TI BQ294522 Overvoltage protection for 2-series and 3-series cell li-ion battery Datasheet

bq294502, bq294504, bq294512, bq294515
bq294522, bq294524, bq294532, bq294562
bq294572, bq294582, bq294592
www.ti.com
SLUSAJ3C – SEPTEMBER 2011 – REVISED MAY 2012
Overvoltage Protection for 2-Series and 3-Series Cell Li-Ion Batteries
Check for
Samples: bq294502, bq294504, bq294512, bq294515, bq294522, bq294524, bq294532, bq294562, bq294572, bq294582, bq294592
FEATURES
•
1
•
•
•
•
2-Series and 3-Series Cell Monitor for
Secondary Protection
Fixed Programmable Delay Timer
Fixed OVP Threshold:
– bq294502 = 4.35 V with 4-s Delay Timer
– bq294504 = 4.35 V with 6.5-s Delay Timer
– bq294512 = 4.40 V with 4-s Delay Timer
– bq294515 = 4.425 V with 4-s Delay Timer
– bq294522 = 4.45 V with 4-s Delay Timer
– bq294524 = 4.45 V with 6.5-s Delay Timer
– bq294532 = 4.50 V with 4-s Delay Timer
– bq294562 = 4.25 V with 4-s Delay Timer
– bq294572 = 4.00 V with 4-s Delay Timer
– bq294582 = 4.225 V with 4-s Delay Timer
– bq294584 = 4.225 V with 6.5-s Delay Timer
– bq294592 = 4.30 V with 4-s Delay Timer
High-Accuracy Overvoltage Protection:
± 10 mV
•
•
Low Power Consumption ICC ≈ 1 µA
(VCELL(ALL) < VPROTECT)
Low leakage current per cell input < 100 nA
Small package footprint
– 6-pin SON
APPLICATIONS
•
2nd-Level Protection in Li-Ion Battery Packs in:
– Tablets
– Slates
– Power Tools
– Notebook Computers
– Portable Equipment and Instrumentation
DESCRIPTION
The bq2945xy family of products is a secondary level voltage monitor and protector for Li-Ion battery pack
systems. Each cell is monitored independently for an overvoltage condition. Based on the configuration, an
output is triggered after a fixed delay if any one of the two or three cells has an overvoltage condition. This output
will be triggered into a high state after an overvoltage condition has satisfied the specified delay timer.
DRV Package
(Top View)
V3
1
V2
2
VSS
3
6
OUT
5
VDD
4
V1
PWR PAD
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
UNLESS OTHERWISE NOTED this document contains
PRODUCTION DATA information current as of publication date.
Products conform to specifications per the terms of Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2011–2012, Texas Instruments Incorporated
bq294502, bq294504, bq294512, bq294515
bq294522, bq294524, bq294532, bq294562
bq294572, bq294582, bq294592
SLUSAJ3C – SEPTEMBER 2011 – REVISED MAY 2012
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION (1)
TA
OVP (V)
DELAY TIME (S)
TAPE AND REEL
(LARGE)
TAPE AND REEL
(SMALL)
bq294502
4.35
4.0
bq294502DRVR
bq294502DRVT
bq294504
4.35
6.5
bq294504DRVR
bq294504DRVT
bq294512
4.40
4.0
bq294512DRVR
bq294512DRVT
bq294515
4.425
4.0
bq294515DRVR
bq294515DRVT
bq294522
4.45
4.0
bq294522DRVR
bq294522DRVT
4.45
6.5
bq294524DRVR
bq294524DRVT
4.50
4.0
bq294532DRVR
bq294532DRVT
4.25
4.0
bq294562DRVR
bq294562DRVT
bq294572
4.00
4.0
bq294572DRVR
bq294572DRVT
bq294582
4.225
4.0
bq294582DRVR
bq294582DRVT
bq294584 (2)
4.225
6.5
bq294584DRVR
bq294584DRVT
bq294592
4.30
4.0
bq294592DRVR
bq294592DRVT
PART NUMBER
–40°C to
110°C
bq294524
bq294532
PACKAGE
SON-6
PACKAGE
DESIGNATOR
DRV
bq294562
(1)
(2)
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the
device product folder on ti.com (www.ti.com).
