ECC100 Series
•
-40 ºC to +75 ºC Operation
•
100 W - Baseplate Cooled
•
High Efficiency Resonant Topology
•
Screw Terminals Available
•
5V Standby Output
•
Remote On/Off & Power OK Signal
•
3 Year Warranty
The ECC100 is a conduction cooled single output AC-DC power supply. It is designed for use in harsh environments where wide
temperature variation and sealed enclosure installation is common place. Featuring highly efficient resonant mode topology, whilst
maintaining its cost effectiveness, the ECC100 also provides remote sense, remote on/off, a combined AC & DC fail signal which
coupled with its own standby rail ensures that control and status reporting is easily achievable.
Comprehensive overload, short circuit, over voltage and over temperature are built into the ECC100 as standard. An optional surge
filter provides further protection from incoming AC surges to level 4 of EN61000-4-5.
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Models and Ratings
Output Power
Output Voltage V1
Max
Output Current V1
Standby Supply V2
Model Number
100 W
12.0 VDC
8.1 A
5.0 V/0.5 A
ECC100US12
100 W
15.0 VDC
6.5 A
5.0 V/0.5 A
ECC100US15
100 W
24.0 VDC
4.1 A
5.0 V/0.5 A
ECC100US24
100 W
28.0 VDC
3.5 A
5.0 V/0.5 A
ECC100US28
100 W
48.0 VDC
2.0 A
5.0 V/0.5 A
ECC100US48
Notes:
1. For optional surge filter add suffix ‘-F’ to model number, e.g. ECC100US12-F.
2. Add suffix -S for screw terminals, consult sales for restrictions and availability.
Input Characteristics
Characteristic
Minimum
Typical
Maximum
Units
Notes & Conditions
Derate output power < 90 VAC. See fig. 1. Power
OK signal cannot be used <90 VAC.
Input Voltage - Operating
85
115/230
264
VAC
Input Frequency
47
50/60
400
Hz
>0.5
Power Factor
Agency approval 47-63 Hz
230 VAC, 100% load
EN61000-3-2 class A compliant
Input Current - No Load
0.07/0.09
A
115/230 VAC
Input Current - Full Load
1.5/0.9
A
115/230 VAC
Inrush Current
110/190
Earth Leakage Current
Input Protection
40
A
230 VAC cold start, 25 ºC
300
µA
115/230 VAC/50 Hz (Typ.), 264 VAC/60 Hz (Max.)
mA
115/230 VAC/400 Hz
0.5/1.2
T5.0A/250 V internal fuse in both line and neutral
Output Characteristics
Characteristic
Output Voltage - V1
Minimum
Typical
12
Initial Set Accuracy
Maximum
Units
Notes & Conditions
48
VDC
See Models and Ratings table
±1 (V1) & ±3(V2)
%
50% load, 115/230 VAC
Output Voltage Adjustment
±5
%
V1 only via potentiometer. See mech. details (P13).
Minimum Load
0
A
Start Up Delay
Hold Up Time
16
1.0
s
20
ms
115 VAC full load (see fig.3 & 4)
Drift
±0.2
%
After 20 min warm up
Line Regulation
±0.5
%
90-264 VAC
Load Regulation
±1 (V1) , ±5 (V2)
%
0-100% load
4
%
Recovery within 1% in less than 500 µs
for a 50-75% and 75-50% load step
%
See fig.5
1 (V1) & 2 (V2)
% pk-pk
Transient Response - V1
Over/Undershoot - V1
5
Ripple & Noise
Overvoltage Protection
115
140
%
Overload Protection
110
150
% I nom
Short Circuit Protection
Overtemperature Protection
20 MHz bandwidth (see fig.6 & 7)
Vnom DC. Output 1 only, recycle input to reset
Output 1 only, auto reset (see fig.8)
Continuous, trip & restart (hiccup mode) all outputs
Temperature Coefficient
0.05
110
* At low temperature and low line voltage, start up time will increase.
2
230 VAC full load (see fig.2)*
%/˚C
°C
Main transformer sensor shutdown
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Input Voltage Derating
Output Power (W)
100
Figure. 1
90
80
70
60
10
85
90
Input Voltage (VAC)
264
Start Up Delay From AC Turn On
AC
Figure 2
V1 & V2 start up example
from AC turn on
V1
V2
Hold Up Time From Loss of AC
AC
V1
V2
Figure 3
V1 hold up example at 100 W load
with 90 VAC input (16.7 ms)
Figure 4
V1 & V2 hold up example at
100 W load 90 VAC input
3
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Output Overshoot
Figure 5
Typical Output Overshoot
(ECC100US12 shown)
Output Ripple & Noise
Figure 6
V1 ECC100 (full load)
27 mV pk-pk ripple. 20 MHz BW
4
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Output Ripple & Noise cont.
