ETC1 ASY90147-X Bleutooth mini module Datasheet

Smart Modular Technologies
Specification ASY90147-1&2
December 10, 2002
1. Document Status
Revision
0.5
0.9
0.92
Date
September 6, 2002
September 23, 2002
October 11, 2002
0.94
1.0
December 6, 2002
December 10, 2002
Comments
First draft
Modified Table 1.
Modified Table 1, mechanical drawing, HCI
stack features.
Modified Table 1 and mechanical drawing.
First formal release version.
To make a request for change, correction, additions or information on references, please
contact:
Product Management
Communication Products Division
Smart Modular Technologies,
4305 Cushing Parkway,
Fremont, CA 94538.USA
+1 (510)-623-1231
2. Reference
[1] Specification of the Bluetooth System, Version 1.1, February 22, 2001.
3. Scope
The intention of this specification is to provide a general guideline on the integration of a
Bluetooth Mini module. The product specification complies with Bluetooth
Specification 1.1 [1].
4. Module General Features and Chipset Description
4.1 Module General Features
The Smart Modular Technologies’ Bluetooth Mini module is based on a Bluetooth
single chip reference design. It is a complete Bluetooth module. The module has the
following general main features:
• Small footprint 52-pin BGA package with 0.8mm ball and1.27mm pitch (14.43mm x
21.47mm x 3.0mm).
• Highly integrated small, thin module built with high-density mounting technology.
• Class II device.
• On board pin out for direct 50Ω RF trace connection.
• Fully compliant with Bluetooth specification v1.1.
• Full speed HCI UART.
• USB v1.1 compliant and USB2.0 compatible.
• Pulse Code Modulation (PCM) interface.
• Programmable Parallel Input Output (PIO) ports.
• Serial Peripheral Interface (SPI).
• Low power 1.8V operation.
• Full speed Bluetooth TM operation.
• Full speed USB interface supports OHCI and UHCI host interface.
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Specification ASY90147-1&2
December 10, 2002
Full piconet support.
On board 4Mbit or 8Mbit external Flash.
Very low power consumption in active and standby modes.
Support for low power sleep modes.
Firmware upgradeable via UART, USB or SPI interface.
RF Shielding Can.
Conforms to FCC Part 15, ICAN RSS-210, ETSI, ARIB ST-T66, CE and (per
customers request for other countries’ EMI standards).
Temperature range: -20°C to +95°C.
5. Mechanical Drawing:
Figure 1. Mechanical drawing of Bluetooth Mini module.
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Smart Modular Technologies
Smart Modular Technologies
Specification ASY90147-1&2
December 10, 2002
6. Interface Definitions:
Table 1. Bluetooth Mini module interface definitions
Pin#
Name
Type
Note
A2
GND
GND
Ground
A8
VIN_3.3V
I
3.3V input
A9
VIN_3.3V
I
3.3V input
B1
N/C
No Connection
B2
N/C
No Connection
B8
GND
GND
Ground
B9
GND
GND
Ground
C1
PCM_IN
I
PCM synchronous data input
C2
N/C
No Connection
C8
N/C
No Connection
C9
N/C
No Connection
D1
PCM_OUT
O
PCM synchronous data output
D2
PCM_SYNC
I/O
PCM synchronous data SYNC
D8
PIO[10]
I/O
Programmable I/O terminal
D9
PIO[2]
I/O
USB_PULL_UP
E1
PCM_CLK
I/O
PCM synchronous data clock
E2
RXD
I
