a Low Distortion 750 MHz Closed-Loop Buffer Amp AD9630* PIN CONFIGURATION FEATURES Excellent Gain Accuracy: 0.99 V/V Wide Bandwidth: 750 MHz Slew Rate: 1200 V/s Low Distortion –65 dBc @ 20 MHz –80 dBc @ 4.3 MHz Settling Time 5 ns to 0.1% 8 ns to 0.02% Low Noise: 2.4 nV/√Hz Improved Source for CLC-110 +VS 1 GENERAL DESCRIPTION 7 NC NC 3 6 *** INPUT 4 OBS APPLICATIONS IF/Communications Impedance Transformations Drives Flash ADCs Line Driving 8 OUTPUT ** 2 AD9630 5 –VS NC = NO CONNECT **OPTIONAL +VS ***OPTIONAL –VS NOTE: FOR BEST SETTLING TIME PERFORMANCE USE OPTIONAL POWER SUPPLIES. ALL SPECIFICATIONS ARE BASED ON USING SINGLE 6VS CONNECTIONS, EXCEPT FOR SETTLING TIME TO 0.02% AND SMALL SIGNAL S21. CONSULT THE FACTORY FOR VERSIONS WITH OPTIONAL POWER SUPPLY PINS DISCONNECTED INTERNAL TO THE PACKAGE. OLE The AD9630 is a monolithic buffer amplifier that utilizes a patented, innovative, closed-loop design technique to achieve exceptional gain accuracy, wide bandwidth, and low distortion. Slew rate limiting has been overcome as indicated by the 1200 V/µs slew rate; this improvement allows the user greater flexibility in wideband and pulse applications. The second harmonic distortion terms for an analog input tone of 4.3 MHz and 20 MHz are –80 dBc and –66 dBc, respectively. Clearly, the AD9630 establishes a new standard by combining outstanding dc and dynamic performance in one part. TE The large signal bandwidth, low distortion over frequency, and drive capabilities of the AD9630 make the buffer an ideal flash ADC driver. The AD9630 provides better signal fidelity than many of the flash ADCs that it has been designed to drive. Other applications that require increased current drive at unity voltage gain (such as cable driving) benefit from the AD9630’s performance. The AD9630 is available in plastic DIP (N) and SOIC (R). *Protected under U.S. patent numbers 5,150,074 and 5,537,079. REV. B Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 617/329-4700 World Wide Web Site: http://www.analog.com Fax: 617/326-8703 © Analog Devices, Inc., 1999 AD9630–SPECIFICATIONS ELECTRICAL CHARACTERISTICS (unless otherwise noted, ⴞV = ⴞ5 V; R S Parameter Test Level At DC ∆VS = ± 5% ± 2 V Full Scale +25°C Full +25°C Full +25 to T MAX TMIN +25°C +25 to T MAX TMIN Full +25 to T MAX TMIN +25°C Full +25°C I IV I IV II VI V II VI VI II VI V VI V VO ≤ 0.7 V p-p VO ≤ 0.7 V p-p VO = 5 V p-p VO = 5 V p-p ≤200 MHz ≤200 MHz DC to 150 MHz DC to 150 MHz 2 V p-p; 4.3 MHz 2 V p-p; 20 MHz 2 V p-p; 50 MHz 2 V p-p; 4.3 MHz 2 V p-p; 20 MHz 2 V p-p; 50 MHz 2 V p-p; 50 MHz 10 MHz 100 kHz – 200 MHz TMIN to +25 TMAX TMIN to +25 TMAX Full Full +25°C +25°C Full Full Full Full Full TMIN to +25 TMAX +25°C +25°C II II V V II II V V IV IV II IV IV II II V V 400 330 VOUT = 5 V Step VOUT = 1 V Step VOUT = 1 V Step VOUT = 5 V Step VOUT = 5 V Step VOUT = 2 V Step +25°C +25°C TMIN to T MAX +25°C TMIN to T MAX Full IV IV IV IV IV IV 700 VOUT = 2 V Step VOUT = 2 V Step VOUT = 2 V Step VOUT = 2 V Step 4.4 MHz 4.4 MHz TMIN to +25 TMAX TMIN to +25 TMAX +25°C +25°C IV IV IV V V V 6 7 8 12 0.015 0.025 10 12 ns ns ns ns % Degree VCC = +5 V VEE = –5 V Full Full II II 19 19 26 26 mA mA VOUT = 2 V p-p VOUT = 2 V p-p OBS Output Voltage Range Output Current (50 Ω Load) Output Impedance PSRR DC Nonlinearity FREQUENCY DOMAIN Bandwidth (–3 dB) Small Signal Large Signal Output Peaking Output Rolloff Group Delay Linear Phase Deviation 2nd Harmonic Distortion 3rd Harmonic Distortion Spectral Input Noise Voltage Integrated Output Noise TIME DOMAIN Slew Rate Rise/Fall Time Overshoot Amplitude Settling Time To 0.1% To 