EX-219 Hi-Reliability Evacuated Miniature Crystal Oscillator (EMXO) EX-219 Frequency stabilities [10 to 20 MHz] Parameter vs. operating temperature range (reference to +25°C) Initial tolerance for fixed frequency vs. supply voltage change vs. load change vs. aging /1 day vs. aging /1st year vs. aging /10 year vs. aging /10 year vs. aging /10 year Warm-up Time @+25°C Min Typ -50 -75 -100 -1 -10 -10 -2 -200 -1000 -1500 -2000 Max. Units Condition +50 +75 +100 +1 +10 +10 +2 +200 +1000 +1500 +2000 120 180 ppb ppb ppb ppm ppb ppb ppb ppb ppb ppb ppb seconds seconds -10 … +60°C -20 … +70°C -40 … +85°C at time of shipment VS ± 5% Load ± 5% after 7 days of operation 10 to <12MHz 12 to <16MHz 16 to 20MHz to ±1000 ppb of freq at 1hr after turn-on to ±100 ppb of freq at 1hr after turn-on Frequency stabilities [>20 to 120 MHz] Parameter vs. operating temperature range (reference to +25°C) Initial tolerance for fixed frequency vs. supply voltage change vs. load change vs. aging /1 day vs. aging /1st year vs. aging /10 year Warm-up Time @+25°C Min Typ -75 -100 -150 -1.5 -15 -15 -3 -300 -3000 Max. Units Condition +75 +100 +150 +1.5 +15 +15 +3 +300 +3000 120 180 ppb ppb ppb ppm ppb ppb ppb ppb ppb seconds seconds -10 … +60°C -20 … +70°C -40 … +85°C at time of shipment VS ± 5% Load ± 5% after 7 days of operation to ±1000 ppb of freq at 1hr after turn-on to ±100 ppb of freq at 1hr after turn-on Single Supply Voltage (Vs) Option Parameter Supply voltage Min Typ Max. Units Condition 3.13 4.75 3.3 5.0 3.47 5.25 2.2 0.7 1.2 VDC VDC Watts Watts Watts during warm-up steady state @ +25°C steady state @ -40°C Power consumption Dual Supply Voltage Option Parameter Oscillator Supply Voltage (Vosc) Oscillator Supply Current (Iosc) Oven Supply Voltage (Voven) Min Typ Max. Units 3.13 4.75 3.3 5.0 3.13 4.75 3.3 5.0 3.47 5.25 60 3.47 5.25 VDC VDC mA VDC VDC Condition Vectron International • 267 Lowell Road, Hudson, NH 03051 • Tel: 1-88-VECTRON-1 • http://www.vectron.com EX-219 Hi-Reliability Evacuated Miniature Crystal Oscillator (EMXO) Oven Power Consumption (Ioven) 2.0 0.6 1.1 Watts Watts Watts during warm-up steady state @ +25°C steady state @ -40°C Units Condition pF Vs Vs ns % (10-90%) (Voh-Vol)/2 RF Output Parameter Signal Load Signal Level (Vol) Signal Level (Voh) Rise/Fall Time Duty cycle Signal Load Output Power (0dBm) Output Power (+3dBm) Output Power (+5dBm) Harmonics Subharmonics Spurious Min Typ Max. HCMOS 15 0.1 0.9 40 +0 +3 +5 +7 60 Sinewave 50 +2 +4 +5 +7 +7 +9 -30 -40 -80 Ohm dBm dBm dBm dBc dBc dBc 50 Ohm load 50 Ohm load 50 Ohm load Only for Freq from >55 to 120 MHz Met during qualification (not tested) Frequency Tuning (EFC) Parameter Tuning Range EFC Input DC Resistance Vref Min Typ Max. Units Sufficient to compensate for 10 years aging 100 200 kOhm +2.4 +2.5 +2.6 VDC Condition EFC (0V to Vref) source current 1 mA maximum Additional Parameters [10 to 20 MHz] Parameter Min Phase Noise (10MHz Output) Typ Max. Units Condition -120 -145 -150 -155 -110 -135 -145 -150 2X10-11 1 dBc/Hz dBc/Hz dBc/Hz dBc/Hz 10 Hz 100 Hz 1 KHz 10 KHz ppb/g Test at 10g sine vibration at 100Hz ADEV G-Sensitivity (total gamma) Additional Parameters [>20 to 55 MHz] Parameter Phase Noise (40MHz Output) Min Typ Max. Units Condition -100 -130 -145 -150 -90 -120 -140 -145 5X10-11 1 dBc/Hz dBc/Hz dBc/Hz dBc/Hz 10 Hz 100 Hz 1 KHz 10 KHz ppb/g Test at 10g sine vibration at 100Hz ADEV G-Sensitivity (total gamma) Parameter Phase Noise (100MHz Output) ADEV G-Sensitivity (total gamma) Additional Parameters [>55 to 120 MHz] Min Typ Max. Units -90 -125 -140 -145 -85 -115 -135 -140 5X10-11 