BB304C Built in Biasing Circuit MOS FET IC VHF RF Amplifier REJ03G0826-0600 (Previous ADE-208-606D) Rev.6.00 Aug.10.2005 Features • Built in Biasing Circuit; To reduce using parts cost & PC board space. • High gain; (PG = 29 dB typ. at f = 200 MHz) • Low noise characteristics; (NF = 1.2 dB typ. at f = 200 MHz) • Wide supply voltage range; Applicable with 5V to 9V supply voltage. • Withstanding to ESD; Built in ESD absorbing diode. Withstand up to 200V at C=200pF, Rs=0 conditions. • Provide mini mold packages; CMPAK-4(SOT-343mod) Outline RENESAS Package code: PTSP0004ZA-A (Package name: CMPAK-4) 2 3 1 4 Notes: 1. Marking is “DW –”. 2. BB304C is individual type number of RENESAS BBFET. Rev.6.00 Aug 10, 2005 page 1 of 9 1. Source 2. Gate1 3. Gate2 4. Drain BB304C Absolute Maximum Ratings (Ta = 25°C) Item Drain to source voltage Gate1 to source voltage Symbol VDS VG1S Gate2 to source voltage Drain current Channel power dissipation Channel temperature Storage temperature VG2S ID Pch Tch Tstg Ratings 12 Unit V +10 –0 ±10 25 100 150 –55 to +150 V V mA mW °C °C Electrical Characteristics (Ta = 25°C) Item Drain to source breakdown voltage Gate1 to source breakdown voltage Gate2 to source breakdown voltage Gate1 to source cutoff current Gate2 to source cutoff current Gate1 to source cutoff voltage Symbol V(BR)DSS V(BR)G1SS V(BR)G2SS IG1SS IG2SS VG1S(off) Min 12 +10 ±10 — — 0.4 Typ — — — — — — Max — — — +100 ±100 1.0 Unit V V V nA nA V Gate2 to source cutoff voltage VG2S(off) 0.5 — 1.0 V Input capacitance Output capacitance Reverse transfer capacitance Drain current Ciss Coss Crss ID(op) 1 2.3 0.9 0.003 9 2.8 1.3 0.02 14 3.6 2.0 0.05 19 pF pF pF mA ID(op) 2 — 13 — mA VDS = 9 V, VG1 = 9 V, VG2S =6 V RG = 470 kΩ |yfs|1 22 27 34 mS VDS = 5 V, VG1 = 5 V, VG2S =4 V RG = 180 kΩ, f = 1 kHz |yfs|2 — 27 — mS VDS = 9 V, VG1 = 9 V, VG2S =6 V RG = 470 kΩ, f = 1 kHz PG1 24 29 32 dB VDS = 5 V, VG1 = 5 V, VG2S =4 V RG = 180 kΩ, f = 200 MHz PG2 — 29 — dB VDS = 9 V, VG1 = 9 V, VG2S =6 V RG = 470 kΩ, f = 200 MHz NF1 — 1.2 1.9 dB VDS = 5 V, VG1 = 5 V, VG2S =4 V RG = 180 kΩ, f = 200 MHz NF2 — 1.2 — dB VDS = 9 V, VG1 = 9 V, VG2S =6 V RG = 470 kΩ, f = 200 MHz Forward transfer admittance Power gain Noise figure Rev.6.00 Aug 10, 2005 page 2 of 9 Test conditions ID = 200 µA, VG1S = VG2S = 0 IG1 = +10 µA, VG2S = VDS = 0 IG2 = +10 µA, VG1S = VDS = 0 VG1S = +9 V, VG2S = VDS = 0 VG2S = +9 V, VG1S = VDS = 0 VDS = 5 V, VG2S = 4 V ID = 100 µA VDS = 5 V, VG1S = 5 V ID = 100 µA VDS = 5 V, VG1 = 5 V, VG2S = 4 V RG = 180 kΩ, f = 1 MHz VDS = 5 V, VG1 = 5 V, VG2S = 4 V RG = 180 kΩ BB304C Main Characteristics Test Circuit for Operating Items (ID(op) , |yfs|, Ciss, Coss, Crss, NF, PG) VG2 VG1 RG Gate 2 Gate 1 Drain Source A ID 200MHz Power Gain, Noise Figure Test Circuit 1000p 47k VT VG2 VT 1000p 1000p 47k 1000p 47k BBFET Output(50Ω) 1000p L2 Input(50Ω) L1 10p max 1000p 1000p 36p 1SV70 RG RFC 470k 1SV70 1000p VD = VG1 L1 : φ1mm Enameled Copper Wire,Inside dia 10mm, 2Turns L2 : φ1mm Enameled Copper Wire,Inside dia 10mm, 2Turns RFC : φ1mm Enameled Copper Wire,Inside dia 5mm, 2Turns Rev.6.00 Aug 10, 2005 page 3 of 9 Unit Resistance (Ω) Capacitance (F) BB304C Typical Output Characteristics 100 50 50 100 150 200 5 2 4 6 10 25 15 Ω 20 30 k Ω 390 k Ω 470 k Ω 10 560 k Ω 68 0 k Ω 820 k Ω 1M Ω 5 Drain Current ID (mA) 270 k VDS = 9 V RG = 390 kΩ 6V 5V 15 4V 10 3V 2V 5 VG2S = 1 V 1.2 2.4 3.8 0 6.0 4.8 Gate2 to Source Voltage VG2S (V) 2 4 6 8 10 Gate1 Voltage VG1 (V) Drain Current vs. Gate1 Voltege Drain Current vs. Gate1 Voltege 25 25 15 ID (mA) VDS = 9 V RG = 470 kΩ 6V 5V 4V 10 3V 2V 5 Drain Current ID (mA) 8 Drain Current vs. Gate1 Voltage RG = 1.5 MΩ Drain Current Ω 1M Ω = 1.5 M Drain Current vs. Gate2 to Source Voltage 3 20 VDS = 9 V RG = 560 kΩ 15 6V 5V 4V 3V 10 2V 5 VG2S = 1 V VG2S = 1 V 0 0 Drain to Source Voltage VDS (V) 20 20 Ω k 0 82 Ambient Temperature Ta (°C) VDS = VG1 = 9 V 0 0 33 10 RG 0 kΩ 0k 27 kΩ 0 47 Ω 0k 56 k Ω 0 68 k Ω 15 0 25 Drain Current ID (mA) 20 VG2S = 6 V VG1 = VDS 39 150 Ω 25 200 Drain Current ID (mA) Channel Power Dissipation Pch (mW) Maximum Channel Power Dissipation Curve 2 4 6 8 Gate1 Voltage VG1 (V) Rev.6.00 Aug 10, 2005 page 4 of 9 10 0 2 4 6 8 Gate1 Voltage VG1 (V) 10 BB304C Forward Transfer Admittance vs. Gate1 Voltage 30 6V VDS = 9 V RG = 390 kΩ 24 f = 1 kHz 5V 4V 3V 2V 18 12 6 VG2S = 1 V 0 2 4 6 8 10 Forward Transfer Admittance |yfs| (mS) Forward Transfer Admittance |yfs| (mS) Forward Transfer Admittance vs. Gate1 Voltage 30 4V 3V 18 12 6 VG2S = 1 V 0 2 4 6 8 10 Gate1 Voltage VG1 (V) Forward Transfer Admittance vs. Gate1 Voltage Power Gain vs. Gate Resistance 40 30 VDS = 9 V RG = 560 kΩ f = 1 kHz 24 6V 5V 4V 35 Power Gain PG (dB) Forward Transfer Admittance |yfs| (mS) 5V 2V Gate1 Voltage VG1 (V) 3V 18 2V 12 6 30 25 20 15 VG2S = 1 V 0 2 4 6 10 0.1 10 8 4 0.5 1 2 5 10 40 VDS = 9 V VG1 = 9 V VG2S = 6 V f = 200 MHz Power Gain PG (dB) 35 2 1 0 0.1 0.2 Power Gain vs. Drain Current Noise Figure vs. Gate Resistance 3 VDS = 9 V VG1 = 9 V VG2S = 6 V f = 200 MHz Gate Resistance RG (MΩ) Gate1 Voltage VG1 (V) Noise Figure NF (dB) 6V VDS = 9 V RG = 470 kΩ 24 f = 1 kHz 0.2 0.5 1 2 5 Gate Resistance RG (MΩ) Rev.6.00 Aug 10, 2005 page 5 of 9 10 30 25 20 15 10 0 VDS = 9 V VG1 = 9 V VG2S = 6 V RG = variable f = 200 MHz 5 10 15 20 25 Drain Current ID (mA) 30 BB304C Noise Figure vs. Drain Current Drain Current vs. Gate Resistance 30 VDS = 9 V VG1 = 9 V VG2S = 6 V RG = variable f = 200 MHz 3 25 Drain Current ID (mA) Noise Figure NF (dB) 4 2 1 0 5 10 15 20 25 20 15 10 5 0 0.1 30 0.2 0.5 1 2 5 10 Gate Resistance RG (MΩ) Drain Current ID (mA) Input Capacitance vs. Gate2 to Source Voltage Gain Reduction vs. Gate2 to Source Voltage 60 6 VDS = 9 V VG1 = 9 V VG2S = 6 V RG = 470 kΩ f = 200 MHz 50 40 Input Capacitance Ciss (pF) Gain Reduction GR (dB) VDS = 9 V VG1 = 9 V VG2S = 6 V 30 20 10 0 1 2 3 4 5 6 Gate2 to Source Voltage VG2S (V) Rev.6.00 Aug 10, 2005 page 6 of 9 7 5 4 3 2 VDS = 9 V VG1 = 9 V RG = 470 kΩ f = 1 MHz 1 0 1 2 3 4 5 6 Gate2 to Source Voltage VG2S (V) BB304C S21 Parameter vs. Frequency S11 Parameter