0.02%4 Differential Gain Differential Phase SUPPLY CURRENTS VCC (+IS) VEE (–I S) = 50 ⍀, RLOAD = 100 ⍀) Temp Conditions DC SPECIFICATIONS Output Offset Voltage Offset Voltage TC Input Bias Current Bias Current TC Input Resistance Input Capacitance Gain IN Min AD9630AN/AR Typ Max ±3 ±8 ±2 ± 20 450 250 1.0 0.990 0.985 ± 3.6 –8 –40 –25 –100 300 150 0.983 0.980 +3.2 50 40 44 OLE +8 +40 +25 +100 Units 0.6 55 0.03 mV µV/°C µA nA/°C kΩ kΩ pF V/V V/V V mA mA Ω dB % 750 550 120 105 0.4 0 0.7 0.7 –80 –66 –52 –86 –75 –47 –46 2.4 32 MHz MHz MHz MHz dB dB ns Degrees dBc dBc dBc dBc dBc dBc dBc nV/√Hz µV –3.2 TE 1200 1.1 1.3 4.2 5.0 2 1.2 0.3 –73 –58 –43 –79 –68 –41 –40 1.7 1.9 5.7 6.5 12 V/µs ns ns ns ns % NOTES 1 Short-term settling with 50 Ω source impedance. Specifications subject to change without notice. –2– REV. B AD9630 ABSOLUTE MAXIMUM RATINGS 1 Supply Voltages (± VS) . . . . . . . . . . . . . . . . . . . . . . . . . . . ±7 V Continuous Output Current2 . . . . . . . . . . . . . . . . . . . . . 70 mA Temperature Range over Which Specifications Apply AD9630AN/AR . . . . . . . . . . . . . . . . . . . . . –40°C to +85°C Lead Soldering Temperature (10 sec) . . . . . . . . . . . . . +300°C Storage Temperature AD9630AN/AR . . . . . . . . . . . . . . . . . . . . –65°C to +150°C Junction Temperature3 AD9630AN/AR . . . . . . . . . . . . . . . . . . . . . . . . . . . . +150°C NOTES 1 Absolute maximum ratings are limiting values to be applied individually, and beyond which the serviceability of the circuit may be impaired. Functional operability is not necessarily implied. Exposure to absolute maximum rating conditions for an extended period of time may affect device reliability. 2 Output is short-circuit protected to ground, but not to supplies. Prolonged short circuit to ground may affect device reliability. 3 Typical thermal impedances (part soldered onto board): Plastic DIP (N): θ JA = 110°C/W; θJC = 30°C/W; SOIC (R): θJA = 155°C/W; θ JC = 40°C/W. OBS ORDERING GUIDE Model Temperature Range EXPLANATION OF TEST LEVELS Test Level I 100% Production tested. II 100% Production tested at +25°C and sample tested at specified temperatures. AC testing of AN and AR grades done on sample basis only. III Sample tested only. IV Parameter is guaranteed by design and characterization testing. V Typical value. VI S Versions are 100% production tested at temperature extremes. Other grades are sample tested at extremes. 100V (5%, 0.25W) +5V 1 0.1mF 8 AD9630 7 NC NC 2 TOP VIEW NC 3 (Not to Scale) 6 NC 4 OLE Package Description –5.2V 5 24V (5%, 0.25W) NC = NO CONNECT Package Option AD9630 Burn-In Circuit AD9630AN –40°C to +85°C 8-Lead Plastic DIP N-8 AD9630AR –40°C to +85°C 8-Lead SOIC SO-8 AD9630AR-REEL –40°C to +85°C 13" Tape and Reel SO-8 CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the AD9630 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. THEORY OF OPERATION The AD9630 is a wide-bandwidth, closed-loop, unity-gain buffer that makes use of a new voltage-feedback architecture. This architecture brings together wide bandwidth and high slew rate along with exceptional dc linearity. Most previous widebandwidth buffers achieved their bandwidth by utilizing an open-loop topology which sacrificed both dc linearity and frequency distortion when driven into low load impedances. The design’s high loop correction factor radically improves dc linearity and distortion characteristics without diminishing bandwidth. This, in combination with high slew rate, results in exceptionally low distortion over a wide frequency range. 