1 Condition dBc/Hz dBc/Hz dBc/Hz dBc/Hz 10 Hz 100 Hz 1 KHz 10 KHz ppb/g Test at 10g sine vibration at 100Hz Environmental Conditions (Qualified to meet) Radiation Tolerant (operating) Mechanical Shock (non operating)*** Vibration Random (non operating)*** Vibration Sine (non operating)*** Storage Temperature*** Note: *** Met during qualification Active devices are selected from product families that are inherently radiation tolerant to meet 100krad (Si) Total Ionizing Dose MIL-STD-202, Test Method 213, Condition E (1000G, 0.5msec) MIL-STD-202, Test Method 214, Condition I-H (30Grms, 3 minutes/axis) MIL-STD-202, Test Method 204, Condition D (20Gpk, 20 minutes/axis) -55°C minimum and +85°C maximum Vectron International • 267 Lowell Road, Hudson, NH 03051 • Tel: 1-88-VECTRON-1 • http://www.vectron.com EX-219 Hi-Reliability Evacuated Miniature Crystal Oscillator (EMXO) Screening Options O rdering Code Test Inspection Nondestructive Bond Pull Internal Visual Stabilization Bake Thermal Shock Temperature Cycling (1) Constant Acceleration (1) Seal (Fine & Gross Leak) (1) PIND Pre-Burn-in Electrical Test Burn-in (1) Post-Burn-in Electrical Test Radiographic “S” “B” “E” S-Level Screening MIL-STD-883 Meth 2023 IAW MIL-PRF-55310 MIL-STD-883 Meth 1008, Cond C 150°C for 48hrs MIL-STD-883 Meth 1011, Cond A 0°C to 100°C for 15cycles MIL-STD-883 Meth 1010, Cond A -55°C to 85°C (2) for 10cycles MIL-STD-883 Meth 2001 1000g’s (3) Y1 Only N/A (Vacuum Seal) MIL-STD-883 Meth 2020, Cond B 10g peak at 60Hz minimum IAW MIL-PRF-55310 85°C (2) for 240hrs IAW MIL-PRF-55310 MIL-STD-883 Method 2012 B-Level Screening N/A IAW MIL-PRF-55310 MIL-STD-883 Meth 1008, Cond C 150°C for 48hrs N/A Electrical Verification (EM) N/A IAW MIL-PRF-55310 MIL-STD-883 Meth 1008, Cond C 150°C for 48hrs N/A MIL-STD-883 Meth 1010, Cond A -55°C to 85°C (2) for 10cycles MIL-STD-883 Meth 2001 1000g’s (3) Y1 Only N/A (Vacuum Seal) N/A N/A N/A (Vacuum Seal) N/A IAW MIL-PRF-55310 85°C (2) for 240hrs IAW MIL-PRF-55310 N/A IAW MIL-PRF-55310 N/A N/A N/A N/A Notes: (1) These test inspections deviate from the screening requirements for Class 2 oscillators listed in MIL-PRF-55310. (2) The maximum operating and storage temperature of the EX-219 is +85°C. The EX-219 shall not be exposed to temperature higher than +85°C for an indefinite period of time. However, the EX-219 can tolerate manufacturing process temperatures up to +100°C maximum for 168 hours total accumulative time. (3) The design and construction of the EX-219 can withstand up to 1000g’s constant acceleration. Group A Inspection (i ncluded 100% w/ screening options S and B) Group A Inspection is performed in accordance with Table V of MIL-PRF-55310 Subgroup 1: Electrical test Subgroup 2: Visual and Mechanical inspection Subgroup 3: Solderability Group B Inspection (i ncluded 100% w/ screening o ptions S and B) Group B Inspection consists of frequency aging testing in accordance with MIL-PRF-55310 with the exception of using a 3rd order log fit for the 1st year aging projection (see app note #11 for detailed information) Group C Inspection (optional, destruct specimens required) Group C Inspection is optional and shall be requested on the customer’s purchase order. Group C Inspection can be performed in accordance with either MIL-PRF-55310 or MIL-PRF-38534 Other Notes 1. Contact factory for improved stabilities or additional product options. Not all options and codes are available at all frequencies. 2. Unless stated otherwise, all values are valid after warm-up time and refer to typical conditions for supply voltage, frequency control voltage, load and temperature (25°C). 