APW8819 DDR TOTAL POWER SOLUTION SYNCHRONOUS BUCK CONTROLLER WITH 1.5A LDO Features General Description Buck Controller (VDDQ) The APW8819 integrates a synchronous buck PWM controller to generate VDDQ, a sourcing and sinking LDO • High Input Voltages Range from 3V to 28V Input linear regulator to generate VTT. It provides a complete power supply for DDR2 and DDR3 memory system. It Power • Provide 1.8V (DDR2), 1.5V (DDR3) or Adjustable offers the lowest total solution cost in system where space is at a premium. Output Voltage from 0.5V to 2V - ±1% Accuracy Over-Temperature • The APW8819 provides excellent transient response and accurate DC voltage output in PFM Mode. In Pulse Fre- Build in VREF Voltage 1.8V ±1% Accuracy over Temperature quency Mode (PFM), the APW8819 provides very high efficiency over light to heavy loads with loading-modulated • Integrated MOSFET Drivers • Integrated Bootstrap Forward P-CH MOSFET • Excellent Line and Load Transient Responses • PFM Mode for Increased Light Load Efficiency The APW8819 is equipped with accurate current-limit, • Selectable 300kHz/400kHz/500kHz Switching output under-voltage, and output over-voltage protections. A Power-On- Reset function monitors the voltage on VCC switching frequencies. Frequebcies prevents wrong operation during power on. • Integrated MOSFET Drivers and Bootstrap Diode • S3 and S5 Pins Control The Device in S0, S3, or The LDO is designed to provide a regulated voltage with S4/S5 State bi-directional output current for DDR-SDRAM termination. The device integrates two power transistors to source or • Power Good Monitoring • 50% Under-Voltage Protection (UVP) • 125% Over-Voltage Protection (OVP) • Adjustable Current-Limit Protection • QFN-20 3mmx3mm Package (QFN-20) and sink current up to 1.5A. It also incorporates current-limit and thermal shutdown protection. An internal resistor divider is used to provide a half voltage of VDDQSNS for VTTREF and VTT Voltage. The VTT - Using Sense Low-Side MOSFET RDS(ON) output voltage is only requiring 20µF of ceramic output capacitance for stability and fast transient response. The QFN-16 3mmx3mm Thin Package (TQFN-16) • S3 and S5 pins provide the sleep state for VTT (S3 state) and suspend state (S4/S5 state) for device, when S5 and Lead Free Available (RoHS Compliant) +1.5A LDO Section (VTT) • S3 are both pulled low the device provides the soft-off for VTT and VTTREF.The APW8819 is available in Souring or Sinking Current up to 1.5A • Fast Transient Response for Output Voltage • Output Ceramic Capacitors Support at Least 3mmx3mm 20-pin QFN and 3mmx3mm 16-pin TQFN packages. 10µF MLCC • VTT and VTTREF Track at Half the VDDQSNS by Applications Internal Divider • ±20mV Accuracy for VTT and VTTREF • Independent Over-Current-Limit (OCL) • DDR2, and DDR3 Memory Power Supplies • Thermal Shutdown Protection • SSTL-2 SSTL-18 and HSTL Termination ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise customers to obtain the latest version of relevant information to verify before placing orders. Copyright ANPEC Electronics Corp. Rev. A.6 - May, 2013 1 www.anpec.com.tw APW8819 Simplified Application Circuit 5V VIN +3V~28V VTT VDDQ/2 Q1 VDDQ ROC LOUT Q2 DDR LDO PWM VREF REFIN MODE RTOP RGND RMODE S3 S5 Ordering and Marking Information Package Code QA : QFN-20 QB : TQFN-16 Temperature Range I : -40 to 85 oC Handling Code TR : Tape & Reel TY : Tray Assembly Material APW8819 Assembly Material Handling Code Temperature Range Package Code G : Halogen and Lead Free Device APW8819 QA : APW 8819 XXXXX XXXXX - Date Code APW8819 QB : APW 8819 XXXXX XXXXX - Date Code Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020D for MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by weight). Copyright ANPEC Electronics Corp. Rev. A.6 - May, 2013 2 www.anpec.com.tw APW8819 Pin Configuration VTT 3 13 PHASE VTTGND 4 12 VCC VTTREF 5 11 LGATE S5 13 14 UGATE S 3 14 15 BOOT VLDOIN 2 O C 15 M O D E 16 S 5 16 S 3 17 O C 18 M O D E 19 P O K 20 VTTSNS 1 12 BOOT POK 1 11 UGATE VLDOIN 2 GND VTT 3 10 PHASE 9 VCC VTTREF 4 8 LGATE 7 VD D QSN S 6 REFIN 5 VR EF 10 P G N D 9 VDDQSNS 8 R E FIN 7 GND 6 VREF TQFN 3x3-16 (Top View) QFN 3x3-20 (Top View) = Thermal Pad (connected to GND plane for better heat dissipation) Absolute Maximum Ratings (Note 1, 2) Symbol VCC VBOOT VBOOT-GND Parameter Rating Unit VCC Supply Voltage (VCC to GND) -0.3 ~ 7 V BOOT Supply Voltage (BOOT to PHASE) -0.3 ~ 7 V -5 ~ 42 -0.3 ~ 35 V -5 ~ VBOOT+0.3 -0.3 ~ VBOOT+0.3 V <20ns Pulse Width >20ns Pulse Width -5 ~ VCC+0.3 -0.3 ~ VCC+0.3 V <20ns Pulse Width >20ns Pulse Width -5 ~ 35 -0.3 ~ 28 V -0.3 ~ 0.3 V BOOT Supply Voltage (BOOT to GND) <20ns Pulse Width >20ns Pulse Width UGATE Voltage (UGATE to PHASE) <20ns Pulse Width >20ns Pulse Width LGATE Voltage (LGATE to GND) PHASE Voltage (PHASE to GND) PGND and VTTGND to GND Voltage All Other Pins (OC, MODE, S3, S5, VDDQSNS, VTTSNS, VLDOIN, VREF, POK, VTT, VTTREF and REFIN to GND Voltage) TJ TSTG TSDR Maximum Junction Temperature Storage Temperature Maximum Soldering Temperature, 10 Seconds -0.3 ~ 7 V 150 o -65 ~ 150 o 260 o C C C Note1: Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability Note 2: The device is ESD sensitive. Handling precautions are recommended. Copyright ANPEC Electronics Corp. Rev. A.6 - May, 2013 3 www.anpec.com.tw APW8819 Thermal Characteristics (Note 3) Parameter Symbol θJA Typical Value Unit 95 95 °C/W Thermal Resistance - Junction to Ambient QFN3x3-20 TQFN3x3-16 Note 3: θJA is measured with the component mounted on a high effective the thermal conductivity test board in free air. The exposed pad of package is soldered directly on the PCB. Recommended Operating Conditions (Note 4) S ymbol Parameter VCC VCC Supply Voltage VIN Converter Input Voltage VVD DQ Converter Output Voltage V VTT LDO Output Voltage