DIP (N-24) 24 13 1 12 0.260 ± 0.001 (6.61 ± 0.03) C1933c–2.5–6/00 (rev. C) 01359 1.228 (31.19) 1.226 (31.14) 0.32 (8.128) 0.30 (7.62) PIN 1 0.130 (3.30) 0.128 (3.25) 0.02 (0.5) 0.11 (2.79) 0.016 (0.41) 0.09 (2.28) SEATING PLANE 0.07 (1.78) 0.05 (1.27) 0.011 (0.28) 0.009 (0.23) 15ⴗ 0 Cerdip (Q-24) 0.005 (0.13) MIN 0.098 (2.49) MAX 24 13 1 12 0.310 (7.87) 0.220 (5.59) 0.320 (8.13) 0.290 (7.37) PIN 1 0.060 (1.52) 0.015 (0.38) 1.280 (32.51) MAX 0.200 (5.08) MAX 0.150 (3.81) MIN 0.200 (5.08) 0.125 (3.18) 0.023 (0.58) 0.014 (0.36) 0.100 (2.54) BSC 0.070 (1.78) SEATING 0.030 (0.76) PLANE 15° 0° 0.015 (0.38) 0.008 (0.20) SOIC (R-24) 1 12 0.1043 (2.65) 0.0926 (2.35) PIN 1 0.012 (0.30) 0.004 (0.10) 0.050 (1.27) BSC 8ⴗ 0.019 (0.49) 0ⴗ SEATING 0.013 (0.32) 0.014 (0.35) PLANE 0.009 (0.23) –14– 0.0291 (0.74) ⴛ 45ⴗ 0.0098 (0.25) 0.050 (1.27) 0.015 (0.40) PRINTED IN U.S.A. 13 0.419 (10.65) 0.394 (10.00) 24 0.299 (7.60) 0.291(7.40) 0.614 (15.6) 0.598 (15.2) REV. C