3. Phase noise degrades with increasing output frequency. 4. Subject to technical modification. 5. Contact factory for availability. Vectron International • 267 Lowell Road, Hudson, NH 03051 • Tel: 1-88-VECTRON-1 • http://www.vectron.com EX-219 Hi-Reliability Evacuated Miniature Crystal Oscillator (EMXO) Outline Drawing / Enclosure Pin Connections for Single Supply Option 1.03 Pin .93 SQUARE CORNER PIN#1 .35 MAX .035 .17 MIN .018 DIA. 3 Fixed Frequency Pin Connections for Dual Supply Option Pin 1 2 With EFC 1 EFC Input No Connection 2-4 No Connection No Connection 8 Ground (Case) Ground (Case) 9 RF Output RF Output 13-14 No Connection No Connection 15 Vref No Connection 16 Supply Voltage Input (Vs) Supply Voltage Input (Vs) Pin numbers are for reference only and not marked on parts. MARKING 4 With EFC Fixed Frequency 1 2-4 8 9 13 EFC Input No Connection No Connection No Connection Ground (Case) Ground (Case) RF Output RF Output Oven Supply Voltage Oven Supply Voltage Input (Voven) Input (Voven) 14 No Connection No Connection 15 Vref No Connection 16 Oscillator Supply Voltage Oscillator Supply Voltage Input (Vosc) Input (Vosc) Pin numbers are for reference only and not marked on parts. 8 Recommended Solder Reflow Maximum temperature is 230°C for 10 seconds .600 16 15 14 13 9 STAND-OFF (9X) .100 .700 DIMENSIONS ARE IN INCHES PIN NUMBERS ARE SHOWN FOR REFERENCE AND NOT MARKED ON THE UNIT Vectron International • 267 Lowell Road, Hudson, NH 03051 • Tel: 1-88-VECTRON-1 • http://www.vectron.com EX-219 Hi-Reliability Evacuated Miniature Crystal Oscillator (EMXO) Ordering Information Vectron International • 267 Lowell Road, Hudson, NH 03051 • Tel: 1-88-VECTRON-1 • http://www.vectron.com EX-219 Hi-Reliability Evacuated Miniature Crystal Oscillator (EMXO) Application Notes All data and notes are for reference only operating temperature. The warm-up time is inversely proportional to the case temperature. Since the EMXO is evacuated and has much less thermal mass than a conventional OCXO, its warm-up time is much faster. Figure 2 shows the typical Warm-up Power characteristic at -40°C and +25°C. 1. EMXO Technology The EMXO is an Oven Controlled Crystal Oscillator (OCXO) hermetically sealed in an evacuated package. It is comprised of a heated substrate (oven) and an output substrate. The oven is mounted on a thermally insulated structure that maintains a nearly constant temperature at about +95°C over the operating temperature range whereas the output substrate is mounted directly on the case. Unlike a conventional OCXO, the EMXO is sealed in an evacuated package using high internal vacuum as the insulation medium to achieve lower power consumption and faster warm-up time. Warm -up Characteristics 2.5 Power (W) 2.0 2. Crystal Resonator 1.5 o -40 C 1.0 0.5 o +25 C A doubly rotated crystal (IT-Cut), which is stress compensated, is used to obtain good phase noise, better aging rate and lower g-sensitivity. The crystal has a 4-point mounting structure for robustness and low g-sensitivity. Synthetic swept quartz is used for the flight model (FM) to achieve higher radiation tolerance. The Temperature Characteristic (TC) of an IT cut crystal in a 3rd order polynomial function has an inflection temperature at +75°C and an upper turn temperature (UTP) of +95°C. To obtain the advantage of minimal frequency sensitivity, the oven temperature is set at or around the UTP of the crystal. Figure 1 shows typical Temperature Characteristic (TC) of an IT cut Crystal. 