I OUT Converter Output Current Range Unit 4.5 ~ 5.5 V 3 ~ 28 V 0.5 ~2V/ DDR2 (1.8V)/ DDR 3 (1.5V) V 0.25~ 1 V 0 ~ 20 A -1.5 ~ +1.5 A I VTT LDO Output Current CVCC VCC Capacitance 1~ µF C VTT VTT Output Capacitance 10~ µF 0.22 ~ 2.2 µF C VTTREF VTTREF Output Capacitance TA Ambient Temperature -40 ~ 85 o TJ Junction Temperature -40 ~ 125 o C C Electrical Characteristics Refer to the typical application circuits. These specifications apply over V VCC=V BOOT=5V, V IN=12V and T A= -40 ~ 85 °C, unless otherwise specified. Typical values are at TA=25°C. Symbol Parameter APW8819 Test Conditions Min. Typ. Unit Max. SUPPLY CURRENT IVCC VCC Supply Current TA = 25oC, VS3 = VS5 = 5V, no load - 1.2 1.5 mA IVCCSTB VCC Standby Current TA = 25oC, VS3 = 0V, VS5 = 5V, no load - 740 850 µA - 0.1 1 µA mA IVCCSDN VCC Shutdown Current o TA =25 C, VS3 = VS5 = 0V, no load o ILDOIN LDOIN Supply Current TA = 25 C, VS3 = VS5 = 5V, no load 0.3 0.6 1 ILDOINSTB LDOIN Standby Current TA = 25oC, VS3 = 0V, VS5 = 5V, no load - 0.1 10 ILDOINSDN LDOIN Shutdown Current TA = 25oC, VS3 = VS5 = 0V, no load - 0.1 1 4.15 4.3 4.45 V - 100 - mV - 1.8 - V 1.782 - 1.8144 V µA POWER-ON-RESET VCC POR Threshold VCC Rising VCC POR Hysteresis VTT OUTPUT VVREF VREF Output Voltage Copyright ANPEC Electronics Corp. Rev. A.6 - May, 2013 IVREF=30µA, TA=25oC 0uA＜IVREF＜300uA, TA= -40oC~85oC 4 www.anpec.com.tw APW8819 Electrical Characteristics (Cont.) Refer to the typical application circuits. These specifications apply over V VCC=V BOOT=5V, V IN=12V and T A= -40 ~ 85 °C, unless otherwise specified. Typical values are at TA=25°C. Symbol Parameter APW8819 Test Conditions Unit Min. Typ. Max. VLDOIN = VVDDQSNS = 1.8V - 0.9 - VLDOIN = VVDDQSNS = 1.5V - 0.75 - VLDOIN = VVDDQSNS = 1.8V, VVDDQSNS/2 - VVTT, IVTT = 0A -20 - 20 VLDOIN = VVDDQSNS = 1.8V, VVDDQSNS/2 - VVTT, IVTT = 1.5A -30 - 30 VLDOIN = VVDDQSNS = 1.5V, VVDDQSNS/2 - VVTT, IVTT = 0A -20 - 20 VLDOIN = VVDDQSNS = 1.5V, VVDDQSNS/2 - VVTT, IVTT = 1.5A -30 - 30 VTT OUTPUT VVTT VVTT ILIM IVTTLK IVTTSNSLK IVTTDIS VTT Output Voltage VTT Output Tolerance Current-Limit VTT Leakage Current V mV Sourcing Current (VLDOIN = 1.8V) 2 2.2 3 Sinking Current (VLDOIN = 1.8V) -2 -2.2 -3 A Sourcing Current (VLDOIN = 1.5V) 2 2.2 3 Sinking Current (VLDOIN = 1.5V) -2 -2.2 -3 VVTT = 1.25V, VS3 = 0V, VS5 = 5V, TA = 25oC -1.0 - 1.0 µA o A VTTSNS Leakage Current VVTT = 1.25V, TA = 25 C -1.00 0.01 1.00 µA VTT Discharge Current VVTT = 0.5V, VS3 = VS5 = 0V, TA = 25oC, VVREF = 0V - 7.8 - mA VLDOIN = VVDDQSNS = 1.8V, VVDDQSNS/2 - 0.9 - VLDOIN = VVDDQSNS = 1.5V, VVDDQSNS/2 - 0.75 - -10mA < IVTTREF < 10mA, VVDDQSNS/2 - VVTTREF VLDOIN = VVTTREF =1.8V -18 - +18 -10mA < IVTTREF < 10mA, VVDDQSNS/2 - VVTTREF VLDOIN = VVDDQSNS = 1.5V -15 - +15 -25 -40 mA VTTREF OUTPUT VVTTREF VTTREF Output Voltage VTTREF Tolerance V mV IVTTREF VTTREF Source Current VVTTREF = 0V -10 IVTTREF VTTREF Sink Current VVTTREF = VVDDQSNS 10 25 40 mA VTTREF Discharge Current TA = 25oC , S3=S5=0V, VVTTREF = 0.5V - 2.6 - mA VREFIN = 1.8V - 1.8 - V -15 - 15 mV - 12 - µA -0.1 - 0.1 µA - 12 - mA - 1000 - mA IVTTREFDIS VDDQ OUTPUT VVDDQ IVDDQSNS IREFIN VDDQ Output Voltage VDDQSNS Regulation Voltage Tolerance to REFIN TA = 25 C, VREFIN = 1.8V, No Load VDDQSNS Input Current VVDDQSNS=1.8V REFIN Input Current VREFIN=1.8V VDDQ Discharge Current LDOIN Discharge Current Copyright ANPEC Electronics Corp. Rev. A.6 - May, 2013 o VS3 = VS5 = 0V, VVDDQSNS = 0.5V, MODE Pin Pulled Down to GND Through 47kΩ (Non-Tracking) VS3 = VS5 = 0V, VVDDQSNS = 0.5V, MODE Pin Pulled Down to GND Through 100kΩ (Tracking) 5 www.anpec.com.tw APW8819 Electrical Characteristics (Cont.) Refer to the typical application circuits. These specifications apply over V VCC=V BOOT=5V, V IN=12V and T A= -40 ~ 85 °C, unless otherwise specified. Typical values are at TA=25°C. Symbol Parameter APW8819 Test Conditions Unit Min. Typ. Max. VIN=12V, VVDDQSNS=1.8V, RMODE=100 kΩ 270 300 330 kHz VIN=12V, VVDDQSNS=1.8V, RMODE=200 kΩ 360 400 440 kHz S5 is High to VOUT Regulation 0.9 1.2 1.5 ms 350 450 550 ns Minimum on Time 80 110 140 ns Zero-Crossing Threshold -9.5 0.5 10.5 mV 9 10 11 µA - 4500 - ppm/ oC -10 0 +10 mV PWM CONTROLLERS FSW Operating Frequency TSS Internal Soft Start Time TOFF(MIN) TON(MIN) Minimum off Time VDDQ PROTECTIONS TA = 25oC OC Pin Source Current OCP Comparator Offset Temperature Coefficient, On The Basis of 25 οC (VOC – VPGND) – (VPGND – VPHASE), VOC – VPGND = 60mV VDDQ Current Limit Setting Range VOC-VPGND 0.2 - 3 V VDDQ OVP Trip Threshold VVDDQ Rising 120 125 130 % VDDQ OVP Debounce Delay VVDDQ Rising, DV=10mV VDDQ UVP Trip Threshold VVDDQ Falling VDDQ UVP Trip Hysteresis - 2 - µs 40 50 60 % - 3 - % VDDQ UVP Debounce - 16 - µs VDDQ UVP Enable Delay 2 2.4 2.8 ms POK VPOK IPOK POK Threshold POK in from Lower (POK Goes High) 87 90 93 % POK Out from Normal (POK Goes Low) 120 125 130 % - 0.1 1.0 µA POK Leakage Current VPOK=5V POK Sink Current VPOK=0.5V 2.5 7.5 - mA POK Enable Delay Time S5 High to POK High 2 2.4 2.8 ms POK Delay Time Delay for POK In - 63 - µs UGATE Pull-Up Resistance BOOT-UGATE=0.5V - 1.5 3 Ω UGATE Sink Resistance UGATE-PHASE=0.5V - 0.7 1.8 Ω LGATE Pull-Up Resistance VCC-LGATE=0.5V - 1 2.2 Ω LGATE Sink Resistance LGATE-PGND=0.5V - 0.5 1.2 Ω UGATE to LGATE Dead time UGATE falling to LGATE rising, no load - 20 - ns LGATE to UGATE Dead time LGATE falling to UGATE rising, no load - 20 - ns GATE DRIVERS Copyright ANPEC Electronics Corp. Rev. A.6 - May, 2013 6 www.anpec.com.tw APW8819 Electrical Characteristics (Cont.) Refer to the typical application circuits. These specifications apply over V VCC=V BOOT=5V, V IN=12V and T A= -40 ~ 85 °C, unless otherwise specified. Typical values are at TA=25°C. Symbol Parameter APW8819 Test Conditions Unit Min. Typ. Max. BOOTSTRAP SWITCH VF RON VVCC - VBOOT, IF = 