UART data input active high
E8
PIO[5]
I
USB_DETACH
E9
PIO[11]
I/O
Programmable I/O terminal
F1
CTS
I
UART clear to send active low
F2
TXD
O
UART data output active high
F8
PIO[9]
I/O
Programmable I/O terminal
F9
PIO[8]
I/O
Programmable I/O terminal
G1
SPI_MOSI
I
Serial Peripheral interface data input
G2
RTS
O
UART request to send active low
G8
PIO[7]
I/O
Programmable I/O terminal
G9
PIO[6]
I/O
CLK_REQ
H1
USB D+
I/O
USB data plus
H2
SPI_CLK
I
Serial Peripheral interface clock
H8
PIO[1]
I/O
Control output for external PA Class I
application only
H9
RST
I
Hardware reset, 3.3V±10% for > 5ms
J1
USB DI/O
USB data minus
J2
SPI_CSB
I
Select for Synchronous Serial Interface
active low
J8
NC
No Connection
J9
NC
No Connection
K1
SPI_MISO
O
Serial Peripheral interface data output
K2
PIO[0]
I/O
Control output for external LNA (if fitted)
K8
N/C
No Connection
K9
N/C
No Connection
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Smart Modular Technologies
Pin#
L1
L2
L8
L9
M1
M2
M8
M9
N1
N2
N3
N8
N9
Name
PIO[4]
N/C
N/C
N/C
PIO[3]
N/C
N/C
N/C
ANT
GND
N/C
GND
GND
Specification ASY90147-1&2
December 10, 2002
Type
I/O
I/O
RF I/O
GND
GND
GND
Note
USB_ON
No Connection
No connection
No connection
USB_WAKE_UP
No connection
No connection
No connection
50 Ω RX/TX connection to antenna
Ground
No connection
Ground
Ground
7. General Specifications
Table 2. General Specifications
Item
Carrier Frequency
Modulation
Channel Intervals
Number of Channels
Frequency Hopping
Receive Sensitivity
Transmission Power
Maximum Data Throughput
SPECIFICATION
2400MHz to 2483.5MHz
GFSK, 1Mbps, 0.5BT Gaussian
1MHz
79
1600 hops/sec, 1MHz channel space
-82 dBm typ. @0.1% BER
+4dBm max.
Asnchronous : 721kbps/57.6kbps
Synchronous : 432.6kbps/432.6kbps
Full speed UART (921.6kbps), USB
(12Mbits/s), PCM, SPI and PIO.
Hardware and Software
3.3V±10%
1.8V
-20°C to 95°C
-40°C to 150°C
14.43 mm x 21.47mm x 3.0mm
Direct 50 Ω RF trace contact
Output Interface
Reset
Power Supply
Operating Voltage
Operating Temperature Range
Storage Temperature Range
Dimensions
Antenna Interface
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Smart Modular Technologies
Specification ASY90147-1&2
December 10, 2002
8. Bluetooth Mini Module Block Diagram
To RF
Output Pin
Crystal
RAM
Clock
Generator
BPF
Memory
Mapped
Control/
Status
UART
PCM
SPI
Balun
RF
Receiver
Baseband and Logic
Memory Management
RF
Transmitter
USB
PCM_IN
PCM_OUT
PCM_SYNC
PCM_CLK
SPI_CLK
SPI_MISO
SPI_MOSI
SPI_CSB
USB_D+
USB_D-
Memory
Driver
RF Synthesizer
4 or 8Mbit
Flash Memory
RISC
Mico-Controller
REG
Programmable
I/O
3.3V
Figure 2. Bluetooth Mini Module Block Diagram
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UART_TX
UART_RX
UART_RTS
UART_CTS
PIO[0]/RXEN
PIO[1]/TXEN
PIO[2]/USB_PULL_UP
PIO[3]/USB_WAKE_UP
PIO[4]/USB_ON
PIO[5]/USB_DETACH
PIO[6]/CLK_REQ
PIO[7]/Programmable I/O
PIO[8]/Programmable I/O
PIO[9]/Programmable I/O
PIO[10]/Programmable I/O
PIO[11]/Programmable I/O
Smart Modular Technologies
Specification ASY90147-1&2
December 10, 2002
9. Electrical Characteristics
Absolute maximum Ratings
• Storage Temperature ---------- -40°C to 150°C (ambient)
• Supply Voltage ---------------- -0.4V to 3.6V (MAX)