0.0 1 10 100 1000 10000 Time (second) Figure 2 During warm-up, the output frequency follows the TC of the crystal frequency until the oven power has cut back to the steady state condition. After oven cut back, the frequency still slowly changes until the oven temperature reaches equilibrium state. Figure 3 shows the Warm-up Frequency characteristic at -40°C and +25°C. Warm -up Characteristics IT Cut Crystal 10 o 8 20 +25 C 6 Frequency (ppm) Frequency (ppm) 0 -20 -40 -60 4 2 0 -2 -4 o -40 C -6 -8 -80 -10 -100 -120 -50 1 100 1000 10000 Time (second) -25 0 25 50 75 100 125 Figure 3 Temp (c) Figure 1 3. 10 Warm-up Characteristic At cold turn-on, the oven is fully powered and the oven temperature rises to the preset temperature which is about 95°C. When the set temperature has been reached, the oven power consumption is cut back to the steady state condition. At steady state, the oven is proportionally controlled and maintains a nearly constant oven temperature. The turn-on power consumption must be higher than the steady state power to prevent power starving, especially at the cold end of the 4. Operating Temperature Characteristic The operating temperature specified herein is the device case temperature. Since the oven is proportionally controlled, its power consumption is inversely proportional to the case temperature. Figure 4 shows the steady state power versus case temperature. If the case temperature rises above the maximum operating temperature, the oven will shut off. Thus, the output frequency is no longer stable and follows the TC for the crystal. Figure 5 shows frequency versus case temperature. Although the maximum operating temperature is +85°C, the case temperature can increase up to +95°C without Vectron International • 267 Lowell Road, Hudson, NH 03051 • Tel: 1-88-VECTRON-1 • http://www.vectron.com EX-219 Hi-Reliability Evacuated Miniature Crystal Oscillator (EMXO) causing any permanent damage. However, the maximum temperature shall not exceed +95°C for an indefinite period of time and, during the manufacturing process, shall not exceed +100°C for more than 168hrs total accumulative time. If a part has been exposed to a temperature above +95°C for a longer duration, it might possibly accelerate internal outgassing. In turn, it will degrade the internal vacuum pressure causing an increase in power consumption. Initial frequency accuracy is not specified for the EFC option. The EFC pull range is sufficient to correct the effects of frequency aging over a 10 to 15 year product life. EFC: 10MHz 2.5 Freq (ppm) 1.5 Steadystate Pow er versus Case Tem perature 1.2 -0.5 -1.5 1.0 Power (W) 0.5 -2.5 0.00 0.8 0.50 1.00 2.00 2.50 EFC (Volts) 0.4 Figure 6 0.2 0.0 -50 -25 0 25 50 75 100 125 Temperature (°C) 6. Supply Ripple of Single Supply Option Most applications require a single supply input voltage for both the oscillator and oven circuitries. Although a voltage reference is used to regulate the supply voltage to the oscillator stage, the output buffer still uses the external supply voltage directly. Thus, the supply ripple can have a direct influence on the output signal. Figure 7 shows the typical ripple response. Figure 4 Frequency versus Case Tem perature 200 150 Supply Ripple (25m Vpp) 100 50 0 0 -50 -100 -50 -25 0 25 50 75 100 125 Temperature (°C) Figure 5 5. Initial Frequency Accuracy Ripple Response (dBc) Frequency (ppb) 1.50 0.6 -20 -40 -60 -80 -100 -120 100 1,000 10,000 100,000 1,000,000 Ripple Frequency (Hz) There are two options for defining initial frequency accuracy. Figure 7 a. Fixed Frequency: This option does not have an output frequency adjustment. The output frequency will be