10mA, TA = 25oC - 0.5 0.8 V IF Reverse Leakage VBOOT = 30V, VPHASE = 25V, VVCC = 5V, TA = 25oC - - 0.5 µA 1.6 - - V LOGIC THRESHOLD VIH S3, S5 High Threshold Voltage S3, S5 Rising VIL S3, S5 Low Threshold Voltage S3, S5 Falling - - 0.9 V IILEAK Logic Input Leakage Current VS3 = VS5 = 5V, TA =25oC -1 - 1 µA IMODE MODE Source Current 14 15 16 µA MODE = 0 - - 0.829 MODE = 1 0.879 - 1.202 MODE = 2 1.262 - 1.76 MODE = 3 1.84 - 1.95 MODE = 4 VCC-1 - - - 160 - o - 25 - o VTHMODE MODE Threshold Voltage V THERMAL SHUTDOWN TSD Thermal Shutdown Temperature TJ Rising Thermal Shutdown Hysteresis Copyright ANPEC Electronics Corp. Rev. A.6 - May, 2013 7 C C www.anpec.com.tw APW8819 Typical Operating Characteristics VREFIN=1.8V, VDDQ=1.8V VREFIN =1.5V, VDDQ=1.5V 1.83 VDDQ Output Voltage (V) VDDQ Output Voltage (V) 1.52 1.51 1.50 1.49 1.82 1.81 1.8 1.79 1.78 1.48 -40 -20 1.77 -40 -20 0 20 40 60 80 100 120 Junction Temperature, TJ (oC) Supply Current in S 0 State vs. Junction Temperature Shutdown Current vs. Junction Temperature 2.0 1.0 Shutdown Current, IVCC (uA) Supply Current, IVCC (mA) 0 20 40 60 80 100 120 Junction Temperature, TJ (°C) 1.6 1.2 0.8 0.4 0.8 0.6 0.4 0.2 S3=S5=5V 0 -40 -20 0 0 20 40 60 80 100 120 Junction Temperature, TJ (°C) Supply Current in S3 State vs. Junction Temperature 0 20 40 60 80 100 120 Junction Temperature, TJ (°C) Frequency vs. Junction Temperature 330 1.0 0.8 Switching Frequency,FSW (KHz) Supply Current, IVCC (mA) -40 -20 0.6 0.4 0.2 320 310 300 290 280 S3=0V, S5=5V Frequency Setting : 300kHz 0 -40 -20 0 20 40 60 270 -40 -20 80 100 120 Junction Temperature, TJ (°C) Copyright ANPEC Electronics Corp. Rev. A.6 - May, 2013 0 20 40 60 80 100 120 Junction Temperature, TJ (°C) 8 www.anpec.com.tw APW8819 Typical Operating Characteristics MODE Source Current vs. Junction Temperature OC Pin Sink Current vs. Junction Temperature 20 18 OC Sink Current (uA) MODE Source Current (uA) 16 18 16 14 14 12 10 8 6 4 12 2 10 0 -40 -20 0 20 40 60 -40 -20 80 100 120 Copyright ANPEC Electronics Corp. Rev. A.6 - May, 2013 0 20 40 60 80 100 120 Junction Temperature, TJ (°C) Junction Temperature, TJ (°C) 9 www.anpec.com.tw APW8819 Operating Waveforms Non-Zero VDDQ S5 Enable S5 Enable , No Load CH1: VS5 (5V/div) CH2: VVDDQ (1V/div) CH3: VUGATE (20V/div) CH4: VPOK (5V/div) Time: 500µs/div CH1: V S5 (5V/div) CH2: V VDDQ (1V/div) CH3: V VTT (500mV/div) CH4: V POK (5V/div) Time: 500µs/div S5 Shutdown - Tracking Discharge S5 Shutdown - Non-Tracking Discharge CH1: VS5 (5V/div) CH2: VVDDQ (1V/div) CH3: VVTT (500mV/div) CH4: VVTTREF (500mV/div) Time: 5ms/div CH1: VS5 (5V/div) CH2: VVDDQ (1V/div) CH3: VVTT (500mV/div) CH4: VVTTREF (500mV/div) Time: 200µs/div Copyright ANPEC Electronics Corp. Rev. A.6 - May, 2013 10 www.anpec.com.tw APW8819 Operating Waveforms S3 Enable-Shutdown Load Transient , I VDDQ = 0A->12A->0A CH1: VS3 (5V/div) CH2: VVDDQ (1V/div) CH3: VVTTREF (500mV/div) CH4: VVTT (500mV/div) Time: 10ms/div CH1: V VDDQ (100mV/div) CH2: V UGATE (20V/div) CH3: V LGATE (5V/div) CH4: IL (10A/div) Time: 20µs/div Current Limit then Occur UVP Load Transient , IVDDQ = 5A->17A->5A CH1: V VDDQ (100mV/div) CH2: V UGATE (20V/div) CH3: V LGATE (5V/div) CH4: IL (10A/div) Time: 20µs/div Copyright ANPEC Electronics Corp. Rev. A.6 - May, 2013 CH1: V VDDQ (1V/div) CH2: V VTT (500mV/div) CH3: V PHASE (20V/div) CH4: IL (10A/div) Time: 100µs/div 11 www.anpec.com.tw APW8819 Operating Waveforms Short Circuit Test : VDDQ Short to GND CH1: VVDDQ (1V/div) CH2: VVTT (500mV/div) CH3: VPHASE (20V/div) CH4: IL (10A/div) Time: 20µs/div Copyright ANPEC Electronics Corp. Rev. A.6 - May, 2013 12 www.anpec.com.tw APW8819 Pin Description NO. NAME FUNCTION QFN-20 TQFN-16 1 - VTTSNS Voltage sense input for the VTT LDO. Connect to plus terminal of the VTT LDO output capacitor. 2 2 VLDOIN Supply voltage input for the VTT LDO. 3 3 VTT 4 - VTTGND Power ground output for the VTT LDO. 5 4 VTTREF VTTREF buffered reference output. 6 5 VREF 1.8V Reference Output. A recommended capacitor with a value of 0.1uF should be attached to the VREF terminal. 7 Thermal Pad GND Signal ground for the PWM controller and VTT LDO. Connect to minus terminal of the VTT LDO output capacitor. 8 6 REFIN Reference input for VDDQ. Programmed by the resistor-divider connected between VREF and GND. 9 7 VDDQSNS VDDQ reference input for VTT and VTTREF. Power supply for the VTTREF. Discharge current sinking terminal for VDDQ non-tracking discharge. Output voltage feedback input for VDDQ output if VDDQSET pin is connected to VCC or GND. 10 - PGND Power ground of the LGATE low-side MOSFET driver. Connect the pin to the Source of the low-side MOSFET. Also it is current sense comparator positive input terminal and the ground of power good circuit. 11 8 LGATE Output of the low-side MOSFET driver for PWM. Connect this pin to Gate of the low-side MOSFET. Swings from PGND to VCC. 12 9 VCC 13 10 PHASE Junction point of the high-side MOSFET Source, output filter inductor and the low-side MOSFET Drain. Connect this pin to the Source of the high-side MOSFET. PHASE serves as the lower supply rail for the UGATE high-side gate driver. 14 11 UGATE Output of the high-side MOSFET driver for PWM. Connect this pin to Gate of the high-side MOSFET. 15 12 BOOT Supply Input for the UGATE Gate Driver and an internal level-shift circuit. Connect to an external capacitor and diode to create a boosted voltage suitable to drive a logic-level N-channel MOSFET. 16 13 S5 S5 signal input. 17 14 S3 S3 signal input. 18 15 OC Over-current trip voltage setting input for RDS(ON) current sense scheme. Connect resistor to GND to set over-current threshold at VOC/8. 