Operating Conditions
• Temperature Range ----------- -20°C< TA<95°C
• Supply Voltage Range --------- 3.3V±10%
Table 3. Radio Characteristics
VDD = 1.8V
Frequency
(GHz)
2.402
Temperature = -20°C
Min
Typ
Max
-
-83
-80
2.441
-
-85
-80
2.480
-
-85
-80
0
-
-
Min
Typ
Max
0
3
4
2.441
0
3
4
2.480
0
3
4
RF power control range
-
35
-
RF power range control resolution
20 dB bandwidth for modulated carrier
-
1.8
-
Initial carrier frequency tolerance
Receiver
Sensitivity at 0.1% BER
Maximum received signal at 0.1% BER
Frequency
Transmitter
(GHz)
2.402
RF transmit power
Bluetooth
Specification
Unit
dBm
≤-70
dBm
dBm
≥ -20
Bluetooth
Specification
dBm
Unit
dBm
-6 to +4
dBm
dBm
-
≥16
-
dB
800
-
1000
kHz
-
±25
-
≤ ±75
kHz
Drift
-
±15
-
kHz
Drift Rate
∆f1avg "Maximum Modulation"
-
-
-
±20
165
≤ ±25
400
-
140<∆f1avg <175
Hz/µs
kHz
∆f2avg "Minimum Modulation"
-
150
-
115
kHz
Bluetooth
Specification
Unit
Receiver
VDD = 1.8V
Frequency
(GHz)
2.402
Sensitivity at 0.1% BER
Temperature = +20°C
Min
Typ
Max
-
-82
-80
2.441
-
-84
-80
2.480
-
-84
-80
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Smart Modular Technologies
dB
dBm
≤-70
dBm
dBm
Smart Modular Technologies
Specification ASY90147-1&2
December 10, 2002
Maximum received signal at 0.1% BER
Frequency
Transmitter
(GHz)
2.402
0
-
-
Min
Typ
Max
0
2.5
4
2.441
0
2.5
4
2.480
0
2.5
4
RF power control range
-
35
-
RF power range control resolution
20 dB bandwidth for modulated carrier
-
1.8
-
Initial carrier frequency tolerance
RF transmit power
≥ -20
Bluetooth
Specification
dBm
Unit
dBm
-6 to +4
dBm
dBm
-
≥16
-
dB
800
-
1000
kHz
-
±25
-
≤ ±75
kHz
Drift
-
±15
-
kHz
Drift Rate
∆f1avg "Maximum Modulation"
-
-
-
±20
165
≤ ±25
400
-
140<∆f1avg <175
Hz/µs
kHz
∆f2avg "Minimum Modulation"
C/I co-channel
-
150
-
115
kHz
-
10
11
≤ 11
dB
Adjacent channel selectivity C/I f=f0 ± 1MHz
-
-4
0
≤0
dB
Adjacent channel selectivity C/I f=f0 ± 2MHz
-
-35
-30
≤ -30
dB
Adjacent channel selectivity C/I f ≥ f0+3MHz
-
-45
-
≤ -40
dB
Adjacent channel selectivity C/I f ≤ f0-3MHz
-
-45
-
≤ -40
dB
Adjacent channel selectivity C/I f=fimage
-
-18
-9
≤ -9
dB
Adjacent channel Transmit power f=f0±2MHz
-
-35
-20
≤ -20
dBc
Adjacent channel Transmit power f=f0±3MHz
-
-35
-40
≤ -40
dBc
Bluetooth
Specification
Unit
Receiver
VDD = 1.8V
Frequency
(GHz)
2.402
Sensitivity at 0.1% BER
RF transmit power
RF power control range
Temperature = +95°C
Min
Typ
Max
-
-81
-80
2.441
-
-82
-80
2.480
-
-82
-80
0
-
-
Min
Typ
Max
0
1
4
2.441
0
1
4
2.480
0
1
4
-
35
-
Maximum received signal at 0.1% BER
Frequency
Transmitter
(GHz)
2.402
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Smart Modular Technologies
dB
dBm
≤-70
dBm
dBm
≥ -20
Bluetooth
Specification
dBm
Unit
dBm
-6 to +4
dBm
dBm
≥16
dB
Smart Modular Technologies
Specification ASY90147-1&2
December 10, 2002
RF power range control resolution
20 dB bandwidth for modulated carrier
-
1.8
-
-
dB
-
800
-
1000
kHz
Initial carrier frequency tolerance
-
±25
-
≤ ±75
kHz
Drift
-
±15
-
kHz
Drift Rate
∆f1avg "Maximum Modulation"
-
±20
-
≤ ±25
400
Hz/µs
-
165
-
140<∆f1avg <175
kHz
∆f2avg "Minimum Modulation"
-
150
-
115
kHz
Note 1. Power at antenna port.