Product Preview only
THERMAL INFORMATION
bq2945xy
THERMAL METRIC (1)
SON
UNITS
6 PINS
θJA
Junction-to-ambient thermal resistance
186.4
θJC(top)
Junction-to-case(top) thermal resistance
90.4
θJB
Junction-to-board thermal resistance
110.7
ψJT
Junction-to-top characterization parameter
96.7
ψJB
Junction-to-board characterization parameter
90
θJC(bottom)
Junction-to-case(bottom) thermal resistance
n/a
(1)
2
°C/W
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
Submit Documentation Feedback
Copyright © 2011–2012, Texas Instruments Incorporated
Product Folder Link(s): bq294502 bq294504 bq294512 bq294515 bq294522 bq294524 bq294532 bq294562
bq294572 bq294582 bq294592
bq294502, bq294504, bq294512, bq294515
bq294522, bq294524, bq294532, bq294562
bq294572, bq294582, bq294592
www.ti.com
SLUSAJ3C – SEPTEMBER 2011 – REVISED MAY 2012
PIN FUNCTIONS
bq2945xy
Pin Name
Type I/O
1
V3
IA
Sense input for positive voltage of the third cell from the bottom of the stack
Description
2
V2
IA
Sense input for positive voltage of the second cell from the bottom of the stack
3
VSS
P
Electrically connected to IC ground and negative terminal of the lowest cell in
the stack
4
V1
IA
Sense input for positive voltage of the lowest cell in the stack
5
VDD
P
Power supply
6
OUT
OA
Output drive for external N-Channel FET
Thermal Pad
PWRPAD
—
VSS pin to be connected to the PWRPAD on the printed circuit board for proper
operation
PIN DETAILS
Description
Cell Voltage (V)
(V3 –V2, V2 – V1, V1–VSS)
The voltage sensing for each cell is done independently using a multiplexer. The method of overvoltage detection
is comparing the voltage to an overvoltage protection voltage VOV. Once the voltage exceeds the programmed
fixed value, the delay timer circuit is activated. This delay (tDELAY) is fixed for either a 4-s or 6.5-s delay. When
these conditions are satisfied, the OUT terminal is transitioned to a high level. This output (OUT) is released to a
low condition if all of the cell inputs (Vx) are below the OVP threshold minus the Vhys.
VOV
VOV –V HYS
t DELAY
OUT (V)
Figure 1. Timing for Overvoltage Sensing
Sense Positive Input for Vx
This is an input to sense each single battery cell voltage. A series resistor and a capacitor across the cell for
each input is required for noise filtering and stable voltage monitoring.
Output Drive, OUT
The gate of an external N-Channel MOSFET is connected to this terminal. This output transitions to a high level
when an overvoltage condition is detected and after the programmed delay timer. The out will reset to a low level
if the cell voltage falls below the VOV threshold before the fixed delay timer expires.
Supply Input, VDD
This terminal is the unregulated input power source for the IC. A series resistor is connected to limit the current,
and a capacitor is connected to ground for noise filtering.
Copyright © 2011–2012, Texas Instruments Incorporated
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Product Folder Link(s): bq294502 bq294504 bq294512 bq294515 bq294522 bq294524 bq294532 bq294562
bq294572 bq294582 bq294592
3
bq294502, bq294504, bq294512, bq294515
bq294522, bq294524, bq294532, bq294562
bq294572, bq294582, bq294592
SLUSAJ3C – SEPTEMBER 2011 – REVISED MAY 2012
www.ti.com
Thermal Pad, PWRPAD
For correct operation, the power pad (PWRPAD) is connected to the VSS terminal on the printed circuit board.
FUNCTIONAL BLOCK DIAGRAM
PACK+
R VD
CVD
VDD
RIN
V3
CIN
V2
RIN
CIN
V1
RIN
Multiplexer Switch Network
REG
INT_EN
VOV
Delay
Timer
OUT
OSC
CIN
VSS
PWRPAD
PACK–
ABSOLUTE MAXIMUM RATINGS
Over operating free-air temperature range (unless otherwise noted) (1)
PARAMETER
CONDITION
VALUE/UNIT
Supply voltage range
Input voltage range
VDD–VSS
–0.3 to 30 V
V1–VSS or V2–VSS or V3–VSS
–0.3 to 30 V
V3–V2 or V2–V1
–0.3 to 8 V
Output voltage range
OUT–VSS
Continuous total power dissipation, PTOT
–0.3 to 30 V
See package dissipation rating.