19 16 MODE 20 1 POK Power output for the VTT LDO. Filtered 5V power supply input for internal control circuitry. Discharge mode and switching frequency setting pin. Power-okay output pin. POK is an open drain output used to Indicate the status of the output voltage. When VDDQ output voltage is within the target range, it is in high state. Copyright ANPEC Electronics Corp. Rev. A.6 - May, 2013 13 www.anpec.com.tw APW8819 Block Diagram 0.5 x VDDQ VDDQSNS VTTREF VLDOIN Thermal Shutdown S3 Current Limit S3,S5 Control Logic VTT S5 0.5 x VDDQ +5/10% VTTSNS VTTGND 0.5 x VDDQ -5/10% 15uA Discharge Mode Selection VREF Soft Start Reference 1.8V MODE POR VCC OC 10uA REFIN 7R Current Limit 1R 125% x REFIN OV Error Comparator BOOT UV UGATE 50% x REFIN PHASE ZC TON Generator PHASE PWM Signal Controller VCC REFIN x 125% POK LGATE Delay PGND GND REFIN x 90% Copyright ANPEC Electronics Corp. Rev. A.6 - May, 2013 14 www.anpec.com.tw APW8819 Typical Application Circuit ROC RMODE 100 K 47K RPOK 100K RVCC 5V S5 2.2 S3 VTT S5 S3 BOOT VLDOIN UGATE APW 8819 Q1 APM4354 PHASE QFN-20 330uF(6mΩ)x 2 CVCC PGND VDDQSNS REFIN GND LOUT 1µH COUT Q2 APM4354 LGATE VTTREF 7V~25V VDDQ 1.5V/20A VCC VTTGND VREF CIN 10uF x 2 (MLCC) CBOOT 0.1uF VTTSNS VTT CVTT 10uF (MLCC) OC POK CVLDOIN 10uF (MLCC) MODE VIN VLDOIN 1uF VTTREF VDDQ/2 RTOP 10K, 1% CVTTREF 0.1 uF C VREF 0.1uF RGND 49K, 1% CREFIN 0.01uF DDR3, 400kHz Application Circuit Copyright ANPEC Electronics Corp. Rev. A.6 - May, 2013 15 www.anpec.com.tw APW8819 Function Description In PWM operation, the high-side switch on-time is determined by a switching frequency control circuit in the on- The APW8819 integrates a synchronous buck PWM controller to generate VDDQ, a sourcing and sinking LDO time generator block. The switching frequency control circuit senses the switching frequency of the high-side linear regulator to generate VTT. It provides a complete power supply for DDR2 and DDR3 memory system in switch and keeps regulating it at a constant frequency in PWM mode. The design improves the frequency varia- 20-pin QFN and 16-pin TQFN packages. User defined output voltage is also possible and can be adjustable tion and be more outstanding than a conventional constant on-time controller which has large switching fre- from 0.5V to 2V. Input voltage range of the PWM converter is 3V to 28V. The converter runs an adaptive on-time PWM quency variation over input voltage, output current and temperature. Both in PFM and PWM, the on-time generator, operation at high-load condition and automatically reduces frequency to keep excellent efficiency down to sev- which senses input voltage on PHASE pin, provides very fast on-time response to input line transients. eral mA. The VTT LDO can source and sink up to 1.5A peak cur- Another one-shot sets a minimum off-time (typical: 450ns). The on-time one-shot is triggered if the error com- rent with only 10µF ceramic output capacitor. VTTREF tracks VDDQ/2 within 1% of VDDQ. VTT output tracks parator is high, the low-side switch current is below the current-limit threshold, and the minimum off-time one- VTTREF within 20 mV at no load condition while 40 mV at full load. The LDO input can be separated from VDDQ shot has timed out. and optionally connected to a lower voltage by using VLDOIN pin. This helps reducing power dissipation in Power-On-Reset sourcing phase. The APW8819 is fully compatible to JEDEC DDR2/DDR3 specifications at S3/S5 sleep state A Power-On-Reset (POR) function is designed to prevent wrong logic controls when the VCC voltage is low. The (see Table 1). When both VTT and VDDQ are disabled, the part has two options of output discharge function. POR function continually monitors the bias supply voltage on the VCC pin if at least one of the enable pins is set high. When the rising VCC voltage reaches the rising The tracking discharge mode discharges VDDQ and VTT outputs through the internal LDO transistors and then POR voltage threshold (4.3V typical), the POR signal goes high and the chip initiates soft-start operations. There is VTT output tracks half of VDDQ voltage during discharge. The non-tracking discharge mode discharges outputs almost no hysteresis to POR voltage threshold (about 100mV typical). When VCC voltage drop lower than 4.2V using internal discharge MOSFETs that are connected to VDDQSNS and VTT. The current capability of these dis- (typical), the POR disables the chip. charge MOSFETs are limited and discharge occurs more slowly than the tracking discharge. Selecting non-dis- Soft-Start charge mode can disable these discharge functions. The APW8819 integrates digital soft-start circuits to ramp up the output voltage of the converter to the programmed regulation set point at a predictable slew rate. The slew Constant-On-Time PWM Controller with Input Feed-Forward rate of output voltage is internally controlled to limit the inrush current through the output capacitors during soft- The constant on-time control architecture is a pseudo- start process. The figure 1 shows VDDQ soft-start sequence. When the S5 pin is pulled above the rising S5 fixed frequency with input voltage feed-forward. This architecture relies on the output filter capacitor’s effective threshold voltage, the switch regulator wait for 400µs and Mode status is read in this period. And then, the device series resistance (ESR) to act as a current-sense resistor, so the output ripple voltage provides the PWM ramp signal. initiates a soft-start process to ramp up the output voltage. The total soft-start interval is 1.2ms (typical) from S5 goes In PFM operation, the high-side switch on-time controlled by the on-time generator is determined solely by a one- high to VDDQ ramps up to regulation and independent of the UGATE switching frequency. shot whose pulse width is inversely proportional to input voltage and directly proportional to output voltage. Copyright ANPEC Electronics Corp. Rev. A.6 - May, 2013 16 www.anpec.com.tw APW8819 Function