vs. Frequency .8 1 90° 1.5 .6 Scale: 1 / div. 60° 120° 2 .4 3 30° 150° 4 5 .2 10 .2 0 .4 .6 .8 1 1.5 2 3 45 10 180° 0° −10 −5 −4 −.2 −3 −.4 –30° –150° −2 −.6 −.8 −1 –60° –120° −1.5 –90° Test Condition : VDS = 9 V , VG1 = 9 V VG2S = 6 V , RG = 470 kΩ 50 — 1000 MHz (50 MHz step) Test Condition : VDS = 9 V , VG1 = 9 V VG2S = 6 V , RG = 470 kΩ 50 — 1000 MHz (50 MHz step) S12 Parameter vs. Frequency S22 Parameter vs. Frequency 90° Scale: 0.002 / div. .8 60° 120° 1 .6 1.5 2 .4 3 30° 150° 4 5 .2 10 180° 0° .2 0 .4 .6 .8 1 1.5 2 3 45 10 −10 −5 −4 −.2 −30° −150° −3 −.4 −120° −60° −90° Test Condition : VDS = 9 V , VG1 = 9 V VG2S = 6 V , RG = 470 kΩ 50 — 1000 MHz (50 MHz step) Rev.6.00 Aug 10, 2005 page 7 of 9 −2 −.6 −.8 −1 −1.5 Test Condition : VDS = 9 V , VG1 = 9 V VG2S = 6 V , RG = 470 kΩ 50 — 1000 MHz (50 MHz step) BB304C S Parameter (VDS = VG1 = 9V, VG2S = 6V, RG = 470kΩ, Zo = 50Ω) f(MHz) S11 S21 S12 S22 50 100 150 200 250 300 350 400 450 500 550 600 650 700 750 800 MAG. 0.996 0.993 0.987 0.978 0.972 0.954 0.943 0.925 0.910 0.893 0.880 0.861 0.847 0.829 0.816 0.804 ANG. –5.3 –10.9 –16.6 –21.9 –27.4 –33.2 –38.2 –43.2 –48.0 –52.5 –57.4 –62.1 –66.1 –69.9 –74.1 –78.2 MAG. 2.74 2.73 2.68 2.66 2.63 2.57 2.50 2.43 2.37 2.30 2.24 2.17 2.10 2.02 1.96 1.91 ANG. 174.0 168.0 162.3 156.3 150.4 144.3 138.7 133.3 128.0 122.6 117.5 112.7 108.1 103.6 99.1 94.8 MAG. 0.00096 0.00130 0.00203 0.00285 0.00335 0.00385 0.00455 0.00488 0.00526 0.00522 0.00498 0.00512 0.00497 0.00455 0.00418 0.00372 ANG. 98.6 84.4 83.6 72.3 69.7 68.3 63.2 55.4 59.8 56.1 53.2 49.1 53.4 53.6 51.6 55.7 MAG. 0.985 0.991 0.990 0.988 0.985 0.982 0.979 0.975 0.971 0.967 0.962 0.957 0.952 0.947 0.943 0.937 ANG. –1.9 –4.5 –6.5 –9.4 –11.6 –14.0 –16.2 –18.4 –21.0 –23.0 –25.2 –27.3 –29.4 –31.6 –33.7 –35.8 850 900 950 1000 0.791 0.779 0.764 0.753 –82.4 –86.1 –89.5 –92.4 1.85 1.79 1.73 1.68 80.4 86.3 82.2 78.3 0.00329 0.00275 0.00233 0.00258 62.4 73.0 82.4 105.1 0.933 0.928 0.921 0.918 –38.0 –40.0 –42.1 –44.2 Rev.6.00 Aug 10, 2005 page 8 of 9 BB304C Package Dimensions JEITA Package Code RENESAS Code SC-82A Package Name PTSP0004ZA-A CMPAK-4(T) / CMPAK-4(T)V D MASS[Typ.] 0.006g A e2 e Q b1 c B B E HE LP Reference Symbol L A A x M L1 S A e2 A2 e l1 b5 S b c A A1 y S b2 A3 b e1 b1 b3 c1 c1 c A-A Section l1 b4 B-B Section Pattern of terminal position areas A A1 A2 A3 b b1 b2 b3 c c1 D E e e2 HE L L1 LP x y b4 b5 e1 l1 Q Dimension in Millimeters Min 0.8 0 0.8 0.25 0.35 0.1 1.8 1.15 1.8 0.3 0.1 0.2 Nom 0.9 0.25 0.32 0.42 0.3 0.4 0.13 0.11 2.0 1.25 0.65 0.6 2.1 Max 1.1 0.1 1.0 0.4 0.5 0.15 2.2 1.35 2.4 0.7 0.5 0.6 0.05 0.05 0.45 0.55 1.5 0.9 0.2 Ordering Information Part Name BB304CDW-TL-E Quantity 3000 Shipping Container φ 178 mm Reel, 8 mm Emboss Taping Note: For some grades, production may be terminated. Please contact the Renesas sales office to check the state of production before ordering the product. Rev.6.00 Aug 10, 2005 page 9 of 9 Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials 1. 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