Functional temperature
–65 to 110°C
Storage temperature range, TSTG
–65 to 150°C
Lead temperature (soldering, 10 s), TSOLDER
(1)
300°C
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating
conditions” is not implied. Exposure to absolute-maximum–rated conditions for extended periods may affect device reliability.
RECOMMENDED OPERATING CONDITIONS
Over operating free-air temperature range (unless otherwise noted)
PARAMETER
Supply voltage, VDD
(1)
Input voltage range V3–V2 or V2–V1 or V1–VSS
Operating ambient temperature range, TA
(1)
4
MIN
NOM
MAX
UNIT
3
25
V
0
5
V
–40
110
°C
See APPLICATION SCHEMATIC.
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Copyright © 2011–2012, Texas Instruments Incorporated
Product Folder Link(s): bq294502 bq294504 bq294512 bq294515 bq294522 bq294524 bq294532 bq294562
bq294572 bq294582 bq294592
bq294502, bq294504, bq294512, bq294515
bq294522, bq294524, bq294532, bq294562
bq294572, bq294582, bq294592
www.ti.com
SLUSAJ3C – SEPTEMBER 2011 – REVISED MAY 2012
DC CHARACTERISTICS
Typical values stated where TA = 25°C and VDD = 10.8 V, MIN/MAX values stated where TA = –40°C to 110°C and VDD =
3 V to 15 V (unless otherwise noted).
Symbol
Parameter
Condition
Min
Typ
Max
Unit
Voltage Protection Threshold VCx
1.0
bq294502, fixed delay 4 s
4.35
V
1.1
bq294504, fixed delay 6.5 s
4.35
V
1.2
bq294512, fixed delay 4 s
4.40
V
1.3
bq294515, fixed delay 4 s
4.425
V
bq294522, fixed delay 4 s
4.45
V
bq294524, fixed delay 6.5 s
4.45
V
bq294532, fixed delay 4 s
4.50
V
1.7
bq294562, fixed delay 4 s
4.25
V
1.8
bq294572, fixed delay 4 s
4.00
V
1.9
bq294582, fixed delay 4 s
4.225
V
4.225
V
4.30
V
1.4
1.5
1.6
VOV
V(PROTECT) –
Overvoltage
Detection
1.10
bq294584, fixed delay 6.5 s
1.11
bq294592, fixed delay 4 s
1.12
VHYS
Overvoltage
Detection
Hysteresis
1.13
VOA
OV Detection
Accuracy
TA = 25°C
1.14
VOA –DRIFT
OV Detection
Accuracy due to
Temperature
TA = -40°C
TA = 0°C
TA = 60°C
TA = 110°C
(1)
250
300
400
mV
–10
10
mV
-40
-20
-24
-54
44
20
24
54
mV
mV
mV
mV
Supply and Leakage Current
1.15
ICC
Supply Current
(V3–V2) = (V2–V1) = (V1–VSS) = 4.0 V (See
Figure 11 for reference)
1
µA
(V3–V2) = (V2–V1) = (V1–VSS) = 2.8 V with TA =
–40°C to 60°C
1.25
Measured at V3, V2, and V1 = 4.0 V
(V2–V1) = (V1–VSS) = 4.0 V
TA = 0°C to 60°C (See Figure 11 for reference.)