Description (Cont.) When PWM converter’s output voltage is greater than 90% of its target value, the internal open-drain device will be Soft-Start (Cont.) pulled low. After 63µs debounce time, the POK goes high. When the output voltage VDDQ outruns 125% of the tar- 2.4ms get voltage, POK signal will be pulled low immediately. VCC 1.2ms Under Voltage Protection VVDDQ In the process of operation, if a short-circuit occurs, the output voltage will drop quickly. When load current is bigger than current limit threshold value, the output voltage S5 will fall out of the required regulation range. The undervoltage continually monitors the setting output voltage after 2.4ms of PWM operations to ensure startup. If a load step is strong enough to pull the output voltage lower Figure 1. Soft-Start Sequence than the under voltage threshold (50% of normal output voltage), the internal UVP delay counter begins counting. During soft-start stage before the POK pin is ready, the After 16µs debounce time, the device turns off both highside and low-side MOSEFET with latched and starts a under voltage protection is prohibited. The over voltage and current limit protection functions are enabled. If the soft-stop process to shut down the output gradually. Toggling VCC power-on-reset signal can only reset it and output capacitor has residue voltage before startup, both low-side and high-side MOSFETs are in off-state until the bring the chip back to operation. VPOK internal digital soft start voltage equal the VVDDQ voltage. This will ensure the output voltage starts from its existing Over-Voltage Protection (OVP) voltage level. The VTT LDO part monitors the output current, both sourc- The feedback voltage should increase over 125% of the reference voltage due to the high-side MOSFET failure or ing and sinking current, and limits the maximum output current to prevent damages during current overload or for other reasons, and the over voltage protection comparator designed with a 1.5µs noise filter will force the short circuit (shorted from VTT to GND or VLDOIN) conditions. low-side MOSFET gate driver to be high. This action actively pulls down the output voltage. The VTT LDO provides a soft-start function, using the constant current to charge the output capacitor that gives When the OVP occurs, the POK pin will pull down and latch-off the converter. This OVP scheme only clamps the a rapid and linear output voltage rise. If the load current is above the current limit start-up, the VTT cannot start voltage overshoot, and does not invert the output voltage when otherwise activated with a continuously high output successfully. APW8819 has an independent counter for each output, from low-side MOSFET driver. It’s a common problem for OVP schemes with a latch. Once an over-voltage fault but the POK signal indicates only the status of VDDQ and does not indicate VTT power good externally. condition is set, toggling VCC power-on-reset signal can only reset it. Power-Good Output (POK) POK is an open-drain output and the POK comparator continuously monitors the output voltage. POK is actively held low in shutdown, and standby. Copyright ANPEC Electronics Corp. Rev. A.6 - May, 2013 17 www.anpec.com.tw APW8819 Function Description (Cont.) PWM Converter Current-Limit IPEAK INDUCTOR CURRENT The current-limit circuit employs a “valley” current-sensing algorithm (See Figure 2). The APW8819 uses the low-side MOSFET’s RDS(ON) of the synchronous rectifier as a current-sensing element. If the magnitude of the current-sense signal at PHASE pin is above the current limit threshold, the PWM is not allowed to initiate a new cycle. The actual peak current is greater than the current limit threshold by an amount equals to the inductor ripple current. Therefore, the exact current-limit characteristic ILIMIT IVALLEY 0 Time Figure 2. Current-Limit Algorithm and maximum load capability are the functions of the sense resistance, inductor value, and input voltage. VTT Sink/Source Regulator The PWM controller uses the low-side MOSFET’s onresistance RDS(ON) to monitor the current for protection The output voltage at VTT pin tracks the reference voltage applied at VTTREF pin. Two internal N-channel MOSFETs controlled by separate high bandwidth error amplifiers against shortened outputs. The MOSFET’s RDS(ON) is varied by temperature and gate to source voltage, the user regulate the output voltage by sourcing current from VLDOIN pin or sinking current to GND pin. To prevent two should determine the maximum RDS(ON) in manufacture’s datasheet. pass transistors from shoot-through, a small voltage offset is created between the positive inputs of the two error The OC pin can source 10µA through an external resistor for adjusting current-limit threshold. The voltage at OC amplifiers. The VTT with fast response feedback loop keeps tracking to the VTTREF within ±40mV at all condi- pin is equal to 10µA x ROC. The relationship between the sampled voltage VOC and the current-limit threshold ILIMIT tions including fast load transient. is given by: S3, S5 Control In the DDR2/DDR3 memory applications, it is important 1 × 10uA × ROC = ILIMIT X RDS(ON) 8 to keep VDDQ always higher than VTT/VTTREF including both start-up and shutdown. The S3 and S5 signals control the VDDQ, VTT, VTTREF states and these pins should be connected to SLP_S3 Where ROC is the resistor of current-limit setting threshold. and SLP_S5 signals respectively. The table1 shows the truth table of the S3 and S5 pins. When both S3 and S5 RDS(ON) is the low side MOSFETs conducive resistance. ILIMIT is the setting current-limit threshold. ILIMIT can be are above the logic threshold voltage, the VDDQ, VTT and VTTREF are turned on at S0 state. When S3 is low and expressed as IOUT minus half of peak-to-peak inductor current. S5 