Chip Capacitor Networks Chip Capacitor Networks Type: EZANP GND GND ■ Features ● Chip Capacitor Networks, exclusively developed by Panasonic using thick film technology. 8 capacitors bussed in one package (6.4 mm ҂ 3.1 mm ҂ 0.75 mm, 1.27 mm pitch), halfpitch (0.635 mm) spacing for high density automatic placing ● Excellent noise reduction by connecting both ground terminals and a simple layout pattern (less through hole) ● Excellent mountability using concave terminals, firm solder joint (2 times that of convex terminal), self-aligning placement during reflow soldering <Effect of high density placing, PWB space saving> I/O I/O I/O I/O No Through Hole 0.635 mm Conventional Chip Capacitors Chip Capacitor Network EZANP ■ Recommended Applications ● ● ● ● Digital equipment such as PCs, word processors, printers, HDD, PPC, and PDAs Digital audio and video equipment such as CD, MD, DAT, digital cameras, digital video and digital TV Communication equipment, cordless phones, automobile phones, GSM, PHS, DECT Electronic musical instruments, and other digital devices ■ Explanation of Part Numbers 1 2 3 4 5 6 7 8 9 10 E Z A N P E 1 0 1 M Product Code Thick Film Noise Suppression and Filtering Components NP Dimensions and Circuit Configuration 8 Capacitors, 6.4 mm Common ҂3.1 mm terminal type Temperature Characteristics E +20 %/–55 % (–25 °C to +85 °C) Capacitance Value The first two digits are significant figures of capacitance value, and the third one denotes the number of zeroes fellow. ex. 101촞100 pF Capacitance Tolerance M 11 Suffix for Special Requirement ±20 % +30 % in –20 % the case of 22 pF Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. Feb. 2006 Chip Capacitor Networks ■ Dimensions in mm (not to scale) P W GND Electrode (Outer) Electrode (Outer) A1 PIOI E1 PIOI GND Electrode (Outer) fD F1 Protective coating B1 Alumina substrate L T A2 E2 F2 B2 ■ Construction ■ Circuit Configuration Mass (Weight) [1000 pcs.] : 52 g 10 9 8 7 GND 1 Type (inches) EZANP (2512) 6 GND 2 3 4 5 L W T A1 B1 E1 F1 ±0.2 0.4±0.2 0.8±0.2 0.4±0.2 6.4±0.2 3.1±0.2 0.75+0.20 –0.10 0.7 A2 B2 0.56±0.20 0.4±0.2 E2 0.8±0.2 F2 P fD 0.3±0.2 1.27±0.10 0.4+0.1 –0.2 ■ Ratings Item Specification Capacitance Values (25 °C, 1 kHz , 1 Vrms) 22 pF, 47 pF, 100 pF, 220 pF (1) % ±20 % (+30 –20 % in the case of 22 pF) Capacitance Tolerance Temperature Characteristics E Characteristic: +20 %/–55 % (–25 °C to +85 °C) Less than 2 % (25 °C, 1 kHz(1), 1 Vrms) Dissipation Factor Rated Voltage 25 V Category Temperature Range (Operating Temperature Range) –25 °C to +85 °C (1) In measuring at 1 MHz, Capacitance Value and Dissipation Factor are different. ■ Attenuation Characteristics Measurement Circuit 0 pF 50 액 pF 0 22 EZANP pF 20 pF 0 30 40 ~ 50 액 촞 Attenuation (dB) 22 47 10 10 50 1M 10M 100M 1G 3G Frequency (Hz) Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. Feb. 2006 Chip Capacitor Networks ■ Packaging Methods (Taping) ● Standard Quantity Type Kind of Taping Pitch (P1) Quantity EZANP Embossed Carrier Taping 4 mm 4000 pcs./reel ● Embossed Carrier Taping ● Taping Reel T t1 Compartment fC E Sprocket hole fD0 B fB F W A fD1 t2 P1 P2 P0 Tape running direction Chip component fA A B W F E P0 Dimensions 3.50±0.20 6.80±0.20 12.00±0.30 5.50±0.20 1.75±0.20 4.00±0.10 (mm) P1 fD0 P2 t1 fD1 t2 Dimensions 4.00±0.10 2.00±0.05 1.50+0.10 0.25±0.05 1.30±0.20 1.50+0.10 −0 −0 (mm) Dimensions (mm) W fA fB fC 180.0+0 −3.0 60 min. 13.0±1.0 Dimensions (mm) W T 13.0±1.0 15.4±2.0 ■ Recommended Land Pattern Design b P (0.20) f a d : Land pattern a Dimensions 2.2 to 2.4 (mm) c g f Dimensions 4.2 to 4.6 (mm) b c d 0.4 to 0.6 5.7 to 5.9 0.4 to 0.8 g P 7.5 to 7.9 1.27 Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. Feb. 2006 Chip Capacitor Networks ■ Recommended Soldering Conditions Recommendations and precautions are described below. ● Recommended soldering conditions for reflow · Reflow soldering shall be performed a maximum of two times. · Please contact us for additional information when used in conditions other than those specified. · Please measure the temperature of the terminals and study every kind of solder and printed circuit board for solderability before actual use. For soldering (Example : Sn/Pb) Preheating Main heating Peak Temperature Time 140 °C to 160 °C 60 s to 120 s Above 200 °C 30 s to 40 s 235 ± 5 °C max. 10 s For lead-free soldering (Example : Sn/Ag/Cu) Temperature Peak Preheating Preheating Main heating Heating Peak Temperature Time 150 °C to 180 °C 60 s to 120 s Above 230 °C 30 s to 40 s max. 260 °C max. 10 s Time ● Please contact us regarding flow soldering. Safety Precautions The following are precautions for individual products. Please also refer to the precautions common to EMI Filters, Fuses, and Sensors(MR Elements) shown on page EX2 of this catalog. 1. Take measures against mechanical stress during and after mounting of Chip Capacitor Networks (hereafter called the capacitor networks) so as not to damage their electrodes and protective coatings. Be careful not to misplace the capacitor networks on the land patterns. Otherwise, solder bridging may occur. 2. Do not use halogen-based or other high-activity flux. Otherwise, the residue may impair the capacitor networks' performance and/or reliability. 3. Perform sufficient preheating so that the difference of the solder temperature and the capacitor networks chip surface temperature becomes 100 °C or less. Maintain the temperature difference within 100 °C during rapid cooling by immersion into solvent after soldering. 4. When soldering with a soldering iron, never touch the capacitor networks' bodies with the tip of the soldering iron. When using a soldering iron with a high temperature tip, finish soldering as quickly as possible (within three seconds at 350 °C max.). 