–0.1
1.17
(V3–V2) or (V2–V1) or (V1–VSS) > VOV
VDD = 7.2 V, IOH = 100 µA, TA = –40°C to 110°C
6
1.18
Two of the three cells are short circuit and only one
cell is powered
(V3–V2) or (V2–V1) or (V1–VSS) > VOV
VDD = Vx (Cell voltage), IOH = 100 µA, TA = –40°C to
110°C
1.16
IIN
Input Current at
Vx Pins
2
0.1
µA
Output Drive OUT
VOUT
Output Drive
Voltage
VDD –
0.2
(V3–V2), (V2–V1), and (V1–VSS) < VOV, IOL = 100
µA, TA = 25°C
TA = –40°C to 110°C
1.19
OUT Short
Circuit Current
OUT = 0 V (V3–V2) or (V2–V1) or (V1–VSS) > VOV
tR
Output Rise
Time
CL = 1 nF, VOH(OUT) = 0 V to 5 V
ZO
Output
Impedance
1.20
IOUT(Short)
1.21
1.22
V
250
(2)
V
400
mV
4.5
mA
5
µs
2
5
kΩ
Fixed Delay Timer
1.23
(1)
(2)
tDELAY
Fault Detection
Delay Time
Fixed Delay, bq2945x2
3.2
4
4.8
Fixed Delay, bq2945x4
5.2
6.5
7.8
s
Product Preview only
Specified by design. Not 100% tested in production.
Copyright © 2011–2012, Texas Instruments Incorporated
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Product Folder Link(s): bq294502 bq294504 bq294512 bq294515 bq294522 bq294524 bq294532 bq294562
bq294572 bq294582 bq294592
5
bq294502, bq294504, bq294512, bq294515
bq294522, bq294524, bq294532, bq294562
bq294572, bq294582, bq294592
SLUSAJ3C – SEPTEMBER 2011 – REVISED MAY 2012
www.ti.com
DC CHARACTERISTICS (continued)
Typical values stated where TA = 25°C and VDD = 10.8 V, MIN/MAX values stated where TA = –40°C to 110°C and VDD =
3 V to 15 V (unless otherwise noted).
Symbol
Parameter
Condition
Min
Typ
Max
Unit
Voltage Protection Threshold VCx
1.24
tDELAY_CTM
Fault Detection
Delay Time in
Test Mode
Fixed delay (Internal settings)
15
ms
TYPICAL CHARACTERISTICS
1.3
ICC Current (µA)
1.2
1.1
1
0.9
0.8
0.7
-40
0
25
Temperature Deg C
60
110
Figure 2. ICC Current Consumption Versus Temperature
Overoltage Threshold (V)
4.370
4.360
4.350
Min
4.340
Max
Mean
4.330
4.320
4.310
–40
0
25
60
110
Temperature Deg C
Figure 3. bq294502 Overvoltage Threshold (OVT) vs. Temp
6
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Product Folder Link(s): bq294502 bq294504 bq294512 bq294515 bq294522 bq294524 bq294532 bq294562
bq294572 bq294582 bq294592
bq294502, bq294504, bq294512, bq294515
bq294522, bq294524, bq294532, bq294562
bq294572, bq294582, bq294592
www.ti.com
SLUSAJ3C – SEPTEMBER 2011 – REVISED MAY 2012
325
324
323
Vhys (mV)
322
321
320
319
318
317
316
315
-40
0
25
60
110
Temperature Deg C
Figure 4. Hysteresis VHYS Versus Temperature
–3.85
–3.9
I OUT (mA)
–3.95
–4
–4.05
–4.1
–40
0
25
60
110
Temperature Deg C
VOH (V)
Figure 5. Output Current IOUT Versus Temperature
8.0
7.5
7.0
6.5
6.0
5.5
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
3-cell data
2-cell data
0
100
200
300
400
500
600
700
800
900
1,000
IOH (µA)
Figure 6. Output Voltage Versus Output Current
Copyright © 2011–2012, Texas Instruments Incorporated
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Product Folder Link(s): bq294502 bq294504 bq294512 bq294515 bq294522 bq294524 bq294532 bq294562
bq294572 bq294582 bq294592
7
bq294502, bq294504, bq294512, bq294515
bq294522, bq294524, bq294532, bq294562
bq294572, bq294582, bq294592
SLUSAJ3C – SEPTEMBER 2011 – REVISED MAY 2012
www.ti.com
APPLICATION INFORMATION
Pack +
RVD
bq2945xy
RIN
VCELL3
RIN
VCELL2
RIN
CIN
V3
OUT
V2
VDD
CIN
CVD
V1
VSS
PWRPAD
VCELL1
CIN
Pack–
Figure 7. Application Configuration
Changes to the ranges stated in Table 1 will impact the accuracy of the cell measurements. Figure 7 shows each
external component.