is high, the VDDQ and VTTREF are kept on while the VTT voltage is disabled and left high impedance in S3 The PCB layout guidelines should ensure that noise and DC errors do not corrupt the current-sense signals at state. When both S3 and S5 are low, the VDDQ, VTT and VTTREF are turned off and discharged to the ground ac- PHASE. Place the hottest power MOSEFTs as close to the IC as possible for best thermal coupling. When com- cording to the discharge mode selected by MODE pin during S4/S5 state. bined with the under-voltage protection circuit, this current-limit method is effective in almost every circumstance. Copyright ANPEC Electronics Corp. Rev. A.6 - May, 2013 18 www.anpec.com.tw APW8819 Function Description (Cont.) S3, S5 Control (Cont.) Thermal Shutdown Table1: The Truth Table of S3 and S5 Pins. A thermal shutdown circuit limits the junction tempera- STATE S3 S5 VDDQ VTTREF VTT S0 H H 1 1 1 ture of APW8819. When the junction temperature exceeds +160oC, PWM converter, VTTLDO and VTTREF are shut S3 L H 1 1 0 (high-Z) off, allowing the device to cool down. The regulator regulates the output again through initiation of a new soft- S4/5 L L start cycle after the junction temperature cools by 25oC, resulting in a pulsed output during continuous thermal 0 0 0 (discharge) (discharge) (discharge) VDDQ and VTT Discharge Control overload conditions. The thermal shutdown designed with a 25oC hysteresis lowers the average junction tempera- APW8819 discharges VDDQ, VTTREF and VTT outputs during S3 and S5 are both low. There are two different ture during continuous thermal overload conditions, extending life time of the device. discharge modes. A 15µA current is sourced from MODE pin across RMODE resistor connected between MODE pin For normal operation, device power dissipation should be externally limited so that junction temperatures will to GND. Table 2 shows R MODE values, corresponding switching frequency and discharge mode configuration. not exceed +125oC. Table 2. MODE Selection. MODE 0 1 2 RMODE(kΩ) 47 68 100 FSW(kHz) 400 300 300 3 200 400 4 Open 500 DISCHARGE MODE Non-Tracking Tracking Tracking When in tracking-discharge mode, APW8819 discharges outputs through the internal VTT regulator transistors and VTT output tracks half of VDDQ voltage during this discharge. Note that VDDQ discharge current flows via VLDOIN to VTTGND thus VLDOIN must be connected to VDDQ output in this mode. The internal LDO can handle up to 1.5A and discharge quickly. After VDDQ is discharged down to 0.2V, the internal LDO is turned off and the operation mode is changed to the non-tracking discharge mode. When in non-tracking-discharge mode, APW8819 discharges outputs using internal MOSFETs that are connected to VDDQSNS and VTT. The current capability of these MOSFETs is limited to discharge slowly. Note that VDDQ discharge current flows from VDDQSNS to PGND in this mode. In case of no discharge mode, APW8819 does not discharge output charge at all. Copyright ANPEC Electronics Corp. Rev. A.6 - May, 2013 19 www.anpec.com.tw APW8819 Application Information In some types of inductors, especially core that is made Output Voltage Selection The Output VDDQSNS Voltage is defined by REFIN of ferrite, the ripple current will increase abruptly when it saturates. This will be result in a larger output ripple voltage. The APW8819 provides a 1.8V voltage reference from VREF. In normal application circuit, the VREF output voltage. voltage drive the REFIN input voltage through a voltage divider circuit. The VDDQ output range is between 0.75 V Output Capacitor Selection and 1.8V, programmed by the resister-divider connected between VREF and GND. For stability operation, connect- Ou tp ut vol ta ge r ip pl e and t he t rans ie nt vol ta g e de viat ion are fac tor s th at h ave to be take n in to ing a few nano farads of capacitance from REFIN to GND is necessary. consideration when selecting an output capacitor. Higher capacitor value and lower ESR reduce the output ripple and the load transient drop. Therefore, selecting high performance low ESR capacitors is in- Output Inductor Selection tended for switching regulator applications. In addition to high frequency noise related MOSFET turn-on and turn- The duty cycle of a buck converter is the function of the input voltage and output voltage. Once an output voltage off, the output voltage ripple includes the capacitance voltage drop and ESR voltage drop caused by the AC peak- is fixed, it can be written as: D= VOUT VIN to-peak current. These two voltages can be represented by: The inductor value determines the inductor ripple current IRIPPLE 8COUTFSW = IRIPPLE × RESR ∆VCOUT = and affects the load transient reponse. Higher inductor ∆VESR value reduces the inductor’s ripple current and induces lower output ripple voltage. The ripple current and ripple voltage can be approxminated by: IRIPPLE = These two components constitute a large portion of the total output voltage ripple. In some applications, multiple capacitors have to be paralleled to achieve the desired VIN - VOUT VOUT × VIN FSW × L Where FSW is the switching frequency of the regulator. ESR value. If the output of the converter has to support another load with high pulsating current, more capaci- Although increase the inductor value and frequency reduce the ripple current and voltage, there is a tradeoff tors are needed in order to reduce the equivalent ESR and suppress the voltage ripple to a tolerable level. A between the inductor’s ripple current and the regulator load transient response time. small decoupling capacitor in parallel for bypassing the noise is also recommended, and the voltage rating A smaller inductor will give the regulator a faster load transient response at the expense of higher ripple of the output capacitors must