0.1mF TE WARNING! ESD SENSITIVE DEVICE Parasitic or load capacitance (>7 pF) connected directly to the AD9630 output will result in frequency peaking. A small series resistor (RS) connected between the buffer output and capacitive load will negate this effect. Figure 1 shows the optimal value of RS as a function of CL to obtain the flattest frequency response. Figure 2 illustrates frequency response for various capacitive loads utilizing the recommended RS. 50 RS 40 RSERIES – V The AD9630 is an excellent choice to drive high speed and high resolution analog-to-digital converters. Its output stage is designed to drive high speed flash converters with minimal or no series resistance. A current booster built into the output driver helps to maintain low distortion. 200V "R" CL 30 20 NO RS NEEDED WHEN CL < 7pF; FOR CL > 30pF, "R" CAN BE OMITTED 10 0 0 7 20 40 60 80 CL – pF Figure 1. Recommended RS vs. CL REV. B –3– 100 AD9630 the device output. To avoid this occurrence, the power supply leads should be tightly twisted (if appropriate). Ferrite beads mounted between the tantalum and ceramic capacitors will serve the same purpose. 2 FREQUENCY RESPONSE – dB 1 10pF 0 25pF –1 All unused pins (except the optional power supply pins) should be connected to ground to reduce pin-to-pin capacitive coupling and prevent external RF interference. If the source and drive electronics require “remote” operation (> 1 inch from the AD9630), the PC board line impedances should be matched with the buffer input and output resistances. Basic microstrip techniques should be observed. RIN and RS should be connected as close to the AD9630 as possible. 50pF –2 –3 –4 –5 –6 –7 –8 <0.1MHz OBS 100MHz 200MHz With only minimal pulse overshoot and ringing, the AD9630 can drive terminated cables directly without the use of an output termination resistor (RS). Termination resistors (RS and R IN) can be either standard carbon composition or microwave type. For matching characteristic impedances, precision microwave resistors of 1% or better tolerance are preferred. 300MHz CL Figure 2. Frequency Response vs. C L with Recommended RS OLE In pulse mode applications, with RS equal to approximately 12 Ω, capacitive loads of up to 50 pF can be driven with minimal settling time degradation. The AD9630 should be soldered directly to the PC board with as little vertical clearance as possible. The use of zero insertion sockets is strongly discouraged because of the high effective pin inductances. Use of this type socket will result in peaking and possibly induce oscillation. The output stage has short circuit protection to ground. The output driver will shut down if more than approximately 130 mA of instantaneous sink or source current is reached. This level of current ensures that output clipping will not result when driving heavy capacitive loads during high slew conditions, although average load currents above 70 mA may reduce device reliability. LAYOUT CONSIDERATIONS TE +VS Due to the high frequency operation of the AD9630 attention to board layout is necessary to achieve optimum dynamic performance. A two ounce copper ground plane on the top side of the board is recommended; it should cover as much of the board as possible with appropriate openings for supply decoupling capacitors as well as for load and source termination resistors, (see Figure 3). 