Note 2. Measured according to the Bluetooth specification v1.1 and Bluetooth RF test specification 0.91.
Table 4. Module Current Consumption
Average Current Consumption
VDD = 1.8V
Temperature = +20°C
Mode
Avg
Peak
Unit
SCO connection HV3 (40 ms interval Sniff Mode) (Slave)
26.0
-
mA
SCO connection HV3 (40 ms interval Sniff Mode) (Master)
26.0
-
mA
SCO connection HV1 (Slave)
53.0
-
mA
SCO connection HV1 (Master)
53.0
-
mA
ACL data transfer 115.2kbps UART (Master)
15.0
-
mA
ACL connection, Sniff Mode 40ms interval, 38.4kpbs UART
4
-
mA
ACL connection, Sniff Mode 1.28s interval, 38.4kpbs UART
8
-
mA
Parked Slave, 1.28s beacon interval, 38.4kpbs UART
6
-
mA
ACL data transfer 720kbps USB (Slave)
53.0
-
mA
ACL data transfer 720kbps USB (Master)
53.0
-
mA
7
-
mΑ
Mode
Typ
Max
Unit
Deep Sleep Mode
300
500
Peak current during TX burst (+4 dBm)
Peak current during TX burst (0dBm)
70.0
80
µA
mA
60.0
70
mA
Peak current during RX burst (-85 dBm)
50.0
70
mA
Standby mode (Connected to host, no RF activity)
Peak Current Consumption
VDD = 1.8V
Temperature = +20°C
Notes: Current consumption is based on BC0212015A and includes current supplied to external 3V Flash.
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Smart Modular Technologies
Specification ASY90147-1&2
December 10, 2002
10. UART Interface
The Universal Asynchronous Receiver Transmitter (UART) interface provides a mechanism
for communicating with other serial devices using the RS232 standard. When the module is
connected to another digital device, UART_RX and UART_TX transfer data between the
two devices. The other two signals, UART_CTS and UART_RTS, can be used to implement
RS232 hardware flow control where both are active low indicators.
Table 5. Possible UART Settings
Parameter
Possible Values
Minimum
Baud Rate
Maximum
Flow Control
Parity
Number of Stop Bits
Bits per channel
1200 Baud (≤2% Error)
9600 Baud (≤1% Error)
1.5MBaud (≤1% Error)
RTS/CTS or None
None, Odd or Even
1 or 2
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11. USB Interface
The Universal Serial Bus (USB) interface on the module provides a full-speed (12Mbits/s)
data throughput, capable of driving a USB cable directly. No external USB transceiver is
required. The device operates as a USB peripheral, responding to requests from a master
host controller such as a PC. Both the OHCI and the UHCI standards are supported. Only
the USB slave operation is supported.
Table 6. USB Data Connections
USB Connections
Function
DD+
“Differential” 0
“Differential” 1
12. PCM
Pulse Code Modulation (PCM) is the standard method used to digitize human voice patterns
for transmission over digital communication channels. The module has hardware support for
continual transmission and reception of PCM data, thus reducing processor overhead for
wireless headset applications. The module offers a bi-directional digital audio interface
routes directly into the basedband layer of the on-chip firmware. Up to three SCO
connections can be supported by the PCM interface at any one time.