set to the specified limit at time of shipment. An external LC filter can be used in the supply line to suppress the ripple amplitude. The current rating of the inductor used in the filter shall be capable of handling high input current especially during warm-up. b. Electronic Frequency Control (EFC): This option offers frequency adjustment with input voltage at pin #1. The EFC is positive and monotonic as shown in Figure 6. This option will allow the end user to adjust the output frequency closer to the nominal frequency or to correct for long term aging. A low noise internal voltage reference (Vref) is offered with this option for biasing a voltage divider resistor network or DAC to control the EFC input. Using a noisy voltage reference to control the EFC input can degrade phase noise or ADEV performance. 7. Dual Supply Option The EX-219 offers a dual supply option for independent operation of oscillator (Vosc) and oven (Voven) supply lines. The advantages of using the dual supply option are described below. Vectron International • 267 Lowell Road, Hudson, NH 03051 • Tel: 1-88-VECTRON-1 • http://www.vectron.com EX-219 Hi-Reliability Evacuated Miniature Crystal Oscillator (EMXO) 8. Thermal Considerations The thermal resistance from the case of the EX-219 to the mounting plate should be considered when the part is mounted. Heat rise on the case is proportional to the steady state power consumption shown in Figure 4. Since the oven is a servo controlled system, the heat rise on the case will eventually reach an equilibrium point depending on the thermal resistance from the case to the mounting plate. If the thermal resistance from the case to the mounting plate is too high, the heat rise on the case will cause the oven to shut off sooner. In the event of oven shut off due to the case temperature exceeding the oven set temperature, there is still remaining self-heating power dissipated by the other components in the oscillator circuitry. This self-heating power is 150 mW typical. The EX-219 is a 16 pin doublewide dual in-line package (DDIP). It consists of nine glass to metal seal feed-thru pins and one case/GND pin. In space applications, sinking heat through mounting pins is not recommended because the nine feed-thru pins have poor thermally conductive properties. Sinking heat directly from the case of the part to the mounting plate is recommended. 9. Part Installation MIL-PRF-55310 specifies measurement of frequency aging for 30 days or longer. The measurements obtained shall be fit using the method of least squares to the function (1) f(t) = A(ln(Bt + 1)) + fo (1) If the aging trend is not monotonic, the measurement period shall be extended to 40 days or longer after the extremum in the aging trend, and the measurements from 12 days after the extremum is reached to the end of the aging measurement period shall be fit to the above function. Thus, Group B Aging can extend beyond 60 days. To maintain Group B Aging to 30 days, the EX-219 uses a 3rd order log function (2) for non-monotonic aging trends. f(t) = A+Bln(t) +Cln(t)^2 +Dln(t)^3 + fo Figure 9 shows that 40 days of aging data fit well to the 3rd order log function with R2 greater than 99%. The fit function was then used to project for one-year aging. EX-219-10M0000 Rank 2 Eqn 8017 [UDF 3] y=3rd-Log(a,b,c,d) r2=0.99761022 DF Adj r2=0.99756617 FitStdErr=0.17181463 Fstat=30334.605 a=6.2425414 b=0.66797883 c=3.5639266 d=-0.73843747 50 50 40 40 30 30 20 20 10 10 0 0 -10 -10 -20 -20 -30 -30 -40 -40 -50 Stress relief mounting is highly recommended for the EX-219. Thermally conductive