Figure 7
V1 ECC100US12 (full load)
39 mV pk-pk ripple. 20 MHz BW
Output Overload Characteristic
14
12
Figure 8
Typical V1 Overload
Characteristic
(ECC100US12 shown)
Output Volts (V)
10
Output enters
Trip & Restart Mode
8
6
4
2
0
0
1
2
3
4
5
6
7
8
Output Current (A)
5
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General
Specifications
Characteristic
Minimum
Typical
Efficiency
Maximum
Units
88
Isolation: Input to Output
Input to Ground
Output to Ground
%
4000
VAC
1500
VAC
500
Notes & Conditions
Full load (see fig.9 & 10)
VAC
Switching Frequency
70
kHz
Power Density
W/in3
3.9
Mean Time Between Failure
236
kHrs
Weight
0.7 (320)
MIL-HDBK-217F, Notice 2
+25 °C GB
lb (g)
Efficiency Versus Load
TA = 25ºC Efficiency
90%
Efficiency (%)
85%
80%
75%
70%
Vin = 115VAC
Vin = 230VAC
65%
60%
0%
20%
40%
60%
Amount of Load
80%
100%
120%
Figure 9
ECC100US12 at 115 & 230 VAC
Efficiency at TA = +25ºC
90%
Efficiency (%)
85%
80%
75%
70%
Vin = 115VAC
Vin = 230VAC
65%
60%
0%
20%
40%
60%
80%
100%
120%
Load
Figure 10
ECC100US24 at 115 & 230 VAC
Characteristic
Notes & Conditions
Signals & Control
6
Remote Sense
Compensates for 0.5 V total voltage drop
Power OK
(combined AC OK & DC OK)
Open collector referenced to logic ground & output 0V, transistor normally off when AC is good (see fig.11 - 15)
AC OK: Provides ≥ 3 ms warning of loss of output from AC failure
Remote On/Off (Inhibit/Enable)
Uncommited isolated optocoupler diode, powered diode inhibits the supply (see fig.16-21)
Standby Supply V3
5 V/0.5 A supply, always present when AC supplied, referenced to logic ground and output 0V
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Signals
Power OK
POWER SUPPLY
5 V Standby
Pin 1
Max 12 V 20 mA
330R
Power OK Collector
Pin 4
Figure 11
Transistor On (<0.8 V): FAULT
Transistor Off (>4.5 V): OK
Logic GND
Pin 2 & 3
J3 Signal Connector
Power OK - Timing Diagram
AC
Transistor OFF
Figure 12
Power OK Signal
Undefined Period
Undefined Period
90%
90%
V1 Output
100-500 ms
7
≥3 ms
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Signals (cont’d)
Power OK
Power OK
V1
Figure 13
Power OK signal example
at AC switch on
V2
Power OK
V1
Figure 14
Power OK signal example
at AC switch off
V2
Figure 15
V1 warning time example at
Power OK signal 90 VAC
100 W load (11.2 ms)
8
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Signals
(cont’d)
Remote On/Off (Inhibit/Enable)
POWER SUPPLY
POWER SUPPLY
5 V Standby
J3 Pin 1
5 V Standby
J3 Pin 1
5 mA max
8 V Max
1K
1K
8 V Max
Inhibit Hi
J3 Pin 5
Inhibit Hi
J3 Pin 5
Inhibit Lo
J3 Pin 6
5 mA
Logic GND
J3 Pins 2 & 3
Logic GND Pin
J3 Pins 2 & 3
Signal Connector
Signal Connector
Figure 16
Inhibit (Hi)
Inhibit Lo
J3 Pin 6
Figure 17
Inhibit (Lo)
Inhibit
Figure 18
Example of outputs
switching off when
Inhibit (Lo) configuration
used & switch closed
V1
V2
Inhibit
Figure 19
Example of outputs
switching on when
Inhibit (Lo) configuration
used & switch open
V1
V2
9
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Signals
(cont’d)
Remote On/Off (Inhibit/Enable)
1K
POWER SUPPLY
5 V Standby
J3 Pin 1
1K
Inhibit Hi
J3 Pin 5
5 mA
Figure 20
Enable (Hi)
Inhibit Lo
J3 Pin 6
Logic GND
J3 Pins 2 & 3
Signal Connector
1K
POWER SUPPLY
5 V Standby
J3 Pin 1
1K
Figure 21
Enable (Lo)
5 mA
Inhibit Hi
J3 Pin 5
Inhibit Lo
J3 Pin 6
Logic GND
J3 Pins 2 & 3
Signal Connector
10
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Environmental
Characteristic
Minimum
Operating Temperature
Typical
Maximum
Units
+75
ºC
-40
Warm Up Time
20
Storage Temperature
Notes & Conditions
Baseplate must not exceed 85ºC.