Table 1. Parameters
PARAMETER
External Component
MIN
NOM
MAX
Voltage monitor filter resistance
RIN
900
1000
1100
Ω
Voltage monitor filter capacitance
CIN
0.01
0.1
µF
Supply voltage filter resistance
RVD
100
Supply voltage filter capacitance
CVD
1K
0.1
UNIT
Ω
µF
APPLICATION SCHEMATIC
Pack +
Pack +
100
100
bq2945xy
1k
VCELL3
1k 0.1µF
VCELL2
1k
VCELL1
bq2945xy
V3
OUT
V2
VDD
VSS
V1
V3
OUT
V2
VDD
1k
VCELL2
0.1µF
1k
0.1 µF
VSS
0.1 µF
VCELL1
PWRPAD
V1
0.1µF
PWRPAD
0.1µF
0.1µF
Pack –
Pack –
Figure 8. 3-Series Cell Configuration with Fixed
Delay
Figure 9. 2-Series Cell Configuration with Internal
Fixed Delay
CUSTOMER TEST MODE
Customer Test Mode (CTM) helps to reduce test time for checking the overvoltage delay timer parameter once
the circuit is implemented in the battery pack. To enter CTM, VDD should be set to at least 10 V higher than V3
(see Figure 10). The delay timer is greater than 10 ms, but considerably shorter than the timer delay in normal
operation. To exit Customer Test Mode, remove the VDD to VC3 voltage differential of 10 V so that the decrease
in this value automatically causes an exit.
CAUTION
Avoid exceeding any Absolute Maximum Voltages on any pins when placing the part
into Customer Test Mode. Also avoid exceeding Absolute Maximum Voltages for the
individual cell voltages (V3–V2), (V2–V1), and (V1–VSS). Stressing the pins beyond
the rated limits may cause permanent damage to the device.
8
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Product Folder Link(s): bq294502 bq294504 bq294512 bq294515 bq294522 bq294524 bq294532 bq294562
bq294572 bq294582 bq294592
bq294502, bq294504, bq294512, bq294515
bq294522, bq294524, bq294532, bq294562
bq294572, bq294582, bq294592
www.ti.com
SLUSAJ3C – SEPTEMBER 2011 – REVISED MAY 2012
Cell Voltage (V)
(V3)
VDD – V3 (V)
Figure 10 shows the timing for the Customer Test Mode.
10 V
VOV
VOV – VHYS
t DELAY > 10 ms
OUT (V)
Figure 10. Timing for Customer Test Mode
Figure 11 shows the measurement for current consumption for the product for both VDD and Vx.
bq2945xy
IIN
3.6 V
IIN
3.6 V
IIN
3.6 V
1
V3
OUT
6
2
V2
VDD
5
V1
4
3 VSS
I CC
PWRPAD
Figure 11. Configuration for IC Current Consumption Test
Copyright © 2011–2012, Texas Instruments Incorporated
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bq294572 bq294582 bq294592
9
bq294502, bq294504, bq294512, bq294515
bq294522, bq294524, bq294532, bq294562
bq294572, bq294582, bq294592
SLUSAJ3C – SEPTEMBER 2011 – REVISED MAY 2012
www.ti.com
REVISION HISTORY
Changes from Original (September 2011) to Revision A
•
Page
Added the bq294582 Device to Production Data ................................................................................................................. 2
Changes from Revision A (November 2011) to Revision B
Page
•
Changed the bq294504 Device to Production Data ............................................................................................................. 1
•
Added the bq294512 Device ................................................................................................................................................ 1
•
Added the bq294592 Device ................................................................................................................................................ 1
•
Added a second ICC Test Condition ...................................................................................................................................... 5
•
Changed Fault Detection Delay Time in bq2945x4 Test Mode Specifications ..................................................................... 5
Changes from Revision B (February 2012) to Revision C
Page
•
Added the bq294515 Device to Production Data ................................................................................................................. 2
•
Added the bq294524 Device to Production Data ................................................................................................................. 2
•