1 4.7mF 0.1mF 0.1mF 2 * VIN AD9630 RIN RS** 8 VOUT 6 * 5 0.1mF Optimum settling time and ac performance results will be achieved with surface mount 0.1 µF supply decoupling ceramic chip capacitors mounted within 50 mils of the corresponding device pins with the other side soldered directly to the ground plane. For best high resolution (<0.02%) settling times, the optional power supply pins should be decoupled as shown above. If the optional power supply pins are not used, they should be left open. 0.1mF 4.7mF –VS *SEE PINOUTS **SEE FIGURE 1 Figure 3. AD9630 Application Circuit If surface mount capacitors cannot be used, radial lead ceramic capacitors with leads less than 30 mils long are recommended. Low frequency power supply decoupling is necessary and can be accomplished with 4.7 µF tantalum capacitors mounted within 0.5 inches of the supply pins. Due to the series inductance of these capacitors interacting with the 0.1 µF capacitors and power supply leads, high frequency oscillations might appear on –4– REV. B Typical Performance Curves – AD9630 1M 30 100 100k 25 80 10k 20 0 –300 RL = 100V V ppm –400 –500 1k –700 60 |Zo| 15 40 100 10 20 10 5 0 –600 –800 PHASE – Degrees –200 V – |Zo| RL = 200V –100 –900 –1 0 VOLTS 1 3 2 OBS 1M Figure 4. Endpoint DC Linearity 0 1M 1G Figure 5. Input Impedance 50 50 50V 20 10 INTERCEPT – +dBm 30 40 TEST CIRCUIT 50V 30 20 10 100M 10M FREQUENCY – Hz 0 dc 1G Figure 7. PSRR vs. Frequency 50 8 40 6 30 4 TE –2 –4 –6 1 GAIN 0 –2 –3 –45 PHASE –4 VIN = 100mV –90 –5 –135 –6 –180 –20 OFFSET VOLTAGE –30 –40 25 CASE TEMPERATURE – 8C –50 125 Figure 9. Offset Voltage and Bias Current vs. Temperature Figure 10 . Forward Gain and Phase RL = 100V 0 TEST CIRCUIT 50V –3 –0.25 –4 50V –5 –7 1G 0.25 RL = 50V –2 –6 400M 600M 800M FREQUENCY – Hz 0.5 0 –8 0M REV. B –10 RL = 200V –1 –7 200M –10 –55 VOLTS 0 MAGNITUDE – dB 2 VIN = 750mV 250 10 0 0 3 VIN = 100mV 1 –1 100 150 200 FREQUENCY – MHz 20 BIAS CURRENT 2 Figure 8. 2-Tone Intermodulation Distortion PHASE – Degrees MAGNITUDE – dB 2 50 1G 10 –8 0 1M 10M 100M FREQUENCY – Hz Figure 6. Output Impedance OLE 40 PSRR – dB 10M 100M FREQUENCY – Hz OFFSET VOLTAGE – mV –2 6pF –0.5 0 40 80 120 160 FREQUENCY – MHz 200 Figure 11. Frequency Response vs. RLOAD –5– BIAS CURRENT – mA 1 –1000 –3 2ns/DIVISION Figure 12. Small-Signal Pulse Response AD9630 0.1 0.1 TEST CIRCUIT 0.06 100V 6pF 0.04 0.02 0 –0.02 –0.04 –0.06 2.0 100V 10 20 30 TIME – ns 40 1.5 1.0 0.02 0 –0.02 0.5 0 –0.5 TEST CIRCUIT 50V –1.0 –0.04 –1.5 –0.06 50V 6pF –2.0 VOUT = 2V STEP –0.1 1 50 OBS Figure 13. Short-Term Settling Time 6pF 0.04 VOUT = 2V STEP –0.1 2.5 0.06 –0.08 –0.08 10 100 1k TIME – ns 10k 100k Figure 14. Long-Term Settling Time –2.5 –3.0 5ns/DIVISION Figure 15. Large-Signal Pulse Response OLE 40 40 RL = 100V RL = 100V 50 50 2nd 60 70 dBc 60 dBc 3.0 TEST CIRCUIT VOLTS SETTLING PERCENTAGE – % SETTLING PERCENTAGE – % 0.08 0.08 3rd 2nd 70 80 80 90 90 3rd 100 100 1 10 FREQUENCY – MHz 100 Figure 16. Harmonic Distortion VOUT = 4 V p-p 1 10 FREQUENCY – MHz 100 Figure 17. Harmonic Distortion VOUT = 2 V p-p –6– TE REV. B AD9630 OUTLINE DIMENSIONS Dimensions shown in inches and (mm). 8-Lead SOIC (SO-8) 0.430 (10.92) 0.348 (8.84) 8 5 1 0.1968 (5.00) 0.1890 (4.80) 0.280 (7.11) 0.240 (6.10) 0.1574 (4.00) 0.1497 (3.80) 4 OBS PIN 1 0.210 (5.33) MAX 0.160 (4.06) 0.115 (2.93) 0.100 (2.54) BSC C1401a–0–12/99 (rev. B) 8-Lead Plastic DIP (N-8) 0.325 (8.25) 0.300 (7.62) 0.060 (1.52) 0.015 (0.38) 0.130 (3.30) MIN 5 1 4 0.2440 (6.20) 0.2284 (5.80) PIN 1 0.0196 (0.50) 3 458 0.0099 (0.25) 0.0500 (1.27) BSC 0.195 (4.95) 0.115 (2.93) 0.0098 (0.25) 0.0040 (0.10) 0.0688 (1.75) 0.0532 (1.35) 0.0192 (0.49) 0.0138 (0.35) OLE SEATING PLANE 0.015 (0.381) 0.008 (0.204) 88 0.0500 (1.27) 0.0098 (0.25) 08 0.0160 (0.41) 0.0075 (0.19) TE PRINTED IN U.S.A. 0.022 (0.558) 0.070 (1.77) SEATING 0.014 (0.356) 0.045 (1.15) PLANE 8 REV. B –7–