The PCM interface can be configured as Master or Slave. When it operates as the PCM
interface Master, it generates an output clock of 128, 256 or 521kHz. When configured as
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Smart Modular Technologies
Specification ASY90147-1&2
December 10, 2002
PCM interface Slave, it can operate with an input clock up to 2048kHz. It is compatible with
a variety of clock formats, including Long Frame Sync, Short Frame Sync and GCI timing.
The module supports 13 or 16-bit linear, 8-bit µ-law or A-law sample formats at
8ksamples/s and can receive and transmit on any selection of the three of the first four slots
following PCM_SYNC.
The PCM interface on the module can interfaces directly to PCM audio devices includes the
following:
• Qualcomm MSM 3000 series and MSM 5000 series CDMA baseband
devices.
• OKI MSM7705 four-channel A-lay and µ-law CODEC.
• Motorola MC145481 8-bit A-law and µ-law CODEC.
• Motorola MC145483 13-bit linear CODEC.
13. The Parallel Input Output (PIO) Port
The PIO is a general-purpose I/O interface to the module. The module has ports with twelve
programmable, bi-directional I/O lines, PIO[11:0]. Programmable I/O lines can be accessed
either via an embedded application running on the module or via private channel or
manufacture-specific HCI commands. Six PIO ports, PIO[5:0], are implemented on the
module.
PIO[0]/RXEN
This is a multifunction terminal. Its function is selected by setting the Persistent Store Key
PSKEY_TX/RX_PIO_CONTROL (0x209). It can be used as a programmable I/O, however
it will normally be used to control the radio front-end receive switch.
PIO[1]/TXEN
This is a multifunction terminal. Its function is selected by setting the Persistent Store Key
PSKEY_TX/RX_PIO_CONTROL (0x209). It can be used as a programmable I/O, however
it will normally be used to control the radio front-end transmit switch.
PIO[2]/USB_PULL_UP
This is a multifunction terminal. For UART versions, it is a programmable I/O. On USB
versions, it can drive a pull-up resistor on USB_D+. For application using external RAM
this terminal may be programmed for chip select.
PIO[3]/USB_WAKE_UP
This is a multifunction terminal. For UART versions, it is a programmable I/O. On USB
versions, its function is selected by setting the Persistent Store Key
PSKEY_USB_PIO_WAKEUP (0x2cf) either as a programmable I/O or as a
USB_WAKE_UP function.
PIO[4]/USN_ON
This is a multifunction terminal. For UART versions, it is a programmable I/O. On USB
versions, the USB_ON function is also selectable.
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Smart Modular Technologies
Specification ASY90147-1&2
December 10, 2002
PIO[5]/USB_DETACH
This is a multifunction terminal. For UART versions, it is a programmable I/O. On USB
versions, the USB_DETACH function is also selectable.
PIO[6]/CLK_REQ
This is a multifunction terminal, its function is determined by Persistent Store Keys. Using
PSKEY_CLOCK_REQUEST_ENABLE (0x246), it can be configured to be low when the
module is in deep sleep and high when a clock is required. The clock must be supplied
within 4ms of the rising edge of PIO[6] to avoid losing timing accuracy in certain Bluetooth
operation modes.
PIO[7]
Programmable I/O terminal.
PIO[8]
Programmable I/O terminal.
PIO[9]
Programmable I/O terminal.
PIO[10]
Programmable I/O terminal.
PIO[11]
Programmable I/O terminal.
Note: USB functions can be software mapped to any PIO terminal, the present module support PIOs [0 - 5].
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Smart Modular Technologies
Specification ASY90147-1&2
December 10, 2002
14. Key Features of HCI Stack
• Bluetooth components: Basedband (including LC), LM and HCI.
• Standard USB v1.1 and UART (H4) HCI Transport Layers.
• All standard radio packet types.
• Full Bluetooth data rate, up to 721kbps asymmetric.
• Operation with up to seven slaves.
• Maximum number of simultaneous active ACL connections: 7
• Maximum number of simultaneous active SCO connections: 3
• Operation with up to 3 SCO links, routed to one or more slaves.