5. As the amount of applied solder becomes larger, the mechanical stress applied to the capacitor networks increases, causing problems such as cracks and faulty characteristics. Avoid applying an excessive amounts of solder. 6. Do not apply shock to the capacitor networks or pinch them with a hard tool (e.g. pliers and tweezers). Otherwise, the capacitor networks' protective coatings and bodies may be chipped, affecting their performance. 7. Avoid excessive bending of printed circuit boards in order to protect the capacitor networks from abnormal stress. 8. The static capacitance may decrease by a few percent from the time of shipment due to the characteristics peculiar to dielectric materials having a high dielectric constant. Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. Feb. 2006 Safety Precautions (Common precautions for EMI Filters, Fuses, and Sensors[MR Elements]) • When using our products, no matter what sort of equipment they might be used for, be sure to make a written agreement on the specifications with us in advance. The design and specifications in this catalog are subject to change without prior notice. • Do not use the products beyond the specifications described in this catalog. • This catalog explains the quality and performance of the products as individual components. Before use, check and evaluate their operations when installed in your products. • Install the following systems for a failsafe design to ensure safety if these products are to be used in equipment where a defect in these products may cause the loss of human life or other significant damage, such as damage to vehicles (automobile, train, vessel), traffic lights, medical equipment, aerospace equipment, electric heating appliances, combustion/gas equipment, rotating equipment, and disaster/crime prevention equipment. ✽ Systems equipped with a protection circuit and a protection device ✽ Systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a single fault (1) Precautions for use • These products are designed and manufactured for general and standard use in general electronic equipment (e.g. AV equipment, home electric appliances, office equipment, information and communication equipment) • These products are not intended for use in the following special conditions. Before using the products, carefully check the effects on their quality and performance, and determine whether or not they can be used. 1. In liquid, such as water, oil, chemicals, or organic solvent 2. In direct sunlight, outdoors, or in dust 3. In salty air or air with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NO2 4. Electric Static Discharge (ESD) Environment These components are sensitive to static electricity and can be damaged under static shock (ESD). Please take measures to avoid any of these environments. Smaller components are more sensitive to ESD environment. 5. Electromagnetic Environment Avoid any environment where strong electromagnetic waves exist. 6. In an environment where these products cause dew condensation 7. Sealing or coating of these products or a printed circuit board on which these products are mounted, with resin or other materials • These products generate Joule heat when energized. Carefully position these products so that their heat will not affect the other components. • Carefully position these products so that their temperatures will not exceed the category temperature range due to the effects of neighboring heat-generating components. Do not mount or place heat-generating components or inflammables, such as vinyl-coated wires, near these products (except Thermal Cutoffs). • Note that non-cleaning solder, halogen-based highly active fl ux, or water-soluble flux may deteriorate the performance or reliability of the products. • Carefully select a flux cleaning agent for use after soldering. An unsuitable agent may deteriorate the performance or reliability. In particular, when using water or a water-soluble cleaning agent, be careful not to leave water residues. Otherwise, the insulation performance may be deteriorated. (2) Precautions for storage The performance of these products, including the solderability, is guaranteed for a year from the date of arrival at your company, provided that they remain packed as they were when delivered and stored at a temperature of 5 °C to 35 °C and a relative humidity of 45 % to 85 %. (Micro Chip Fuses: Guaranteed for 6 months from the date of arrival at your company) The performance of EMI Filters is guaranteed for 6 months or a year from the outgoing inspection date indicated on the packages, provided that they are stored at a temperature of -5 °C to +40 °C and a relative humidity of 40 % to 60 %. Check the guarantee period in the specifications. The performance of Thermal Cutoffs is guaranteed for a year from the outgoing inspection date indicated on the packages, provided that they are stored at a temperature of -10 °C to +40 °C and a relative humidity of 30 % to 75 %. Even within the above guarantee periods, do not store these products in the following conditions. Otherwise, their electrical performance and/or solderability may be deteriorated, and the packaging materials (e.g. taping materials) may be deformed or deteriorated, resulting in mounting failures. 1. In salty air or in air with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NO2 2. In direct sunlight <Package markings> Package markings include the product number, quantity, and country of origin. In principle, the country of origin should be indicated in English. Feb. 2006 – EX2 –