also be considered. current. Increasing the switching frequency (FSW ) also reduces the ripple current and voltage, but it will switching frequency, more capacitors have to be used to reduce the voltage excursion during load step change. increase the switching loss of the MOSFETs and the power dissipation of the converter. The maximum ripple current occurs at the maximum input voltage. A Another aspect of the capacitor selection is that the total AC current going through the capacitors has to be good starting point is to choose the ripple current to be approximately 30% of the maximum output current. pacitors to prevent the capacitor from over-heating. To support a load transient that is faster than the less than the rated RMS current specified on the ca- Once the inductance value has been chosen, selecting an inductor is capable of carrying the required peak current without going into saturation. Copyright ANPEC Electronics Corp. Rev. A.6 - May, 2013 20 www.anpec.com.tw APW8819 Application Information (Cont.) Input Capacitor Selection The input capacitor is chosen based on the voltage rating and the RMS current rating. For reliable operation, select losses in the MOSFETs have two components: conduction loss and transition loss. For the high-side and low- the capacitor voltage rating to be at least 1.3 times higher than the maximum input voltage. The maximum RMS side MOSFETs, the losses are approximately given by the following equations : current rating requirement is approximately IOUT/2, where IOUT is the load current. During power up, the input capaci- Phigh-side = IOUT (1+ TC)(RDS(ON))D + (0.5)( IOUT)(VIN)( tSW)FSW 2 2 Plow-side = IOUT (1+ TC)(RDS(ON))(1-D) tors have to handle large amount of surge current. In lowduty notebook appliactions, ceramic capacitors are Where remmended. The capacitors must be connected between the drain of high-side MOSFET and the source of low- I is the load current OUT side MOSFET with very low-impeadance PCB layout. TC is the temperature dependency of RDS(ON) FSW is the switching frequency MOSFET Selection tSW is the switching interval D is the duty cycle The application for a notebook battery with a maximum voltage of 24V, at least a minimum 30V MOSFETs Note that both MOSFETs have conduction losses while the high-side MOSFET includes an additional transi- should be used. The design has to trade off the gate charge with the RDS(ON) of the MOSFET: tion loss. The switching internal, t SW , is the function of the reverse transfer capacitance CRSS. The (1+TC) term • For the low-side MOSFET, before it is turned on, the is to factor in the temperature dependency of the RDS(ON) and can be extracted from the “RDS(ON) vs Temperature” body diode has been conducted. The low-side MOSFET driver will not charge the miller capacitor of this curve of the power MOSFET.. MOSFET. Layout Consideration • In the turning off process of the low-side MOSFET, In any high switching frequency converter, a correct layout the load current will shift to the body diode first. The is important to ensure proper operation of the regulator. With power devices switching at higher frequency, the high dv/dt of the phase node voltage will charge the miller capacitor through the low-side MOSFET driver resulting current transient will cause voltage spike across the interconnecting impedance and parasitic circuit sinking current path. This results in much less switching loss of the low-side MOSFETs. The duty elements. As an example, consider the turn-off transition of the PWM MOSFET. Before turn-off condition, the cycle is often very small in high battery voltage applications, and the low-side MOSFET will con- MOSFET is carrying the full load current. During turn-off, current stops flowing in the MOSFET and is freewheeling duct most of the switching cycle; therefore, the RDS(ON) of the low-side MOSFET, the less the power loss. The by the lower MOSFET and parasitic diode. Any parasitic inductance of the circuit generates a large voltage spike gate charge for this MOSFET is usually a secondary consideration. The high-side MOSFET does not have during the switching interval. In general, using short and wide printed circuit traces should minimize interconnect- this zero voltage switching condition, and because it conducts for less time compared to the low-side ing impedances and the magnitude of voltage spike. And signal and power grounds are to be kept separating and MOSFET, the switching loss tends to be dominant. Priority should be given to the MOSFETs with less finally combined to use the ground plane construction or single point grounding. The best tie-point between the gate charge, so that both the gate driver loss and switching loss will be minimized. signal ground and the power ground is at the negative side of the output capacitor on each channel, where there The selection of the N-channel power MOSFETs are determined by the RDS(ON), reversing transfer capacitance is less noise. Noisy traces beneath the IC are not recommended. Below is a checklist for your layout: (CRSS) and maximum output current requirement. The Copyright ANPEC Electronics Corp. Rev. A.6 - May, 2013 21 www.anpec.com.tw APW8819 Application Information (Cont.) Layout Consideration (Cont.) • Keep the switching nodes (UGATE, LGATE, BOOT, and • The PGND trace should be a separate trace, and inde PHASE) away from sensitive small signal nodes pendently go to the source of the low-side MOSFETs (VREF, REFIN, VTTREF, OC, and MODE) since these nodes are fast mov ing signals. Therefore, keep traces for current limit accuracy. TQFN3X3-16 to these nodes as short as possible and there should be no other weak signal traces in parallel with theses 3mm traces on any layer. • The signals going through theses traces have both high dv/dt and high di/dt, with high peak charging and 0.5mm * discharging current. The traces from the gate drivers to the MOSFETs (UGATE and LGATE) should be short 0.24mm 1.66 mm and wide. • Place the source of the high-side MOSFET and the drain 0.5mm of the low-side MOSFET as close as possible. Minimizing the impedance with wide layout plane between the two pads reduces the voltage bounce of the node. • Decoupling capacitor, the resistor dividers, boot capacitors, and current limit stetting resistor should be 0.508mm 3mm 1.66mm 0.162mm * Just Recommend close their pins. (For example, place the decoupling ceramic capacitor near the drain of the high-side MOSFET as close as possible. The bulk capacitors are also placednear the drain). And need to noted, con- QFN3x3-20 necting capacitor with OC pin is forbidden. 