• Role switch: can reverse Maser/Slave relationship.
• All standard SCO voice codings, plus “transparent SCO”.
• Standard operating modes: page, inquiry, page-scan and inquiry-scan.
• All standard pairing, authentication, link key and encryption operations.
• Standard Bluetooth power saving mechanisms: Hold, Sniff and Park modes,
including “Forced Hold”.
• Dynamic control of peers’ transmit power via LMP.
• Master/Slave switch.
• Broadcast.
• Channel quality driven data rate.
• All standard Bluetooth Test Modes.
• Standard firmware upgrade via UART interface.
• Standard firmware upgrade via USB interface.
• Provides manufacture-specific HCI extension commands with the following features:
Ø Access to the chip’s general-purpose PIO port.
Ø Access to the chip’s Bluetooth clock.
Ø The negotiated effective encryption length on established Bluetooth links.
Ø Access to the firmware’s random number generator.
Ø Controls to set the default and maximum transmit powers.
Ø Dynamic UART configuration.
Ø Radio transmitter enable/disable.
• A UART “break” condition can be used in two ways:
Ø Presenting a UART break condition on the module can force the chip to
perform a hardware reboot.
Ø Presenting a break condition at boot time can hold the chip in a low power
state, thus preventing normal initialization while the condition exists.
• Hardware low power modes: Shallow Sleep and Deep Sleep.
• SCO channels are normally routed over HCI. However, up to three SCO channels
can be routed over the chip’s single PCM port (at the same time as routing other
SCO channels over HCI).
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Smart Modular Technologies
Specification ASY90147-1&2
December 10, 2002
15. Qualification Tests
15.1
15.2
Bluetooth Qualification Tests.
USB Qualification Tests.
16. Agency and Regulatory Body Approvals
16.1
Safety Compliance
• IEC 60 950:1999 (3rd Edition) “Safety of Information Technology” including
all CB scheme country deviations.
• EN 60950:2000 “Safety of Information Technology”, European Union.
• UL 60950:2000 (3rd Edition) “Safety of Information Technology”, USA,
Canada.
16.2
Electromagnetic Compatibility (EMC)
• FCC Part 15, Class B “Radio Frequency Devices”, USA.
• ICES-003, Issue 3 "Interference-causing equipment standard - digital
apparatus", Canada.
• EN 301 489-17:2000 “Electromagnetic Compatibility for Radio Equipment
and Services”, European Union.
• VCCI, “Interference By Information Technology Equipment”, Japan.
16.3
Radio Compliance
• FCC Part 15 “Radio Frequency Devices”, USA.
• ICAN RSS-210, Issue 5 “Low Power License-Exempt Radio
Communication Devices”, Canada.
• EN 300 328-2:2001 “Data Transmission Equipment Operating in 2.4GHz
ISM Band Using Spread Spectrum Modulation Technique”, European Union.
• ARIB STD-T66 “Second Generation Low Power Data Communication
System and Wireless LAN System”, ARIB STD-33, “Low Power data
Communication System of Wireless Equipment”, Japan.
16.4
CE Marking
• EN 60950:2000 “Safety of Information Technology”, European Union.
• EN 301 489-17:2000: “Electromagnetic Compatibility for Radio Equipment
and Services”, European Union.
• EN 300 328-2:2001 “Data Transmission Equipment Operating in 2.4GHz
ISM Band Using Spread Spectrum Modulation Technique”, European Union.
17. Manufacture Procedure and Production Test
17.1
17.2
Manufacture Process Flow
• Process and X-ray
Manufacture Test
• F/T
18. Product Design and Related Documentations
•
Hardware & SW Functional Test Reports
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Smart Modular Technologies
•
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Specification ASY90147-1&2
December 10, 2002
Hardware Compatibility Test Report
Hardware/SW performance Test Report
Hardware EMI Test Report
Hardware Reliability Test Report
Hardware Environmental Test Report
Product Specifications
Chipsets Specifications
Schematics
BOM
Layout
Drawings
PCB artwork
SW Process Control / Release process document
15
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