adhesive can be used to mechanically bond the bottom surface of the case to the mounting plate with all ten pins protruding through the clearance holes to the opposite side of the PCB. Then, wires can be used to make connections from the pins to the I/O pads on the PCB as shown in Figure 8. (2) 22942121 b. 3.3V LVCMOS Output: If 3.3V LVCMOS output waveform is required and the 3.3Vdc supply does not have sufficient power to operate the 3.3Vdc single supply option, then a dual supply option with 5.0Vdc (Voven) and 3.3Vdc (Vosc) can be used. 11. Aging Projection 22942121 a. Supply Ripple: With this option, an external LC filter with a low current rating can be used in the Vosc line to suppress supply ripple. 0 120 240 -50 360 Time (day) Figure 9 12. Leak Test Most hermetically sealed packages are back filled with a gas or gasses mixed with some low percentage of detective gas such as He at around 1atm pressure and then are sealed using resistance weld or seam weld methods. Packages sealed in this manner have a typical leak rate of 1x10-10 to 1x10-9 atm cc/sec. Therefore, a leak detector having 1x10-8 atm cc/sec resolution and accuracy will be sufficient to perform the leak test. Figure 8 10. No Connection Pins All "No Connection" pins are NOT electrically connected internally and are recommended to be connected to GND. On the other hand, the EMXO package is hermetically sealed using a cold-weld process and evacuated under hard vacuum during welding. The cold-weld package is typically used for crystals and achieves a leak rate better than 1x10-12 atm cc/sec He. The internal vacuum level at seal is better than 1x10-5 torr. To maintain performance over a mission life of 15 years, the EX-219 package leak rate should achieve 1x10-11 Vectron International • 267 Lowell Road, Hudson, NH 03051 • Tel: 1-88-VECTRON-1 • http://www.vectron.com EX-219 Hi-Reliability Evacuated Miniature Crystal Oscillator (EMXO) atm cc/sec He or better. To perform a leak test at this level presents a challenging task. A Krypton-85 leak detector can test leak rates down to this level but the bomb duration is very long and may not be practical for manufacturing. Contrary to most electronic devices, the EMXO has a proportionally controlled oven whereby power consumption is inversely proportional to thermal resistance from the oven to the case. In this case, the EMXOs vacuum is utilized for thermal insulation. If the vacuum degrades as a result of a leak, the power consumption will be much higher. Hence, electrical parameters such as power consumption and frequency aging can determine package hermeticity. Please request Vectron’s EMXO white paper for additional detailed information on package hermiticity. Figure 11 (10MHz) 13. Other Typical Parameters Phase Noise (dBc/Hz) Phase Noise: 10MHz -70 -80 -90 -100 -110 -120 -130 -140 -150 -160 -170 1 10 100 1,000 10,000 100,000 Offset Frequency (Hz) Figure 10 Rev: 6-24-15 SEM For Additional Information, Please Contact USA: Europe: Asia: Vectron International -PXFMM3PBE 6OJU )VETPO /) 5FM 'BY Vectron International -BOETUSBTTF % /FDLBSCJTDIPGTIFJN (FSNBOZ 5FM 'BY Vectron International :JO$IFOH3PBE $ OE'MPPS 0OF-V+JB;VJ 1VEPH 4IBOHIBJ $IJOB 5FM 'BY Disclaimer Vectron International reserves the right to make changes to the product(s) and or information contained herein without notice. No liability is assumed as a result of their use or application. No rights under any patent accompany the sale of any such product(s) or information. Vectron International • 267 Lowell Road, Hudson, NH 03051 • Tel: 1-88-VECTRON-1 • http://www.vectron.com