3mm • The input capacitor should be near the drain of the up per MOSFET; the high quality ceramic decoupling capacitor can be put close to the VCC and GND pins; the VTTREF decoupling capacitor should be close to the 0.5mm * VTTREF pin and GND; A capacitor with a value of 0.1µF or larger should be close to the VREF terminal; the 0.2mm 1.66 mm REFIN decoupling capacitor should be close to the REFIN pin and GND; the VDDQ and VTT output capacitors should be located right across their output pin as clase as possible to the part to minimize parasitics. 3mm 0.4mm 1.66 mm The input capacitor GND should be close to the output capacitor GND and the lower MOSFET GND. 0.17 mm 0.5mm • The drain of the MOSFETs (PHASE node) should be a large plane for heat sinking. And PHASE pin traces are also the return path for UGATE. Connect this pin to the * Just Recommend converter’s upper MOSFET source. Copyright ANPEC Electronics Corp. Rev. A.6 - May, 2013 Figure3. Recommended Minimum Footprint 22 www.anpec.com.tw APW8819 Package Information QFN3x3-20 A E b D Pin 1 A1 A3 D2 NX aaa c L K E2 Pin 1 Corner e S Y M B O L QFN3x3-20 MILLIMETERS MIN. INCHES MAX. MIN. MAX. A 0.80 1.00 0.031 0.039 A1 0.00 0.05 0.000 0.002 A3 0.20 REF 0.008 REF b 0.15 0.25 0.006 0.010 D 2.90 3.10 0.114 0.122 0.071 D2 1.50 1.80 0.059 E 2.90 3.10 0.114 0.122 E2 1.50 1.80 0.059 0.071 0.50 0.012 e 0.40 BSC L 0.30 K 0.20 aaa 0.016 BSC 0.020 0.008 0.08 0.003 Note : 1. Followed from JEDEC MO-220 WEEE Copyright ANPEC Electronics Corp. Rev. A.6 - May, 2013 23 www.anpec.com.tw APW8819 Package Information TQFN3x3-16 A b E D Pin 1 D2 A1 A3 L K E2 Pin 1 Corner e S Y M B O L TQFN3x3-16 INCHES MILLIMETERS MIN. MAX. MIN. MAX. A 0.70 0.80 0.028 0.031 A1 0.00 0.05 0.000 0.002 A3 0.20 REF 0.008 REF b 0.18 0.30 0.007 0.012 D 2.90 3.10 0.114 0.122 D2 1.50 1.80 0.059 0.071 E 2.90 3.10 0.114 0.122 E2 1.50 1.80 0.059 0.071 e 0.50 BSC L 0.30 K 0.20 0.020 BSC 0.012 0.50 0.020 0.008 Note : Follow JEDEC MO-220 WEED-4. Copyright ANPEC Electronics Corp. Rev. A.6 - May, 2013 24 www.anpec.com.tw APW8819 Carrier Tape & Reel Dimensions P0 P2 P1 A B0 W F E1 OD0 K0 A0 A OD1 B B T SECTION A-A SECTION B-B H A d T1 Application QFN3X3-20 A H T1 C d D W E1 F 330±2.00 50 MIN. 12.4+2.00 -0.00 13.0+0.50 -0.20 1.5 MIN. 20.2 MIN. 12.0±0.30 1.75±0.10 5.5±0.05 P0 P1 P2 D0 D1 T A0 B0 K0 2.0±0.05 1.5+0.10 -0.00 1.5 MIN. 0.6+0.00 -0.40 3.30±0.20 3.30±0.20 1.30±0.20 4.0±0.10 TQFN3x3-16 8.0±0.10 A H T1 C d D W E1 F 330±2.00 50 MIN. 12.4+2.00 -0.00 13.0+0.50 -0.20 1.5 MIN. 20.2 MIN. 12.0±0.30 1.75±0.10 5.5±0.05 P0 P1 P2 D0 D1 T A0 B0 K0 4.0±0.10 8.0±0.10 2.0±0.05 1.5+0.10 -0.00 1.5 MIN. 0.6+0.00 -0.40 3.30±0.20 3.30±0.20 1.30±0.20 (mm) Devices Per Unit Package Type QFN3x3-20 TQFN3x3-16 Unit Tape & Reel Tape & Reel Copyright ANPEC Electronics Corp. Rev. A.6 - May, 2013 Quantity 3000 3000 25 www.anpec.com.tw APW8819 Taping Direction Information QFN3x3-20 &TQFN3x3-16 USER DIRECTION OF FEED Classification Profile Copyright ANPEC Electronics Corp. Rev. A.6 - May, 2013 26 www.anpec.com.tw APW8819 Classification Reflow Profiles Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly 100 °C 150 °C 60-120 seconds 150 °C 200 °C 60-120 seconds 3 °C/second max. 3°C/second max. 183 °C 60-150 seconds 217 °C 60-150 seconds See Classification Temp in table 1 See Classification Temp in table 2 Time (tP)** within 5°C of the specified classification temperature (Tc) 20** seconds 30** seconds Average ramp-down rate (Tp to Tsmax) 6 °C/second max. 6 °C/second max. 6 minutes max. 8 minutes max. Preheat & Soak Temperature min (Tsmin) Temperature max (Tsmax) Time (Tsmin to Tsmax) (ts) Average ramp-up rate (Tsmax to TP) Liquidous temperature (TL) Time at liquidous (tL) Peak package body Temperature (Tp)* Time 25°C to peak temperature * Tolerance for peak profile Temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. Table 1. SnPb Eutectic Process – Classification Temperatures (Tc) Package Thickness <2.5 mm ≥2.5 mm Volume mm <350 235 °C 220 °C 3 Volume mm ≥350 220 °C 220 °C 3 Table 2. Pb-free Process – Classification Temperatures (Tc) Package Thickness <1.6 mm 1.6 mm – 2.5 mm ≥2.5 mm Volume mm <350 260 °C 260 °C 250 °C 3 Volume mm 350-2000 260 °C 250 °C 245 °C 3 Volume mm >2000 260 °C 245 °C 245 °C 3 Reliability Test Program Test item SOLDERABILITY HOLT PCT TCT HBM MM Latch-Up Method JESD-22, B102 JESD-22, A108 JESD-22, A102 JESD-22, A104 MIL-STD-883-3015.7 JESD-22, A115 JESD 78 Copyright ANPEC Electronics Corp. Rev. A.6 - May, 2013 27 Description 5 Sec, 245°C 1000 Hrs, Bias @ Tj=125°C 168 Hrs, 100%RH, 2atm, 121°C 500 Cycles, -65°C~150°C VHBM≧2KV VMM≧200V 10ms, 1tr≧100mA www.anpec.com.tw APW8819 Customer Service Anpec Electronics Corp. Head Office : No.6, Dusing 1st Road, SBIP, Hsin-Chu, Taiwan, R.O.C. Tel : 886-3-5642000 Fax : 886-3-5642050 Taipei Branch : 2F, No. 11, Lane 218, Sec 2 Jhongsing Rd., Sindian City, Taipei County 23146, Taiwan Tel : 886-2-2910-3838 Fax : 886-2-2917-3838 Copyright ANPEC Electronics Corp. Rev. A.6 - May, 2013 28 www.anpec.com.tw