See thermal considerations.
Minutes
-40
+85
ºC
Cooling
Baseplate cooled
Humidity
5
Operating Altitude
95
%RH
3000
m
Non-condensing
Shock
3 x 30 g/11 ms shocks in both +ve & -ve
directions along the 3 orthogonal axis,
total 18 shocks.
Vibration
Triple axis 5-500 Hz at 2 g x 10 sweeps
Electromagnetic Compatibility - Immunity
Phenomenon
Standard
Test Level
Criteria
EN61204-3
High severity level
as below
Harmonic Current
EN61000-3-2
Class A
Radiated
EN61000-4-3
3
EFT
EN61000-4-4
3
A
Installation class 3
A
Installation class 4
A
3
A
Low Voltage PSU EMC
Surges
EN61000-4-5
Conducted
EN61000-4-6
Dips and Interruptions
EN61000-4-11
Notes & Conditions
A
Dip:
30% 10 ms
A
Dip:
60% 100 ms
B
Dip: 100% 5000 ms
B
With option -F
Electromagnetic Compatibility - Emissions
Phenomenon
Standard
Test Level
Conducted
EN55022
Class B
EN55022
Class A
Radiated
Voltage Fluctuations
Criteria
Notes & Conditions
EN61000-3-3
Safety Agency Approvals
Safety Agency
Safety Standard
Category
CB Report
UL File #E139109-A42-CB-1, IEC60950-1 (2005) Second Edition
Information Technology
UL
UL File #E139109-A42-UL, UL60950-1, 2nd Edition, 2007-03-27, CSA C22.2
No 60950-1-07 2nd Edition 2007-03
Information Technology
TUV
TUV Certificate B 09 12 57396 067, EN60950-1/A11:2009
Information Technology
CE
LVD
Equipment Protection Class
Safety Standard
Notes & Conditions
IEC60950-1:2005 Ed 2
See safety agency conditions of acceptibility
for details
Class I
11
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Xxxxxxxxxx Details - ECC100USxx
Mechanical
5 x M3 clearance holes
4 x M3-0.5
0.25 Faston
Ground tab
2
1
10
9
Voltage Adj.
J3
2 x 3.70
(94.0)
8
J2
1
J1
4.10
(104.1)
3.30
(83.8)
2
1
0.40
(10.2)
2 x 0.20 (5.1)
Mounting surface
marked with “A”
3 x 0.20
(5.1)
2.30 (58.4)
2 x 4.60 (116.8)
2 x 0.23
(5.8)
4.10
(104.1)
1.55
(39.4)
3.30
(83.8)
0.40
(10.2)
5.00 (127.0)
Screw Terminal Side View
Output Connector J2
Molex PN 09-65-2088
Single Output
+V1
+V1
+V1
+V1
RTN
RTN
A
RTN
RTN
Pin
1
2
3
4
5
6
7
8
Input Connector J1
Molex PN 09-65-2038
1
Line
2
Neutral
J1 mates with Molex housing
PN 09-50-1031.
A
A
J2 mates with Molex housing PN
1 and both with Molex
09-50-1081
series 5194 crimp terminals.
J3 mates with JST housing PN
PHDR-10VS and with
JST SPHD-001T-P0.5 crimp terminals.
J1
2
8
9
10
1
2
1
Notes
1. All dimensions in inchesA (mm).
2. Tolerance .xx = ±0.02 (0.50); .xxx = ±0.01 (0.25)
12
3. Weight 1.2 lbs (550g)
A
Signal Connector J3
Molex PN B10B-PHDSS
1
+5 V Standby
2
Logic GND
3
Logic GND
4
Power OK
5
Inhibit Hi
6
Inhibit Lo
7
+Sense
8
-Sense
9
+Vout
10
-Vout
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Xxxxxxxxxx Details - ECC100USxx-F
Mechanical
2 x 0.20
(5.08)
5 x M3 clearance holes
2 x 4.60 (116.84)
2.30 (58.42)
A
A
A
1
J2
Output Interface
Connector
J1
3.70
(93.98)
2
8
Voltage Adjust
9
10
1
2
3.30
(83.8)
1
4.10
(104.1)
J3
Logic Connector
A
A
0.25 Faston Ground tab
0.20
(5.08)
5.00 (127.0)
1.55
(39.3)
2.50 (63.5)
0.40
(10.2)
2.50
(63.50)
1.55
(39.4)
5.00 (127.0)
Pin
1
2
3
4
5
6
7
8
Output Connector J2
Molex PN 09-65-2088
Single Output
+V1
+V1
+V1
+V1
RTN
RTN
RTN
RTN
Input Connector J1
Molex PN 09-65-2038
1
Line
2
Neutral
J1 mates with Molex housing
PN 09-50-1031.