Added the bq294532 Device to Production Data ................................................................................................................. 2
•
Added the bq294572 Device to Production Data ................................................................................................................. 2
•
Changed Overvoltage Detection Hysteresis ......................................................................................................................... 5
•
Added Output Voltage Versus Output Current graphic ........................................................................................................ 7
•
Changed Timing for Customer Test Mode figure ................................................................................................................. 9
10
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Copyright © 2011–2012, Texas Instruments Incorporated
Product Folder Link(s): bq294502 bq294504 bq294512 bq294515 bq294522 bq294524 bq294532 bq294562
bq294572 bq294582 bq294592
PACKAGE OPTION ADDENDUM
www.ti.com
28-May-2012
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
(3)
BQ294502DRVR
ACTIVE
SON
DRV
6
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
BQ294502DRVT
ACTIVE
SON
DRV
6
250
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
BQ294504DRVR
ACTIVE
SON
DRV
6
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
BQ294504DRVT
ACTIVE
SON
DRV
6
250
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
BQ294512DRVR
ACTIVE
SON
DRV
6
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
BQ294512DRVT
ACTIVE
SON
DRV
6
250
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
BQ294515DRVR
PREVIEW
SON
DRV
6
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
BQ294515DRVT
PREVIEW
SON
DRV
6
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
BQ294522DRVR
ACTIVE
SON
DRV
6
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
BQ294522DRVT
ACTIVE
SON
DRV
6
250
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
BQ294582DRVR
ACTIVE
SON
DRV
6
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
BQ294582DRVT
ACTIVE
SON
DRV
6
250
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
BQ294592DRVR
ACTIVE
SON
DRV
6
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
BQ294592DRVT
ACTIVE
SON
DRV
6
250
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Addendum-Page 1
Samples
(Requires Login)
PACKAGE OPTION ADDENDUM
www.ti.com
28-May-2012
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
6-Jun-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
BQ294502DRVR
SON
DRV
6
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
3000
330.0
12.4
2.2
2.2
1.1
8.0
12.0
Q2
BQ294502DRVT
SON
DRV
6
250
180.0
12.4
2.2
2.2
1.1
8.0
12.0
Q2
BQ294504DRVR
SON
DRV
6
3000
330.0
12.4
2.2
2.2
1.1
8.0
12.0
Q2
BQ294504DRVT
SON
DRV
6
250
180.0
12.4
2.2
2.2
1.1
8.0
12.0
Q2
BQ294512DRVR
SON
DRV
6
3000
330.0
12.4
2.2
2.2
1.1
8.0
12.0
Q2
BQ294512DRVT
SON
DRV
6
250
180.0
12.4
2.2
2.2
1.1
8.0
12.0
Q2
BQ294522DRVR
SON
DRV
6
3000
330.0
12.4
2.2
2.2
1.1
8.0
12.0
Q2
BQ294522DRVT
SON
DRV
6
250
180.0
12.4
2.2
2.2
1.1
8.0
12.0
Q2
BQ294582DRVR
SON
DRV
6
3000
330.0
12.4
2.2
2.2
1.1
8.0
12.0
Q2
BQ294582DRVT
SON
DRV
6
250
180.0
12.4
2.2
2.2
1.1
8.0
12.0
Q2
BQ294592DRVR
SON
DRV
6
3000
330.0
12.4
2.2
2.2
1.1
8.0
12.0
Q2
BQ294592DRVT
SON
DRV
6
250
180.0
12.4
2.2
2.2
1.1
8.0
12.0
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
6-Jun-2012
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
BQ294502DRVR
SON
DRV
6
3000
346.0
346.0
29.0
BQ294502DRVT
SON
DRV
6
250
210.0
185.0
35.0
BQ294504DRVR
SON
DRV
6
3000
346.0
346.0
29.0
BQ294504DRVT
SON
DRV
6
250
210.0
185.0
35.0
BQ294512DRVR
SON
DRV
6
3000
346.0
346.0
29.0
BQ294512DRVT
SON
DRV
6
250
210.0
185.0
35.0
BQ294522DRVR
SON
DRV
6
3000
346.0
346.0
29.0
BQ294522DRVT
SON
DRV
6
250
210.0
185.0
35.0
BQ294582DRVR
SON
DRV
6
3000
346.0
346.0
29.0
BQ294582DRVT
SON
DRV
6
250
210.0
185.0
35.0
BQ294592DRVR
SON
DRV
6
3000
346.0
346.0
29.0
BQ294592DRVT
SON
DRV
6
250
210.0
185.0
35.0
Pack Materials-Page 2
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