J2 mates with Molex housing PN
09-50-1081 and both with Molex
series 5194 crimp terminals.
Signal Connector J3
Molex PN B10B-PHDSS
1
+5 V Standby
2
Logic GND
3
Logic GND
4
Power OK
5
Inhibit Hi
6
Inhibit Lo
7
+Sense
8
-Sense
9
+Vout
10
-Vout
J3 mates with JST housing PN
PHDR-10VS and with
JST SPHD-001T-P0.5 crimp terminals.
Notes
1. All dimensions in inches (mm).
2. Tolerance .xx = ±0.02 (0.50); .xxx = ±0.01 (0.25)
3. Weight 1.2 lbs (550g)
13
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Thermal
Considerations - Baseplate Cooling
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The use of power supplies in harsh or remote environments brings with it many fundamental design issues that must be fully understood if long-term
reliability is to be attained.
Under these conditions, it is generally accepted that electronic systems have to be sealed against the elements. This makes the removal of unwanted
heat particularly difficult. The use of forced-air cooling is undesirable as it increases system size, adds the maintenance issues of cleaning or
replacing filters, and the fan being prone to wear out, particularly in tough environments.
The extremes of ambient temperature encountered in remote sites can range from -40 ºC to over+40 °C. It is common for the temperature within the
enclosure to rise some 15 to 20 °C above the external temperature. The positioning of the power supply within the enclosure can help minimize the
ambient temperature in which it operates and this can have a dramatic effect on system reliability.
System enclosures are typically sealed to IP65, IP66 or NEMA 4 standards to prevent ingress of dust or water. Removal of heat from other electronic
equipment and power supplies in a situation with negligible airflow is the challenge. From the power system perspective, the most effective solution is
to remove the heat using a heatsink that is external to the enclosure. However, most standard power supplies cannot provide an adequate thermal
path between the heat-dissipating components within the unit and the external environment.
Fundamentally, the successful design of a power supply for use within sealed enclosures relies on creating a path with low thermal resistance through
which conducted heat can be passed from heat- generating components to the outside world.
The components that generate the most heat in a power supply are distributed throughout the design, from input to output. They include the power
FET used in an active PFC circuit, the PFC inductor, power transformers, rectifiers, and power switches. Heat can be removed from these components
by thermally connecting them to the base-plate that in turn can be affixed to a heatsink. As mentioned earlier, the heatsink is then located outside of
the enclosure.
Power transistor
Baseplate of power supply
PCB
External heatsink
Inductor
Ambient
Basic construction of baseplate cooled PSU with all of the major heat-generating
components thermally connected to the baseplate
Dissipating the Heat: Heatsink Calculations
Three basic mechanisms contribute to heat dissipation: conduction, radiation and convection. All mechanisms are active to some degree but once heat
is transferred from the baseplate to the heatsink by conduction, free convection is the dominant one.
Effective conduction between the baseplate and heatsink demands flat surfaces in order to achieve low thermal resistance. Heat transfer can be
maximized by the use of a thermal compound that fills any irregularities on the surfaces. System designers should aim to keep thermal resistance
between baseplate and heatsink to below 0.1 °C/W. This is the performance offered by most commonly used thermal compounds when applied in
accordance with manufacturers’ instructions.
Radiation accounts for less than 10% of heat dissipation and precise calculations are complex. In any case, it is good practice to consider this 10% to
be a safety margin.
14
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The following example shows how to calculate the heatsink required for an ECC100US12 with 230 VAC input and an output load of 90 W operating in
a 40 ºC outside ambient temperature.
1. Calculate the power dissipated as waste heat from the power supply. The efficiency (see fig. 9 & 10) and worst case load figures are used to
determine this using the formula:
Waste heat
=
- Eff%
{ 1 Eff%
}x P
out
=
- 0.87
{ 1 0.87
}x 90 W
= 13.5 W
2. Estimate the impedance of the thermal interface between the power supply baseplate and the heatsink. This is typically 0.1°C/W when using a
thermal compound.
3. Calculate the maximum allowable temperature rise on the baseplate. The allowable temperature rise is simply:
TB – TA where TA is the maximum ambient temperature outside of the cabinet
and TB is the maximum allowable baseplate temperature.
4. The required heatsink is defined by its thermal impedance using the formula:
θH =
T B – TA
-0.1
Waste Power
=
85 ºC – 40 ºC
-0.1
= 3.23 ºC/W
13.5 W
5. The final choice is then based on the best physical design of heatsink for the application that can deliver the required thermal impedance. The
system’s construction will determine the maximum available area for contact with the baseplate of the power supply and the available space outside of
the enclosure will then determine the size, number and arrangement of cooling fins on the heatsink to meet the dissipation requirement.
10-Sept-12